JP2022105540A5 - - Google Patents
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- Publication number
- JP2022105540A5 JP2022105540A5 JP2022074212A JP2022074212A JP2022105540A5 JP 2022105540 A5 JP2022105540 A5 JP 2022105540A5 JP 2022074212 A JP2022074212 A JP 2022074212A JP 2022074212 A JP2022074212 A JP 2022074212A JP 2022105540 A5 JP2022105540 A5 JP 2022105540A5
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- sensor unit
- unit according
- conductive path
- biasing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 3
- 229920003002 synthetic resin Polymers 0.000 claims 3
- 239000000057 synthetic resin Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Claims (13)
前記被検出体上に配され、導電路が形成された可撓性を有する帯状の導電路構成体と、
前記導電路構成体の表面において前記導電路に接続されたセンサ素子と、
前記導電路構成体において前記センサ素子が設けられた部分の裏面に取り付けられるとともに、前記導電路構成体と前記被検出体とを熱的に接続する板材と、
前記板材における前記センサ素子の外周縁部を弾性復帰力によって前記被検出体に向けて付勢する付勢部材と、
前記導電路構成体の表面に設けられた台座部と、を備え、
前記台座部は、前記付勢部材により付勢される付勢面を有し、
前記センサ素子を収容するセンサ収容部は、前記センサ素子が搭載される前記導電路構成体と、前記台座部における前記付勢面よりも前記導電路構成体側の部分と、で構成され、
前記センサ収容部には、前記センサ素子を覆う樹脂製の保護部が設けられているセンサユニット。 A sensor unit attached to an object to be detected,
a flexible strip-shaped conductive path structure arranged on the detected object and having a conductive path formed thereon;
a sensor element connected to the conductive path on the surface of the conductive path structure;
a plate that is attached to the back surface of the portion of the conductive path structure where the sensor element is provided and that thermally connects the conductive path structure and the object to be detected;
an urging member that urges an outer peripheral edge portion of the sensor element on the plate toward the object to be detected by an elastic restoring force ;
a pedestal provided on the surface of the conductive path structure ,
The pedestal has a biasing surface biased by the biasing member,
The sensor housing portion for housing the sensor element is composed of the conductive path structure on which the sensor element is mounted, and a portion of the pedestal portion closer to the conductive path structure than the urging surface,
The sensor unit is provided with a protective part made of resin that covers the sensor element in the sensor accommodating part .
前記付勢部材は、前記係止部と前記保持部との係止によって前記係止部と前記保持部とが互いに係止する方向に弾性変形する請求項1から請求項5のいずれか1項に記載のセンサユニット。 The pedestal has an engaging portion that can be engaged with a holding portion provided on the object to be detected,
6. The urging member according to any one of claims 1 to 5, wherein the biasing member is elastically deformed in a direction in which the locking portion and the holding portion are locked to each other by the locking of the locking portion and the holding portion. The sensor unit described in .
前記ばね収容部に対して前記付勢部材の軸方向に組み付ける蓋部と、を有しており、
前記ばね収容部と前記蓋部とは、前記付勢部材を軸方向に挟持する請求項7に記載のセンサユニット。 The pedestal portion includes a spring accommodating portion that axially accommodates a portion of the biasing member;
a lid portion assembled in the axial direction of the biasing member with respect to the spring accommodating portion,
8. The sensor unit according to claim 7, wherein the spring accommodating portion and the lid portion sandwich the biasing member in the axial direction.
前記付勢部材は、前記台座部と一体に合成樹脂によって形成されている請求項1から請求項6のいずれか一項に記載のセンサユニット。 The pedestal is made of synthetic resin,
The sensor unit according to any one of claims 1 to 6, wherein the biasing member is formed integrally with the pedestal from a synthetic resin.
請求項1から請求項12のいずれか1項に記載のセンサユニットと、を備え、
前記被検出体は、蓄電素子である蓄電モジュール。 the detectable body;
A sensor unit according to any one of claims 1 to 12 ,
The power storage module, wherein the object to be detected is a power storage element.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022074212A JP7293453B2 (en) | 2020-08-06 | 2022-04-28 | Sensor unit and power storage module |
JP2023093641A JP2023116611A (en) | 2020-08-06 | 2023-06-07 | Sensor unit and energy storage module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020133648A JP7068397B2 (en) | 2020-08-06 | 2020-08-06 | Sensor unit and power storage module |
JP2022074212A JP7293453B2 (en) | 2020-08-06 | 2022-04-28 | Sensor unit and power storage module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020133648A Division JP7068397B2 (en) | 2020-08-06 | 2020-08-06 | Sensor unit and power storage module |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023093641A Division JP2023116611A (en) | 2020-08-06 | 2023-06-07 | Sensor unit and energy storage module |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022105540A JP2022105540A (en) | 2022-07-14 |
JP2022105540A5 true JP2022105540A5 (en) | 2022-08-02 |
JP7293453B2 JP7293453B2 (en) | 2023-06-19 |
Family
ID=86896184
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022074212A Active JP7293453B2 (en) | 2020-08-06 | 2022-04-28 | Sensor unit and power storage module |
JP2023093641A Pending JP2023116611A (en) | 2020-08-06 | 2023-06-07 | Sensor unit and energy storage module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023093641A Pending JP2023116611A (en) | 2020-08-06 | 2023-06-07 | Sensor unit and energy storage module |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP7293453B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7235153B2 (en) * | 2017-12-29 | 2023-03-08 | 株式会社三洋物産 | game machine |
JP7235154B2 (en) * | 2018-02-15 | 2023-03-08 | 株式会社三洋物産 | game machine |
JP7231076B2 (en) * | 2018-03-08 | 2023-03-01 | 株式会社三洋物産 | game machine |
JP2020103418A (en) * | 2018-12-26 | 2020-07-09 | 株式会社三洋物産 | Game machine |
JP2021186294A (en) * | 2020-05-29 | 2021-12-13 | 株式会社三洋物産 | Game machine |
JP2023053387A (en) * | 2022-02-04 | 2023-04-12 | 株式会社三洋物産 | game machine |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015069738A (en) * | 2013-09-27 | 2015-04-13 | 株式会社オートネットワーク技術研究所 | Temperature sensor and wiring module |
JP6536474B2 (en) | 2015-06-01 | 2019-07-03 | 株式会社デンソー | Sensor device |
JP2017102048A (en) | 2015-12-03 | 2017-06-08 | 株式会社オートネットワーク技術研究所 | Temperature sensor and temperature sensing module |
-
2022
- 2022-04-28 JP JP2022074212A patent/JP7293453B2/en active Active
-
2023
- 2023-06-07 JP JP2023093641A patent/JP2023116611A/en active Pending
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