JP2022031285A - Resin composition, sheet-like laminate material, printed wiring board, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition providing a cured article having low dielectric loss tangent, high mechanical strength, and high adhesiveness.

SOLUTION: There is provided a resin composition containing (A) a resin having a thermosetting functional group FA, (B) a resin having a radical polymerizable functional group FB, and (C) a resin having a functional group FA' reactive with the thermosetting functional group FA and a functional group FB' reactive with the radical polymerizable functional group FB, and the number n_a of the functional group FA' of the (C) component when the number of the thermosetting functional group FA of the (A) component is 1, and the number n_b of the functional group FB' of the (C) component when the number of the radical polymerizable functional group FB of the (B) component is 1, satisfy 0.01≤n_a≤200 and 0.01≤n_b≤400.

SELECTED DRAWING: None

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a resin composition. Further, the present invention relates to a sheet-shaped laminated material, a printed wiring board, and a semiconductor device.

As a manufacturing technique for a printed wiring board, a manufacturing method by a build-up method in which an insulating layer and a conductor layer are alternately stacked on an inner layer board is known. The insulating layer is generally formed of a cured product of the resin composition.

For example, Patent Document 1 describes a thermosetting epoxy resin composition containing at least an epoxy resin (A) and an active ester compound (B) containing a naphthalene structure, wherein the non-volatile component in the resin composition is 100. A resin composition having a content of the active ester compound (B) containing the naphthalene structure in an amount of 0.1 to 30% by mass is disclosed.

Further, Patent Document 2 discloses a resin composition containing (A) a radically polymerizable compound, (B) an epoxy resin, (C) a curing agent, and (D) a roughening component. ..

Japanese Unexamined Patent Publication No. 2014-47318 Japanese Unexamined Patent Publication No. 2014-34580

An object of the present invention is to provide a resin composition that provides a cured product having low dielectric loss tangent, high mechanical strength, and high adhesion.

As a result of diligent studies on the above-mentioned problems, the present inventors have found that (A) a resin having a thermosetting functional group FA, (B) a resin having a radically polymerizable functional group FB, and (C) a thermosetting functional group FA. It has been found that the above-mentioned problems can be solved by a resin composition containing a predetermined amount of a resin having a functional group FA'that reacts with the functional group FA'and a functional group FB' that reacts with the radically polymerizable functional group FB, and the present invention has been completed. rice field.

That is, the present invention includes the following contents.
[1] (A) A resin having a thermosetting functional group FA,
(B) A resin having a radically polymerizable functional group FB, and (C) a resin having a functional group FA'that reacts with a thermosetting functional group FA and a functional group FB' that reacts with a radically polymerizable functional group FB.
A resin composition containing
When the number of thermosetting functional groups FA of the component (A) is 1, the number of functional groups FA'of the component (C) is n _a , and the number of radically polymerizable functional groups FB of the component (B) is 1. When the number n _b of the functional group FB'of the component (C) is
0.01 ≤ n _a ≤ 200 and 0.01 ≤ n _b ≤ 400
A resin composition that meets the requirements.
[2] The thermosetting functional group FA is an epoxy group, a phenolic hydroxyl group, a benzoxazine group, a cyanate ester group, an active ester group, a carbodiimide group, an acid anhydride group, an oxetanyl group, an episulfide group, an isocyanate group, and an amino group. The resin composition according to [1], which is one or more selected from the group consisting of.
[3] The resin composition according to [1] or [2], wherein the radically polymerizable functional group FB is an ethylenically unsaturated group.
[4] The radically polymerizable functional group FB is at least one selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an allyl group, a vinyl group, a propenyl group, and a maleimide group, [1] to [ 3] The resin composition according to any one of.
[5] The functional group FA'of the component (C) is an epoxy group, a phenolic hydroxyl group, a benzoxazine group, a cyanate ester group, an active ester group, a carbodiimide group, an acid anhydride group, an oxetanyl group, an episulfide group, an isocyanate group, and the like. The resin composition according to any one of [1] to [4], which is one or more selected from the group consisting of an amino group and an amino group.
[6] The functional group FB'of the component (C) is at least one selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an allyl group, a vinyl group, a propenyl group, and a maleimide group [1]. ] To [5]. The resin composition according to any one of.
[7] The resin composition according to any one of [1] to [6], further comprising (D) an inorganic filler.
[8] The resin composition according to any one of [1] to [7], which is used for an insulating layer for forming a conductor layer.
[9] The resin composition according to any one of [1] to [8], which is used for an insulating layer of a printed wiring board.
[10] A sheet-like laminated material containing the resin composition according to any one of [1] to [9].
[11] A printed wiring board containing a cured product of the resin composition according to any one of [1] to [9].
[12] A semiconductor device comprising a cured product of the resin composition according to any one of [1] to [9].

According to the present invention, it is possible to provide a resin composition that provides a cured product having low dielectric loss tangent, high mechanical strength, and high adhesion.

Hereinafter, the present invention will be described in detail with reference to embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and may be arbitrarily modified and carried out without departing from the scope of claims of the present invention and the equivalent scope thereof.

In the following description, the amount of each component in the resin composition is a value with respect to 100% by mass of the resin component in the resin composition unless otherwise specified.
In the following description, the "resin component" means the (D) inorganic filler (hereinafter, "(D) component" in the present specification among the non-volatile components contained in the resin composition, unless otherwise specified. Also referred to as the component excluding).

[Resin composition]
The resin composition of the present invention comprises (A) a resin having a heat-curable functional group FA, (B) a resin having a radically polymerizable functional group FB, and (C) a functional group FA that reacts with the heat-curable functional group FA. (C) in the case of a resin composition containing'and a resin having a functional group FB that reacts with a radically polymerizable functional group FB', wherein the number of thermosetting functional groups FA of the component (A) is 1. The number n a of the functional group _{FA'of the component and the number n b of} the functional group FB' of the component (C) when the number of the radically polymerizable functional group FB of the component (B) is 1 are 0.01. It is characterized by satisfying ≦ _{na ≦ 200 and 0.01 ≦ n b ≦} 400. The cured product formed by curing the resin composition of the present invention has a molecular structure moiety formed by the reaction of the radically polymerizable functional group FB of the component (B) and the functional group FB'of the component (C). including. This molecular structure site has a small polarity, so that the polarity of the cured product becomes small, and the value of the dielectric loss tangent can be reduced.

Further, the cured product formed by curing the resin composition of the present invention has a molecular structure formed by the reaction between the radically polymerizable functional group FB of the component (B) and the functional group FB'of the component (C). It contains not only the site but also the molecular structure site formed by the reaction between the thermosetting functional group FA of the component (A) and the functional group FA'of the component (C). Therefore, the crosslink density becomes dense (that is, the structure becomes dense), the mechanical strength of the cured product is improved, and peeling accompanied by destruction of the cured product is less likely to occur. Therefore, the cured product and the object to be adhered (conductor layer, etc.) It has excellent adhesion to.

As described above, the resin composition of the present invention can provide a cured product that simultaneously exhibits the effects that can be exhibited when the component (A) and the component (B) are used alone. Further, in the resin composition of the present invention using the component (A) and the component (C) having a reaction site capable of reacting with the component (B), the compound having a thermosetting functional group capable of reacting with the component (A). Compared with the case where the compound having a radically polymerizable functional group capable of reacting with the component (C) is used separately, the miscibility of each component including the component (A) and the component (B) is improved. Can be done. Therefore, the uniformity of the composition in the cured product can be improved, and the above effect can be obtained at a higher level.

From the viewpoint of realizing a resin composition that provides a cured product having low dielectric adjunct, high mechanical strength, and high adhesion, the component (C) when the number of thermosetting functional groups FA of the component (A) is 1. The number _{na of the functional group FA'and the number n b of} the functional group FB'of the component (C) when the number of the radically polymerizable functional group FB of the component (B) is 1 are 0.01 ≦ n. It is important to satisfy _a ≤ 200 and 0.01 ≤ n _b ≤ 400. As will be described later, the present inventors have found that by satisfying the above conditions for _{na and n b ,} it is possible to realize a resin composition that produces a cured product with less deterioration in adhesion even in a high temperature and high humidity environment. Here, n _a is the equivalent of the mass part (MA) of the component ( _A ) and the thermosetting functional group FA (Eq _FA ), and the equivalent of the mass part (MC) of the component ( _C ) and the functional group FA'. Using (Eq _FA' ), it can be obtained by the _formula : na ₌ (MC / Eq _FA' ) / ( _MA / Eq _FA ). Similarly, n _b is the equivalent of the mass part (MB) of the component ( _B ) and the radically polymerizable functional group FB (Eq _FB ), and the equivalent of the mass part (MC) of the component ( _C ) and the functional group FB'. Using (Eq _FB' ), it can be obtained by the _formula : n _b = (MC / Eq _FB' ) / ( _MB / Eq _FB ). When a plurality of resins having different equivalent values are mixed and used as the component ( _A ), the total value of the mass parts / equivalent values of each resin may be used for (MA / Eq _FA ). When a plurality of resins having different equivalent values are mixed and used as the component ( _B ), the total value of the mass parts / equivalent values of each resin may be used for (MB / Eq _FB ). The same applies to (MC / Eq _FA' ) and ( _MC / Eq _FB' ) relating to the component ( _C ). The equivalent (Eq _FA ) of the thermosetting functional group FA of the component (A) is the mass of the resin containing 1 equivalent of the thermosetting functional group FA, and can be measured according to JIS K7236. The same applies to the equivalent of the radically polymerizable functional group FB of the component (B) (Eq _FB ), the equivalent of the functional group FA'of the component (C) (Eq _FA' ) and the equivalent of the functional group FB' (Eq _FB' ). ..

From the viewpoint of realizing a resin composition that provides a cured product with even better dielectric loss tangent, mechanical strength, and adhesion, especially from the viewpoint of realizing a resin composition that produces a cured product with less deterioration of adhesion even in a high temperature and high humidity environment. n _a is preferably 0.05 or more, more preferably 0.1 or more, still more preferably 0.15 or more, 0.2 or more, 0.3 or more, 0.4 or more, or 0.5 or more. The upper limit of such _na is preferably 180 or less, more preferably 160 or less, still more preferably 150 or less, 140 or less, 130 or less, 120 or less, 110 or less, or 100 or less.

From the viewpoint of realizing a resin composition that provides a cured product with even better dielectric loss tangent, mechanical strength, and adhesion, especially from the viewpoint of realizing a resin composition that produces a cured product with less deterioration of adhesion even in a high temperature and high humidity environment. n _b is preferably 0.05 or more, more preferably 0.1 or more, still more preferably 0.2 or more, 0.3 or more, 0.4 or more, 0.5 or more, or 1 or more. The upper limit of such n _b is preferably 350 or less, more preferably 300 or less, still more preferably 250 or less, 240 or less, 230 or less, 220 or less, 210 or less, or 200 or less.

