JP2021525656A - Rotating tool for polishing - Google Patents

Abstract

The present disclosure provides a rotary tool for polishing with replaceability and improved contact pressure. An exemplary polishing rotary tool includes a polishing assembly holder, a polishing assembly, and an elastic layer. The polishing assembly includes a polishing layer having a contact surface for polishing the surface of the substrate and a hard support layer that supports the polishing layer so as to keep the contact surface substantially flat during polishing against the surface of the substrate. And, including. The elastic layer is arranged between the shank and the polishing layer and is configured to compress during polishing of the substrate so as to increase the contact time of the contact surface with the substrate. An exemplary polishing rotary tool also includes a bonding layer configured to attach the polishing assembly to the polishing assembly holder. After a sufficient amount of wear, the polishing assembly is removed from the polishing assembly holder and replaced with another polishing assembly.

Description

The present invention relates to a rotary tool for polishing.

Handheld electronics such as touch screen smartphones and tablets often include a cover glass that provides durability and optical transparency to those devices. Cover glass manufacturing may use computer numerically controlled (CNC) machining for homogeneity and mass production of features within each cover glass. The edge finish around the cover glass is important for strength and aesthetic appearance. Typically, a diamond polishing tool, such as a metal bond diamond tool, is used to machine the cover glass. These tools can have a relatively long durability and can be effective at high cutting speeds. However, these tools can leave microcracks in the cover glass, which can become stress concentration points and significantly reduce the strength of the glass. Edges can be polished to improve the strength or appearance of the cover glass. For example, a polishing slurry such as cerium oxide is typically used to polish the glass cover. However, slurry-based polishing is slow and may require multiple polishing steps. In addition, slurry polishing equipment can be large, expensive and specific to the particular feature being polished. Overall, the slurry polishing system itself can reduce yields and create rounded corners of the substrate to be polished, increasing labor requirements.

The present disclosure is generally directed to rotary tools for polishing with improved contact pressure to the substrate. An exemplary polishing rotary tool includes a polishing assembly holder, a polishing assembly, and an elastic layer. The polishing assembly includes a rigid support layer and a polishing layer. The polishing layer has a contact surface configured to polish the surface of the substrate. The rigid support layer is configured to support the polished layer so that the contact surface remains substantially flat during polishing against the surface of the substrate. The elastic layer is arranged between the shank of the polishing assembly holder and the polishing layer, for example, between the shaft and the rigid support layer. The elastic layer is configured to compress during polishing of the substrate so that the contact time between the contact surface and the substrate can be increased. Polishing rotary tools do not use a rigid support layer proximal to the polishing layer and an elastic layer distal to the polishing layer. Can be added, with improved flatness, improved removal rate uniformity, and / or improved life. An exemplary polishing rotary tool also includes a bonding layer configured to attach the polishing assembly to the polishing assembly holder of the rotary tool. After a sufficient amount of wear, the polishing assembly is removed and replaced with another polishing assembly.

In one embodiment, the polishing rotary tool includes a polishing assembly holder, a polishing assembly, and an elastic layer. The polishing assembly holder includes a shank that defines the axis of rotation of the rotating tool. The polishing assembly includes a rigid support layer and a polishing layer. The rigid support layer has a Shore A hardness of more than about 90. The polishing layer has a contact surface. The elastic layer is arranged between the shank and the polishing layer. The elastic layer has a Shore A hardness of less than about 70.

In another embodiment, the polishing rotary tool includes a polishing assembly holder, a polishing assembly, and an elastic layer. The polishing assembly holder includes a shank that defines the axis of rotation of the rotating tool. The polishing assembly includes a rigid support layer and a polishing layer. The rigid support layer has a compressive modulus of more than about 1 GPa. The polishing layer has a contact surface. The elastic layer is arranged between the shank and the polishing layer. The elastic layer has an elastic modulus of less than about 0.1 GPa.

In another embodiment, the polishing system comprises a polishing rotary tool that includes a polishing assembly holder, a first polishing assembly, and a bonding layer. The polishing assembly holder includes a shank that defines the axis of rotation of the rotating tool. The first polishing assembly is coupled to the polishing assembly holder and includes a first rigid support layer and a first polishing layer having a first contact surface. The binding layer is arranged between the shank and the polishing layer. The polishing system further includes a second polishing assembly that includes a second rigid support layer and a second polishing layer having a second contact surface. The polishing system further includes a rotary tool changer configured to remove the first polishing assembly from the rotary tool and attach the second polishing assembly to the polishing assembly holder.

In another example, the assembly includes a computer controlled machining system including a computer controlled rotary tool holder and a substrate platform, a substrate secured to the substrate platform, and the polishing rotary tool described above.

In another embodiment, the method for polishing the substrate comprises providing a computer controlled machining system that includes a computer controlled rotary tool holder and a substrate platform. The method further comprises fixing the polishing rotary tool to the rotary tool holder of a computer controlled machining system. The polishing rotary tool includes a polishing assembly holder, a first polishing assembly, and a binding layer. The polishing assembly holder includes a shank that defines the axis of rotation of the rotating tool. The first polishing assembly is coupled to the polishing assembly holder and includes a first rigid support layer and a first polishing layer having a first contact surface. The binding layer is arranged between the shank and the polishing layer. The method further comprises manipulating a computer-controlled machining system to grind the contact surfaces of the substrate using the first grind assembly of the grind rotary tool. The method further comprises removing the first polishing assembly from the polishing assembly holder of the rotating tool for polishing and attaching the second polishing assembly to the polishing assembly holder of the rotating tool for polishing. The second polishing assembly includes a second rigid support layer and a second polishing layer having a second contact surface.

Details of one or more embodiments of the present disclosure will be given in the accompanying drawings and the following description. Other features, objectives, and advantages of the present invention will become apparent from the specification and drawings, as well as the claims.

Similar reference numerals in the figure indicate similar elements. Dotted lines indicate optional or functional components, and dashed lines indicate undisplayed components.

An assembly for polishing a substrate is shown.

The plan view of the cylindrical rotary tool for polishing a base material is shown.

The plan view of the conical rotary tool for polishing a base material is shown.

The side sectional view of the rotary tool for cylindrical polishing which polishes a base material along the x-axis is shown.

The side sectional view of the rotary tool for conical polishing which polishes a base material along the z-axis is shown.

Shows the cover glass of electronic components.

A side sectional view of a part of a base material having two chamfered corners is shown.

A side sectional view of a part of a base material having one chamfered corner and three 90 degree corners is shown.

A side sectional view of a polishing rotary tool having a replaceable polishing assembly for polishing a substrate is shown.

A side sectional view of a polishing rotary tool having a replaceable polishing assembly for polishing a substrate is shown.

A side sectional view of a polishing rotary tool having a replaceable polishing assembly for polishing a substrate is shown.

