JP2022101288A - Release film and method for manufacturing electronic component device - Google Patents

Abstract

To provide a release film having excellent anti-static performance.SOLUTION: Provided is a release film that includes, in this order, a base layer, a conductive layer, and a release layer. The release layer contains polyacrylonitrile particles.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a method for manufacturing a release film and a semiconductor package.

In recent years, as electronic devices, especially mobile phones, have become thinner, electronic components such as semiconductor elements are also required to be thinner. Also, from the viewpoint of improving heat dissipation, instead of overmolding (Over Molding) in which the entire electronic component is covered with a sealing resin, exposure molding (Exposed Die Molding) that exposes a part of the surface of the electronic component is used. The number of cases adopted is increasing.

When sealing an electronic component so that a part of the electronic component is exposed, it is necessary to prevent leakage (flash burr) of the sealing material to the exposed portion of the electronic component. Therefore, it is possible to seal the exposed part of the electronic component with a releaseable film (release film) attached, and then peel off the release film to expose the surface of the electronic component. It has been.
As such a release film, for example, Patent Document 1 describes a laminated film in which a film made of a fluororesin is laminated on at least one side of a base film made of a stretched polyester resin film.

Japanese Unexamined Patent Publication No. 2006-49850

If the release film is made of a material that is easily charged, electric discharge may occur when the release film is brought into contact with the electronic component or when the release film is peeled off from the electronic component, and electrostatic destruction of the electronic component may occur. .. In recent years, with the increasing integration of semiconductor devices, the miniaturization of process nodes has progressed, and the risk of electrostatic breakdown of electronic components has increased.

In view of the above circumstances, one aspect of the present disclosure is to provide a release film having excellent antistatic performance. Another aspect of the present disclosure is to provide a method for manufacturing a semiconductor package using this release film.

The means for solving the above problems include the following embodiments.
<1> A release film having a base material layer, a conductive layer, and a release layer in this order, and the release layer contains polyacrylonitrile particles.
<2> The release film according to <1>, wherein the ratio (A / B) of the average particle diameter A of the polyacrylonitrile particles to the thickness B of the release layer is larger than 0.7.
<3> The release film according to <1> or <2>, wherein the content of the polyacrylonitrile particles is 10% by mass or more of the entire release layer.
<4> The release film according to any one of <1> to <3>, wherein the release layer contains a pressure-sensitive adhesive.
<5> The release film according to any one of <1> to <4>, for temporarily protecting at least a part of the surface of the object.
<6> The release film according to any one of <1> to <5>, which is for exposure molding.
<7> The step of sealing the periphery of the electronic component in a state where the release film according to any one of <1> to <6> is in contact with at least a part of the surface of the electronic component, and the release film. A method for manufacturing an electronic component device, comprising a step of peeling the electronic component from the electronic component.

According to one aspect of the present disclosure, a release film having excellent antistatic performance is provided. According to another aspect of the present disclosure, a method for manufacturing an electronic component device using this release film is provided.

It is a figure which shows the structure of a release film schematically.

Hereinafter, embodiments for carrying out the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit this disclosure.

In the present specification, the term "process" includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other processes. Is done.
In the numerical range indicated by using "-" in the present specification, the numerical values before and after "-" are included as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present specification, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. good. Further, in the numerical range described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present specification, the content or content of each component in the composition is the same as that in the case where a plurality of substances corresponding to each component are present in the composition, unless otherwise specified. It means the total content or content of substances.
In the present specification, the particle size of each component in the composition is a mixture of the plurality of particles present in the composition when a plurality of particles corresponding to each component are present in the composition, unless otherwise specified. Means a value for.
In the present specification, the term "layer" refers to the case where the layer is formed in the entire region when the region is observed, and the case where the layer is formed only in a part of the region. Is also included.
In the present specification, the thickness of the release film or each layer constituting the release film can be measured by a known method. For example, it may be measured using a dial gauge or the like, or it may be measured from a cross-sectional image of a release film. Alternatively, the material constituting the layer may be removed using a solvent or the like, and calculated from the mass before and after the removal, the density of the material, the area of the layer, and the like. If the layer thickness is not constant, the arithmetic mean value of the values measured at any five points is used as the layer thickness.
As used herein, "(meth) acrylic" means either acrylic or methacrylic, or both, and "(meth) acrylate" means one or both of acrylate and methacrylate.

