JP2022018252A - Electrode for brain wave measurement and brain wave measurement device - Google Patents

Abstract

To provide a technique which suppresses the occurrence of a malfunction such as a failure even when an electrode for brain wave measurement receives an impact.SOLUTION: An electrode 10 for brain wave measurement comprises: a columnar base part 31 which is formed of an elastic member; a plurality of protrusion parts 32 which are provided on one end (base part lower surface 36) of the base part 31; a conductive contact part 33 which is provided on at least a tip side surface of the protrusion part 32; a signal line part 34 which is provided to the other end (base part upper surface 35) of the base part 31 via the protrusion part 32 and the base part 31 from the conductive contact part 33; a conductive cushion member 60 which is provided on the other end (base part upper surface 35) of the base part 31, is electrically connected to the signal line part 34, has the conductivity and is elastically deformed; and a snap button 40 which is provided on a side opposite to the base part 31 in the conductive cushion member 60 and has a button part 42 extending in a direction opposite to the base part 31.SELECTED DRAWING: Figure 4

Description

The present invention relates to an electroencephalogram measuring electrode and an electroencephalogram measuring device.

Various developments have been made on electrodes for EEG detection. As this kind of technique, for example, the technique described in Patent Document 1 is known. The electroencephalogram measurement electrode (electroencephalogram detection bioelectrode) disclosed in Patent Document 1 has a holder portion having a plurality of through holes, a base portion extending outward from the peripheral surface of the through holes, and a base portion protruding from the base portion. An electrode portion formed of at least one conductive elastic body having at least one protruding portion capable of penetrating the through hole, and a conductive lid portion sandwiching the base portion between the holder portion. Be prepared.

International Publication No. 2019/07374

In the electroencephalogram measurement electrode, a conductive member such as silver paste is adhered to the surface of a portion in contact with the scalp (for example, a protrusion shape). When the electroencephalogram measurement electrode was impacted, the components may be damaged (damaged). For example, peeling of the conductive member may occur, and the electroencephalogram detection performance may be deteriorated. The technology disclosed in Patent Document 1 is not sufficient in dealing with a failure when it receives an impact or the like, and a technology for countermeasures has been required.

The present invention has been made in view of such a situation, and an object of the present invention is to provide a technique for suppressing the occurrence of a defect such as a failure even when an electroencephalogram measurement electrode is impacted. do.

According to the present invention
A columnar base formed of an elastic member, a plurality of electrode protrusions provided at one end of the base, a conductive portion provided on at least the distal end side surface of the electrode protrusion, and the conductive portion to the above. An electrode portion having a projection portion for an electrode and a signal path provided to the other end of the base portion via the base portion.
A connecting member provided at the other end of the base, which is electrically connected to the signal path, has conductivity, and is elastically deformed.
A conductive connecting member provided on the side opposite to the base side of the connecting member and having a connecting protrusion extending in a direction opposite to the base side.
Have,
Electrodes for electroencephalogram measurement are provided.

According to the present invention, it is possible to provide a technique for suppressing the occurrence of a defect such as a failure even when the electroencephalogram measurement electrode receives an impact.

It is a figure which shows typically the electroencephalogram measuring apparatus in the state attached to the human head which concerns on 1st Embodiment. It is a perspective view of the frame which concerns on 1st Embodiment. It is a perspective view of the electroencephalogram measurement electrode which concerns on 1st Embodiment. It is sectional drawing which shows typically the electrode for electroencephalogram detection which concerns on 1st Embodiment. It is an exploded sectional view schematically showing the electrode for electroencephalogram detection which concerns on 1st Embodiment. It is sectional drawing which shows typically the electrode for electroencephalogram detection which concerns on 2nd Embodiment. It is sectional drawing which shows typically the electrode for electroencephalogram detection which concerns on 3rd Embodiment.

<First Embodiment>
<Overview>
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram schematically showing an electroencephalogram measuring device 1 in a state of being attached to a human head 99.
The electroencephalogram measuring device 1 is attached to a human head 99, detects an electroencephalogram as a potential fluctuation from a living body, and outputs the detected electroencephalogram to a measuring unit (not shown). The measurement unit acquires the electroencephalogram detected by the electroencephalogram measurement electrode 10, displays it on a monitor, saves data, and performs well-known electroencephalogram analysis processing.

<Structure of EEG measuring device 1>
As shown in FIG. 1, the electroencephalogram measuring device 1 has a plurality of electroencephalogram measuring electrodes 10 and a frame 20. In this embodiment, the electroencephalogram measurement electrodes 10 are provided for 5 channels (5).

<Structure of frame 20>
FIG. 2 shows a perspective view of the frame 20. The frame 20 is made of a hard member such as a polyamide resin and is formed in a band shape and curved so as to follow the shape of the human head 99.

The frame 20 is provided with five electrode unit mounting portions 21 as openings for mounting the electroencephalogram measuring electrodes 10. The position of the electrode unit mounting portion 21 (that is, the mounting position of the electroencephalogram measuring electrode 10) corresponds to, for example, the positions of T3, C3, Cz, C4, and T4 in the international 10-20 electrode placement method.

The inner peripheral surface of the electrode unit mounting portion 21 is set to have substantially the same outer diameter as the outer peripheral surface of the electroencephalogram measuring electrode 10, and the electroencephalogram measuring electrode 10 is fitted and fixed to the electrode unit mounting portion 21. Will be done. The inner peripheral surface of the electrode unit mounting portion 21 and the outer peripheral surface of the electroencephalogram measuring electrode 10 may be screwed so that the electroencephalogram measuring electrode 10 is screwed to the electrode unit mounting portion 21.

<Structure of electrode 10 for EEG measurement>
FIG. 3 shows a perspective view of the electroencephalogram measuring electrode 10. FIG. 4 shows a cross-sectional view schematically showing the electroencephalogram measurement electrode 10. FIG. 5 shows a cross-sectional view showing the electroencephalogram measurement electrode 10 of FIG. 4 in an exploded manner. In FIG. 5, the mold resin 70 is omitted.

