JP2022019040A - Electric power conversion device - Google Patents

Abstract

To provide an electric power conversion device that improves heat dissipation of a heat generation member while prevented from being large-sized, and makes heat dissipation of a power module uniform.SOLUTION: An electric power conversion device comprises: a power module; a heat sink having one surface thermally connected to the power module; a cooling refrigerant flow passage where a refrigerant flows in a direction along the other surface of the heat sink; a supply refrigerant flow passage which extends from a refrigerant inflow port in a direction along the other surface of the heat sink and also extends in a normal direction of the other surface to be connected to the cooling refrigerant flow passage; a discharge refrigerant flow passage which extends from a refrigerant outflow port in the direction along the other surface of the heat sink and also extends in the normal direction of the other surface to be connected to the cooling refrigerant flow passage; and a heat generation member which is electrically connected to the power module and also thermally connected to a side wall of the supply refrigerant flow passage or discharge refrigerant flow passage. The device has one or both of a first projection part and a second projection part provided apart from surfaces on fourth side faces of the supply refrigerant flow passage and discharge refrigerant flow passage at a part on the side of the fourth side face and on the side in the normal direction.SELECTED DRAWING: Figure 1

Description

The present application relates to a power conversion device.

Electric vehicles, such as electric vehicles or hybrid vehicles, in which a motor is used as a drive source, are equipped with a plurality of electric power conversion devices. A power conversion device is a device that converts an input current from direct current to alternating current, from alternating current to direct current, or an input voltage to a different voltage. Specifically, a charger that converts a commercial AC power supply to a DC power supply to charge a high-voltage battery, a DC / DC converter that converts the DC power supply of a high-pressure battery to the voltage of a battery for auxiliary equipment (for example, 12V), and a battery. Examples thereof include an inverter that converts DC power from a battery into AC power to a motor.

Power conversion devices mounted on electric vehicles or hybrid vehicles are required to be smaller and have higher output. As the output of the power conversion device increases, the capacitor housed in the power conversion device handles a large current, and the amount of heat generated by the capacitor is increasing. The heat resistant temperature of the capacitor is lower than that of other components constituting the power conversion device. Further, since the temperature rise of the capacitor shortens the life of the capacitor, a method of cooling the capacitor has become an issue as a countermeasure against the temperature rise of the capacitor element.

In order to suppress the temperature rise of the capacitor, a structure for cooling the capacitor is disclosed as well as a cooling structure for cooling the power module contributing to power conversion with a refrigerant (see, for example, Patent Document 1). In the disclosed structure, cooling channels are provided in each of the power module and the capacitor. In addition, as a cooling structure that cools the power module with refrigerant, in order to make the heat dissipation of the power module uniform regardless of the location of the cooling structure in contact with the power module, the flow velocity is increased even at a place far from the refrigerant inlet where the flow velocity becomes slow. A structure that can be used is disclosed (see, for example, Patent Document 2). In the disclosed structure, the width of the flow path portion is not uniform, and the wall thickness of the flow path portion is increased to narrow the width of the flow path portion. Therefore, the flow velocity is increased even at a location far from the refrigerant inlet. be able to.

Japanese Unexamined Patent Publication No. 2013-31330 International Publication No. 2013/05/4887

In Patent Document 1, since the capacitor is also provided with a cooling flow path, the capacitor can be cooled in the same manner as the power module. However, since separate cooling channels are provided for each of the power module and the capacitor, there is a problem that the number of parts increases and the power conversion device becomes large.

Further, in Patent Document 2, since the thickness of the wall of the flow path portion is changed, the heat dissipation of the power module can be made uniform regardless of the location of the cooling structure in contact with the power module. However, in the disclosed structure, when the capacitor is arranged on the side wall of the flow path portion in order to make the cooling flow path of the power module and the capacitor common, the portion where the wall thickness of the flow path portion is increased is the flow path portion. Since the capacitor is continuously provided up to the end of the wall, the heat dissipation of the capacitor deteriorates in the place where the thickness increases and does not come into contact with the refrigerant, and the capacitor is sufficiently provided at the end of the flow path where the wall thickness is the largest. There was a problem that it did not get cold.

Therefore, an object of the present application is to obtain a power conversion device capable of improving the heat dissipation of a heat generating member such as a capacitor while suppressing the increase in size and making the heat dissipation of a power module uniform regardless of the location. There is.

The power conversion device disclosed in the present application includes a power module having a semiconductor element, a rectangular plate-shaped heat sink in which one surface is thermally connected to the power module, and a heat sink along the other side of the heat sink. A cooling refrigerant flow path in which the refrigerant flows in the first second direction from the side of the first side surface to the side of the second side surface opposite to the first side surface, and the side of the first side surface of the cooling refrigerant flow path. Extends from the refrigerant inlet provided on the third side surface side of the heat sink in the third and fourth directions from the side of the third side surface toward the side of the fourth side surface opposite to the third side surface. Both the supply refrigerant flow path, which extends in the normal direction of the other surface of the heat sink and is connected to the side portion of the first side surface of the cooling refrigerant flow path, and the side of the second side surface of the cooling refrigerant flow path. From the refrigerant outlet provided on the third side surface, it extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink, and is connected to the side portion of the second side surface in the cooling refrigerant flow path. The discharge refrigerant flow path is electrically connected to the power module, and the side wall on the side of the first side surface or the side of the second side surface in the supply refrigerant flow path, or the first side surface in the discharge refrigerant flow path. A fourth side of the supply refrigerant flow path is provided with a heat generating member thermally connected to the side wall on the side or the second side surface, and is provided on the side of the fourth side surface and the portion on the side in the normal direction in the supply refrigerant flow path. The fourth side surface of the discharge refrigerant flow path is provided on the side of the fourth side surface and the portion on the side in the normal direction in the first protrusion portion provided apart from the side surface of the side surface of the discharge refrigerant flow path. It has one or both of the second protrusions provided apart from the side surface.

