JP2022084504A - Liquid discharge head - Google Patents

Liquid discharge head Download PDF

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Publication number
JP2022084504A
JP2022084504A JP2021050143A JP2021050143A JP2022084504A JP 2022084504 A JP2022084504 A JP 2022084504A JP 2021050143 A JP2021050143 A JP 2021050143A JP 2021050143 A JP2021050143 A JP 2021050143A JP 2022084504 A JP2022084504 A JP 2022084504A
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recording element
element substrate
adhesive
discharge head
liquid discharge
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JP2022084504A5 (en
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真吾 奥島
Shingo Okujima
友美 駒宮
Tomomi Komamiya
悟司 及川
Satoshi Oikawa
了 木村
Satoru Kimura
大知 谷口
Hirotomo Taniguchi
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Canon Inc
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Canon Inc
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Priority to US17/530,295 priority Critical patent/US11827020B2/en
Publication of JP2022084504A publication Critical patent/JP2022084504A/en
Publication of JP2022084504A5 publication Critical patent/JP2022084504A5/ja
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Abstract

To suppress occurrence of cracking of a recording element substrate.SOLUTION: A liquid discharge head comprises: a recording element substrate 2010 that discharges liquid; a support member 2030 that supports the recording element substrate 2010; an adhesion layer 4000 provided between the recording element substrate 2010 and the support member 2030; a terminal 16 provided at an end part 500 of the recording element substrate 2010; and a sealing member 110 that seals the end part 500 of the recording element substrate 2010 including the terminal 16. The sealing member 110 contacts a side surface of the end part 500 and an end face of the adhesion layer 4000. The adhesion layer 4000 has a first adhesion part 400 and a second adhesion part 401 positioned between the first adhesion part 400 and the sealing member 110. Rigidity of the second adhesion part 401 is smaller than respective rigidity of the sealing member 110 and of the first adhesion part 400.SELECTED DRAWING: Figure 2

Description

本発明は、インク等の液体を吐出する液体吐出ヘッドに関する。 The present invention relates to a liquid ejection head that ejects a liquid such as ink.

特許文献１には、吐出エネルギーを発生するエネルギー発生素子を備えた記録素子基板を有する液体吐出ヘッドが記載されている。記録素子基板は、支持部材に接着剤で固定されている。支持部材には、電気配線基板の端部が記録素子基板の端部に隣接するように固定されている。電気配線基板および記録素子基板のそれぞれの端部には電気接続部が設けられており、これら電気接続部がワイヤーボンディング等の電気接続部材によって電気的に接続されている。電気配線基板の電気接続部、記録素子基板の電気接続部および電気接続部材を含む部分全体が、樹脂等の封止部材で覆われている。
上記液体吐出ヘッドにおいては、より高い絶縁性を得るため、あるいは、液体侵入を防ぐために、より剛性の高い封止部材が用いられる。また、接着性を高めるために、より剛性の高い接着剤が用いられる。 Patent Document 1 describes a liquid discharge head having a recording element substrate including an energy generating element that generates discharge energy. The recording element substrate is fixed to the support member with an adhesive. The end portion of the electrical wiring board is fixed to the support member so as to be adjacent to the end portion of the recording element substrate. An electrical connection portion is provided at each end of the electrical wiring board and the recording element substrate, and these electrical connection portions are electrically connected by an electrical connection member such as wire bonding. The entire portion including the electrical connection portion of the electrical wiring board, the electrical connection portion of the recording element substrate, and the electrical connection member is covered with a sealing member such as resin.
In the liquid discharge head, a sealing member having higher rigidity is used in order to obtain higher insulating properties or to prevent liquid intrusion. Further, in order to improve the adhesiveness, a more rigid adhesive is used.

特開２０１７－２０５９０３号公報JP-A-2017-205903

しかしながら、特許文献１に記載の液体吐出ヘッドでは、剛性の高い封止部材や接着剤を用いると、記録素子基板と支持部材の熱膨張係数が異なるため、温度変化が生じた際に、封止部材と記録素子基板および支持部材との接触面に強い応力が生じる。その結果、支持部材に比較して機械的な強度が低い記録素子基板にクラックが発生する場合がある。 However, in the liquid discharge head described in Patent Document 1, if a highly rigid sealing member or adhesive is used, the coefficients of thermal expansion of the recording element substrate and the supporting member are different, so that the liquid discharge head is sealed when a temperature change occurs. A strong stress is generated on the contact surface between the member and the recording element substrate and the support member. As a result, cracks may occur in the recording element substrate, which has lower mechanical strength than the support member.

本発明は、上記クラックの発生を抑制することが可能な液体吐出ヘッドを提供することを目的とする。 An object of the present invention is to provide a liquid discharge head capable of suppressing the occurrence of the above cracks.

上記目的を達成するために、本発明の液体吐出ヘッドは、液体を吐出する記録素子基板と、上記記録素子基板を支持する支持部材と、上記記録素子基板と上記支持部材との間に設けられた接着層と、上記記録素子基板の端部に設けられた第１電気接続部と、上記第１電気接続部を含む上記記録素子基板の上記端部を覆う封止部材と、を有する。上記封止部材は、上記記録素子基板の上記端部の側面と上記接着層の端面に接している。上記接着層は、第１接着部と、該第１接着部と上記封止部材との間に位置する第２接着部と、を有する。上記第２接着部の剛性が、上記封止部材の剛性と上記第１接着部の剛性のいずれよりも小さい。 In order to achieve the above object, the liquid discharge head of the present invention is provided between the recording element substrate for discharging the liquid, the support member for supporting the recording element substrate, and the recording element substrate and the support member. It has an adhesive layer, a first electric connection portion provided at an end portion of the recording element substrate, and a sealing member covering the end portion of the recording element substrate including the first electric connection portion. The sealing member is in contact with the side surface of the end portion of the recording element substrate and the end surface of the adhesive layer. The adhesive layer has a first adhesive portion and a second adhesive portion located between the first adhesive portion and the sealing member. The rigidity of the second adhesive portion is smaller than either the rigidity of the sealing member or the rigidity of the first adhesive portion.

本発明によれば、記録素子基板のクラックの発生を抑制することができる。 According to the present invention, it is possible to suppress the occurrence of cracks in the recording element substrate.

本発明の一実施形態に係る液体吐出ヘッドの構成を示す断面図である。It is sectional drawing which shows the structure of the liquid discharge head which concerns on one Embodiment of this invention. 図１に示す液体吐出ヘッドの吐出モジュールの構成を示す斜視図である。It is a perspective view which shows the structure of the discharge module of the liquid discharge head shown in FIG. 比較例の接着構造を示す模式図である。It is a schematic diagram which shows the adhesive structure of the comparative example. 図２に示す液体吐出ヘッドと図３に示す比較例とのクラックの発生し易さを比較した結果を説明するための図である。It is a figure for demonstrating the result of having compared the tendency of crack occurrence between the liquid discharge head shown in FIG. 2 and the comparative example shown in FIG. 図２に示す液体吐出ヘッドの第１変形例を示す図である。It is a figure which shows the 1st modification of the liquid discharge head shown in FIG. 図２に示す液体吐出ヘッドの第２変形例を示す図である。It is a figure which shows the 2nd modification of the liquid discharge head shown in FIG. 図２に示す液体吐出ヘッドの第１接着部および第２接着部の配置形態例を説明するための図である。It is a figure for demonstrating the arrangement form example of the 1st adhesive part and the 2nd adhesive part of the liquid discharge head shown in FIG.

次に、添付の図面を参照して、本発明の実施の形態の詳細について説明する。なお、添付図面中、同一の機能を有する構成には同一の番号を付与し、その説明を省略することがある。また、実施の形態に記載されている構成要素はあくまで例示であり、本発明の範囲をそれらに限定する趣旨のものではない。 Next, the details of the embodiment of the present invention will be described with reference to the accompanying drawings. In the attached drawings, the same number may be assigned to the configurations having the same function, and the description thereof may be omitted. Further, the components described in the embodiments are merely examples, and the scope of the present invention is not intended to be limited thereto.

