JP2022056014A - Packaging container with RF tag - Google Patents

Abstract

To reduce swelling of a portion storing an RF tag without reducing the size of an antenna of the RF tag in a packaging container in which the RF tag is stored between a pasting margin and a plate adhered to the pasting margin in the packaging container.SOLUTION: In a packaging container 1 with an RF tag, the RF tag 2 is provided with an inlay 21 in which an IC chip 22 and a coupling conductive wire 23 connected to the IC chip are formed, and an antenna body 20 formed separately from the inlay 21. In order to capacitively couple the coupling conductive wire 23 and the antenna main body 20, a surface of the inlay 21 on which the coupling conductive wire 23 is formed and the antenna main body 20 are adhered to each other so that the coupling conductive wire 23 and the antenna main body 20 overlap each other by using a glue layer 12 formed on a glue margin 10.SELECTED DRAWING: Figure 1

Description

The present invention relates to a packaging container with an RF tag (RF: Radio Frequency) used in an automatic recognition technique using wireless communication.

In recent years, the use of RF tags for packaging container management applications such as automatic settlement and inventory management has been studied. An RF tag means an information medium attached to an object to be recognized in an automatic recognition technology using wireless communication. The RF tag may be referred to as a radio tag, an IC tag, an RFID tag (RFID: Radio Frequency Identification), or the like. In addition, the packaging container means a container in which a product is put or wrapped.

As shown in FIG. 3 of Patent Document 1, it is common to attach an RF tag to the surface of the packaging container to be recognized (the packaging box in FIG. 3 above). In Patent Document 1, a sheet-shaped antenna material that functions as a part of the antenna is attached to the packaging container (in Patent Document 1, the packaging material) in order to be attached to the surface of the packaging container to be recognized. An IC strap consisting of an IC chip and a lead wire is attached so as to overlap with the antenna material.

Attaching the RF tag to the outer surface of the packaging container is hygienic if the RF tag is attached to the inner surface of the packaging container to be recognized if the packaging container is a food product. If the packaging container is a packaging box, the RF tag may break down due to friction between the product inside and the RF tag.

Attaching the RF tag to the surface of the packaging container to be recognized facilitates the process of attaching the RF tag, but on the other hand, there is a problem caused by attaching the RF tag to the surface of the packaging container to be recognized. There is also. As this problem, there is a problem that the appearance of the packaging container is deteriorated and a problem that fraudulent acts against the RF tag (such as the RF tag being peeled off) can be easily performed. In order to solve this problem, in the invention disclosed in Patent Document 2, the RF tag is housed between the glue margin and the plate (panel) to be adhered to the glue margin in the packaging container, so that the RF tag is placed on the surface of the packaging container. And it is prevented from appearing on the inside.

Japanese Unexamined Patent Publication No. 2020-63067 Japanese Unexamined Patent Publication No. 2011-201567

By accommodating the RF tag between the glue margin and the plate to be adhered to it, various problems that occur when the RF tag is attached to the surface of the packaging container can be solved. However, if the RF tag is accommodated between the glue margin and the plate to be adhered to it, the RF tag does not appear on the surface of the packaging container, but the part where the RF tag is accommodated swells, causing defects such as poor adhesion of the glue margin. It will be the cause.

If the size of the RF tag accommodated between the glue margin and the plate to be bonded to the packaging container is reduced, the swelling of the portion where the RF tag is accommodated is also reduced, and the occurrence of defects such as poor adhesion of the glue margin can be suppressed. However, if the size of the RF tag is reduced, the size of the antenna of the RF tag is also reduced, so that the communication distance of the RF tag is shortened.

Therefore, according to the present invention, in a packaging container in which the RF tag is housed between the glue margin and the plate to be adhered to the glue margin in the packaging container, the swelling of the place where the RF tag is housed is reduced without reducing the size of the antenna of the RF tag. The purpose is to do.