The plan view of the rotary tool for polishing which has a magnetic coupling mechanism is shown.

The plan view of the rotary tool for polishing which has a screw coupling mechanism is shown.

The side view of the polishing system which removes a 1st polishing assembly from a polishing assembly holder is shown.

The side view of the polishing system which attaches a 2nd polishing assembly to a polishing assembly holder is shown.

FIG. 5 is a flow chart illustrating an exemplary technique for polishing a substrate using a rotary tool and replacing the polishing assembly of the rotary tool.

It is the schematic of the experimental system for determining the peeling force measurement value of the coupling layer of a rotary tool for polishing.

It is a figure of a rotary tool for polishing having a removable flat polishing assembly bonded to a polishing assembly holder using a hook coupling mechanism.

It is a figure of a rotary tool for polishing having a detachable cylindrical polishing assembly bonded to a polishing assembly holder using a magnetic coupling mechanism.

9A is a view of the polishing rotary tool of FIG. 9A, in which the removable polishing assembly has been removed from the polishing assembly holder.

The present disclosure describes a polished article that provides an improved substrate shape.

In many cases, a rotating tool for polishing can be used to polish a particular surface of a component. Rotating tools for rigid polishing can show high variation in the application of pressure from the contact surface of the polishing layer of the rotating tool, which is the uneven polishing of the surface of the component due to the surface variation of the component. Can cause. To improve contact between the contact layer and the surface of the component, the polishing layer may have a compressible backing that allows the contact surface of the polishing layer to adapt to the surface of the component. Such familiarity may be desirable to provide rounded edges, but may not be desirable to provide flat edges. For example, the contact surface may apply greater pressure at the corners of the component's surface than the component's surface, resulting in a non-flat surface of the component.

As described herein, the polishing rotary tools of the present disclosure have improved contact during polishing of the substrate due to the more uniform flatness of the surface of the substrate, and the contact surface of the rotary tool. A flat contact surface with less wear can be provided. In one embodiment, the polishing rotary tool includes a shank, a polishing assembly, and an elastic layer. The polishing assembly includes a polishing layer and a rigid support layer. The polishing layer is configured to come into surface contact with the substrate and remove the material from the surface of the substrate. The rigid support layer is configured to support the polished layer so that the contact surface remains substantially flat during polishing against the surface of the substrate. For example, the rigid support layer can include a material having high hardness and / or low elasticity. The elastic layer is configured to compress during wear of the substrate so that the contact surface can have more uniform contact with the substrate. For example, the elastic layer can include a material having low hardness and / or high elasticity. The high rigidity of the rigid support layer and the high elasticity of the elastic layer can provide a rotary tool for polishing with a contact surface with reduced hysteresis along the axis of applied force while maintaining flatness.

In another embodiment, the polishing rotary tool, such as the polishing rotary tool described above, comprises a bonding layer disposed between the shank and the polishing layer. The bond layer can be configured to secure the polishing assembly to the tool and allow the polishing assembly to be removed for replacement with another polishing assembly. For example, after a set number of uses, the polishing assembly may be replaced with a new polishing assembly. The replaceability of the polishing assembly allows the operator to operate the rotary tool in such a way as to provide a more uniform polished substrate.

FIG. 1A shows an assembly 10 including a computer controlled machining system 12 and a machining system controller 14. The controller 14 is configured to send a control signal to the machining system 12 in order to machine, grind, or polish the base material 16 using the rotary tool 18 in the machining system 12, and the rotary tool 18 is a machine. It is mounted in the rotary tool holder 20 of the machining system 12. In one embodiment, the machining system 12 is capable of performing routing, turning, drilling, milling, grinding, polishing, and / or other machining operations, 3-axis, 4-axis, or 5 Representing a CNC machine, such as an axial CNC machine, the controller 14 commands the rotary tool holder 20 to perform machining, grinding, and / or polishing of the substrate 16 with one or more rotary tools 18. It may include a CNC controller to issue. The controller 14 may include a general purpose computer running software, and such a computer may be combined with a CNC controller to provide the functionality of the controller 14.

The base material 16 is attached to and fixed to the base material platform 22 so as to facilitate the precise machining of the base material 16 by the machining system 12. The base material holding fixture 24 fixes the base material 16 to the base material platform 22 and accurately positions the base material 16 with respect to the machining system 12. The substrate holding fixture 24 can also provide a reference position for the control program of the machining system 12. Although the techniques disclosed herein can be applied to workpieces made of any material, the substrate 16 may be a component for electronic devices. In some embodiments, the substrate 16 may be a display element for an electronic device, such as a cover glass for an electronic device, more specifically, a cover glass for a smartphone touch screen, for example, a transparent display element. For example, such a cover glass may include chamfered edges where a high degree of flatness and slope is desired.

In some embodiments, the substrate 16 has a first main surface 2 (eg, the top of the substrate 16), a second main surface 4 (eg, the bottom of the substrate 16), and one or more edges. It may include a surface 6 (eg, a side portion of the substrate 16). The area of the edge surface 6 of the base material 16 is typically smaller than the area of the first and / or second main surface of the base material 16. In some embodiments, the ratio of the edge surface 6 of the base material 16 to the area of the first main surface 2 of the base material 16 and / or the second main surface of the base material 16 of the edge surface 6 of the base material 16. The ratio to the area of 4 is greater than 0.00001, greater than 0.0001, greater than 0.0005, greater than 0.001, greater than 0.005, or even greater than 0.01; less than 0.1. , Less than 0.05, or even less than 0.02. In some embodiments, the thickness of the edge surface 6 measured perpendicular to the first main surface 2 and / or the second main surface 4 is 5 mm or less, 4 mm or less, 3 mm or less, 2 mm or less, Alternatively, it is 1 mm or less. The edge surface 6 intersects the first main surface 2 to form the first corner portion 3, and intersects the second main surface 4 to form the second corner portion 5. In some embodiments, the edge surface 6 may be substantially perpendicular to each of the main surfaces 2 and 4, while in other embodiments the edge surface 6 has two or more edges. Surfaces may be included and at least one of their two or more edge surfaces is not vertical (eg, chamfered edges). During polishing of the substrate 16, one or more edge surfaces 6 so that the first corner 3 and the second corner 5 can remain sharp and well-defined when the material is removed during polishing. May be polished. Further embodiments of the base material 16 will be described in FIGS. 1D-1E and 2A-2C below.

