JP2022064033A - Cutting blade - Google Patents

Abstract

To provide a cutting blade that can cut off a fragile material with a high quality over a long time.SOLUTION: A cutting blade 100 is configured so that a blade main body 10 that is rotated around an axis line cuts off a material to be cut, with a cutting edge 11A. The blade main body 10 comprises a resin bond phase 20 formed in a discoid shape and made of resin, abrasive grains 30 that is dispersed in the resin bond phase 20; fillers 40 that are dispersed in the resin bond phase 20; and the cutting edge 11A arranged at an outer periphery part 11 of the resin bond phase 20. The fillers 40 include fillers made of titanium boride (TiB2).SELECTED DRAWING: Figure 3

Description

The present invention relates to cutting blades used for cutting brittle materials such as glass and ceramics.

Conventionally, a material to be cut, which is made of a brittle material (hard and brittle material) such as glass and ceramics used for semiconductor products, is grooved or cut into individual pieces (in the present specification, these are processed). The processing of the above is generally referred to as cutting processing or simply cutting), and high quality is required.

In order to perform such a cutting process with high quality, for example, a cutting blade (thin blade grindstone) in which abrasive grains are dispersed in a resin bond phase is used.
The cutting blade includes, for example, a blade body having a circular plate shape and a cutting blade formed on the outer peripheral edge of the blade body, and the blade body has a resin bond phase made of resin and a resin bond. It is provided with abrasive grains (super-abrasive grains) made of diamond or cBN (cubic boron nitride) dispersed in a phase.

By the way, as the electronic material parts cut and manufactured by the cutting blade, those which are cut from a semiconductor wafer, divided and then mounted on a lead frame and resin-molded as in the above-mentioned semiconductor element, for example, a lead. Among the QFN (quadflatnon-leaded package) formed by mounting a large number of elements on a frame at once, molding them, and then cutting them into individual pieces, or through holes formed in a glass epoxy resin substrate. An IrDA (Infrared Data Association) standard optical transmission module that has a substrate plated with Ni, Au, Cu, etc. on its peripheral surface and is separated by cutting (hereinafter, simply abbreviated as IrDA). It has been known.

In cutting such electronic material parts, for example, in QFN, it is necessary to cut a metal lead frame having high ductility such as Cu arranged in the molding resin. There is a problem that metal burrs such as lead frames are likely to occur depending on the rotation direction.

Therefore, in order to improve the wear resistance of the cutting blade, for example, SiC, Al ₂ O ₃ , or the like may be contained. However, cutting blades that only contain SiC, Al ₂ O ₃ , etc. have the problem that when cutting electronic material parts, superabrasive grains tend to fall off and the sharpness is lost at an early stage, causing burrs. It was difficult to control for a long time.

In addition, when the sharpness of the cutting blade deteriorates due to the dropping of superabrasive grains, the cutting resistance increases. It is often necessary to dress the cutting blade, such as by performing it. Such dressing work also leads to a decrease in operating rate and a decrease in work efficiency.

On the other hand, in a cutting device that cuts electronic material parts, it is common to detect the zero point, and by making the cutting blade conductive, it is conductive in order to reliably detect the zero point by using electrical means. Gender may be required.
On the other hand, since the resin bond phase is generally insulating, a conductive material such as carbon may be added to impart conductivity to the cutting blade, but carbon or the like is added to the resin bond phase. Then, the wear resistance is lowered, and the sharpness is further deteriorated due to the dropping of the superabrasive grains.

Therefore, for example, when cutting electronic material parts such as QFN and IrDA, WC (tungsten carbide) powder is added to improve wear resistance to prevent the generation of burrs for a long period of time and to impart conductivity. The blade is disclosed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2006-062009

However, the cutting blade described in Patent Document 1 can be easily imparted with conductivity while being improved in wear resistance by WC (tungsten carbide), but it is rotated at high speed because the WC is heavy. Is difficult and may reduce cutting performance.
Further, for example, when water is used in the cutting process, the abrasive grains tend to fall off, and it is difficult to sufficiently maintain the cutting performance.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a cutting blade capable of cutting a brittle material with high quality even when it is near the end of its life.

In order to solve such a problem and achieve the above object, the present invention proposes the following means.
(1) The first aspect of the present invention is a cutting blade in which a blade body rotated around an axis cuts a material to be cut by a cutting edge, and the blade body is formed in a disk shape and is made of resin. The filler is provided with a resin bond phase, abrasive grains dispersed in the resin bond phase, a filler dispersed in the resin bond phase, and a cutting edge arranged on the outer peripheral portion of the resin bond phase. It is characterized by containing a filler made of titanium boiled (TiB ₂ ).

According to the cutting blade of the present invention, the blade main body includes a resin bond phase made of a resin, abrasive grains dispersed in the resin bond phase, and a filler dispersed in the resin bond phase. Further, in this embodiment, all the fillers are composed of titanium boride (TiB ₂ ).
Titanium diboride (TiB ₂ ) has excellent wear resistance, maintains wear resistance for a long period of time, and can suppress an increase in cutting resistance in the cutting process when cutting a brittle material.
Further, since titanium boride (TiB ₂ ) has excellent water resistance, even if the material to be cut is cut while being sprinkled with water, the abrasive grains and the filler composed of titanium boride (TiB ₂ ) are separated from the resin bond phase. It is suppressed from falling off, and it becomes possible to cut a brittle material with high quality even when it is near the end of its life. In other words, it is possible to extend the life of the cutting blade.
As a result, the cutting resistance when cutting the brittle material is reduced, corner chipping (for example, back surface corner chipping) and chipping of the material to be cut are suppressed, and high-quality cutting processing is stably maintained for a long period of time. be able to.