The present invention that solves the above-mentioned problems is a non-metal packaging container in which an RF tag is housed between a glue margin and a portion bonded to the glue margin, and the RF tag is connected to an IC chip. The inlay on which the coupling lead wire is formed and the antenna body formed separately from the inlay are provided, and the glue layer formed in the glue margin is used for capacitively coupling the coupling lead wire and the antenna body. It is a packaging container with an RF tag, characterized in that the surface of the inlay on which the coupling lead wire is formed and the antenna body are attached so that the coupling lead wire and the antenna body overlap.
In the present invention, the antenna body can be formed on the glued surface of the glue margin. Further, in the present invention, the antenna body can be formed in the region of the portion to be adhered to the glue margin.

In the packaging container with an RF tag according to the present invention, even if the RF tag is accommodated between the glue margin and the plate to be adhered to the glue margin, the place where the swelling occurs can be limited to the place where the inlay is arranged. Even if the size of the antenna body is such that the desired communication distance can be obtained, the inlay can be made smaller than the antenna body, so that the bulge at the place where the RF tag is housed is small.

The figure explaining the packaging container with RF tag which concerns on this embodiment. The figure explaining the RF tag provided in the tag packaging container with RF which concerns on this embodiment. The figure explaining the blank used for the packaging container with RF tag which concerns on this embodiment. The figure explaining the process of pasting a blank with a sack. The figure explaining the packaging container with RF tag which concerns on 1st modification. The figure explaining the blank which concerns on the 1st modification. The figure explaining the process of sack pasting the blank which concerns on the 1st modification. The figure explaining the packaging container with RF tag which concerns on the 2nd modification. The figure explaining the blank which concerns on the 2nd modification The figure explaining the packaging container with RF tag which concerns on 3rd modification. The figure explaining the packaging container with RF tag which concerns on 4th modification.

From here, an embodiment according to the present invention will be described. The present embodiment is for facilitating the understanding of the present invention, and the present invention is not limited to the present embodiment. Unless otherwise specified, the drawings are schematic drawings drawn to facilitate understanding of the present invention.

FIG. 1 is a diagram illustrating a packaging container 1 with an RF tag according to the present embodiment. The RF-tagged packaging container 1 shown in FIG. 1 is a non-metal packaging container having a structure in which the RF tag 2 is housed between the glue margin 10 and the portion bonded to the glue margin 10. In FIG. 1, the place where the RF tag 2 is stored is the body 1a of the packaging container 1 with the RF tag.

A non-metal packaging container means a packaging container using a non-metal base material. The non-metal base material used for packaging containers means a base material that is not metal. As the non-metal base material used for the packaging container, plastic, paper, or a laminated base material in which these are laminated can be used.

In the RF-tagged packaging container 1, the layer structure of the portion accommodating the RF tag 2 is such that the glue margin 10 to which the glue is applied, the antenna main body 20 processed into the glue margin 10 in order from the inner surface of the RF-tagged packaging container 1. The glue layer 12 applied to the glue margin 10, the inlay 21 in which the IC chip 22 and the connecting lead wires 23 connected to both sides of the IC chip 22 are formed on the inlay base material 24, and the side plate 11a serving as a portion to be bonded to the glue margin 10. .. Although the glue margin 10 and the side plate 11a are shown in FIG. 1 so as not to be adhered to each other for the sake of clarity, the glue margin 10 and the side plate 11a are crimped in the actual RF-tagged packaging container 1. It is adhered by the glue layer 12.

FIG. 2 is a diagram illustrating an RF tag 2 provided in the RF-tagged packaging container 1 according to the present embodiment. FIG. 2A is a diagram for explaining the components of the RF tag 2, and FIG. 2B is a diagram for explaining the structure of the RF tag 2.

As shown in FIG. 2A, the component of the RF tag 2 is a small inlay 21 (referred to as a strap) in which an IC chip 22 and a pair of connecting conductors 23 connected to the IC chip 22 are formed on an inlay base material 24. In some cases), the antenna body 20 is formed separately from the inlay 21.

