JP2022009083A - Cover tape and electronic component package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cover tape 10 with improved peel strength.

SOLUTION: A cover tape 10 is formed by laminating a base material layer 1, an intermediate layer 2, and a sealant layer 3 in this order. The sealant layer 3 is used to seal a carrier tape 20. The sealant layer 3 contains (A) a styrene resin and (B) a poly(meth)acrylic acid derivative. The styrene content in the component (A) is 15 mass% or more.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a cover tape and an electronic component package.

Electronic components such as semiconductor IC chips are packed in packaging materials to prevent contamination from the time they are manufactured until they are provided to the mounting process, and are stored in a state of being wound on paper or plastic reels. And be transported. A tape-shaped packaging material is used for packaging the electronic components so as to correspond to the mounting process on the substrate by the automatic mounting device, and the packaging material is placed on a long sheet at predetermined intervals. It is composed of a carrier tape having a plurality of concave storage pockets formed therein and a cover tape heat-sealed by the carrier tape. After the electronic components are housed in the storage pocket of the carrier tape, the cover tape as a lid material is laminated on the upper surface of the carrier tape, and both ends of the cover tape are continuously heat-sealed in the length direction with a heated seal bar. It is used as an electronic component package.

The conveyed electronic component package is carried to the mounting process on the semiconductor substrate, the cover tape is peeled off from the carrier tape, the stored electronic component is taken out, and the electronic component is mounted on the semiconductor substrate. Therefore, it is important that the cover tape is smoothly peeled off. Further, with the recent increase in high-speed mounting, the peeling speed of the cover tape has increased, and it is required to improve the peeling strength of the cover tape. For example, Patent Document 1 describes a predetermined thickness from the viewpoint of obtaining a cover tape in which the peel strength is not easily affected by the peel speed and the peel strength at the time of high-speed mounting does not increase abnormally even in the conventional peel strength management method. A cover tape containing a substrate layer having a tensile elastic modulus, a polystyrene-based resin, a polyethylene-based resin, and a fatty acid amide, and having a heat-sealing layer having a predetermined thickness and a tensile elastic modulus is disclosed.

Japanese Unexamined Patent Publication No. 2005-263257

However, in the above-mentioned technique described in Patent Document 1, when the cover tape is peeled off, the sealant layer of the cover tape stays on the carrier tape side, and peeling may occur between the sealant layer and the intermediate layer. As a result, it was not possible to sufficiently obtain high peel strength of the cover tape.

According to the present invention
A cover tape in which a base material layer, an intermediate layer, and a sealant layer are laminated in this order, and the carrier tape is sealed by the sealant layer.
The sealant layer contains the following components (A) and (B), and contains the following components (A) and (B).
(A) Styrene-based resin (B) Poly (meth) acrylic acid derivative A cover tape having a styrene content of 15% by mass or more in the component (A) is provided.

Further, according to the present invention,
Carrier tape containing electronic components and
The cover tape sealed from the sealant layer on the carrier tape, and
Electronic component packaging is provided.

According to the present invention, it is possible to obtain a cover tape having improved peel strength.

It is sectional drawing which shows typically the structure of the cover tape in this embodiment. It is a perspective view which shows an example of the state which the cover tape for electronic component packaging in this embodiment is sealed with a carrier tape. It is sectional drawing which shows typically the modification of the cover tape in this embodiment.

Hereinafter, embodiments will be described with reference to the drawings. In all the drawings, similar components are designated by a common reference numeral, and the description thereof will be omitted as appropriate. Further, the figure is a schematic view and does not necessarily match the actual dimensional ratio. Further, in the present embodiment, the composition may contain each component alone or in combination of two or more.

<Cover tape 10>
FIG. 1 schematically shows an example of a cover tape 10 (also simply referred to as “cover tape 10”) for packaging electronic components according to the present embodiment. As shown in FIG. 1, in the cover tape 10, the base material layer 1, the intermediate layer 2, and the sealant layer 3 are laminated in this order. That is, the sealant layer 3 is the outermost surface and constitutes one surface of the cover tape 10, whereby it can be in close contact with the carrier tape 20 described later.
In the present embodiment, the base material layer 1, the intermediate layer 2, and the sealant layer 3 all have substantially the same width and length, and exist without breaks or divisions.
Further, as shown in FIG. 2, the cover tape 10 is used for sealing the carrier tape 20 having a pocket 21 for accommodating electronic components. That is, the sealant layer 3 in the cover tape 10 is heat-sealed so as to be in contact with the carrier tape 20.

