JP2022055710A - Manufacturing method for heating device and heating device - Google Patents

Abstract

To provide a manufacturing method for a heating device and a heating device that enable a heating part to be easily bonded to a base material.SOLUTION: A heating section 3 is formed to extend along the surface of an adhesive layer 2 composed of a composite material including a prepreg. A base material is thermo-compressed to the back surface of the adhesive layer 2. Here, the prepreg is, for example, made of carbon fibers impregnated with a thermosetting resin such as epoxy and has thermosetting properties. The prepreg has a high thermal conductivity of 3.0 W/mK or higher, for example.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a method for manufacturing a heating device and a heating device.

Conventionally, a heating device for heating an object to be heated has been put into practical use. In the heating device, a heating portion to be heated by energization is arranged on the base material, and by controlling the energization of the heating portion, the heating target can be heated to a predetermined temperature. Here, it is required to easily manufacture the heating device.

Therefore, as a technique for easily manufacturing a heating device, for example, Patent Document 1 proposes a method for manufacturing a surface warming device having good productivity, low cost, and good quality. In this method, a heat-sealing sheet is interposed on the heater unit to form a backing material unit in which a shock absorber is superposed, and this backing material unit is hot-pressed to manufacture, so that the number of heat-pressing is suppressed. Can be done.

Japanese Unexamined Patent Publication No. 05-198357

However, in the method of Patent Document 1, a plurality of layers such as a buffer and a heat-sealing sheet are arranged between a heating portion made of a heating wire and a base material made of a heat insulating material and heat-pressed, so that the heating portion is heated. It took a lot of effort to adhere to the substrate.

It is an object of the present disclosure to provide a method for manufacturing a heating device and a heating device for easily adhering a heating portion to a base material.

In the method for manufacturing a heating device according to the present disclosure, a heating portion is formed so as to extend along the surface of an adhesive layer composed of a composite material containing a prepreg, and a base material is thermocompression bonded to the back surface of the adhesive layer. ..

The heating device according to the present disclosure is arranged so as to extend along the surface of the adhesive layer composed of a composite material containing a prepreg, and is thermocompression bonded to the heating portion heated by energization and the back surface of the adhesive layer. It is provided with a base material.

According to the present disclosure, the heated portion can be easily adhered to the base material.

It is a figure which shows the structure of the heating apparatus which concerns on Embodiment 1 of this disclosure. It is a figure which shows the state of manufacturing the heating apparatus. It is a figure which shows the structure of the heating apparatus which concerns on Embodiment 2.

Hereinafter, embodiments according to the present disclosure will be described with reference to the accompanying drawings.

(Embodiment 1)
FIG. 1 shows the configuration of the heating device according to the first embodiment of the present disclosure. The heating device includes a heat insulating layer 1, an adhesive layer 2, a heating unit 3, and energizing terminals 4a and 4b.

The heat insulating layer 1 blocks heat transferred from the heating unit 3, and is made of a heat insulating material. The heat insulating layer 1 is formed in the shape of a rectangular flat plate.

The adhesive layer 2 adheres the heating portion 3 to the heat insulating layer 1 and has an insulating property. The adhesive layer 2 has a rectangular flat plate shape composed of a prepreg, and the back surface of the adhesive layer 2 is thermocompression bonded onto the front surface of the heat insulating layer 1. Here, the prepreg is, for example, a carbon fiber impregnated with a thermosetting resin such as epoxy and has thermosetting property. Further, the prepreg has a high thermal conductivity of, for example, 3.0 W / mK or more.

The heating portion 3 is arranged so as to extend along the surface of the adhesive layer 2 and is formed of a conductive material having a predetermined resistance value so as to be heated by energization. Examples of the conductive material include metals such as copper.

The energizing terminals 4a and 4b are connected to a power source (not shown) and are made of a conductive material. The energizing terminal 4a is connected to one end of the heating unit 3, and the energizing terminal 4b is connected to the other end of the heating unit 3. Examples of the conductive material include metals such as copper.

Next, a method of manufacturing the heating device will be described.

