JP2022080460A - Multi-unit system - Google Patents

Abstract

To quickly detect a data abnormality in a multi-unit system in which a unit having an imaging part is connected to another unit through a communication cable so as to enable data communication.SOLUTION: A component mounting device 1 as a multi-unit system comprises: a mounting unit 40 which includes a substrate recognition camera 5; a base part 10 which includes a control device 7; and a communication cable 8 which connects both units so as to enable data communication. A substrate recognition camera 5 comprises: an imaging part 51; a test signal generation part 53 which generates a test signal Ts; and a first communication control part 54 which transmits image data Vd and the test signal Ts. The control device 7 comprises: a second communication control part 77 which acquires Vd and Ts; and an abnormality detection part 79 which determines the presence/absence of the abnormality of the test signal Ts. The first communication control part 54 transmits the test signal Ts at the timing at which transmission of the image data Vd to the control device 7 is not performed.SELECTED DRAWING: Figure 5

Description

The present invention relates to a multi-unit system in which a unit including an image pickup unit for capturing an image and another unit are connected to each other so as to be capable of data communication by a communication cable.

For example, a component mounting device (an example of a multi-unit system) for mounting electronic components on a board includes a mounting unit including a mounting head having a component suction nozzle and a main body unit including a controller for controlling the operation of the mounting unit. To prepare for. The mounting unit and the main body unit are connected so as to be capable of data communication by a communication cable. Generally, an imaging unit such as a substrate recognition camera or a component recognition camera is mounted on the mounting unit, and image data acquired by imaging is transmitted to the main body unit.

When operating the component mounting device, it is necessary to perform an abnormality check as to whether or not the image data is normally transmitted from the image pickup unit to the main body unit. For example, an abnormality occurs in the image data received by the main unit due to an operation abnormality of the camera, breakage or damage of the communication cable, or the like. Conventionally, the abnormality check has adopted a method of confirming the image data itself acquired by the imaging unit or identification information such as parity and checksum attached to the image data on the main body unit side (for example). Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-236198

In the conventional method, it is necessary for the image pickup unit to actually perform an image pickup operation to acquire image data in order to check the abnormality. That is, there is a problem that the abnormality cannot be determined unless the component mounting device is made to execute the production operation of the component mounting board. In addition, there is a risk that the component mounting board will be produced in a state where there is an abnormality in the image pickup unit or the communication cable.

An object of the present invention is to enable prompt detection of a data abnormality in a multi-unit system in which a unit provided with an image pickup unit and another unit are connected so as to be capable of data communication by a communication cable.

The multi-unit system of an object according to one aspect of the present invention includes an imaging unit that captures an image and generates image data, a first data generation unit that generates a predetermined test signal, the image data, and the test signal. A first unit including a transmission unit capable of transmitting to the outside, a data acquisition unit for acquiring the image data and the test signal, and a first determination unit for determining the presence or absence of an abnormality in the test signal. A second unit is provided, and a communication cable for connecting the first unit and the second unit so as to be capable of data communication is provided, and the transmission unit is at a timing when the image data is not transmitted to the second unit. , The test signal is transmitted.

According to this multi-unit system, the transmitting unit can transmit a test signal regardless of whether or not the imaging unit is actually performing an imaging operation. That is, even if the image data is not actually acquired, it is possible to check the data abnormality based on the test signal. Therefore, it is possible to quickly detect a data abnormality before the first unit starts actual operation. The test signal may be transmitted directly from the transmission unit to the second unit, or may be indirectly transmitted to the second unit via another unit.

In the above multi-unit system, it is desirable that the transmitting unit transmits the test signal during the invalid period during which the image data is not transmitted during the period in which the imaging unit can take an image.

For example, when reading the pixel data of the frame image, if the period for transferring each pixel data is set as the valid period, there is an invalid period before and after the valid period in which the pixel data is not transferred. According to the above-mentioned multi-unit system, by utilizing such an invalid period, a test signal can be transmitted without depending on the existence of image data.

In the above multi-unit system, it is desirable that the transmission unit always transmits the test signal during the period during which the first unit can operate, excluding the valid period for transmitting the image data.

According to this multi-unit system, the transmitter always transmits a test signal except for the validity period. For example, the test signal can be transmitted from the timing when the power of the first unit is turned on. Therefore, it is possible to reliably detect a data abnormality before the actual operation of the first unit.

In the above-mentioned multi-unit system, an intermediate unit is further provided between the first unit and the second unit to relay the transmission of the image data, and the intermediate unit has an abnormality in the test signal. The communication cable includes an upstream communication cable connecting the first unit and the intermediate unit, and a downstream communication cable connecting the intermediate unit and the second unit. Is desirable.

According to the above-mentioned multi-unit system, it is possible to separately detect whether an abnormality exists on the first unit side or the second unit side with the intermediate unit as a boundary. For example, if the upstream communication cable does not include a moving part and the installation environment is not damaged, the data abnormality is caused by either the abnormality of the imaging unit or the abnormality of the downstream communication cable due to the intervention of the intermediate unit. It is possible to determine whether to do so. Therefore, the cause of the abnormality can be quickly detected, and the repair work can be performed promptly.

In the above multi-unit system, the image pickup unit includes a first image pickup unit and a second image pickup unit, and the first data generation unit includes a first test signal for the first image pickup unit and the second image pickup unit. The upstream communication cable generates a second test signal for the unit, and connects the first upstream communication cable that connects the first imaging unit and the intermediate unit, and the second imaging unit and the intermediate unit. It is desirable to include a second upstream communication cable.

According to this multi-unit system, in the intermediate unit, based on the first test signal or the second test signal, it is determined whether the data abnormality exists on the first imaging unit side or the second imaging unit side. It can be detected by the unit. Therefore, even when a plurality of image pickup units are provided in the first unit, the cause of the abnormality can be quickly detected.

In the above multi-unit system, it is desirable that the intermediate unit includes a data shaping unit that shapes the test signal transmitted via the upstream communication cable into the original test signal when the test signal is deformed.

According to this multi-unit system, an abnormality in the downstream communication cable can be detected by using the test signal created by the first data generation unit without providing a data generation unit for newly generating a test signal in the intermediate unit. Can be done.

In the above multi-unit system, it is desirable that the intermediate unit includes a second data generation unit that generates a test signal different from the test signal generated by the first data generation unit.

According to this multi-unit system, the test signal generated by the second data generation unit can be used to detect an abnormality in the downstream communication cable separately from the image pickup unit of the first unit.