According to the power conversion apparatus disclosed in the present application, a supply extending in the third and fourth directions and extending in the normal direction of the other surface of the heat sink and connected to a portion on the side of the first side surface in the cooling refrigerant flow path. A refrigerant flow path, a discharge refrigerant flow path that extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink and is connected to a side portion of the second side surface of the cooling refrigerant flow path, and a power module. A heating member that is electrically connected to and thermally connected to the side wall on the side of the first side surface or the side of the second side surface in the supply refrigerant flow path or the discharge refrigerant flow path is provided, and the supply refrigerant flow is provided. A first protrusion provided on the side of the fourth side surface and a portion on the side in the normal direction of the road away from the surface on the side of the fourth side surface of the supply refrigerant flow path, and a second in the discharge refrigerant flow path. Since one or both of the second protrusions provided apart from the surface on the side of the fourth side surface of the discharged refrigerant flow path are provided on the side surface side and the side portion in the normal direction of the fourth, the power module and the power module. The size increase is suppressed without providing a separate cooling flow path for each of the heat generating members such as the condenser, and the side wall of the supply refrigerant flow path or the discharge refrigerant flow path is thermally connected to the heat generation member such as the condenser to generate heat. In addition to improving the heat dissipation of the power module, the provision of protrusions makes it possible to make the heat dissipation of the power module uniform regardless of the location.

It is sectional drawing which shows the outline of the power conversion apparatus which concerns on Embodiment 1. FIG. It is a top view which shows the outline of the main part of the power conversion apparatus which concerns on Embodiment 1. FIG. It is sectional drawing of the main part of the power conversion apparatus cut at the cross-sectional position AA of FIG. It is sectional drawing which shows the outline of another power conversion apparatus which concerns on Embodiment 1. FIG. It is sectional drawing which shows the outline of another power conversion apparatus which concerns on Embodiment 1. FIG. It is sectional drawing which shows the outline of the power conversion apparatus which concerns on Embodiment 2. FIG. It is a top view which shows the outline of the main part of the power conversion apparatus which concerns on Embodiment 2. FIG. It is sectional drawing which shows the outline of the power conversion apparatus which concerns on Embodiment 3. FIG. It is a top view which shows the outline of the main part of the power conversion apparatus which concerns on Embodiment 3. FIG. It is sectional drawing which shows the outline of another power conversion apparatus which concerns on Embodiment 3. FIG. It is sectional drawing which shows the outline of the power conversion apparatus which concerns on Embodiment 4. FIG. It is a top view which shows the outline of the main part of the power conversion apparatus which concerns on Embodiment 4. FIG.

Hereinafter, the power conversion device according to the embodiment of the present application will be described with reference to the drawings. In each figure, the same or corresponding members and parts will be described with the same reference numerals.

Embodiment 1.
1 is a cross-sectional view showing an outline of the power conversion device 100 according to the first embodiment, FIG. 2 is a plan view showing an outline of a main part of the power conversion device 100, and FIG. 3 is cut at the AA cross-sectional position of FIG. FIG. 4 is a sectional view of a main part of the power conversion device 100, FIG. 4 is a sectional view showing an outline of another power conversion device 100 according to the first embodiment, and FIG. 5 is a schematic view of another power conversion device 100 according to the first embodiment. It is a cross-sectional view which shows. FIG. 1 is a cross-sectional view of the power conversion device 100 cut at the BB cross-sectional position of FIG. FIG. 2 is a configuration diagram showing a part of the parts arranged in the housing 70 removed, and the outer shape of the heat sink 90 is shown by a broken line. FIG. 3 is a diagram showing a part of the capacitor module 30 omitted, and FIGS. 4 and 5 are sectional views of another power conversion device 100 cut at a position equivalent to the BB cross-sectional position of FIG. The power conversion device 100 is a device that converts an input current from direct current to alternating current, from alternating current to direct current, or an input voltage to a different voltage.

As shown in FIG. 1, the power conversion device 100 includes a power module 10 having a semiconductor element 11, a capacitor module 30 having a smoothing capacitor as a heat generating member, an AC bus bar 50, a terminal block 51, a housing 70, and a current sensor. 80, a rectangular plate-shaped heat sink 90 having one surface thermally connected to the power module 10, and a heat sink fin 91 provided on the other surface of the heat sink 90. In the power conversion device 100, smoothed DC power is transmitted from the outside to the power module 10 via the condenser module 30, power is converted by the power module 10, AC power is sent to the AC bus bar 50, and AC power is output to the outside. It is a device to do. The power module 10 outputs, for example, three-phase alternating current. The power conversion device 100 can also send DC power to the outside by a route opposite to the above-mentioned route. The AC bus bar 50 is attached to the terminal block 51, and the current sensor 80 is mounted on the AC bus bar 50.

<Power module 10>
The power module 10 includes a semiconductor element 11, a wiring member 12 for a semiconductor element, wiring members 13a and 13b for a power module, a conductive bonding material 14, a mold resin 15, and an insulating member 16. The power module 10 generates heat when energized. The power module wiring member 13a is electrically and thermally connected to the semiconductor element 11 via the conductive joining material 14 on one surface. The power module wiring member 13a is thermally connected to the insulating member 16 on the other surface. A part of the power module wiring member 13a extends from the mold resin 15 to the outside and is electrically connected to the AC bus bar 50. The power module wiring member 13b is electrically and thermally connected to one end of the semiconductor element wiring member 12 via the conductive bonding material 14 on one surface. The power module wiring member 13b is thermally connected to the insulating member 16 on the other surface. A part of the power module wiring member 13b extends from the mold resin 15 to the outside and is electrically connected to the capacitor wiring member 34. The other end of the semiconductor element wiring member 12 is electrically and thermally connected to the semiconductor element 11 via the conductive joining material 14. The components of the power module 10 such as the semiconductor element 11 are sealed with the mold resin 15. The surface of the insulating member 16 on the side not connected to the power module wiring members 13a and 13b is exposed from the mold resin 15 and is thermally connected to one surface of the heat sink 90. The heat sink 90 and the heat sink fin 91 are made of a metal having high thermal conductivity such as aluminum. Screw fastening or welding is used for the connection between the power module wiring member 13a and the AC bus bar 50 and the connection between the power module wiring member 13b and the capacitor wiring member 34.

