JP2022026520A - Array type inductor - Google Patents

Abstract

To provide an array type inductor suppressing a magnetic coupling between inductors in a small size in a direction along a component side.SOLUTION: An array type inductor 1 comprises: a base substance 10 containing a plurality of metal magnetic particles and having a first surface 10b; a first coil conductor 25A and a second coil conductor 25B provided in the base substance; a first outer electrode 21A connected to one end of the first coil conductor and a second outer electrode 22A connected to the other end; and a third outer electrode 21B connected to one end of the second coil conductor and a fourth outer electrode 22B connected to the other end. Each of the first to fourth outer electrodes is provided to the base substance so that at least one part is contacted to the first surface. The first coil conductor includes a first circulation part wound around the circumference of a first coil axis extending in a direction parallel to the first surface at a position separated from the first surface by a first distance. The second coil conductor includes a second circulation part wound around the circumference of a second coil axis extending in a direction parallel to the first coil axis at a position separated by a second distance larger than the first distance.SELECTED DRAWING: Figure 1

Description

The invention disclosed herein relates to an array-type inductor, a circuit board including the array-type inductor, and an electronic device including the circuit board.

Array type inductors including a plurality of inductors have been conventionally known. In an array-type inductor, a plurality of inductors are packaged on a single chip. A typical conventional array-type inductor includes a substrate, a plurality of coil conductors provided in the substrate and insulated from each other in the substrate, and a plurality of coil conductors connected to both ends of each of the plurality of coil conductors. With an external electrode. Conventional array-type inductors are described in, for example, JP-A-2016-006830 (Patent Document 1) and JP-A-2019-153649 (Patent Document 2).

Japanese Unexamined Patent Publication No. 2016-006830 Japanese Unexamined Patent Publication No. 2019-153649

Each of the coil conductors included in the array type inductor of Patent Document 1 is wound around a coil shaft extending in a direction perpendicular to the mounting surface. Generally, in a coil conductor in an array type inductor, the dimension in the direction perpendicular to the coil axis is larger than the dimension in the direction parallel to the coil axis. Therefore, in the array type inductor of Patent Document 1, there is a problem that the dimension in the direction along the mounting surface of the substrate increases according to the number of inductors. That is, in the array type inductor of Patent Document 1, it is difficult to reduce the size in the direction along the mounting surface.

Patent Document 2 discloses an array-type inductor having a plurality of coil conductors configured so that both ends are exposed from the mounting surface. When the distance between the plurality of inductors included in the array-type inductor is reduced in order to reduce the size of the array-type inductor of Patent Document 2, the magnetic coupling between the plurality of inductors becomes large, and each inductor is located. It becomes impossible to demonstrate the characteristics of the period.

An object of the present invention is to solve or alleviate at least a part of the above-mentioned problems. One of the more specific objects of the present invention is to provide an array-type inductor that can be miniaturized in the direction along the mounting surface and in which magnetic coupling between inductors is suppressed.

Objectives other than the above of the present invention will be made clear through the description of the entire specification. The invention disclosed in the present specification may solve a problem grasped from other than the description in the column of "Problem to solve the invention".

The array-type inductor according to one or a plurality of embodiments of the present invention is provided in a substrate containing a plurality of metallic magnetic particles and having a first surface, and in the substrate, and is separated from the first surface by a first distance. A first coil conductor having a first circumferential portion wound around a first coil shaft extending in a direction parallel to the first surface at a position, and a first coil conductor provided in the substrate, from the first surface to the first surface. A second coil conductor having a second circuit wound around a second coil shaft extending in a direction parallel to the first coil shaft at a position separated by a second distance larger than one distance, and at least the first coil conductor. A first external electrode (21A) provided on the substrate so as to be in contact with a surface and connected to one end of the first coil conductor, and the first coil provided on the substrate so as to be in contact with at least the first surface. A second external electrode connected to the other end of the conductor, a third external electrode provided on the substrate so as to be in contact with at least the first surface and connected to one end of the second coil conductor, and at least the first surface. A fourth external electrode provided on the substrate so as to be in contact with the surface and connected to the other end of the second coil conductor.

In one or more embodiments of the present invention, the distance between the first coil conductor and the second coil conductor in the direction along the first coil axis is 0.3 mm or less.

In one or more embodiments of the present invention, the relative permeability of the substrate is 100 or less.

In one or more embodiments of the present invention, the first circuit is wound around the first coil shaft for 1.5 turns or less, and the second circuit is the second coil shaft. It is wrapped around for 1.5 turns or less.

In one or more embodiments of the present invention, the shape of the first peripheral portion seen from the direction of the first coil shaft is the same as the shape of the second peripheral portion seen from the direction of the second coil shaft. be.

In one or more embodiments of the present invention, the absolute value of the coupling coefficient between the first coil conductor and the second coil conductor is 0.15 or less.

In one or more embodiments of the invention, the dimensions of the cross section of the first circuit in the direction perpendicular to the first coil axis relative to the dimensions of the cross section of the first circuit in the direction parallel to the first coil axis. The first aspect ratio, which is the ratio of, is larger than 1.

In one or more embodiments of the invention, the dimensions of the cross section of the second circuit in the direction perpendicular to the second coil axis relative to the dimensions of the cross section of the second circuit in the direction parallel to the second coil axis. The second aspect ratio, which is the ratio of, is larger than 1.

In one or more embodiments of the present invention, the first orbital portion has a first orbital pattern extending around the first coil axis, and the first orbital pattern is a cross section passing through the first coil axis. Has a shape without corners.

In one or more embodiments of the invention, the substrate has a first end surface connected to the first surface, and the first coil conductor is connected to one end of the first circumferential portion. It has a first lead conductor extending along one end face, and the first external electrode is connected to the first coil conductor via the first lead conductor.

The array-type inductor according to one or more embodiments of the present invention is provided in the substrate on the side opposite to the first coil conductor with respect to the second coil conductor, and is smaller than the second distance. A third coil conductor having a third circuit wound around a third coil shaft extending in a direction parallel to the first coil shaft and separated from the first surface by a distance, and one end of the third coil conductor. A fifth external electrode connected to the third coil conductor and a sixth external electrode connected to the other end of the third coil conductor are provided.

In one or more embodiments of the invention, the third distance is equal to the first distance.

In one or more embodiments of the present invention, the shape of the third peripheral portion viewed from the direction of the third coil shaft is the shape of the first peripheral portion viewed from the direction of the first coil shaft and the first. It is the same as at least one of the shapes of the second peripheral portion viewed from the direction of the two coil shafts.

In one or more embodiments of the invention, the substrate has a first end surface connected to the first surface, and the first coil conductor is the substrate in a direction along the first coil axis. It is arranged so as to face the first end surface, and is arranged so as to face the first end surface.
The distance between the second coil conductor and the third coil conductor in the direction along the first coil axis is between the first coil conductor and the second coil conductor in the direction along the first coil axis. Greater than the interval between.

The array type inductor according to one or more embodiments of the present invention is provided in the substrate on the side opposite to the second coil conductor with respect to the third coil conductor, and is larger than the third distance. A fourth coil conductor having a fourth coil wound around a fourth coil shaft extending in a direction parallel to the first coil shaft and separated from the first surface by a distance, and one end of the fourth coil conductor. A seventh external electrode connected to the third coil conductor and an eighth external electrode connected to the other end of the third coil conductor are provided.

In one or more embodiments of the invention, the fourth distance is equal to the second distance.

In one or more embodiments of the present invention, the shape of the fourth peripheral portion viewed from the direction of the fourth coil shaft is the shape of the first peripheral portion viewed from the direction of the first coil shaft, the first. It is the same as at least one of the shape of the second peripheral portion seen from the direction of the two coil shafts and the shape of the third peripheral portion seen from the direction of the third coil shaft.

In one or more embodiments of the invention, the substrate has a second end face that is connected to the first surface and faces the first end face, and the fourth coil conductor is the first coil shaft. It is arranged so as to face the second end surface of the substrate in the direction along the third coil axis, and the distance between the second coil conductor and the third coil conductor in the direction along the third coil axis is the first. It is larger than the distance between the third coil conductor and the fourth coil conductor in the direction along the three coil axes.

One embodiment of the present invention relates to a circuit board including any of the above array-type inductors.

One embodiment of the present invention relates to an electronic device including the above circuit board.

According to the disclosure of the present specification, it is possible to provide an array-type inductor that can be miniaturized in the direction along the mounting surface and in which magnetic coupling between inductors is suppressed.

It is a perspective view of the array type inductor by one Embodiment of this invention mounted on a mounting board. It is an exploded view of the array type inductor of FIG. It is sectional drawing which shows schematically the cross section of the array type inductor of FIG. 1 along the line I-I. It is a transmission diagram which saw the coil conductor 25A through a part of the substrate 10 from the direction of the L axis in the array type inductor of FIG. It is a transmission diagram which saw the coil conductor 25B through a part of the substrate 10 from the direction of the L axis in the array type inductor of FIG. It is sectional drawing which shows typically the cross section of the circumferential pattern of the coil conductor included in the array type inductor of FIG. It is sectional drawing which shows typically the cross section of the circumferential pattern of the coil conductor provided in the array type inductor according to another embodiment of this invention. It is a figure which shows typically the magnetic flux generated from the circumferential part of the coil conductor included in the array type inductor of FIG. It is a figure which shows typically the magnetic flux generated from the circumferential part of the coil conductor provided in the conventional array type inductor. It is sectional drawing which shows typically the cross section of the circumferential pattern of the coil conductor provided in the array type inductor according to another embodiment of this invention. It is an exploded view of the array type inductor according to another embodiment of this invention. It is a transmission diagram which saw the coil conductor 125A through a part of the substrate 10 from the direction of the L axis in the array type inductor of FIG. It is an exploded view of the array type inductor according to another embodiment of this invention. It is a transmission diagram which saw the coil conductor 225A through a part of the substrate 10 from the direction of the L axis in the array type inductor of FIG. It is a perspective view of the array type inductor according to another embodiment of this invention. It is an exploded view of the array type inductor of FIG. It is a perspective view of the array type inductor according to another embodiment of this invention. FIG. 6 is a cross-sectional view schematically showing a cross section of the inductor of FIG. 14 along the line II-II. It is a transmission diagram which saw the coil conductor 25C through a part of the substrate 10 from the direction of the L axis in the array type inductor of FIG. It is a transmission diagram which saw the coil conductor 25D through a part of the substrate 10 from the direction of the L axis in the array type inductor of FIG.

Hereinafter, various embodiments of the present invention will be described with reference to the drawings as appropriate. The components common to the plurality of drawings are designated by the same reference numerals throughout the plurality of drawings. It should be noted that each drawing is not always drawn to the correct scale for convenience of explanation.

The array type inductor 1 according to one or more embodiments of the present invention will be described with reference to FIGS. 1 to 5a. FIG. 1 is a perspective view of an array-type inductor 1 according to an embodiment of the present invention, FIG. 2 is an exploded view of the array-type inductor 1, and FIG. 3 is a cross section of the array-type inductor 1 along the I-I line. FIG. 4a and FIG. 4b are schematic sectional views showing the coil conductor through a part of the array-type inductor 1, and FIG. 5a shows the circumferential portion of the coil conductor included in the array-type inductor 1. It is sectional drawing which shows typically the cross section of the constituent orbital pattern.

Each figure shows an L-axis, a W-axis, and a T-axis that are orthogonal to each other. In the present specification, the "length" direction, the "width" direction, and the "thickness" direction of the array-type inductor 1 are the L-axis direction and the W-axis of FIG. 1, respectively, unless otherwise understood in the context. The direction and the T-axis direction.