図１は、本発明の一実施形態に係る液体吐出ヘッドの構成を示す断面図である。
図１を参照すると、本実施形態の液体吐出ヘッドは、液体を吐出する液体吐出モジュール２２００を有する。液体吐出モジュール２２００は、液体を吐出する記録素子基板２０１０と、記録素子基板２０１０を支持する支持部材２０３０を有する。支持部材２０３０は、液体を記録素子基板２０１０に供給する連通口３１を有する。記録素子基板２０１０は、接着剤によって支持部材２０３０に固定されている。
液体吐出モジュール２２００は、第１流路部材２０５０および第２流路部材２０６０を積層した流路部材上に設けられている。第２流路部材２０６０は、共通供給流路２２１１および共通回収流路２２１２を有する。共通供給流路２２１１は、連通口６１、５３、５１を介して支持部材２０３０の液体連通口３１に連通している。液体は、共通供給流路２２１１から記録素子基板２０１０に供給される。記録素子基板２０１０に供給された液体の一部は、不図示の連通口を介して共通回収流路２２１２に回収される。 FIG. 1 is a cross-sectional view showing the configuration of a liquid discharge head according to an embodiment of the present invention.
Referring to FIG. 1, the liquid discharge head of the present embodiment has a liquid discharge module 2200 that discharges a liquid. The liquid discharge module 2200 has a recording element substrate 2010 for discharging liquid and a support member 2030 for supporting the recording element substrate 2010. The support member 2030 has a communication port 31 that supplies a liquid to the recording element substrate 2010. The recording element substrate 2010 is fixed to the support member 2030 with an adhesive.
The liquid discharge module 2200 is provided on the flow path member in which the first flow path member 2050 and the second flow path member 2060 are laminated. The second flow path member 2060 has a common supply flow path 2211 and a common recovery flow path 2212. The common supply flow path 2211 communicates with the liquid communication port 31 of the support member 2030 via the communication ports 61, 53, 51. The liquid is supplied to the recording element substrate 2010 from the common supply flow path 2211. A part of the liquid supplied to the recording element substrate 2010 is recovered in the common recovery flow path 2212 through a communication port (not shown).

図２は、吐出モジュール２２００の詳細な構成を説明するための図である。図２（ａ）は、記録素子基板２０１０と支持部材２０３０が接着された状態を示す模式図である。図２（ｂ）は、記録素子基板２０１０と支持部材２０３０を接着する接着層４０００を示す平面図である。図２（ｃ）は、図２（ｂ）の破線Ａ－Ａにおける断面図である。
図２（ａ）～図２（ｃ）を参照すると、液体吐出モジュール２２００は、記録素子基板２０１０と、２枚のフレキシブル配線基板４０と、支持部材２０３０と、接着層４０００と、封止部材１１０とを有する。記録素子基板２０１０は、液体を吐出する吐出口が形成された吐出面２０１０ａを備える。吐出口と対向する位置に、液体を吐出するためのエネルギーを発生する記録素子が形成されている。記録素子は、例えば、液体を熱エネルギーにより発泡させるための発熱素子である。記録素子基板２０１０として、例えばシリコン基板等を用いることができる。 FIG. 2 is a diagram for explaining a detailed configuration of the discharge module 2200. FIG. 2A is a schematic view showing a state in which the recording element substrate 2010 and the support member 2030 are adhered to each other. FIG. 2B is a plan view showing an adhesive layer 4000 for adhering the recording element substrate 2010 and the support member 2030. FIG. 2 (c) is a cross-sectional view taken along the broken line AA of FIG. 2 (b).
Referring to FIGS. 2A and 2C, the liquid discharge module 2200 includes a recording element substrate 2010, two flexible wiring boards 40, a support member 2030, an adhesive layer 4000, and a sealing member 110. And have. The recording element substrate 2010 includes a discharge surface 2010a on which a discharge port for discharging a liquid is formed. A recording element that generates energy for discharging a liquid is formed at a position facing the discharge port. The recording element is, for example, a heat generating element for foaming a liquid by heat energy. As the recording element substrate 2010, for example, a silicon substrate or the like can be used.

記録素子を駆動するための複数の端子１６が、記録素子基板２０１０の端部５００に設けられている。端子１６は、第１電気接続部の一例である。ここでは、端子１６は、記録素子基板２０１０の吐出口列方向の両端部（長辺部）に配置されている。
支持部材２０３０は、記録素子基板２０１０の吐出面２０１０ａとは反対側の面（裏面）２０１０ｂを支持する支持面２０３０ａを備える。接着層４０００は、記録素子基板２０１０と支持部材２０３０との間に設けられている。接着層４０００は、記録素子基板２０１０の裏面２０１０ｂと支持部材２０３０の支持面２０３０ａとを接着する。
封止部材１１０は、少なくとも端子１６を含む記録素子基板２０１０の端部５００を覆う。封止部材１１０は、記録素子基板２０１０の端部５００の側面と接着層４００の端面に接している。 A plurality of terminals 16 for driving the recording element are provided at the end portion 500 of the recording element substrate 2010. The terminal 16 is an example of the first electrical connection portion. Here, the terminals 16 are arranged at both ends (long sides) of the recording element substrate 2010 in the discharge port row direction.
The support member 2030 includes a support surface 2030a that supports a surface (back surface) 2010b on the side opposite to the discharge surface 2010a of the recording element substrate 2010. The adhesive layer 4000 is provided between the recording element substrate 2010 and the support member 2030. The adhesive layer 4000 adheres the back surface 2010b of the recording element substrate 2010 and the support surface 2030a of the support member 2030.
The sealing member 110 covers the end portion 500 of the recording element substrate 2010 including at least the terminal 16. The sealing member 110 is in contact with the side surface of the end portion 500 of the recording element substrate 2010 and the end surface of the adhesive layer 400.

フレキシブル配線基板４０は、配線基板の一例である。複数の端子４１が、フレキシブル配線基板４０の端部に形成されている。端子４１は、第２電気接続部の一例である。記録素子基板２０１０の端子１６とフレキシブル配線基板４０の端子４１とが電気接続部材４０２を介して電気的に接続されている。電気接続部材４０２は、例えばワイヤーボンディングである。
支持部材２０３０には、フレキシブル配線基板４０の端部が記録素子基板２０１０の端部５００に隣接するように固定されている。封止部材１１０は、電気接続部材４０２、フレキシブル配線基板４０の端部および記録素子基板２０１０の端部５００を覆う。封止部材１１０の剛性を高めることで、電気接続部材４０２、記録素子基板２０１０の端子１６およびフレキシブル配線基板４０の端子４１をより効果的に保護することができ、さらに液体による腐食からも保護することができる。封止部材１１０として、例えば、弾性率の大きな材料を用いることができる。ここで、弾性率は、変形のしにくさを表す物性値である。 The flexible wiring board 40 is an example of a wiring board. A plurality of terminals 41 are formed at the end of the flexible wiring board 40. The terminal 41 is an example of the second electrical connection portion. The terminal 16 of the recording element substrate 2010 and the terminal 41 of the flexible wiring board 40 are electrically connected via the electrical connection member 402. The electrical connection member 402 is, for example, wire bonding.
The end portion of the flexible wiring board 40 is fixed to the support member 2030 so as to be adjacent to the end portion 500 of the recording element substrate 2010. The sealing member 110 covers the electrical connection member 402, the end portion of the flexible wiring board 40, and the end portion 500 of the recording element substrate 2010. By increasing the rigidity of the sealing member 110, the electrical connection member 402, the terminal 16 of the recording element substrate 2010, and the terminal 41 of the flexible wiring board 40 can be more effectively protected, and further protected from corrosion by liquid. be able to. As the sealing member 110, for example, a material having a large elastic modulus can be used. Here, the elastic modulus is a physical property value representing the difficulty of deformation.

接着層４０００は、第１接着剤からなる第１接着部４００と、第２接着剤からなる第２接着部４０１と、を有する。第２接着部４０１は、第１接着部４００と封止部材１１０との間に位置する。第２接着部４０１と封止部材１１０との接触面は、記録素子基板２０１０の端部５００の側面に対して面一になるように設けられている。
記録素子基板２０１０と支持部材２０３０とを強固に接着し、かつ、液体の漏れを防止するために、第１接着剤として、強い接着力を有する高強度接着剤を用いる。第１接着部４００は第２接着部４０１よりも支持部材２０３０の液体連通口３１の開口縁部の近くに位置している。高強度接着剤で構成された第１接着部４００の剛性は高い。第２接着部４０１の剛性は、封止部材１１０の剛性と第１接着部４００の剛性のいずれよりも小さい。 The adhesive layer 4000 has a first adhesive portion 400 made of a first adhesive and a second adhesive portion 401 made of a second adhesive. The second adhesive portion 401 is located between the first adhesive portion 400 and the sealing member 110. The contact surface between the second adhesive portion 401 and the sealing member 110 is provided so as to be flush with the side surface of the end portion 500 of the recording element substrate 2010.
In order to firmly bond the recording element substrate 2010 and the support member 2030 and prevent liquid leakage, a high-strength adhesive having a strong adhesive force is used as the first adhesive. The first adhesive portion 400 is located closer to the opening edge of the liquid communication port 31 of the support member 2030 than the second adhesive portion 401. The rigidity of the first adhesive portion 400 made of a high-strength adhesive is high. The rigidity of the second adhesive portion 401 is smaller than either the rigidity of the sealing member 110 or the rigidity of the first adhesive portion 400.