In the embodiment of FIG. 1A, the rotary tool 18 can be used to improve the surface finish of machined features of the substrate 16 such as holes and edge features in the cover glass. In some embodiments, separate rotary tools 18 can be used in succession to iteratively improve the surface finish of the machined features. For example, the assembly 10 is utilized to provide a coarser grinding process using a first rotary tool 18 or a set of rotary tools 18, followed by a second rotary tool 18 or a set of rotary tools 18. Can be used to provide a finer polishing process. In some embodiments, one rotary tool 18 can include a variety of different polishing levels to facilitate repeated grinding and / or polishing processes using a smaller number of rotary tools 18. Each of these embodiments has a machine feature of the substrate as compared to other embodiments that use only one grinding step to improve the surface finish of the feature within the substrate after machining. It is possible to shorten the cycle time of finishing and polishing of the base material after processing. In some embodiments, the substrate may remain fixed to the substrate holding fixture 24 throughout the iterations of the separate rotary tool 18.

In the embodiment of FIG. 1A, the assembly 10 includes a rotary tool changer 26. The rotary tool changer 26 and / or the machining system 12 may be configured to remove the used polishing assembly of the rotary tool 18 and install a new polishing assembly of the rotary tool 18. For example, a portion of a rotary tool 18 such as a polishing assembly holder may remain fixed to the rotary tool holder 20, while a rotary tool 18 such as a polishing assembly configured to polish the surface of the substrate 16. Other parts can be replaced. Further operations of the rotary tool changer 26 can be described with reference to FIGS. 5A-5B and 6 below.

In some embodiments, following grinding and / or polishing with the assembly 10, the substrate may be polished, for example, using a separate polishing system to further improve the surface finish. In general, the better the surface finish before polishing, the shorter the time required to achieve the desired surface finish after polishing. To polish the edges of the substrate 16 with the assembly 10, the controller 14 uses the rotary tool 18 with respect to one or more features of the substrate 16 as the rotary tool holder 20 rotates the rotary tool 18. The rotary tool holder 20 can be instructed to apply the polishing layer precisely. The command may include, for example, a command to precisely trace the contour of the feature portion of the base material 16 using one polishing rotary tool 18. The device 26 has a polishing layer for the rotating tool 18 to automatically replenish the polishing assembly / polishing layer of the rotating tool 18 or to partially or completely change the shape of the rotating tool 18. Contains a polishing assembly for.

According to the embodiments described herein, the polishing rotary tool 18 is configured to apply a uniform contact pressure to the surface of the substrate 16 over a period of time. The polishing rotary tool 18 includes a polishing assembly holder and a polishing assembly coupled to the polishing assembly holder. The polishing assembly holder includes a shank that defines the axis of rotation of the rotary tool 18. The polishing assembly includes a rigid support layer and a polishing layer having a contact surface configured to remove material from the substrate 16. The rigid support layer is configured to support the abrasive layer and maintain the contact surface of the abrasive layer in a substantially flat orientation during transmission of contact forces on the contact surface. The rotary tool 18 is an elastic layer arranged between a shank of a polishing assembly holder that receives one or more forces applied from the polishing machine and a polishing layer of the polishing assembly that applies contact pressure to the substrate through the contact surface. Is further included. The elastic layer is configured to compress during the transmission of contact forces on the contact surfaces. In this way, the rotary tool 18 can exhibit a contact surface that exhibits improved contact while maintaining flatness.

1B and 1C show exemplary rotary tools that can be used as the rotary tool 18 of FIG. 1A. FIG. 1B shows a cylindrical polishing rotary tool 30 for applying a force substantially perpendicular to the rotary shaft 46 of the rotary tool 30, and FIG. 1C shows a rotary tool 30 substantially relative to the rotary shaft 66 of the rotary tool 50. A rotary tool 50 for conical polishing for applying a force parallel to is shown. Cylindrical and conical polishing rotary tools are shown in FIGS. 1B and 1C, but other forms of polishing rotary tools may be used. For example, in order to apply a force from a flat contact surface, cylindrical polishing with a contact surface perpendicular to the axis of rotation, as shown in FIGS. 3A-3C, 4A-4B, and 5A-5B. Rotating tools can be used.

Referring to the embodiment of FIG. 1B, the rotary tool 30 includes a polishing assembly holder 32 and a polishing assembly 34. The polishing assembly holder 32 includes a shank 36 that defines the rotating shaft 46 of the rotary tool 30. The polishing assembly 34 is coupled to the polishing assembly holder 32, for example, through a permanent or non-permanent coupling mechanism (not shown). The polishing assembly 34 includes a rigid support layer 40 and a polishing layer 42. The polishing layer 42 includes a contact surface 44 that is substantially parallel (eg, within 5 degrees) to the axis of rotation 46. In the embodiment of FIG. 1B, the rotary tool 30 includes an elastic layer 38 disposed between the shank 36 and the polishing layer 42. The elastic layer 38 may be part of the polishing assembly holder 32 or the polishing assembly 34.

Referring to the embodiment of FIG. 1C, the rotary tool 50 includes a polishing assembly holder 52 and a polishing assembly 54. The polishing assembly holder 52 includes a shank 56 that defines the rotation axis 66 of the rotary tool 50. The polishing assembly 54 is coupled to the polishing assembly holder 52, for example, through a permanent or non-permanent coupling mechanism (not shown). The polishing assembly 54 includes a rigid support layer 60 and a polishing layer 62. The polishing layer 62 includes a contact surface 64 that forms an angle with the rotating shaft 66. In some embodiments, the angle between the contact surface 64 and the axis 62 is 5 degrees to 90 degrees, 5 degrees to 85 degrees, 5 degrees to 80 degrees, or even 5 degrees, as shown in FIG. 1C. It can be from degree to 70 degrees. In the embodiment of FIG. 1C, the rotary tool 50 includes an elastic layer 58 disposed between the shank 56 and the polishing layer 52. The elastic layer 58 may be part of the polishing assembly holder 52 or the polishing assembly 54.

FIG. 1D shows a side sectional view of a cylindrical polishing rotary tool 30 for polishing a base material 70 along the x-axis, as indicated by an arrow 78. The substrate 70 includes an edge surface 72 that intersects adjacent surfaces to form a first corner 74 and a second corner 76. The substrate 70 can be, for example, the outer edge of the cover glass. The rotary tool 30 rotates around the rotary shaft 46 and brings the contact surface 44 into contact with the base material 70 on the edge surface 72. A rotary tool holder (not shown), such as the rotary tool holder 20 of FIG. 1, is such that the rotary tool 30 applies contact pressure to the edge surface 72 of the substrate 70 with respect to the shaft 36, as indicated by the arrow 78. A force perpendicular to the rotating shaft 46 can be applied. When the contact surface 44 comes into contact with the edge surface 72, the elastic layer 38 allows the contact surface 44 to move in a direction (x-axis) substantially parallel to the applied force (eg, within 10 degrees). On the other hand, the contact surface 44 maintains a substantially flat orientation with respect to the edge surface 72 or, if an angle is desired, is compressed on one side of the elastic layer 38 and on the other side. It can be either extended. As a result, the contact surface 44 can evenly remove material from the edge surface 72 so that the corners 74 and 76 maintain their slope.

