JP2022043698A - Substrate processing method, storage medium, and substrate processing apparatus - Google Patents

Abstract

To suppress film thickness variation between substrates.SOLUTION: A substrate processing method includes performing liquid processing including supplying a processing liquid to the surface of a substrate held at a predetermined processing position using a liquid processing unit that holds the substrate at the predetermined position and supplies the processing liquid to the surface of the substrate and holding the substrate so that a film of the treatment solution is formed on the surface of the substrate after the supply of the treatment solution and performing temperature control processing for adjusting the temperature of a member of the liquid processing unit that affects the temperature of the substrate during the execution of the liquid processing before the liquid processing.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a substrate processing method, a storage medium and a substrate processing apparatus.

Patent Document 1 discloses a treatment method characterized in that when a treatment liquid is applied to a treatment body to be treated, the treatment body is provided with a temperature distribution.

Japanese Unexamined Patent Publication No. 5-36597

The present disclosure provides a substrate processing method, a storage medium, and a substrate processing apparatus capable of suppressing a film thickness variation between substrates.

The substrate processing method according to one aspect of the present disclosure uses a liquid treatment unit that holds the substrate at a predetermined treatment position and supplies the treatment liquid to the surface of the substrate, and the surface of the substrate held at the treatment position. The liquid treatment including supplying the treatment liquid to the substrate and holding the substrate so that a film of the treatment liquid is formed on the surface of the substrate after the supply of the treatment liquid, and the liquid treatment unit Among them, a temperature control process for adjusting the temperature of a member that affects the temperature of the substrate at the time of executing the liquid treatment is performed before the liquid treatment.

According to the present disclosure, a substrate processing method, a storage medium, and a substrate processing apparatus capable of suppressing a variation in film thickness between substrates are provided.

FIG. 1 is a perspective view schematically showing an example of a substrate processing system according to the first embodiment. FIG. 2 is a side view schematically showing an example of a coating and developing apparatus. FIG. 3 is a schematic diagram showing an example of a liquid treatment unit. FIG. 4 is a block diagram showing an example of the hardware configuration of the control device. FIG. 5 is a flowchart showing an example of the substrate processing method. FIG. 6 is a flowchart showing an example of liquid treatment. FIG. 7 is a flowchart showing an example of temperature control processing. FIG. 8 is a graph showing an example of the measurement result of the film thickness variation according to the comparative example. FIG. 9 is a graph showing an example of the measurement result of the film thickness variation according to the first embodiment. FIG. 10 is a schematic diagram showing an example of the liquid treatment unit according to the second embodiment. FIG. 11 is a flowchart showing an example of the substrate processing method. FIG. 12 is a flowchart showing an example of temperature control processing. FIG. 13A is a graph showing an example of the measurement result of the film thickness variation according to the comparative example. 13 (b) and 13 (c) are graphs showing an example of the measurement result of the film thickness variation according to the second embodiment. FIG. 14 is a schematic view showing an example of the liquid treatment unit according to the third embodiment. FIG. 15 is a flowchart showing an example of the substrate processing method. FIG. 16 is a flowchart showing an example of temperature control processing. FIG. 17 is a graph showing an example of a temperature change of the inner cup. FIG. 18 is a flowchart showing an example of the substrate processing method. FIG. 19A is a graph showing an example of the measurement result of the film thickness variation according to the comparative example. FIG. 19B is a graph showing an example of the measurement result of the film thickness variation according to the third embodiment.

Hereinafter, various exemplary embodiments will be described.

The substrate processing method according to one exemplary embodiment is to use a liquid processing unit that holds the substrate at a predetermined processing position and supplies the processing liquid to the surface of the substrate, and the substrate is held at the processing position. Liquid treatment including supplying the treatment liquid to the surface and holding the substrate so that a film of the treatment liquid is formed on the surface of the substrate after the supply of the treatment liquid, and the liquid treatment unit. Among these, a temperature control process for adjusting the temperature of a member that affects the temperature of the substrate at the time of executing the liquid treatment is performed before the liquid treatment.

In the liquid treatment using the treatment liquid, a part of the liquid contained in the treatment liquid evaporates as the film is formed after the treatment liquid is supplied, and the temperature around the treatment position may decrease due to the heat of vaporization. Therefore, when the liquid treatment is repeatedly performed, the temperature conditions around the treatment position may vary depending on the liquid treatment, and the film thickness of the coating film may vary. On the other hand, in the substrate processing method, the liquid treatment can be performed in a state where the temperature variation around the processing position is reduced by the temperature control processing for adjusting the temperature of the member that affects the temperature of the substrate. Therefore, it is possible to suppress the fluctuation in the film thickness between the substrates.

The treatment conditions in the temperature control treatment may be set according to the start timing of the liquid treatment. Depending on the start timing of the liquid treatment, the temperature around the treatment position may fluctuate. Therefore, by setting the treatment conditions for the temperature control treatment according to the start timing of the liquid treatment, it is possible to appropriately adjust the ambient temperature of the treatment position at the start of the liquid treatment.

The member may include a holding portion that supports the back surface of the substrate so as to hold the substrate at the processing position. The temperature control process may include cooling the holding portion by supplying the first fluid to the holding portion. In this case, the holding portion that affects the temperature of the substrate is cooled before the liquid treatment is performed, and the degree to which the ambient temperature of the processing position drops with the execution of the liquid treatment becomes small. Therefore, it is possible to reduce the variation in temperature around the treatment position for each liquid treatment and suppress the variation in the film thickness between the substrates.

To supply the treatment liquid to the surface of the substrate, the treatment liquid is supplied to the surface of the substrate while the holding portion supporting the substrate is rotated by the rotation holding portion connected to the holding portion. May include doing. Supplying the first fluid to the holding portion may include supplying the first fluid to the central portion of the holding portion. The central portion of the holding portion is located near the driving portion for rotating the holding portion, and the heat capacity of the central portion tends to be larger than that of the other portions. Therefore, by cooling the central portion of the holding portion, it is possible to increase the degree of temperature control by the temperature control process.

The member may include an inner cup arranged in a state close to the outer peripheral portion of the back surface of the substrate among the accommodating portions surrounding the substrate held at the processing position. The temperature control treatment may include cooling the inner cup by supplying a second fluid to the inner cup. In this case, the inner cup, which affects the temperature of the substrate, is cooled before the liquid treatment is performed, and the degree to which the ambient temperature of the treatment position drops with the execution of the liquid treatment becomes small. Therefore, the variation in temperature around the processing position for each liquid treatment is reduced, and it is possible to suppress the variation in the film thickness between the substrates.

Cooling the inner cup by supplying the second fluid to the inner cup means supplying the solvent to the inner cup and maintaining the state where the solvent is not supplied to the inner cup after the solvent is supplied. It may be included. In this case, since the cooling of the inner cup proceeds by the heat of vaporization of the solvent after being supplied to the inner cup, it is possible to cool the inner cup while suppressing the amount of the solvent used.

In the substrate processing method, the liquid treatment may be started within a predetermined time after the inner cup is cooled to the target temperature by supplying the second fluid to the inner cup. In this case, it is possible to start the liquid treatment in a state where the ambient temperature of the treatment position is lowered.

In the above-mentioned substrate processing method, after the liquid treatment, the substrate is unloaded from the processing position, and the inner is between the time when the supply of the processing liquid to the surface of the substrate is completed and the time when the substrate is unloaded from the processing position. It may further include supplying a second fluid to the cup. In this case, it is possible to suppress variations in the temperature of the inner cup after the liquid treatment for each liquid treatment.

The member may include a holding portion that supports the back surface of the substrate so as to hold the substrate at the processing position. Supplying the treatment liquid to the surface of the substrate may include supplying the treatment liquid to the surface of the substrate while rotating the holding portion in a state of supporting the substrate. The temperature control process may include raising the temperature of the holding portion by rotating the holding portion in a state where the holding portion does not support the substrate. In this case, it is possible to suppress that the temperature of the holding portion, which affects the temperature of the substrate, rises before the liquid treatment is performed, and the ambient temperature of the treatment position decreases with the execution of the liquid treatment. Therefore, the temperature variation around the treatment position for each liquid treatment is reduced, and the film thickness variation between the substrates can be suppressed.

The storage medium according to one exemplary embodiment is a computer-readable storage medium that stores a program for causing the apparatus to execute the above-mentioned substrate processing method.

The substrate processing apparatus according to one exemplary embodiment includes a liquid treatment unit that holds the substrate at a predetermined processing position and supplies the treatment liquid to the surface of the substrate, and a control unit that controls the liquid treatment unit. .. The control unit supplies the treatment liquid to the surface of the substrate held at the processing position, and holds the substrate so that a film of the treatment liquid is formed on the surface of the substrate after the treatment liquid is supplied. Have the liquid treatment unit execute the liquid treatment including. The control unit causes the liquid treatment unit to perform a temperature control process for adjusting the temperature of a member of the liquid treatment units that affects the temperature of the substrate at the time of executing the liquid treatment before the liquid treatment. In this substrate processing apparatus, it is possible to suppress the film thickness fluctuation between the substrates in the same manner as the above-mentioned substrate processing method.

Hereinafter, embodiments will be described with reference to the drawings. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted.

[First Embodiment]
First, as an example of a system including a substrate processing apparatus, the substrate processing system 1 according to the first embodiment will be described with reference to FIGS. 1 to 7. The substrate processing system 1 shown in FIG. 1 is a system for forming a photosensitive film, exposing the photosensitive film, and developing the photosensitive film on the work W. The work W to be processed is, for example, a substrate or a substrate in which a film, a circuit, or the like is formed by being subjected to a predetermined treatment. The substrate included in the work W is, for example, a wafer containing silicon. The work W (substrate) may be formed in a circular shape. The work W to be processed may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like, or may be an intermediate obtained by subjecting these substrates or the like to a predetermined treatment. The photosensitive film is, for example, a resist film.

The substrate processing system 1 includes a coating / developing device 2 and an exposure device 3. The coating / developing apparatus 2 applies a resist (chemical solution) to the surface of the work W to form a resist film before the exposure process by the exposure apparatus 3, and develops the resist film after the exposure process. The exposure apparatus 3 is an apparatus for exposing a resist film (photosensitive film) formed on the work W (substrate). Specifically, the exposure apparatus 3 irradiates the exposed portion of the resist film with energy rays by a method such as immersion exposure.

Hereinafter, the configuration of the coating / developing device 2 will be described as an example of the substrate processing device. As shown in FIGS. 1 and 2, the coating / developing device 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100 (control unit).

The carrier block 4 introduces the work W into the coating / developing device 2 and derives the work W from the coating / developing device 2. For example, the carrier block 4 can support a plurality of carriers C for the work W, and has a built-in transfer device A1 including a transfer arm. The carrier C accommodates, for example, a plurality of circular workpieces W. The transport device A1 takes out the work W from the carrier C, passes it to the processing block 5, receives the work W from the processing block 5, and returns it to the carrier C. The processing block 5 has processing modules 11, 12, 13, and 14.

