JP2022106356A - Electrode for brain wave measurement and brain wave measuring device - Google Patents

Abstract

To provide a technology to achieve stable brain wave measurement while reducing the number of components in an electrode for brain wave measurement in which a conductive part to come in contact with the scalp is provided to a columnar base part directly or indirectly, which includes a connection member connected to an external measuring device.SOLUTION: An electrode 10 for brain wave measurement includes: a columnar base part 31; a conductive part provided on a base part undersurface 36 (a conductive contact part 33 provided at a protruding part 32): a housing part 50 provided on a base part upper surface 35; and a snap button 40 housed in the housing part 50, which is a conductive connection member equipped with a button part 42 extending in a direction opposite to the side in which the conductive part is provided. The housing part 50 includes a housing part body 51 formed in a recessed shape in a direction from the base part upper surface 35 to the base part undersurface 36, and a pressing part 55 extending in a recessed internal direction of the housing body 51 by a predetermined width on the base part upper surface 35. The pressing part 55 presses a disk part 41 in a state that the snap button 40 is housed in the housing part 50.SELECTED DRAWING: Figure 4

Description

The present invention relates to an electroencephalogram measuring electrode and an electroencephalogram measuring device.

So far, various developments have been made regarding electrodes for detecting brain waves. As this kind of technique, for example, the techniques described in Patent Document 1 and Patent Document 2 are known.

The electroencephalogram measurement electrode (biological electrode) disclosed in Patent Document 1 includes a support member, a supported portion that is a member supported by the support member, and at least one electrode portion that is a member protruding from the supported portion. It is provided with an electrode member which is a conductive rubber having the above and a snap button type connector provided on the support member and electrically connecting the electrode member to the outside, and the snap button type connector and the supported portion. And are integrally molded.

The electroencephalogram measurement electrode (electroencephalogram detection bioelectrode) disclosed in Patent Document 2 has a holder portion having a plurality of through holes, a base portion extending outward from the peripheral surface of the through holes, and a base portion protruding from the base portion. An electrode portion formed of at least one conductive elastic body having at least one protruding portion capable of penetrating the through hole, and a conductive lid portion sandwiching the base portion between the holder portion. Be prepared.

International Publication No. 2020/121777 International Publication No. 2019/0773740

In the techniques described in Patent Documents 1 and 2, a columnar base having a conductive member that contacts the scalp, a member that supports or holds the base, and a connecting member (snap button type connector, etc.) that outputs a signal to an external device are used. It is realized by the configuration having. The electroencephalogram measurement electrode composed of these components tends to have a large number of parts, and there is a concern that the parts may be displaced due to an impact and the continuity may be lost, resulting in a decrease in detection accuracy. In addition, if the number of parts is large, the cost price rises and the manufacturing and usage management tends to be complicated, so a countermeasure technique is required.

The present invention has been made in view of such a situation, and a connecting member (snap button type connector, etc.) in which a conductive portion in contact with the scalp is directly or indirectly provided on a columnar base and is connected to an external measuring device. It is an object of the present invention to provide a technique capable of realizing stable electroencephalogram measurement while reducing the number of parts in an electroencephalogram measurement electrode having the above.

According to the present invention
Columnar base and
A conductive portion provided on one end surface of the base portion and
An accommodating portion provided on the other end surface of the base portion and
A conductive connecting member housed in the accommodating portion and having a connecting protrusion extending in a direction opposite to the side where the conductive portion is provided.
Have,
The accommodating part
A housing unit body formed in a concave shape from the other end surface in the direction of the one end surface,
On the other end surface, there is a holding portion that extends in a predetermined width in the concave shape of the housing portion main body.
In a state where the conductive connecting member is housed in the housing portion, the holding portion holds the conductive connecting member.
Electrodes for electroencephalogram measurement are provided.
With the above electrodes for EEG measurement,
A frame that holds the plurality of electrodes for measuring brain waves, and
A measuring unit connected to the connecting projection of the conductive connecting member and measuring the measured electroencephalogram signal, and a measuring unit.
An electroencephalogram measuring device having the above is provided.

According to the present invention, in an electroencephalogram measuring electrode in which a conductive portion in contact with the scalp is directly or indirectly provided at a columnar base and is connected to an external measuring device and has a connecting member, a stable electroencephalogram while reducing the number of parts is achieved. It is possible to provide a technique capable of realizing the measurement.

It is a figure which shows typically the electroencephalogram measuring apparatus in the state which is attached to the human head which concerns on embodiment. It is a perspective view of the frame which concerns on embodiment. It is a perspective view of the electrode for electroencephalogram measurement which concerns on embodiment. It is sectional drawing which shows typically the electrode for electroencephalogram detection which concerns on embodiment. It is sectional drawing which shows typically the electrode for electroencephalogram detection in the disassembled state which concerns on embodiment. It is sectional drawing which shows typically the manufacturing process of the electrode for electroencephalogram detection which concerns on embodiment.

<Outline of EEG measuring device 1>
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram schematically showing an electroencephalogram measuring device 1 worn on a human head 99.
The electroencephalogram measuring device 1 is attached to a human head 99, detects an electroencephalogram as a potential fluctuation from a living body, and outputs the detected electroencephalogram to a measuring unit (not shown). The measurement unit acquires the electroencephalogram detected by the electroencephalogram measurement electrode 10, displays it on a monitor, saves data, and performs well-known electroencephalogram analysis processing.

<Structure of EEG measuring device 1>
As shown in FIG. 1, the electroencephalogram measuring device 1 has a plurality of electroencephalogram measuring electrodes 10 and a frame 20. In this embodiment, the electroencephalogram measurement electrodes 10 are provided for 5 channels (5).

<Structure of frame 20>
FIG. 2 shows a perspective view of the frame 20. The frame 20 is formed of a hard member such as a polyamide resin in a band shape and curved so as to follow the shape of a human head 99.

The frame 20 is provided with five electrode unit mounting portions 21 as openings for mounting the electroencephalogram measuring electrode 10. The position of the electrode unit mounting portion 21 (that is, the mounting position of the electroencephalogram measuring electrode 10) corresponds to, for example, the positions of T3, C3, Cz, C4, and T4 in the international 10-20 electrode placement method.