In the above multi-unit system, it is desirable that the first unit is a mounting unit that performs an operation of mounting electronic components on a substrate, and the second unit is a control unit that controls the operation of the mounting unit.

According to this configuration, the multi-unit system according to the present invention is applied to a component mounting device for mounting electronic components on a substrate. Then, it is possible to quickly detect an abnormality in the image pickup unit mounted on the mounting unit or an abnormality in the communication cable connecting the mounting unit and the control unit.

In the above-mentioned multi-unit system, the control unit transmits an instruction signal for causing the mounting unit to execute the transmission operation of the test signal before the mounting unit starts the operation of mounting the electronic component on the board. Is desirable.

According to this configuration, it is possible to detect a data abnormality before the substrate production operation for mounting the electronic component is performed. Therefore, it is possible to prevent the substrate from being produced in the presence of an abnormality.

According to the present invention, it is possible to add a function capable of promptly detecting a data abnormality to a multi-unit system in which a unit provided with an image pickup unit and another unit are connected so as to be capable of data communication by a communication cable.

FIG. 1 is a plan view showing a schematic configuration of a component mounting device which is an example of the multi-unit system of the present invention. FIG. 2 is a side view showing a schematic configuration of a mounting unit portion of a component mounting device. FIG. 3 is a block diagram of a component mounting device. FIG. 4 is a schematic diagram of a component mounting device having a signal quality confirmation configuration according to the first embodiment. FIG. 5 is a block diagram of the configuration related to the signal quality confirmation of the first embodiment. FIG. 6 is a schematic diagram of a component mounting device having a signal quality confirmation configuration according to a second embodiment. FIG. 7 is a schematic diagram of a component mounting device having a signal quality confirmation configuration according to a third embodiment. FIG. 8 is a block diagram of the configuration related to the signal quality confirmation of the third embodiment. FIG. 9 is a side view showing a schematic configuration of a mounting unit portion having a plurality of cameras. FIG. 10 is a schematic diagram of a component mounting device having a signal quality confirmation configuration according to a fourth embodiment. FIG. 11 is a block diagram of the configuration related to the signal quality confirmation of the fourth embodiment. FIG. 12 is a flowchart showing an example of the operation of signal quality confirmation.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this embodiment, an example is shown in which the multi-unit system according to the present invention is applied to a component mounting device for mounting electronic components on a substrate. The component mounting device is a device for mounting various electronic components on a printed circuit board, and includes a plurality of units such as a unit for performing a component mounting operation, a unit having an image pickup unit, and a unit having a controller. The multi-unit system of the present invention is not limited to the component mounting device, and is widely applied to various electric devices / mechanical devices, equipment, etc. including a unit having an image pickup unit and other units for which image data is transmitted from this unit. can do.

[Overall structure of component mounting device]
FIG. 1 is a plan view showing a schematic configuration of a component mounting device 1, and FIG. 2 is a side view showing a schematic configuration of a mounting unit 40 portion of the component mounting device 1. The component mounting device 1 is a device for producing a mounting board obtained by mounting various electronic components on a board P. In FIGS. 1 and 2, XYZ direction indications are attached. In the following description, the X direction may be referred to as the left-right direction, which is the moving direction of the substrate P, the Y direction may be referred to as the front-back direction, and the Z direction may be referred to as the up-down direction.

The component mounting device 1 (multi-unit system) includes a base portion 10 (second unit) and a mounting unit 40 (first unit) arranged on the base portion 10. A board transfer section 2 and a component supply section 3 are assembled to the base section 10. The mounting unit 40 includes a head unit 4 having a plurality of heads 4H, and a substrate recognition camera 5 (imaging unit) mounted on the head unit 4. The base portion 10 is provided with a control device 7 that controls the operation of each portion of the component mounting device 1. The base portion 10 and the mounting unit 40 are connected so as to enable data communication.

The board transport unit 2 transports the board P on which the electronic components are mounted. The substrate transport unit 2 has a pair of conveyors 21 and 22 that transport the substrate P in the left-right direction on the base portion 10. The conveyors 21 and 22 carry the substrate P from the right side into the machine of the component mounting device 1, convey it to the left to a predetermined working position (the position of the substrate P shown in FIG. 1), and temporarily stop the conveyors 21 and 22. At this working position, the electronic components are mounted on the substrate P. After the mounting work, the conveyors 21 and 22 carry the substrate P to the left side and carry it out of the machine of the component mounting device 1.

The component supply unit 3 supplies electronic components to be mounted on the substrate P. The component supply unit 3 is arranged in the front-rear direction of the substrate transport unit 2. Each component supply unit 3 includes a plurality of tape feeders 31 arranged in the left-right direction. Each tape feeder 31 holds a reel on which tapes containing (holding) various electronic components are wound. The tape feeder 31 intermittently feeds the tape from the reel and supplies electronic components to the component supply position at the tip of the feeder.

The head unit 4 takes out an electronic component from the component supply unit 3 and mounts the electronic component on the substrate P. The head unit 4 is movably arranged above the base portion 10 in the XY directions, takes out an electronic component from the tape feeder 31 at the component supply position, and mounts the electronic component at a predetermined position on the substrate P at the working position. .. A support beam 23 extending in the X direction is erected above the base portion 10. The head unit 4 is movably supported with respect to the X-axis fixed rail 24 fixed to the support beam 23.

The support beam 23 is supported by a Y-axis fixed rail 25 extending in the Y direction, and can move in the Y direction along the Y-axis fixed rail 25. The X-axis servomotor 26 and the ball screw shaft 27 are arranged with respect to the X-axis fixed rail 24. A Y-axis servomotor 28 and a ball screw shaft 29 are arranged with respect to the Y-axis fixed rail 25. The head unit 4 moves in the X direction by the rotational drive of the ball screw shaft 27 by the X-axis servomotor 26, and moves in the Y direction by the rotational drive of the ball screw shaft 29 by the Y-axis servomotor 28.

The head unit 4 is equipped with a plurality of mounting heads 4H for holding and transporting parts. Each head 4H includes a shaft 41 extending in the Z direction and a suction nozzle 42 mounted on the lower end of the shaft 41. The shaft 41 can move up and down and rotate around the nozzle center axis (R axis) with respect to the head unit 4. The suction nozzle 42 can suck and hold the electronic component and mount it on the surface of the substrate P.

A multi-camera 11 is incorporated in the base portion 10. The multi-camera 11 is a camera whose imaging field of view is above the base portion 10. The main role of the multi-camera 11 is to take an image of the electronic component sucked by the suction nozzle 42 from the lower surface side in order to recognize the suction state of the electronic component by the suction nozzle 42.

