JP2022052911A - Electronic apparatus manufacturing method and jig for assembly - Google Patents

Abstract

To provide technology with which it is possible to improve workability.SOLUTION: An electronic apparatus manufacturing method comprises: a first step for assembling a magnetic core 106 through an opening into the inside of a case body 102, one end of which is open and the other end is capable of accommodating the magnetic core 106; a second step for holding the magnetic core 106 assembled into position in the first step at a position near the opening using magnetic forces made to act upon from the outside of the case body 102; and a third step for temporarily assembling, to the magnetic core 106 held in position in the second step, an electronic component that is inserted into a gap 106a thereof.SELECTED DRAWING: Figure 9

Description

The present invention relates to a method for manufacturing an electronic device suitable for assembling an electronic device product, and an assembly jig that can be used in this manufacturing method.

As an electronic device, for example, there is known a current sensor in which a magnetic component is housed inside a container-shaped case and the electronic component is combined with the magnetic component to complete the process (see, for example, Patent Document 1). A characteristic of this type of current sensor is that the core, which is a magnetic component, occupies most of the volume of the finished product, whereas electronic components such as substrates and Hall elements are extremely small, and such extremely small electronic components. Is precisely positioned and placed within a small gap provided in a portion of a relatively large core.

Generally, in the assembly work of this type of current sensor, the core is first dropped into the accommodation space formed in the case body, and then the precision parts such as the substrate and Hall element are assembled while being delicately aligned. Will be done. This is because it is easier to align small and lightweight parts later if relatively large heavy objects such as cores are stored first. Therefore, in an electronic device such as a current sensor, the assembly order is usually reflected in the positional relationship between the core and the electronic component as seen in the completed state, and the core is located in the back side of the case body in the completed state and in front of it. The structure is such that electronic components are located on the side.

Japanese Unexamined Patent Publication No. 2006-78255

However, in the above-mentioned current sensor assembly work, since the core is dropped into the accommodation space first, the position of the gap for inserting the electronic component later is deep in the accommodation space, and the visibility is not so good. There is. For this reason, in some cases, the operator may be forced to perform the assembly work only with a rough idea without depending on the visual recognition, and there is a risk that the electronic component may come into contact with the edge of the gap and be damaged.

The present invention provides a technique capable of improving workability.

The present invention provides a manufacturing method. The manufacturing method of the present invention comprises the following steps.
[First step]
In this step, the magnetic component is incorporated into a container-shaped case body having an opening at one end and a closed end surface capable of accommodating the magnetic component through the opening. At this time, the magnetic component may be inserted from above with the opening of the case body facing upward.
[Second step]
In this step, the magnetic component incorporated in the first step is held in the vicinity of the opening by using the magnetic force applied from the outside of the case body.
Alternatively, in the above [second step], the magnetic component is floated from the inside of the case body to a position near the opening by attracting the magnetic component with a magnet arranged close to the outer surface of the case body. You can also.
[Third step]
In this step, electronic parts to be combined in a predetermined positional relationship in a completed state are temporarily assembled to the magnetic parts held in the vicinity of the opening in the second step.

As a result, even if a relatively large and heavy magnetic component is dropped inside the case body, the magnetic component is located near the opening of the case body at the stage of temporarily assembling the electronic component. , The visibility of the position where the electronic parts should be combined in the completed state is improved, and the occurrence of work mistakes can be reduced.

The production method of the present invention further includes the following steps.
[Fourth step]
In this step, the magnetic parts and electronic parts temporarily assembled in the third step are installed at each accommodation position in the resin case.

As a result, the temporarily assembled parts can be accommodated in their respective accommodation positions while maintaining the correct positional relationship, so that the assembly accuracy of the final finished product can be improved.

Next, the present invention provides an assembly jig. The assembly jig includes a mounting surface, a contact surface, and a magnet. Of these, the mounting surface can mount intermediate products to be assembled. Further, the contact surface can be in contact with the side surface of the intermediate product mounted on the mounting surface. The magnet can exert a magnetic force on the magnetic component incorporated inside the intermediate product at a position separated from the mounting surface of the contact surface by a predetermined height.