The inner peripheral surface of the electrode unit mounting portion 21 is set to have substantially the same outer diameter as the outer peripheral surface of the electroencephalogram measuring electrode 10, and the electroencephalogram measuring electrode 10 is fitted and fixed to the electrode unit mounting portion 21. Will be done. The inner peripheral surface of the electrode unit mounting portion 21 and the outer peripheral surface of the electroencephalogram measuring electrode 10 may be screwed so that the electroencephalogram measuring electrode 10 is screwed to the electrode unit mounting portion 21.

<Structure of electrode 10 for electroencephalogram measurement>
FIG. 3 shows a perspective view of the electroencephalogram measurement electrode 10. FIG. 4 shows a cross-sectional view schematically showing the electroencephalogram measurement electrode 10. FIG. 5 shows a cross-sectional view schematically showing the electroencephalogram measurement electrode 10 in a disassembled state. Note that the adhesive member 70 is omitted in FIG. The electroencephalogram measurement electrode 10 has an electrode portion 30, a snap button 40, a conductive connection layer 60, and an adhesive member 70.

<Electrode part 30>
The electrode portion 30 includes a base portion 31, a projection portion for electrodes (hereinafter, simply referred to as “projection portion 32”), a conductive contact portion 33, a signal line portion 34, and a housing portion 50. The base portion 31 and the protrusion portion 32 are integrally provided by a rubber-like elastic member. The specific material of the elastic member will be described later. The base 31 and the protrusion 32 are not limited to the one provided integrally, and the base 31 and the protrusion 32 may be assembled separately by an adhesive or a fitting structure.

<Base 31 and protrusion 32>
The base 31 has a substantially cylindrical shape. On the lower surface 36 of the circular base portion on one end side (lower side in the drawing) of the base portion 31, a plurality of substantially conical protrusions 32 protruding downward in the drawing are provided at predetermined intervals in the circumferential direction of the circle. The base 31 may have a columnar shape and may have a cross section of a polygon or other shape in addition to a circle. Further, the shape of the protrusion 32 is not limited to the conical shape, and various shapes such as a pyramid such as a triangular pyramid and a cylindrical shape can be adopted.

A conductive contact portion 33 is provided on at least the front end side surface of the protrusion 32. The conductive contact portion 33 may be provided on the entire surface of the protrusion 32.

The outer diameter of the base portion 31 (diameter of the peripheral surface 37) is, for example, 10 mm to 50 mm. The height (thickness) of the base 31 is, for example, 2 mm to 30 mm. The height of the protrusion 32 is, for example, 3 mm to 15 mm. The width of the protrusion 32 (outer diameter of the root portion) is, for example, 1 mm to 10 mm.

<Structure of signal line unit 34>
The electrode portion 30 is provided with a signal line portion 34 as a signal path connected to the conductive contact portion 33. The signal line portion 34 may adopt various wiring structures as long as it is conductive via the base portion 31 and the protrusion portion 32. Here, the signal line portion 34 is provided so as to pass through the inside of the protrusion 32 and the base 31 from the conductive contact portion 33 at the tip of the protrusion 32 and be exposed to the bottom surface 51a of the housing portion 50. .. The portion of the signal line portion 34 that protrudes from the bottom surface 51a of the accommodating portion becomes a bent portion 34a that is sandwiched and bent when the snap button 40 is accommodated, and is connected to the conductive connection layer 60.

The lower tip of the signal line portion 34 has a structure that protrudes from the tip portion of the protrusion 32 or its vicinity, that is, a region where the conductive contact portion 33 is formed, a structure that is substantially on the same surface, and a buried structure. It may be any of. From the viewpoint of connection stability with the conductive contact portion 33, a protruding structure may be used. The protruding portion at the tip of the signal line portion 34 is partially or wholly covered with the conductive contact portion 33. As the protruding structure at the tip of the signal line portion 34, a structure without folding back, with folding back, and winding around the surface of the tip end portion of the protruding portion 32 can be adopted.

As another wiring structure of the signal line portion 34, it may be a structure provided on the surface of the protrusion 32 and the base portion 31, or a wiring structure in which a part is provided inside and a part is provided on the surface. That is, the signal detected by the conductive contact portion 33 may be transmitted to the conductive connection layer 60 and finally to the snap button 40.

<Snap button 40>
The snap button 40 has, for example, a disk-shaped disk portion 41 made of a good conductor metal and having a diameter D3, and a convex button-shaped button portion 42 extending from the center of the disk upper surface 43 of the disk portion 41. The disk portion 41 is accommodated in the accommodating portion 50, and is connected to the conductive contact portion 33 by starting the signal line portion 34. The button portion 42 has a cylindrical shape with a tip side having a diameter expanded from the root side, and is fitted with a terminal provided on a signal line connected to an external device. As the metal of a good conductor, for example, stainless steel, copper alloy, aluminum alloy, brass and the like can be used.

<Accommodation section 50>
The upper surface 35 of the base portion of the base portion 31 is provided with a housing portion 50 formed in a concave shape on the lower surface 36 side of the base portion. The accommodating portion 50 includes an accommodating portion main body 51 for accommodating the snap button 40, a central opening 53 for pulling out the button portion 42 of the snap button 40 so as to project upward in the drawing, and the snap button 40 so as not to come out. It has a pressing portion 55 for pressing.

The accommodating portion main body 51 is a columnar space having a diameter D1 and a predetermined depth, and accommodates the disk portion 41 of the snap button 40. The diameter D1 is substantially the same as the diameter D3 of the disk portion 41. The predetermined depth is substantially the same as the sum of the thickness of the disk portion 41 and the thickness of the conductive connection layer 60. That is, the snap button 40 and the conductive connection layer 60 are provided on the accommodating portion main body 51, and the dimensions are such that they are properly fixed and do not shift.