The electroencephalogram measuring electrode 10 has an electrode portion 30, a snap button 40, a cap 50, and a conductive cushion member 60. The cap 50 has a bottomed cylindrical shape and functions as a holder. An electrode portion 30, a snap button 40, and a conductive cushion member 60 are housed therein, and these are molded and fixed by a mold resin 70.

<Electrode section 30>
The electrode portion 30 has a base portion 31, a protrusion portion 32, a conductive contact portion 33, and a signal line portion 34. The base portion 31 and the protrusion portion 32 are integrally provided by a rubber-like elastic member. The specific material of the elastic member will be described later. The base 31 and the protrusion 32 are not limited to the one provided integrally, but may be provided separately and assembled by an adhesive or a fitting structure.

The base 31 has a substantially cylindrical shape. On the lower surface surface 36 of the circular base portion on one end side (lower side in the drawing) of the base portion 31, a plurality of substantially conical protrusions 32 protruding in the lower direction in the drawing are provided at predetermined intervals in the circumferential direction of the circle. The shape of the protrusion 32 is not limited to a conical shape, and various shapes such as a pyramid such as a triangular pyramid or a cylindrical shape can be adopted.

A conductive contact portion 33 is provided on at least the front end side surface of the protrusion 32. The conductive contact portion 33 may be provided on the entire surface of the protrusion 32.

The outer diameter of the base 31 is, for example, 10 mm to 50 mm. The height (thickness) of the base 31 is, for example, 2 mm to 30 mm. The height of the protrusion 32 is, for example, 3 mm to 15 mm. The width of the protrusion 32 (outer diameter of the root portion) is, for example, 1 mm to 10 mm.

<Structure of signal line unit 34>
As shown in FIGS. 4 and 5, the electrode portion 30 is provided with a signal line portion 34 as a signal path connected to the conductive contact portion 33. The signal line portion 34 may adopt various wiring structures as long as it is conductive via the base portion 31 and the protrusion portion 32. Here, the signal line portion 34 is provided so as to pass through the inside of the protrusion 32 and the base 31 from the conductive contact portion 33 at the tip of the protrusion 32 and to be exposed on the upper surface 35 of the base of the base 31.

For example, the tip of the signal line portion 34 has a structure that protrudes from the tip portion of the protrusion 32 or its vicinity, that is, a region where the conductive contact portion 33 is formed, a structure that is substantially on the same surface, and a buried structure. Any of them may be used. From the viewpoint of connection stability with the conductive contact portion 33, a protruding structure may be used. The protruding portion at the tip of the signal line portion 34 is partially or wholly covered with the conductive contact portion 33. As the protruding structure at the tip of the signal line portion 34, a structure without folding back, with folding back, and winding around the surface of the tip end portion of the protruding portion 32 can be adopted.
As another wiring structure of the signal line portion 34, it may be a structure provided on the surface of the protrusion 32 and the base portion 31, or may be a wiring structure in which a part is provided inside and a part is provided on the surface. That is, the signal detected by the conductive contact portion 33 may be transmitted to the conductive cushion member 60.

<Material of electrode portion 30>
The material of the electrode portion 30 (base portion 31 and protrusion portion 32) will be described. The electrode portion 30 is a rubber-like elastic body as described above. The rubber-like elastic body is specifically a rubber or a thermoplastic elastomer (also simply referred to as "elastomer (TPE)"). Examples of the rubber include silicone rubber. Examples of the thermoplastic elastomer include styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), urethane-based TPE (TPU), ester-based TPE (TPEE), and amide-based TPE (TPAE). There is.

When the electrode portion 30 is made of silicone rubber, the type A durometer hardness on the surface of the electrode portion 30 (base 31 or protrusion 32) measured according to JIS K 6253 (1997) at 37 ° C. is the rubber hardness A. The rubber hardness A is, for example, 15 or more and 55 or less.

Here, the silicone rubber-based curable composition will be described.
The silicone rubber can be composed of a cured product of a silicone rubber-based curable composition. The curing step of the silicone rubber-based curable resin composition is, for example, heating at 100 to 250 ° C. for 1 to 30 minutes (primary curing) and then post-baking at 100 to 200 ° C. for 1 to 4 hours (secondary curing). It is done by.

The insulating silicone rubber is a silicone rubber that does not contain a conductive filler, and the conductive silicone rubber is a silicone rubber that contains a conductive filler.

The silicone rubber-based curable composition according to the present embodiment can contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer which is a main component of the silicone rubber-based curable composition of the present embodiment.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same kind of vinyl group-containing linear organopolysiloxane. The vinyl group-containing linear organopolysiloxane of the same type may contain at least the same vinyl group as the functional group and may have a linearity, and the vinyl group amount, the molecular weight distribution, or the addition amount thereof in the molecule may be. It may be different.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different vinyl group-containing organopolysiloxanes.

The vinyl group-containing organopolysiloxane (A) can include a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains a vinyl group, and the vinyl group serves as a cross-linking point at the time of curing.

The content of the vinyl group of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably, for example, having two or more vinyl groups in the molecule and 15 mol% or less. , 0.01-12 mol%, more preferably. As a result, the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1) is optimized, and a network with each component described later can be reliably formed. In the present embodiment, "to" means to include the numerical values at both ends thereof.

In the present specification, the vinyl group content is the mol% of the vinyl group-containing siloxane unit when all the units constituting the vinyl group-containing linear organopolysiloxane (A1) are 100 mol%. .. However, it is considered that there is one vinyl group for each vinyl group-containing siloxane unit.

The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of, for example, preferably about 1000 to 10000, and more preferably about 2000 to 5000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number average degree of polymerization (or number average molecular weight) in GPC (gel permeation chromatography) using chloroform as a developing solvent.

