JP2022064090A - Dividing device and dividing method - Google Patents

Dividing device and dividing method Download PDF

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JP2022064090A
JP2022064090A JP2020172606A JP2020172606A JP2022064090A JP 2022064090 A JP2022064090 A JP 2022064090A JP 2020172606 A JP2020172606 A JP 2020172606A JP 2020172606 A JP2020172606 A JP 2020172606A JP 2022064090 A JP2022064090 A JP 2022064090A
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workpiece
split
work piece
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waste receiving
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金艶 趙
Kinen Cho
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to KR1020210122853A priority patent/KR20220048934A/en
Priority to TW110137363A priority patent/TW202215516A/en
Priority to CN202111175034.0A priority patent/CN114346459A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02076—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

To provide a dividing device that divides a workpiece attached to an expand sheet along a split starting point.SOLUTION: A dividing device 12 that divides a workpiece 11 along a division starting point by expanding an expand sheet 31 of a workpiece unit 10 in which a workpiece 11 having the division starting point formed thereon is attached to the expand sheet 31 and the expand sheet 31 is attached to a frame 33 includes: an expansion unit 22 that holds the frame 33 of the workpiece unit 10 with the workpiece 11 facing down, and expands the expand sheet 31 to divide the workpiece 11 along the division starting point; and a waste receiving mechanism 60. The waste receiving mechanism 60 includes a waste receiving surface 62a that faces the workpiece 11 of the work piece unit 10 including the frame 33 held by the holding mechanism 24 and receives a division waste 70 generated by the division of the workpiece 11, and a cleaning liquid supply unit 64 for supplying a cleaning liquid 66 toward the waste receiving surface 62a.SELECTED DRAWING: Figure 6

Description

本発明は、分割起点が形成された被加工物がエキスパンドシートに貼着された被加工物ユニットのエキスパンドシートを拡張することで被加工物を分割起点に沿って分割する分割装置に関する。 The present invention relates to a splitting device in which a work piece on which a split start point is formed divides a work piece along a split start point by expanding the expand sheet of the work piece unit attached to the expand sheet.

従来、例えば特許文献１に開示されるように、分割起点が形成された被加工物がエキスパンドシートに貼着された被加工物ユニットのエキスパンドシートを拡張することで被加工物を分割起点に沿って分割する分割装置が知られている。 Conventionally, as disclosed in, for example, Patent Document 1, a work piece on which a split start point is formed expands the expand sheet of the work piece unit attached to the expand sheet to divide the work piece along the split start point. A splitting device is known.

そして、特許文献１では、分割屑が被加工物の表面に付着してしまうのを防止するために、被加工物を下に向けた状態でエキスパンドする構成を開示している。分割の際に生じる分割屑は、さらに下方に位置する集塵装置の屑受け機構に落下して集められる。 Further, Patent Document 1 discloses a configuration in which the workpiece is expanded in a state of facing downward in order to prevent the split chips from adhering to the surface of the workpiece. The split dust generated during the split falls and is collected by the dust receiving mechanism of the dust collector located further below.

特開２０１４－２３６０５９号公報Japanese Unexamined Patent Publication No. 2014-236059

しかし、屑受け機構に落下した分割屑がエキスパンド中に舞い上がると、被加工物表面に付着してしまうことが懸念される。 However, if the split debris that has fallen on the debris receiving mechanism soars during the expansion, there is a concern that it will adhere to the surface of the workpiece.

特に被加工物が半導体デバイスウェーハの場合では、デバイスに分割屑が付着することでデバイスの品質を低下させることや、ボンディングやパッケージングに支障をきたしてしまう恐れがある。 In particular, when the workpiece is a semiconductor device wafer, there is a risk that the quality of the device will be deteriorated due to the adhesion of split chips to the device, and that bonding and packaging will be hindered.

さらに、被加工物が分割後に洗浄することのできないＭＥＭＳ（Ｍｉｃｒｏ Ｅｌｅｃｔｒｏ Ｍｅｃｈａｎｉｃａｌ Ｓｙｓｔｅｍｓ）デバイスでは、分割屑の付着は大きな問題となる。 Further, in a MEMS (Micro Electro Electro Mechanical Systems) device in which the workpiece cannot be washed after being divided, the adhesion of the divided debris becomes a big problem.

以上に鑑み、本願発明は、被加工物への分割屑の付着の問題を解決するための新規な技術を提案するものである。 In view of the above, the present invention proposes a novel technique for solving the problem of adhesion of split chips to a work piece.

本発明の解決しようとする課題は以上の如くであり、次にこの課題を解決するための手段を説明する。 The problem to be solved by the present invention is as described above, and next, the means for solving this problem will be described.

本発明の一態様によれば、
分割起点が形成された被加工物がエキスパンドシートに貼着されるとともにエキスパンドシートがフレームに装着された被加工物ユニットのエキスパンドシートを拡張することで被加工物を分割起点に沿って分割する分割装置であって、
被加工物が下を向いた状態で被加工物ユニットのフレームを保持し、エキスパンドシートを拡張して分割起点に沿って被加工物を分割する拡張ユニットと、
保持機構で保持されたフレームを含む被加工物ユニットの被加工物に対面し、被加工物の分割で生じる分割屑を受ける屑受け面と、屑受け面に向けて洗浄液を供給するための洗浄液供給部と、を有する屑受け機構と、
を備える、分割装置とする。 According to one aspect of the invention
A work piece on which a split start point is formed is attached to an expand sheet, and the work piece is divided along a split start point by expanding the expand sheet of the work piece unit to which the expand sheet is mounted on a frame. It ’s a device,
An expansion unit that holds the frame of the work piece unit with the work piece facing down and expands the expand sheet to divide the work piece along the split starting point.
A cleaning liquid for supplying cleaning liquid toward the waste receiving surface facing the workpiece of the workpiece unit including the frame held by the holding mechanism and receiving the split dust generated by the division of the workpiece, and the waste receiving surface. With a supply unit, a waste receiving mechanism, and
It is a dividing device provided with.

