JP2022050029A - Functional device, and manufacturing method of functional device - Google Patents

Abstract

To provide a functional device capable of using materials effectively while ensuring high quality.SOLUTION: A functional device 100 includes: a bank 130 that has a liquid repellent portion 132, and a low liquid-repellent portion 134, the liquid-repellent property of which is smaller than that of the liquid-repellent portion 132, on a surface 131; a first functional layer 140 that is positioned in an area defined by the bank 130 and in contact with the liquid-repellent portion 132; and a second functional layer 150 that is in contact with the low liquid-repellent portion 134 and covers the first functional layer 140.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a functional device and a method for manufacturing the functional device.

In recent years, studies have been actively conducted to form various electronic devices by the printing method. Since the printing method is a method of applying the required amount of ink only to the necessary positions, the material utilization efficiency is higher than that of the vacuum deposition and sputtering methods.

Among the printing methods, an inkjet method that is non-contact with a printing object and can form a desired pattern on demand is attracting attention.

Examples of the electronic device formed by the printing method include wiring using conductive ink, a transistor using semiconductor ink, and a display device using a light emitting material.

Patent Document 1 discloses an organic EL device which is an example of an electronic device. The bank of the organic EL device of Patent Document 1 has relatively large liquid repellency in order to hold the ink which is the material of the hole transport layer and the organic light emitting layer within the region defined by the bank. ..

Japanese Patent No. 4990415

When manufacturing an organic EL device having a bank having a large liquid repellency, when a transparent cathode located above the light emitting layer and a functional layer such as a transparent sealing film are formed by a coating process such as an inkjet method, This causes a decrease in the uniformity of the film thickness of the functional layer.

Similarly, in the case of manufacturing an organic transistor device having a bank having a large liquid repellency, if a functional layer such as a source electrode, a drain electrode, and a protective film is formed by a coating process such as an inkjet method, the functional layer is formed. It causes a decrease in the uniformity of the film thickness.

If a film with high uniformity is not formed, the quality of organic EL devices and functional devices such as organic transistor devices deteriorates.

It is an object of the present disclosure to provide a functional device and a method for manufacturing the functional device, which can effectively use the material and ensure high quality.

The functional device according to one aspect of the present disclosure is located in a bank having a liquid-repellent portion on the surface portion and a low liquid-repellent portion having a liquid-repellent property smaller than that of the liquid-repellent portion, and a region defined by the bank. A first functional layer in contact with the liquid-repellent portion and a second functional layer in contact with the low liquid-repellent portion and covering the first functional layer are provided.

The method for manufacturing a functional device according to one aspect of the present disclosure includes a step of forming a bank on a substrate and a first method of being located in a region defined by the bank and in contact with a liquid-repellent portion on the surface of the bank. A step of forming a functional layer, a step of forming a low liquid repellent portion having a relatively smaller liquid repellent property than the liquid repellent portion on a part of the surface portion, and a step of contacting the low liquid repellent portion and being in contact with the low liquid repellent portion. It comprises a step of forming a second functional layer overlying the first functional layer.

According to the present disclosure, it is possible to provide a functional device and a method for manufacturing the functional device, which can effectively use the material and ensure high quality.

Cross-sectional view showing the structure of the organic EL device disclosed in Patent Document 1. Sectional drawing which shows the structure of the functional device which concerns on embodiment of this disclosure. A cross-sectional view showing an intermediate product according to an embodiment in which an electrode layer and a bank are formed on a substrate. The figure which shows the state which the CF ₄ plasma is irradiated to the intermediate product which concerns on embodiment. A cross-sectional view showing an intermediate product according to an embodiment in which ink is accumulated in a light emitting region. A cross-sectional view showing an intermediate product according to an embodiment in which a light emitting layer is formed. The figure which shows the state that the intermediate product which concerns on embodiment is irradiated with O ₂ plasma through a shielding mask. A cross-sectional view showing an intermediate product according to an embodiment in which an electrode layer is formed. Sectional drawing which shows the structure of the functional device which concerns on modification 1 of this disclosure. A cross-sectional view showing the structure of a functional device having another structure according to the first modification of the present disclosure. Sectional drawing which shows the structure of the functional device which concerns on modification 2 of this disclosure. Sectional drawing which shows the structure of the functional device which concerns on modification 3 of this disclosure. A cross-sectional view showing an intermediate product according to Example 1 in which an electrode layer and a bank are formed on a substrate. Sectional drawing which shows the intermediate product which concerns on Example 1 in the state which red light emitting layer is formed. The figure which shows the state that the intermediate product which concerns on Example 1 is irradiated with O ₂ plasma through a shielding mask. Sectional drawing which shows the structure of the functional device which concerns on Example 1. A cross-sectional view showing an intermediate product according to Example 2 in which an electrode layer and a bank are formed on a substrate. The figure which shows the state which the CF ₄ plasma is irradiated to the intermediate product which concerns on Example 2. Sectional drawing which shows the intermediate product which concerns on Example 2 in the state which red light emitting layer is formed. Sectional drawing showing an intermediate product in a state housed in a vacuum dryer Sectional drawing which shows the structure of the functional device which concerns on Example 2.

In the present specification, the term "functional device" is a general term for devices that output a target function by utilizing a physical phenomenon. For example, functional devices include organic EL devices, quantum dot light emitting devices, color conversion filter devices, organic transistor devices, sensor devices and the like.

(Technical background)
Since functional devices, particularly functional materials such as light emitting materials and conductive materials used for manufacturing light emitting devices, are very expensive, it is desirable to minimize material loss.

Since the printing method is a method in which the required amount of ink can be applied only to the necessary positions, the material utilization efficiency is higher than that of the vacuum deposition and sputtering methods. Further, the printing method can form a film in the atmosphere instead of in a vacuum. Therefore, the printing method does not require energy for operating the vacuum equipment, and is desirable from the viewpoint of reducing the operating energy. In addition, in this specification, an ink means a material of a predetermined layer and a liquid material.

Printing methods include screen printing, letterpress printing, intaglio printing, and an inkjet method. In particular, the inkjet method is attracting attention, and a method for forming a display device such as a color filter, an organic EL display, and a quantum dot display by the inkjet method is being actively developed.

As a next-generation display, there is a display using a quantum dot material, which is an inorganic material, as a light emitting layer. The development of this display is being actively carried out.

Quantum dots are very small, specifically, special semiconductors with a diameter of 2 to 10 nm (in other words, about 10 to 50 atoms). As described above, a substance having a small size is different from the property exhibited when the size is relatively large.

For quantum dots, the size of the bandgap can be controlled simply by changing the particle size of the quantum. Since the emission wavelength of the quantum dot depends on the size of the band gap, the emission wavelength of the quantum dot can be adjusted very precisely. That is, the emission wavelength of the quantum dot can be changed only by changing the particle size of the quantum. More specifically, the smaller the particle size of the quantum, the more the emission wavelength of the quantum dot shifts to the blue side, and the larger the particle size of the quantum, the more the emission wavelength shifts to the red side.

The half width of the emission wavelength is very small and is several tens of nm or less. Since the half width of each emission wavelength of red, blue, and green is small, the emission wavelength exhibits high color gamut characteristics. As a result, the performance as a display device is dramatically improved.

Quantum dots are composed of a core, a layer called a shell formed around the core, and a ligand formed around the shell. Typical core materials are inorganic materials such as cadmium-selenium-based, indium-phosphorus-based, copper-indium-sulfur-based, and silver-indium-sulfur-based, and inorganic materials having a perovskite structure. A typical shell material is zinc sulfide or the like.

Quantum dots realize stability as an ink by forming a ligand around the shell. Light emitting devices formed of such a quantum dot material include a photoluminescence device in which electrons of the quantum dot material are excited by light energy to emit light, and an electroluminescence device in which electrons of the quantum dot material are excited by electric energy to emit light.

The photoluminescence device is used as a color filter for a micro LED display, which is an example of a quantum dot display.

The electroluminescence device is an example of a quantum dot display, and is used in a quantum dot light emitting display formed by thinning a quantum dot material between an anode and a cathode.

Quantum dot displays in which a photoluminescence device or an electroluminescence device is used have much higher brightness than an organic EL display and are excellent in outdoor visibility. Therefore, it is expected to be used for mobile phones, displays for in-vehicle applications, head-mounted displays, and the like. It is expected that these displays will require a pixel resolution of 200 dpi (pixels per inch) or higher.

The light emitting material that forms a light emitting device such as a photoluminescence device and an electroluminescence device deteriorates its light emitting performance due to the influence of moisture in the atmosphere. Therefore, when manufacturing these devices, it is necessary to form a sealing film after forming a light emitting layer. The sealing film is often formed of a silicon nitride film and a laminated film such as an acrylic resin film or an epoxy resin film. The silicon nitride film is formed by a vacuum process called CVD (Chemical Vapor Deposition). The laminated film is formed by an inkjet method.

For the reasons (1) to (3) below, a method for forming all layers and films of functional devices by a coating process such as an inkjet method without using a vacuum process is being actively developed.

(1) Material loss When a functional device is manufactured by using a vacuum process such as thin film deposition, sputtering method, and CVD, many materials are lost. Since the material of the membrane constituting the functional device is very expensive, it is desirable to minimize the loss of material.

