JP2022084452A - Processing device - Google Patents

Abstract

To provide a technology that inhibits scattering of particles and mist in a processing device and inhibits accumulation of heat in the processing device.SOLUTION: A processing device includes: a chuck; an internal housing; a tool driving unit; an external housing; and an exhaust part. The chuck holds a substrate. The internal housing houses the chuck, the substrate held by the chuck, and a processing tool which processes the substrate. The tool driving unit drives the processing tool. The external housing houses the internal housing and the tool driving unit. The exhaust part includes an exhaust port in an area located inside the external housing and outside the internal housing and exhausts a gas from the exhaust port to the outside of the external housing.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to processing equipment.

The processing apparatus described in Patent Document 1 includes a first transfer unit, a position adjusting mechanism, a second transfer unit, a turntable, a chuck table, a tool drive unit, and a cleaning mechanism. The first transfer unit transfers the substrate from the cassette to the position adjusting mechanism. The position adjustment mechanism adjusts the position of the substrate. The second transfer unit transfers the substrate from the position adjusting mechanism to the chuck table on the turntable. When the chuck table sucks and holds the substrate, the turntable rotates and the substrate is placed below the tool drive unit. The tool drive unit grinds the substrate with a grinding wheel. The second transport unit sucks and holds the ground substrate, turns it, and transports it to the cleaning mechanism. The cleaning mechanism cleans the ground substrate. The first transport unit transports the cleaned substrate from the cleaning mechanism to the cassette.

Japanese Unexamined Patent Publication No. 2019-185645

One aspect of the present disclosure provides a technique for suppressing the dispersal of particles and mist inside a processing device and suppressing the accumulation of heat inside the processing device.

The processing apparatus according to one aspect of the present disclosure includes a chuck, an internal housing, a tool drive unit, an external housing, and an exhaust unit. The chuck holds the substrate. The internal housing accommodates the chuck, the substrate held by the chuck, and a processing tool for processing the substrate. The tool drive unit drives the machining tool. The outer housing accommodates the inner housing and the tool drive unit. The exhaust portion includes an exhaust port inside the outer housing and outside the inner housing, and exhausts gas from the exhaust port to the outside of the outer housing.

According to one aspect of the present disclosure, by discharging the mist and particles together with the gas by the exhaust unit, it is possible to suppress the dispersal of the mist and the particles. Further, by discharging heat together with gas by the exhaust unit, heat accumulation can be suppressed.

FIG. 1 is a cross-sectional view perpendicular to the Y-axis direction of the grinding apparatus according to the embodiment. FIG. 2 is a cross-sectional view perpendicular to the X-axis direction of the grinding apparatus according to the embodiment. FIG. 3 is a plan view showing an example of the gas flow in the inner housing. FIG. 4 is a cross-sectional view showing an example of a grinding unit. FIG. 5 is a perspective view showing an example of a fixed partition wall and a rotary partition wall by breaking a part of the internal housing.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding configurations may be designated by the same reference numerals and description thereof may be omitted. In the present specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are the horizontal direction, and the Z-axis direction is the vertical direction.

The grinding apparatus 1 according to the present embodiment will be described with reference to FIGS. 1 to 3. Grinding involves polishing. The processing device of the present disclosure is not limited to the grinding device 1, and may be, for example, a cutting device. The processing device may be any device that processes the substrate using a processing tool. As a processing tool, a grinding tool, a cutting tool, or the like is used.

The grinding device 1 grinds the substrate W. The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device layer formed on the surface of the semiconductor substrate or the glass substrate. The device layer includes electronic circuits. Further, the substrate W may be a polymerized substrate in which a plurality of substrates are joined. The grinding device 1 includes, for example, a rotary table 10, a rotary mechanism 11, four chucks 20, and three tool drive units 30.

The rotary table 10 holds four chucks 20 around the rotation center line R1 and rotates around the rotation center line R1. The rotation mechanism 11 rotates the rotary table 10. When viewed from above, the rotation direction of the rotary table 10 can be switched between a clockwise direction and a counterclockwise direction.