The processing module 11 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 for transporting the work W to these units. The treatment module 11 forms an underlayer film on the surface of the work W by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 applies a treatment liquid for forming an underlayer film onto the work W. The heat treatment unit U2 performs various heat treatments accompanying the formation of the underlayer film.

The processing module 12 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 for transporting the work W to these units. The treatment module 12 forms a resist film on the lower layer film by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 forms a film of the treatment liquid on the surface of the work W by applying the treatment liquid for forming the resist film on the lower layer film. The heat treatment unit U2 performs various heat treatments accompanying the formation of the resist film.

The processing module 13 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 for transporting the work W to these units. The treatment module 13 forms an upper layer film on the resist film by the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 applies a treatment liquid for forming an upper layer film onto the resist film. The heat treatment unit U2 performs various heat treatments accompanying the formation of the upper layer film.

The processing module 14 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 for transporting the work W to these units. The processing module 14 uses the liquid treatment unit U1 and the heat treatment unit U2 to develop the exposed resist film and perform heat treatment associated with the development treatment. The liquid treatment unit U1 develops a resist film by applying a developing solution on the surface of the exposed work W and then rinsing it with a rinsing solution. The heat treatment unit U2 performs various heat treatments associated with the development process. Specific examples of the heat treatment include heat treatment before development (PEB: Post Exposure Bake), heat treatment after development (PB: Post Bake), and the like.

A shelf unit U8 is provided on the carrier block 4 side in the processing block 5. The shelf unit U8 is divided into a plurality of cells arranged in the vertical direction. A transport device A7 including an elevating arm is provided in the vicinity of the shelf unit U8. The transport device A7 raises and lowers the work W between the cells of the shelf unit U8.

A shelf unit U9 is provided on the interface block 6 side in the processing block 5. The shelf unit U9 is divided into a plurality of cells arranged in the vertical direction.

The interface block 6 transfers the work W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transfer device A8 including a transfer arm, and is connected to the exposure device 3. The transport device A8 passes the work W arranged in the shelf unit U9 to the exposure device 3. The transport device A8 receives the work W from the exposure device 3 and returns it to the shelf unit U9.

The control device 100 controls the coating / developing device 2 so as to execute the coating / developing process in the following procedure, for example. First, the control device 100 controls the transfer device A1 so as to transfer the work W in the carrier C to the shelf unit U8, and controls the transfer device A7 so as to arrange the work W in the cell for the processing module 11.

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U8 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 11. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form a lower layer film on the surface of the work W. After that, the control device 100 controls the transfer device A3 so as to return the work W on which the lower layer film is formed to the shelf unit U8, and controls the transfer device A7 so as to arrange the work W in the cell for the processing module 12. ..

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U8 to the liquid processing unit U1 and the heat treatment unit U2 in the processing module 12. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form a resist film on the surface of the work W. After that, the control device 100 controls the transfer device A3 so as to return the work W to the shelf unit U8, and controls the transfer device A7 so as to arrange the work W in the cell for the processing module 13.

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U8 to each unit in the processing module 13. Further, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 so as to form an upper layer film on the resist film of the work W. After that, the control device 100 controls the transfer device A3 so as to transfer the work W to the shelf unit U9.

Next, the control device 100 controls the transfer device A8 so as to send the work W of the shelf unit U9 to the exposure device 3. After that, the control device 100 controls the transfer device A8 so as to receive the exposed work W from the exposure device 3 and arrange it in the cell for the processing module 14 in the shelf unit U9.

Next, the control device 100 controls the transfer device A3 so as to transfer the work W of the shelf unit U9 to each unit in the processing module 14, and the liquid processing unit U1 so as to develop the resist film of the work W. And control the heat treatment unit U2. After that, the control device 100 controls the transfer device A3 so as to return the work W to the shelf unit U8, and controls the transfer device A7 and the transfer device A1 so as to return the work W to the carrier C. This completes the coating / developing process for one piece of work W. The control device 100 causes the coating / developing device 2 to execute the coating / developing process for each of the plurality of workpieces W in the same manner as described above.

The specific configuration of the substrate processing apparatus is not limited to the configuration of the coating / developing apparatus 2 exemplified above. The substrate processing apparatus may be any as long as it includes a liquid treatment unit that forms a film of the treatment liquid and a control device that can control the liquid treatment unit.

(Liquid treatment unit)
Subsequently, an example of the liquid processing unit U1 of the processing module 12 will be described in detail with reference to FIG. The liquid treatment unit U1 holds the work W at a predetermined treatment position and supplies the treatment liquid to the surface Wa of the work W held at the treatment position to perform liquid treatment on the work W. By applying the liquid treatment to the work W, a film of the treatment liquid is formed on the surface Wa of the work W. The processing position is a position where the work W to be processed is held during the execution period of the liquid processing by the liquid processing unit U1. As shown in FIG. 3, the liquid treatment unit U1 has, for example, a rotation holding unit 30 and a processing liquid supply unit 40.

The rotation holding unit 30 holds the work W at the processing position and then rotates the work W. The rotation holding unit 30 has, for example, a holding unit 32 and a rotation driving unit 34. The holding portion 32 supports the back surface of the work W so as to hold the work W at the processing position. The holding portion 32 may support the back surface Wb of the work W with the front surface Wa of the work W facing upward, and may hold the work W (back surface Wb) by, for example, vacuum suction. The holding portion 32 may support the central portion of the back surface Wb of the work W. The holding portion 32 is, for example, a mounting portion 33 including a surface on which the central portion of the back surface Wb of the work W is mounted (hereinafter, referred to as “mounting surface 33a”), and a shaft 36 that supports the mounting portion 33. And have. The area of the mounting surface 33a is smaller than the area of the back surface Wb of the work W. In one example, the mounting surface 33a is formed in a circular shape, and the radius of the mounting surface 33a is about 1/3 to 1/2 of the radius of the work W. As described above, since the holding portion 32 (mounting surface 33a) is in contact with the back surface Wb of the work W, the temperature of the holding portion 32 affects the temperature of the work W at the time of executing the liquid treatment. That is, the holding portion 32 is a member that affects the temperature of the work W at the time of executing the liquid treatment (hereinafter, referred to as “temperature-affected member”).

The rotation drive unit 34 is connected to the holding unit 32. For example, the rotation drive unit 34 is connected to the mounting unit 33 via the shaft 36. The rotation drive unit 34 rotates the shaft 36 (holding unit 32) around the vertical axis Ax by a power source such as an electric motor. As a result, the work W rotates around the axis Ax. The holding portion 32 may hold the work W so that the center of the work W substantially coincides with the axis Ax (center of rotation).

The treatment liquid supply unit 40 supplies the treatment liquid to the surface Wa of the work W held by the holding unit 32. The treatment liquid is a solution (resist liquid) for forming a resist film. The processing liquid supply unit 40 includes, for example, a nozzle 42, a tank 44, a valve 46, and a nozzle drive unit 48.

The nozzle 42 discharges the processing liquid from above the processing position toward the surface Wa of the work W held by the holding portion 32. The nozzle 42 is connected to the tank 44 via a pipe line 49. The tank 44 contains the treatment liquid and supplies the treatment liquid toward the nozzle 42. The valve 46 is provided in the pipeline 49. The valve 46 is, for example, an air operation valve, and adjusts the opening degree in the pipeline 49. By controlling the valve 46, it is possible to switch between a state in which the processing liquid is discharged from the nozzle 42 and a state in which the processing liquid is not discharged from the nozzle 42. The nozzle drive unit 48 adjusts the position of the nozzle 42. The nozzle drive unit 48 moves the nozzle 42 along the surface Wa of the work W by, for example, a power source such as a motor.

(Control device)
As shown in FIG. 2, the control device 100 has a storage unit 102 and a control unit 104 as a functional configuration. The storage unit 102 stores a program for operating each unit of the coating / developing device 2 including the liquid processing unit U1. The storage unit 102 also stores various data (for example, information related to an instruction signal for operating the liquid processing unit U1) and information from sensors and the like provided in each unit. The storage unit 102 is, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or an optical magnetic recording disk. The program may also be included in an external storage device separate from the storage unit 102, or an intangible medium such as a propagating signal. The program may be installed in the storage unit 102 from these other media, and the program may be stored in the storage unit 102.

The control unit 104 controls the operation of each unit of the coating / developing device 2 based on the program read from the storage unit 102. The control unit 104 causes the liquid treatment unit U1 to perform liquid treatment on the work W. In this liquid treatment, the treatment liquid is supplied to the surface Wa of the work W held at the treatment position by the holding portion 32, and a film of the treatment liquid is formed on the surface Wa of the work W after the supply of the treatment liquid. It includes holding the work W in the holding portion 32 so as to be performed. For example, when supplying the treatment liquid to the surface Wa, the control unit 104 rotates the holding unit 32 in a state of supporting the work W by the rotation drive unit 34, and the control unit 104 to the surface Wa of the work W. The processing liquid is supplied by the processing liquid supply unit 40. The control unit 104 rotates the holding unit 32 (work W) by the rotation driving unit 34 in a state where the supply of the processing liquid is stopped when the film of the processing liquid is formed.

The control unit 104 causes the liquid treatment unit U1 to perform a temperature control treatment for adjusting the temperature of the temperature-affecting member that affects the temperature of the work W at the time of executing the liquid treatment before the liquid treatment. When the temperature control process is executed, the control unit 104 raises the temperature of the holding unit 32 by rotating the holding unit 32 in a state where the holding unit 32 does not support the work W, for example. In this case, the temperature of the holding unit 32 after the temperature control process is executed is higher than the temperature of the holding unit 32 when the temperature control process is not executed. In one example, when the control unit 104 causes each of the plurality of workpieces W to execute the above liquid treatment, the control unit 104 performs a temperature control treatment between one liquid treatment and the next liquid treatment of the one liquid treatment. Let the processing unit U1 execute.

The control device 100 is composed of one or a plurality of control computers. For example, the control device 100 has a circuit 120 shown in FIG. The circuit 120 has one or more processors 122, a memory 124, a storage 126, an input / output port 128, and a timer 132. The storage 126 has a storage medium that can be read by a computer, such as a hard disk. The storage medium stores a program for causing the control device 100 to execute the substrate processing method described later. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 124 temporarily stores the program loaded from the storage medium of the storage 126 and the calculation result by the processor 122.

The processor 122 executes the above program in cooperation with the memory 124. The input / output port 128 inputs / outputs an electric signal to / from the rotation holding unit 30, the processing liquid supply unit 40, and the like in accordance with a command from the processor 122. The timer 132 measures the elapsed time, for example, by counting a reference pulse having a fixed cycle. The hardware configuration of the control device 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the logic circuit is integrated.

(Board processing method)
Subsequently, as an example of the substrate processing method, a series of processes including the liquid treatment and the temperature control treatment performed in the liquid treatment unit U1 of the treatment module 12 will be described with reference to FIGS. 5 to 7. FIG. 5 is a flowchart showing a series of processes sequentially performed on a plurality of works W in one liquid processing unit U1.