(2) Cost Since the vacuum equipment has a high operating cost, the cost required for manufacturing the functional device becomes high when the vacuum process is used.

(3) Manufacturing at low temperature A method for forming a functional device on a flexible substrate such as a plastic film is being actively developed. Since the heat resistance of a flexible substrate is low, when a flexible substrate is used as the substrate, it is necessary to manufacture a functional device at a low temperature.

For the purpose of increasing the efficiency of material use, reducing manufacturing costs by manufacturing functional devices under atmospheric pressure, and manufacturing functional devices at temperatures that plastic films can withstand. Studies have been made to form all layers in the coating process.

<Problems with the coating process>
FIG. 1 is a cross-sectional view showing the structure of an organic EL device 1 (an example of a functional device) disclosed in Patent Document 1.

The organic EL device 1 includes a TFT panel 10, an anode 12, a hole injection layer 13, a hole transport layer 14, an organic light emitting layer 15, a bank 16, an electron injection layer 18, a transparent cathode 20, and a transparent sealing film 22. I have.

In the manufacture of the organic EL device 1, the functional layer such as the organic light emitting layer 15 is formed by an inkjet method. Specifically, the organic EL device 1 is manufactured by the following procedure.
(1) An anode (electrode) 12 and a hole injection layer 13 are formed on the TFT panel 10.
(2) A bank 16 defining a pixel region is formed on the hole injection layer 13.
(3) The hole transport layer 14 and the organic light emitting layer 15 are formed in the region defined by the bank 16 by an inkjet method.
(4) The electron injection layer 18 and the transparent cathode 20 are formed on the organic light emitting layer 15 by a vacuum process.
(5) A transparent sealing film 22 is formed so as to cover the electron injection layer 18 and the transparent cathode 20.

The bank 16 needs to have a liquid repellency of a certain value or more in order to hold the ink which is the material of the hole transport layer 14 and the organic light emitting layer 15 in a predetermined region. Therefore, the bank 16 has a relatively large liquid repellency.

When the transparent cathode 20 and the transparent sealing film 22 are formed by the inkjet method when the organic EL device 1 having the structure shown in FIG. 1 is manufactured, the transparent cathode 20 and the transparent sealing film 22 are formed. Membrane performance is significantly reduced.

Specifically, since the bank 16 has a relatively large liquid repellency, the coating film formed of the ink is repelled by the bank 16, and the film of the transparent cathode 20 and the transparent sealing film 22 is formed. This causes a decrease in thickness uniformity and a decrease in the coating property of the transparent sealing film 22.

In particular, when the uniformity of the film thickness of the transparent cathode 20 is lowered, the resistance value of the organic EL device 1 varies, which causes deterioration of electrical characteristics. As a result, the light emitting characteristics of the organic EL device 1 may be deteriorated. Further, when the coating property of the transparent sealing film 22 is deteriorated, moisture in the atmosphere or the like infiltrates into the organic EL device 1 from the thin portion of the transparent sealing film 22 and adversely affects the organic light emitting layer 15. As a result, the light emitting characteristics of the organic EL device 1 deteriorate with time.

Other functional devices will be described. When the organic transistor device has a bank having a relatively large liquid repellency, it is applied on the bank when the functional layer such as the source electrode, the drain electrode, and the protective film is formed by the inkjet method. The ink of the functional layer is repelled. Therefore, the uniformity of the functional layer is lowered. As a result, the quality of the organic transistor device deteriorates.

As described above, when the functional device is formed by the inkjet method, the bank has a relatively large liquid repellency, which may lead to deterioration of the quality of the functional device.

The functional devices of the present disclosure can manufacture many functional layers of the functional devices by a coating process while ensuring quality.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The components common to each figure are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

(Embodiment)
FIG. 2 is a cross-sectional view showing the structure of the functional device 100 according to the embodiment of the present disclosure. The cross-sectional view in the present specification is a cross-sectional view of the functional device 100 in a vertical plane. In the present embodiment, the functional device 100 will be described as being an organic EL device that emits electroluminescence.

The functional device 100 includes a substrate 110, an electrode layer 120, a bank 130, a first functional layer 140, and a second functional layer 150. As will be described in detail later, in the present embodiment, the first functional layer 140 is composed of the light emitting layer 141. The functional device 100 has a top emission structure that emits the light emitted by the light emitting layer 141 from the upper side of the functional device 100 toward the outside.

<Board 110>
Various layers are laminated on one surface of the substrate 110. The material of the substrate 110 may be any material having insulating properties, and may be either a transparent material or an opaque material. The substrate 110 may be a flexible resin sheet such as glass or polyimide.

<Electrode layer 120>
In the present embodiment, the electrode layer 120 is composed of a reflective electrode. The electrode layer 120 is formed on the substrate 110. The material of the electrode layer 120 is a metal material having high optical reflectivity such as silver-palladium-copper alloy or aluminum. Therefore, the functional device 100 can efficiently emit the light emitted by the light emitting layer 141 to the outside of the functional device 100.

<Bank 130>
The bank 130 is formed so as to cover a part of the electrode 102. Bank 130 defines a region in which the first functional layer 140 is formed.

The bank 130 is generally formed so as to have a relatively large liquid repellency. Further, the ink applied by the coating process such as the inkjet method often has a low viscosity. The low viscosity of the ink means that the concentration of the solid content contained in the ink is low. That is, in order to make the layer formed after drying the ink solvent to a certain thickness or more, it is necessary to apply an appropriate amount of ink.

For example, when the ink 41 (see FIG. 5) of the light emitting layer 141 is applied in the coating process, the area defined by the bank 130 (hereinafter, the light emitting area) is used in order to use the applied ink for forming the light emitting layer 141. It is necessary to store the ink 41 in the ink 41. If the liquid repellency of the bank 130 is relatively small, the applied ink 41 overflows from the light emitting region. If the liquid repellency of the bank 130 is relatively large, a required amount of ink 41 can be stored in the light emitting region. Therefore, from the viewpoint of forming the light emitting layer 141 so as to have a sufficient thickness, it is desirable that the bank 130 has a large liquid repellency, that is, a small wettability. Here, low wettability means high liquid repellency, and high wettability means low liquid repellency.

However, when the liquid repellency of the bank 130 is relatively large and the second functional layer 150 covering the bank 130 is formed by a coating process such as an inkjet method or screen printing, the second functional layer 150 to be coated is applied. Ink is repelled by the bank 130. As a result, the uniformity of the second functional layer 150 is lowered. Therefore, from the viewpoint of forming the second functional layer 150, which is the upper layer of the light emitting layer 141, so as to have high uniformity, the liquid repellency of the bank 130 is smaller, that is, the wettability is larger. Is desirable.

Therefore, the bank 130 of the functional device 100 according to the embodiment of the present disclosure has a portion having a large liquid repellency and a portion having a small liquid repellency. Hereinafter, the bank 130 will be described in detail.

The bank 130 has a surface portion 131 and an internal 136. The surface portion 131 covers the inside 136 and a part of the electrode layer 120.

The surface portion 131 has a liquid repellent portion 132 and a low liquid repellent portion 134. The liquid-repellent portion 132 is a portion of the surface portion 131 in contact with the first functional layer 140. The liquid-repellent portion 132 is a portion of the surface portion 131 excluding the liquid-repellent portion 132, and is a portion in contact with the second functional layer 150.

The material of the liquid-repellent portion 132 is a photosensitive resin material. Further, the liquid-repellent portion 132 contains a fluorine compound which is a liquid-repellent component. The material of the low liquid repellent portion 134 is a photosensitive resin material like the liquid repellent portion 132. The low liquid repellent portion 134 may or may not contain a fluorine compound. The photosensitive resin material is specifically a resin material such as an acrylic resin, an epoxy resin, or a polyimide.

The concentration of fluorine atoms in the liquid repellent portion 132 is higher than the concentration of fluorine atoms in the low liquid repellent portion 134. Specifically, the concentration of the fluorine atom in the liquid repellent portion 132 is 5 atom% or more and 10 atom% or less, and the concentration of the fluorine atom in the low liquid repellent portion 134 is 0 atom% or more and less than 5 atom%. The fluorine atom concentration can be measured by an X-ray photoelectron spectroscopy analyzer (also referred to as XPS or ESCA).

As described above, since the low liquid repellent portion 134 has a lower concentration of the liquid repellent component than the liquid repellent portion 132, the low liquid repellent portion 134 has a smaller liquid repellent property than the liquid repellent portion 132.

The contact angle of the liquid-repellent portion 132 with respect to the ink of the first functional layer 140 is 20 degrees or more and 70 degrees or less, preferably 30 degrees or more and 60 degrees or less. The contact angle of the low liquid repellent portion 134 with respect to the ink of the second functional layer 150 is 0 degrees or more and 30 degrees or less, preferably 0 degrees or more and 20 degrees or less. Here, the contact angle is a value indicating the wettability with respect to the liquid, and the larger the contact angle, the smaller the wettability, and the smaller the contact angle, the larger the wettability. The contact angle of the liquid-repellent portion 132 and the contact angle of the low liquid-repellent portion 134 described above are not contact angles for the same ink, but values for inks containing different substances. Therefore, it cannot be acknowledged that the functional device 100 according to the embodiment has a low liquid repellent portion 134 having a higher liquid repellent property than the liquid repellent portion 132.

