JP2022108088A - Processing liquid supply system and substrate processing device - Google Patents

Abstract

To facilitate maintaining operation of the concentration of a volatile component contained in a processing liquid.SOLUTION: A processing liquid supply system according to the present disclosure includes a supply line, a plurality of pressure loss portions, and a concentration meter. The supply line is connected to a liquid processing unit that processes a substrate using a processing liquid containing a volatile component, and supplies the processing liquid to the liquid processing unit. The plurality of pressure loss portions includes filters and heaters arranged in the supply line. The concentration meter is arranged in the supply line and measures a concentration of the processing liquid flowing through the supply line. Also, the concentration meter is arranged downstream of the plurality of pressure loss portions.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a processing liquid supply system and a substrate processing apparatus.

2. Description of the Related Art Conventionally, in a manufacturing process of a semiconductor device, liquid processing is performed in which a substrate such as a semiconductor wafer is processed by supplying a processing liquid to the substrate.

In Patent Document 1, the volatilization amount of the ammonia component volatilized from the processing liquid remaining in the reservoir is calculated based on the estimated lost portion of the unrecovered portion of the processing liquid in the reservoir, and the calculated volatilization amount. Techniques have been disclosed for replenishing ammonia in the reservoir. According to this technique, the concentration of the processing liquid can be maintained at a desired concentration.

Japanese Patent No. 6393238

The present disclosure provides a technique capable of facilitating maintenance of the concentration of volatile components contained in the treatment liquid.

A processing liquid supply system according to one aspect of the present disclosure includes a supply line, a plurality of pressure loss sections, and a concentration meter. The supply line is connected to a liquid processing unit that processes a substrate using a processing liquid containing a volatile component, and supplies the processing liquid to the liquid processing unit. The plurality of pressure drop sections includes filters and heaters arranged in the supply line. The densitometer is arranged in the supply line and measures the concentration of the processing liquid flowing through the supply line. Also, the densitometer is arranged downstream of the plurality of pressure drop sections.

According to the present disclosure, it is possible to facilitate maintenance of the concentration of volatile components contained in the treatment liquid.

FIG. 1 is a block diagram showing the configuration of the substrate processing apparatus according to the first embodiment. FIG. 2 is a diagram showing the configuration of the liquid processing unit according to the first embodiment. FIG. 3 is a diagram showing the configuration of the processing liquid supply system according to the first embodiment. FIG. 4 is a diagram for explaining the flow of the treatment liquid in the comparative example. FIG. 5 is a diagram for explaining the flow of the treatment liquid in the supply line according to the first embodiment. FIG. 6 is a diagram showing the configuration of a processing liquid supply system according to the second embodiment. FIG. 7 is a diagram for explaining the flow of the treatment liquid in the supply line according to the second embodiment. FIG. 8 is a diagram showing the configuration of a processing liquid supply system according to the third embodiment. FIG. 9 is a diagram showing the configuration of a processing liquid supply system according to the fourth embodiment. FIG. 10 is a diagram showing the configuration of a processing liquid supply system according to the fifth embodiment. FIG. 11 is a flowchart illustrating an example of processing executed by a control unit according to the fifth embodiment; FIG. 12 is a diagram showing the configuration of a processing liquid supply system according to the sixth embodiment. FIG. 13 is a flowchart illustrating an example of processing executed by a control unit according to the sixth embodiment; FIG. 14 is a diagram showing the configuration of a liquid processing unit according to the seventh embodiment. FIG. 15 is a diagram showing the configuration of a processing liquid supply system according to the seventh embodiment.

Embodiments (hereinafter referred to as "embodiments") for implementing a processing liquid supply system and a substrate processing apparatus according to the present disclosure will be described in detail below with reference to the drawings. Note that the present disclosure is not limited by this embodiment. Further, each embodiment can be appropriately combined within a range that does not contradict the processing contents. Also, in each of the following embodiments, the same parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

Further, in the embodiments described below, expressions such as "constant", "perpendicular", "perpendicular" or "parallel" may be used, but these expressions are strictly "constant", "perpendicular", " It does not have to be "perpendicular" or "parallel". That is, each of the expressions described above allows deviations in, for example, manufacturing accuracy and installation accuracy.

In addition, in each drawing referred to below, in order to make the explanation easier to understand, an orthogonal coordinate system is shown in which the X-axis direction, the Y-axis direction and the Z-axis direction that are orthogonal to each other are defined, and the Z-axis positive direction is the vertically upward direction. Sometimes. Also, the direction of rotation about the vertical axis is sometimes called the θ direction.

(First embodiment)
<Substrate processing equipment>
First, the configuration of a substrate processing apparatus including a processing liquid supply system according to the present disclosure will be described with reference to FIG. FIG. 1 is a block diagram showing the configuration of the substrate processing apparatus according to the first embodiment.

As shown in FIG. 1, the substrate processing apparatus 1 according to the first embodiment includes a liquid processing unit 2, a processing liquid supply system 3, and a control device 4. As shown in FIG.

The liquid processing unit 2 processes a substrate such as a semiconductor wafer (hereinafter referred to as "wafer") with a processing liquid.