As shown in FIG. 2B, in the RF tag 2, the surface of the inlay 21 (bonding conductor 23 and the like) in which the IC chip 22 and the coupling conductors 23 provided on both sides thereof are mounted on the inlay base material 24 is formed. The surface) and the antenna body 20 are attached to each other by using the glue layer 12 formed on the glue margin 10.

The antenna body 20 of the present embodiment has a shape corresponding to the frequency of the UHF band. Specifically, the antenna body 20 has the shape of a dipole antenna. A slit 20a is provided in the center of the antenna body 20, and the antenna body 20 is divided into two parts by the slit 20a. The location where the IC chip 22 is placed is the slit 20a of the antenna body 20.

With the RF tag 2 viewed from above in a plan view, each of the coupling conductors 23 provided on both sides of the IC chip 22 overlaps with the antenna main body 20. The coupling conductor 23 on the left side of the IC chip 22 overlaps with the left part of the antenna body 20, and the coupling conductor 23 on the right side of the IC chip 22 overlaps with the right part of the antenna body 20. Since the glue layer 12 exists between the coupling conductor 23 and the antenna body 20, the coupling conductor 23 and the antenna body 20 overlap each other, so that the coupling conductor 23 and the antenna body 20 are capacitively coupled via the glue layer 12. However, each part of the antenna body 20 serves as a lead-out wiring for the IC chip 22.

As shown in FIG. 2, by forming the inlay 21 and the antenna body 20 separately, swelling occurs even if the RF tag is accommodated between the glue margin and the plate to be adhered to the glue margin in the RF-tagged packaging container 1. The place to do is limited to the place where the inlay 21 is arranged. The antenna body 20 is formed by printing using conductive ink or stamping using metal foil. Therefore, the thickness of the antenna body 20 is very thin, and even if the size of the antenna body 20 is such that a desired communication distance can be obtained, the portion of the antenna body 20 does not swell. Since the inlay 21 has an inlay base material 24 and the like, its thickness is thicker than that of the antenna main body 20, but since the inlay 21 can be made smaller than the antenna main body 20, the swelling of the portion accommodating the RF tag 2 can be obtained. Can be made smaller. Therefore, in the packaging container 1 with an RF tag of the present embodiment, the inlay 21 can be made smaller than the antenna main body 20 even if the antenna main body 20 has a size that allows a desired communication distance, and therefore the RF tag 2 is accommodated. The swelling of the part can be reduced.

FIG. 3 is a diagram illustrating a blank 3 used in the RF-tagged packaging container 1 according to the present embodiment. The RF-tagged packaging container 1 according to the present embodiment is formed by punching into the shape of the developed view of the RF-tagged packaging container 1 and attaching a blank 3 having a ruled line of 11 m to a portion to be folded. Ru.

The blank 3 shown in FIG. 3 has four side plates 11a, 11b, 11c and 11d forming the body 1a of the RF-tagged packaging container 1, one bottom plate 11f that closes the bottom side of the body 1a, and the body 1a. It has a single top plate 11e that closes the top side of the. In the blank 3 illustrated in FIG. 3, the flap 11g for fixing the top plate 11e in a state where the top side of the body 1a is closed is connected to the top plate 11e, and the flap 11h for this is connected to the side plate 11c. The flap 11i for the purpose is connected to the side plate 11a. Further, in the blank 3 illustrated in FIG. 3, the flap 11j for fixing the bottom plate 11f in a state where the bottom side of the body 1a is closed is connected to the bottom plate 11f, and the flap 11k for this is connected to the side plate 11c. A flap 11l for this purpose is connected to the side plate 11a.

FIG. 3 illustrates the surface (printed surface) of the blank 3. In order to realize the present invention, in the blank 3 shown in FIG. 3, a glue margin 10 is provided on one side of the side plate 11d, and the antenna main body 20 is processed in the glue margin 10. This is because the surface of the glue margin 10 becomes the glued surface, and the glue layer 12 is formed on the surface of the glue margin 10. The antenna body 20 can be formed by a printing process using a metal ink or a foil stamping process using a metal foil. The portion to be adhered to the glue margin 10 is the side plate 11a on the opposite side of the glue margin 10.