Further, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above range, the silicone rubber obtained has heat resistance, flame retardancy, chemical stability, etc. Can be improved.

The vinyl group-containing linear organopolysiloxane (A1) preferably has a structure represented by the following formula (1).

In formula (1), R ¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group and the like, and among them, a vinyl group is preferable. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group and the like.

Further, R ² is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

Further, R ³ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group.

Further, examples of the substituent of R ¹ and R ² in the formula (1) include a methyl group, a vinyl group and the like, and examples of the substituent of R ³ include a methyl group and the like.

In the equation (1), the plurality of R ^1s are independent of each other and may be different from each other or may be the same. The same applies to R ² and R ³ .

Further, m and n are the number of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by the formula (1), m is an integer of 0 to 2000, and n is 1000 to 10000. Is an integer of. m is preferably 0 to 1000, and n is preferably 2000 to 5000.

Moreover, as a specific structure of the vinyl group-containing linear organopolysiloxane (A1) represented by the formula (1), for example, the one represented by the following formula (1-1) can be mentioned.

In formula (1-1), R ¹ and R ² are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

Further, the vinyl group-containing linear organopolysiloxane (A1) contains a first vinyl group having a vinyl group content of 2 or more in the molecule and 0.4 mol% or less. It contains a linear organopolysiloxane (A1-1) and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%. It is preferable to have it. As raw rubber which is a raw material of silicone rubber, a first vinyl group-containing linear organopolysiloxane (A1-1) having a general vinyl group content and a second vinyl group-containing direct having a high vinyl group content. By combining with a chain organopolysiloxane (A1-2), the vinyl group can be unevenly distributed, and the cross-linking density can be more effectively formed in the cross-linking network of the silicone rubber. As a result, the tear strength of the silicone rubber can be increased more effectively.

Specifically, as the vinyl group-containing linear organopolysiloxane (A1), for example, in the above formula (1-1), a unit in which R ¹ is a vinyl group and / or a unit in which R ² is a vinyl group is used. , A first vinyl group-containing linear organopolysiloxane (A1-1) having two or more in the molecule and containing 0.4 mol% or less, and a unit in which R ¹ is a vinyl group and / or R. It is preferable to use a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol% of the unit in which ² is a vinyl group.

Further, the first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol%. Further, the vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol%.

Further, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are blended in combination (A1-1). The ratio of and (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1) :( A1-2) is preferably 50:50 to 95: 5, and 80:20 to 90: It is more preferably 10.

The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may be used alone or in combination of two or more. good.

Further, the vinyl group-containing organopolysiloxane (A) may contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

<< Organohydrogen Polysiloxane (B) >>
The silicone rubber-based curable composition of the present embodiment may contain a cross-linking agent. The cross-linking agent can include organohydrogenpolysiloxane (B).
The organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure. Either one or both can be included.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of cross-linking agent. The cross-linking agent of the same type may have at least a common structure such as a linear structure or a branched structure, may contain a molecular weight distribution in the molecule or a different functional group, and the addition amount thereof is different. You may.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different cross-linking agents.

The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure (≡Si—H) in which hydrogen is directly bonded to Si, and is a vinyl group-containing organopolysiloxane (A). In addition to the vinyl group, it is a polymer that undergoes a hydrosilylation reaction with the vinyl group contained in the components contained in the silicone rubber-based curable composition to crosslink these components.

The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20000 or less, and more preferably 1000 or more and 10000 or less.

The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by polystyrene conversion in GPC (gel permeation chromatography) using chloroform as a developing solvent.

Further, the linear organohydrogenpolysiloxane (B1) is usually preferably one having no vinyl group. This makes it possible to accurately prevent the cross-linking reaction from proceeding in the molecule of the linear organohydrogenpolysiloxane (B1).

As the linear organohydrogenpolysiloxane (B1) as described above, for example, one having a structure represented by the following formula (2) is preferably used.

In formula (2), ^R4 is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, a hydrocarbon group combining these, or a hydride group. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group and the like. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

Further, R5 is a substituted or unsubstituted alkyl group having 1 to ¹⁰ carbon atoms, an alkenyl group, an aryl group, a hydrocarbon group combining these, or a hydride group. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group and a propyl group, and among them, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group and the like. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

In the equation (2), the plurality of R ^4s are independent of each other and may be different from each other or may be the same. The ^same applies to R5. However, of the plurality of R ⁴ and R ⁵ , at least two or more are hydride groups.

Further, R ⁶ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group in which these are combined. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. The plurality of ^R6s are independent of each other and may be different from each other or may be the same.

Examples of the substituent of R ⁴ , R ⁵ , and R ⁶ in the formula (2) include a methyl group and a vinyl group, and a methyl group is preferable from the viewpoint of preventing an intramolecular cross-linking reaction.

Further, m and n are the number of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by the formula (2), where m is an integer of 2 to 150 and n is an integer of 2 to 150. Is. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more.

Since the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms a region having a high crosslink density and is a component that greatly contributes to the formation of a dense structure having a crosslink density in the silicone rubber system. Further, like the linear organohydrogenpolysiloxane (B1), it has a structure (≡Si—H) in which hydrogen is directly bonded to Si, and in addition to the vinyl group of the vinyl group-containing organopolysiloxane (A), silicone. It is a polymer that hydrosilylates with the vinyl group of the component contained in the rubber-based curable composition and crosslinks these components.

The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

Further, the branched organohydrogenpolysiloxane (B2) is usually preferably one having no vinyl group. This makes it possible to accurately prevent the cross-linking reaction from proceeding in the molecule of the branched organohydrogenpolysiloxane (B2).

The branched organohydrogenpolysiloxane (B2) is preferably represented by the following average composition formula (c).

