JP2022049917A - Electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus that can improve cooling performance.SOLUTION: According to an embodiment, an electronic apparatus comprises; a housing; an electronic component; a channel constitution part; and a fan. The housing has an accommodation space therein, is formed with a first channel through which air can flow in an outer wall part defining the contour, and is formed with a first inflow port and a first outflow port in an outer surface of the outer wall part. The channel constitution part is provided in the accommodation space and in contact with the electronic component, has therein a second channel communicating with the first channel and through which air can flow, and is formed with a second inflow port opening in the outer surface of the housing. The fan is provided in the first outflow port, allows air to flow into the first channel through the first inflow port, allows air to flow into the second channel through the second inflow port, and allows air to flow to the outside of the housing.SELECTED DRAWING: Figure 4

Description

Embodiments of the present invention relate to electronic devices.

Conventionally, in an electronic device in which an electronic component is housed in a housing, a technique of indirectly cooling an electronic component that generates heat by operation through a flow path formed in a wall portion of the housing has been known.

Japanese Unexamined Patent Publication No. 2014-150156

An object to be solved by the present invention is to provide an electric device capable of improving the cooling performance of an electronic component requiring indirect cooling.

According to the embodiment, the electrical device includes a housing, electronic components, a flow path component, and a fan. The housing has a storage space inside, a first flow path through which air can flow is formed in an outer wall portion defining an outer shell, and a first inflow port and a first inflow port and a first inflow surface are formed on the outer surface of the outer wall portion. Outlet is formed. The electronic component is provided in the accommodation space and comes into contact with the first flow path through the inner surface of the accommodation space. The flow path constituent portion is provided in the accommodation space and has a second flow path that comes into contact with the electronic component and communicates with the first flow path to allow air to flow. A second inflow port that opens to the outer surface of the housing is formed. The fan is provided at the first outlet, allows air to flow into the first flow path through the first inlet, and flows air into the second flow path through the second inlet. And let the air flow out of the housing.

The perspective view which shows the structure of the electronic device which concerns on one Embodiment. Front view showing the configuration of the electronic device. Sectional drawing which shows the main part of the electronic device. Sectional drawing which shows the main part of the electronic device. The perspective view which shows the structure of the housing body, the motherboard, the board, the heat dissipation plate, and the fan of the housing of the electronic device. The perspective view which shows the structure of the board and the heat dissipation plate. The perspective view which shows the structure which concerns on the modification of the heat dissipation plate. The front view which shows the structure which concerns on the modification of the heat dissipation plate. The cross-sectional view which shows the structure which concerns on the modification of the said housing.

The electronic device 10 according to the embodiment will be described with reference to FIGS. 1 to 6.
FIG. 1 is a perspective view showing the configuration of the electronic device 10. FIG. 2 is a front view showing the configuration of the electronic device 10. FIG. 3 is a cross-sectional view showing the configuration of the electronic device 10, and specifically, shows a state in which the electronic device 10 is cut along the line F3-F3 shown in FIG. FIG. 4 is a cross-sectional view showing the configuration of the electronic device 10, and specifically, shows a state in which the electronic device 10 is cut along the line F4-F4 shown in FIG. FIG. 5 shows a state in which the plate 22 of the housing 20 is removed from the electronic device 10, in other words, the configuration of the housing main body 21, the motherboard 50, the board 60, the heat dissipation plate 70, and the fan 80 is shown. There is. FIG. 6 is a perspective view showing the configurations of the board 60 and the heat dissipation plate 70.

As shown in FIGS. 1 to 5, the electronic device 10 includes a housing 20, a motherboard 50, a board (electronic component) 60, a heat dissipation plate (flow path component) 70, a stopper 100, and a fan 80. , Is equipped. The electronic device 10 is boarded via a first flow path 32 formed within the thickness of the outer wall portion defining the outer shell of the housing 20 and a second flow path 71 formed in the heat dissipation plate 70. Cool 60. The electronic device 10 is, for example, an electronic device including a VME standard board 60. The electronic device 10 is mounted on a moving device such as an aircraft or a vehicle.
As shown in FIG. 5, the housing 20 has an accommodation space S for accommodating the motherboard 50, the board 60, and the heat dissipation plate 70 inside. As shown in FIG. 1, the housing 20 includes, for example, a housing body 21 and a plate 22.

As shown in FIG. 5, the housing main body 21 has a detachable opening (second opening) 23, and through the detachable opening 23, the work of attaching / detaching the board 60 to / from the motherboard 50 and the housing main body 21 The heat radiating plate 70 is attached / detached to / from. By attaching the plate 22 to the housing body 21, the attachment / detachment opening 23 is closed.

The housing body 21 is configured in a rectangular parallelepiped shape, for example, and has a removable opening 23 on the front surface. The housing body 21 includes a bottom wall portion 24, an upper wall portion 25, a pair of side wall portions 26, and a rear wall portion 27, which are outer wall portions that form a part of the outer shell of the housing 20. There is. Further, the housing body 21 includes a heat sink 31 and a first flow path 32.

