JP2022129870A - Circuit device and method for manufacturing circuit device - Google Patents

Abstract

To provide a circuit device capable of improving solderability between a conductor layer and a lead.SOLUTION: A circuit device includes: a substrate having a first surface and a second surface that is an opposite surface to the first surface; an electronic component with a lead; a first solder layer; and a connection member. There is formed a through hole penetrating trough the substrate along a direction from the first surface to the second surface, in the substrate. The internal wall surface of the through hole is covered with a conductor layer where a through hole is formed. The substrate has first wiring and second wiring on the first surface. The first wiring includes a first edge connected to the conductor layer and a second edge that is an edge on the opposite side to the first edge. The second wiring includes a third edge separated from the second edge. The lead is inserted into the through hole. The first solder layer is filled in the through hole, thereby connecting the lead and the conductor layer. The connection member connects the second edge and the third edge.SELECTED DRAWING: Figure 1

Description

The present invention relates to a circuit device and a method of manufacturing a circuit device.

For example, Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2007-250697) describes a multilayer wiring board. A multilayer wiring board described in Patent Document 1 has a plurality of wiring layers and a plurality of insulating layers. The plurality of wiring layers and the plurality of insulating layers are alternately laminated along the thickness direction of the multilayer wiring board. A through hole is formed in the multilayer wiring board so as to penetrate the multilayer wiring board along the thickness direction. The inner wall surface of the through hole is covered with a conductor layer in which the through hole is formed. The leads of the electrical component are inserted into the through holes and connected to the conductor layers by soldering.

A power supply wiring layer is included in the plurality of wiring layers. The power wiring layer is formed over the entire surface between the two insulating layers. Therefore, the heat of the conductor layer is easily diffused to the surroundings through the power supply wiring layer. As a result, it may be difficult for the temperature of the conductor layer to rise.

If the temperature of the conductor layer does not rise easily, the soldering between the conductor layer and the leads may not be performed satisfactorily. To solve this problem, a thermal land is formed in the power supply wiring layer around the conductor layer.

JP 2007-250697 A

However, according to the inventors' intensive studies, the multilayer wiring board described in Patent Document 1 has room for improvement in the solderability between the conductor layer and the leads.

The present invention has been made in view of the problems of the prior art as described above. More specifically, the present invention provides a circuit device capable of improving solderability between conductor layers and leads.

A circuit device of the present invention comprises a substrate having a first surface and a second surface opposite to the first surface, an electrical component having leads, a first solder layer, and a connecting member. A through hole is formed in the substrate so as to extend through the substrate along the direction from the first surface to the second surface. The inner wall surface of the through hole is covered with a conductor layer in which the through hole is formed. The substrate has a first wiring and a second wiring on the first surface. The first trace includes a first end connected to the conductor layer and a second end opposite the first end. The second trace includes a third end spaced apart from the second end. Leads are inserted into the through holes. The first solder layer connects the lead and the conductor layer by filling the through hole. The connecting member connects the second end and the third end.

In the above circuit device, the connection member may be a jumper resistor. In the above circuit device, the connection member may be a jumper wire.

In the above circuit device, the connection member may be the second solder layer. In this case, the second end portion and the third end portion may be separated by a groove formed in a comb shape, or may be separated by a groove formed in a spiral shape.

A method of manufacturing a circuit device according to the present invention includes the steps of preparing a substrate having a first surface and a second surface opposite to the first surface and an electrical component having leads, and attaching the electrical component to the substrate. Prepare. A through hole is formed in the substrate so as to extend through the substrate along the direction from the first surface to the second surface. The inner wall surface of the through hole is covered with a conductor layer in which the through hole is formed. The substrate has a first wiring and a second wiring on the first surface. The first trace includes a first end connected to the conductor layer and a second end opposite the first end. The second trace includes a third end spaced apart from the second end. The process of attaching the electrical component to the substrate is performed by soldering the leads and the conductor layer while the leads are inserted into the through holes. The method of manufacturing a circuit device further includes the step of connecting the first end and the second end with a connecting member after the step of attaching the electrical component to the substrate.

According to the circuit device and circuit device manufacturing method of the present invention, the solderability between the conductor layer and the lead can be improved.