<Capacitor module 30>
The capacitor module 30 includes a capacitor element 32, which is a smoothing capacitor for smoothing DC power, a capacitor case 31, a sealing material 33, a capacitor wiring member 34, and a heat dissipation member 35. The capacitor element 32 is housed in the capacitor case 31 via the sealing material 33. One end of the capacitor wiring member 34 is electrically connected to the capacitor element 32, and the other end extends outward from the capacitor case 31 to be electrically connected to the power module wiring member 13b. The capacitor case 31 is housed in the housing 70 and fixed to the housing 70. The heat radiating member 35 is arranged between the housing 70 and the outside of the condenser case 31, and the condenser case 31 and the housing 70 are thermally connected to each other. In the present embodiment, as shown in FIG. 1, an example in which the heat radiating member 35 is arranged only between the housing 70 on the side of the supply refrigerant flow path 71 and the capacitor case 31 is shown, but the radiating member 35 is arranged. The configuration is not limited to this, and the heat radiating member 35 may be further arranged between the other housing 70 and the capacitor case 31. The heat radiating member 35 is, for example, heat radiating grease, but the heat radiating member 35 is not limited to the heat radiating grease, and may be a heat radiating sheet or a heat radiating compound. A heat radiating member 35 may be provided between the power module 10 and the heat sink 90.

<Refrigerant flow path>
The refrigerant flow path, which is one of the main parts of the present application, will be described. The refrigerant flow path through which the refrigerant flows is composed of a supply refrigerant flow path 71, a discharge refrigerant flow path 72, and a cooling refrigerant flow path 73. The housing 70 includes a refrigerant flow path, a refrigerant inlet 76, a refrigerant outlet 77, and a first protrusion 74. As the refrigerant, for example, water or an ethylene glycol liquid is used. The housing 70 is die-cast from, for example, aluminum. The cooling refrigerant flow path 73 is a first first along the other surface of the heat sink 90 from the side of the first side surface 90a of the heat sink 90 toward the side of the second side surface 90b opposite to the first side surface 90a. It is a flow path through which the refrigerant flows in two directions. The heat sink 90 and the heat sink fins 91 are cooled by the refrigerant. As shown in FIG. 3, the heat sink fins 91 are provided along the first and second directions in which the refrigerant flows.

The supply refrigerant flow path 71 has a third side surface 90c from a refrigerant inlet 76 provided on the side of the first side surface 90a of the heat sink 90 in the cooling refrigerant flow path 73 on the side of the third side surface 90c of the heat sink 90. In the third fourth direction toward the side of the fourth side surface 90d opposite to the third side surface 90c, and extending in the normal direction of the other surface of the heat sink 90, in the cooling refrigerant flow path 73. It is a flow path connected to a portion of the heat sink 90 on the side of the first side surface 90a. The discharge refrigerant flow path 72 extends from the refrigerant outlet 77 provided on the third side surface 90c to the side of the second side surface 90b of the heat sink 90 in the cooling refrigerant flow path 73 in the third and fourth directions, and is a heat sink. A flow path extending in the normal direction of the other surface of the 90 and connected to a portion of the cooling refrigerant flow path 73 on the side of the second side surface 90b of the heat sink 90.

The heat generating member is electrically connected to the power module 10 and is a side wall on the side of the first side surface 90a or the side of the second side surface 90b in the supply refrigerant flow path 71, or a first side wall in the discharge refrigerant flow path 72. It is thermally connected to the side wall on the side of the side surface 90a or the side of the second side surface 90b. The heat generating member in the present embodiment is a condenser element 32, and the condenser element 32 is thermally connected to the side wall on the side of the first side surface 90a in the supply refrigerant flow path 71. The heat-generating member is not limited to the capacitor element 32, and at least one of the heat-generating member DC bus bar, reactor, discharge resistance, AC bus bar, power module wiring members 13a and 13b, capacitor wiring member 34, and the like is supplied as a refrigerant. It may be thermally connected to the side wall of the flow path 71 or the discharge refrigerant flow path 72.

Wiring members such as the capacitor module 30, the power module 10, and the AC bus bar 50 arranged in the current path of the power conversion device 100 generate power due to power loss when energized. The heat generated by the power module 10 and the capacitor module 30 is particularly large, and their heat resistant temperatures are lower than those of the wiring members. When the temperature rises due to the heat generated by itself and the thermal interference of other parts, the power module 10 and the capacitor module 30 may exceed the heat resistant temperature. Therefore, it is necessary to improve the heat dissipation of the power module 10 and the capacitor module 30 to cool the power module 10 and the capacitor module 30.

According to this configuration, since the heat sink 90 and the heat sink fins 91 are cooled by the refrigerant, the power module 10 thermally connected to the heat sink 90 by the insulating member 16 is also cooled by the refrigerant. Since the condenser element 32 is thermally connected to the side wall of the supply refrigerant flow path 71 through which the refrigerant flows, the condenser element 32 is also cooled by the refrigerant without providing a new refrigerant flow path, and the heat dissipation of the condenser element 32 is improved. .. Since the supply refrigerant flow path 71 extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink 90 to expand the side wall, the portion thermally connected to the capacitor element 32 is also expanded. Therefore, the heat dissipation of the capacitor element 32 is further improved.

The temperature of the refrigerant flowing through the refrigerant flow path is low in the supply refrigerant flow path 71 before passing through the cooling refrigerant flow path 73, and high in the discharge refrigerant flow path 72 after passing through the cooling refrigerant flow path 73. Since the condenser element 32, which is a heat generating member, is thermally connected to the supply refrigerant flow path 71 in which the temperature of the refrigerant is low, the heat dissipation of the condenser element 32 is further improved.

Further, the capacitor module 30 is arranged close to the power module 10 in order to connect the capacitor module 30 to the power module 10 with a low wiring inductance. Since the capacitor module 30 and the power module 10 are close to each other and the capacitor module 30 and the power module 10 are connected with a low wiring inductance, the extra loss in the wiring member connecting the capacitor module 30 and the power module 10 is lost. The occurrence can be suppressed. Since the occurrence of loss is suppressed, heat generation due to Joule heat of the wiring member is suppressed, and the capacitor element 32 can be protected from temperature rise.