The board recognition camera 5 is fixedly mounted on the left side of the head unit 4. The substrate recognition camera 5 captures various marks attached to the surface of the substrate P carried into the working position by the conveyors 21 and 22. In FIG. 1, as an example of the mark, a pair of fiducial marks FM attached on the diagonal line of the rectangular substrate P are shown. The fiducial mark FM is a mark for detecting the amount of positional deviation of the carried-in substrate P with respect to the origin coordinates of the working position. The position of the fiducial mark FM is specified on the image data obtained by the image pickup of the substrate recognition camera 5, and the amount of positional deviation with respect to the origin coordinates is obtained. This amount of misalignment is referred to at the time of component mounting, and the electronic component is mounted on the substrate P so that the misalignment does not occur.

[Electrical configuration of component mounting device]
Subsequently, the control configuration of the component mounting device 1 will be described. FIG. 3 is a block diagram showing an electrical configuration of the component mounting device 1. As described above, the component mounting device 1 includes a control device 7 (control unit) arranged in the base portion 10. The control device 7 controls the operation of the above-mentioned mounting unit 40 (head unit 4, board recognition camera 5), the multi-camera 11 and the like by executing a predetermined program. The block diagram of FIG. 3 shows a Z-axis servomotor 43, an R-axis servomotor 44, and a camera-axis servomotor 45, which are omitted in FIGS. 1 and 2.

The Z-axis servomotor 43 and the R-axis servomotor 44 are motors incorporated in the head unit 4. The Z-axis servomotor 43 is a drive source that raises and lowers the head 4H (shaft 41) along the Z-axis when attracting or mounting electronic components. The R-axis servomotor 44 is a drive source that rotates the shaft 41 around the R-axis. The camera shaft servomotor 45 is a motor for operating the scan unit 6 adopted in the fourth embodiment (FIG. 9) described later. The camera axis servomotor 45 is omitted in the mounting unit 40 shown in FIG. 2 which does not include the scan unit 6.

The control device 7 functionally includes an image pickup control unit 71, an image processing unit 72, an axis control unit 73, a main control unit 74, and a storage unit 75. In FIG. 3, the description of the functional unit of the control device 7 relating to the data communication between the units described later is omitted (detailed in FIG. 5 and others described later).

The image pickup control unit 71 controls the image pickup operation of various cameras provided in the component mounting device 1 in addition to the substrate recognition camera 5 and the multi-camera 11. For example, the image pickup control unit 71 gives a control signal for designating the timing for causing these cameras to perform an image pickup operation.

The image processing unit 72 applies image processing techniques such as edge detection processing and pattern recognition processing accompanied by feature quantity extraction to the image data acquired by the substrate recognition camera 5 and the multi-camera 11, and various types of images are obtained from the image. Extract information. Specifically, the image processing unit 72 performs a process of specifying the position of the fiducial mark FM based on the image data acquired by the substrate recognition camera 5. Further, the image processing unit 72 performs a process of specifying the shape, position, and the like of the electronic component held by the suction nozzle 42 based on the image data acquired by the multi-camera 11.

The axis control unit 73 controls the movement operation of the head unit 4 in the XY direction by controlling the X-axis servomotor 26 and the Y-axis servomotor 28. Further, the axis control unit 73 controls the elevating and rotating operations of the mounting head 4H (shaft 41) by controlling the Z-axis servomotor 43 and the R-axis servomotor 44 included in the head unit 4. Further, in the embodiment of the fourth embodiment described later, the axis control unit 73 controls the movement of the scan unit 6 in the X direction along the lower surface of the head unit 4 by controlling the camera axis servomotor 45. ..

The main control unit 74 comprehensively controls various operations with respect to the component mounting device 1. For example, the main control unit 74 gives a control signal to the image pickup control unit 71, the image processing unit 72, the axis control unit 73, and the like to capture an image, causes the image data to perform image processing, and the head unit 4 and the like. The operation of driving the head 4H is executed. Further, the main control unit 74 also comprehensively controls the data communication operation between the units described later.

The storage unit 75 stores various information related to the board P and electronic components, various setting values and parameters related to the component mounting device 1, control data, an operation program, and the like.

[Various examples of signal quality confirmation]
Hereinafter, various examples of signal quality confirmation provided in the component mounting device 1 (multi-unit system) will be described. In the embodiment shown below, the mounting unit 40 is treated as the first unit and the base unit 10 is treated as the second unit, and the board recognition camera 5 of the mounting unit 40 and the control device 7 of the base unit 10 can communicate with each other as a communication cable. An example of being connected by 8 is shown.

<Example 1>
FIG. 4 is a schematic diagram of a component mounting device 1 having a signal quality confirmation configuration according to a first embodiment. Roughly speaking, in the first embodiment, the image data Vd and the test signal Ts are transmitted from the board recognition camera 5 side to the control device 7, and the quality of the test signal Ts is checked on the control device 7 side, thereby between the two. The signal quality in data communication is confirmed. In the conventional method, the signal quality is confirmed based on the image data itself or the identification information such as parity and checksum attached to the image data. In this method, it is necessary to actually capture an image with the substrate recognition camera 5. However, in the configuration of the first embodiment, since the signal quality is confirmed based on the test signal Ts, it is not essential to capture the actual image by the substrate recognition camera 5.

FIG. 5 is a block diagram of the configuration of the component mounting device 1 regarding the signal quality confirmation of the first embodiment. The substrate recognition camera 5 includes an image pickup unit 51, a camera control unit 52, a test signal generation unit 53 (first data generation unit), a first communication control unit 54 (transmission unit), and an I / F unit 55.

The image pickup unit 51 captures a required image and generates image data Vd. The image pickup unit 51 includes an image pickup element that photoelectrically converts an optical image of a subject, and an optical system that forms an image of the subject image on a light receiving surface of the image pickup element. The camera control unit 52 causes the image pickup unit 51 to execute an image pickup operation at a timing designated by the image pickup control unit 71 of the control device 7. At this time, the camera control unit 52 controls the focusing operation of the image pickup unit 51, the shutter timing, the shutter speed (exposure amount), and the like.

The test signal generation unit 53 generates predetermined test signals Ts for checking the signal quality. The test signal Ts is a test pattern signal with a predetermined signal arrangement, a unique identification signal, or the like, and is a signal that can be clearly distinguished from the image data Vd. In FIG. 4, the test signal Ts is simply exemplified as "AAA".

