JP2022065385A - Metal chip scattering prevention device - Google Patents

Abstract

To provide a metal chip scattering prevention device which is used for preventing scattering of metal chips occurring when drilling a metal-worked member such as a switchboard by a drill or the like.SOLUTION: A metal chip scattering prevention device has: an electromagnet 2 for adsorption of a worked surface, which is annularly formed and generates magnetic adsorption force on one end face in an axial direction that faces a worked surface 4a; an electromagnet 3 for adsorption of chips which is disposed inside the electromagnet 2 for adsorption of worked surface, is annularly formed so that a drilling tool can be inserted therein, and generates magnetic adsorption force on an inner periphery; and a housing 6 which houses the electromagnet 2 for adsorption of worked surface and the electromagnet 3 for adsorption of chips. There are provided in the housing 6, a first power source 24 which can energize the electromagnet 2 for adsorption of worked surface, a second power source 34 which can energize the electromagnet 3 for adsorption of chips, a first switch 25 which turns on and off electric conduction to the electromagnet 2 for adsorption of worked surface from the first power source 24, and a second switch 35 which turns on and off electric conduction to the electromagnet 3 for adsorption of chips from the second power source 34.SELECTED DRAWING: Figure 1

Description

The present invention relates to a metal chip scattering prevention device used for preventing the scattering of metal chips generated when drilling a metal processing member such as a switchboard with a drill or the like.

When drilling a metal processing member such as a switchboard using a processing tool such as an electric drill, not a little metal chips are generated. For this reason, in drilling using a processing tool, a curing sheet is laid below the processing site in order to collect scattered metal chips. However, when the number of processing points increases, it is necessary to change the laying position of the curing sheet each time or lay a large number of curing sheets according to the processing points, which requires time and effort to prepare for processing. .. In addition, since the scattering range of metal chips varies, there is also the inconvenience that chips cannot be collected efficiently.
Further, depending on the location, it may not be possible to lay the curing sheet well below the processed portion, and in such a location, it becomes more difficult to effectively collect metal chips.

Therefore, conventionally, a chip scattering prevention device as shown in Patent Document 1 has been proposed. This chip scattering prevention tool includes an insertion portion formed in a tubular shape so that the drilling tool can be inserted, and an opposing portion formed so as to face the drilling surface on the side of one end of the insertion portion. When the facing portion of the main body faces the drilling surface while being detachably provided around the main body and one end of the insertion portion in the main body and attached to the periphery of one end of the insertion portion. A permanent magnet that attracts to the drilling surface with the facing portion sandwiched between them, and a permanent magnet that is detachably provided with respect to the other end of the insertion portion in the main body, and when attached to the other end of the insertion portion, other than the insertion portion It is configured with a lid that closes the opening at the end, and the main body is attracted to the machined surface by a permanent magnet, and the metal chips generated during the machining of the machined surface are attracted to the inner surface of the insertion part, and the metal chips are attracted. Not only does it prevent the scattering of metal chips, but it also makes it easy to collect and dispose of the generated metal chips.

Further, as shown in Patent Document 2, a coil is wound around the base of a drill drill or tap, and the coil is energized to magnetize the drill drill or tap, whereby metal chips are magnetized on the drill drill or tap to cut metal. A drilling device for preventing powder scattering has also been proposed.

Japanese Unexamined Patent Publication No. 2018-15393 Jitsukaisho 53-163788 Gazette

However, the former chip scattering prevention tool realizes the function of adsorbing the main body to the machined surface and the function of collecting chips with a common permanent magnet, so that the permanent magnet is removed from the main body when it is removed from the machined surface. If it comes off, there is a disadvantage that the collected chips are scattered. In order to deal with such inconvenience, it is necessary to close the insertion part for inserting the drilling part with a lid before removing the main body from the machined surface, and a permanent magnet to dispose of the collected chips. It was necessary to prevent the lid from coming off even when the magnet was removed from the main body, and a lot of careful work was required from the collection of chips to the disposal.