Such an assembly jig can be applied to the manufacturing method of the present invention. That is, the product in which the magnetic component is incorporated in the case body in the above [first step] is used as an intermediate product, and in the above [second step], such an intermediate product is placed on the mounting surface and then the case. By bringing the side surface of the body into contact with the contact surface, a magnetic force can be applied from the outside to levitate the magnetic component to a position near the opening of the case body, and its visibility can be improved. Then, in this state, by temporarily assembling the electronic component in the above [third step], the risk of the electronic component being damaged can be greatly reduced.

According to the present invention, workability can be improved.

It is a perspective view which shows the completed state after assembling the current sensor 100. It is an exploded perspective view which shows the structure of the current sensor 100. It is sectional drawing which follows the line III-III in FIG. It is a figure which showed the example of the general assembly procedure of the current sensor 100. It is sectional drawing which follows the VV line of FIG. 4 (B). It is a perspective view which shows the structure of the assembly jig 200. 6 is a cross-sectional view taken along the line VII-VII in FIG. 6 (A). It is a continuation which shows the working procedure example of the manufacturing method of the current sensor 100 using the assembly jig 200. It is a continuation which shows the working procedure example of the manufacturing method of the current sensor 100 using the assembly jig 200. 9 is a cross-sectional view taken along the line XX in FIG. 9 (B). It is a continuation which shows the working procedure example of the manufacturing method of the current sensor 100 using the assembly jig 200.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiment, the current sensor is mentioned as an example of the electronic device to be assembled and manufactured, but the manufacturing target of the present invention is not limited to this.

[Example of manufacturing target]
FIG. 1 is a perspective view showing a completed state after assembly of the current sensor 100 as an example of an electronic device that can be a target of a manufacturing method. Further, FIG. 2 is an exploded perspective view showing the configuration of the current sensor 100. When the current sensor 100 shown in FIG. 1 (A) is shown from a different direction (180 ° opposite side), it is a perspective view of FIG. 1 (B).

The current sensor 100 mainly includes a case body 102, a magnetic body core 106, and a circuit board 110, and has a magnetic body core 106 and a circuit board 110 housed in the case body 102, as shown in FIG. It becomes a usage pattern. FIG. 1 shows the current sensor 100 in a posture assuming this usage mode. In this usage mode, a conductor (bus bar, etc.) (not shown) that conducts the detected current is inserted in the horizontal direction (horizontal direction). Is assumed. The current sensor 100 may be in a form used in other postures (for example, a flat posture, a small end standing posture, an inverted posture, etc.). Further, after assembling as shown in FIG. 1A, the inside of the case body 102 is filled with, for example, a sealing resin.

[Case body]
The case body 102 has a rectangular container shape in which one end surface is open and the other end surface is closed by an exterior wall 102d, and the inside thereof is formed as a storage space 102a for various parts. Further, the case body 102 has a rectangular through hole 104 formed in the center thereof, and the case body 102 has an inner peripheral wall 102b that partitions the periphery of the through hole 104. Therefore, the accommodation space 102a inside the case body 102 has a rectangular ring shape as a whole except for the through hole 104. The through hole 104 penetrates the center of the current sensor 100 in the thickness direction in the assembled state, and the conductor (not shown) described above penetrates the inside of the through hole 104 in the lateral direction (horizontal direction) in the standing posture of the current sensor 100 shown in FIG. It will be inserted in the direction). For example, resin is used as the material of the case body 102.

Further, as shown in FIG. 2, various ribs (without reference numerals) are formed inside the case body 102, and along the inner peripheral surface at a position to some extent inside from the opening of one end surface. The stepped portion 102c is formed. Some ribs guide the incorporation of the magnetic core 106 (insertion into the case 102) together with the inner peripheral wall 102b during assembly work, and position the magnetic core 106 in the case 102 in the completed state. be able to. Further, some ribs and stepped portions 102c guide the peripheral edge portion of the circuit board 110 during the assembly work, and the circuit board 110 can be positioned in the case body 102 in the completed state.

[Magnetic parts]
When the manufacturing target is the current sensor 100, the magnetic component housed in the case 102 is the magnetic core 106 described above. The magnetic core 106 has a rectangular annular shape, and the accommodation space 102a inside the case 102 is formed to match the shape of the magnetic core 106. Although the magnetic core 106 has a rectangular annular shape, it may have an annular shape or another ring shape. The magnetic core 106 can converge the magnetic field generated by the conduction of the primary current (detected current) in a state where a primary conductor (not shown) is inserted inside the magnetic core 106. Further, the magnetic core 106 has a gap 106a formed at one position in the circumferential direction thereof. A soft magnetic material (for example, ferrite, silicon steel plate, etc.) is used for the magnetic core 106, and a toroidal core, a laminated core, or the like can be structurally adopted.