<First protrusion 74>
The first protrusion 74, which is another main part of the present application, will be described. The first protrusion 74 is located on the side of the fourth side surface 90d of the supply refrigerant flow path 71 and the side of the other surface of the heat sink 90 in the normal direction, on the side of the fourth side surface 90d of the supply refrigerant flow path 71. It is provided apart from the surface of. The first protrusion 74 is formed on the side wall to which the capacitor element 32 is thermally connected. The side of the third side surface 90c of the first protrusion 74 and the side of the other side of the heat sink 90 are inclined so as not to obstruct the flow of the refrigerant.

According to this configuration, the area in contact with the refrigerant on the side wall to which the condenser element 32 is thermally connected increases, so that the heat dissipation of the condenser element 32 can be further improved. Further, since the first protrusion 74 is separated from the surface of the supply refrigerant flow path 71 on the side of the fourth side surface 90d, the thickness of the side wall increases on the side of the fourth side surface 90d of the supply refrigerant flow path 71. Since the area in contact with the refrigerant on the side wall is surely increased, the heat dissipation of the capacitor element 32 can be improved. The first protrusion 74 may be formed on the wall surface perpendicular to the side wall of the supply refrigerant flow path 71 to which the condenser element 32 is thermally connected, but the side wall to which the condenser element 32 is thermally connected may be formed. When formed in, the effect of enhancing the heat dissipation of the capacitor element 32 is great.

In the present embodiment, an example is shown in which the first protrusion 74 itself is one cooling fin, but the configuration of the first protrusion 74 is not limited to this, and as shown in FIG. 4, the first protrusion 74 is the first. The protrusion 74 may be provided with a plurality of cooling fins 74a. When the first protrusion 74 includes the plurality of cooling fins 74a, the area in contact between the side wall and the refrigerant is further increased, so that the heat dissipation of the condenser element 32 can be further improved. The arrangement of the cooling fins 74a is not limited to the arrangement parallel to the other surface of the heat sink 90 shown in FIG. 4, and may be provided so as to be inclined toward the cooling refrigerant flow path 73.

When the width of the supply refrigerant flow path 71 is uniform, the flow velocity of the refrigerant becomes slower on the side of the fourth side surface 90d, which is a location farther than the location near the refrigerant inlet 76 of the supply refrigerant flow path 71. By providing the first protrusion 74 on the side of the fourth side surface 90d where the flow velocity of the refrigerant becomes slow, the flow path of the refrigerant near the first protrusion 74 is narrowed, so that the flow path of the refrigerant is narrowed. The flow velocity of the refrigerant flowing through the location increases. Since the flow velocity of the refrigerant does not slow down on the side of the fourth side surface 90d of the supply refrigerant flow path 71, the refrigerant flows stably to the cooling refrigerant flow path 73 regardless of the location far from or near the refrigerant inlet 76. The heat dissipation of the power module 10 can be made uniform regardless of the location of the cooling refrigerant flow path 73. Further, since the first protrusion 74 is provided on the portion of the supply refrigerant flow path 71 on the side in the normal direction, the direction in which the refrigerant flows can be directed to the cooling refrigerant flow path 73.

In the present embodiment, the condenser element 32 is arranged to be thermally connected to the side wall on the side of the first side surface 90a in the supply refrigerant flow path 71, but the arrangement of the condenser element 32 is not limited to this. For example, as shown in FIG. 5, the capacitor element 32 may be arranged to be thermally connected to the side wall on the side of the second side surface 90b in the supply refrigerant flow path 71. Even with such an arrangement, since the condenser element 32 is thermally connected to the side wall of the supply refrigerant flow path 71 through which the refrigerant flows, the condenser element 32 is also cooled by the refrigerant without providing a new refrigerant flow path. The heat dissipation of the capacitor element 32 is improved. Since the supply refrigerant flow path 71 extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink 90 to expand the side wall, the portion thermally connected to the capacitor element 32 is also expanded. Therefore, the heat dissipation of the capacitor element 32 is further improved. Further, since the condenser element 32 is thermally connected to the side wall of the discharge refrigerant flow path 72 through which the refrigerant flows, the heat dissipation of the condenser element 32 is further improved. Further, since the capacitor wiring member 34 is thermally connected to the side wall on the side of the first side surface 90a in the supply refrigerant flow path 71 via an insulating member (not shown), heat is dissipated from the capacitor wiring member 34. Sex also improves.

As described above, in the power conversion device 100 according to the first embodiment, both extending in the third and fourth directions and extending in the normal direction of the other surface of the heat sink 90, the side of the first side surface 90a in the cooling refrigerant flow path 73. In the portion of the cooling refrigerant flow path 73 on the side of the second side surface 90b, which extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink 90. The discharged cooling flow path 72 to be connected is electrically connected to the power module 10 and is thermally connected to the side wall of the supply cooling flow path 71 on the side of the first side surface 90a or the side of the second side surface 90b. 4 Since it has the first protrusion 74 provided apart from the side surface, it is possible to suppress the increase in size without providing separate cooling flow paths for the power module 10 and the condenser element 32, and the supply refrigerant flow path 71. The side wall of the power module 32 and the condenser element 32 are thermally connected to improve the heat dissipation of the condenser element 32, and the first protrusion 74 is provided to provide the power module 10 regardless of the location of the cooling refrigerant flow path 73. The heat dissipation can be made uniform.

Further, since the supply refrigerant flow path 71 extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink 90 to expand the side wall, the portion thermally connected to the capacitor element 32 also expands. Therefore, the heat dissipation of the capacitor element 32 is further improved. Further, since the first protrusion 74 is separated from the surface of the supply refrigerant flow path 71 on the side of the fourth side surface 90d, the thickness of the side wall increases on the side of the fourth side surface 90d of the supply refrigerant flow path 71. Since the area of the side wall in contact with the refrigerant is surely increased, the heat dissipation of the capacitor element 32 can be improved. Further, when the first protrusion 74 is provided on the side wall of the supply refrigerant flow path 71 thermally connected to the capacitor element 32, the area in contact with the refrigerant on the side wall to which the capacitor element 32 is thermally connected increases. Therefore, the heat dissipation of the capacitor element 32 can be further improved. Further, when the first protrusion 74 is provided with a plurality of cooling fins 74a, the area in contact between the side wall and the refrigerant is further increased, so that the heat dissipation of the condenser element 32 can be further improved.

