JP2022105348A - Substrate for measuring electrical characteristics of electronic component, and method for measuring electrical characteristics of electronic component using the same - Google Patents

Abstract

To provide a substrate for measuring electrical characteristics of an electronic component that allows accurate execution of calibration.SOLUTION: A substrate 1 for measuring electrical characteristics comprises: a pattern 20 for measurement that is formed on a surface 11 of a substrate main body 10, and includes a conductor pattern 21 to be connected to a first terminal electrode of an electronic component to be measured and a conductor pattern 22 to be connected to a second terminal electrode of the electronic component; and a pattern 30 for calibration that is formed on the surface 11 of the substrate main body 10. Since the pattern 20 for measurement and the pattern 30 for calibration are formed on the same substrate main body 10 in this way, a calibration error caused by a manufacturing variation does not occur. In addition, since the pattern for measurement and the pattern for calibration are provided separately, a through chip to be a cause of the error is not required to be used.SELECTED DRAWING: Figure 1

Description

The present invention relates to a substrate for measuring electrical characteristics of electronic components and a method for measuring electrical characteristics of electronic components using the same, and in particular, a substrate for measuring electrical characteristics of electronic components capable of accurately calibrating and using the substrate for measuring electrical characteristics of electronic components. The present invention relates to a method for measuring electrical characteristics of electronic components.

The electrical characteristics of electronic components such as inductors and capacitors can be measured using an electrical characteristic measuring device such as a network analyzer or an impedance analyzer. However, since the influence of the measurement system such as the board for measuring the electrical characteristics and the cable is superimposed on the measurement result, it is necessary to remove the influence of the measurement system by performing calibration. As a calibration method, a TRL method, a SOLT method, or the like is known. For example, when calibrating using the TRL method, a calibration board for evaluating through characteristics (Thru characteristics), a calibration board for evaluating reflection characteristics (Reflect characteristics), and line characteristics (Line characteristics). By evaluating each characteristic using a calibration substrate for evaluating the above, the influence of the measurement system is eliminated.

However, due to manufacturing variations and the like, characteristic differences may occur between the measurement board for mounting the electronic component (DUT) to be measured and the calibration board. In this case, correct calibration is performed. There was a problem that it could not be done. On the other hand, Patent Document 1 proposes a method of evaluating through characteristics by mounting a through chip on a measurement substrate. According to this method, since the measurement of the electronic component and the measurement of the through characteristic are performed using the same measurement pattern, the calibration error due to the manufacturing variation or the like does not occur.

International Publication No. WO2007 / 037116

However, in the method described in Patent Document 1, not only the parasitic inductance component of the through tip is superimposed on the through characteristic, but also the through characteristic varies depending on the position where the through chip is mounted and the characteristic of the through chip to be used. was there.

Therefore, an object of the present invention is to provide a substrate for measuring electrical characteristics of electronic components that can be accurately calibrated without using a through chip or the like, and a method for measuring electrical characteristics of electronic components using the substrate. And.

The substrate for measuring electrical characteristics according to the present invention is formed on the surface of the substrate body and the substrate body, and has a first conductor pattern for connecting to the first terminal electrode of the electronic component to be measured and a second electronic component. It is characterized by comprising a measurement pattern including a second conductor pattern for connecting to the terminal electrode of the substrate and a calibration pattern formed on the surface of the substrate main body.

According to the present invention, since the measurement pattern and the calibration pattern are formed on the same substrate body, calibration error due to manufacturing variation or the like does not occur. Moreover, since the measurement pattern and the calibration pattern are provided separately, it is not necessary to use a through tip or the like that causes an error.

In the present invention, the surface of the substrate body is a rectangle having first and second sides located on opposite sides of each other, and one end of the first conductor pattern and one end of the second conductor pattern are mounted with electronic components. Opposing each other through the region, the other end of the first conductor pattern and one end of the calibration pattern are located on the first side, the other end of the second conductor pattern and the other end of the calibration pattern are second. It may be located on the second side. This makes it possible to simplify the shape of the substrate for measuring electrical characteristics.

In the present invention, one end of the first conductor pattern and one end of the second conductor pattern face each other via a mounting area of an electronic component located between the first calibration surface and the second calibration surface, and are calibrated. The length of the pattern is equal to the sum of the length from the end of the first conductor pattern to the first calibration surface and the length from the end of the second conductor pattern to the second calibration surface. It doesn't matter. This makes it possible to accurately evaluate the through characteristics using the calibration pattern.