Average composition formula (c)
(H _a (R ⁷ ) _3-a SiO _1/2 ) _m (SiO _4/2 ) _n
(In the formula (c), R ⁷ is a monovalent organic group, a is an integer in the range of 1 to 3, m is _a number of Ha (R ⁷ ) _3-a SiO _1/2 units, and n is SiO _{4 /.} It is a number of ₂ units)

In formula (c), R ⁷ is a monovalent organic group, preferably a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an aryl group, or a hydrocarbon group in combination thereof. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

In the formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer in the range of 1 to 3, preferably 1.

Further, in the formula ( _c ), m is the number of Ha (R ⁷ ) _3-a SiO _1/2 unit, and n is the number of SiO _4/2 unit.

The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in that their structure is linear or branched, and the Si is the same as when the number of Si is 1. The number of alkyl groups R to be bonded (R / Si) is 1.8 to 2.1 for the linear organohydrogenpolysiloxane (B1) and 0.8 to 1 for the branched organohydrogenpolysiloxane (B2). It is in the range of 0.7.

Since the branched organohydrogenpolysiloxane (B2) has a branched structure, for example, the residual amount when heated to 1000 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere is 5% or more. Will be. On the other hand, since the linear organohydrogenpolysiloxane (B1) is linear, the amount of residue after heating under the above conditions is almost zero.

Further, specific examples of the branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3).

In formula (3), R ⁷ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group in combination thereof, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, a propyl group and the like, and among them, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. Examples of the substituent of R ⁷ include a methyl group and the like.

In the equation (3), the plurality of R ^7s are independent of each other and may be different from each other or may be the same.

Further, in the equation (3), "-O-Si≡" indicates that Si has a branched structure that spreads three-dimensionally.

The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more.

Further, in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2), the amount of hydrogen atoms (hydride groups) directly bonded to Si is not particularly limited. However, in the silicone rubber-based curable composition, the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpoly are added to 1 mol of the vinyl group in the vinyl group-containing linear organopolysiloxane (A1). The total amount of hydride groups of siloxane (B2) is preferably 0.5 to 5 mol, more preferably 1 to 3.5 mol. This ensures that a crosslinked network is formed between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1). Can be made to.

<< Silica particles (C) >>
The silicone rubber-based curable composition according to the present embodiment contains a non-conductive filler. The non-conductive filler may contain silica particles (C), if necessary. This makes it possible to improve the hardness and mechanical strength of the elastomer.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same kind of non-conductive filler. The non-conductive filler of the same type may have at least a common constituent material, and may differ in particle size, specific surface area, surface treatment agent, or addition amount thereof.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

The silica particles (C) are not particularly limited, but for example, fumed silica, calcined silica, precipitated silica and the like are used. These may be used alone or in combination of two or more.

For example, the specific surface area of the silica particles (C) by the BET method is preferably, for example, 50 to 400 m ² / g, and more preferably 100 to 400 m ² / g. The average primary particle size of the silica particles (C) is preferably, for example, 1 to 100 nm, and more preferably about 5 to 20 nm.

By using the silica particles (C) within the range of the specific surface area and the average particle size, it is possible to improve the hardness and mechanical strength of the formed silicone rubber, particularly the tensile strength.

<< Silane Coupling Agent (D) >>
The silicone rubber-based curable composition of the present embodiment can contain a silane coupling agent (D).
The silane coupling agent (D) can have a hydrolyzable group. The hydrolyzing group is hydrolyzed by water to become a hydroxyl group, and this hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl group on the surface of the silica particles (C), whereby the surface of the silica particles (C) can be modified.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent. The silane coupling agent of the same type may have at least a common functional group, and other functional groups in the molecule and the amount added may be different.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

Further, the silane coupling agent (D) can include a silane coupling agent having a hydrophobic group. As a result, this hydrophobic group is imparted to the surface of the silica particles (C), so that the cohesive force of the silica particles (C) is reduced in the silicone rubber-based curable composition and thus in the silicone rubber (hydrogen due to the silanol group). Aggregation due to bonding is reduced), and as a result, it is presumed that the dispersibility of the silica particles (C) in the silicone rubber-based curable composition is improved. As a result, the interface between the silica particles (C) and the rubber matrix increases, and the reinforcing effect of the silica particles (C) increases. Further, it is presumed that the slipperiness of the silica particles (C) in the matrix is improved when the rubber matrix is deformed. Then, by improving the dispersibility and slipperiness of the silica particles (C), the mechanical strength (for example, tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C) is improved.

Further, the silane coupling agent (D) can include a silane coupling agent having a vinyl group. As a result, a vinyl group is introduced on the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, the vinyl group of the vinyl group-containing organopolysiloxane (A) and the hydride group of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction. When the network (crosslinked structure) formed by these is formed, the vinyl group of the silica particles (C) is also involved in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B). Silica particles (C) will also be incorporated into. As a result, it is possible to reduce the hardness and increase the modulus of the formed silicone rubber.

As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

Examples of the silane coupling agent (D) include those represented by the following formula (4).

Y _n -Si- (X) _4-n ... (4)
In the above equation (4), n represents an integer of 1 to 3. Y represents any functional group having a hydrophobic group, a hydrophilic group or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of them is. It is a hydrophobic group. X represents a hydrolyzable group.

The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group in which these are combined, and examples thereof include a methyl group, an ethyl group, a propyl group, a phenyl group, and the like. Methyl groups are preferred.

Examples of the hydrophilic group include a hydroxyl group, a sulfonic acid group, a carboxyl group, a carbonyl group and the like, and a hydroxyl group is particularly preferable. The hydrophilic group may be contained as a functional group, but is preferably not contained from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

Further, examples of the hydrolyzable group include an alkoxy group such as a methoxy group and an ethoxy group, a chloro group or a silazane group, and among them, a silazane group is preferable because it has high reactivity with the silica particles (C). A group having a silazane group as a hydrolyzable group has two structures of ( _Yn —Si—) in the above formula (4) due to its structural characteristics.