Further, not only the capacitor element 32 but also at least one of the DC bus bar, the reactor, the discharge resistance, and the AC bus bar, which are heat generating members, is electrically connected to the power module 10, and these are the first in the supply refrigerant flow path 71. When the side wall of the side surface 90a or the side wall of the second side surface 90b is thermally connected and provided, the size of the power conversion device 100 can be increased without newly providing a cooling flow path around these heat generating members. It is suppressed, and the side wall of the supply refrigerant flow path 71 and the heat generating member can be thermally connected to improve the heat dissipation of the heat generating member.

Embodiment 2.
The power conversion device 100 according to the second embodiment will be described. FIG. 6 is a cross-sectional view showing an outline of the power conversion device 100 according to the second embodiment, and FIG. 7 is a plan view showing an outline of a main part of the power conversion device 100. FIG. 6 is a cross-sectional view of the power conversion device 100 cut at the CC cross-sectional position of FIG. FIG. 7 is a configuration diagram showing a part of the parts arranged in the housing 70 removed. The power conversion device 100 according to the second embodiment is configured to include a second protrusion 75 and a DC bus bar 52 in addition to the power conversion device 100 shown in the first embodiment.

The second protrusion 75 is located on the side of the fourth side surface 90d of the exhaust refrigerant flow path 72 and the portion of the other surface of the heat sink 90 on the side in the normal direction of the fourth side surface 90d of the discharge refrigerant flow path 72. It is provided apart from the side surface. The DC bus bar 52 is a wiring member that transfers electric power between the external battery and the capacitor module 30. The DC bus bar 52 is electrically connected to the capacitor element 32 at the upper part of the capacitor module 30, and is thermally connected to the housing 70 via the second heat dissipation member 53. The second heat radiating member 53 is, for example, a silicone material having excellent thermal conductivity or a heat radiating compound, but is not limited thereto. The power module wiring member 13a and the AC bus bar 50 are also thermally connected to the housing 70 via the second heat dissipation member 53. When the second heat radiating member 53 does not have an insulating property, an insulating member (not shown) is provided between the second heat radiating member 53 and the housing 70 or between the second heat radiating member 53 and each wiring member (not shown). Is provided. The power conversion device 100 converts the DC power input from the DC bus bar 52 into power and outputs it from the AC bus bar 50. The power conversion device 100 can also send DC power to the outside by the reverse route.

The AC bus bar 50 and the DC bus bar 52 are heat-generating members that generate heat when an electric current flows. When the AC bus bar 50 generates heat, heat is transferred to the terminal block 51 to which the AC bus bar 50 is attached, and the temperature of the terminal block 51 rises. When the temperature of the terminal block 51 rises, the temperature of the terminal block 51 may exceed the heat resistant temperature. When the DC bus bar 52 generates heat, heat is transferred to the capacitor element 32 connected to the DC bus bar 52, and the temperature of the capacitor element 32 rises. When the temperature of the capacitor element 32 rises, the temperature of the capacitor element 32 may exceed the heat resistant temperature. Therefore, it is necessary to improve the heat dissipation of the AC bus bar 50 and the DC bus bar 52 to cool the AC bus bar 50 and the DC bus bar 52.

The AC bus bar 50 is thermally connected to the side wall on the side of the second side surface 90b in the exhaust refrigerant flow path 72. The DC bus bar 52 is thermally connected to the side wall on the side of the first side surface 90a in the supply refrigerant flow path 71. According to this configuration, since the AC bus bar 50 is thermally connected to the side wall of the discharge refrigerant flow path 72 through which the refrigerant flows, the AC bus bar 50 is also cooled by the refrigerant, and the heat dissipation of the AC bus bar 50 is improved. Since the DC bus bar 52 is thermally connected to the side wall of the supply refrigerant flow path 71 through which the refrigerant flows, the DC bus bar 52 is also cooled by the refrigerant, and the heat dissipation of the DC bus bar 52 is improved.

The first protrusion 74 is formed on the side wall to which the DC bus bar 52 is thermally connected, and the second protrusion 75 is formed on the side wall to which the AC bus bar 50 is thermally connected. According to this configuration, since the area in contact between the refrigerant and the side wall increases in the side wall where the AC bus bar 50 and the DC bus bar 52 are thermally connected, the heat dissipation of the AC bus bar 50 and the DC bus bar 52 can be further improved. .. Further, since the first protrusion 74 is separated from the surface of the supply refrigerant flow path 71 on the side of the fourth side surface 90d, the thickness of the side wall increases on the side of the fourth side surface 90d of the supply refrigerant flow path 71. Since the area of the side wall in contact with the refrigerant is surely increased, the heat dissipation of the DC bus bar 52 can be improved. Further, since the second protrusion 75 is separated from the surface on the side of the fourth side surface 90d of the discharged refrigerant flow path 72, the thickness of the side wall increases on the side of the fourth side surface 90d of the discharged refrigerant flow path 72. Since the area of the side wall in contact with the refrigerant is surely increased, the heat dissipation of the AC bus bar 50 can be improved.

By providing the second protrusion 75 on the side of the fourth side surface 90d where the flow velocity of the refrigerant becomes slow, the flow path of the refrigerant near the second protrusion 75 is narrowed, so that the flow path of the refrigerant is narrowed. The flow velocity of the refrigerant flowing through the location increases. Since the flow velocity of the refrigerant does not slow down also on the side of the fourth side surface 90d of the discharge refrigerant flow path 72, the refrigerant flows stably to the cooling refrigerant flow path 73 regardless of the location far from or near the refrigerant outlet 77. The heat dissipation of the power module 10 can be made uniform regardless of the location of the cooling refrigerant flow path 73.

