JP2022105540A5 - - Google Patents

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JP2022105540A5
JP2022105540A5 JP2022074212A JP2022074212A JP2022105540A5 JP 2022105540 A5 JP2022105540 A5 JP 2022105540A5 JP 2022074212 A JP2022074212 A JP 2022074212A JP 2022074212 A JP2022074212 A JP 2022074212A JP 2022105540 A5 JP2022105540 A5 JP 2022105540A5
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Japan
Prior art keywords
sensor
sensor unit
unit according
conductive path
biasing member
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JP2022074212A
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Japanese (ja)
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JP2022105540A (en
JP7293453B2 (en
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Priority claimed from JP2020133648A external-priority patent/JP7068397B2/en
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Priority to JP2022074212A priority Critical patent/JP7293453B2/en
Priority claimed from JP2022074212A external-priority patent/JP7293453B2/en
Publication of JP2022105540A publication Critical patent/JP2022105540A/en
Publication of JP2022105540A5 publication Critical patent/JP2022105540A5/ja
Priority to JP2023093641A priority patent/JP2023116611A/en
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Publication of JP7293453B2 publication Critical patent/JP7293453B2/en
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Claims (13)

被検出体に取り付けられるセンサユニットであって、
前記被検出体上に配され、導電路が形成された可撓性を有する帯状の導電路構成体と、
前記導電路構成体の表面において前記導電路に接続されたセンサ素子と、
前記導電路構成体において前記センサ素子が設けられた部分の裏面に取り付けられるとともに、前記導電路構成体と前記被検出体とを熱的に接続する板材と、
前記板材における前記センサ素子の外周縁部を弾性復帰力によって前記被検出体に向けて付勢する付勢部材と
前記導電路構成体の表面に設けられた台座部と、を備え
前記台座部は、前記付勢部材により付勢される付勢面を有し、
前記センサ素子を収容するセンサ収容部は、前記センサ素子が搭載される前記導電路構成体と、前記台座部における前記付勢面よりも前記導電路構成体側の部分と、で構成され、
前記センサ収容部には、前記センサ素子を覆う樹脂製の保護部が設けられているセンサユニット。
A sensor unit attached to an object to be detected,
a flexible strip-shaped conductive path structure arranged on the detected object and having a conductive path formed thereon;
a sensor element connected to the conductive path on the surface of the conductive path structure;
a plate that is attached to the back surface of the portion of the conductive path structure where the sensor element is provided and that thermally connects the conductive path structure and the object to be detected;
an urging member that urges an outer peripheral edge portion of the sensor element on the plate toward the object to be detected by an elastic restoring force ;
a pedestal provided on the surface of the conductive path structure ,
The pedestal has a biasing surface biased by the biasing member,
The sensor housing portion for housing the sensor element is composed of the conductive path structure on which the sensor element is mounted, and a portion of the pedestal portion closer to the conductive path structure than the urging surface,
The sensor unit is provided with a protective part made of resin that covers the sensor element in the sensor accommodating part .
前記台座部における前記センサ収容部を構成する部分と前記導電路構成体とは、接着により固定されている、請求項1に記載のセンサユニット。2. The sensor unit according to claim 1, wherein a portion of said pedestal that forms said sensor accommodating portion and said conductive path structure are fixed by adhesion. 前記センサ収容部の内壁には、前記センサ素子とともに前記保護部に覆われる抜止突起が設けられている、請求項1または請求項2に記載のセンサユニット。3. The sensor unit according to claim 1, wherein an inner wall of said sensor accommodating portion is provided with a retaining projection covered with said protective portion together with said sensor element. 前記センサ素子は、前記被検出体の温度を検出する温度センサである請求項1から請求項3のいずれか1項に記載のセンサユニット。 The sensor unit according to any one of claims 1 to 3 , wherein the sensor element is a temperature sensor that detects the temperature of the object to be detected. 前記板材は、金属板材である請求項1から請求項4のいずれか1項に記載のセンサユニット。 The sensor unit according to any one of claims 1 to 4, wherein the plate material is a metal plate material. 前記台座部は、前記被検出体に設けられた保持部と係止可能な係止部を有しており、
前記付勢部材は、前記係止部と前記保持部との係止によって前記係止部と前記保持部とが互いに係止する方向に弾性変形する請求項1から請求項5のいずれか1項に記載のセンサユニット。
The pedestal has an engaging portion that can be engaged with a holding portion provided on the object to be detected,
6. The urging member according to any one of claims 1 to 5, wherein the biasing member is elastically deformed in a direction in which the locking portion and the holding portion are locked to each other by the locking of the locking portion and the holding portion. The sensor unit described in .
前記付勢部材は、螺旋状をなす金属製のコイルばねである請求項1から請求項6のいずれか1項に記載のセンサユニット。 The sensor unit according to any one of claims 1 to 6, wherein the biasing member is a spiral metal coil spring. 記台座部は、前記付勢部材の一部を軸方向に収容するばね収容部と、
前記ばね収容部に対して前記付勢部材の軸方向に組み付ける蓋部とを有しており、
前記ばね収容部と前記蓋部とは、前記付勢部材を軸方向に挟持する請求項7に記載のセンサユニット。
The pedestal portion includes a spring accommodating portion that axially accommodates a portion of the biasing member;
a lid portion assembled in the axial direction of the biasing member with respect to the spring accommodating portion,
8. The sensor unit according to claim 7, wherein the spring accommodating portion and the lid portion sandwich the biasing member in the axial direction.
記台座部は、合成樹脂製であって、
前記付勢部材は、前記台座部と一体に合成樹脂によって形成されている請求項1から請求項6のいずれか一項に記載のセンサユニット。
The pedestal is made of synthetic resin,
The sensor unit according to any one of claims 1 to 6, wherein the biasing member is formed integrally with the pedestal from a synthetic resin.
前記付勢部材は、合成樹脂製の樹脂ばね部である請求項1から請求項6のいずれか一項に記載のセンサユニット。The sensor unit according to any one of claims 1 to 6, wherein the biasing member is a resin spring portion made of synthetic resin. 記付勢部材は、一対の金属製の板ばねであって、前記台座部において前記センサ素子の両側に設けられた一対のばね保持部に保持されている請求項1から請求項6のいずれか一項に記載のセンサユニット。 7. The urging member according to any one of claims 1 to 6, wherein the biasing member is a pair of metal leaf springs held by a pair of spring holding portions provided on both sides of the sensor element on the base portion. or the sensor unit according to claim 1. 前記一対の板ばねは、前記台座部を付勢する部分が前記センサ素子を基準に点対称となるように配置されている請求項11に記載のセンサユニット。 12. The sensor unit according to claim 11 , wherein the pair of leaf springs are arranged such that portions that bias the base portion are symmetrical with respect to the sensor element. 前記被検出体と、
請求項1から請求項12のいずれか1項に記載のセンサユニットとを備え、
前記被検出体は、蓄電素子である蓄電モジュール。
the detectable body;
A sensor unit according to any one of claims 1 to 12 ,
The power storage module, wherein the object to be detected is a power storage element.
JP2022074212A 2020-08-06 2022-04-28 Sensor unit and power storage module Active JP7293453B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022074212A JP7293453B2 (en) 2020-08-06 2022-04-28 Sensor unit and power storage module
JP2023093641A JP2023116611A (en) 2020-08-06 2023-06-07 Sensor unit and energy storage module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020133648A JP7068397B2 (en) 2020-08-06 2020-08-06 Sensor unit and power storage module
JP2022074212A JP7293453B2 (en) 2020-08-06 2022-04-28 Sensor unit and power storage module