また、本発明の一態様によれば、
屑受け面には排出口が形成されており、屑受け面には排出口に向かって下がる向きの傾斜がつけられている、こととする。 Further, according to one aspect of the present invention.
It is assumed that a discharge port is formed on the waste receiving surface, and the waste receiving surface is inclined downward toward the discharge port.

また、本発明の一態様によれば、
分割起点が形成された被加工物がエキスパンドシートに貼着された被加工物ユニットのエキスパンドシートを拡張することで被加工物を分割起点に沿って分割する分割方法であって、
被加工物が下を向いた状態で被加工物ユニットのフレームを保持機構で保持するとともに、エキスパンドシートを拡張して分割起点に沿って被加工物を分割する分割ステップと、
分割ステップで被加工物が分割されて生じる分割屑を屑受け機構で受けるとともに、屑受け機構の屑受け面に洗浄液を供給する洗浄液供給ステップと、を備えた分割方法とする。 Further, according to one aspect of the present invention.
A split method in which a work piece on which a split start point is formed divides the work piece along the split start point by expanding the expand sheet of the work piece unit attached to the expand sheet.
A split step in which the frame of the workpiece unit is held by a holding mechanism with the workpiece facing down, and the expand sheet is expanded to divide the workpiece along the split starting point.
The division method includes a cleaning liquid supply step in which the divided dust generated by dividing the workpiece in the dividing step is received by the waste receiving mechanism and the cleaning liquid is supplied to the waste receiving surface of the waste receiving mechanism.

また、本発明の一態様によれば、
屑受け面には排出口が形成されており、屑受け面には排出口に向かって下がる向きの傾斜がつけられている、こととする。 Further, according to one aspect of the present invention.
It is assumed that a discharge port is formed on the waste receiving surface, and the waste receiving surface is inclined downward toward the discharge port.

本発明の構成によれば、分割により生じた分割屑が舞い上がって被加工物に付着することを防止することができ、デバイスの品質を低下させることや、ボンディングやパッケージングに支障をきたすことを防止できる。また、被加工物には洗浄液が供給されないため、被加工物が分割後に洗浄することができない場合においては、特に好適なものとなる。 According to the configuration of the present invention, it is possible to prevent the split debris generated by the split from flying up and adhering to the workpiece, which deteriorates the quality of the device and hinders bonding and packaging. Can be prevented. Further, since the cleaning liquid is not supplied to the workpiece, it is particularly suitable when the workpiece cannot be cleaned after being divided.

また、本発明の構成によれば、屑受け面に落下した分割屑を排出口を通じて洗浄液とともに外部に排出することができる。 Further, according to the configuration of the present invention, the divided debris that has fallen on the debris receiving surface can be discharged to the outside together with the cleaning liquid through the discharge port.

（Ａ）は、分割される被加工物の構成例を模式的に示す斜視図である。（Ｂ）は、保護部材の貼着について説明するための斜視図である。(A) is a perspective view schematically showing a configuration example of a work piece to be divided. (B) is a perspective view for explaining attachment of a protective member. （Ａ）及び（Ｂ）は、改質層の形成について説明する一部断面側面図である。(A) and (B) are partial cross-sectional side views explaining the formation of a modified layer. エキスパンドシートの貼着について説明する斜視図である。It is a perspective view explaining the sticking of an expand sheet. 分割装置の構成例について説明する図である。It is a figure explaining the configuration example of the dividing device. 拡張ユニットを下側に配置した状態について説明する図である。It is a figure explaining the state which arranged the expansion unit on the lower side. 分割時の様子について説明する図である。It is a figure explaining the state at the time of division. 屑受け機構について説明する図である。It is a figure explaining the scrap receiving mechanism. 分割方法の各ステップの順番について示すフローチャートである。It is a flowchart which shows the order of each step of a division method.

以下添付図面を参照して、本発明の実施形態について説明する。
本願発明にかかる分割装置で対象となる被加工物と、分割起点の形成について説明する。
図１（Ａ）は、本実施形態で分割される被加工物１１の構成例を模式的に示す斜視図である。図１（Ａ）に示すように、被加工物１１は、例えば、シリコンや炭化珪素、サファイア等の材料でなる円盤状のウェーハである。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
A work piece targeted by the splitting device according to the present invention and the formation of a split starting point will be described.
FIG. 1A is a perspective view schematically showing a configuration example of a workpiece 11 to be divided according to the present embodiment. As shown in FIG. 1A, the workpiece 11 is a disk-shaped wafer made of, for example, a material such as silicon, silicon carbide, or sapphire.