The treatment liquid contains volatile components. As an example, the treatment liquid according to the first embodiment is SC1 (ammonia/hydrogen peroxide aqueous solution). SC1 contains ammonia as a volatile component. The liquid processing unit 2 supplies SC1 to the wafer to etch away silicon-based films (for example, polysilicon film, silicon oxide film, SiN film, etc.) formed on the wafer. A configuration example of the liquid processing unit 2 will be described later.

Note that the treatment liquid is not limited to SC1 as long as it contains at least a volatile component. For example, the treatment liquid may be ammonium hydroxide (dilute ammonia water) diluted to a predetermined concentration, BHF (buffered hydrofluoric acid: mixed solution of hydrofluoric acid and ammonium fluoride solution), or the like. These also contain ammonia as a volatile component. Also, the treatment liquid may contain a volatile component other than ammonia.

The processing liquid supply system 3 supplies the processing liquid to the liquid processing unit 2 . A configuration example of the treatment liquid supply system 3 will be described later.

A control device 4 controls the liquid processing unit 2 and the processing liquid supply system 3 . The control device 4 is, for example, a computer, and includes a control section 41 and a storage section 42 . The storage unit 42 stores programs for controlling various processes executed in the substrate processing apparatus 1 . The control unit 41 controls operations of the liquid processing unit 2 and the processing liquid supply system 3 by reading and executing programs stored in the storage unit 42 .

The program may be recorded in a computer-readable storage medium and installed in the storage unit 42 of the control device 4 from the storage medium. Examples of computer-readable storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.

The substrate processing apparatus 1 may include multiple liquid processing units 2 . In this case, the substrate processing apparatus 1 may include a plurality of processing liquid supply systems 3 corresponding to a plurality of liquid processing units 2, or may include one processing liquid supply system 3 corresponding to a plurality of liquid processing units 2. may be provided.

<Structure of liquid processing unit>
Next, a configuration example of the liquid processing unit 2 will be described with reference to FIG. FIG. 2 is a diagram showing the configuration of the liquid processing unit 2 according to the first embodiment.

The liquid processing unit 2 shown in FIG. 2 is a batch type processing unit that collectively processes a plurality of wafers W (only one wafer W is shown in FIG. 2). As shown in FIG. 2, the liquid processing unit 2 includes a processing tank 21, a holding section 22, and a plurality of (here, three) discharge sections 23. As shown in FIG. Note that the number of ejection sections 23 included in the liquid processing unit 2 is not limited to three.

The processing bath 21 includes an inner bath 211 and an outer bath 212 . The inner tank 211 is a box-shaped tank with an open top, and stores the processing liquid therein. A lot formed by a plurality of wafers W is immersed in the inner bath 211 . The outer tub 212 is arranged around the inner tub 211 . Further, the outer tub 212 is open at the top. The processing liquid overflowing from the inner tank 211 flows into the outer tank 212 .

The holding part 22 holds a plurality of wafers W forming a lot in a vertical posture. The holding unit 22 has an elevating mechanism for elevating the held lot. The lot is lowered from above the inner tank 211 in the processing tank 21 to be immersed in the inner tank 211, or the lot immersed in the inner tank 211 is lowered. is lifted and removed from the processing tank 21 .

The plurality of discharge parts 23 are arranged inside the inner tank 211 , specifically near the bottom of the inner tank 211 . The plurality of ejection units 23 are connected to the processing liquid supply system 3 and eject the processing liquid supplied from the processing liquid supply system 3 into the inner bath 211 .

The liquid processing unit 2 holds the lot using the holding unit 22 and immerses the held lot in the processing liquid stored in the inner tank 211 . Thereby, the plurality of wafers W are processed with the processing liquid. Specifically, in the first embodiment, silicon-based films of the plurality of wafers W are removed by etching with SC1, which is the processing liquid.

<Configuration of processing liquid supply system>
Next, a configuration example of the processing liquid supply system 3 will be described with reference to FIG. FIG. 3 is a diagram showing the configuration of the processing liquid supply system 3 according to the first embodiment.

As shown in FIG. 3, the treatment liquid supply system 3 includes a supply line 30, a pump 31, a heater 32, deaerators 33a and 33b, a filter 34, a concentration meter 35, and a flow meter 36. . The processing liquid supply system 3 also includes a replenishment section 37 .

The supply line 30 is connected to the liquid processing unit 2 and supplies the processing liquid to the liquid processing unit 2 . The supply line 30 is a circulation line for flowing out the processing liquid from the processing bath 21 and returning it to the processing bath 21 . Specifically, one end of the supply line 30 is connected to the bottom of the outer tank 212 in the processing tank 21 , and the other end is connected to a plurality of discharge sections 23 arranged inside the inner tank 211 . Thus, the supply line 30 as a circulation line circulates the processing liquid between the inner bath 211 and the outer bath 212 .

Pump 31 , heater 32 , deaerators 33 a and 33 b , filter 34 , densitometer 35 and flow meter 36 are provided in supply line 30 . The pump 31 sends out the processing liquid in the outer bath 212 to the supply line 30 . The heater 32 heats the processing liquid flowing through the supply line 30 .