Further, the filler made of titanium boride (TiB ₂ ) has conductivity in addition to wear resistance, and it is possible to impart conductivity by dispersing it in the blade body.
Further, the electrical conductivity can be easily ensured without containing carbon, and the position of the cutting blade with respect to the material to be cut can be easily detected.

In addition, titanium boride (TiB ₂ ) is lighter than WC (tungsten carbide), and the superabrasive particles do not easily fall off even when water is applied during cutting, so the blade body can be cut at high speed. Is suppressed from being damaged, and the material to be cut can be efficiently cut.

Further, even when the blade main body (blade main body material) includes a step (sintering step) in which the blade main body (blade main body material) is heated to, for example, about 250 ° C. at the time of manufacturing the cutting blade, the titanium boride (TiB ₂ ) can be used. Since it does not deteriorate and does not diffuse (bond) to the resin bond phase, the above-mentioned actions and effects can be stably and surely obtained.

(2) In the cutting blade according to (1) above, the content of the entire filler containing titanium boride (TiB ₂ ) is preferably 20 vol% or more and 50 vol% or less with respect to the blade body. ..

According to the cutting blade of the present invention, the content of the entire filler containing titanium boride (TiB ₂ ) is 20 vol% or more and 50 vol% or less with respect to the blade body, so that an appropriate bonding force is ensured. It is possible to prevent the abrasive grains from falling off.
By setting the filler content to 20% or more, it is possible to give sufficient bonding force to the resin bond phase and prevent the abrasive grains and the filler from falling off from the blade body, which is high over a long period of time. It is possible to maintain a high-quality cutting.
As a result, the brittle material can be cut into high quality over a long period of time.
On the other hand, when the content of the filler exceeds 50%, the bonding force of the resin bond phase is lowered, the abrasive grains are easily dropped off, and the processing performance and the wear resistance are lowered. Therefore, the content of the filler is the blade. It is preferably 50 vol% or less with respect to the main body.

(3) In the cutting blade according to (1) or (2) above, the average particle size of the filler made of titanium boride (TiB ₂ ) is preferably 1 μm or more and 15 μm or less.

According to the cutting blade of the present invention, the average particle size of the filler made of titanium boride (TiB ₂ ) is 1 μm or more and 15 μm or less, so that the abrasive grains are sufficiently dispersed with respect to the resin bond phase in the blade body. To.
As a result, sufficient durability can be ensured and good processing performance can be obtained.
By setting the average particle size of the filler made of titanium boride (TiB ₂ ) to 1 μm or more, the filer can be stably obtained, and a cutting blade having stable quality can be manufactured. Further, it is not preferable to make the average particle size larger than 15 μm because it becomes difficult to sufficiently disperse the abrasive grains in the blade body and it is not easy to stably secure sufficient processing performance.

According to the cutting blade according to the present invention, since the filler contains a filler made of titanium boride (TiB ₂ ), the abrasive grains are suppressed from falling off from the resin bond phase, and the brittleness is reached even near the end of its life. The material can be cut into high quality for a long time.

It is a side view explaining the schematic structure of the cutting blade which concerns on one Embodiment of this invention. It is sectional drawing which shows the arrow | view II-II in FIG. 1 explaining the schematic structure of the cutting blade which concerns on one Embodiment. It is an enlarged view of the part shown by III in FIG. 2 explaining the schematic structure of the cutting blade which concerns on one Embodiment. It is a conceptual diagram explaining the outline of the evaluation item in the Example concerning the cutting blade of this invention, (A) is a conceptual diagram which shows the schematic structure of the evaluation target, and (B) is the conceptual diagram which shows the definition of the evaluation item.

Hereinafter, the cutting blade according to the embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a side view illustrating a schematic configuration of a cutting blade according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view shown by arrow II-II in FIG. 1 illustrating a schematic configuration of a cutting blade. be. Further, FIG. 3 is an enlarged view of a portion shown in FIG. 2 to explain the schematic configuration of the cutting blade.

In FIGS. 1 to 3, reference numeral 100 is a cutting blade, reference numeral 10 is a blade body, reference numeral 11 is an outer peripheral surface, reference numeral 11A is a cutting edge, reference numeral 20 is a resin bond phase, and reference numeral 30 is a superabrasive grain. (Abrasion grain) is indicated by reference numeral 40 filler.

In the cutting blade 100 according to the embodiment, as shown in FIGS. 1 and 2, for example, the blade body 10 rotated around the axis O cuts the material to be cut (not shown) by the cutting blade 11A. It is a blade for.
Further, the cutting blade 100 is used for precision cutting using a brittle material (hard and brittle material) such as glass, ceramics, and quartz used for a semiconductor device (electronic material component) as a material to be cut.