Specific examples of the silane coupling agent (D) represented by the above formula (4) are as follows.
Examples of the functional group having a hydrophobic group include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, and n-propyltrimethoxysilane. Ekalkylsilanes such as n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane; hexamethyldisilazane. Can be mentioned. Among these, a silane coupling agent having a trimethylsilyl group containing at least one selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane is preferable.

As the functional group having a vinyl group, for example, methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxy. Alkoxysilanes such as silanes, vinylmethyldimethoxysilanes; chlorosilanes such as vinyltrichlorosilanes, vinylmethyldichlorosilanes; and divinyltetramethyldisilazane. Among these, methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinyl. A silane coupling agent having a vinyl group-containing organosilyl group containing at least one selected from the group consisting of methyldimethoxysilane is preferable.

When the silane coupling agent (D) contains two types of a silane coupling agent having a trimethylsilyl group and a silane coupling agent having a vinyl group-containing organosilyl group, the one having a hydrophobic group is hexamethyldisilazane. Those having a vinyl group preferably contain divinyltetramethyldisilazane.

When a silane coupling agent having a trimethylsilyl group (D1) and a silane coupling agent having a vinyl group-containing organosilyl group (D2) are used in combination, the ratio of (D1) to (D2) is not particularly limited, but for example. By weight ratio, (D1): (D2) is 1: 0.001 to 1: 0.35, preferably 1: 0.01 to 1: 0.20, more preferably 1: 0.03 to 1: 0. It is .15. By setting such a numerical range, the desired physical properties of the silicone rubber can be obtained. Specifically, it is possible to balance the dispersibility of silica in the rubber and the crosslinkability of the rubber.

In the present embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more with respect to 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). It is more preferably 5% by mass or more, and further preferably 5% by mass or more. The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, preferably 80% by mass or less, based on 100 parts by mass of the total amount of the vinyl group-containing organopolysiloxane (A). It is more preferably present, and further preferably 40% by mass or less.
By setting the content of the silane coupling agent (D) to the above lower limit value or more, the adhesion between the columnar portion containing the elastomer and the conductive resin layer can be enhanced. Further, it can contribute to the improvement of the mechanical strength of the silicone rubber. Further, by setting the content of the silane coupling agent (D) to the above upper limit value or less, the silicone rubber can have appropriate mechanical properties.

<< Platinum or platinum compound (E) >>
The silicone rubber-based curable composition according to the present embodiment may contain a catalyst. The catalyst can include platinum or platinum compound (E). Platinum or the platinum compound (E) is a catalytic component that acts as a catalyst during curing. The amount of platinum or the platinum compound (E) added is the amount of the catalyst.

The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst. The catalysts of the same type may have at least a common constituent material, and the catalysts may contain different compositions or may have different addition amounts.
The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts from each other.

As the platinum or the platinum compound (E), known ones can be used, for example, platinum black, platinum supported on silica, carbon black or the like, platinum chloride acid or an alcohol solution of platinum chloride acid, chloride. Examples thereof include a complex salt of platinum acid and olefin, and a complex salt of platinum chloride acid and vinyl siloxane.

As the platinum or the platinum compound (E), only one type may be used alone, or two or more types may be used in combination.

In the present embodiment, the content of platinum or the platinum compound (E) in the silicone rubber-based curable composition means a catalyst amount and can be appropriately set, but specifically, a vinyl group-containing organopolysiloxane. The amount of the platinum group metal is 0.01 to 1000 ppm by weight with respect to 100 parts by weight of the total amount of (A), the silica particles (C) and the silane coupling agent (D), and is preferably 0. The amount is 1 to 500 ppm.
By setting the content of platinum or the platinum compound (E) to the above lower limit value or more, the silicone rubber-based curable composition can be cured at an appropriate rate. Further, by setting the content of platinum or the platinum compound (E) to the above upper limit value or less, it is possible to contribute to the reduction of manufacturing cost.

<< Water (F) >>
Further, the silicone rubber-based curable composition according to the present embodiment may contain water (F) in addition to the above components (A) to (E).

Water (F) functions as a dispersion medium for dispersing each component contained in the silicone rubber-based curable composition, and is a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). .. Therefore, in the silicone rubber, the silica particles (C) and the silane coupling agent (D) can be more reliably connected to each other, and uniform characteristics can be exhibited as a whole.

(Other ingredients)
Further, the silicone rubber-based curable composition of the present embodiment may further contain other components in addition to the above components (A) to (F). Other components include silica particles (C) such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica. Examples thereof include additives such as inorganic fillers, reaction inhibitors, dispersants, pigments, dyes, antioxidants, antioxidants, flame retardants, and thermal conductivity improvers.

The conductive solution (conductive silicone rubber composition) according to the present embodiment contains the conductive filler and the solvent in addition to the silicone rubber-based curable composition which does not contain the conductive filler.

As the solvent, various known solvents can be used, and for example, a high boiling point solvent can be included. These may be used alone or in combination of two or more.

Examples of the above solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane and tetradecane; benzene, toluene, ethylbenzene, xylene and trifluoromethylbenzene. , Benzotrifluoride and other aromatic hydrocarbons; diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3 -Ethers such as dioxane and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2-trichloroethane; N, N-dimethyl Carboxyric acid amides such as formamide and N, N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide can be exemplified. These may be used alone or in combination of two or more.

By adjusting the amount of solid content in the solution, the conductive solution can have an appropriate viscosity for various coating methods such as spray coating and dip coating.

When the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the content of the silica particles (C) contained in the electrode portion 30 is the silica particles (C) and the conductive filler. For example, it may be 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more with respect to the total amount of 100% by mass. Thereby, the mechanical strength of the electrode portion 30 can be improved. On the other hand, the upper limit of the content of the silica particles (C) contained in the electrode portion 30 is, for example, 20% by mass or less with respect to 100% by mass of the total amount of the silica particles (C) and the conductive filler. It is preferably 15% by mass or less, and more preferably 10% by mass or less. As a result, it is possible to balance the conductivity of the electrode portion 30 with the mechanical strength and flexibility.