FIG. 1E shows a side sectional view of a conical polishing rotary tool 50 that polishes the base material 80 along the z-axis. The polishing rotary tool 50 includes a polishing assembly holder 52 including a shank 56 that defines the rotary axis 66 of the rotary tool 50, and a polishing assembly 54 including a rigid support layer 60 and a polishing layer 62. The substrate 80 includes a chamfered surface 82 that intersects adjacent surfaces to form a first corner 84 and a second corner 86. The base material 80 may be the inner edge of the cover glass, such as a hole. The rotary tool 50 rotates around the rotary shaft 66 and brings the contact surface 64 into contact with the base material 80 on the chamfered surface 82. A rotary tool holder (not shown), such as the rotary tool holder 20 of FIG. 1A, has a shaft 56, as indicated by the arrow 88, such that the rotary tool 50 applies contact pressure to the chamfered surface 82 of the substrate 80. A downward force can be applied to the. When the contact surface 64 comes into contact with the chamfered surface 82, the elastic layer 58 is compressed, allowing the contact surface 64 to move in a direction substantially parallel to the applied force (z-axis). The contact surface 64 maintains a substantially flat orientation with respect to the chamfered surface 82. As a result, the contact surface 64 can evenly remove the material from the chamfered surface 82.

The polishing assembly holders described herein, such as the polishing assembly holders 32 and 52, can be configured to be coupled to a polishing assembly such as the polishing assemblies 34 and 54. In some embodiments, the polishing assembly holder is directly bonded to the polishing assembly (ie, as described further in FIGS. 3-6) via a non-permanent bonding layer (eg, a magnetic bonding layer). Can share the same interface). In some embodiments, the polishing assembly holder can be indirectly attached to the polishing assembly via a bonding layer (eg, a thermosetting high-strength adhesive), an elastic layer, or another layer. The polishing assembly holder may also be configured to be coupled to a rotary tool holder such as the rotary tool holder 20 of FIG. 1A. For example, the shank of the polishing assembly holder may have a shape, surface, or other feature configured to attach to the rotary tool holder.

The polishing assembly holder described herein is a rotating tool, such as a rotational force around the axis of rotation of the shank and a directional force along at least one of the x-axis, y-axis, or z-axis. It may be configured to receive the force applied from the holder and transfer at least a portion of the applied force to the polishing assembly. In the embodiment of FIG. 1D, the shank 36 of the polishing assembly holder 32 receives a rotational force around the rotating shaft 46 and a force along the x-axis and transmits the rotational force and the x-axis force to the polishing assembly 34. In the embodiment of FIG. 1E, the shank 56 of the polishing assembly holder 32 receives a rotational force around the rotating shaft 66 and a force along the z-axis, and transmits the rotational force and the z-axis force to the polishing assembly 54.

The polishing assemblies described herein, such as the polishing assemblies 34 and 54, can be configured to be coupled to a polishing assembly holder such as the polishing assembly holders 32 and 52. In some embodiments, the polishing assembly can be attached directly to the polishing assembly holder, such as through a non-permanent bonding layer, whereas in other embodiments, the polishing assembly is indirectly attached to the polishing assembly holder. Can be combined.

The polishing assembly holder described herein is a polishing assembly that includes a rotational force around the axis of rotation of the shank and a directional force along at least one of the x-axis, y-axis, or z-axis. It may be configured to receive the force applied from the holder and transfer at least a portion of the applied force to the contact surface of the polishing assembly. In the embodiment of FIG. 1D, the polishing assembly 34 receives a rotational force around the rotating shaft 46 and a force along the x-axis via the elastic layer 38 and transmits the rotational force and the x-axis force to the contact surface 44. In the embodiment of FIG. 1E, the polishing assembly 54 receives a rotational force around the rotating shaft 66 and a force along the z-axis via the elastic layer 58, and transmits the rotational force and the z-axis force to the contact surface 64.

The rigid support layers described herein, such as the rigid support layers 40 and 60, are configured to support the polishing layers such as the polishing layers 42 and 62 in response to the contact pressure of the polishing assembly against the substrate. Can be done. The rigid support layer receives contact pressure from the abrasive layer, such as the pressure normally encountered during polishing of the substrate, resists deformation and substantially maintains flatness at the interface between the rigid support layer and the abrasive layer. By doing so, the polishing layer can be supported. In contrast, the elastic layers described herein, such as the elastic layers 38 and 58, can be configured to deform in response to the contact pressure of the polishing assembly against the substrate. The elastic layer can be deformed by receiving contact pressure from a rigid support layer, a bonding layer, or another layer forming an interface with the elastic layer, and compressing at least a part of the elastic layer.

In some embodiments, the rigid support layer and the elastic layer may each be composed of materials selected according to their softness. The softness of the material can correlate with the familiarity of the material, and in general, the softer the material, the higher the familiarity at a given contact pressure. Softness is represented by the various properties of each material of the rigid support layer and the elastic layer, and may be selected based on them. For example, softer materials have lower hardness materials (shown using any suitable hardness scale such as Shore A or Shore OO), materials with lower modulus, and higher compressibility. It can be a material (typically quantified by the Poisson's ratio or deflection of the material) or a material having a modified structure, such as containing a plurality of gas-containing substances such as foams.

In some embodiments, the rigid support layer and the elastic layer may each be composed of a material selected according to hardness. The hardness may represent the measured values of the rigid support layer and the elastic layer in response to the force. In some cases, separate scales for the rigid and elastic layers (eg, Shore A durometer for the elastic layer and Rockwell scale for the elastic layer) can be used to best measure hardness. In some embodiments, the rigid support layer has a sufficiently high hardness so that the rigid support layer does not substantially deform with respect to the substrate under normal operating conditions. In some embodiments, the rigid support layer may have a hardness greater than about 90 shore A, or greater than about 95 shore A. In some embodiments, the elastic layer has a sufficiently low hardness so that the elastic layer deforms with respect to the substrate under normal operating conditions. In some embodiments, the elastic layer is less than about 70 shore A, or less than about 50 shore A, or less than about 40 shore A, or less than about 30 shore A, or less than about 20 shore A, or about 10 shore A. May have less than hardness.

In some embodiments, the rigid support layer and the elastic layer may each be composed of materials selected according to the compressibility. Compressibility may represent a measure of the relative changes in the materials of a rigid support layer and an elastic layer in response to pressure, while the terms "compressible" or "non-compressible" are compressible. It may also refer to the material properties of. For example, the term "substantially incompressible" refers to a material having a Poisson's ratio greater than about 0.45. The compressibility of a material can be expressed as the specific pressure required to compress the material to a reference deflection (eg, 25% deflection). In some embodiments, the compressibility of the layer is determined by a compressive deflection test with ASTM D3574 or a modified version thereof when the layer is foam, and the layer is a flexible sponge such as a sponge or expandable rubber. When it is a state material, it can be measured by a compression deflection test with ASTM D1056.