As shown in the figure, the array-type inductor 1 includes a substrate 10, coil conductors 25A and 25B provided in the substrate 10, and external electrodes 21A, 21B, 22A and 22B provided on the surface of the substrate 10. Be prepared. The coil conductor 25A is connected to the external electrode 21A at one end thereof and to the external electrode 22A at the other end. The coil conductor 25B is connected to the external electrode 21B at one end thereof and to the external electrode 22B at the other end. As described above, the array-type inductor 1 includes a first inductor having a coil conductor 25A and external electrodes 21A and 22A, and a second inductor having a coil conductor 25B and external electrodes 21B and 22B. The external electrodes 21A, 22A, 21B, and 22B are separated from each other.

The array type inductor 1 is used, for example, in a large current circuit through which a large current flows. More specifically, the array type inductor 1 may be an inductor used in a DC / DC converter.

The array type inductor 1 can be mounted on the mounting board 2a. The mounting board 2a is provided with four lands 3. The four external electrodes 21A, 21B, 22A, and 22B of the array-type inductor 1 are arranged so as to face the corresponding lands 3 when the array-type inductor 1 is mounted on the mounting substrate 2a. The array-type inductor 1 may be mounted on the mounting substrate 2 by joining the external electrodes 21A, 21B, 22A, 22B and the corresponding lands 3 with solder, respectively. As described above, the circuit board 2 includes an array-type inductor 1 and a mounting board 2a on which the array-type inductor 1 is mounted. Various electronic components other than the array type inductor 1 can be mounted on the mounting board 2a.

The circuit board 2 can be mounted on various electronic devices. Electronic devices on which the circuit board 2 can be mounted include smartphones, tablets, game consoles, servers, automobile electrical components, and various other electronic devices. The array-type inductor 1 may be an internal component embedded inside the mounting board 2a.

The array-type inductor 1 is an electronic component because the first inductor having the coil conductor 25A and the external electrodes 21A and 22A and the second inductor having the coil conductor 25B and the external electrodes 21B and 22B are configured as a single chip. It is particularly suitable for small electronic devices that require high-density mounting.

The substrate 10 is formed of a magnetic material into a rectangular parallelepiped shape. In one embodiment of the present invention, the substrate 10 has a length dimension (dimension in the L-axis direction) of 0.6 mm to 10 mm, a width dimension (dimension in the W-axis direction) of 0.2 to 10 mm, and a height dimension (T). Axial dimensions) are formed to be 0.2 to 10 mm. The substrate 10 has a first region on the positive side in the L-axis direction with respect to the boundary position and a second region on the negative side with the boundary position, with a predetermined position in the L-axis direction as a boundary. The first region includes the coil conductor 25A, and the second region includes the coil conductor 25B. As described above, the substrate 10 has a plurality of regions, each having one inductor. The dimension of one region of the substrate 10 including one inductor in the L-axis direction is 0.15 mm to 5.0 mm. The dimensions of the substrate 10 are not limited to the dimensions specifically described herein. In the present specification, the term "rectangular parallelepiped" or "rectangular parallelepiped shape" does not mean only "rectangular parallelepiped" in a mathematically strict sense.

The substrate 10 has a first main surface 10a, a second main surface 10b, a first end surface 10c, a second end surface 10d, a first side surface 10e, and a second side surface 10f. The outer surface of the substrate 10 is defined by these six surfaces. The first main surface 10a and the second main surface 10b face each other, the first end surface 10c and the second end surface 10d face each other, and the first side surface 10e and the second side surface 10f face each other. Each of the first end surface 10c and the second end surface 10d connects the first main surface 10a and the second main surface 10b, and also connects the first side surface 10e and the second side surface 10f. Since the first main surface 10a is on the upper side of the substrate 10 when the mounting substrate 2a is used as a reference, the first main surface 10a may be referred to as an "upper surface" and the second main surface 10b may be referred to as a "lower surface". The array type inductor 1 is arranged so that the first main surface 10a or the second main surface 10b faces the mounting substrate 2a. Of the first main surface 10a or the second main surface 10b, the surface facing the mounting board 2a is referred to as a "mounting surface". In the illustrated embodiment, the second main surface 10b faces the mounting board 2a, so that the second main surface 10b is the "mounting surface". Therefore, in the present specification, the second main surface 10b may be referred to as a “mounting surface 10b”. Since the "mounting surface" of the substrate 10 is a surface facing the mounting substrate 2a, a surface other than the second main surface 10b may be the mounting surface. At least a part of all the external electrodes 21A, 22A, 21B, and 22B included in the array type inductor 1 are in contact with the mounting surface of the substrate 10. In the embodiment shown in FIG. 1, since all a part of the external electrodes 21A, 22A, 21B, and 22B are in contact with the first main surface 10a and the second main surface 10b, respectively, the first main surface 10a and the first main surface 10a and the first surface are in contact with each other. 2 Either of the main surfaces 10b may be used as the mounting surface.

When referring to the vertical direction of the array type inductor 1, the vertical direction of FIG. 1 is used as a reference. The thickness direction of the array-type inductor 1 or the substrate 10 may be perpendicular to at least one of the upper surface 10a and the mounting surface 10b. The length direction of the array-type inductor 1 or the substrate 10 may be perpendicular to at least one of the first end surface 10c and the second end surface 10d. The width direction of the array-type inductor 1 or the substrate 10 may be perpendicular to at least one of the first side surface 10e and the second side surface 10f. The width direction of the array-type inductor 1 or the substrate 10 may be a direction perpendicular to the thickness direction and the length direction of the array-type inductor 1 or the substrate 10.

In the illustrated embodiment, the external electrodes 21A and 21B are provided so as to be in contact with the mounting surface 10b, the first side surface 10e, and the upper surface 10a of the substrate 10. The external electrodes 22A and 22B are provided so as to be in contact with the mounting surface 10b, the second side surface 10f, and the upper surface 10a of the substrate 10. The external electrodes 21A and 21B may be provided on the substrate 10 so as to be in contact with the mounting surface 10b and the first side surface 10e but not with the upper surface 10a. The external electrodes 22A and 22B may be provided on the substrate 10 so as to be in contact with the mounting surface 10b and the second side surface 10f but not with the upper surface 10a. The shapes and arrangements of the external electrodes 21A, 21B, 22A, 22B are not limited to those explicitly described herein. The external electrodes 21A, 21B, 22A, and 22B may have the same shape or different shapes from each other. A set of external electrodes arbitrarily selected from the external electrodes 21A, 21B, 22A, and 22B may have the same shape.

The substrate 10 is made of a magnetic material. The magnetic material for the substrate 10 may contain a plurality of metallic magnetic particles. The metal magnetic particles contained in the magnetic material for the substrate 10 include, for example, (1) metal particles such as Fe and Ni, (2) Fe—Si—Cr alloy, Fe—Si—Al alloy, Fe—Ni alloy and the like. Crystal alloy particles, (3) amorphous alloy particles such as Fe—Si—Cr—B—C alloy, Fe—Si—Cr—B alloy, or (4) mixed particles in which these are mixed. The composition of the metallic magnetic particles contained in the substrate 10 is not limited to that described above. For example, the metallic magnetic particles contained in the substrate 10 are Co—Nb—Zr alloy, Fe—Zr—Cu—B alloy, Fe—Si—B alloy, Fe—Co—Zr—Cu—B alloy, Ni—Si—. It may be a B alloy or a Fe-AL-Cr alloy. The Fe-based metal magnetic particles contained in the substrate 10 may contain 80 wt% or more of Fe. An insulating film may be formed on each surface of the metallic magnetic particles. The insulating film may be an oxide film formed by oxidizing the above-mentioned metal or alloy. The insulating film provided on each surface of the metal magnetic particles may be, for example, a silicon oxide film coated by a sol-gel method.

In one or more embodiments, the metallic magnetic particles contained in the substrate 10 have an average particle size of 1.0 to 20 μm. The average particle size of the metal magnetic particles contained in the substrate 10 may be smaller than 1.0 μm or larger than 20 μm. The substrate 10 may contain two or more types of metallic magnetic particles having different average particle sizes from each other.

In the substrate 10, the metal magnetic particles may be bonded to each other by an oxide film formed by oxidizing the elements contained in the metal magnetic particles in the manufacturing process. The substrate 10 may contain a binder in addition to the metal magnetic particles. When the substrate 10 contains a binder, the metal magnetic particles are bonded to each other by the binder. The binder contained in the substrate 10 may be formed, for example, by curing a thermosetting resin having excellent insulating properties. Examples of the binder material include epoxy resin, polyimide resin, polystyrene (PS) resin, high-density polyethylene (HDPE) resin, polyoxymethylene (POM) resin, polycarbonate (PC) resin, polyvinyl fluoride den (PVDF) resin, and phenol. (Phenolic) resin, polytetrafluoroethylene (PTFE) resin, or polybenzoxazole (PBO) resin can be used.

In one or more embodiments of the present invention, the relative permeability of the substrate 10 is 100 or less. In one or more embodiments of the present invention, the relative permeability of the substrate 10 is 30 or more. In one or more embodiments of the present invention, the relative magnetic permeability of the substrate 10 is in the range of 30 or more and 100 or less. The substrate 10 may be configured such that the relative magnetic permeability is in the range of 30 to 100 in the entire region. As described above, the array-type inductor 1 may be used in a DC / DC converter that requires low inductance. By setting the relative magnetic permeability of the substrate 10 to 100 or less, it becomes easy to realize the required low inductance. By setting the relative magnetic permeability of the substrate 10 to 100 or less, it becomes easy to realize high current characteristics. By setting the relative magnetic permeability of the substrate 10 to 100 or less, it becomes easy to realize high insulation. By setting the relative magnetic permeability of the substrate 10 to 100 or less, it is possible to suppress the occurrence of magnetic saturation, so that it is not necessary to provide a magnetic gap in the substrate 10 in order to improve the DC superimposition characteristic.

As described above, since the relative magnetic permeability of the substrate 10 of the array type inductor 1 takes a small value of 100 or less, the inductance L of the inductors of each system of the array type inductor 1 also takes a small value. As described above, since the inductance of the inductors of each system is low, magnetic saturation is unlikely to occur in the array-type inductor 1. Therefore, a large current can be passed through the inductors of each system of the array type inductor 1. Therefore, in one or more embodiments of the present invention, in the inductor of each system of the array type inductor 1, the energy density Ed (that is, Ed) represented by the product of the inductance L and the square of the flowing current I (that is, Ed). = LxI ² ) can be increased. For example, when the inductance L of the inductors of each system of the array type inductor 1 is made smaller than 100 nH, Ed can be set to 1500 nH · A / mm ³ . Further, when the inductance L of the inductors of each system of the array type inductor 1 is made smaller than 50 nH, Ed can be set to 2000 nH · A / mm ³ . Further, when the inductance L of the inductors of each system of the array type inductor 1 is made smaller than 25 nH, Ed can be set to 2500 nH · A / mm ³ .