In the present embodiment, as shown in FIG. 7, the first protrusion 74 is formed in a size suitable for a portion where the DC bus bar 52 is thermally connected to the housing 70, but the first protrusion is formed. The size of the portion 74 is not limited to this. In order to improve the heat dissipation of the condenser module 30, the size of the first protrusion 74 may be expanded toward the condenser module 30 along the side wall of the supply refrigerant flow path 71.

Further, in the present embodiment, the heat generating member is shown as the AC bus bar 50 and the DC bus bar 52, but the power module wiring members 13a and 13b and the capacitor wiring member 34 are also heat generating members. Therefore, these may be thermally connected to the side wall of the supply refrigerant flow path 71 or the discharge refrigerant flow path 72. By thermally connecting the wiring members 13a and 13b for the power module and the wiring member 34 for the capacitor to the side wall of the supply refrigerant flow path 71 or the discharge refrigerant flow path 72, the heat dissipation property thereof is improved. Further, by forming the first protrusion 74 or the second protrusion 75 on the side wall to which the power module wiring members 13a and 13b and the capacitor wiring member 34 are thermally connected, the heat dissipation thereof can be improved. Further improve. Further, at least one of the reactor as a heat generating member and the discharge resistance may be thermally connected to the side wall of the supply refrigerant flow path 71 or the discharge refrigerant flow path 72.

Further, in the present embodiment, the AC bus bar 50 is equipped with a current sensor 80 that measures the current value of the current flowing through the AC bus bar 50. The current sensor 80 is composed of, for example, a core member made of a magnetic material surrounding the AC bus bar 50 and a current sensor element arranged in a gap portion of the core member. By mounting the current sensor 80 on the AC bus bar 50, the magnitude of the current flowing through the AC bus bar 50 can be easily measured. The mounting location of the current sensor 80 is not limited to the AC bus bar 50. The current sensor 80 may be mounted on the DC bus bar 52, the power module wiring members 13a and 13b, and the capacitor wiring member 34. When the current sensor 80 is mounted on the DC bus bar 52, the power module wiring members 13a, 13b, or the capacitor wiring member 34, the current sensor 80 easily measures the magnitude of the current flowing through these mounted wiring members. be able to. Further, the wiring member on which the current sensor 80 is mounted is a side wall on the side of the first side surface or the side of the second side surface of the supply refrigerant flow path 71, or the side of the first side surface or the second side of the discharge refrigerant flow path 72. When thermally connected to the side wall on the side surface of the current sensor 80, the heat dissipation of the current sensor 80 can be improved. When the first protrusion 74 or the second protrusion 75 is formed in the supply refrigerant flow path 71 or the discharge refrigerant flow path 72, the heat dissipation of the current sensor 80 can be further improved.

As described above, in the power conversion device 100 according to the second embodiment, both extending in the third and fourth directions and extending in the normal direction of the other surface of the heat sink 90, the side of the first side surface 90a in the cooling refrigerant flow path 73. In the portion of the cooling refrigerant flow path 73 on the side of the second side surface 90b, which extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink 90. It includes a discharged refrigerant flow path 72 to be connected, and a DC bus bar 52 electrically connected to the power module 10 and thermally connected to a side wall on the side of the first side surface 90a in the supply refrigerant flow path 71. , Provided on the side of the fourth side surface 90d of the supply refrigerant flow path 71 and the portion of the other surface of the heat sink 90 on the normal side, away from the surface on the side of the fourth side surface 90d of the supply refrigerant flow path 71. Since the power module 10 and the DC bus bar 52 are each provided with a separate cooling flow path, the increase in size is suppressed because the first protrusion 74 is provided, and the side wall of the supply refrigerant flow path 71 and the DC bus bar 52 are separated from each other. It is thermally connected to improve the heat dissipation of the DC bus bar 52, and by providing the first protrusion 74, the heat dissipation of the power module 10 can be made uniform regardless of the location of the cooling refrigerant flow path 73. can.

Further, the AC bus bar 50 is provided, which is electrically connected to the power module 10 and is thermally connected to the side wall on the side of the second side surface 90b in the exhaust refrigerant flow path 72, and is provided with a fourth in the exhaust refrigerant flow path 72. A second protrusion 75 is provided on the side of the side surface 90d and the portion of the other surface of the heat sink 90 in the normal direction so as to be separated from the surface on the side of the fourth side surface 90d of the discharged refrigerant flow path 72. Therefore, it is possible to suppress the increase in size without providing separate cooling channels for the power module 10 and the AC bus bar 50, and the side wall of the exhaust refrigerant flow path 72 and the AC bus bar 50 are thermally connected to the AC bus bar 50. By providing the second protrusion 75, the heat dissipation of the power module 10 can be made uniform regardless of the location of the cooling refrigerant flow path 73.

When the current sensor 80 is mounted on either one or both of the DC bus bar 52 and the AC bus bar 50, the magnitude of the current flowing through the DC bus bar 52 or the AC bus bar 50 on which the current sensor 80 is mounted can be easily measured. can do. Further, the DC bus bar 52 or the AC bus bar 50 on which the current sensor 80 is mounted is a side wall on the side of the first side surface or the side of the second side surface in the supply refrigerant flow path 71, or the first side surface in the discharge refrigerant flow path 72. When it is thermally connected to the side wall on the side of the current sensor 80 or the side wall on the side of the second side surface, the heat dissipation of the current sensor 80 can be improved. Further, when the first protrusion 74 or the second protrusion 75 is formed in the supply refrigerant flow path 71 or the discharge refrigerant flow path 72, the heat dissipation of the current sensor 80 can be further improved.

Embodiment 3.
The power conversion device 100 according to the third embodiment will be described. 8 is a cross-sectional view showing an outline of the power conversion device 100 according to the third embodiment, FIG. 9 is a plan view showing an outline of a main part of the power conversion device 100, and FIG. 10 is another power conversion according to the third embodiment. It is sectional drawing which shows the outline of the apparatus 100. FIG. 8 is a cross-sectional view of the power conversion device 100 cut at the DD cross-sectional position of FIG. FIG. 9 is a configuration diagram showing a part of the parts arranged in the housing 70 removed. FIG. 10 is a cross-sectional view of another power conversion device 100 cut at a position equivalent to the DD cross-sectional position of FIG. The power conversion device 100 according to the third embodiment has a configuration in which the first protrusion 74 is arranged at a position different from that of the first embodiment.

