JP2022038996A - Sealant and packaging material used for transporting packaging body of silicon material, transporting packaging body of silicon material, and package of silicon material - Google Patents

Abstract

To provide a sealant used for a transporting packaging body of a silicon material and well in slidability, transparency and cleanliness and a packaging material using the sealant, a transporting packaging body of a silicon material, and a package of a silicon material.SOLUTION: A sealant used for a transporting packaging body of a silicon material comprises a first surface positioned closer to a silicon material in a transporting packaging body and a second surface opposite to the first surface. The sealant comprises a first portion including the first surface and a second portion positioned closer to the second surface than the first portion. The first portion includes low-density polyethylene (LDPE) and the second portion includes linear low-density polyethylene (LLDPE), and the first surface has a fractal dimension D falling in a range of 1.50-1.90 and the first surface has a persistent homology value N10 equal to or greater than 1.0.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to sealants and packaging materials used for transport packages of silicon materials, transport packages of silicon materials, and packages of silicon materials.

High cleanliness is required for silicon wafers used in the manufacture of semiconductor products and silicon materials such as polysilicon used as raw materials for silicon wafers. For example, when transporting a silicon wafer, the silicon wafer is stored in a cleanly cleaned resin case, and the resin case in which the silicon wafer is stored is after being labeled with information about the silicon wafer. Each resin case is packaged in a clean package and sealed. As such a package, for example, Patent Document 1 describes a dust-free packaging bag for packaging electronic parts and the like, which comprises a laminate of at least two layers of a base material layer including an outermost layer film and a sealant layer of the innermost layer. The surface of the outermost layer film has a static friction coefficient (μs) of 0.40 or less, a dynamic friction coefficient (μk) of 0.35 or less, and a surface roughness (Ra) of 0.10 to 0.40 μm. In addition to being formed on the rough surface of the base material, an adhesive layer or an adhesive primer layer containing at least one antistatic agent is provided inside or on the innermost surface of the base material layer, which is excellent in automatic packaging suitability. The dust packaging bag is disclosed.

Japanese Unexamined Patent Publication No. 2013-136405

The sealant of the packaging material constituting the transportation package of the silicon material is required to have good slipperiness. For example, if the sealants have poor slipperiness, it will be difficult to open the package, and if the sealants and the resin case have poor slipperiness, it will be difficult to put the resin case in and out of the package. Occur.

In addition, the sealant of the packaging material constituting the transportation package of the silicon material is also required to have good transparency. For sealants with poor transparency, for example, it is difficult to check the information on the label attached to the resin case or the state of the silicon wafer or resin case when the package is unopened, or the sealant. There is a problem that it is difficult to confirm the foreign matter existing in.

However, slipperiness and transparency may be in a trade-off relationship, and in addition to these, the sealant used for the transportation package of the silicon material is required to have a high degree of cleanliness as a basic required characteristic. It is not easy to obtain a sealant having good slipperiness and good transparency while having a high degree of cleanliness that can be used for a package for transporting a silicon material.

The present disclosure is used in a packaging material for transporting a silicon material, and a sealant having good slipperiness, transparency, and cleanliness, and a packaging material using the sealant, a packaging material for transporting a silicon material, and a silicon material. The subject is to provide the packaging body of.

In order to solve the above problems, one embodiment of the present disclosure is a sealant used for a transport package of a silicon material, wherein the sealant is located on the silicon material side in the transport package. The sealant has a surface and a second surface facing the first surface, and the sealant has a first portion including the first surface and a second portion located on the second surface side of the first portion. The first portion comprises low density polyethylene (LDPE), the second portion comprises linear low density polyethylene (LLDPE), and the fractal dimension D of the first surface is 1.50 to 1.90. Provided is a sealant having a value N ₁₀ of the persistent homology of the first surface of 1.0 or more.

One embodiment of the present disclosure provides a packaging material comprising a substrate and the aforementioned sealant provided on one side of the substrate.

The base material may further have a gas barrier layer provided on the side opposite to the sealant, and the gas barrier layer may contain an aluminum oxide or a silicon oxide.

One embodiment of the present disclosure provides a transport package of a silicone material made of the above-mentioned packaging material. One embodiment of the present disclosure provides a package of silicon material comprising the above-mentioned transport package of silicon material and the silicon material contained in the package for transport of the silicon material.

According to the present disclosure, a sealant used for a transport package of a silicon material and having good slipperiness, transparency, and cleanliness, and a package material using the sealant, a transport package of a silicon material, and a sealant. A package of silicon material can be provided.

FIG. 1 is a partially enlarged cut end view showing a schematic configuration of a sealant according to an embodiment of the present disclosure. FIG. 2 is a partially enlarged cut end view showing a schematic configuration of another aspect of the sealant according to the embodiment of the present disclosure. FIG. 3 is a partially enlarged cut end view showing a schematic configuration of another aspect of the sealant according to one embodiment of the present disclosure. FIG. 4 is a partially enlarged cut end view showing a schematic configuration of a packaging material according to an embodiment of the present disclosure. FIG. 5 is a partially enlarged end-view view showing a schematic configuration of another aspect of the packaging material in one embodiment of the present disclosure. FIG. 6 is a schematic diagram schematically showing the configuration of an example of a manufacturing apparatus capable of manufacturing a packaging material according to an embodiment of the present disclosure. FIG. 7 is a perspective view showing a schematic configuration of a package for transporting a silicon material according to an embodiment of the present disclosure. FIG. 8 is a perspective view showing a schematic configuration of a package of silicon material according to an embodiment of the present disclosure. FIG. 9 is a perspective view showing a schematic configuration of a package of silicon material according to an embodiment of the present disclosure.

Embodiments of the present disclosure will be described with reference to the drawings.
In the drawings, the shape, scale, aspect ratio, etc. of each part may be changed or exaggerated from the actual product for easy understanding. In the present specification and the like, terms such as "film", "sheet", and "board" are not distinguished from each other based on the difference in designation. For example, "board" is a concept that also includes members that may be commonly referred to as "sheets" or "films".

[Sealant]
A sealant used for a transport package of a silicon material, wherein the sealant has a first surface located on the silicon material side and a second surface facing the first surface in the transport package. The sealant has a first portion including the first surface and a second portion located on the second surface side of the first portion, wherein the first portion is made of low density polyethylene (LDPE). The second portion comprises linear low density polyethylene (LLDPE), the fractal dimension D of the first surface is in the range of 1.50 to 1.90, and the persistent homology of the first surface. The value N ₁₀ is 1.0 or more. The sealant according to the present embodiment has good slipperiness, transparency, and cleanliness.

