JP2022119375A - 光電変換装置 - Google Patents

光電変換装置 Download PDF

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Publication number
JP2022119375A
JP2022119375A JP2021016447A JP2021016447A JP2022119375A JP 2022119375 A JP2022119375 A JP 2022119375A JP 2021016447 A JP2021016447 A JP 2021016447A JP 2021016447 A JP2021016447 A JP 2021016447A JP 2022119375 A JP2022119375 A JP 2022119375A
Authority
JP
Japan
Prior art keywords
photoelectric conversion
pad
conversion device
processing unit
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021016447A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022119375A5 (enExample
Inventor
優 有嶋
Masaru Arishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021016447A priority Critical patent/JP2022119375A/ja
Priority to US17/587,891 priority patent/US12137291B2/en
Publication of JP2022119375A publication Critical patent/JP2022119375A/ja
Publication of JP2022119375A5 publication Critical patent/JP2022119375A5/ja
Priority to US18/903,743 priority patent/US20250024158A1/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/617—Upgrading or updating of programs or applications for camera control
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/665—Control of cameras or camera modules involving internal camera communication with the image sensor, e.g. synchronising or multiplexing SSIS control signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Software Systems (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2021016447A 2021-02-04 2021-02-04 光電変換装置 Pending JP2022119375A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021016447A JP2022119375A (ja) 2021-02-04 2021-02-04 光電変換装置
US17/587,891 US12137291B2 (en) 2021-02-04 2022-01-28 Photoelectric conversion apparatus having pad arrangement
US18/903,743 US20250024158A1 (en) 2021-02-04 2024-10-01 Photoelectric conversion apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021016447A JP2022119375A (ja) 2021-02-04 2021-02-04 光電変換装置

Publications (2)

Publication Number Publication Date
JP2022119375A true JP2022119375A (ja) 2022-08-17
JP2022119375A5 JP2022119375A5 (enExample) 2024-02-01

Family

ID=82611670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021016447A Pending JP2022119375A (ja) 2021-02-04 2021-02-04 光電変換装置

Country Status (2)

Country Link
US (2) US12137291B2 (enExample)
JP (1) JP2022119375A (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010200A (ja) * 2008-06-24 2010-01-14 Oki Semiconductor Co Ltd 半導体装置の製造方法
JP2020014144A (ja) * 2018-07-19 2020-01-23 株式会社デンソー カメラシステムおよびイベント記録システム
JP2020025263A (ja) * 2018-07-31 2020-02-13 ソニーセミコンダクタソリューションズ株式会社 積層型受光センサ及び電子機器
JP2020061755A (ja) * 2016-09-16 2020-04-16 ソニーセミコンダクタソリューションズ株式会社 撮像装置、及び、電子機器
WO2020116185A1 (ja) * 2018-12-05 2020-06-11 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、信号処理チップ、および、電子機器
WO2021187350A1 (ja) * 2020-03-19 2021-09-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008058853A (ja) * 2006-09-04 2008-03-13 Sony Corp 表示装置及びその製造方法
US9129816B2 (en) * 2012-03-16 2015-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Contact test structure and method
JP7402606B2 (ja) * 2018-10-31 2023-12-21 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
JP2021064860A (ja) * 2019-10-11 2021-04-22 ソニーセミコンダクタソリューションズ株式会社 撮像装置及び電子機器
CN115699793B (zh) * 2020-07-07 2025-12-16 索尼半导体解决方案公司 摄像装置和电子设备
KR20220064085A (ko) * 2020-11-11 2022-05-18 삼성전자주식회사 이미지 센서
JP7721275B2 (ja) * 2021-01-22 2025-08-12 キヤノン株式会社 半導体素子、機器、チップ
JP7654415B2 (ja) * 2021-02-04 2025-04-01 キヤノン株式会社 光電変換装置、機器
JP2022119382A (ja) * 2021-02-04 2022-08-17 キヤノン株式会社 光電変換装置、光電変換システム、移動体
JP7686402B2 (ja) * 2021-02-04 2025-06-02 キヤノン株式会社 光電変換装置、光電変換システム
JP2023057660A (ja) * 2021-10-12 2023-04-24 キヤノン株式会社 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010200A (ja) * 2008-06-24 2010-01-14 Oki Semiconductor Co Ltd 半導体装置の製造方法
JP2020061755A (ja) * 2016-09-16 2020-04-16 ソニーセミコンダクタソリューションズ株式会社 撮像装置、及び、電子機器
JP2020014144A (ja) * 2018-07-19 2020-01-23 株式会社デンソー カメラシステムおよびイベント記録システム
JP2020025263A (ja) * 2018-07-31 2020-02-13 ソニーセミコンダクタソリューションズ株式会社 積層型受光センサ及び電子機器
WO2020116185A1 (ja) * 2018-12-05 2020-06-11 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、信号処理チップ、および、電子機器
WO2021187350A1 (ja) * 2020-03-19 2021-09-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置

Also Published As

Publication number Publication date
US20250024158A1 (en) 2025-01-16
US20220246651A1 (en) 2022-08-04
US12137291B2 (en) 2024-11-05

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