A conductive silicone rubber can be obtained by heating and drying the conductive solution as required.
The conductive silicone rubber may have a structure that does not contain silicone oil. As a result, it is possible to prevent the silicone oil from bleeding out to the surface of the electrode portion 30 and to prevent the continuity from being lowered.

<Material of signal line unit 34>
As the signal line portion 34, known ones can be used, but for example, the signal line portion 34 may be made of a conductive fiber. As the conductive fiber, one or more selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber can be used. These may be used alone or in combination of two or more.

The metal materials of the above metal fibers and metal-coated fibers are not limited as long as they have conductivity, but copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, and silver / chloride. Examples include silver and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. Further, it is preferable that the metal material does not contain a metal such as chromium that gives an environmental load.

The fiber material of the metal-coated fiber, the conductive polymer-coated fiber, and the conductive paste-coated fiber is not particularly limited, and may be any of synthetic fiber, semi-synthetic fiber, and natural fiber. Among these, it is preferable to use polyester, nylon, polyurethane, silk, cotton and the like. These may be used alone or in combination of two or more.

Examples of the carbon fiber include PAN-based carbon fiber and pitch-based carbon fiber.

The conductive polymer material of the conductive polymer fiber and the conductive polymer-coated fiber is, for example, a mixture of a conductive polymer and a binder resin such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylene vinylene, polynaphthalene, and derivatives thereof. Alternatively, an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene) -poly (styrene sulfonic acid)) is used.

The resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but is preferably elastic, for example, silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene. It can contain one or more selected from the group consisting of propylene rubber. These may be used alone or in combination of two or more.

The conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but a known conductive material may be used, but metal particles, metal fiber, metal-coated fiber, carbon black, acetylene black, graphite, carbon. It can include one or more selected from the group consisting of fibers, carbon nanotubes, conductive polymers, conductive polymer coated fibers and metal nanowires.

The metal constituting the conductive filler is not particularly limited, but is, for example, copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or at least one of these alloys. , Or two or more of these can be included. Among these, silver or copper is preferable because of its high conductivity and high availability.

The signal line portion 34 may be composed of a twisted yarn obtained by twisting a plurality of linear conductive fibers. As a result, it is possible to suppress disconnection of the signal line portion 34 at the time of deformation.

In the present embodiment, the coating on the conductive fiber does not only cover the outer surface of the fiber material, but in the case of a twisted yarn obtained by twisting a single fiber, a metal or a conductive polymer is formed in the fiber gap in the twisted yarn. , Or, which is impregnated with a conductive paste and covers the single fibers constituting the plyed yarn one by one.

The tensile elongation at break of the signal line portion 34 is, for example, 1% or more and 50% or less, preferably 1.5% or more and 45%. By setting it within such a numerical range, it is possible to suppress excessive deformation of the protrusion 32 while suppressing breakage at the time of deformation.

<Material of conductive contact portion 33>
The conductive member of the conductive contact portion 33 is, for example, a paste containing a good conductive metal (so-called conductive paste). Good-leading metals include one or more selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, or alloys thereof. In particular, silver, silver chloride, and copper are suitable from the viewpoint of availability and conductivity.

When the conductive contact portion 33 is formed of a paste containing a good conductive metal, the top of the protrusion 32 made of a rubber-like elastic body is dipped (immersed) in a paste-like conductive solution containing the good conductive metal. Apply). As a result, the conductive contact portion 33 is formed on the surface of the protrusion 32.

The conductive contact portion 33 as the conductive resin layer may be formed by applying the conductive solution containing the conductive filler and the solvent to the protrusion 32. At this time, by using a material (silicone rubber) of the same system as the protrusion 32, the adhesiveness of the conductive contact portion 33 (conductive resin layer) can be enhanced.

A conductive silicone rubber can be obtained by heating and drying the conductive solution as required.
The conductive silicone rubber may have a structure that does not contain silicone oil. As a result, it is possible to prevent the silicone oil from bleeding out to the surface of the conductive contact portion 33, thereby suppressing the decrease in conductivity.

As a result, it is possible to improve the hair scraping performance when the electroencephalogram measuring device 1 is attached to the head 99. In addition, it is possible to secure a sufficient contact area of the conductive contact portion 33 when the electroencephalogram measuring device 1 is attached.

<Manufacturing method of electrode portion 30>
An example of the method for manufacturing the electrode portion 30 of the present embodiment can include the following steps.
First, the silicone rubber-based curable composition is heat-press molded using a mold to obtain a molded product composed of a base 31 and a protrusion 32. Subsequently, the signal line portion 34 is passed through the inside of each protrusion 32 of the obtained molded product using a sewing needle. After that, a paste-like conductive solution is dip-applied to the tip of the protrusion 32 of the obtained molded product, heated and dried, and then post-cured. As a result, the conductive contact portion 33 can be formed on the protrusion 32. From the above, the electrode portion 30 can be manufactured. At the time of the molding step, insert molding may be used in which the silicone rubber-based curable composition is introduced into the molding space in which the signal line portion 34 is arranged and pressure-heat molded.

<Cap 50>
The cap 50 is made of, for example, a hard resin material and has a bottomed cylindrical shape. The cap 50 functions as a holder for accommodating and holding the electrode portion 30, the snap button 40, and the conductive cushion member 60 inside. In the present embodiment, the electrode portion 30, the snap button 40, and the conductive cushion member 60 are fixed to the inside of the cap 50 by the mold resin 70.

The bottom surface of the bottomed tubular shape presented by the cap 50 is the cap top plate 51. A tubular cap body 52 is integrally provided on the peripheral edge of the cap top plate 51. The cap inner peripheral surface 55 of the cap body 52 is formed larger than the base 31 of the electrode portion 30, and the outer surface of the base 31 is separated from the cap inner peripheral surface 55 in a state where the electrode portion 30 is accommodated. Is set to.