[Electronic components]
The current sensor 100 includes a Hall element 108 as an example of an electronic component. The Hall element 108 is arranged in the gap 106a of the magnetic core 106 in a state of being mounted on the mounting board 112 on the circuit board 110. Therefore, the circuit board 110 is provided with a large number of clip terminals 112a that support the mounting board 112, and the mounting board 112 is held by rows of these clip terminals 112a. The mounting board 112 is held in a direction perpendicular to the board surface of the circuit board 110 that is the base, and the Hall element 108 is mounted on the board surface.

In addition, the circuit board 110 has a connection terminal row 114 mounted on the board surface opposite to the mounting board 112, and is completed after assembling the current sensor 100 as shown in FIG. 1 (A). In this state, the individual terminals of the connection terminal row 114 project outward (downward) of the case body 102.

Further, in the present embodiment, for example, a ground terminal 106b is bonded to the surface (outer peripheral surface) of the magnetic core 106, and the ground terminal 106b connects the magnetic core 106 to the ground (GND) of the circuit board 110. Is. By connecting the current sensor 100 to the circuit board 110 in the ground, the electrical characteristics (so-called dV / dt noise characteristics) of the current sensor 100 can be improved.

[Position relationship]
FIG. 3 is a cross-sectional view of the current sensor 100 as seen in the completed state after assembly (cross-sectional view taken along the line III-III in FIG. 2). It should be noted that the illustration of the filler is omitted here (the same applies thereafter).

As described above, the magnetic core 106 is positioned deepest in the accommodation space 102a inside the case 102, with one end surface (lower end surface in FIG. 3) in contact with the inner surface of the exterior wall 102d. ing. In addition, a clearance may be secured by ribs or the like between the inner surface of the exterior wall 102d and the magnetic core 106.

The circuit board 110 is positioned by the stepped portion 102c at a position near one end opening of the case body 102 with respect to the magnetic core 106 located at the innermost part of the case body 102. At this time, the Hall element 108 as an electronic component is positioned in the gap 106a of the magnetic core 106 while being supported by the circuit board 110, and maintains a predetermined positional relationship with each other. Such a positional relationship is defined for the current sensor 100 to normally measure the primary current.

[Example of assembly procedure]
Next, FIG. 4 is a diagram showing an example of a general assembly procedure of the current sensor 100. Here, first, an example of a generally considered assembly procedure will be described.
In FIG. 4 (A): The magnetic core 106 is placed in the accommodation space 102a of the case body 102 by placing the opening of one end surface of the case body 102 facing upward on a workbench or the like (not shown) and aligning the direction of the gap 106a from above. Drop in. At this time, the front and back surfaces of the magnetic core 106 are aligned so that the ground terminal 106b protrudes upward. Since the magnetic core 106 has a considerable weight, if the position is aligned to some extent near the opening of the case 102, the magnetic core 106 falls into the case 102 by its own weight.

In FIG. 4 (B): The circuit board 110 is incorporated (inserted) into the case body 102 into which the magnetic material core 106 is dropped. At this time, the insertion position of the circuit board 110 is set to a position where the mounting board 112 (Hall element 108) correctly enters the gap 106a.

In FIG. 4 (C): When the circuit board 110 is correctly inserted, the peripheral edge portion is received by the stepped portion 102c in the case body 102 and is also positioned with respect to the case body 102. This completes the assembly work of the current sensor 100. After this, the inside of the case body 102 is filled with the sealing resin.

[Risk of damage]
FIG. 5 is a cross-sectional view (cross-sectional view taken along the line VV in FIG. 4B) showing the current sensor 100 in the middle of assembly work. Of these, (A) in FIG. 5 shows an overall cross section, and (B) in FIG. 5 is an enlarged view of the range surrounded by the alternate long and short dash line in FIG. 5 (A).