First, as shown in FIG. 2A, the conductive layer 11 is adhered on the surface of the adhesive layer 2. Here, the adhesive layer 2 is composed of a prepreg, and has, for example, a semi-cured state in which carbon fibers are impregnated with a thermosetting resin. Further, the conductive layer 11 is made of a conductive material such as metal.

Next, as shown in FIG. 2B, the conductive layer 11 is etched to form the heating portion 3 so as to extend along the surface of the adhesive layer 2.

Subsequently, as shown in FIG. 2C, the adhesive layer 2 is arranged on the surface of the heat insulating layer 1. At this time, since the adhesive layer 2 has non-adhesiveness at room temperature, it can be easily aligned with the heat insulating layer 1.

Then, by pressing the adhesive layer 2 while heating it from the heating portion 3 side, the adhesive layer 2 is thermosetting, and the heat insulating layer 1 is thermocompression bonded to the back surface of the adhesive layer 2.
Here, it is preferable that the heat insulating layer 1 has an uneven portion on the surface to be adhered to the adhesive layer 2. As a result, the adhesive layer 2 is thermocompression-bonded while being inserted into the uneven portion of the heat insulating layer 1, so that the adhesive layer 2 can be firmly adhered to the heat insulating layer 1.

As described above, since the adhesive layer 2 is composed of the prepreg, the adhesive layer 2 can be easily aligned with the heat insulating layer 1, and the back surface of the adhesive layer 2 can be easily thermocompression bonded to the heat insulating layer 1. can. As a result, the heating portion 3 can be easily adhered to the heat insulating layer 1 only through the adhesive layer 2.

Further, since the adhesive layer 2 has a high thermal conductivity of 3.0 W / mK or more, the heating unit 3 side can be heated at a predetermined temperature even if the heating units 3 are sparsely arranged at large intervals. The heating portion 3 can be easily formed.

In the present embodiment, the adhesive layer 2 is thermocompression-bonded to the heat insulating layer 1 after the heating portion 3 is bonded, but it is sufficient if the heating unit 3 and the heat insulating layer 1 can be bonded to each other. It is not something that can be done. For example, the heating unit 3 and the heat insulating layer 1 can be arranged on the adhesive layer 2, and the heating unit 3 and the heat insulating layer 1 can be bonded to the adhesive layer 2 at once by thermocompression bonding.

Further, the heating portion 3 was formed by etching before the adhesive layer 2 was thermocompression bonded to the heat insulating layer 1, but it is limited to this as long as it is formed so as to extend along the surface of the adhesive layer 2. It is not something that can be done. For example, the heating unit 3 can also be formed by thermocompression bonding the conductive layer 11 and the heat insulating layer 1 to the adhesive layer 2 and then etching.

Subsequently, as shown in FIG. 1, the energizing terminal 4a is connected to one end of the heating unit 3 and the energizing terminal 4b is connected to the other end of the heating unit 3. The energizing terminals 4a and 4b can be connected to the heating unit 3 by, for example, welding and soldering.

In the heating device manufactured in this way, the energization terminals 4a and 4b are connected to a power source (not shown), and the heating unit 3 is heated by energization from the power source. As a result, the heating target existing in front of the heating unit 3 can be heated.

At this time, since the heating unit 3 is directly adhered to the adhesive layer 2, peeling due to heat can be suppressed as compared with the case where the heating portion 3 is adhered via an adhesive such as double-sided tape. , The heating target can be heated stably.

Further, since the adhesive layer 2 has a high thermal conductivity of 3.0 W / mK or more, the heat transferred from the heating unit 3 can be quickly transferred in the plane direction, and a wide range can be heated. ..
Further, since the heating unit 3 is directly adhered to the adhesive layer 2, heat can be efficiently transferred to the adhesive layer 2.

The heating target may be, for example, an individual such as a battery, or a fluid such as a gas or a liquid.

According to the present embodiment, since the adhesive layer 2 is composed of a prepreg, the heating portion 3 can be easily adhered to the heat insulating layer 1 by thermocompression bonding the back surface of the adhesive layer 2 to the heat insulating layer 1. can.

(Embodiment 2)
Hereinafter, Embodiment 2 of the present disclosure will be described. Here, the differences from the first embodiment will be mainly described, and the common reference numerals will be used for the common points with the first embodiment, and detailed description thereof will be omitted.