<(A) Resin having a thermosetting functional group FA>
The resin composition of the present invention contains a resin having a thermosetting functional group FA as the component (A). Since the cured product has a molecular structure site formed by the reaction of the thermosetting functional group FA of the component (A) and the functional group FA'of the component (C), the structure becomes dense and the mechanical strength is increased. It is possible to provide a cured product having high adhesion and excellent adhesion.

From the viewpoint of realizing a cured product having excellent dielectric positive contact, mechanical strength, and adhesion in combination with the component (B) and the component (C), suitable heat-curable functional group FA is, for example, an epoxy group or a phenolic group. Examples thereof include a hydroxyl group, a benzoxazine group, a cyanate ester group, an active ester group, a carbodiimide group, an acid anhydride group, an oxetanyl group, an episulfide group, an isocyanate group, and an amino group. The component (A) may have one or more thermosetting functional groups FA.

The component (A) refers to a resin having a thermosetting functional group FA and not having a radically polymerizable functional group such as the functional groups FB and FB'described later.

Suitable components (A) include, for example, epoxy resin, phenol resin, naphthol resin, benzoxazine resin, cyanate ester resin, active ester resin, carbodiimide resin, acid anhydride resin, oxetane resin, episulfide resin, isocyanate resin, and amino. Examples include resins and their reaction products. The component (A) may be used alone or in combination of two or more.

-Epoxy resin-
Examples of the epoxy resin include bisphenol type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, and naphthalene type epoxy resin. , Naftor type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, oil ring Examples thereof include a formula epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, a cyclohexanedimethanol type epoxy resin, a naphthylene ether type epoxy resin, a trimethylol type epoxy resin, a tetraphenylethane type epoxy resin, and a halogenated epoxy resin. .. The bisphenol type epoxy resin refers to an epoxy resin having a bisphenol structure, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and bisphenol AF type epoxy resin. The biphenyl type epoxy resin refers to an epoxy resin having a biphenyl structure, wherein the biphenyl structure may have a substituent such as an alkyl group, an alkoxy group, or an aryl group. Therefore, the biphenyl type epoxy resin is also included in the biphenyl type epoxy resin.

Among these, the epoxy resin includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, and biphenyl type epoxy resin from the viewpoint of improving adhesion. Naftylene ether type epoxy resin, glycidyl ester type epoxy resin and anthracene type epoxy resin are preferable. Further, from the viewpoint of reducing the average linear thermal expansion rate, an epoxy resin containing an aromatic skeleton is preferable. Here, the aromatic skeleton is a concept including polycyclic aromatics and aromatic heterocycles. Epoxy resins containing an aromatic skeleton include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, and naphthol type epoxy resin. One or more epoxy resins selected from the group consisting of are preferable.

Further, the epoxy resin preferably has two or more epoxy groups in one molecule. The ratio of the epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass with respect to 100% by mass of the non-volatile component of the epoxy resin. % Or more. Above all, it is preferable that the epoxy resin has three or more epoxy groups in one molecule and contains a solid epoxy resin (hereinafter, may be referred to as “solid epoxy resin”) at a temperature of 20 ° C.

The epoxy resin may contain only the solid epoxy resin, or may contain a combination of the solid epoxy resin and other epoxy resins. Among them, the epoxy resin includes a solid epoxy resin and an epoxy resin having two or more epoxy groups in one molecule and liquid at a temperature of 20 ° C. (hereinafter, may be referred to as “liquid epoxy resin”). , It is preferable to include them in combination. By using the liquid epoxy resin and the solid epoxy resin in combination, the flexibility of the resin composition can be improved and the breaking strength of the cured product of the resin composition can be improved.

Examples of the liquid epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, and ester skeleton. An alicyclic epoxy resin, a cyclohexanedimethanol type epoxy resin, a glycidylamine type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a glycidylamine type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol AF are preferable. Type epoxy resin and naphthalene type epoxy resin are more preferable.

Examples of the liquid epoxy resin include "HP4032", "HP4032D" and "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC; "YL980", "828US", "jER828EL" and "825" manufactured by Mitsubishi Chemical Corporation. , "Epicoat 828EL" (bisphenol A type epoxy resin); "jER806H", "jER807", "YL983U", "1750" (bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd .; "jER152" manufactured by Mitsubishi Chemical Co., Ltd. ( Phenol novolak type epoxy resin); Mitsubishi Chemical Co., Ltd. "630", "630LSD" (glycidylamine type epoxy resin); Nippon Steel & Sumitomo Metal Corporation "ZX1059" (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) Product); "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagase Chemtex Co., Ltd .; "Selokiside 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by Daicel Co., Ltd .; "PB-3600" manufactured by Daisel Co., Ltd. (Epoxy resin having a butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Corporation can be mentioned.

Examples of the solid epoxy resin include naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, and naphthylene. Ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, tetraphenylethane type epoxy resin are preferable, and naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, naphthol type epoxy resin, and biphenyl type epoxy resin are more preferable. ..

Examples of the solid epoxy resin include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC; "HP-4700" and "HP-4710" (naphthalen type tetrafunctional epoxy resin) manufactured by DIC; "N-690", "N-695" (cresol novolac type epoxy resin); "HP-7200", "HP-7200HH", "HP-7200H" (dicyclopentadiene type epoxy resin) manufactured by DIC; DIC's "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); Nippon Kayakusha "EPPN-502H" (trisphenol type epoxy resin); "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd .; "NC3000H", "NC3000", "NC3000L" manufactured by Nihon Kayaku Co., Ltd. "NC3100" (biphenyl type epoxy resin); "ESN475V" (naphthol naphthalene type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd .; "ESN485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. "YL6121", "YX4000H", "YX4000", "YX4000HK" (biphenyl type epoxy resin); "YX8800" (anthracen type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd .; "PG-100", "CG-100" manufactured by Osaka Gas Chemical Co., Ltd. -500 ";" YL7760 "(bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd .;" YL7800 "(fluorene type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd .;" jER1010 "(solid bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. Resin); Examples thereof include "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation.

When a liquid epoxy resin and a solid epoxy resin are used in combination, their mass ratios (liquid epoxy resin: solid epoxy resin) are preferably 1: 0.1 to 1:15, more preferably 1: 0. It is 5 to 1:10, particularly preferably 1: 1 to 1: 8. The mass ratio of the liquid epoxy resin in such a range provides sufficient flexibility when used in the form of a sheet-like laminated material, improves handleability, and has sufficient fluidity during laminating. Can be obtained. When the mass ratio of the solid epoxy resin is in such a range, the viscosity of the epoxy resin can be lowered, and when used in the form of a sheet-like laminated material, the degassing property at the time of vacuum laminating can be improved. In addition, the peelability of the protective film and the support film at the time of vacuum laminating can be improved, and the heat resistance after curing can be improved.

-Phenol resin and naphthol resin-
As the phenol resin and the naphthol resin, a phenol resin having a novolak structure or a naphthol resin having a novolak structure is preferable from the viewpoint of heat resistance and water resistance. Further, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol resin or a nitrogen-containing naphthol resin is preferable, and a triazine skeleton-containing phenol resin or a triazine skeleton-containing naphthol resin is more preferable. Of these, a triazine skeleton-containing phenol novolac resin is preferable from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion to the conductor layer.

Specific examples of the phenol resin and naphthol resin include "MEH-7700", "MEH-7810", "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., and "NHN" and "CBN" manufactured by Nippon Kayaku Co., Ltd. , "GPH", "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495" manufactured by Nippon Steel & Sumitomo Metal Corporation, Examples thereof include "SN-375", "SN-395", "LA-7052", "LA-7054", "LA-3018", "LA-1356", "TD2090" manufactured by DIC Corporation.

-Benzoxazine resin-
Examples of the benzoxazine resin include 6,6- (1-methylethylidene) bis (3,4-dihydro-3-phenyl-2H-1,3-benzoxazine) and 6,6- (1-methylethylidene). Examples thereof include bis (3,4-dihydro-3-methyl-2H-1,3-benzoxazine). The benzoxazine resin may contain a structure in which the oxazine ring is ring-opened polymerized. Specific examples of the benzoxazine resin include "HFB2006M" manufactured by Showa Polymer Co., Ltd., "Pd" and "FA" manufactured by Shikoku Chemicals Corporation, and "RLV-" manufactured by Air Water Inc. 100 ”and the like.

-Cyanate ester resin-
Examples of the cyanate ester resin include bisphenol A dicyanate, polyphenol cyanate (oligo (3-methylene-1,5-phenylencyanate)), 4,4'-methylenebis (2,6-dimethylphenylcyanate), and 4,4'. -Etilidendiphenyl disyanate, hexafluorobisphenol A disyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1-bis (4-cyanatephenylmethane), bis (4-cyanate-3,5-dimethylphenyl) ) Bifunctional cyanate resins such as methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)) benzene, bis (4-cyanatephenyl) thioether, and bis (4-cyanatephenyl) ether, phenol novolac. Examples thereof include polyfunctional cyanate resins derived from cresol novolak and the like, and prepolymers in which these cyanate resins are partially triazined. Specific examples of the cyanate ester resin include "PT30" and "PT60" (both are phenol novolac type polyfunctional cyanate ester resins) and "BA230" (part or all of bisphenol A dicyanate) manufactured by Ronza Japan Co., Ltd. Prepolymers that have been converted into trimer) and the like.

-Active ester resin-
The active ester resin is not particularly limited, but generally contains 2 highly reactive ester groups such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds in one molecule. Compounds having more than one are preferably used. The active ester resin is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester resin obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester resin obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid and the like. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-. Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenol, trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglucin, Examples thereof include benzenetriol, dicyclopentadiene-type diphenol compound, and phenol novolac. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two phenol molecules with one dicyclopentadiene molecule.

Specifically, an active ester resin containing a dicyclopentadiene-type diphenol structure, an active ester resin containing a naphthalene structure, an active ester resin containing an acetylated product of phenol novolac, and an active ester resin containing a benzoylated product of phenol novolac are preferable. Of these, an active ester resin containing a naphthalene structure and an active ester resin containing a dicyclopentadiene-type diphenol structure are more preferable. The "dicyclopentadiene-type diphenol structure" represents a divalent structural unit composed of phenylene-dicyclopentalene-phenylene.

Specific examples of the active ester resin include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T" (manufactured by DIC Co., Ltd.) as active ester resins containing a dicyclopentadiene type diphenol structure. "EXB9416-70BK" (manufactured by DIC Co., Ltd.) as an active ester resin containing a naphthalene structure, "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.) as an active ester resin containing an acetylated product of phenol novolac, and a benzoylated product of phenol novolac. Examples of the active ester resin contained include "YLH1026" (manufactured by Mitsubishi Chemical Corporation).