The first communication control unit 54 controls to transmit the image data Vd acquired by the image pickup unit 51 and the test signal Ts generated by the test signal generation unit 53 to the outside. In the present embodiment, the transmission destination of these signals is the control device 7. The first communication control unit 54 transmits the image data Vd to the control device 7 at a predetermined timing and period on the clock pulse for performing operation control. Further, the first communication control unit 54 transmits the test signal Ts to the control device 7 at a timing when the image data Vd is not transmitted to the control device 7. Although not shown, the first communication control unit 54 also has a function of receiving a control signal transmitted from the control device 7 side and transmitting the control signal to each unit of the substrate recognition camera 5.

The I / F unit 55 is an interface circuit that enables mutual data communication between the substrate recognition camera 5 and the control device 7. The image data Vd and the test signal Ts are converted into a data format capable of data communication with the control device 7 in the I / F unit 55.

FIG. 4 schematically shows the transmission format of the image data Vd and the test signal Ts transmitted by the first communication control unit 54. H (High) and L (Low) are set as DVALs that determine the data communication timing on the time axis t of the control clock pulse. On the time axis t, the period H is treated as a valid period in which the image data Vd is transmitted, and the period L is treated as an invalid period in which the image data Vd is not transmitted. The invalid period is a period in which the image pickup unit 51 can perform an image pickup operation, or a period in which image pickup is actually performed, but the image data Vd is not transmitted. For example, it is a period between timings at which the pixel data of the frame image acquired by the image sensor is transferred.

The first communication control unit 54 transmits the image data Vd during the valid period. On the other hand, the first communication control unit 54 transmits the test signal Ts by utilizing the invalid period. That is, the test signal Ts is transmitted during the invalid period, which is between the valid periods during which the image data Vd is transmitted. This makes it possible to confirm the signal quality based on the test signal Ts without relying on the image data Vd at all. It should be noted that the imaging unit 51 may be in the imaging standby state, and the test signal Ts may be transmitted during the period between one imaging and the next imaging.

The image data Vd and the test signal Ts are transmitted from the substrate recognition camera 5 to the control device 7 through the communication cable 8. The communication cable 8 includes electric wires, coaxial lines, optical fibers, and the like that transmit signals such as image data and test signals. The periphery of these signal lines may be covered with a shielding layer for shielding or the like. Since the communication cable 8 includes a portion that repeatedly bends and extends as the head unit 4 moves, it is desirable to use a cable having a bending-resistant outer skin. Further, the communication cable 8 may be a cable in which a power line for supplying power to the head unit 4 is combined.

In addition to the image processing unit 72 and the main control unit 74 described above, the control device 7 includes an I / F unit 76, a second communication control unit 77 (data acquisition unit), an image data storage unit 78, and an abnormality detection unit 79 (first). Judgment unit) is provided. Further, the control device 7 is provided with an abnormality notification unit 71G.

The I / F unit 76 is an interface circuit that enables mutual data communication between the substrate recognition camera 5 and the control device 7. The image data Vd and the test signal Ts are converted into a data format that can be processed in the control device 7 in the I / F unit 76.

The second communication control unit 77 acquires the image data Vd and the test signal Ts transmitted from the first communication control unit 54. The second communication control unit 77 temporarily stores the acquired image data Vd in the image data storage unit 78. The image processing unit 72 executes necessary image processing (for example, image processing for specifying the position of the fiction mark FM described above) on the image data Vd stored in the image data storage unit 78. Further, the second communication control unit 77 extracts the test signal Ts from the acquired data and inputs it to the abnormality detection unit 79.

The abnormality detection unit 79 performs a process of determining the presence or absence of an abnormality in the test signal Ts. The abnormality detection unit 79 is provided with information on the comparison test signal Ts, which is the same as the test signal Ts generated by the test signal generation unit 53 of the substrate recognition camera 5. The abnormality detection unit 79 compares the comparison test signal Ts with the test signal Ts transmitted from the substrate recognition camera 5, and if they match, it is determined that data communication has been performed normally. On the other hand, if there is a discrepancy between the two, the abnormality detection unit 79 determines that a data abnormality has occurred.

FIG. 4 schematically shows a determination mode of the abnormality detection unit 79. It is assumed that the test signal Ts schematically indicated as "AAA" is transmitted from the first communication control unit 54 of the board recognition camera 5. If the test signal Ts detected by the abnormality detection unit 79 is the same "AAA", the abnormality detection unit 79 determines that data communication has been performed normally. In this case, it can be estimated that there is no abnormality in the communication cable 8. On the other hand, when the test signal Ts detected by the abnormality detection unit 79 is detected in a modified state from the test signal Ts on the transmitting side, for example, "AAB", the abnormality detection unit 79 has an abnormality in data communication. Judge that it has occurred.

For example, a data communication abnormality occurs due to factors such as disconnection of an electric wire or the like included in the communication cable 8, ground fault due to coating breakage, and superimposition of noise due to damage to the shielding layer. According to the first embodiment, it is possible to quickly find out whether or not an abnormality has occurred in the communication cable 8 which is the transmission line of the image data Vd based on the determination result of the abnormality detection unit 79. If the abnormal image data Vd is detected on the control device 7 side even though the test signal Ts is normally received, it means that the board recognition camera 5 itself has an abnormality. ..

When the abnormality detection unit 79 detects a data abnormality, the main control unit 74 causes the abnormality notification unit 71G to issue warning information for notifying the operator or the like of the occurrence of the abnormality. The warning information is, for example, an indication to the monitor device of the component mounting device 1 that a data abnormality has occurred, and lighting or blinking of an alarm lamp.

According to the configuration of the first embodiment described above, communication is performed only by setting the board recognition camera 5 in an operable state without actually performing an image pickup operation such as a fiction mark FM on the board recognition camera 5. It is possible to check the signal quality of communication between units through the cable 8. Of course, the signal quality can be confirmed even when the substrate recognition camera 5 is actually performing an imaging operation. That is, regardless of whether or not the image pickup unit 51 is actually performing the image pickup operation, the first communication control unit 54 transmits the test signal Ts to the control device 7 and checks for data abnormality based on the test signal Ts. Can be done. Therefore, it is possible to detect a data abnormality before the mounting unit 40 starts actual operation.

Further, the test signal Ts is transmitted during the invalid period during which the image data Vd is not transmitted during the period during which the image pickup unit 51 can take an image. For example, when reading the pixel data of the frame image, the test signal Ts is generated by using the invalid period in which the pixel data is not transferred, which exists before and after the valid period (DVAL = H) for transferring each pixel data. Will be sent. Therefore, the test signal Ts can be transmitted without depending on the existence of the image data.