First, the control unit 104 of the control device 100 controls the transfer device A3 and the liquid treatment unit U1 so as to carry the work W to be processed into the liquid treatment unit U1 (step S01). For example, the control unit 104 controls the transport device A3 and the liquid processing unit U1 so that the work W to be processed is placed on the holding unit 32 of the rotation holding unit 30, and the holding unit 32 works at the processing position. Hold W. As a result, the loading of the work W into the processing position in the liquid processing unit U1 is completed. The temperature of the work W to be processed may be adjusted to a predetermined set temperature by the temperature control unit provided in the coating / developing device 2 before being carried into the liquid treatment unit U1 (immediately before being carried in).

Next, the control unit 104 controls the liquid processing unit U1 so as to perform liquid treatment on the work W held at the processing position by the holding unit 32 (step S02). At the start of the liquid treatment for the first work W, the temperature in the liquid treatment unit U1 (the temperature around the treatment position) may be adjusted to approach the set temperature. Specific examples of liquid treatment will be described later. During the execution of the liquid treatment, the temperature may be continuously adjusted so that the temperature in the liquid treatment unit U1 does not deviate (excessively) from the set temperature.

Next, the control unit 104 controls the transfer device A3 and the liquid treatment unit U1 so that the work W after the liquid treatment is carried out from the liquid treatment unit U1 (step S03). For example, the control unit 104 controls the liquid treatment unit U1 and the transfer device A3 so that the work W after the liquid treatment is transferred from the holding unit 32 to the transfer device A3 after the work W is released from being adsorbed by the holding unit 32. do. As a result, the work W is carried out from the processing position in the liquid processing unit U1.

Next, the control unit 104 determines whether or not the processing of the predetermined number of work Ws has been completed (step S04). When it is determined in step 04 that the processing of the set number of works W has not been completed (step S04: NO), the control unit 104 causes the liquid processing unit U1 to execute the above-mentioned temperature control processing (step S05). .. For example, the control unit 104 rotates the holding unit 32 in a state where the work W is not held by the rotation driving unit 34 so as to raise the temperature of the holding unit 32. In one example, the control unit 104 rotates the holding unit 32 by the rotation driving unit 34 so that the temperature of the holding unit 32 approaches the target temperature. A specific example of the temperature control process will be described later. After the end of step S05, the control unit 104 re-executes the processes of steps S01 to S04.

On the other hand, when it is determined in step S04 that the processing of the set number of works W has been completed (step S04: YES), the control unit 104 ends a series of processing. In the above series of processes, the processes of steps S01 to S05 are repeated until the process of the set number of works W is performed. In this case, the temperature control treatment in step S05 is performed after the liquid treatment for one work W is executed and before the liquid treatment for the subsequent work W to be processed next to the one work W. In this example, the temperature control treatment in step S05 is not performed before the liquid treatment for the first work W is executed, but the control unit 104 is performed before the liquid treatment for the first work W is executed. , The temperature control process of step 05 may be executed by the liquid processing unit U1. The control unit 104 may end the above-mentioned series of processes after executing the liquid process for the final work W and then causing the liquid process unit U1 to perform the temperature control process in step S05.

FIG. 6 is a flowchart showing an example of the liquid treatment in step S02. In the liquid treatment in step S02, first, the control unit 104 controls the rotation holding unit 30 so as to start the rotation of the holding unit 32 holding the work W carried into the processing position (step S11). For example, the control unit 104 controls the rotation holding unit 30 so that the work W rotates around the axis Ax at a predetermined first rotation speed.

Next, the control unit 104 controls the processing liquid supply unit 40 so as to start supplying the processing liquid to the surface Wa of the work W (step S12). For example, the control unit 104 controls the nozzle drive unit 48 so that the nozzle 42 of the processing liquid supply unit 40 is arranged at a position facing the center of the work W, and then switches the valve 46 from the closed state to the open state. As a result, the processing liquid starts to be discharged from the nozzle 42 toward the center (rotation center) of the work W rotating by the rotation holding portion 30.

Next, the control unit 104 waits until a predetermined supply time elapses from the start of supply of the treatment liquid (step S13). The supply period and the first rotation speed are stored in the storage unit 102, and are set to such an extent that the treatment liquid is spread on the surface Wa of the work W. Next, the control unit 104 controls the processing liquid supply unit 40 so as to stop the supply of the processing liquid to the surface Wa of the work W (step S14). For example, the control unit 104 stops the discharge of the processing liquid from the nozzle 42 by switching the valve 46 from the open state to the closed state.

Next, the control unit 104 controls the rotation holding unit 30 so as to adjust the rotation speed of the work W (step S15). For example, the control unit 104 controls the rotation holding unit 30 so as to reduce the rotation of the work W from the first rotation speed to the second rotation speed. The second rotation speed is predetermined to be a value lower than the first rotation speed.

Next, the control unit 104 waits until the predetermined drying time elapses after the rotation of the work W is adjusted to the second rotation speed in step S15 (step S16). The drying time and the second rotation speed are stored in the storage unit 102, and are set to such an extent that a film (coating film) of the treatment liquid is formed on the surface Wa of the work W. Next, the control unit 104 controls the rotation holding unit 30 so as to stop the rotation of the work W (step S17). As a result, the liquid treatment for one work W is completed. In this liquid treatment, the control unit 104 causes the rotation holding unit 30 to continue the rotation of the work W at the second rotation speed for the drying time, so that a film of the treatment liquid is formed on the surface Wa of the work W. The work W is held in. The liquid (solvent) contained in the treatment liquid supplied on the surface Wa of the work W evaporates to form a film of the treatment liquid. Due to the heat of vaporization accompanying the evaporation of the solvent in the treatment liquid, the temperature around the treatment position (the temperature of the temperature-affecting member such as the holding portion 32) may be lower than the above-mentioned set temperature. Therefore, the temperature control process in step S05 is performed.

FIG. 7 is a flowchart showing an example of the temperature control process in step S05. In the temperature control process of step S05, first, the control unit 104 controls the rotation holding unit 30 so as to start the rotation of the holding unit 32 in a state where the work W is not held (step S21). For example, the control unit 104 controls the rotation holding unit 30 so as to rotate the holding unit 32 at the third rotation speed.

Next, the control unit 104 waits from the start of rotation of the work W at the third rotation speed until the idling time elapses (step S22). Next, the control unit 104 controls the rotation holding unit 30 so as to stop the rotation of the holding unit 32 (step S23). As a result, one temperature control process is completed. The idling time and the third rotation speed may be predetermined or may be stored in the storage unit 102. In this case, the idling time and the third rotation speed may be set so that the temperature of the holding portion 32 approaches the target temperature (approaches the target range). The third rotation speed may be higher than the second rotation speed in forming the film of the treatment liquid, or may be higher than the first rotation speed in the supply (discharge) of the treatment liquid.

The control unit 104 may set the processing conditions in the temperature control process according to the start timing of the liquid process performed after the temperature control process. The processing conditions include the idling time and the third rotation speed, and the processing conditions define the operation of the liquid processing unit U1 at the time of executing the temperature control processing. That is, the control unit 104 causes the liquid processing unit U1 to execute the temperature control processing according to the processing conditions. The storage unit 102 may store information in which the idling time and the third rotation speed are associated with the rising temperature of the holding unit 32, and the target temperature of the holding unit 32. The control unit 104 has a time between the start timing of the temperature control process and the start timing of the liquid process to be performed next to the temperature control process (the carry-in timing of the work W to be performed next) (hereinafter, ". The processing conditions may be set so that the temperature of the holding unit 32 approaches the target temperature according to the "processing waiting time"). In this case, the control unit 104 may determine the third rotation speed after determining the idling time according to the processing waiting time. The third rotation speed may be determined to be a value larger than the second rotation speed in the film formation of the treatment liquid, or may be determined to be a value larger than the first rotation speed at the time of supplying (discharging) the treatment liquid. .. The control unit 104 acquires information on the start timing of the next liquid treatment (the timing of carrying in the next work W) before the start of the temperature control treatment according to the situation before the liquid treatment of the work W to be processed. You may.

The procedure of a series of treatments including the liquid treatment and the temperature control treatment described above is an example and can be changed as appropriate. For example, some of the steps (processes) described above may be omitted, or the steps may be executed in a different order. Further, any two or more steps among the above-mentioned steps may be combined, or a part of the steps may be modified or deleted. Alternatively, other steps may be performed in addition to each of the above steps. In the above example, the temperature control treatment in step S05 is performed for each liquid treatment for one work W, but one temperature control treatment is performed for each of a plurality of liquid treatments for a plurality of work W. It may be done.

(Effect of the first embodiment)
The substrate processing method according to the first embodiment described above is held at the processing position by using the liquid processing unit U1 that holds the work W at a predetermined processing position and supplies the processing liquid to the surface Wa of the work W. A liquid including supplying the treatment liquid to the surface Wa of the work W and holding the work W so that a film of the treatment liquid is formed on the surface Wa of the work W after the supply of the treatment liquid. Performing the treatment and performing the temperature control treatment for adjusting the temperature of the temperature-affecting member that affects the temperature of the work W at the time of executing the liquid treatment in the liquid treatment unit U1 before the liquid treatment. include.

In the liquid treatment using the treatment liquid, a part of the liquid contained in the treatment liquid evaporates as the film is formed after the treatment liquid is supplied, and the temperature around the treatment position may decrease due to the heat of vaporization. Therefore, when the liquid treatment is repeatedly performed, the temperature conditions around the treatment position may vary depending on the liquid treatment, and the film thickness of the coating film may vary. On the other hand, in the substrate processing method, the liquid treatment can be performed in a state where the temperature variation around the treatment position is reduced by the temperature control treatment for adjusting the temperature of the member that affects the temperature of the work W. .. Therefore, it is possible to suppress the fluctuation in the film thickness between the works W.

In the substrate processing method, the processing conditions in the temperature control processing are set according to the start timing of the liquid processing. Depending on the start timing of the liquid treatment, the temperature around the treatment position may fluctuate. Therefore, by setting the treatment conditions for the temperature control treatment according to the start timing of the liquid treatment, it is possible to appropriately adjust the ambient temperature of the treatment position at the start of the liquid treatment.

As an example of the temperature-affected member, there is a holding portion 32 that supports the back surface Wb of the work W so as to hold the work W at the processing position. In the above-mentioned substrate processing method, supplying the treatment liquid to the surface Wa of the work W causes the treatment liquid to be supplied to the surface Wa of the work W while rotating the holding portion 32 in a state of supporting the work W. Including supplying. The temperature control process includes raising the temperature of the holding portion 32 by rotating the holding portion 32 in a state where the holding portion 32 does not support the work W. In this case, it is possible to suppress that the temperature of the holding portion 32, which affects the temperature of the work W, rises before the liquid treatment is performed, and the ambient temperature of the treatment position decreases with the execution of the liquid treatment. Therefore, the variation in temperature around the processing position for each liquid treatment is reduced, and it is possible to suppress the variation in the film thickness between the work Ws.