-Carbodiimide resin-
Examples of the carbodiimide resin include resins having one or more carbodiimide groups (-N = C = N-) in the molecule. The carbodiimide resin preferably has two or more carbodiimide groups in the molecule. Specific examples of the carbodiimide resin include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co., Ltd.

-Acid anhydride resin-
Examples of the acid anhydride resin include resins having one or more acid anhydride groups in the molecule. Examples of the acid anhydride resin include phthalic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrohydride phthalic acid, methylnadic acid anhydride, and hydride methylnadic acid anhydride. Trialkyltetrahydrohydride phthalic acid, dodecenyl anhydride succinic acid, 5- (2,5-dioxotetrahydro-3-franyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride, trimellitic anhydride, Pyromytz anhydride, benzophenone tetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, oxydiphthalic acid dianhydride, 3,3'-4,4'-diphenylsulfone tetra Carboxydianhydride, 1,3,3a,4,5,9b-hexahydro-5- (tetrahydro-2,5-dioxo-3-franyl) -naphtho [1,2-C] furan-1,3- Examples thereof include dione, ethylene glycol bis (anhydrotrimeritate), and polymer-type acid anhydrides such as styrene / maleic acid resin in which styrene and maleic acid are copolymerized. Specific examples of the acid anhydride resin include "MH-700" manufactured by NEW JAPAN CHEMICAL CO., LTD.

-Oxetane resin-
Examples of the oxetane resin include resins having one or more oxetanyl groups in the molecule. Examples of the oxetane resin include alkyl oxetane such as oxetane, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, and 3,3-dimethyloxetane, 3-methyl-3-methoxymethyloxetane, 3,3. -Di (trifluoromethyl) perfluorooxetane, 2-chloromethyloxetane, 3,3-bis (chloromethyl) oxetane, and biphenyl-type oxetane can be mentioned. Specific examples of the oxetane resin include "OXT-101" and "OXT-121" manufactured by Toagosei Co., Ltd.

-Episulfide resin-
Examples of the episulfide resin include resins having one or more episulfide groups in the molecule. The episulfide resin preferably has two or more episulfide groups in the molecule. Examples of the episulfide resin include bisphenol type episulfide resin, naphthalene type episulfide resin, novolak type episulfide resin, and biphenyl type episulfide resin. Specific examples of the episulfide resin include "YL7000" manufactured by Mitsubishi Chemical Corporation.

-Isocyanate resin-
Examples of the isocyanate resin include resins having one or more isocyanate groups in the molecule. The isocyanate resin preferably has two or more isocyanate groups in the molecule. Examples of the isocyanate resin include 4,4'-diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, tolylene diisocyanate, hexamethylene diisocyanate and the like.

-Amino resin-
Examples of the amino resin include melamine resin, benzoguanamine resin, acetoguanamine resin, spiroganamine resin, cyclohexylguanamine resin and the like. Specific examples of the amino resin include the Cymel series manufactured by Mitsui Sianamid Co., Ltd. and the Nicarac series manufactured by Sanwa Chemical Co., Ltd.

The equivalent amount of the thermosetting functional group FA of the component (A) is preferably 5000 or less from the viewpoint that the crosslink density of the cured product is sufficient and a resin composition capable of producing a cured product having excellent mechanical strength and adhesion can be realized. It is more preferably 3000 or less, still more preferably 2000 or less, or 1000 or less. The lower limit of the equivalent amount of the thermosetting functional group FA is not particularly limited as long as the effect of the present invention is exhibited, but may be 50 or more, 80 or more, 100 or more, or 110 or more.

The weight average molecular weight of the component (A) is preferably 100 to 5000, more preferably 250 to 4000, and even more preferably 400 to 3000. The weight average molecular weight of the component (A) can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method. For example, for the weight average molecular weight of the component (A), LC-9A / RID-6A manufactured by Shimadzu Corporation was used as a measuring device, and Shodex K-800P / K-804L / K-804L manufactured by Showa Denko Corporation was used as a column for the mobile phase. It can be measured at a column temperature of 40 ° C. using chloroform or the like, and calculated using a calibration curve of standard polystyrene.

The content of the component (A) in the resin composition is not particularly limited as long as the above conditions of _{na and n b are} satisfied, but is, for example, 0.5% by mass with respect to 100% by mass of the resin component in the resin composition. % Or more, 1% by mass or more, 2% by mass or more, or 3% by mass or more. The upper limit of the content of the component (A) is, for example, 90% by mass or less, 85% by mass or less, 80% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, or 50% by mass or less. ..

<(B) Resin having radically polymerizable functional group FB>
The resin composition of the present invention contains a resin having a radically polymerizable functional group FB as the component (B). Since the cured product has a molecular structure site formed by the reaction of the radically polymerizable functional group FB of the component (B) and the functional group FB'of the component (C), the polarity of the cured product becomes smaller and the dielectric loss tangent The value of can be reduced.

The radically polymerizable functional group FB is preferably an ethylenically unsaturated group having a carbon-carbon double bond. The ethylenically unsaturated group is preferably one or more groups selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an olefin group and a maleimide group. Preferred examples of the olefin group include an allyl group, a vinyl group and a propenyl group. Therefore, in one preferred embodiment, the radically polymerizable functional group FB is one or more selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an allyl group, a vinyl group, a propenyl group and a maleimide group. The component (B) may have one or more radically polymerizable functional groups FB.

The component (B) refers to a resin having a radically polymerizable functional group FB and not having a thermosetting functional group such as the above-mentioned functional group FA and the later-described functional group FA'.

Suitable examples of the component (B) include a compound represented by the following formula (B1), a compound represented by the following formula (B6), a compound represented by the following formula (B7), and a compound represented by the following formula (B9). Examples thereof include a compound represented by the following formula and a compound represented by the following formula (B10).

In the formula (B1), R ¹ to R ⁶ independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and preferably represent a hydrogen atom. In the formula (B1), A represents a divalent group represented by the following formula (B2) or the following formula (B3).

In the formula (B2), B represents a divalent group represented by the following formula (B2-1), (B2-2) or (B2-3).

In the formula (B2-1), R ¹⁵ to R ¹⁸ independently represent a hydrogen atom, an alkyl group or a phenyl group having 6 or less carbon atoms, and preferably represent a hydrogen atom or a methyl group.
In the formula (B2-2), R ¹⁹ to R ²⁶ independently represent a hydrogen atom, an alkyl group or a phenyl group having 6 or less carbon atoms, and preferably represent a hydrogen atom or a methyl group.
In the formula (B2-3), R ²⁷ to R ³⁴ independently represent a hydrogen atom, an alkyl group or a phenyl group having 6 or less carbon atoms, and preferably represent a hydrogen atom or a methyl group. Further, in the formula (B2-3), E represents a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

In the formula (B3), D represents a divalent group represented by the following formula (B4).

In the formula (B4), R ⁷ to R ¹⁴ independently represent a hydrogen atom, an alkyl group or a phenyl group having 6 or less carbon atoms, and preferably represent a hydrogen atom or a methyl group. In particular, R ⁷ , R ⁸ , R ¹³ and R ¹⁴ more preferably represent a methyl group. In the formula (B4), a and b are integers of 0 or more and 100 or less, one of which is not 0. In the formula (B4), B represents a divalent group represented by the above formula (B2-1), (B2-2) or (B2-3).

The compound represented by the formula (B1) is preferably a compound represented by the following formula (B5).

^In the formula (B5), ^R1 to R6 are synonymous with ^R1 to R6 in the ^formula (B1), B is synonymous with B in the formula (B2), and a and b are. , Is synonymous with a and b in the above formula (B4).

In formula (B7), ring F represents a divalent group having a cyclic ether structure of 5 or more members.

The cyclic ether structure may have a monocyclic structure containing only one ring, a polycyclic structure containing two or more rings, and a condensed ring structure including a condensed ring. You may.

The number of oxygen atoms contained in one cyclic ether structure is preferably 1 or more, more preferably 2 or more, preferably 5 or less, more preferably 4 or less, from the viewpoint of remarkably obtaining the desired effect of the present invention. More preferably, it is 3 or less.

The cyclic ether structure is preferably a 5- to 10-membered ring, more preferably a 5- to 8-membered ring, and even more preferably a 5- to 6-membered ring. Specific examples of the cyclic ether structure having a 5-membered ring or more include a furan structure, a tetrahydrofuran structure, a dioxolane structure, a pyran structure, a dihydropyran structure, a tetrahydropyran structure, and a dioxane structure. Above all, the dioxane structure is preferable from the viewpoint of improving the compatibility of the resin composition. The dioxane structure includes a 1,2-dioxane structure, a 1,3-dioxane structure and a 1,4-dioxane structure, and a 1,3-dioxane structure is preferable.

The cyclic ether structure may have a substituent. The type of the substituent is not particularly limited, and may be any of the above-mentioned substituents, and examples thereof include an alkyl group and an alkoxy group. The number of carbon atoms of such a substituent is as described above, but is preferably 1 to 6, more preferably 1 to 3.

Examples of the divalent group having a cyclic ether structure having a 5-membered ring or more include a furan-2,5-diyl group, a tetrahydrofuran-2,5-diyl group, a dioxolan-2,5-diyl group, and a pyran-2. 5-Diyl group, dihydropyran-2,5-diyl group, tetrahydropyran-2,5-diyl group, 1,2-dioxane-3,6-diyl group, 1,3-dioxane-2,5-diyl group , 1,4-Dioxane-2,5-diyl group, 5-ethyl-1,3-dioxane-2,5-diyl group. Of these, 5-ethyl-1,3-dioxane-2,5-diyl groups are preferred.

In formula (B7), B ¹ and B ² each independently represent a single bond or a divalent linking group. B ¹ and B ² are preferably divalent linking groups. Examples of the divalent linking group include an alkylene group which may have a substituent, an alkenylene group which may have a substituent, an alkynylene group which may have a substituent, and a substituent. An arylene group which may have a substituent, a heteroarylene group which may have a substituent, a group represented by -COO-, a group represented by -CO-, a group represented by -CONH-, a group represented by -NHCONH. A group represented by-, a group represented by -NHCOO-, a group represented by -C (= O)-, a group represented by -S-, a group represented by -SO-, a group represented by -NH- Examples thereof include a group represented by and a group in which a plurality of these groups are combined.

Among these, B ¹ and B ² are an alkylene group which may have a substituent, an alkenylene group which may have a substituent, an alkynylene group which may have a substituent, and -COO-. A group in which two or more groups are selected and combined from the group consisting of the group represented by and the group represented by —O— is preferable. In particular, B ¹ and B ² are more preferably a group in which two or more groups are selected and combined from the group consisting of an alkylene group which may have a substituent and a group represented by -COO-. ..