The method for measuring electrical characteristics according to the present invention is a method for measuring electrical characteristics of electronic parts using the above-mentioned substrate for measuring electrical characteristics, and a pattern for calibrating the first and second cables connected to the electrical characteristic measuring device. The first calibration is performed by connecting to both ends of the electronic component, the first terminal electrode of the electronic component is connected to one end of the first conductor pattern, and the second terminal electrode of the electronic component is of the second conductor pattern. It is characterized in that the electrical characteristics of an electronic component are measured by connecting the first and second cables to the other ends of the first and second conductor patterns while being connected to one end.

According to the present invention, the through characteristic and the line characteristic can be correctly evaluated by the first calibration. In this case, the electrical characteristic measuring device may be a network analyzer, and the electrical characteristic may be an S parameter.

In the present invention, the second calibration is performed by connecting the first cable to the other end of the first conductor pattern in a state where one end of the first conductor pattern is open, and the second calibration is performed. A third calibration may be performed by connecting the second cable to the other end of the second conductor pattern while the one end of the conductor pattern is open. According to this, it is possible to evaluate the reflection characteristics by the second and third calibrations without using a dedicated calibration pattern.

In the present invention, the fourth calibration is performed by connecting the first and second cables to both ends of another calibration pattern having a length different from that of the calibration pattern, and the measurement is performed by the first calibration. The through characteristics of the system may be evaluated, the reflection characteristics of the measurement system may be evaluated by the second and third calibrations, and the line characteristics of the measurement system may be evaluated by the fourth calibration. According to this, accurate calibration can be performed by the TRL method or the LRL method.

As described above, according to the present invention, there is provided a substrate for measuring the electrical characteristics of an electronic component, which can be accurately calibrated without using a through chip or the like, and a method for measuring the electrical characteristics of the electronic component using the substrate. It becomes possible to do.

1A and 1B are views showing the configuration of a substrate 1 for measuring electrical characteristics according to the first embodiment of the present invention, in which FIG. 1A is a schematic plan view and FIG. 1B is along the line AA shown in FIG. It is a schematic cross-sectional view. FIG. 2 is a schematic plan view for explaining the relationship between the land patterns P1 and P2 and the calibration surfaces C1 and C2. FIG. 3 is a schematic diagram for explaining a method of performing the first calibration. FIG. 4 is a schematic diagram for explaining a method of performing the second and third calibrations. FIG. 5 is a schematic diagram for explaining a method of performing the fourth calibration. FIG. 6 is a schematic diagram for explaining a method of measuring the characteristics of the electronic component 80. FIG. 7 is a graph showing the measurement result of the S parameter. FIG. 8 is a graph showing the measurement result of the inductance value. FIG. 9 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 2 according to the second embodiment of the present invention. FIG. 10 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 3 according to the third embodiment of the present invention. FIG. 11 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 4 according to the fourth embodiment of the present invention. FIG. 12 is a schematic plan view showing the configuration of the substrate 5 for measuring electrical characteristics according to the fifth embodiment of the present invention. FIG. 13 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 6 according to the sixth embodiment of the present invention. FIG. 14 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 7 according to the seventh embodiment of the present invention. FIG. 15 is a schematic plan view showing the configuration of the substrate 8 for measuring electrical characteristics according to the eighth embodiment of the present invention. FIG. 16 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 9 according to the ninth embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B are views showing the configuration of a substrate 1 for measuring electrical characteristics according to the first embodiment of the present invention, in which FIG. 1A is a schematic plan view and FIG. 1B is along the line AA shown in FIG. It is a schematic cross-sectional view.

As shown in FIG. 1, the substrate 1 for measuring electrical characteristics according to the first embodiment includes a substrate main body 10, a measurement pattern 20 and a calibration pattern 30 formed on the surface 11 of the substrate main body 10, and a substrate main body. It is composed of a ground pattern 13 formed on the entire surface of the back surface 12 of 10. The substrate body 10 is made of an insulating material such as glass epoxy, and has a thickness in the z direction of, for example, about 0.2 mm to 0.4 mm. The planar shape of the substrate body 10 is rectangular, and has sides E1 and E2 extending in the y direction and located on opposite sides to each other, and sides E3 and E4 extending in the x direction and located on opposite sides to each other. .. The substrate 1 for measuring electrical characteristics has a microstrip line structure in which a ground pattern is provided on the back surface of the substrate.