この被加工物１１の表面１１ａ側は、格子状に設定された分割予定ライン（ストリート）１３で複数の領域に区画されており、各領域には、ＩＣ（ＩｎｔｅｇｒａｔｅｄＣｉｒｃｕｉｔ）、ＭＥＭＳ（ＭｉｃｒｏＥｌｅｃｔｒｏＭｅｃｈａｎｉｃａｌＳｙｓｔｅｍｓ）、ＬＥＤ（ＬｉｇｈｔＥｍｉｔｔｉｎｇＤｉｏｄｅ）等のデバイス１５が形成されている。 The surface 11a side of the workpiece 11 is divided into a plurality of regions by a grid-shaped division schedule line (street) 13, and each region includes an IC (Integrated Circuit), a MEMS (MicroElectromagnetic Systems), and an LED. A device 15 such as (LightEmittingDeode) is formed.

なお、本実施形態では、シリコンや炭化珪素、サファイア等の材料でなる円盤状のウェーハを被加工物１１としているが、被加工物１１の材質、形状、構造、大きさ等に制限はない。他の半導体、セラミックス、樹脂、金属等の材料でなる基板を被加工物１１として用いることもできる。同様に、デバイス１５の種類、数量、形状、構造、大きさ、配置等にも制限はない。 In the present embodiment, a disk-shaped wafer made of a material such as silicon, silicon carbide, or sapphire is used as the workpiece 11, but the material, shape, structure, size, and the like of the workpiece 11 are not limited. A substrate made of other materials such as semiconductors, ceramics, resins, and metals can also be used as the workpiece 11. Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device 15.

図１（Ｂ）に示すように、本実施例では、被加工物１１の表面１１ａ側に保護部材が貼着される。保護部材２１は、例えば、被加工物１１と同等の径を持つ円形のフィルム（シート、テープ）であり、その表面２１ａ側には、粘着力のある糊層（粘着材層）が設けられている。この表面２１ａ側を被加工物１１の表面１１ａ側に密着させることで、保護部材２１が被加工物１１の表面１１ａ側に貼着される。保護部材２１を貼着することで、デバイス１５等が保護される。 As shown in FIG. 1B, in this embodiment, the protective member is attached to the surface 11a side of the workpiece 11. The protective member 21 is, for example, a circular film (sheet, tape) having a diameter equivalent to that of the workpiece 11, and an adhesive layer (adhesive material layer) is provided on the surface 21a side thereof. There is. By bringing the surface 21a side into close contact with the surface 11a side of the workpiece 11, the protective member 21 is attached to the surface 11a side of the workpiece 11. By attaching the protective member 21, the device 15 and the like are protected.

図２（Ａ）及び図２（Ｂ）に示すように、被加工物１１には分割起点が形成される。本実施例では、レーザー照射装置２を用いて被加工物１１にレーザー加工が行われ、被加工物１１の分割予定ライン１３（図１（Ａ））に沿って分割起点となる改質層（起点領域）が形成される。 As shown in FIGS. 2A and 2B, a split starting point is formed in the workpiece 11. In this embodiment, the workpiece 11 is laser-processed using the laser irradiation device 2, and the modified layer (FIG. 1 (A)) serving as a split starting point is along the planned split line 13 (FIG. 1 (A)) of the workpiece 11. The starting point region) is formed.

レーザー照射装置２は、被加工物１１を吸引、保持するためのチャックテーブル４を備える。チャックテーブル４は、モータ等の図示せぬ回転駆動機構に連結されており、鉛直の回転軸周りに回転する。また、チャックテーブル４は、図示せぬ移動機構によって水平方向に移動する。 The laser irradiation device 2 includes a chuck table 4 for sucking and holding the workpiece 11. The chuck table 4 is connected to a rotation drive mechanism (not shown) such as a motor, and rotates around a vertical rotation axis. Further, the chuck table 4 moves in the horizontal direction by a moving mechanism (not shown).

チャックテーブル４の上面の一部は、被加工物１１を吸引、保持する保持面４ａとして構成される。保持面４ａは、チャックテーブル４の内部に形成された図示せぬ吸引路等を介して図示せぬ吸引源に接続され、負圧により被加工物１１を吸引保持する。 A part of the upper surface of the chuck table 4 is configured as a holding surface 4a for sucking and holding the workpiece 11. The holding surface 4a is connected to a suction source (not shown) via a suction path (not shown) formed inside the chuck table 4, and sucks and holds the workpiece 11 by negative pressure.

チャックテーブル４の上方には、レーザー照射ユニット６が配置される。レーザー照射ユニット６は、図示せぬレーザー発振器でパルス発振されたレーザービームＬを所定の位置に照射、集光する。レーザー発振器は、被加工物１１に対して透過性を有する波長のレーザービームＬをパルス発振できるように構成されている。 A laser irradiation unit 6 is arranged above the chuck table 4. The laser irradiation unit 6 irradiates and condenses a laser beam L pulse-oscillated by a laser oscillator (not shown) at a predetermined position. The laser oscillator is configured to be able to pulse-oscillate a laser beam L having a wavelength that is transparent to the workpiece 11.

レーザー加工の際には、保護部材２１側をチャックテーブル４の保持面４ａに載置し、被加工物１１の裏面１１ｂを上側に露出させるとともに、保持面４ａに負圧を作用させることで、被加工物１１が保護部材２１を介してチャックテーブル４に吸引保持される。 During laser machining, the protective member 21 side is placed on the holding surface 4a of the chuck table 4, the back surface 11b of the workpiece 11 is exposed upward, and a negative pressure is applied to the holding surface 4a. The workpiece 11 is sucked and held by the chuck table 4 via the protective member 21.