Hereinafter, aspects, materials, and the like of each layer of the cover tape 10 will be described below.

[Base material layer 1]
The material constituting the base material layer 1 is not particularly limited. Typically, a material having sufficient mechanical strength to withstand when the cover tape 10 is manufactured, when the cover tape 10 is adhered to the carrier tape, when an external force is applied, or the like is preferable. Further, a material having heat resistance sufficient to withstand the heat when the cover tape 10 is adhered to the carrier tape is preferable.
The form of the material constituting the base material layer 1 is preferably in the form of a film in terms of ease of processing.

Specific examples of the material constituting the base material layer 1 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin and the like. Be done.
Above all, a polyester resin is preferable from the viewpoint of improving the mechanical strength of the cover tape 10. Further, nylon 6 may be used as a material constituting the base material layer 1 from the viewpoint of improving the mechanical strength and / or flexibility of the cover tape 10.
Further, the base material layer 1 may contain an additive such as a lubricant.

The base material layer 1 may be only one layer or may have two or more layers (for example, the base material layer 1 may be formed of a multilayer film in which the above-mentioned materials are laminated).
The film used to form the base material layer 1 may be an unstretched film or a film stretched in the uniaxial direction or the biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, a film stretched in the uniaxial direction or the biaxial direction is preferable.

The thickness of the base material layer 1 is not particularly limited. The thickness of the base material layer 1 is preferably 5 μm or more, more preferably 10 μm or more. The thickness of the base material layer 1 is preferably 50 μm or less, more preferably 40 μm or less, and further preferably 30 μm or less.
When the thickness of the base material layer 1 is 50 μm or less, the rigidity of the cover tape 10 does not become too high. As a result, even when a torsional stress is applied to the carrier tape after sealing, the cover tape 10 easily follows the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape 10 from being unintentionally peeled off from the carrier tape.
When the thickness of the base material layer 1 is 5 μm or more, the mechanical strength of the cover tape 10 can be sufficiently good. Therefore, for example, even when the cover tape 10 is peeled off from the carrier tape at high speed, it is possible to prevent the cover tape 10 from breaking.

The total light transmittance of the base material layer 1 is preferably 80% or more, more preferably 85% or more.
By doing so, in the electronic component package composed of the cover tape 10 and the carrier tape, it is possible to secure the necessary transparency to the extent that it can be inspected whether or not the electronic component is correctly housed. In other words, by setting the total light transmittance of the base material layer 1 to 80% or more, it becomes easy to visually confirm the electronic components housed inside the package composed of the cover tape 10 and the carrier tape from the outside. ..
The total light transmittance can be measured according to JIS-K-7361.

[Intermediate layer 2]
The intermediate layer 2 is located between the base material layer 1 and the sealant layer 3, and can enhance the cushioning property, impact resistance, and the like of the cover tape 10.

Examples of the material forming the intermediate layer 2 include one or more selected from ethylene- (meth) acrylic acid ester copolymer, ethylene-vinyl acetate copolymer, polystyrene resin, and polyethylene. ..
Above all, from the viewpoint of improving the cushioning property of the entire cover tape 10, it is preferable to contain an ethylene- (meth) acrylic acid ester copolymer, an ethylene-vinyl acetate copolymer, polyethylene, and a polystyrene-based resin. As the polyethylene, low density polyethylene (LDPE) or linear low density polyethylene (L-LDPE) is more preferable.
Further, the intermediate layer 2 may contain various additives.

The thickness of the intermediate layer 2 is preferably 10 to 50 μm, more preferably 15 to 45 μm, and even more preferably 20 to 40 μm from the viewpoint of improving the cushioning property of the entire cover tape 10.

[Sealant layer 3]
The sealant layer 3 contains (A) a styrene resin and (B) a (meth) acrylic acid ester polymer. As a result, good heat sealability can be obtained.

(A) Styrene-based resin The styrene content in the (A) styrene-based resin is 15% by mass or more, preferably 20% by mass or more, and more preferably 30% by mass or more. On the other hand, the upper limit of the styrene content in the (A) styrene resin is not particularly limited, but is preferably 90% by mass or less, more preferably 80% by mass, from the viewpoint of maintaining the adhesion of the sealant layer 3. It is as follows.
In the cover tape 10 of the present embodiment, by setting the styrene content of the sealant layer 3 to the above lower limit value or more, the adhesion between the intermediate layer 2 and the sealant layer 3 can be improved, and the peel strength can be improved. The details of such a mechanism are not clear, but it is presumed that the affinity between the intermediate layer 2 and the sealant layer 3 is improved.
Here, the styrene content refers to the ratio (mass%) of the structural units derived from styrene contained in (A) the styrene-based resin. When the styrene-based resin (A) contains two or more kinds of copolymers, the average value of the styrene content of each is the styrene content of the styrene-based resin (A).