Here, with reference to FIGS. 8 and 9, the effect of the substrate processing method according to the first embodiment will be further described. FIG. 8 shows the measurement result of the film thickness (film thickness) according to the comparative example when the temperature control treatment in step S05 was not executed. In the measurement of the film thickness according to the comparative example, the above liquid treatment is continuously performed on five pieces of the work W, and the film thickness of the central portion of the coating of the treatment liquid on the surface Wa of the work W is measured. The central portion of the coating film to be measured for the film thickness corresponds to the portion where the work W contacts the holding portion 32 (mounting surface 33a), and the film thickness of a plurality of locations in the central portion of the coating film is measured. However, the average value is calculated as the film thickness in the central part. In FIG. 8, the vertical axis shows the measured value of the film thickness at the central portion of the coating film, and the horizontal axis “Wafer No” is the work W of the five wafers subjected to the liquid treatment in order. Is shown. In FIG. 8, the circles indicate the measured values (average values) of the film thickness, and the broken lines indicate the approximate straight lines calculated based on the measured values of the film thickness.

From the measurement results of FIG. 8, it can be seen that the film thickness in the central portion becomes smaller as the number of liquid treatments increases. It is considered that this fluctuation (decrease) in the film thickness is caused by the decrease in the temperature around the treatment position due to the heat of vaporization when the solvent in the treatment liquid evaporates in the liquid treatment. In one liquid treatment, when the work W is rotated to form a film after the treatment liquid is supplied, the solvent in the treatment liquid evaporates in the first stage of the film formation period, so that the solvent around the treatment position is formed. The temperature is lower than the above-mentioned set temperature. Then, in the latter stage of the film formation period, the solvent evaporates almost completely, and the temperature around the treatment position gradually rises toward the set temperature. After the liquid treatment is completed (after the treatment liquid is supplied) and before the temperature around the treatment position rises to the set temperature, the work W may be carried out and the next liquid treatment may be performed. In this case, the temperature around the treatment position in the next liquid treatment is lower than the temperature around the treatment position in the previous liquid treatment, and the thickness of the formed film may fluctuate. On the other hand, in the substrate processing method according to the first embodiment, by raising the temperature of the holding portion 32 before the liquid treatment, a decrease in temperature around the processing position is suppressed, and as a result, between the work Ws. Fluctuations in film thickness are suppressed.

The degree of film thickness variation between the workpieces W can be represented by the slope of the approximate straight line in the measurement results shown in FIG. FIG. 9 shows the measurement results of the film thickness variation when the temperature control treatment in step S05 is executed before the liquid treatment of each of the second to fifth work W out of the five work W. .. In FIG. 9, the vertical axis shows the slope of an approximate straight line (change in film thickness for each work W) based on the measurement result of the film thickness in the central portion of the film for five workpieces W, and the horizontal axis. Indicates the rotation time of the holding portion 32 in a state where the work W is not held. In the measurement of the film thickness variation in FIG. 9, the rotation speed and the rotation time are each changed in three stages. In FIG. 9, "ω1", "ω2", and "ω3" indicate the rotation speed (rpm), and the values are larger in the order of ω3, ω2, and ω1. The rotation time is changed in three stages of Rt1 (seconds), 2 × Rt1 (seconds), and 3 × Rt1 (seconds). The measured value Ft0 when the rotation time is zero indicates the measurement result (slope of an approximate straight line) of the film thickness variation in the above-mentioned comparative example. The measurement result of FIG. 9 does not include the measurement result when the rotation time is 2 × Rt1 (seconds) and the rotation speed is ω2.

The broken line, the alternate long and short dash line, and the alternate long and short dash line shown in FIG. 9 show an approximate straight line calculated based on a plurality of measured values of the film thickness variation at each rotation speed. From the measurement results of FIG. 9, it can be seen that the film thickness variation is lower when the temperature control process of step S05 is executed, as compared with the measured value Ft0 showing the film thickness variation according to the comparative example. Further, in the range of change in the rotation time in the measurement result of FIG. 9, it can be seen that the value of the film thickness fluctuation further decreases as the rotation time increases, regardless of the rotation speed. Furthermore, by comparing the approximate straight lines for each rotation speed, in the range of change in the rotation speed in the measurement result of FIG. 9, the larger the rotation speed, the larger the slope (absolute value) of the approximate straight line. It can be seen that the value of the film thickness fluctuation is further reduced accordingly. As described above, the temperature of the holding portion 32 (the temperature around the processing position) is raised by the rotation of the holding portion 32 during a plurality of consecutive liquid treatments, so that the center between the work Ws is reached. It can be seen that the fluctuation of the film thickness in the portion is suppressed.

[Second Embodiment]
In the temperature control treatment according to the first embodiment described above, the temperature is adjusted so that the temperature of the holding portion 32 rises, but for the purpose of reducing the variation in the film thickness for each liquid treatment of the work W. The temperature control process may be performed so as to lower the temperature of the holding portion 32. The coating / developing device 2 (processing module 12) of the substrate processing system according to the second embodiment includes a liquid processing unit U10 instead of the liquid processing unit U1. FIG. 10 shows the liquid treatment unit U10 according to the second embodiment. As shown in FIG. 10, the liquid treatment unit U10 has, for example, a rotation holding unit 30A, a treatment liquid supply unit 40, a solvent supply unit 50, and a gas supply unit 60.

The rotation holding portion 30A is different from the rotation holding portion 30 in that the umbrella portion 38 is further provided. The umbrella portion 38 prevents the liquid from flowing to the rotary drive portion 34 along the bottom surface of the mounting portion 33 of the holding portion 32 and the side surface of the shaft 36. The umbrella portion 38 is formed in a ring shape so as to surround the circumference of the shaft 36, and includes an inclined surface that goes vertically downward as it goes outward from the axis Ax. The outer edge of the inclined surface is located outside the rotation drive unit 34. As a result, the liquid flows along the bottom surface of the mounting portion 33, the side surface of the shaft 36, and the inclined surface of the umbrella portion 38, and the liquid is prevented from flowing into the motor or the like of the rotary drive unit 34.

The liquid treatment unit U10 according to the second embodiment cools the holding unit 32 by supplying a fluid to the holding unit 32 by the solvent supply unit 50 and the gas supply unit 60. The fluid supplied to the holding portion 32 (hereinafter referred to as “first fluid”) may be either a solvent (liquid) or a gas, and any kind of solvent or any kind of solvent can be used as long as the holding portion 32 can be cooled. It may be a gas.

The solvent supply unit 50 supplies a solvent that can cool the holding unit 32 (hereinafter, referred to as “cooling solvent”) to the holding unit 32. The cooling solvent contains, for example, thinner. The solvent supply unit 50 may supply the cooling solvent to the central portion of the holding unit 32. The central portion of the holding portion 32 is a portion located in the center with respect to the axis Ax. For example, the central portion of the holding portion 32 corresponds to the shaft 36 and the central portion of the mounting portion 33 having a radius of about twice the radius of the shaft 36. The solvent supply unit 50 includes, for example, a nozzle 52, a tank 54, and a valve 56.

The nozzle 52 is arranged below the holding portion 32, and discharges the cooling solvent toward the holding portion 32 (for example, the bottom surface of the mounting portion 33). The nozzle 52 may be arranged so that the cooling solvent is supplied to the holding portion 32 without hitting the back surface Wb of the work W held by the holding portion 32. The nozzle 52 may be arranged so that the cooling solvent is discharged toward the central portion of the holding portion 32. For example, the discharge direction of the cooling solvent from the nozzle 52 and the axis Ax intersect with each other inside the holding portion 32. The nozzle 52 is connected to the tank 54 via a pipe line 58. The tank 54 contains a cooling solvent and supplies the cooling solvent toward the nozzle 52. The valve 56 is provided in the pipeline 58. The valve 56 is, for example, an air operation valve, and adjusts the opening degree in the pipeline 58. By controlling the valve 56, it is possible to switch between a state in which the cooling solvent is discharged from the nozzle 52 and a state in which the cooling solvent is not discharged from the nozzle 52.

The gas supply unit 60 supplies a gas that can cool the holding unit 32 (hereinafter, referred to as “cooling gas”) to the holding unit 32. The cooling gas includes, for example, nitrogen gas. The gas supply unit 60 may supply cooling gas to the central portion of the holding unit 32. The gas supply unit 60 includes, for example, a nozzle 62, a gas source 64, and a valve 66.

The nozzle 62 is arranged below the holding portion 32, and discharges cooling gas toward the holding portion 32 (for example, the bottom surface of the holding portion 32). The nozzle 62 may be arranged so that the cooling gas is discharged toward the central portion of the holding portion 32. For example, the discharge direction of the cooling gas from the nozzle 62 and the axis Ax intersect with each other inside the holding portion 32. The nozzle 62 is connected to the gas source 64 via the pipe line 68. The gas source 64 supplies cooling gas toward the nozzle 62. The valve 66 is provided in the pipeline 68. The valve 66 is, for example, an air operation valve, and adjusts the opening degree in the pipeline 68. By controlling the pipeline 68, it is possible to switch between a state in which the cooling gas is discharged from the nozzle 62 and a state in which the cooling gas is not discharged from the nozzle 62.

The liquid treatment unit U10 is also controlled by the control device 100 in the same manner as the liquid treatment unit U1 according to the first embodiment. The control unit 104 of the control device 100 causes the liquid treatment unit U10 to perform a temperature control process for adjusting the temperature of the holding unit 32, which affects the temperature of the work W when the liquid process is executed. When the temperature control process is executed, the control unit 104 supplies the first fluid (cooling solvent and cooling gas) to the holding unit 32 by, for example, the solvent supply unit 50 and the gas supply unit 60, so that the holding unit 32 The temperature of the holding portion 32 is lowered (cooling the holding portion 32). In this case, the temperature of the holding unit 32 after the temperature control process is executed is lower than the temperature of the holding unit 32 when the temperature control process is not executed. In one example, when the control unit 104 causes each of a plurality of work Ws to perform the above liquid treatment, the liquid treatment unit U10 performs one temperature control treatment before the plurality of liquid treatments on the plurality of work Ws. To execute.

Subsequently, with reference to FIGS. 11 and 12, an example of a series of treatments including the liquid treatment and the temperature control treatment performed in the liquid treatment unit U10 according to the second embodiment will be described. FIG. 11 is a flowchart showing a series of processes sequentially performed on a plurality of works W in one liquid processing unit U10. Before this series of treatments is performed, the temperature inside the liquid treatment unit U10 (the temperature around the treatment position) may be adjusted to a predetermined set temperature.

The control unit 104 of the control device 100 first causes the liquid processing unit U10 to perform a temperature control process for cooling the holding unit 32 (step S31). For example, the control unit 104 controls the liquid treatment unit U10 so as to cool the holding unit 32 by supplying the first fluid to the holding unit 32. In one example, the control unit 104 supplies the cooling solvent and the cooling gas to the holding unit 32 by the solvent supply unit 50 and the gas supply unit 60 so that the temperature of the holding unit 32 approaches the target temperature. The target temperature of the holding portion 32 is preset to a value lower than the above set temperature. A specific example of the temperature control process in step S31 will be described later.