The first portion may further comprise linear low density polyethylene (LLDPE), high density polyethylene (HDPE), or polypropylene (PP). For example, the fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted. The sealant is a laminate having a first layer including the first surface and a second layer, and the first portion may be the first layer. The fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted. The sealant is a laminate having a first layer including the first surface and a second layer, the first portion is the first layer, and the second portion is the second layer. May be good. The fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted. The sealant substrate may further include a third portion comprising the second surface, which portion may contain low density polyethylene (LDPE). The fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted. The sealant is a laminate having a first layer, a second layer, and a third layer including the first surface in this order, the first portion is the first layer, and the second portion is. , The second layer, and the third portion may be the third layer. The fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted. The second portion may further comprise low density polyethylene (LDPE). The fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted.

Further, the sealant according to the present embodiment is a sealant used for a transport package of a silicon material, and the sealant is a first surface located on the silicon material side of the transport package and the first surface. It is a monolayer consisting of only one layer having a second surface facing the surface, the sealant has a first portion including the first surface, and the first portion is low density polyethylene (the first portion). LDPE), the sealant further comprising a second portion located closer to the second surface than the first portion, the second portion comprising linear low density polyethylene (LLDPE) in the sealant. The content ratio of low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) is in the range of 1: 1 to 7: 3 on a mass basis, and the fractal dimension D of the first surface is 1.50 to 1. It is in the range of 90, and the value N ₁₀ of the persistent homology on the first surface is 1.0 or more. The sealant according to the present embodiment has good slipperiness, transparency, and cleanliness.

The slip agent may not be substantially added to the low density polyethylene (LDPE). The fractal dimension D of the first surface and the persistent homology N ₁₀ can be easily adjusted.

The sealant 10 according to the present embodiment is used for a package for transporting a silicon material, and has a first surface 11A located on the silicon material side and a second surface 11B facing the first surface 11A in the package for transportation. A third portion comprising a heat-sealable sealant substrate 11 including a first surface 11A, a second portion located on the second surface 11B side of the first portion, and a second surface 11B. Has a portion. The sealant 10 according to the present embodiment may be a laminated body (see FIGS. 1 and 2) or a single layer body (see FIG. 3). For example, the first layer 111 located on the first surface 11A side, the third layer 113 located on the second surface 11B side, and the second layer 112 sandwiched between the first layer 111 and the third layer 113. The first portion may be the first layer 111, the second portion may be the second layer 112, and the third portion may be the third layer 113 (see FIG. 1). It is a laminate having one layer 111 and a second layer 112, the first portion may be the first layer 111, and the second portion may be the second layer 112 (see FIG. 2). Further, it may be a single layer body having the first surface 11A and the second surface 11B (see FIG. 3). The sealant 10 according to the present embodiment may be a laminated body (see FIGS. 1 and 2) or a single layer body (see FIG. 3), but is a single layer from the viewpoint of adjusting the surface shape of the sealant. A laminate of two or more layers, which has more choices than a body, is preferred over a monolayer.

The fractal dimension D of the first surface 11A of the sealant 10 according to the present embodiment is in the range of 1.50 to 1.90, and the value N ₁₀ of the persistent homology of the first surface 11A is 1.0 or more. .. When the fractal dimension D of the first surface 11A is within a predetermined range, the slipperiness between the first surfaces 11A of the sealant 10 and the good slipperiness between the first surface 11A and the resin case for storing the silicon wafer. Can be obtained. Further, when the fractal dimension D of the first surface 11A is within a predetermined range, good cleanliness of the sealant 10 can be ensured. Further, when the value N ₁₀ of the persistent homology of the first surface 11A is within a predetermined range, good transparency of the sealant 10 can be ensured. Thereby, when the silicon material is packaged in the packaging material 40 (see FIG. 7) for transporting the silicon material produced from the packaging material 20 (see FIGS. 4 and 5) containing the sealant 10, the silicon material is transported. It is possible to prevent the visibility inside the package 40 from being deteriorated by the sealant 10. In addition, it can be easily confirmed whether or not foreign matter is attached to the first surface 11A of the sealant 10 in the transport package 40 of the silicon material.

Generally, a resin case for storing a silicon wafer is automatically packaged in a package for transporting a silicon material by using an automatic packing machine. In this automatic packing machine, the packages are automatically opened to store the resin case, but the packages before the opening are stacked so that the surfaces of the sealants are in contact with each other. In order for packaging using an automatic packing machine to be performed smoothly, it is required that the package can be opened automatically and easily. For that purpose, it is required that the sealants of the packaging materials constituting the packaging body have good slipperiness. Further, in order to facilitate the insertion of the resin case from the opening of the package and the removal of the resin case from the opened package, it is required that the resin case and the sealant have good slipperiness.

On the other hand, it is desirable that the packaging material constituting the transport package of the silicon material and the sealant located in the innermost layer thereof have good transparency. For example, a resin case containing a silicon wafer may be labeled with information about the silicon wafer. If the packaging material and the sealant have good transparency, the label information can be visually confirmed or confirmed by a reading device in the unopened state of the package. It is also possible to confirm damage or discoloration of the silicon wafer or resin case during transportation in an unopened state of the package. In particular, the package of silicon material is opened in a clean room in order to maintain the cleanliness (cleanliness) of the silicon wafer. Due to the lighting in the clean room, if the packaging material and sealant are not highly transparent, there is a problem that the inside of the unopened package is difficult to see. Therefore, the packaging material constituting the packaging for transporting the silicon material should have transparency to the extent that the label information and the state of the silicon wafer and the resin case can be visually recognized and read by a reading device in the clean room. Is preferable. Further, for example, the surface of the sealant in the package for transporting the silicon material comes into direct contact with the resin case for storing the silicon wafer. Therefore, if foreign matter adheres to the surface of the sealant, the silicon wafer packaged in the package will be affected. Foreign matter may adhere. It is desirable to remove the package or sealant to which foreign matter is attached before use because it is not suitable for transporting silicon wafers. Since the packaging material and sealant are transparent to the extent that foreign matter can be visually recognized, the presence of foreign matter can be confirmed before packaging the resin case in the package, and contamination of the silicon wafer can be prevented. Can be prevented. Foreign matter can be confirmed by visually observing the package, packaging material or its intermediate material, or sealant, or by using an inspection device. Since both sides of the sealant can be confirmed at the same time, the sealant is preferably transparent to such an extent that foreign matter present in the sealant can be visually recognized or recognized by an inspection device through the sealant.