次に、チャックテーブル４を移動、回転させ、レーザービームの集光点を被加工物内部の所定の位置に位置づけた状態で、格子状に配置される分割予定ライン１３に沿ってレーザービームＬを照射し、分割の起点となる改質層１７を形成する。 Next, the chuck table 4 is moved and rotated, and the laser beam L is moved along the scheduled division line 13 arranged in a grid pattern with the condensing point of the laser beam positioned at a predetermined position inside the workpiece. Irradiation is performed to form a modified layer 17 which is a starting point of division.

なお、この改質層１７は、図２（Ａ）及び図２（Ｂ）に示すように、被加工物１１の表面１１ａ（又は裏面１１ｂ）にクラック１９が到達する条件で形成されることが望ましい。これにより、被加工物１１がより適切に分割され易くなる。また、各分割予定ライン１３に対して、異なる深さの位置に複数の改質層１７を形成してもよい。 As shown in FIGS. 2A and 2B, the modified layer 17 may be formed under the condition that the crack 19 reaches the front surface 11a (or the back surface 11b) of the workpiece 11. desirable. This makes it easier for the workpiece 11 to be more appropriately divided. Further, a plurality of modified layers 17 may be formed at positions having different depths for each planned division line 13.

図３に示すように、分割起点が形成された被加工物１１は、エキスパンドシート３１に貼着される。このエキスパンドシート３１には、被加工物１１の周囲を囲むようように環状のフレーム３３が貼着され、被加工物１１とフレーム３３を一体とした被加工物ユニット１０が構成される。 As shown in FIG. 3, the workpiece 11 on which the split starting point is formed is attached to the expand sheet 31. An annular frame 33 is attached to the expanded sheet 31 so as to surround the periphery of the workpiece 11, and a workpiece unit 10 in which the workpiece 11 and the frame 33 are integrated is configured.

被加工物ユニット１０を構成する前、あるいは、構成後において、被加工物１１の表面１１ａ側に貼着されている保護部材２１を剥離、除去して、被加工物１１の表面１１ａを露出させる。 Before or after the workpiece unit 10 is configured, the protective member 21 attached to the surface 11a side of the workpiece 11 is peeled off and removed to expose the surface 11a of the workpiece 11. ..

以上のように構成された被加工物ユニット１０について、分割装置を用いて分割が行われる。なお、以上の説明では、被加工物に透過性を有する波長のレーザービームにより改質層を形成して分割起点を形成することとしたが、レーザービームによるアブレーション加工によって溝を形成することや、切削ブレードにより切削溝を形成することにより分割起点が形成されることとしてもよい。 The workpiece unit 10 configured as described above is divided using a dividing device. In the above description, the modified layer is formed by a laser beam having a wavelength that has transparency in the workpiece to form a split starting point. However, a groove may be formed by ablation processing by a laser beam. A split starting point may be formed by forming a cutting groove with a cutting blade.

次に、図４に示す分割装置１２の構成例について説明する。
分割装置１２は、箱状の筐体１４を備え、筐体１４の内部において、筐体１４の底部１４ａに複数の支柱１６が立設されている。 Next, a configuration example of the dividing device 12 shown in FIG. 4 will be described.
The dividing device 12 includes a box-shaped housing 14, and a plurality of columns 16 are erected on the bottom portion 14a of the housing 14 inside the housing 14.

各支柱１６の上部において、水平方向に延びる支持軸２０を介して基台１８が支持される。基台１８は略直方体状に形成されており、支持軸２０の回転により回転することで、基台１８の表面１８ａと裏面１８ｂとの上下位置を入れ替えることができる。 At the top of each column 16, the base 18 is supported via a horizontally extending support shaft 20. The base 18 is formed in a substantially rectangular parallelepiped shape, and the vertical positions of the front surface 18a and the back surface 18b of the base 18 can be exchanged by rotating the support shaft 20.

図４は、基台１８の表面１８ａが上側に位置する状態を示すものであり、表面１８ａ側には、拡張ユニット２２が配置されている。拡張ユニット２２は、被加工物１１を支持するための保持機構２４と、円筒状の拡張ドラム２６とを備える。なお、この図４に示すように、拡張ユニット２２が上側に配置される状態において、被加工物ユニット１０が分割装置１２に搬入され、また、分割後は搬出される。 FIG. 4 shows a state in which the surface 18a of the base 18 is located on the upper side, and the expansion unit 22 is arranged on the surface 18a side. The expansion unit 22 includes a holding mechanism 24 for supporting the workpiece 11 and a cylindrical expansion drum 26. As shown in FIG. 4, the workpiece unit 10 is carried into the dividing device 12 in a state where the expansion unit 22 is arranged on the upper side, and is carried out after the division.

保持機構２４は、平面視で円形の開口部を有する支持テーブル２８を有し、この支持テーブル２８の上面に、被加工物ユニット１０のフレーム３３が載せられる。支持テーブル２８の外周部分には、フレーム３３を固定するための複数のクランプ３０が設けられている。支持テーブル２８は、保持機構２４を昇降させるための昇降機構３２によって支持されている。 The holding mechanism 24 has a support table 28 having a circular opening in a plan view, and the frame 33 of the workpiece unit 10 is placed on the upper surface of the support table 28. A plurality of clamps 30 for fixing the frame 33 are provided on the outer peripheral portion of the support table 28. The support table 28 is supported by an elevating mechanism 32 for elevating and lowering the holding mechanism 24.