In formula (B7), C ¹ and C ² each independently represent a functional group. Examples of the functional group include a vinyl group, a methacrylic group, an acrylic group, an allyl group, a styryl group, a propenyl group and an epoxy group. In one preferred embodiment, C ¹ and C ² are vinyl groups.

Specific examples of the compound represented by the formula (B7) include a compound represented by the following formula (B8).

In the formula (B10), n represents 1 to 5.

Examples of the component (B) include "OPE-2St 1200" manufactured by Mitsubishi Gas Chemicals, Ltd. (styrene-modified polyphenylene ether resin, radically polymerizable functional group equivalent 630 g / eq, number average molecular weight 1200, equivalent to the above formula (B5)). "YL7776" manufactured by Mitsubishi Chemical Co., Ltd. (Bixylenol diallyl ether resin, radically polymerizable functional group equivalent 165.5 g / eq, number average molecular weight 331, equivalent to the above formula (B6)), "A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd. (Dioxane acrylic monomer glycol diacrylate, radically polymerizable functional group equivalent 163 g / eq, number average molecular weight 326, equivalent to the above formula (B8)), "KAYARAD R-604" manufactured by Nippon Kayakusha (equivalent to the above formula (B8)). , "A-DCP" manufactured by Shin-Nakamura Chemical Industry Co., Ltd. (tricyclodecanedimethanol diacrylate, radically polymerizable functional group equivalent 152 g / eq, number average molecular weight 304, equivalent to the above formula (B9)), manufactured by Nippon Kayaku Co., Ltd. MIR-3000-70MT ”, radically polymerizable functional group equivalent 275 g / eq, equivalent to the above formula (B10)). Further, the component (B) may be used alone or in combination of two or more.

The number average molecular weight of the component (B) is preferably 100 or more, more preferably 200 or more, preferably 10,000 or less, and more preferably 3000 or less. When the number average molecular weight of the component (B) is in the above range, it is possible to suppress volatilization of the resin varnish during drying and to prevent the melt viscosity of the resin composition from becoming excessive. The number average molecular weight can be measured by a gel permeation chromatography (GPC) method in terms of polystyrene. For the measurement of the number average molecular weight by the GPC method, for example, "LC-9A / RID-6A" manufactured by Shimadzu Corporation is used as a measuring device, and "Chromatography K-800P / K-804L / K-804L" manufactured by Showa Denko Corporation is used as a column. ], Using chloroform as the mobile phase, can be measured at a column temperature of 40 ° C.

The equivalent amount of the radically polymerizable functional group FB of the component (B) is preferably 5000 or less, more preferably 3000, from the viewpoint of realizing a resin composition in which the polarity of the cured product becomes small and a cured product having a low dielectric loss tangent can be realized. Hereinafter, it is more preferably 2000 or less, or 1000 or less. The lower limit of the equivalent amount of the radically polymerizable functional group FB is not particularly limited as long as the effect of the present invention is exhibited, but may be 50 or more, 80 or more, or 100 or more.

The content of the component (B) in the resin composition is not particularly limited as long as the above conditions of _{na and n b are} satisfied, but is, for example, 0.1% by mass with respect to 100% by mass of the resin component in the resin composition. % Or more, 0.5% by mass or more, 1% by mass or more, 3% by mass or more, or 5% by mass or more. The upper limit of the content of the component (B) is, for example, 40% by mass or less, 35% by mass or less, 30% by mass or less, or 25% by mass or less.

<(C) Resin having a functional group FA'that reacts with a thermosetting functional group FA and a functional group FB' that reacts with a radically polymerizable functional group FB>
The resin composition of the present invention contains, as the component (C), a resin having a functional group FA'that reacts with the thermosetting functional group FA and a functional group FB' that reacts with the radically polymerizable functional group FB. By using the component (C), it reacts with both the components (A) and the component (B) to form a cured product. The cured product has a molecular structure site formed by the reaction of the thermosetting functional group FA of the component (A) and the functional group FA'of the component (C), so that the structure becomes dense and the machine of the cured product becomes dense. It has high strength and excellent adhesion. Further, since the cured product has a molecular structure site formed by the reaction of the radically polymerizable functional group FB of the component (B) and the functional group FB'of the component (C), the polarity of the cured product becomes smaller. , The value of the dielectric loss tangent can be reduced.

Conventionally, when two resins having different reactivity are used in combination, the miscibility of each resin is poor and it is difficult to form a cured product uniformly. Therefore, it was difficult to simultaneously develop the above effects at high levels. On the other hand, in the resin composition of the present invention, the component (C) has a site capable of reacting with two resins having different reactivity in the same compound. Therefore, the component (C) can connect the resins to form a cured product, and a uniform cured product can be formed. Therefore, the above-mentioned characteristics can be simultaneously expressed at a high level, and the desired effect of the present invention can be obtained. Furthermore, when the component (C) is used, the miscibility of each component including the component (A) and the component (B) can be improved. Therefore, the uniformity of the composition in the cured product can be improved, and the above effect can be obtained at a higher level.

The functional group FA'of the component (C) is not particularly limited as long as it can react with the thermosetting functional group FA of the component (A), and for example, an epoxy group, a phenolic hydroxyl group, a benzoxazine group, a cyanate ester group, and an activity. Examples thereof include an ester group, a carbodiimide group, an acid anhydride group, an oxetanyl group, an episulfide group, an isocyanate group, and an amino group. The component (C) may have one or more functional groups FA'.

When the thermosetting functional group FA is an epoxy group, the functional group FA'may be an epoxy group, a phenolic hydroxyl group, an active ester group, or an amino group.
When the thermosetting functional group FA is an active ester group, the functional group FA'may be an epoxy group or a carbodiimide group.
When the thermosetting functional group FA is a phenolic hydroxyl group, the functional group FA'may be an epoxy group or a phenolic hydroxyl group.
When the thermosetting functional group FA is a carbodiimide group, the functional group FA'may be an epoxy group or an active steal group.
The combination of the thermosetting functional group FA and the functional group FA'is not particularly limited as long as they can react, but at least one of the thermosetting functional group FA and the functional group FA'is an epoxy group, an episulfide group, or an episulfide group. It is preferably an oxetanyl group, more preferably an epoxy group.

The functional group FB'of the component (C) is not particularly limited as long as it can react with the radically polymerizable functional group FB of the component (B), but is preferably an ethylenically unsaturated group having a carbon-carbon double bond. .. The ethylenically unsaturated group is preferably one or more groups selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an olefin group and a maleimide group. Preferred examples of the olefin group include an allyl group, a vinyl group and a propenyl group as described above. Therefore, in one preferred embodiment, the functional group FB'is one or more selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an allyl group, a vinyl group, a propenyl group and a maleimide group. The component (C) may have one or more functional groups FB'.

Suitable examples of the component (C) include a compound represented by the following formula (C1), a compound represented by the following formula (C2), a compound represented by the following formula (C3), and a compound represented by the following formula (C4). ) Is mentioned.

式（Ｃ１）中、ｍは１～６の整数を表し、ｎは１～２０の整数を表す。

In the formula (C1), m represents an integer of 1 to 6, and n represents an integer of 1 to 20.

In the formula (C1), m is preferably an integer of 1 to 6, and more preferably an integer of 1 to 3. Further, n is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, and particularly preferably an integer of 1 to 3. Within such a numerical range, the component (C) reacts with the component (B) at an appropriate ratio, and a decrease in dielectric loss tangent can be realized.

The component (C) may be a mixture of compounds represented by the formula (C1) having different values of m and n. In the case of a mixture, as long as the component (C) contains the compound represented by the formula (C1), the compound in which n is 0 in the formula (C1) (the compound represented by the following formula (0-1)) or It may contain a compound in which n is an integer of 1 to 20 and m is 0 (a compound represented by the following formula (0-2)).

When the total of the component (C) is 100% by mass, the total ratio of the compound represented by the formula (0-1) and the compound represented by the formula (0-2) is preferably 10% by mass. Hereinafter, it is more preferably 5% by mass or less, further preferably 3% by mass or less, and particularly preferably 1% by mass or less, or 0% by mass. Within such a range, the component (C) reacts with the component (B) at an appropriate ratio, and a decrease in dielectric loss tangent can be realized.

In equation (0-2), n represents an integer of 1 to 20.

In the formula (C4), n is 0 to 3, and R ^c1 to R ^c5 independently represent a hydrogen atom or an allylic group, respectively. Here, at least one of R ^c1 to R ^c5 in the formula (C4) is an allyl group.

As the component (C), for example, "PC1300-02-65MA" manufactured by Air Water Co., Ltd. (active ester group equivalent 199 g / eq, vinyl group equivalent 1400 g / eq, equivalent to the above formula (C1)), manufactured by Nippon Kayaku Co., Ltd. "RE-810NM" (epoxide group equivalent 221 g / eq, allyl group equivalent 221 g / eq, equivalent to the above formula (C2)), Nippon Kayakusha "RE-820" (epoxide group equivalent 228 g / eq, allyl group equivalent 228 g) / Eq, equivalent to the above formula (C3)), "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd. (phenolic hydroxyl group equivalent 140 g / eq, allyl group equivalent 140 g / eq, equivalent to the above formula (C4)).

The equivalent of the functional group FA'of the component (C) is preferably 5000 or less, more preferably 5000 or less, from the viewpoint that the cross-linking density of the cured product is sufficient and a resin composition capable of producing a cured product having excellent mechanical strength and adhesion can be realized. Is 3000 or less, more preferably 2000 or less, or 1000 or less. The lower limit of the equivalent of the functional group FA'is not particularly limited as long as the effect of the present invention is exhibited, but may be 50 or more, 80 or more, or 100 or more.

The equivalent of the functional group FB'of the component (C) is preferably 5000 or less, more preferably 3000 or less, from the viewpoint of realizing a resin composition in which the polarity of the cured product is reduced and a cured product having a low dielectric loss tangent is obtained. More preferably, it is 2000 or less, or 1500 or less. The lower limit of the equivalent of the functional group FB'is not particularly limited as long as the effect of the present invention is exhibited, but may be 50 or more, 80 or more, or 100 or more.

The content of the component (C) in the resin composition is not particularly limited as long as the above conditions of _{na and n b are} satisfied, but is, for example, 1% by mass or more with respect to 100% by mass of the resin component in the resin composition. 2, 2% by mass or more, 3% by mass or more, 5% by mass or more, or 10% by mass or more. The upper limit of the content of the component (C) is, for example, 99% by mass or less, 98% by mass or less, 95% by mass or less, 90% by mass or less, or 80% by mass or less.