However, it is easy for the present inventors to obtain a sealant having good slipperiness and transparency required for a silicone material transport package as a sealant used for a silicon material transport package. I noticed that it wasn't. The reason is that the sealant used for the transportation packaging of silicon material is required to ensure high cleanliness as a premise, so there are restrictions on raw materials, manufacturing machines, conditions or processes, film composition, etc. Because there are many. For example, slip agents commonly used for adjusting slipperiness are restricted in their use because they themselves may become foreign substances. For example, the use of a printing roll generally used for adjusting the surface shape of a film is not preferable because foreign matter may be transferred. Alternatively, as factors that can affect slipperiness and transparency, for example, the type and amount of resin used as a raw material, the laminated structure and thickness of the sealant, etc. can be considered. It is selected from the viewpoint of obtaining, and then it is required to increase the slipperiness and transparency within the allowable range under the selected conditions. Moreover, as will be described later, slipperiness and transparency may be in a trade-off relationship. Therefore, the present inventors have noticed that the surface condition of the sealant is important for the sealant used for the transport package of the silicon material, and the slipperiness and transparency required for the transport package of the silicon material. And, from the viewpoint of cleanliness, we noticed that the fractal dimension D and the value N ₁₀ of the persistent homology should be focused on as an index showing the surface state, and the fractal dimension D is in the range of 1.50 to 1.90. In addition, when the value N ₁₀ of the persistent homology is 1.0 or more, a sealant having good slipperiness, transparency, and cleanliness required for the transport package of the silicon material can be obtained. The present invention was completed by noticing that it was possible.

The fractal dimension D is an index showing the complexity and fractal property of the surface state (surface structure) of an object (object). Generally, the sealant is formed so as to make the surface flat, but when the sealant is formed or the like, slight irregularities (waviness) on the order of nanometers are present on the surface of the sealant. The fact that the fractal dimension D of the sealant surface is a relatively small value (for example, less than 1.50) means that in a sealant formed so that the surface is flat, slight unevenness (for example, that may occur during the formation of the sealant). It can be said that there are irregularities with a size larger than the swell). Since such unevenness is caused by additives and the like contained in the sealant, it can be said that the smaller the fractal dimension D of the sealant surface is, the lower the cleanliness is. On the other hand, the fact that the fractal dimension D of the sealant surface is a relatively large value means that only slight irregularities (waviness) that occur during film formation of the sealant are present on the sealant surface. That is, it is considered that only slight irregularities (waviness) that occur during film formation of the sealant can be present on the sealant surface because the sealant does not contain additives or the like, and therefore the fractal dimension of the sealant surface. It can be said that the larger the value of D, the higher the cleanliness.

The value N ₁₀ of the persistent homology is an index that relatively represents the size of the unevenness on the surface of the object (object). As described above, the sealant is generally formed so as to flatten its surface, but slight irregularities (waviness) on the order of nanometers are present on the surface of the sealant when the sealant is formed. Will end up. In the sealant formed so that the surface is flat as described above, the fact that the value N ₁₀ of the persistent homology of the sealant surface is a relatively large value means that the plurality of irregularities existing on the sealant surface are present. A state in which the concave portions (or convex portions) are relatively close to each other (for example, a plurality of concave portions (or convex portions) located so as to form a substantially annular shape in close proximity to each other and located in the annular portion). It is a state in which a relatively large number of uneven groups consisting of one or more convex portions (or concave portions) are present on the sealant surface), and when the wavelength of visible light is taken into consideration, light is emitted by the unevenness of the sealant surface. It can be said that it is difficult to reflect. That is, it can be said that the larger the value N ₁₀ of the persistent homology on the surface of the sealant is, the higher the transparency of the sealant is. On the other hand, the fact that the value N ₁₀ of the persistent homology on the sealant surface is a relatively small value means that a plurality of uneven concave portions (or convex portions) existing on the sealant surface are present at relatively distant positions. (For example, the unevenness group is present or absent in a relatively small number on the sealant surface), and the light on the sealant surface is easily reflected when the wavelength of visible light is taken into consideration. be able to. That is, it can be said that the smaller the value N ₁₀ of the persistent homology on the surface of the sealant is, the lower the transparency of the sealant is.

In the present embodiment, the fractal dimension D of the first surface 11A of the sealant 10 is in the range of 1.50 to 1.90, and the value of the persistent homology N ₁₀ of the first surface 11A of the sealant 10 is 1. When it is 0 or less, good transparency of the sealant 10 can be ensured, slipperiness between the first surfaces 11A of the sealant 10 and between the first surface 11A and the resin case for storing the silicon wafer. The slipperiness of the material can also be obtained, and the cleanliness required for a transport package made of a silicon material can be obtained. Sealants used in shipping packaging of silicon materials have restrictions on the use of slip agents and printing rolls, so they have good slipperiness even with reduced use or virtually no use of slip agents and printing rolls. The sealant of the present embodiment capable of obtaining the above-mentioned sealant is particularly suitable as a sealant used for a package for transporting a silicon material.

In the present embodiment, the fractal dimension D of the first surface 11A of the sealant 10 can be obtained, for example, as follows.
The first surface 11A of the sealant 10 is imaged under the following conditions using, for example, a white interferometric optical microscope (manufactured by Zygo, product name: NewView6300 type), and a gray scale including the height information of the first surface 11A. The image (496 pixels × 496 pixels) is acquired.
[Measurement condition]
-Measuring device: White interferometric optical microscope (manufactured by Zygo, product name: NewView6300 type)
-Objective lens: 50x-Zoom lens: 1x-Number of measurement pixels: 496 pixels x 496 pixels-Field of view: 216μm x 216μm
[Analysis conditions]
-Analysis software: MetroPro ver8.3.2
-Removed: Cylinder
・ FilterType: None

Grayscale images are subjected to Threat processing (Image-Adjust-Treshold: Select Otsu) using, for example, image analysis software ImageJ (image analysis freeware developed by the National Institute of Public Health (NIH)). The grayscale image is converted into a binarized image so that the convex portion existing on the first surface 11A of the sealant 10 is white and the concave portion is black. The grayscale image may be converted into a binarized image so that the convex portion existing on the first surface 11A of the sealant 10 is black and the concave portion is white.

The binarized image is converted into a contour image (background white, contour width 2 pixels) by performing contour extraction processing (Prosess-Find Edges) using, for example, image analysis software ImageJ.