The four chucks 20 are arranged at equal intervals around the rotation center line R1 of the rotary table 10. Each chuck 20 rotates together with the rotary table 10 and moves to the attachment / detachment position A0, the primary grinding position A1, the secondary grinding position A2, the tertiary grinding position A3, and the attachment / detachment position A0 in this order.

The attachment / detachment position A0 is a position where the substrate W is attached / detached to / from the chuck 20, and serves both as a position where the substrate W is attached and a position where the substrate W is attached / detached. The primary grinding position A1 is a position where the primary grinding of the substrate W is performed. The secondary grinding position A2 is a position where the secondary grinding of the substrate W is performed. The tertiary grinding position A3 is a position where the tertiary grinding of the substrate W is performed.

The four chucks 20 are rotatably attached to the rotary table 10 around their respective rotation center lines R2. A motor (not shown) or the like is provided for each chuck 20. The rotational driving force of the motor is transmitted to the chuck 20 via a timing belt or the like. A gear may be used instead of the timing belt.

One tool drive unit 30 drives the grinding tool D for primary grinding. The tool drive unit 30 rotates and raises and lowers the grinding tool D. Another tool drive unit 30 drives the grinding tool D for secondary grinding. The remaining tool drive unit 30 drives the grinding tool D for tertiary grinding.

Next, the tool drive unit 30 will be described with reference to FIG. The tool drive unit 30 includes a movable portion 31 on which the grinding tool D is mounted. The grinding tool D is pressed against the substrate W and grinds the substrate W. The grinding tool D includes, for example, a disk-shaped grinding wheel D1 and a plurality of grindstones D2 arranged in a ring shape on the lower surface of the grinding wheel D1.

The movable portion 31 has a flange 32 on which the grinding tool D is mounted, a spindle shaft 33 having the flange 32 at the lower end, and a spindle motor 34 for rotating the spindle shaft 33. The flange 32 is arranged horizontally, and the grinding tool D is mounted on the lower surface thereof. The spindle shaft 33 is arranged vertically. The spindle motor 34 rotates the spindle shaft 33 and rotates the grinding tool D mounted on the flange 32. The rotation center line R3 of the grinding tool D is the rotation center line of the spindle shaft 33.

The tool drive unit 30 further has an elevating portion 35 for elevating and lowering the movable portion 31. The elevating portion 35 has, for example, a vertical Z-axis guide 36, a Z-axis slider 37 that moves along the Z-axis guide 36, and a Z-axis motor 38 that moves the Z-axis slider 37. A movable portion 31 is fixed to the Z-axis slider 37, and the movable portion 31 and the grinding tool D move up and down together with the Z-axis slider 37. The elevating unit 35 further includes a position detector 39 for detecting the position of the grinding tool D. The position detector 39 detects, for example, the rotation of the Z-axis motor 38 and detects the position of the grinding tool D.

The elevating part 35 lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, comes into contact with the upper surface of the rotating substrate W, and grinds the entire upper surface of the substrate W. When the thickness of the substrate W reaches the set value, the elevating portion 35 stops the lowering of the grinding tool D. After that, the elevating part 35 raises the grinding tool D to the standby position.

The grinding device 1 includes an internal housing 40. The internal housing 40 houses the chuck 20, the substrate W held by the chuck 20, and the grinding tool D for grinding the substrate W. The internal housing 40 suppresses the scattering of grinding debris and grinding fluid to the outside. The grinding debris is powder or debris generated by grinding the substrate W. The internal housing 40 may also accommodate the rotary table 10.

As shown in FIG. 3, the grinding apparatus 1 includes a fixed partition wall 45 that partitions the inside of the internal housing 40 into a plurality of rooms around the rotation center line R1 of the rotary table 10. The fixed partition wall 45 is fixed to the lower surface of the upper surface panel of the inner housing 40. The fixed partition wall 45 extends in the radial direction of the rotary table 10 (direction orthogonal to the rotation center line R1) when viewed from above.

The fixed partition wall 45 is provided, for example, in a cross shape, and partitions the inside of the internal housing 40 into four rooms B0 to B3 around the rotation center line R1 of the rotary table 10. The three chambers B1 to B3 are grinding chambers in which the substrate W is ground. B1 is a primary grinding chamber, B2 is a secondary grinding chamber, and B3 is a tertiary grinding chamber. The remaining one room B0 is a detachable chamber in which the substrate W is attached / detached to / from the chuck 20.