The processing bath 21 may be provided with a temperature measuring unit for measuring the temperature of the processing liquid in the processing bath 21 . In this case, the control unit 41 (see FIG. 1) controls the heater 32 and the supply line 30 based on the measurement result of the temperature measurement unit so as to keep the temperature of the processing liquid in the processing bath 21 at a desired temperature. Heat the flowing processing liquid. Thereby, the processing liquid supply system 3 can maintain the temperature of the processing liquid at the specified value.

The heater 32 has, for example, a meandering flow path and a resistor for heating the flow path. The heater 32 heats the processing liquid flowing through the flow path by using Joule heat generated by the resistor to heat the flow path. When the treatment liquid passes through the heater 32 , pressure loss occurs due to friction with the meandering flow path of the heater 32 . Thus, the heater 32 corresponds to one of the pressure loss parts in the supply line 30 . A pressure loss unit is a device that causes a pressure loss in the processing liquid flowing through the supply line 30 .

Debubblers 33 a and 33 b remove bubbles from the processing liquid flowing through the supply line 30 . Filter 34 removes impurities from the processing liquid flowing through supply line 30 .

A densitometer 35 measures the concentration of the processing liquid flowing through the supply line 30 . Specifically, the concentration meter 35 measures the concentration of ammonia in the treatment liquid. A densitometer 35 is provided on the sampling line 301 . The sampling line 301 is a line branching from the supply line 30 and returning to the supply line 30 . A measurement result obtained by the densitometer 35 is input to the control unit 41 .

A flow meter 36 measures the flow rate of the processing liquid flowing through the supply line 30 . A measurement result obtained by the flow meter 36 is input to the control section 41 .

The replenishment section 37 includes a replenisher supply source 371 , a replenishment line 372 and a flow regulator 373 . The replenisher supply source 371 supplies a solution containing a volatile component as a replenisher. For example, the replenisher supply 371 may supply fresh processing liquid. Further, the replenisher supply source 371 may supply an aqueous solution of a volatile component (for example, ammonia water when the volatile component is ammonia). The replenishment line 372 connects the replenisher supply source 371 and the outer tank 212 and supplies the replenisher from the replenisher supply source 371 to the outer tank 212 . Note that the replenishment line 372 may be connected to the inner tank 211 . A flow rate regulator 373 is provided in the replenishment line 372 and regulates the amount of volatile components supplied to the outer tank 212 . The flow regulator 373 is composed of, for example, an on-off valve, a flow control valve, a flow meter, and the like.

The controller 41 (see FIG. 1) controls the replenisher 37 based on the concentration of the volatile components measured by the densitometer 35, for example, to supply the replenisher to the processing bath 21. FIG. As a result, the processing liquid supply system 3 can maintain the concentration of the volatile component in the processing liquid at the specified value.

The processing liquid supply system 3 sends out the processing liquid from the outer bath 212 to the supply line 30 using the pump 31 . The processing liquid sent to the supply line 30 is supplied from the discharge section 23 into the inner bath 211 through the supply line 30 . The processing liquid supplied to the inner bath 211 overflows the inner bath 211 and flows out to the outer bath 212 . Thus, the processing liquid circulates between the inner bath 211 and the outer bath 212 .

Assuming that the outer tank 212 is the most upstream and the inner tank 211 is the most downstream, the pump 31, heater 32, deaerator 33a, filter 34, deaerator 33b, densitometer 35 and flow meter 36 are connected from the upstream side. are set in order.

Here, the filter 34 corresponds to one pressure loss portion in the supply line 30 . That is, the treatment liquid undergoes pressure loss due to friction with the filtration membrane when passing through the filter 34 . This causes the pressure on the secondary side of the filter 34 to be lower than the pressure on the primary side of the filter 34 . Volatile components in the treatment liquid are more likely to volatilize as the pressure is lowered. Therefore, the processing liquid passing through the filter 34 may reduce the concentration of volatile components in the processing liquid.

This point will be described in comparison with a comparative example. FIG. 4 is a diagram for explaining the flow of the treatment liquid in the comparative example. Also, FIG. 5 is a diagram for explaining the flow of the processing liquid in the supply line 30 according to the first embodiment.

As shown in FIG. 4, in the processing liquid supply system according to the comparative example, a pump, a heater, a deaerator, a densitometer, a filter, and a flow meter are provided in the supply line in this order from the upstream side. That is, in the processing liquid supply system according to the comparative example, the concentration meter is provided upstream of the filter in the supply line. In this case, the processing liquid passes through the filter after passing through the densitometer.

As mentioned above, the concentration of volatiles in the processing liquid can be reduced on the secondary side of the filter. For example, after a plurality of wafers are immersed in the inner bath, the concentration of volatile components in the processing liquid is maintained at a specified value until the processing liquid in the inner bath passes through the pump, heater, deaerator and densitometer. Assume that In this assumption, when the processing liquid passes through the filter, the volatile components in the processing liquid volatilize, and the concentration of the volatile components in the processing liquid becomes lower than the specified value. The treated liquid is supplied to the inner tank.

As described above, in the processing liquid supply system according to the comparative example, there is a possibility that the volatile component concentration (specified value) measured by the densitometer and the volatile component concentration (low) of the processing solution supplied to the inner tank may be different. There is Therefore, even if the volatile components are replenished from the replenishing unit to the storage tank based on the measurement result of the concentration meter, it is difficult to adjust the concentration of the volatile components in the processing liquid to the specified value. That is, in the processing liquid supply system according to the comparative example, it is difficult to accurately control the concentration of volatile components in the processing liquid.