昇降機構３２は、基台１８の表面１８ａに固定されたシリンダケース３４と、シリンダケース３４に下端側が挿入されたピストンロッド３６とを備えている。ピストンロッド３６の上端部には、支持テーブル２８が固定されている。昇降機構３２は、例えば、エアやオイル等の流体の圧力を利用してピストンロッド３６を上下にスライドさせることで保持機構２４を昇降させる。 The elevating mechanism 32 includes a cylinder case 34 fixed to the surface 18a of the base 18, and a piston rod 36 having a lower end inserted into the cylinder case 34. A support table 28 is fixed to the upper end of the piston rod 36. The elevating mechanism 32 raises and lowers the holding mechanism 24 by sliding the piston rod 36 up and down by using the pressure of a fluid such as air or oil, for example.

支持テーブル２８の開口部の内側には、拡張ドラム２６が配置されている。この拡張ドラム２６の内径（直径）は、被加工物１１の直径より大きい。一方で、拡張ドラム２６の外径（直径）は、フレーム３３の内径（直径）より小さい。また、拡張ドラム２６の下端は、基台１８の表面１８ａに固定されている。 An expansion drum 26 is arranged inside the opening of the support table 28. The inner diameter (diameter) of the expansion drum 26 is larger than the diameter of the workpiece 11. On the other hand, the outer diameter (diameter) of the expansion drum 26 is smaller than the inner diameter (diameter) of the frame 33. Further, the lower end of the expansion drum 26 is fixed to the surface 18a of the base 18.

支持軸２０には、回転力を伝達させるベルトやギア等の伝達部材３８を介して、モータ等の回転駆動源４０が連結されている。この回転駆動源４０から発生する力によって、図５に示すように、拡張ユニット２２は、基台１８とともに支持軸２０の周りに回転し、支持している被加工物ユニット１０を下向きに保持した状態とする。なお、回転駆動源４０は、例えば、筐体１４の底部１４ａに固定される。 A rotational drive source 40 such as a motor is connected to the support shaft 20 via a transmission member 38 such as a belt or a gear that transmits a rotational force. As shown in FIG. 5, the expansion unit 22 rotates around the support shaft 20 together with the base 18 by the force generated from the rotation drive source 40, and holds the workpiece unit 10 to be supported downward. Make it a state. The rotation drive source 40 is fixed to, for example, the bottom portion 14a of the housing 14.

図４及び図５に示すように、拡張ドラム２６の下方には、分割の際に生じる分割屑を受けるための屑受け機構６０が設けられている。屑受け機構６０は、中心に向けて低くなる傾斜がつけられた屑受け面６２ａを有する屑受け６２と、屑受け面６２ａに向けて洗浄液を供給するための洗浄液供給部６４と、を有して構成される。 As shown in FIGS. 4 and 5, a waste receiving mechanism 60 for receiving the divided waste generated during the division is provided below the expansion drum 26. The waste receiving mechanism 60 has a waste receiving surface 62a having a waste receiving surface 62a inclined toward the center, and a cleaning liquid supply unit 64 for supplying the cleaning liquid toward the waste receiving surface 62a. It is composed of.

図４及び図７に示すように、本実施例では、屑受け６２の上部において、合計４箇所に洗浄液供給部６４が等間隔で配置され、各洗浄液供給部６４から屑受け６２の屑受け空間６３内に向けて洗浄液６６（図７）が供給されるように構成される。 As shown in FIGS. 4 and 7, in this embodiment, cleaning liquid supply units 64 are arranged at a total of four locations on the upper portion of the waste receiver 62, and the waste receiving spaces of the waste receiver 62 from each cleaning liquid supply unit 64. The cleaning liquid 66 (FIG. 7) is configured to be supplied toward the inside of the 63.

図４に示すように、屑受け６２は上方が開放されたすり鉢状をなすように構成されており、被加工物１１側から落下する分割屑は、屑受け６２の屑受け空間６３内へと落下し、屑受け空間６３の屑受け面６２ａに着地する。屑受け６２の屑受け空間６３の上側の開放部の面積は、被加工物１１の面積よりも大きく構成され、被加工物１１の下方の投影面の全範囲をカバーすることで、被加工物１１から生じる分割屑を確実に捕捉できるように構成される。 As shown in FIG. 4, the waste receiver 62 is configured to form a mortar shape with an open upper portion, and the divided waste falling from the workpiece 11 side enters the waste receiving space 63 of the waste receiver 62. It falls and lands on the mortar receiving surface 62a of the mortar receiving space 63. The area of the open portion on the upper side of the waste receiving space 63 of the waste receiving 62 is configured to be larger than the area of the workpiece 11, and covers the entire range of the projection surface below the workpiece 11. It is configured to reliably capture the split debris generated from 11.

図６及び図７に示すように、洗浄液６６としては、例えば水を使用することができ、各洗浄液供給部６４に設けたノズルから噴射させることができる。各洗浄液供給部６４は、制御バルブ６５を介して洗浄液供給源６８に接続され、制御バルブ６５の制御により、洗浄液６６の供給の開始／停止が制御される。 As shown in FIGS. 6 and 7, water can be used as the cleaning liquid 66, for example, and water can be sprayed from a nozzle provided in each cleaning liquid supply unit 64. Each cleaning liquid supply unit 64 is connected to the cleaning liquid supply source 68 via the control valve 65, and the start / stop of the supply of the cleaning liquid 66 is controlled by the control of the control valve 65.