In some embodiments, the compressibility of the elastic layer may be relatively high with respect to the operating conditions encountered during polishing. In some embodiments, the elastic layer has a compressibility of less than about 1.5 MPa (220 psi), less than about 1.1 MPa (160 psi), less than about 0.31 MPa (45 psi) at 25% deflection, and / or about. Less than 0.5, less than about 0.4, less than 0.3, or preferably about 0.1. It can have a Poisson's ratio of less than.

In some embodiments, the rigid support layer may be substantially incompressible, eg, the relative volume change of the material in response to contact pressure is less than 5%, less than 2%, less than 1%. , Less than 0.5%, or less than 0.2%.

In some embodiments, the rigid support layer and the elastic layer may each be composed of a material selected according to the elastic modulus. The modulus of elasticity (or modulus of rigidity) may represent a measure of the relative deformation (strain) of the materials of the rigid support layer and the elastic layer in response to pressure (stress), but may be "elastic" or "non-elastic". The term "elastic" may also refer to elastic material properties. For example, the term "substantially inelastic" refers to a material having a Poisson's ratio greater than about 0.45. The elastic modulus of a material can be expressed as tensile elastic modulus, Young's modulus, or elastic modulus. In some embodiments, the modulus of elasticity of the layer can be measured by standard test methods for Young's modulus, tangential modulus, and cord modulus according to ASTM E111-17.

In some embodiments, the rigid support layer has sufficiently low elasticity so that the rigid support layer does not substantially deform with respect to the substrate under normal operating conditions. In some embodiments, the rigid elastic layer may be substantially inelastic, for example, the relative volume change of the material in response to contact pressure is less than 5%, less than 2%, less than 1%. Less than 0.5% or less than 0.2%. In some embodiments, the rigid support layer is made of a 3D printed, embossed, or carved, virtually incompressible material that is patterned to provide the desired familiarity. NS. In some embodiments, the rigid support layer is at least one of aluminum 6061, 2011, or 2024, or a metal such as steel 4140, W1, or 01; a plastic such as nylon, polycarbonate, or acrylic; rubber or the like. including.

In some embodiments, the elastic layer has sufficiently high elasticity that the elastic layer compresses against the substrate under normal operating conditions. In some embodiments, the elastic layer has a Young's modulus of less than about 1.5 MPa (220 psi), less than about 1.1 MPa (160 psi), less than about 0.31 MPa (45 psi), and / or less than about 0.5. Less than about 0.4, less than 0.3, or preferably about 0.1. It can have a Poisson's ratio of less than. In some embodiments, the elastic layer comprises at least one of an elastomer, a fabric, a non-woven material, or a spring.

In some embodiments, the elastic layer may be composed of a material selected according to the elastic deformation. Elastic deformation can represent the ability of a material to recover to its original state after deformation. The material can be elastically deformable, eg, being deformed and then restored to its original state is substantially 100% (eg, 90% or more, 95% or more, 99% or more, 99). 5.5% or more, or 99.9% or more) is possible.

In some embodiments, the elastic layer may be composed of a material selected according to the relaxation modulus, eg, the stress relaxation modulus. The relaxed modulus may represent a measure of time-dependent viscous properties. In the present disclosure, the relaxation modulus is expressed as a percentage and is determined from the relaxation modulus vs. time curve resulting from a stress relaxation test using the following equation (eg, as measured using ASTM D6048). Will be done.

Relaxation modulus (%) = (Instantaneous modulus-Elastic modulus after relaxation for 2 minutes under constant compressive strain) / Momentary modulus x 100 In some embodiments, at least of the rigid support layer and the elastic layer. One has a relaxed modulus of less than 25%.

In some embodiments, the elastic layer may be configured with varying thicknesses. For example, the thickness of the elastic layer can correlate with the repulsive force or repulsive distance of the elastic layer, so that the elastic layer provides a specific range or moving distance with respect to the force generated or absorbed by the elastic layer. Can have elasticity. As an example, the elastic layer of a rotating tool for polishing for a base material having a relatively high flatness is larger than the elastic layer of a rotating tool for polishing targeting a base material having a relatively low flatness. It may be thinner, because the higher the flatness, the less compression or movement of the elastic layer can be. In some embodiments, the thickness of the elastic layer may be less than 3 mm, less than 2 mm, or less than 1 mm. In some embodiments, the elastic layer comprises at least one of an elastomeric, fabric, or non-woven material. Suitable elastomers include thermocurable elastomers such as nitrile, fluoroelastomer, chloroprene, epichlorohydrin, silicone, urethane, polyacrylate, EPDM (ethylene propylene diene monomer) rubber, SBR (styrene butadiene rubber), butyl rubber, etc. Nylon, polystyrene, polyethylene, polypropylene, polyester, polyurethane and the like can be mentioned. In some embodiments, the density of the elastic layer ^{is greater than 0.2 g / cm 3} , greater than 0.4 g / cm ³ , greater than 0.6 g / cm ³ , greater than 0.8 g / cm ³ , 0. greater than .85g / cm ^3, more than 0.9 g / cm ^3, more than 0.95 g / cm ^3, more than 1.0 g / cm ^3, more than 1.1 g / cm ^3, or even 1.2g / cm ³ may be greater than, less than 2.0 g / cm ^3, less than 1.8 g / cm ^3, less than 1.6 g / cm ^3, less than 1.4 g / cm ^3, or even 1.2 g / cm ³ It may be less than.

The elastic layer may also be formed from a variety of materials having one or more of the properties described above. In some embodiments, the elastic layer is one or more of a foam, carved, structured, 3D printed or embossed elastomer, fabric or non-woven layer, or soft rubber. Can include. Suitable foams include, for example, synthetic or natural foams, thermoformed foams, polyurethanes, polyesters, polyethers, filled or grafted polyethers, viscoelastic foams, melamine foams, polyethylene, crosslinked polyethylenes, etc. It can be an open cell or closed cell, including polypropylene, silicone, ionomer foam, and the like. The elastic layer also includes, for example, isoprene, neoprene, polybutadiene, polyisoprene, polychloroprene, natural rubber, nitrile rubber, polyvinyl chloride and nitrile rubber, ethylene-propylene copolymers such as EPDM (ethylene propylene diene monomer), and butyl rubber ( For example, foamed elastomers and vulture rubbers containing (isoprene-isoprene copolymer) can be mentioned. In some embodiments, the elastic layer comprises various compressible structures. For example, the elastic layer may include any suitable compressible structure such as springs, non-woven fabrics, fabrics, air bladder and the like. In some embodiments, the elastic layer may be 3D printed to provide the desired Poisson's ratio, compressibility, and elastic response. In some embodiments, the density of the elastic layer ^{is greater than 0.2 g / cm 3} , greater than 0.25 g / cm ³ , greater than 0.3 g / cm ³ , greater than 0.35 g / cm ³ , 0. it exceeds .4g / cm ^3, more than 0.45 g / cm ^3, or even 0.50 g / cm ³ and even may exceed; ³ less than 1.2 g / cm, less than 1.0g / cm ^3, 0. Less than 95 g / cm ^3, less than 0.90 g / cm ^3, less than 0.85 g / cm ^3, less than 0.80 g / cm ^3, less than 0.75 g / cm ³ , or even less than 0.70 g / cm ^3. You may.