In contrast, in the processing liquid supply system 3 according to the first embodiment, the concentration meter 35 is provided downstream of the filter 34 . In this case, even if the concentration of volatile components in the processing liquid decreases on the secondary side of the filter 34, the densitometer 35 measures the concentration of volatile components in the processing liquid after the concentration of volatile components has decreased. Therefore, as shown in FIG. 5, the volatile component concentration (low) measured by the densitometer 35 and the volatile component concentration (low) of the processing liquid supplied to the inner bath are less likely to deviate from each other. Therefore, according to the processing liquid supply system 3 according to the first embodiment, it is easy to accurately control the volatile component concentration in the processing liquid.

As described above, according to the processing liquid supply system 3 according to the first embodiment, it is possible to easily maintain the concentration of the volatile components contained in the processing liquid.

In addition, in the treatment liquid supply system according to the comparative example, a large amount of air bubbles generated on the secondary side of the filter pass through the flowmeter, which may cause a discrepancy between the measurement result of the flowmeter and the actual flow rate. . On the other hand, in the processing liquid supply system 3 according to the first embodiment, the deaerator 33b is provided between the filter 34 and the flow meter 36 in the supply line 30, and the air bubbles generated on the secondary side of the filter 34 Air bubbles are removed by the deaerator 33b before passing through the flow meter 36. FIG. Therefore, it is possible to suppress the occurrence of error due to air bubbles in the measurement result of the flow meter.

(Second embodiment)
Next, the configuration of the processing liquid supply system according to the second embodiment will be described with reference to FIG. FIG. 6 is a diagram showing the configuration of a processing liquid supply system according to the second embodiment. Also, FIG. 7 is a diagram for explaining the flow of the treatment liquid in the supply line 30 according to the second embodiment.

As shown in FIG. 6, a substrate processing apparatus 1A according to the second embodiment includes a processing liquid supply system 3A. In the processing liquid supply system 3A according to the second embodiment, the heater 32 is arranged downstream of the filter 34 . Specifically, when the outer tank 212 is the most upstream, the pump 31, the deaerator 33a, the filter 34, the heater 32, the deaerator 33b, the concentration meter 35, and the flow meter 36 are supplied in this order from the upstream side. provided in line 30;

In the processing liquid supply system according to the comparative example shown in FIG. 4, the heater is arranged on the upstream side of the filter. The temperature of the wafer before being immersed in the inner bath is lower than the temperature of the processing liquid stored in the inner bath. Therefore, when a plurality of wafers are immersed in the inner bath, the temperature of the processing liquid stored in the inner bath drops. Heat the flowing processing liquid. As a result, the high-temperature processing liquid heated by the heater passes through the filter. Volatile components in the treatment liquid are more likely to volatilize as the temperature of the treatment liquid increases. Therefore, the higher the temperature of the treatment liquid, the more easily bubbles are generated. That is, when the processing liquid passes through the filter, a large amount of air bubbles may be generated on the secondary side of the filter.

On the other hand, in the processing liquid supply system 3A according to the second embodiment, as shown in FIG. remains low. Therefore, in the processing liquid supply system 3A according to the second embodiment, the amount of air bubbles generated on the secondary side of the filter is smaller than in the processing liquid supply system according to the comparative example. In other words, in the processing liquid supply system 3A according to the second embodiment, the reduction in concentration of volatile components caused by passing through the filter 34 is suppressed more than in the processing liquid supply system according to the comparative example. For example, in the processing liquid supply system according to the comparative example, the volatile component concentration of the processing liquid when supplied to the inner tank is "low" (see FIG. 4), whereas the processing liquid supply system according to the second embodiment In system 3A, it can be suppressed to "slightly low".

As described above, according to the processing liquid supply system 3A according to the second embodiment, it is possible to suppress a decrease in the volatile component concentration of the processing liquid caused by passing through the filter 34 .

(Third embodiment)
Next, the configuration of the processing liquid supply system according to the third embodiment will be described with reference to FIG. FIG. 8 is a diagram showing the configuration of a processing liquid supply system according to the third embodiment. As shown in FIG. 8, a substrate processing apparatus 1B according to the third embodiment includes a processing liquid supply system 3B.

In the processing liquid supply system 3B according to the third embodiment, the supply line 30B has a sampling line 302 . The sampling line 302 branches from a plurality of pressure loss portions (here, the heater 32 and the filter 34) in the supply line 30B and upstream of the processing tank 21 (inner tank 211) to branch to the processing tank 21 (outer tank 212). connected to Specifically, the sampling line 302 is branched from between the deaerator 33b and a back pressure valve 38 described later and connected to the outer tank 212 . A densitometer 35 is connected to such a sampling line 302 .