<Release film>
The release film of the present disclosure is a release film having a base material layer, a conductive layer, and a release layer in this order, and the release layer contains polyacrylonitrile particles.

The release film having the above structure exhibits excellent antistatic performance. Specifically, in addition to having a conductive layer between the base material layer and the release layer, the release layer contains polyacrylonitrile particles, which exhibits excellent antistatic performance.
The reason why the antistatic performance is improved by containing the polyacrylonitrile particles in the release layer is considered to be that the unshared electron pair of the nitrogen atom contained in the polyacrylonitrile particles imparts conductivity to the release layer.

An example of the structure of the release film having the base material layer, the release layer and the conductive layer is schematically shown in FIG. The release film 40 shown in FIG. 1 includes a base material layer 10, a release layer 20, and a conductive layer 30 arranged between the base material layer 10 and the release layer 20.

Since the release film has a base material layer, the required strength is imparted to the release film, and physical properties such as elongation and elastic modulus can be adjusted by appropriately selecting the material. ..
Since the release film has a release layer, the release film can be easily peeled off from the adherend surface.
Since the release film has a conductive layer, electric discharge at the time of sticking or peeling of the release film is suppressed, and the occurrence of electrostatic destruction of electronic components is effectively suppressed.

The overall thickness of the release film is not particularly limited and can be set according to desired physical properties (elongation rate, elastic modulus, etc.). For example, it may be 30 μm to 300 μm, 35 μm to 250 μm, or 40 μm to 200 μm.

(Base layer)
The material of the base material layer is not particularly limited. Examples thereof include polyesters such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and resins such as polyimides, polyamides, polyester ethers, polyamideimides, fluorine-containing resins and thermoplastic elastomers. The resin contained in the base material layer may be only one type or two or more types.

From the viewpoint of the handleability of the film, it is preferable that the release film has a certain degree of elasticity. Therefore, the base material layer preferably contains polyester, and more preferably polyethylene terephthalate.

The base material layer may or may not be stretched. When the stretch treatment is applied, the strength of the release film tends to be excellent, and when the stretch treatment is not applied, the extensibility of the release film tends to be excellent.

The thickness of the base material layer is not particularly limited, and is preferably 10 μm or more, more preferably 20 μm or more, and further preferably 30 μm or more. When the thickness of the base material layer is 10 μm or more, the release sheet is not easily torn and the handleability is excellent.
The thickness of the base material layer is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm. When the thickness of the base material layer is 300 μm or less, the ability to follow the adherend surface (the property of deforming according to the shape of the adherend surface) can be sufficiently obtained.

The base material layer may be composed of only one layer or may be composed of two or more layers. Examples of the method for obtaining a base material layer composed of two or more layers include a method of extruding the material of each layer by a coextrusion method and a method of laminating two or more films.

When the release film contains a conductive layer, the surface of the base material layer on the side where the conductive layer is provided may be treated to improve the adhesion to the conductive layer. Examples of the treatment method include corona treatment, surface treatment such as plasma treatment, and application of an undercoating agent (primer).

If necessary, a back treatment agent for adjusting the unwindability of the release film from the roll may be applied to the back surface of the base material layer (the surface opposite to the side to be attached to the adherend surface). .. Examples of the back treatment agent include silicone resin, fluorine-containing resin, polyvinyl alcohol, and resin having an alkyl group. If necessary, these back treatment agents may be modified. The back treatment agent may be used alone or in combination of two or more.

(Release layer)
The material of the release layer is not particularly limited as long as it contains polyacrylonitrile particles. From the viewpoint of adhesion to the adherend surface, the release layer preferably has adhesiveness. Examples of the method of imparting adhesiveness to the release layer include a method of incorporating an adhesive in the release layer.

The type of the adhesive is not particularly limited and can be selected in consideration of adhesiveness, mold release property, heat resistance and the like. Specifically, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a urethane-based pressure-sensitive adhesive are preferable, and an acrylic-based pressure-sensitive adhesive is more preferable. The pressure-sensitive adhesive contained in the release layer may be only one type or two or more types.