Examples of the styrene-based resin include (A-1) polystyrene, styrene- (meth) acrylate copolymer, styrene-olefin copolymer, hydrogenated styrene block copolymer, and impact-resistant polystyrene (HIPS; High Impact). Polystyrene), styrene-based polymers such as General Purpose Polystylerene (GPPS), and (A-2) styrene-based polymers, α-methylstyrene-based polymers, styrene- (α-methylstyrene) -based copolymers. , Styrene-aliphatic hydrocarbon-based copolymers, styrene- (α-methylstyrene) -aliphatic hydrocarbon-based copolymers, styrene-based oligomers such as styrene-aromatic hydrocarbon-based copolymers, and the like. , These may be used individually by 1 type, or may be used by mixing 2 or more types.
Among them, from the viewpoint of effectively improving the peel strength, it is preferable to contain a styrene- (meth) acrylate copolymer and / or a styrene-olefin copolymer.

The above-mentioned styrene-olefin copolymer is a copolymer having a unit derived from olefin and a unit derived from styrene. Specific examples of the olefin include monoolefins such as α-olefins such as ethylene, propylene and butene; and diolefins (conjugated diene) such as butadiene and isoprene.
The polymerization mode of the styrene-olefin copolymer is not limited, but the styrene-olefin copolymer is preferably a block copolymer from the viewpoint of improving the peel strength between the cover tape 10 and the carrier tape 20.

Examples of the styrene-olefin copolymer include a styrene / butadiene / styrene block copolymer (SBS), a styrene / ethylene / butadiene / styrene block copolymer (SEBS), and a styrene / isoprene / styrene block copolymer (SIS). ), Styrene / ethylene / propylene / styrene block copolymer (SEPS) and the like.

The styrene content in the styrene-olefin copolymer is preferably 15% by mass or more from the viewpoint of making the peel strength between the cover tape 10 and the carrier tape 20 more preferable with respect to the entire styrene-olefin copolymer. Yes, more than 20% by mass, more preferably 25% by mass or more. From the same viewpoint, the styrene content in the styrene-olefin copolymer is preferably 90% by mass or less, more preferably 85% by mass or less, based on the total styrene-olefin copolymer.

The content of the styrene resin (A) is preferably 5% by mass or more with respect to 100% by mass of the resin composition for forming the sealant layer 3 from the viewpoint of improving the peel strength between the cover tape 10 and the carrier tape 20. Yes, more preferably 8% by mass or more. From the same viewpoint, the content of the (A) styrene-based resin is preferably 90% by mass or less, more preferably 80% by mass or less, based on 100% by mass of the resin composition for forming the sealant layer 3. More preferably, it is 70% by mass or less.

When the styrene polymer of (A-1) is used among the styrene resins (A), the melt flow rate (MFR) at 200 ° C. and 5 kg is preferably 0.05 g / 10 min or more and 200 g / 10 min or less, which is preferable. Is 0.1 g / 10 min or more and 100 g / 10 min or less.
By setting the MFR to the above lower limit value or more, it becomes easy to improve the peel strength.
On the other hand, by setting the MFR to the above upper limit value or less, workability is improved and high peel strength can be stably obtained.
Here, the MFR of the (A) styrene resin is measured according to JIS-K-7210 under the conditions of 200 ° C. and 5 kg.

When the styrene-based oligomer of (A-1) is used among the styrene-based resins (A), the number average molecular weight is, for example, 300 or more and 5000 or less, preferably 500 or more and 3000 or less.

(B) Poly (meth) acrylic acid derivative The poly (meth) acrylic acid derivative of the component (B) is either (B-1) (meth) acrylic acid or (B-2) (meth) acrylic acid ester. A polymer containing either or both.
Examples of the (meth) acrylic acid of the component (B-1) include acrylic acid and methacrylic acid.
Examples of the (meth) acrylic acid ester of the component (B-2) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and (meth) acrylic. Examples thereof include those using one or more selected from isobutyl acid acid, hexyl (meth) acrylate, ethylhexyl (meth) acrylate and the like.