The first protrusion 74 is located on the side of the fourth side surface 90d of the supply refrigerant flow path 71 and the side of the other surface of the heat sink 90 in the normal direction on the side of the fourth side surface 90d of the supply refrigerant flow path 71. It is provided apart from the surface of. The first protrusion 74 is formed on the wall surface of the supply refrigerant flow path 71 perpendicular to the side wall of the supply refrigerant flow path 71 to which the condenser element 32, which is a heat generating member, is thermally connected. The first protrusion 74 includes a side wall to which the capacitor element 32 is thermally connected and a surface facing each other via a refrigerant, and a gap flow path 78 is formed between the side wall and the facing surface.

When the width of the supply refrigerant flow path 71 is uniform, the flow velocity of the refrigerant becomes slower on the side of the fourth side surface 90d, which is a location farther than the location near the refrigerant inlet 76 of the supply refrigerant flow path 71. By providing the first protrusion 74 on the side of the fourth side surface 90d where the flow velocity of the refrigerant becomes slow, the gap flow path 78 is formed, and the flow path of the refrigerant becomes narrow in the gap flow path 78, so that the gap flow path 78 The flow velocity of the refrigerant flowing through the is increased. By increasing the flow velocity of the refrigerant flowing through the gap flow path 78, the heat dissipation of the capacitor element 32 can be improved.

Further, the flow velocity of the refrigerant also increases in the flow path between the side wall of the supply refrigerant flow path 71 facing the side wall of the supply refrigerant flow path 71 to which the condenser element 32 is thermally connected and the first protrusion 74. .. Therefore, since the refrigerant stably flows to the cooling refrigerant flow path 73 regardless of the location far from or near the refrigerant inlet 76, the heat dissipation of the power module 10 should be uniform regardless of the location of the cooling refrigerant flow path 73. Can be done.

Further, in the present embodiment, the first protrusion 74 is formed on the wall surface of the supply refrigerant flow path 71 perpendicular to the side wall of the supply refrigerant flow path 71 to which the capacitor element 32 is thermally connected, but the first protrusion is formed. The arrangement of the part 74 is not limited to this. As shown in FIG. 10, the first protrusion 74 may have a side wall to which the capacitor element 32 is thermally connected and a surface facing each other via a refrigerant, and a gap flow path 78 may be formed. In FIG. 10, the first protrusion 74 is formed in an L shape and is arranged on the side wall of the supply refrigerant flow path 71 to which the condenser element 32 is thermally connected.

As described above, in the power conversion device 100 according to the third embodiment, the first protrusion 74 includes a surface facing the side wall of the supply refrigerant flow path 71 to which the capacitor element 32 is thermally connected via the refrigerant. Since the gap flow path 78 is formed between the side wall and the surface facing the side wall, the flow velocity of the refrigerant in the gap flow path 78 increases, and the flow velocity of the refrigerant flowing in the gap flow path 78 increases, so that the capacitor element 32 The heat dissipation can be improved. Further, the flow velocity of the refrigerant also increases in the flow path between the side wall of the supply refrigerant flow path 71 facing the side wall of the supply refrigerant flow path 71 to which the condenser element 32 is thermally connected and the first protrusion 74. Since the refrigerant flows stably to the cooling refrigerant flow path 73 regardless of the location far from or near the refrigerant inlet 76, the heat dissipation of the power module 10 can be made uniform regardless of the location of the cooling refrigerant flow path 73. can.

Embodiment 4.
The power conversion device 100 according to the fourth embodiment will be described. 11 is a cross-sectional view showing an outline of the power conversion device 100 according to the third embodiment, and FIG. 12 is a plan view showing an outline of a main part of the power conversion device 100. FIG. 11 is a cross-sectional view of the power conversion device 100 cut at the EE cross-sectional position of FIG. FIG. 12 is a configuration diagram showing a part of the parts arranged in the housing 70 removed. The power conversion device 100 according to the fourth embodiment includes a second protrusion 75 in addition to the power conversion device 100 shown in the first embodiment, and has a configuration in which the arrangement of the AC bus bar 50 is changed.

The second protrusion 75 is located on the side of the fourth side surface 90d of the exhaust refrigerant flow path 72 and the portion of the other surface of the heat sink 90 on the side in the normal direction of the fourth side surface 90d of the discharge refrigerant flow path 72. It is provided apart from the side surface. The AC bus bar 50, which is a heat generating member, is thermally connected to the side wall on the side of the second side surface 90b in the discharged refrigerant flow path 72. In the present embodiment, the AC bus bar 50 is attached to the outer wall of the side wall on the side of the second side surface 90b in the discharged refrigerant flow path 72 together with the terminal block 51 via the second heat radiating member 53.

According to this configuration, since the AC bus bar 50 is thermally connected close to the side wall of the discharge refrigerant flow path 72 through which the refrigerant flows, the AC bus bar 50 is further cooled by the refrigerant, and the heat dissipation of the AC bus bar 50 is improved. do. Further, the second protrusion 75 is formed on the side wall of the discharge refrigerant flow path 72 to which the AC bus bar 50 is thermally connected, and the area in contact with the refrigerant on the side wall to which the AC bus bar 50 is thermally connected increases. , The heat dissipation of the AC bus bar 50 can be further improved. Further, since the second protrusion 75 is separated from the surface on the side of the fourth side surface 90d of the discharged refrigerant flow path 72, the thickness of the side wall increases on the side of the fourth side surface 90d of the discharged refrigerant flow path 72. Since the area of the side wall in contact with the refrigerant is surely increased, the heat dissipation of the AC bus bar 50 can be improved. In addition, at least one of a DC bus bar, a reactor, a discharge resistance, a wiring member 13a and 13b for a power module, and a wiring member 34 for a capacitor, which are heat generating members, is further added to the side wall of the supply refrigerant flow path 71 or the discharge refrigerant flow path 72. It may be connected thermally.