In addition, the latter drilling device magnetizes the drill drill or tap with a coil wound around the base to directly adsorb the metal chip to the drill drill or tap, so that the drill drill or tap that has been exposed for the work of collecting and disposing of the metal chip can be used. It must be done in close proximity to or in contact with the tap and may cause injury. In addition, not all metal chips are adsorbed on the drill drill or tap, so there is an inconvenience that the metal chips separated from the drill drill or tap cannot be collected and discarded.

The present invention has been made in view of the above circumstances, and effectively collects metal chips generated by drilling a metal processing member without scattering them, and at the time of removal from the processed surface or collection of chips. The main issue is to provide a metal chip scattering prevention device that does not have the inconvenience of scattering metal chips even at the time of disposal.

In order to achieve the above problems, the metal chip scattering prevention device according to the present invention is an electromagnet for machined surface adsorption that is formed in an annular shape and generates a magnetic attraction force on one end surface in the axial direction facing the machined surface. The chip adsorption electromagnet, which is arranged inside the machined surface adsorption electromagnet and is formed in an annular shape so that a drilling tool can be inserted, and generates a magnetic attraction force on the inner peripheral surface, and the machined surface. It has an electromagnet for adsorption and a housing for accommodating the electromagnet for chip adsorption.
The housing has a first power source capable of energizing the machined surface adsorption electromagnet, a second power source capable of energizing the chip adsorption electromagnet, and the first power source to the machined surface adsorption electromagnet. It is characterized in that a first switch for turning on / off the energization and a second switch for turning on / off the energization of the chip adsorption electromagnet from the second power source are provided.

According to such a configuration, the magnetic attraction force of the electromagnet for adsorbing the machined surface is generated by turning on / off the first switch, adsorbing to the machined surface by stopping, releasing the adsorption, and adsorbing chips by turning the second switch on / off. The metal chip scattering prevention device can be easily attached to and detached from the machined surface by generating the magnetic attraction force of the electromagnet, adsorbing the metal chips by stopping, and releasing the adsorption, and also easily adsorbs the metal chips generated by the drilling process. It can be separated (collected and discarded).

That is,
・ Fixing of chip scattering prevention device to the machined surface
When the first switch is turned on, the electromagnet for attracting the machined surface is energized from the first power source, and a magnetic attraction force is generated on one end surface in the axial direction facing the machined surface to attract the chip scattering prevention device to the machined surface. Let, let
・ Collection of metal chips by drilling holes in the machined surface
The second switch is turned on and the chip adsorption electromagnet is energized from the second power source to generate a magnetic attraction force on the inner peripheral surface of the chip adsorption electromagnet, and the metal chips generated by drilling with a drilling tool are removed. Adsorb to the chip adsorption electromagnet,
(3) Removal of chip scattering prevention device from the machined surface
The first switch is turned off to release the energization of the electromagnet for attracting the machined surface from the first power source, and the magnetic attraction force generated on one end face in the axial direction facing the machined surface is eliminated, and chips are scattered. Separate the preventive device from the machined surface,
(4) Disposal of metal chips
The second switch is turned off to release the energization of the chip adsorption electromagnet from the second power source, the magnetic adsorption force generated on the inner peripheral surface of the chip adsorption electromagnet is eliminated, and the collected metal chips are collected. To separate,
By performing a series of operations, the chip scattering prevention device can be easily attached to and detached from the machined surface, and the metal chips generated by drilling can be easily adsorbed and separated (collected and discarded). Become.