For the contour image, for example, the image analysis software ImageJ is used to perform fractal analysis by the box counting method, and the fractal dimension D is calculated. Specifically, the number of portions having a signal value included in the pixel by changing the size of the pixel (length a of one side) (the pixel in the black portion because the background color is white in this embodiment). The fractal dimension D can be calculated by counting (N (a)) and obtaining the slope of each log-log (log (a) vs. log (N (a))) graph.

The value N ₁₀ of the persistent homology of the first surface 11A of the sealant 10 can be obtained, for example, as follows.
After reducing the grayscale image (496 pixels x 496 pixels) acquired in the above-mentioned calculation of the fractal dimension D to a size of 120 pixels x 120 pixels, for example, the image analysis software ImageJ (National Institute of Public Health (NIH)) Using the developed image analysis freeware), the grayscale image whose size has been reduced is subjected to Threshold processing (Image-Adjust-Treshold: Otsu is selected), and the convex portion existing on the first surface 11A of the sealant 10 is formed. The grayscale image is converted into a binarized image so that it is white and the recesses are black. If a grayscale image having a size of 120 pixels × 120 pixels can be acquired using a white interference type optical microscope, the grayscale image does not have to be reduced. Further, the grayscale image may be converted into a binarized image so that the convex portion existing on the first surface 11A of the sealant 10 is black and the concave portion is white.

For the binarized image, the scale of the recess is calculated using persistent homology. Persistent Homology is an image for characterizing the transition of m-dimensional (m = 1 in this embodiment) hole in an object (in this embodiment, a set of white points of a binarized image). It is an analysis method. Persistent homology can be used to examine features related to point placement. In this embodiment, the scale of the concave portion located between the convex portions is calculated. Specifically, when each white point in the object is gradually increased in a circular shape, the white points are connected in the process, and a cyclic complex having a cavity in the substantially center is formed. If each white point is increased as it is, the cavity disappears. Then, the diameter X of each white point at the time when the annular complex is generated (hereinafter referred to as "occurrence diameter") X and the diameter of each white point in the circle at the time when the cavity disappears (hereinafter referred to as "disappearance diameter"). ) Find Y. Regarding the generation diameter X and the disappearance diameter Y, the generation diameter X and the disappearance diameter Y are obtained for the cyclic complex formed in the binarized image using statistical analysis software (for example, R's TDA (Topological Data Analysis) library or the like). Is converted to the μm scale and calculated. Then, the number of cyclic complexes satisfying the following formula is calculated.
Y ≧ X + 10
The value N ₁₀ of the persistent homology obtains the grayscale images of a plurality of arbitrarily selected locations (for example, three locations) on the first surface 11A of the sealant 10, and the cyclic complex calculated from each image. It may be obtained as the average value of the numbers.

The fractal dimension D of the first surface 11A may be in the range of 1.50 to 1.90, preferably in the range of 1.70 to 1.85, and preferably in the range of 1.70 to 1.80. Is more preferable. Further, the value N ₁₀ of the persistent homology may be 1.0 or more, preferably in the range of 2.0 to 10.0, and more preferably in the range of 3.0 to 9.0. preferable.

The thickness T10 of the sealant 10 shown in FIGS. 1 to 3 can be appropriately set according to a desired thickness of a package for transporting a silicon material composed of a packaging material containing the sealant 10, a desired heat seal strength, and the like. However, for example, it may be about 30 to 60 μm.

The first layer 111 corresponding to the first portion located on the first surface side 11A side of the sealant 10 shown in FIGS. 1 and 2 is, for example, a low-density polyethylene to which a slip agent is substantially not added (hereinafter, “” It is a layer containing "LDPE") as a main component. By containing LDPE as the main component of the first layer 111, it is possible to suppress the volatilization of the small molecule component of the sealant. By forming the first layer 111 as a layer to which the slip agent is not substantially added, it is possible to suppress the occurrence of surface irregularities due to the slip agent, so that the fractal dimension of the first surface 11A of the sealant 10 can be suppressed. It becomes easy to set D in the range of 1.50 to 1.90 and the value N ₁₀ of the persistent homology of the first surface 11A to 1.0 or more.

Examples of the slip agent include particles such as calcium carbonate and talc, and surfactants such as a silicone resin and a quaternary ammonium salt compound, but the use of the slip agent may be reduced or substantially not used. This makes it possible to suppress the possibility that unevenness due to the shape and size of the slip agent and unevenness due to the affinity with other components of the first layer 111 such as LDPE may occur on the surface of the sealant. In the present embodiment, the fact that the slip agent is not substantially added means that the fractal dimension D of the first surface 11A is in the range of 1.50 to 1.90, and the persistent homozygous of the first surface 11A. The purpose is to allow the slip agent to be added to the extent that the log value N ₁₀ can be in the range of 1.0 or more. Further, in the present embodiment, the embodiment in which the slip agent is not substantially added is described, but the present invention is not limited to this, and for example, flat particles or particles having a small size may be used, or the particles may be used. By adjusting the type and amount of the surfactant to generate the desired unevenness, the fractal dimension D of the first surface 11A of the sealant 10 is in the range of 1.50 to 1.90, and the persistent dimension of the first surface 11A is set. The homology value N ₁₀ may be 1.0 or more.

The content of LDPE in the first layer 111 of the sealant 10 shown in FIGS. 1 and 2 is 50% by mass to 100% by mass with respect to the total amount of the resin components. The first layer 111 may contain a plurality of types of LDPE having different densities, molecular weight distributions, and the like. In addition to LDPE, the first layer 111 includes, for example, linear low density polyethylene (hereinafter referred to as "LLDPE"), high density polyethylene (hereinafter referred to as "HDPE"), polypropylene (hereinafter referred to as "PP"). A resin having a heat-sealing property such as) may be contained in a content of 0% by mass to 50% by mass with respect to the total amount of the resin component. By combining a plurality of types of resins having different affinities, the unevenness generated in the first layer 111 is adjusted, and the fractal dimension D of the first surface 11A of the sealant 10 is in the range of 1.50 to 1.90 and the first surface. It becomes possible to adjust the value N10 of the persistent homology of 11A to _1.0 or more. In the sealant 10 shown in FIGS. 1 and 2, the first layer 111 contains LDPE as a main component, but the present invention is not limited to this. For example, the first layer 111 includes LLDPE and HDPE. , PP and other heat-sealing resins may be contained in an amount of 50% by mass to 100% by mass with respect to the total amount of the resin components, and may not contain LDPE.