Acrylic pressure-sensitive adhesives include monomers having a low glass transition temperature (Tg) (for example, -20 ° C. or lower) such as butyl acrylate, ethyl acrylate, and 2-ethylhexyl acrylate as main monomers, and (meth) acrylic acid and hydroxy. A copolymer obtained by copolymerizing a monomer having a functional group such as ethyl (meth) acrylate, hydroxyethyl (meth) acrylate, (meth) acrylamide, and (meth) acrylonitrile (hereinafter, also referred to as acrylic copolymer). Is preferable. The above-mentioned "glass transition temperature" is the glass transition temperature of a homopolymer obtained by using the corresponding monomer.

The acrylic copolymer may be a crosslinked acrylic copolymer. The cross-linked acrylic copolymer can be synthesized by cross-linking a monomer which is a raw material of the acrylic copolymer with a cross-linking agent. Examples of the cross-linking agent used for synthesizing the cross-linked acrylic copolymer include known cross-linking agents such as isocyanate compounds, melamine compounds, and epoxy compounds. Further, in order to form a network structure that spreads gently in the acrylic pressure-sensitive adhesive, it is more preferable that the cross-linking agent is a polyfunctional cross-linking agent such as trifunctional or tetrafunctional.

The content of the polyacrylonitrile particles contained in the release layer is preferably 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more of the entire release layer. .. When the content of the polyacrylonitrile particles is 10% by mass or more of the entire release layer, the polyacrylonitrile particles sufficiently function as a conductive path of the release layer, and a sufficient antistatic performance tends to be obtained.
From the viewpoint of suppressing the cohesive failure of the release layer and the generation of residues on the adherend surface, the content of polyacrylonitrile particles is preferably 50% by mass or less, preferably 40% by mass or less of the entire release layer. It is more preferably present, and further preferably 30% by mass or less.

From the viewpoint of imparting sufficient conductivity to the release layer, the ratio (A / B) of the average particle diameter A of the polyacrylonitrile particles to the thickness B of the release layer is preferably larger than 0.7, and 0. It is more preferably 75 or more, further preferably 0.8 or more, further preferably 0.9 or more, and even more preferably 0.95 or more.
When the ratio (A / B) of the average particle diameter A of the polyacrylonitrile particles to the thickness B of the release layer is 0.75 or more, the polyacrylonitrile particles sufficiently function as a conductive path and have sufficient antistatic performance. It tends to be obtained.
From the viewpoint of suppressing the desorption of polyacrylonitrile particles from the release layer, the A / B is preferably 2.0 or less, and more preferably 1.7 or less.

The thickness B of the release layer is the thickness of the release layer containing the polyacrylonitrile particles in the thickness direction of the release film. When the thickness is not constant, the cross section obtained after cutting the release film is observed by SEM, and the arithmetic mean value of the thicknesses at five arbitrarily selected points is defined as the thickness B of the release layer.

When the approximate resin composition can be found by a known analysis method, the release layer is removed using a solvent such as methyl ethyl ketone as described in Examples, and the mass difference of the release film before and after removal and the solvent are used. The thickness B of the release layer can be calculated from the specific gravity of the resin removed in step 1 and the volume of the polyacrylonitrile particles remaining as an insoluble matter.

The average particle size of the polyacrylonitrile particles may be, for example, in the range of 1 μm to 50 μm, in the range of 5 μm to 30 μm, or in the range of 7 μm to 20 μm.

In the present disclosure, the average particle size of the particles is the particle size (D50) when the accumulation from the small diameter side is 50% in the volume-based particle size distribution measured by the laser diffraction / scattering method.

The particle shape of the polyacrylonitrile particles is not particularly limited, and may be spherical or non-spherical (flat, indefinite, etc.).
From the viewpoint of blending a sufficient amount into the release layer, the polyacrylonitrile particles are preferably non-spherical. For example, the average aspect ratio (major axis / minor axis) of the polyacrylonitrile particles may be 1.1 or more, 1.2 or more, or 1.5 or more. The average aspect ratio of the polyacrylonitrile particles may be 10 or less, 7 or less, or 5 or less.
In the present disclosure, the average aspect ratio of the particles is an arithmetic mean value of the aspect ratios of 100 arbitrarily selected particles.