The heat sink 31 is integrally formed with a part of the outer wall portion of the housing body 21, and is configured to be able to contact the board 60 accommodated in the accommodation space S. The heat sink 31 is configured to be able to dissipate the heat transferred from the board 60 to the air flowing through the first flow path 32.

A plurality of heat sinks 31 are provided, and as an example, an upper heat sink 33 and a lower heat sink 34 are provided.

The upper heat sink 33 is integrally configured with, for example, the upper wall portion 25. In other words, a part of the upper wall portion 25 constitutes the upper heat sink 33. The upper heat sink 33 constitutes a part of the upper surface 28 of the accommodation space S of the housing 20. The upper heat sink 33 is formed with an upper groove portion 35 on which the board 60 or the heat dissipation plate 70 can be arranged.

The upper groove portion 35 extends in parallel from the attachment / detachment opening 23 of the housing body 21 toward the motherboard 50 in the direction in which the board 60 is inserted. Further, the plurality of upper groove portions 35 are arranged side by side in the width direction. Here, the width direction is a direction from one side wall portion 26 toward the other side wall portion 26.

As shown in FIG. 4, the upper groove portion 35 has a communication opening (first opening) 36 that is a part of the first flow path 32 and communicates with the upper flow path 41 formed in the upper wall portion 25. Is formed. The lid member 37 is detachably attached to the communication opening 36. The communication opening 36 is airtightly closed by attaching the lid member 37. In FIG. 4, the lid member 37 is shown by a two-dot chain line. The lid member 37 is detachably attached to the upper groove portion 35 by, for example, a fixing member such as a screw.
A first wall portion 35a that separates the two upper groove portions 35 is formed between the two adjacent upper groove portions 35. The first wall portion 35a is configured to extend in the front-rear direction of the housing 20.
The upper groove portion 35 configured in this way is configured, for example, by providing the upper heat sink 33 with the first wall portions 35a arranged side by side in a plurality of width directions.

As shown in FIGS. 5 and 4, the lower heat sink 34 is integrally configured with, for example, the bottom wall portion 24. In other words, a part of the bottom wall portion 24 constitutes the lower heat sink 34. The lower heat sink 34 constitutes a part of the lower surface 29 of the accommodation space S of the housing 20. The lower heat sink 34 is formed with a lower groove portion 38 into which the board 60 or the heat dissipation plate 70 can be arranged. The lower groove portion 38 extends in parallel from the attachment / detachment opening 23 of the housing body 21 toward the motherboard 50 in the direction in which the board 60 is inserted. The plurality of lower groove portions 38 are arranged side by side in the width direction.
A second wall portion 38a that separates the two lower groove portions 38 is formed between the two adjacent lower groove portions 38. The second wall portion 38a is configured to extend in the front-rear direction of the housing 20.
As an example, the lower groove portion 38 configured as described above is configured such that the lower heat sink 34 is provided with the second wall portions 38a arranged side by side in a plurality of width directions.

The first flow path 32 is configured to take in the air outside the housing 20 and discharge it to the outside of the housing 20. The first flow path 32 is provided within the thickness of the outer wall portion of the housing 20. The first flow path 32 cools the upper heat sink 33 and the lower heat sink 34 in the process of air flowing inside. In other words, the upper heat sink 33 and the lower heat sink 34 dissipate heat to the air flowing through the first flow path 32.

The first flow path 32 is, for example, an upper flow path 41 configured inside the upper wall portion 25 of the housing body 21, a lower flow path 42 configured inside the lower heat sink 34, and an upper flow path 41 and a lower flow path 42. It is provided with a connecting flow path 43 for connecting the above.

As shown in FIGS. 2, 4, and 5, the upper flow path 41 includes an upstream inlet (first inlet) 41a, an upstream outlet (first outlet) 41b, and a plurality of fins 41c. have.
The upstream inlet 41a allows air outside the housing 20 to flow into the upper flow path 41. The upstream inlet 41a is formed, for example, on the front surface of the upper wall portion 25. The upstream inlet 41a extends from the vicinity of one end to the vicinity of the other end in the width direction, for example.

The upstream outlet 41b causes the air flowing through the upper flow path 41 to flow out of the housing 20. A fan 80 is provided at the upstream outlet 41b. A plurality of upstream outlets 41b are formed, for example, and three are formed as a specific example. The plurality of upstream outlets 41b are arranged side by side in the width direction, for example, at the rear portion of the upper surface of the housing 20.

The plurality of fins 41c are arranged side by side in the width direction, for example. As shown in FIG. 4, the plurality of fins 41c are formed, for example, in the region of the upper flow path 41 formed on the upper heat sink 33. The lower ends of the plurality of fins 41c are fixed to the bottom surface of the upper flow path 41. The upper ends of the plurality of fins 41c are fixed to the upper surface of the upper flow path 41. The plurality of fins 41c are formed in parallel in the direction from the upstream inlet 41a toward the rear wall portion 27.

The lower flow path 42 has a downstream inlet 42a and a plurality of fins 42b.
The downstream inlet 42a allows air outside the housing 20 to flow into the lower flow path 42. The lower flow path 42 extends from the vicinity of one end to the vicinity of the other end in the width direction of the front surface of the bottom wall portion 24, for example.