The poly (meth) acrylic acid ester polymer (B) may be a copolymer with another monomer as long as it does not correspond to the above-mentioned component (A). For example, one selected from the group consisting of ethylene-methyl (meth) acrylate copolymer, ethylene-ethyl (meth) acrylate copolymer, ethylene- (meth) acrylate copolymer and ethylene-vinyl acetate copolymer. Alternatively, it may be a copolymer containing two or more kinds.
The (meth) acrylic acid ester polymer contains, for example, 5% by mass or more, preferably 10% by mass or more, and more preferably 15% by mass, of structural units derived from the (meth) acrylic acid ester. It includes the above.

The content of the poly (meth) acrylic acid ester polymer (B) is 1% by mass or more, preferably 10% by mass or more, and more preferably 20% by mass with respect to 100% by mass of the resin composition for forming the sealant layer 3. It is mass% or more. On the other hand, the content of the (B) poly (meth) acrylic acid ester polymer may be 100% by mass, or 98% by mass or less, with respect to 100% by mass of the resin composition for forming the sealant layer 3. May be good. As a result, good adhesion resistance can be obtained.

The content [(A) / (B)] (weight ratio) of the component (A) with respect to the content of the component (B) is preferably 0.015 or more, more preferably 0.02 or more. preferable. On the other hand, [(A) / (B)] (weight ratio) is preferably 5 or less, and more preferably 4 or less.
By setting (A) / (B) to such a numerical range, the balance between peelability and adhesion can be improved.

The sealant layer 3 may further contain the following components.

(C) Antistatic agent The sealant layer 3 may contain an antistatic agent. This makes it possible to improve the antistatic ability.
Examples of the antistatic agent include those containing lithium ions. A polymer-type antistatic agent in which lithium ions are present in the resin can be used. As a result, excellent antistatic performance is continuously and stably exhibited.
Lithium ions can be contained in the antistatic agent in the form of, for example, a lithium salt. Examples of this lithium salt include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and pentafluoroethanesulfonic acid. Examples include lithium.

Lithium ions contained in the antistatic agent can be confirmed by measuring the amount of metal elements. The amount of lithium ions contained in the antistatic agent is preferably, for example, 50 μg / g or more (50 ppm or more).

Of course, as the antistatic agent, a known antistatic agent can be used in addition to the one containing lithium ions. In addition, those containing lithium ions and those not containing lithium ions can be used in combination.
Examples of the antistatic agent containing no lithium ion include the following.
-Polymer containing a polyether structure (for example, a polyamide-based copolymer such as a polyether ester amide, a block polymer of a polyolefin and a polyether, a polymer composed of polyethylene ether and a glycol), a carboxylic acid base-containing polymer such as a potassium ionomer, a fourth Grade ammonium base-containing polymers, etc.
-Metal fillers such as tin oxide, zinc oxide, and titanium oxide.
-Conductive polymers such as polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyacetylene, and polyaniline.
・ Conductive carbon

When the sealant layer 3 contains an antistatic agent, the amount thereof (total amount when two or more kinds are contained) is, for example, 1% by mass or more, preferably 5% by mass or more, more preferably 5% by mass or more, based on the entire sealant layer 3. It is 8% by mass or more, more preferably 10% by mass or more. Thereby, an appropriate antistatic ability can be obtained.
The content of the antistatic agent is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 80% by mass or less, and particularly preferably 70% by mass or less, based on the entire sealant layer 3. .. Antistatic agents are often expensive. Therefore, by setting the content of the antistatic agent in this way, the cost of manufacturing the cover tape 10 can be reduced.

-Adhesive-imparting agent The sealant layer 3 may contain a tackifier.
Examples of the tackifier include petroleum resin, rosin-based resin, terpene resin, styrene resin, and kumaron-inden resin. Of these, petroleum resin and styrene resin are preferable because of the difficulty of adhering electronic components, heat-sealing property to carrier tape, gas barrier property, and the like.
Examples of the petroleum resin-based tackifier include aliphatic petroleum resins, aromatic petroleum resins, and aliphatic aromatic copolymer petroleum resins. Commercially available products include hydrogenated petroleum resin manufactured by Arakawa Chemical Industry Co., Ltd. and the brand name "Arcon" series.

When a tackifier is used, one type may be used alone, or two or more types may be used in combination.
When the sealant layer 3 contains a tackifier, the lower limit of the content of the tackifier with respect to the entire sealant layer 3 is preferably 0.5% by mass or more from the viewpoint of making the sealing strength with the carrier tape suitable. More, more preferably 1% by mass or more.
Further, the upper limit of the content of the tackifier to the entire sealant layer is, for example, 5% by mass or less, specifically 4% by mass or less, from the viewpoint of difficulty in adhering electronic components and heat-sealing property to the carrier tape. Is.