An upper surface 35 of the base is formed on the upper side of the accommodating portion main body 51, and the center is a central opening 53 having a diameter of D2, so that the space of the accommodating portion main body 51 is exposed to the outside (here, upward). The diameter D2 is smaller than the diameter D1 and a part of the accommodating portion main body 51 is covered with the base upper surface 35. In other words, the upper surface 35 of the base portion has a pressing portion 55 extending in a predetermined width in the concave internal direction (that is, the button portion 42 side) of the accommodating portion main body 51. The extension width of the pressing portion 55 (that is, the relationship between the diameter D1 and the diameter D2) is set so that the disk portion 41 can be pushed into the accommodating portion main body 51.

The pressing portion 55 presses the peripheral edge of the disk upper surface 43 of the disk portion 41 in a state where the snap button 40 (more specifically, the disk portion 41) is accommodated in the accommodating portion 50.

<Conductive connection layer 60>
When the electrode portion 30 is accommodated in the accommodating portion 50, the conductive connection layer 60 (also referred to as “conductive paste layer”) is the disc lower surface 44 of the accommodating portion bottom surface 51a of the accommodating portion main body 51 and the disc portion 41 of the snap button 40. It is provided between and to maintain good conductivity between them.

As the conductive member of the conductive connection layer 60, a conductive member similar to the conductive contact portion 33 provided on the protrusion 32 can be used, and for example, there is a paste containing a good conductive metal (so-called conductive paste). Good-leading metals include one or more selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, or alloys thereof. In particular, silver, silver chloride, and copper are preferable from the viewpoint of availability and conductivity.

A metal foil may be provided instead of the conductive connection layer 60, or a metal foil may be provided between the conductive connection layer 60 and the snap button 40 or between the conductive connection layer 60 and the accommodating portion main body 51. good. The metal leaf is, for example, aluminum, copper (including an alloy thereof), or stainless steel in the form of a foil. Internal maintenance after assembling the electroencephalogram measurement electrode 10 is difficult, and considering deterioration of the scalp due to sweat, aluminum or stainless steel is preferable. The thickness of the metal foil is, for example, 1 μm to 100 μm. In any configuration, the bent portion 34a of the signal line portion 34 is sandwiched between the disk portion 41 of the snap button 40 and the accommodating portion main body 51, so that the electrical connection of this portion can be stabilized. can.

<Adhesive member 70>
An adhesive member 70 for joining the pressing portion 55 and the snap button 40 (here, the disk portion 41) is provided at the tip end portion (that is, the central opening portion 53) of the pressing portion 55 of the accommodating portion 50. The pressing portion 55 and the snap button 40 are sealed by the adhesive member 70. As the adhesive member 70, for example, a silicone adhesive can be used.

<Material of electrode portion 30>
The material of the electrode portion 30 (base portion 31 and protrusion portion 32) will be described. The electrode portion 30 is a rubber-like elastic body as described above. The rubber-like elastic body is specifically a rubber or a thermoplastic elastomer (also simply referred to as "elastomer (TPE)"). Examples of rubber include silicone rubber. Examples of the thermoplastic elastomer include styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), urethane-based TPE (TPU), ester-based TPE (TPEE), and amide-based TPE (TPAE). There is.

When the electrode portion 30 is made of silicone rubber, the type A durometer hardness on the surface of the electrode portion 30 (base 31 or protrusion 32) measured according to JIS K 6253 (1997) at 37 ° C. is the rubber hardness A. The rubber hardness A is, for example, 15 or more and 55 or less.

Here, the silicone rubber-based curable composition will be described.
The silicone rubber can be composed of a cured product of a silicone rubber-based curable composition. The curing step of the silicone rubber-based curable resin composition is, for example, heating (primary curing) at 100 to 250 ° C. for 1 to 30 minutes and then post-baking (secondary curing) at 100 to 200 ° C. for 1 to 4 hours. It is done by.

The insulating silicone rubber is a silicone rubber that does not contain a conductive filler, and the conductive silicone rubber is a silicone rubber that contains a conductive filler.

The silicone rubber-based curable composition according to the present embodiment can contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer that is the main component of the silicone rubber-based curable composition of the present embodiment.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same kind of vinyl group-containing linear organopolysiloxane. The vinyl group-containing linear organopolysiloxane of the same type may contain at least the same vinyl group as the functional group and have a linearity, and the amount of vinyl group in the molecule, the molecular weight distribution, or the amount thereof added may be. It may be different.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different vinyl group-containing organopolysiloxanes.

The vinyl group-containing organopolysiloxane (A) can include a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains a vinyl group, and the vinyl group serves as a cross-linking point at the time of curing.

The content of the vinyl group of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably, for example, having two or more vinyl groups in the molecule and 15 mol% or less. , 0.01-12 mol%, more preferably. As a result, the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1) is optimized, and a network with each component described later can be reliably formed. In the present embodiment, "-" means that the numerical values at both ends thereof are included.

In the present specification, the vinyl group content is the mol% of the vinyl group-containing siloxane unit when all the units constituting the vinyl group-containing linear organopolysiloxane (A1) are 100 mol%. .. However, it is considered that there is one vinyl group for each vinyl group-containing siloxane unit.

The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of, for example, about 1000 to 10000, and more preferably about 2000 to 5000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number average degree of polymerization (or number average molecular weight) in GPC (gel permeation chromatography) using chloroform as a developing solvent.

Further, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above range, the obtained silicone rubber has heat resistance, flame retardancy, chemical stability, etc. Can be improved.

The vinyl group-containing linear organopolysiloxane (A1) preferably has a structure represented by the following formula (1).

In formula (1), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group and the like, and among them, a vinyl group is preferable. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group and the like.

Further, R ² is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

Further, R ³ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group.

Further, examples of the substituent of R ¹ and R ² in the formula (1) include a methyl group, a vinyl group and the like, and examples of the substituent of R ³ include a methyl group and the like.

In the equation (1), the plurality of R ^1s are independent of each other and may be different from each other or may be the same. The same applies to R ² and R ³ .

Further, m and n are the number of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by the formula (1), m is an integer of 0 to 2000, and n is 1000 to 10000. Is an integer of. m is preferably 0 to 1000, and n is preferably 2000 to 5000.