In the illustrated embodiment, the coil conductor 25A has a circumferential portion 26A, a lead conductor 27A1 and a lead conductor 27A2. The peripheral portion 26A extends in the circumferential direction around the coil shaft Ax1 extending in the direction parallel to the mounting surface 10b of the substrate 10. In other words, the peripheral portion 26A is wound around the coil shaft Ax1. A lead conductor 27A1 is connected to one end of the peripheral portion 26A, and a lead conductor 27A2 is connected to the other end. The lead conductor 27A1 extends from the lower end to the upper end along the first side surface 10e. The lead conductor 27A2 extends from the lower end to the upper end along the second side surface 10f. The lead conductor 27A1 is connected to the external electrode 21A, and the lead conductor 27A2 is connected to the external electrode 22A. In the illustrated embodiment, the peripheral portion 26A has an elliptical shape when viewed from the L-axis direction.

In the illustrated embodiment, the coil conductor 25B has a circumferential portion 26B, a lead conductor 27B1 and a lead conductor 27B2. The peripheral portion 26B extends in the circumferential direction around the coil shaft Ax2 extending in the direction parallel to the mounting surface 10b of the substrate 10. In other words, the peripheral portion 26B is wound around the coil shaft Ax2. A lead conductor 27B1 is connected to one end of the peripheral portion 26B, and a lead conductor 27B2 is connected to the other end. The lead conductor 27B1 extends from the lower end to the upper end along the first side surface 10e. The lead conductor 27B2 extends from the lower end to the upper end along the second side surface 10f. The lead conductor 27B1 is connected to the external electrode 21B, and the lead conductor 27B2 is connected to the external electrode 22B. In the illustrated embodiment, the peripheral portion 26B has an elliptical shape when viewed from the L-axis direction.

As shown in FIG. 2, the array-type inductor 1 may have a laminated structure in which a plurality of magnetic material layers are laminated. In FIG. 2, the external electrodes 21A, 22A, 21B, and 22B are omitted for convenience of explanation. In the illustrated embodiment, the substrate 10 comprises magnetic layers 11a-11g. Each of the magnetic layers 11a to 11g is made of a magnetic material. The substrate 10 has a magnetic material layer 11a, a magnetic material layer 11b, a magnetic material layer 11c, a magnetic material layer 11d, a magnetic material layer 11e, a magnetic material layer 11f, and a magnetic material from the negative side to the positive side in the L-axis direction. The layers are laminated in the order of 11 g. The magnetic layer 11a, 11d, and 11g may each include a plurality of magnetic layers as shown in the figure. Each magnetic material layer other than the magnetic material layers 11a, 11d, and 11g may also include a plurality of magnetic material layers. Since the magnetic material layer 11a and the magnetic material layer 11g are arranged so as to cover the coil conductor 25A and the coil conductor 25B from both sides in the L-axis direction, they are sometimes called a cover layer.

A conductor pattern constituting the coil conductors 25A and 25B is provided on one surface of the magnetic material layers 11b, 11c, 11e and 11f. Specifically, the circumferential pattern 26A1 and the lead conductor 27A1 are provided on the surface on the positive side in the L-axis direction of the pair of surfaces intersecting the L-axis of the magnetic material layer 11b, and the L-axis of the magnetic material layer 11c The circumferential pattern 26A2 and the lead conductor 27A2 are provided on the surface of the pair of intersecting surfaces on the positive side in the L-axis direction. Similarly, of the pair of surfaces intersecting the L axis of the magnetic layer 11e, the circumferential pattern 26B1 and the lead conductor 27B1 are provided on the surface on the positive side in the L axis direction, and the pair intersecting the L axis of the magnetic layer 11f. A circumferential pattern 26B2 and a lead conductor 27B2 are provided on the surface on the positive side in the L-axis direction. The orbital patterns 26A1, 26A2, 26B1, 26B2, and drawer conductors 27A1, 27A2, 27B1, 27B2 are formed by, for example, printing a conductive paste made of a metal or alloy having excellent conductivity on each magnetic material layer by a screen printing method. It is formed. As the conductive material contained in this conductive paste, Ag, Cu or an alloy thereof can be used. The orbital patterns 26A1, 26A2, 26B1, 26B2, and the lead conductors 27A1, 27A2, 27B1 and 27B2 may be formed by a material and method other than the above. The orbital patterns 26A1, 26A2, 26B1, 26B2, and drawer conductors 27A1, 27A2, 27B1, 27B2 may be formed by, for example, a sputtering method, an inkjet method, or a known method other than these.

Vias VA and VB are provided at predetermined positions of the magnetic layer 11b and 11e, respectively. The vias VA and VB are formed by forming through holes penetrating the magnetic material layers 11b and 11e in the L-axis direction at predetermined positions of the magnetic material layers 11b and 11e, respectively, and embedding a conductive paste in the through holes. Beer.

The orbital pattern 26A1 and the orbital pattern 26A2 are connected by a via VA. The orbiting portion 26A is composed of the orbiting pattern 26A1, the via VA, and the orbiting pattern 26A2. The orbital pattern 26B1 and the orbital pattern 26B2 are connected by a via VB. The circuit portion 26B is composed of the circuit pattern 26B1, the via VB, and the circuit pattern 26B2.

In one or more embodiments of the present invention, the circumferential portion 26A is wound around the coil shaft Ax1 by a predetermined number of turns. The number of turns of the peripheral portion 26A may be 1.5 turns or less. As shown in FIG. 4a, in the illustrated embodiment, the orbital pattern 26A1 has about 0.75 turns (270 °) around the coil shaft Ax1 from the connection position with the lead conductor 27A1 to the connection position with the via VA. The orbital pattern 26A2 extends about 0.75 turns (270 °) around the coil shaft Ax1 from the connection position with the via VA to the connection position with the lead conductor 27A2. Therefore, the circumferential portion 26A is wound around the coil shaft Ax1 by about 1.5 turns (540 °). As described above, the array type inductor 1 may be an inductor used in a DC / DC converter. As the switching speed of DC / DC converters increases, the inductors used in DC / DC converters are required to have low inductance. By setting the number of turns of the peripheral portion 26A to 1.5 turns or less, the inductance of the inductor including the peripheral portion 26A can be suppressed to a low level.

Of the substrate 10, the region inside the peripheral portion 26A when viewed from the L-axis direction is defined as the core region 10A. In one embodiment, the coil axis Ax1 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 10A viewed from the L-axis direction. As shown in FIG. 4a, the geometric center of the core region 10A is the midpoint of the line segment connecting the two focal points of the ellipse when the shape of the circumferential portion 26A seen from the L-axis direction is elliptical. It is the intersection of the major axis and the minor axis of the ellipse). The shape of the circumferential portion 26A seen from the L-axis direction is not limited to an ellipse, and may be an oval, a circle, a rectangle, a polygon other than a rectangle, and various shapes other than these.

In one or more embodiments of the present invention, the peripheral portion 26B may be configured in the same shape as the peripheral portion 26A. More specifically, the shape of the peripheral portion 26A seen from the direction of the coil shaft Ax1 may be the same as the shape of the peripheral portion 26B seen from the direction of the coil shaft Ax2. Thereby, the electric characteristics and the magnetic characteristics of the inductor including the peripheral portion 26A can be matched with the electrical characteristics and the magnetic characteristics of the inductor including the peripheral portion 26B. Further, by making the shape of the peripheral portion 26A and the shape of the peripheral portion 26B the same, the inductor including the peripheral portion 26A and the inductor including the peripheral portion 26B are external factors (for example, electromagnetic from an external element). It will be possible to show the same behavior for the effect). Specifically, the circumferential portion 26B is wound around the coil shaft Ax2 by a predetermined number of turns. The number of turns of the peripheral portion 26B may be 1.5 turns or less. In the embodiment shown in FIG. 4b, the orbital pattern 26B1 extends about 0.75 turns (270 °) around the coil shaft Ax2 from the connection position with the lead conductor 27B1 to the connection position with the via VB. The circumferential pattern 26B2 extends around the coil shaft Ax2 from the connection position with the via VB to the connection position with the lead conductor 27B2 by about 0.75 turns (270 °). Therefore, the circumferential portion 26B is wound around the coil shaft Ax2 by about 1.5 turns (540 °).

Of the substrate 10, the region inside the peripheral portion 26B when viewed from the L-axis direction is defined as the core region 10B. In one embodiment, the coil axis Ax2 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 10B viewed from the L-axis direction. The description of the core region 10A also applies to the core region 10B as much as possible.

Next, the coil conductors 25A and 25B will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing a cross section of the array type inductor 1 along the I-I line. FIG. 3 shows a cross section of the array-type inductor 1 cut along a plane passing through the coil shaft Ax1 and perpendicular to the substrate 10b. As shown in FIG. 3, in one or more embodiments of the present invention, the coil shaft Ax1 and the coil shaft Ax2 each extend parallel to the mounting surface 10b. The coil axes Ax1 and Ax2 may be orthogonal to at least one of the first end surface 10c and the first end surface 10d. As used herein, the terms "parallel," "orthogonal," or "vertical" do not mean only "parallel," "orthogonal," or "vertical" in the strict mathematical sense. In one or more embodiments of the invention, the coil shaft Ax1 is separated from the mounting surface 10b by a first distance T1 and the coil shaft Ax2 is separated from the mounting surface 10b by a second distance T2 that is greater than the first distance T1. There is. In other words, the second distance T2 between the coil shaft Ax2 and the mounting surface 10b is larger than the first distance T1 between the coil shaft Ax1 and the mounting surface 10b.

As shown in FIG. 3, in one or more embodiments of the present invention, in the coil conductor 25A and the coil conductor 25B, the coil shaft Ax1 is not only the core region 10A of the coil conductor 25A but also the core region of the coil conductor 25B. 10B is also penetrated, and the coil shaft Ax2 is arranged so as to penetrate not only the core region 10B of the coil conductor 25B but also the core region 10A of the coil conductor 25A. With such an arrangement, it is possible to suppress an increase in the size of the array type inductor 1 in the T-axis direction.

In one or more embodiments of the present invention, the dimension a2 (dimension in the direction along the coil axis Ax1) of the circumferential portion 26A in the L-axis direction is the dimension D1 (dimension in the direction orthogonal to the coil axis Ax1) in the T-axis direction. Smaller than. Similarly, in one or more embodiments of the present invention, the dimension of the circumferential portion 26B in the L-axis direction (dimension in the direction along the coil axis Ax2) is the dimension in the T-axis direction (dimension in the direction orthogonal to the coil axis Ax2). ) Is smaller. As described above, since the dimensions of the coil conductors 25A and 25B in the direction along the mounting surface 10b are miniaturized, the array-type inductor 1 can be miniaturized in the direction along the mounting surface 10b.

In one or more embodiments of the present invention, the coil conductor 25B is arranged at a position separated from the coil conductor 25A by a distance G1 in the direction along the coil axis Ax1. In other words, the distance between the coil conductor 25A and the coil conductor 25B in the direction along the coil axis Ax1 is G1. The distance G1 between the coil conductor 25A and the coil conductor 25B is the distance in the L-axis direction between the negative end of the coil conductor 25A in the L-axis direction and the positive end of the coil conductor 25B in the L-axis direction. be. In one or more embodiments of the present invention, the distance G1 between the coil conductor 25A and the coil conductor 25B is set to 0.3 mm or less.

Next, the peripheral portions 26A and 26B will be further described with reference to FIG. 5a. FIG. 5a is an enlarged view showing a part of FIG. 4 in an enlarged manner. As shown in FIG. 5a, the cross sections of the circumferential patterns 26A1 and 26A2 cut along the coil shaft Ax1 and perpendicular to the mounting surface 10b have a rectangular shape. In the present specification, the cross sections of the orbital portions 26A, the orbital patterns 26A1 and 26A2, which are cut along the coil shaft Ax1 and perpendicular to the mounting surface 10b, are simply shown without specifying the cut surface for the sake of simplicity. It may be referred to as a "cross section" of the orbiting portion 26A and the orbiting patterns 26A1 and 26A2.