Next, the control unit 104 controls the transfer device A3 and the liquid treatment unit U10 so that the first work W to be processed is carried into the liquid treatment unit U10 (step S32). For example, step S32 is performed in the same manner as step S01 shown in FIG. The temperature of the work W to be processed may be adjusted to a predetermined set temperature by the temperature control unit included in the coating / developing device 2 before being carried into the liquid processing unit U10.

Next, the control unit 104 controls the liquid processing unit U10 so as to perform liquid treatment on the work W held at the processing position by the holding unit 32 (step S33). For example, step S32 is performed in the same manner as step S02 shown in FIGS. 5 and 6.

Next, the control unit 104 controls the transfer device A3 and the liquid treatment unit U10 so that the work W after the liquid treatment is carried out from the liquid treatment unit U10 (step S34). For example, step S34 is performed in the same manner as step S03 shown in FIG. Next, the control unit 104 determines whether or not the processing of the predetermined number of work Ws has been completed (step S35). If it is determined in step S35 that the processing of the set number of works W has not been completed (step S35: NO), the control unit 104 repeats the processing of steps S32 to S35.

On the other hand, when it is determined in step S35 that the processing of the set number of works W has been completed (step S35: YES), the control unit 104 has a series of liquid processing and temperature control processing for the set number of works W. End the process. As described above, unlike the first embodiment, the temperature control treatment (cooling of the holding portion 32) in step S31 is performed before the liquid treatment for the plurality of work W is executed.

FIG. 12 is a flowchart showing an example of the temperature control process in step S31. In the temperature control process in step S31, first, the control unit 104 controls the rotation holding unit 30 so as to start the rotation of the holding unit 32 in a state where the work W is not held (step S41). For example, the control unit 104 controls the rotation holding unit 30 so as to rotate the holding unit 32 at a predetermined fourth rotation speed. The fourth rotation speed may be about the same as the first rotation speed at the time of supply (discharge) of the treatment liquid contained in the liquid treatment in step S33, or may be smaller than the first rotation speed. The fourth rotation speed may be about the same as the second rotation speed in the film formation of the treatment liquid contained in the liquid treatment in step S33, or may be smaller than the second rotation speed.

Next, the control unit 104 controls the liquid treatment unit U10 so as to start supplying the first fluid to the holding unit 32 (step S42). For example, the control unit 104 causes the solvent supply unit 50 to start discharging the cooling solvent contained in the first fluid toward the holding unit 32, and discharges the cooling gas contained in the first fluid toward the holding unit 32. Let the supply unit 60 start. In one example, the control unit 104 switches the valve 56 of the solvent supply unit 50 from the closed state to the open state, and switches the valve 66 of the gas supply unit 60 from the closed state to the open state, thereby causing the solvent supply unit 50 and the gas supply unit. 60 is started to discharge the cooling solvent and the cooling gas, respectively.

Next, the control unit 104 waits until a predetermined supply time elapses from the start of supply of the first fluid (step S43). The supply time is set to such that the cooling of the holding portion 32 progresses due to the supply of the first fluid, and is set to, for example, several seconds or several tens of seconds.

Next, the control unit 104 controls the liquid treatment unit U10 so as to stop the supply of the first fluid to the holding unit 32 (step S44). For example, the control unit 104 switches the valve 56 from the open state to the closed state and switches the valve 66 from the open state to the closed state, whereby the cooling solvent and the cooling gas are discharged to the solvent supply unit 50 and the gas supply unit 60, respectively. Stop it. In the supply of the first fluid to the holding unit 32 as described above, the cooling solvent from the nozzle 52 of the solvent supply unit 50 may be discharged toward the central portion of the holding unit 32, and may be discharged from the nozzle 62 of the gas supply unit 60. Cooling gas may be discharged toward the central portion of the holding portion 32.

Next, the control unit 104 waits until a predetermined cooling time elapses from the stop of the supply of the first fluid (step S45). The cooling time is set to such that the cooling solvent supplied to the holding portion 32 is sufficiently evaporated (dried), and is set to, for example, several seconds or several tens of seconds. This cooling time may be less than or equal to the supply time in step S43, or may be longer than the supply time. During the cooling period from when the supply of the first fluid is stopped until the cooling time elapses, the cooling of the holding portion 32 further progresses due to the heat of vaporization accompanying the evaporation of the cooling solvent.

Next, the control unit 104 determines whether or not the supply of the first fluid has been completed for a predetermined number of times (step S46). If it is determined in step S46 that the supply of the set number of times has not been completed (step S46: NO), the control unit 104 repeats steps S42 to S46. This set number of times indicates the number of times that the cooling process including the supply of the first fluid and the cooling period after the supply is repeated, and is set to such an extent that the temperature of the holding unit 32 is cooled to the target temperature. A plurality of cooling treatments may be performed, or a single cooling treatment may be performed (step S46 may be omitted).

On the other hand, when it is determined in step S46 that the supply of the set number of times is completed (step S46: YES), the control unit 104 controls the rotation holding unit 30 so as to stop the rotation of the holding unit 32 (step S47). ). As a result, the temperature control process in step S31 for cooling the holding portion 32 is completed. As described above, the processing conditions for the temperature control processing in step S31 may be predetermined. The processing conditions for the temperature control processing include a supply time for supplying the first fluid, a cooling time for waiting after the supply of the first fluid, the above-mentioned set number of times, and a start timing for the temperature control process.

Unlike the above example, the control unit 104 sets at least a part of the processing conditions in the temperature control process of step S31 according to the start timing of the first liquid process of step S32 performed after the temperature control process. You may. For example, the control unit 104 may determine the start timing of the temperature control process according to the start timing of the first liquid process in step S32, or may determine at least a part of the process conditions other than the start timing. .. In one example, the control unit 104 determines the temperature control process in step S32 so that the temperature of the holding unit 32 approaches the target temperature (so as to be included in the target range) according to the start timing of the first liquid process in step S32. You may decide the start timing of. The control unit 104 acquires information on the start timing of the liquid treatment of the work W (the timing of carrying in the work W) before the start of the temperature control processing according to the situation before the liquid treatment of the first work W. You may.

Alternatively, the control unit 104 may supply a supply condition (supply) relating to the supply of the first fluid among the processing conditions so that the temperature of the holding unit 32 approaches the target temperature when the start timing of the temperature control process has already been determined. Time, cooling time, set number of times, etc.) may be determined. In this case, the control unit 104 determines according to the time between the start timing of the temperature control process and the start timing of the first liquid process (the delivery timing of the first work W) performed after the temperature control process. The processing conditions may be set so that the temperature of the holding unit 32 approaches the target temperature. The target temperature of the holding unit 32 may be set in advance to a value lower than the set temperature of the work W before processing (the set temperature in the liquid processing unit U10).

In the above example, one temperature control treatment for cooling the holding portion 32 is performed before a plurality of liquid treatments, but the temperature for cooling the holding portion 32 is performed for each liquid treatment. The conditioning treatment may be performed before the liquid treatment. Either one of the cooling solvent and the cooling gas may be supplied to the holding portion 32. In this case, the liquid treatment unit U10 does not have to have either the solvent supply unit 50 or the gas supply unit 60. In the above example, the cooling solvent or the like is supplied to the shaft 36 of the holding portion 32 and the central portion of the mounting portion 33, but the central portion of the holding portion 32 is the center of the shaft 36 and the mounting portion 33. A cooling solvent or the like may be supplied to either one of the portions.

(Effect of the second embodiment)
In the substrate processing method performed in the liquid treatment unit U10 according to the second embodiment, as in the first embodiment, the temperature control treatment reduces the variation in temperature around the treatment position for each liquid treatment. Processing can be performed. Therefore, it is possible to suppress the fluctuation in the film thickness between the works W.

Examples of the temperature-affected member include a holding portion 32 that supports the back surface Wb of the work W so as to hold the work W at the processing position. In the substrate processing method according to the second embodiment, the temperature control process includes cooling the holding unit 32 by supplying the first fluid to the holding unit 32. In this case, the holding portion 32, which affects the temperature of the work W, is cooled before the liquid treatment is performed, and the degree to which the ambient temperature of the treatment position drops with the execution of the liquid treatment becomes small. Therefore, the variation in temperature around the treatment position for each liquid treatment is reduced, and it is possible to suppress the variation in the film thickness between the work Ws.

In the substrate processing method according to the second embodiment, supplying the processing liquid to the surface Wa of the work W is a rotational drive in which the holding portion 32 in a state of supporting the work W is connected to the holding portion 32. It includes supplying the treatment liquid to the surface Wa of the work W while rotating by the portion 34. Supplying the first fluid to the holding portion 32 includes supplying the first fluid to the central portion of the holding portion 32. The central portion of the holding portion 32 is located near the rotation driving portion 34 for rotating the holding portion 32, and the heat capacity of the central portion tends to be larger than that of the other portions. Therefore, by cooling the central portion of the holding portion 32, it is possible to increase the degree of temperature control by the temperature control process.

Here, the effect of the substrate processing method according to the second embodiment will be further described with reference to FIGS. 13 (a) to 13 (c). 13 (a) to 13 (c) show the measurement results of the coating film in the central portion of the coating film on the surface Wa of the work W. The film thickness measurement shown in FIGS. 13 (a) to 13 (c) is performed in the same manner as the film thickness measurement shown in FIG. 8, except for the method of executing the temperature control process and the like. FIG. 13A shows the measurement result of the film thickness according to the comparative example when the temperature control treatment of step S31 was not executed. FIG. 13B shows the measurement result of the film thickness when the temperature control process of step S31 shown in FIG. 11 is executed and the number of times of setting in step S46 shown in FIG. 12 is one. .. FIG. 13C shows the measurement result of the film thickness when the temperature control process of step S31 is executed and the number of times of setting in step S46 is five.

The slope of the approximate straight line (absolute value) indicating the degree of film thickness fluctuation in the measurement result of FIG. 13 (b) becomes the slope of the approximate straight line (absolute value) in the measurement result according to the comparative example of FIG. 13 (a). Compared to that, it has decreased to about 2/3. The slope (absolute value) of the approximate straight line in the measurement result of FIG. 13 (c) is about 1/4 of the slope (absolute value) of the approximate straight line in the measurement result according to the comparative example of FIG. 13 (a). is decreasing. As described above, from the measurement results of FIGS. 13 (a) to 13 (c), it can be seen that the film thickness fluctuation is suppressed by executing the temperature control process in step S31. Further, it can be seen that the film thickness fluctuation is further suppressed by increasing the number of repetitions of the supply of the first fluid and the standby for cooling.

[Third Embodiment]
In the temperature control treatment according to the first embodiment and the second embodiment described above, the temperature of the holding portion 32 (temperature-affected member) in contact with the work W is adjusted, but the film thickness of each liquid treatment of the work W is adjusted. For the purpose of reducing the variation, the temperature control treatment may be performed on the temperature-affecting member arranged close to the work W. The coating / developing device 2 (processing module 12) of the substrate processing system according to the third embodiment includes a liquid processing unit U20 instead of the liquid processing unit U1. FIG. 14 shows the liquid treatment unit U20 according to the third embodiment. As shown in FIG. 14, the liquid processing unit U20 has, for example, a rotation holding unit 30, a processing liquid supply unit 40, and an accommodating unit 70.