As described above, in the power conversion device 100 according to the fourth embodiment, the AC bus bar 50, which is a heat generating member, passes through the second heat radiating member 53 on the outer wall of the side wall on the side of the second side surface 90b in the discharged refrigerant flow path 72. Since the AC bus bar 50 is thermally connected close to the side wall of the discharge refrigerant flow path 72 through which the refrigerant flows because it is attached together with the terminal block 51, the AC bus bar 50 is further cooled by the refrigerant, and the AC bus bar 50 is further cooled. The heat dissipation of the can be improved.

In the above, the power conversion device 100 has been described as an example of a power conversion device that outputs a three-phase alternating current. However, the power conversion device 100 may be various power conversion devices such as a DC-DC converter, and the capacitor module 30 may be provided in each part requiring smoothing, such as the output side connected to the load. good. Further, the capacitor module 30 is not limited to the power module 10, and may be, for example, a substrate provided with a semiconductor switching element.

The present application also describes various exemplary embodiments and examples, although the various features, embodiments, and functions described in one or more embodiments are those of a particular embodiment. It is not limited to application, but can be applied to embodiments alone or in various combinations.
Therefore, innumerable variations not exemplified are envisioned within the scope of the techniques disclosed herein. For example, it is assumed that at least one component is modified, added or omitted, and further, at least one component is extracted and combined with the components of other embodiments.

10 Power module, 11 Semiconductor element, 12 Wiring member for semiconductor element, 13a Wiring member for power module, 13b Wiring member for power module, 14 Conductive bonding material, 15 Mold resin, 16 Insulation member, 30 Condenser module, 31 Condenser case , 32 Condenser element, 33 Encapsulant, 34 Condenser wiring member, 35 Heat sink, 50 AC bus bar, 51 Terminal block, 52 DC bus bar, 53 Second heat sink member, 70 housing, 71 Supply refrigerant flow path, 72 Discharge refrigerant flow path, 73 Cooling refrigerant flow path, 74 1st protrusion, 74a Cooling fin, 75 2nd protrusion, 76 Refrigerator inlet, 77 Refrigerator outlet, 78 Gap flow path, 80 Current sensor, 90 Heat sink , 91 heat sink fins, 100 power converter

The power conversion device disclosed in the present application includes a power module having a semiconductor element, a rectangular plate-shaped heat sink in which one surface is thermally connected to the power module, and a heat sink along the other side of the heat sink. A cooling refrigerant flow path in which the refrigerant flows in the first second direction from the side of the first side surface to the side of the second side surface opposite to the first side surface, and the side of the first side surface of the cooling refrigerant flow path. Extends from the refrigerant inlet provided on the third side surface side of the heat sink in the third and fourth directions from the side of the third side surface toward the side of the fourth side surface opposite to the third side surface. Together , the supply refrigerant flow path extending in the normal direction of the other surface of the heat sink and connected to the side portion of the first side surface of the cooling refrigerant flow path and the side of the second side surface of the cooling refrigerant flow path. , From the refrigerant outlet provided on the third side surface, extends in the third and fourth directions and extends in the normal direction of the other surface of the heat sink to the portion on the side of the second side surface in the cooling refrigerant flow path. The discharged refrigerant flow path to be connected is electrically connected to the power module, and the side wall on the side of the first side surface or the side of the second side surface in the supply refrigerant flow path, or the first side wall in the discharged refrigerant flow path. A heating member thermally connected to the side wall of the side surface or the side of the second side surface is provided, and the supply refrigerant flow path is provided on the side of the fourth side surface and the side in the normal direction in the supply refrigerant flow path. A fourth protrusion of the exhaust refrigerant flow path is provided on the side of the fourth side surface and a portion of the discharge refrigerant flow path on the side in the normal direction, and a first protrusion provided apart from the surface on the side of the fourth side surface. It has one or both of the second protrusions provided apart from the side surface of the side surface.

Claims (6)

A power module with a semiconductor element and
A rectangular plate-shaped heat sink with one surface thermally connected to the power module,
A cooling refrigerant flow in which the refrigerant flows in the first second direction from the side of the first side surface of the heat sink toward the side of the second side surface opposite to the first side surface along the other surface of the heat sink. The road and
The side of the first side surface of the cooling refrigerant flow path is from the side of the third side surface to the side opposite to the third side surface from the refrigerant inlet provided on the side of the third side surface of the heat sink. Extends in the third and fourth directions toward the side of the fourth side surface of the heat sink, extends in the normal direction of the other surface of the heat sink, and is connected to a portion of the cooling refrigerant flow path on the side of the first side surface. Supply refrigerant flow path and
The side of the second side surface of the cooling refrigerant flow path extends in the third and fourth directions from the refrigerant outlet provided on the third side surface, and in the normal direction of the other surface of the heat sink. A discharge refrigerant flow path that extends and is connected to a portion of the cooling refrigerant flow path on the side of the second side surface.
Electrically connected to the power module, the side wall of the first side surface or the side of the second side surface of the supply refrigerant flow path, or the side of the first side surface of the discharge refrigerant flow path. Alternatively, a heat generating member thermally connected to the side wall on the side of the second side surface is provided.
A first protrusion provided on the side of the fourth side surface of the supply refrigerant flow path and the portion on the side in the normal direction so as to be separated from the surface of the supply refrigerant flow path on the side of the fourth side surface. , And a second side of the discharged refrigerant flow path provided on the side of the fourth side surface and the portion on the side in the normal direction away from the surface on the side of the fourth side surface of the discharged refrigerant flow path. A power converter having one or both of the protrusions. The power conversion device according to claim 1, wherein one or both of the first protrusion and the second protrusion are formed on a side wall to which the heat generating member is thermally connected. The power conversion device according to claim 2, wherein one or both of the first protrusion and the second protrusion are provided with one or more cooling fins. The power conversion according to claim 1, wherein one or both of the first protrusion and the second protrusion have a side wall to which the heat generating member is thermally connected and a surface facing each other via a refrigerant. Device. The power conversion device according to any one of claims 1 to 4, wherein the heat generating member is at least one of a smoothing capacitor, a DC bus bar, a reactor, a discharge resistance, and an AC bus bar. The power conversion device according to claim 5, wherein a current sensor is mounted on either one or both of the DC bus bar and the AC bus bar.

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