The operation of causing the test signal generation unit 53 of the board recognition camera 5 to generate the test signal Ts and causing the first communication control unit 54 to transmit the test signal Ts is executed based on the instruction signal issued by the main control unit 74 of the control device 7. Can be made to. In this case, it is desirable that the main control unit 74 transmits an instruction signal for causing the board recognition camera 5 to execute the test signal Ts transmission operation before the mounting unit 40 starts the operation of mounting the electronic components on the board P. .. As a result, it is possible to detect the presence or absence of a data abnormality, that is, the detection of an abnormality of the communication cable 8 or the like before the substrate production operation for mounting the electronic component is performed. Therefore, it is possible to prevent a defect in which the substrate is produced in a state where an abnormality exists in the communication path and a defective product is produced.

<Example 2>
FIG. 6 is a schematic diagram of a component mounting device 1 having a signal quality confirmation configuration according to a second embodiment. The apparatus configuration of the second embodiment is the same as that of the first embodiment. The difference from the first embodiment is that the test signal Ts is always transmitted during the period in which the mounting unit 40 can operate, excluding the valid period for transmitting the image data Vd. The period during which the mounting unit 40 can operate is simply a period during which the power of the mounting unit 40 is turned on, and includes a period during which the substrate recognition camera 5 has not reached the image pickup standby state.

In the second embodiment, after the power is turned on to the component mounting device 1, the test signal generation unit 53 generates the test signal Ts, and the first communication control unit 54 generates the test signal Ts during a period other than the valid period. Is executed to the control device 7. For example, immediately after the power is turned on, the image data Vd is not acquired, and as shown in FIG. 6, the invalid period continues for the time being. The first communication control unit 54 constantly transmits, for example, the test signal Ts of "AAA" during the invalid period.

The second communication control unit 77 of the control device 7 receives the test signal Ts, and the abnormality detection unit 79 detects the received test signal Ts. If the detected test signal Ts is the same "AAA", it is determined that the data communication is normal, and if it is in a modified state such as "AAB", it is determined that an abnormality has occurred in the data communication.

According to the configuration of the second embodiment, the test signal Ts is always transmitted during the period during which the mounting unit 40 can operate and excluding the valid period for transmitting the image data Vd. That is, the test signal Ts is always transmitted and the abnormality is detected from the timing when the power of the component mounting device 1 is turned on. Therefore, it is possible to reliably detect a data abnormality before the mounting unit 40 actually operates the board for production.

<Example 3>
FIG. 7 is a schematic diagram of a component mounting device 1 having a signal quality confirmation configuration according to a third embodiment. In the third embodiment, an example in which the intermediate unit 9 is interposed between the mounting unit 40 (first unit) and the base portion 10 (second unit) is shown. The intermediate unit 9 is a unit that relays the transmission of the image data Vd and the test signal Ts, and has a function of determining whether or not the test signal Ts is abnormal. That is, it can be said that the communication cable 8 is composed of the upstream communication cable 81 and the downstream communication cable 82.

In the third embodiment, the communication cable 8 includes an upstream communication cable 81 and a downstream communication cable 82. The upstream communication cable 81 connects the board recognition camera 5 and the intermediate unit 9 so as to be capable of data communication. The downstream communication cable 82 connects the intermediate unit 9 and the control device 7 so as to be capable of data communication.

In the general component mounting device 1, the electrical device mounted on the base portion 10 (for example, the board recognition camera 5) and the control unit (control device 7) mounted on the mounting unit 40 are electrically connected. In this case, in consideration of assembleability and maintainability, the cable pulled out from the board recognition camera 5 side and the cable pulled out from the control device 7 side are connected by a connector. The upstream communication cable 81 corresponds to a cable pulled out from the board recognition camera 5 side, and the downstream communication cable 82 corresponds to a cable pulled out from the control device 7 side. In the second embodiment, by interposing the intermediate unit 9 capable of detecting the abnormality of the test signal Ts, whether the data abnormality is caused by the abnormality of the camera side, that is, the board recognition camera 5 itself or the upstream communication cable 819, the control unit. It is possible to determine whether the cause is an abnormality on the side, that is, the downstream communication cable 82.

FIG. 8 is a block diagram of the component mounting device 1 having a configuration related to signal quality confirmation according to the third embodiment. The configuration of the substrate recognition camera 5 and the control device 7 is the same as that of the first embodiment (FIG. 5) described above. However, the "abnormality detection unit 79" of the control device 7 in FIG. 5 is described as "first abnormality detection unit 79A" in FIG. 8 (both functions are the same), and the description of the abnormality notification unit 71G. Is omitted.

The intermediate unit 9 includes an I / F unit 91, a third communication control unit 92, a second abnormality detection unit 93, and a data shaping unit 94. The I / F unit 91 is an interface circuit that enables mutual data communication between the substrate recognition camera 5 and the intermediate unit 9, and between the intermediate unit 9 and the control device 7. The image data Vd and the test signal Ts are converted into a data format capable of data communication in the I / F unit 91.

The third communication control unit 92 acquires the image data Vd and the test signal Ts transmitted from the first communication control unit 54 of the board recognition camera 5. The third communication control unit 92 performs a simple relay operation for the image data Vd, and inputs the test signal Ts to the second abnormality detection unit 93. Further, the third communication control unit 92 controls to transmit the image data Vd and the test signal Ts to the control device 7.

The second abnormality detection unit 93 performs a process of determining the presence or absence of an abnormality in the test signal Ts, similarly to the abnormality detection unit 79 of the first embodiment and the first abnormality detection unit 79A of the control device 7. The second abnormality detection unit 93 is provided with information on the comparison test signal Ts, which is the same as the test signal Ts generated by the test signal generation unit 53 of the substrate recognition camera 5. The second abnormality detection unit 93 compares the comparison test signal Ts with the test signal Ts transmitted from the board recognition camera 5, and when they match, the data via the upstream communication cable 81. It is determined that the communication has been performed normally. On the other hand, when there is a discrepancy between the two, the second abnormality detection unit 93 determines that a data abnormality has occurred.