The roughness of the surface 135, which is the surface of the low liquid repellent portion 134 in contact with the first functional layer 140, is larger than the roughness of the surface 133 of the liquid repellent portion 132. The smaller the roughness, the smaller the coefficient of friction of the surface, and the larger the roughness, the larger the coefficient of friction of the surface.

The material of the inner 136 is a photosensitive resin material, specifically, a resin material such as an acrylic resin, an epoxy resin, or a polyimide.

<First functional layer 140>
The first functional layer 140 is located on the electrode layer 120 and in a region defined by the bank 130, and is in contact with the liquid repellent portion 132.

In the present embodiment, the first functional layer 140 is composed of the light emitting layer 141.

The light emitting layer 141 includes a red light emitting layer 141R that emits red light, a green light emitting layer 141G that emits green light, and a blue light emitting layer 141B that emits blue light.

The thickness of the light emitting layer 141 is, for example, several tens of nm. The thickness of the light emitting layer 141 varies depending on the type of material and the optical design of the device to be manufactured, but is about 20 nm or more and 100 nm or less.

The material of the light emitting layer 141 is a fluorene-based polymer organic compound. This fluorene-based high molecular weight organic compound is, for example, poly (9,9-dioctylfluorene-alt-benzothiazole), so-called F8BT.

<Second functional layer 150>
The second functional layer 150 is in contact with the low liquid repellent portion 134 and covers the first functional layer 140.

In the present embodiment, the second functional layer 150 is composed of an electrode layer 151 and a sealing layer 156.

The electrode layer 151 is composed of a transparent electrode. The electrode layer 151 is formed so as to cover a part of the bank 130 and the light emitting layer 141. The material of the electrode layer 151 is indium-tin oxide (ITO). Since the electrode layer 151 has high optical transparency, the light emitted by the light emitting layer 141 can be efficiently emitted to the outside of the functional device 100.

The sealing layer 156 is formed so as to cover at least a part of the bank 130 and the electrode layer 151. Needless to say, the sealing layer 156 covers the light emitting layer 141 located below the electrode layer 151. As shown in FIG. 2, in the present embodiment, the sealing layer 156 is formed as a so-called solid layer so as to span a plurality of regions defined by the bank 130.

The material of the sealing layer 156 is a photosensitive epoxy resin or a resin material such as an acrylic resin.

The light emitting layer 141 of the functional device 100 is liable to deteriorate due to the influence of moisture. The sealing layer 156 protects the light emitting layer 141 from moisture in the atmosphere.

The sealing layer 156 may only cover a part of the bank 130 as long as it can protect the light emitting layer 141 from moisture in the atmosphere.

The materials of each layer and bank 130 described above are examples, and are not limited to these materials.

<Manufacturing method of functional device 100>
The manufacturing method of the functional device 100 according to the present embodiment will be described with reference to FIGS. 2 to 8. In the following description, the entire product formed during the production of the functional device 100 is referred to as an intermediate product. The method for manufacturing the functional device 100 includes the following steps S1 to S5.

First, the electrode layer 120 is formed on the substrate 110 (step S1). The electrode layer 120 is formed by a vacuum film forming method such as a sputtering method using a material such as aluminum or a silver-palladium-copper alloy.

Next, the bank 130 is formed so as to cover a part of the electrode layer 120 (step S2). Step S2 includes a step S21 for forming the bank 130 having a relatively small liquid repellency, and a step S22 for forming the liquid repellent portion 132 on the surface portion 131 of the bank 130. Here, the bank 130 having a relatively small liquid repellency is a bank 130 having no liquid repellency 132 on the surface portion 131 and having a relatively small liquid repellency inside 136.

In step S21, a photosensitive resin material is used to form a bank 130 having a small liquid repellency by a photolithography method. As described above, the photosensitive resin material is a resin material such as an acrylic resin, an epoxy resin, or a polyimide. Step S21 includes the following steps S211 to S214.

First, a photosensitive resin material that is cured by exposure to ultraviolet light is applied onto the substrate 110 by a spin coating method, which is an example of a coating process (step S211). The rotation speed in the spin coating method, which is a condition of coating, is adjusted according to the required height of the bank 130.

Next, the coating layer is prebaked using a hot plate or the like, and the coated material is dried to remove the solvent component (step S212). Then, the ultraviolet light is exposed through the photomask on which the desired pattern is formed (step S213). Here, among the photosensitive resin materials, there are a negative type material in which the exposed portion irradiated with ultraviolet light is cured and a positive type material in which the unexposed portion of ultraviolet light is cured. Remove the uncured portion using an appropriate developer depending on the type of material. Then, the remaining pattern is post-baked in a curing furnace or the like (step S214). By these steps S211 to S214, a bank 130 having a relatively small liquid repellency is formed. As a result, the intermediate product is in the state shown in FIG. 3, which is a cross-sectional view showing the intermediate product in which the electrode layer 120 and the bank 130 having a relatively small liquid repellency are formed on the substrate 110. .. The bank 130 of the intermediate product shown in FIG. 3 has a relatively small liquid repellency.

Next, the liquid-repellent portion 132 is formed on the surface portion 131 of the bank 130 with respect to the intermediate product of FIG. 2 (step S22). In this embodiment, plasma irradiation is performed using fluorocarbon gas in step S22. The fluorocarbon gas is, for example, a fluorine compound such as carbon tetrafluoride (CF ₄ ). In the following description, the fluorocarbon gas will be described as being carbon tetrafluoride (CF ₄ ). In this case, as shown in FIG. 4, the CF ₄ plasma 310 irradiates the fluorocarbon gas toward the surface portion 131. FIG. 4 is a diagram showing how the intermediate product is irradiated with CF ₄ plasma 310.

When the fluorocarbon gas is irradiated toward the surface portion 131, the fluorine compound produced by the CF ₄ plasma 310 is introduced into the surface portion 131, and the liquid repellency of the surface portion 131 is increased. In other words, the surface portion 131 of the bank 130 has less wettability. As a result, the liquid-repellent portion 132 is formed on the surface portion 131 (see FIG. 4).

Next, by applying the ink of the first functional layer 140 to the light emitting region, the first is located in the region defined by the bank 130 and in contact with the liquid repellent portion 132 of the surface portion 131 of the bank 130. The functional layer 140 of the above is formed (step S3). In the present embodiment, since the first functional layer 140 is composed of only the light emitting layer 141, step S3 includes only step S31 for forming the light emitting layer 141. Step S31 includes the following steps S311 to S313.

An ink in which a high molecular weight compound having a light emitting property and a low molecular weight compound are dissolved is applied to a light emitting region by an inkjet method (step S311). The inks applied in step S311 are the ink 41R of the red light emitting layer 141R, the ink 41G of the green light emitting layer 141G, and the ink 41B of the blue light emitting layer 141B.

In the ink 41, the high molecular weight compound and the low molecular weight compound are dispersed using an organic solvent as a dispersion medium. Here, the concentration of the high molecular weight compound and the low molecular weight compound with respect to the organic solvent (hereinafter, also simply referred to as a solvent) is 0.5% by weight or more and 10% by weight or less.

Since the liquid-repellent portion 132 is located on the surface portion 131 of the bank 130, when the ink 41 is applied to the light emitting region, the ink 41 rises in the light emitting region as shown in FIG. Therefore, a relatively large amount of ink 41 can be stored in the light emitting region. FIG. 5 is a cross-sectional view showing an intermediate product in which the ink 41 is accumulated in the light emitting region.

After the ink 41 is applied, vacuum drying is performed on the substrate 110 to which the ink 41 is applied (step S312). Vacuum drying is performed using a vacuum dryer 210 (see FIG. 19). The vacuum dryer 210 includes an accommodating portion 211 capable of accommodating intermediate products and an exhaust pump 212 for reducing the degree of vacuum in the accommodating portion 211.

Vacuum drying is a method of accelerating the evaporation of the solvent by depressurizing the inside of the accommodating portion 211 in which the substrate 110 is accommodated by the exhaust pump 212. In the ink 41 applied by the inkjet method, a solvent having a relatively high boiling point is often used in order to suppress solvent drying at the nozzle. For this reason, vacuum drying is often used for early drying.

As the conditions for vacuum drying, for example, the ultimate vacuum degree of the accommodating portion 211 is several Pa, and the holding time is several tens of minutes. However, since the conditions for the appropriate ultimate vacuum degree and holding time differ depending on the high boiling point of the solvent contained in the ink 41 of the light emitting layer 141, the conditions for vacuum drying are not necessarily such that the ultimate vacuum degree is several Pa and the ultimate vacuum degree is several Pa. The retention time is not limited to tens of minutes.

After vacuum drying is performed, the ink 41 is heated (step S313). Since step S313 may be performed as needed, step S31 does not necessarily have to include step S313.

As a result, as shown in FIG. 6, light emitting layers 141R, 141G, and 141B are formed, respectively. FIG. 6 is a diagram showing an intermediate product in which the light emitting layers 141R, 141G, and 141B are formed. The thicknesses of the light emitting layers 141R, 141G, and 141B shown in FIG. 6 correspond to the amounts of the inks 41R, 41G, and 41B stored in the light emitting region.