具体的には、第２接着部４０１の弾性率は、第１接着部４００の弾性率および封止部材１１０の弾性率のいずれよりも小さい。例えば、第２接着部４０１の弾性率は、第１接着部４００または封止部材１１０の弾性率の３分の１以下である。望ましくは、第１接着部４００および封止部材１１０の弾性率は１０GPa以上であり、第２接着部４０１の弾性率は１０GPa未満である。例えば、第１接着部４００、第２接着部４０１および封止部材１１０には、接着性の良いアニオン硬化系エポキシ樹脂を用いることができる。望ましくは、第１接着部４００と封止部材１１０には、より剛性の高い樹脂、例えば、シリカフィラー50%以上の無水酸化物硬化系エポキシ樹脂を用いることができる。第２接着部４０１には、アミン系エポキシ樹脂を用いることができる。 Specifically, the elastic modulus of the second adhesive portion 401 is smaller than either the elastic modulus of the first adhesive portion 400 or the elastic modulus of the sealing member 110. For example, the elastic modulus of the second adhesive portion 401 is one-third or less of the elastic modulus of the first adhesive portion 400 or the sealing member 110. Desirably, the elastic modulus of the first adhesive portion 400 and the sealing member 110 is 10 GPa or more, and the elastic modulus of the second adhesive portion 401 is less than 10 GPa. For example, an anion-curing epoxy resin having good adhesiveness can be used for the first adhesive portion 400, the second adhesive portion 401, and the sealing member 110. Desirably, a resin having higher rigidity, for example, an anhydrous oxide curable epoxy resin having a silica filler of 50% or more can be used for the first adhesive portion 400 and the sealing member 110. An amine-based epoxy resin can be used for the second adhesive portion 401.

上述した吐出モジュール２２００は、次のような手順で作製される。まず、記録素子基板２０１０およびフレキシブル配線基板４０を互いの端部が隣接するように支持部材２０３０上に接着する。次に、記録素子基板２０１０の端子１６と、フレキシブル配線基板４０の端子４１とを電気接続部材４０２によって電気的に接続する。その後、端子１６、４１および電気接続部４０２を含む部分全体を封止部材１１０で覆って封止する。
なお、支持部材２０３０は、記録素子基板２０１０を支持する支持体であるとともに、液体を記録素子基板２０１０に供給し、一部の液体を回収する流路部材でもある。このため、支持部材２０３０の材質は、平面度が高く、また十分に高い信頼性をもって記録素子基板２０１０と接合できるものが好ましい。支持部材２０３０の材質としては、例えばアルミナ（酸化アルミニウム）や樹脂材料が好ましい。 The discharge module 2200 described above is manufactured by the following procedure. First, the recording element substrate 2010 and the flexible wiring board 40 are adhered onto the support member 2030 so that their ends are adjacent to each other. Next, the terminal 16 of the recording element substrate 2010 and the terminal 41 of the flexible wiring board 40 are electrically connected by the electrical connection member 402. After that, the entire portion including the terminals 16 and 41 and the electrical connection portion 402 is covered with the sealing member 110 and sealed.
The support member 2030 is a support that supports the recording element substrate 2010, and is also a flow path member that supplies liquid to the recording element substrate 2010 and recovers a part of the liquid. Therefore, the material of the support member 2030 is preferably one that has high flatness and can be joined to the recording element substrate 2010 with sufficiently high reliability. As the material of the support member 2030, for example, alumina (aluminum oxide) or a resin material is preferable.

次に、本実施形態の液体吐出ヘッドの効果について、比較例を挙げて説明する。
図３（ａ）は、第１比較例の接着構造を示す模式図である。第１比較例の接着構造では、第２接着部４０１が無く、第１接着部４００のみで記録素子基板２０１０と支持部材２０３０とを接着する。第１接着部４００は、封止部材１１０に接している。第１接着部４００の封止部材１１０側の端面は、記録素子基板２０１０の端部の側面に対して面一になるように設けられている。封止部材１１０の弾性率および第１接着部４００の弾性率はいずれも高い。
図３（ｂ）は、第２比較例の接着構造を示す模式図である。第２比較例の接着構造は、第１比較例の接着構造に補助接着部４０３を加えたものである。補助接着部４０３は、第１接着部４００の端面と記録素子基板２０１０の端部の側面の一部を覆う。補助接着部４０３の弾性率は、封止部材１１０の弾性率および第１接着部４００の弾性率のいずれよりも小さい。 Next, the effect of the liquid discharge head of the present embodiment will be described with reference to comparative examples.
FIG. 3A is a schematic diagram showing the adhesive structure of the first comparative example. In the adhesive structure of the first comparative example, the recording element substrate 2010 and the support member 2030 are adhered only by the first adhesive portion 400 without the second adhesive portion 401. The first adhesive portion 400 is in contact with the sealing member 110. The end surface of the first adhesive portion 400 on the sealing member 110 side is provided so as to be flush with the side surface of the end portion of the recording element substrate 2010. Both the elastic modulus of the sealing member 110 and the elastic modulus of the first adhesive portion 400 are high.
FIG. 3B is a schematic view showing the adhesive structure of the second comparative example. The adhesive structure of the second comparative example is obtained by adding the auxiliary adhesive portion 403 to the adhesive structure of the first comparative example. The auxiliary adhesive portion 403 covers a part of the end surface of the first adhesive portion 400 and the side surface of the end portion of the recording element substrate 2010. The elastic modulus of the auxiliary adhesive portion 403 is smaller than either the elastic modulus of the sealing member 110 or the elastic modulus of the first adhesive portion 400.

第１比較例および第２比較例では、弾性率が高い封止部材１１０を用いた場合に、以下のような問題を生じる。
記録素子基板２０１０の熱膨張係数が支持部材２０３０の熱膨張係数と異なる。このため、記録素子基板２０１０と支持部材２０３０に温度変化が生じた際に、封止部材１１０と記録素子基板２０１０との接触面や封止部材１１０と支持部材２０３０との接触面に強い応力が生じる。その結果、支持部材２０３０に比較して機械的な強度が低い記録素子基板２０１０にクラックが生じ易い。例えば、記録素子基板２０１０がシリコン基板からなる場合に、記録素子基板２０１０の端部のエッジ部分にクラックが生じ易い。ここで、熱膨張係数は、温度上昇によって物体の長さや体積が膨張する割合を温度当たりで示したものである。
加えて、記録素子基板２０１０と支持部材２０３０とを接着する第１接着部４００の弾性率が小さい場合は、上記温度変化が生じた際に、支持部材２０３０に対して記録素子基板２０１０が大きく動く。その結果、封止部材１１０と記録素子基板２０１０および支持部材２０３０との接触面に強い応力が生じる。 In the first comparative example and the second comparative example, the following problems occur when the sealing member 110 having a high elastic modulus is used.
The coefficient of thermal expansion of the recording element substrate 2010 is different from the coefficient of thermal expansion of the support member 2030. Therefore, when the temperature changes between the recording element substrate 2010 and the support member 2030, strong stress is applied to the contact surface between the sealing member 110 and the recording element substrate 2010 and the contact surface between the sealing member 110 and the support member 2030. Occurs. As a result, cracks are likely to occur in the recording element substrate 2010, which has lower mechanical strength than the support member 2030. For example, when the recording element substrate 2010 is made of a silicon substrate, cracks are likely to occur at the edge portion of the end portion of the recording element substrate 2010. Here, the coefficient of thermal expansion indicates the rate at which the length or volume of an object expands due to a temperature rise per temperature.
In addition, when the elastic modulus of the first adhesive portion 400 that adheres the recording element substrate 2010 and the support member 2030 is small, the recording element substrate 2010 moves significantly with respect to the support member 2030 when the temperature change occurs. .. As a result, strong stress is generated on the contact surfaces between the sealing member 110 and the recording element substrate 2010 and the support member 2030.

また、第１比較例の接着構造において、第１接着部４００の弾性率が高い場合は、記録素子基板２０１０の端部（エッジ部分を含む）全体を剛性の高い材料（第１接着部４００および封止部材１１０）で覆うことになる。その結果、上記温度変化が生じた際に、記録素子基板２０１０と支持部材２０３０との熱膨張係数の違いにより、記録素子基板２０１０の端部のエッジ部分に強い応力が生じる。 Further, in the adhesive structure of the first comparative example, when the elastic modulus of the first adhesive portion 400 is high, the entire end portion (including the edge portion) of the recording element substrate 2010 is made of a highly rigid material (first adhesive portion 400 and the first adhesive portion 400 and). It will be covered with a sealing member 110). As a result, when the temperature change occurs, a strong stress is generated at the edge portion of the end portion of the recording element substrate 2010 due to the difference in the coefficient of thermal expansion between the recording element substrate 2010 and the support member 2030.