As a more specific configuration example of the chip scattering prevention device described above, the first coil accommodating groove is formed in an annular shape along the circumferential direction on one end surface in the axial direction facing the machined surface. A first magnetic material and an electromagnet for attracting a machined surface having a first exciting coil housed in the first coil accommodating groove.
A second coil accommodating groove is formed in an annular shape on the inner peripheral surface along the circumferential direction while being arranged inside the electromagnet for attracting the machined surface and being formed in an annular shape so that a drilling tool can be inserted. A magnetic material, an electromagnet for adsorbing chips having a second exciting coil housed in the second coil accommodating groove, and an electromagnet for adsorbing chips.
It has a machined surface adsorption electromagnet and a housing for accommodating the chip adsorption electromagnet.
A first non-magnetic material is interposed between the machined surface adsorption electromagnet and the chip adsorption electromagnet, and also covers one end surface in the axial direction facing the machined surface of the chip adsorption electromagnet. A second non-magnetic material is provided in
The housing has a first power source capable of energizing the machined surface adsorption electromagnet, a second power source capable of energizing the chip adsorption electromagnet, and the first power source to the machined surface adsorption electromagnet. It is conceivable that a first switch for turning on / off the energization and a second switch for turning on / off the energization of the chip adsorption electromagnet from the second power source are provided.

Here, the first power supply, the second power supply, the first switch, and the second switch are an outer peripheral wall covering the radial outside of the machined surface adsorption electromagnet of the housing, or the machined surface suction. It is preferable to provide the electromagnet for chip and the electromagnet for chip adsorption on the end wall of the housing covering the other end surface on the opposite side in the axial direction from the side facing the processed surface.
With such a configuration, the power supply and the switch are arranged in an easily accessible location of the housing except for the surface that generates the magnetic attraction force, so that good operability can be ensured.

The housing may be formed of a non-magnetic material accommodating an electromagnet for adsorbing a machined surface and an electromagnet for adsorbing chips, and the first non-magnetic material may be integrally formed.
Further, the housing includes a first housing portion made of a non-magnetic material accommodating a machined surface adsorption electromagnet, and a second housing portion made of a non-magnetic material accommodating a chip adsorption electromagnet. The first non-magnetic material may be formed by the wall portions of the first housing portion and the second housing portion facing each other.

Further, the electromagnet for adsorbing chips may be detachably attached. With such a configuration, maintenance of the chip adsorption electromagnet can be performed more easily, and a plurality of chip adsorption electromagnets having different specifications are prepared to be suitable for work. It is also possible to select and attach an electromagnet for chip (for example, an electromagnet for chip adsorption that matches the inner diameter of the second housing portion and the chip adsorption capacity).

As described above, according to the metal chip scattering prevention device of the present invention, an annular machined surface adsorption electromagnet that generates a magnetic attraction force on one end face in the axial direction facing the machined surface, and this machined surface. It is arranged inside the electromagnet for attraction, is formed in an annular shape so that the drilling tool can be inserted, and has an electromagnet for chip adsorption that generates magnetic attraction on the inner peripheral surface, and the first switch is turned on. Generation of magnetic force of the electromagnet for attracting the machined surface by cutting, adsorption to the machined surface by stopping, release of adsorption, generation of magnetic force of the electromagnet for chip adsorption by turning on / off the second switch, adsorption and adsorption of metal chips by stopping Since it can be released, a chip scattering prevention device can be easily attached to and detached from the machined surface, and metal chips generated by drilling can be easily adsorbed and separated (collected and discarded).

