JP2021535059A - 炭化ケイ素マトリックスにダイヤモンド粒子が埋め込まれた構造部品の製造方法 - Google Patents
炭化ケイ素マトリックスにダイヤモンド粒子が埋め込まれた構造部品の製造方法 Download PDFInfo
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- 239000002245 particle Substances 0.000 title claims abstract description 174
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 71
- 239000010432 diamond Substances 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 71
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 60
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- 238000000034 method Methods 0.000 claims abstract description 19
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
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Abstract
Description
a)炭化ケイ素をベースとする少なくとも一つの第1の材料を堆積させることであって、前記材料は、第1の層を得るために、後の部品の所望の幾何学的形状に対応するビーズの形態で堆積される;
b)第1の層の少なくとも一部の上に炭化ケイ素をベースとする少なくとも一つの第2の材料を堆積させ、前記材料は、第2の層を得るために、後の部品の所望の幾何学的形状に対応するビーズの形態で堆積される;
c)所望の成分が得られるまで工程a)およびb)を繰り返す;
ここで、炭化ケイ素をベースとする2つの材料のうちの少なくとも一つは、ダイヤモンド粒子、好ましくはナノダイヤモンド粒子、マイクロダイヤモンド粒子、およびそれらの混合物からなる群から選択されるものを含む。前記ナノダイヤモンド粒子は、好ましくは40〜160nm、特に50〜150nmの粒径を有し、前記マイクロダイヤモンド粒子は、好ましくは3〜300μm、より好ましくは4〜100μm、さらにより好ましくは30〜300μm、特に40〜100μmの粒径を有し、レーザー回折法によってそれぞれ測定される。代替的に好ましい実施形態では、マイクロダイヤモンド粒子は、3〜10μmおよび/または25〜45μmの粒径を有し、レーザー回折法によってそれぞれ測定される。
a)第1の層を得るために炭化ケイ素を含む第1スリップを堆積させ;
b)後の部品の所望の幾何学的形状に従って、第1の層の少なくとも一部を硬化させ;
c)第2の層を得るための炭化ケイ素を含む第2スリップを堆積させ;
d)後の部品の所望の幾何学的形状に従って、第2の層の少なくとも一部を、硬化させ;
e)所望の部品が得られるまで工程a)〜d)を繰り返す;
ここで、前記スリップの少なくとも一つは、ダイヤモンド粒子、好ましくはナノダイヤモンド粒子、マイクロダイヤモンド粒子、およびそれらの混合物からなる群から選択されるものをさらに含む。前記ナノダイヤモンド粒子は、好ましくは40〜160nm、特に50〜150nmの粒径を有し、前記マイクロダイヤモンド粒子は、好ましくは3〜300μm、より好ましくは4〜100μm、さらにより好ましくは30〜300μm、特に40〜100μmの粒径を有し、レーザー回折法によってそれぞれ測定される。代替的に好ましい実施形態では、マイクロダイヤモンド粒子は、3〜10μmおよび/または25〜45μmの粒径を有し、レーザー回折法によってそれぞれ測定される。
a)炭化ケイ素をベースとする第1の材料を堆積させ;
b)後の部品の所望の幾何学的形状に従って、バインダーを堆積させ;
c)任意にバインダーを乾燥させ;
d)炭化ケイ素をベースとする第2の材料を堆積させ;
e)後の部品の所望の幾何学的形状に従って、バインダーを堆積させ;
f)任意にバインダーを乾燥させ;および
g)所望の成分が得られるまで、工程a)〜f)を繰り返す;
ここで、炭化ケイ素をベースとする2つの材料のうちの少なくとも一つは、ダイヤモンド粒子、好ましくはナノダイヤモンド粒子、マイクロダイヤモンド粒子、およびそれらの混合物からなる群から選択されるものを含む。前記ナノダイヤモンド粒子は、好ましくは40〜160nm、特に50〜150nmの粒径を有し、前記マイクロダイヤモンド粒子は、好ましくは3〜300μm、より好ましくは4〜100μm、さらにより好ましくは30〜300μm、特に40〜100μmの粒径を有し、レーザー回折法によってそれぞれ測定される。