From the viewpoint of realizing a resin composition that provides a cured product having excellent dielectric loss tangent, mechanical strength, and adhesion, when the non-volatile component in the resin composition is 100% by mass, the component (A), the component (B), and (C) ) The total content of the components is preferably 10% by mass or more, more preferably 20% by mass or more, and further preferably 30% by mass or more. The upper limit of the total content is not particularly limited, but may be usually 95% by mass or less, 90% by mass or less, 80% by mass or less, or 70% by mass or less.

<(D) Inorganic filler>
The resin composition of the present invention may further contain an inorganic filler as the component (D). By including the inorganic filler, a cured product having a lower coefficient of linear thermal expansion and dielectric loss tangent can be realized.

The material of the component (D) is not particularly limited, but for example, silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, etc. Aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, titanium Examples thereof include bismuth acid, titanium oxide, zirconate oxide, barium zirconate titanate, barium zirconate, calcium zirconate, zirconate zirconate, and zirconate titanate phosphate. Among these, silica is preferable, amorphous silica, crushed silica, fused silica, crystalline silica, synthetic silica, hollow silica, and spherical silica are more preferable, and fused silica and spherical silica are preferable from the viewpoint of reducing the surface roughness of the insulating layer. Silica is more preferred, and spherical fused silica is particularly preferred. The component (D) may be used alone or in combination of two or more.

Usually, the component (D) is contained in the resin composition in the form of particles. The average particle size of the component (D) is preferably 5 μm or less, more preferably 3 μm or less, still more preferably 2 μm or less, particularly preferably 1 μm or less, 0.8 μm or less, 0.6 μm or less, 0.4 μm or less. The lower limit of the average particle size is preferably 0.01 μm or more, more preferably 0.03 μm or more, still more preferably 0.05 μm or more, and particularly preferably 0.07 μm or more, 0.1 μm or more. Examples of commercially available components (D) include "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd .; "YC100C", "YA050C", "YA050C-MJE" and "YA010C" manufactured by Admatex. "UFP-30" manufactured by Denka; "Silfil NSS-3N", "Silfil NSS-4N", "Silfil NSS-5N" manufactured by Tokuyama; "SC2500SQ", "SO-C4", "SO-C4" manufactured by Admatex. "SO-C2" and "SO-C1" can be mentioned.

The average particle size of the particles (D) and the like can be measured by a laser diffraction / scattering method based on the Mie scattering theory. For example, a laser diffraction / scattering type particle size distribution measuring device can measure the particle size distribution of particles on a volume basis, and the average particle size can be measured as the median diameter from the particle size distribution. As the measurement sample, those in which the particles are dispersed in water by ultrasonic waves can be preferably used. As the laser diffraction / scattering type particle size distribution measuring device, "LA-960" manufactured by HORIBA, Ltd. or the like can be used.

The component (D) may be surface-treated with any surface-treating agent. Examples of the surface treatment agent include aminosilane-based coupling agents, epoxysilane-based coupling agents, mercaptosilane-based coupling agents, alkoxysilane compounds, organosilazane compounds, titanate-based coupling agents and the like. By surface-treating the component (D) with these surface treatment agents, the moisture resistance and dispersibility of the component (D) can be enhanced.

Examples of commercially available surface treatment agents include "KBM-22" (dimethyldimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and Shin-Etsu Chemical Co., Ltd. "KBM-803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBE-903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd. ( N-phenyl-3-aminopropyltrimethoxysilane), "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd. Examples thereof include "KBM-4803" (long-chain epoxy type silane coupling agent) manufactured by the same company. Further, the surface treatment agent may be used alone or in combination of two or more at any ratio.

The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the component (D). The amount of carbon per unit surface area of the component (D) is preferably 0.02 mg / m ² or more, more preferably 0.1 mg / m ² or more, and particularly preferably 0, from the viewpoint of improving the dispersibility of the component (D). .2 mg / m ² or more. On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin composition and the melt viscosity in the sheet form, the amount of carbon is preferably 1 mg / m ² or less, more preferably 0.8 mg / m ² or less, and particularly preferably. Is 0.5 mg / m ² or less.

The amount of carbon per unit surface area of the component (D) can be measured after the component (D) after the surface treatment is washed with a solvent (for example, methyl ethyl ketone (hereinafter, may be abbreviated as “MEK”)). .. For example, a sufficient amount of methyl ethyl ketone and the component (D) surface-treated with a surface treatment agent are mixed and ultrasonically cleaned at 25 ° C. for 5 minutes. Then, after removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the component (D) can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by HORIBA, Ltd. can be used.

From the viewpoint of obtaining a cured product having a low linear thermal expansion coefficient and dielectric loss tangent, the content of the component (D) in the resin composition is preferably 50% by mass when the non-volatile component in the resin composition is 100% by mass. The above is more preferably 55% by mass or more, 60% by mass or more, 65% by mass or more, or 70% by mass or more. The upper limit of the content of the component (D) is preferably 90% by mass or less, more preferably 85% by mass or less, still more preferably 80% by mass or less, from the viewpoint of the mechanical strength of the obtained cured product.

The resin composition of the present invention may further contain one or more additives selected from the group consisting of a curing accelerator, a thermoplastic resin, a flame retardant and an organic filler, if necessary.

-Curing accelerator-
The resin composition of the present invention may further contain a curing accelerator. Examples of the curing accelerator include an amine-based curing accelerator, an imidazole-based curing accelerator, a guanidine-based curing accelerator, a metal-based curing accelerator, a peroxide-based curing accelerator, and the like. Of these, amine-based curing accelerators, imidazole-based curing accelerators, and peroxide-based curing accelerators are preferable. The curing accelerator may be used alone or in combination of two or more. When a curing accelerator is used, the content of the curing accelerator in the resin composition is 0. The range of 01 to 3% by mass is preferable.

-Thermoplastic resin-
The resin composition of the present invention may further contain a thermoplastic resin. Examples of the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, and polyether. Examples thereof include ether ketone resin, polyester resin, and indenkumaron resin. The thermoplastic resin may be used alone or in combination of two or more.

The polystyrene-equivalent weight average molecular weight of the thermoplastic resin is preferably in the range of 8,000 to 70,000, more preferably in the range of 10,000 to 60,000, and even more preferably in the range of 20,000 to 60,000. The polystyrene-equivalent weight average molecular weight of the thermoplastic resin is measured by a gel permeation chromatography (GPC) method. For example, for the polystyrene-equivalent weight average molecular weight of the thermoplastic resin, LC-9A / RID-6A manufactured by Shimadzu Corporation is used as a measuring device, and Shodex K-800P / K-804L / K-804L manufactured by Showa Denko Co., Ltd. is used as a column. It can be measured at a column temperature of 40 ° C. using chloroform or the like as a mobile phase, and can be calculated using a calibration line of standard polystyrene.

Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolak skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantan skeleton, and terpene. Examples thereof include phenoxy resins having one or more skeletons selected from the group consisting of skeletons and trimethylcyclohexane skeletons. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resin may be used alone or in combination of two or more at any ratio.

Examples of the phenoxy resin include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both bisphenol A skeleton-containing phenoxy resin); "YX8100" manufactured by Mitsubishi Chemical Corporation (bisphenol S skeleton-containing phenoxy resin); Mitsubishi Chemical Corporation. "YX6954" (bisphenol acetophenone skeleton-containing phenoxy resin); "FX280" and "FX293" manufactured by Nippon Steel & Sumitomo Metal Corporation; "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL7769BH30" manufactured by Mitsubishi Chemical Corporation. Examples thereof include "YL6794", "YL7213", "YL7290", "YL7891BH30" and "YL7482".

Examples of the indene mullon resin include "H-100", "WS-100G", "WS-100H", "WS-120V", and "WS-100GC" manufactured by Nikko Kagaku Co., Ltd .; manufactured by Novales Lutgers Co., Ltd. "C10", "C30", "CA80" of.

The lower limit of the content of the thermoplastic resin in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, based on 100% by mass of the resin component in the resin composition. The upper limit thereof is preferably 10% by mass or less, more preferably 5% by mass or less. Within such a range, the effect of improving the film forming ability and the mechanical strength can be exhibited, the melt viscosity can be increased, and the roughness of the surface of the insulating layer after the wet roughening step can be lowered.

-Flame retardants-
The resin composition of the present invention may further contain a flame retardant. Examples of the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicone flame retardant, a metal hydroxide and the like. The flame retardant may be used alone or in combination of two or more. When a flame retardant is used, the content of the flame retardant in the resin composition is not particularly limited, but is preferably in the range of 0.5 to 20% by mass with respect to 100% by mass of the resin component in the resin composition. The range of 0.5% by mass to 15% by mass is more preferable, and the range of 0.5 to 10% by mass is further preferable.

-Organic filler-
The resin composition of the present invention may further contain an organic filler. As the organic filler, any organic filler that can be used for forming the insulating layer of the printed wiring board may be used, and examples thereof include rubber particles, polyamide fine particles, and silicone particles, and rubber particles are preferable.

The rubber particles are not particularly limited as long as they are fine particles of a resin that is insoluble and insoluble in an organic solvent by subjecting a resin exhibiting rubber elasticity to a chemical cross-linking treatment. For example, acrylonitrile butadiene rubber particles, butadiene rubber particles, and the like. Acrylic rubber particles and the like can be mentioned. Specific examples of the rubber particles include XER-91 (manufactured by Nippon Synthetic Rubber Co., Ltd.), Staphyroid AC3355, AC3816, AC3816N, AC3832, AC4030, AC3364, IM101 (manufactured by Aica Kogyo Co., Ltd.) Pararoid EXL2655. , EXL2602 (all manufactured by Kureha Chemical Industry Co., Ltd.) and the like.

The average particle size of the organic filler is preferably in the range of 0.005 μm to 1 μm, more preferably in the range of 0.2 μm to 0.6 μm. The average particle size of the organic filler can be measured using a dynamic light scattering method. For example, the organic filler is uniformly dispersed in an appropriate organic solvent by ultrasonic waves, etc., and the particle size distribution of the organic filler is measured by mass using a concentrated particle size analyzer (“FPAR-1000” manufactured by Otsuka Electronics Co., Ltd.). It can be measured by creating a standard and using the median diameter as the average particle size. When an organic filler is used, the content of the organic filler in the resin composition is preferably 1% by mass to 10% by mass, more preferably 2 when the non-volatile component in the resin composition is 100% by mass. It is from mass% to 5% by mass.

The resin composition of the present invention may contain other components, if necessary. Examples of such other components include organometallic compounds such as organocopper compounds, organozinc compounds and organocobalt compounds, and resin additions such as thickeners, defoaming agents, leveling agents, adhesion-imparting agents and colorants. Agents and the like can be mentioned.