図６及び図７に示すように、屑受け６２の下部には、分割装置１２の外部に通じる排出口６２ｂが形成され、屑受け面６２ａに落下した分割屑７０や、洗浄液６６が排出口６２ｂを通じて外部に排出される。屑受け面６２ａには、排出口６２ｂ側が低くなる傾斜がつけられることで、分割屑７０や洗浄液６６が排出口６２ｂへとスムーズに案内される。 As shown in FIGS. 6 and 7, a discharge port 62b leading to the outside of the splitting device 12 is formed in the lower part of the scrap receiver 62, and the split scrap 70 dropped on the scrap receiving surface 62a and the cleaning liquid 66 are discharged to the discharge port 62b. It is discharged to the outside through. The waste receiving surface 62a is inclined so that the discharge port 62b side is lowered, so that the split waste 70 and the cleaning liquid 66 are smoothly guided to the discharge port 62b.

次に、以上の装置構成による分割方法について説明する。図８は、以下で説明する分割方法の各ステップの順番について示すフローチャートである。
＜保持ステップ＞
図５に示すように、被加工物１１が下を向いた状態で被加工物ユニット１０のフレーム３３を保持するステップである。 Next, a division method based on the above device configuration will be described. FIG. 8 is a flowchart showing the order of each step of the division method described below.
<Holding step>
As shown in FIG. 5, it is a step of holding the frame 33 of the workpiece unit 10 in a state where the workpiece 11 faces downward.

被加工物１１には、図２（Ａ）（Ｂ）に示すように事前に分割起点が形成されるものである。 A split starting point is formed in advance on the workpiece 11 as shown in FIGS. 2 (A) and 2 (B).

＜分割ステップ＞
図６に示すように、エキスパンドシート３１を拡張し、分割起点に沿って被加工物１１を分割するステップである。この分割の際に発生する分割屑７０は、下方へと落下し、屑受け６２の屑受け面６２ａにて捕捉される。 <Split step>
As shown in FIG. 6, this is a step of expanding the expand sheet 31 and dividing the workpiece 11 along a split starting point. The split waste 70 generated during this division falls downward and is captured by the waste receiving surface 62a of the waste receiving 62.

分割ステップにおいては、図６に示すように、被加工物１１が下を向いた状態において、保持機構２４の支持テーブル２８を昇降機構３２により上方に移動させる。この際、拡張ドラム２６によって被加工物１１の外周縁とフレーム３３との間に位置するエキスパンドシート３１の部分が押圧され、エキスパンドシート３１が拡張する。 In the dividing step, as shown in FIG. 6, the support table 28 of the holding mechanism 24 is moved upward by the elevating mechanism 32 while the workpiece 11 is facing downward. At this time, the expansion drum 26 presses the portion of the expand sheet 31 located between the outer peripheral edge of the workpiece 11 and the frame 33, and the expand sheet 31 expands.

エキスパンドシート３１の拡張に伴って被加工物１１に半径方向外側に向かう内部応力が発生し、この内部応力によって被加工物１１が分割起点に沿って分割される。 Along with the expansion of the expand sheet 31, an internal stress is generated in the workpiece 11 toward the outer side in the radial direction, and the workpiece 11 is split along the split starting point by this internal stress.

＜洗浄液供給ステップ＞
図６及び図７に示すように、分割ステップで被加工物１１が分割されて生成された分割屑７０を屑受け６２で受けるとともに、屑受け６２の屑受け面６２ａに洗浄液６６を供給するステップである。 <Cleaning liquid supply step>
As shown in FIGS. 6 and 7, the step of receiving the divided waste 70 generated by dividing the workpiece 11 in the division step by the waste receiver 62 and supplying the cleaning liquid 66 to the waste receiving surface 62a of the waste receiver 62. Is.

このようにして分割屑７０に洗浄液６６が付着し、分割屑７０が舞い上がって被加工物１１に付着することを防止できる。さらに、所定の温度の洗浄水６６を供給することで、分割装置内の湿度を上げることにより静電気の発生を抑えることができ、分割屑７０が静電気によって舞い上がって被加工物１１に付着することも防止できる。 In this way, the cleaning liquid 66 adheres to the split waste 70, and it is possible to prevent the split waste 70 from flying up and adhering to the workpiece 11. Further, by supplying the washing water 66 having a predetermined temperature, it is possible to suppress the generation of static electricity by increasing the humidity in the dividing device, and the dividing waste 70 may fly up due to the static electricity and adhere to the workpiece 11. Can be prevented.

ここで、洗浄液６６は常時供給するほか、所定のタイミングで供給することとしてもよい。所定のタイミングとは、例えば、被加工物１１が下を向いたタイミング、分割ステップにおいてエキスパンドを開始するタイミング、分割ステップにおいてエキスパンドが終了したタイミングなどが考えられる。また、洗浄液６６を常時供給せず所定のタイミングにおいてのみ供給する場合には、分割ステップにおいてエキスパンドが終了した後において、分割屑が排出口６２ｂから排出されるのに十分な時間の経過後に、洗浄液６６の供給が停止される。 Here, the cleaning liquid 66 may be supplied at a predetermined timing as well as being constantly supplied. The predetermined timing may be, for example, a timing at which the workpiece 11 faces downward, a timing at which expansion is started in the division step, a timing at which expansion is completed in the division step, and the like. Further, when the cleaning liquid 66 is not always supplied but is supplied only at a predetermined timing, the cleaning liquid is after a sufficient time has elapsed for the divided waste to be discharged from the discharge port 62b after the expansion is completed in the dividing step. The supply of 66 is stopped.