Further, as a specific structure of the vinyl group-containing linear organopolysiloxane (A1) represented by the formula (1), for example, the one represented by the following formula (1-1) can be mentioned.

In formula (1-1), R ¹ and R ² are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

Further, the vinyl group-containing linear organopolysiloxane (A1) contains a first vinyl group having a vinyl group content of 2 or more in the molecule and 0.4 mol% or less. It contains a linear organopolysiloxane (A1-1) and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%. It is preferable to have it. As raw rubber which is a raw material of silicone rubber, a first vinyl group-containing linear organopolysiloxane (A1-1) having a general vinyl group content and a second vinyl group-containing direct link having a high vinyl group content. By combining with the chain organopolysiloxane (A1-2), the vinyl groups can be unevenly distributed, and the cross-linking density can be more effectively formed in the cross-linking network of the silicone rubber. As a result, the tear strength of the silicone rubber can be increased more effectively.

Specifically, as the vinyl group-containing linear organopolysiloxane (A1), for example, in the above formula (1-1), a unit in which R ¹ is a vinyl group and / or a unit in which R ² is a vinyl group is used. , A first vinyl group-containing linear organopolysiloxane (A1-1) having two or more in the molecule and containing 0.4 mol% or less, and a unit in which R ¹ is a vinyl group and / or R. It is preferable to use a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol% of the unit in which ² is a vinyl group.

Further, the first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol%. The vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol%.

Further, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are blended in combination (A1-1). The ratio of and (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1) :( A1-2) is preferably 50:50 to 95: 5, and 80:20 to 90: It is more preferably 10.

The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may be used alone or in combination of two or more. good.

Further, the vinyl group-containing organopolysiloxane (A) may contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

<< Organohydrogenpolysiloxane (B) >>
The silicone rubber-based curable composition of the present embodiment may contain a cross-linking agent. The cross-linking agent can include organohydrogenpolysiloxane (B).
Organohydrogenpolysiloxane (B) is classified into linear organohydrogenpolysiloxane (B1) having a linear structure and branched organohydrogenpolysiloxane (B2) having a branched structure. Either one or both can be included.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of cross-linking agent. The cross-linking agent of the same type may have at least a common structure such as a linear structure or a branched structure, may contain a molecular weight distribution in the molecule or a different functional group, and the addition amount thereof is different. You may.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different cross-linking agents.

The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure (≡Si—H) in which hydrogen is directly bonded to Si, and is a vinyl group-containing organopolysiloxane (A). In addition to the vinyl group, it is a polymer that undergoes a hydrosilylation reaction with the vinyl group of the component blended in the silicone rubber-based curable composition to crosslink these components.

The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20000 or less, and more preferably 1000 or more and 10000 or less.

The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by polystyrene conversion in GPC (gel permeation chromatography) using chloroform as a developing solvent.

Further, the linear organohydrogenpolysiloxane (B1) usually preferably has no vinyl group. This makes it possible to accurately prevent the cross-linking reaction from proceeding in the molecule of the linear organohydrogenpolysiloxane (B1).

As the linear organohydrogenpolysiloxane (B1) as described above, for example, one having a structure represented by the following formula (2) is preferably used.

In the formula (2), ^R4 is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, a hydrocarbon group combining these, or a hydride group. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group and the like. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

Further, R5 is a substituted or unsubstituted alkyl group having 1 to ¹⁰ carbon atoms, an alkenyl group, an aryl group, a hydrocarbon group combining these, or a hydride group. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group and a propyl group, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group and the like. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

In the equation (2), the plurality of R ^4s are independent of each other and may be different from each other or may be the same. The ^same applies to R5. However, of the plurality of R ⁴ and R ⁵ , at least two or more are hydride groups.

Further, R ⁶ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. The plurality of ^R6s are independent of each other and may be different from each other or may be the same.

Examples of the substituent of R ⁴ , R ⁵ , and R ⁶ in the formula (2) include a methyl group and a vinyl group, and a methyl group is preferable from the viewpoint of preventing an intramolecular cross-linking reaction.

Further, m and n are the number of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by the formula (2), m is an integer of 2 to 150, and n is an integer of 2 to 150. Is. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more.

Since the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms a region having a high crosslink density and is a component that greatly contributes to the formation of a sparsely packed structure with a crosslink density in the silicone rubber system. Further, like the linear organohydrogenpolysiloxane (B1), it has a structure (≡Si—H) in which hydrogen is directly bonded to Si, and in addition to the vinyl group of the vinyl group-containing organopolysiloxane (A), silicone. It is a polymer that hydrosilylates with the vinyl group of the component blended in the rubber-based curable composition and crosslinks these components.

The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

Further, the branched organohydrogenpolysiloxane (B2) is usually preferably one having no vinyl group. As a result, it is possible to accurately prevent the cross-linking reaction from proceeding in the molecule of the branched organohydrogenpolysiloxane (B2).

Further, as the branched organohydrogenpolysiloxane (B2), those represented by the following average composition formula (c) are preferable.

Average composition formula (c)
(Ha (R ⁷ ) _{3-a SiO 1/2} ) _m (SiO _4/2 ) _n
(In the formula (c), R ⁷ is a monovalent organic group, a is an integer in the range of 1 to 3, m is the number of Ha (R ⁷ ) _{3-a SiO 1/2} units, and n is SiO _{4 /.} It is a number of ₂ units)

In formula (c), R ⁷ is a monovalent organic group, preferably a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an aryl group, or a hydrocarbon group in combination thereof. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

In the formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer in the range of 1 to 3, preferably 1.

Further, in the formula ( _c ), m is the number of Ha (R ⁷ ) _3-a SiO _1/2 unit, and n is the number of SiO _4/2 unit.

The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in that their structures are linear or branched, and are different from Si when the number of Si is 1. The number of alkyl groups R to be bonded (R / Si) is 1.8 to 2.1 for linear organohydrogenpolysiloxane (B1) and 0.8 to 1 for branched organohydrogenpolysiloxane (B2). It is in the range of 0.7.