Further, although not particularly shown, the cutting blade 100 has a blade body 10 attached to the main shaft of the cutting device via a flange, and is rotated around the central axis O of the blade body 10 and perpendicular to the central axis O. The material to be cut is cut by the cutting edge 11A at the outer peripheral edge portion that protrudes radially outward from the flange in the blade main body 10 by being moved in such a direction (for example, in the height direction).
Here, in the present specification, the direction along the central axis O direction of the blade main body 10 is referred to as a width direction, the direction orthogonal to the central axis O is referred to as a radial direction, and the direction orbiting around the central axis O is referred to as a circumferential direction. In some cases.

In FIG. 2, for the sake of explanation, the thickness of the blade main body 10 is shown to be thicker than the actual thickness. Further, in the radial center portion (on the central axis O) of the blade main body 10, a circular mounting hole 13 is formed centering on the central axis O and penetrating the blade main body 10 in the width direction. Therefore, the blade body 10 is specifically in the shape of an annular plate. That is, the "blade body 10 having a circular plate shape" as used herein also includes the fact that it has an annular plate shape.

As shown in FIGS. 1 and 2, the cutting blade 100 includes, for example, a resin bond phase 20 formed in a disk shape and made of a resin, superabrasive grains 30 dispersed in the resin bond phase 20, and a resin bond phase. It is provided with a filler 40 dispersed in 20 and a cutting edge 11A arranged on the outer peripheral portion of the resin bond phase 20.
The dimensions of the cutting blade 100 can be arbitrarily set, but in this embodiment, the cutting blade 100 has, for example, an outer diameter of φ56 mm, an inner diameter (diameter of a mounting hole) of φ40 mm, and a thickness of t0.15 mm. (For example, it is set to 0.1 mm or more and 0.3 mm or less).

As shown in FIG. 3, the cutting edge 11A of the blade main body 10 has an outer peripheral surface 11 of the blade main body 10 having an extremely small width equal to the thickness of the blade main body 10 and both side surfaces facing the width direction of the blade main body 10. It is formed by an outer peripheral edge portion of 12 and an edge portion forming an intersecting ridge line between the outer peripheral edge portion of the side surface 12 and the outer peripheral surface 11.

The resin bond phase 20 is made of, for example, a thermosetting resin such as a phenol resin. As shown in FIGS. 1 and 2, the resin bond phase 20 has an annular plate shape centered on the central axis O. That is, the disk shape of the above-mentioned "disk-shaped resin bond phase 20" in the present embodiment includes an annular plate shape having a hole in the center of the disk.

The resin bond phase 20 has a mounting hole 13. The mounting hole 13 is located on the central axis O of the resin bond phase 20. The mounting hole 13 penetrates the resin bond phase 20 in the thickness direction. That is, the mounting holes 13 are opened in the pair of side surfaces 12 facing the thickness direction of the resin bond phase 20. The mounting hole 13 has a circular hole shape centered on the central axis O.

The dimension of the resin bond phase 20 in the thickness direction (hereinafter referred to as “thickness”) is, for example, 0.15 mm (for example, 0.1 mm or more and 0.3 mm or less).
The cutting edge 11A is an annular shape centered on the central axis O. The cutting edge 11A is arranged on the outer peripheral surface of the resin bond phase 20. The cutting edge 11A has a blade width having the same dimensions as the thickness of the resin bond phase 20.

The abrasive grain 30 is made of, for example, either diamond or cBN. However, as the abrasive grains 30, a hard material other than the diamond and cBN (however, a material harder than the resin bond phase 20) may be used. The average particle size of the abrasive grains 30 is, for example, 0.5 to 100 μm. The ratio of the volume of the abrasive grains 30 to the volume of the entire blade body 10 (content ratio of the abrasive grains 30) is, for example, 2.5 to 35%. Although not particularly shown, the outer surface (surface) of the abrasive grains 30 may be coated with a metal material such as Ti.

The above-mentioned "average particle size" represents an average value of the particle sizes of a large number of superabrasive grains 30, and for example, the superabrasive grains 30 having a certain particle size range are model MT3300EXII manufactured by Microtrac (registered trademark). -Measurement is performed by SDC or the like, and the average particle size is calculated by the particle size display based on the mesh size (see JIS B 4130: 1998).
Further, in the resin bond phase 20, the filler 40 is dispersed in addition to the superabrasive grains 30.

The filler 40 of the present embodiment is composed of particulate titanium (TiB ₂ ) made of particles, powder, or the like. The titanium boride (TiB ₂ ) may be formed in the form of particles, and the shape is not particularly limited.
The average particle size of the filler 40 made of titanium boride (TiB ₂ ) can be arbitrarily set, but is preferably 1 μm or more and 15 μm or less, for example. In this embodiment, the average particle size of titanium boride (TiB ₂ ) is, for example, 5 μm.

The average particle size of titanium boride (TiB ₂ ) is set to 1 μm or more because it can be stably obtained and a cutting blade having stable quality can be manufactured. Further, if the average particle size is larger than 15 μm, it becomes difficult to sufficiently disperse the abrasive grains in the blade body, and as a result, it becomes difficult to stably secure sufficient processing performance. Therefore, the average particle size is 15 μm. It is desirable to do the following. There is no particular problem even if the average particle size of titanium boride (TiB ₂ ) is less than 1 μm, and in that respect, the average particle size of titanium boride (TiB ₂ ) may be, for example, 15 μm or less.