The plurality of fins 42b are arranged side by side in the width direction and the front-rear direction so as to be separated from each other. The air in the lower flow path 42 can flow toward the connecting flow path 43 through between the plurality of fins 42b arranged side by side in the front-rear direction. The upper ends of the plurality of fins 42b are fixed to the upper surface of the lower flow path 42. The lower ends of the plurality of fins 42b are fixed to the bottom surface of the lower flow path 42.

The connecting flow path 43 is formed within the thickness of at least one of the rear wall portion 27 or the side wall portion 26. As shown in FIGS. 2 and 3, in the present embodiment, as an example, the connecting flow path 43 is formed within the thickness of one side wall portion 26. The connecting flow path 43 is formed from the lower part to the upper part of the side wall portion 26. Further, the connecting flow path 43 is open to the front surface of the side wall portion 26.

As shown in FIG. 1, the plate 22 is detachably attached to the front surface of the housing body 21. The plate 22 is detachably attached to the housing body 21 by, for example, a fixing member such as a screw. The plate 22 is a part of the outer wall portion constituting the outer shell of the housing 20. The plate 22 closes the attachment / detachment opening 23 in a state of being attached to the front surface of the housing body 21.

As shown in FIGS. 1, 2, and 3, the plate 22 includes, for example, a cover member 22b constituting a front flow path 22e between the plate body 22a and the plate body 22a, and a plurality of fins 22g. And prepare.

The plate body 22a has an outlet 22c at a portion facing the front surface of the heat dissipation plate 70 installed in the accommodation space S. In other words, the inflow port 72a, which will be described later, of the heat dissipation plate 70 opens to the outer surface of the outer wall portion of the housing 20 via the outflow port 22c. In the present embodiment, as an example, the electronic device 10 is configured to include one heat dissipation plate 70, and one outlet 22c is formed in the plate main body 22a.
Further, the plate body 22a has an outlet 22d at a portion facing the opening of the connecting flow path 43. The front flow path 22e communicates with the connecting flow path 43 through the outlet 22d and the opening on the front surface of the side wall portion 26 of the connecting flow path 43.

The plate body 22a is configured to be in contact with the front surface of the board 60 and the front surface of the heat dissipation plate 70. When the plate body 22a is fixed to the front surface of the housing body 21, the plate body 22a comes into surface contact with the front surface of the board 60 and the front surface of the plate body 22a. Then, the outlet 22c communicates with the second flow path 71 described later of the heat dissipation plate 70. Further, the outlet 22d communicates with the connecting flow path 43.

The cover member 22b forms a front flow path 22e with the plate body 22a. The cover member 22b is formed in a shape having a space forming a front flow path 22e between the cover member 22b and the plate main body 22a. The cover member 22b is formed, for example, with a concave cross section. The cover member 22b is formed with an inflow port 22f communicating with the front flow path 22e. The front flow path 22e communicates with the outlet 22c and the outlet 22d.
In the plate 22 configured in this way, the front flow path 22e is formed according to the number of heat dissipation plates 70 provided in the housing 20. In the present embodiment, the electronic device 10 is configured to include one heat dissipation plate 70 in the housing 20 as an example. Therefore, the plate 22 is provided with, for example, one front flow path 22e.
However, the plate 22 is not limited to the configuration including one front flow path 22e. For example, when the electronic device 10 is configured to include a plurality of heat dissipation plates 70, the plate 22 includes a front flow path 22e according to the plurality of heat dissipation plates 70.
When the electronic device 10 is configured to include a plurality of heat dissipation plates 70, the plate 22 has a plurality of cover members 22b and a plurality of fins for forming the front flow path 22e according to the plurality of heat dissipation plates 70. 22 g and is provided.
In the present embodiment, as an example, the front flow path 22e is formed at the end in the width direction of the plate 22, and the front flow path 22e is formed in the side wall portion 26 of the housing body 21. The connection flow path 43 is communicated with the outlet 22d formed in the plate main body 22a. When a plurality of front flow paths 22e are formed, one of the plurality of front flow paths 22e communicates with the connecting flow path 43 via the outlet 22d, and the other front flow path 22e. The flow path 22e does not communicate with the connecting flow path 43. The cover member 22b constituting the front flow path 22e that does not communicate with the connecting flow path 43 is, for example, an outflow port that flows into the front flow path 22e from the inflow port 22f and causes air that has passed through the plurality of fins 22g to flow out to the outside. Is formed.

The plurality of fins 22g are formed between the plate body 22a and the cover member 22b. The plurality of fins 22g are formed so that the air flowing in from the inflow port 22f can flow toward the outflow port 22d. Each of the plurality of fins 22g is provided apart in the vertical direction and parallel to the width direction.

The motherboard 50 is arranged in the vicinity of the rear wall portion 27 in the accommodation space S of the housing body 21, for example. In FIG. 4, the motherboard 50 is omitted. A board 60 is connected to the motherboard 50.