-Other additive components In addition to the above components, the sealant layer 3 contains antiblocking agents, slip agents, lubricants, plasticizers, antioxidants, ultraviolet absorbers, colorants, surfactants, and inorganic substances, as long as the characteristics are not impaired. It may contain any additive such as a filler. And / or the surface of the sealant layer 3 may be subjected to these coating treatments.

Examples of the anti-blocking agent include silica, aluminosilicate (zeolite, etc.) and the like. By containing the anti-blocking agent in the sealant layer 3, blocking of the sealant layer 3 is alleviated.

Examples of slip agents include palmitate amide, stearate amide, behenic acid amide, oleic acid amide, erucic acid amide, oleyl palmido amide, stearyl palmido amide, methylene bisstearyl amide, methylene bisoleyl amide, ethylene bisoleyl amide, Examples thereof include various amides such as ethylene biserkaic acid amides, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, and hydrogenated castor oil. By containing the slip agent in the sealant layer 3, processability such as extrusion processing, roll-off property, film slip property and the like are improved.

The amount of other additive components in the sealant layer 3 may be appropriately adjusted according to the purpose of addition. Typically, it may be adjusted in the range of about 0.01 to 10% by mass with respect to the entire sealant layer 3.

The thickness of the sealant layer 3 is, for example, 0.01 to 30 μm, preferably 0.02 to 20 μm, more preferably 0.05 to 10 μm, and further preferably 0.1 to 5 μm.
When the thickness of the sealant layer 3 is 0.01 μm or more, sufficient sealing properties can be ensured.
When the thickness of the sealant layer 3 is 30 μm or less, the rigidity of the cover tape 10 does not become too high. As a result, even when a torsional stress is applied to the carrier tape after sealing, the cover tape 10 easily follows the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape 10 from being unintentionally peeled off from the carrier tape.
Further, since the thickness of the sealant layer 3 is 20 μm or less, there is an advantage that “bleeding out” of the melted resin during heat sealing can be suppressed.
The thickness of the sealant layer 3 is preferably 0.001 to 0.05, more preferably 0.002 to 0.03, based on the thickness of the entire cover tape 10.

[Other layers]
The cover tape 10 may include additional layers in addition to the above-mentioned layers.
For example, a reinforcing layer for increasing the mechanical strength of the cover tape 10 may be provided, or an adhesive layer may be present between the base material layer 1 and the intermediate layer 2 and / or between the intermediate layer 2 and the sealant layer 3. May be good.

[Reinforcing layer 4]
The cover tape 10 may further include a reinforcing layer 4 at an arbitrary position on the surface of the sealant layer 3 on the intermediate layer 2 side (see FIG. 3). By providing the reinforcing layer 4, the mechanical strength of the cover tape 10 can be further increased.

Specific examples of the material constituting the reinforcing layer 4 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin and the like. Be done.
Above all, a polyester resin is preferable from the viewpoint of improving the mechanical strength of the cover tape 10. Further, from the viewpoint of improving the mechanical strength and / or flexibility of the cover tape 10, a polyamide resin, particularly nylon 6, may be used as a material constituting the reinforcing layer 4.
Further, the reinforcing layer 4 may contain an additive such as a lubricant.

The reinforcing layer 4 may be located at any position as long as it is on the surface of the sealant layer 3 on the intermediate layer 2 side. In the cover tape shown in FIG. 3, the reinforcing layer 4 is located between the base material layer 1 and the intermediate layer 2, but the present invention is not limited to this. For example, the reinforcing layer 4 may be on the surface of the base material layer 1 opposite to the surface on the intermediate layer 2 side.

The reinforcing layer 4 may have only one layer or two or more layers (for example, the reinforcing layer 4 may be formed of a multilayer film on which the above-mentioned materials are laminated).
The film used to form the reinforcing layer 4 may be an unstretched film or a film stretched in the uniaxial direction or the biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, a film stretched in the uniaxial direction or the biaxial direction is preferable.

The thickness of the reinforcing layer 4 is not particularly limited. The thickness of the reinforcing layer 4 is preferably 5 μm or more, more preferably 10 μm or more. The thickness of the reinforcing layer 4 is preferably 50 μm or less, more preferably 40 μm or less, and further preferably 30 μm or less.
When the thickness of the reinforcing layer 4 is 50 μm or less, the rigidity of the cover tape 10 does not become too high. As a result, even when a torsional stress is applied to the carrier tape after sealing, the cover tape 10 easily follows the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape 10 from being unintentionally peeled off from the carrier tape.
When the thickness of the reinforcing layer 4 is 5 μm or more, the mechanical strength of the cover tape 10 can be sufficiently good. Therefore, for example, even when the cover tape 10 is peeled off from the carrier tape at high speed, it is possible to prevent the cover tape 10 from breaking.
The thickness of the reinforcing layer 4 may be the same as the thickness of the base material layer 1, but it is preferably thicker than the base material layer 1 from the viewpoint of effectively increasing the strength.