The average particle size of the polyacrylonitrile particles contained in the release film can be measured by the following procedure. The release layer of the release film is removed using a solvent such as methyl ethyl ketone, and the polyacrylonitrile particles remaining as insoluble matter are analyzed in a volume-based particle size distribution measured by laser diffraction / scattering method, and analyzed from the small diameter side. The particle size (D50) when the cumulative number of particles is 50% is taken as the average particle size.

The release layer may contain only polyacrylonitrile particles, or may contain polyacrylonitrile particles and particles other than polyacrylonitrile particles.

The material of the particles other than the polyacrylonitrile particles is not particularly limited, and may be an organic substance such as a resin, an inorganic substance such as a metal or a metal oxide, or a combination of an organic substance and an inorganic substance. good.

From the viewpoint of affinity with the pressure-sensitive adhesive contained in the release layer, the particles other than the polyacrylonitrile particles are preferably resin particles. Examples of the resin constituting the resin particles include acrylic resin, olefin resin, styrene resin, silicone resin and the like. Acrylic resin is preferable from the viewpoint of suppressing the residue on the surface of the semiconductor package after molding.

The average particle size of the particles other than the polyacrylonitrile particles is not particularly limited. For example, it can be selected from the range of 1 μm to 20 μm.

When the release layer contains polyacrylonitrile particles and particles other than the polyacrylonitrile particles, the polyacrylonitrile particles are used from the viewpoint of imparting sufficient conductivity to the release layer and suppressing cohesive failure of the release layer. The proportion of the total particles is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 70% by mass or more.

The release layer may contain components other than the pressure-sensitive adhesive and particles, if necessary. For example, it may contain an anchoring improver, a cross-linking accelerator, a colorant and the like.

The thickness of the release layer is not particularly limited, and is preferably 0.1 μm or more, and more preferably 1 μm or more. When the thickness of the release layer is 0.1 μm or more, sufficient adhesive force to the electronic component is obtained, and the intrusion of the encapsulant is effectively suppressed.
The thickness of the release layer may be 100 μm or less, 50 μm or less, or 10 μm or less. When the thickness of the release layer is 100 μm or less, heat shrinkage stress during heat curing of the release layer is unlikely to occur, and the flatness of the release film is likely to be maintained. Further, when the release film has a conductive layer, the surface resistivity of the release layer is kept low without being too far from the conductive layer, and the electrostatic breakdown of electronic components is effective. It is suppressed.
The thickness of the release layer is more preferably 3 μm to 50 μm, considering the ease of forming the release layer (applicability, etc.), the securing of the adhesive strength, the securing of the antistatic function, and the like.

(Conductive layer)
The configuration of the conductive layer is not particularly limited as long as it can increase the conductivity of the release film and suppress charging. For example, it may be a layer containing a conductive material such as an antistatic agent, a conductive polymer material, and a metal.

Examples of the antistatic agent contained in the conductive layer include a cationic antistatic agent having a cationic group such as a quaternary ammonium salt, a pyridium salt, and a primary to tertiary amino group, a sulfonic acid base, a sulfate ester base, and a phosphoric acid. Anionic antistatic agents having anionic groups such as ester bases, amphoteric antistatic agents such as amino acid-based and amino acid sulfate esters, and nonionic antistatic agents having nonionic groups such as aminoalcohol-based, glycerin-based, and polyethylene glycol-based antistatic agents. Examples thereof include agents and high molecular weight antistatic agents obtained by increasing the molecular weight of these antistatic agents. The antistatic agent may be a combination of a main agent and an auxiliary agent (curing agent, etc.).
Examples of the conductive polymer material contained in the conductive layer include polymer compounds having polythiophene, polyaniline, polypyrrole, polyacetylene and the like in the skeleton.
Examples of the metal include aluminum, copper, gold, chromium, tin and the like, and aluminum is preferable from the viewpoint of availability.