The board 60 is an example of an electronic component included in the electronic device 10. The board 60 has, for example, a substrate, a plurality of electronic components mounted on the substrate, and a housing for covering the substrate and the plurality of electronic components, and the appearance is formed in a plate shape. Both main surfaces of the board 60 are formed, for example, in a plane orthogonal to the width direction. Both main surfaces of the board 60 are surfaces facing the width direction of the housing 20 in a state where the board 60 is installed in the housing 20, and are surfaces that come into contact with the heat dissipation plate 70. A slide portion 61 inserted into the upper groove portion 35 or the lower groove portion 38 is provided at the upper end portion and the lower end portion of the board 60, respectively.

The slide portion 61 is movably supported with respect to the upper groove portion 35 or the lower groove portion 38. The slide portion 61 formed at the upper end portion of the board 60 is formed in a shape that is movably fitted into the upper groove portion 35, for example. The slide portion 61 formed at the lower end portion of the board 60 is formed, for example, in a shape that is movably fitted into the lower groove portion 38.
The board 60 is inserted through the attachment / detachment opening 23 of the housing body 21. The slide portion 61 formed at the upper end portion is inserted into the upper groove portion 35, and the slide portion 61 formed at the lower end portion is inserted into the lower groove portion 38. The board 60 is moved toward the motherboard 50 along the upper groove portion 35 and the lower groove portion 38 and is connected to the motherboard 50.

The slide portion 61 is configured to be able to transfer the heat of the board 60 to the upper heat sink 33 and the lower heat sink 34. One or a plurality of boards 60 configured in this way may be used depending on the function of the electronic device 10.

The heat dissipation plate 70 is an example of a flow path component provided in the accommodation space S of the housing 20. The heat dissipation plate 70 is configured to be removable from the housing 20. The heat radiating plate 70 is in surface contact with the main surface of the board 60, and the heat of the board 60 is transferred. Further, the heat dissipation plate 70 is provided with a second flow path 71 inside, and is configured to be able to dissipate heat to the air flowing through the second flow path 71.

As shown in FIGS. 4 and 6, the heat dissipation plate 70 includes, for example, a plate main body 72, an upper slide portion 73, a plurality of fins 74 provided in the plate main body 72, and a lower slide portion 77. There is.

The plate body 72 is formed, for example, in the shape of a rectangular plate. A main body flow path 78, which is a part of the second flow path 71, is formed in the plate main body 72. Further, the plate body 72 has an inflow port 72a that opens in the front surface of the plate body 72. The inflow port 72a is formed in a region on the front surface of the plate body 72, for example, in the vertical direction from the center position to the vicinity of the lower end.
The inflow port 72a communicates with the outflow port 22c of the plate 22 of the housing 20 in a state where the heat dissipation plate 70 is installed in the housing 20, that is, in a state where the heat dissipation plate 70 is installed in the upper groove portion 35 and the lower groove portion 38. The front surface of the plate body 72 comes into surface contact with the rear surface of the plate 22 of the housing 20, so that the edge of the opening of the inflow port 72a is hermetically sealed by the rear surface of the plate 22.
The opening area of the inflow port 72a is, for example, smaller than the opening area of the outflow port 22c of the plate 22. The opening edge of the inlet 72a is arranged inside the opening edge of the outlet 22c of the plate 22.

The main body flow path 78 is configured to pass in the vicinity of the lower heat sink 34 on the secondary side of the inflow port 72a, and further pass in the vicinity of the upper heat sink 33 on the secondary side. Specifically, the main body flow path 78 has a first portion 78a extending from the inflow port 72a toward the rear end side of the plate main body 72, and a second portion extending from the rear end of the first portion 78a toward the upper slide portion 73. It has a portion 78b of 2. As described above, the main body flow path 78 is formed in an L shape in a side view by the first portion 78a and the second portion 78b.

As shown in FIGS. 5 and 6, a heat radiating sheet 76 is provided on the main surface of the plate body 72 facing the main surface of the board 60. The heat radiating sheet 76 comes into surface contact with the board 60. The heat radiating sheet 76 transfers the heat of the board 60 to the plate body 72.

The upper slide portion 73 is formed on the upper part of the plate body 72. The upper slide portion 73 is slidably supported by the upper groove portion 35. The upper slide portion 73 is formed in a unidirectionally long shape along the upper end of the plate body 72. The upper slide portion 73 is formed, for example, in a shape that is movably fitted in the upper groove portion 35.

As shown in FIG. 4, an upper slide portion flow path 75 constituting another portion of the second flow path 71 is formed in the upper slide portion 73. The flow path 75 for the upper slide portion has an outlet 75a that opens on the upper surface of the upper slide portion 73. The outlet 75a faces the communication opening 36. The upper slide portion flow path 75 communicates with the upper flow path 41 through the communication opening 36. In the state where the heat dissipation plate 70 is installed on the upper slide portion 73, the upper slide portion 73 and the upper groove portion 35 come into surface contact with each other, so that the edge portion of the communication opening 36 and the edge portion of the outlet 75a are airtight. Be sealed. Therefore, leakage of air into the accommodation space S through the outlet 75a and the communication opening 36 is prevented.