Further, the supply line 30B is provided with a back pressure valve 38 downstream of the branch position of the sampling line 302 in the supply line 30B and upstream of the processing tank 21 (inner tank 211). Specifically, the back pressure valve 38 is provided in the supply line 30 between the branch position of the sampling line 302 and the flow meter 36 . The back pressure valve 38 maintains the pressure of the processing liquid on the upstream side of the back pressure valve 38 at a predetermined pressure by adjusting the degree of opening of the valve. The predetermined pressure is a preset pressure, and the valve opening degree of the back pressure valve 38 is controlled by the controller 41 .

By thus providing the back pressure valve 38 in the supply line 30B, the flow velocity of the processing liquid in the sampling line 302 can be increased. As a result, the responsiveness of the densitometer 35 is enhanced, so that changes in the concentration of volatile components in the treatment liquid can be detected quickly. Further, by providing the back pressure valve 38 downstream of the filter 34, the pressure on the secondary side of the filter 34 is increased, so the generation of air bubbles on the secondary side of the filter 34 can be suppressed. That is, it is possible to suppress the decrease in the concentration of the volatile component due to passing through the filter 34 .

(Fourth embodiment)
Next, the configuration of the processing liquid supply system according to the fourth embodiment will be described with reference to FIG. FIG. 9 is a diagram showing the configuration of a processing liquid supply system according to the fourth embodiment. As shown in FIG. 9, a substrate processing apparatus 1C according to the fourth embodiment includes a processing liquid supply system 3C.

A processing liquid supply system 3</b>C according to the fourth embodiment includes a plurality of filters 34 . A plurality of filters 34 are provided in parallel with the supply line 30C between the deaerator 33a and the heater 32, for example.

By arranging a plurality of filters 34 in parallel with the supply line 30</b>C in this manner, pressure drop on the secondary side of each filter 34 can be suppressed. As a result, the generation of air bubbles on the secondary side of the filter 34 is suppressed, so that the decrease in the volatile component concentration during processing on the secondary side of the filter 34 can be suppressed.

Note that the heater 32 may be provided between the pump 31 and the deaerator 33a as in the processing liquid supply system 3 according to the first embodiment. In this case, multiple filters 34 may be provided between the deaerator 33a and the deaerator 33b. Moreover, although an example in which the processing liquid supply system 3C includes two filters 34 is shown here, the processing liquid supply system 3C may include three or more filters 34. FIG.

(Fifth embodiment)
Next, the configuration of the processing liquid supply system according to the fifth embodiment will be described with reference to FIG. FIG. 10 is a diagram showing the configuration of a processing liquid supply system according to the fifth embodiment. As shown in FIG. 10, a substrate processing apparatus 1D according to the fifth embodiment includes a processing liquid supply system 3D.

A processing liquid supply system 3D according to the fifth embodiment has, for example, the same piping configuration as the processing liquid supply system 3A according to the second embodiment. That is, a pump 31, a deaerator 33a, a filter 34, a heater 32, a deaerator 33b, a densitometer 35 and a flow meter 36 are provided in this order from the upstream side of the supply line 30. FIG. The processing liquid supply system 3D has the same piping configuration as the processing liquid supply system 3 according to the first embodiment, the processing liquid supply system 3B according to the third embodiment, and the processing liquid supply system 3C according to the fourth embodiment. may have.

A processing liquid supply system 3</b>D according to the fifth embodiment includes an atmospheric pressure gauge 39 . The atmospheric pressure gauge 39 is provided, for example, in a factory where the substrate processing apparatus 1D is installed. The atmospheric pressure gauge 39 outputs the measurement result of the atmospheric pressure to the control unit 41 .

FIG. 11 is a flowchart showing an example of processing executed by the control unit 41 according to the fifth embodiment.

As shown in FIG. 11, the control unit 41 may estimate the generation of air bubbles in the supply line 30 based on the measurement result of the barometer. For example, atmospheric pressure at high altitudes is lower than atmospheric pressure at low altitudes. The lower the atmospheric pressure, the easier it is for the volatile components in the processing liquid to volatilize. That is, bubbles of volatile components are likely to be generated in the supply line 30 .

The control unit 41 acquires the atmospheric pressure value measured by the atmospheric pressure gauge 39 (step S101), and determines whether or not the acquired atmospheric pressure value is lower than a preset threshold value (step S102). Then, when the atmospheric pressure value is lower than the threshold value (step S102, Yes), the control unit 41 estimates the generation of air bubbles in the supply line 30 (step S103). Then, when the control unit 41 estimates the occurrence of air bubbles, it executes a predetermined abnormality handling process (step S104). For example, the control unit 41 may control the replenishment unit 37 to continue supplying the replenisher to the processing tank 21 while the generation of air bubbles is estimated. When the process of step S104 is finished, or when the atmospheric pressure value is not lower than the preset threshold value in step S102 (step S102, No), the control unit 41 returns the process to step S101, and repeat the process.

In this manner, the processing liquid supply system 3D may execute a predetermined abnormality handling process when it is estimated that bubbles are generated in the supply line 30 based on the measurement result of the atmospheric pressure gauge 39 . As a result, even when the substrate processing apparatus 1D is installed in a location with low atmospheric pressure, it is possible to easily maintain the concentration of the volatile components contained in the processing liquid.