FIG. 4 is a diagram illustrating a process of attaching a blank 3 to a sack, and the blank 3 has an inner surface facing up. Attaching the blank 3 to the sack means that the glue margin 10 of the blank 3 and the side plate 11a are adhered to each other so that the blank 3 can be assembled in the form of a packaging container.

The steps of sack-pasting the blank 3 include a gluing step S1 for gluing the glue margin 10 of the blank 3 and an inlay pasting step S2 for pasting the inlay 21 according to the position of the antenna body 20 printed on the glue margin 10. Includes a folding step S3 in which the blank 3 is folded using a folding guide or the like, and a crimping step S4 in which the glue margin 10 and the side plate 11a are crimped.

The gluing step S1 for gluing the gluing allowance 10 of the blank 3 is a step of forming the gluing layer 12 on the surface of the gluing allowance 10 by using a gluing roller or the like. As the glue, a hot melt adhesive, an emulsion adhesive, a double-sided tape, or the like can be used. A sticking machine for sticking a sheet-shaped medium is used in the inlay sticking step S2 for sticking the inlay 21 according to the position of the antenna main body 20 printed on the glue margin 10. The inlay 21 is attached onto the glue layer 12 formed in the glue margin 10 in the gluing step S1. The folding step S3 is a step of folding a predetermined ruled line processed into the blank 3 along the folding guide while transporting the blank 3. The crimping step S4 for crimping the glue margin 10 and the side plate 11a is a step of crimping the portion of the blank 3 glued by using the crimping roller.

By pasting the blank 3 with a sack, the blank 3 is processed so that the glue margin 10 and the side plate 11a are adhered to each other. By folding the top side and the bottom side of the blank 3 in this state, the RF-tagged packaging container 1 shown in FIG. 1 can be assembled.

In the above-described embodiment, the antenna main body 20 is processed on the glue margin 10, but the antenna main body 20 can also be processed in a region overlapping the glue margin 10 at a portion to be adhered to the glue margin 10.

FIG. 5 is a diagram illustrating the structure of the RF-tagged packaging container 4 according to the first modification. In FIG. 5, the same elements as those in FIG. 1 are designated by the same reference numerals as those in FIG.

The RF-tagged packaging container 4 according to the first modification shown in FIG. 5 is between the glue margin 10 and the portion bonded to the glue margin 10, similarly to the RF-tagged packaging container 1 shown in FIG. It is a non-metal packaging container having a structure in which the RF tag 2 is housed in the container. Also in FIG. 5, similarly to FIG. 1, the place where the RF tag 2 is stored is the body 4a of the packaging container 4 with the RF tag according to the first modification.

The RF-tagged packaging container 1 and the RF-tagged packaging container 4 according to the first modification are the same in that the RF tag 2 is accommodated between the glue margin 10 and the portion bonded to the glue margin 10. However, the layer structure of the place where the RF tag 2 is housed is different.

In the RF-tagged packaging container 4 according to the first modification, the layer structure of the portion accommodating the RF tag 2 is such that the adhesive is applied in order from the inner surface of the RF-tagged packaging container 4 according to the first modification. The glue margin 10, the adhesive layer 40 for adhering the glue margin 10, the inlay 21 adhering to the glue margin 10 via the adhesive layer 40, the glue layer 12 applied to the glue margin 10, and the portion to be adhered to the glue margin 10. It becomes the antenna main body 20 processed into the side plate 11a and the side plate 11a which becomes a portion to be adhered to the glue margin 10. In FIG. 5, for the sake of clarity, the glue margin 10 and the side plate 11a are shown so as not to be adhered to each other. The side plate 11a is crimped and adhered by the glue layer 12.