When the dimension in the direction perpendicular to the coil axis Ax1 and the dimension in the direction parallel to the coil axis Ax1 are a2 in the cross section of the peripheral portion 26A cut in the plane orthogonal to the direction in which the current flows in the coil conductor 25A. In the present specification, the ratio (a1 / a2) of a1 to the dimension a2 is referred to as a first aspect ratio. When the orbiting portion 26A has two or more orbital patterns, the one end of the orbiting pattern at one end of the coil shaft Ax1 among the plurality of orbiting patterns and the coil shaft among the plurality of orbiting patterns. The distance between the orbital pattern at the other end of Ax1 and the other end is set to the dimension a2 in the direction parallel to the coil axis Ax1 in the cross section of the orbiting portion 26A. In the illustrated embodiment, the orbiting portion 26A has the orbiting patterns 26A1 and 26A2, and one end (left end in FIG. 5a) of the orbiting pattern 26A1 in the direction along the coil axis Ax1 and the coil of the orbiting pattern 26A2. The distance from the other end (right end in FIG. 5a) in the direction along the axis Ax1 is defined as the dimension a2 in the direction parallel to the coil axis Ax1 in the cross section of the peripheral portion 26A.

In one or more embodiments of the invention, the first aspect ratio is greater than 1. In other words, the size a1 of the cross section of the peripheral portion 26A in the direction perpendicular to the coil axis Ax1 is larger than the size a2 of the cross section of the peripheral portion 26A in the direction parallel to the coil axis Ax1. In the illustrated embodiment, the first aspect ratio is approximately 1.3. The first aspect ratio may be greater than 1.1, 1.2, 1.3, 1.4, 1.5, 2.0, 5.0, or 10.0.

In the illustrated embodiment, the cross sections of the circumferential patterns 26B1 and 26B2 cut along the coil shaft Ax2 and perpendicular to the mounting surface 10b also have a rectangular shape. In the present specification, the cross sections of the orbiting portions 26B, the orbiting patterns 26B1 and 26B2, which are cut along the coil shaft Ax1 and perpendicular to the mounting surface 10b, are simply shown without specifying the cut surface for the sake of brevity. It may be referred to as a "cross section" of the orbiting portion 26B and the orbiting patterns 26B1 and 26B2.

When the dimension in the direction perpendicular to the coil axis Ax2 and the dimension in the direction parallel to the coil axis Ax2 are b2 in the cross section of the peripheral portion 26B cut in the plane orthogonal to the direction in which the current flows in the coil conductor 25B. The ratio of b1 to the dimension b2 (b1 / b2) is called the second aspect ratio. When the circumferential portion 26B has two or more layers of orbital patterns, the one end of the orbital pattern at one end of the coil shaft Ax2 among the plurality of orbital patterns and the coil shaft among the plurality of orbital patterns. The distance between the orbital pattern at the other end of Ax2 and the other end is set to the dimension b2 in the direction parallel to the coil axis Ax2 in the cross section of the orbiting portion 26B. In the illustrated embodiment, the orbiting portion 26B has the orbiting patterns 26B1 and 26B2, and one end (left end in FIG. 5a) of the orbiting pattern 26B1 in the direction along the coil axis Ax2 and the coil of the orbiting pattern 26B2. The distance from the other end (right end in FIG. 5a) in the direction along the axis Ax2 is defined as the dimension b2 in the direction parallel to the coil axis Ax2 in the cross section of the peripheral portion 26B. In one or more embodiments of the invention, the second aspect ratio is greater than 1. In other words, the size b1 of the cross section of the peripheral portion 26B in the direction perpendicular to the coil shaft Ax2 is larger than the size b2 of the cross section of the peripheral portion 26B in the direction parallel to the coil shaft Ax2. In the illustrated embodiment, the second aspect ratio is approximately 1.3. The first aspect ratio may be greater than 1.1, 1.2, 1.3, 1.4, 1.5, 2.0, 5.0, or 10.0. The first aspect ratio and the second aspect ratio may be the same or different.

In one or more embodiments of the present invention, the first distance T1 and the second distance T2 may be the same when at least one of the first aspect ratio and the second aspect ratio is larger than 1. In other words, when at least one of the first aspect ratio and the second aspect ratio is larger than 1, the coil conductor 25A and the coil conductor 25B are arranged so that the coil shaft Ax1 and the coil shaft Ax2 are coaxial with each other. May be good.

Modifications of the coil conductor 25A and the coil conductor 25B will be described with reference to FIG. 5b. The orbital patterns 26A1 and 26A2 and the lead conductors 27A1 and 27A2 constituting the coil conductor 25A may each include a plurality of conductor layers. FIG. 5b shows an embodiment in which the circumferential patterns 26A1 and 26A2 and the drawer conductors 27A1 and 27A2 each include two conductor layers having the same shape. As shown in the figure, the orbital pattern 26A1 has a first orbital pattern 26A1a and a second orbital pattern 26A1b arranged to face the first orbital pattern 26A1a and having the same shape as the first orbital pattern 26A1a. The first orbital pattern 26A1a and the second orbital pattern 26A1b may be electrically connected to each other in the substrate 10. Similarly, the orbital pattern 26A2 has a first orbital pattern 26A2a and a second orbital pattern 26A2b arranged to face the first orbital pattern 26A2a and having the same shape as the first orbital pattern 26A2a. The first orbital pattern 26A2a and the second orbital pattern 26A2b may be electrically connected to each other in the substrate 10. Although not shown, the lead conductor 27A1 may also include two conductor layers having the same shape as each other, as described above. A plurality of conductor layers constituting the lead conductor 27A1 may also be electrically connected to each other in the substrate 10. The lead conductor 27A2 also contains two conductor layers having the same shape as each other. A plurality of conductor layers constituting the lead conductor 27A2 may also be electrically connected to each other in the substrate 10. Since each of the plurality of conductor layers included in the circumferential patterns 26A1 and 26A2 and the drawer conductors 27A1 and 27A2 constituting the coil conductor 25A has the same shape as each other, among the plurality of conductor layers, each other in the substrate 10 There is no potential difference between the opposing parts. Therefore, even when each of the circumferential patterns 26A1 and 26A2 and the lead conductors 27A1 and 27A2 constituting the coil conductor 25A is composed of a conductor layer, the insulation reliability (withstand voltage) required for the substrate 10 is the coil conductor 25A. Can be as good as if it consists of a single conductor section.

Similar to the coil conductor 25A, the circumferential patterns 26B1 and 26B2 and the lead conductors 27B1 and 27B2 constituting the coil conductor 25B may each include a plurality of conductor layers. FIG. 5b shows an embodiment in which the circumferential patterns 26B1 and 26B2 and the drawer conductors 27B1 and 27B2 each include two conductor layers having the same shape. As shown in the figure, the orbital pattern 26B1 has a first orbital pattern 26B1a and a second orbital pattern 26B1b arranged to face the first orbital pattern 26B1a and having the same shape as the first orbital pattern 26B1a. The first orbital pattern 26B1a and the second orbital pattern 26B1b may be electrically connected to each other in the substrate 10. Similarly, the orbital pattern 26B2 has a first orbital pattern 26B2a and a second orbital pattern 26B2b arranged to face the first orbital pattern 26B2a and having the same shape as the first orbital pattern 26B2a. The first orbital pattern 26B2a and the second orbital pattern 26B2b may be electrically connected to each other in the substrate 10. Although not shown, the lead conductor 27B1 may also include two conductor layers having the same shape as each other, as described above. A plurality of conductor layers constituting the lead conductor 27B1 may also be electrically connected to each other in the substrate 10. The lead conductor 27B2 also contains two conductor layers having the same shape as each other. A plurality of conductor layers constituting the lead conductor 27B2 may also be electrically connected to each other in the substrate 10.

As shown in FIG. 5b, when the orbital patterns 26A1 and 26A2 each include a plurality of conductor layers, one end of the conductor layers constituting the orbiting pattern 26A1 in the direction along the coil axis Ax1 (FIG. 5b). One end of the conductor layer arranged at the left end of the circuit pattern 26A1 and the other end of the conductor layer constituting the circuit pattern 26A1 in the direction along the coil axis Ax1 of the circuit pattern 26A2 (right end in FIG. 5b). The distance from the other end of the conductor layer is defined as the dimension a2 in the direction parallel to the coil axis Ax1 in the cross section of the peripheral portion 26A. Similarly, when the circulation patterns 26B1 and 26B2 each include a plurality of conductor layers, they are arranged at one end (left end in FIG. 5b) of the conductor layers constituting the circulation pattern 26B1 in the direction along the coil axis Ax1. One end of the conductor layer and the other end of the conductor layer constituting the orbital pattern 26B2 in the direction along the coil axis Ax1 of the orbital pattern 26B2 (right end in FIG. 5b). The distance from and is set to the dimension b2 in the direction parallel to the coil axis Ax1 in the cross section of the peripheral portion 26B.

Next, with reference to FIGS. 6a and 6b, the magnetic flux generated around the circumferential portion 26A due to the change in the current flowing through the coil conductor 25A will be described. FIG. 6a schematically shows a magnetic flux generated by a change in the current flowing through the peripheral portion 26A of the coil conductor 25A, and FIG. 6b shows a conventional coil conductor having a peripheral portion A1 wound around the coil shaft Ax. The magnetic flux generated by the change in the current flowing through the coil is schematically shown. The orbital portion A1 shown in FIG. 6b has an orbital pattern A1 and an orbital pattern A2. It is assumed that the orbital pattern A1 is connected to the orbital pattern A2 by a via to form the orbiting portion A1. The cross section of the orbital patterns A1 and A2 has a square shape having the same area as the orbiting patterns 26A1 and 26A2. The ratio of the ratio of the cross-sectional dimension of the peripheral portion A11 in the direction parallel to the coil axis Ax to the cross-sectional dimension of the peripheral portion A11 in the direction perpendicular to the coil axis Ax is smaller than 1. As shown in FIG. 6a, the magnetic flux generated around the circumferential portion 26A wound around the coil shaft Ax1 when the current flowing through the coil conductor 25A changes has a first aspect ratio larger than 1. Therefore, it becomes easy to face the direction perpendicular to the coil axis Ax1. On the other hand, as shown in FIG. 6b, the magnetic flux generated around the circumferential portion A1 having an aspect ratio smaller than 1 wound around the coil shaft Ax is parallel to the coil shaft Ax. It makes it easier to turn. Therefore, by making the first aspect ratio of the orbiting patterns 26A1 and 26A2 larger than 1, the magnetic flux generated around the orbiting patterns 26A1 and 26A2 when the current flowing through the coil conductor 25A changes is in the direction along the coil axis Ax1. It becomes difficult to reach other coil conductors (for example, coil conductor 25B) arranged adjacent to each other. Therefore, by making the first aspect ratio of the orbital patterns 26A1 and 26A2 of the orbiting portion 26A included in the coil conductor 25A larger than 1, the coil conductor 25A is adjacent to the coil conductor 25A in the direction along the coil shaft Ax1. It is possible to suppress magnetic coupling with other coil conductors (for example, coil conductor 25B). In one or more embodiments of the present invention, the absolute value of the coupling coefficient between the coil conductor 25A and the coil conductor 25B is 0.15 or less. In one or more embodiments of the present invention, even if the distance between the coil conductor 25A and the coil conductor 25B is 0.3 mm or less, the absolute value of the coupling coefficient between the coil conductor 25A and the coil conductor 25B is 0.15 or less. can do. In one or more embodiments of the present invention, the absolute value of the coupling coefficient between the coil conductor 25A and the coil conductor 25B is set to 0.15 or less, so that the coil conductor 25A and the coil conductor 25B are electromagnetically magnetized from the other coil conductor. It is possible to stably exhibit each characteristic without receiving much interference. Since the coil conductor 25A and the coil conductor 25B included in the array type inductor 1 are less susceptible to electromagnetic interference from other coil conductors, the wiring pitch of the circuit on which the array type inductor 1 is mounted is small (for example,). Even if it is 0.2 mm or less), each characteristic can be exhibited. For example, in a circuit in which an array-type inductor 1 is connected to a plurality of semiconductor elements (for example, a power transistor), independent power supplies are supplied to each of the plurality of semiconductor elements by the coil conductor 25A and the coil conductor 25B. Can be done.