The accommodating portion 70 surrounds the work W held at the processing position by the holding portion 32. The accommodating portion 70 is provided around the rotation holding portion 30. The accommodating portion 70 functions as a liquid collecting container for receiving a part of the liquid supplied to the work W (treatment liquid or the like shaken off the work W) in the liquid treatment of the work W. The accommodating portion 70 includes, for example, a bottom wall 72, an outer peripheral wall 74, an inner peripheral wall 76, partition walls 78 and 80, an inner cup 82, a drainage pipe 84, and an exhaust pipe 86.

The bottom wall 72 is formed in an annular shape so as to surround the circumference of the rotation holding portion 30. The outer peripheral wall 74 is formed in a cylindrical shape so as to surround the inner peripheral wall 76 and the inner cup 82. The outer peripheral wall 74 extends vertically upward from the outer peripheral edge of the bottom wall 72. The outer peripheral wall 74 is located outside the peripheral edge of the work W held by the holding portion 32. Therefore, the outer peripheral wall 74 prevents the treatment liquid shaken off from the work W rotated by the rotation holding portion 30 from scattering.

The inner peripheral wall 76 is formed in a cylindrical shape so as to surround the rotation holding portion 30. The inner peripheral wall 76 extends vertically upward from the inner peripheral edge of the bottom wall 72. The inner peripheral wall 76 is located inside the peripheral edge of the work W held by the holding portion 32. The upper end portion 76a of the inner peripheral wall 76 is closed by the partition wall 78. A through hole is provided in the center of the partition wall 78, and the shaft 36 is inserted into the through hole.

The partition wall 80 is formed in a cylindrical shape. The partition wall 80 is located between the outer peripheral wall 74 and the inner peripheral wall 76, and extends vertically upward from the bottom wall 72. In this way, the partition wall 80 surrounds the inner peripheral wall 76. The upper end of the partition wall 80 is separated from the inner cup 82 located above the partition wall 80.

The inner cup 82 is formed in a cylindrical shape (ring shape). The inner cup 82 is attached to the upper end portion 76a of the inner peripheral wall 76 so as to project outward from the partition wall 78. The upper surface of the inner cup 82 is formed in an umbrella shape (mountain shape) protruding upward. The upper surface of the inner cup 82 includes an inclined surface S that inclines downward as it goes outward in the radial direction of the axis Ax of the rotation holding portion 30. The inclined surface S faces the outer peripheral portion of the back surface Wb of the work W held by the holding portion 32 in the vertical direction. When the surface Wa of the work W is viewed from the direction along the axis Ax, the outer peripheral portion of the work W overlaps at least a part of the inclined surface S. When the surface Wa of the work W is viewed from the direction along the axis Ax, the central region of the work W does not overlap the inner cup 82, and the outer peripheral portion of the work W (the region other than the central region) is on the inner cup 82. overlapping.

The inner cup 82 is arranged in a state close to the work W held at the processing position by the holding portion 32. As illustrated in FIG. 14, the inner cup 82 may be arranged in a state close to the outer peripheral portion of the back surface Wb of the work W held at the processing position by the holding portion 32. In this case, the distance between the inner cup 82 and the central region of the back surface Wb of the work W is larger than the distance between the inner cup 82 and the outer peripheral portion of the back surface Wb of the work W. The upper surface of the inner cup 82 is close to the work W at the processing position to such an extent that it affects the temperature of the work W. For example, the distance (shortest distance) between the inner cup 82 and the work W at the processing position is about several mm. As described above, the inner cup 82 is a temperature-influencing member that affects the temperature of the work W when the liquid treatment is executed.

The drainage pipe 84 is connected to a liquid drainage hole 72a formed between the outer peripheral wall 74 and the partition wall 80 of the bottom wall 72. The liquid that has been shaken off from the surface Wa of the work W and has fallen flows through the path CH between the outer peripheral wall 74 or the bottom wall 186 described later and the inclined surface S of the inner cup 82, and partitions from the outer peripheral wall 74. It is guided between the wall 80 and discharged to the outside of the accommodating portion 70 through the liquid discharge hole 72a and the drain pipe 84.

The exhaust pipe 86 is connected to a gas discharge hole 72b formed in a portion of the bottom wall 72 between the inner peripheral wall 76 and the partition wall 80. By exhausting the inside of the accommodating portion 70 through the exhaust pipe 86, a down blow flowing around the peripheral edge of the work W is generated. This down blow flows through the path CH, passes between the upper end of the partition wall 80 and the inner cup 82, is guided between the inner peripheral wall 76 and the partition wall 80, and is guided through the gas discharge hole 72b and the exhaust pipe 86. It is discharged to the outside of the accommodating portion 70.

The liquid treatment unit U20 cools the inner cup 82 by supplying a fluid to the inner cup 82 of the accommodating portion 70. The fluid supplied to the inner cup 82 (hereinafter referred to as “second fluid”) may be either a solvent or a gas, and may be any kind of solvent or gas as long as the inner cup 82 can be cooled. You may. For example, the liquid treatment unit U20 further includes a solvent supply unit 90.

The solvent supply unit 90 supplies a solvent capable of cooling the inner cup 82 (hereinafter, referred to as “cooling solvent”) to the inner cup 82. The cooling solvent supplied by the solvent supply unit 90 includes, for example, thinner. The solvent supply unit 90 may supply the cooling solvent to the inclined surface S of the inner cup 82. The solvent supply unit 90 includes, for example, a discharge member 180, a tank 92, and a valve 94.

The discharge member 180 discharges the cooling solvent toward the inner cup 82. The details of the discharge member 180 will be described later. The discharge member 180 is connected to the tank 92 via the pipe line 96. The tank 92 contains a cooling solvent and supplies the cooling solvent to the discharge member 180. The valve 94 is provided in the pipeline 96. The valve 94 is, for example, an air operation valve, and adjusts the opening degree in the pipeline 96. By controlling the valve 94, it is possible to switch between a state in which the cooling solvent is discharged from the discharge member 180 and a state in which the cooling solvent is not discharged from the discharge member 180.

The discharge member 180 is located above the accommodating portion 70 (outer peripheral wall 74). The discharge member 180 is formed so as to surround the peripheral edge of the work W held by the holding portion 32. The discharge member 180 may be formed in a cylindrical shape or may be formed in a substantially C shape (arc shape), for example. As described above, the discharge member 180 may surround the entire peripheral edge of the work W held by the holding portion 32, or may partially surround the peripheral edge of the work W held by the holding portion 32. .. The discharge member 180 includes, for example, an outer peripheral wall 182, an inner peripheral wall 184, a bottom wall 186, and a top wall 188.

The outer peripheral wall 182 is formed so as to surround the inner peripheral wall 184, the bottom wall 186, and the top wall 188. The outer peripheral wall 182 may be formed in a cylindrical shape extending along the vertical direction. The lower end of the outer peripheral wall 182 is connected to the upper end of the outer peripheral wall 74. The outer peripheral wall 182 may be integrally molded with the outer peripheral wall 74 (a part of the accommodating portion 70), or may be a separate body from the outer peripheral wall 74 (a part of the accommodating portion 70). The inner peripheral wall 184 is formed so as to surround the peripheral edge of the work W held by the holding portion 32. The inner peripheral wall 184 may be formed in a cylindrical shape extending along the vertical direction.

The bottom wall 186 is formed so as to connect the outer peripheral wall 182 and the inner peripheral wall 184. The bottom wall 186 may be inclined upward from the outer peripheral wall 182 toward the inner peripheral wall 184. The bottom wall 186 may be formed in an annular shape (ring shape). The bottom wall 186 may be integrally molded with the outer peripheral wall 182 and the inner peripheral wall 184, or may be a separate body from the outer peripheral wall 182 and the inner peripheral wall 184.

The top wall 188 is formed so as to connect the outer peripheral wall 182 and the inner peripheral wall 184. The top wall 188 is located above the bottom wall 186. The top wall 188 may be formed in an annular shape (ring shape). The top wall 188 may be integrally molded with the outer peripheral wall 182 and the inner peripheral wall 184, or may be a separate body from the outer peripheral wall 182 and the inner peripheral wall 184.

The space partitioned by the outer peripheral wall 182, the inner peripheral wall 184, the bottom wall 186, and the top wall 188 functions as a storage chamber V capable of storing the cooling solvent inside. When the entire discharge member 180 is formed in an annular shape, the storage chamber V also has an annular shape. The outer peripheral wall 182 is formed with an introduction hole 192 that penetrates the outer peripheral wall 182 so as to connect the storage chamber V and the space outside the discharge member 180. The cooling solvent supplied from the tank 92 is introduced into the storage chamber V through the introduction hole 192. The introduction hole 192 may be formed so as to extend along the horizontal direction.

A plurality of dropping holes 194 are formed in the bottom wall 186 so as to communicate the space (path CH) between the discharge member 180 and the work W and the storage chamber V. The plurality of dropping holes 194 may penetrate the bottom wall 186 so as to extend along the vertical direction. The plurality of dropping holes 194 are located, for example, vertically above the inclined surface S of the inner cup 82. The plurality of dropping holes 194 are arranged along the circumferential direction about the axis Ax. The plurality of dropping holes 194 may be arranged at substantially equal intervals along the circumferential direction. The cooling solvent that has flowed into the storage chamber V through the introduction hole 192 is dropped downward through the plurality of dropping holes 194. As a result, the cooling solvent is discharged to the inclined surface S of the inner cup 82.

The liquid treatment unit U20 is also controlled by the control device 100 in the same manner as the liquid treatment unit U1 according to the first embodiment. The control unit 104 of the control device 100 causes the liquid treatment unit U20 to perform a temperature control process for adjusting the temperature of the inner cup 82, which affects the temperature of the work W at the time of executing the liquid treatment. When the temperature control process is executed, the control unit 104 lowers the temperature of the inner cup 82 by supplying the second fluid (cooling solvent) to the inner cup 82, for example, by the solvent supply unit 90. In this case, the temperature of the inner cup 82 after the temperature control process is executed is lower than the temperature of the inner cup 82 when the temperature control process is not executed. In one example, when the control unit 104 causes the liquid treatment unit U20 to execute the liquid treatment for each of the plurality of work Ws, the control unit 104 causes the liquid treatment unit U20 to execute the temperature control treatment before the liquid treatments for the plurality of work Ws a plurality of times. .. Alternatively, the control unit 104 may cause the liquid treatment unit U20 to periodically perform the temperature control treatment.

Subsequently, with reference to FIGS. 15 to 17, an example of a series of treatments including the liquid treatment and the temperature control treatment performed in the liquid treatment unit U20 according to the third embodiment will be described. FIG. 15 is a flowchart showing a series of processes sequentially performed on a plurality of works W in one liquid processing unit U20. Before this series of treatments is performed, the temperature in the liquid treatment unit U20 may be adjusted to a predetermined set temperature.