When viewed from above, the inside of the internal housing 40 is partitioned counterclockwise into the attachment / detachment chamber B0, the primary grinding chamber B1, the secondary grinding chamber B2, and the tertiary grinding chamber B3 in this order. ing. The order of the four chambers B0 to B3 may be reversed, and when viewed from above, the inside of the internal housing 40 is, in the clockwise direction, the attachment / detachment chamber B0, the primary grinding chamber B1, and the secondary grinding chamber B2. And the tertiary grinding chamber B3 may be partitioned in this order.

As shown in FIG. 5, the grinding device 1 includes a plurality of rotary partition walls 15 that rotate together with the rotary table 10. Each of the plurality of rotary partition walls 15 is located between the plurality of chucks 20 adjacent to each other in the circumferential direction of the rotary table 10, rotates with the rotary table 10, stops directly under the fixed partition wall 45, and is the fixed partition wall 45. Contact the lower end of the. The fixed partition wall 45 and the rotary partition wall 15 suppress the movement of grinding debris and grinding fluid between adjacent rooms. The upper end of the rotary partition wall 15 and the lower end of the fixed partition wall 45 do not have to be in contact with each other.

As shown in FIG. 1 and the like, the grinding apparatus 1 has a grinding fluid nozzle 50 for supplying the grinding fluid to the substrate W in each of the primary grinding chamber B1, the secondary grinding chamber B2, and the tertiary grinding chamber B3. Be prepared. The grinding fluid nozzle 50 supplies the grinding fluid. The grinding fluid is, for example, pure water such as DIW (Deionized Water). The grinding fluid enters between the substrate W and the grinding tool D, reduces the grinding resistance, and suppresses the generation of heat.

The grinding device 1 includes a substrate cleaning unit 51 and a chuck cleaning unit 52 in the attachment / detachment chamber B0. The substrate cleaning unit 51 cleans the ground substrate W with a cleaning liquid before it is detached from the chuck 20. Further, the chuck cleaning unit 52 cleans the upper surface of the chuck 20 with a cleaning liquid after the substrate W is detached and before the next substrate W is mounted. The cleaning liquid is, for example, pure water such as DIW.

The substrate cleaning unit 51 supplies a cleaning liquid to the upper surface of the substrate W that rotates together with the chuck 20. The cleaning liquid is wetted and spread over the entire upper surface of the substrate W by centrifugal force, and the particles attached to the upper surface of the substrate W are washed away. The substrate cleaning unit 51 includes, for example, a nozzle for discharging a cleaning liquid. The nozzle may move in the radial direction of the substrate W above the rotating substrate W.

The chuck cleaning unit 52 supplies cleaning liquid to the upper surface of the rotating chuck 20. The cleaning liquid is wetted and spread over the entire upper surface of the chuck 20 by centrifugal force, and the particles attached to the upper surface of the chuck 20 are washed away. The chuck cleaning unit 52 includes, for example, a nozzle for discharging a cleaning liquid. The nozzle may move in the radial direction of the chuck 20 above the rotating chuck 20.

The chuck cleaning unit 52 may include a friction body that rubs and cleans the upper surface of the rotating chuck 20. The friction body is, for example, a brush, a sponge, a grindstone, or the like. Two or more selected from brushes, sponges, and grindstones may be used. The friction body may move on the rotating chuck 20 in the radial direction of the chuck 20.

The internal housing 40 includes, for example, a first top panel 41A, a second top panel 41B, and four side panels 42A, 42B, 42C, 42D. The first top panel 41A covers the upper part of the primary grinding chamber B1, the secondary grinding chamber B2 and the tertiary grinding chamber B3. The second upper surface panel 41B covers the upper part of the attachment / detachment chamber B0. The four side panels 42A, 42B, 42C, 42D cover the sides of the attachment / detachment chamber B0, the primary grinding chamber B1, the secondary grinding chamber B2, and the tertiary grinding chamber B3. The inner housing 40 includes a recovery pan (not shown) at the lower portion thereof. The collection pan collects grinding debris and grinding fluid.