The data shaping unit 94 performs a process of shaping the test signal Ts transmitted from the board recognition camera 5 side and detected by the second abnormality detection unit 93 into the original test signal Ts. For example, it is assumed that the test signal Ts with "AAA" transmitted from the board recognition camera 5 side via the upstream communication cable 81 is transformed into "AAB" by the second abnormality detection unit 93 and detected. In this case, the data shaping unit 94 shapes the signal with "AAB" into the original test signal Ts with "AAA", and inputs it to the third communication control unit 92 as the test signal Ts to be used in the next stage. On the other hand, when the test signal Ts with "AAA" is detected as "AAA" by the second abnormality detection unit 93, the signal shaping process is passed through and the "AAA" is directly transmitted to the third communication control unit 92 as a test signal. Enter as Ts.

The third communication control unit 92 transmits the shaped or passed test signal Ts to the control device 7 via the downstream communication cable 82. The processing in the control device 7 is the same as that in the first embodiment. In the first abnormality detection unit 79A, a process of determining the presence or absence of an abnormality in the test signal Ts received by the second communication control unit 77 is performed.

The operation of the signal quality confirmation in the component mounting apparatus 1 of the third embodiment will be described with reference to FIG. 7. The image data Vd and the test signal Ts of, for example, “AAA” are transmitted from the first communication control unit 54 of the board recognition camera 5 to the intermediate unit 9 through the upstream communication cable 81. Similar to the first embodiment, the image data Vd is transmitted during the valid period of DVAL = H, and the test signal Ts is transmitted during the invalid period of DVAL = L.

In the intermediate unit 9, the first signal quality check is performed. If the test signal Ts = "AAA" is detected by the second abnormality detection unit 93, it is confirmed that there is no abnormality in the upstream communication cable 81 on the board recognition camera 5 side. On the other hand, when other than "AAA" is detected, it is found that an abnormality exists in the upstream communication cable 81. After that, the data shaping unit 94 shapes the test signal Ts as needed. Then, the image data Vd and the test signal Ts of "AAA" are transmitted from the third communication control unit 92 to the control device 7 through the downstream communication cable 82. Similar to the above, the image data Vd is transmitted during the valid period of DVAL = H, and the test signal Ts is transmitted during the invalid period of DVAL = L.

In the control device 7, the second signal quality confirmation is performed. If the test signal Ts = "AAA" is detected by the first abnormality detection unit 79A, it is confirmed that there is no abnormality in the downstream communication cable 82. On the other hand, when a modified signal is detected, for example, "AAB", it is found that an abnormality exists in the downstream communication cable 82.

According to the third embodiment, it is possible to separately detect whether the abnormality exists on the mounting unit 40 side or the base portion 10 side with the intermediate unit 9 as a boundary. For example, when only the second abnormality detection unit 93 of the intermediate unit 9 detects an abnormality in the test signal Ts, it is found that the upstream communication cable 81 or the board recognition camera 5 has an abnormality in the entire communication path between the units. can. Therefore, the cause of the abnormality can be quickly detected, and the operator can quickly start the necessary repair work.

<Example 4>
In the fourth embodiment, a suitable example is shown when a plurality of cameras are mounted on the mounting unit 40. A wide variety of cameras may be mounted on the head unit 4 of the mounting unit 40 in order to realize various functions. An example thereof is shown in FIG. FIG. 9 is a side view showing a schematic configuration of a mounting unit 40A having a plurality of cameras. The same parts as those of the mounting unit 40 shown in FIG. 2 are designated by the same reference numerals, and the description thereof will be omitted. A scan unit 6 is attached to the head unit 4 of the mounting unit 40A, and a first board recognition camera 5A, a second board recognition camera 5B, and a scan camera 62 are mounted.

The first and second substrate recognition cameras 5A and 5B are cameras that capture the fiction mark FM attached to the surface of the substrate P, similarly to the substrate recognition camera 5 shown in FIG. The first substrate recognition camera 5A is mounted on the left side surface of the head unit 4, and the second substrate recognition camera 5B is mounted on the right side surface.

The scan unit 6 is mounted near the lower end of the head unit 4 so as to be movable in the X direction with respect to the head unit 4. The scan unit 6 includes a ball screw shaft 61 for realizing the movement in the X direction and a scan camera 62 for the imaging. The ball screw shaft 61 extends in the X direction and is attached to the head unit 4. The ball screw shaft 61 is driven by the camera shaft servomotor 45 shown in FIG. The scan camera 62 is a camera that captures an image of an electronic component sucked by the suction nozzle 42 from the side surface side. Based on the image data obtained by this imaging, the amount of positional deviation in the X-axis and Y-axis directions of the electronic component and the amount of rotational deviation in the R-axis direction are detected.

FIG. 10 is a schematic diagram of a component mounting device 1 having a signal quality confirmation configuration according to a fourth embodiment. In the fourth embodiment, an example is shown in which the mounting unit 40A includes a first camera 50A (first imaging unit) and a second camera 50B (second imaging unit). The first camera 50A and the second camera 50B assume any two of the first board recognition camera 5A, the second board recognition camera 5B, and the scan camera 62 shown in FIG. The point that the intermediate unit 9A is interposed between the mounting unit 40A (first unit) and the base portion 10 (second unit) is the same as that of the third embodiment.

The first camera 50A is connected to the intermediate unit 9A via the first upstream communication cable 81A so as to be capable of data communication. The second camera 50B is connected to the intermediate unit 9A via a second upstream communication cable 81B so as to be capable of data communication. The intermediate unit 9A and the base portion 10 are connected by a downstream communication cable 82. In the fourth embodiment, the first camera 50A, the second camera 50B, and the intermediate unit 9A each transmit their own test signals Ts, whereby the first upstream communication cable 81A, the second upstream communication cable 81B, or the downstream communication cable It is possible to detect which of 82 the abnormality has occurred.

FIG. 11 is a block diagram of the component mounting device 1 having a configuration related to signal quality confirmation according to the fourth embodiment. The first camera 50A and the second camera 50B have the same image pickup units 51A and 51B and the camera control unit 52A as the image pickup unit 51, the camera control unit 52 and the I / F unit 55 of the above-described first embodiment (FIG. 5). It includes 52B and I / F units 55A and 55B.

In addition to these, the first camera 50A includes a first test signal generation unit 53A (first data generation unit) and a first camera communication control unit 54A. The first test signal generation unit 53A generates a unique first test signal Ts1 preset for checking the signal quality of the first camera 50A. The first camera communication control unit 54A transmits the first test signal Ts1 and the image data Vd1 generated by the image pickup unit 51A toward the intermediate unit 9A. Ts1 and Vd1 are transmitted to the intermediate unit 9 via the I / F unit 55A and the first upstream communication cable 81A.