(Sixth embodiment)
Next, the configuration of the processing liquid supply system according to the sixth embodiment will be described with reference to FIG. FIG. 12 is a diagram showing the configuration of a processing liquid supply system according to the sixth embodiment. As shown in FIG. 12, a substrate processing apparatus 1E according to the sixth embodiment includes a processing liquid supply system 3E.

A processing liquid supply system 3E according to the sixth embodiment includes a first flow meter 36a and a second flow meter 36b in a supply line 30E. The first flow meter 36 a is provided downstream of the concentration meter 35 . A second flow meter 36 b is provided downstream of the heater 32 and upstream of the concentration meter 35 . The first flow meter 36a and the second flow meter 36b. The flow rate measurement result is output to the control unit 41 .

A supply line 30E included in the processing liquid supply system 3E includes a detour line 303 and a switching section 304 . The detour line 303 is a line that bypasses the deaerator 33b. Specifically, the bypass line 303 branches off from the supply line 30E downstream of the second flow meter 36b and upstream of the deaerator 33b, and supplies downstream of the deaerator 33b and upstream of the concentration meter 35. connected to line 30E. The switching unit 304 is provided at a branch position of the bypass line 303 from the supply line 30</b>E, and switches the outflow destination of the processing liquid between the supply line 30</b>E and the bypass line 303 . The switching unit 304 is controlled by the control unit 41 .

FIG. 13 is a flowchart showing an example of processing executed by the control unit 41 according to the sixth embodiment.

As shown in FIG. 13, the control unit 41 acquires the flow rate of the treatment liquid from the second flow meter 36b (step S201), and determines whether or not the acquired flow rate exceeds a preset threshold range ( step S202). Then, when it is determined that the flow rate exceeds the threshold range (step S202, Yes), the control unit 41 estimates the generation of air bubbles in the supply line 30 (step S203). Then, when the control unit 41 estimates the occurrence of air bubbles, the control unit 41 executes a predetermined abnormality handling process (step S204). For example, the control unit 41 controls the switching unit 304 to switch the outflow destination of the treatment liquid from the detour line 303 to the supply line 30E. When the process of step S204 is completed, or when the flow rate does not exceed the threshold range in step S202 (step S202, No), the control unit 41 returns the process to step S201 and repeats the process from step S201.

In this way, the processing liquid supply system 3E controls the switching unit 304 to select the outflow destination of the processing liquid when it is estimated that bubbles are generated in the supply line 30E based on the flow rate measurement result of the second flow meter 36b. The bypass line 303 may be switched to the supply line 30E. As a result, for example, the treatment liquid does not pass through the deaerator 33b when bubbles are not generated, so that the service life of the deaerator 33b can be extended.

(Seventh embodiment)
Next, the configuration of the substrate processing apparatus according to the seventh embodiment will be described with reference to FIGS. 14 and 15. FIG. FIG. 14 is a diagram showing the configuration of a liquid processing unit according to the seventh embodiment. FIG. 15 is a diagram showing the configuration of a processing liquid supply system according to the seventh embodiment.

As shown in FIG. 14, the substrate processing apparatus 1F according to the seventh embodiment includes a single-wafer type liquid processing unit 2F that liquid-processes wafers W one by one. The liquid processing unit 2F includes, for example, a chamber 24, a substrate holding mechanism 25, a nozzle 26, and a collection cup 27.

Chamber 24 accommodates substrate holding mechanism 25 , nozzle 26 and recovery cup 27 . An FFU (Fan Filter Unit) 241 is provided on the ceiling of the chamber 24 . FFU 241 forms a downflow in chamber 24 .

The substrate holding mechanism 25 includes a holding portion 251 , a support portion 252 and a driving portion 253 . The holding part 251 holds the wafer W horizontally. The column portion 252 is a member extending in the vertical direction, the base end portion of which is rotatably supported by the drive portion 253, and the tip portion of which supports the holding portion 251 horizontally. The drive section 253 rotates the support section 252 around the vertical axis.

The substrate holding mechanism 25 rotates the support 251 supported by the support 252 by rotating the support 252 using the driving unit 253 . As a result, the wafer W held by the holding portion 251 rotates.

The nozzle 26 is connected to the processing liquid supply system 3F and ejects onto the wafer W the processing liquid supplied from the processing liquid supply system 3F.

The collection cup 27 is arranged to surround the holding portion 251 and collects the processing liquid scattered from the wafer W due to the rotation of the holding portion 251 . A drain port 271 is formed at the bottom of the recovery cup 27, and the processing liquid collected by the recovery cup 27 is discharged from the drain port 271 to the outside of the liquid processing unit 2F. Further, an exhaust port 272 is formed at the bottom of the recovery cup 27 for discharging the gas supplied from the FFU 241 to the outside of the liquid processing unit 2F.

As shown in FIG. 15, the processing liquid supply system 3F according to the seventh embodiment includes a storage tank 50. As shown in FIG. The storage tank 50 stores the processing liquid. A waste liquid line 51 is provided at the bottom of the storage tank 50 . The waste liquid line 51 discharges the processing liquid from the storage tank 50 when the processing liquid in the storage tank 50 is replaced, for example.

A supply line 30</b>F provided in the processing liquid supply system 3</b>F includes a circulation line 315 , a plurality of branch lines 316 and a return line 317 .