2 is a plan view of the circuit device 100; FIG. 2 is a cross-sectional view of the circuit device 100; FIG. 3A to 3C are process diagrams showing a method of manufacturing the circuit device 100; It is a sectional view of substrate 10 in preparatory process S1. 2 is a cross-sectional view of the circuit device 200; FIG. 3 is a plan view of the circuit device 300; FIG. 3 is a side view of the circuit device 300; FIG. 4 is a plan view of the circuit device 400; FIG. 4 is an enlarged plan view of the circuit device 400; FIG. FIG. 11 is an enlarged plan view of a circuit device 400 according to a modification;

Details of embodiments of the present invention will be described with reference to the drawings. Here, the same reference numerals are given to the same or corresponding parts, and redundant description will not be repeated.

(First embodiment)
A circuit device (hereinafter referred to as "circuit device 100") according to the first embodiment will be described below.

<Configuration of Circuit Device 100>
FIG. 1 is a plan view of the circuit device 100. FIG. FIG. 2 is a cross-sectional view of the circuit device 100. As shown in FIG. As shown in FIGS. 1 and 2, the circuit device 100 includes a substrate 10, electrical components 20, solder layers 30, and connection members 40. As shown in FIGS.

The board 10 is, for example, a multilayer wiring board. Substrate 10 may be a copper inlay substrate. The substrate 10 has a first surface 10a and a second surface 10b. The first surface 10a and the second surface 10b are end surfaces of the substrate 10 in the thickness direction. The second surface 10b is the opposite surface of the first surface 10a.

The substrate 10 has a plurality of wiring layers 11 and a plurality of insulating layers 12 . The plurality of wiring layers 11 and the plurality of insulating layers 12 are alternately stacked along the thickness direction of the substrate 10 such that the wiring layers 11 are positioned on the first surface 10a and the second surface 10b. From another point of view, the wiring layers 11 other than the wiring layers 11 located on the first surface 10 a and the second surface 10 b are sandwiched between two insulating layers 12 .

The wiring layer 11 is made of a conductive material. A conductive material is, for example, a metal material. A specific example of the metal material is copper (Cu) or the like. The insulating layer 12 is made of an insulating material. The insulating material is, for example, a resin material. A specific example of the resin material is epoxy resin.

A through hole 10 c is formed in the substrate 10 . The through hole 10c penetrates the substrate 10 along the thickness direction. That is, the through hole 10c penetrates the substrate 10 along the direction from the first surface 10a to the second surface 10b.

The substrate 10 has a conductor layer 13 . The conductor layer 13 covers the inner wall surface of the through hole 10c. The conductor layer 13 is made of a conductive material. A conductive material is, for example, a metal material. A specific example of a metallic material is copper. A through hole 13 a is formed in the conductor layer 13 . The through hole 13a penetrates the substrate 10 along the thickness direction. The conductor layer 13 is connected to each of the plurality of conductor layers 13 .

At least one of the wiring layers 11 other than the wiring layers 11 located on the first surface 10a and the second surface 10b is a power supply wiring layer. This power supply wiring layer is formed over the entire surface between the two insulating layers. A thermal land (not shown) may be formed in the power supply wiring layer in a portion around the conductor layer 13 .

The wiring layer 11 located on the first surface 10 a has first wirings 14 and second wirings 15 . The first wiring 14 has a first end 14a and a second end 14b. The first end 14 a is the end of the first wiring 14 connected to the conductor layer 13 . The second end 14b is the end opposite to the first end 14a. The second wiring 15 has a third end 15a. The third end 15a is separated from the first end 14a. That is, the third end portion 15a is arranged to face the first end portion 14a with a space therebetween.

The electrical component 20 has leads 21 . The lead 21 is made of a conductive material and functions as a connection terminal for the electrical component 20 . A conductive material is, for example, a metal material. A specific example of the conductive material is copper (copper alloy). The lead 21 is inserted into the through hole 13a. More specifically, the lead 21 is inserted into the through hole 13a from the second surface 10b side.

The solder layer 30 is made of solder. Solder is, for example, an alloy containing tin (Sn) as a main component. Solder layer 30 fills through hole 13a. The lead 21 is thereby connected to the conductor layer 13 .

