JP2022133165A - Wiring board, manufacturing method of wiring board and loop antenna - Google Patents

Abstract

To provide a wiring board having stable characteristics, a manufacturing method of the wiring board and a loop antenna.SOLUTION: In a loop antenna, a wiring board 10 comprises: a substrate 20 including a first face and a second face which is positioned at an opposite side of the first face, and having flexibility; and a wire 50 positioned at the side of the first face of the substrate. The wire includes: a plurality of crest parts arranged side by side in a length direction of the wire; a first side edge 501 and a second side edge 502 which extend in the length direction; a slit 60 extending in the length direction; a first portion 51 positioned between the slit and the first side edge and extending in the length direction; a second portion 52 positioned between the slit and the second side edge and extending in the length direction; and a connection portion 55 connecting the first portion and the second portion.SELECTED DRAWING: Figure 2

Description

An embodiment of the present disclosure relates to a wiring board and a manufacturing method thereof. Embodiments of the present disclosure also relate to loop antennas.

In recent years, research has been conducted on electronic devices having deformability such as stretchability. For example, an electronic device is known that includes a stretchable base material and stretchable silver wiring. Further, an electronic device is known that includes a stretchable base material and horseshoe-shaped wiring (see, for example, Patent Document 1). Further, Patent Literature 2 discloses a flexible wiring board that includes a base material and wiring provided on the base material. Patent Document 2 employs a manufacturing method in which a circuit is provided on a pre-stretched base material, and the base material is relaxed after the circuit is formed.

JP 2013-187308 A Japanese Patent Application Laid-Open No. 2007-281406

When the base material is in a relaxed state, the wiring provided on the base material has a bellows-shaped portion in which a plurality of peaks appear repeatedly along the in-plane direction of the base material. In this case, when the base material is stretched, the wiring can follow the expansion of the base material by expanding the bellows-shaped portion in the in-plane direction. Therefore, according to the wiring board of the type having the bellows-shaped portion, it is possible to suppress the change in the resistance value of the wiring due to the expansion and contraction of the base material.

The height of the ridges of the accordion-shaped portion may vary depending on the position. Possible causes of variations in the height of the ridges include variations in the thickness of the base material, variations in the elongation of the base material during elongation, variations in the distribution density of wiring provided on the base material, and the like. Further, when the base material is greatly elongated, the period of the bellows-shaped portion is disturbed, and the height of the ridges may be locally increased. If the height of the ridge varies depending on the position, the degree of bending or bending that occurs in the wiring also increases locally. In particular, when the degree of expansion of the base material is large, it is conceivable that the wiring may be broken or otherwise damaged.

An object of the embodiments of the present disclosure is to provide a wiring board and a wiring board manufacturing method that can effectively solve such problems.

One embodiment of the present disclosure provides:
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a wiring located on the first surface side of the base material,
The wiring includes a plurality of ridges arranged in the length direction of the wiring, a first side edge and a second side edge extending in the length direction, a slit extending in the length direction, the slit and the first side edge. a first portion located between the side edge and extending in the length direction; a second portion located between the slit and the second side edge and extending in the length direction; and a connection portion that connects the second portion.

In the wiring board according to one embodiment of the present disclosure, the wiring may include a corner wiring whose extending direction changes, and the slit may include a corner slit located in the corner wiring.

In the wiring board according to one embodiment of the present disclosure, the base material may contain thermoplastic elastomer, silicone rubber, urethane gel, or silicone gel.

In the wiring board according to an embodiment of the present disclosure, the base may have a slit overlapping the slit.

A wiring board according to an embodiment of the present disclosure may include a support substrate that supports the wiring.

In the wiring board according to an embodiment of the present disclosure, the modulus of elasticity of the support substrate may be ten times or more the modulus of elasticity of the base material.

In the wiring board according to one embodiment of the present disclosure, the support substrate may contain polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate.

In the wiring board according to one embodiment of the present disclosure, the support substrate may include a support substrate slit that overlaps the slit.

A wiring board according to an embodiment of the present disclosure may include a control layer located on the first surface side of the base material.

In the wiring board according to one embodiment of the present disclosure, the control layer may have a larger elastic modulus than the base material.

A wiring board according to an embodiment of the present disclosure includes two of the wires extending in parallel, and the control layer includes a first control layer located between the two wires and extending in the length direction. You can stay.

In the wiring board according to one embodiment of the present disclosure, the control layer may include a plurality of second control layers arranged in the length direction.

The wiring board according to an embodiment of the present disclosure may include two of the wirings extending in parallel, and the second control layer may overlap the two of the wirings.

In the wiring board according to one embodiment of the present disclosure, the wiring includes a corner wiring whose extending direction changes, the second control layer overlaps the corner wiring, and the width of the second control layer may, at least in part, decrease inwardly.

In the wiring board according to one embodiment of the present disclosure, the first side edge may include a stepped portion that overlaps an end portion of the slit when viewed along the width direction of the wiring.

In the wiring board according to an embodiment of the present disclosure, the slit may include curved ends.

In the wiring board according to one embodiment of the present disclosure, the slit includes a first slit and a second slit extending in the length direction, and the wiring is positioned between the first slit and the first side edge. the first portion located between the second slit and the second side edge; and the third portion located between the first slit and the second slit. may contain.

In the wiring board according to one embodiment of the present disclosure, the wiring may include a plurality of slits arranged in the length direction.

One embodiment of the present disclosure provides:
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a wiring located on the first surface side of the base material and forming a loop,
The wiring includes a plurality of ridges arranged in the length direction of the wiring, a first side edge and a second side edge extending in the length direction, a slit extending in the length direction, the slit and the first side edge. a first portion located between the side edge and extending in the length direction; a second portion located between the slit and the second side edge and extending in the length direction; and a connection portion that connects the second portion to the loop antenna.

One embodiment of the present disclosure provides:
an elongation step of applying a tensile stress to a stretchable base material including a first surface and a second surface located on the opposite side of the first surface to elongate the base material;
a wiring forming step of providing wiring on the first surface side of the base material stretched by the stretching step;
a shrinking step that removes tension from the substrate;
The wiring includes a plurality of ridges arranged in the length direction of the wiring, a first side edge and a second side edge extending in the length direction, a slit extending in the length direction, the slit and the first side edge. a first portion located between the side edge and extending in the length direction; a second portion located between the slit and the second side edge and extending in the length direction; and a connection portion that connects the second portion to the second portion.

According to the embodiments of the present disclosure, it is possible to control the ridges formed on the wiring board.

1 is a plan view showing a wiring board according to one embodiment; FIG. FIG. 2 is an enlarged plan view showing wiring of a wiring substrate; FIG. 3 is a cross-sectional view of the wiring substrate of FIG. 2 taken along line AA; FIG. 4 is a plan view showing an example of ridges formed on a wiring board; FIG. 5 is a cross-sectional view of the wiring substrate of FIG. 4 taken along line BB; It is another example of the cross-sectional view of the wiring board. It is another example of the cross-sectional view of the wiring board. It is another example of the cross-sectional view of the wiring board. It is a figure for demonstrating the manufacturing method of a wiring board. FIG. 4 is a cross-sectional view showing an enlarged wiring board in an extended state; FIG. 10 is a cross-sectional view showing a wiring board according to a first modified example; FIG. 4 is a cross-sectional view showing an example of ridges formed on a wiring board; It is a figure for demonstrating the manufacturing method of the wiring board based on a 1st modification. FIG. 11 is a cross-sectional view showing a wiring board according to a second modified example; FIG. 11 is a cross-sectional view showing a wiring board according to a third modified example; FIG. 11 is a cross-sectional view showing a wiring board according to a fourth modified example; It is a top view which shows the wiring which concerns on a 5th modification. It is a top view which shows the wiring which concerns on a 6th modification. FIG. 11 is a plan view showing wiring according to a seventh modification; FIG. 20 is a plan view showing wiring according to an eighth modified example; FIG. 21 is a plan view showing wiring according to a ninth modification; FIG. 20 is a plan view showing a wiring board according to a tenth modification; FIG. 2 is an enlarged plan view showing wiring of a wiring substrate; FIG. 21 is a plan view showing wiring according to an eleventh modification; FIG. 20 is a plan view showing wiring according to a twelfth modification; FIG. 21 is a plan view showing wiring according to a thirteenth modification; FIG. 20 is a plan view showing wiring according to a fourteenth modification; FIG. 20 is a plan view showing wiring according to a fifteenth modification; FIG. 20 is a plan view showing a wiring board according to a sixteenth modification; FIG. 4 is a plan view showing an enlarged corner wiring of the wiring substrate; FIG. 22 is a plan view showing a corner wiring according to a seventeenth modification; FIG. 20 is a plan view showing a corner wiring according to an eighteenth modification; FIG. 20 is a plan view showing a corner wiring according to a nineteenth modification; FIG. 21 is a cross-sectional view showing a wiring board according to a twentieth modification; FIG. 4 is a cross-sectional view showing an example of ridges formed on a wiring board; FIG. 20 is a plan view showing a control layer according to a twenty-first modification; FIG. 37 is a cross-sectional view of the wiring substrate of FIG. 36 taken along line CC; FIG. 20 is a plan view showing a control layer according to a twenty-second modification; FIG. 21 is a plan view showing a control layer according to a twenty-third modification; FIG. 20 is a plan view showing a control layer according to a twenty-fourth modification; FIG. 20 is a plan view showing a wiring board according to a twenty-fifth modification; FIG. 20 is a plan view showing a wiring board according to a twenty-sixth modification; FIG. 20 is a plan view showing a wiring board according to a twenty-seventh modification;

Hereinafter, a configuration of a wiring board and a method for manufacturing the same according to embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below are examples of embodiments of the present disclosure. Interpretation of this disclosure is not limited to these embodiments. As used herein, the terms "substrate", "substrate", "sheet", "film" and the like are not to be distinguished from each other based solely on their designation. For example, the concept of "substrate" also includes such members as may be referred to as substrates, sheets, and films. Interpretations of terms such as "parallel" and "perpendicular" and values of lengths and angles used herein to specify shapes and geometric conditions as well as degrees thereof are not strictly limited. However, it includes the extent to which similar functions can be expected.