Further, the content rate (vol%) (volume ratio) of the filler 40 made of titanium boride (TiB ₂ ) with respect to the volume of the entire blade body 10 can be arbitrarily set, for example, 20 vol% or more and 50 vol% or less. Is preferable. Further, the content of titanium boride (TiB ₂ ) is more preferably 30 vol% or more and 50 vol% or less.
In this embodiment, the content of titanium boride (TiB ₂ ) is, for example, 35 vol%.

According to the cutting blade 100 according to the embodiment, the blade main body 10 is dispersed in a resin bond phase 20 made of a phenol resin, superabrasive grains 30 dispersed in the resin bond phase 20, and a filler dispersed in the resin bond phase 20. Since the filler 40 contains a filler made of titanium boulder (TiB ₂ ), the superabrasive particles 30 are suppressed from falling off from the resin bond phase 20 and the wear resistance is maintained for a long time. Be maintained.
As a result, according to the cutting blade 100 according to the embodiment, the brittle material can be cut into high quality (processed product) for a long time. That is, the brittle material can be cut to a high quality even when the life is near, and a long life can be realized.

Further, according to the cutting blade 100 according to the embodiment, since titanium diboride (TiB ₂ ) has excellent water resistance, even if the material to be cut is cut while being sprinkled with water, it exceeds the resin bond phase 20. The filler 40 made of the abrasive grains 30 and titanium boride (TiB ₂ ) is suppressed from falling off, and the material to be cut can be cut with high quality for a long time.

Further, according to the cutting blade 100 according to the embodiment, since the blade main body 10 can be imparted with conductivity by the boron diboride (TiB ₂ ), the zero point thereof is obtained in the cutting device for cutting the electronic material component. Accurate detection can be performed.
Further, according to the cutting blade 100, since the conductivity can be imparted without mixing carbon, the abrasive grains do not fall off due to the addition of carbon, and the wear resistance is maintained for a long time to achieve high quality. Can be cut into.

Further, according to the cutting blade 100 according to the embodiment, since the content of titanium boride (TiB ₂ ) with respect to the blade body 10 is set to 35 vol%, an appropriate bonding force is secured and the abrasive grains are produced. It can be suppressed from falling off.

As described above, according to the cutting blade 100 according to the embodiment, the wear resistance is maintained for a long time even if water is used for cutting, and the cutting resistance when cutting the material to be cut is reduced. As a result, backside corner chipping (corner chipping) and chipping of the material to be cut are suppressed, and high-quality cutting processing can be stably maintained. In addition, the tool life can be extended.

It should be noted that the present invention is not limited to the above embodiment, and as illustrated below, various modifications can be made and arbitrarily carried out without departing from the spirit of the present invention.

For example, in the above embodiment, the case where the filler 40 dispersed in the resin bond phase 20 is all titanium diboride (TiB ₂ ) has been described, but the filler 40 is composed of at least titanium boride (TiB ₂ ). It suffices if a filler is contained, and it is possible to arbitrarily set whether or not the filler 40 contains a substance other than titanium boride (TiB ₂ ). For example, in addition to titanium boride (TiB ₂ ), SiC, Al ₂ O ₃ or the like (one type or a plurality of types) may be dispersed in the resin bond phase 20.

Further, in the above embodiment, the case where the average particle size of titanium boride (TiB ₂ ) is 5 μm or more and 20 μm or less has been described, but the average particle size of titanium boride (TiB ₂ ) is set to be smaller than 5 μm. It may be set larger than 20 μm.

Further, in the above embodiment, the case where the content of titanium boride (TiB ₂ ) with respect to the blade body 10 is 20 vol% or more and 50 vol% or less has been described, but the content with respect to the blade body 10 is less than 20 vol% or 50 vol. It may be set higher than%.

Further, in the above embodiment, the case where the abrasive grains 30 are diamond superabrasive grains has been described, but the abrasive grains 30 can be arbitrarily set. For example, cBN or the like can be used instead of the diamond superabrasive grains. Other abrasive grains may be dispersed in the resin bond phase 20.
Further, the average particle size and the content of the abrasive grains can be arbitrarily set.

Further, in the above embodiment, the case where the resin constituting the resin bond phase 20 is a phenol resin has been described, but the resin constituting the resin bond phase 20 can be arbitrarily set, and the phenol resin can be used. Alternatively, for example, polyimide or the like may be used.

Further, in the above embodiment, the case where the cutting blade 100 is formed to have an outer diameter: φ56 mm, an inner diameter (diameter of the mounting hole): 40 mm, and a thickness: 0.15 mm has been described. The outer diameter, inner diameter, and thickness may be set arbitrarily.

Further, in the above-described embodiment, the case where the cutting blade 100 is used as a material to be cut for cutting a hard and brittle material such as glass and quartz (ceramics) has been described. Or DA (Infrared Data Association) standard optical transmission module or other electronic component material may be used for cutting as a material to be cut.

In addition, as long as it does not deviate from the gist of the present invention, each configuration (component) described in the above-described embodiments, modifications, and notes may be combined, and addition, omission, replacement, and other configurations may be added. It can be changed. Further, the present invention is not limited to the above-described embodiments.