The measurement pattern 20 is composed of a pair of conductor patterns 21 and 22 extending in the x direction. As shown in FIG. 2, one ends of the conductor patterns 21 and 22 face each other via the mounting area M of the electronic component to be measured. The land pattern P1 connected to one end of the conductor pattern 21 and the land pattern P2 connected to one end of the conductor pattern 22 are provided in the mounting area M of the electronic component. At the time of measurement, a pair of terminal electrodes provided on the electronic component to be measured are connected to the land patterns P1 and P2, respectively. The width of the land patterns P1 and P2 in the y direction may be larger than the width of the conductor patterns 21 and 22 in the y direction as shown in FIG. 2A, and the conductor pattern may be larger as shown in FIG. 2B. It may be smaller than the width of 21 and 22 in the y direction, or may be the same as the width of the conductor pattern 21 and 22 in the y direction as shown in FIG. 2 (c).

As shown in FIG. 2, one end of the conductor pattern 21 is defined by the calibration surface C1 which is one end of the mounting area M, and one end of the conductor pattern 22 is defined by the calibration surface C2 which is the other end of the mounting area M. Defined. The other end of the conductor pattern 21 is defined by the side E1 of the substrate body 10, and the other end of the conductor pattern 22 is defined by the side E2 of the substrate body 10. Therefore, the length of the conductor pattern 21 is defined by the section X1 from the side E1 to the calibration surface C1, and the length of the conductor pattern 22 is defined by the section X2 from the side E2 to the calibration surface C2. The lengths of the section X1 and the section X2 may be the same (X1 = X2) or different (X1 ≠ X2). The influence of the measurement system including the sections X1 and X2 is removed by the calibration described later.

The calibration pattern 30 is composed of one conductor pattern extending in the x direction, one end of which is located on the side E1 of the substrate body 10 and the other end of which is located on the side E2 of the substrate body 10. Therefore, the length of the calibration pattern 30 in the x direction is larger than the sum of the sections X1 and X2 by the length of the mounting area M. The width of the calibration pattern 30 in the y direction is the same as the width of the measurement pattern 20 in the y direction.

The electrical characteristic measurement of the electronic component using the electrical characteristic measuring substrate 1 is performed as follows.

First, as shown in FIG. 3, a network analyzer 60 is prepared, the cable 61 is connected to one end of the calibration pattern 30 via the connector 71, and the cable 62 is connected to the other end of the calibration pattern 30 via the connector 72. Connect to. The cable 61 is connected to Port 1 of the network analyzer 60, and the cable 62 is connected to Port 2 of the network analyzer 60. By measuring the S parameter using the network analyzer 60 in this state, the through characteristic of the measurement system is evaluated. The through characteristic is a characteristic that imitates a state in which one ends (that is, calibration surfaces C1 and C2) of the conductor patterns 21 and 22 constituting the measurement pattern 20 are short-circuited to each other. As described above, the calibration pattern 30 has a through characteristic. Since the length is slightly longer than the total length of the conductor patterns 21 and 22, the electrical length corresponding to this difference is input to the network analyzer so that this difference is canceled, and the correction is made inside the network analyzer 60. conduct. As a result, the through characteristics of the electrical characteristic measurement substrate 1 can be acquired.

Next, as shown in FIG. 4, the cable 61 is connected to the other end of the conductor pattern 21 via the connector 71 with one end of the conductor pattern 21 open. By measuring the S parameter using the network analyzer 60 in this state, the reflection characteristic on the Port 1 side of the measurement system is evaluated. Then, with one end of the conductor pattern 22 open, the cable 62 is connected to the other end of the conductor pattern 22 via the connector 72. By measuring the S parameter using the network analyzer 60 in this state, the reflection characteristic on the Port 2 side of the measurement system is evaluated. The reflection characteristic is a characteristic that imitates a state in which one ends (that is, calibration surfaces C1 and C2) of the conductor patterns 21 and 22 constituting the measurement pattern 20 are open to each other. The calibration board for measuring the reflection characteristics in TRL calibration has an optimum reflection coefficient of 1, but does not need to be known. As described above, the land patterns P1 and P2 are connected to one ends of the conductor patterns 21 and 22, respectively, but the size of the land patterns P1 and P2 is very small and the magnitude of the reflection coefficient is close to 1. It meets the conditions as a calibration board for measuring reflection characteristics.