The plurality of fins 74 are formed in the main body flow path 78. The plurality of fins 74 are configured to allow the air flowing in from the inflow port 72a to flow to the outflow port 75a. Further, the plurality of fins 74 are formed in a shape capable of smoothly flowing the air flowing in from the inflow port 72a toward the outflow port 75a, for example. The plurality of fins 74 are formed, for example, in the vertical direction of the second portion 78b in the central portion and parallel to the second portion 78b. Here, the fact that the plurality of fins 74 are formed parallel to the second portion 78b means that both main surfaces of the plurality of fins 74 are arranged apart from each other in a posture parallel to the second portion 78b. Is Rukoto. In this embodiment, the second portion 78b is inclined with respect to the height direction of the heat dissipation plate 70, for example. Therefore, in the present embodiment, the plurality of fins 74 are arranged along a direction inclined with respect to the height direction of the heat radiating plate 70, as an example.

The lower slide portion 77 is formed in the lower part of the plate body 72. The lower slide portion 77 is slidably supported by the lower groove portion 38. The lower slide portion 77 is formed in a long shape in one direction along the lower end of the plate body 72. The lower slide portion 77 is formed so as to be movably fitted into the lower groove portion 38, for example.
The stopper 100 is configured to be able to prevent the heat dissipation plate 70 from moving beyond a predetermined position. Here, the predetermined position means that the front surface of the heat dissipation plate 70 is in surface contact with the rear surface of the plate 22, the inflow port 72a communicates with the outlet 22c of the plate 22, and the outlet 75a communicates with the communication opening 36. The position.
The stopper 100 is configured in, for example, the heat dissipation plate 70, and by contacting the front ends of both the first wall portion 35a and the second wall portion 38a, the heat dissipation plate 70 is attached to the upper groove portion 35 and the lower groove portion 38. On the other hand, it is restricted to move beyond a predetermined position.
In this embodiment, a gap is provided between the front end of the housing body 21 and the first wall portion 35a where the stopper 100 can be placed. A gap into which the stopper 100 can be placed is provided between the front end of the housing body 21 and the second wall portion 38a.
The stopper 100 includes, for example, an upper stopper 101 and a lower stopper 102. The upper stopper 101 is configured to be able to come into contact with the front end of the first wall portion 35a adjacent to the upper groove portion 35 in which the heat dissipation plate 70 is installed. The upper stopper 101 is provided on at least one upper portion of both main surfaces of the heat radiating plate 70. The upper stopper 101 is provided, for example, at the front end portion of the upper end portion of one main surface of the heat dissipation plate 70.
The thickness of the upper stopper 101 has, for example, a dimension equal to or less than the distance from the edge of the attachment / detachment opening 23 of the housing body 21 to the front end of the first wall portion 35a. In the present embodiment, the thickness of the upper stopper 101 has the same dimension as the distance from the edge of the attachment / detachment opening 23 to the front end of the first wall portion 35a. Therefore, the upper stopper 101 is sandwiched between the first wall portion 35a and the plate 22.
The lower stopper 102 is configured to be able to come into contact with the front end of the second wall portion 38a adjacent to the lower groove portion 38 in which the heat dissipation plate 70 is installed. The lower stopper 102 is provided at the lower part of at least one of both main surfaces of the heat radiating plate 70. The lower stopper 102 is provided, for example, at the front end portion of the lower end portion of one main surface of the heat dissipation plate 70.
The thickness of the lower stopper 102 has, for example, a dimension equal to or less than the distance from the edge of the attachment / detachment opening 23 of the housing body 21 to the front end of the second wall portion 38a. In the present embodiment, the thickness of the lower stopper 102 has the same dimension as the distance from the edge of the attachment / detachment opening 23 to the front end of the second wall portion 38a. Therefore, the lower stopper 102 is sandwiched between the second wall portion 38a and the plate 22.

One or more fans 80 are provided. In the present embodiment, a plurality of fans 80 are provided, and as a specific example, three fans 80 are provided. The fan 80 is provided, for example, at the upstream outlet 41b formed on the upper surface of the housing body 21. The fan 80 communicates with the upper flow path 41.

Next, an example of the work of installing the board 60 and the heat dissipation plate 70 in the accommodation space S of the housing 20 will be described.

As shown in FIG. 5, the board 60 is installed in the accommodation space S through the attachment / detachment opening 23. The slide portion 61 formed at the upper end portion of the board 60 is inserted into the upper groove portion 35 arranged in the front-rear direction with the connector to which the board 60 of the motherboard 50 is connected. The slide portion 61 formed at the lower end portion of the board 60 is inserted into the lower groove portion 38 arranged in the front-rear direction with the connector to which the board 60 of the motherboard 50 is connected.

When the slide portion 61 formed at the upper end portion of the board 60 is inserted into the upper groove portion 35 and the slide portion 61 formed at the lower end portion is inserted into the lower groove portion 38, the board 60 is moved toward the motherboard 50 and is moved toward the motherboard 50. Connected to.

Part of the heat of the board 60 is transferred to the upper heat sink 33 from the slide portion 61 formed at the upper end portion. Further, a part of the heat of the board 60 is transferred from the slide portion 61 formed at the lower end portion to the lower heat sink 34. Further, a part of the heat of the board 60 is transferred to the heat dissipation plate 70 arranged adjacent to the board 60.