In the first embodiment described above, the heat insulating layer 1 is formed in a flat plate shape, but is not limited to this as long as it is thermocompression bonded to the back surface of the adhesive layer 2.

For example, as shown in FIG. 3, the heat insulating layer 21 and the adhesive layer 22 can be arranged in place of the heat insulating layer 1 and the adhesive layer 2 of the first embodiment.

The heat insulating layer 21 blocks heat transferred from the heating unit 3 and is made of a heat insulating material. The heat insulating layer 21 is formed so as to be curved, and a curved surface is formed on the surface thereof.

The adhesive layer 22 adheres the heating portion 3 to the heat insulating layer 21 and has an insulating property. The adhesive layer 22 has a curved shape composed of a prepreg, and the back surface of the adhesive layer 22 is thermocompression bonded in a state of being arranged along the curved surface of the heat insulating layer 21.

Next, a method of manufacturing the heating device according to the present embodiment will be described.

First, as in the first embodiment, the heating portion 3 is formed so as to extend along the surface of the adhesive layer 22. Subsequently, the adhesive layer 22 is arranged along the curved surface of the heat insulating layer 21. At this time, since the adhesive layer 22 has non-adhesiveness at room temperature, it can be easily aligned with the heat insulating layer 21.

Then, the adhesive layer 22 is thermally cured by pressing the adhesive layer 22 while heating it in a state where the adhesive layer 22 is arranged along the curved surface of the heat insulating layer 21, and the heat insulating layer 21 is heated on the back surface of the adhesive layer 22. It is crimped.
As described above, since the adhesive layer 22 is composed of the prepreg, the adhesive layer 22 can be easily thermocompression-bonded along the curved surface of the heat insulating layer 21. As a result, the heating portion 3 can be easily adhered to the heat insulating layer 21 via the adhesive layer 22.

The heating device manufactured in this way can be arranged in a curved member such as an intake pipe and an exhaust pipe of a vehicle, and can heat a heating target in the curved member.

According to the present embodiment, since the adhesive layer 22 is composed of a prepreg, the heating portion 3 is easily bonded to the heat insulating layer 21 by thermocompression bonding the adhesive layer 22 along the curved surface of the heat insulating layer 21. can do.

In the above-described first and second embodiments, the adhesive layer is thermocompression-bonded to the heat insulating layer, but it is not limited to the heat-insulating layer as long as it is thermocompression-bonded to the base material.

Further, in the above-described first and second embodiments, the adhesive layer is composed of only the prepreg, but is not limited to this as long as it is composed of the composite material containing the prepreg.

In addition, the above embodiments are merely examples of embodiment of the present invention, and the technical scope of the present invention should not be construed in a limited manner by these. be. That is, the present invention can be implemented in various forms without departing from its gist or its main features. For example, the disclosure of the shape, number, and the like of each part described in the above embodiment is merely an example, and can be appropriately modified and carried out.

The method for manufacturing a heating device according to the present disclosure can be used as a method for adhering a heating portion to a base material.

1,21 Insulation layer 2,22 Adhesive layer 3 Heating part 4a, 4b Energizing terminal 11 Conductive layer

Claims (5)

A heated portion is formed so as to extend along the surface of an adhesive layer composed of a composite material containing a prepreg.
A method for manufacturing a heating device in which a base material is thermocompression bonded to the back surface of the adhesive layer. A conductive layer is adhered on the surface of the adhesive layer, and the conductive layer is adhered to the surface.
The method for manufacturing a heating device according to claim 1, wherein the conductive layer is etched to form the heating portion. The method for manufacturing a heating device according to claim 1 or 2, wherein the base material is a heat insulating layer made of a heat insulating material. The method for manufacturing a heating device according to any one of claims 1 to 3, wherein the base material has a curved surface, and the adhesive layer is thermocompression-bonded along the curved surface. An adhesive layer composed of a composite material containing prepreg,
A heating unit that is arranged so as to extend along the surface of the adhesive layer and is heated by energization.
A heating device including a base material thermocompression bonded to the back surface of the adhesive layer.

Images