The polishing layers described herein, such as the polishing layers 42 and 62, include contact surfaces such as the contact surfaces 44 and 64. The contact surface is configured to contact and polish one or more surfaces of the substrate. Polishing may include grinding, polishing, and any other action of removing material from the substrate. As will be appreciated by those skilled in the art, contact surfaces can be formed according to a variety of methods, including, for example, molding, extrusion, embossing, and combinations thereof.

The polishing layer is not particularly limited and may include, but is limited to, conventional coated abrasives and structured abrasives (eg, 3M TRIZACT ABRASIVE available from 3M Company (St. Paul, Minnesota)). Not done. The polishing layer may include a base layer (eg, a backing layer) and a contact layer. The base layer can be formed from a polymeric material. For example, the base layer can be formed from a thermoplastic resin such as polypropylene, polyethylene or polyethylene terephthalate, a thermosetting resin such as polyurethane or epoxy resin, or any combination thereof. The base layer may include any number of layers. The thickness of the base layer (ie, the dimensions of the base layer perpendicular to the first and second main surfaces) is less than 10 mm, less than 5 mm, less than 1 mm, less than 0.5 mm, less than 0.25 mm, less than 0.125 mm. Alternatively, it may be less than 0.05 mm.

In some embodiments, the contact surface of the abrasive layer comprises a microstructured surface. The microstructured surface may include microstructures configured to increase the contact pressure of the contact surface onto one or more surfaces of the substrate. In some embodiments, the microstructured surface may include multiple cavities spaced apart between the outermost abrasives of the abrasive layer. For example, the shape of the cavity is cubic, cylindrical, prismatic, hemispherical, rectangular parallelepiped, pyramidal, truncated pyramidal, conical, truncated cone, crossed, arcuate or columnar with a flat bottom surface. Alternatively, it can be selected from a large number of geometric shapes such as a combination thereof. Alternatively, some or all of the cavities may have an irregular shape. In various embodiments, one or more of the sidewalls or inner walls forming the cavity may be perpendicular to the top of the main surface, or may taper in either direction (ie, the cavity). A taper is formed towards the bottom or the top of the cavity (towards the main surface). The angle at which the taper is formed may range from about 1 to 75 degrees, about 2 to 50 degrees, about 3 to 35 degrees, or about 5 to 15 degrees. The height, or depth, of the cavity can be at least 1 micron, at least 10 microns, or at least 500 microns, or at least 1000 microns; less than 10 mm, less than 5 mm, or less than 1 mm. The heights of the cavities may be the same, or one or more of the cavities may have a height different from any number of other cavities. In some embodiments, the cavities can be arranged in rows and columns in which the cavities are aligned. In some cases, one or more rows of cavities may be directedly aligned with adjacent rows of cavities. Alternatively, one or more rows of cavities may be offset from adjacent rows of cavities. In a further embodiment, the cavities can be arranged in a spiral, spiral, corkscrew or grid pattern. In a further embodiment, the complex may be arranged in a "random" sequence (ie, rather than a tissue pattern).

In some embodiments, the microstructured surface of the contact surface comprises a plurality of precision molded abrasive complexes. "Precision-shaped polishing composite" refers to a polishing composite having a molding shape that is the reverse of the mold cavity, which is held after the polishing composite is removed from the mold, preferably this composite. As described in US Pat. No. 5,152,917 (Pieper et al.), The entire body of which is incorporated herein by reference, the abrasive layer projects beyond the exposed surface of its shape before it is used. Substantially free of abrasive particles. The plurality of precision-shaped polishing composites may include a combination of polishing particles and a resin / binder that forms a fixed abrasive. In some embodiments, the contact surface 70 may be formed as a two-dimensional abrasive, such as a polishing sheet having a layer of abrasive particles held backed by one or more resins or other binder layers. Alternatively, the contact surface may be formed as a three-dimensional abrasive such as a resin or other binder layer, the three-dimensional abrasive containing abrasive particles dispersed therein and by a molding or embossing process. , Formed into a three-dimensional structure (forming a microstructured surface), eg, the resin is then cured, crosslinked, and / or crystallized to solidify and maintain the three-dimensional structure. The three-dimensional structure may include a plurality of precision-shaped polishing complexes. In any embodiment, the contact surface can include a polishing complex, which has an appropriate height and / or polishing that allows the polishing complex to wear during use or finishing. It has a height suitable for exposing a new layer of particles. The polishing layer may include a three-dimensional, textured, soft fixed polishing structure containing a plurality of precision shaped polishing complexes. The precision-shaped polishing composites may be arranged in an array that forms a three-dimensional, textured, soft fixed polishing structure. The polishing layer may include a patterned polishing structure. The TRIZACT patterned abrasives available from 3M Company (St. Paul, Minnesota) and the abrasive layers available under the trade names of TRIZACT diamond tile abrasives are exemplary patterned abrasives. The patterned polishing layer comprises a monolithic row of polishing composites that are precisely arranged and manufactured from dies, molds, or other techniques.

The shape of each precision-shaped polishing complex can be selected according to a specific application (for example, the material of the work piece, the shape of the work surface, the shape of the contact surface, the temperature, and the material of the resin phase). The shape of each precision-shaped polishing composite can be any useful shape, such as a cube, cylinder, prism, right parallel hexahedron, pyramid, pyramid, cone, hemisphere, cone, cross, or It may have a columnar cross section with a distal end. The complex weapon may have, for example, three, four, five, or six faces. The cross-sectional shape at the bottom of the polishing complex may differ from the cross-sectional shape at the distal end. The transition between these shapes may be smooth and continuous or may occur through discontinuous steps. The precision-shaped polishing composite may also be a mixture of various shapes. The precision-shaped polishing composites may be arranged in rows, spirals, spirals, or grids, or may be randomly arranged. The precision-shaped polishing complex can be constructed with a design intended to guide the flow of fluid and / or facilitate the removal of chips.