一方、第２比較例の接着構造では、補助接着部４０３が部分的に緩衝材のような機能を果たすため、第１接着部４００の弾性率が高い場合でも、記録素子基板２０１０の端部全体が剛性の高い材料で覆われることはない。しかし、最も応力が掛かりやすい記録素子基板２０１０の端部の支持部材２０３０側のエッジ部は、弾性率が高い第１接着部４００で支持部材２０３０に固定されている。その結果、エッジ部に強い応力が生じる。
加えて、封止部材１１０は、電気接続部材４０２、記録素子基板２０１０の端子１６、フレキシブル配線基板４０の端子４１を機械的に保護し、さらに液体による腐食から保護する。この封止構造において、補助接着部４０３が露出することは好ましくない。そのため、第２比較例の接着構造でも、封止部材１１０が補助接着部４０３を覆い、記録素子基板２０１０と支持部材２０３０を強固に固定する。このように封止部材１１０で固定された記録素子基板２０１０の端部のエッジ部分には、上記温度変化が生じた際に、記録素子基板２０１０と支持部材２０３０との熱膨張係数の違いによる強い応力が生じる。 On the other hand, in the adhesive structure of the second comparative example, since the auxiliary adhesive portion 403 partially functions as a cushioning material, even when the elastic modulus of the first adhesive portion 400 is high, the entire end portion of the recording element substrate 2010 is used. Is not covered with a rigid material. However, the edge portion on the support member 2030 side of the end portion of the recording element substrate 2010 where stress is most likely to be applied is fixed to the support member 2030 by the first adhesive portion 400 having a high elastic modulus. As a result, strong stress is generated at the edge portion.
In addition, the sealing member 110 mechanically protects the electrical connection member 402, the terminal 16 of the recording element substrate 2010, and the terminal 41 of the flexible wiring board 40, and further protects them from corrosion due to liquid. In this sealing structure, it is not preferable that the auxiliary adhesive portion 403 is exposed. Therefore, even in the adhesive structure of the second comparative example, the sealing member 110 covers the auxiliary adhesive portion 403 and firmly fixes the recording element substrate 2010 and the support member 2030. When the temperature change occurs, the edge portion of the end portion of the recording element substrate 2010 fixed by the sealing member 110 is strong due to the difference in the coefficient of thermal expansion between the recording element substrate 2010 and the support member 2030. Stress is generated.

第１比較例や第２比較例の他にも、封止部材１１０と支持部材２０３０との間に空間が形成された構成が考え得る。しかし、補助接着部４０３の場合と同様に、電気的な観点から封止部材１１０で空間を覆うことが必要であり、そのような構成を形成することは困難である。 In addition to the first comparative example and the second comparative example, a configuration in which a space is formed between the sealing member 110 and the support member 2030 can be considered. However, as in the case of the auxiliary adhesive portion 403, it is necessary to cover the space with the sealing member 110 from the electrical viewpoint, and it is difficult to form such a configuration.

第１比較例や第２比較例に対して、本実施形態の液体吐出ヘッドによれば、最も応力が掛かりやすい記録素子基板２０１０の端部５００の支持部材２０３０側のエッジ部分は、弾性率が低い第２接着部４０１を介して支持部材２０３０に接着されている。そのため、記録素子基板２０１０の端部５００は、支持部材２０３０に対して動き易い。よって、記録素子基板２０１０と支持部材２０３０に温度変化が生じた際に、記録素子基板２０１０と支持部材２０３０との熱膨張係数の違いによりエッジ部分に生じる応力を低減することが可能である。 According to the liquid discharge head of the present embodiment, the elastic modulus of the edge portion of the end portion 500 of the recording element substrate 2010 on the support member 2030 side, which is most likely to be stressed, is higher than that of the first comparative example and the second comparative example. It is adhered to the support member 2030 via the lower second adhesive portion 401. Therefore, the end portion 500 of the recording element substrate 2010 is easy to move with respect to the support member 2030. Therefore, when the temperature changes between the recording element substrate 2010 and the support member 2030, it is possible to reduce the stress generated at the edge portion due to the difference in the coefficient of thermal expansion between the recording element substrate 2010 and the support member 2030.

図４は、本実施形態の液体吐出ヘッドと第１比較例および第２比較例とのクラックの発生し易さを比較した結果を示す。図４（ａ）は実験に用いた接着剤および封止部材の種類を示し、図４（ｂ）は実験結果を示す。
図４（ａ）に示すように、本実施形態の液体吐出ヘッドにおいて、封止部材１１０と第１接着部４００には、フィラー充填率の高い酸無水物硬化系エポキシ樹脂を用い、第２接着部４０１には、アミン系エポキシ樹脂を用いた。第１比較例において、封止部材１１０と第１接着部４００には、フィラー充填率の高い酸無水物硬化系エポキシ樹脂を用いた。第２比較例において、封止部材１１０と第１接着部４００には、フィラー充填率の高い酸無水物硬化系エポキシ樹脂を用い、補助接着部４０３には、アミン系エポキシ樹脂を用いた。第１接着部４００、第２接着部４０１、封止部材１１０および補助接着部４０３それぞれの主要な物性は、図４（ａ）に示す通りである。 FIG. 4 shows the results of comparing the susceptibility to cracks between the liquid discharge head of the present embodiment and the first comparative example and the second comparative example. FIG. 4A shows the types of adhesive and sealing member used in the experiment, and FIG. 4B shows the experimental results.
As shown in FIG. 4A, in the liquid discharge head of the present embodiment, an acid anhydride-curable epoxy resin having a high filler filling rate is used for the sealing member 110 and the first adhesive portion 400 for the second adhesion. An amine-based epoxy resin was used for part 401. In the first comparative example, an acid anhydride-curable epoxy resin having a high filler filling rate was used for the sealing member 110 and the first adhesive portion 400. In the second comparative example, an acid anhydride-curable epoxy resin having a high filler filling rate was used for the sealing member 110 and the first adhesive portion 400, and an amine-based epoxy resin was used for the auxiliary adhesive portion 403. The main physical characteristics of each of the first adhesive portion 400, the second adhesive portion 401, the sealing member 110, and the auxiliary adhesive portion 403 are as shown in FIG. 4A.

図４（ａ）に示した条件で、本実施形態の液体吐出ヘッド、第１比較例および第２比較例のそれぞれについて、熱衝撃試験を実施した。熱衝撃試験の条件は、マイナス７０℃の中に３０分、プラス１３０℃の中に３０分ずつ投入するサイクル試験とした。その結果、図４（ｂ）に示すように、第１比較例と第２比較例はそれぞれ５０サイクルと６０サイクルで全てのサンプルにクラックが生じた。これに対して、本実施形態の液体吐出ヘッドでは、１００サイクルでも全てのサンプルにクラックは生じなかった。 Under the conditions shown in FIG. 4A, a thermal shock test was carried out for each of the liquid discharge head, the first comparative example and the second comparative example of the present embodiment. The conditions for the thermal shock test were a cycle test in which the temperature was ▲ 70 ° C. for 30 minutes and the temperature was plus 130 ° C. for 30 minutes each. As a result, as shown in FIG. 4B, cracks were generated in all the samples in the first comparative example and the second comparative example in 50 cycles and 60 cycles, respectively. On the other hand, in the liquid discharge head of the present embodiment, no cracks occurred in all the samples even after 100 cycles.

以上のように、本実施形態の液体吐出ヘッドにおいては、記録素子基板２０１０と支持部材２０３０との間に配置された接着層４０００が、第１接着部４００と第２接着部４０１とを有する。第２接着部４０１は、第１接着部４００よりも封止部材１１０の側に設けられている。第２接着部４０１の剛性（または弾性率）は、第１接着部４００および封止部材１１０のそれぞれの剛性（または弾性率）よりも小さい。このような構造により、記録素子基板２０１０の端部５００に生じる応力を低減することができ、記録素子基板２０１０にクラックが発生することを抑制することが可能となる。 As described above, in the liquid discharge head of the present embodiment, the adhesive layer 4000 arranged between the recording element substrate 2010 and the support member 2030 has the first adhesive portion 400 and the second adhesive portion 401. The second adhesive portion 401 is provided on the side of the sealing member 110 with respect to the first adhesive portion 400. The rigidity (or elastic modulus) of the second adhesive portion 401 is smaller than the rigidity (or elastic modulus) of the first adhesive portion 400 and the sealing member 110, respectively. With such a structure, it is possible to reduce the stress generated in the end portion 500 of the recording element substrate 2010, and it is possible to suppress the generation of cracks in the recording element substrate 2010.