Since the branched organohydrogenpolysiloxane (B2) has a branched structure, for example, the amount of residue when heated to 1000 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere is 5% or more. It becomes. On the other hand, since the linear organohydrogenpolysiloxane (B1) is linear, the amount of residue after heating under the above conditions is almost zero.

Further, as a specific example of the branched organohydrogenpolysiloxane (B2), those having a structure represented by the following formula (3) can be mentioned.

In formula (3), R ⁷ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group combining these, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. Examples of the substituent of R ⁷ include a methyl group and the like.

In the equation (3), the plurality of R ^7s are independent of each other and may be different from each other or may be the same.

Further, in the equation (3), "-O-Si≡" indicates that Si has a branched structure that spreads three-dimensionally.

The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more.

Further, in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2), the amount of hydrogen atoms (hydride groups) directly bonded to Si is not particularly limited. However, in the silicone rubber-based curable composition, the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpoly are added to 1 mol of the vinyl group in the vinyl group-containing linear organopolysiloxane (A1). The total amount of hydride groups of siloxane (B2) is preferably 0.5 to 5 mol, more preferably 1 to 3.5 mol. This ensures that a crosslinked network is formed between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1). Can be made to.

<< Silica particles (C) >>
The silicone rubber-based curable composition according to the present embodiment contains a non-conductive filler. The non-conductive filler may contain silica particles (C), if necessary. As a result, the hardness and mechanical strength of the elastomer can be improved.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of non-conductive filler. The non-conductive fillers of the same type may have at least a common constituent material, and may differ in particle size, specific surface area, surface treatment agent, or the amount added thereof.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

The silica particles (C) are not particularly limited, but for example, fumed silica, calcined silica, precipitated silica and the like are used. These may be used alone or in combination of two or more.

The specific surface area of the silica particles (C) according to the BET method is preferably, for example, 50 to 400 m ² / g, and more preferably 100 to 400 m ² / g. The average primary particle size of the silica particles (C) is preferably, for example, 1 to 100 nm, and more preferably about 5 to 20 nm.

By using the silica particles (C) within the range of the specific surface area and the average particle size, it is possible to improve the hardness and mechanical strength of the formed silicone rubber, particularly the tensile strength.

<< Silane Coupling Agent (D) >>
The silicone rubber-based curable composition of the present embodiment can contain a silane coupling agent (D).
The silane coupling agent (D) can have a hydrolyzable group. The hydrolyzing group is hydrolyzed by water to become a hydroxyl group, and this hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl group on the surface of the silica particles (C), whereby the surface of the silica particles (C) can be modified.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent. It is sufficient that the silane coupling agent of the same type has at least a common functional group, and other functional groups in the molecule and the amount of addition may be different.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

Further, the silane coupling agent (D) can include a silane coupling agent having a hydrophobic group. As a result, this hydrophobic group is imparted to the surface of the silica particles (C), so that the cohesive force of the silica particles (C) is reduced in the silicone rubber-based curable composition and thus in the silicone rubber (hydrogen due to silanol groups). Aggregation due to bonding is reduced), and as a result, it is presumed that the dispersibility of the silica particles (C) in the silicone rubber-based curable composition is improved. As a result, the interface between the silica particles (C) and the rubber matrix increases, and the reinforcing effect of the silica particles (C) increases. Further, it is presumed that the slipperiness of the silica particles (C) in the matrix is improved when the rubber matrix is deformed. Then, by improving the dispersibility and slipperiness of the silica particles (C), the mechanical strength (for example, tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C) is improved.

Further, the silane coupling agent (D) can include a silane coupling agent having a vinyl group. As a result, a vinyl group is introduced on the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, the vinyl group contained in the vinyl group-containing organopolysiloxane (A) and the hydride group contained in the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction. When the network (crosslinked structure) formed by these is formed, the vinyl group of the silica particles (C) is also involved in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B). Silica particles (C) will also be incorporated into the. As a result, it is possible to reduce the hardness and increase the modulus of the formed silicone rubber.

As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

Examples of the silane coupling agent (D) include those represented by the following formula (4).

Y _n -Si- (X) _4-n ... (4)
In the above equation (4), n represents an integer of 1 to 3. Y represents any functional group having a hydrophobic group, a hydrophilic group or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of them is. It is a hydrophobic group. X represents a hydrolyzable group.

The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group in which these are combined, and examples thereof include a methyl group, an ethyl group, a propyl group, a phenyl group, and the like. Methyl groups are preferred.

Examples of the hydrophilic group include a hydroxyl group, a sulfonic acid group, a carboxyl group, a carbonyl group and the like, and among them, a hydroxyl group is particularly preferable. The hydrophilic group may be contained as a functional group, but is preferably not contained from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

Further, examples of the hydrolyzable group include an alkoxy group such as a methoxy group and an ethoxy group, a chloro group or a silazane group, and among them, a silazane group is preferable because it has high reactivity with the silica particles (C). Those having a silazane group as a hydrolyzable group have two structures of ( _Yn —Si−) in the above formula (4) due to their structural characteristics.

Specific examples of the silane coupling agent (D) represented by the above formula (4) are as follows.
Examples of the functional group having a hydrophobic group include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, and n-propyltrimethoxysilane. alkoxysilanes such as n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane; hexamethyldisilazane Can be mentioned. Among these, a silane coupling agent having a trimethylsilyl group containing at least one selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane is preferable.

Examples of those having a vinyl group as the functional group include metharoxypropyltriethoxysilane, methacrypropyltrimethoxysilane, methaloxypropylmethyldiethoxysilane, methaloxypropylmethyldimethoxysilane, vinyltriethoxysilane, and vinyltrimethoxy. Alkoxysilanes such as silanes and vinylmethyldimethoxysilanes; chlorosilanes such as vinyltrichlorosilanes and vinylmethyldichlorosilanes; and divinyltetramethyldisilazane. Among these, methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinyl. A silane coupling agent having a vinyl group-containing organosilyl group containing at least one selected from the group consisting of methyldimethoxysilane is preferable.

When the silane coupling agent (D) contains two types of a silane coupling agent having a trimethylsilyl group and a silane coupling agent having a vinyl group-containing organosilyl group, hexamethyldisilazane as having a hydrophobic group is used. Those having a vinyl group preferably contain divinyltetramethyldisilazane.