First, the control unit 104 of the control device 100 acquires the timing at which the first work W to be processed is carried into the liquid processing unit U20 (step S51). The control unit 104 carries the work W into the liquid treatment unit U20 according to, for example, the situation before the liquid treatment of the work W to be processed and the operation status of the transfer device A3 for transporting the work W to the liquid treatment unit U20. Determine when it will be done. When the timing of being carried into the liquid treatment unit U20 is determined, the timing of starting the liquid treatment to be performed after the carrying in is determined.

Next, the control unit 104 waits until the cooling start timing is reached (step S52). The cooling start timing is set according to the carry-in timing of the work W so that the temperature of the inner cup 82 becomes the target temperature when the work W is carried into the liquid treatment unit U20, for example. In one example, the cooling start timing is set before a predetermined time from the delivery timing of the work W to the liquid treatment unit U20. In this case, the liquid treatment by the liquid treatment unit U20 starts within a predetermined time after the inner cup 82 is cooled to the target temperature by supplying the second fluid (cooling solvent) to the inner cup 82. The cooling start timing will be described later.

Next, the control unit 104 causes the liquid processing unit U20 to execute a temperature control process for cooling the inner cup 82 (step S53). For example, the control unit 104 controls the liquid treatment unit U20 so as to cool the inner cup 82 by supplying the second fluid to the inner cup 82. In one example, the control unit 104 supplies the cooling solvent to the inner cup 82 by the solvent supply unit 90 so that the temperature of the inner cup 82 approaches the target temperature. A specific example of the temperature control process in step S53 will be described later.

Next, the control unit 104 waits until the delivery timing is reached (step S54). The temperature of the work W to be processed may be adjusted to a predetermined set temperature before the carry-in timing. Next, the control unit 104 controls the transfer device A3 and the liquid treatment unit U20 so as to carry the work W into the liquid treatment unit U20 (step S55). For example, step S55 is performed in the same manner as step S01 shown in FIG.

Next, the control unit 104 controls the liquid treatment unit U20 so as to perform liquid treatment on the work W held at the processing position by the holding unit 32 (step S56). For example, step S56 is performed in the same manner as step S02 shown in FIGS. 5 and 6. Next, the control unit 104 controls the transfer device A3 and the liquid treatment unit U20 so that the work W after the liquid treatment is carried out from the liquid treatment unit U20 (step S57). For example, step S57 is performed in the same manner as step S03 shown in FIG.

Next, the control unit 104 determines whether or not the processing of the predetermined number of work Ws has been completed (step S58). If it is determined in step S58 that the processing of the set number of works W has not been completed (step S58: NO), the control unit 104 repeats the processing of steps S54 to S58. On the other hand, when it is determined in step S58 that the processing of the set number of works W has been completed (step S58: YES), the control unit 104 has a series of liquid processing and temperature control processing for the set number of works W. End the process. As described above, unlike the first embodiment, the temperature control process (cooling of the inner cup 82) in step S53 is performed before a series of processes for the plurality of work Ws are executed.

FIG. 16 is a flowchart showing an example of the temperature control process in step S53. In the temperature control process of step S53, first, the control unit 104 controls the liquid process unit U20 so as to start supplying the second fluid to the inner cup 82 (step S61). For example, the control unit 104 causes the solvent supply unit 90 to start discharging the cooling solvent contained in the second fluid toward the inner cup 82. In one example, the control unit 104 causes the solvent supply unit 90 to start discharging the cooling solvent from the plurality of dropping holes 194 by switching the valve 94 of the solvent supply unit 90 from the closed state to the open state.

Next, the control unit 104 waits until a predetermined supply time elapses from the start of supply of the second fluid (step S62). The supply time is set to such that the amount required for cooling the inner cup 82 is supplied by the supply of the second fluid, and is set to, for example, several seconds or several tens of seconds. Next, the control unit 104 controls the solvent supply unit 90 so as to stop the supply of the second fluid to the inner cup 82 (step S63). For example, the control unit 104 stops the discharge of the cooling solvent to the solvent supply unit 90 by switching the valve 94 from the open state to the closed state. The above cooling solvent is supplied in a state where the holding portion 32 does not hold the work W. Therefore, the supply of the cooling solvent to the inner cup 82 suppresses the direct influence on the temperature of the work W.

Next, the control unit 104 waits until a predetermined cooling time elapses from the stop of the supply of the second fluid (step S64). As a result, the state in which the second fluid is not supplied to the inner cup 82 is maintained for the cooling time. The cooling time is set to such that the cooling solvent supplied to the inner cup 82 is sufficiently evaporated (dried), and is set to, for example, several seconds or several tens of seconds. This cooling time may be less than or equal to the supply time in step S62, or may be longer than the supply time. During the period from the stop of the supply of the second fluid to the lapse of the cooling time, the cooling of the inner cup 82 further progresses due to the heat of vaporization accompanying the evaporation of the cooling solvent.

Next, the control unit 104 determines whether or not the supply of the second fluid has been completed for a predetermined number of times (step S65). If it is determined in step S65 that the supply of the set number of times has not been completed (step S65: NO), the control unit 104 repeats steps S61 to S65. This set number of times indicates the number of times that the cooling process including the supply of the second fluid and the cooling after the supply is repeated. For example, the number of times of setting is set so that the temperature of the inner cup 82 is cooled to the target temperature. In the temperature control process of step S53, a plurality of cooling processes may be performed, or a single cooling process may be performed (step S65 may be omitted). As described above, the processing conditions for the temperature control processing in step S53 may be predetermined. The processing conditions of the temperature control processing include the supply time for supplying the second fluid, the cooling time for waiting after the supply of the second fluid, the above-mentioned set number of times, and the start timing of the temperature control process.

The control unit 104 sets at least a part of the processing conditions in the temperature control process in step S53 according to the carry-in timing (start timing of the first liquid process) of the first work W performed after the temperature control process. You may. For example, the control unit 104 sets the temperature of the inner cup 82 closer to the target temperature (so as to be included in the target range) according to the start timing of the first liquid treatment in step S56 shown in FIG. The supply time, the cooling time in step S64, and the number of times of setting in step S65 may be determined. The control unit 104 may set the start timing of the temperature control process in step S53, that is, the cooling start timing in step S52 described above according to the carry-in timing of the first work W (the start timing of the first liquid process). good.

Here, an example of a method for setting the cooling start timing will be described with reference to FIG. FIG. 17 is a graph showing the time change of the temperature of the inner cup 82 with the supply of the cooling solvent from the solvent supply unit 90. The horizontal axis shows time, and the vertical axis shows the temperature of the inner cup. In the graph of the time change of the temperature shown in FIG. 17, the supply of the cooling solvent by the solvent supply unit 90 is stopped at the time t1. Until time t1, the temperature of the inner cup 82 substantially coincides with the set temperature Ts in the liquid treatment unit U20. After time t1, the temperature of the inner cup 82 gradually decreases with the heat of vaporization of the cooling solvent. Then, at time t2, the temperature of the inner cup 82 falls below the target temperature Ta. After that, the temperature of the inner cup 82 drops to the minimum temperature and then gradually rises. The temperature of the inner cup 82 further rises after exceeding the target temperature Ta at time t3.

In the time change of the temperature of the inner cup 82 shown in FIG. 17, the time from the time t1 to the time t2 is the temperature decrease time from the completion of the supply of the cooling solvent to the decrease to the target temperature Ta. The time from the time t2 to the time t3 is a state maintenance time in which the temperature of the inner cup 82 is maintained below the target temperature Ta. The storage unit 102 may store these temperature decrease time and state maintenance time. The control unit 104 may determine the cooling start timing so that the carry-in timing (liquid processing start timing) of the work W is included in the state maintenance time. In one example, in the control unit 104, the time from the stop of the supply of the cooling solvent in the final step S63 to the delivery timing of the work W is larger than the temperature decrease time and larger than the total time of the temperature decrease time and the state maintenance time. The cooling start timing may be determined so as to be smaller. In this case, the control unit 104 starts the liquid treatment in step S56 within a predetermined time (within the state maintenance time) after the inner cup 82 is cooled to the target temperature Ta. The control unit 104 may determine the supply time in step S62, the cooling time in step S64, and the set number of times together with the cooling start timing, and these processing conditions (supply time, cooling time, and set number of times) may be determined in advance. It may be defined.

In the above example, one temperature control treatment for cooling the inner cup 82 is performed before the plurality of liquid treatments, but the temperature for cooling the inner cup 82 is performed for each liquid treatment. The preparation treatment may be performed before the liquid treatment. In the temperature control treatment for cooling the inner cup 82, a cooling gas (second fluid) may be supplied to the inner cup 82 in addition to or in place of the cooling solvent. In this case, the liquid treatment unit U20 may further have a gas supply unit that supplies cooling gas to the inner cup 82. This gas supply unit may supply cooling gas to the inner cup 82 via the discharge member 180 (storage chamber V). The cooling gas discharged from the discharge member 180 (reservoir V) is guided to the exhaust pipe 86 through the path CH, so that the inner cup 82 is cooled. Instead of the discharge member 180, cooling gas may be supplied to the inner cup 82 from another nozzle.

The control unit 104 may cause the liquid treatment unit U20 to perform a series of treatments including the liquid treatment and the temperature control treatment so that the temperature control treatment is performed periodically (for example, at a predetermined cycle). FIG. 18 is a flowchart showing another example of a series of treatments including the liquid treatment and the temperature control treatment performed in the liquid treatment unit U20 according to the third embodiment.

First, the control unit 104 causes the liquid processing unit U20 to execute a temperature control process for cooling the inner cup 82 (step S81). The temperature control process in step S81 is performed in the same manner as in step S53 shown in FIGS. 15 and 16, for example. Next, the control unit 104 determines whether or not to execute the liquid treatment in the liquid treatment unit U20 (step S82). For example, the control unit 104 determines whether or not to execute the liquid treatment according to the state before the liquid treatment of the work W to be processed and the operating state of the transport device A3 for transporting the work W to the liquid treatment unit U20. to decide.

When it is determined in step S82 that the liquid treatment is to be executed (step S82: YES), the control unit 104 carries the work W to be processed into the liquid treatment unit U20 in the same manner as in step S55 shown in FIG. The liquid processing unit U20 and the transfer device A3 are controlled so as to be performed (step S83). Next, the control unit 104 causes the liquid processing unit U20 to perform liquid treatment on the work W to be processed in the same manner as in step S56 shown in FIGS. 15 and 16 (step S84). Next, the control unit 104 controls the liquid treatment unit U20 and the transfer device A3 so that the work W to be processed is carried out from the liquid treatment unit U20 in the same manner as in step S57 shown in FIG. 15 (step S85).

On the other hand, if it is determined in step S82 that the liquid treatment is not executed (step S82: NO), the control unit 104 does not execute steps S83 to S85. When it is determined in step S82 that the liquid treatment is not executed, or after step S85 is completed, the control unit 104 determines whether or not it is the cooling start timing (step S86). For example, the control unit 104 determines whether or not a predetermined waiting time has elapsed from the reference time. The reference time is set, for example, to the end time of the temperature control process after the execution of the temperature control process, and is set (updated) to the end time of the liquid process when the liquid process is performed after the temperature control process. ). The control unit 104 determines that it is the cooling start timing when the standby time has elapsed, and determines that it is not the cooling start timing when the standby time has not elapsed.