The method for forming the conductive layer is not particularly limited. For example, a method of laminating a metal foil or the like on one side of a film to be a base material layer, a method of applying a conductive layer material to one side of a film to be a base material layer, a method of applying by vapor deposition, or the like can be mentioned.

The thickness of the conductive layer is not particularly limited as long as the antistatic effect of the release film can be sufficiently obtained. For example, it may be in the range of 0.01 μm to 1 μm.

The release film of the present disclosure can be used for various purposes. For example, it can be used to temporarily protect at least a portion of the surface of an object. Since the release film of the present disclosure has excellent followability to the adherend surface, when the periphery of the area to which the release film is attached is processed, the area is effectively protected from the influence. Can be done.
In the present disclosure, "temporarily protecting" means protecting the portion to which the release film is attached from the time when the release film is attached to at least a part of the surface of the object until the release is peeled off.

The type of processing performed on the periphery of the area to which the release film is attached is not particularly limited. Specific examples thereof include sealing with a sealing material, roughening treatment, coating treatment, water repellent treatment, antistatic treatment and the like.
The release film may be one used for exposure molding.

<Manufacturing method of electronic component equipment>
The method for manufacturing the electronic component device of the present disclosure includes a step of sealing the periphery of the electronic component in a state where the above-mentioned release film is in contact with at least a part of the surface of the electronic component, and a step of peeling the release film from the electronic component. It is a manufacturing method of an electronic component device including a process.

As described above, the release film of the present disclosure is excellent in antistatic performance. Therefore, the occurrence of electrostatic breakdown of electronic components is effectively suppressed.

The type of electronic component used in the above method is not particularly limited. For example, semiconductor elements, capacitors, terminals and the like can be mentioned.
In the above method, the type of material (sealing material) that seals the periphery of the electronic component is not particularly limited. For example, a resin composition containing an epoxy resin, an acrylic resin and the like can be mentioned.

Hereinafter, the release film of the present disclosure will be described based on examples. However, the present disclosure is not limited to the following examples.

<Example 1>
As a base material layer, a 38 μm-thick biaxially stretched polyethylene terephthalate film (trade name “S-38”, Unitika Ltd.) having a corona treatment on one side was prepared.
The following antistatic agent diluted to 2.5% by mass with a mixed solvent (water / isopropyl alcohol = 1/1 (mass ratio)) is applied to the corona-treated surface of the base material layer, and the temperature is 100 ° C. for 1 minute. It was heated to form a conductive layer.

The antistatic agent used to prepare the release film is a mixture of the following component A (100 parts by mass) and component B (25 parts by mass).

Ingredient A: Cationic antistatic agent which is an acrylic copolymer having a quaternary ammonium salt, trade name "Bondip PA-100 main agent", Konishi Co., Ltd. Ingredient B: Epoxy-based curing agent, trade name "Bondip PA" -100 Hardener ", Konishi Co., Ltd.

The following composition for forming a release layer was applied onto the formed conductive layer and heated at 100 ° C. for 1 minute to form a release layer to prepare a release film.
The composition for forming the release layer used for producing the release film includes the following pressure-sensitive adhesive (100 parts by mass), a cross-linking agent (10 parts by mass), resin particles A (25 parts by mass), and a mixed solvent (20 parts by mass). It is a mixture with 34 parts by mass of toluene / methyl ethyl ketone = 8: 2 (mass ratio).

Adhesive: Acrylic adhesive, trade name "B-3", Lion Specialty Chemicals Co., Ltd., mixture of multiple types of methacrylic acid ester monomers Cross-linking agent: Hexamethylene diisocyanate cross-linking agent, trade name "Coronate H-CL" , Nippon Polyurethane Industry Co., Ltd. Resin particles A: Polyacrylonitrile particles, Trade name "Tuftic ASF-7", Toyo Spinning Co., Ltd., Volume average particle diameter: 7 μm, Indefinite shape

<Example 2>
A release film was produced in the same manner as in Example 1 except that the amount of the resin particles A was changed to 30 parts by mass.

<Example 3>
A release film was produced in the same manner as in Example 1 except that the amount of the resin particles A was changed to 40 parts by mass.