The precision-shaped polishing composite can be placed in a predetermined pattern or in a predetermined position within the polishing layer. For example, when the polishing layer is made by providing a polishing / resin slurry between the backing and the molding die, the predetermined pattern of the precision shaped polishing composite is considered to correspond to the pattern of the molding die. Therefore, the pattern can be reproduced from the polishing layer to the polishing layer. The predetermined pattern may be in a certain arrangement or configuration, which is intended to form an array in which the complex is designed, eg, aligned rows and columns, or alternating rows and columns. ing. In another embodiment, the polishing complexes can be arranged in a "random" arrangement or pattern. This means that the complex is not a regular array of rows and columns as described above. However, it is understood that this "random" arrangement is a predetermined pattern in that the position of the precision shaped polishing complex is predetermined and corresponds to the molding die.

The abrasive material forming the contact surface of the abrasive layer may contain a polymer material such as a resin. In some embodiments, the resin phase may comprise a cured or curable organic material. The curing method is not important and may include, for example, curing via energy such as ultraviolet light or heat. Examples of suitable resin phase materials include, for example, amino resins, alkylated urea formaldehyde resins, melamine-formaldehyde resins, alkylated benzoguanamine-formaldehyde resins, acrylate resins (including acrylates and methacrylates), phenol resins, urethane resins, and Epoxy resin can be mentioned.

Examples of abrasive particles suitable for the abrasive layer include cubic boron nitride, molten aluminum oxide, ceramic aluminum oxide, heat-treated aluminum oxide, white molten aluminum oxide, black silicon carbide, green silicon carbide, titanium diboride, boron carbide, Includes silicon nitride, tungsten carbide, titanium carbide, diamond, cubic boron nitride, hexagonal boron nitride, alumina zirconia, iron oxide, ceria, garnet, molten alumina zirconia, and abrasive particles derived from alumina-based solgel. The alumina abrasive particles may contain a metal oxide modifier. The diamond and cubic boron nitride abrasive particles may be single crystal or polycrystalline. Other examples of suitable inorganic abrasive particles include silica, iron oxide, chromia, ceria, zirconia, titania, tin oxide, gamma alumina and the like. The polishing particles may be polishing aggregate particles. Abrasive agglomerate particles typically include a plurality of abrasive particles, binders, and optional additives. The binder may be organic or inorganic. The abrasive agglomerates may have a random shape or may have a predetermined shape associated with them.

In some embodiments, the abrasive layer containing the resin, abrasive particles, and any additional additives dispersed in the resin may be a coating on a rigid support layer. In some specific embodiments, the polishing layer may be formed from a polishing complex layer deposited on the base layer, and the base layer may include a primer layer between the polishing complex layer and the base layer. The base layer itself may be arranged so as to cover a backing layer such as a rigid support layer or an elastic layer, and the base layer is fixed to the backing layer with an adhesive.

In various embodiments, the rotary tools for polishing described herein may be suitable for grinding the edges or main surfaces of cover glass. For example, the cover glass can include various surfaces, for which the surface has a high degree of flatness (ie, surface flatness) and a high degree of inclination between the surfaces (ie, the angle between the surfaces). Sharpness) is desired. FIG. 2A shows a cover glass 100, which is a cover glass for electronic devices such as mobile phones, personal music players, or other electronic devices. In some embodiments, the cover glass 100 may be a component of a touch screen for electronic devices. The cover glass 100 may be an alumina silicate glass having a thickness of less than 1 mm, but other compositions having a thickness of less than 5 mm, less than 4 mm, less than 3 mm, or even less than 2 mm are also possible.

The cover glass 100 includes a first main surface 102 facing the second main surface 104. Usually, but not always, the main surfaces 102, 104 are flat surfaces. The edge surface 106 follows the peripheral portions of the main surfaces 102 and 104, and the peripheral portions include rounded corner portions 108. The edge surface 106 intersects the first main surface 102 at the first corner, intersects the second main surface 104 at the second corner, and the first and second corners are generally based. It extends around the entire circumference of the material.

In order to improve the resistance to cracks and the appearance, the surface of the cover glass 100 including the main surfaces 102, 104 and the edge surface 106 needs to be smoothed to a practical range during the manufacture of the cover glass 100. There is. In addition, as disclosed herein, a polishing rotary tool (eg, the polishing rotary tool described with respect to FIGS. 1A-1E) is provided prior to polishing with a polishing layer having polish grade abrasive particles. In use, a CNC machine may be used to reduce edge surface roughness such as corners of the edge surface 106 and the corners of the edge surface 106 formed at the intersections of the main surfaces 102, 104. While this intermediate grinding process can reduce the polishing time of the polishing process, which results in the desired surface finish quality of the cover glass 80, it can also provide more precise dimensional control in the manufacture of the cover glass 100. The particle size of the fine-grade abrasive particles may be larger than the particle size of the polishing-grade abrasive particles.

FIG. 2B shows an exemplary edge portion 110 of a cover glass, such as the cover glass 100 of FIG. 2A. The edge portion 110 includes a first main surface 114 facing the second main surface 116. The edge surface 112 intersects the first main surface 114 at the first corner surface 118 and intersects the second main surface 116 at the second corner surface 120. The polishing rotary tools described herein, such as the polishing rotary tools 30 and 50 of FIG. 1, have an edge surface 112 (similar to the cylindrical polishing rotary tool 30) and (similar to the conical polishing rotary tool 50). To) one of the first corner surface 118 and the second corner surface 120, or the first main surface 114 and the second main surface (similar to a cylindrical polishing rotary tool having a bottom contact surface). At least one of 116 can be configured to be polished to a high degree of flatness and / or slope.

FIG. 2C shows an exemplary edge portion 130 of a cover glass, such as the cover glass 100 of FIG. 2A. The edge portion 130 includes a first main surface 134 facing the second main surface 136. The edge surface 132 intersects the first main surface 134 at the first corner surface 138 and intersects the second main surface 116 at the second corner. The polishing rotary tools described herein, such as the polishing rotary tools 30 and 50 of FIG. 1, include an edge surface 132 (similar to the cylindrical polishing rotary tool 30) and a conical polishing rotary tool 50. At least one of a square surface 120, or one of a first main surface 134 and a second main surface 136 (similar to a cylindrical polishing rotary tool with a bottom contact surface). Can be configured to polish to a high degree of flatness and / or slope.

In various embodiments, the polishing assembly disclosed herein may be removable from the polishing rotary tool holder. For example, when a polishing rotary tool polishes the surface of one or more substrates, the contact surfaces of the abrasive layer may wear and become less effective, which may result in longer polishing times and / or of the substrate. It can result in non-uniform material removal from the surface. However, other components of the polishing rotary tool, such as shanks, can have a significantly longer life than the life of the polishing layer. The replaceable abrasive layer may take some time to replace and may not be uniformly applied to the surface of the rotary tool and / or may not be removed from the surface of the rotary tool. For example, in addition to manually aligning and applying the polishing layer, the mounting surface for mounting the polishing layer may require cleaning.