Subsequently, an array-type inductor in another embodiment of the present invention will be described with reference to FIGS. 7 to 13.

First, one of the modified examples of the coil conductors 25A and 25B will be described with reference to FIG. 7. In the embodiment shown in FIG. 7, the cross sections of the orbital patterns 26A1, 26A2, 26B1 and 26B2 have a shape without corners. In other words, the outer edges of the cross sections of the orbital patterns 26A1, 26A2, 26B1 and 26B2 are defined only by curves. The cross section of the circumferential pattern 26A1, 26A2, 26B1, 26B2 may have an elliptical shape as shown in FIG. 7, or may have another shape (for example, an oval shape). By making the cross sections of the orbiting patterns 26A1, 26A2, 26B1 and 26B2 square-free, the magnetic flux generated around the orbiting patterns 26A1, 26A2, 26B1 and 26B2 is a magnetic path closer to the center of the cross section of each orbiting pattern. Will pass through. As a result, it is possible to suppress the magnetic coupling between the coil conductor 25A having the orbital patterns 26A1 and 26A2 and the coil conductor 25B having the orbiting patterns 26B1 and 26B2. In one or more embodiments of the present invention, some of the circuit patterns 26A1, 26A2, 26B1, and 26B2 may have a shape without corners. In one or more embodiments of the present invention, the circular pattern 26A2 has a cross section without corners, and the circular pattern 26A1 has a cross section with corners (for example, the rectangular shape shown in FIG. 5a). You may have. Since the orbiting pattern 26A2 faces the coil conductor 25B, the magnetic flux generated around the orbiting pattern 26A2 has a shape without angles in the cross section of the orbiting pattern 26A2 and passes through a magnetic path closer to the center of the cross section of the orbiting pattern 26A2. By doing so, it is possible to suppress the magnetic coupling between the coil conductor 25A and the coil conductor 25B. On the other hand, since the circuit pattern 26A1 does not face the coil conductor 25B but faces the outer surface of the substrate 10, even if the cross section of the circuit pattern 26A2 has an angular shape, the coil conductor 25A and the coil conductor 25B The effect of strengthening the magnetic bond is small. For the same reason, in one or more embodiments of the present invention, the cross section of the orbiting pattern 26B1 may have a shape without corners, and the cross section of the orbiting pattern 26B2 may have a shape with corners.

The cross-sectional shape of the orbiting patterns 26A1, 26A2, 26B1 and 26B2 is not limited to the above shape. The shape of the cross section of the orbiting pattern 26A1, 26A2, 26B1, 26B2 may be, for example, a circle, a rectangle, or a polygon other than a rectangle. However, in the embodiment in which the first aspect ratio of the orbital patterns 26A1, 26A2, 26B1 and 26B2 is larger than 1, the cross section of the orbiting patterns 26A1, 26A2, 26B1 and 26B2 has a shape other than a circle or a square. The shapes of the orbital patterns 26A1 and 26A2 and the orbital patterns 26B1 and 26B2 may be the same or different.

Next, the array-type inductor 101 according to one or more embodiments of the present invention will be described with reference to FIGS. 8 and 9. The array-type inductor 101 shown in FIGS. 8 and 9 is different from the array-type inductor 1 in that the coil conductors 125A and 125B are provided in place of the coil conductors 25A and 25B, respectively. In the following description, the points common to the array-type inductor 1 in the array-type inductor 101 will be omitted.

The array type inductor 101 includes a coil conductor 125A and a coil conductor 125B. In the illustrated embodiment, the coil conductor 125A has a circumferential portion 126A, a lead conductor 127A1 and a lead conductor 127A2. The peripheral portion 126A extends in the circumferential direction around the coil shaft Ax1 extending in the direction parallel to the mounting surface 10b of the substrate 10. The circumferential portion 126A is a pair of surfaces that intersect the L-axis of the magnetic layer 11b with the orbital pattern 126A1 provided on the surface on the positive side in the L-axis direction among the pair of surfaces that intersect the L-axis of the magnetic layer 11b. Among them, the circumferential pattern 126A2 provided on the surface on the positive side in the L-axis direction and the via VA provided on the magnetic material layer 11b are included. The orbital pattern 126A1 and the orbital pattern 126A2 are connected by a via VA. The peripheral portion 126A is wound around the coil shaft Ax1 for approximately one turn.

The lead conductor 127A1 is provided on the magnetic layer 11b so as to extend along the W axis, one end of which is connected to the circumferential pattern 126A1 and the other end of which is the external electrode 21A (in FIGS. 8 and 9). It is connected to (not shown). The lead conductor 127A2 is provided on the magnetic layer 11c so as to extend along the W axis, one end thereof is connected to the circumferential pattern 126A2, and the other end is the external electrode 22A (in FIGS. 8 and 9). It is connected to (not shown).

In the illustrated embodiment, the coil conductor 125B has a circumferential portion 126B, a lead conductor 127B1 and a lead conductor 127B2. The peripheral portion 126B extends in the circumferential direction around the coil shaft Ax2 extending in the direction parallel to the mounting surface 10b of the substrate 10. The circumferential portion 126B is a pair of surfaces that intersect the L-axis of the magnetic layer 11f with the orbital pattern 126B1 provided on the surface on the positive side in the L-axis direction among the pair of surfaces that intersect the L-axis of the magnetic layer 11e. Among them, the circumferential pattern 126B2 provided on the surface on the positive side in the L-axis direction and the via VB provided on the magnetic material layer 11e are provided. The orbital pattern 126B1 and the orbital pattern 126B2 are connected by a via VB. The peripheral portion 126B is wound around the coil shaft Ax2 for approximately one turn.

The lead conductor 127B1 is provided on the magnetic layer 11e so as to extend along the W axis, one end of which is connected to the circumferential pattern 126B1 and the other end of which is the external electrode 21B (in FIGS. 8 and 9). It is connected to (not shown). The lead conductor 127B2 is provided on the magnetic layer 11f so as to extend along the W axis, one end thereof is connected to the circumferential pattern 126B2, and the other end is the external electrode 22B (in FIGS. 8 and 9). It is connected to (not shown).

Circumferential patterns 126A1, 126A2, 126B1, 126B2 and drawer conductors 127A1, 127A2, 127B1, 127B2 can be made from conductor paste, similar to orbital patterns 26A1, 26A2, 26B1, 26B2 and drawer conductors 27A1, 27A2, 27B1, 27B2. ..

Of the substrate 10, the region inside the peripheral portion 126A when viewed from the L-axis direction is defined as the core region 110A. In one embodiment, the coil axis Ax1 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 110A viewed from the L-axis direction. Of the substrate 10, the region inside the peripheral portion 126B when viewed from the L-axis direction is defined as the core region 110B. In one embodiment, the coil shaft Ax2 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 110B viewed from the L-axis direction. Also in the array type inductor 101, the coil shaft Ax1 is separated from the mounting surface 10b by a first distance T1, and the coil shaft Ax2 is separated from the mounting surface 10b by a second distance T2 larger than the first distance T1.

The description of the cross sections of the circuit patterns 26A1 and 26A2 also applies to the cross sections of the circuit patterns 126A1 and 126A2 cut along the plane perpendicular to the mounting surface 10b through the coil shaft Ax1, and the description of the cross sections of the circuit patterns 26B1 and 26B2 applies to the coil shaft. This also applies to the cross sections of the orbital patterns 126B1 and 126B2 that pass through Ax2 and are cut in a plane perpendicular to the mounting surface 10b.

Next, the array type inductor 201 according to one or more embodiments of the present invention will be described with reference to FIGS. 10 and 11. The array-type inductor 201 shown in FIGS. 10 and 11 includes a magnetic material layer 211a in place of the magnetic material layers 11b and 11c, a magnetic material layer 211b in place of the magnetic material layers 11e and 11f, and a coil conductor. It differs from the array type inductor 1 in that coil conductors 225A and 225B are provided instead of 25A and 25B, respectively. In the following description, the points common to the array-type inductor 1 in the array-type inductor 201 will be omitted.

As shown in the figure, in the array type inductor 201, the magnetic material layer 211a is provided between the magnetic material layer 11a and the magnetic material layer 11d, and the magnetic material layer 211b is the magnetic material layer 11d and the magnetic material layer 11g. It is provided between and. The magnetic material layers 211a and 211b can be produced in the same manner as the magnetic material layers 11a to 11g.

In the illustrated embodiment, the coil conductor 225A has a circumferential portion 226A, a lead conductor 227A1 and a lead conductor 227A2. The peripheral portion 226A extends in the circumferential direction around the coil shaft Ax1 extending in the direction parallel to the mounting surface 10b of the substrate 10. The peripheral portion 226A and the lead conductors 227A1 and 227A2 are provided on the surface of the pair of surfaces intersecting the L axis of the magnetic material layer 211a on the positive side in the L axis direction. The peripheral portion 226A is wound around the coil shaft Ax1 for approximately 0.5 turns. The lead conductor 227A1 extends from the lower end to the upper end along the first side surface 10e. The lead conductor 227A2 extends from the lower end to the upper end along the second side surface 10f. The lead conductor 227A1 is connected to the external electrode 21A, and the lead conductor 227A2 is connected to the external electrode 22A. In FIGS. 10 and 11, the external electrodes 21A and 22A are not shown.

In the illustrated embodiment, the coil conductor 225B has a circumferential portion 226B, a lead conductor 227B1 and a lead conductor 227B2. The peripheral portion 226B extends in the circumferential direction around the coil shaft Ax2 extending in the direction parallel to the mounting surface 10b of the substrate 10. The peripheral portion 226B and the lead conductors 227B1 and 227B2 are provided on the surface of the pair of surfaces intersecting the L axis of the magnetic material layer 211b on the positive side in the L axis direction. The peripheral portion 226B is wound around the coil shaft Ax2 for about 0.5 turn. The lead conductor 227B1 extends from the lower end to the upper end along the first side surface 10e. The lead conductor 227B2 extends from the lower end to the upper end along the second side surface 10f. The lead conductor 227B1 is connected to the external electrode 21B, and the lead conductor 227B2 is connected to the external electrode 22B. In FIGS. 10 and 11, the external electrodes 21B and 22B are not shown.

Circumferential portions 226A, 226B and lead conductors 227A1, 227A2, 227B1, 227B2 can be made from conductor paste, as well as orbital patterns 26A1, 26A2, 26B1, 26B2 and drawer conductors 27A1, 27A2, 27B1, 27B2.