＜排出ステップ＞
分割屑７０を排出口６２ｂより排出するステップである。 <Discharge step>
This is a step of discharging the split waste 70 from the discharge port 62b.

このようにして屑受け６２から分割屑７０が排出され、分割屑７０を堆積させることなく連続的に外部へと排出することができる。 In this way, the split waste 70 is discharged from the waste receiver 62, and the split waste 70 can be continuously discharged to the outside without being deposited.

以上のようにして本発明を実現することができる。
即ち、図４乃至図７に示すように、
分割起点が形成された被加工物１１がエキスパンドシート３１に貼着されるとともにエキスパンドシート３１がフレーム３３に装着された被加工物ユニット１０のエキスパンドシート３１を拡張することで被加工物１１を分割起点に沿って分割する分割装置１２であって、
被加工物１１が下を向いた状態で被加工物ユニット１０のフレーム３３を保持し、エキスパンドシート３１を拡張して分割起点に沿って被加工物１１を分割する拡張ユニット２２と、
屑受け機構６０であって、
保持機構２４で保持されたフレーム３３を含む被加工物ユニット１０の被加工物１１に対面し、被加工物１１の分割で生じる分割屑７０を受ける屑受け面６２ａと、屑受け面６２ａに向けて洗浄液６６を供給するための洗浄液供給部６４と、を有する屑受け機構６０と、
を備える、分割装置１２とする。 The present invention can be realized as described above.
That is, as shown in FIGS. 4 to 7.
The workpiece 11 on which the split starting point is formed is attached to the expand sheet 31, and the expand sheet 31 divides the workpiece 11 by expanding the expand sheet 31 of the workpiece unit 10 mounted on the frame 33. A splitting device 12 that splits along a starting point.
An expansion unit 22 that holds the frame 33 of the workpiece unit 10 in a state where the workpiece 11 faces downward, expands the expand sheet 31 and divides the workpiece 11 along a split starting point, and the expansion unit 22.
It is a waste receiving mechanism 60,
Facing the work piece 11 of the work piece unit 10 including the frame 33 held by the holding mechanism 24, toward the work piece receiving surface 62a and the work piece receiving surface 62a for receiving the split waste 70 generated by the division of the work piece 11. A waste receiving mechanism 60 having a cleaning liquid supply unit 64 for supplying the cleaning liquid 66, and
The dividing device 12 is provided with the above.

また、図４乃至図７に示すように、
分割起点が形成された被加工物１１がエキスパンドシート３１に貼着された被加工物ユニット１０のエキスパンドシート３１を拡張することで被加工物１１を分割起点に沿って分割する分割方法であって、
被加工物１１が下を向いた状態で被加工物ユニット１０のフレーム３３を保持するとともに、エキスパンドシート３１を拡張して分割起点に沿って被加工物１１を分割する分割ステップと、
分割ステップで被加工物１１が分割されて生じる分割屑７０を屑受け機構６０で受けるとともに、屑受け機構６０の屑受け面６２ａに洗浄液６６を供給する洗浄液６６供給ステップと、を備えた分割方法とする。 Further, as shown in FIGS. 4 to 7,
A split method in which a work piece 11 on which a split start point is formed divides the work piece 11 along a split start point by expanding the expand sheet 31 of the work piece unit 10 attached to the expand sheet 31. ,
A split step in which the frame 33 of the work piece unit 10 is held with the work piece 11 facing downward, and the expand sheet 31 is expanded to divide the work piece 11 along a split starting point.
A division method comprising a cleaning liquid 66 supply step of receiving the divided waste 70 generated by dividing the workpiece 11 in the dividing step by the waste receiving mechanism 60 and supplying the cleaning liquid 66 to the waste receiving surface 62a of the waste receiving mechanism 60. And.

以上によれば、分割により生じた分割屑７０が舞い上がって被加工物１１に付着することを防止することができ、デバイスの品質を低下させることや、ボンディングやパッケージングに支障をきたすことを防止できる。また、被加工物１１には洗浄液６６が供給されないため、被加工物１１が分割後に洗浄することができない場合においては、特に好適なものとなる。 According to the above, it is possible to prevent the split waste 70 generated by the split from flying up and adhering to the workpiece 11, thereby preventing the quality of the device from being deteriorated and the bonding and packaging from being hindered. can. Further, since the cleaning liquid 66 is not supplied to the workpiece 11, it is particularly suitable when the workpiece 11 cannot be cleaned after being divided.

また、図４乃至図７に示すように、屑受け面６２ａには排出口６２ｂが形成されており、屑受け面６２ａには排出口６２ｂに向かって下がる向きの傾斜がつけられている、こととする。 Further, as shown in FIGS. 4 to 7, a discharge port 62b is formed on the waste receiving surface 62a, and the waste receiving surface 62a is inclined downward toward the discharge port 62b. And.