Next, the low liquid repellent portion 134 is formed on a part of the surface portion 131 (step S4). In the present embodiment, the concentration of the liquid-repellent component of a part of the liquid-repellent portion 132 is lowered to generate the low liquid-repellent portion 134 from the part.

Specifically, in step S4, as shown in FIG. 7, plasma irradiation is performed on a part of the surface portion 131 using oxygen gas (O ₂ ) via the shielding mask 330. FIG. 7 is a diagram showing a state in which the intermediate product is irradiated with the O ₂ plasma 320 via the shielding mask 330. The reason for using the shielding mask 330 is to prevent the light emitting layer 141 from being irradiated with the O ₂ plasma 320. The part of the surface portion 131 is a portion of the liquid-repellent portion 132 that occupies most of the surface portion 131, other than the portion that is in contact with the light emitting layer 141.

The portion irradiated with the O ₂ plasma 320 is ashed, and the fluorine compound is removed from the portion. As a result, the concentration of fluorine atoms in the portion of the surface portion 131 irradiated with the O ₂ plasma 320 is reduced. That is, the liquid repellency of the portion irradiated with the O ₂ plasma 320 becomes small, and the wettability becomes large. As a result, as shown in FIG. 7, the portion of the liquid-repellent portion 132 that occupied most of the surface portion 131 and irradiated with the O ₂ plasma 320 becomes the low liquid-repellent portion 134 (FIG. 7). reference). Here, the liquid-repellent portion 132 is only a portion of the surface portion 131 that is in contact with the light emitting layer 141.

Since the surface 135 of the low liquid repellent portion 134 is irradiated with the O ₂ plasma 320, the surface 135 of the low liquid repellent portion 134 becomes rougher than the surface 133 of the liquid repellent portion 132.

Next, a second functional layer 150 that comes into contact with the low liquid repellent portion 134 and covers the light emitting layer 141 is formed (step S5). In the present embodiment, step S5 includes step S51 for forming the electrode layer 151 and step S52 for forming the sealing layer 156.

In step S51, the electrode layer 151 is formed so as to cover at least a part of the bank 130 and the light emitting layer 141. Here, an ink in which nanoparticles of indium-tin oxide are dispersed is applied by an inkjet method, the solvent of the applied ink is dried by a method such as vacuum drying, and the ink is heated at about 200 ° C. As shown in FIG. 8, the electrode layer 151 is formed. FIG. 8 is a diagram showing an intermediate product in a state where the electrode layer 151 is formed.

In step S51, the amount of ink to be applied is determined so that the thickness of the electrode layer 151 after the ink is dried becomes a predetermined thickness.

In step S52, by applying the ink of the sealing layer 156, at least a part of the bank 130 and the sealing layer 156 covering the electrode layer 151 are formed. Step S52 includes steps S521 to S524.

First, an epoxy resin material or an ink containing an acrylic resin material is applied by an inkjet method (step S521).

After applying the ink, the applied ink is left for a certain period of time (step S522). This forms a layer. Next, leveling is performed on the formed layer to make the thickness of the layer uniform (step S523).

Subsequently, the homogenized layer is irradiated with ultraviolet light to cure the layer (step S524). In step S524, the wavelength of the ultraviolet light to be irradiated is about 350 nm or more and 400 nm or less. In step S524, a metal halide lamp may be used, or an LED capable of emitting ultraviolet light having a single wavelength may be used. The irradiation amount of ultraviolet light is, for example, 200 mJ / cm ² or more and 1000 mJ / cm ² or less.

Since the low liquid repellent portion 134 is formed in the bank 130, the ink of the second functional layer 150 can be uniformly applied without being repelled by the bank 130 in step S5.

As a result of performing step S5, the functional device 100 shown in FIG. 2 is completed.

As described above, according to the present embodiment, the functional device 100 includes a bank 130 having a liquid repellent portion 132 and a low liquid repellent portion 134 having a smaller liquid repellent property than the liquid repellent portion 132 on the surface portion 131. There is. Further, the first functional layer 140 is in contact with the liquid repellent portion 132, and the second functional layer 150 is in contact with the low liquid repellent portion 134.

Therefore, when the second functional layer 150 covering the first functional layer 140 is formed by using the coating process, the ink of the second functional layer 150 is not repelled by the bank 130. Therefore, the uniformity of the thickness of the second functional layer 150 can be ensured. Therefore, it is possible to prevent the deterioration of the quality of the functional device 100 due to the deterioration of the uniformity of the second functional layer 150. As a result, even when the second functional layer 150 is formed by using the coating process, the high quality functional device 100 can be manufactured. Therefore, the material of each layer can be effectively used and high quality can be ensured.

Further, since the ink of the second functional layer 150 is not repelled by the bank 130, it is easy to form the second functional layer 150 without a pin pole. Therefore, it is possible to improve the covering property of the sealing layer 156 of the second functional layer 150 and prevent the invasion of moisture into the first functional layer 140 due to the deterioration of the covering property of the sealing layer 156. Therefore, the reliability of the functional device 100 over time can be ensured.

Further, since the bank 130 has the liquid-repellent portion 132, when the first functional layer 140 is formed, a sufficient amount of the ink of the first functional layer 140 is applied to the region defined by the bank 130. Can be stored. Therefore, it is easy to form the first functional layer 140 having a desired thickness. Further, since it is not necessary to form a relatively high bank 130 in order to store the ink of the first functional layer 140, the size of the functional device 100 does not increase, and the first functional layer 140 having a desired thickness is used. It is easy to make it easy, and the quality of the functional device 100 can be ensured. Further, since it is not necessary to form a relatively high bank 130, the risk of lowering the coverage of the second functional layer 150 is reduced.

By forming the second functional layer 150 by using the coating process, the operating energy can be reduced as compared with the case of forming by using the vacuum process, so that the cost for manufacturing the functional device 100 can be reduced.

Further, by forming the second functional layer 150 by using the coating process, the functional device 100 can be manufactured at a lower temperature than that of the vacuum process. Therefore, a substrate having low heat resistance such as a glass substrate and a plastic substrate can be used. The functional device 100 can be manufactured. Therefore, a wider variety of functional devices 100 can be manufactured.

Further, the roughness of the surface 135 of the low liquid repellent portion 134 is relatively large. More specifically, the roughness of the surface 135 of the low liquid repellent portion 134 is larger than the roughness of the surface 133 of the liquid repellent portion 132. Therefore, the adhesion of the second functional layer 150 formed so as to be in contact with the surface 135 of the low liquid repellent portion 134 to the surface 135 is enhanced. As a result, the sealing performance of the second functional layer 150 is improved, so that it is possible to prevent moisture from entering the first functional layer 140 from the outside, and it is possible to ensure the reliability of the functional device 100 over time. ..

The inner 136 of the bank 130 may be made of the same material as the liquid repellent portion 132. That is, the inner 136 of the bank 130 may contain a fluorine compound which is a liquid-repellent component. In this case, the inner 136 has a relatively high liquid repellency. Further, in step S21, the bank 130 is formed by using the ink containing the acrylic resin material containing the fluorine compound. Further, when an ink containing an acrylic resin material containing a fluorine compound is used in step S21, the entire range of the surface portion 131 of the bank 130 formed by executing step S21 is occupied by the liquid repellent portion 132. It will be in the state of being. That is, the liquid repellent portion 132 is already formed on the surface portion 131. Therefore, when an ink containing an acrylic resin material containing a fluorine compound is used in step S21, step S2 does not include step S22.

Further, in the embodiment, the functional device 100 does not necessarily have to have a top emission structure.

(Modification 1)
Hereinafter, with reference to FIG. 9A, the modification 1 will be described mainly different from the above-described embodiment. FIG. 9A is a cross-sectional view of the functional device 100 according to the first modification.

The sealing layer 156 included in the functional device 100 according to the first modification is divided into regions defined by the bank 130. Among the layers constituting the functional device 100, the sealing layer 156 is a portion that occupies most of the thickness of the layer. Therefore, when the functional device 100 is subjected to deformation stress (for example, bending stress), the stress applied to the sealing layer 156 becomes large, and the sealing layer 156 may be cracked. However, if the sealing layer 156 is divided as in the functional device 100 according to the first modification, the action of relieving stress works at that portion, and cracking of the sealing layer 156 can be suppressed. ..

In step S521 of the method for manufacturing the functional device 100 according to the first modification, the ink of the sealing layer 156 is applied to a part of the bank 130 and the region corresponding to the light emitting region on the electrode layer 151. Regarding other points, the method for manufacturing the functional device 100 according to the first modification is the same as the method for manufacturing the functional device 100 according to the embodiment.

According to the functional device 100 according to the first modification, the same effect as that of the functional device 100 according to the embodiment can be obtained.

Further, in the first modification, as shown in FIG. 9B, the second functional layer 150 may include an inorganic layer 158 located on the sealing layer 156 in addition to the electrode layer 151 and the sealing layer 156. .. More specifically, the sealing layer 156 and the inorganic layer 158 may be alternately laminated on the electrode layer 151 and the bank 130. Here, when the combination of the sealing layer 156 and the inorganic layer 158 is paired, the second functional layer 150 may contain N pairs of the combination. N is an integer of 1 or more. The thickness of the sealing layer 156 and the inorganic layer 158 is thinner in the upper portion of the bank 130 than in the upper portion of the light emitting layer 141.