Next, as shown in FIG. 5, another electrical characteristic measurement board 1A having the calibration pattern 40 is prepared, the cable 61 is connected to one end of the calibration pattern 40 via the connector 71, and the connector 72 is used. The cable 62 is connected to the other end of the calibration pattern 40 via the cable 62. The calibration pattern 40 is the same as the calibration pattern 30 except that the length in the x direction is different. By measuring the S parameter using the network analyzer 60 in this state, the line characteristics of the measurement system are evaluated. The line characteristic is used to calculate the characteristic impedance of the measurement pattern 20. In order to acquire the line characteristics, a plurality of calibration patterns 40 having different lengths may be used. As a result, the line characteristics of the electrical characteristic measurement substrate 1 can be acquired.

Then, as shown in FIG. 6, with the electronic component 80 to be measured mounted in the mounting area M, the cable 61 is connected to the other end of the conductor pattern 21 via the connector 71, and the cable is connected via the connector 72. 62 is connected to the other end of the conductor pattern 22. The electronic component 80 has a first terminal electrode 81 and a second terminal electrode 82, and these terminal electrodes 81 and 82 are connected to the land patterns P1 and P2 shown in FIG. 2, respectively. By performing the measurement using the network analyzer 60 in this state, the S parameter of the electronic component 80 is measured. The S-parameters obtained here include the influence of the measurement system, that is, the influence of the measurement pattern 20 (conductor patterns 21 and 22), the influence of the cables 61 and 62, the influence of the connectors 71 and 72, and the like. By performing the calibration for obtaining the through characteristic, the reflection characteristic, and the line characteristic described above in advance, it is possible to calculate the S parameter in a state where the influence of the measurement system is excluded. The order of calibration is not limited to the above order.

As described above, in the electrical characteristic measurement substrate 1 according to the present embodiment, since the measurement pattern 20 and the calibration pattern 30 are formed on the same substrate main body 10, the manufacturing variation of the substrate main body 10 and the patterning conditions can be met. It is possible to eliminate measurement errors caused by variations and the like. That is, if the measurement pattern 20 and the calibration pattern 30 are formed on different substrate bodies, not only the thickness and dielectric constant of the substrate body may be slightly different, but also the measurement pattern may be different due to the difference in patterning conditions. There may be a difference in the pattern width and the pattern shape between the 20 and the calibration pattern 30, which causes a calibration error. On the other hand, in the electrical characteristic measurement substrate 1 according to the present embodiment, since the measurement pattern 20 and the calibration pattern 30 are formed on the same substrate main body 10, such a calibration error does not occur. , It is possible to perform accurate calibration.

FIG. 7 is a graph showing the results of measuring the S parameter (S ₁₁ ) of the same electronic component 80 (inductor chip) using a plurality of electrical characteristic measurement boards, and FIG. 7A is a graph showing the measurement pattern 20 and calibration. The results obtained when the passion patterns 30 are formed on different substrate bodies are shown, and (b) shows the results obtained when the electrical characteristic measurement substrate 1 according to the present embodiment is used. As shown in FIG. 7A, it can be seen that in the conventional measurement method, even with the same electronic component 80, there is a large difference in S-parameters depending on the board for measuring electrical characteristics used. On the other hand, when the electrical characteristic measurement substrate 1 according to the present embodiment is used, it can be seen that the difference due to the electrical characteristic measurement substrate 1 used is significantly reduced as shown in FIG. 7B.

FIG. 8 is a graph obtained by converting the S parameter into an inductance value, and FIG. 8A shows the results obtained when the measurement pattern 20 and the calibration pattern 30 are formed on different substrate bodies, and FIG. 8B shows the results obtained when the measurement pattern 20 and the calibration pattern 30 are formed on different substrate bodies. Shows the results obtained when the substrate 1 for measuring electrical characteristics according to this embodiment is used. As shown in FIG. 8A, it can be seen that in the conventional measurement method, even if the same electronic component 80 is used, there is a large difference in the inductance value depending on the board for measuring electrical characteristics used. On the other hand, when the electrical characteristic measurement substrate 1 according to the present embodiment is used, it can be seen that the difference due to the electrical characteristic measurement substrate 1 used is significantly reduced as shown in FIG. 8B.