Hereinafter, with reference to FIG. 4 and Tables 1 to 6, the average particle size of the titanium boride (TiB ₂ ) filler (Example 1) and the content of the titanium boride (TiB ₂ ) filler (Example 2). ) Has an effect on the processed quality of the material to be cut. However, this example shows only one example, and the present invention is not limited to this example.

4A and 4B are conceptual diagrams illustrating an outline of evaluation items in an embodiment of the cutting blade of the present invention, FIG. 4A is a schematic configuration of an evaluation target, and FIG. 4B is an evaluation item. Shows the definition of. In FIG. 4, reference numeral W indicates a material to be cut, reference numeral A indicates backside corner chipping, reference numeral B indicates front surface chipping, and reference numeral C indicates back surface chipping. Further, the reference numerals LA1 and LA2 are the dimensions in the cutting direction and the cutting orthogonal direction of the back surface angle chipping, the reference numeral LB is the chipping size (dimensions) of the front surface chipping (hereinafter referred to as the front surface chipping size), and the reference numeral LC is the chipping size of the back surface chipping. (Dimensions) (hereinafter referred to as backside chipping size) are shown.

The back surface corner chipping A is, as shown in FIG. 4A, a corner chipping formed at the corner portion of the chip (processed material) cut out in a rectangular shape.
Further, as shown in FIG. 4B, the size (dimension) of the back surface angle chip A is represented by the dimension LA1 in the cutting direction and the dimension LA2 in the cutting orthogonal direction.

Further, as shown in FIG. 4A, the surface chipping B is chipping generated inward along the chip surface from the calf end face generated on the surface of the chip (workpiece) by the cutting process. ..
Further, as shown in FIG. 4B, the surface chipping size LB is a size (dimension) from the calf end surface of the surface chipping generated on the chip (work material) to the tip portion of the surface chipping B.

Similarly, as shown in FIG. 4A, the back surface chipping C is generated inward along the back surface of the chip from the calf end surface generated on the surface of the chip (workpiece) by the cutting process. It's chipping.
Further, as shown in FIG. 4B, the back surface chipping size LC is a size (dimension) from the calf end surface of the back surface chipping generated on the chip (work material) to the tip end portion of the back surface chipping C.

<Example 1>
(1) Effect of the average particle size of the titanium boborized (TiB ₂ ) filler on the cutting quality In Example 1, the average particle size of the titanium boried (TiB ₂ ) dispersed as a filler in the resin bond phase 20 was changed. The relationship between the average particle size and the cutting quality (presence or absence of chipped back surface angle, presence or absence of back surface chipping, or their dimensions) and spindle current value (magnitude of cutting resistance) was confirmed.

Specifically, the blade body 10 having an outer diameter of φ56 mm, an inner diameter (diameter of a mounting hole): 40 mm, and a thickness of 0.15 mm in which abrasive grains 30 made of diamond having a particle size of # 600 are dispersed in the resin bond phase 20. A cutting test was carried out using a cutting blade 100 having the above.
Among these cutting blades, those without the filler 40 of titanium boride (TiB ₂ ) were used as a comparative example (base blade).
Further, as the filler 40, those in which titanium boride (TiB ₂ ) was dispersed were designated as Examples 1 to 6 of the present invention. In Example 1, only titanium boride (TiB ₂ ) was used as the filler 40.

The average particle size of titanium boride (TiB ₂ ) in Comparative Examples 1 to 6 of the present invention evaluated in Example 1 is as shown below.
Comparative example: Base blade (# 600 resin blade (56D / 40H / 0.15))
Example 1: Base blade + Titanium diboride (TiB ₂ ) filler (1 μm)
Example 2: Base blade + Titanium diboride (TiB ₂ ) filler (5 μm) Example 3: Base blade + Titanium diboride (TiB ₂ ) filler (10 μm)
Example 4: Base blade + Titanium diboride (TiB ₂ ) filler (15 μm)
Example 5 of the present invention: Base blade + Titanium diboride (TiB ₂ ) filler (20 μm)
Example 6: Base blade + Titanium diboride (TiB ₂ ) filler (30 μm)
The content of the filler 40 in Examples 1 to 6 of the present invention was set to 35 vol% by volume with respect to the blade main body 10.

Here, the base blade is a resin blade in which diamond superabrasive grains of # 600 are dispersed as superabrasive grains (abrasive grains) 30 in a resin bond phase 20 made of a phenol resin. The content of diamond superabrasive grains in the blade body is 12.5 vol%.

The cutting conditions are as follows.
[Cut condition]
Work (material to be cut): Quartz (100 mm x 100 mm x t0.5 mm)
Flange: φ49.6 mm
Spindle speed: 20000min- ¹
Feed rate: 5 mm / sec

Then, with respect to the chip obtained by cutting the material W to be cut, the presence or absence of the back surface corner chipping A at any one of the four corners of the rectangular shape of the cut chip, and the case where the back surface corner chipping A is present. , The larger dimension of the cutting direction dimension LA1 and the cutting orthogonal dimension LA2 of the back surface corner chipping A is described.
When there are a plurality of back surface chippings C, the largest chipping size (dimension) LC among the back surface chipping Cs is described.
In addition, the spindle current value during cutting was confirmed as an indicator of cutting resistance.
Here, in Example 1, since the chip (material to be cut) is quartz, it is common that the back surface chipping size LC> the front surface chipping size LB, and only the back surface chipping size LC is confirmed.