The material of the inorganic layer 158 is an inorganic compound.

As shown in FIG. 9B, when the functional device 100 has an inorganic layer 158, step S52 includes step S525 in addition to steps S521 to S524. Step S525 is a step of forming an inorganic layer 158 on the sealing layer 156 by an inkjet method. Further, forming the sealing layer 156 on the inorganic layer 158 and forming the inorganic layer 158 on the formed sealing layer 156 means that N pairs of the sealing layer 156 and the inorganic layer 158 are formed. It will be done until.

As shown in FIG. 9B, when the second functional layer 150 has the inorganic layer 158, the water permeability of the second functional layer 150 can be reduced. Therefore, the reliability of the functional device 100 over time can be ensured more reliably.

As shown in FIG. 9B, when the second functional layer 150 has a plurality of pairs of the sealing layer 156 and the inorganic layer 158, it is necessary that the second functional layer 150 is divided into regions defined by the bank 130. It is not always necessary, and it may be connected.

(Modification 2)
Hereinafter, with reference to FIG. 10, the modification 2 will be described mainly different from the above-described embodiment. FIG. 10 is a cross-sectional view of the functional device 100 according to the modified example 2.

The first functional layer 140 of the functional device 100 according to the second modification is composed of a light emitting layer 141, a hole injection layer 142, a hole transport layer 143, and an electron injection layer 144.

<Hole injection layer 142>
The hole injection layer 142 is located on the electrode layer 120. The hole injection layer 142 is a layer for injecting holes into the light emitting layer 141. The material of the hole injection layer 142 is an organic material such as a polythiophene-based material. Specifically, the material of the hole injection layer 142 is poly (3,4-ethylenedioxythiophene): poly (styrenesulfonate), so-called PEDOT: PSS. PEDOT: PSS is a conductive polymer material.

<Hole transport layer 143>
The hole transport layer 143 is formed on the hole injection layer 142 so as to cover the hole injection layer 142. The hole transport layer 143 is a layer that transports the holes injected by the hole injection layer 142 to the light emitting layer 141. Further, the hole transport layer 143 is also a layer for preventing the electrons injected by the electron injection layer 144 from invading the hole injection layer 142. The material of the hole transport layer 143 is, for example, poly (9,9-dioctylfluorene-co-N- (4-butylphenyl) -diphenyllamine), so-called TFB.

<Electron injection layer 144>
The electron injection layer 144 is formed so as to cover the light emitting layer 141. The material of the electron injection layer 144 is a transparent oxide semiconductor such as zinc oxide.

Next, a method of manufacturing the functional device 100 according to the second modification will be described.

Step S3 includes steps S301, S302, and S321 in addition to the above-mentioned step S31. Step S301 is a step of forming the hole injection layer 142 in the light emitting region after the completion of step S2. Step S302 is a step of forming the hole transport layer 143 so as to cover the hole injection layer 142 after the step S301 is completed. Step S321 is a step of forming the electron injection layer 144 so as to cover the light emitting layer 141 after the step S31 is completed.

In steps S301, S302, and S321, the ink of each layer is applied to the light emitting region, the solvent of the applied ink is dried by a method such as vacuum drying, and the substrate 110 is heated if necessary. As a result, the hole injection layer 142, the hole transport layer 143, and the electron injection layer 144 are formed.

In the second modification, in step S4, the O ₂ plasma 320 is irradiated to the light emitting layer 141, the hole injection layer 142, the hole transport layer 143, and the electron injection layer 144 by irradiating the O ₂ plasma 320 through the shielding mask 330. Prevent the 320 from being irradiated.

In addition, the method for manufacturing the functional device 100 according to the second modification is the same as the method for manufacturing the functional device 100 according to the embodiment. In the second modification, when step S4 is executed, a portion of the surface portion 131 other than the portion in contact with the light emitting layer 141, the hole injection layer 142, the hole transport layer 143, and the electron injection layer 144. However, it becomes a low liquid repellent portion 134.

According to the functional device 100 according to the second modification, the same effect as that of the functional device 100 according to the embodiment can be obtained.

(Modification 3)
Hereinafter, with reference to FIG. 11, the modification 3 will be described mainly with respect to the differences from the above-described embodiment. FIG. 11 is a cross-sectional view of the functional device 100 according to the modified example 3.

The functional device 100 according to the third modification is an organic transistor device. The functional device 100 shown in FIG. 11 is an organic transistor device having a bottom gate structure and a top contact structure.

The electrode layer 120 of the functional device 100 is composed of a gate electrode layer 121 and a gate insulating layer 122. Further, the first functional layer 140 of the functional device 100 is composed of the organic semiconductor layer 145. The second functional layer 150 is composed of an electrode layer 151 and a protective layer 157, and the electrode layer 151 is composed of a source electrode 152 and a drain electrode 153.

<Gate electrode layer 121>
The gate electrode layer 121 is located on the substrate 110, and the material of the gate electrode layer 121 is, for example, molybdenum.

<Gate insulating layer 122>
The gate insulating layer 122 is a layer that covers the gate electrode layer 121, and the material of the gate insulating layer 122 is, for example, an olefin polymer.

<Organic semiconductor layer 145>
The organic semiconductor layer 145 covers the gate insulating layer 122 and is positioned so as to be in contact with the liquid repellent portion 132 in the region defined by the bank 130. The material of the organic semiconductor layer 145 is pentacene. In addition to pentacene, the material of the organic semiconductor layer 145 may be a low molecular weight organic semiconductor material such as tetracene and a phthalocyanine compound, a high molecular weight organic semiconductor material such as polythiophene and polyphenylene vinylene, and a carbon nanotube.

<Source electrode 152 and drain electrode 153>
The source electrode 152 and the drain electrode 153 are electrodes for forming a channel. The source electrode 152 and the drain electrode 153 are located directly above the organic semiconductor layer 145 so as to cover at least a part of the bank 130 and the organic semiconductor layer 145. The source electrode 152 and the drain electrode 153 are arranged so as to be opposed to each other at a certain distance (for example, about several μm) from each other. The functional device 100 exhibits semiconductor characteristics by allowing carriers to flow between the source electrode 152 and the drain electrode 153. In order to secure a long carrier path, the source electrode 152 and the drain electrode 153 may be formed in a comb-teeth shape. The material of the source electrode 152 and the drain electrode 153 is, for example, gold.

An organic transistor device having a top contact structure as in Modification 3 exhibits stable semiconductor characteristics because the source electrode 152 and the drain electrode 153 are arranged directly above the organic semiconductor layer 145.

The protective layer 157 covers at least a part of the bank 130, the source electrode 152, the drain electrode 153, and the organic semiconductor layer 145. A contact hole 400 is formed in the protective layer 157. The contact hole 400 penetrates the protective layer 157 from the end of the protective layer 157 on the farthest side from the substrate 110 to the drain electrode 153. By forming the contact hole 400, the drain electrode 153 and the electrode of another functional device can be electrically connected. Thereby, for example, the drain electrode 153 of the functional device 100 according to the modified example 3 and the electrode of the organic EL device are electrically connected, and the light emission of the organic EL device is controlled by the functional device 100 according to the modified example 3. be able to.

In the third modification, the inner 136 of the bank 130 is made of the same material as the liquid-repellent portion 132. The material of the inner 136 of the bank 130 and the liquid-repellent portion 132 includes a photosensitive resin material and a fluorine compound which is a liquid-repellent component. Therefore, the internal 136 has a relatively high liquid repellency.

<Manufacturing method of functional device 100>
The method for manufacturing the functional device 100 according to the third modification includes the above-mentioned steps S1 to S5, but the content regarding the difference between the organic EL device and the organic transistor device and the difference between the materials constituting the internal 136. Is different.

In step S1 of the modification 3, molybdenum is used as a material, a layer is formed on the substrate 110 by using a sputtering method, and the layer is patterned into a desired pattern by using a photolithography method. The gate electrode layer 121 is formed. Further, an olefin polymer is applied to the substrate 110 and the gate electrode layer 121 by a spin coating method to form a layer, and the layer is heated to form a gate insulating layer 122.

Step S2 of the modification 3 is other than forming a bank 130 having a relatively large liquid repellency by using an ink containing a photosensitive acrylic resin material containing a fluorine compound, and not including step S22. Is the same as step S2 of the embodiment.

In step S3 of the modification 3, the ink produced by dissolving pentacene in an organic solvent is applied to the region defined by the bank 130 by an inkjet method, and the applied ink is vacuum dried and heat-treated. This forms the organic semiconductor layer 145.

Step S4 of the modification 3 is the same as step S4 of the embodiment.