FIG. 9 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 2 according to the second embodiment of the present invention.

As shown in FIG. 9, in the board 2 for measuring electrical characteristics according to the second embodiment, the side E2 of the board body 10 has a stepped shape, whereby the length of the calibration pattern 30 in the x direction is formed. Is different from the substrate 1 for measuring electrical characteristics according to the first embodiment in that is shorter than that of the first embodiment. Since the other basic configurations are the same as those of the electrical characteristic measurement substrate 1 according to the first embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

In the present embodiment, the side E2 of the substrate main body 10 is composed of the sides E2a and E2b. The side E2a exists in the same x direction as the side E2 in the first embodiment. On the other hand, the side E2b exists in the −x direction with respect to the side E2 in the first embodiment, whereby the distance between the side E1 and the side E2b in the x direction is shortened as compared with the first embodiment. .. The distance between the side E1 and the side E2b in the x direction is equal to the sum of the intervals X1 and X2 of the conductor patterns 21 and 22. As a result, the length of the calibration pattern 30 in the x direction is also equal to the sum of the sections X1 and X2.

As a result, in the evaluation of the through characteristics shown in FIG. 3, for electrical characteristic measurement without correcting the characteristic difference caused by the difference in length between the measurement pattern 20 and the calibration pattern 30 inside the network analyzer 60. It is possible to directly acquire the through characteristics of the substrate 2.

FIG. 10 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 3 according to the third embodiment of the present invention.

As shown in FIG. 10, the substrate 3 for measuring electrical characteristics according to the third embodiment is for measuring electrical characteristics according to the second embodiment in that the sides E1 and E2 of the substrate main body 10 have a stepped shape. It is different from the substrate 2. Since the other basic configurations are the same as those of the electrical characteristic measurement substrate 2 according to the second embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

In the present embodiment, the side E1 of the substrate main body 10 is composed of the sides E1a and E1b. The side E1a exists in the same x direction as the side E1 in the second embodiment. On the other hand, the side E1b exists in the + x direction with respect to the side E2 in the second embodiment, and the side E2b exists in the + x direction with respect to the side E2b in the second embodiment. The distance between the sides E1b and the sides E2b in the x direction is equal to the sum of the intervals X1 and X2 of the conductor patterns 21 and 22. As a result, the length of the calibration pattern 30 in the x direction is also equal to the sum of the sections X1 and X2.

As a result, it is possible to directly acquire the through characteristics of the electrical characteristic measurement substrate 3 as in the electrical characteristic measurement substrate 2 according to the second embodiment.

FIG. 11 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 4 according to the fourth embodiment of the present invention.

As shown in FIG. 11, the substrate 4 for measuring electrical characteristics according to the fourth embodiment has a stepped side E2 of the substrate main body 10 and is provided with a calibration pattern 40. It is different from the substrate 1 for measuring electrical characteristics according to the first embodiment. Since the other basic configurations are the same as those of the electrical characteristic measurement substrate 1 according to the first embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

In the present embodiment, the side E2 of the substrate main body 10 is composed of the sides E2a and E2c. The side E2a exists in the same x direction as the side E2 in the first embodiment. On the other hand, the side E2c exists in the + x direction with respect to the side E2 in the first embodiment, so that the distance between the side E1 and the side E2c in the x direction is longer than that in the first embodiment. The calibration pattern 40 extends in the x direction from the side E1 to the side E2c. The calibration pattern 40 corresponds to the calibration pattern 40 shown in FIG.

As described above, according to the present embodiment, since the measurement pattern 20 and the two calibration patterns 30 and 40 are formed on the same substrate main body 10, more accurate calibration can be performed. ..

FIG. 12 is a schematic plan view showing the configuration of the substrate 5 for measuring electrical characteristics according to the fifth embodiment of the present invention.