When a silane coupling agent having a trimethylsilyl group (D1) and a silane coupling agent having a vinyl group-containing organosilyl group (D2) are used in combination, the ratio of (D1) to (D2) is not particularly limited, but for example, By weight ratio, (D1): (D2) is 1: 0.001 to 1: 0.35, preferably 1: 0.01 to 1: 0.20, more preferably 1: 0.03 to 1: 0. It is .15. With such a numerical range, the desired physical properties of the silicone rubber can be obtained. Specifically, it is possible to balance the dispersibility of silica in the rubber and the crosslinkability of the rubber.

In the present embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more with respect to 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). It is more preferably mass% or more, and further preferably 5 mass% or more. The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, preferably 80% by mass or less, based on 100 parts by mass of the total amount of the vinyl group-containing organopolysiloxane (A). More preferably, it is more preferably 40% by mass or less.
By setting the content of the silane coupling agent (D) to the above lower limit value or more, the adhesion between the columnar portion containing the elastomer and the conductive resin layer can be improved. Further, it can contribute to the improvement of the mechanical strength of the silicone rubber. Further, by setting the content of the silane coupling agent (D) to the above upper limit value or less, the silicone rubber can have appropriate mechanical properties.

<< Platinum or platinum compound (E) >>
The silicone rubber-based curable composition according to the present embodiment may contain a catalyst. The catalyst can include platinum or platinum compound (E). Platinum or the platinum compound (E) is a catalytic component that acts as a catalyst during curing. The amount of platinum or platinum compound (E) added is the amount of catalyst.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst. The catalysts of the same type may have at least a common constituent material, and the catalysts may contain different compositions or may be added in different amounts.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts from each other.

As the platinum or the platinum compound (E), known ones can be used, for example, platinum black, platinum supported on silica, carbon black or the like, platinum chloride acid or an alcohol solution of platinum chloride acid, chloride. Examples thereof include a complex salt of platinum acid and olefin, and a complex salt of platinum chloride acid and vinyl siloxane.

As the platinum or the platinum compound (E), only one type may be used alone, or two or more types may be used in combination.

In the present embodiment, the content of platinum or the platinum compound (E) in the silicone rubber-based curable composition means the amount of catalyst and can be appropriately set, but specifically, a vinyl group-containing organopolysiloxane. The amount of the platinum group metal is 0.01 to 1000 ppm by weight with respect to 100 parts by weight of the total amount of (A), the silica particles (C) and the silane coupling agent (D), and is preferably 0. The amount is 1 to 500 ppm.
By setting the content of platinum or the platinum compound (E) to the above lower limit value or more, the silicone rubber-based curable composition can be cured at an appropriate rate. Further, by setting the content of platinum or the platinum compound (E) to the above upper limit value or less, it is possible to contribute to the reduction of manufacturing cost.

<< Water (F) >>
Further, the silicone rubber-based curable composition according to the present embodiment may contain water (F) in addition to the above components (A) to (E).

Water (F) functions as a dispersion medium for dispersing each component contained in the silicone rubber-based curable composition, and is a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). .. Therefore, in the silicone rubber, the silica particles (C) and the silane coupling agent (D) can be more reliably connected to each other, and uniform characteristics can be exhibited as a whole.

(Other ingredients)
Further, the silicone rubber-based curable composition of the present embodiment may further contain other components in addition to the above components (A) to (F). Other components include silica particles (C) such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica. Examples thereof include additives such as inorganic fillers, reaction inhibitors, dispersants, pigments, dyes, antioxidants, antioxidants, flame retardants, and thermal conductivity improvers.

The conductive solution (conductive silicone rubber composition) according to the present embodiment contains the above-mentioned conductive filler and solvent in addition to the above-mentioned silicone rubber-based curable composition which does not contain the above-mentioned conductive filler.

As the solvent, various known solvents can be used, and for example, a high boiling point solvent can be included. These may be used alone or in combination of two or more.

Examples of the above solvents include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane and tetradecane; benzene, toluene, ethylbenzene, xylene and trifluoromethylbenzene. , Aromatic hydrocarbons such as benzotrifluoride; diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3 -Ethers such as dioxane and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2-trichloroethane; N, N-dimethyl Carborate amides such as formamide and N, N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide can be exemplified. These may be used alone or in combination of two or more.

By adjusting the amount of solids in the solution, the conductive solution can have an appropriate viscosity for various coating methods such as spray coating and dip coating.

When the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the content of the silica particles (C) contained in the electrode portion 30 is the silica particles (C) and the conductive filler. With respect to the total amount of 100% by mass, for example, it can be 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more. Thereby, the mechanical strength of the electrode portion 30 can be improved. On the other hand, the upper limit of the content of the silica particles (C) contained in the electrode portion 30 is, for example, 20% by mass or less with respect to 100% by mass of the total amount of the silica particles (C) and the conductive filler. It is preferably 15% by mass or less, and more preferably 10% by mass or less. As a result, it is possible to balance the conductivity of the electrode portion 30 with the mechanical strength and flexibility.

A conductive silicone rubber can be obtained by heating and drying the conductive solution as needed.
The conductive silicone rubber may have a structure that does not contain silicone oil. As a result, it is possible to prevent the silicone oil from bleeding out to the surface of the electrode portion 30 to reduce the conductivity.

<Material of signal line unit 34>
As the signal line portion 34, known ones can be used, but for example, the signal line portion 34 may be made of a conductive fiber. As the conductive fiber, one or more selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber can be used. These may be used alone or in combination of two or more.

The metal material of the metal fiber and the metal coating fiber is not limited as long as it has conductivity, but copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver / chloride. Examples include silver and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. Further, it is preferable that the metal material does not contain a metal such as chromium that gives an environmental load.

The fiber material of the metal-coated fiber, the conductive polymer-coated fiber, and the conductive paste-coated fiber is not particularly limited, and may be any of synthetic fiber, semi-synthetic fiber, and natural fiber. Among these, it is preferable to use polyester, nylon, polyurethane, silk, cotton and the like. These may be used alone or in combination of two or more.