In step S5 of the modification 3, first, the source electrode 152 and the drain electrode 153 that are in contact with the low liquid repellent portion 134 and cover the organic semiconductor layer 145 are formed. More specifically, the source electrode 152 and the drain electrode 153 are formed by applying an ink in which gold nanoparticles are dispersed to a part of the low liquid repellent portion 134 and the organic semiconductor layer 145 by an inkjet method. Here, the source electrode 152 and the drain electrode 153 are formed so as to be opposed to each other at a certain distance from each other. Next, a protective layer 157 that covers the source electrode 152, the drain electrode 153, and the low liquid repellent portion 134 is formed. Next, a contact hole 400 for exposing the drain electrode 153 is formed in the protective layer 157.

According to the functional device 100 according to the modification 3, the same effect as that of the functional device 100 according to the embodiment can be obtained.

The contact hole 400 may not be formed on the protective layer 157. In that case, the contact hole 400 is not formed in step S5.

(Other variants)
The liquid-repellent component may be a compound containing a fluorine atom or a silicon atom. That is, as the liquid-repellent component, a silicon compound may be used instead of the fluorine compound. In this case, the concentration of the silicon atom in the liquid repellent portion 132 is higher than the concentration of the silicon atom in the low liquid repellent portion 134. Specifically, the concentration of the fluorine atom in the liquid repellent portion 132 is 5 atom% or more and 10 atom% or less, and the concentration of the fluorine atom in the low liquid repellent portion 134 is 0 atom% or more and less than 5 atom%. Even when a silicon compound is used instead of the fluorine compound as the liquid-repellent component, the contact angle of the liquid-repellent portion 132 with respect to the ink of the first functional layer 140 is 20 degrees or more and 70 degrees or less, preferably 30 degrees or more. It is 60 degrees or less. In the same case, the contact angle of the low liquid repellent portion 134 with respect to the ink of the second functional layer 150 is 0 degrees or more and 30 degrees or less, preferably 0 degrees or more and 20 degrees or less.

Even when the liquid-repellent component contained in the liquid-repellent portion 132 and the low-liquid-repellent portion 134 is a silicon compound, the same effect as when the liquid-repellent component is a fluorine compound can be obtained.

In step S4, if the concentration of the liquid-repellent component contained in the liquid-repellent portion 132 can be reduced to form the low-liquid-repellent portion 134 from a part of the liquid-repellent portion 132, the following is shown below instead of plasma irradiation (step S4). The processes A) to (C) may be performed.

(A) In step S4, the substrate 110 on which the bank 130 and the first functional layer 140 are formed is housed in the housing section 211 of the vacuum dryer 210 (see FIG. 19), and the housing section is heated while heating the bank 130. The degree of vacuum of 211 may be reduced. For example, the degree of vacuum of the accommodating portion 211 is reduced to 10 Pa.

The fluorine compound produced by the CF ₄ plasma 310 is introduced into the surface portion 131 by bonding with the carbon atom of the surface portion 131. The bond between the fluorine compound introduced by the CF ₄ plasma 310 into the surface portion 131 of the bank 130 and the carbon atom of the surface portion 131 is weak and unstable. Therefore, the fluorine compound is separated from the surface portion 131 (liquid repellent portion 132) over time. This detachment phenomenon can be accelerated by heating the bank 130 and reducing the pressure of the atmosphere around the bank 130.

(B) In step S4, a part of the liquid-repellent portion 132 may be irradiated with ultraviolet light.

(C) In step S4, a part of the liquid-repellent portion 132 may be scraped to expose the inside 136 of the bank 130. As a result, the inner 136 having a small liquid repellency is located on the surface portion 131 of the bank 130, and the portion having a small liquid repellency is formed on the surface portion 131. That is, the low liquid repellent portion 134 is formed on the surface portion 131.

When scraping a part of the liquid-repellent portion 132, sandblasting, mechanical polishing, or the like may be performed.

Even when any of the treatments (B) and (C) is performed in step S4, the roughness of the surface of the surface 135 of the low liquid repellent portion 134 is the surface roughness of the surface 133 of the liquid repellent portion 132. It will be larger than the roughness. In particular, the surface roughness changes significantly by performing the treatment (C). Therefore, the adhesion of the second functional layer 150 to the surface 135 is enhanced, and the sealing property of the second functional layer 150 is improved, so that the intrusion of moisture from the outside can be prevented and the reliability of the functional device 100 over time can be prevented. Sex can be ensured.

In step S4, the treatments (A) and (C) are performed on the premise that the liquid repellency of the inner 136 of the bank 130 is relatively small. When an ink containing a resin material that does not contain a liquid-repellent component such as a fluorine compound or a silicon compound is used as the material of the bank 130 in step S21 as in the embodiment, the liquid-repellent property of the inside 136 of the bank 130 is used. Is relatively small.

In step S4, plasma irradiation or ultraviolet light irradiation may be performed with a small intensity so that the first functional layer 140 is not damaged. In this case, the process of step S4 is executed without using the shielding mask 330.

In step S211 the photosensitive resin material may be coated by another coating process, slit coating. In this case, the scanning speed of the slit coat, which is a coating condition, is adjusted according to the height of the required bank 130.

The electrode layer 120 may be ashed using _O2 plasma or atmospheric pressure plasma before irradiating the surface portion 131 of the bank 130 with the CF ₄ plasma 310. The merits of ashing the electrode layer 120 are the following two points.

(I) When ashing is performed with O ₂ plasma or atmospheric pressure plasma, the number of carbon atoms on the electrode layer 120 becomes extremely small. The fluorine compound produced by the CF ₄ plasma 310 is introduced into the surface portion 131 by bonding with the carbon atom of the surface portion 131. Therefore, by ashing the electrode layer 120, the fluorine compound is less likely to be introduced into the surface of the electrode layer 120, and on the other hand, it is more likely to be introduced into the surface portion 131 of the bank 130 made of the resin material.

(II) When a fluorine compound is introduced on the surface of the electrode layer 120, the liquid repellency of the surface of the electrode layer 120 becomes large, and when the ink of the first functional layer 140 is applied to the surface of the electrode layer 120, It will be repelled and the light emitting layer 141 with high uniformity cannot be formed. In other words, by ashing the electrode layer 120 to reduce the number of carbon atoms on the surface of the electrode layer 120, even if the CF ₄ plasma 310 is irradiated, the surface of the electrode layer 120 is liquid-repellent. Since the increase in sex can be suppressed, the first functional layer 140 having high uniformity can be formed.

The functional device 100 may be a quantum dot light emitting device. In this case, the material of the light emitting layer 141 is an inorganic compound in which a cadmium-selenium compound is formed into quantum dots. The emission color of the quantum dot material changes according to the particle size of the particles, and the larger the particle size, the more red the light is emitted. Therefore, the inks 41R, 41G, and 41B of the red light emitting layer 141R, the green light emitting layer 141G, and the blue light emitting layer 141B each include a material having a different particle size (that is, a quantum dot material).

Further, in step S311, the ink 41 in which the inorganic compound in the quantum dot state is dispersed is applied by a coating process such as an inkjet method. Here, the ink 41 contains a cadmium-selenium-based inorganic material or the like. In these inks 41, a cadmium-selenium-based inorganic material or the like is dispersed using an organic solvent as a dispersion medium, and the concentration of the material is 0.5% by weight or more and 10% by weight or less.

As the ink 41 of the light emitting layer 141, an ink in which any one of indium-phosphorus-based, copper-indium-sulfur-based, silver-indium-sulfur-based materials, and an inorganic material having a perovskite structure is dispersed is used. May be good.

Further, the functional device 100 may be a color conversion filter device that converts the emission color. In this case, the first functional layer 140 of the functional device 100 includes a layer formed of the quantum dot material. The layer formed of the quantum dot material can be formed by an inkjet method.

Further, the functional device 100 may be a sensor device. In this case, the first functional layer 140 of the functional device 100 includes a layer formed of a piezoelectric material. When the functional device 100 is a sensor device, it goes without saying that the functional device 100 has an electrode layer 151 that functions as an electrode. The electrode layer 151 and the layer formed of the piezoelectric material can be formed by an inkjet method.

In the first embodiment and the second modification, the sealing layer 156 may be formed after forming a thin film with silicon nitride on the electrode layer 151.

The first functional layer 140 is not limited to the layers shown in the embodiments and the modifications 1 to 3, but the light emitting layer 141, the hole injection layer 142, the hole transport layer 143, the electron injection layer 144, and the like. It suffices to include one or more layers in the organic semiconductor layer 145.

Further, the second functional layer 150 is not limited to the layers shown in the embodiments and the modifications 1 to 3, but is one or more of the electrode layer 151, the sealing layer 156, and the protective layer 157. It suffices to include a layer.

(Example 1)
The inventor manufactured the functional device 100, which is an organic EL device, by the manufacturing method according to any one of the above-described embodiment, Modifications 1 to 3, and other modifications. Hereinafter, the manufacture of the functional device 100 (that is, the organic EL device) will be described with reference to FIGS. 12 to 15.

First, as the substrate 110, glass made of AGC having a plate thickness of 0.5 mm was prepared. Then, the electrode layer 120 is formed by using a silver-palladium-copper alloy as a material, forming a layer on the substrate 110 by using a sputtering method, and patterning it into a desired pattern by using a photolithography method. Formed.