The heat radiating plate 70 is installed in the accommodation space S through the attachment / detachment opening 23. The heat dissipation plate 70 is supported by the upper groove portion 35 adjacent to the upper groove portion 35 supporting the slide portion 61 of the board 60 and the lower groove portion 38 adjacent to the lower groove portion 38 supporting the slide portion 61 of the board 60.

In the heat radiating plate 70, the upper slide portion 73 is inserted into the upper groove portion 35, and the lower slide portion 77 is inserted into the lower groove portion 38. Then, in the heat radiating plate 70, the upper stopper 101 abuts on the front end of the first wall portion 35a along the upper slide portion 73 and the lower slide portion 77, and the lower stopper 102 abuts on the front end of the second wall portion 38a. It is pushed toward the motherboard 50 side of the accommodation space S until it comes into contact with. When the upper stopper 101 abuts on the front end of the first wall portion 35a and the lower stopper 102 abuts on the front end of the second wall portion 38a, the heat radiating plate 70 completes its movement to a predetermined position. The movement is stopped. When the heat radiating plate 70 is in a predetermined position, the front surface of the heat radiating plate 70 is arranged in the same manner as the front surface of the housing body 21.

When the heat radiating plate 70 is pushed in until the upper stopper 101 abuts on the front end of the first wall portion 35a and the lower stopper 102 abuts on the front end of the second wall portion 38a, the second flow path of the radiating plate 70 The outlet 75a of the upper slide portion flow path 75 of 71 faces the communication opening 36. As a result, the second flow path 71 and the upper flow path 41 communicate with each other through the outlet 75a and the communication opening 36.

The heat dissipation plate 70 contacts the main surface of the board 60 in a state where the upper stopper 101 abuts on the front end of the first wall portion 35a and the lower stopper 102 abuts on the front end of the second wall portion 38a. Will be done. Heat is transferred from the board 60 to the heat dissipation plate 70. Of the plurality of upper groove portions 35, the lid member 37 is not provided in the upper groove portion 35 that supports the upper slide portion 73 of the heat dissipation plate 70. Of the plurality of upper groove portions 35, a lid member 37 is provided in the communication opening 36 of the upper groove portion 35 other than the upper groove portion 35 that supports the upper slide portion 73 of the heat dissipation plate 70, and the communication opening 36 is airtightly sealed. Will be done.

The heat radiating plate 70 dissipates heat transferred from the adjacent board 60 to the upper heat sink 33 via the upper slide portion 73. Further, the heat transferred from the adjacent board 60 is dissipated to the lower heat sink 34 via the lower slide portion 77.

When the board 60 and the heat dissipation plate 70 are installed in the accommodation space S in this way, the plate 22 is fixed to the front surface of the housing body 21. By fixing the plate 22, the front surface of the board 60 comes into surface contact with the inner surface of the plate 22 facing the accommodation space S, and the front surface of the heat dissipation plate 70 comes into surface contact. Then, the inflow port 72a of the heat dissipation plate 70 communicates with the outflow port 22c of the plate 22.

Next, the air flow in the first flow path 32 of the electronic device 10 and the air flow in the second flow path 71 will be described.

First, the flow of air in the first flow path 32 will be described. As shown in FIG. 5, when a plurality of fans 80 are driven, air flows into the upper flow path 41 from the upstream inlet 41a of the upper flow path 41 of the first flow path 32 as shown by an arrow. The air that has flowed into the upper flow path 41 flows to the plurality of upstream outlets 41b. The air flowing in the upper flow path 41 cools the upper heat sink 33 before reaching the upstream outlet 41b. The air that has reached the upstream outlet 41b is discharged to the outside of the housing 20 via the plurality of fans 80.

Further, when a plurality of fans 80 are driven, air flows into the lower flow path 42 from the downstream inlet 42a of the lower flow path 42 of the first flow path 32, as shown by an arrow. The air that has flowed into the lower flow path 42 flows through the lower flow path 42 toward the side wall portion 26 on which the connecting flow path 43 is formed, and flows into the connecting flow path 43. The air flowing in the lower flow path 42 cools the lower heat sink 34 until it flows into the connecting flow path 43. The air that has flowed into the connecting flow path 43 flows upward in the connecting flow path 43, flows into the upper flow path 41, and is discharged to the outside of the housing 20 by the plurality of fans 80.

Further, when a plurality of fans 80 are driven, they flow into the front flow path 22e from the inflow port 22f as shown by arrows in FIG. A part of the air flowing into the front flow path 22e flows through the front flow path 22e and enters the connecting flow path 43 through the outlet 22d and the opening on the front surface of the side wall portion 26 of the connecting flow path 43. And flows out of the housing 20 via the upper flow path 41 and the plurality of fans 80. The air flowing through the front flow path 22e cools the plate body 22a of the plate 22 until it reaches the connecting flow path 43.

Next, the flow of air in the second flow path 71 will be described. As shown by arrows in FIG. 4, when a plurality of fans 80 are driven, the second flow path 71 is passed through the inflow port 22f of the cover member 22b, the outflow port 22c of the plate body 22a, and the inflow port 72a. Air flows in.