FIG. 1 is a cross-sectional view showing a schematic configuration of a first embodiment of the metal chip scattering prevention device according to the present invention. 2A is a front view of the metal chip scattering prevention device shown in FIG. 1, and FIG. 2B is a back view of the metal chip scattering prevention device shown in FIG. 1. FIG. 3 is a diagram illustrating an operation of attaching (adsorbing) the metal chip scattering prevention device according to the present invention to the machined surface. FIG. 4 is a diagram showing a state when the second switch is turned on after the metal chip scattering prevention device is attached to the machined surface. FIG. 5 is a diagram illustrating a work of drilling a machined surface with a drilling tool. FIG. 6 is a diagram illustrating an operation of removing the metal chip scattering prevention device from the machined surface after drilling. FIG. 7 is a diagram illustrating an operation of discarding the collected chips (separating from the metal chip scattering prevention device). FIG. 8 is a cross-sectional view showing a schematic configuration of a second embodiment of the metal chip scattering prevention device according to the present invention. FIG. 9 is a cross-sectional view showing a schematic configuration of a third embodiment of the metal chip scattering prevention device according to the present invention. FIG. 10 is a cross-sectional view showing a schematic configuration of a fourth embodiment of the metal chip scattering prevention device according to the present invention. FIG. 11 is a cross-sectional view showing a schematic configuration of a fifth embodiment of the metal chip scattering prevention device according to the present invention. In each drawing except FIG. 2, the power supply and the switch are schematically shown for easy understanding.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 and 2 show the first form of the metal chip scattering prevention device 1.
The metal chip scattering prevention device 1 is configured by combining two electromagnets, an electromagnet 2 for adsorbing a machined surface and an electromagnet 3 for adsorbing chips.

The machined surface adsorption electromagnet 2 is a first magnetic material 22 in which a first coil accommodating groove 21 is formed in an annular shape along the circumferential direction on one end surface 2a in the axial direction facing the machined surface 4a. It has a first exciting coil 23 housed in the first coil housing groove 21 and resin-molded.

The chip adsorption electromagnet 3 is arranged inside the machined surface adsorption electromagnet 2, is formed in an annular shape so that a drilling tool 5 (for example, an electric drill shown in FIG. 5) can be inserted, and has an inner peripheral surface. It has a second magnetic body 32 in which a second coil accommodating groove 31 is formed in an annular shape along the circumferential direction in 3a, and a second exciting coil 33 accommodated in the second coil accommodating groove 31 and molded by resin. ..

The machined surface adsorption electromagnet 2 and the chip adsorption electromagnet 3 are housed in a housing 6 made of a non-magnetic material. The housing 6 is formed in a bottomed cylindrical shape, and the side facing the machined surface 4a is opened, and the surface facing the machined surface 4a of the machined surface adsorption electromagnet 2 and the chip adsorption electromagnet 3 is opened. A housing 6 that covers the outer peripheral wall 6a and the bottom wall (the end surface opposite to the side facing the processed surface 4a of the machined surface adsorption electromagnet 2 and the chip adsorption electromagnet 3) so as to cover the surface excluding the above. (End wall) 6b and. The bottom wall 6b of the housing 6 is formed with a tool insertion hole 6c that is substantially equal to the inner diameter of the chip adsorption electromagnet 3 (the inner diameter of the second magnetic body 32).

Further, between the electromagnet 2 for attracting the machined surface and the electromagnet 3 for adsorbing chips (between the first magnetic body 22 and the second magnetic body 32) housed in the housing 6, the magnetic paths of the respective electromagnets are formed. A first non-magnetic material 17 is interposed so as not to cross each other, and one end surface 3b in the axial direction facing the processed surface 4a of the chip adsorption electromagnet 3 is provided so as to cover the end surface 3b. A second non-magnetic material 18 is provided so that a magnetic path is not formed between the surface 4a and the surface 4a. The first non-magnetic material 17 is formed in a cylindrical shape provided over the entire length of the electromagnet 2 for adsorbing the machined surface and the electromagnet 3 for adsorbing chips, and the second non-magnetic material 18 is for adsorbing chips. It is formed in a ring shape having a width substantially equal to the radial width of the electromagnet 3.

In this example, the surface opposite to the surface facing the machined surface 4a of the housing 6, that is, the bottom wall 6b, has a first power source 24 capable of energizing the machined surface adsorption electromagnet 2 and chip adsorption. From the second power supply 34 capable of energizing the electromagnet 3 and the first switch 25 for turning on and off the energization of the electromagnet 2 for adsorbing the machined surface from the first power supply 24, and the second power supply 34 to the electromagnet 3 for adsorbing chips. A second switch 35, which turns on and off the energization of the above, is provided.
The first power supply 24 and the first switch 25, the second power supply 34, and the second switch 35 may be provided on the outer peripheral wall 6a that covers the radial outside of the machined surface adsorption electromagnet 2 of the housing 1.