The second camera 50B includes a second test signal generation unit 53B (first data generation unit) and a second camera communication control unit 54B. The second test signal generation unit 53B generates a unique second test signal Ts2 preset for checking the signal quality of the second camera 50B. The second camera communication control unit 54B transmits the second test signal Ts2 and the image data Vd2 generated by the image pickup unit 51B toward the intermediate unit 9A. Ts2 and Vd2 are transmitted to the intermediate unit 9 via the I / F unit 55B and the second upstream communication cable 81B.

The intermediate unit 9A includes an I / F unit 91, a third communication control unit 92, a second abnormality detection unit 93, and a third test signal generation unit 95 (second data generation unit) similar to the intermediate unit 9 of the third embodiment. And have. The third test signal generation unit 95 generates a unique third test signal Ts3 preset for quality confirmation between the intermediate unit 9A and the base unit 10.

The I / F unit 91 of the fourth embodiment is an interface circuit that enables mutual data communication between the first camera 50A and the second camera 50B and the intermediate unit 9A, and between the intermediate unit 9A and the control device 7. Is. The image data Vd1 and Vd2 and the test signals Ts1 and Ts2 are converted into a data format capable of data communication in the I / F unit 91.

The third communication control unit 92 acquires the image data Vd1 and Vd2 and the test signals Ts1 and Ts2 transmitted from the first camera 50A and the second camera 50B. The third communication control unit 92 performs a simple relay operation for the image data Vd1 and Vd2, and inputs the test signals Ts1 and Ts2 to the second abnormality detection unit 93. Further, the third communication control unit 92 transmits the image data Vd1 and Vd2 and the third test signal Ts3 newly generated by the third test signal generation unit 95 to the control device 7.

The second abnormality detection unit 93 performs a process of determining whether or not the first test signal Ts1 of the first camera 50A and the second test signal Ts2 of the second camera 50B are abnormal. The second abnormality detection unit 93 contains information on the comparison test signals Ts1 and Ts2, which are the same as the first and second test signals Ts1 and Ts2 generated by the first and second test signal generation units 53A and 53B, respectively. Given. The second abnormality detection unit 93 compares the comparison test signals Ts1 and Ts2 with the first and second test signals Ts1 and Ts2 transmitted from the camera side, respectively, and when they match, the first , It is determined that the data communication via the second upstream communication cables 81A and 81B has been normally performed. On the other hand, when there is a discrepancy between the two, the second abnormality detection unit 93 determines that a data abnormality has occurred.

The control device 7 has substantially the same configuration as that of the first to third embodiments. However, the difference is that the test signal for signal quality confirmation is not the one created on the camera side, but the third test signal Ts3 created by the intermediate unit 9A. That is, the first abnormality detection unit 79A performs a process of determining the presence or absence of an abnormality in the third test signal Ts3 received by the second communication control unit 77.

The operation of the signal quality confirmation in the component mounting apparatus 1 of the fourth embodiment will be described with reference to FIG. From the first camera 50A, the image data Vd1 and the first test signal Ts1 with, for example, "AAA" are transmitted to the intermediate unit 9A through the first upstream communication cable 81A. Further, from the second camera 50B, the image data Vd2 and the second test signal Ts2 with, for example, "BBB" are transmitted to the intermediate unit 9A through the second upstream communication cable 81B. Similar to Examples 1 to 3, image data Vd1 and Vd2 are transmitted during the valid period of DVAL = H of each camera, and test signals Ts1 and Ts2 are transmitted during the invalid period of DVAL = L, respectively.

In the intermediate unit 9A, the first signal quality check is performed. If the first test signal Ts1 = "AAA" is detected by the second abnormality detecting unit 93, it is confirmed that there is no abnormality in the first upstream communication cable 81A of the first camera 50A. On the other hand, when it is detected as "AAB" other than "AAA", it is found that an abnormality exists in the first upstream communication cable 81A. Similarly, if the second test signal Ts2 = "BBB" is detected by the second abnormality detection unit 93, it is confirmed that there is no abnormality in the second upstream communication cable 81B of the second camera 50B. On the other hand, when it is detected as "ABB" other than "BBB", it is found that an abnormality exists in the second upstream communication cable 81B.

In parallel with the above-mentioned first-order signal quality confirmation process, the intermediate unit 9A generates a third test signal Ts3. The third test signal Ts3 is a test signal different from both the first and second test signals Ts1 and Ts2. From the intermediate unit 9A, the relayed image data Vd1 and Vd2 and, for example, the third test signal Ts3 of "CCC" are transmitted to the control device 7 through the downstream communication cable 82. Similar to the above, the image data Vd1 and Vd2 are transmitted during the valid period of DVAL = H, and the third test signal Ts3 is transmitted during the invalid period of DVAL = L.

In the control device 7, the second signal quality confirmation is performed. If the third test signal Ts3 = "CCC" is detected by the first abnormality detection unit 79A, it is confirmed that there is no abnormality in the downstream communication cable 82. On the other hand, when a modified signal is detected, for example, "CCB", it is found that an abnormality exists in the downstream communication cable 82.

According to the fourth embodiment, it is possible to separately detect whether the abnormality exists on the mounting unit 40A side or the base portion 10 side with the intermediate unit 9A as a boundary. It is also possible to determine whether the communication path of the first camera 50A or the second camera 50B has an abnormality. Further, the abnormality of the downstream communication cable 82 can be detected separately from the mounting unit 40A side. Therefore, the cause of the abnormality can be quickly detected, and the operator can quickly start the necessary repair work.

[Operation flow]
The operation related to the signal quality confirmation of the component mounting device 1 will be described with reference to the flowchart shown in FIG. Here, the operation will be described mainly with reference to the block diagram shown in FIG. When the power of the component mounting device 1 is turned on, the power of the base portion 10 is turned on (step S1), and the power of the mounting unit 40 (board recognition camera 5) is turned on (step S2), control is performed. The processing of the device 7 is in the standby state. In Examples 3 and 4, power is also turned on to the intermediate units 9 and 9A.

Subsequently, the test signal generation unit 53 generates the test signal Ts, and the first communication control unit 54 transmits the test signal Ts to the control device 7 (step S3). In the first embodiment, this transmission is performed using an invalid period during which the image data Vd acquired by the image pickup unit 51 is not transmitted. In the second embodiment, the transmission is started immediately after the power is turned on, and in the state where the image pickup unit 51 has acquired the image data Vd, the test signal Ts is transmitted during the invalid period.