The air that has flowed into the second flow path 71 flows through the main body flow path 78 in the order of the first portion 78a and the second portion 78b. The air flowing through the first portion 78a cools the lower heat sink 34. The air flowing through the second portion 78b cools the upper heat sink 33.

The air that has flowed through the main body flow path 78 flows into the upper flow path 41 via the upper slide portion flow path 75 and the outflow port 75a, and is discharged to the outside of the housing 20 by the plurality of fans 80.

In the electronic device 10 configured in this way, the first flow path 32 is formed in the outer wall portion of the housing 20, and the board 60 comes into contact with the inner surface defining the storage space S in the housing 20, and further accommodates the board 60. A heat dissipation plate 70 having a second flow path 71 is provided in the space S. Then, the heat dissipation plate 70 is in contact with the board 60.

As described above, the electronic device 10 can indirectly cool the board 60 and can form a flow path for cooling the board 60 in the housing 20 in addition to the first flow path 32. It is possible to form many channels for cooling the board 60. As a result, the cooling performance of the board 60 can be improved in the device that requires indirect cooling of the electronic device 10 such as an aircraft or a vehicle.

Further, by providing the heat dissipation plate 70 according to the board 60, it is possible to obtain the cooling performance according to the electronic device 10. For example, when a plurality of boards 60 are used, by providing the same number of heat dissipation plates 70 as the boards 60, cooling performance corresponding to the electronic device 10 having the plurality of boards 60 can be obtained.

Further, the heat dissipation plate 70 is configured to be removable from the housing body 21. Therefore, when manufacturing a plurality of electronic devices 10, it is not necessary to manufacture a housing 20 in which the heat radiating plate 70 is fixed for each electronic device 10, and it is sufficient to attach the heat radiating plates 70 according to the number of boards 60. .. Therefore, the manufacturing efficiency of the electronic device 10 can be improved.

Further, the board 60 and the heat radiating plate 70 are formed in a plate shape, and an upper groove portion 35 and a lower groove portion 38 that slidably support the board 60 and the heat radiating plate 70 are provided in the housing main body 21. Therefore, the efficiency of the work of installing the board 60 and the heat radiating plate 70 in the accommodation space S can be improved.

Further, the housing body 21 includes an upper heat sink 33 and a lower heat sink 34, a part of the first flow path 32 is formed in the upper heat sink 33 and the lower heat sink 34, and the upper groove portion 35 and the lower groove portion 38 are formed in the upper heat sink. It is formed on the 33 and the lower heat sink 34. Therefore, the heat of the heat radiating plate 70 can be efficiently radiated to the outside of the housing 20 via the upper heat sink 33 and the lower heat sink 34.

Further, since the heat radiating plate 70 includes the heat radiating sheet 76, the heat of the board 60 can be efficiently transferred to the heat radiating plate 70.

As described above, according to the electronic device 10 of the present embodiment, the cooling performance of the board 60 of the electronic device 10 that requires indirect cooling can be improved by providing the heat dissipation plate 70 having the second flow path 71 inside.

In the above example, the structure in which the inflow port 72a of the second flow path 71 of the heat dissipation plate 70 has a predetermined constant opening area has been described as an example, but the present invention is not limited to this. In another example, the inlet of the second flow path 71 may be configured so that the opening area can be changed according to the cooling performance required for the board 60.

An example of a configuration in which the opening area of the inflow port of the second flow path 71 can be changed will be described with reference to FIG. 7. As shown in FIG. 7, the heat dissipation plate 70 may include, for example, an attachment 90. The attachment 90 is detachably attached to the front surface of the plate body 72. The attachment 90 is attached to the plate body 72 by a fixing member such as a screw. The attachment 90 includes an opening 91. The opening 91 has an opening area smaller than the opening area of the inflow port 72a.

The opening 91 faces the inflow port 72a when the attachment 90 is attached to the plate body 72. When the attachment 90 is attached, air flows into the second flow path 71 through the opening 91. That is, the opening 91 functions as an inflow port of the second flow path 71.

In this way, by using the attachment 90 having an opening 91 having an opening area smaller than that of the inflow port 72a, it is possible to change the opening area of the inflow port of the second flow path 71. Alternatively, the attachment 90 may be configured to block a part of the inflow port 72a.

As described above, when the opening area of the inflow port of the second flow path 71 is changed according to the board 60 by the attachment 90, the opening area of the inflow port 72a formed in the plate body 72 is assumed to be used. It is determined according to the board 60 that requires the highest cooling performance among the 60, and the attachment 90 may be used for the other boards 60.

Alternatively, as another example, as shown in FIG. 8, the heat dissipation plate 70 may be provided with a shutter 93 in which the opening area of the inflow port 72a can be adjusted. By operating the shutter 93, it is possible to adjust the opening area of the inflow port 72a.

Further, in the above-mentioned example, the configuration in which the electronic device 10 includes one board 60 has been described as an example, but the present invention is not limited to this. In another example, the electronic device 10 may use a plurality of boards 60. In the case of this configuration, the heat radiating plate 70 is used according to the number of the boards 60 requiring cooling by the heat radiating plate 70 among the plurality of boards 60. Further, in the case of this configuration, an opening communicating with the inflow port 72a is formed in the portion of the plate body 22a of the plate 22 facing the inflow port 72a of the heat dissipation plate 70. The inflow port 72a opens to the outer surface of the outer wall portion of the housing 20 through this opening, and allows outside air to flow in.