In the above configuration, next, an operation of collecting and discarding metal chips generated during drilling of a metal processing member 4 such as a switchboard by using the metal chip scattering prevention device 1 will be described.

First, as shown in FIG. 3, in order to attach the metal chip scattering prevention device 1 to the machined surface 4a, the first switch 25 is turned on and the first power source 24 to the first excitation coil 23 of the electromagnet 2 for adsorbing the machined surface 23. Is energized to generate a magnetic attraction force on one end surface 2a in the axial direction of the machined surface adsorption electromagnet 2. In this state, when the metal chip scattering prevention device 1 is brought close to the machined surface 4a, a magnetic path is formed between the first magnetic body 22 and the machined surface 4a to generate an adsorption force, and the metal chip scattering prevention device 1 is generated. 1 can be adsorbed on the machined surface 4a.

With the metal chip scattering prevention device 1 adsorbed on the machined surface 4a, the second switch 35 is then turned on as shown in FIG. Then, the second exciting coil 33 of the chip adsorption electromagnet 3 is energized from the second power supply 34, and the magnetic attraction force 10 is generated on the inner peripheral surface 3a of the chip adsorption electromagnet 3. As described above, a second non-magnetic material 18 is provided on one end surface 3b in the axial direction facing the machined surface 4a of the chip adsorption electromagnet 3 so that a magnetic path is not formed between the machined surface 4a and the machined surface 4a. Therefore, the chip adsorption electromagnet 3 does not contribute to the adsorption with the machined surface 4a, and is in a state where it can adsorb the metal chips that are about to pass inside.

Further, since the first non-magnetic material 17 is arranged between the electromagnet 2 for adsorbing the machined surface and the electromagnet 3 for adsorbing chips, the magnetic paths of the electromagnets do not intersect each other, and the electromagnets of each electromagnet do not intersect with each other. The function is not impaired (the machined surface adsorption electromagnet 2 has a function of only attracting the metal chip scattering prevention device 1 to the machined surface 4a, and affects the function of the chip adsorption electromagnet 3. Further, the chip adsorption electromagnet 3 has a function of only adsorbing metal chips and does not affect the function of the machined surface adsorption electromagnet 2.).

After the above operations are completed, next, as shown in FIG. 5, the drilling tool 5 is inserted through the tool insertion hole 6c, and the machined surface 4a (metal processing member 4) is drilled. Metal chips 40 are generated by this drilling process, but since the magnetic adsorption force 10 is generated on the inner peripheral surface 3a of the chip adsorption electromagnet 3, the generated metal chips 40 are generated on the inner peripheral surface 3a. It is attracted to the tool and does not scatter from the tool insertion hole 6c.

After the drilling process is completed, the metal chip scattering prevention device 1 is then held by hand to turn off the first switch 25 as shown in FIG. Then, the energization of the first exciting coil 23 of the machined surface adsorption electromagnet 2 is lost from the first power supply 24, and the magnetic attraction force 10 of the machined surface attraction electromagnet 2 disappears. In this state, the metal chip scattering prevention device 1 can be removed from the machined surface 4a, so that the worker keeps the metal chip scattering prevention device 1 away from the machined surface 4a. In this state, since the metal chips 40 are maintained in a state of being adsorbed on the inner peripheral surface 3a of the chip adsorption electromagnet 3, the metal chips are removed when the metal chip scattering prevention device 1 is removed from the machined surface 4a. Will not be scattered.

After that, as shown in FIG. 7, the metal chip scattering prevention device 1 removed from the machined surface 4a is moved onto the trash can 41, and the second switch 35 is turned off with the open side of the housing 6 facing downward. To. Then, the energization of the chip adsorption electromagnet 3 to the second excitation coil 33 is lost from the second power supply 34, the magnetic attraction force 10 of the chip adsorption electromagnet 3 disappears, and the chips are attracted to the chip adsorption electromagnet 3. The metal chips 40 can be dropped into the trash box 41 and discarded.