Table 1 shows the cutting grade and the spindle current value of the material W to be cut at the initial stage of processing (first sheet) when the blade 100 for cutting blade is started to be used in Example 1.
Table 2 shows the cutting grade and the spindle current value of the material W to be cut at the stage where the cutting blade 100 is worn by 2 mm in the radial direction due to the cutting process.
Further, Table 3 shows the difference between the cutting grade and the spindle current value of the material W to be cut at the stage where the cutting blade 100 is worn by 2 mm in the radial direction and at the initial stage of machining.

Hereinafter, with reference to Tables 1 to 3, the cutting test results regarding the average particle size of the titanium diboride (TiB ₂ ) filler in Example 1 will be described.
The cutting test results of Example 1 are as shown in Tables 1 to 3.

[Backside corner missing]
As shown in Tables 1 and 2, in the comparative example, the back surface corner chipping was not found at the initial stage of processing, but the back surface corner chipping of 150 μm was found at the 2 mm wear stage.
On the other hand, in Examples 1 to 4 of the present invention, the back surface corner chipping did not occur.
Further, in Example 5 of the present invention, although there was no backside corner chipping at the initial stage of processing, a backside corner chipping of 30 μm was found at the 2 mm wear stage.
Further, in Example 6 of the present invention, a back surface corner chipping of 25 μm occurred at the initial stage of processing, and the back surface corner chipping grew to 33 μm at the 2 mm wear stage. Considering that the general permissible standard for chipping the back surface angle is 30 μm, Example 6 of the present invention slightly exceeds the permissible standard.
As described above, in Examples 1 to 6 of the present invention, the backside corner chipping is suppressed to a small size, and good processed quality is ensured.

Further, as shown in Table 3, the difference in the stage where the cutting blade 100 is worn by 2 mm with respect to the initial state of machining is 150 μm in the comparative example, but 0 to 30 μm in the examples 1 to 5 of the present invention. In Example 6, it is 8 μm. Therefore, in Examples 1 to 6 of the present invention, it can be seen that the amount of change at the time of transition from the initial stage of machining to 2 mm wear is very small, and high-quality cutting is possible even near the end of the service life.

Considering that the allowable standard for chipping the back surface is 30 μm, the cutting quality at the 2 mm wear stage is not ensured in the example of the present invention, but if the life standard is shortened or the cutting conditions are reviewed, It is presumed that the acceptance criteria can be fully satisfied.
Therefore, it can be seen that the cutting blades of Examples 1 to 6 of the present invention have significantly improved processing quality when cut for a long time as compared with Comparative Examples.

[Back side chipping]
As shown in Tables 1 and 2, in the comparative example, the back surface chipping size was 11 μm at the initial stage of processing and 25 μm at the 2 mm wear stage.
On the other hand, in Examples 1 to 6 of the present invention, the back surface chipping size was 7 to 20 μm at the initial stage of processing, and the maximum chipping size was 8 to 18 μm at the 2 mm wear stage.
As described above, in the comparative example, the back surface chipping size was small at the initial stage of processing, but the back surface chipping size was as large as 25 μm at the 2 mm wear stage. Further, in Examples 1 to 6 of the present invention, it was found that the back surface chipping size at the initial stage of processing and the 2 mm wear stage was 20 μm and 18 μm, respectively, the back surface chipping size was suppressed to a small size, and good processed quality was ensured.
Further, as shown in Table 3, the difference in the stage where the cutting blade 100 is worn by 2 mm with respect to the initial state of machining is 14 μm in the comparative example, but -2 to 2 μm in the examples 1 to 6 of the present invention. It was confirmed that in the invention examples 1 to 6, there was no significant change in the cutting quality even when the life was approaching, and the cutting quality was significantly improved as compared with the comparative examples.

[Main shaft current value]
As shown in Tables 1 and 2, in the comparative example, the spindle current value is 2.5 A at the initial stage of machining, but 3.3 A at the 2 mm wear stage. Therefore, in the comparative example, the spindle current value increases by 0.8 A when worn by 2 mm as compared with the initial stage of machining.
On the other hand, in Examples 1 to 6 of the present invention, the spindle current value at the initial stage of machining is 2.3 to 3.1 A, and the spindle current value is 2.3 to 3.1 A at the time of 2 mm wear. In Example 5 of the present invention, although the spindle current value at the initial stage of machining and 2 mm wear is as large as 3.1 A, there is no change when 2 mm wear is performed in the radial direction from the initial stage of machining, and the cutting resistance is maintained.
That is, in the comparative example, the cutting resistance of the cutting blade was significantly increased, whereas the example 5 of the present invention was maintained, and it was confirmed that the cutting resistance did not change significantly even when the life was approached.
Further, when the allowable range of change of the spindle current value (cutting resistance) is set to 0.5 A, it can be said that the comparative example is incompatible.
As described above, in Examples 1 to 6 of the present invention, the cutting resistance at the 2 mm wear stage is smaller than that of the comparative example, and the change in cutting resistance is small, so that the wear resistance is significantly improved. You can see.