Related Parent Applications (1)

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JP2020133648A Division JP7068397B2 (en) 2020-08-06 2020-08-06 Sensor unit and power storage module

Related Child Applications (1)

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JP2023093641A Division JP2023116611A (en) 2020-08-06 2023-06-07 Sensor unit and energy storage module

Publications (3)

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JP2022105540A JP2022105540A (en) 2022-07-14
JP2022105540A5 true JP2022105540A5 (en) 2022-08-02
JP7293453B2 JP7293453B2 (en) 2023-06-19

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JP2023093641A Pending JP2023116611A (en) 2020-08-06 2023-06-07 Sensor unit and energy storage module

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7235153B2 (en) * 2017-12-29 2023-03-08 株式会社三洋物産 game machine
JP7235154B2 (en) * 2018-02-15 2023-03-08 株式会社三洋物産 game machine
JP7231076B2 (en) * 2018-03-08 2023-03-01 株式会社三洋物産 game machine
JP2020103418A (en) * 2018-12-26 2020-07-09 株式会社三洋物産 Game machine
JP2021186294A (en) * 2020-05-29 2021-12-13 株式会社三洋物産 Game machine
JP2023053387A (en) * 2022-02-04 2023-04-12 株式会社三洋物産 game machine

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015069738A (en) * 2013-09-27 2015-04-13 株式会社オートネットワーク技術研究所 Temperature sensor and wiring module
JP6536474B2 (en) 2015-06-01 2019-07-03 株式会社デンソー Sensor device
JP2017102048A (en) 2015-12-03 2017-06-08 株式会社オートネットワーク技術研究所 Temperature sensor and temperature sensing module

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