The connecting member 40 is, for example, a jumper resistor 41 . A connection member 40 (jumper resistor 41) is connected to the second end portion 14b and the third end portion 15a. Thereby, the first wiring 14 and the second wiring 15 are electrically connected.

<Method for Manufacturing Circuit Device 100>
3A to 3D are process diagrams showing a method of manufacturing the circuit device 100. FIG. As shown in FIG. 3, the method of manufacturing the circuit device 100 includes a preparation step S1, an electrical component mounting step S2, and a connecting member mounting step S3. The electrical component mounting step S2 is performed after the preparation step S1. The connection member mounting step S3 is performed after the electrical component mounting step S2.

In the preparation step S1, the substrate 10 and the electrical component 20 are prepared. In the preparation step S1, the connection member 40 (jumper resistor 41) is prepared. FIG. 4 is a cross-sectional view of the substrate 10 in the preparation step S1. As shown in FIG. 4, the second end portion 14b and the third end portion 15a are not connected by the jumper resistor 41 in the preparation step S1. Therefore, at this stage, the first wiring 14 is thermally and electrically separated from the second wiring 15 .

In the electrical component attachment step S2, the electrical component 20 is attached to the board 10. FIG. In the electric component mounting step S2, first, the leads 21 are inserted into the through holes 13a. Second, the leads 21 are soldered to the conductor layer 13 while the leads 21 are inserted into the through holes 13a. This soldering is performed, for example, by flow soldering. However, the method of soldering the leads 21 to the conductor layer 13 is not limited to this.

In the connection member attaching step S3, the second end portion 14b and the third end portion 15a are connected by the connection member 40 (jumper resistor 41). The connection of the second end portion 14b and the third end portion 15a by the jumper resistor 41 is performed by soldering the jumper resistor 41 to the second end portion 14b and the third end portion 15a. This soldering is performed, for example, by manual soldering (soldering using a soldering iron). Thereby, the first wiring 14 and the second wiring 15 are electrically connected, and the circuit device 100 having the structure shown in FIGS. 1 and 2 is manufactured.

<Effects of circuit device 100>
Hereinafter, the circuit device according to the comparative example is referred to as "circuit device 200". FIG. 5 is a cross-sectional view of the circuit device 200. As shown in FIG. FIG. 5 shows a cross-sectional view of the circuit device 200 at a position corresponding to FIG. As shown in FIG. 5, the circuit device 200 has a substrate 10, an electrical component 20, and a solder layer 30. As shown in FIG. However, circuit device 200 does not have connection member 40 (jumper resistor 41). Further, the circuit device 200 has a wiring 16 integrally formed instead of the first wiring 14 and the second wiring 15 .

Also in the manufacturing process of the circuit device 200, the leads 21 and the conductor layer 13 are soldered while the leads 21 are inserted into the through holes 13a. Since the circuit device 200 uses the wiring 16 integrally formed instead of the first wiring 14 and the second wiring 15, the wiring 16 is damaged by the heat of the conductor layer 13 during the soldering. Easy to spread through. As a result, the temperature of the conductor layer 13 does not rise sufficiently during soldering, and the soldering of the conductor layer 13 and the leads 21 may become defective.

On the other hand, in the circuit device 100, when the lead 21 and the conductor layer 13 are soldered, the wiring on the first surface 10a connected to the conductor layer 13 is the first wiring 14 and the second wiring 15. Therefore, the heat of the conductor layer 13 is difficult to diffuse to the second wiring 15 . As a result, in the circuit device 100, the temperature of the conductor layer 13 is likely to rise while the leads 21 and the conductor layer 13 are being soldered. Thus, according to the circuit device 100, the solderability between the conductor layer 13 and the leads 21 can be improved. Since the first wiring 14 and the second wiring 15 are finally electrically connected by the connecting member 40 (jumper resistor 41), the circuit device 100 has the same electrical function as the circuit device 200. realizable.

(Second embodiment)
A circuit device (hereinafter referred to as "circuit device 300") according to the second embodiment will be described below. Here, differences from the circuit device 100 will be mainly described, and redundant description will not be repeated.