Similar to the first layer 111, the third layer 113 corresponding to the third portion located on the second surface 11B side of the sealant 10 shown in FIG. 1 is mainly composed of, for example, LDPE to which a slip agent is substantially not added. It is a layer contained as an ingredient. However, in the present embodiment, similarly to the first layer 111, the third layer 113 is not limited to the layer containing LDPE as a main component to which the slip agent is not substantially added, and for example, LLDPE, HDPE, PP. Such a resin having a heat-sealing property may be contained in an amount of 50% by mass to 100% by mass with respect to the total amount of the resin component, and may not contain LDPE.

The second layer 112 corresponding to the second portion of the sealant 10 shown in FIGS. 1 and 2 is, for example, a layer containing LLDPE. When the volatile component derived from the sealant 10 (outgas component derived from the sealant 10) located in the innermost layer of the transport package of the silicon material adheres to the silicon material such as the silicon wafer or polysilicon which is the content, the silicon is silicon. There is a risk of causing defects in semiconductor devices manufactured using wafers. Therefore, it is desirable that the amount of volatile components derived from the sealant 10 is as small as possible. In order to reduce the volatile components derived from the sealant 10, it is desirable to reduce the thickness T10 of the sealant 10. In this respect, since LLDPE has higher elasticity and resistance to bending than LDPE, the thickness T10 of the sealant 10 can be made relatively thin by using LLDPE as the sealant 10.

Further, since the resin case 51 is housed in the transport package 40 of the silicon material and then degassed from the transport package 40 of the silicon material and packed, the packaging material constituting the transport package 40 of the silicon material is formed. The sealant 10 contained in the above is required to have good followability. Also in this respect, the use of LLDPE improves the followability of the sealant 10. However, since the pressure at the time of polymerization of LLDPE is lower than the pressure at the time of polymerization of LDPE, a small molecule component is generated and easily volatilized as compared with LDPE. Therefore, as shown in FIG. 1, the second layer 112 containing LLDPE is positioned between the first layer 111 containing LDPE as a main component and the third layer 113, so that the thickness T10 of the sealant 10 is relatively increased. It can be made thinner and can prevent low molecular weight components from volatilizing from LLDPE.

The content of LLDPE in the second layer 112 of the sealant 10 shown in FIGS. 1 and 2 is 20% by mass to 100% by mass, preferably 30% by mass to 80% by mass, more preferably with respect to the total amount of the resin components. Is 40% by mass to 60% by mass. In addition to LLDPE, the second layer 112 may contain, for example, a heat-sealing resin such as LDPE, HDPE, PP, etc. in a content of 0% by mass to 80% by mass with respect to the total amount of the resin component. .. Since the affinity between the LLDPE of the second layer 112 and the LDPE which is the main component of the first layer 111 or the third layer 113 is relatively high, the second layer 112 contains LDPE in addition to the LLDPE. Is preferable. In addition, surface irregularities may be intentionally formed by adding HDPE or PP, which has a relatively low affinity with LLDPE. In the embodiment shown in FIGS. 1 and 2, the second layer 112 shows that the second layer 112 contains 20% by mass to 100% by mass of LLDPE with respect to the total amount of the resin component, but the present invention is not limited to this, and for example. In the second layer 112, the content of LLDPE may be less than 20% by mass with respect to the total amount of the resin component, and a heat-sealing resin such as LDPE, HDPE, or PP may be used with respect to the total amount of the resin component. It may contain an amount of more than 50% by mass and may not contain LDPE.

By adjusting the raw materials and processing of the second layer 112, the fractal dimension D of the first surface 11A of the sealant 10 is in the range of 1.50 to 1.90, and the value of the persistent homology of the first surface 11A. It can be in the range where N ₁₀ is 1.0 or more. The surface shape of the first surface 11A of the sealant 10 changes depending on the unevenness of the interface between the second layer 112 and the first layer 111 and the affinity between the raw material of the second layer 112 and the raw material of the first layer 111. For example, a slip agent such as particles or a surfactant may be added to the second layer 112, the amount of the slip agent used in the second layer 112 may be reduced or the slip agent may not be added, or the second layer 112 may be printed. The first layer 111 is formed after pressing with a button to obtain a desired surface shape, or a material having a low affinity or a high affinity for the raw material of the first layer 111 is selected for the second layer 112. By adjusting the surface shape of the first surface 11A of the sealant 10, the fractal dimension D is in the range of 1.50 to 1.90, and the value N ₁₀ of the persistent homology of the first surface 11A is 1. It can be 0 or more.

In the sealant 10 shown in FIG. 3, the sealant base material 11 of the single-layer structure contains LDPE and LLDPE. In this sealant base material 11, the blending ratio of LDPE and LLDPE may be about 1: 1 to 7: 3. As described above, since the blending amount of LDPE is larger than the blending amount of LLDPE, the abundance of LDPE can be increased on the first surface 11A side of the sealant base material 11, and the thickness T10 of the sealant 10 can be increased by LLDPE. It can be made thinner and can prevent low molecular weight components from volatilizing. The fractal dimension D and the persistent homology value N ₁₀ of the first surface 11A of the sealant 10 shown in FIG. 3 can be adjusted in the same manner as the first layer 111 of the sealant 10 shown in FIG. 1 described above.

The sealant 10 in this embodiment can be produced by using a conventionally known film forming method. For example, the sealant 10 shown in FIG. 1 can be produced by laminating the third layer 113, the second layer 112, and the first layer 111 by using a coating method such as a die coating method, an extrusion inflation method, or the like. The sealant 10 shown in FIGS. 2 and 3 can also be manufactured by similarly using a coating method, an extrusion inflation method, or the like.

[Packaging material]
FIG. 4 is a partially enlarged cut end view showing a schematic configuration of the packaging material according to the embodiment of the present disclosure, and FIG. 5 shows a schematic configuration of another aspect of the packaging material according to the embodiment of the present disclosure. It is a partially enlarged end view.

As shown in FIG. 4, the packaging material 20 has a laminated structure in which the sealant 10 is laminated so that the second surface 11B is brought into contact with one surface side of the base material 21. The base material 21 is, for example, one kind of resin material or two or more kinds of resin materials selected from polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyamides such as nylon, polyimides, cycloolefin copolymers and the like. It is composed of a laminated body of. In the packaging material 20 shown in FIG. 5, the base material 21 is composed of a laminate of two types of resin materials (first resin layer 211 and second resin layer 212), and the first resin layer 211 is a sealant. It functions as an adhesive layer for the second surface 11B of 10. In this case, for example, the first resin layer 211 is made of polyethylene (PE), and the second resin layer 212 is made of polyethylene terephthalate (PET).