本実施形態の液体吐出ヘッドにおいて、以下のような変形を加えることが可能である。
図５は、本実施形態の液体吐出ヘッドの第１変形例を示す図である。第２接着部４０１は、記録素子基板２０１０の端面よりも封止部材１１０側に張出した張出し部４０１ａを備える。張出し部４０１ａは、記録素子基板２０１０の端面の一部を覆う。このような張出し部４０１ａを備えることで、最も応力が掛かりやすい記録素子基板２０１０の端部の支持部材２０３０側のエッジ部分を弾性率が低い第２接着部４０１で確実に覆うことができる。よって、記録素子基板２０１０と支持部材２０３０との熱膨張係数の違いによってエッジ部分に生じる応力を低減することができ、記録素子基板２０１０にクラックが発生することをさらに抑制することが可能となる。 The liquid discharge head of the present embodiment can be modified as follows.
FIG. 5 is a diagram showing a first modification of the liquid discharge head of the present embodiment. The second adhesive portion 401 includes an overhanging portion 401a that overhangs the sealing member 110 side from the end surface of the recording element substrate 2010. The overhanging portion 401a covers a part of the end face of the recording element substrate 2010. By providing such an overhanging portion 401a, the edge portion on the support member 2030 side of the end portion of the recording element substrate 2010 where stress is most likely to be applied can be reliably covered with the second adhesive portion 401 having a low elastic modulus. Therefore, it is possible to reduce the stress generated at the edge portion due to the difference in the coefficient of thermal expansion between the recording element substrate 2010 and the support member 2030, and it is possible to further suppress the occurrence of cracks in the recording element substrate 2010.

図６は、本実施形態の液体吐出ヘッドの第２変形例を示す図である。図６（ａ）は、記録素子基板２０１０と支持部材２０３０を接着する接着層４０００を示す平面図である。図６（ｂ）は、図６（ａ）の破線Ｂ－Ｂにおける断面図である。
図６（ａ）および図６（ｂ）に示すように、支持部材２０３０の支持面２０３０ａに、液体を記録素子基板２０１０に供給する複数の液体供給口３１を備える。第１接着部４００および第２接着部４０１は、液体供給口３１を囲むように形成されている。このように、第１接着部４００および第２接着部４０１が液体供給口３１を囲む構造によれば、記録素子基板２０１０を支持部材２０３０の支持面２０３０ａに確実に接着することができる。
また、第２接着部４０１は、記録素子基板２０１０の端部に沿って延在している。第１接着部４００は、複数の帯状の接着部４００ａを有する。各帯状の接着部４００ａは、第２接着部４０１の長手方向と交差する方向に延在する。液体供給口３１は複数個設けられている。帯状の接着部４００ａと液体供給口３１とが交互に配置されている。この構造によれば、応力の掛かり易い記録素子基板２０１０の端部に沿った方向に弾性率の高い第１接着部４００を複数の帯状の接着部４００ａに分離する。この分離により、記録素子基板２０１０と支持部材２０３０との熱膨張係数の違いによってエッジ部分に生じる応力をさらに低減することができる。 FIG. 6 is a diagram showing a second modification of the liquid discharge head of the present embodiment. FIG. 6A is a plan view showing an adhesive layer 4000 for adhering the recording element substrate 2010 and the support member 2030. 6 (b) is a cross-sectional view taken along the broken line BB of FIG. 6 (a).
As shown in FIGS. 6A and 6B, the support surface 2030a of the support member 2030 is provided with a plurality of liquid supply ports 31 for supplying liquid to the recording element substrate 2010. The first adhesive portion 400 and the second adhesive portion 401 are formed so as to surround the liquid supply port 31. As described above, according to the structure in which the first adhesive portion 400 and the second adhesive portion 401 surround the liquid supply port 31, the recording element substrate 2010 can be reliably adhered to the support surface 2030a of the support member 2030.
Further, the second adhesive portion 401 extends along the end portion of the recording element substrate 2010. The first adhesive portion 400 has a plurality of strip-shaped adhesive portions 400a. Each band-shaped adhesive portion 400a extends in a direction intersecting the longitudinal direction of the second adhesive portion 401. A plurality of liquid supply ports 31 are provided. The band-shaped adhesive portions 400a and the liquid supply port 31 are alternately arranged. According to this structure, the first adhesive portion 400 having a high elastic modulus is separated into a plurality of strip-shaped adhesive portions 400a in the direction along the end portion of the recording element substrate 2010 where stress is easily applied. By this separation, the stress generated in the edge portion due to the difference in the coefficient of thermal expansion between the recording element substrate 2010 and the support member 2030 can be further reduced.

第２変形例の液体吐出ヘッドについて、前述した熱衝撃試験と同様の試験を実施した。帯状の接着部４００ａに分離していない構造のサンプルでは、１２０サイクルからクラックが生じることがあった。これに対して、帯状の接着部４００ａに分離した構造のサンプルでは、２００サイクルでもクラックは生じなかった。
なお、必ずしも全域に渡って封止部材１１０と第１接着部４００の間に第２接着部４０１が設けられている必要はない。一部の帯状の接着部４００ａが封止部材１１０まで第２接着部４０１を超えて飛び出していても良い。この場合も、第１接着部４００を複数の帯状の接着部４００ａに分離したことで、応力が分散されるため、クラックの発生を抑制することができる。 The same test as the above-mentioned thermal shock test was carried out for the liquid discharge head of the second modification. In the sample having a structure not separated into the band-shaped adhesive portion 400a, cracks may occur from 120 cycles. On the other hand, in the sample having the structure separated into the band-shaped adhesive portion 400a, no crack occurred even after 200 cycles.
It should be noted that the second adhesive portion 401 does not necessarily have to be provided between the sealing member 110 and the first adhesive portion 400 over the entire area. A part of the band-shaped adhesive portion 400a may protrude to the sealing member 110 beyond the second adhesive portion 401. Also in this case, since the stress is dispersed by separating the first adhesive portion 400 into the plurality of strip-shaped adhesive portions 400a, the generation of cracks can be suppressed.

また、第２変形例の液体吐出ヘッドによれば、支持部材２０３０の液体供給路３１および記録素子基板２０１０の供給路１８と封止部材１１０との間において、第１接着部４００を帯状の接着部４００ａに分離したことで、以下の効果も奏する。
図２に示した接着層４０００の形状では、記録素子基板２０１０と支持部材２０３０を接着するときに、第１接着部４００と第２接着部４０１との間に気泡を巻き込む場合がある。接着剤を硬化キュアする際に、この気泡が膨張して接着層４０００内に空隙が生じると、液体流路から液体が漏れてしまうことがある。これに対して、第２変形例によれば、第１接着部４００を帯状の接着部４００ａに分離することで、記録素子基板２０１０と支持部材２０３０を接着する際の気泡の巻き込みを低減することができる。その結果、液体流路からの液体漏れを抑制することが可能となる。 Further, according to the liquid discharge head of the second modification, the first adhesive portion 400 is bonded in a band shape between the liquid supply path 31 of the support member 2030 and the supply path 18 of the recording element substrate 2010 and the sealing member 110. By separating into the parts 400a, the following effects are also obtained.
In the shape of the adhesive layer 4000 shown in FIG. 2, when the recording element substrate 2010 and the support member 2030 are adhered, air bubbles may be caught between the first adhesive portion 400 and the second adhesive portion 401. When the adhesive is cured and cured, if the bubbles expand to form voids in the adhesive layer 4000, the liquid may leak from the liquid flow path. On the other hand, according to the second modification, by separating the first adhesive portion 400 into the band-shaped adhesive portion 400a, the entrainment of air bubbles when adhering the recording element substrate 2010 and the support member 2030 is reduced. Can be done. As a result, it becomes possible to suppress liquid leakage from the liquid flow path.