Of the substrate 10, the region inside the circumferential portion 226A when viewed from the L-axis direction is defined as the core region 210A. More specifically, the core region 210A is defined by a virtual line VL1 connecting one end 226A1 and the other end 226A2 in the circumferential direction around the coil axis Ax1 of the peripheral portion 226A and an inner peripheral surface of the peripheral portion 226A. Refers to the area. In one embodiment, the coil axis Ax1 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 210A viewed from the L-axis direction. Similarly, of the substrate 10, the region inside the peripheral portion 126B when viewed from the L-axis direction is defined as the core region 210B. Similar to the core region 210A, the region defined by the virtual line connecting one end and the other end in the circumferential direction around the coil axis Ax2 of the peripheral portion 226B and the inner peripheral surface of the peripheral portion 226B is defined as the core region 210B. can do. In one embodiment, the coil axis Ax2 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 210B viewed from the L-axis direction. Also in the array type inductor 201, the coil shaft Ax1 is separated from the mounting surface 10b by a first distance T1, and the coil shaft Ax2 is separated from the mounting surface 10b by a second distance T2 larger than the first distance T1.

The explanation about the cross section of the orbital patterns 26A1 and 26A2 also applies to the cross section of the orbiting portion 226A cut along the plane perpendicular to the mounting surface 10b through the coil shaft Ax1, and the explanation about the cross section of the orbiting patterns 26B1 and 26B2 applies to the coil shaft Ax2. The same applies to the cross section of the peripheral portion 226B cut in a plane perpendicular to the through mounting surface 10b.

Next, the array-type inductor 301 according to one or more embodiments of the present invention will be described with reference to FIGS. 12 and 13. The array-type inductor 301 shown in FIGS. 12 and 13 includes external electrodes 321A, 321B, 322A, and 322B in place of the external electrodes 21A, 21B, 22A, and 22B, respectively, and a coil in place of the coil conductors 25A, 25B. It differs from the array type inductor 1 in that it includes conductors 325A and 325B, respectively. In the following description, the points common to the array-type inductor 1 in the array-type inductor 301 will be omitted.

As shown in the figure, the external electrodes 321A and 321B have an L-shape when viewed from the L-axis direction, and are provided so as to be in contact with the mounting surface 10b and the first side surface 10e of the substrate 10. The external electrodes 322A and 322B have an L-shape when viewed from the L-axis direction, and are provided so as to be in contact with the mounting surface 10b and the second side surface 10f of the substrate 10.

In the illustrated embodiment, the coil conductor 325A has a circumferential portion 326A, a lead conductor 327A1 and a lead conductor 327A2. The peripheral portion 326A extends in the circumferential direction around the coil shaft Ax1 extending in the direction parallel to the mounting surface 10b of the substrate 10. The circumferential portion 326A is a pair of surfaces that intersect the L-axis of the magnetic layer 11b with the orbital pattern 326A1 provided on the surface on the positive side in the L-axis direction among the pair of surfaces that intersect the L-axis of the magnetic layer 11b. Among them, it has an orbital pattern 326A2 provided on the surface on the positive side in the L-axis direction and a via VA provided on the magnetic material layer 11b. The orbital pattern 326A1 and the orbital pattern 326A2 are connected by a via VA. The peripheral portion 326A is wound around the coil shaft Ax1 for approximately 1.5 turns.

The lead conductor 327A1 is provided on the magnetic layer 11b so as to extend along the T axis, and one end thereof is connected to the circumferential pattern 326A1. The lead conductor 327A1 is exposed from the first side surface 10e and the mounting surface 10b toward the outside of the substrate 10, and is connected to the external electrode 321A at this exposed portion. The lead conductor 327A2 is provided on the magnetic layer 11c so as to extend along the T axis, and one end thereof is connected to the circumferential pattern 326A2. The lead conductor 327A2 is exposed from the second end surface 10f and the mounting surface 10b toward the outside of the substrate 10, and is connected to the external electrode 322A at this exposed portion.

In the illustrated embodiment, the coil conductor 325B has a circumferential portion 326B, a lead conductor 327B1 and a lead conductor 327B2. The peripheral portion 326B extends in the circumferential direction around the coil shaft Ax2 extending in the direction parallel to the mounting surface 10b of the substrate 10. The circumferential portion 326B is a pair of surfaces that intersect the L-axis of the magnetic layer 11f with the orbital pattern 326B1 provided on the surface on the positive side in the L-axis direction among the pair of surfaces that intersect the L-axis of the magnetic layer 11e. Among them, it has an orbital pattern 326B2 provided on the surface on the positive side in the L-axis direction and a via VB provided on the magnetic material layer 11e. The orbital pattern 326B1 and the orbital pattern 326B2 are connected by a via VB. The peripheral portion 326B is wound around the coil shaft Ax2 for approximately 1.5 turns.

The lead conductor 327B1 is provided on the magnetic layer 11e so as to extend along the T axis, and one end thereof is connected to the circumferential pattern 326B1. The lead conductor 327B1 is exposed from the first side surface 10e and the mounting surface 10b toward the outside of the substrate 10, and is connected to the external electrode 321B at this exposed portion. The lead conductor 327B2 is provided on the magnetic layer 11f so as to extend along the T axis, and one end thereof is connected to the circumferential pattern 326B2. The lead conductor 327A2 is exposed from the second end surface 10f and the mounting surface 10b toward the outside of the substrate 10, and is connected to the external electrode 322B at this exposed portion.

Circumferential patterns 326A1, 326A2, 326B1, 326B2 and drawer conductors 327A1, 327A2, 327B1, 327B2 can be made from conductor paste, as well as orbital patterns 26A1, 26A2, 26B1, 26B2 and drawer conductors 27A1, 27A2, 27B1, 27B2. ..

Of the substrate 10, the region inside the circumferential portion 326A when viewed from the L-axis direction is defined as the core region 310A. In one embodiment, the coil axis Ax1 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 310A viewed from the L-axis direction. Of the substrate 10, the region inside the circumferential portion 326B when viewed from the L-axis direction is defined as the core region 310B. In one embodiment, the coil shaft Ax2 is an axis extending in a direction parallel to the mounting surface 10b through the geometric center of the core region 310B viewed from the L-axis direction. Also in the array type inductor 301, the coil shaft Ax1 is separated from the mounting surface 10b by a first distance T1, and the coil shaft Ax2 is separated from the mounting surface 10b by a second distance T2 larger than the first distance T1.

The description of the cross sections of the circuit patterns 26A1 and 26A2 also applies to the cross sections of the circuit patterns 326A1 and 326A2 cut along the surface perpendicular to the mounting surface 10b through the coil shaft Ax1, and the description of the cross sections of the circuit patterns 26B1 and 26B2 applies to the coil shaft. This also applies to the cross sections of the orbital patterns 326B1 and 326B2 that pass through Ax2 and are cut in a plane perpendicular to the mounting surface 10b.

Next, the array type inductor 401 according to one or more embodiments of the present invention will be described with reference to FIGS. 14 to 16b. The array-type inductor 401 differs from the array-type inductor 1 having two coil conductors and two sets of external electrodes in that it has four coil conductors and four sets of external electrodes. The points common to the array-type inductor 1 in the array-type inductor 401 will be omitted.

The array-type inductor 401 includes coil conductors 25A, 25B, 25C, 25D provided in the substrate 10, and external electrodes 21A, 21B, 21C, 21D, 22A, 22B, 22C, 22D provided on the surface of the substrate 10. .. The coil conductors 25A and 25B are configured and arranged in the same manner as the coil conductors 25A and 25B included in the array type inductor 1. The coil conductor 25C is connected to the external electrode 21C at one end thereof and to the external electrode 22C at the other end. The coil conductor 25D is connected to the external electrode 21D at one end thereof and to the external electrode 22D at the other end. As described above, the array type inductor 401 includes a first inductor having a coil conductor 25A and external electrodes 21A and 22A, a second inductor having a coil conductor 25B and external electrodes 21B and 22B, and a coil conductor 25C and an external electrode 21C. A third inductor having 22C and a fourth inductor having coil conductors 25D and external electrodes 21D and 22D are provided. The eight external electrodes 21A to 21D and 22A to 22D of the array type inductor 401 are arranged so as to face the corresponding lands 3 when the array type inductor 401 is mounted on the mounting substrate 2a.

In the illustrated embodiment, the coil conductor 25C is provided on the side opposite to the coil conductor 25A with respect to the coil conductor 25B in the L-axis direction. Further, the coil conductor 25D is provided on the side opposite to the coil conductor 25B with respect to the coil conductor 25C in the L-axis direction. The coil conductors 25A, 25B, 25C, and 25D are arranged in this order from the positive side to the negative side in the L-axis direction. The coil conductor 25A faces the second end surface 10d of the substrate 10 in one of the directions along the first coil axis Ax1 (on the positive side in the L-axis direction). That is, no other coil conductor is arranged between the coil conductor 25A and the second end surface 10d. The coil conductor 25D faces the first end surface 10c of the substrate 10 on one side (negative side in the L-axis direction) along the fourth coil axis Ax4. That is, no other coil conductor is arranged between the coil conductor 25D and the first end surface 10c. The second coil conductor 25B and the third coil conductor 25C are arranged between the first coil conductor 25A and the second coil conductor 25C. In one or more embodiments of the present invention, in the coil conductor 25C and the coil conductor 25D, the coil shaft Ax3 penetrates not only the core region 10C of the coil conductor 25C but also the core region 10D of the coil conductor 25D, and the coil shaft Ax4 penetrates the coil conductor. It is arranged so as to penetrate not only the core region 10D of 25D but also the core region 10C of the coil conductor 25C.

As described above, the coil conductor 25B is arranged at a position separated from the coil conductor 25A by a distance G1 in the direction along the coil axis Ax1. The coil conductor 25C is arranged at a position separated from the coil conductor 25B by a distance G2 in the direction along the coil axis Ax1. The coil conductor 25D is arranged at a position separated from the coil conductor 25C by a distance G3 in the direction along the coil axis Ax1. In one or more embodiments of the invention, the distance G2 between the coil conductor 25B and the coil conductor 25C is greater than the distance G1 between the coil conductor 25A and the coil conductor 25B. In one or more embodiments of the invention, the distance G2 between the coil conductor 25B and the coil conductor 25C is greater than the distance G3 between the coil conductor 25C and the coil conductor 25D. The interval G1 and the interval G3 may be equal to or different from each other. The distance G2 between the coil conductor 25B and the coil conductor 25C may be 0.3 mm or less.

The coil conductor 25C has a peripheral portion 26C, a lead conductor 27C1, and a lead conductor 27C2. The peripheral portion 26C extends in the circumferential direction around the coil shaft Ax3 extending in the direction parallel to the mounting surface 10b of the substrate 10. In other words, the peripheral portion 26C is wound around the coil shaft Ax3. A lead conductor 27C1 is connected to one end of the peripheral portion 26C, and a lead conductor 27C2 is connected to the other end. The lead conductor 27C1 extends from the lower end to the upper end along the first side surface 10e. The lead conductor 27C2 extends from the lower end to the upper end along the second side surface 10f. The lead conductor 27C1 is connected to the external electrode 21C, and the lead conductor 27C2 is connected to the external electrode 22C. The orbiting portion 26C has an orbiting pattern 26C1 provided on a magnetic material layer that is a part of the substrate 10, an orbiting pattern 26C2 provided on another magnetic material layer that is a part of the substrate 10, and an orbiting pattern 26C1. It has a via VC that connects to the pattern 26C2. The shape of the peripheral portion 26C seen from the direction of the coil shaft Ax3 is the same as the shape of the peripheral portion 26A seen from the direction of the coil shaft Ax1 and the shape of the peripheral portion 26B seen from the direction of the coil shaft Ax2. May be good.