In the middle of the general assembly work ((B) in FIG. 4), the visibility of the magnetic core 106, particularly the gap 106a, is not very good when the circuit board 110 is inserted. On the other hand, the interval of the gap 106a is specified (several mm), and the thickness of the Hall element 108 that enters there is only slightly smaller than the specified with respect to the gap 106a even if the whole including the mounting substrate 112 is the minimum. It is several mm-α), and there is not much room for clearance. Therefore, even if the circuit board 110 is slightly tilted at the time of insertion, there is a risk that electronic components such as the Hall element 108 come into contact with the edge of the gap 106a and are undesirably damaged.

[Assembly jig]
Therefore, in the present embodiment, the following assembly jig 200 is used in order to reduce the risk of damage during the assembly work as described above.

FIG. 6 is a perspective view showing the configuration of the assembly jig 200. When the assembly jig 200 shown in FIG. 6 (A) is shown from a different direction (180 ° opposite side), it is a perspective view of FIG. 6 (B). Further, FIG. 7 is a vertical cross-sectional view showing the internal structure of the assembly jig 200 (cross-sectional view taken along line VII-VII in FIG. 6A).

The assembly jig 200 is roughly divided into a base plate portion 202, a wall plate portion 204, and a magnet 206. Of these, the base plate portion 202 and the wall plate portion 204 are both made of a rectangular plate having a certain wall thickness. As the material of the base plate portion 202 and the wall plate portion 204, for example, a non-magnetic metal is preferably used, but resin or wood may be used. Further, the base plate portion 202 and the wall plate portion 204 may be appropriately lightened.

[Base plate, mounting surface]
As shown in FIGS. 6 and 7, the base plate portion 202 is arranged in a flat position, and its upper surface is formed as a smooth mounting surface 202a. The base plate portion 202 is formed in a size capable of stably mounting the case body 102 with the opening facing upward on the mounting surface 202a.

[Wall plate, contact surface]
The wall plate portion 204 is attached to one side end of the base plate portion 202 by using fasteners such as bolts, and one side surface having an opening of about 90 ° with the mounting surface 202a is formed as the contact surface 204a. Has been done. The wall plate portion 204 is formed in such a size that the contact surface 204a can be brought into contact with the side surface of the case body 102 in a state where the case body 102 is placed on the mounting surface 202a. In this embodiment, the cushioning plate 208 can be attached to the wall plate portion 204. Therefore, when the cushioning plate 208 is attached to the wall plate portion 204, the cushioning plate 208 can actually abut on the side surface of the case body 102. Therefore, in the present embodiment, the exposed side surface of the cushioning plate 208 becomes an actual contact surface, and the wall plate portion may be formed including the cushioning plate 208.

〔magnet〕
The magnet 206 is arranged so as to be embedded inside the wall plate portion 204 (thick portion). Further, the arrangement of the magnet 206 is set to a constant height from the mounting surface 202a. The arrangement of the magnet 206 and the action of the magnetic force will be further described later.

[Guide member]
Further, a pair of guide members 210 are attached to both sides of the range of the mounting surface 202a on the base plate portion 202. Each of the pair of guide members 210 has a narrow flat plate shape (strip shape), and is arranged separately on both side edges of the base plate portion 202 with the mounting surface 202a as the center. These guide members 210 guide the lower ends of both side surfaces in the longitudinal direction in a state where the case body 102 is placed on the mounting surface 202a. Further, one of the pair of guide members 210 is formed with a cut-off portion (unsigned) diagonally toward the outside of the base plate portion 202 when viewed from above. As a result, the distance between the pair of guide members 210 widens in a taper shape toward the outside of the base plate portion 202, facilitating the acceptance of the case body 102 from the outside.

〔others〕
Although not shown in detail, for example, as shown in FIG. 6B, bolts are used to attach the wall plate portion 204, and the wall plate portion 204 is provided with an elongated hole in the vertical direction. .. Therefore, the position of the wall plate portion 204 in the height direction can be adjusted with bolts, and the height of the magnet 206 from the mounting surface 202a can be appropriately adjusted. In addition to this, by providing each guide member 210 with an elongated hole in the width direction, the distance between the pair of guide members 210 can be adjusted according to the size of the case body 102.

〔Production method〕
In this embodiment, a manufacturing method (assembly work procedure) using the above-mentioned assembly jig 200 is presented. Hereinafter, the manufacturing method of this embodiment will be described.