<Configuration of Circuit Device 300>
FIG. 6 is a plan view of the circuit device 300. FIG. FIG. 7 is a side view of the circuit device 300. FIG. As shown in FIGS. 6 and 7, the circuit device 300 has a substrate 10, electrical components 20, solder layers 30, and connection members 40. As shown in FIGS. In this regard, the configuration of circuit device 300 is common to the configuration of circuit device 100 .

However, in circuit device 300 , jumper wires 42 are used as connection members 40 instead of jumper resistors 41 . Further, the circuit device 300 differs from the circuit device 100 in the detailed configuration of the substrate 10 .

In the circuit device 300, the substrate 10 is further formed with a through hole 10d and a through hole 10e. The through holes 10d and 10e penetrate the substrate 10 along the thickness direction (the direction from the first surface 10a to the second surface 10b). A second end portion 14b and a third end portion 15a are arranged between the through hole 10d and the through hole 10e.

The jumper wire 42 has a first portion 42a, a second portion 42b and a third portion 42c. The first portion 42a extends in a direction parallel to the first surface 10a. The second portion 42b and the third portion 42c extend in the direction from the first surface 10a toward the second surface 10b. The second portion 42b and the third portion 42c are respectively connected to both ends of the first portion 42a. That is, the jumper wire 42 has a U-shape.

The second portion 42b and the third portion 42c are inserted into the through holes 10d and 10e, respectively. Thereby, the second end portion 14b and the third end portion 15a are connected by the first portion 42a.

<Method for Manufacturing Circuit Device 300>
The manufacturing method of the circuit device 300 is common to the manufacturing method of the circuit device 100 in that it includes a preparation step S1, an electrical component mounting step S2, and a connecting member mounting step S3. However, the manufacturing method of the circuit device 300 differs from the manufacturing method of the circuit device 100 with respect to the details of the connection member attaching step S3.

In the connection member attaching step S3 in the manufacturing method of the circuit device 300, first, the second portion 42b and the third portion 42c are inserted into the through holes 10d and 10e, respectively. In this state, the first portion 42a, the second end portion 14b and the third end portion 15a are connected by soldering.

<Effect of circuit device 300>
Also in the circuit device 300, the wiring on the first surface 10a connected to the conductor layer 13 when the leads 21 and the conductor layer 13 are soldered is separated into the first wiring 14 and the second wiring 15. Therefore, it is difficult for the heat of the conductor layer 13 to diffuse to the second wiring 15 . Therefore, in the circuit device 300 as well as in the circuit device 100, the temperature of the conductor layer 13 is likely to rise when soldering is performed between the leads 21 and the conductor layer 13. Solderability can be improved during

(Third Embodiment)
A circuit device (hereinafter referred to as "circuit device 400") according to the third embodiment will be described below. Here, differences from the circuit device 100 will be mainly described, and redundant description will not be repeated.

<Configuration of Circuit Device 400>
FIG. 8 is a plan view of the circuit device 400. FIG. As shown in FIG. 8 , the circuit device 300 has a substrate 10 , electrical components 20 , solder layers 30 and connection members 40 . In this regard, the configuration of circuit device 400 is common to the configuration of circuit device 100 .

However, in circuit device 400 , solder layer 43 is used as connecting member 40 instead of jumper resistor 41 . Further, the circuit device 400 differs from the circuit device 100 in the detailed configuration of the substrate 10 .

FIG. 9 is an enlarged plan view of the circuit device 400. FIG. FIG. 9 shows an enlarged plan view of the circuit device 400 near the second end 14b and the third end 15a. In FIG. 9, the solder layer 43 is indicated by dotted lines. As shown in FIG. 9 , in circuit device 400 , second end 14 b and third end 15 a are separated by groove 17 . The grooves 17 are formed in a comb shape in plan view.

FIG. 10 is an enlarged plan view of a circuit device 400 according to a modification. FIG. 10 shows an enlarged plan view of circuit device 400 at a position corresponding to FIG. In FIG. 10, the solder layer 43 is indicated by dotted lines. As shown in FIG. 10, the groove 17 may be spirally formed in plan view.

As shown in FIGS. 9 and 10, the solder layer 43 is arranged on the second end 14b and the third end 15a. Another way of looking at this is that the solder layer 43 bridges between the second end 14b and the third end 15a. Thereby, the first wiring 14 and the second wiring 15 are electrically connected.