If it is determined in step S86 that it is not the cooling start timing, the process returns to step S82. On the other hand, if it is determined in step S86 that it is the cooling start timing, the reference time is reset and the process returns to step S81 (the temperature control process is executed again). By performing the above series of processes, if the liquid process is not performed before the waiting time elapses after the temperature control process is executed, the temperature control process in step S81 is executed again. If the next liquid treatment is not performed before the waiting time elapses after the liquid treatment is performed after the temperature control treatment, the temperature control treatment in step S81 is executed again. In addition, regardless of whether or not the liquid treatment is executed, the control unit 104 continues the temperature control treatment to the liquid treatment unit U20 at a predetermined cycle (after a certain period of time has elapsed from the end of the previous temperature control treatment). You may let it run.

In addition to the temperature control treatment for cooling the inner cup 82, the control unit 104 is subjected to the inner cup by the solvent supply unit 90 between the completion of the supply of the treatment liquid in the liquid treatment and the start of the work W being carried out from the treatment position. A second fluid (eg, cooling solvent) may be supplied to 82. In this case, the control unit 104 controls the solvent supply unit 90 so as to supply the cooling solvent to the inner cup 82 when the work W for forming the film of the treatment liquid is rotated after the treatment liquid is supplied. You may. After forming the film of the treatment liquid (after the rotation of the work W is stopped), the control unit 104 applies the cooling solvent to the inner cup 82 while waiting until the work W to which the liquid treatment is carried out is started to be carried out. The solvent supply unit 90 may be controlled so as to supply the solvent.

(Effect of the third embodiment)
Also in the substrate processing method performed in the liquid treatment unit U20 according to the third embodiment, as in the first embodiment and the second embodiment, the temperature control treatment reduces the variation in temperature around the treatment position. Liquid treatment can be performed. Therefore, it is possible to suppress the fluctuation in the film thickness between the works W.

Examples of the temperature-affecting member include an inner cup 82 arranged in a state close to the outer peripheral portion of the back surface Wb of the work W in the accommodating portion 70 surrounding the work W held at the processing position. In the substrate processing method according to the third embodiment, the temperature control treatment includes cooling the inner cup 82 by supplying a second fluid to the inner cup 82. In this case, the inner cup 82, which affects the temperature of the work W, is cooled before the liquid treatment is performed, and the degree to which the ambient temperature of the treatment position drops with the execution of the liquid treatment becomes small. Therefore, the variation in temperature around the treatment position for each liquid treatment is reduced, and it is possible to suppress the variation in the film thickness between the work Ws.

In the substrate processing method according to the third embodiment, cooling the inner cup 82 by supplying the second fluid to the inner cup 82 means supplying the solvent to the inner cup 82 and supplying the solvent to the inner cup. It includes maintaining a state in which no solvent is supplied to 82. In this case, since the cooling of the inner cup proceeds by the heat of vaporization of the solvent after being supplied to the inner cup 82, it is possible to cool the inner cup 82 while suppressing the amount of the solvent used.

In the substrate processing method according to the third embodiment, the liquid treatment is started within a predetermined time after the inner cup 82 is cooled to the target temperature Ta by supplying the second fluid to the inner cup 82. In this case, the liquid treatment can be started in a state where the ambient temperature at the treatment position is lowered to the same level as the target temperature Ta.

In the substrate processing method according to the third embodiment, after the liquid treatment, the work W is carried out from the processing position, and after the supply of the processing liquid to the surface Wa of the work W is completed, the work W from the processing position is loaded. It may further include supplying a second fluid to the inner cup 82 until the carry-out starts. In this case, it is possible to suppress variations in the temperature of the inner cup 82 after the liquid treatment for each liquid treatment.

Here, the effect of the substrate processing method according to the third embodiment will be further described with reference to FIGS. 19 (a) and 19 (b). 19 (a) and 19 (b) show the measurement results of the film thickness at the central portion and the outer peripheral portion of the coating film on the surface Wa of the work W. The measurement of the film thickness in the central portion in FIGS. 19 (a) and 19 (b) is performed in the same manner as the measurement of the film thickness shown in FIG. 8, except for the method of executing the temperature control treatment. The outer peripheral portion of the coating film, which is one of the measurement targets of the film thickness, corresponds to the portion of the work W facing the inner cup 82, and corresponds to the area from approximately half of the radius of the work W to the outer edge. There is. The film thickness of a plurality of points in the outer peripheral portion is measured, and the average value is calculated as the film thickness of the outer peripheral portion. 19 (a) and 19 (b) show the film thickness measurement results for the first, third, and fifth workpieces W, and an approximate straight line based on the film thickness measurement results. Has been done. FIG. 19A shows the measurement result of the film thickness according to the comparative example when the temperature control treatment of step S53 was not executed. FIG. 19B shows the measurement result of the film thickness when the series of processes shown in FIG. 15 is executed.

Comparing the measurement results of the central portions of the coating, the slope (absolute value) of the approximate straight line indicating the degree of film thickness variation in the central portion in the measurement results of FIG. 19 (b) is the measurement result of FIG. 19 (a). It is slightly lower than the slope (absolute value) of the approximate straight line indicating the degree of film thickness fluctuation in the central part of. Comparing the measurement results of the outer peripheral portions of the coating, the slope (absolute value) of the approximate straight line indicating the degree of film thickness variation in the outer peripheral portion in the measurement result of FIG. 19 (b) is the measurement result of FIG. 19 (a). It is reduced to about 1/3 of the slope (absolute value) of the approximate straight line indicating the degree of film thickness fluctuation in the outer peripheral portion. As described above, from the measurement results of FIGS. 19 (a) and 19 (b), it can be seen that the film thickness fluctuation in the outer peripheral portion is suppressed by executing the temperature control process in step S53.

[Modification example]
The disclosure herein should be considered exemplary and not restrictive in all respects. Various omissions, substitutions, changes, etc. may be made to the above examples (first embodiment to third embodiment) within the scope of the claims and the scope thereof.

The control unit 104 executes both the temperature control process for cooling the holding unit 32 in the second embodiment and the temperature control process for cooling the inner cup 82 in the third embodiment before the liquid treatment. The liquid treatment unit U1 may be controlled. Instead of cooling the inner cup 82, the control unit 104 may cause the liquid treatment unit U1 to perform a temperature control process for raising the temperature of the inner cup 82. In this case, the control unit 104 executes both the temperature control process for raising the temperature of the holding unit 32 and the temperature control process for raising the temperature of the inner cup 82 in the liquid treatment unit U1 by rotating the holding unit 32. You may let me.

The temperature-affecting member is a member other than the holding portion 32 and the inner cup 82 as long as it is a member that is in contact with or is close to the work W and that affects the temperature of the work W at the time of executing the liquid treatment. You may. In the above example, the liquid treatment for forming the coating film of the resist liquid is exemplified, but the coating film of the treatment liquid other than the resist liquid (for example, the coating film of the treatment liquid for forming the lower layer film or the upper layer film) is formed. Any temperature control treatment may be performed before the liquid treatment.

2 ... Coating / developing device, 30 ... Rotational holding part, 32 ... Holding part, 40 ... Processing liquid supply part, 50 ... Solvent supply part, 60 ... Gas supply part, 70 ... Storage part, 82 ... Inner cup, 90 ... Solvent Supply unit, 100 ... control device, U1 ... liquid processing unit, W ... work, Wa ... front surface, Wb ... back surface.

Claims (11)

The treatment liquid is supplied to the surface of the substrate held at the treatment position by using a liquid treatment unit that holds the substrate at a predetermined processing position and supplies the treatment liquid to the surface of the substrate. That, after the supply of the treatment liquid, the liquid treatment including holding the substrate so that a film of the treatment liquid is formed on the surface of the substrate is performed.
A substrate treatment method comprising performing a temperature control treatment for adjusting the temperature of a member of the liquid treatment unit that affects the temperature of the substrate at the time of executing the liquid treatment before the liquid treatment. The substrate treatment method according to claim 1, wherein the treatment conditions in the temperature control treatment are set according to the start timing of the liquid treatment. The member includes a holding portion that supports the back surface of the substrate so as to hold the substrate at the processing position.
The substrate processing method according to claim 1 or 2, wherein the temperature control treatment includes cooling the holding portion by supplying a first fluid to the holding portion. Supplying the treatment liquid to the surface of the substrate means to supply the treatment liquid to the surface of the substrate while rotating the holding portion in a state of supporting the substrate by a rotation driving unit connected to the holding portion. Including supplying the treatment liquid
The substrate processing method according to claim 3, wherein supplying the first fluid to the holding portion includes supplying the first fluid to the central portion of the holding portion. The member includes an inner cup arranged in a state close to the outer peripheral portion of the back surface of the substrate among the accommodating portions surrounding the substrate held at the processing position.
The substrate processing method according to any one of claims 1 to 4, wherein the temperature control treatment includes cooling the inner cup by supplying a second fluid to the inner cup. Cooling the inner cup by supplying the second fluid to the inner cup means supplying the solvent to the inner cup and not supplying the solvent to the inner cup after the supply of the solvent. The substrate processing method according to claim 5, which comprises maintaining a state. The substrate processing method according to claim 5 or 6, wherein the liquid treatment is started within a predetermined time after the inner cup is cooled to a target temperature by supplying the second fluid to the inner cup. After the liquid treatment, the substrate is carried out from the treatment position, and
Further including supplying the second fluid to the inner cup during the period from the completion of the supply of the treatment liquid to the surface of the substrate to the start of carrying out the substrate from the treatment position. , The substrate processing method according to any one of claims 5 to 7. The member includes a holding portion that supports the back surface of the substrate so as to hold the substrate at the processing position.
Supplying the treatment liquid to the surface of the substrate includes supplying the treatment liquid to the surface of the substrate while rotating the holding portion in a state of supporting the substrate.
The substrate treatment according to claim 1 or 2, wherein the temperature control treatment includes raising the temperature of the holding portion by rotating the holding portion in a state where the holding portion does not support the substrate. Method. A computer-readable storage medium in which a program for causing an apparatus to execute the substrate processing method according to any one of claims 1 to 9 is stored. A liquid treatment unit that holds the substrate in a predetermined treatment position and supplies the treatment liquid to the surface of the substrate.
A control unit that controls the liquid treatment unit is provided.
The control unit is
The substrate is supplied so that the treatment liquid is supplied to the surface of the substrate held at the treatment position and a film of the treatment liquid is formed on the surface of the substrate after the treatment liquid is supplied. The liquid treatment unit is allowed to perform liquid treatment including holding.
A substrate processing apparatus that causes the liquid treatment unit to perform temperature control processing for adjusting the temperature of a member of the liquid treatment unit that affects the temperature of the substrate at the time of execution of the liquid treatment. ..

Images