In the RF-tagged packaging container 4 according to the first modification, the basic structure of the RF tag 2 is the same as that in FIG. The RF tag 2 includes an inlay 21 in which an IC chip 22 and coupling conductors 23 provided on both sides thereof are formed on an inlay base material 24, and an antenna body 20 that is capacitively coupled to the coupling conductors 23. In the RF-tagged packaging container 4 according to the first modification, the back surface of the inlay 21 (the surface on which the bonding lead wire 23 is not mounted) is adhered to the glue margin 10 by the adhesive layer 40, and the IC chip 22 is glued. It will be protected by the glue layer 12 applied to the teen.

FIG. 6 is a diagram illustrating a blank 5 according to the first modification. In FIG. 6, the same elements as those in FIG. 3 are designated by the same reference numerals as those in FIG.

FIG. 6 illustrates the inner surface of the blank 5 according to the first modification. Since the structure of the blank 5 according to the first modification illustrated in FIG. 6 is the same as that in FIG. 3, the description thereof is omitted here. In order to realize the present invention, in the blank 5 according to the first modification shown in FIG. 6, the antenna body 20 is processed in the region overlapping with the glue margin 10 in the side plate 11a which is a portion to be adhered to the glue margin 10. ing. This is because, in the side plate 11a which is a portion to be adhered to the glue margin 10, the region overlapping with the glue margin 10 is the inner surface of the side plate 11a.

FIG. 7 is a diagram illustrating a step of sack-pasting the blank 5 according to the first modification. In the blank according to the first modification, the antenna body 20 is processed on the inner surface of the side plate 11a which is a portion to be adhered to the glue margin 10, so that the step of sack-pasting the blank 5 according to the first modification is It is different from FIG.

In the step of sack-pasting the blank 5 according to the first modification, the inlay attachment step S10 for attaching the inlay 21 to the glue allowance 10 and the glue allowance 10 for the blank 5 according to the first modification are attached. It includes a gluing step S11, a folding step S12 for folding the blank 5 according to the first modification using a folding guide, and a crimping step S13 for crimping the glue margin 10 and the side plate 11a.

In the first modification, the glue layer 12 is not formed on the glue allowance 10 at the time of executing the inlay attachment step S10 for attaching the inlay 21 to the glue allowance 10. Therefore, in this step, an adhesive layer 40 is formed on the back surface of the inlay 21 (the surface on which the connecting conductor 23 is not mounted) using an adhesive, and the back surface of the inlay 21 and the glue margin 10 are adhered to each other. become. When the back surface of the inlay 21 and the glue margin 10 are adhered to each other, the front surface of the inlay 21 (the surface on which the connecting conductor 23 is mounted) appears on the inner surface of the blank 5 according to the first modification.

In the gluing step S11 for gluing the glue margin 10 of the blank 5 according to the first modification, the glue layer 12 is formed on the glue margin 10 of the blank 5 according to the first modification to form the surface of the inlay 21 ( The surface on which the connecting conductor 23 is mounted) is covered with the glue layer 12, and the IC chip 22 mounted on the inlay 21 is protected by the glue layer 12.

Since the folding step S12 and the crimping step S13 according to the first modification are the same as those described with reference to FIG. 4, the description thereof is omitted here.

Until now, the form of the packaging container was a box body, but the present invention can be applied to various packaging containers other than the box body.

FIG. 8 is a diagram illustrating the RF-tagged packaging container 6 according to the second modification. As shown in FIG. 8, the form of the RF-tagged packaging container 6 according to the second modification is a gable top type liquid paper container. In the packaging container 6 with an RF tag according to the second modification, the RF tag 2 provided with the inlay 21 and the antenna main body 20 is housed between the two sealing flaps 60. In the case of the RF-tagged packaging container 6 according to the second modification, one sealing flap 60 serves as a glue margin, and the other sealing flap 60 serves as a portion to be adhered to the glue margin. Similar to the RF-tagged packaging container 1 illustrated in FIG. 1, when the RF tag 2 is housed in the body 6a of the RF-tagged packaging container 6 according to the second modification, the RF according to the second modification is obtained. This is because the communication distance of the RF tag 2 is shortened due to the influence of the liquid filled in the body 6a of the tagged packaging container 6.