The circulation line 315 returns the processing liquid sent from the storage tank 50 to the storage tank 50 . A circulation line 315 is provided so that the processing liquid flows outside the storage tank 50 and returns to the storage tank 50 again. A plurality of branch lines 316 are provided in the middle of the circulation line 315 . A plurality of branch lines 316 are branched from the circulation line 315 and connected to the corresponding nozzles 26 of 2F. The branch line 316 supplies the processing liquid flowing through the circulation line 315 to the nozzle 26 . A return line 317 connects the plurality of liquid processing units 2F and the storage tank 50 and returns the processing liquid discharged from the liquid processing unit 2F to the storage tank 50 .

The circulation line 315 is provided with a pump 31, a deaerator 33a, a filter 34, a heater 32, a deaerator 33b, a densitometer 35 and a flow meter . Specifically, the pump 31, the deaerator 33a, the filter 34, the heater 32, the deaerator 33b, the densitometer 35, and the flow meter 36 are arranged from the upstream side in the flow direction of the processing liquid with the storage tank 50 as a reference. They are provided in this order. Note that the plurality of branch lines 316 are provided downstream of the flowmeter 36 . The order of arrangement of the pump 31, the deaerator 33a, the filter 34, the heater 32, the deaerator 33b, the concentration meter 35, and the flow meter 36 is not limited to the above order. For example, as in the processing liquid supply system 3 according to the first embodiment, the pump 31, heater 32, deaerator 33a, filter 34, deaerator 33b, concentration meter 35, and flow meter 36 are arranged in this order from the upstream side. may be provided.

In this way, the processing liquid supply system 3F is not limited to the batch-type liquid processing unit 2, and may supply the processing liquid to the sheet-type liquid processing unit 2F.

As described above, the processing liquid supply system according to the embodiment (substrate processing apparatuses 1, 1A to 1F as an example) includes supply lines (supply lines 30, 30C, 30E, 30F as an example) and a plurality of pressure loss section (heater 32 and filter 34 as an example) and a densitometer (densitometer 35 as an example). The supply line is a liquid processing unit (liquid processing units 2 and 2F as an example) that processes a substrate (wafer W as an example) using a processing liquid (SC1 as an example) containing a volatile component (ammonia as an example). to supply the processing liquid to the liquid processing unit. The multiple pressure loss units include a filter (as an example, filter 34) and a heater (as an example, heater 32) arranged in the supply line. The densitometer is arranged in the supply line and measures the concentration of the processing liquid flowing through the supply line. Also, the densitometer is arranged downstream of the plurality of pressure drop sections.

According to such a configuration, even if the concentration of volatile components in the processing liquid decreases on the secondary side of the filter, the densitometer measures the concentration of volatile components in the processing liquid after the concentration of volatile components has decreased. Therefore, deviation between the volatile component concentration measured by the densitometer and the volatile component concentration of the processing liquid supplied to the storage tank is unlikely to occur. Therefore, according to the processing liquid supply system according to the embodiment, it is easy to accurately control the volatile component concentration in the processing liquid. That is, it is possible to easily maintain the concentration of the volatile components contained in the treatment liquid.

The processing liquid supply system according to the embodiment may include a deaerator (for example, a deaerator 33b) arranged between a plurality of pressure loss portions in the supply line and the concentration meter. This can prevent air bubbles generated on the secondary side of the filter from flowing into the storage tank. Further, for example, when a flow meter is provided downstream of the filter, bubbles generated on the secondary side of the filter can be removed by a deaerator before passing through the flow meter. As a result, it is possible to suppress errors due to air bubbles in the measurement results of the flow meter.

The heater may be arranged downstream of the filter. This can reduce the amount of air bubbles generated on the secondary side of the filter compared to, for example, the case where the heater is arranged upstream of the filter. Therefore, it is possible to suppress a decrease in the volatile component concentration of the treatment liquid caused by passing through the filter.

The liquid processing unit may include a processing bath (eg, processing bath 21) capable of accommodating a plurality of substrates. In this case, the supply lines may include circulation lines (for example, supply lines 30, 30C, and 30E) that flow out the processing liquid from the processing bath and return it to the processing bath.

The processing liquid supply system according to the embodiment may include a storage tank (eg, a storage tank 50) that stores the processing liquid. In this case, the supply line (supply line 30F as an example) may include a circulation line (circulation line 315 as an example) that causes the treatment liquid to flow out of the reservoir and return it to the reservoir.

The supply line (supply line 30B as an example) is provided with a sampling line (sampling line 302 as an example) branched from downstream of the plurality of pressure loss portions in the circulation line and upstream of the storage tank and connected to the storage tank. may be In this case, the densitometer may be provided in the sampling line.

The processing liquid supply system according to the embodiment (for example, the processing liquid supply system 3B) includes a back pressure valve (for example, the back pressure valve 38 ).

By providing the back pressure valve in the supply line, the flow velocity of the processing liquid in the sampling line increases, so that the responsiveness of the concentration meter can be improved. Therefore, it is possible to quickly detect changes in the concentration of volatile components in the treatment liquid. In addition, by providing a back pressure valve downstream of the filter, the pressure on the secondary side of the filter increases, so it is possible to suppress the generation of air bubbles on the secondary side of the filter. That is, it is possible to suppress the decrease in the concentration of volatile components due to passage through the filter.