The first upper surface panel 41A is provided horizontally. The first upper surface panel 41A is formed with an insertion port 41a for the movable portion 31. The first upper surface panel 41A has a shape in which one corner of a rectangle is cut out in an L shape when viewed from above. The second upper surface panel 41B is provided at the notched position.

The second upper surface panel 41B covers the upper part of the attachment / detachment chamber B0. Compared with the case where the second upper surface panel 41B is not provided, that is, when the attachment / detachment chamber B0 is opened upward, it is possible to prevent the outflow of mist and particles upward from the attachment / detachment chamber B0.

The second upper surface panel 41B is arranged at the same height as the first upper surface panel 41A and is continuously provided. However, the second upper surface panel 41B is separated from the first upper surface panel 41A and is removable. If the second upper surface panel 41B is removed, the attachment / detachment chamber B0 can be opened and maintenance workability can be improved.

The substrate W is ground in the primary grinding chamber B1, the secondary grinding chamber B2, and the tertiary grinding chamber B3. Therefore, the first upper surface panel 41A is made of metal. Metal is not easily scratched by the collision of grinding debris and has excellent durability. The metal is opaque.

On the other hand, in the attachment / detachment chamber B0, the substrate W is not ground. Therefore, the second upper surface panel 41B is formed of, for example, a resin. Resin is inferior in durability to metal, but is excellent in transparency. If the second upper surface panel 41B is transparent, the upper surface of the chuck 20 and the like can be visually recognized from above the second upper surface panel 41B.

In the attachment / detachment chamber B0, unlike the primary grinding chamber B1 and the like, the chuck 20 or the substrate W is cleaned. As a result, the droplets of the cleaning liquid are scattered and adhere to the lower surface of the second upper surface panel 41B. The attached droplets contain particles such as grinding debris.

As shown in FIG. 2, the lower surface of the second upper surface panel 41B may be inclined diagonally downward. The lower surface of the second upper surface panel 41B is inclined downward so as to be separated from the fixed partition wall 45, which is the boundary between the attachment / detachment chamber B0 and the tertiary grinding chamber B3, for example. Due to the inclination, the droplets flow diagonally downward while being attached to the lower surface of the second upper surface panel 41B. It is possible to suppress the droplets from falling on the suction surface of the chuck 20, and it is possible to prevent the suction surface from becoming dirty. The substrate W can be placed on a clean suction surface, and the biting of particles can be suppressed. Therefore, the substrate W can be ground flat, and deterioration of the thickness deviation (TTV: Total Tickness Variation) of the substrate W can be suppressed.

As shown in FIG. 1, the grinding device 1 may have an exhaust unit 60 on the second upper surface panel 41B. The exhaust unit 60 includes a duct. The duct of the exhaust unit 60 extends to the outside of the grinding device 1 and is connected to a suction source (not shown). The suction source is, for example, a vacuum pump or an ejector. The suction source may be part of factory equipment. The exhaust unit 60 discharges gas from the attachment / detachment chamber B0 by the suction force of the suction source. A damper for adjusting the displacement may be provided in the middle of the duct of the exhaust section 60.

The exhaust unit 60 discharges the gas flowing into the attachment / detachment chamber B0 from the transport port 43 of the internal housing 40 above the second upper surface panel 41B. The exhaust unit 60 discharges mist and particles together with the gas, and suppresses the dispersal of the mist and particles. Further, the exhaust unit 60 forms a one-way gas flow in the transport port 43 of the internal housing 40 to suppress the outflow of particles. Further, the exhaust unit 60 forms an updraft in the attachment / detachment chamber B0, and suppresses the drop of droplets or particles adhering to the lower surface of the second upper surface panel 41B.

As shown in FIG. 3, the grinding apparatus 1 may include a bottom surface cleaning mechanism 53 and a cleaning cover 70. The bottom surface cleaning mechanism 53 cleans the bottom surface of the ground substrate W separated from the chuck 20 at the cleaning position A5 next to the attachment / detachment position A0. The bottom surface cleaning mechanism 53 may also clean the suction pad 2a of the transport device 2.