FIG. 9 is a diagram illustrating a blank 7 according to the second modification. Since the blank 7 according to the second modification is a developed view of a general gable top type liquid paper container, detailed description thereof will be omitted here. In the blank 7 according to the second modification, the antenna main body is placed on the inner surface of one of the two sealing flaps 60 on the top side of the blank 7 according to the second modification. 20 is processed. The RF tag 2 is formed by assembling the blank 7 according to the second modification to which the sticker is attached into a liquid paper container, filling the liquid paper container with liquid, and then sealing the two sealing flaps 60. It is housed between two sealing flaps 60.

FIG. 10 is a diagram illustrating a packaging container 8 with an RF tag according to a third modification. As shown in FIG. 10, the form of the RF-tagged packaging container 8 according to the third modification is a pillow package. In the packaging container 8 with an RF tag according to the third modification, the RF tag 2 is housed in the gassho adhesive portion 80 to which the edges of the resin film are bonded. In this case, one of the ends of the resin film bonded to the gassho adhesive portion 80 becomes the glue margin, and the other end becomes the portion to be adhered to the glue margin by the glue.

The RF tag 2 provided with the inlay 21 and the antenna main body 20 is housed in the gassho adhesive portion 80 when the gassho adhesive portion 80 of the RF tag-attached packaging container 8 according to the third modification is sealed. In the RF-tagged packaging container 8 according to the third modification, the antenna body 20 is processed on one end of the resin film, and the inlay 21 is attached to the other end.

FIG. 11 is a diagram illustrating the RF-tagged packaging container 9 according to the fourth modification. As shown in FIG. 11, the form of the RF-tagged packaging container 9 according to the fourth modification is a container with a lid. In the packaging container 9 with an RF tag according to the fourth modification, the RF tag 2 is accommodated between the container body 90 in which the accommodating portion is formed and the peripheral edge 90a of the container body 90 and the lid 91 adhered by glue. There is.

When the lid 91 is attached to the peripheral edge 90a of the container body 90 of the RF-tagged packaging container 9 according to the fourth modification, the RF tag 2 is the peripheral edge 90a of the container body 90 and the lid 91 serving as a glue margin. It is housed in between. The portion where the antenna main body 20 is processed may be the peripheral edge 90a of the container main body 90 serving as a glue margin, or the lid 91 which adheres to the peripheral edge 90a of the container main body 90.

1 RF-tagged packaging container 10 Glue allowance 11a Side plate 12 Glue layer 2 RF tag 20 Antenna body 21 Inlay 22 IC chip 23 Coupling lead wire 24 Inlay base material 3 Blank 4 RF-tagged packaging container according to the first modification Example 40 Adhesion Agent layer 5 Blank according to the first modification 6 RF-tagged packaging container according to the second modification 60 Sealing flap 7 Blank according to the second modification 8 RF-tagged packaging according to the third modification Container 80 Gassho adhesive part 9 Packaging container with RF tag according to the 4th modification 90 Container body 90a Periphery 91 Lid

Claims (3)

A non-metal packaging container in which an RF tag is housed between the glue margin and the portion bonded to the glue margin.
The RF tag includes an IC chip, an inlay forming a connecting lead wire connected to the IC chip, and an antenna body formed separately from the inlay.
In the inlay where the coupling conductor is formed so that the coupling conductor and the antenna body overlap each other by using the glue layer formed in the glue margin in order to capacitively couple the coupling conductor and the antenna body. The surface and the antenna body were attached.
A packaging container with an RF tag that features that. The RF-tagged packaging container according to claim 1, wherein the antenna body is formed on the glued surface of the glue margin. The RF-tagged packaging container according to claim 1, wherein the antenna body is formed in a region of a portion to be adhered to the glue margin.

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