Examples of the carbon fibers include PAN-based carbon fibers and pitch-based carbon fibers.

The conductive polymer material of the conductive polymer fiber and the conductive polymer-coated fiber is, for example, a mixture of a conductive polymer and a binder resin such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylene vinylene, polynaphthalene, and derivatives thereof. Alternatively, an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene) -poly (styrene sulfonic acid)) is used.

The resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but is preferably elastic, for example, silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene. It can contain one or more selected from the group consisting of propylene rubber. These may be used alone or in combination of two or more.

The conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but a known conductive material may be used, but metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon. It can include one or more selected from the group consisting of fibers, carbon nanotubes, conductive polymers, conductive polymer coated fibers and metal nanowires.

The metal constituting the conductive filler is not particularly limited, but is, for example, copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or at least one of these alloys. , Or two or more of these can be included. Among these, silver or copper is preferable because of its high conductivity and high availability.

The signal line portion 34 may be composed of a twisted yarn obtained by twisting a plurality of linear conductive fibers. Thereby, the disconnection of the signal line portion 34 at the time of deformation can be suppressed.

In the present embodiment, the coating on the conductive fiber does not only cover the outer surface of the fiber material, but in the case of a twisted yarn obtained by twisting single fibers, a metal or a conductive polymer is formed in the fiber gap in the twisted yarn. , Or, which is impregnated with a conductive paste and coats the single fibers constituting the plyed yarn one by one.

The tensile elongation at break of the signal line portion 34 is, for example, 1% or more and 50% or less, preferably 1.5% or more and 45%. By setting it within such a numerical range, it is possible to suppress excessive deformation of the protrusion 32 while suppressing breakage at the time of deformation.

<Material of conductive contact portion 33>
The conductive member of the conductive contact portion 33 is, for example, a paste containing a good conductive metal (so-called conductive paste). Good-leading metals include one or more selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, or alloys thereof. In particular, silver, silver chloride, and copper are preferable from the viewpoint of availability and conductivity.

When the conductive contact portion 33 is formed of a paste containing a good conductive metal, the top of the protrusion 32 made of a rubber-like elastic body is dipped (immersed) in a paste-like conductive solution containing a good conductive metal. Apply). As a result, the conductive contact portion 33 is formed on the surface of the protrusion 32.

The conductive contact portion 33 as the conductive resin layer may be formed by applying the conductive solution containing the conductive filler and the solvent to the protrusion 32. At this time, by using a material (silicone rubber) of the same system as the protrusion 32, the adhesiveness of the conductive contact portion 33 (conductive resin layer) can be enhanced.

A conductive silicone rubber can be obtained by heating and drying the conductive solution as needed.
The conductive silicone rubber may have a structure that does not contain silicone oil. As a result, it is possible to prevent the silicone oil from bleeding out to the surface of the conductive contact portion 33, thereby suppressing the decrease in conductivity.

As a result, it is possible to improve the hair scraping performance when the electroencephalogram measuring device 1 is attached to the head 99. In addition, it is possible to secure a sufficient contact area of the conductive contact portion 33 when the electroencephalogram measuring device 1 is attached.

<Manufacturing method of electrode 10 for electroencephalogram measurement>
An example of a method for manufacturing the electroencephalogram measurement electrode 10 will be described with reference to FIG.
As shown in FIG. 6A, the silicone rubber-based curable composition is heat-press molded using a mold to obtain an electrode portion 30 (base 31 and protrusion 32) having an accommodating portion 50. ..

Subsequently, as shown in FIG. 6B, a signal line portion 34 is passed through the inside of each protrusion 32 of the obtained molded body by using a sewing needle, and one of them is exposed to the tip of the protrusion 32. The other is exposed from the bottom surface 51a of the accommodating portion.

Next, as shown in FIG. 6 (c), a paste-like conductive solution is dip-coated on the tip of the protrusion 32 of the obtained molded body, and the paste-like conductive solution is heat-dried and then annealed. As a result, the conductive contact portion 33 can be formed on the protrusion 32.

Further, as shown in FIG. 6D, the accommodating portion main body 51 of the accommodating portion 50 is coated with a conductive paste, and the snap button 40 is accommodated therein to perform an annealing treatment. As a result, the conductive connection layer 60 is formed between the snap button 40 and the accommodating portion main body 51.

Finally, as shown in FIG. 6E, an adhesive member 70 such as a silicone adhesive is applied to the tip portion (center opening 53) of the pressing portion 55 and cured, and the snap button 40 is sealed in the accommodating portion 50. ..
As a result, the electroencephalogram measurement electrode 10 shown in FIGS. 3 and 4 is manufactured.