The method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include a method in which a compounding component is mixed and dispersed by adding a solvent or the like as necessary and using a rotary mixer or the like.

The resin composition of the present invention can provide a cured product having a low dielectric loss tangent. The dielectric loss tangent of the cured product of the resin composition of the present invention can be measured by the method described in <Measurement of dielectric loss tangent and mechanical properties (elongation)> described later. Specifically, it can be measured at a frequency of 5.8 GHz and a measurement temperature of 23 ° C. by the cavity resonance perturbation method. The dielectric loss tangent is preferably less than 0.0058 from the viewpoint of preventing heat generation at high frequencies and reducing signal delay and signal noise. The lower limit of the dielectric loss tangent is preferably as low as possible, but it can usually be 0.001 or more.

The resin composition of the present invention can provide a cured product having high mechanical strength. The elongation at break point (elongation at break) of the cured product of the resin composition of the present invention can be measured by the method described in <Measurement of dielectric loss tangent and mechanical properties (elongation)> described later. The elongation at break is preferably 1.6% or more. The upper limit is not particularly limited and may be 10% or less.

The resin composition of the present invention can provide a cured product having excellent adhesion to the conductor layer (copper foil adhesion). The copper foil adhesion of the cured product of the resin composition of the present invention can be measured by the method described in <Measurement of Copper Foil Adhesion> described later. The copper foil adhesion of the obtained cured product is preferably 0.40 kgf / cm or more, more preferably 0.45 kgf / cm or more, or 0.50 kgf / cm or more. The upper limit of the copper foil adhesion is not particularly limited, but usually it may be 1.2 kgf / cm or less.
The resin composition of the present invention can provide a cured product with less deterioration of copper foil adhesion in a high temperature and high humidity environment. The obtained cured product exhibits high copper foil adhesion even after an accelerated environmental test held at 130 ° C. and 85% RH for 100 hours. The adhesion of the copper foil after the accelerated environment test is preferably 0.25 kgf / cm or more. The upper limit of the adhesion to the copper foil is not particularly limited, but may be usually 1.2 kgf / cm or less.

The resin composition of the present invention can provide a cured product having low dielectric loss tangent, high mechanical strength, and high adhesion. Therefore, the resin composition of the present invention is a resin composition for forming an insulating layer (including a rewiring layer) in which a conductor layer (including a rewiring layer) is formed in contact with the resin composition (resin for an insulating layer for forming a conductor layer). It can be suitably used as a composition). Further, it can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board), and a resin for forming an interlayer insulating layer of a printed wiring board. It can be more preferably used as a composition (resin composition for an interlayer insulating layer of a printed wiring board). Further, the resin composition of the present invention can be suitably used as a resin composition (resin composition for embedding parts) for embedding semiconductor parts in a semiconductor package or embedding parts in a circuit board with built-in parts. .. The resin composition of the present invention can also be used in a wide range of applications in which a resin composition is required, such as an adhesive film, a sheet-like laminated material such as a prepreg, a solder resist, an underfill material, a die bonding material, and a hole filling resin.

[Sheet-like laminated material]
The resin composition of the present invention can be applied and used in a varnished state, but industrially, it is generally preferable to use the resin composition in the form of a sheet-like laminated material containing the resin composition.

As the sheet-shaped laminated material, the following adhesive films and prepregs are preferable.

In one embodiment, the adhesive film comprises a support and a resin composition layer (adhesive layer) bonded to the support, and the resin composition layer (adhesive layer) is the resin composition of the present invention. Formed from.

The thickness of the resin composition layer is preferably 100 μm or less, more preferably 80 μm or less, still more preferably 60 μm or less or 50 μm or less, from the viewpoint of reducing the thickness of the printed wiring board. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be usually 1 μm or more, 5 μm or more, and the like.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.

When a film made of a plastic material is used as the support, the plastic material includes, for example, polyester such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and acrylic such as polycarbonate (PC) and polymethylmethacrylate (PMMA). , Cyclic polyolefin, Triacetyl Cellulose (TAC), Polyether Sulfide (PES), Polyether Ketone, Polyimide and the like. Of these, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, and the like, and copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. You may use it.

The support may be matted or corona-treated on the surface of the support to be joined to the resin composition layer. Further, as the support, a support with a release layer having a release layer on the surface on the side to be joined with the resin composition layer may be used. Examples of the release agent used for the release layer of the support with the release layer include one or more release agents selected from the group consisting of alkyd resin, olefin resin, urethane resin, and silicone resin. .. Examples of commercially available release agents include "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation, which are alkyd resin-based mold release agents.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When the support is a support with a release layer, the thickness of the entire support with a release layer is preferably in the above range.

For the adhesive film, for example, a resin varnish in which a resin composition is dissolved in an organic solvent is prepared, and this resin varnish is applied onto a support using a die coater or the like and further dried to form a resin composition layer. It can be manufactured by.

Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK) and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, cellosolve and butyl carbitol and the like. Examples thereof include carbitols, aromatic hydrocarbons such as toluene and xylene, and amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone. The organic solvent may be used alone or in combination of two or more.

Drying may be carried out by a known method such as heating or blowing hot air. The drying conditions are not particularly limited, but the resin composition layer is dried so that the content of the organic solvent is 10% by mass or less, preferably 5% by mass or less. Although it depends on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, the resin composition is obtained by drying at 50 ° C. to 150 ° C. for 3 to 10 minutes. A layer can be formed.

In the adhesive film, a protective film similar to the support can be further laminated on the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to prevent dust and the like from adhering to the surface of the resin composition layer and scratches. The adhesive film can be rolled up and stored. If the adhesive film has a protective film, it can be used by peeling off the protective film.

In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

The sheet-shaped fiber base material used for the prepreg is not particularly limited, and those commonly used as the base material for the prepreg such as glass cloth, aramid non-woven fabric, and liquid crystal polymer non-woven fabric can be used. From the viewpoint of reducing the thickness of the printed wiring board, the thickness of the sheet-shaped fiber base material is preferably 50 μm or less, more preferably 40 μm or less, still more preferably 30 μm or less, still more preferably 20 μm or less. The lower limit of the thickness of the sheet-shaped fiber base material is not particularly limited, but is usually 10 μm or more.

The prepreg can be produced by a known method such as a hot melt method or a solvent method.

The thickness of the prepreg may be in the same range as the resin composition layer in the above-mentioned adhesive film.

In the present invention using a resin composition containing a combination of the component (A), the component (B), and the component (C), the dielectric loss tangent is low, the mechanical strength is high, and the adhesion to the conductor layer is good. It is possible to realize a sheet-like laminated material that brings about an object.

[Printed wiring board]
The printed wiring board of the present invention includes an insulating layer made of a cured product of the resin composition of the present invention.

In one embodiment, the printed wiring board of the present invention can be manufactured by a method including the following steps (I) and (II) using the above-mentioned adhesive film.
(I) A step of laminating an adhesive film on an inner layer substrate so that the resin composition layer of the adhesive film is bonded to the inner layer substrate (II) A step of thermally curing the resin composition layer to form an insulating layer.

The "inner layer substrate" used in the step (I) is mainly a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a heat-curable polyphenylene ether substrate or the like, or one or both sides of the substrate. A circuit board on which a patterned conductor layer (circuit) is formed. Further, the inner layer circuit board of the intermediate product in which the insulating layer and / or the conductor layer should be further formed when the printed wiring board is manufactured is also included in the "inner layer board" in the present invention. When the printed wiring board is a circuit board with built-in parts, an inner layer board having built-in parts may be used.

The lamination of the inner layer substrate and the adhesive film can be performed, for example, by heat-pressing the adhesive film to the inner layer substrate from the support side. Examples of the member for heat-pressing the adhesive film to the inner layer substrate (hereinafter, also referred to as “heat-bonding member”) include a heated metal plate (SUS end plate or the like) or a metal roll (SUS roll). It is preferable not to press the heat-bonded member directly onto the adhesive film, but to press it through an elastic material such as heat-resistant rubber so that the adhesive film sufficiently follows the surface irregularities of the inner layer substrate.

The inner layer substrate and the adhesive film may be laminated by a vacuum laminating method. In the vacuum laminating method, the heat crimping temperature is preferably in the range of 60 ° C. to 160 ° C., more preferably 80 ° C. to 140 ° C., and the heat crimping pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0. It is in the range of .29 MPa to 1.47 MPa, and the heat crimping time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions with a pressure of 26.7 hPa or less.

Lamination can be performed by a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a vacuum pressurizing laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., and the like.

After laminating, the laminated adhesive film may be smoothed by pressing under normal pressure (under atmospheric pressure), for example, from the support side. The press conditions for the smoothing treatment can be the same as the heat-bonding conditions for the above-mentioned lamination. The smoothing process can be performed by a commercially available laminator. The laminating and smoothing treatment may be continuously performed using the above-mentioned commercially available vacuum laminator.

The support may be removed between steps (I) and step (II) or after step (II).

In step (II), the resin composition layer is thermally cured to form an insulating layer.

The thermosetting conditions of the resin composition layer are not particularly limited, and the conditions usually adopted when forming the insulating layer of the printed wiring board may be used.

For example, the thermosetting conditions of the resin composition layer differ depending on the type of the resin composition and the like, but the curing temperature is in the range of 120 ° C. to 240 ° C. (preferably in the range of 150 ° C. to 220 ° C., more preferably 170 ° C. to 170 ° C.). The curing time can be in the range of 5 minutes to 120 minutes (preferably 10 minutes to 100 minutes, more preferably 15 minutes to 90 minutes).

Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is heated at a temperature of 50 ° C. or higher and lower than 120 ° C. (preferably 60 ° C. or higher and 110 ° C. or lower, more preferably 70 ° C. or higher and 100 ° C. or lower). Preheating may be performed for 5 minutes or longer (preferably 5 to 150 minutes, more preferably 15 to 120 minutes).

When manufacturing a printed wiring board, even if (III) a step of drilling a hole in the insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer on the surface of the insulating layer are further carried out. good. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art used for manufacturing a printed wiring board. When the support is removed after the step (II), the support may be removed between the steps (II) and the step (III), between the steps (III) and the step (IV), or the step ( It may be carried out between IV) and step (V).

In another embodiment, the printed wiring board of the present invention can be manufactured using the above-mentioned prepreg. The manufacturing method is basically the same as when an adhesive film is used.