As shown in FIG. 12, the board 5 for measuring electrical characteristics according to the fifth embodiment has a stepped shape in which the sides E2 of the board body 10 are composed of the sides E2a to E2e, and the calibration patterns 41 to 43. Is provided, which is different from the boards 2 and 4 for measuring electrical characteristics according to the second or fourth embodiment. Since the other basic configurations are the same as those of the boards 2 and 4 for measuring electrical characteristics according to the second or fourth embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

The sides E2a and E2b are located in the same x direction as the sides E2a and E2b in the second embodiment, respectively, and the sides E2c are located in the same x direction as the sides E2c in the fourth embodiment. On the other hand, the side E2d exists in the + x direction with respect to the side E2c in the fourth embodiment, and the side E2e exists in the + x direction with respect to the side E2d. The calibration pattern 41 has the same length as the calibration pattern 40 in the fourth embodiment. On the other hand, the calibration pattern 42 extends in the x direction from the side E1 to the side E2d, and therefore has a longer length in the x direction than the calibration pattern 41. Further, the calibration pattern 43 extends in the x direction from the side E1 to the side E2e, and therefore has a longer length in the x direction than the calibration pattern 42.

The calibration patterns 41 to 43 are patterns for evaluating line characteristics. As described above, according to the present embodiment, since the three calibration patterns 41 to 43 having different lengths are formed on the same substrate main body 10, it is possible to acquire more accurate line characteristics. ..

FIG. 13 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 6 according to the sixth embodiment of the present invention.

As shown in FIG. 13, the substrate 6 for measuring electrical characteristics according to the sixth embodiment is the substrate 1 for measuring electrical characteristics according to the first embodiment in that the calibration pattern 50 is provided on the substrate main body 10. Is different from. Since the other basic configurations are the same as those of the electrical characteristic measurement substrate 1 according to the first embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

The calibration pattern 50 has the same length as the section X1 (= X2), one end thereof is open, and the other end is located on the side E1. This makes it possible to evaluate the reflection characteristics shown in FIG. 4 using the calibration pattern 50. Since the calibration pattern 50 is not provided with the land pattern, if the electrical characteristic measurement substrate 6 according to the present embodiment is used, more accurate evaluation of the reflection characteristics is made even when the land patterns P1 and P2 are large. Can be done.

FIG. 14 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 7 according to the seventh embodiment of the present invention.

As shown in FIG. 14, in the electrical characteristic measurement substrate 7 according to the seventh embodiment, the width of the substrate main body 10 in the x direction is equal to the sum of the sections X1 and X2, and the measurement pattern 20 extends in the diagonal direction. It differs from the electrical characteristic measurement substrate 1 according to the first embodiment in that it exists. Since the other basic configurations are the same as those of the electrical characteristic measurement substrate 1 according to the first embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

In the present embodiment, since the measurement pattern 20 extends in the diagonal direction, the calibration pattern is the same as in the second and third embodiments, while the planar shape of the substrate body 10 is a simple rectangle. It is possible to match the length of 30 with the sum of the intervals X1 and X2.

FIG. 15 is a schematic plan view showing the configuration of the substrate 8 for measuring electrical characteristics according to the eighth embodiment of the present invention.

As shown in FIG. 15, the substrate 8 for measuring electrical characteristics according to the eighth embodiment is different from the substrate 1 for measuring electrical characteristics according to the first embodiment in that a conductor pattern 23 is added. Since the other basic configurations are the same as those of the electrical characteristic measurement substrate 1 according to the first embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

The conductor pattern 23 constitutes a part of the measurement pattern 20 together with the conductor patterns 21 and 22, and is terminated at the mounting region M of the electronic component. In this embodiment, the conductor pattern 23 extends in the y direction. If the substrate 8 for measuring electrical characteristics having such a configuration is used, it is possible to measure the electrical characteristics of a three-terminal type electronic component. In the calibration using the electrical characteristic measurement substrate 8, the S-parameter measurement process by connecting the conductor pattern 23 to Port 3 of the network analyzer may be added. This makes it possible to evaluate the reflection characteristics on the Port3 side of the measurement system and the through characteristics between Port1-3 and Port2-3.

FIG. 16 is a schematic plan view showing the configuration of the electrical characteristic measurement substrate 9 according to the ninth embodiment of the present invention.

As shown in FIG. 16, the substrate 9 for measuring electrical characteristics according to the ninth embodiment is different from the substrate 8 for measuring electrical characteristics according to the eighth embodiment in that a conductor pattern 24 is added. Since the other basic configurations are the same as those of the substrate 8 for measuring electrical characteristics according to the eighth embodiment, the same elements are designated by the same reference numerals, and duplicate description will be omitted.