<Example 4>
A release film was produced in the same manner as in Example 1 except that the resin particles A were changed to the following resin particles B and the amount thereof was changed to 30 parts by mass.
Resin particles B: Polyacrylonitrile particles, trade name "Tuftic AM", Toyobo Co., Ltd., volume average particle diameter: 10 μm, irregular shape

<Example 5>
A release film was produced in the same manner as in Example 1 except that the amount of the resin particles A was changed to 15 parts by mass.

<Comparative Example 1>
A release film was produced in the same manner as in Example 1 except that the resin particles A were not added to the release layer forming composition.

<Comparative Example 2>
A release film was produced in the same manner as in Comparative Example 1 except that 25 parts by mass of the following resin particles C were added to the release layer forming composition.
Resin particles C: Polyacrylic particles, trade name "MX-1000", Soken Chemical Co., Ltd., volume average particle diameter: 10 μm, spherical

<Comparative Example 3>
A release film was produced in the same manner as in Comparative Example 2 except that the amount of the resin particles C was changed to 40 parts by mass.

<Comparative Example 4>
A release film was produced in the same manner as in Comparative Example 2 except that the resin particles C were changed to 25 parts by mass of the following resin particles D.
Resin particles D: Polyacrylic particles, trade name "MX-500", Soken Chemical Co., Ltd., volume average particle diameter: 5 μm, spherical

<Comparative Example 5>
A release film was produced in the same manner as in Comparative Example 4 except that the amount of the resin particles D was changed to 40 parts by mass.

<Evaluation test>
The following evaluation test was performed using the prepared release film.

<Release layer thickness>
The release layer of the produced release film was removed using methyl ethyl ketone, and the thickness of the release layer was calculated from the mass difference of the release film before and after removal. The results are shown in Table 1.

<Remaining glue>
A release film was pressed on the surface of a mirror-finished SUS (stainless steel) plate under the conditions of 180 ° C., 16 MPa, and 5 minutes. After pressing, the film was left to stand and cooled to room temperature (25 ° C.), and then the release film was peeled off from the SUS plate. The surface of the SUS plate was visually observed, and if no glue residue was observed, it was OK, and if glue residue was observed, it was NG and the state of the glue residue was evaluated. The results are shown in Table 1.

<Surface resistivity>
The surface resistivity of the release film on the release layer side of the release film was measured using an insulation resistance tester (digital ultra-high resistance / micro ammeter manufactured by Advantest). Specifically, the release film was left in an atmosphere of 23 ± 2 ° C. and a humidity of 50 ± 10% RH for 1 hour, and then a voltage of 500 V was applied for 1 minute, and then the surface resistivity (Ω) was measured. The surface resistivity (Ω / □) was calculated using the following equation. The results are shown in Table 1.

Surface resistivity = π (D + d) / (Dd) × R
π: pi, D: inner diameter of ring-shaped electrode, d: outer diameter of ring-shaped electrode, R: surface resistivity The value of π (D + d) / (Dd) used to calculate the surface resistivity is It was 18.84.

As shown in the results of Table 1, the release film of the example in which the release layer contains polyacrylonitrile particles has a lower surface resistance than the release film of the comparative example in which the release layer does not contain polyacrylonitrile particles. , It can be judged that the antistatic performance is excellent.

Claims (7)

A release film having a base material layer, a conductive layer, and a release layer in this order, and the release layer contains polyacrylonitrile particles. The release film according to claim 1, wherein the ratio (A / B) of the average particle diameter A of the polyacrylonitrile particles to the thickness B of the release layer is larger than 0.7. The release film according to claim 1 or 2, wherein the content of the polyacrylonitrile particles is 10% by mass or more of the entire release layer. The release film according to any one of claims 1 to 3, wherein the release layer contains a pressure-sensitive adhesive. The release film according to any one of claims 1 to 4, for temporarily protecting at least a part of the surface of the object. The release film according to any one of claims 1 to 5, which is for exposure molding. A step of sealing the periphery of the electronic component in a state where the release film according to any one of claims 1 to 6 is in contact with at least a part of the surface of the electronic component, and the release film is the electron. A method of manufacturing an electronic component device including a process of peeling from a component.

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