The bottom surface cleaning mechanism 53 has, for example, a nozzle for discharging the cleaning liquid to the substrate W or the suction pad 2a, and a drying portion for removing the cleaning liquid from the substrate W or the suction pad 2a. The dry portion absorbs, for example, the cleaning liquid. The cleaning cover 70 is adjacent to the internal housing 40 and houses the bottom surface cleaning mechanism 53 inside. The cleaning cover 70 forms a cleaning chamber B5 inside.

The cleaning cover 70 includes a top panel 71 and four side panels 72A, 72B, 72C, 72D. The upper surface panel 71 covers the upper part of the lower surface cleaning mechanism 53. The top panel 71 is arranged horizontally, for example. On the other hand, the side panels 72A, 72B, 72C and 72D cover the sides of the bottom surface cleaning mechanism 53. The side panels 72A, 72B, 72C, 72D are arranged vertically, for example. A cleaning pan (not shown) is provided below the bottom surface cleaning mechanism 53. The washing pan collects the washing liquid and the like. The cleaning cover 70 suppresses the cleaning liquid from scattering to the outside.

The cleaning cover 70 partitions the attachment / detachment position A0 and the cleaning position A5. Specifically, the side panel 72B of the cleaning cover 70 partitions the attachment / detachment position A0 and the cleaning position A5. The movement of mist and particles from the attachment / detachment position A0 to the cleaning position A5 can be suppressed. The side panel 42A of the internal housing 40 also partitions the attachment / detachment position A0 and the cleaning position A5.

The grinding device 1 includes an outer housing 80 that forms the outermost surface of the grinding device 1. The outer housing 80 houses the inner housing 40 and the tool drive unit 30 inside. The outer housing 80 also houses the cleaning cover 70 inside. The outer housing 80 has a top panel 81 and four side panels 82A, 82B, 82C, 82D. The top panel 81 is arranged horizontally. On the other hand, the side panels 82A, 82B, 82C, 82D are arranged vertically. The outer housing 80 may include a frame (not shown). The frame includes columns, beams and the like.

As shown in FIG. 3, the outer housing 80 includes a transport port 83 for the substrate W on its side surface. The transport port 83 is formed on the side panel 82A. The cleaning cover 70 includes openings 73A and 73B through which the substrate W and gas pass on a straight line connecting the transport port 83 of the outer housing 80 and the transport port 43 of the inner housing 40. By arranging these 83, 73A, 73B, and 43 in a straight line, the transfer of the substrate W and the movement of the gas become easy.

The grinding device 1 further includes a shutter 84 that opens and closes the transport port 83 of the outer housing 80. The shutter 84 basically closes the transport port 83, and opens the transport port 83 when the substrate W passes through the shutter 84. Compared with the case where the transport port 83 is always open, it is possible to suppress the outflow of mist and particles through the transport port 83.

While the shutter 84 opens the transport port 83 of the outer housing 80, the gas passes through the transport port 83 of the outer housing 80, the openings 73B and 73A of the cleaning cover 70, and the transport port 43 of the inner housing 40. It flows into the attachment / detachment chamber B0. Since this gas flow is one-way, the outflow of particles can be suppressed. However, this gas flow is blocked when the shutter 84 closes the transport port 83 of the outer housing 80.

Therefore, as shown in FIG. 1, a gap G is formed between the transport port 83 of the outer housing 80 and the opening 73A of the cleaning cover 70. The gap G forms a gas passage from the outside of the cleaning cover 70 to the opening 73A of the cleaning cover 70. Even if the shutter 84 closes the transport port 83 of the outer housing 80, a desired gas flow is formed. The gas passes through the openings 73A and 73B of the cleaning cover 70 and the transport port 43 of the internal housing 40, and flows into the attachment / detachment chamber B0.

As shown in FIG. 3, the grinding device 1 is adjacent to the side panel 42A or 42B of the internal housing 40 and includes exhaust boxes 61A, 61B, 61C for discharging gas. The exhaust boxes 61A, 61B, 61C are connected to the exhaust ducts 62A, 62B, 62C. The exhaust ducts 62A, 62B, and 62C extend to the outside of the grinding device 1 and are connected to a suction source. The suction source is, for example, a vacuum pump or an ejector. The suction source may be part of factory equipment. A damper for adjusting the exhaust amount may be provided in the middle of the exhaust ducts 62A, 62B, 62C.