第１接着部４００および第２接着部４０１は上述した配置形態に限定されない。クラックの発生を抑制することができるのであれば、第１接着部４００および第２接着部４０１はどのような配置形態にしても良い。以下に、第１接着部４００および第２接着部が液体供給口３１を囲む構造のいくつかの形態を説明する。
図７は、第１接着部４００および第２接着部４０１の配置形態例を説明するための図である。図７（ａ）には、外形が長方形で、両端部に端子１６を備えた記録素子基板２０１０を支持部材２０３０に接着する接着層４０００の例が示されている。支持部材２０３０は、液体を記録素子基板２０１０に供給する複数の液体供給口３１を備える。第１接着部４００および第２接着部４０１は、液体供給口３１を囲むように形成されている。第２接着部４０１は、記録素子基板２０１０の端部に沿って延在している。各液体供給口３１は、第２接着部４０１の長手方向と交差する方向に延在している。第１接着部４００は複数の帯状の接着部４００ａからなる。各帯状の接着部４００ａは、第２接着部４０１の長手方向と交差する方向に延在している。帯状の接着部４００ａと液体供給口３１とは交互に配置されている。 The first adhesive portion 400 and the second adhesive portion 401 are not limited to the above-mentioned arrangement form. The first adhesive portion 400 and the second adhesive portion 401 may be arranged in any form as long as the generation of cracks can be suppressed. Hereinafter, some forms of the structure in which the first adhesive portion 400 and the second adhesive portion surround the liquid supply port 31 will be described.
FIG. 7 is a diagram for explaining an example of arrangement of the first adhesive portion 400 and the second adhesive portion 401. FIG. 7A shows an example of an adhesive layer 4000 in which a recording element substrate 2010 having a rectangular outer shape and having terminals 16 at both ends is adhered to a support member 2030. The support member 2030 includes a plurality of liquid supply ports 31 that supply the liquid to the recording element substrate 2010. The first adhesive portion 400 and the second adhesive portion 401 are formed so as to surround the liquid supply port 31. The second adhesive portion 401 extends along the end portion of the recording element substrate 2010. Each liquid supply port 31 extends in a direction intersecting the longitudinal direction of the second adhesive portion 401. The first adhesive portion 400 is composed of a plurality of strip-shaped adhesive portions 400a. Each band-shaped adhesive portion 400a extends in a direction intersecting the longitudinal direction of the second adhesive portion 401. The band-shaped adhesive portions 400a and the liquid supply port 31 are arranged alternately.

図７（ｂ）には、外形が長方形で、一方の端部に端子１６を備えた記録素子基板２０１０を支持部材２０３０に接着する接着層４０００の例が示されている。第２接着部４０１は、記録素子基板２０１０の端部に沿って延在している。各液体供給口３１は、第２接着部４０１の長手方向と平行な方向に延在している。第１接着部４００は、第２接着部４０１の長手方向と交差する方向に延在する２つの帯状の接着部４００ａと、これら帯状の接着部４００ａの間に設けられた、第２接着部４０１の長手方向と平行な方向に延在する複数の帯状の接着部４００ｂを有する。各帯状の接着部４００ａの一端は第２接着部４０１に接続されている。帯状の接着部４００ｂと液体供給口３１とは交互に配置されている。各帯状の接着部４００ｂの一端は一方の帯状の接着部４００ａに接続され、他端はもう一方の帯状の接着部４００ａに接続されている。 FIG. 7B shows an example of an adhesive layer 4000 for adhering a recording element substrate 2010 having a rectangular outer shape and having a terminal 16 at one end to a support member 2030. The second adhesive portion 401 extends along the end portion of the recording element substrate 2010. Each liquid supply port 31 extends in a direction parallel to the longitudinal direction of the second adhesive portion 401. The first adhesive portion 400 is provided between two strip-shaped adhesive portions 400a extending in a direction intersecting the longitudinal direction of the second adhesive portion 401 and the second adhesive portion 401. It has a plurality of strip-shaped adhesive portions 400b extending in a direction parallel to the longitudinal direction of the. One end of each band-shaped adhesive portion 400a is connected to the second adhesive portion 401. The band-shaped adhesive portions 400b and the liquid supply port 31 are arranged alternately. One end of each strip-shaped adhesive portion 400b is connected to one strip-shaped adhesive portion 400a, and the other end is connected to the other strip-shaped adhesive portion 400a.

図７（ｃ）には、外形が平行四辺形で、一方の端部に端子１６を備えた記録素子基板２０１０を支持部材２０３０に接着する接着層４０００の例が示されている。ここで平行四辺形は、鈍角および鋭角を含む。支持部材２０３０には、液体を記録素子基板２０１０に供給する複数の液体供給口３１が千鳥状に配置されている。第１接着部４００および第２接着部４０１は、液体供給口３１を囲むように形成されている。第１接着部４００の第２接着部４０１との接続部分は、複数の帯状の接着部４００ａからなる。 FIG. 7C shows an example of an adhesive layer 4000 having a parallelogram in outer shape and adhering a recording element substrate 2010 having a terminal 16 at one end to a support member 2030. Here the parallelogram includes obtuse and acute angles. In the support member 2030, a plurality of liquid supply ports 31 for supplying liquid to the recording element substrate 2010 are arranged in a staggered manner. The first adhesive portion 400 and the second adhesive portion 401 are formed so as to surround the liquid supply port 31. The connection portion of the first adhesive portion 400 with the second adhesive portion 401 is composed of a plurality of strip-shaped adhesive portions 400a.

以上説明した本発明の液体吐出ヘッドは、以下のような場合に適用することがより好ましい。
記録素子基板２０１０の外形が鈍角および鋭角を含む平行四辺形である場合、記録素子基板２０１０と支持部材２０３０の熱膨張係数の違いにより、支持部材２０３０に対して記録素子基板２０１０は接合面に平行に回転するように変形しようとする。そのため、記録素子基板２０１０の鋭角近傍の端部のエッジ部分には、より強い応力が生じることになり、記録素子基板２０１０のクラックが生じ易くなる。このような場合に、本発明の液体吐出ヘッドを適用することで、記録素子基板２０１０のクラック発生を抑制することが可能となる。 The liquid discharge head of the present invention described above is more preferably applied in the following cases.
When the outer shape of the recording element substrate 2010 is a parallelogram including obtuse and acute angles, the recording element substrate 2010 is parallel to the joint surface with respect to the support member 2030 due to the difference in the coefficient of thermal expansion between the recording element substrate 2010 and the support member 2030. Attempts to transform to rotate. Therefore, stronger stress is generated at the edge portion of the end portion near the acute angle of the recording element substrate 2010, and cracks of the recording element substrate 2010 are likely to occur. In such a case, by applying the liquid discharge head of the present invention, it is possible to suppress the occurrence of cracks in the recording element substrate 2010.

また、端子１６が記録素子基板２０１０の両端部に形成されている場合、高弾性率の封止部材１１０によって記録素子基板２０１０の両端部が支持部材２０３０に固定される。そのため、記録素子基板２０１０の鋭角近傍の端部のエッジ部分には、より強い応力が生じることとなり、記録素子基板２０１０のクラックが生じ易くなる。このような場合に、本発明の液体吐出ヘッドを適用することで、記録素子基板２０１０のクラック発生を抑制することが可能となる。 When the terminals 16 are formed at both ends of the recording element substrate 2010, both ends of the recording element substrate 2010 are fixed to the support member 2030 by the sealing member 110 having a high elastic modulus. Therefore, a stronger stress is generated at the edge portion of the end portion near the acute angle of the recording element substrate 2010, and cracks of the recording element substrate 2010 are likely to occur. In such a case, by applying the liquid discharge head of the present invention, it is possible to suppress the occurrence of cracks in the recording element substrate 2010.

さらに、液体吐出ヘッドが高品位の吐出をするために記録素子基板２０１０を温調制御する構成において、記録素子基板２０１０および支持部材２０３０には大きな熱変化が繰り返し加わる。その結果、記録素子基板２０１０のクラックが生じ易くなる。このような場合にも、本発明の液体吐出ヘッドを適用することで、記録素子基板２０１０のクラック発生を抑制することが可能となる。 Further, in the configuration in which the temperature control of the recording element substrate 2010 is controlled so that the liquid ejection head discharges high quality, a large thermal change is repeatedly applied to the recording element substrate 2010 and the support member 2030. As a result, cracks in the recording element substrate 2010 are likely to occur. Even in such a case, by applying the liquid discharge head of the present invention, it is possible to suppress the occurrence of cracks in the recording element substrate 2010.

さらに、電気接続部材４０２、端子１６および端子４１の機械的な保護や液体による腐食からの保護のために、封止部材１１０を硬化する際のキュア温度をより高温にすることが好ましい。例えば、キュア温度を１５０℃以上にすることが好ましい。しかし、キュア温度を高温にすると、キュア温度で硬化した封止部材１１０が常温に戻った際の熱応力がより大きくなり、記録素子基板２０１０のクラックが生じ易くなる。このような場合にも、本発明の液体吐出ヘッドを適用することで、記録素子基板２０１０のクラック発生を抑制することが可能となる。 Further, for mechanical protection of the electrical connection member 402, the terminal 16 and the terminal 41 and protection from corrosion by liquid, it is preferable to raise the cure temperature when curing the sealing member 110 to a higher temperature. For example, it is preferable to set the cure temperature to 150 ° C. or higher. However, when the cure temperature is raised to a high temperature, the thermal stress when the sealing member 110 cured at the cure temperature returns to room temperature becomes larger, and cracks in the recording element substrate 2010 are likely to occur. Even in such a case, by applying the liquid discharge head of the present invention, it is possible to suppress the occurrence of cracks in the recording element substrate 2010.