Therefore, according to the above-mentioned metal chip scattering prevention device 1, the magnetic attraction force of the machined surface adsorption electric magnet 2 is generated and stopped by turning on / off the first switch 25, so that the metal chip scattering prevention device 1 is attracted to and released from the machined surface 4a. Further, the metal chips can be adsorbed and desorbed by generating and stopping the magnetic adsorption force of the chip adsorption electric magnet 3 by turning on and off the second switch 35, so that the machined surface 4a can be used. The metal chip scattering prevention device 1 can be easily attached and detached, and the metal chips generated by the drilling process can be easily adsorbed and separated (collected and discarded).

8 to 11 show other embodiments of the present invention.

In the form shown in FIG. 8 (second form), the first non-magnetic material 17 that separates the machined surface adsorption electromagnet 2 and the chip adsorption electromagnet 3 is integrally formed in the housing 1 formed of the non-magnetic material. This is an example. Since the other configurations are the same as those of the first embodiment, the same reference numerals are given to the same parts and the description thereof will be omitted.
With such a structure, the work of attaching the first non-magnetic material 17 becomes unnecessary, and a gap is formed between the housing and the first non-magnetic material when the first non-magnetic material 17 is attached. The inconvenience that a part of the magnetic path intersects is also eliminated.

In the form shown in FIG. 9 (third form), the housing 6 accommodates the first housing portion 61 formed of a non-magnetic material accommodating the machined surface adsorption electromagnet 2, and the chip adsorption electromagnet 3. This is an example in which the second housing portion 62 made of a non-magnetic material is separately formed. As a result, the first non-magnetic material 17 is formed of wall portions 61a and 62a of the first housing portion 61 and the second housing portion 62 facing each other. Since the other configurations are the same as those of the first embodiment, the same reference numerals are given to the same parts and the description thereof will be omitted.
In such a structure, the electromagnet 2 for adsorbing the machined surface and the electromagnet 3 for adsorbing chips can be separately produced and then combined and integrated, which facilitates production.

The form shown in FIG. 10 (fourth form) is an example in which an annular ridge 36 projecting inward is provided on the inner peripheral edge of the second magnetic material 32 on the rear end side. Since the other configurations are the same as those of the first embodiment, the same reference numerals are given to the same parts and the description thereof will be omitted.
In such a configuration, it is possible to more reliably prevent the metal chips that are about to scatter inside the chip adsorption electromagnet 3 from scattering and falling from the tool insertion hole 6c.
The annular ridge 36 protruding inward may be formed by making the diameter of the tool insertion hole 6c of the housing smaller than the inner diameter of the chip adsorption electromagnet 3.

The form shown in FIG. 11 (fifth form) is an example in which the chip adsorption electromagnet 3 is detachably attached to the housing 6 to which the machined surface adsorption electromagnet 2 is attached. A detachable connector (for example, a jack 37 on the surface facing the bottom wall 6b of the second magnetic body 32, a bottom wall) in the middle of the lead wire connecting the second exciting coil 33, the second power supply 34, and the second switch 35. It is conceivable that a plug 38) is provided on the surface of the 6b facing the second magnetic body 32, and the connector is connected by inserting the chip adsorption electromagnet 3 into the housing 6.
According to such a configuration, by removing the chip adsorption electromagnet 3, maintenance of the chip adsorption electromagnet 3 can be easily performed, and a plurality of chip adsorption electromagnets 3 having different specifications are prepared. It is possible to select and attach the chip adsorption electromagnet 3 suitable for the work.

In the above configuration, an example of directly operating the first switch 25 and the second switch 35 has been described, but the switch on / off operation may be performed remotely. Further, although the switchboard is taken as an example of the metal processing member, it is needless to say that the same metal chip scattering prevention device can be used for other metal processing members that perform drilling with a drilling tool.