In the drawings referred to in this embodiment, the same reference numerals or similar reference numerals are given to the same parts or parts having similar functions. Repeated descriptions of parts to which the same or similar reference numerals are attached may be omitted. The dimensional ratios in the drawings may differ from the actual ratios for convenience of explanation. Some configurations may be omitted from the drawings.

In this specification, when multiple upper limit candidates and multiple lower limit candidates are given for a parameter, the numerical range of the parameter is any one upper limit candidate and any one lower limit value. may be configured by combining the candidates of For example, "Parameter B is, for example, A1 or more, may be A2 or more, or may be A3 or more. Parameter B may be, for example, A4 or less, may be A5 or less, or A6 or less. There may be.” In this case, the numerical range of the parameter B may be A1 or more and A4 or less, A1 or more and A5 or less, A1 or more and A6 or less, or A2 or more and A4 or less, It may be A2 or more and A5 or less, A2 or more and A6 or less, A3 or more and A4 or less, A3 or more and A5 or less, or A3 or more and A6 or less.

(wiring board)
FIG. 1 is a plan view showing a wiring substrate 10 according to this embodiment. In this embodiment, an example in which the wiring substrate 10 constitutes the loop antenna 1 will be described. The loop antenna 1 is used, for example, for wireless communication and power supply. The wiring board 10 includes at least the base material 20 and the wiring 50 . FIG. 2 is a plan view showing the wiring 50 in an enlarged manner. FIG. 3 is a cross-sectional view of the wiring substrate 10 of FIG. 2 taken along line AA.

〔Base material〕
The base material 20 is a member configured to be stretchable in at least one direction. The substrate 20 includes a first side 21 and a second side 22 opposite the first side 21 . In the example shown in FIG. 1, the base material 20 has a pair of sides extending in the x direction and a pair of sides extending in the y direction intersecting the x direction when viewed along the normal direction of the first surface 21. It has a square shape containing The y-direction may be orthogonal to the x-direction, as shown in FIG. Although not shown, the y-direction need not be orthogonal to the x-direction. In the following description, viewing the wiring board 10 or components of the wiring board 10 along the normal direction of the first surface 21 is also simply referred to as "plan view". In this embodiment, the base material 20 has elasticity at least in the x-direction. The base material 20 may also have stretchability in directions other than the x-direction. For example, the base material 20 may also have elasticity in the y direction.

The thickness T1 of the base material 20 is, for example, 10 μm, may be 20 μm or more, or may be 30 μm or more. The thickness T1 of the base material 20 is, for example, 10 mm or less, may be 3 mm or less, or may be 1 mm or less. By setting the thickness T1 of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. By setting the thickness T1 of the base material 20 to 10 mm or less, the wearing comfort of the wiring board 10 can be ensured. If the thickness T1 of the base material 20 is too small, the stretchability of the base material 20 may be impaired.

The stretchability of the base material 20 refers to the property that the base material 20 can be stretched from its normal non-stretched state, and then the base material 20 can be restored when released from the stretched state. In the following description, the property of being able to restore itself when released from the stretched state is also referred to as resilience. The non-stretched state is the state of substrate 20 when no tensile stress is applied. The extent to which the base material 20 can be stretched from the non-stretched state without being destroyed is, for example, 1% or more, may be 20% or more, or may be 75% or more. By using the base material 20 having such characteristics, the wiring board 10 as a whole can have elasticity. Furthermore, the wiring board 10 can be used in products and applications that require a high degree of expansion and contraction and that are attached to a part of the body such as a human arm. Generally, it is said that a product to be applied to a person's armpit should have a stretchability of 72% in the vertical direction and 27% in the horizontal direction. In addition, it is said that products that are attached to the knees, elbows, buttocks, ankles, and armpits of a person must have a stretchability of 26% or more and 42% or less in the vertical direction. It is also said that less than 20% stretchability is required for products that are attached to other parts of the human body.

It is preferable that the difference between the shape of the substrate 20 in the non-stretched state and the shape of the substrate 20 when it returns to the non-stretched state after being stretched from the non-stretched state is small. This difference is also referred to as shape change in the following description. The change in shape of the substrate 20 is, for example, 20% or less, may be 10% or less, or may be 5% or less in terms of area ratio. By using the base material 20 with a small change in shape, formation of peaks and valleys, which will be described later, is facilitated.

An example of a parameter representing the stretchability of the base material 20 is the elastic modulus of the base material 20 . The elastic modulus of the base material 20 is, for example, 10 MPa or less, and may be 1 MPa or less. By using the base material 20 having such an elastic modulus, the wiring board 10 as a whole can have stretchability. In the following description, the elastic modulus of the base material 20 is also referred to as the first elastic modulus. The first elastic modulus of the base material 20 is, for example, 1 kPa or more, and may be 10 kPa or more.

As a method of calculating the first elastic modulus of the base material 20, a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. Alternatively, a method of measuring the elastic modulus of a sample of the base material 20 by a nanoindentation method in compliance with ISO14577 may be adopted. A nanoindenter can be used as a measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample are considered. be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the material constituting the base material 20 is analyzed, and the first elastic modulus of the base material 20 is calculated based on an existing material database. method can be adopted. The elastic modulus in the present application is the elastic modulus in an environment of 25°C.

Another example of the parameter representing the stretchability of the base material 20 is the flexural rigidity of the base material 20 . Bending stiffness is the product of the area moment of inertia of the member under consideration and the elastic modulus of the material that constitutes the member under consideration. The unit of bending stiffness is N·m ² or Pa·m ⁴ . The geometrical moment of inertia of the base material 20 is calculated based on a cross section obtained by cutting a portion of the base material 20 overlapping the wiring 50 along a plane orthogonal to the expansion/contraction direction of the wiring board 10 .

Base material 20 may contain an elastomer as a main component. Also, the base material 20 may contain cloth such as woven fabric, knitted fabric, or non-woven fabric as a main component. In addition, the "main component" is a component that accounts for 51% by weight or more of the constituent elements of interest. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used. Elastomers include, for example, polyurethane elastomers, styrene elastomers, nitrile elastomers, olefin elastomers, vinyl chloride elastomers, ester elastomers, amide elastomers, 1,2-BR elastomers, fluorine elastomers, silicone rubbers, and urethane rubbers. , fluororubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene, and the like. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Substrate 20 may comprise a silicone such as polydimethylsiloxane. Silicone has excellent heat resistance, chemical resistance, and flame resistance.

〔wiring〕
The wiring 50 is a member having conductivity and having an elongated shape in plan view. In the example shown in FIG. 1, the wiring 50 has the shape of a loop. In the example shown in FIG. 1, the number of turns of the loop antenna 1 formed by the wiring 50 is two. As shown in FIG. 1 , the wiring board 10 may include pads 70 connected to the ends of the wirings 50 . Wiring 50 and pad 70 may include the same conductive layer.

The loop may be rectangular as shown in FIG. In this case, the wiring 50 includes an x-wiring 50x extending in the x-direction, a y-wiring 50y extending in the y-direction, and a corner wiring 50z including the corner wiring 50z. The corner wiring 50z connects the x wiring 50x and the y wiring 50y.
Although not shown, the loop may be circular.

In this embodiment, the wiring 50 is positioned on the first surface 21 side of the base material 20 . As shown in FIG. 3 , the wiring 50 may be in contact with the first surface 21 of the substrate 20 . Although not shown, another member may be interposed between the first surface 21 of the base material 20 and the wiring 50 .

The trace 50 includes a first side edge 501 and a second side edge 502 extending longitudinally. If the wiring 50 is an x-wiring 50x, the length direction is the x-direction. When the wiring 50 is a y-wiring 50y, the length direction is the y-direction. In the following description, the direction perpendicular to the length direction is also referred to as the width direction. The dimension of the wiring 50 in the length direction (hereinafter also referred to as the length of the wiring 50) is larger than the dimension of the wiring 50 in the width direction (hereinafter also referred to as the width of the wiring 50). The length of the wiring 50 is, for example, twice or more the width of the wiring 50, may be five times or more, or may be ten times or more.

The first side edge 501 is the side edge of the wiring 50 positioned inside. The second side edge 502 is the side edge of the wiring 50 located outside. "Inner" is the side towards center point 2 of the loop. "Outer" is the side away from the center point 2 of the loop.

As will be described later, the wiring 50 is provided on the base material 20 in a state of being stretched by a first stretch amount under tension. In this case, when the tension is removed from the substrate 20 and the substrate 20 contracts, the wiring 50 deforms into a bellows shape. As a result, the wiring 50 has a plurality of ridges aligned in the length direction.

As the material of the wiring 50, a material is used that can follow the expansion and contraction of the base material 20 by utilizing the elimination and formation of peaks. The material of the wiring 50 itself may or may not have elasticity.
Examples of materials that can be used for the wiring 50 and that do not have elasticity per se include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. If the material of the wiring 50 itself does not have stretchability, a metal film can be used as the wiring 50 .
When the material itself used for the wiring 50 has elasticity, the elasticity of the material is the same as that of the base material 20, for example. Examples of materials that can be used for the wiring 50 and that have elasticity in themselves include a conductive composition containing conductive particles and an elastomer. The conductive particles may be those that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon, and the like. Among them, silver particles are preferably used.