Claims (14)
- 添加剤製造方法を使用して部品を調整する方法であって、前記部品は、炭化ケイ素マトリックスに埋め込まれたダイヤモンド粒子を有し、前記製造方法は、炭化ケイ素をベースとする少なくとも一つの第1の材料の第1の層が堆積されるステップと、前記炭化ケイ素をベースとする少なくとも一つの第2の材料の第2の層が堆積される異なるステップと、を含み、炭化ケイ素をベースとする前記材料の少なくとも一つは、ダイヤモンド粒子を含むことを特徴とする、添加剤製造方法を使用して部品を調整する製造方法。
- 添加剤製造方法は、ステレオリソグラフィ(SL)、材料ジェッティング/ダイレクトインクプリンティング(DIP)、ダイレクトインクライティング(DIW)、ロボキャスティング(FDM)、バインダージェッティング(3DP)、選択的レーザー焼結、およびそれら方法の組み合わせからなる群から選択されることを特徴とする、請求項1に記載の製造方法。
- 前記炭化ケイ素をベースとする第1の材料と、前記炭化ケイ素をベースとする第2の材料とが、同一または異なるものであることを特徴とする、先行する請求項の1以上に記載の製造方法。
- 前記ダイヤモンド粒子は、ナノダイヤモンド粒子、マイクロダイヤモンド粒子、およびそれらの混合物からなる群から選択されるダイヤモンド粒子であり、前記ナノダイヤモンド粒子は、好ましくは40〜160nm、特に50〜150nmの粒径を有し、前記マイクロダイヤモンド粒子は、好ましくは3〜300μm、特に4〜100μmの粒径を有し、それぞれレーザー回折法によって測定される、先行する請求項の1以上に記載の製造方法。
- 前記製造方法が以下のステップを含み、
a)炭化ケイ素をベースとする第1の材料を堆積させ、
b)後の部品の所望の形状に従ってバインダーを堆積させ、
c)任意にバインダーを乾燥させ、
d)炭化ケイ素をベースとする第2の材料を堆積させ、
e)後の部品の所望の形状に従ってバインダーを堆積させ、
f)バインダーを任意に乾燥させ、
g)所望の部品が得られるまで、ステップa)〜f)を繰り返し、
炭化ケイ素をベースとする2つの材料のうちの少なくとも一つは、ダイヤモンド粒子を含む、先行する請求項の1以上に記載の製造方法。 - 前記少なくとも前記第1の材料および/または前記少なくとも前記第2の材料は、粉末の形態で堆積されることを特徴とする、請求項1〜5の一つ以上に記載の製造方法。
- 前記少なくとも前記第1の材料および/または前記少なくとも前記第2の材料は、スリップの形態で堆積されることを特徴とする、請求項1〜5の一つ以上に記載の製造方法。
- 前記部品は、好ましくは少なくとも一つの巨視的に構造化された表面、および/または内部構造を有することを特徴とする、請求項1〜7の1以上に記載の製造方法によって得られる部品。
- 請求項1〜7の1以上に記載の製造方法によって得られる部品であって、前記部品は、30〜80体積%、好ましくは40〜70体積%のダイヤモンド粒子の濃度を有することを特徴とする、請求項8に記載の部品。
- 前記ダイヤモンド粒子の粒径は、前記部品の総体積にわたって変化することを特徴とする、請求項8および9のいずれかまたは両方に記載の部品。
- 前記ダイヤモンド粒子は、ナノダイヤモンド粒子、マイクロダイヤモンド粒子、およびそれらの混合物からなる群から選択されるダイヤモンド粒子であり、前記ナノダイヤモンド粒子は、好ましくは40〜160nm、特に50〜150nmの粒径を有し、前記マイクロダイヤモンド粒子は、好ましくは3〜300μm、特に4〜100μmの粒径を有し、それぞれレーザー回折法によって測定されることを特徴とする、請求項8〜10の一つ以上に記載の部品。
- 添加物製造方法における炭化ケイ素マトリックスに埋め込まれたダイヤモンド粒子の使用。
- 前記ダイヤモンド粒子は、3〜300μm、好ましくは4〜100μm、および/または40〜160nm、好ましくは50〜150nmの粒径を有し、それぞれレーザー回折法によって測定されることを特徴とする、請求項12に記載の使用。
- 前記添加剤製造方法は、ステレオリソグラフィ(SL)、材料ジェッティング/ダイレクトインクプリンティング(DIP)、ダイレクトインクライティング(DIW)、ロボキャスティング(FDM)、バインダージェッティング(3DP)、選択的レーザー焼結、およびそれらの方法の組み合わせからなる群から選択されることを特徴とする、請求項12または13のいずれか一つまたは両方に記載の使用。
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