Next, an acrylic resin material containing a fluorine compound and containing a photosensitive acrylic resin material made of AGC is applied onto the substrate 110 by a spin coating method, and the applied ink is prebaked at 100 ° C. to form a layer. Was formed, and the layer was irradiated with ultraviolet light having a wavelength of 365 nm to form a rectangular pattern, which was further post-baked. As a result, the bank 130 was formed. In Example 1, the bank 130 was formed so that the height was 1 μm. As a result, the intermediate product shown in FIG. 12 was formed. FIG. 12 is a cross-sectional view showing an intermediate product in which the electrode layer 120 and the bank 130 are formed on the substrate 110.

In the intermediate product shown in FIG. 12, the fluorine compound was segregated on the surface portion 131 of the bank 130. The surface portion 131 had high liquid repellency and low wettability. That is, it can be said that the surface portion 131 is occupied by the liquid repellent portion 132. The contact angle of the liquid-repellent portion 132 of the bank 130 with respect to the ink 41R is 20 degrees or more and 70 degrees or less, preferably 30 degrees or more and 60 degrees or less. The inner 136 has a relatively large liquid repellency.

Next, the ink 41R, which is the material of the red light emitting layer 141R, was applied to the light emitting region, which is the region defined by the bank 130, by an inkjet method.

Then, the intermediate product was dried by vacuum drying. More specifically, the solvent of the applied ink 41R was dried by lowering the pressure of the atmosphere around the ink 41R. As a result, as shown in FIG. 13, a red light emitting layer 141R was formed. FIG. 13 is a cross-sectional view showing an intermediate product in a state where the red light emitting layer 141R is formed.

FIG. 14 is a diagram showing a state in which the intermediate product is irradiated with O ₂ plasma via a shielding mask.

After the red light emitting layer 141R was formed, the bank 130 was irradiated with O ₂ plasma 320. At this time, the O ₂ plasma 320 was irradiated through the shielding mask 330 so that the red light emitting layer 141R was not irradiated with the O ₂ plasma 320. By this treatment, the fluorine compound is removed from the surface portion 131 of the bank 130 to which the red light emitting layer 141R is not in contact, so that the presence of fluorine atoms is compared with the surface portion 131 of the bank 130 to which the red light emitting layer 141R is in contact. The density decreases and the concentration of fluorine atoms decreases. As a result, as shown in FIG. 14, the portion of the liquid repellent portion 132 that is not in contact with the red light emitting layer 141R becomes the low liquid repellent portion 134. The liquid-repellent portion 132 is only a portion of the surface portion 131 in contact with the red light emitting layer 141R. The contact angle of the low liquid repellent portion 134 with respect to the ink of the second functional layer 150 is 0 degrees or more and 30 degrees or less, preferably 0 degrees or more and 20 degrees or less.

Next, an ink in which nanoparticles of indium-tin oxide (ITO) are dispersed is applied to a part of the bank 130 and the red light emitting layer 141R by an inkjet method, and the solvent of the applied ink is evaporated by vacuum drying. The ink was heated at about 200 ° C. As a result, an electrode layer 151 covering at least a part of the bank 130 and the red light emitting layer 141R was formed.

Next, an ink containing a photosensitive acrylic resin material (that is, the ink of the sealing layer 156) was applied to a part of the bank 130 and the electrode layer 151 by an inkjet method. The height (that is, the thickness) of the ink when applied was about 4 μm. Then, using an LED lamp, the irradiation time was adjusted so that the irradiation amount was 1000 mJ / cm ² , and the ink of the sealing layer 156 was irradiated with ultraviolet light having a wavelength of 395 nm to cure the acrylic resin material. .. As a result, the sealing layer 156 was formed, and as shown in FIG. 15, the functional device 100, which is an organic EL device, was completed. FIG. 15 is a cross-sectional view showing the structure of the functional device 100 according to the first embodiment.

By making the device structure of the functional device 100 the device structure shown in any of the above-described embodiments, the first to third modifications, and the other modifications, an electrode having high uniformity using the inkjet method can be used. The layer 151 and the sealing layer 156 could be formed.

Therefore, it can be said that the quality of the manufactured functional device 100 can be ensured even when not only the first functional layer 140 but also the second functional layer 150 is formed by using the coating process. Further, it can be said that the cost for manufacturing the functional device 100 can be reduced and the functional device 100 can be manufactured at a relatively low temperature as compared with the case of forming by using the vacuum process. The fact that the functional device 100 can be manufactured at a low temperature means that a substrate having low heat resistance such as a glass substrate and a plastic substrate can be used as the substrate 110, so that the substrate 110 can be made flexible.

(Example 2)
The inventor is a functional device 100 which is an organic EL device by a method different from the first embodiment of the above-described embodiment and the manufacturing method of any of the modified examples 1 to 3 and other modified examples. Manufactured. Hereinafter, with reference to FIGS. 16 to 20, the manufacturing of the functional device 100 (that is, the organic EL device) will be described mainly different from that of the first embodiment.

First, the substrate 110 was prepared, and the electrode layer 120 was formed on the substrate 110.

Next, an ink containing a photosensitive acrylic resin material manufactured by Nissan Chemical Industries, Ltd. was applied onto the substrate 110 by a spin coating method, and the applied ink was prebaked at 100 ° C. to form a layer, and ultraviolet light having a wavelength of 365 nm was formed. Was applied to the layer to form a rectangular pattern, which was further post-baked. As a result, the bank 130 was formed. In Example 2, the bank 130 was formed so that the height was 1 μm. As a result, the intermediate product shown in FIG. 16 was formed. FIG. 16 is a cross-sectional view showing an intermediate product in which the electrode layer 120 and the bank 130 are formed on the substrate 110.

The ink used to form the bank 130 mainly contains an acrylic resin material, and the formed bank 130 has relatively low liquid repellency on both the surface portion 131 and the internal 136.

Next, the bank 130 was irradiated with O ₂ plasma 320. Then, the CF ₄ plasma 310 was irradiated to the bank 130 to introduce the fluorine compound into the surface portion 131 of the bank 130. FIG. 17 is a diagram showing how the intermediate product is irradiated with CF ₄ plasma 310. By irradiating the CF ₄ plasma 310, the concentration of fluorine atoms on the surface portion 131 is improved, and the liquid repellency of most of the surface portion 131 is increased. That is, as shown in FIG. 17, the liquid repellent portion 132 is formed on the surface portion 131.

Next, the ink 41R, which is the material of the red light emitting layer 141R, was applied to the light emitting region, which is the region defined by the bank 130, and the applied ink 41R was vacuum-dried. As a result, as shown in FIG. 18, a red light emitting layer 141R was formed. FIG. 18 is a cross-sectional view showing an intermediate product in a state where the red light emitting layer 141R is formed.

Next, as shown in FIG. 19, the intermediate product of FIG. 17 was housed in the housing section 211 of the vacuum dryer 210. FIG. 19 is a cross-sectional view showing an intermediate product in a state of being housed in the vacuum dryer 210. The vacuum dryer 210 includes an accommodating portion 211 and an exhaust pump 212.

After accommodating the intermediate product in the accommodating portion 211, the air in the accommodating portion 211 was exhausted by the exhaust pump 212 to reduce the vacuum degree of the accommodating portion 211 and heat the bank 130 at 60 degrees.

The fluorine compound produced by the CF ₄ plasma 310 is introduced into the surface portion 131 by bonding with the carbon atom of the surface portion 131. The bond between the fluorine compound introduced by the CF ₄ plasma 310 into the surface portion 131 of the bank 130 and the carbon atom of the surface portion 131 is weak and unstable. Therefore, the fluorine compound is separated from the surface portion 131 (liquid repellent portion 132) over time. This detachment phenomenon was accelerated by heating the bank 130 and depressurizing the atmosphere around the bank 130.

As a result, the fluorine compound is removed from the portion of the liquid-repellent portion 132 that is not in contact with the red light emitting layer 141R, and the density of fluorine atoms in the portion is reduced. Therefore, the liquid repellency of the portion is reduced and the wettability is increased. That is, as shown in FIG. 19, the portion of the surface portion 131 becomes the low liquid repellent portion 134.

On the other hand, the fluorine compound is not removed from the portion of the liquid-repellent portion 132 that is in contact with the red light emitting layer 141R.

Next, the electrode layer 151 and the sealing layer 156 were formed in the same manner as in Example 1. As a result, as shown in FIG. 20, the functional device 100, which is an organic EL device, was completed. FIG. 20 is a cross-sectional view showing the structure of the functional device according to the second embodiment.

Therefore, by changing the device structure of the functional device 100 to the device structure of any one of the above-described embodiment, Modifications 1 to 3, and other modifications, the uniformity is high by utilizing the inkjet method. The electrode layer 151 and the sealing layer 156 could be formed.

Therefore, it can be said that the quality of the manufactured functional device 100 can be ensured even when not only the first functional layer 140 but also the second functional layer 150 is formed by using the coating process. Further, it can be said that the functional device 100 can be manufactured at a low cost and at a relatively low temperature as compared with the case of forming by using a vacuum process. Being able to manufacture the functional device 100 at a low temperature means that the substrate 110 can be made flexible.

(Example 3)
The inventor manufactured the functional device 100, which is a quantum dot light emitting device, by the manufacturing method according to any one of the above-described embodiment, Modifications 1 to 3, and other modifications. Hereinafter, the manufacturing of the functional device 100 (that is, the quantum dot light emitting device) will be described mainly different from that of the first embodiment.