The coil conductor 25D has a peripheral portion 26D, a lead conductor 27D1, and a lead conductor 27D2. The peripheral portion 26D extends in the circumferential direction around the coil shaft Ax4 extending in the direction parallel to the mounting surface 10b of the substrate 10. In other words, the peripheral portion 26D is wound around the coil shaft Ax4. A lead conductor 27D1 is connected to one end of the peripheral portion 26D, and a lead conductor 27D2 is connected to the other end. The lead conductor 27D1 extends from the lower end to the upper end along the first side surface 10e. The lead conductor 27D2 extends from the lower end to the upper end along the second side surface 10f. The lead conductor 27D1 is connected to the external electrode 21D, and the lead conductor 27D2 is connected to the external electrode 22D. The orbiting portion 26D has an orbiting pattern 26D1 provided on a magnetic material layer that is a part of the substrate 10, an orbiting pattern 26D2 provided on another magnetic material layer that is a part of the substrate 10, and an orbiting pattern 26D1. It has a via VD that connects to the pattern 26D2. The shape of the orbiting portion 26D seen from the direction of the coil shaft Ax4 is the shape of the orbiting portion 26A seen from the direction of the coil shaft Ax1, the shape of the orbiting portion 26B seen from the direction of the coil shaft Ax2, and the shape of the orbiting portion 26B seen from the direction of the coil shaft Ax3. The shape of the peripheral portion 26C seen may be the same as that of one.

In one or more embodiments of the present invention, the ratio of the dimensions in the direction perpendicular to the coil axis Ax3 (third aspect ratio) to the dimensions in the direction parallel to the coil axis Ax3 in the cross section of the circumferential pattern 26C1 is the first aspect ratio. Like, greater than 1. In one or more embodiments of the present invention, the ratio of the dimensions in the direction perpendicular to the coil axis Ax4 (fourth aspect ratio) to the dimensions in the direction parallel to the coil axis Ax4 in the cross section of the circumferential pattern 26D1 is the first aspect ratio. Like, greater than 1. The description of the first aspect ratio also applies to the third aspect ratio and the fourth aspect ratio.

Similar to the peripheral portions 26A and 26B, in one or more embodiments of the present invention, the dimension of the peripheral portion 26C in the L-axis direction is smaller than the dimension of the peripheral portion 26C in the T-axis direction. Similarly, in one or more embodiments of the present invention, the dimension of the orbital portion 26D in the L-axis direction is smaller than the dimension of the orbital portion 26D in the T-axis direction.

FIG. 15 is a cross-sectional view schematically showing a cross section of the array type inductor 401 along the line II-II. FIG. 15 shows a cross section of the array type inductor 1 cut along a plane passing through the coil shaft Ax1 and perpendicular to the substrate 10b. As shown in FIG. 15, in one or more embodiments of the present invention, the coil shaft Ax3 and the coil shaft Ax4 each extend parallel to the mounting surface 10b. The coil axes Ax3 and Ax4 may be orthogonal to at least one of the first end surface 10c and the first end surface 10d. In one or more embodiments of the invention, the coil shaft Ax3 is separated from the mounting surface 10b by a third distance T3, and the coil shaft Ax4 is separated from the mounting surface 10b by a fourth distance T4 that is larger than the third distance T3. There is. In other words, the fourth distance T4 between the coil shaft Ax4 and the mounting surface 10b is larger than the third distance T3 between the coil shaft Ax3 and the mounting surface 10b. In one or more embodiments of the invention, the third distance T3 is equal to the first distance T1 between the coil shaft Ax1 and the mounting surface 10b. In one or more embodiments of the invention, the fourth distance T4 is equal to the second distance T2 between the coil shaft Ax2 and the mounting surface 10b.

The array type inductor 401 may include three inductors or may include five or more inductors. When the array type inductor 401 includes five or more inductors, even if the distance between the coil shaft of the coil conductor of the inductor at the odd number from the positive side in the L-axis direction and the mounting surface 10b is equal to each other. good. When the array type inductor 401 includes five or more inductors, even if the distance between the coil shaft of the coil conductor of the inductor located even-numbered from the positive side in the L-axis direction and the mounting surface 10b is equal to each other. good.

Subsequently, an exemplary manufacturing method of the array type inductor 1 according to the embodiment of the present invention will be described. FIG. 2 is appropriately referred to for the purpose of explaining this manufacturing method. In one or more embodiments of the present invention, the array-type inductor 1 is manufactured by a sheet laminating method of laminating magnetic sheets. When the array type inductor 1 is manufactured by the sheet laminating method, a magnetic sheet is first prepared. The magnetic sheet is produced, for example, from a slurry obtained by kneading metal magnetic particles made of a soft magnetic material and a resin, using various sheet molding machines such as a doctor blade type sheet molding machine. As the resin to be kneaded with the metal magnetic particles, for example, a resin having excellent insulating properties such as polyvinyl butyral (PVB) resin and epoxy resin can be used.

The magnetic sheet is cut into a predetermined shape. Through holes penetrating in the thickness direction are formed at predetermined positions of the cut magnetic sheet. Next, by applying the conductor paste to the magnetic sheet cut into a predetermined shape by a known method such as screen printing, a plurality of unfired conductor patterns, each of which becomes the circumferential pattern 26A1 and the extraction conductor 27A1 after firing, are formed. It is formed. By applying the conductor paste to another magnetic sheet in the same manner, a plurality of unfired conductor patterns that become the circumferential pattern 26A2 and the lead conductor 27A2 after firing are formed. By applying the conductor paste to yet another magnetic sheet, a plurality of unfired conductor patterns that become the circumferential pattern 26B1 and the lead conductor 27B1 after firing are formed, and the conductor paste is similarly applied to the other magnetic sheet. Is applied to form a plurality of unfired conductor patterns that become the circumferential pattern 26B2 and the lead conductor 27B2 after firing, respectively. During the formation of the unfired conductor pattern, the conductor paste is embedded in the through holes of the magnetic sheet. The unfired vias (unfired vias) embedded in the through holes become vias VA and VB after firing. This conductor paste can be obtained, for example, by kneading Ag, Cu or an alloy and resin thereof.

As described above, the mother laminated body can be obtained by laminating the magnetic material sheet on which the unfired conductor pattern and the unfired via are formed and the magnetic material sheet on which the conductor is not formed. In the mother laminate, adjacent unfired conductor patterns are connected to each other by unfired vias to form unfired coil patterns that become coil conductors 25A and 25B after firing. The distance between the coil conductor 25A and the coil conductor 25B can be adjusted by the magnetic sheet on which the conductor is not formed.

Next, a chip laminate can be obtained by individualizing the mother laminate using a cutting machine such as a dicing machine or a laser processing machine.

Next, the chip laminate is heat-treated at 600 ° C. to 850 ° C. for 20 minutes to 120 minutes. By this heat treatment, the chip laminate is degreased, the magnetic sheet and the conductor paste are fired, and the substrate 10 containing the coil conductors 25A and 25B is obtained. When the magnetic sheet contains a thermosetting resin, the thermosetting resin may be cured by heat-treating the chip laminate at a lower temperature. This cured resin serves as a binder for binding the metal magnetic particles contained in the magnetic sheet. The heat treatment at a low temperature is performed, for example, at a temperature in the range of 100 ° C. to 200 ° C. for about 20 minutes to 120 minutes.

Next, the external electrodes 21A, 22A, 21B, and 22B are formed by applying the conductor paste to the surface of the heat-treated chip laminate (that is, the substrate 10). By the above steps, the array type inductor 1 is obtained. The array-type inductors 101, 201, 301, and 401 can also be manufactured by the same manufacturing method as the array-type inductor 1.

In the above manufacturing method, it is possible to omit a part of the steps, add steps not explicitly described, and / or change the order of the steps, and such omissions and additions. , The processing procedure in which the order is changed is also included in the scope of the present invention as long as it does not deviate from the gist of the present invention.

The method for manufacturing the array-type inductor 1 is not limited to that described above. The array-type inductor 1 may be manufactured by a laminating method other than the sheet laminating method (for example, a printing laminating method), a thin film process, a compression molding process, or a known method other than the above.

Next, the action and effect of the above embodiment will be described. According to one or more embodiments of the present invention, the coil conductor 25A and the coil conductor 25B are arranged so that the coil shaft Ax1 and the coil shaft Ax2 are parallel to the mounting surface 10b of the substrate 10, so that the array type inductor is used. 1, 101, 201, 301, 401 can be miniaturized in the direction along the mounting surface 10b.

According to one or more embodiments of the present invention, since the coil shaft Ax2 is arranged at a distance from the coil shaft Ax1, the magnetic interference between the coil conductor 25A and the coil conductor 25B is weakened. Can be done. Therefore, as compared with the array type inductor having the coil conductor 25A and the coil conductor 25B arranged so that the coil shaft Ax1 and the coil shaft Ax2 are coaxial with each other, the magnetic coupling between the coil conductor 25A and the coil conductor 25B is improved. Can be weakened. As described above, in one or more embodiments of the present invention, the relative magnetic permeability of the substrate 10 is set to 100 or less in order to realize low inductance. When the specific magnetic permeability of the substrate 10 is 100 or less, it is difficult to keep the magnetic flux generated from the coil conductor 25A in the vicinity of the coil conductor 25A and the magnetic flux generated from the coil conductor 25B in the vicinity of the coil conductor 25B. When the distance G1 between the coil conductor 25A and the coil conductor 25B is reduced, the magnetic coupling between the coil conductor 25A and the coil conductor 25B tends to be strengthened. In one or more embodiments of the present invention, as described above, the coil shaft Ax2 is arranged at a distance from the coil shaft Ax1, so that the distance G1 between the coil conductor 25A and the coil conductor 25B is small. However (for example, even if it is 0.3 mm or less), the magnetic coupling between the coil conductor 25A and the coil conductor 25B can be weakened.

Therefore, according to one or more embodiments of the present invention, the array-type inductors 1, 101, 201, and 301 can be miniaturized in the direction along the mounting surface 10b and the magnetic coupling between the inductors is suppressed. , 401 can be provided.

According to one or more embodiments of the present invention, the low inductance array type inductors 1, 101, 201, 301, and 401 can be obtained by setting the relative magnetic permeability of the substrate 10 to 100 or less. According to one or more embodiments of the present invention, the substrate 10 may be configured such that the relative permeability is in the range of 30 to 100 in the entire region thereof. If there is a region of the substrate 10 having a relative permeability less than 30, that region may substantially function as a magnetic gap. When the substrate 10 has a low magnetic permeability region that can function as a magnetic gap, the magnetic flux generated from one of the coil conductor 25A and the coil conductor 25B passes through a magnetic path that does not include the low magnetic permeability region, and thus the other coil. It becomes easy to interfere with the conductor. Further, if the substrate 10 has a low magnetic permeability region that can function as a magnetic gap, magnetic flux leakage occurs, and magnetic interference with elements other than the array-type inductors 1, 101, 201, 301, and 401 becomes large. It ends up. By setting the relative magnetic permeability in the range of 30 to 100 in the entire region of the substrate 10, the region that functions as a magnetic gap does not exist in the substrate 10, and therefore, it is included in the array-type inductors 1, 101, 201, 301, and 401. Magnetic coupling between the coil conductors can be suppressed, and magnetic interference with elements other than the array-type inductors 1, 101, 201, 301, and 401 can be suppressed.