The total light transmittance of the reinforcing layer 4 is preferably 80% or more, more preferably 85% or more.
By doing so, in the electronic component package composed of the cover tape 10 and the carrier tape, it is possible to secure the necessary transparency to the extent that it can be inspected whether or not the electronic component is correctly housed. In other words, by setting the total light transmittance of the reinforcing layer 4 to 80% or more, it becomes easy to visually confirm the electronic components housed inside the package including the cover tape 10 and the carrier tape from the outside.
The total light transmittance can be measured according to JIS-K-7361.

[Adhesive layer]
As the material for forming the adhesive layer, for example, various known solvent-based or water-based anchor coating agents can be used. More specific examples of the anchor coating agent include isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based ones.

By performing corona treatment or plasma treatment on the base material layer 1, the adhesion between the base material layer 1 and another layer can be improved. The corona treatment or plasma treatment may be performed by appropriately selecting known conditions.

In addition, the cover tape 10 for packaging electronic components of the present embodiment may include a conductive layer (antistatic layer) in addition to the base material layer 1, the intermediate layer 2, and the sealant layer 3.

[Thickness, width, length of cover tape 10]
The thickness of the cover tape 10 is appropriately set, but is preferably 20 to 80 μm, more preferably 25 to 70 μm.
The width and length of the cover tape 10 can be appropriately set mainly according to the width and length of the carrier tape.
Typically, the width of the cover tape 10 is about 1 to 100 mm, and the length is about 100 to 30,000 m.

<Manufacturing method of cover tape 10>
The method for manufacturing the cover tape 10 of the present embodiment is not particularly limited. For example, it can be produced by applying a known extrusion method, laminating method, coating method, or the like.
As an example, the cover tape 10 of the present embodiment can be manufactured by an extrusion laminating method.

More specifically, the cover tape 10 of the present embodiment can be manufactured by the following procedures (1) to (4).
(1) A film corresponding to the base material layer 1 is prepared.
(2) A laminating agent is applied to one side of the film prepared in (1), and a layer corresponding to the intermediate layer 2 is formed on the laminating agent by an extrusion laminating method. As a result, a film having a two-layer structure of the base material layer 1 and the intermediate layer 2 is obtained.
(3) A layer corresponding to the sealant layer 3 is formed on the exposed surface of the two-layered film of (2) by a gravure coating method. As a result, a film having a three-layer structure is obtained.
(4) If necessary, the obtained three-layer film is cut to an appropriate length and width.

In the extrusion laminating of the step (2), a molten resin material is formed on one side of the film corresponding to the base material layer 1. Examples of the resin material include the resins mentioned in the above [Intermediate layer 2] column and various additives. When the resin material contains two or more kinds of materials, it is preferable that they are appropriately mixed (in a molten state) before film formation. The extrusion temperature in the step (2) may be appropriately adjusted. For example, it can be adjusted between 150 and 350 ° C.

<Electronic component packaging>
The electronic component package 100 can be obtained from the cover tape 10 described above and the carrier tape 20 in which the electronic component is housed in the pocket 21 (recess). This will be described with reference to FIG.

In FIG. 2, the cover tape 10 is used as a cover material for a band-shaped carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of an electronic component.
Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 10 and the carrier tape 20 will be referred to as an electronic component package 100.

The electronic component package 100 can be manufactured, for example, by the following procedure.
First, the electronic components are housed in the pocket 21 of the carrier tape 20.
Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 is brought into contact with the carrier tape 20 (that is, the heat seal is performed so that the "back surface" of the cover tape 10 in FIG. 2 is the sealant layer 3). By doing so, a structure (electronic component package 100) in which electronic components are hermetically sealed can be obtained.
The specific method and conditions of the heat seal are not particularly limited as long as the cover tape 10 adheres sufficiently strongly to the carrier tape 20. Typically, a known taping machine can be used, and the temperature can be set within the range of 100 to 240 ° C., a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

The material of the carrier tape 20 is not particularly limited as long as the cover tape 10 can be adhered by heat sealing, but is made of a resin such as a material containing polystyrene resin, a material containing polycarbonate resin, a material containing polyethylene terephthalate resin, or paper. Can be mentioned. Above all, it is preferably made of resin from the viewpoint of effectively improving the peel strength.
By heat-sealing the above-mentioned cover tape 10 to a carrier tape made of these materials to form an electronic component package, it is possible to further reduce the residual of the sealant layer on the carrier tape side.