From the above, regarding the average particle size of titanium boride (TiB ₂ ), in the range of Examples 1 to 6 of the present invention, the back surface angle chipping, the back surface chipping, and the spindle current value (cutting resistance) are all good. It was confirmed that a special effect was exhibited by setting the average particle size of the filler made of titanium boride (TiB ₂ ) to 5 μm or more and 30 μm or less.

<Example 2>
Effect of Titanium Boron (TiB ₂ ) Filler Content on Cutting Quality In Example 2, the volume ratio (content rate) of the titanium boron (TiB ₂ ) dispersed as a filler in the resin bond phase 20 to the blade body 10 (Volume ratio)) was changed to confirm the relationship between the content of the titanium boring (TiB ₂ ) filler and the cutting quality (chip backside corner chipping, front surface chipping size, back surface chipping size, spindle current value (cutting resistance)). bottom.

Specifically, the blade body 10 having an outer diameter of φ56 mm, an inner diameter (diameter of a mounting hole): 40 mm, and a thickness of 0.1 mm in which abrasive grains 30 made of diamond having a particle size of # 800 are dispersed in the resin bond phase 20. A cutting test was carried out using a cutting blade 100 having the above.
Among these cutting blades, those without the filler 40 of titanium boride (TiB ₂ ) were used as a comparative example (base blade).
Further, as the filler 40, those in which titanium boride (TiB ₂ ) was dispersed were designated as Examples 7 to 12 of the present invention.
The ratio of the volume of the filler 40 (the content of the filler 40) to the volume of the entire blade body 10 in Examples 7 to 12 of the present invention was set to 15 to 60 vol%.
The specific content is as shown below.
In this example, only titanium boride (TiB ₂ ) was used as the filler 40.

Comparative example: Base blade (# 800 resin blade (56D / 40H / 0.1t)
Example 7 of the present invention: Base blade + filler content 15 vol%
Example 8 of the present invention: Base blade + filler content 20 vol%
Example 9 of the present invention: Base blade + filler content 30 vol%
Example 10 of the present invention: Base blade + filler content 40 vol%
Example 11 of the present invention: Base blade + filler content 50 vol%
Example 12 of the present invention: Base blade + filler content 60 vol%
The average particle size of the filler 40 of Examples 7 to 12 of the present invention was 5 μm.

Here, the base blade is a resin blade in which diamond superabrasive grains of # 800 are dispersed as superabrasive grains (abrasive grains) 30 in a resin bond phase 20 made of a phenol resin. The average particle size of the diamond superabrasive grains with respect to the blade body is 5 μm.

The disconnection conditions are as follows.
[Cut condition]
Work (material to be cut): Alkaline glass (100 mm x 100 mm x t0.5 mm)
Flange: φ52 mm
Spindle speed: 15000min- ¹
Feed rate: 10 mm / sec

Then, with respect to the chip obtained by cutting the material W to be cut, the presence or absence of the back surface corner chipping A at any one of the four corners of the rectangular shape of the cut chip, and the case where the back surface corner chipping A is present. , The larger dimension of the cutting direction dimension LA1 and the cutting orthogonal dimension LA2 of the back surface corner chipping A is described.
When there are a plurality of surface chipping B, the largest surface chipping size (dimension) LB among the surface chipping B is described.
When there are a plurality of back surface chippings C, the largest back surface chipping size (dimension) LC among the back surface chippings C is described.
In addition, the spindle current value during cutting was confirmed as an indicator of cutting resistance.
Here, in Example 2, since the chip (material to be cut) is alkaline glass, the back surface chipping size LC> the front surface chipping size LB is not always satisfied. Therefore, both the front surface chipping size LB and the back surface chipping size LC are confirmed. bottom.

Table 4 is a table showing the initial state of machining by the cutting blade 100 in Example 2. Further, Table 4 is a table showing the state at the stage where the cutting blade 100 is worn by 2 mm due to the cutting process. Further, Table 6 is a table showing the difference in the stage where the cutting blade 100 is worn by 2 mm with respect to the initial state of machining.

Hereinafter, with reference to Tables 4 to 6, the cutting test results regarding the content of the titanium diboride (TiB ₂ ) filler in Example 2 will be described.
The cutting results of Example 2 are as shown in Tables 4 to 6.

[Backside corner missing]
As shown in Tables 4 and 5, in the comparative example, the back surface corner chipping was not found at the initial stage of processing, but the back surface corner chipping of 180 μm was found at the 2 mm wear stage.
Further, in Example 7 of the present invention, a back corner chipping of 53 μm occurred at the initial stage of processing, and a back corner chipping of 49 μm was found at the 2 mm wear stage.
Further, in Example 12 of the present invention, a back surface angle chipping of 41 μm occurred at the initial stage of processing, and a back surface angle chipping of 51 μm occurred at the 2 mm wear stage.
On the other hand, in Examples 8 to 11 of the present invention, the back angle chipping did not occur at any of the initial processing stages and the 2 mm wear stage.
As described above, in Examples 8 to 11 of the present invention, there was no backside corner chipping, and good processed quality was ensured.
However, as shown in Table 6, in Examples 7 and 12 of the present invention, the size of the back surface angle chipping did not change so much, and moreover, it was very small compared to 180 μm of Comparative Example. It was confirmed that there was no significant change in the processed quality even when the service life was approaching.