The exhaust box 61A discharges gas from the primary grinding chamber B1 by the suction force of the suction source. Further, the exhaust box 61B discharges gas from the secondary grinding chamber B2 by the suction force of the suction source. Further, the exhaust box 61C discharges gas from the tertiary grinding chamber B3 by the suction force of the suction source. It is possible to suppress the movement of mist and particles between the primary grinding chamber B1, the secondary grinding chamber B2, the tertiary grinding chamber B3, and the attachment / detachment chamber B0.

As shown in FIG. 1, the grinding device 1 includes an exhaust unit 63. The exhaust unit 63 includes an exhaust port 64 inside the outer housing 80 and outside the inner housing 40, and exhausts gas from the exhaust port 64 to the outside of the outer housing 80. The exhaust unit 63 includes, for example, a duct 65. An exhaust port 64 is provided at one end of the duct 65. The other end of the duct 65 is connected to the suction source. The suction source is, for example, a vacuum pump or an ejector. The suction source may be part of factory equipment. A damper for adjusting the displacement may be provided in the middle of the duct 65.

The suction source may be common to a plurality of ducts (for example, the duct 65 of the exhaust unit 63, the duct of the exhaust unit 60, the exhaust ducts 62A, 62B, 62C). These ducts meet along the way and are connected to a common suction source. The balance of displacement of multiple ducts is adjusted by dampers.

The exhaust unit 63 discharges gas from the exhaust port 64 inside the outer housing 80 to the outside of the outer housing 80 by the suction force of the suction source. The exhaust unit 63 discharges the particles and mist leaked from the internal housing 40 and the heat generated during the operation of the tool drive unit 30 and the like together with the gas. Therefore, the inside of the outer housing 80 can be kept clean, and the clean room in which the grinding device 1 is installed can be kept clean. Further, the accumulation of heat inside the outer housing 80 can be suppressed, and the temperature rise can be suppressed.

The exhaust port 64 of the exhaust unit 63 faces the side panel 82B of the outer housing 80 and faces diagonally downward. The side panel 82B is provided with an intake port 68, which will be described later. The intake port 68 sucks in the gas outside the outer housing 80. Since the exhaust port 64 faces the intake port 68, the gas can be efficiently sucked by the intake port 68, and the gas can be efficiently discharged by the exhaust port 64. Further, since the exhaust port 64 is also directed downward, gas can be efficiently discharged from below.

The exhaust unit 63 may include a straightening vane 66 in the exhaust port 64. The straightening vane 66 is, for example, punching metal. Punching metal is a metal plate in which a plurality of round holes are arranged. The hole of the straightening vane 66 is not limited to a round hole, and may be a polygonal hole such as a triangular hole, a square hole, or a hexagonal hole. The straightening vane 66 can efficiently discharge the gas from a desired direction.

As shown in FIG. 1, the grinding device 1 includes an air supply unit 67. The air supply unit 67 supplies gas from the outside of the outer housing 80 to the inside. The air supply unit 67 and the exhaust unit 63 face each other with the tool drive unit 30 interposed therebetween. The gas absorbs the heat of the tool drive unit 30 on the way from the air supply unit 67 to the exhaust unit 63. Therefore, the heat of the tool drive unit 30 can be efficiently discharged.

The air supply unit 67 includes an intake port 68 provided on the side panel 82B of the outer housing 80. When the exhaust unit 63 discharges gas from the inside of the outer housing 80 to the outside and the inside of the outer housing 80 becomes a negative pressure, the outside air automatically flows from the inside of the outer housing 80 to the outside via the intake port 68. Is sucked into. Since a pump or the like is not required, the mechanism of the air supply unit 67 can be simplified.

The air supply unit 67 includes a hood 69 that covers the intake port 68 in addition to the outer housing 80. The hood 69 is open only downwards and is obstructed upwards and laterally. The intake port 68 sucks in outside air from below the hood 69. Therefore, gravity can be used to suppress the inhalation of particles.