The electronic component package 100 is wound on a reel, for example, and then transported to a work area where electronic components are mounted on an electronic circuit board or the like. The material of the reel can be metal, paper, plastic, or the like.

After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled off from the carrier tape 20 and the contained electronic component is taken out.

The electronic components housed in the electronic component package 100 are not particularly limited. Examples include all parts used in the manufacture of electrical and electronic devices such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like to the extent that the object of the present invention can be achieved are included in the present invention.

Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

<Raw materials>
(A) Styrene-based resin-Styrene-butadiene copolymer: Asahi Kasei Corporation, "Tough Tech H1221" (styrene content (PS ratio): 12%, MFR (230 ° C, 2.16 kg): 4.5 g / 10 minutes )
-Styrene-butadiene copolymer: Asahi Kasei Corporation, "Tough Tech H1062" (styrene content (PS ratio): 18%, MFR (230 ° C, 2.16 kg): 4.5 g / 10 minutes)
-Styrene-butadiene copolymer: Asahi Kasei Corporation, "Tough Tech H1041" (styrene content (PS ratio): 30%, MFR (230 ° C, 2.16 kg): 5 g / 10 minutes)
-Styrene-butadiene copolymer: Asahi Kasei Corporation, "Tough Tech H1517" (styrene content (PS ratio): 43%, MFR (230 ° C, 2.16 kg): 3 g / 10 minutes)
-Styrene-butadiene copolymer: Denka, "Clearlen 730L" (styrene content (PS ratio): 75%, MFR (200 ° C, 5 kg): 8 g / 10 minutes-Styrene oligomer: Mitsui Chemicals, " FTR8100 ”Molecular weight (Mn): 820
(B) Poly (meth) acrylic acid derivative ・ "A450A" manufactured by Dainippon Ink Co., Ltd.
(C) Antistatic agent-Tin oxide (T-1 manufactured by Mitsubishi Materials Corporation)
[Middle layer]
・ Sumitomo Chemical Co., Ltd., "Sumikasen L705" low density polyethylene (LDPE)
-Mitsui-DuPont Polychemical Co., Ltd., "Elvalois AC1820" EMA (ethylene-methyl acrylate copolymer resin)
[Reinforcing layer]
-Biaxially stretched polyester film (Toyobo Co., Ltd., product name: E5202)
-Biaxially stretched polyamide film (Toyobo Co., Ltd., product name: N1202)

<Manufacturing of cover tape 1>
(Examples 1 to 10, Comparative Examples 1 to 2)
A biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 μm was used as a base material layer, and a laminating agent (Mitsui Chemicals Co., Ltd., Takelac A-520) was applied thereto, and Table 1 shows. An intermediate layer (thickness 25 μm) was formed on the base material layer by laminating the resin as a raw material of the intermediate layer shown by an extrusion laminating method (extrusion temperature: 280 ° C.).
On the surface of the obtained laminated film on the intermediate layer side, 60% by mass (C) antistatic agent and 40% by mass of the formulation ((A) / (B)) shown in Table 1 are used to form the components (A) and the components. The sealant layer made of (B) was formed into a film having a thickness of 0.5 μm by a gravure coating method.
From the above, the cover tapes of each Example and Comparative Example were manufactured.

<Manufacturing of cover tape 2>
(Example 11)
A biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 μm is used as a base material layer, and a laminating agent (Takelac A-520 manufactured by Mitsui Chemicals Co., Ltd.) is applied thereto and shown in Table 1. An intermediate layer (thickness 40 μm) was formed on the base material layer by laminating the resin as a raw material of the intermediate layer by an extrusion laminating method (extrusion temperature: 280 ° C.).
On the surface of the obtained laminated film on the intermediate layer side, 60% by mass (C) antistatic agent and 40% by mass of the formulation ((A) / (B)) shown in Table 1 are used to form the components (A) and the components. The sealant layer made of (B) was formed into a film having a thickness of 0.5 μm by a gravure coating method.