The transmitted test signal Ts (and image data Vd) is received by the second communication control unit 77 of the control device 7 (step S4). The test signal Ts is input to the abnormality detection unit 79. The abnormality detection unit 79 compares the received test signal Ts with the comparison test signal Ts given in advance, and performs a pattern check as to whether or not both signals match (step S5). When the reception test signal Ts and the comparison test signal Ts match (YES in step S5), the abnormality detection unit 79 determines that the data communication has been performed normally, and counts up the "normal counter" by one. (Step S6).

Next, the abnormality detection unit 79 determines whether or not the count number of the "normal counter" has reached a preset designated number of times (step S7). The designated number of times is, for example, 20 times. This is to prevent the determination in step S7 from being affected by sudden noise, rare errors, or the like. When the specified number of times is reached (YES in step S7), the abnormality detection unit 79 determines that the data communication via the communication cable 8 is in the "normal state" (step S8). If the specified number of times has not been reached (NO in step S7), the process returns to step S5, and the pattern check of the reception test signal Ts in the next stage is performed.

If it is determined in step S8 that it is in a "normal state", transmission / reception of image data Vd is permitted. It is confirmed whether or not the image data Vd exists at present (step S9). When the image data Vd exists (YES in step S9), the transmission / reception of the image data Vd is performed between the substrate recognition camera 5 and the base portion 10 (step S10). After that, it is confirmed whether or not the imaging by the substrate recognition camera 5 is completed (step S11), and if it is not completed, the process returns to step S9. When the imaging is completed, the process is finished. On the other hand, when the image data Vd does not exist (NO in step S9), the process returns to step S5 and the process is performed.

On the other hand, when the reception test signal Ts and the comparison test signal Ts do not match in the pattern check in step S5 (NO in step S5), the abnormality detection unit 79 determines that an abnormality has occurred in the data communication. Then, the "abnormality counter" is counted up by one (step S12). Subsequently, the abnormality detection unit 79 determines whether or not the count number of the "abnormality counter" has reached a preset designated number of times (step S13). When the specified number of times is reached (YES in step S13), the abnormality detection unit 79 determines that the data communication via the communication cable 8 is in the "abnormal state" (step S14). If the specified number of times has not been reached (NO in step S13), the process returns to step S5.

When it is determined that the state is "abnormal", the abnormality detection unit 79 sets an "abnormal flag" indicating a data abnormality (step S15). In this case, transmission / reception of image data Vd is prohibited. Corresponding to the above-mentioned "abnormality flag", the main control unit 74 causes the abnormality notification unit 71G to issue warning information for notifying the operator or the like of the occurrence of an abnormality (step S16). With this warning, the operation of the component mounting device 1 is stopped.

As described above, according to the present invention, in a multi-unit system such as a component mounting device 1 in which a unit provided with an image pickup unit and another unit are connected so as to be capable of data communication by a communication cable, the image data Vd is dependent on the unit. It is possible to quickly detect an abnormality in the communication path without doing so.

In the above embodiment, an example is shown in which a test signal Ts is generated on the substrate recognition camera 5 side and transmitted to the control device 7, and an abnormality in the test signal Ts received on the control device 7 side is detected. On the contrary, the control device 7 may generate a test signal Ts and transmit it to the board recognition camera 5, and may be configured to detect an abnormality in the test signal Ts received by the board recognition camera 5. ..

1 Component mounting device (multi-unit system)
10 Base (2nd unit)
40 Mounting unit (1st unit)
5 Board recognition camera (imaging unit)
50A 1st camera (1st imaging unit)
50B 2nd camera (2nd image pickup unit)
53 Test signal generation unit (first data generation unit)
54 First communication control unit (transmission unit)
7 Control unit (control unit)
77 Second communication control unit (data acquisition unit)
79 Abnormality detection unit (first judgment unit)
8 Communication cable 81 Upstream communication cable 81A, 81B 1st and 2nd upstream communication cable 82 Downstream communication cable 9 Intermediate unit 93 2nd abnormality detection unit (2nd judgment unit)
94 Data shaping unit 95 3rd test signal generation unit (2nd data generation unit)
Vd image data Ts test signal

Claims (9)

A first image device including an image pickup unit that captures an image and generates image data, a first data generation unit that generates a predetermined test signal, and a transmission unit that can transmit the image data and the test signal to the outside. With the unit,
A second unit including a data acquisition unit for acquiring the image data and the test signal, and a first determination unit for determining the presence or absence of an abnormality in the test signal.
A communication cable for connecting the first unit and the second unit so as to be capable of data communication is provided.
The transmission unit is a multi-unit system that transmits the test signal at a timing when the image data is not transmitted to the second unit. In the multi-unit system according to claim 1,
The transmission unit is a multi-unit system that transmits the test signal during an invalid period during which the image data is not transmitted during a period in which the image pickup unit is capable of imaging. In the multi-unit system according to claim 1,
The transmission unit is a multi-unit system that constantly transmits the test signal during a period during which the first unit can operate, excluding an effective period for transmitting the image data. In the multi-unit system according to any one of claims 1 to 3, further
An intermediate unit that is interposed between the first unit and the second unit and relays the transmission of the image data is provided.
The intermediate unit includes a second determination unit for determining the presence or absence of an abnormality in the test signal.
The communication cable is a multi-unit system including an upstream communication cable connecting the first unit and the intermediate unit, and a downstream communication cable connecting the intermediate unit and the second unit. In the multi-unit system according to claim 4,
The image pickup unit includes a first image pickup unit and a second image pickup unit.
The first data generation unit generates a first test signal for the first imaging unit and a second test signal for the second imaging unit.
The upstream communication cable is a multi-unit including a first upstream communication cable connecting the first imaging unit and the intermediate unit, and a second upstream communication cable connecting the second imaging unit and the intermediate unit. system. In the multi-unit system according to claim 4 or 5.
The intermediate unit is a multi-unit system including a data shaping unit that shapes the test signal transmitted via the upstream communication cable into the original test signal when the test signal is deformed. In the multi-unit system according to claim 4 or 5.
The intermediate unit is a multi-unit system including a second data generation unit that generates a test signal different from the test signal generated by the first data generation unit. In the multi-unit system according to any one of claims 1 to 7.
The first unit is a mounting unit that performs an operation of mounting electronic components on a board.
The second unit is a multi-unit system, which is a control unit that controls the operation of the mounting unit. In the multi-unit system according to claim 8,
The control unit is a multi-unit system that transmits an instruction signal for causing the mounting unit to execute a transmission operation of the test signal before the mounting unit starts an operation of mounting an electronic component on the board.

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