The sealant 10 in the packaging material 20 has a fractal dimension D of the first surface 11A in the range of 1.50 to 1.90, and a persistent homology value N ₁₀ of the first surface 11A of 1.0 or more. Therefore, it has good slipperiness, good transparency, and good cleanliness. As a result, when the silicon wafer or polysilicon is packaged in the silicon material transport package 40 (see FIG. 7) manufactured from the packaging material 20, the internal visibility of the silicon material transport package 40 becomes visible. It can be prevented from being aggravated by the sealant 10. In addition, it can be easily confirmed whether or not foreign matter is attached to the first surface 11A of the sealant 10 in the transport package 40 of the silicon material.

As shown in FIG. 5, the packaging material 20 may have a gas barrier layer 22 between the base material 21 and the sealant 10. By having the gas barrier layer 22, it is possible to prevent gas or the like that contaminates the surface of the silicon material or reacts with the silicon material from entering from the outside of the packaging body 40 for transporting the silicon material manufactured from the packaging material 20. be able to. The gas barrier layer 22 may be, for example, a vapor-deposited film obtained by depositing an inorganic oxide such as aluminum oxide or silicon oxide or an inorganic nitride such as silicon nitride on a resin layer (for example, a PET layer). In particular, the gas barrier layer of aluminum oxide or silicon oxide is preferable because it has good transparency. Further, the gas barrier layer 22 may be a metal vapor deposition film on which a metal such as aluminum is vapor-deposited, or a metal foil such as aluminum. When the packaging material 20 has these metal vapor deposition films or metal foils between the base material 21 and the sealant 10, the transparency of the packaging material 20 is not ensured, but the silicon material produced from the packaging material 20 is transported. In addition to the gas barrier property, the packaging body 40 can also be provided with a light shielding property. Further, in this embodiment, whether or not foreign matter adheres to the first surface 11A of the sealant 10 in the transport package 40 of the silicon material made from the packaging material 20 because the sealant 10 has good transparency. Can be confirmed more easily.

FIG. 6 is a schematic diagram schematically showing the configuration of an example of a manufacturing apparatus capable of manufacturing a packaging material according to an embodiment of the present disclosure. The above-mentioned packaging material 20 may be produced by a conventionally known method for producing a film or the like. For example, as shown in FIG. 6, it can be manufactured using a manufacturing apparatus 60 having a first roll 61, a second roll 62, a third roll 63, and a T-die 64. In such a manufacturing apparatus, the resin material constituting the first resin layer 211 is extruded from the T-die 64 in the form of a film between the second surface 11B of the sealant 10 and the second resin layer 212, and the first roll 61, The packaging material 20 can be produced by being surface-pressed and cooled by the second roll 62 and the third roll 63.

[Package for transporting silicon material]
FIG. 7 is a perspective view showing a schematic configuration of a package for transporting a silicon material according to an embodiment of the present disclosure, and FIGS. 8 and 9 are a package of the silicon material according to the embodiment of the present disclosure. It is a perspective view which shows the schematic structure.

As shown in FIG. 7, the silicon material transport package 40 in the present embodiment is a packaging bag that becomes a substantially rectangular shape (substantially rectangular shape) when expanded, and has a first side surface film 41 and a second side surface. It is composed of a film 42, a first gusset film 43, and a second gusset film 44. The first side surface film 41, the second side surface film 42, the first gusset film 43, and the second gusset film 44 are all made of the packaging material 20. In the silicon material transport package 40, the first side surface 11A of the sealant 10 is located in the innermost layer of each of the first side surface film 41, the second side surface film 42, the first gusset film 43, and the second gusset film 44. , The other side of the base material 21 is configured to be located on the outermost surface.

In the silicon material transport package 40, one of the two opposing side edges of the first side film 41 and one of the two opposing side edges of the folded first gusset film 43 are overlapped and heated. The welded first heat-sealed portion HS1 welded by the seal is formed, and the other side edge portion of the first side surface film 41 and one of the two opposing side edge portions of the folded second gusset film 44. The second heat-sealed portion HS2 is formed by superimposing and welding the films by heat-sealing. Further, one of the two opposite side edges of the second side surface film 42 and the other of the side edges of the folded first gusset film 43 are overlapped with each other and welded by heat sealing to the third heat seal portion HS3. Is formed, and the other side portion of the second side surface film 42 and the other side edge portion of the folded second gusset film 44 are overlapped with each other and welded by heat sealing to form the fourth heat seal portion HS4. Has been done. The side edges of the first side film 41 and the second side film 42 are overlapped and welded by heat sealing. The first side film 41 and the second side film 42 are located facing the bottom heat sealing portion HSB. Each side edge is not heat-sealed and forms an opening 45 of the silicone material transport package 40.

In a state where a large number of silicon material transport packages 40 in which the first gusset film 43 and the second gusset film 44 are folded are stacked, the first side surface film 41 or the second side surface film 42 is sucked and held and lifted upward. This makes it possible to open the opening 45. From the open opening 45, the resin case 51 (see FIG. 8) or the polysilicon 53 (see FIG. 9) for storing the silicon wafer 52 is housed in the packaging body 40 for transporting the silicon material, and the first in the opening 45. By superimposing and heat-sealing the side edges of the side film 41 and the second side film 42, an upper surface heat-sealing portion HST is formed to prepare a packaging body 50 (see FIGS. 8 and 9) made of a silicon material. can do.

In the silicon material transport package 40 shown in FIG. 7, the fractal dimension D of the first surface 11A of the sealant 10 of the first side surface film 41, the second side surface film 42, the first gusset film 43 and the second gusset film 44. Is in the range of 1.50 to 1.90, and the value N ₁₀ of the persistent homology of the first surface 11A is 1.0 or more. The first surface 11A is located on the innermost surface of the packaging body 40 for transporting silicon material, and easily opens the opening 45 when the first side surface film 41 or the second side surface film 42 is attracted and held and lifted upward. In addition, the resin case 51 can be easily accommodated in the packaging body 40 for transporting the silicon material through the open opening 45. Further, since the sealant 10 has good transparency, the visibility of the silicon wafer 52, the resin case 51, or the polysilicon 53 packaged in the transport package 40 of the silicon material can be improved. When the metal vapor deposition film or the metal foil is provided on the side of the base material 21 of the packaging material 20 opposite to the sealant 10, the transparency of the packaging 40 for transporting the silicon material is not ensured, but the silicon material It is possible to impart gas barrier property and light shielding property to the transport package 40. Further, since good transparency is ensured in the sealant 10 provided on the side opposite to the metal vapor deposition film or the metal foil of the base material 21, the sealant 10 in the transport package 40 of the silicon material is the first. It can be easily confirmed whether or not foreign matter is attached to the surface 11A.