As shown in FIG. 3, the outer housing 80 includes two side panels 82A and 82B facing each other. An intake port 68 is formed on the side panel 82B, and a transport port 83 for the substrate W is formed on the side panel 82A. An exhaust unit 63 is provided in the vicinity of the side panel 82A. When viewed from above, the exhaust unit 63 is provided between the side panel 82A and the internal housing 40. For example, the exhaust unit 63 is provided directly above the cleaning cover 70.

The grinding device 1 includes a control unit 90. The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed in the grinding device 1. The control unit 90 controls the operation of the grinding device 1 by causing the CPU 91 to execute the program stored in the storage medium 92.

Although the grinding apparatus according to the present disclosure has been described above, the present disclosure is not limited to the above-described embodiment and the like. Various changes, modifications, replacements, additions, deletions, and combinations are possible within the scope of the claims. Of course, they also belong to the technical scope of the present disclosure.

1 Grinding equipment (processing equipment)
20 Chuck 30 Tool drive unit 40 Internal housing 63 Exhaust part 64 Exhaust port 80 External housing D Grinding tool (machining tool)
W board

Claims (15)

The chuck that holds the board and
An internal housing that houses the chuck, the substrate held by the chuck, and a processing tool for processing the substrate.
A tool drive unit that drives the machining tool and
An internal housing, an external housing for accommodating the tool drive unit, and
An exhaust unit inside the outer housing, including an exhaust port outside the inner housing, and discharging gas from the exhaust port to the outside of the outer housing.
Equipped with processing equipment. An air supply unit that supplies gas from the outside to the inside of the outer housing is provided.
The processing device according to claim 1, wherein the air supply unit and the exhaust unit face each other with the tool drive unit interposed therebetween. The processing device according to claim 2, wherein the air supply unit includes an intake port provided on a side surface of the outer housing. The processing device according to claim 3, wherein the air supply unit includes a hood that covers the intake port in addition to the outer housing. The processing apparatus according to claim 3 or 4, wherein the exhaust port of the exhaust portion faces the side surface of the outer housing and faces diagonally downward. The processing apparatus according to any one of claims 1 to 5, wherein the exhaust unit includes a straightening vane in the exhaust port. A rotary table that holds a plurality of the chucks around the rotation center line and rotates around the rotation center line,
A rotation mechanism that rotates the rotary table and moves the chuck between the attachment / detachment position where the substrate is attached / detached to / from the chuck and the processing position where the substrate is processed by being adsorbed on the chuck.
The processing apparatus according to any one of claims 1 to 6. The processing apparatus according to claim 7, wherein the internal housing includes a first upper surface panel that covers the upper part of the processing position and a second upper surface panel that covers the upper part of the attachment / detachment position. A second exhaust unit is provided on the second upper panel of the inner housing.
The processing apparatus according to claim 8, wherein the gas inside the inner housing is discharged above the inner housing. A bottom surface cleaning mechanism that cleans the bottom surface of the substrate after processing that has been removed from the chuck at the cleaning position next to the attachment / detachment position.
It has a cleaning cover that is adjacent to the internal housing and houses the bottom surface cleaning mechanism inside.
The processing device according to claim 9, wherein the cleaning cover partitions the attachment / detachment position and the cleaning position. The outer housing includes a transport port of the substrate on its side surface.
The processing apparatus according to claim 10, wherein the cleaning cover includes an opening through which the substrate and the gas pass on a straight line connecting the transport port of the outer housing and the transport port of the inner housing. 11. The processing apparatus according to claim 11, further comprising a shutter for opening and closing the transport port of the outer housing. A gap is formed between the transport port of the outer housing and the opening of the cleaning cover.
12. The processing apparatus according to claim 12, wherein the gap forms a passage for the gas from the outside of the cleaning cover to the opening of the cleaning cover. The processing apparatus according to any one of claims 8 to 13, wherein the second upper surface panel is transparent. The processing apparatus according to any one of claims 8 to 14, wherein the lower surface of the second upper surface panel is inclined diagonally downward.

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