8 to 11 are views showing an example of a working procedure of a method of manufacturing a current sensor 100 using an assembly jig 200. Of these, FIGS. 8, 9 and 11 are continuous views, and FIG. 10 is a cross-sectional view of an intermediate product during work (cross-sectional view taken along line XX in FIG. 9 (B)). Further, FIG. 11 (B) is an enlarged view of the range surrounded by the alternate long and short dash line in FIG. 11 (A).

[First step]
In FIG. 8 (A): With the opening of the case body 102 facing upward, the magnetic core 106 is incorporated into the accommodation space 102a inside the case body 102 through the opening. This work is the same as that described above as a general procedure ((A) in FIG. 4). Further, in this work, it is not necessary to use the assembly jig 200 in particular.

In FIG. 8 (B): As described above, a product in which the magnetic core 106 is incorporated in the case 102 is used as an intermediate product of the current sensor 100. Then, the assembly jig 200 is preferably used from here. That is, an assembly jig 200 is prepared, and the above intermediate product is placed on the mounting surface 202a. At this time, the case body 102 can be placed so as to slide between the pair of guide members 210.

In FIG. 9 (A): The intermediate product placed on the mounting surface 202a is slid toward the wall plate portion 204. Specifically, the intermediate product is slid so that the side surface of the case body 102 is pressed against the magnet 206 and the contact surface 204a (here, the side surface of the cushioning plate 208).

[Second step]
In FIG. 9 (B): When the case body 102 is pressed against the magnet 206 via the cushioning plate 208, the magnetic body core 106 rises from the bottom of the case body 102 to the opening surface (top surface). That is, the magnetic core 106 is lifted by using the magnetic attraction of the magnet 206 acted from the outside of the case 102, and the magnetic core 106 is held in a horizontal posture near the opening of the case 102 by the magnetic force of the magnet 206. do. As a result, the visibility of the magnetic core 106 including the position of the gap 106a is improved, and workability can be greatly improved. At this time, the cushioning plate 208 can be adjusted while appropriately relaxing the magnitude of the magnetic force, and the posture of the magnetic core 106 can be stabilized.

[Arrangement of magnets, etc.]
FIG. 10: The height at which the magnet 206 is arranged (height from the mounting surface 202a) is preset according to the manufacturing target. Specifically, from the specifications (dimensions, mass, etc.) of the case body 102 and the magnetic material core 106 used in this manufacturing target, the magnetic material core when abutted against the contact surface 204a (side surface of the cushioning plate 208). Assuming that the 106 is held on the opening surface (top surface) of the case body 102, the magnetic force and the height position of the magnet 206 can be set in advance. Therefore, if the specifications to be manufactured differ, the detailed specifications of the assembly jig 200 also differ accordingly.

[Third step]
In FIG. 11 (A): The circuit board 110 including the Hall element 108 and the mounting board 112 is temporarily assembled to the magnetic core 106 held at the opening surface (top surface) position of the case body 102. Specifically, the Hall element 108 and the mounting board 112 are correctly inserted into the gap 106a.
In FIG. 11 (B): At this time, the operator can perform appropriate work by utilizing the visibility of the gap 106a, so that the risk of damage to the Hall element 108 and the like can be suppressed to an extremely low level. At this stage, the ground terminal 106b may be soldered to the circuit board 110.

[Fourth step]
Although not particularly shown, if the circuit board 110 is temporarily assembled as described above and then the intermediate product is separated from the magnet 206 to release the magnetic force, the magnetic core 106 and the circuit board 110 can be accommodated in the case 102. It can be installed at each accommodation position within 102a (Fig. 3).

According to the manufacturing method of the above-described embodiment, the following advantages can be obtained.
(1) In the process of assembling work, the circuit board 110 can be inserted in a state where the visibility of the magnetic core 106 including the gap 106a is improved.
(2) By improving the visibility, the risk of damage to electronic parts such as the Hall element 108 during work can be significantly reduced.
(3) As a result, the yield of the product is increased and the quality can be maintained at a high level.
(4) Further, by using the assembly jig 200, the manufacturing method of the present embodiment can be easily and surely used.
(5) The assembly jig 200 is manufactured because it has a simple structure specialized for the work of placing an intermediate product on the mounting surface 202a and pressing the case body 102 against the magnet 206 of the contact surface 204a. It is easy to prepare a sufficient number of magnets according to the convenience of the work site.
(6) Since the height of the magnet 206 and the like can be adjusted according to the specifications of the assembly target, the assembly jig 200 can quickly respond to changes in the product specifications.