Preferably, the wiring 50 comprises a structure that is resistant to deformation. For example, line 50 has a base material and a plurality of conductive particles dispersed within the base material. In this case, by using a deformable material such as resin as the base material, the wiring 50 can also be deformed according to the expansion and contraction of the base material 20 . In addition, the conductivity of the wiring 50 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. .

As the base material of the wiring 50, general thermoplastic elastomers and thermosetting elastomers can be used. Examples of the base material include styrene elastomer, acrylic elastomer, olefin elastomer, urethane elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, and polychloroprene. Resins and rubbers containing urethane-based or silicone-based structures are preferable as the base material because they have stretchability and durability. As a material that constitutes the conductive particles of the wiring 50, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. In particular, silver particles are preferably used.

A method for forming the wiring 50 is appropriately selected according to the material and the like. For example, a metal film is formed on the base material 20 or a support substrate 40 to be described later by a vapor deposition method, a sputtering method, lamination of metal foil, or the like. After that, the metal film is patterned by photolithography. Thereby, the wiring 50 is formed. When a metal foil is laminated on the base material 20 or a support substrate 40 described later, an adhesive layer or the like may be interposed between the base material 20 or the support substrate 40 and the metal foil. Further, when the material of the wiring 50 itself has stretchability, for example, the conductive composition containing the above-described conductive particles and elastomer is patterned on the base material 20 or the support substrate 40 by a general printing method. There is a method of printing. Among these methods, the printing method can be preferably used. Since the printing method has high material efficiency, the wiring 50 can be manufactured inexpensively.

The thickness T2 of the wiring 50 is appropriately selected according to the material of the wiring 50 and the like so as to withstand expansion and contraction of the base material 20 .
When the material of the wiring 50 does not have stretchability, the thickness T2 of the wiring 50 is, for example, 25 nm or more, may be 50 nm or more, or may be 100 nm or more. The thickness T2 of the wiring 50 is, for example, 100 μm or less, may be 50 μm or less, or may be 5 μm or less.
When the material of the wiring 50 has stretchability, the thickness T2 of the wiring 50 is, for example, 5 μm or more, may be 10 μm or more, or may be 20 μm or more. The thickness T2 of the wiring 50 is, for example, 60 μm or less, may be 50 μm or less, or may be 40 μm or less.

The width W1 of the wiring 50 is appropriately selected according to the electrical resistance value required for the wiring 50 . The width W1 of the wiring 50 is, for example, 100 μm or more, may be 200 μm or more, may be 500 μm or more, or may be 1 mm or more. The width W1 of the wiring 50 is, for example, 20 mm or less, may be 10 mm or less, or may be 5 mm or less. The width W1 of the wiring 50 is defined as the width of the portion of the wiring 50 not provided with a slit, which will be described later.

As the width W1 of the wiring 50 increases, the cross-sectional area of the wiring 50 increases. As the cross-sectional area of the wiring 50 increases, the resistance of the wiring 50 decreases. On the other hand, as the cross-sectional area of the wiring 50 increases, the rigidity of the wiring 50 increases. If the rigidity of the wiring 50 becomes too high, it becomes difficult to control the crest formed on the wiring 50 . For example, it is conceivable that the position, shape, direction, etc. of the peaks deviate from the design.

Considering such a problem, it is proposed in the present embodiment to form the slit 60 in the wiring 50 . In the example shown in FIG. 1, wiring 50 includes an x-slit 60x formed in x-wiring 50x, a y-slit 60y formed in y-wiring 50y, and a corner slit 60z formed in corner wiring 50z. In the example shown in FIG. 1, x-slit 60x, y-slit 60y and corner slit 60z are continuous.

A configuration of the wiring 50 will be described in detail. As shown in FIG. 2 , the wiring 50 has a first side edge 501 , a second side edge 502 , a slit 60 , a first portion 51 , a second portion 52 and a connecting portion 55 . The slit 60 is a hole penetrating the wiring 50 . The slit 60 extends in the length direction D1 of the wiring 50, like the first side edge 501 and the second side edge 502. As shown in FIG. For example, the length of slit 60 is at least twice the width of slit 60 .

The first portion 51 is the portion of the wiring 50 located between the slit 60 and the first side edge 501 . The second portion 52 is the portion of the wiring 50 located between the slit 60 and the second side edge 502 . The first portion 51 and the second portion 52 also extend in the length direction D1. The first portion 51 and the second portion 52 comprise the same conductive layer comprising the materials described above.

The connection portion 55 is a portion of the wiring 50 that electrically connects the first portion 51 and the second portion 52 . The connecting portion 55 is in contact with the end 65 of the slit 60 in the length direction D1. In this embodiment, the connection portion 55 extends in the width direction D2 from the first side edge 501 to the second side edge 502 . A slit 60 is not formed in the connecting portion 55 . Width W1 of wiring 50 is the width of connection portion 55 shown in FIG.

The first portion 51 has a first width W11. The second portion 52 has a second width W12. The first width W11 and the second width W12 are set so that a plurality of ridges are formed in the first portion 51 and the second portion 52 along the length direction D1 as the base material 20 shrinks. The first width W11 and the second width W12 are, for example, 50 μm or more, may be 100 μm or more, may be 250 μm or more, or may be 500 μm or more. The width W2 of the wiring 50 is, for example, 10 mm or less, may be 5 mm or less, may be 2.5 mm or less, or may be 1 mm or less.

A ratio W12/W11 of the width W12 to the width W11 is, for example, 0.7 or more, may be 0.8 or more, or may be 0.9 or more. W12/W11 is, for example, 1.3 or less, may be 1.2 or less, or may be 1.1 or less.

The width W2 of the slit 60 is, for example, 1 μm or more, may be 2 μm or more, or may be 5 μm or more. The width W2 of the slit 60 is, for example, 200 μm or less, may be 100 μm or less, or may be 50 μm or less.

When the number of turns of the loop antenna 1 is two or more, the wiring board 10 is provided with two or more wirings 50 extending in parallel, as shown in FIG. Reference W3 represents the width of the gap 75 between two adjacent wirings 50 . The width W3 is set according to the characteristics required for the loop antenna 1 . The width W3 is, for example, 50 μm or more, may be 100 μm or more, or may be 200 μm or more. The width W3 is, for example, 5 mm or less, may be 2 mm or less, or may be 1 mm or less.

FIG. 4 is a plan view showing an example of the ridges 11 formed on the wiring board 10. As shown in FIG. Wiring board 10 includes a plurality of peaks 11 arranged in length direction D1. According to the present embodiment, since wiring 50 includes slit 60, control of peak portion 11 is facilitated. For example, it is possible to suppress irregular periods of the peaks 11 in the length direction D1. For example, it is possible to prevent the direction in which the peak portion 11 extends from deviating from the width direction D2. For example, it is possible to suppress a local increase in the height of the peak portion 11 .

The width W3 of the gap 75 between the two wires 50 affects the characteristics of the loop antenna 1 such as inductance. If the position, shape, direction, etc. of the peak portion 11 are disturbed, the width W3 may change depending on the position.
According to this embodiment, the peak portion 11 can be controlled more accurately due to the effect of the slits 60 . Therefore, it is possible to suppress the width W3 from changing depending on the position. Therefore, it is possible to provide the loop antenna 1 having stable characteristics.

The inductance of the loop antenna 1 configured by the wiring board 10 is, for example, 100 nH or more, and may be 300 nH or more. The inductance is, for example, 10 μH or less, and may be 3 μH or less.

A cross section of the wiring board 10 in the length direction D1 will be described. FIG. 5 is a cross-sectional view of the wiring substrate of FIG. 4 taken along line BB. Wiring board 10 includes above-described mountain portion 11 appearing on the surface of wiring board 10 on the first surface 21 side. The peak portion 11 is a portion of the surface of the wiring board 10 that protrudes in the normal direction of the first surface 21 . The structure including the ridges 11 is also referred to as a bellows-shaped portion 13 . The bellows-shaped portion may include valleys 12 located between two peaks 11 adjacent in the length direction D1.

As shown in FIG. 5, the wiring 50 includes a plurality of peaks 57 arranged in the length direction D1. The wiring 50 may include a valley portion 58 located between two peak portions 57 adjacent in the length direction D1. The peaks 57 and the valleys 58 appear in the portions of the wiring 50 overlapping the peaks 11 and the valleys 12 in plan view.

A reference S11 represents the amplitude of the peaks 11 and the valleys 12 when the wiring board 10 is not under tension. In the example shown in FIG. 5, the wiring 50 is located on the surface of the wiring board 10, so the amplitude S11 is the amplitude of the peaks and valleys of the wiring 50. In the example shown in FIG. The amplitude S11 is, for example, 1 μm or more, and may be 10 μm or more. When the amplitude S11 is 10 μm or more, the wiring 50 easily deforms following the elongation of the base material 20 . The amplitude S11 is, for example, 500 μm or less.

The amplitude of peaks and valleys is measured, for example, by measuring the distance in the normal direction of the substrate 20 between adjacent peaks and valleys over a certain range in the direction in which the peaks and valleys are aligned, Calculated by averaging them. The "fixed range in the direction in which the peaks and valleys are arranged" is, for example, 10 mm. As a measuring device for measuring the distance between adjacent peaks and valleys, a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. The dimensions of the elements of the wiring board 10 in plan view, such as the width W1, the width W2, and the width W3 described above, are also measured by a non-contact measuring instrument or a contact measuring instrument.
Based on an image such as a cross-sectional photograph, the distance between adjacent peaks and valleys may be measured. The dimensions of the elements of the wiring board 10 in the cross-sectional view, such as the thicknesses T1 and T2 described above, are also measured based on an image such as a cross-sectional photograph. The above width W1, width W2, width W3, etc. may be measured based on an image such as a cross-sectional photograph.