The processing liquid supply system according to the embodiment (processing liquid supply system 3E as an example) may include a flow meter (second flow meter 36b as an example) and a control section (control section 41 as an example). . A flow meter is provided between a plurality of pressure loss portions in the supply line and the deaerator, and measures the flow rate of the processing liquid flowing through the supply line. The control unit executes a predetermined abnormality handling process when it is estimated that bubbles are generated in the supply line based on the measurement result of the flow meter.

The supply line (processing liquid supply system 3E as an example) includes a bypass line (a bypass line 303 as an example) that bypasses the deaerator (the deaerator 33b as an example), and between the supply line and the bypass line A switching unit (for example, the switching unit 304) that switches the outflow destination of the treatment liquid may be provided. In this case, the control unit may control the switching unit to switch the outflow destination of the processing liquid from the detour line to the supply line when the occurrence of air bubbles is estimated. As a result, for example, the treatment liquid does not pass through the deaerator when bubbles are not generated, so that the service life of the deaerator can be extended.

The processing liquid supply system according to the embodiment (processing liquid supply system 3D as an example) may include an atmospheric pressure gauge (the atmospheric pressure gauge 39 as an example) and a controller (the controller 41 as an example). A barometer measures atmospheric pressure. The control unit executes a predetermined abnormality handling process when it is estimated that bubbles are generated in the supply line based on the measurement result of the atmospheric pressure gauge. As a result, even when the processing liquid supply system is installed in a location with low atmospheric pressure, it is possible to easily maintain the concentration of the volatile components contained in the processing liquid.

It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in many different forms. Also, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

Reference Signs List 1: Substrate processing apparatus 2: Liquid processing unit 3: Processing liquid supply system 4: Control device 21: Storage tank 22: Holding unit 23: Discharge unit 30: Supply line 31: Pump 32: Heaters 33a, 33b: Deaerator 34 : Filter 35 : Densitometer 36 : Flow meter 37 : Replenishment unit 38 : Back pressure valve 39 : Atmospheric pressure gauge 41 : Control unit 42 : Storage unit W : Wafer

Claims (11)

a supply line connected to a liquid processing unit that processes a substrate using a processing liquid containing a volatile component, the supply line supplying the processing liquid to the liquid processing unit;
a plurality of pressure loss units including filters and heaters arranged in the supply line;
a densitometer arranged in the supply line for measuring the concentration of the treatment liquid flowing through the supply line;
The processing liquid supply system, wherein the concentration meter is arranged downstream of the plurality of pressure loss sections. 2. The processing liquid supply system according to claim 1, further comprising a deaerator disposed between said plurality of pressure loss portions in said supply line and said concentration meter. 3. The processing liquid supply system according to claim 1, wherein said heater is arranged downstream of said filter. The liquid processing unit is
A processing tank capable of accommodating a plurality of substrates,
4. The processing liquid supply system according to claim 1, wherein said supply line includes a circulation line for flowing out said processing liquid from said processing bath and returning it to said processing bath. A storage tank for storing the treatment liquid,
4. The processing liquid supply system according to claim 1, wherein said supply line includes a circulation line for flowing out said processing liquid from said storage tank and returning it to said storage tank. The supply line is
A sampling line branched from downstream of the plurality of pressure loss portions in the circulation line and upstream of the storage tank and connected to the storage tank,
6. The processing liquid supply system according to claim 5, wherein said concentration meter is provided in said sampling line. 7. The processing liquid supply system according to claim 6, further comprising a back pressure valve provided downstream of a branch position of said sampling line in said circulation line and upstream of said storage tank. a flow meter provided between the plurality of pressure loss portions and the deaerator in the supply line for measuring the flow rate of the treatment liquid flowing through the supply line;
3. The processing liquid supply system according to claim 2, further comprising a control unit that executes a predetermined abnormality handling process when it is estimated that bubbles have been generated in the supply line based on the measurement result of the flow meter. The supply line is
a bypass line that bypasses the deaerator;
a switching unit that switches an outflow destination of the treatment liquid between the supply line and the detour line,
9. The processing liquid supply system according to claim 8, wherein said control section controls said switching section to switch the outflow destination of said processing liquid from said detour line to said supply line when said bubble generation is estimated. an atmospheric pressure gauge for measuring atmospheric pressure;
The process according to any one of claims 1 to 7, comprising: a control unit that executes a predetermined abnormality handling process when it is estimated that bubbles are generated in the supply line based on the measurement result of the barometer. Liquid supply system. a liquid processing unit that processes a substrate using a processing liquid containing a volatile component;
a supply line connected to the liquid processing unit and supplying the processing liquid to the liquid processing unit;
a plurality of pressure loss units including filters and heaters arranged in the supply line;
a densitometer arranged in the supply line for measuring the concentration of the treatment liquid flowing through the supply line;
The liquid processing unit is
A processing tank capable of accommodating a plurality of substrates,
the supply line includes a circulation line for flowing out the processing liquid from the processing bath and returning it to the processing bath;
The substrate processing apparatus, wherein the densitometer is arranged downstream of the plurality of pressure loss sections.

Images