The embodiments described above are described for facilitating the understanding of the present disclosure, and are not described for the purpose of limiting the present disclosure. Therefore, each element disclosed in the above-described embodiment is intended to include all design items and equivalents belonging to the technical scope of the present disclosure.

The packaging body 50 made of silicon material in the present embodiment may have the above-mentioned packaging body 40 for transporting silicon material as an inner bag, and may further have an outer bag having the same structure as the inner bag. In this case, the inner bag may be further provided. As a bag, the silicon wafer 52 and the polysilicon 53 may be housed in the packaging body 40 for transporting the silicon material, and further housed in the outer bag. Even if the packaging material constituting each of the first side surface film 41, the second side surface film 42, the first gusset film 43, and the second gusset film 44 of the outer bag is the packaging material 20 shown in FIGS. 4 and 5. Alternatively, the gas barrier layer 22, the first resin layer 211, and the sealant 10 such as a resin film having an antistatic function (for example, PTME-RT or Emblem ERT (product name, manufactured by Unitika Ltd.)) are laminated in this order. It may be a body.

The package 40 for transporting the silicon material in the present embodiment may not have the first gusset film 43 and the second gusset film 44. In this case, the first side surface film 41 and the second side surface film 42 may be heat-sealed at the three side edges so that the first side surface 11A of the sealant 10 faces each other.

Hereinafter, the present disclosure will be described in more detail with reference to examples and the like, but the present disclosure is not limited to the following examples and the like.

[Example 1]
As the constituent material of the first layer 111, low-density polyethylene (so-called additive-free LDPE, manufactured by Ube-Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128) to which a slip agent is not substantially added is used, and the constituent material of the second layer 112 is used. Low-density polyethylene with virtually no slip agent added (so-called additive-free LDPE, manufactured by Ube-Maruzen Polyethylene, product name: UBE polyethylene B128) and linear low-density polyethylene with virtually no slip agent added (so-called) Using a melt mixture (blending ratio = 1: 1 (mass basis)) of additive-free LLDPE, manufactured by Prime Polymer Co., Ltd., product name: Ultozex 3500ZA), a slip agent is substantially added as a constituent material of the third layer 113. Using low-density polyethylene (so-called additive-free LDPE, manufactured by Ube-Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128) that has not been used, the sealant 10 (first layer 111 (film) having the configuration shown in FIG. Thickness: 8 μm), second layer 112 (thickness: 24 μm), third layer 113 (thickness: 8 μm)) were produced.

In order to calculate the fractal dimension D and the persistent homology value N ₁₀ on the first surface 11A of the first layer 111 of the sealant 10 produced as described above, a white interferometric optical microscope (manufactured by Zygo). A grayscale image (496 pixels x 496 pixels) was obtained by imaging under the following conditions using a product name (NewView 6300 type).

[Measurement condition]
-Measuring device: White interferometric optical microscope (manufactured by Zygo, product name: NewView6300 type)
-Objective lens: 50x-Zoom lens: 1x-Number of measurement pixels: 496 pixels x 496 pixels-Field of view: 216μm x 216μm
[Analysis conditions]
-Analysis software: MetroPro ver8.3.2
-Removed: Cylinder
・ FilterType: None

Grayscale images are subjected to Threat processing (Image-Adjust-Treshold: Select Otsu) using image analysis software ImageJ (image analysis freeware developed by the National Institute of Public Health (NIH)), and the first The grayscale image was converted into a binarized image so that the convex portion of the surface 11A was white and the concave portion was black.

The binarized image was converted into a contour image (background white, contour width 2 pixels) by performing contour extraction processing (Prosess-Find Edges) using image analysis software ImageJ.

The contour image is subjected to fractal analysis by the box counting method using the image analysis software ImageJ, and the fractal dimension D is calculated. Specifically, the number of portions having a signal value included in the pixel by changing the size of the pixel (length a of one side) (the pixel in the black portion because the background color is white in this embodiment). The fractal dimension D was calculated by counting (N (a)) and obtaining the slope of each log-log (log (a) vs. log (N (a))) graph. The results are shown in Table 1.

Further, in order to calculate the value of persistent homology, after reducing the size of three arbitrarily selected grayscale images (496 pixels × 496 pixels) on the first surface 11A to a size of 120 pixels × 120 pixels. , Image analysis software ImageJ (image analysis freeware developed by the American National Institute of Public Health (NIH)) is used to apply Threat processing (Image-Adjust-Treshold: Otsu is selected) to grayscale images. Each grayscale image was converted into a binarized image so that the convex portion of the first surface 11A was white and the concave portion was black.

For each binarized image, the scale of the recess was calculated using persistent homology. Specifically, regarding the generation diameter X and the disappearance diameter Y, the generation diameter X and the disappearance diameter Y are scaled to μm for all the cyclic complexes in the binarized image using statistical analysis software (TDA library of R). Calculated by conversion. Then, the number of cyclic complexes satisfying the following formula was calculated for each of the three binarized images, and the average value N ₁₀ was calculated. The results are shown in Table 1.
Y ≧ X + 10

The dynamic friction coefficient of the first layer 111 of the sealant 10 is measured using a friction measuring machine (manufactured by Toyo Seiki Seisakusho, product name: friction measuring machine TR-2), and the slipperiness of the first surface 11A of the sealant 10 is as follows. Evaluated according to the criteria. The results are shown in Table 1.
<Slipperiness evaluation criteria>
〇: The coefficient of dynamic friction is less than 0.45.
X: The dynamic friction coefficient is 0.45 or more.

The mapping property of the sealant 10 was measured using a mapping measuring machine (manufactured by Suga Test Instruments Co., Ltd., product name: ICM-1T), and the transparency of the sealant 10 was evaluated according to the following criteria. The results are shown in Table 1.
<Transparency evaluation criteria>
◯: The imageability is 60% or more at an optical comb width of 2 mm.
X: The imageability is less than 60% at an optical comb width of 2 mm.

Further, the volatile components from the sealant 10 were analyzed by GC / MS under the following conditions to obtain a mass spectrum, and the cleanliness of the sealant 10 was evaluated according to the following criteria. The results are shown in Table 1.