Reference character F11 represents the period of the peaks 11 and the valleys 12 when the wiring board 10 is not under tension. The period F11 is, for example, 10 μm or more, and may be 100 μm or more. The period F11 is, for example, 100 mm or less, and may be 10 mm or less. The period F11 of the ridges 11 and the troughs 12 is calculated by measuring intervals between the ridges 11 over a certain range in the direction in which the ridges 11 and the troughs 12 are arranged and averaging them.

Reference numerals M11 and M21 represent dimensions in the length direction D1 of the peaks 11 and the valleys 12, respectively, when the wiring board 10 is not under tension. In the example shown in FIG. 5, the dimension M11 of the peak portion 11 and the dimension M21 of the valley portion 12 are substantially the same. The ratio of the peaks 11 in the bellows-shaped portion 13 when the wiring board 10 is not under tension is represented by X1. The ratio X1 is calculated by M11/(M11+M21). The ratio X1 is, for example, 0.40 or more and 0.60 or less.

As shown in FIG. 5, the surface of the wiring board 10 on the second surface 22 side may also have a bellows-shaped portion 18 including a plurality of peaks 16 and valleys 17 aligned in the length direction D1. In the example shown in FIG. 5 , peak 16 appears at a position overlapping valley 58 , and valley 17 appears at a position overlapping peak 57 .

A reference S21 represents the amplitude of the peaks 16 and the valleys 17 when the wiring board 10 is not under tension. Amplitude S21 may be the same as or different from amplitude S11. For example, amplitude S21 may be smaller than amplitude S11. For example, the amplitude S21 may be 0.9 times or less, 0.8 times or less, or 0.6 times or less the amplitude S11. The amplitude S21 may be 0.1 times or more the amplitude S11, or may be 0.2 times or more. Note that "the amplitude S21 is smaller than the amplitude S11" is a concept that includes the case where peaks and valleys do not appear on the surface of the wiring board 10 on the second surface 22 side.

Reference character F21 represents the period of the peaks 16 and the valleys 17 when the wiring board 10 is not under tension. The period F21 may be the same as the period F11 of the peaks 11 and the valleys 12 .

FIG. 6 shows another example of a cross-sectional view of the wiring board 10. As shown in FIG. As shown in FIG. 6, the width M11 of the peak portion 11 may be smaller than the width M21 of the valley portion 12 when the wiring board 10 is not under tension. Such peaks 11 may occur, for example, when the peaks and valleys of the first surface 21 of the base material 20 are deformed over time and the influence of the deformation is transmitted to the bellows-shaped portion 13 . The width M11 of the peak portion 11 and the width M21 of the valley portion 12 are the width of the peak portion 11 and the width of the valley portion 12 at the center of the amplitude S11. The width M11 of the peak portion 11 is preferably 0.3 times or more the width M21 of the valley portion 12, may be 0.5 times or more, or may be 0.7 times or more. The width M11 of the peak portion 11 may be less than 1.0 times the width M21 of the valley portion 12, may be 0.9 times or less, may be 0.8 times or less, or may be 0.8 times or less. It may be 7 times or less.

FIG. 7 shows another example of a cross-sectional view of the wiring board 10. As shown in FIG. As shown in FIG. 7 , the period F21 of the peaks 16 and the valleys 17 may be greater than the period F11 of the peaks 11 and the valleys 12 . For example, the period F21 may be 1.1 times or more, 1.2 times or more, 1.5 times or more, or 2.0 times or more the period F11. good too. Note that “the period F21 is longer than the period F11” is a concept that includes the case where peaks and valleys do not appear on the surface of the wiring board 10 on the second surface 22 side.

FIG. 8 shows another example of a cross-sectional view of the wiring board 10. As shown in FIG. As shown in FIG. 8, the positions of the peaks 16 and the valleys 17 may be shifted by J from the positions of the valleys 12 and the peaks 11 . The deviation amount J is, for example, 0.1×F11 or more, and may be 0.2×F11 or more.

(Method for manufacturing wiring board)
Next, a method for manufacturing the wiring board 10 will be described with reference to FIGS. 9(a) to 9(c).

First, as shown in FIG. 9(a), a substrate preparation step for preparing the substrate 20 is performed. Reference L0 represents the dimension in the x-direction of the substrate 20 in an untensioned state.

Then, as shown in FIG.9(b), the 1st elongation process of elongating the base material 20 is implemented. The first stretching step applies a first tension T to the substrate 20 in the x-direction to stretch the substrate 20 to the dimension L1. In the first stretching step, the substrate 20 may be tensioned in the x-direction and in a direction crossing the x-direction. For example, in a first stretching step, the substrate 20 may be tensioned in the x-direction and the y-direction.

The elongation rate (=(L1−L0)×100/L0) of the base material 20 in the x direction is, for example, 10% or more, and may be 30% or more. The elongation rate of the base material 20 is, for example, 200% or less, and may be 100% or less. The elongation step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the base material 20, the temperature of the base material 20 is 50 to 100 degreeC, for example.

Then, as shown in FIG.9(b), a wiring formation process is implemented. In the wiring forming step, the wiring 50 is provided on the first surface 21 of the base material 20 stretched by the first tension T in the first stretching step. For example, a conductive paste containing a base material and conductive particles is printed on the first surface 21 of the substrate 20 .
Printing may be performed such that there are slits 60 in the traces 50 . Alternatively, the slits 60 may be formed by processing the wiring 50 after forming the wiring 50 on the base material 20 . For example, the slits 60 may be formed by irradiating the wiring 50 with a laser. For example, the slit 60 may be formed by punching out a portion of the wiring 50 using a mold. For example, the slit 60 may be formed by cutting a portion of the wiring 50 using a cutter blade. A cutting plotter is an example of a device that processes the wiring 50 using a cutter blade.

After that, a first contraction step is performed to remove the first tension T from the substrate 20 . As a result, the base material 20 shrinks in the x direction, as indicated by arrow C in FIG. 9(c). When the base material 20 shrinks, the wiring 50 also deforms. The deformation of the wiring 50 occurs as a bellows shape as described above. Thus, the wiring substrate 10 with the bellows-shaped portion exposed can be obtained.

According to the present embodiment, wiring 50 of wiring board 10 has a plurality of peaks 57 . When the base material 20 of the wiring board 10 expands, the wiring 50 can follow the elongation of the base material 20 by deforming so as to reduce the amplitude of the peaks 57 . Therefore, it is possible to suppress an increase in the total length of the wiring 50 and a decrease in the cross-sectional area of the wiring 50 due to the elongation of the base material 20 . As a result, it is possible to suppress an increase in the resistance value of the wiring 50 due to the elongation of the wiring substrate 10 . Moreover, it is possible to suppress the occurrence of damage such as cracks in the wiring 50 .

An example of the effect related to the resistance value of the wiring 50 will be described. The electrical resistance value of the wiring 50 in the first state in which no tension is applied to the wiring board 10 in the x direction is referred to as the first electrical resistance value. Also, the resistance value of the wiring 50 in the second state in which the wiring board 10 is tensioned in the x direction is referred to as the second electrical resistance value. In the second state, wiring board 10 is elongated by 30% compared to the first state. According to this embodiment, by forming the bellows-shaped portion in the wiring 50, the ratio of the absolute value of the difference between the first electrical resistance value and the second electrical resistance value to the first electrical resistance value can be reduced. The ratio is, for example, 20% or less, more preferably 10% or less, and even more preferably 5% or less.

FIG. 10 is an enlarged cross-sectional view showing wiring board 10 in a third state in which wiring board 10 is stretched by 25% compared to the first state by applying tension to wiring board 10 in the x direction. Symbols S12 and F12 represent the amplitude and period of the bellows-shaped portion 13 in the third state. Symbols S22 and F22 represent the amplitude and period of the bellows-shaped portion 18 in the third state. The amplitude S12 in the third state is, for example, 0.8 times or less the amplitude S11 in the first state, may be 0.7 times or less, or may be 0.6 times or less. The amplitude S12 is, for example, 0.2 times or more the amplitude S11, may be 0.3 times or more, or may be 0.4 times or more.

Symbols M12 and M22 respectively represent the dimensions in the length direction D1 of the peaks 11 and the valleys 12 in the third state. The dimension M12 and the dimension M22 in the third state are larger than the dimension M11 of the peak portion 11 and the dimension M21 of the valley portion 12 in the first state.

When the wiring substrate 10 is stretched, the dimensions of the peaks 11 and the valleys 12 may increase while maintaining the ratio between them. The ratio of peaks 11 in the third state is represented by symbol X2. The ratio X2 is calculated by M12/(M12+M22). The ratio X2 is equivalent to X1 described above in the first state, and is, for example, 0.40 or more and 0.60 or less. Further, the absolute value of the difference between the ratio X1 and the ratio X2 is, for example, 0.20 or less, may be 0.15 or less, may be 0.10 or less, or may be 0.08 or less. It may be 0.06 or less, or 0.04 or less.

Further, according to the present embodiment, since wiring 50 includes slit 60, control of peak portion 11 is facilitated. For example, it is possible to suppress irregular periods of the peaks 11 in the length direction D1. For example, it is possible to prevent the direction in which the peak portion 11 extends from deviating from the width direction D2. For example, it is possible to suppress a local increase in the height of the peak portion 11 . Therefore, when the loop antenna 1 is configured using the wiring board 10, the width W3 of the gap 75 between the two wires 50 can be suppressed from changing depending on the position. Therefore, it is possible to provide the loop antenna 1 having stable characteristics.