<Summary of features and functions of electrode 10 for EEG measurement>
The features and functions of the electroencephalogram measurement electrode 10 of the present embodiment will be collectively described below.
(1) The electroencephalogram measurement electrode 10 is
Columnar base 31 and
A conductive portion (conductive contact portion 33 provided on the protrusion 32) provided on one end surface (lower surface 36 of the base portion) of the base portion 31 and
The accommodating portion 50 provided on the other end surface (base upper surface 35) of the base portion 31 and
A conductive connecting member (that is, a snap button 40) that is housed in the accommodating portion 50 and has a connecting protrusion (button portion 42) that extends in the direction opposite to the side where the conductive portion (conductive contact portion 33) is provided. And have
The accommodating unit 50
A housing portion main body 51 formed in a concave shape from the other end surface (base upper surface 35) to the one end surface (base lower surface 36).
On the other end surface (upper surface 35 of the base portion), there is a pressing portion 55 extending with a predetermined width in the concave internal direction (that is, the button portion 42 side) of the accommodating portion main body 51.
With the snap button 40 accommodated in the accommodating portion 50, the pressing portion 55 presses the snap button 40 (more specifically, the disk portion 41).
As described above, since the electroencephalogram measurement electrode 10 is mainly composed of the electrode portion 30 and the snap button 40 housed in the accommodating portion 50 formed in the electrode portion 30, the number of parts can be reduced. As a result, it is possible to reduce the cost, the manufacturing process, and the control process at the time of use. In addition, since the number of parts is small, deviation due to use is unlikely to occur, and stable electroencephalogram measurement can be performed.
(2) The base 31 is made of an elastic member. This makes it possible to suppress discomfort and the like when the head 99 comes into contact with the head 99. Further, when the snap button 40 is accommodated in the accommodating portion 50, the disk portion 41 can be pushed into the accommodating portion main body 51 against the pressing portion 55.
(3) The pressing portion 55 presses the peripheral edge of the snap button 40 (more specifically, the disk portion 41).
As a result, the deviation of the snap button 40 can be suppressed.
(4) It has a plurality of protrusions 32 provided on the base 31, and a conductive contact portion 33, which is a conductive portion, is provided on at least the front end side surface of the protrusion 32.
(5) It has a signal path (that is, a signal line portion 34) extending from the conductive contact portion 33 through the inside of the protrusion 32 to the accommodating portion main body 51.
(6) A conductive connection layer 60 made of a conductive paste is provided on the bottom surface 51a of the concave housing portion main body 51.
As a result, the signal from the signal line unit 34 can be stably transmitted to the snap button 40.
(7) A metal foil is provided on the bottom surface 51a of the housing portion of the concave housing portion main body 51.
This enables stable signal transmission.
(8) The snap button 40 has a disk portion 41 and a button portion 42 protruding from one surface (disk upper surface 43) of the disk portion 41.
The other surface of the disk portion 41 (the lower surface of the disk 44) is accommodated toward (that is, in direct or indirect contact) the bottom surface 51a of the accommodating portion 50 of the accommodating portion 50.
The peripheral edge of one surface (disk portion 41) of the disk portion 41 is pressed by the pressing portion 55.
(9) An adhesive member 70 for joining the pressing portion 55 and the snap button 40 is provided at the tip end portion (that is, the central opening portion 53) of the pressing portion 55 of the accommodating portion 50.
As a result, the snap button 40 can be reliably accommodated in the accommodating portion 50 and the deviation can be suppressed.
(10) The pressing portion 55 and the snap button 40 are sealed by the adhesive member 70.
As a result, it is possible to prevent the ingress of moisture and the like, and it is possible to prevent deterioration of the signal path.
(11) The electroencephalogram measuring device 1 includes the above-mentioned electroencephalogram measuring electrode 30 and
A frame 20 holding the plurality of electrodes 30 for measuring brain waves, and
It is connected to the button portion 42 of the snap button 40 and has a measuring unit for measuring the measured electroencephalogram signal.

Although the embodiments of the present invention have been described above with reference to the drawings, these are examples of the present invention, and various configurations other than the above can be adopted. For example, in the electroencephalogram measurement electrode 10, a plurality of protrusions 32 are provided from the base 31, and a conductive contact portion 33 is provided at the tip thereof. Not limited to this, a conductive contact portion may be provided on one protrusion having a structure continuous from the base 31. Further, the conductive connection layer 60 may not be provided, and the disk portion 41 of the snap button 40 may be directly connected to the bottom surface 51a of the accommodating portion, and the bent portion 34a may be sandwiched between them.

1 EEG measurement device 10 Electroencephalogram measurement electrode 20 Frame 30 Electrode 31 Base 32 Electrode protrusion 33 Conductive contact 34 Signal line 34a Bending 35 Base upper surface 36 Base lower surface 40 Snap button 41 Disk 42 Button 43 Disk Upper surface 44 Disk lower surface 50 Accommodating part 51 Accommodating part main body 51a Accommodating part bottom surface 53 Central opening 55 Holding part 60 Conductive connection layer 70 Adhesive member

Claims (11)

Columnar base and
A conductive portion provided on one end surface of the base portion and
An accommodating portion provided on the other end surface of the base portion and
A conductive connecting member housed in the accommodating portion and having a connecting protrusion extending in a direction opposite to the side where the conductive portion is provided.
Have,
The accommodating part
A housing unit body formed in a concave shape from the other end surface in the direction of the one end surface,
On the other end surface, there is a holding portion that extends in a predetermined width in the concave shape of the housing portion main body.
In a state where the conductive connecting member is housed in the housing portion, the holding portion holds the conductive connecting member.
Electrodes for EEG measurement. The base is made of an elastic member.
The electrode for measuring electroencephalogram according to claim 1. The pressing portion presses the peripheral edge of the conductive connecting member.
The electrode for measuring electroencephalogram according to claim 1 or 2. It has a plurality of electrode protrusions provided on the base, and has a plurality of electrode protrusions.
The conductive portion is provided on at least the front end side surface of the electrode protrusion.
The electrode for electroencephalogram measurement according to any one of claims 1 to 3. It has a signal path extending from the conductive portion through the inside of the electrode protrusion to the housing portion main body.
The electrode for measuring electroencephalogram according to claim 4. A conductive connection layer made of a conductive paste is provided on the concave bottom surface of the housing portion main body.
The electrode for electroencephalogram measurement according to any one of claims 1 to 5. A metal foil is provided on the concave bottom surface of the housing portion main body.
The electrode for electroencephalogram measurement according to any one of claims 1 to 6. The conductive connecting member has a disk portion and the connecting projection projecting from one surface of the disk portion.
The other surface of the disk portion is accommodated toward the concave bottom surface of the accommodating portion.
The peripheral edge of the one surface of the disk portion is pressed by the pressing portion.
The electrode for electroencephalogram measurement according to any one of claims 1 to 7. The electrode for electroencephalogram measurement according to any one of claims 1 to 8, wherein an adhesive member for joining the holding portion and the conductive connecting member is provided at the tip end portion of the holding portion of the accommodating portion. .. The electrode for electroencephalogram measurement according to claim 9, wherein the holding portion and the conductive connecting member are sealed by the adhesive member. The electrode for electroencephalogram measurement according to any one of claims 1 to 10 and
A frame that holds the plurality of electrodes for measuring brain waves, and
A measuring unit connected to the connecting projection of the conductive connecting member and measuring the measured electroencephalogram signal, and a measuring unit.
An electroencephalogram measuring device having.

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