さらに、産業用途などで高使用頻度かつ高寿命が求められる場合には、記録素子基板２０１０および支持部材２０３０に対して大きな熱変化が繰り返し加わることとなる。その結果、記録素子基板２０１０のクラックが生じ易くなる。このような場合にも、本発明の液体吐出ヘッドを適用することで、記録素子基板２０１０のクラック発生を抑制することが可能となる。 Further, when a high frequency of use and a long life are required for industrial applications and the like, a large thermal change is repeatedly applied to the recording element substrate 2010 and the support member 2030. As a result, cracks in the recording element substrate 2010 are likely to occur. Even in such a case, by applying the liquid discharge head of the present invention, it is possible to suppress the occurrence of cracks in the recording element substrate 2010.

また、第１接着部４００の第１接着剤と第２接着部４０１の第２接着剤はいずれも熱で硬化する材料であり、第２接着剤の硬化温度は、第１接着剤の硬化温度よりも低いと良い。記録素子基板２０１０を支持部材２０３０に強く接着するためには、接着剤は熱硬化型の接着剤であり、且つ硬化温度が高い接着剤がよいことがある。しかし、記録素子基板２０１０を支持部材２０３０に高い温度で硬化する接着剤で接着すると、互いの部材の線膨張係数が異なることから、常温に戻った際には記録素子基板２０１０と支持部材２０３０との相対的な位置関係が動いてしまう。これに対して、より硬化温度が低い別の接着剤を補助的に用いて、より低い温度で仮止めをして、高い接着強度と高い配置精度を両立する方法が一般に行われている。しかしながら、電気接続部がある側には電気接続部を効果的に保護するために、図３（ｂ）の補助接着部４０３のように記録素子基板２０１０の側壁に仮止めするための接着剤を配置することは望ましくない。これに対して、図２に示すような接着層４０００の形状において、第２接着部４０１に硬化温度が低い仮止め用の接着剤を用いることが可能である。具体的には、第１接着部４００に硬化温度が高く、接着強度が強い接着剤を用い、第２接着部４０１に硬化温度が低い仮止め用の接着剤を用いる。これにより、高い接着強度で電気接続部の効果的な保護をしながら仮止めをすることができる。なお、前述したように、図２に示した接着層４０００の形状では、記録素子基板２０１０と支持部材２０３０を接着するときに、第１接着部４００と第２接着部４０１との間に気泡を巻き込むことがある。これに対して、図６に示した第２変形例を用いれば、気泡を巻き込むことなく仮止めをすることが可能となる。接着剤および封止部材として、例えば、図４（ａ）に示すような材料の組み合わせがある。このように、第２接着剤の硬化温度が第１接着剤の硬化温度よりも低い材料を用いることで、記録素子基板２０１０にクラックが発生することを防ぎながら、記録素子基板２０１０と支持部材２０３０の接着位置を高精度に維持することができる。 Further, both the first adhesive of the first adhesive portion 400 and the second adhesive of the second adhesive portion 401 are materials that are cured by heat, and the curing temperature of the second adhesive is the curing temperature of the first adhesive. It is better if it is lower than. In order to strongly adhere the recording element substrate 2010 to the support member 2030, the adhesive may be a thermosetting adhesive and an adhesive having a high curing temperature may be preferable. However, when the recording element substrate 2010 is adhered to the support member 2030 with an adhesive that cures at a high temperature, the linear expansion coefficients of the members are different from each other. Therefore, when the temperature returns to room temperature, the recording element substrate 2010 and the support member 2030 The relative positional relationship of is moving. On the other hand, a method is generally performed in which another adhesive having a lower curing temperature is used as an auxiliary and temporarily fixed at a lower temperature to achieve both high adhesive strength and high placement accuracy. However, in order to effectively protect the electrical connection portion on the side where the electrical connection portion is located, an adhesive for temporarily fixing to the side wall of the recording element substrate 2010 as in the auxiliary adhesive portion 403 of FIG. 3B is applied. It is not desirable to place it. On the other hand, in the shape of the adhesive layer 4000 as shown in FIG. 2, it is possible to use an adhesive for temporary fixing having a low curing temperature for the second adhesive portion 401. Specifically, an adhesive having a high curing temperature and a strong adhesive strength is used for the first adhesive portion 400, and an adhesive for temporary fixing having a low curing temperature is used for the second adhesive portion 401. As a result, temporary fixing can be performed while effectively protecting the electrical connection portion with high adhesive strength. As described above, in the shape of the adhesive layer 4000 shown in FIG. 2, when the recording element substrate 2010 and the support member 2030 are adhered, air bubbles are formed between the first adhesive portion 400 and the second adhesive portion 401. You may get involved. On the other hand, if the second modification shown in FIG. 6 is used, temporary fixing can be performed without entraining air bubbles. As the adhesive and the sealing member, for example, there is a combination of materials as shown in FIG. 4A. As described above, by using a material in which the curing temperature of the second adhesive is lower than the curing temperature of the first adhesive, the recording element substrate 2010 and the support member 2030 are prevented from being cracked in the recording element substrate 2010. The bonding position can be maintained with high accuracy.

なお、上述した構成は本発明の範囲を限定するものではない。１例として、発熱素子により気泡を発生させて液体を吐出するサーマル方式について説明したが、ピエゾ方式およびその他の各種液体吐出方式が採用された液体吐出ヘッドにも本発明を適用することができる。
また、本発明は、記録媒体の幅に対応した長さを有する、所謂ライン型ヘッドや、記録媒体に対してスキャンを行いながら記録を行う、所謂シリアル型の液体吐出ヘッドに適用することができる。 The above-mentioned configuration does not limit the scope of the present invention. As an example, the thermal method of generating bubbles by a heat generating element to discharge the liquid has been described, but the present invention can also be applied to a liquid discharge head in which a piezo method and various other liquid discharge methods are adopted.
Further, the present invention can be applied to a so-called line type head having a length corresponding to the width of the recording medium and a so-called serial type liquid ejection head that records while scanning the recording medium. ..

４０ フレキシブル配線基板
１１０ 封止部材
４００ 第１接着部
４０１ 第２接着部
５００ 端部
２０１０ 記録素子基板
２０３０ 支持部材
４０００ 接着層 40 Flexible wiring board 110 Sealing member 400 First adhesive part 401 Second adhesive part 500 End part 2010 Recording element board 2030 Support member 4000 Adhesive layer

Claims (20)