An element configured by the wiring 50 is not limited to the loop antenna 1 . The wiring 50 can constitute various elements that conduct power, signals, and the like. For example, the wiring 50 may constitute an antenna other than the loop antenna 1 . For example, the wiring 50 may constitute sensors, shields, and the like.
The application of the wiring board 10 is not limited to the loop antenna 1 . Applications of the wiring board 10 include the healthcare field, the medical field, the nursing care field, the electronics field, the sports/fitness field, the beauty field, the mobility field, the livestock/pet field, the amusement field, the fashion/apparel field, the security field, and the military field. , distribution, education, building materials/furniture/decoration, environmental energy, agriculture, forestry and fisheries, and robots. For example, a product to be attached to a part of the human body such as an arm is constructed using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be stretched, for example, by attaching the wiring board 10 to the body in a stretched state, the wiring board 10 can be brought into closer contact with a part of the body. Therefore, it is possible to realize a good wearing feeling. In addition, since it is possible to suppress the decrease in the electrical resistance value of the wiring 50 when the wiring board 10 is elongated, the wiring board 10 can have good electrical characteristics. In addition, since the wiring board 10 can be stretched, it can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a human being. Examples of such products include vital sensors, masks, hearing aids, toothbrushes, plasters, poultices, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, drug packs, bandages, disposable bioelectrodes, diapers, rehabilitation equipment, and home appliances. Products, displays, signage, personal computers, mobile phones, mice, speakers, sportswear, wristbands, headbands, gloves, swimwear, supporters, balls, gloves, rackets, clubs, bats, fishing rods, relay batons and gymnastics equipment, In addition, grips, equipment for physical training, floats, tents, swimwear, bibs, goal nets, goal tapes, chemical penetration beauty masks, electrical stimulation diet products, pocket warmers, false nails, tattoos, automobiles, planes, trains, ships, bicycles , strollers, drones, wheelchairs, seats, instrument panels, tires, interiors, exteriors, saddles, handles, roads, rails, bridges, tunnels, gas and water pipes, electric wires, tetrapods, rope collars, leads, harnesses, animals tags, bracelets, belts, etc., game consoles, haptic devices such as controllers, luncheon mats, tickets, dolls, stuffed animals, support goods, hats, clothes, glasses, shoes, insoles, socks, stockings, slippers, innerwear, Scarves, earmuffs, bags, accessories, rings, watches, ties, personal ID recognition devices, helmets, packages, IC tags, PET bottles, stationery, books, pens, carpets, sofas, bedding, lighting, doorknobs, handrails, vases, Beds, mattresses, cushions, curtains, doors, windows, ceilings, walls, floors, batteries, vinyl houses, nets, robot hands, and robot exteriors can be mentioned.

Various modifications can be made to the above-described embodiment. Modifications will be described below with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment are used for the portions that can be configured in the same manner as in the above-described embodiment, Duplicate explanations are omitted. Further, when it is clear that the effects obtained in the above-described embodiment can also be obtained in the modified example, the explanation thereof may be omitted.

(First modification)
Although an example in which the wiring 50 is provided on the base material 20 has been described in the above-described embodiment, the present invention is not limited to this. This modification shows an example in which the wiring 50 is supported by a support substrate.

FIG. 11 is a cross-sectional view of wiring board 10 according to a first modification. FIG. 11 is a cross-sectional view in the width direction D2 and corresponds to FIG. 3 in the above embodiment. The wiring board 10 includes at least a base material 20 , a support substrate 40 and wiring 50 .

[Supporting substrate]
The support substrate 40 is a member configured to have lower stretchability than the base material 20 . The support substrate 40 includes a second surface 42 facing the base material 20 and a first surface 41 located on the opposite side of the second surface 42 . In the example shown in FIG. 11 , the wiring 50 is positioned on the first surface 41 side of the support substrate 40 . A second surface 42 of the support substrate 40 is bonded to the base material 20 . Also in this modification, the wiring 50 includes a slit 60 as in the case of the above-described embodiment.

Although not shown, the wiring 50 may be positioned on the second surface 42 side of the support substrate 40 .

An adhesive layer 45 containing an adhesive may be provided between the base material 20 and the support substrate 40 . Examples of adhesives that can be used include acrylic adhesives, silicone adhesives, siloxane primers, thiol primers, and the like. A molecular film of HMDSO (hexamethyldisiloxane), HMDS (hexamethyldisilazane), or the like, which is produced by a gas phase method, may be used as the adhesive layer 45 . The thickness of the adhesive layer 45 is, for example, 5 μm or more and 200 μm or less.

FIG. 12 is an example of a cross-sectional view of the wiring board 10 in the length direction D1. In this modification, when the tension is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the peaks and valleys similar to the peaks 57 and valleys 58 of the wiring 50 are supported. It also appears on the substrate 40 . The characteristics and dimensions of the support substrate 40 are set to facilitate the formation of such peaks and valleys. For example, the support substrate 40 has an elastic modulus greater than the first elastic modulus of the substrate 20 . In the following description, the elastic modulus of the support substrate 40 is also referred to as the second elastic modulus.

The second elastic modulus of the support substrate 40 is, for example, 100 MPa or more, may be 1 GPa or more, or may be 10 GPa or more. The second elastic modulus of the support substrate 40 is, for example, 10 times or more, may be 100 times or more, or may be 1000 times or more the first elastic modulus of the base material 20 . The second elastic modulus of the support substrate 40 is, for example, 50000 times or less, may be 10000 times or less, or may be 5000 times or less the first elastic modulus of the base material 20 . By setting the second elastic modulus of the support substrate 40 in this manner, it is possible to prevent the period F11 of the peaks 57 and the valleys 58 from becoming too small. Moreover, it is possible to suppress the occurrence of local bending at the peaks 57 and the valleys 58 .
If the modulus of elasticity of the support substrate 40 is too low, the support substrate 40 is likely to deform during the process of forming the wirings 50 , and as a result, alignment of the wirings 50 with respect to the support substrate 40 becomes difficult. Further, if the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 when relaxed, and the base material 20 is likely to crack or break.

The thickness T3 of the support substrate 40 is, for example, 500 nm or more, and may be 1 μm or more. The thickness T3 of the support substrate 40 is, for example, 10 μm or less, and may be 5 μm or less. If the thickness T3 of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming members such as the wirings 50 on the support substrate 40 . If the thickness T3 of the support substrate 40 is too large, it becomes difficult to restore the base material 20 during relaxation, and the desired expansion and contraction of the base material 20 cannot be obtained.

Examples of materials that can be used for the support substrate 40 include polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, and acrylic resin. Among them, polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.

As a method of calculating the second modulus of elasticity of the support substrate 40, a method of performing a tensile test based on ASTM D882 using a sample of the support substrate 40 can be adopted.

(Method for manufacturing wiring board)
Next, a method for manufacturing the wiring board 10 according to this modification will be described with reference to FIGS.

First, as shown in FIG. 13A, a support substrate 40 is prepared. Subsequently, as shown in FIG. 13A, wiring 50 is provided on the first surface 41 of the support substrate 40 . For example, first, a conductive layer such as a copper layer is formed on the first surface 41 of the support substrate 40 by vapor deposition, plating, or the like. Subsequently, the conductive layer is processed using a photolithography method and an etching method. Thereby, the wiring 50 can be obtained on the first surface 41 .
Photolithography and etching may be performed to form slits 60 in wiring 50 . Alternatively, the slits 60 may be formed by processing the wiring 50 after forming the wiring 50 on the support substrate 40 . For example, the slits 60 may be formed by irradiating the wiring 50 with a laser.

Subsequently, as shown in FIG. 13(b), a first elongation step of elongating the base material 20 is performed. Then, a wiring formation process is implemented. In the wiring forming step, the second surface 42 of the support substrate 40 provided with the wiring 50 is joined to the first surface 21 of the base material 20 in the extended state. An adhesive layer 45 may be provided between the base material 20 and the support substrate 40 .

After that, a first contraction step is performed to remove the first tension T from the substrate 20 . As a result, the base material 20 shrinks in the x direction, as indicated by arrow C in FIG. 13(c). When the base material 20 shrinks, the support substrate 40 and the wiring 50 are also deformed. Deformation of the support substrate 40 and the wiring 50 occurs as a bellows-shaped portion as described above.

Also in this modified example, since the wiring 50 includes the slit 60, the control of the peak portion 11 is facilitated. For example, it is possible to suppress irregular periods of the peaks 11 in the length direction D1. For example, it is possible to prevent the direction in which the peak portion 11 extends from deviating from the width direction D2. For example, it is possible to suppress a local increase in the height of the peak portion 11 . Therefore, when the loop antenna 1 is configured using the wiring board 10, the width W3 of the gap 75 between the two wires 50 can be suppressed from changing depending on the position. Therefore, for example, it is possible to suppress a change in inductance of the loop antenna 1 due to expansion and contraction of the base material 20 .

(Second modification)
FIG. 14 is a cross-sectional view showing a wiring substrate 10 according to a second modified example. As shown in FIG. 14, the base material 20 may include slits 28 overlapping the slits 60 of the wiring 50 in plan view. The slit of the base material 20 is also called a base material slit. The substrate slit 28 penetrates the substrate 20 . The base material slit 28 extends in the longitudinal direction D1 similarly to the slit 60 . By forming the substrate slit 28 in the substrate 20, the direction in which the plurality of peaks are arranged is more likely to be parallel to the length direction D1.

The width W4 of the substrate slit 28 is, for example, 1.0 times or less the width W2 of the slit 60, may be 0.9 times or less, or may be 0.8 times or less. The substrate slit 28 may be formed in the substrate 20 after the wiring forming process.

(Third modification)
FIG. 15 is a cross-sectional view showing a wiring board 10 according to a third modified example. As shown in FIG. 15, the support substrate 40 may include slits 43 overlapping the slits 60 of the wiring 50 in plan view. The slit of the support substrate 40 is also called a support substrate slit. The support substrate slit 43 penetrates the support substrate 40 . The support substrate slit 43 extends in the length direction D1, similarly to the slit 60 . By forming the support substrate slit 43 in the support substrate 40, the direction in which the plurality of peaks are arranged is more likely to be parallel to the length direction D1. Although not shown, the adhesive layer 45 may include slits overlapping the slits 60 of the wirings 50 in plan view.