<GC / MS conditions>
-Gas chromatograph: GCMS-QP2010 (manufactured by Shimadzu Corporation)
-Column: 670-15003-03 (length: 30 mm, inner diameter: 0.25 mm, manufactured by Shimadzu Corporation)
・ Column oven temperature: 50 ℃
・ Injection amount: 1 μL
-Carrier gas: He (57.1 mL / min)
・ Vaporization chamber temperature setting: 300 ℃
・ Measurement mode: Split

<Cleanliness evaluation>
〇: Peaks other than alkanes, and peaks of 10 ppm or more in terms of toluene are not detected.
X: Peaks other than alkanes, which are 10 ppm or more in terms of toluene, are detected.

[Example 2]
Pellets of low-density polyethylene (so-called additive-free LDPE, manufactured by Ube-Maruzen Polyethylene, product name: UBE polyethylene B128) with virtually no slip agent added, and linear low-density polyethylene with virtually no slip agent added (so-called additive-free LDPE) Pellets of so-called additive-free LLDPE, manufactured by Prime Polymer Co., Ltd., product name: Ultozex 3500ZA) were melt-mixed at a blending ratio of 7: 3 (mass basis) to prepare the sealant 10 shown in FIG. 3 by an inflation film forming method.

The fractal dimension D and the persistent homology value N ₁₀ on the first surface 11A of the sealant 10 produced as described above were calculated in the same manner as in Example 1. Moreover, the slipperiness of the first surface 11A of the sealant 10, the transparency of the sealant 10, and the cleanliness of the sealant 10 were evaluated in the same manner as in Example 1. The results are also shown in Table 1.

[Comparative Example 1]
Examples of fractal dimension D and persistent homology value N ₁₀ on the first surface of a sealant made of linear low density polyethylene (LLDPE, manufactured by Mitsui Chemicals Tosero, product name: TUX MC-S). It was calculated in the same manner as in 1. In addition, the slipperiness of the first surface of the sealant, the transparency of the sealant, and the cleanliness of the sealant were evaluated in the same manner as in Example 1. The results are also shown in Table 1.

[Comparative Example 2]
A sealant was prepared by an inflation film forming method using pellets of high-density polyethylene (HDPE, manufactured by Prime Polymer Co., Ltd., product name: HZ3600F). The fractal dimension D and the persistent homology value N ₁₀ on the first surface of the prepared sealant were calculated in the same manner as in Example 1. In addition, the slipperiness of the first surface of the sealant, the transparency of the sealant, and the cleanliness of the sealant were evaluated in the same manner as in Example 1. The results are also shown in Table 1.

[Comparative Example 3]
The fractal dimension D and the persistent homology value N ₁₀ on the first surface of the sealant made of linear low density polyethylene (LLDPE, manufactured by Aicello Corporation, product name: N601) were calculated in the same manner as in Example 1. In addition, the slipperiness of the first surface of the sealant, the transparency of the sealant, and the cleanliness of the sealant were evaluated in the same manner as in Example 1. The results are also shown in Table 1.

From the results shown in Table 1, it is good that the fractal dimension D of the first surface 11A of the sealant 10 is within a predetermined range and the value N ₁₀ of the persistent homology of the first surface 11A is within a predetermined range. It was confirmed to have slipperiness, good transparency, and good cleanliness. On the other hand, in Comparative Example 1 in which the fractal dimension D is less than 1.50, the result is inferior in cleanliness. Further, in Comparative Example 2 and Comparative Example 3 in which the value N ₁₀ of the persistent homology was less than 1.0, the result was inferior in transparency. From this, the fractal dimension D of the first surface 11A of the sealant 10 is in the range of 1.50 to 1.90, and the value N ₁₀ of the persistent homology of the first surface 11A is 1.0 or more. Therefore, it is considered that good slipperiness, good transparency, and good cleanliness can be obtained.

10 ... Sealant 11A ... 1st surface 11B ... 2nd surface 20 ... Packaging material 40 ... Packaging material for transporting silicon material 50 ... Packaging material for silicon material

Claims (14)

A sealant used for shipping packaging of silicone materials.
The sealant has a first surface located on the silicon material side and a second surface facing the first surface in the transport package.
The sealant has a first portion including the first surface and a second portion located on the second surface side of the first portion.
The first portion comprises low density polyethylene (LDPE).
The second portion comprises linear low density polyethylene (LLDPE).
A sealant in which the fractal dimension D of the first surface is in the range of 1.50 to 1.90 and the value N ₁₀ of the persistent homology of the first surface is 1.0 or more. The sealant according to claim 1, wherein the first portion further comprises linear low density polyethylene (LLDPE), high density polyethylene (HDPE), or polypropylene (PP). The sealant is a laminate having a first layer including the first surface and a second layer.
The sealant according to claim 1 or 2, wherein the first portion is the first layer. The sealant is a laminate having a first layer including the first surface and a second layer.
The sealant according to any one of claims 1 to 3, wherein the first portion is the first layer, and the second portion is the second layer. The sealant substrate further comprises a third portion comprising the second surface.
The sealant according to claim 1 or 2, wherein the third portion comprises low density polyethylene (LDPE). The sealant is a laminate having a first layer, a second layer, and a third layer including the first surface in this order.
The sealant according to claim 5, wherein the first portion is the first layer, the second portion is the second layer, and the third portion is the third layer. The sealant according to any one of claims 1 to 6, wherein the second portion further comprises low density polyethylene (LDPE). A sealant used for shipping packaging of silicone materials.
The sealant is a single layer composed of only one layer, comprising a sealant base material having a first surface located on the silicon material side and a second surface facing the first surface in the transport package. And
The sealant substrate comprises low density polyethylene (LDPE) and linear low density polyethylene (LLDPE).
The content ratio of low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) in the sealant is in the range of 1: 1 to 7: 3 on a mass basis.
A sealant in which the fractal dimension D of the first surface is in the range of 1.50 to 1.90 and the value N ₁₀ of the persistent homology of the first surface is 1.0 or more. The sealant according to any one of claims 1 to 8, wherein the slip agent is not substantially added to the low density polyethylene (LDPE). A packaging material comprising a base material and the sealant according to any one of claims 1 to 9 provided on one surface side of the base material. The packaging material according to claim 10, further comprising a gas barrier layer provided on the surface side of the base material opposite to the sealant. The packaging material according to claim 11, wherein the gas barrier layer contains an aluminum oxide or a silicon oxide. A packaging body for transporting a silicon material composed of the packaging material according to any one of claims 10 to 12. The packaging body for transporting the silicon material according to claim 13,
A package of a silicon material, comprising the silicon material contained in the package for transporting the silicon material.

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