<Method for Manufacturing Circuit Device 400>
The manufacturing method of the circuit device 400 is common to the manufacturing method of the circuit device 100 in that it includes a preparation step S1, an electrical component mounting step S2, and a connection member mounting step S3. However, the manufacturing method of the circuit device 400 differs from the manufacturing method of the circuit device 100 with respect to the details of the connection member attaching step S3.

In the connecting member attaching step S3 in the manufacturing method of the circuit device 400, the second end portion 14b and the third end portion 15a are connected by soldering. This soldering is performed, for example, by manual soldering (soldering using a soldering iron). As a result of the second end 14b and the third end 15a being separated by the comb-shaped or spiral groove 17, the space between the second end 14b and the third end 15a Since the distance is small, the solder layer 43 tends to bridge between the second end 14b and the third end 15a during the above soldering.

Also in the circuit device 400, the wiring on the first surface 10a connected to the conductor layer 13 when the lead 21 and the conductor layer 13 are soldered is separated into the first wiring 14 and the second wiring 15. Therefore, it is difficult for the heat of the conductor layer 13 to diffuse to the second wiring 15 . Therefore, in the circuit device 400 as well as in the circuit device 100, the temperature of the conductor layer 13 is likely to rise when soldering is performed between the leads 21 and the conductor layer 13. Solderability can be improved during

Although the embodiment of the present invention has been described as above, it is also possible to modify the above embodiment in various ways. Moreover, the scope of the present invention is not limited to the above embodiments. The scope of the present invention is indicated by the scope of claims, and is intended to include all changes within the meaning and scope of equivalence to the scope of claims.

The above embodiments are particularly advantageously applied to circuit devices in which electrical components are mounted on a substrate.

10 substrate 10a first surface 10b second surface 10c, 10d, 10e through hole 11 wiring layer 12 insulating layer 13 conductor layer 13a through hole 14 first wiring 14a first end 14b second 2 ends, 15 second wiring, 15a third end, 16 wiring, 17 groove, 20 electric component, 21 lead, 30 solder layer, 40 connection member, 41 jumper resistor, 42 jumper wire, 42a first portion, 42b 2nd part 42c 3rd part 43 solder layer 100, 200, 300, 400 circuit device S1 preparation step S2 electrical component mounting step S3 connection member mounting step.

Claims (7)

a substrate having a first surface and a second surface opposite to the first surface;
an electrical component having leads;
a first solder layer;
a connecting member;
The substrate is formed with a through hole penetrating the substrate along a direction from the first surface to the second surface,
The inner wall surface of the through hole is covered with a conductor layer in which the through hole is formed,
The substrate has a first wiring and a second wiring on the first surface,
the first wiring includes a first end connected to the conductor layer and a second end opposite to the first end;
the second wiring includes a third end spaced apart from the second end;
The lead is inserted into the through hole,
The first solder layer is filled in the through hole to connect the lead and the conductor layer,
The circuit device, wherein the connection member connects the second end and the third end. 2. The circuit device according to claim 1, wherein said connecting member is a jumper resistor. 2. The circuit device according to claim 1, wherein said connection member is a jumper wire. 2. The circuit device according to claim 1, wherein said connecting member is a second solder layer. 5. The circuit device according to claim 4, wherein said second end and said third end are separated by a comb-shaped groove. 5. The circuit device of claim 4, wherein the second end and the third end are separated by a spirally formed groove. providing an electrical component having a substrate and leads having a first side and a second side opposite the first side;
and attaching the electrical component to the substrate;
The substrate is formed with a through hole penetrating the substrate along a direction from the first surface to the second surface,
The inner wall surface of the through hole is covered with a conductor layer in which the through hole is formed,
The substrate has a first wiring and a second wiring on the first surface,
The first wiring includes a first end connected to the conductor layer and a second end opposite to the first end,
the second wiring includes a third end spaced apart from the second end;
The step of attaching the electrical component to the substrate is performed by soldering the lead and the conductor layer while the lead is inserted into the through hole,
A method of manufacturing a circuit device, further comprising the step of connecting the first end and the second end with a connecting member after the step of attaching the electrical component to the substrate.

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