The step (III) is a step of drilling holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out by using, for example, a drill, a laser, a plasma, or the like, depending on the composition of the resin composition used for forming the insulating layer. The dimensions and shape of the holes may be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. The procedure and conditions for the roughening treatment are not particularly limited, and known procedures and conditions usually used for forming the insulating layer of the printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order. The swelling solution is not particularly limited, and examples thereof include an alkaline solution and a surfactant solution, preferably an alkaline solution, and the alkaline solution is more preferably a sodium hydroxide solution or a potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Security Guns P" and "Swelling Dip Security Guns SBU" manufactured by Atotech Japan Co., Ltd. The swelling treatment with the swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in the swelling liquid at 30 ° C. to 90 ° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the cured product in the swelling liquid at 40 ° C to 80 ° C for 5 to 15 minutes. The oxidizing agent is not particularly limited, and examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60 ° C to 80 ° C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dozing Solution Security P" manufactured by Atotech Japan Co., Ltd. The neutralizing solution is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Security P" manufactured by Atotech Japan Co., Ltd. The treatment with the neutralizing solution can be performed by immersing the treated surface that has been roughened with the oxidizing agent in the neutralizing solution at 30 ° C. to 80 ° C. for 5 to 30 minutes. From the viewpoint of workability and the like, a method of immersing the object roughened with an oxidizing agent in a neutralizing solution at 40 ° C to 70 ° C for 5 to 20 minutes is preferable.

Step (V) is a step of forming a conductor layer.

The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer is one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be, for example, an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper, etc.). Examples include layers formed from nickel alloys and copper-titanium alloys). Among them, from the viewpoint of versatility, cost, ease of patterning, etc. for forming a conductor layer, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy, copper, etc. A nickel alloy, a copper-titanium alloy alloy layer is preferable, a chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper single metal layer, or a nickel-chromium alloy alloy layer is more preferable, and a copper single metal layer is preferable. A metal layer is more preferred.

The conductor layer may have a single-layer structure, a single metal layer made of different types of metals or alloys, or a multi-layer structure in which two or more alloy layers are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

The thickness of the conductor layer depends on the design of the desired printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

In one embodiment, the conductor layer may be formed by plating. For example, the surface of the insulating layer can be plated by a conventionally known technique such as a semi-additive method or a full additive method to form a conductor layer having a desired wiring pattern.

In other embodiments, the conductor layer may be formed using metal leaf. When the conductor layer is formed using the metal foil, it is preferable that the step (V) is carried out between the steps (I) and the step (II). For example, after step (I), the support is removed and a metal leaf is laminated on the surface of the exposed resin composition layer. The laminating of the resin composition layer and the metal foil may be carried out by a vacuum laminating method. The laminating conditions may be the same as the conditions described for step (I). Then, step (II) is carried out to form an insulating layer. After that, the metal foil on the insulating layer can be used to form a conductor layer having a desired wiring pattern by a conventionally known technique such as a subtractive method or a modified semi-additive method.

The metal foil can be produced by a known method such as an electrolysis method or a rolling method. Examples of commercially available metal foils include HLP foils and JXUT-III foils manufactured by JX Nippon Mining & Metals Co., Ltd., 3EC-III foils and TP-III foils manufactured by Mitsui Mining & Smelting Co., Ltd.

When a printed wiring board is manufactured using the resin composition of the present invention containing a combination of the component (A), the component (B), and the component (C), the dielectric loss tangent is low, the mechanical strength is high, and the adhesion is high. An excellent insulating layer can be realized.

[Semiconductor package]
The semiconductor package of the present invention includes a circuit board, a semiconductor component mounted on the circuit board, and a sealing material for sealing the semiconductor component, and the sealing material is a cured product of the resin composition of the present invention. It is characterized by being formed from. Here, the structure and type of the circuit board and the semiconductor component constituting the semiconductor package of the present invention are not particularly limited, and any circuit board and the semiconductor component usually used when forming the semiconductor package may be used.

The semiconductor package of the present invention can be produced by encapsulating a semiconductor with the resin composition of the present invention. The conditions for encapsulating the semiconductor are not particularly limited, and any encapsulation conditions usually used for manufacturing a semiconductor package may be adopted.

[Semiconductor device]
The semiconductor device of the present invention includes a cured product of the resin composition of the present invention. The semiconductor device of the present invention can be manufactured by using the printed wiring board or the semiconductor package of the present invention.

Examples of semiconductor devices include various semiconductor devices used in electric products (for example, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft, etc.).

Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to the examples shown below. In the following description, "parts" and "%" representing quantities mean "parts by mass" and "% by mass", respectively, unless otherwise specified.

First, the measurement / evaluation method in the physical property evaluation in the present specification will be described.

<Measurement of copper foil adhesion>
(1) Base treatment of copper foil Immerse the glossy surface of electrolytic copper foil (“3EC-III” manufactured by Mitsui Mining & Smelting Co., Ltd., thickness 35 μm) in a microetching agent (“CZ-8101” manufactured by MEC Co., Ltd.). Then, the copper surface was subjected to a roughening treatment (Ra value = 1 μm), and then a rust preventive treatment was performed using a rust preventive solution (“CL8300” manufactured by MEC). The obtained copper foil is called CZ copper foil. Further, it was heat-treated in an oven at 130 ° C. for 30 minutes.

(2) Lamination of copper foil and formation of insulating layer As an inner layer circuit board, a glass cloth base material epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic Corporation) Made "R1515A") was prepared. Next, the adhesive films obtained in Examples and Comparative Examples are bonded to the inner circuit board by the resin composition layer using a batch type vacuum pressure laminator (“MVLP-500” manufactured by Meiki Seisakusho Co., Ltd.). As described above, they were laminated on both sides of the inner layer circuit board. Lamination was carried out by reducing the pressure for 30 seconds to reduce the atmospheric pressure to 13 hPa or less, and then crimping at 100 ° C. and a pressure of 0.74 MPa for 30 seconds. After laminating, the PET film was peeled off. The treated surface of the CZ copper foil was laminated on the exposed resin composition layer under the same conditions as described above. Then, by curing the resin composition layer at 190 ° C. for 90 minutes to form an insulating layer, CZ copper foil / insulating layer / glass cloth base material epoxy resin double-sided copper-clad laminate / insulating layer / CZ A sample having a copper foil structure was prepared.

-Measurement of copper foil adhesion (adhesion 1)-
The prepared sample was cut into small pieces of 150 × 30 mm. Use a cutter to make a notch in the copper foil part of a small piece with a width of 10 mm and a length of 100 mm, and peel off one end of the copper foil in the length direction. The load was measured in accordance with JIS C6481 when it was grasped by SL ”) and the 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature using an Instron universal tester. The load measured in this way is referred to as "adhesion 1".

-Measurement of copper foil adhesion (adhesion 2) after high temperature and high humidity environment test (HAST)-
The prepared sample was subjected to an accelerated environmental test for 100 hours at 130 ° C. and 85% RH using an advanced accelerated life test device (“PM422” manufactured by Kusumoto Kasei Co., Ltd.). After that, as in the measurement of adhesion 1, after making a notch, peel off one end in the length direction of the copper foil and grab it with a gripper (“AC-50C-SL” manufactured by TSE Co., Ltd.), and instron universal. Using a testing machine, the load when 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature was measured according to JIS C6481. The load measured in this way is referred to as "adhesion 2".

The case where the measurement result in the adhesion 2 was less than 0.25 kgf / cm was evaluated as "NG", and the case where the measurement result was 0.25 kgf / cm or more was evaluated as "OK".

<Measurement of dielectric loss tangent and mechanical properties (elongation)>
The adhesive films obtained in Examples and Comparative Examples were heat-cured at 200 ° C. for 90 minutes, and then the support was peeled off to prepare a sample for evaluation of cured physical properties.

-Measurement of dielectric loss tangent-
A test piece having a width of 2 mm and a length of 80 mm was cut out from the sample for evaluating the cured physical characteristics. The dielectric loss tangent of the test piece was measured at a measurement frequency of 5.8 GHz and a measurement temperature of 23 ° C. by a cavity resonance perturbation method using "HP8632B" manufactured by Agilent Technologies. Measurements were made on the two test pieces, and the average value was calculated.

When the average value of the dielectric loss tangent was less than 0.0058, it was evaluated as "OK", and when it was 0.0058 or more, it was evaluated as "NG".

-Measurement of breaking elongation-
Tensile strength was measured using a tensile tester "RTC-1250A" manufactured by Orientec, and the elongation at break at 23 ° C. was measured. The measurement was carried out in accordance with JIS K7127. The measurement was performed 5 times, and the average value of the top 3 points was calculated.

When the average value of elongation at break was less than 1.6%, it was evaluated as "NG", and when it was 1.6% or more, it was evaluated as "OK".

<Example 1>
Bisphenol A type epoxy resin (Mitsubishi Chemical's "828US", epoxy equivalent 180g / eq) 10 parts, Naftor type epoxy resin (Nippon Steel & Sumikin Chemical Co., Ltd. "ESN475V", epoxy equivalent 330g / eq) 5 parts, bisphenol AF type epoxy 10 parts of the resin (“YL7760” manufactured by Mitsubishi Chemical Co., Ltd., epoxy equivalent 238 g / eq) was heated and dissolved in 30 parts of methyl ethyl ketone (MEK) with stirring, and then cooled to room temperature. To the obtained resin solution, 30 parts of an active ester resin (“HPC-8000-65T” manufactured by DIC, a toluene solution having an active ester group equivalent of 223 g / eq and a non-volatile content of 65% by mass) and a phenol resin (“LA” manufactured by DIC). -3018-50P ", phenolic hydroxyl group equivalent 151 g / eq, 2-methoxypropanol solution with 50% non-volatile content), acrylic group-containing resin ("A-DCP "manufactured by Shin-Nakamura Chemical Industry Co., Ltd., radically polymerizable functional group" Equivalent 152 g / eq) 20 parts, vinyl group-containing active ester resin (“PC1300-02-65MA” manufactured by Air Water Co., Ltd., active ester group equivalent 199 g / eq, radical polymerizable functional group equivalent 1400 g / eq, non-volatile content 65% 20 parts of methylamylketone solution), 5 parts of phenoxy resin (“YL7553BH30” manufactured by Mitsubishi Chemical Co., Ltd., 1: 1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass), curing accelerator (4-dimethylaminopyridine (DMAP)) , 3 parts of MEK solution with 5% by mass of non-volatile content), 0.6 parts of dicumyl peroxide (“Park Mill D” manufactured by Nichiyu Co., Ltd.), surface with amine-based silane coupling agent (“KBM573” manufactured by Shin-Etsu Chemical Industry Co., Ltd.) 150 parts of treated spherical silica ("SO-C2" manufactured by Admatex, average particle size 0.5 μm) is mixed, uniformly dispersed with a high-speed rotary mixer, and then filtered with a cartridge filter ("SHP020" manufactured by ROKITECHNO). Then, the resin varnish 1 was prepared.