A central opening 53 penetrating in the thickness direction is provided at the center of the circle of the circular cap top plate 51. The size of the central opening 53 is such that at least the button portion 42 of the snap button 40 can protrude from the inside to the outside when the snap button 40 is housed in the cap 50.

<Snap button 40>
The snap button 40 is made of a conductive member and functions as an interface for connecting the signal of the electrode unit 30 to an external measurement unit. As the conductive member, there are conductive metals such as stainless steel, copper alloy, and aluminum alloy.

The snap button 40 has a disk portion 41 having a predetermined thickness and having a circular shape when viewed from above, and a columnar button portion 42 extending upward from the center of the disk upper surface 43 of the disk portion 41.

The disc lower surface 44 of the disc portion 41 is connected to the conductive cushion member 60. The disk upper surface 43 of the disk portion 41 abuts on the top plate lower surface 54 of the cap top plate 51 of the cap 50, more specifically, the region near the central opening 53.

<Conductive cushion member 60>
The conductive cushion member 60 is provided between the electrode portion 30 and the snap button 40, and by having conductivity and elastically deforming, the conductive cushion member 60 is configured as a part of a signal path and functions as a cushioning material.

The conductive cushion member 60 is, for example, a conductive fiber cushion. As the conductive fiber cushion, those plated with various metal fibers or resin fibers can be used, but fibers obtained by silver-plating nylon fibers or stainless fibers can be preferably used. As an example, silver-plated fiber cotton (manufactured by Osaka Denki Kogyo Co., Ltd.), SUS fiber web (manufactured by Nippon Seisen Co., Ltd.), and silver-plated fiber staple (manufactured by Osaka Denki Kogyo Co., Ltd.) can be used. The diameter of the conductive fibers constituting the conductive fiber cushion is, for example, 10 to 150 μm. As the conductive cushion member 60, for example, a conductive urethane foam or a conductive sponge can be used in addition to the conductive fiber cushion, but at least a conductive function and a repulsive force (force) act during compression. Any member may be used as long as it has a function to perform the function.

<Accommodation structure of the electrode portion 30 and the like by the cap 50>
The structure in which the electrode portion 30 and the like are housed in the cap 50 will be described with reference to FIGS. 3 to 5 together with a method for manufacturing the electrode 10 for electroencephalogram measurement.

First, the snap button 40 is accommodated in the snap button 40 with the button portion 42 as the upper side in the drawing through the opening on the lower side of the cap body portion 52 of the cap 50. At this time, the peripheral edge portion of the disk upper surface 43 abuts on the opening edge portion of the central opening 53 of the top plate lower surface 54. Further, the button portion 42 penetrates the central opening 53 of the cap 50 and protrudes to the outside.

Next, the conductive cushion member 60 is housed so as to be in contact with the lower surface 44 of the disk of the snap button 40.

Subsequently, the electrode portion 30 is arranged so that the upper surface 35 of the base portion thereof presses against the conductive cushion member 60. At this time, the conductive cushion member 60 is compressed to a certain extent, and an urging force acts on it. As a result, the conductive cushion member 60 and the signal line portion 34 exposed on the upper surface 35 of the base portion are conductive and the state is maintained.

After that, with the electrode portion 30 arranged at an appropriate position, a mold resin 70 such as epoxy resin is injected into the cap 50 and cured, and the electrode portion 30, the snap button 40 and the conductive cushion member 60 are capped 50. Fix inside. As a result, the electroencephalogram measurement electrode 10 shown in FIGS. 3 and 4 is obtained.

<Summary of features and functions of electrode 10 for EEG measurement>
The features and functions of the electroencephalogram measurement electrode 10 of the present embodiment will be collectively described below.
(1) The electroencephalogram measurement electrode 10 is
A columnar base 31 formed of an elastic member, a plurality of protrusions 32 provided at one end of the base 31 (here, the lower surface 36 of the base), and a conductive contact portion provided on at least the front end side surface of the protrusion 32. An electrode portion 30 having a 33 and a signal line portion 34 provided from the conductive contact portion 33 to the other end of the base portion 31 (here, the upper surface portion 35 of the base portion) via the protrusion portion 32 and the base portion 31.
A conductive cushion member 60 provided at the other end of the base 31 (upper surface 35 of the base), electrically connected to the signal line portion 34, and having conductivity and elastically deforming.
A snap button 40 provided on the conductive cushion member 60 on the side opposite to the base 31 and having a button portion 42 extending in the direction opposite to the base 31.
Have.
With such a configuration, even when an impact is applied to the electroencephalogram measurement electrode 10, the impact can be absorbed by the elastic force of the conductive cushion member 60. As a result, it is possible to suppress the occurrence of defects in the components of the electroencephalogram measurement electrode 10. For example, it is possible to prevent the conductive contact portion 33 of the protrusion 32 of the electrode portion 30 from peeling off.
(2) The electroencephalogram measurement electrode 10 has a cap 50 for holding the base 31 of the electrode portion 30, and the cap 50 has a surface (cap) with which the snap button 40 abuts when holding the base 31 of the electrode portion 30. It has a top plate 51) and a central opening 53 in the cap top plate 51.
When the base portion 31 of the electrode portion 30 is held by the cap 50, the button portion 42 protrudes from the central opening portion 53.
With such a configuration, the cap 50 protects the electrode portion 30, the snap button 40, and the conductive cushion member 60 housed inside the cap 50, and the conductive cushion member 60 can effectively absorb the impact from the outside.
(3) The cap 50 has a bottomed tubular shape, and a central opening 53 is provided on the bottom surface of the bottomed tubular shape (that is, the cap top plate 51).
(4) The conductive cushion member 60 is made of conductive fibers.
(5) The conductive contact portion 33 is made of a paste containing a good conductive metal.
(6) The signal line portion 34 is composed of a projection portion 32 and a conductive fiber provided inside the base portion 31.
(7) The electroencephalogram measuring device 1 includes the above-mentioned electroencephalogram measuring electrode 10 and
A frame 20 that holds a plurality of electrodes 10 for measuring brain waves,
A measurement unit that is connected to the button unit 42 of the snap button 40 and measures the measured EEG signal,
Have.
With such a configuration, it is possible to realize an electroencephalogram measuring device 1 that is strong against an impact from the outside.