1 Metal chip scattering prevention device 2 Machining surface adsorption electromagnet 2a One end surface 3 Chip adsorption electromagnet 3a Inner peripheral surface 3b One end surface 4 Machining member 4a Machining surface 5 Drilling tool 6 Housing 6a Outer wall 6b Bottom wall 6c Tool insertion hole 17 1st non-magnetic material 18 2nd non-magnetic material 21 1st coil accommodating groove 22 1st magnetic material 23 1st exciting coil 24 1st power supply 25 1st switch 31 2nd coil accommodating groove 32 2nd magnetic Body 33 2nd exciting coil 34 2nd power supply 35 2nd switch 61 1st housing part 62 2nd housing part

Claims (6)

A machined surface adsorption electromagnet that is formed in an annular shape and generates a magnetic attraction force on one end face in the axial direction facing the machined surface.
A chip adsorption electromagnet which is arranged inside the machined surface adsorption electromagnet and is formed in an annular shape so that a drilling tool can be inserted and generates a magnetic attraction force on the inner peripheral surface.
It has an electromagnet for adsorbing a machined surface and a housing for accommodating the electromagnet for adsorbing chips.
The housing has a first power source capable of energizing the machined surface adsorption electromagnet, a second power source capable of energizing the chip adsorption electromagnet, and the first power source to the machined surface adsorption electromagnet. A metal chip scattering prevention device characterized in that a first switch for turning on / off the energization and a second switch for turning on / off the energization of the chip adsorption electromagnet from the second power source are provided. The first coil accommodating groove is accommodated in the first magnetic material and the first coil accommodating groove formed in an annular shape along the circumferential direction on one end surface in the axial direction facing the machined surface. A machined surface adsorption electromagnet with a first excitation coil,
A second coil accommodating groove is formed in an annular shape on the inner peripheral surface along the circumferential direction while being arranged inside the electromagnet for attracting the machined surface and being formed in an annular shape so that a drilling tool can be inserted. A magnetic material, an electromagnet for adsorbing chips having a second exciting coil housed in the second coil accommodating groove, and an electromagnet for adsorbing chips.
It has a machined surface adsorption electromagnet and a housing for accommodating the chip adsorption electromagnet.
A first non-magnetic material is interposed between the machined surface adsorption electromagnet and the chip adsorption electromagnet, and also covers one end surface in the axial direction facing the machined surface of the chip adsorption electromagnet. A second non-magnetic material is provided in
The housing has a first power source capable of energizing the machined surface adsorption electromagnet, a second power source capable of energizing the chip adsorption electromagnet, and the first power source to the machined surface adsorption electromagnet. A metal chip scattering prevention device characterized in that a first switch for turning on / off the energization and a second switch for turning on / off the energization of the chip adsorption electromagnet from the second power source are provided. The first power supply, the second power supply, the first switch, and the second switch are an outer peripheral wall covering the radial outside of the machined surface adsorption electromagnet of the housing, or the machined surface suction electromagnet and the like. The metal according to claim 1 or 2, wherein the electromagnet for adsorbing chips is provided on the end wall of a housing covering the other end surface on the opposite side in the axial direction from the side facing the processed surface. Chip scattering prevention device. The second aspect of the present invention, wherein the housing is formed of a non-magnetic material accommodating the machined surface adsorption electromagnet and the chip adsorption electromagnet, and the first non-magnetic material is integrally formed. Metal chips shatterproof device. The housing includes a first housing portion made of a non-magnetic material accommodating the machined surface adsorption electromagnet, and a second housing portion formed of a non-magnetic material accommodating the chip adsorption electromagnet. 2. The metal chip according to claim 2, wherein the first non-magnetic material is formed of a wall portion of the first housing portion and the second housing portion facing each other. Anti-scattering device. The metal chip scattering prevention device according to any one of claims 1 to 5, wherein the chip adsorption electromagnet is detachably attached.

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