The width W5 of the support substrate slit 43 is, for example, 1.0 times or less the width W2 of the slit 60, may be 0.9 times or less, or may be 0.8 times or less. The substrate slit 28 may be formed in the supporting substrate 40 before the wiring forming process, or may be formed in the supporting substrate 40 after the wiring forming process.

(Fourth modification)
FIG. 16 is a cross-sectional view showing a wiring board 10 according to a fourth modification. As shown in FIG. 16 , the substrate 20 may include the substrate slit 28 and the support substrate 40 may include the support substrate slit 43 . The substrate slit 28 and the support substrate slit 43 may overlap in plan view.

(Fifth Modification)
FIG. 17 is a plan view showing wiring 50 according to the fifth modification. As shown in FIG. 17, the first side edge 501 may include a stepped portion 501a that overlaps the edge 65 of the slit 60 when viewed along the width direction D2. The step portion 501a is configured such that the first side edge 501 is displaced inward from the connection portion 55 toward the first portion 51 in the length direction D1. Similarly, the second side edge 502 may include a stepped portion 502a overlapping the edge 65 of the slit 60 when viewed along the width direction D2. The step portion 502a is configured such that the second side edge 502 is displaced outward from the connecting portion 55 toward the second portion 52 in the length direction D1.

According to this modification, the first width W11 of the first portion 51 and the second width W12 of the second portion 52 are larger than in the above-described embodiment. Therefore, it is possible to suppress an increase in the electrical resistance value of the wiring 50 due to the slit 60 . The stepped portion 501a and the stepped portion 502a may be configured such that the sum of the first width W11 and the second width W12 is equal to or equal to the width W1 of the connecting portion 55 . (W11+W12)/W1, which is the ratio of the sum of the first width W11 and the second width W12 to the width W1, is, for example, 0.90 or more, may be 0.95 or more, or may be 0.98 or more. good too. (W11+W12)/W1 is, for example, 1.10 or more, may be 1.05 or less, or may be 1.02 or less.

(Sixth modification)
FIG. 18 is a plan view showing wiring 50 according to the sixth modification. As shown in FIG. 18, edges 65 of slit 60 may include curved contours. Thereby, for example, it is possible to suppress the occurrence of disconnection of the wiring 50 at the end 65 . The radius of curvature of the end 65 in plan view is, for example, 10 μm or more, may be 50 μm or more, or may be 100 μm or more.

(Seventh Modification)
FIG. 19 is a plan view showing wiring 50 according to the seventh modification. As shown in FIG. 19, wiring 50 may include through holes 66 connected to ends 65 of slits 60 . Thereby, for example, it is possible to suppress the occurrence of disconnection of the wiring 50 at the end 65 . The through hole 66 penetrates the wiring 50 . Through holes 66 may include curved contours. A dimension W6 of the through-hole 66 in the width direction D2 may be larger than the width W2 of the slit 60 .

(Eighth modification)
FIG. 20 is a plan view showing wiring 50 according to the eighth modification. As shown in FIG. 20, the slits of the wiring 50 may include a first slit 61 and a second slit 62 located at different positions in the width direction D2. The first slit 61 and the second slit 62 extend in the length direction D1. The second slit 62 is located outside the first slit 61 . In this case, the wiring 50 may include the third portion 53 in addition to the first portion 51 and the second portion 52 . A third portion 53 is a portion of the wiring 50 located between the first slit 61 and the second slit 62 . The third portion 53 extends in the length direction D1. The connecting portion 55 electrically connects the first portion 51 , the second portion 52 and the third portion 53 .

(Ninth modification)
FIG. 21 is a plan view showing wiring 50 according to the ninth modification. As shown in FIG. 21, the slits of the wiring 50 may include a first slit 61, a second slit 62, and a third slit 63 at different positions in the width direction D2. The first slit 61, the second slit 62 and the third slit 63 extend in the length direction D1. The second slit 62 is located outside the first slit 61 . The third slit 63 is located between the first slit 61 and the second slit 62 in the width direction D2. In this case, the wiring 50 may include the third portion 53 and the fourth portion 54 in addition to the first portion 51 and the second portion 52 . A third portion 53 is a portion of the wiring 50 positioned between the first slit 61 and the third slit 63 . A fourth portion 54 is a portion of the wiring 50 positioned between the second slit 62 and the third slit 63 . The third portion 53 and the fourth portion 54 extend in the length direction D1. The connecting portion 55 electrically connects the first portion 51 , the second portion 52 , the third portion 53 and the fourth portion 54 .

(Tenth Modification)
FIG. 22 is a plan view showing a wiring board 10 according to a tenth modification. As shown in FIG. 22 , the wiring 50 may have a plurality of slits 60 arranged in the length direction of the wiring 50 . For example, line 50 may include a plurality of x-slits 60x formed in x-line 50x. For example, the wiring 50 may have a plurality of y-slits 60y formed in the y-wiring 50y.

FIG. 23 is a plan view showing an enlarged wiring 50 in FIG. Reference U1 represents the length of the slit 60 . The wiring 50 includes a plurality of slits 60 arranged in the length direction D1. In this case, the wiring 50 includes a plurality of first portions 51 and a plurality of second portions 52 arranged in the length direction D1, and a plurality of connection portions 55 electrically connecting the first portions 51 and the second portions 52. ,including.

A reference U2 represents the length of the connection portion 55 . The slits 60 are configured such that the ratio of the sum of the length U1 of the slits 60 to the total length of the wiring 50 is equal to or greater than a certain value. The total length of the wiring 50 is the sum of the length U1 of the slit 60 and the length U2 of the connecting portion 55. As shown in FIG. The ratio of the total length U1 of the slits 60 to the total length of the wiring 50 is, for example, 0.50 or more, may be 0.60 or more, or may be 0.70 or more. The ratio of the total length U1 of the slits 60 to the total length of the wiring 50 is, for example, less than 1.00, may be 0.95 or less, or may be 0.90 or less.

Length U1 of slit 60 may be greater than length U2 of connecting portion 55 . U2/U1, which is the ratio of length U1 to length U2, is, for example, 1.1 or more, may be 1.2 or more, may be 1.5 or more, or may be 2.0 or more. may

(11th modification)
FIG. 24 is a plan view showing wiring 50 according to the eleventh modification. As shown in FIG. 24, the slits of the wiring 50 may include a plurality of first slits 61 arranged in the length direction D1 and a plurality of second slits 62 arranged in the length direction D1. The first slit 61 and the second slit 62 are located at different positions in the width direction D2. In this case, the wiring 50 includes a plurality of first portions 51, a plurality of second portions 52, and a plurality of third portions 53 arranged in the length direction D1, and the first portion 51, the second portion 52, and the third portion 53. and a plurality of connection portions 55 for electrical connection.

(Twelfth Modification)
FIG. 25 is a plan view showing wiring 50 according to the twelfth modification. As shown in FIG. 25, the position of the end of the second slit 62 in the length direction D1 may be different from the position of the end of the first slit 61 in the length direction D1. In this case, the wiring 50 has a first connection portion 551 that electrically connects the first portion 51 and the third portion 53 and a second connection portion 552 that electrically connects the second portion 52 and the third portion 53 . , may be included. The first connection portion 551 extends from the first side edge 501 to the second slit 62 in the width direction D2. The second connection portion 552 extends from the second side edge 502 to the first slit 61 in the width direction D2.

(Thirteenth Modification)
FIG. 26 is a plan view showing wiring 50 according to the thirteenth modification. As shown in FIG. 26, the wiring 50 may include a through hole 67 located at the connecting portion 55. As shown in FIG. The through hole 67 penetrates the wiring 50 . The through hole 67 may be positioned between two first slits 61 aligned in the length direction D1. The through hole 67 may be positioned between two second slits 62 aligned in the length direction D1.

(14th modification)
FIG. 27 is a plan view showing wiring 50 according to the fourteenth modification. As shown in FIG. 27, the through hole 67 may be positioned so as not to overlap the slit in the length direction D1.

(Fifteenth modification)
FIG. 28 is a plan view showing wiring 50 according to the fifteenth modification. As shown in FIG. 28, the wiring 50 may include a plurality of through holes 67 positioned in the first portion 51 and arranged in the length direction D1. The wiring 50 may include a plurality of through holes 67 positioned in the second portion 52 and arranged in the length direction D1. The through hole 67 of the first portion 51 may overlap the through hole 67 of the second portion 52 when viewed along the width direction D2. Although not shown, the through hole 67 of the first portion 51 does not have to overlap the through hole 67 of the second portion 52 when viewed along the width direction D2.

(16th modification)
FIG. 29 is a plan view showing a wiring board 10 according to a sixteenth modification. As shown in FIG. 29, when wiring 50 has a plurality of slits 60 arranged in the length direction, wiring 50 may include corner slits 60z formed in corner wiring 50z. FIG. 30 is a plan view showing an enlarged corner wiring 50z.

(17th modification)
FIG. 31 is a plan view showing a wiring board 10 according to a seventeenth modification. As in the fifth modification described above, the first side edge 501 of the corner wiring 50z may include a stepped portion 501a that overlaps the edge 65 of the slit 60 when viewed along the width direction D2. . Similarly, the second side edge 502 of the corner wiring 50z may include a stepped portion 502a that overlaps the end 65 of the slit 60 when viewed along the width direction D2. According to this modification, it is possible to suppress an increase in the electrical resistance value of the corner wiring 50z due to the corner slit 60z.