[Surface chipping]
As shown in Tables 4 and 5, in the comparative example, the surface chipping size was 20 μm at the initial stage of machining and 36 μm at the 2 mm wear stage.
As described above, in the comparative example, the surface chipping size was small at the initial stage of processing, but increased by about 1.8 times at the 2 mm wear stage.
On the other hand, in Examples 7 to 12 of the present invention, the surface chipping size was 15 to 24 μm at the initial stage of processing and 18 to 24 μm at the 2 mm wear stage, and it was found that the general allowable standard of 30 μm was sufficiently satisfied.
As described above, in the comparative example, it was confirmed that the surface chipping size was small at the initial stage of machining, but was large at the 2 mm wear stage, and the rate of change at the 2 mm wear stage was large.
Further, in Examples 7 to 12 of the present invention, the surface chipping size is kept small at both the initial processing stage and the 2 mm wear stage, the cutting quality does not change significantly even near the end of the service life, and the cutting quality is significantly improved. Was confirmed.

[Back side chipping]
As shown in Tables 4 and 5, in the comparative example, the back surface chipping size was 30 μm at the initial stage of machining and 61 μm at the 2 mm wear stage.
As described above, in the comparative example, although the general allowable standard of 30 μm is satisfied at the initial stage of machining, the allowable standard of 30 μm cannot be satisfied at the 2 mm wear stage, and the rate of change at the 2 mm wear stage is about 2. It was confirmed that it was twice as large.
Further, Example 7 of the present invention is 29 μm at the initial stage of machining and 31 μm at the 2 mm wear stage, and does not slightly satisfy the general allowable standard of 30 μm at the 2 mm wear stage.
Further, Example 9 of the present invention is 32 μm at the initial stage of processing and 30 μm at the 2 mm wear stage, and does not slightly satisfy the allowable standard of 30 μm at the initial stage of processing.
Further, Example 12 of the present invention is 39 μm at the initial stage of machining and 40 μm at the 2 mm wear stage, and does not slightly satisfy the allowable standard of 30 μm at any of the initial machining stage and the 2 mm wear stage.
On the other hand, in Examples 8, 10 and 11 of the present invention, the surface chipping is 25 to 26 μm at the initial stage of processing and 28 μm to 29 μm at the 2 mm wear stage, which satisfies the allowable standard of 30 μm.
As described above, in the comparative example, it was confirmed that the surface chipping size was small at the initial stage of machining, but was large at the 2 mm wear stage, and the rate of change at the 2 mm wear stage was large.
Further, in Examples 7 to 12 of the present invention, although the back surface chipping size may slightly exceed the back surface chipping size at the initial processing stage and the 2 mm wear stage, the cutting quality does not change significantly even near the end of the service life, and the cutting quality is significantly improved. I was able to confirm that it was done.

[Main shaft current value]
As shown in Tables 3 and 4, in the comparative example, the spindle current value is 2.4 A at the initial stage of machining, but 3.3 A at the 2 mm wear stage. Therefore, in the comparative example, it was confirmed that the increase was 0.9 A (32%) at the 2 mm wear stage as compared with the initial stage of machining, and the allowable standard of 0.5 was exceeded.
On the other hand, in Examples 7 to 12 of the present invention, the spindle current value is 2.3 to 3.0 A at the initial stage of machining, and the spindle current value is 2.3 to 2.9 A at the time of 2 mm wear.
Further, as shown in Table 6, in Examples 7 to 12 of the present invention, the change in the spindle current value (cutting resistance) is −0.1 to 0.1 A, which is almost unchanged, even when the life is near. It was confirmed that there was no significant change in the cutting resistance.
As described above, it was confirmed that in Examples 7 to 12 of the present invention, the cutting resistance at the 2 mm wear stage was smaller than that in the comparative example, and the cutting resistance did not change significantly even when the life was approached.

From the above, when the average particle size of titanium boride (TiB ₂ ) is changed, the range of Examples 7 to 12 of the present invention is the backside angle chipping, front surface chipping, back surface chipping, and spindle current value (cutting resistance). All of them were good, and it was confirmed that by setting the content of titanium boride (TiB ₂ ) to 20% or more and 60% or less, a particularly remarkable effect was exhibited.

According to the cutting blade according to the present invention, the brittle material can be cut into high quality over a long period of time, so that it can be used industrially.

10 Blade body 11 Outer peripheral surface (outer peripheral part)
11A Cutting edge 20 Resin bond phase 30 Abrasive grain 40 Filler 100 Cutting blade

Claims (3)

The blade body rotated around the axis is a cutting blade that cuts the material to be cut by the cutting edge.
The blade body is
A resin bond phase formed in a disk shape and made of resin,
The abrasive grains dispersed in the resin bond phase and
Dispersed in the resin bond phase, the filler and
The cutting edge arranged on the outer peripheral portion of the resin bond phase and
Equipped with
The filler is
A cutting blade characterized by containing a filler made of titanium boride (TiB ₂ ). The cutting blade according to claim 1.
The content of the entire filler containing titanium boride (TiB ₂ ) is
A cutting blade having a content of 20 vol% or more and 50 vol% or less with respect to the blade body. The cutting blade according to claim 1 or 2.
A cutting blade having an average particle size of 1 μm or more and 15 μm or less of the filler made of titanium boride (TiB ₂ ).

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