The conductor pattern 24, together with the conductor patterns 21 to 23, constitutes a part of the measurement pattern 20 and is terminated at the mounting region M of the electronic component. In this embodiment, the conductor patterns 23 and 24 extend in the x direction. By using the electrical characteristic measuring board 9 having such a configuration, it is possible to measure the electrical characteristics of a 4-terminal type electronic component. In the calibration using the electrical characteristic measurement substrate 9, the S-parameter measurement process by connecting the conductor pattern 24 to Port 4 of the network analyzer may be added. This makes it possible to evaluate the reflection characteristics on the Port4 side of the measurement system and the through characteristics between Port1-4, Port2-4, and Port3-4.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the present invention, and these are also the present invention. Needless to say, it is included in the range.

For example, in the above embodiment, the S parameter of the electronic component is measured by using a network analyzer, but the measured electrical characteristics are not limited to this. Further, the measuring device to be used is not limited to the network analyzer, and may be another measuring device such as an impedance analyzer or an oscilloscope. Further, the substrate structure to be used is not limited to the microstrip structure, and other substrate structures such as a coplanar line structure and a strip line structure may be used.

1-9,1A Electrical characteristic measurement board 10 Board body 11 Front side 12 Back side 13 Ground pattern 20 Measurement pattern 21 to 24 Conductor pattern 30, 40 to 43, 50 Calibration pattern 60 Network analyzer 61, 62 Cable 71, 72 Connector 80 Electronic component 81 First terminal electrode 82 Second terminal electrode C1, C2 Calibration surface E1 to E4, E1a, E1b, E2a to E2e Side M Mounting area P1, P2 Land pattern X1, X2 section

Claims (7)

The board body and
A first conductor pattern formed on the surface of the substrate body and for connecting to the first terminal electrode of the electronic component to be measured and a second conductor for connecting to the second terminal electrode of the electronic component. Measurement patterns including patterns and
A substrate for measuring electrical characteristics, which comprises a calibration pattern formed on the surface of the substrate main body. The surface of the substrate body is a rectangle having first and second sides located on opposite sides of each other.
One end of the first conductor pattern and one end of the second conductor pattern face each other via the mounting area of the electronic component, and face each other.
The other end of the first conductor pattern and one end of the calibration pattern are located on the first side.
The substrate for measuring electrical characteristics according to claim 1, wherein the other end of the second conductor pattern and the other end of the calibration pattern are located on the second side. One end of the first conductor pattern and one end of the second conductor pattern face each other via a mounting area of the electronic component located between the first calibration surface and the second calibration surface.
The length of the calibration pattern is the length from the end of the first conductor pattern to the first calibration surface and the length from the end of the second conductor pattern to the second calibration surface. The substrate for measuring electrical characteristics according to claim 1, wherein the substrate is equal to the sum of the sums. The method for measuring electrical characteristics of electronic components using the substrate for measuring electrical characteristics according to claim 1.
The first calibration is performed by connecting the first and second cables connected to the electrical characteristic measuring device to both ends of the calibration pattern.
The first terminal electrode of the electronic component is connected to one end of the first conductor pattern, and the second terminal electrode of the electronic component is connected to one end of the second conductor pattern. A method for measuring electrical characteristics, which comprises connecting the first and second cables to the other ends of the first and second conductor patterns to measure the electrical characteristics of the electronic component. With the one end of the first conductor pattern open, the first cable is connected to the other end of the first conductor pattern to perform a second calibration, and the second is performed. The third calibration is performed by connecting the second cable to the other end of the second conductor pattern in a state where the one end of the conductor pattern is open. 4. The method for measuring electrical characteristics according to 4. A fourth calibration is performed by connecting the first and second cables to both ends of another calibration pattern having a length different from that of the calibration pattern.
The through characteristics of the measurement system are evaluated by the first calibration, the reflection characteristics of the measurement system are evaluated by the second and third calibrations, and the line characteristics of the measurement system are evaluated by the fourth calibration. The method for measuring electrical characteristics according to claim 5, wherein the method is characterized by the above. The method for measuring electrical characteristics according to any one of claims 4 to 6, wherein the electrical characteristic measuring device is a network analyzer, and the electrical characteristics are S-parameters.

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