The present invention can be variously modified and implemented without being limited to the above-described embodiment.
The manufacturing method can be applied to case bodies and magnetic body parts having various shapes, and is not limited to the shapes of the case body 102 and the magnetic body core 106 mentioned in the embodiment.

Further, when the magnetic core 106 is held near the opening surface (top surface) of the case body 102, it is preferable to press the side opposite to the gap 106a against the magnet 206 as in the embodiment, but the gap 106a position is 90. ° The sides of adjacent magnetic cores 106 may be pressed against the magnet 206. Alternatively, the side surface of the magnetic core 106 in which the gap 106a is located may be pressed against the magnet 206 as long as the visibility during work can be improved.

The electronic component such as the Hall element 108 may be mounted on the circuit board 110 in addition to the form mounted on the mounting board 112. Alternatively, the mounting board 112 may be the only component inserted into the gap 106a of the magnetic core 106 without the circuit board 110 and the mounting board 112 being provided as a single unit.

In the assembly jig 200, the base plate portion 202 and the wall plate portion 204 may be formed as an integral part. Further, the magnet 206 may not be an embedded type but may be in a form protruding from the wall plate portion 204. In this case, the outer surface of the protruding magnet 206 itself becomes the contact surface, and the side surface of the case body 102 may come into contact with such a contact surface.

The magnet 206 may be provided at a plurality of locations. Alternatively, the magnet 206 may have a size that extends over almost the entire contact surface 204a. Even in this case, the magnetic core 106 can be held at the position where the magnetic force is the strongest.

When the magnetic component is magnetic, a magnetic force having a polarity opposite to that of the magnetic component may be applied from the lower surface side of the case body 102 and levitated by the repulsive force of the magnetic component.

In the embodiment, the case body 102 is slid on the mounting surface 202a, but the position of the case body 102 is fixed, and the magnet 206 and the wall plate portion 204 are brought closer to the side surface of the case body 102. May be good.

In addition, the structure shown in the illustration in the embodiment is merely a preferable example, and it is needless to say that the present invention can be suitably carried out even if various elements are added to the basic structure or a part thereof is replaced. Nor.

100 Current sensor 102 Case body 102a Accommodation space 106 Magnetic material core 106a Gap 108 Hall element 110 Circuit board 200 Assembly jig 202 Base plate part 202a Mounting surface 204 Wall plate part 204a Contact surface 206 Magnet 208 Cushion plate

Claims (7)

The first step of incorporating the magnetic component into a container-shaped case body having an opening at one end and a closed end surface capable of accommodating the magnetic component through the opening.
The second step of holding the magnetic component incorporated in the first step in the vicinity of the opening by using the magnetic force applied from the outside of the case body.
A method for manufacturing an electronic device, comprising a third step of temporarily assembling electronic components to be combined in a predetermined positional relationship in a completed state with respect to the magnetic component held in the second step. In the method for manufacturing an electronic device according to claim 1,
A method for manufacturing an electronic device further comprising a fourth step of installing the magnetic component and the electronic component temporarily assembled in the third step at each accommodation position inside the case body. In the method for manufacturing an electronic device according to claim 1 or 2.
In the second step,
A method for manufacturing an electronic device, which comprises attracting a magnetic component with a magnet arranged close to the outer surface of the case body to levitate the magnetic component from the inside of the case body to a position near the opening. A mounting surface on which intermediate products to be assembled can be mounted,
A contact surface that can come into contact with the side surface of the intermediate product placed on the above-mentioned mounting surface, and
An assembly jig provided with a magnet capable of applying a magnetic force to a magnetic component incorporated inside the intermediate product at a position separated from the previously described mounting surface of the contact surface by a predetermined height. .. In the assembly jig according to claim 4,
The base plate portion that forms the above-mentioned mounting surface on the upper surface,
It is further provided with a wall plate portion attached to one side end of the base plate portion and forming the contact surface on one side surface.
The magnet is
An assembly jig characterized in that it is embedded inside the wall plate portion. In the assembly jig according to claim 4 or 5.
An assembly jig further provided with a guide member provided on the above-mentioned mounting surface and guiding the proximity movement of the mounted intermediate product to the contact surface. In the assembly jig according to any one of claims 4 to 6.
An assembly jig characterized in that the height position of the magnet from the previously described mounting surface can be adjusted according to the intermediate product.

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