(18th modification)
FIG. 32 is a plan view showing a wiring board 10 according to an eighteenth modification. As in the sixth variant described above, the edge 65 of corner slit 60z may include a curved profile. As shown in FIG. 32, corner 68 of corner slit 60z may include a curved profile.

(Nineteenth Modification)
FIG. 33 is a plan view showing a wiring board 10 according to a nineteenth modification. As in the seventh modification described above, the corner wire 50z may include a through hole 66 connected to the end 65 of the corner slit 60z. As shown in FIG. 33, corner wiring 50z may include through holes 66 connected to corners 68 of corner slits 60z.

(Twentieth Modification)
FIG. 34 is a cross-sectional view of wiring board 10 according to a twentieth modification. FIG. 34 is a cross-sectional view in the width direction D2 and corresponds to FIG. 3 in the above embodiment. The wiring board 10 includes at least a substrate 20 , a control layer 30 and wiring 50 . The wiring board 10 may include a support substrate 40 .

[Control layer]
The control layer 30 is a layer provided to control expansion and contraction of the base material 20 . The control layer 30 is arranged so as to overlap the wiring 50 or be close to the wiring 50 when viewed along the normal direction of the first surface 21 . The control layer 30 may overlap the entire wiring 50 .

Control layer 30 may have a higher modulus of elasticity than the first modulus of elasticity of substrate 20 . In the following description, the elastic modulus of the control layer 30 is also referred to as the third elastic modulus. The third elastic modulus of the control layer 30 is, for example, 100 MPa or more, may be 1 GPa or more, or may be 10 GPa or more. The third elastic modulus of the control layer 30 is, for example, 1.1 times or more, may be 2 times or more, may be 10 times or more, or may be 100 times the first elastic modulus of the base material 20. or more.

The third modulus of elasticity of control layer 30 may be less than or equal to the first modulus of elasticity of substrate 20 . The third elastic modulus of the control layer 30 is, for example, 1.0 times or less, may be 0.9 times or less, or may be 0.8 times or less the first elastic modulus of the base material 20. good.

The material of the control layer 30 may or may not be stretchable. If the control layer 30 comprises a stretchable material, the control layer 30 can be resistant to deformation.

An example of a non-stretchable material used for the control layer 30 is resin. As the resin, a general resin can be used, and for example, any of thermoplastic resin, thermosetting resin, photo-setting resin and the like can be used. If the control layer 30 contains a resin or elastomer, the control layer 30 can also be made of a resin base material.

The control layer 30 may contain a metallic material. Examples of metallic materials are copper, aluminum, stainless steel, and the like.

The stretchability of the material used for the control layer 30 may be the same or similar to the stretchability of the substrate 20 .
An example of a stretchable material is an elastomer. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used. Examples of elastomers include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, amide-based elastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadiene, polyisobutylene, polystyrene-butadiene, and polychloroprene. When the material forming the control layer 30 is one of these resins, the control layer 30 may have transparency. The control layer 30 may have a light blocking property, for example, a property of blocking ultraviolet rays. For example, control layer 30 may be black. The color of the control layer 30 and the color of the substrate 20 may be the same or different.

The control layer 30 may have insulating properties. A resin or an elastomer can be used as the material of the control layer 30 having insulating properties.

The thickness T4 of the control layer 30 may be any thickness that can withstand expansion and contraction, and is appropriately selected according to the material of the control layer 30 and the like. The thickness T4 of the control layer 30 is, for example, 0.1 μm or more, may be 1 μm or more, or may be 10 μm or more. The thickness of the control layer 30 is, for example, 5 mm or less, may be 1 mm or less, may be 500 μm or less, or may be 100 μm or less. If the control layer 30 is too thin, the effect of controlling the period of the accordion-shaped portion may not be sufficiently obtained. Also, if the control layer 30 is too thick, even if the elastic modulus of the control layer 30 satisfies the above relationship, the bending rigidity of the control layer 30 increases, and the stretchability of the wiring board 10 may decrease. .

A method for forming the control layer 30 is appropriately selected according to the material and the like. For example, after the wiring 50 is formed on the base material 20 or the support substrate 40, the material forming the control layer 30 may be provided on the wiring 50 by a printing method. A member such as a metal foil or a resin film that constitutes the control layer 30 may be attached to the base material 20 or the support substrate 40 via an adhesive layer or the like.

The adhesive layer for attaching the control layer 30 to the substrate 20 or the support substrate 40 may be a molecular adhesive layer. The term "molecular adhesion" refers to the application of a molecular adhesive compound between two adherends to bond the two adherends by chemical bonding.

A known molecular adhesive can be used as the molecular adhesive used for the molecular adhesive layer, and the molecular adhesive is appropriately selected according to the use of the wiring board 10 and the like. Examples include silane coupling agents and thiol compounds. The thickness of the molecular adhesion layer is, for example, about several nm to 100 nm.

FIG. 35 is an example of a cross-sectional view of the wiring board 10 in the length direction D1. In the example shown in FIG. 35, the control layer 30 is located on the surface of the wiring substrate 10, so the amplitude S11 is the amplitude of peaks and valleys of the control layer 30. In the example shown in FIG.

By including the control layer 30 in the wiring board 10, for example, it is possible to suppress the width W3 of the gap 75 between the wirings 50 from changing due to expansion and contraction of the base material 20. FIG. Therefore, it is possible to suppress the inductance of the loop antenna 1 from changing.

(21st modification)
FIG. 36 is a plan view showing wiring 50 according to the twenty-first modification. As shown in FIG. 36, the control layer 30 may include a first control layer 31 that overlaps the gap 75 between the two wires 50 in plan view. The first control layer 31 extends in the length direction D1.

FIG. 37 is a cross-sectional view of the wiring board 10 of FIG. 36 taken along line CC. As shown in FIG. 37, the first control layer 31 may overlap side edges of two adjacent wirings 50 . The width W7 of the first control layer 31 is, for example, 50 μm or more, may be 100 μm or more, or may be 200 μm or more. The width W7 is, for example, 5 mm or less, may be 2 mm or less, or may be 1 mm or less.

The first control layer 31 can suppress the width W3 of the gap 75 between the two wirings 50 from changing. Therefore, for example, it is possible to suppress a change in inductance of the loop antenna 1 due to expansion and contraction of the base material 20 .

Although not shown, the wiring 50 may not include the slit 60 . Even in this case, by providing the first control layer 31, it is possible to suppress the width W3 of the gap 75 between the two wirings 50 from changing. Therefore, for example, it is possible to suppress a change in inductance of the loop antenna 1 due to expansion and contraction of the base material 20 .

(22nd modification)
FIG. 38 is a plan view showing the control layer 30 according to the twenty-second modification. As shown in FIG. 38, the control layer 30 may include a first control layer 31 overlapping the gap 75 between the two corner wirings 50z in plan view.

Although not shown, the corner wiring 50z may not include the corner slit 60z. Even in this case, by providing the first control layer 31, it is possible to suppress a change in the width W3 of the gap 75 between the two corner wirings 50z. Therefore, for example, it is possible to suppress a change in inductance of the loop antenna 1 due to expansion and contraction of the base material 20 .

(23rd modification)
FIG. 39 is a plan view showing the control layer 30 according to the twenty-third modification. As shown in FIG. 39, the control layer 30 may include a plurality of second control layers 32 aligned in the length direction D1. The area moment of inertia of wiring board 10 in the portion where second control layer 32 is located differs from the area moment of inertia of wiring substrate 10 in the portion where second control layer 32 is not located. When the plurality of second control layers 32 are arranged in the length direction D1, the geometrical moment of inertia of the wiring board 10 periodically changes along the length direction D1. This makes it easier to form the ridges 11 on the wiring substrate 10 with a period corresponding to the second control layer 32 . That is, the period of the peaks 11 can be stabilized.

As shown in FIG. 39, the second control layer 32 may overlap two wirings 50 extending in parallel. For example, the second control layer 32 may extend from the first side edge 501 of the inner trace 50 to the second side edge 502 of the outer trace 50 . The direction in which the second control layer 32 extends may be parallel to the width direction D2 or may be deviated from the width direction D2.

The width W8 of the second control layer 32 is, for example, 50 μm or more, may be 100 μm or more, or may be 200 μm or more. The width W8 is, for example, 5 mm or less, may be 2 mm or less, or may be 1 mm or less.

Although not shown, the wiring 50 may not include the slit 60 . Even in this case, the period of the peaks 11 can be stabilized by providing the second control layer 32 . Therefore, for example, it is possible to suppress a change in inductance of the loop antenna 1 due to expansion and contraction of the base material 20 .

(24th modification)
FIG. 40 is a plan view showing the control layer 30 according to the twenty-fourth modification. As shown in FIG. 40, the second control layer 32 may overlap two corner wires 50z. For example, the second control layer 32 may extend from the first side edge 501 of the inner corner wire 50z to the second side edge 502 of the outer corner wire 50z.

The second control layer 32 includes an inner edge 321 , an outer edge 322 and a pair of side edges 323 . The inner edge 321 is the edge of the second control layer 32 located inside. The outer edge 322 is the edge of the second control layer 32 located on the outside. Side edges 323 extend from inner edge 321 to outer edge 322 .

As shown in FIG. 40, the width W8 of the second control layer 32 may at least partially decrease inward. That is, the distance between the pair of side ends 323 may decrease toward the inside. As shown in FIG. 40, the period of the second control layer 32 when viewed along the first side edge 501 of the inner corner wire 50z is the same as the second side edge 502 of the outer corner wire 50z. It is smaller than the period of the second control layer 32 when viewed along. By making the width W8 of the second control layer 32 on the inside smaller than the width W8 of the second control layer 32 on the outside, the ratio of the width of the second control layer 32 to the period of the second control layer 32 changes depending on the position. can be suppressed.