これにより、屑受け面６２ａに落下した分割屑を排出口６２ｂを通じて洗浄液６６とともに外部に排出することができる。 As a result, the divided debris that has fallen on the debris receiving surface 62a can be discharged to the outside together with the cleaning liquid 66 through the discharge port 62b.

２ レーザー照射装置
６ レーザー照射ユニット
１０ 被加工物ユニット
１１ 被加工物
１１ａ 表面
１１ｂ 裏面
１２ 分割装置
１３ 分割予定ライン
１５ デバイス
１７ 改質層
１８ 基台
１８ａ 表面
１８ｂ 裏面
２０ 支持軸
２１ 保護部材
２１ａ 表面
２２ 拡張ユニット
２４ 保持機構
２６ 拡張ドラム
２８ 支持テーブル
３０ クランプ
３１ エキスパンドシート
３２ 昇降機構
３３ フレーム
３４ シリンダケース
３６ ピストンロッド
３８ 伝達部材
４０ 回転駆動源
６０ 屑受け機構
６２ａ 屑受け面
６２ｂ 排出口
６３ 屑受け空間
６４ 洗浄液供給部
６５ 制御バルブ
６６ 洗浄液
６８ 洗浄液供給源
７０ 分割屑
Ｌ レーザービーム


2 Laser irradiation device 6 Laser irradiation unit 10 Work piece unit 11 Work piece 11a Front side 11b Back side 12 Dividing device 13 Scheduled division line 15 Device 17 Modified layer 18 Base 18a Front side 18b Back side 20 Support shaft 21 Protective member 21a Surface 22 Expansion unit 24 Holding mechanism 26 Expansion drum 28 Support table 30 Clamp 31 Expanding seat 32 Elevating mechanism 33 Frame 34 Cylinder case 36 Piston rod 38 Transmission member 40 Rotational drive source 60 Waste receiving mechanism 62a Waste receiving surface 62b Discharge port 63 Waste receiving space 64 Cleaning liquid supply unit 65 Control valve 66 Cleaning liquid 68 Cleaning liquid supply source 70 Divided waste L Laser beam

Claims (4)

分割起点が形成された被加工物がエキスパンドシートに貼着されるとともに該エキスパンドシートがフレームに装着された被加工物ユニットの該エキスパンドシートを拡張することで被加工物を該分割起点に沿って分割する分割装置であって、
被加工物が下を向いた状態で被加工物ユニットの該フレームを保持し、該エキスパンドシートを拡張して該分割起点に沿って被加工物を分割する拡張ユニットと、
該保持機構で保持された該フレームを含む被加工物ユニットの被加工物に対面し、被加工物の分割で生じる分割屑を受ける屑受け面と、該屑受け面に向けて洗浄液を供給するための洗浄液供給部と、を有する屑受け機構と、
を備える、分割装置。 A work piece on which a split start point is formed is attached to an expand sheet, and the work piece is expanded along the split start point by expanding the expand sheet of the work piece unit to which the expand sheet is mounted on a frame. It is a splitting device that splits
An expansion unit that holds the frame of the workpiece unit with the workpiece facing down, expands the expand sheet, and divides the workpiece along the split starting point.
Facing the workpiece of the workpiece unit including the frame held by the holding mechanism, the cleaning liquid is supplied toward the scrap receiving surface that receives the split dust generated by the division of the workpiece and the scrap receiving surface. With a cleaning liquid supply unit, and a waste receiving mechanism,
A splitting device. 該屑受け面には排出口が形成されており、該屑受け面には該排出口に向かって下がる向きの傾斜がつけられている、
ことを特徴とする請求項１に記載の分割装置。 A discharge port is formed on the waste receiving surface, and the waste receiving surface is inclined downward toward the discharge port.
The dividing device according to claim 1. 分割起点が形成された被加工物がエキスパンドシートに貼着された被加工物ユニットの該エキスパンドシートを拡張することで被加工物を該分割起点に沿って分割する分割方法であって、
被加工物が下を向いた状態で被加工物ユニットの該フレームを保持機構で保持するとともに、該エキスパンドシートを拡張して該分割起点に沿って被加工物を分割する分割ステップと、
該分割ステップで被加工物が分割されて生じる分割屑を屑受け機構で受けるとともに、該屑受け機構の屑受け面に洗浄液を供給する洗浄液供給ステップと、を備えた分割方法。 A split method in which a work piece on which a split start point is formed divides a work piece along the split start point by expanding the expand sheet of the work piece unit attached to the expand sheet.
A split step in which the frame of the work piece unit is held by a holding mechanism with the work piece facing downward, and the expand sheet is expanded to divide the work piece along the split starting point.
A division method comprising a cleaning liquid supply step in which a waste receiving mechanism receives the divided dust generated by dividing the workpiece in the dividing step and supplies the cleaning liquid to the waste receiving surface of the waste receiving mechanism. 該屑受け面には排出口が形成されており、該屑受け面には該排出口に向かって下がる向きの傾斜がつけられている、
ことを特徴とする請求項３に記載の分割方法。 A discharge port is formed on the waste receiving surface, and the waste receiving surface is inclined downward toward the discharge port.
The division method according to claim 3, wherein the method is characterized by the above.
JP2020172606A 2020-10-13 2020-10-13 Dividing device and dividing method Pending JP2022064090A (en)

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TW110137363A TW202215516A (en) 2020-10-13 2021-10-07 Dicing device and dicing method Solving the problem that the diced debris adhere to the workpiece
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