<Second embodiment>
The electroencephalogram measurement electrode 10A of the present embodiment will be described with reference to FIG. Hereinafter, the points different from those of the first embodiment will be described, and the description of the same configuration / function will be omitted as appropriate.

In the electroencephalogram measurement electrode 10A of the present embodiment, the molding resin 70 is not provided for fixing the electrode portion 30, and the locking claw 56 directed toward the inside (cylindrical inner side) at the lower end of the cap body 52. Are provided in multiple places. Further, the inner peripheral surface 55 of the cap comes into contact with the outer peripheral surface 37 of the base portion 31 of the electrode portion 30. The depth of the cap body portion 52, that is, the height in the vertical direction is set so as to be at the same position as the lower surface surface 36 of the base portion in the state where the electrode portion 30 is accommodated. Further, the locking claw 56 presses the outer edge portion of the lower surface 36 of the base. At this time, the conductive cushion member 60 is elastically deformed in the thickness direction thereof and is urged by the upper snap button 40 and the lower electrode portion 30 to maintain good conduction between them. With such a configuration, it is possible to realize an electroencephalogram measuring electrode 10A that is resistant to an external impact.

<Third embodiment>
The electroencephalogram measurement electrode 10B of the present embodiment will be described with reference to FIG. 7. Hereinafter, the differences from the first and second embodiments will be described, and the description of the same configuration / function will be omitted as appropriate.

In the electroencephalogram measurement electrode 10B of the present embodiment, the electrode portion 30 and the cap 50 are fixed by screw fitting without providing the mold resin 70 for fixing the electrode portion 30. That is, a screw 59 is formed on the inner peripheral surface 55A of the cap 50. Further, a screw 39 is also formed on the outer peripheral surface 37 of the base 31 of the electrode portion 30 corresponding to the screw 59 on the inner peripheral surface 55A of the cap.

When manufacturing the electroencephalogram measurement electrode 10, the snap button 40 and the conductive cushion member 60 are arranged inside the cap 50, and the electrode portion 30 is further screwed from the lower side of the cap body portion 52 of the cap 50. The electroencephalogram measurement electrode 10 shown in 6 is obtained. At this time, the mold resin 70 is elastically deformed in the thickness direction, and the conductive cushion member 60 is urged by the snap button 40 on the upper side and the electrode portion 30 on the lower side to maintain good continuity between them. ing. The amount of elastic deformation (that is, urging force) of the conductive cushion member 60 can be adjusted by the amount of screwing the electrode portion 30. With such a configuration, it is possible to realize an electroencephalogram measuring electrode 10B that is resistant to an external impact. Further, by adjusting the screwing amount of the electrode portion 30, the positional relationship between the protrusion 32 and the head 99, that is, the force when the protrusion 32 hits the head 99 can be adjusted.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like to the extent that the object of the present invention can be achieved are included in the present invention. For example, in the electroencephalogram measurement electrode 10 of the first embodiment, the electrode portion 30, the snap button 40, and the conductive cushion member 60 are housed in the cap 50, but the snap button 40 and the cap 50 are integrated. It may be configured as. That is, the snap button 40 has a bottomed cylindrical shape, and the bottomed portion is provided with a configuration having the same function and shape as the button portion 42. Further, the electrode portion 30, the snap button 40, and the conductive cushion member 60 may be resin-molded without providing the cap 50.

1 EEG measurement device 10, 10A, 10B Electrode for EEG measurement 20 Frame 21 Electrode unit mounting part 30 Electrode part 31 Base part 32 Protrusion part 33 Conductive contact part 34 Signal line part 39 Screwing 40 Snap button 41 Disc part 42 Button part 50 Cap 51 Cap top plate 52 Cap body 53 Central opening 56 Locking claw 59 Screw 60 Conductive cushion member 70 Mold resin

Claims (7)

A columnar base formed of an elastic member, a plurality of electrode protrusions provided at one end of the base, a conductive portion provided on at least the distal end side surface of the electrode protrusion, and the conductive portion to the above. An electrode portion having a projection portion for an electrode and a signal path provided to the other end of the base portion via the base portion.
A connecting member provided at the other end of the base, which is electrically connected to the signal path, has conductivity, and is elastically deformed.
A conductive connecting member provided on the side opposite to the base portion of the connecting member and having a connecting protrusion extending in a direction opposite to the base portion.
Have,
Electrodes for EEG measurement. It has a holder for holding the electrode portion and has a holder.
The holder has a surface that comes into contact with the conductive connecting member when holding the electrode portion, and has a through hole in the surface.
When the electrode portion is held by the holder, the connecting protrusion protrudes from the through hole.
The electrode for electroencephalogram measurement according to claim 1. The electrode for electroencephalogram measurement according to claim 2, wherein the holder has a bottomed tubular shape and the through hole is provided in the bottom surface of the bottomed tubular shape. The electrode for electroencephalogram measurement according to any one of claims 1 to 3, wherein the connecting member is made of a conductive fiber. The electrode for electroencephalogram measurement according to any one of claims 1 to 4, wherein the conductive portion is made of a paste containing a good conductive metal. The electrode for electroencephalogram measurement according to any one of claims 1 to 5, wherein the signal path is composed of a protrusion for the electrode and a conductive fiber provided inside the base. The electroencephalogram measurement electrode according to any one of claims 1 to 6 and
A frame holding the plurality of electrodes for measuring brain waves,
A measuring unit that is connected to the connecting projection of the conductive connecting member and measures the measured electroencephalogram signal, and a measuring unit.
EEG measuring device with.

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