The ratio of the width of the second control layer 32 at the inner end 321 to the width of the second control layer 32 at the outer end 322 is, for example, 0.99 or less, may be 0.95 or less, or 0.90 or less. may be

Although not shown, the corner wiring 50z may not include the corner slit 60z. Even in this case, the period of the peaks 11 can be stabilized by providing the second control layer 32 . Therefore, for example, it is possible to suppress a change in inductance of the loop antenna 1 due to expansion and contraction of the base material 20 .

(25th modification)
FIG. 41 is a plan view showing a wiring board 10 according to a twenty-fifth modification. As shown in FIG. 41, corner wiring 50z and corner slit 60z may have curved contours. The base material 20 may have a curved contour corresponding to the corner wiring 50z.

(26th modification)
The number of turns of the loop antenna 1 configured by the wiring 50 is arbitrary. For example, as shown in FIG. 42, the number of turns may be one. As shown in FIG. 42, the loop of wiring 50 does not have to include an overlapping portion. The overlapping portion is a combination of the first portion of the wiring and the second portion of the wiring. The second portion extends parallel to the first portion. Currents in the same direction flow through the first portion and the second portion at the same timing. Although not shown, the loop of the wiring 50 may be U-shaped. Although not shown, the number of turns may be 3 or more.

(27th modification)
FIG. 43 is a plan view showing a wiring board 10 according to a twenty-seventh modification. As shown in FIG. 43, the substrate 20 may have openings 29 located inside the loops of the traces 50 . Aperture 29 extends through substrate 20 .

The modified examples described above may be combined as appropriate.

The present invention will be specifically described based on examples and comparative examples. The present invention is not limited to the description of the following examples as long as the gist thereof is not exceeded.

[Example 1]
(Preparation of base material)
A silicone rubber was applied onto the support and cured. Thus, the base material 20 was formed on the support base. The thickness of the base material 20 was 1.5 mm. Subsequently, a part of the base material 20 was taken out as a sample, and the elastic modulus of the base material 20 was measured by a tensile test according to JIS K625:2010. As a result, the elastic modulus of the base material 20 was 0.03 MPa.

(preparation of support substrate, wiring and control layer)
A polyethylene terephthalate (PET) film having a thickness of 4 μm was prepared as the support substrate 40 . Subsequently, a copper layer having a thickness of 3 μm was formed on the first surface 41 of the support substrate 40 by vapor deposition. Subsequently, the copper layer was processed using photolithography and etching. Thus, wiring 50 extending in the x direction was obtained. The dimension of the wiring 50 in the x-direction was 40 mm. The dimension of the wiring 50 in the y-direction perpendicular to the x-direction is 4 mm.

Subsequently, ink containing dissolved urethane resin was applied onto the wiring 50 and the support substrate 40 by screen printing to form the control layer 30 . The thickness of the control layer 30 is 30 μm.

Subsequently, an adhesive was applied onto the second surface 42 of the support substrate 40 to form an adhesive layer 45 . Subsequently, the control layer 30, the wiring 50, the support substrate 40, and the adhesive layer 45 were processed along the x direction. As a result, one slit extending in the x direction was formed in the control layer 30 , the wiring 50 , the support substrate 40 and the adhesive layer 45 . The slit passes through the center of the wire 50 in the y-direction. The slit length in the x-direction is 20 mm. The distance from the end of the slit to the end of the wiring 50 in the x direction is 10 mm.

The wiring 50 is divided into two parts in the y direction by one slit. The width of each portion is approximately 2 mm.

(Bonding of base material and support substrate)
Tension was applied to substrate 20 in the x- and y-directions to elongate substrate 20 by 50% in each of the x- and y-directions. That is, tension was applied to the substrate 20 until the dimensions of the substrate 20 in the x and y directions were 1.5 times larger. Further, the support substrate 40 provided with the wiring 50 and the control layer 30 was bonded to the base material 20 via the adhesive layer 45 while the base material 20 was stretched by 50%. Thus, the wiring board 10 including the base material 20, the support substrate 40, the wiring 50, and the control layer 30 was produced.

Subsequently, the tension was removed from the substrate 20, causing the substrate 20 and the support substrate 40 bonded to the substrate 20 to contract. As a result, a plurality of peaks and valleys aligned in the x-direction appeared in the portion of the wiring 50 and the support substrate 40 that overlapped with the wiring 50 .

The direction in which the peak extends was measured in the portion of the wiring 50 where the slit 60 is formed, that is, within a range of 20 mm in the x direction. Four defect crests were confirmed. A defective peak portion is a peak portion whose extending direction deviates from the y direction by 20° or more.

[Example 2]
A wiring substrate 10 was produced under the same conditions as in Example 1, except that three slits were formed. The wiring 50 is divided into four parts in the y direction by three slits. The width of each portion is approximately 1 mm.

In the portion of the wiring 50 where the slit 60 is formed, the direction in which the crest extends was measured. One defective crest was confirmed.

[Example 3]
A wiring substrate 10 was produced under the same conditions as in Example 1, except that seven slits were formed. The wiring 50 is divided into eight parts in the y direction by seven slits. The width of each portion is approximately 0.5 mm.

In the portion of the wiring 50 where the slit 60 is formed, the direction in which the crest extends was measured. One defective crest was confirmed.

[Comparative Example 1]
A wiring substrate 10 was produced under the same conditions as in Example 1, except that no slit was formed.

As in Examples 1 to 3, the direction in which the peaks extend was measured within a range of 20 mm in the x direction. 15 defect crests were confirmed.

1 loop antenna 2 center point 10 wiring board 11 peak 12 valley 16 peak 17 valley 20 substrate 21 first surface 22 second surface 28 substrate slit 29 opening 30 control layer 31 first control layer 32 second control Layer 40 Support substrate 41 First surface 42 Second surface 43 Support substrate slit 45 Adhesive layer 50 Wiring 50x x wiring 50y y wiring 50z corner wiring 501 first side edge 501a stepped portion 502 second side edge 502a stepped portion 51 first portion 52 Second portion 53 Third portion 54 Fourth portion 55 Connecting portion 551 First connecting portion 552 Second connecting portion 57 Mountain portion 58 Valley portion 60 Slit 60x x slit 60y y slit 60z corner slit 61 first slit 62 second slit 63 third slit 65 end 66 through hole 67 through hole

Claims (20)

a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a wiring located on the first surface side of the base material,
The wiring includes a plurality of ridges arranged in the length direction of the wiring, a first side edge and a second side edge extending in the length direction, a slit extending in the length direction, the slit and the first side edge. a first portion located between the side edge and extending in the length direction; a second portion located between the slit and the second side edge and extending in the length direction; and a connection portion that connects the second portion. the wiring includes a corner wiring in which the direction in which the wiring extends changes;
2. The wiring substrate according to claim 1, wherein said slits include corner slits positioned at said corner wirings. 3. The wiring board according to claim 1, wherein said base material includes thermoplastic elastomer, silicone rubber, urethane gel, or silicone gel. The wiring board according to any one of claims 1 to 3, wherein the base material has a slit that overlaps with the slit. 5. The wiring board according to claim 1, further comprising a support substrate that supports said wiring. 6. The wiring board according to claim 5, wherein the elastic modulus of said supporting substrate is ten times or more the elastic modulus of said base material. 7. The wiring board according to claim 5, wherein said supporting substrate contains polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate. The wiring board according to any one of claims 5 to 7, wherein the supporting substrate has a slit that overlaps with the slit. 9. The wiring board according to any one of claims 1 to 8, comprising a control layer positioned on the first surface side of the base material. 10. The wiring board according to claim 9, wherein said control layer has a larger elastic modulus than said base material. comprising two wires extending in parallel,
11. The wiring board according to claim 9, wherein said control layer includes a first control layer positioned between two of said wires and extending in said length direction. 12. The wiring board according to claim 9, wherein said control layer includes a plurality of second control layers arranged in said length direction. comprising two wires extending in parallel,
13. The wiring board according to claim 12, wherein said second control layer overlaps two of said wirings. the wiring includes a corner wiring in which the direction in which the wiring extends changes;
The second control layer overlaps the corner wiring,
14. The wiring board according to claim 12 or 13, wherein the width of the second control layer at least partially decreases inwardly. 15. The wiring substrate according to claim 1, wherein said first side edge includes a stepped portion that overlaps an end of said slit when viewed along the width direction of said wiring. 16. The wiring substrate according to any one of claims 1 to 15, wherein said slit includes curved ends. The slit includes a first slit and a second slit extending in the length direction,
The wiring includes the first portion located between the first slit and the first side edge, the second portion located between the second slit and the second side edge, and the second portion located between the second slit and the second side edge. 17. The wiring board according to any one of claims 1 to 16, further comprising a third portion located between the first slit and the second slit. The wiring board according to any one of claims 1 to 17, wherein the wiring includes a plurality of slits arranged in the length direction. a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a wiring located on the first surface side of the base material and forming a loop,
The wiring includes a plurality of ridges arranged in the length direction of the wiring, a first side edge and a second side edge extending in the length direction, a slit extending in the length direction, the slit and the first side edge. a first portion located between the side edge and extending in the length direction; a second portion located between the slit and the second side edge and extending in the length direction; and a connection portion that connects the second portion. an elongation step of applying a tensile stress to a stretchable base material including a first surface and a second surface located on the opposite side of the first surface to elongate the base material;
a wiring forming step of providing wiring on the first surface side of the base material stretched by the stretching step;
a shrinking step that removes tension from the substrate;
The wiring includes a plurality of ridges arranged in the length direction of the wiring, a first side edge and a second side edge extending in the length direction, a slit extending in the length direction, the slit and the first side edge. a first portion located between the side edge and extending in the length direction; a second portion located between the slit and the second side edge and extending in the length direction; and a connection portion that connects the second portion to the second portion.

Images