(Example 12)
A biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 μm is used as a base material layer, and a laminating agent (Takelac A-520 manufactured by Mitsui Chemicals Co., Ltd.) is applied thereto and shown in Table 1. A reinforcing layer (thickness 16 μm) was formed on the base material layer by laminating the film to be the reinforcing layer by the dry laminating method. Further, a laminating agent (Takelac A-520 manufactured by Mitsui Chemicals, Inc.) was placed on the reinforcing layer (thickness 16 μm). An intermediate layer (thickness 25 μm) was formed on the reinforcing layer by coating and laminating the resin as a raw material of the intermediate layer shown in Table 1 by an extrusion laminating method (extrusion temperature: 280 ° C.).
On the surface of the obtained laminated film on the intermediate layer side, 60% by mass (C) antistatic agent and 40% by mass of the formulation ((A) / (B)) shown in Table 1 are used to form the components (A) and the components. The sealant layer made of (B) was formed into a film having a thickness of 0.5 μm by a gravure coating method.

(Example 13)
A biaxially stretched polyester film (Toyobo Co., Ltd., trade name: T6140) having a thickness of 12 μm was used as a base material layer, and a laminating agent (Mitsui Chemicals Co., Ltd., Takelac A-520) was applied thereto, and Table 1 shows. A reinforcing layer (thickness 15 μm) was formed on the base material layer by laminating the films to be the reinforcing layers shown by the dry laminating method. Further, a laminating agent (Takelac A-520 manufactured by Mitsui Chemicals, Inc.) is applied on this, and the resin used as the raw material of the intermediate layer shown in Table 1 is laminated by an extrusion laminating method (extrusion temperature: 280 ° C.). An intermediate layer (thickness 25 μm) was formed on the reinforcing layer.
On the surface of the obtained laminated film on the intermediate layer side, 60% by mass (C) antistatic agent and 40% by mass of the formulation ((A) / (B)) shown in Table 1 are used to form the components (A) and the components. The sealant layer made of (B) was formed into a film having a thickness of 0.5 μm by a gravure coating method.

<Evaluation / Measurement>
The following evaluations and measurements were performed using the cover tapes obtained in each Example and Comparative Example. The results are shown in Table 1.

[Peeling strength]
(Peeling strength against carrier tape)
The peel strength was evaluated according to a peel test conforming to JIS C 0806-3. The cover tape obtained by the above method has a width of 9.5 mm, and a carrier tape having a width of 12 mm (conductive polystyrene carrier tape, "CEL-E980A" manufactured by Sumitomo Bakelite Co., Ltd.) has a heat seal temperature of 180 ° C. The sample was prepared by heat-sealing using a heat-sealing machine under the conditions of iron size 0.4 mm width × 32 mm length, 2 rows, 4 times striking, a load of 1 kg, and a sealing time of 100 ms. With respect to the obtained sample, the peel strength (gf) when the cover tape was peeled from the carrier tape was measured under the conditions of a peeling speed of 300 mm / min, a peeling angle of 170 °, and a peeling time of 10 seconds.

[Tensile strength (breaking point load: MPa)]
The tensile strength was evaluated by a method according to JIS K6734.

1 Base material layer 2 Intermediate layer 3 Sealant layer 4 Reinforcing layer 10 Cover tape 20 Carrier tape 21 Pocket 100 Electronic component packaging.

Claims (9)

A cover tape in which a base material layer, an intermediate layer, and a sealant layer are laminated in this order, and the carrier tape is sealed by the sealant layer.
The sealant layer contains the following components (A) and (B), and contains the following components (A) and (B).
(A) Styrene-based resin (B) Poly (meth) acrylic acid derivative A cover tape having a styrene content of 15% by mass or more in the component (A). The cover tape according to claim 1, wherein the component (A) is (A-1) a styrene-based polymer or (A-2) a styrene-based oligomer. The cover tape according to claim 2, wherein the component (A-1) is a styrene-olefin copolymer. The cover tape according to claim 1 or 2, wherein the component (B) is a copolymer using the following components (B-1) and (B-2) and at least one of them.
(B-1) Acrylic acid or methacrylic acid (B-2) (meth) acrylic acid ester Ingredient (B-2) is methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, The cover tape according to claim 4, wherein the cover tape is one or more selected from ethylhexyl acrylate (meth). The cover tape according to any one of claims 1 to 5, wherein the content [(A) / (B)] of the component (A) is 0.015 or more with respect to the content of the component (B). The cover tape according to any one of claims 1 to 6, wherein the sealant layer further contains (C) an antistatic agent. The cover tape according to any one of claims 1 to 7, further comprising a reinforcing layer at an arbitrary position on the surface of the sealant layer on the intermediate layer side. Carrier tape containing electronic components and
The cover tape according to any one of claims 1 to 8, which is sealed from the sealant layer on the carrier tape.
Electronic component packaging.

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