Next, a resin varnish was placed on the release layer of a PET film with an alkyd resin-based release layer (“AL-5” manufactured by Lintec Co., Ltd., thickness 38 μm) so that the thickness of the resin composition layer after drying was 40 μm. 1 was uniformly applied with a die coater and dried at 80 to 110 ° C. (average 95 ° C.) for 5 minutes to prepare an adhesive film 1.

<Example 2>
Instead of 10 parts of bisphenol A type epoxy resin (Mitsubishi Chemical Co., Ltd. "828US"), allyl group-containing epoxy resin (Nippon Kayaku Co., Ltd. "RE810-NM", epoxy group equivalent 221 g / eq, radically polymerizable functional group equivalent) The resin varnish 2 and the adhesive film 2 were produced in the same manner as in Example 1 except that 10 parts of 221 g / eq) were used.

<Example 3>
The fact that the vinyl group-containing active ester resin (“PC1300-02-65MA” manufactured by Air Water Co., Ltd.) was not blended, and the blending amount of the active ester resin (“HPC-8000-65T” manufactured by DIC Co., Ltd.) was 30 to 50 parts. The resin varnish 3 and the adhesive film 3 were produced in the same manner as in Example 1 except that the parts were changed.

<Example 4>
5 parts of phenolic resin (“LA-3018-50P” manufactured by DIC, phenolic hydroxyl group equivalent 151 g / eq, 2-methoxypropanol solution with 50% non-volatile content), styryl group-containing resin (“OPE-2St” manufactured by Mitsubishi Gas Chemicals, Inc.) 1200 ”, radically polymerizable functional group equivalent 630 g / eq, non-volatile content 60% toluene solution), vinyl group-containing active ester resin (“PC1300-02-65MA” manufactured by Air Water Co., Ltd., active ester group equivalent 199 g / eq, radical polymerizable group equivalent 1400 g / eq, non-volatile content 65% methylamylketone solution) 50 parts, allyl group-containing epoxy resin (“RE810-NM” manufactured by Nippon Kayaku Co., Ltd., epoxy group equivalent 221 g / eq, radical polymerization 25 parts of sex functional group equivalent (221 g / eq), 5 parts of phenoxy resin (“YL7553BH30” manufactured by Mitsubishi Chemical Co., Ltd., 1: 1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass), curing accelerator (DMAP, 5 mass of non-volatile content) % MEK solution) 3 parts, dicumyl peroxide ("Park Mill D" manufactured by Nichiyu Co., Ltd.) 0.6 parts, spherical silica (Spherical silica ("KBM573" manufactured by Shin-Etsu Chemical Industry Co., Ltd.) surface-treated with an amine-based silane coupling agent ("KBM573"). 150 parts of "SO-C2" manufactured by Admatex (average particle size 0.5 μm) are mixed, uniformly dispersed with a high-speed rotary mixer, filtered with a cartridge filter (“SHP020” manufactured by ROKITECHNO), and a resin varnish. 4 was prepared.
Using the obtained resin varnish 4, an adhesive film 4 was produced in the same manner as in Example 1.

<Example 5>
(1) The compounding amount of the phenol resin ("LA-3018-50P" manufactured by DIC) was changed from 5 parts to 1 part, and (2) the styryl group-containing resin ("OPE-2St 1200" manufactured by Mitsubishi Gas Chemicals Co., Ltd. " ) Was changed from 10 parts to 1 part, and (3) the amount of vinyl group-containing active ester resin (“PC1300-02-65MA” manufactured by Air Water Co., Ltd.) was changed from 50 parts to 55 parts. Point, (4) Resin varnish 5 and adhesion in the same manner as in Example 4, except that the blending amount of the allyl group-containing epoxy resin (“RE810-NM” manufactured by Nippon Kayaku Co., Ltd.) was changed from 25 parts to 30 parts. Film 5 was produced.

<Example 6>
Examples except that 10 parts of acryloyl group-containing resin (“OPE-2St 1200” manufactured by Mitsubishi Gas Chemical Co., Ltd.) was used instead of 20 parts of acrylic group-containing resin (“A-DCP” manufactured by Shin-Nakamura Chemical Industry Co., Ltd.). The resin varnish 6 and the adhesive film 6 were produced in the same manner as in 2.

<Example 7>
Carbodiimide resin ("V-03" manufactured by Nisshinbo Chemical Co., Ltd., carbodiimide group equivalent 216 g / eq, toluene solution with 50% by mass of non-volatile content) instead of 5 parts of phenol resin ("LA-3018-50P" manufactured by DIC) 20 The resin varnish 7 and the adhesive film 7 were produced in the same manner as in Example 6 except that the parts were used.

<Example 8>
Instead of 10 parts of styryl group-containing resin (Mitsubishi Gas Chemicals Co., Ltd. "OPE-2St 1200"), bismaleimide resin (Nippon Kayaku Co., Ltd. "MIR-3000-70MT", radical polymerizable group equivalent 275 g / eq, non-volatile A resin varnish 8 and an adhesive film 8 were prepared in the same manner as in Example 6 except that 10 parts (70% by mass of toluene, MEK solution) was used.

<Example 9>
Instead of 10 parts of the allyl group-containing epoxy resin (Nippon Kayaku Co., Ltd. "RE810-NM"), the allyl group-containing epoxy resin (Nippon Kayaku Co., Ltd. "RE820", epoxy group equivalent 228 g / eq, radically polymerizable group equivalent) A resin varnish 9 and an adhesive film 9 were produced in the same manner as in Example 3 except that 10 parts of 228 g / eq) were used.

<Example 10>
Instead of 10 parts of allyl group-containing epoxy resin ("RE810-NM" manufactured by Nippon Kayaku Co., Ltd.), allyl group-containing phenol resin ("MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenolic hydroxyl group equivalent 140 g / eq, radical polymerizable A resin varnish 10 and an adhesive film 10 were produced in the same manner as in Example 3 except that 10 parts of functional group equivalent 140 g / eq) were used.

<Comparative Examples 1 to 8>
Resin varnishes 11 to 18 of Comparative Examples 1 to 8 were prepared according to the blending amounts shown in the table below. Then, the adhesive films 11 to 18 were produced in the same manner as in Example 1.

Table 1 shows the evaluation results of Examples and Comparative Examples.

Even when the spherical silica "SO-C2" is not blended and the curing accelerator (dimethylaminopyridine (DMAP) and "Parkmill D") is not blended, the results are the same as those in the above-mentioned Examples, although the degree is different. I have confirmed that I will return.

Claims (22)

(A) Resin having a thermosetting functional group FA (however, component (C) is excluded),
(B) Reacts with a resin having a radically polymerizable functional group FB (however, the component (C) is excluded), and (C) a functional group FA'that reacts with a thermosetting functional group FA and a radically polymerizable functional group FB. Resin having the functional group FB',
A resin composition containing
A copper foil having a thickness of 35 μm was laminated on the resin composition layer of the resin composition, and the resin composition layer was cured under curing conditions of 190 ° C. for 90 minutes. When the accelerated environment test for 100 hours was carried out under the condition of% RH, and 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature, which was measured according to JIS C6481 for the sample. The load is 0.25 kgf / cm or more.
Resin composition. The group in which the thermosetting functional group FA consists of an epoxy group, a phenolic hydroxyl group, a benzoxazine group, a cyanate ester group, an active ester group, a carbodiimide group, an acid anhydride group, an oxetanyl group, an episulfide group, an isocyanate group, and an amino group. The resin composition according to claim 1, which is one or more selected from the above. The resin composition according to claim 1 or 2, wherein the radically polymerizable functional group FB is an ethylenically unsaturated group. Any one of claims 1 to 3, wherein the radically polymerizable functional group FB is at least one selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an allyl group, a vinyl group, a propenyl group, and a maleimide group. The resin composition according to item 1. The functional group FA'of the component (C) is an epoxy group, a phenolic hydroxyl group, a benzoxazine group, a cyanate ester group, an active ester group, a carbodiimide group, an acid anhydride group, an oxetanyl group, an episulfide group, an isocyanate group, and an amino group. The resin composition according to any one of claims 1 to 4, which is one or more selected from the group consisting of. Claims 1 to 5 wherein the functional group FB'of the component (C) is at least one selected from the group consisting of an acrylic group, a methacrylic group, a styryl group, an allyl group, a vinyl group, a propenyl group, and a maleimide group. The resin composition according to any one of the above items. The resin composition according to any one of claims 1 to 6, further comprising (D) an inorganic filler. (D) The resin composition according to claim 7, wherein the median diameter (volume standard) of the component is 3 μm or less. The resin composition according to claim 7 or 8, wherein the content of the component (D) is 50% by mass or more when the non-volatile component in the resin composition is 100% by mass. The resin composition according to claim 7 or 8, wherein the content of the component (D) is 60% by mass or more when the non-volatile component in the resin composition is 100% by mass. The resin composition according to claim 7 or 8, wherein the content of the component (D) is 65% by mass or more when the non-volatile component in the resin composition is 100% by mass. Any one of claims 1 to 11, wherein the number na of the functional group _FA'of the component (C) when the number of thermosetting functional groups FA of the component ( _A ) is 1 satisfies na ≤ 200. The resin composition according to the section. Any one of claims 1 to 12, wherein the number n _b of the functional group FB'of the component (C) when the number of the radically polymerizable functional group FB of the component (B) is 1 satisfies n _b ≤ 400. The resin composition according to the section. When the number of thermosetting functional groups FA of the component (A) is 1, the number of functional groups FA'of the component (C) is n _a , and the number of radically polymerizable functional groups FB of the component (B) is 1. When the number n _b of the functional group FB'of the component (C) is
0.01 ≤ n _a ≤ 200 and 0.01 ≤ n _b ≤ 400
The resin composition according to any one of claims 1 to 13, which satisfies the above conditions. The resin composition according to any one of claims 1 to 14, which is substantially free of a photopolymerization initiator. The resin composition according to any one of claims 1 to 15, which is for an insulating layer for forming a conductor layer. The resin composition according to any one of claims 1 to 16, which is used for an insulating layer of a printed wiring board. A sheet-like laminated material containing the resin composition according to any one of claims 1 to 17. The cured product of the resin composition according to any one of claims 1 to 17. A cured product of the resin composition according to any one of claims 1 to 17.
A copper foil having a thickness of 35 μm was laminated on the resin composition layer of the resin composition, and the resin composition layer was cured under curing conditions of 190 ° C. for 90 minutes. When the accelerated environment test for 100 hours was carried out under the condition of% RH, and 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature, which was measured according to JIS C6481 for the sample. A cured product having a load of 0.25 kgf / cm or more. A printed wiring board containing the cured product of the resin composition according to any one of claims 1 to 17 or the cured product according to claim 19 or 20. A semiconductor device comprising the cured product of the resin composition according to any one of claims 1 to 17 or the cured product according to claim 19 or claim 20.