液体を吐出する記録素子基板と、
前記記録素子基板を支持する支持部材と、
前記記録素子基板と前記支持部材との間に設けられた接着層と、
前記記録素子基板の端部に設けられた第１電気接続部と、
前記第１電気接続部を含む前記記録素子基板の前記端部を覆う封止部材と、を有し、
前記封止部材は、前記記録素子基板の前記端部の側面と前記接着層の端面に接し、
前記接着層は、
第１接着部と、
該第１接着部と前記封止部材との間に位置する第２接着部と、を有し、
前記第２接着部の剛性が、前記封止部材の剛性と前記第１接着部の剛性のいずれよりも小さいことを特徴とする液体吐出ヘッド。 A recording element board that discharges liquid and
A support member that supports the recording element substrate and
An adhesive layer provided between the recording element substrate and the support member,
The first electrical connection portion provided at the end of the recording element substrate and
It has a sealing member that covers the end portion of the recording element substrate including the first electrical connection portion.
The sealing member is in contact with the side surface of the end portion of the recording element substrate and the end surface of the adhesive layer.
The adhesive layer is
With the first adhesive part
It has a second adhesive portion located between the first adhesive portion and the sealing member, and has.
A liquid discharge head characterized in that the rigidity of the second adhesive portion is smaller than either the rigidity of the sealing member or the rigidity of the first adhesive portion. 前記第２接着部の前記封止部材との接触面が、前記記録素子基板の前記端部の側面に対して面一になるように設けられていることを特徴とする、請求項１に記載の液体吐出ヘッド。 The first aspect of the present invention, wherein the contact surface of the second adhesive portion with the sealing member is provided so as to be flush with the side surface of the end portion of the recording element substrate. Liquid discharge head. 前記第２接着部は、前記記録素子基板の前記端部の側面よりも前記封止部材の側に張出した張出し部を備えることを特徴とする、請求項１に記載の液体吐出ヘッド。 The liquid discharge head according to claim 1, wherein the second adhesive portion includes an overhanging portion that projects toward the sealing member from the side surface of the end portion of the recording element substrate. 前記張出し部が前記記録素子基板の前記端部の側面の一部を覆うことを特徴とする、請求項３に記載の液体吐出ヘッド。 The liquid discharge head according to claim 3, wherein the overhanging portion covers a part of a side surface of the end portion of the recording element substrate. 前記支持部材は、前記記録素子基板を支持する支持面に、前記液体を前記記録素子基板に供給する液体供給口を備え、前記第１接着部および第２接着部が前記液体供給口を囲むように形成されていることを特徴とする、請求項１乃至請求項４のいずれか一項に記載の液体吐出ヘッド。 The support member is provided with a liquid supply port for supplying the liquid to the recording element substrate on a support surface that supports the recording element substrate, so that the first adhesive portion and the second adhesive portion surround the liquid supply port. The liquid discharge head according to any one of claims 1 to 4, wherein the liquid discharge head is formed in 1. 前記第１接着部は、複数の帯状の接着部を有し、前記液体供給口は複数個設けられ、該帯状の接着部と前記液体供給口とが交互に配置されていることを特徴とする、請求項５に記載の液体吐出ヘッド。 The first adhesive portion has a plurality of strip-shaped adhesive portions, a plurality of liquid supply ports are provided, and the strip-shaped adhesive portions and the liquid supply port are alternately arranged. , The liquid discharge head according to claim 5. 前記第２接着部は、前記記録素子基板の前記端部に沿って延在し、
前記帯状の接着部が、前記第２接着部の長手方向と交差する方向に延在することを特徴とする、請求項６に記載の液体吐出ヘッド。 The second adhesive portion extends along the end portion of the recording element substrate and extends.
The liquid discharge head according to claim 6, wherein the band-shaped adhesive portion extends in a direction intersecting the longitudinal direction of the second adhesive portion. 前記第２接着部は、前記記録素子基板の前記端部に沿って延在し、
前記帯状の接着部が、前記第２接着部の長手方向と平行な方向に延在することを特徴とする、請求項６に記載の液体吐出ヘッド。 The second adhesive portion extends along the end portion of the recording element substrate and extends.
The liquid discharge head according to claim 6, wherein the band-shaped adhesive portion extends in a direction parallel to the longitudinal direction of the second adhesive portion. 前記支持部材は、前記記録素子基板を支持する支持面に、前記液体を前記記録素子基板に供給する液体供給口を備え、前記第１接着部は前記第２接着部よりも前記液体供給口の近くに位置することを特徴とする、請求項１乃至請求項８のいずれか一項に記載の液体吐出ヘッド。 The support member is provided with a liquid supply port for supplying the liquid to the recording element substrate on a support surface supporting the recording element substrate, and the first adhesive portion is a liquid supply port rather than the second adhesive portion. The liquid discharge head according to any one of claims 1 to 8, characterized in that it is located close to the liquid discharge head. 前記記録素子基板の熱膨張係数が前記支持部材の熱膨張係数と異なることを特徴とする、請求項１乃至請求項９のいずれか一項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 9, wherein the coefficient of thermal expansion of the recording element substrate is different from the coefficient of thermal expansion of the support member. 配線基板と、
前記配線基板の端部に形成された第２電気接続部と、
前記第１電気接続部と前記第２電気接続部とを電気的に接続する電気接続部材と、を有し、
前記配線基板の前記端部が前記記録素子基板の前記端部に隣接するよう前記支持部材に固定され、
前記封止部材が、前記第２電気接続部を含む前記配線基板の前記端部と前記電気接続部材とをさらに覆うことを特徴とする、請求項１乃至請求項１０のいずれか一項に記載の液体吐出ヘッド。 Wiring board and
A second electrical connection formed at the end of the wiring board,
It has an electrical connection member that electrically connects the first electrical connection portion and the second electrical connection portion.
The end portion of the wiring board is fixed to the support member so as to be adjacent to the end portion of the recording element substrate.
The invention according to any one of claims 1 to 10, wherein the sealing member further covers the end portion of the wiring board including the second electrical connection portion and the electrical connection member. Liquid discharge head. 前記記録素子基板がシリコン基板からなり、前記支持部材が酸化アルミニウムからなることを特徴とする、請求項１乃至請求項１１のいずれか一項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 11, wherein the recording element substrate is made of a silicon substrate and the support member is made of aluminum oxide. 前記記録素子基板の形状が、鈍角と鋭角を備えた平行四辺形であることを特徴とする、請求項１乃至請求項１２のいずれか一項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 12, wherein the shape of the recording element substrate is a parallelogram having an obtuse angle and an acute angle. 前記第１接着部を構成する第１接着剤と前記第２接着部を構成する第２接着剤はいずれも熱で硬化する材料であり、前記第２接着剤の硬化温度は、前記第１接着剤の硬化温度よりも低いことを特徴とする、請求項１乃至請求項１３のいずれか一項に記載の液体吐出ヘッド。 The first adhesive constituting the first adhesive portion and the second adhesive constituting the second adhesive portion are both heat-curable materials, and the curing temperature of the second adhesive is the first adhesion. The liquid discharge head according to any one of claims 1 to 13, wherein the liquid discharge head is lower than the curing temperature of the agent. 液体を吐出する記録素子基板と、
前記記録素子基板を支持する支持部材と、
前記記録素子基板と前記支持部材との間に設けられた接着層と、
前記記録素子基板の端部に設けられた第１電気接続部と、
前記第１電気接続部を含む前記記録素子基板の前記端部を覆う封止部材と、を有し、
前記封止部材は、前記記録素子基板の前記端部の側面と前記接着層の端面に接し、
前記接着層は、
第１接着部と、
該第１接着部と前記封止部材との間に位置する第２接着部と、を有し、
前記第１接着部を構成する第１接着剤と前記第２接着部を構成する第２接着剤はいずれも熱で硬化する材料であり、前記第２接着剤の硬化温度は、前記第１接着剤の硬化温度よりも低いことを特徴とする液体吐出ヘッド。 A recording element board that discharges liquid and
A support member that supports the recording element substrate and
An adhesive layer provided between the recording element substrate and the support member,
The first electrical connection portion provided at the end of the recording element substrate and
It has a sealing member that covers the end portion of the recording element substrate including the first electrical connection portion.
The sealing member is in contact with the side surface of the end portion of the recording element substrate and the end surface of the adhesive layer.
The adhesive layer is
With the first adhesive part
It has a second adhesive portion located between the first adhesive portion and the sealing member, and has.
The first adhesive constituting the first adhesive portion and the second adhesive constituting the second adhesive portion are both heat-curable materials, and the curing temperature of the second adhesive is the first adhesion. A liquid discharge head characterized by being lower than the curing temperature of the agent. 前記第２接着部は、前記記録素子基板の前記端部の側面よりも前記封止部材の側に張出した張出し部を備えることを特徴とする、請求項１５に記載の液体吐出ヘッド。 The liquid discharge head according to claim 15, wherein the second adhesive portion includes an overhanging portion that projects toward the sealing member from the side surface of the end portion of the recording element substrate. 前記張出し部が前記記録素子基板の前記端部の側面の一部を覆うことを特徴とする、請求項１６に記載の液体吐出ヘッド。 The liquid discharge head according to claim 16, wherein the overhanging portion covers a part of a side surface of the end portion of the recording element substrate. 前記支持部材は、前記記録素子基板を支持する支持面に、前記液体を前記記録素子基板に供給する液体供給口を備え、前記第１接着部および第２接着部が前記液体供給口を囲むように形成されていることを特徴とする、請求項１５乃至請求項１７のいずれか一項に記載の液体吐出ヘッド。 The support member is provided with a liquid supply port for supplying the liquid to the recording element substrate on a support surface that supports the recording element substrate, so that the first adhesive portion and the second adhesive portion surround the liquid supply port. The liquid discharge head according to any one of claims 15 to 17, wherein the liquid discharge head is formed in 1. 前記第１接着部は、複数の帯状の接着部を有し、前記液体供給口は複数個設けられ、該帯状の接着部と前記液体供給口とが交互に配置されていることを特徴とする、請求項１８に記載の液体吐出ヘッド。 The first adhesive portion has a plurality of strip-shaped adhesive portions, a plurality of liquid supply ports are provided, and the strip-shaped adhesive portions and the liquid supply port are alternately arranged. The liquid discharge head according to claim 18. 前記支持部材は、前記記録素子基板を支持する支持面に、前記液体を前記記録素子基板に供給する液体供給口を備え、前記第１接着部は前記第２接着部よりも前記液体供給口の近くに位置することを特徴とする、請求項１５乃至請求項１９のいずれか一項に記載の液体吐出ヘッド。 The support member is provided with a liquid supply port for supplying the liquid to the recording element substrate on a support surface supporting the recording element substrate, and the first adhesive portion is a liquid supply port rather than the second adhesive portion. The liquid discharge head according to any one of claims 15 to 19, wherein the liquid discharge head is located nearby.
JP2021050143A 2020-11-26 2021-03-24 Liquid discharge head Pending JP2022084504A (en)

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