Further, in the above example, the configuration in which the board 60 is used as an example of the electronic components cooled by the heat radiating plate 70 has been described, but the electronic components cooled by the heat radiating plate 70 are not limited to the board 60. do not have.

Further, in the above example, the configuration in which the board 60 is in direct contact with the portion of the outer wall portion of the housing 20 in which the first flow path 32 is formed within the thickness has been described as an example. Specifically, the board 60 was in contact with the upper heat sink 33 in which the upper flow path 41 was formed inside, and was in contact with the lower heat sink 34 in which the lower flow path 42 was formed inside. However, the board 60 is not limited to the configuration in which the outer wall portion of the housing 20 is in direct contact with the portion where the first flow path 32 is formed within the thickness. In another example, the board 60 is configured to indirectly contact a portion of the outer wall portion of the housing 20 where the first flow path 32 is formed within the thickness via a member capable of conducting heat. There may be.
Further, in the above example, the configuration in which the stopper 100 for preventing the heat radiating plate 70 from moving beyond a predetermined position is provided on the heat radiating plate 70 has been described as an example, but the present invention is not limited to this. In another example, the stopper 100 may be provided on the housing 20. As an example of the configuration in which the stopper 100 is provided in the housing 20, the stopper 100 may be provided in at least one of the upper groove portion 35 and the lower groove portion 38 as in the modified example shown in FIG. In the configuration shown in FIG. 9, as an example, the upper stopper 101 of the stopper 100 is provided, for example, on the inner side of the upper groove portion 35. The lower stopper 102 of the stopper 100 is provided, for example, on the inner side of the lower groove portion 38.

According to at least one embodiment described above, the cooling performance of the board 60 of the electronic device 10 can be improved by providing the heat dissipation plate 70.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

10 ... Electronic device, 20 ... Housing, 21 ... Housing body, 22 ... Plate, 23 ... Detachable opening (second opening), 24 ... Bottom wall, 25 ... Upper wall, 26 ... Side wall, 27 ... rear wall portion, 31 ... heat sink, 32 ... first flow path, 33 ... upper heat sink, 34 ... lower heat sink, 35 ... upper groove portion, 36 ... communication opening (first opening), 36 ... communication opening, 37 ... lid member, 38 ... lower groove, 41 ... upper flow path, 41a ... upstream inlet (first inflow port), 41b ... upstream outlet (first outflow port), 41c ... fin, 42 ... lower flow path, 42a ... Downstream inlet, 42b ... fins, 43 ... connecting flow path, 50 ... motherboard, 60 ... board (electronic component), 61 ... slide part, 70 ... heat dissipation plate (flow path component part), 71 ... second flow path, 72 ... plate body, 72a ... inlet, 73 ... upper slide, 74 ... fins, 75 ... upper slide flow path, 75a ... outlet, 76 ... heat sink, 77 ... lower slide, 78 ... main body flow path , 78a ... 1st part, 78b ... 2nd part, 80 ... fan, 90 ... attachment, 91 ... opening, 93 ... shutter, S ... accommodation space.

Claims (5)

A first flow path through which air can flow is formed in an outer wall portion having an accommodation space inside and defining an outer shell, and a first inflow port and a first outflow port are formed on the outer surface of the outer wall portion. With the housing to be
Electronic components provided in the accommodation space and in contact with the first flow path through the inner surface of the accommodation space, and
A second flow path provided in the accommodation space, which comes into contact with the electronic component and communicates with the first flow path to allow air to flow, is provided on the outer surface of the housing. A flow path component in which a second inflow port to be opened is formed,
Provided at the first outlet, air is allowed to flow into the first flow path through the first inlet, air is allowed to flow into the second flow path through the second inlet, and the air is allowed to flow into the second flow path. A fan that allows air to flow out of the housing,
Electronic equipment equipped with. A first opening communicating with the first flow path is formed on the inner surface.
The flow path component is detachably provided in the housing, and the second flow path communicates with the first flow path through the first opening in a state of being attached to the housing. death,
The housing comprises a removable lid member that opens and closes the first opening.
The electronic device according to claim 1. The flow path component and the electronic component are each configured in a plate shape.
The housing has a second opening for moving the electronic component and the flow path component in and out of the accommodation space.
A plurality of grooves are formed on the inner surface to slidably support the electronic component and the flow path constituent portion in one direction from the second opening toward the inside of the accommodation space.
The flow path component is supported by the groove portion adjacent to the groove portion that supports the electronic component among the plurality of the groove portions.
The electronic device according to claim 1. The outer wall portion includes a heat sink with which the electronic component comes into contact.
The first flow path is provided in the heat sink.
The groove is provided in the heat sink.
The electronic device according to claim 3. The electronic device according to claim 3, wherein the flow path component includes a heat radiating sheet provided on a surface facing the electronic component and in contact with the electronic component.

Images