According to one or more embodiments of the present invention, it is the ratio of the cross-sectional dimension a1 of the peripheral portion 26A in the direction perpendicular to the coil shaft Ax1 to the cross-sectional dimension a2 of the peripheral portion 26A in the direction parallel to the coil shaft Ax1. Since the first aspect ratio is larger than 1, the magnetic flux generated from the orbiting portion 26A including the orbiting pattern 26A1 is more likely to be directed in the direction perpendicular to the direction parallel to the coil axis Ax1 than in the direction parallel to the coil axis Ax1. Therefore, the magnetic flux generated from the peripheral portion 26A of the coil conductor 25A is less likely to reach the coil conductor 25B than the magnetic flux generated from the inductor having the peripheral portion having the first aspect ratio of 1 or less, and as a result, the coil. It is possible to suppress the magnetic coupling between the conductor 25A and the coil conductor 25B.

According to one or more embodiments of the present invention, the second aspect ratio of the circumferential patterns 26B1 and 26B2 included in the circumferential portion 26B of the coil conductor 25B may be larger than 1. In this case, the magnetic coupling between the coil conductor 25A and the coil conductor 25B can be further suppressed.

According to one or more embodiments of the present invention, the third aspect ratio of the circumferential patterns 26C1 and 26C2 included in the circumferential portion 26C of the coil conductor 25C may be larger than 1. In this case, it is possible to suppress the magnetic coupling between the coil conductor 25C and another coil conductor (for example, coil conductors 25B and 25D). According to one or more embodiments of the present invention, the fourth aspect ratio of the circumferential patterns 26D1 and 26D2 included in the circumferential portion 26D of the coil conductor 25D may also be larger than 1. In this case, it is possible to suppress the magnetic coupling between the coil conductor 25D and another coil conductor (for example, the coil conductor 25C).

According to one or more embodiments of the present invention, the orbital patterns 26A1 and 26A2 have a shape having no corner in a cross section passing through the coil shaft Ax1. Therefore, the magnetic flux generated from the orbital patterns 26A1 and 26A2 of the coil conductor 25A can easily pass closer to the center of the cross section of the orbiting patterns 26A1 and 26A2. Therefore, it becomes difficult for the magnetic flux generated from the orbital patterns 26A1 and 26A2 of the coil conductor 25A to reach another coil conductor (for example, the coil conductor 25B), and as a result, the magnetic flux between the coil conductor 25A and the other coil conductor is magnetic. Binding can be suppressed. According to one or more embodiments of the present invention, the orbital pattern constituting the coil conductor other than the coil conductor 25A may have a shape having no corner in the cross section passing through each coil axis. This makes it possible to suppress the magnetic coupling between the coil conductor and another coil conductor.

In the array-type inductor 401 according to one or more embodiments of the present invention, the coil conductor 25B and the coil conductor 25C are arranged between the coil conductor 25A and the coil conductor 25D in the direction along the coil axis Ax2. ing. Therefore, the magnetic flux generated from the coil conductor 25B and the magnetic flux generated from the coil conductor 25C are less likely to leak to the outside of the substrate 10 than the magnetic flux generated from the coil conductors 25A and 25D. On the other hand, since the coil conductor 25A faces the second end surface 10d of the substrate 10 in the direction along the coil shaft Ax1, the magnetic flux generated from the coil conductor 25A tends to leak out from the substrate 10. Similarly, since the coil conductor 25D faces the first end surface 10c of the substrate 10 in the direction along the coil shaft Ax4, the magnetic flux generated from the coil conductor 25D tends to leak out from the substrate 10. Therefore, the magnetic coupling between the coil conductor 25B and the coil conductor 25C tends to be stronger than the magnetic coupling between the coil conductor 25A and the coil conductor 25B and the magnetic coupling between the coil conductor 25C and the coil conductor 25D. .. According to one or more embodiments of the present invention, the distance G2 between the coil conductor 25B and the coil conductor 25C is set to be larger than the distance G1 between the coil conductor 25A and the coil conductor 25B to obtain the coil conductor 25B. The magnetic coupling with the coil conductor 25C is weakened, and the strength of the magnetic coupling between the coil conductor 25B and the coil conductor 25C is weakened to the same level as the strength of the magnetic coupling between the coil conductor 25A and the coil conductor 25B. be able to. Further, by making the distance G2 between the coil conductor 25B and the coil conductor 25C larger than the distance G3 between the coil conductor 25C and the coil conductor 25D, the magnetic coupling between the coil conductor 25B and the coil conductor 25C is weakened. The strength of the magnetic coupling between the coil conductor 25B and the coil conductor 25C can be weakened to the same extent as the strength of the magnetic coupling between the coil conductor 25C and the coil conductor 25D.

The dimensions, materials, and arrangement of each component described herein are not limited to those expressly described in the embodiments, and each component may be included within the scope of the present invention. Can be modified to have the dimensions, materials, and arrangement of. In addition, components not explicitly described in the present specification may be added to the described embodiments, or some of the components described in each embodiment may be omitted.

1, 101, 201, 301, 401 Array type inductor 2 Circuit board 10 Base 25A, 25B, 25C, 25D, 125A, 125B, 225A, 225B, 325A, 325B Coil conductor Ax1, Ax2, Ax3, Ax4 Coil shaft

As described above, since the relative magnetic permeability of the substrate 10 of the array type inductor 1 takes a small value of 100 or less, the inductance L of the inductors of each system of the array type inductor 1 also takes a small value. As described above, since the inductance of the inductors of each system is low, magnetic saturation is unlikely to occur in the array-type inductor 1. Therefore, a large current can be passed through the inductors of each system of the array type inductor 1. Therefore, in one or more embodiments of the present invention, in the inductor of each system of the array type inductor 1, the product of the inductance L and the product of the square of the flowing current I is divided by the volume V of each inductor. The expressed energy density Ed (that is, Ed = LxI ² / V ) can be increased. For example, when the inductance L of the inductors of each system of the array type inductor 1 is made smaller than 100 nH, Ed can be set to 1500 nH · A / mm ³ . Further, when the inductance L of the inductors of each system of the array type inductor 1 is made smaller than 50 nH, Ed can be set to 2000 nH · A / mm ³ . Further, when the inductance L of the inductors of each system of the array type inductor 1 is made smaller than 25 nH, Ed can be set to 2500 nH · A / mm ³ .

Claims (20)

A substrate containing a plurality of metallic magnetic particles and having a first surface,
A first circuit provided in the substrate and having a first circumferential portion wound around a first coil shaft extending in a direction parallel to the first surface at a position separated from the first surface by a first distance. With coil conductor,
It is wound around a second coil shaft which is provided in the substrate and extends in a direction parallel to the first coil shaft at a position separated from the first surface by a second distance larger than the first distance. A second coil conductor having a second circuit and
A first external electrode provided on the substrate so as to be in contact with at least the first surface and connected to one end of the first coil conductor.
A second external electrode provided on the substrate so as to be in contact with at least the first surface and connected to the other end of the first coil conductor.
A third external electrode provided on the substrate so as to be in contact with at least the first surface and connected to one end of the second coil conductor.
A fourth external electrode provided on the substrate so as to be in contact with at least the first surface and connected to the other end of the second coil conductor.
Array type inductor with. The distance between the first coil conductor and the second coil conductor in the direction along the first coil axis is 0.3 mm or less.
The array type inductor according to claim 1. The specific magnetic permeability of the substrate is 100 or less.
The array type inductor according to claim 1 or 2. The first circuit portion is wound around the first coil shaft for 1.5 turns or less.
The second circuit portion is wound around the second coil shaft by 1.5 turns or less.
The array-type inductor according to any one of claims 1 to 3. The shape of the first peripheral portion seen from the direction of the first coil shaft is the same as the shape of the second peripheral portion seen from the direction of the second coil shaft.
The array-type inductor according to any one of claims 1 to 4. The absolute value of the coupling coefficient between the first coil conductor and the second coil conductor is 0.15 or less.
The array-type inductor according to any one of claims 1 to 5. The first aspect ratio, which is the ratio of the dimension of the cross section of the first circuit in the direction perpendicular to the first coil axis to the dimension of the cross section of the first circuit in the direction parallel to the first coil axis, is 1 or more. big,
The array type inductor according to any one of claims 1 to 6. The second aspect ratio, which is the ratio of the dimension of the cross section of the second circuit in the direction perpendicular to the second coil axis to the dimension of the cross section of the second circuit in the direction parallel to the second coil axis, is 1 or more. big,
The array-type inductor according to any one of claims 1 to 7. The first orbital portion has a first orbital pattern extending around the first coil shaft.
The first circuit pattern has a shape having no angle in a cross section passing through the first coil shaft.
The array type inductor according to any one of claims 1 to 8. The substrate has a first end surface that is connected to the first surface.
The first coil conductor has a first lead conductor that is connected to one end of the first circumferential portion and extends along the first end face.
The first external electrode is connected to the first coil conductor via the first lead conductor.
The array-type inductor according to any one of claims 1 to 9. The first coil shaft is provided in the substrate on the side opposite to the first coil conductor with respect to the second coil conductor, and is separated from the first surface by a third distance smaller than the second distance. A third coil conductor having a third coil wound around a third coil shaft extending in a direction parallel to the third coil conductor.
A fifth external electrode connected to one end of the third coil conductor,
A sixth external electrode connected to the other end of the third coil conductor,
The array-type inductor according to any one of claims 1 to 10. The third distance is equal to the first distance,
The array type inductor according to claim 11. The shape of the third circuit seen from the direction of the third coil shaft is the shape of the first circuit seen from the direction of the first coil shaft and the shape of the second circuit seen from the direction of the second coil shaft. It has the same shape as at least one of the orbits,
The array type inductor according to claim 11 or 12. The substrate has a first end surface that is connected to the first surface.
The first coil conductor is arranged so as to face the first end surface of the substrate in a direction along the first coil axis.
The distance between the second coil conductor and the third coil conductor in the direction along the first coil axis is between the first coil conductor and the second coil conductor in the direction along the first coil axis. Greater than the interval between
The array-type inductor according to any one of claims 11 to 13. The first coil shaft is provided in the substrate on the side opposite to the second coil conductor with respect to the third coil conductor, and is separated from the first surface by a fourth distance larger than the third distance. A fourth coil conductor with a fourth coil wound around a fourth coil shaft extending in a direction parallel to
A seventh external electrode connected to one end of the fourth coil conductor,
An eighth external electrode connected to the other end of the third coil conductor,
The array-type inductor according to any one of claims 11 to 14. The fourth distance is equal to the second distance,
The array-type inductor according to claim 15. The shape of the fourth circuit portion viewed from the direction of the fourth coil shaft is the shape of the first circuit portion viewed from the direction of the first coil shaft, and the shape of the second circuit portion viewed from the direction of the second coil shaft. It is the same as at least one of the shape of the peripheral portion and the shape of the third peripheral portion as viewed from the direction of the third coil shaft.
The array type inductor according to claim 15 or 16. The substrate has a second end surface that is connected to the first surface and faces the first end surface.
The fourth coil conductor is arranged so as to face the second end surface of the substrate in a direction along the first coil axis.
The distance between the second coil conductor and the third coil conductor in the direction along the third coil axis is between the third coil conductor and the fourth coil conductor in the direction along the third coil axis. Greater than the interval between
The array-type inductor according to any one of claims 15 to 17. A circuit board comprising the array-type inductor according to any one of claims 1 to 18. The electronic device provided with the circuit board according to claim 19.

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