As the quantum dot light emitting material, a cadmium-selenium-based inorganic compound having a particle size of several tens of nm was used.

In the manufacture of quantum dot light emitting devices, an ink having a particle size of several tens of nm and a cadmium-selenium-based inorganic compound dispersed in an aromatic organic solvent is applied to the light emitting region by an inkjet method to form a light emitting layer. Formed.

The functional device 100, which is a quantum dot light emitting device, could be formed by the same manufacturing process as in Example 1 except that the materials of the light emitting layer 141 are different.

Therefore, according to any of the above-described embodiments, modifications 1 to 3, and other modifications, it can be said that not only the organic EL device but also the quantum dot light emitting device can be manufactured in the same manner.

(Example 4)
The inventor manufactured the functional device 100, which is an organic transistor device, by any of the above-described embodiments and any of the manufacturing methods of any of the modified examples 1 to 3 and other modified examples.

First, as the substrate 110, glass made of AGC having a plate thickness of 0.5 mm was prepared. Then, molybdenum is used as a material, a layer is formed on the substrate 110 by using a sputtering method, and the layer is patterned into a desired pattern by using a photolithography method to form a gate electrode layer 121. did.

Next, an olefin polymer was applied to the substrate 110 and the gate electrode layer 121 by a spin coating method to form a layer, and the layer was cured by heating at 130 degrees. As a result, the gate insulating layer 122 covering the gate electrode layer 121 was formed.

Next, an acrylic resin material containing a fluorine compound and containing a photosensitive acrylic resin material made of AGC is applied onto the substrate 110 by a spin coating method, and the applied ink is prebaked at 100 ° C. to form a layer. Was formed, and the layer was irradiated with ultraviolet light having a wavelength of 365 nm to form a rectangular pattern, which was further post-baked. As a result, the bank 130 was formed. In Example 4, the bank 130 was formed so that the height was 0.3 μm or more and 1 μm or less.

Fluorine compounds were segregated on the surface portion 131 of the bank 130, and the surface portion 131 had high liquid repellency and low wettability. That is, the surface portion 131 was occupied by the liquid repellent portion 132. The contact angle of the liquid-repellent portion 132 with respect to the ink of the organic semiconductor layer 145 is 20 degrees or more and 70 degrees or less, preferably 30 degrees or more and 60 degrees or less. The inner 136 has a relatively large liquid repellency.

Next, the ink produced by dissolving pentacene in an organic solvent was applied to the region defined by the bank 130 by an inkjet method.

Then, the solvent of the applied ink was dried by vacuum drying, and the ink was heated at 100 ° C. As a result, the organic semiconductor layer 145 was formed.

Next, the bank 130 was irradiated with O ₂ plasma 320 by the same method as in Example 1. As a result, the fluorine compound was removed from the portion of the liquid-repellent portion 132 of the bank 130 that was not in contact with the organic semiconductor layer 145, the liquid-repellent property of the portion was reduced, and the wettability was increased. That is, the portion of the surface portion 131 became the low liquid repellent portion 134. The contact angle of the low liquid repellent portion 134 with respect to the ink of the second functional layer 150 is 0 degrees or more and 30 degrees or less, preferably 0 degrees or more and 20 degrees or less.

Next, an ink in which gold nanoparticles were dispersed was applied to a part of the low liquid repellent portion 134 and the organic semiconductor layer 145 by an inkjet method to form a source electrode 152 and a drain electrode 153. Here, the source electrode 152 and the drain electrode 153 are formed so as to be opposed to each other at a certain distance from each other.

Next, a protective layer 157 covering the source electrode 152, the drain electrode 153, and the low liquid repellent portion 134 was formed. Then, a contact hole 400 was formed in order to expose the drain electrode 153. As a result, the functional device 100, which is the organic transistor device shown in FIG. 11, was completed.

Therefore, it can be said that the organic transistor device can be manufactured in the same manner according to any of the above-described embodiments, modifications 1 to 3, and other modifications.

The functional device and the method for manufacturing the functional device of the present disclosure can be suitably used for a functional device such as an organic EL device, a quantum dot light emitting device, a color conversion filter device, an organic transistor device, and a sensor device.

1 Organic EL device 10 TFT panel 12 Anhydrous 13 Hole injection layer 14 Hole transport layer 15 Organic light emitting layer 16 Bank 18 Electron injection layer 20 Transparent cathode 22 Transparent sealing film 70 Optical 100 Functional device 110 Substrate 120 Electrode layer 121 Gate electrode Layer 122 Gate insulating layer 130 Bank 131 Surface part 132 Liquid repellent part 133 Surface of liquid repellent part 134 Low liquid repellent part 135 Surface of low liquid repellent part 136 Inside 140 First functional layer 141 Light emitting layer 141R Red light emitting layer 141G Green light emission Layer 141B Blue light emitting layer 41 Ink 41R Red light emitting ink 41G Red green light emitting ink 41B Blue light emitting ink 142 Hole injection layer 143 Hole transport layer 144 Electron injection layer 145 Organic semiconductor layer 150 Second functional layer 151 Electrode layer 152 Source electrode 153 Drain electrode 156 Sealing layer 157 Protective layer 158 Inorganic layer 210 Vacuum dryer 211 Containment unit 212 Exhaust pump 310 CF ₄ Plasma 320 O ₂ Plasma 330 Shielding mask 400 Contact hole

Claims (17)

A bank having a liquid-repellent portion and a low liquid-repellent portion having a liquid-repellent property smaller than that of the liquid-repellent portion on the surface portion,
A first functional layer located in the region defined by the bank and in contact with the liquid repellent portion,
A second functional layer that is in contact with the low liquid repellent portion and covers the first functional layer,
Functional device with. The concentration of fluorine atoms in the liquid-repellent portion is higher than the concentration of fluorine atoms in the low-liquid-repellent portion.
The functional device according to claim 1. The concentration of fluorine atoms in the liquid-repellent portion is 5 atom% or more and 10 atom% or less.
The concentration of fluorine atoms in the low liquid repellent portion is 0 atom% or more and less than 5 atom%.
The functional device according to claim 2. The concentration of silicon atoms in the liquid repellent portion is higher than the concentration of silicon atoms in the low liquid repellent portion.
The functional device according to claim 1. The concentration of silicon atoms in the liquid-repellent portion is 5 atom% or more and 10 atom% or less.
The concentration of silicon atoms in the low liquid repellent portion is 0 atom% or more and less than 5 atom%.
The functional device according to claim 4. The contact angle of the liquid-repellent portion with respect to the ink which is the material of the first functional layer is 20 degrees or more and 70 degrees or less.
The contact angle of the low liquid repellent portion with respect to the ink which is the material of the second functional layer is 0 degrees or more and 30 degrees or less.
The functional device according to any one of claims 1 to 5. The roughness of the surface of the low liquid repellent portion is larger than the roughness of the surface of the liquid repellent portion.
The functional device according to any one of claims 1 to 6. The first functional layer includes one or more layers among a light emitting layer, a hole injection layer, a hole transport layer, an electron injection layer, and an organic semiconductor layer.
The functional device according to any one of claims 1 to 7. The second functional layer comprises one or more layers of an electrode layer, a sealing layer, and a protective layer.
The functional device according to any one of claims 1 to 8. Steps to form a bank on the board,
A step of forming a first functional layer located in a region defined by the bank and in contact with a liquid repellent portion on the surface of the bank.
A step of forming a low liquid repellent portion having a relatively smaller liquid repellent property than the liquid repellent portion on a part of the surface portion.
A step of forming a second functional layer that is in contact with the low liquid repellent portion and covers the first functional layer.
A method of manufacturing a functional device. The liquid-repellent portion contains a liquid-repellent component containing a fluorine atom or a silicon atom.
The step of forming the low liquid repellent portion is a step of reducing the concentration of the liquid repellent component contained in the liquid repellent portion to generate the low liquid repellent portion from a part of the liquid repellent portion.
The method for manufacturing a functional device according to claim 10. The step of forming the low liquid repellent portion is a step of irradiating a part of the liquid repellent portion with plasma.
The method for manufacturing a functional device according to claim 11. The step of forming the low liquid repellent portion is a step of irradiating a part of the liquid repellent portion with ultraviolet light.
The method for manufacturing a functional device according to claim 11. The step of forming the bank includes a step of forming the liquid repellent portion on the surface portion.
The step of forming the low liquid repellent portion is a step of accommodating the bank and the substrate on which the first functional layer is formed in the accommodating portion, heating the bank, and reducing the degree of vacuum in the accommodating portion. Is,
The method for manufacturing a functional device according to claim 11. The step of forming the bank includes a step of forming the liquid repellent portion on the surface portion.
The step of forming the low liquid repellent portion is a step of scraping a part of the liquid repellent portion to expose the inside of the bank.
The method for manufacturing a functional device according to claim 10. The step of forming the low liquid repellent portion is a step of scraping a part of the liquid repellent portion by sandblasting.
The method for manufacturing a functional device according to claim 15. The step of forming the low liquid repellent portion is a step of scraping a part of the liquid repellent portion by mechanical polishing.
The method for manufacturing a functional device according to claim 15.

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