In order to maintain a contact surface having a high and / or uniform material removal rate, the polishing rotary tool disclosed herein is removed from the polishing assembly holder of the polishing rotary tool and attached to the polishing assembly holder. It may include a removable polishing assembly that can be. The removable polishing assembly can be replaced more quickly and can have a more uniformly applied polishing layer as compared to a rotating tool for polishing that utilizes a replaceable polishing layer.

The polishing rotary tool disclosed herein may include a coupling layer disposed between the shank of the polishing rotary tool and the polishing layer of the polishing rotary tool. The bond layer can be placed at various positions between the shank of the rotating tool for polishing and the polishing layer.

FIG. 3A shows a side sectional view of a polishing rotary tool 200 having a replaceable flat polishing assembly 204 for polishing a substrate by a contact surface 214. The polishing assembly 204 includes a polishing layer 212 and a rigid support layer 210 coupled to the polishing layer 212. The polishing assembly 204 is coupled to the polishing assembly holder 202 via the bonding layer 216. In the embodiment of FIG. 3A, the polishing assembly holder 202 includes a shank 206 and an elastic layer 208. The rigid support layer 210 can provide rigid support to the polishing layer 212 so that the polishing assembly 204 can have a substantially flat contact surface during polishing. Further, since the polishing assembly 204 contains few components, the polishing assembly 204 can be manufactured at low cost.

FIG. 3B shows a side sectional view of a polishing rotary tool 220 having a replaceable flat polishing assembly 224 for polishing the substrate by the contact surface 234. The polishing assembly 224 includes a polishing layer 232, an elastic layer 228, and a rigid support layer 230 coupled to the polishing layer 232 and the elastic layer 228. The polishing assembly 224 is coupled to the polishing assembly holder 222 via the bonding layer 236. In the embodiment of FIG. 3B, the polishing assembly holder 222 includes a shank 226. Similar to FIG. 3A above, the rigid support layer 230 can provide rigid support to the polishing layer 232 such that the polishing assembly 224 may have a substantially flat contact surface 234 during polishing. Further, the polishing assembly 224 may include an elastic layer 228 so that the elastic layer 228 can be replaced with the replacement of the polishing assembly 224.

FIG. 3C shows a side sectional view of a polishing rotary tool 240 having a replaceable flat polishing assembly 244 for polishing a substrate by a contact surface 254. The polishing assembly 244 includes a polishing layer 252 coupled to the rigid support layer 250. The polishing assembly 244 is coupled to the polishing assembly holder 242 via a bonding layer 256. In the embodiment of FIG. 3C, the polishing assembly holder 242 includes a shank 246 and at least a portion of the bond layer 256. The elastic layer 248, which is a component of the polishing assembly 244, can provide compressible support to the polishing layer 252 such that the polishing assembly 244 may have a substantially familiar contact surface 254 during polishing. .. Further, since the polishing assembly 244 includes the elastic layer 248, the elastic layer 248 can be replaced with the replacement of the polishing assembly 244.

The bond layer may be configured to non-permanently bond the polishing assembly to the polishing assembly holder. The non-permanent coupling mechanism can be an interconnect coupling mechanism (eg, threading), or any coupling mechanism that utilizes a non-interconnect range of peeling pressure or force (eg, magnetic force). In some embodiments, the non-permanent coupling mechanism may allow the polishing assembly to be removed from the polishing assembly holder without damaging at least one of the polishing assembly and the polishing assembly holder. The bonding layer uses various bonding mechanisms for bonding the polished assembly to the polished assembly holder, such as an adhesive mechanism (eg, an adhesive), a magnetic mechanism (eg, a magnet), and a mechanical mechanism (eg, a screw). be able to. In some embodiments, the bond layer comprises at least one of a mechanical bond layer such as a magnetic bond layer, an adhesive bond layer, and a hook and loop bond layer, or a thread bond layer. The binding layer may include two or more portions so that each of the polishing assembly and the polishing assembly holder can include a portion of the bonding layer. For example, a rotary tool for polishing may include a magnetic coupling layer containing a magnet, and a rigid support layer contains a ferromagnetic material. In this embodiment, the ferromagnetic material may include at least one of ferromagnetic steel and ferromagnetic stainless steel.

In some embodiments, such as rotary tools that utilize a magnetic or adhesive bonding mechanism, the bonding layer may have an associated peeling pressure or force. The peeling pressure or force of the bond layer may represent a predetermined pressure or force or range of pressure or force that can be applied to the rotating tool to remove the polishing assembly from the polishing assembly holder. In some embodiments, the peeling pressure or force may be calibrated to exceed the maximum force experienced during polishing so that the polishing assembly does not come off due to the operating force experienced on a regular basis. In some embodiments, the peeling pressure or force may be calibrated below the maximum force capacity of the polishing machine so that the polishing assembly is removed with a force below the maximum force. In some embodiments, the binding layer has a peeling pressure of about 70 kPa to about 10 MPa. Further consideration of the peeling pressure can be seen, for example, in FIG. 7 below.

In some embodiments, such as rotary tools that utilize mechanical bonding mechanisms, the bonding layer may have an associated bonding sequence. The binding sequence may have an associated set of one or more steps for removing and / or attaching the polishing assembly. For example, a rotary tool utilizing a screw coupling mechanism may have a coupling sequence that includes a counterclockwise rotational force or torque for removing the polishing assembly and a clockwise rotational force or torque for attaching the polishing assembly. ..

FIG. 4A shows a plan view of a polishing rotary tool 300 having a magnetic coupling mechanism. The polishing rotary tool 300 includes a polishing assembly holder 302 and a polishing assembly 304. The polishing assembly holder 302 includes a shank 306 that defines the axis of rotation of the rotary tool and an elastic layer 308. The polishing assembly 304 includes a rigid support layer 310 and a polishing layer 312 having a contact surface 314. The elastic layer 308 is arranged between the shank 306 and the magnetic coupling layer 316.

In the embodiment of FIG. 4A, the magnetic coupling layer 316 is configured to couple to the rigid support layer 310. For example, the magnetic coupling layer 316 may be a magnet, and the rigid support layer 310 may be a ferromagnetic material. The rigid support layer 310 does not limit the peeling force applied downward, and the rotation stop gap of the magnetic coupling layer 316 is provided so that the polishing assembly 304 can remain fixed while the polishing assembly 304 is subjected to a rotational force. A rotation stop 320 configured to fit into the 318 may be included. In some embodiments, the magnetic coupling layer 316 may be a permanent magnet, whereby the peeling pressure of the magnetic layer 316 can be relatively constant with respect to the particular material of the polishing assembly 304. In some embodiments, the magnetic coupling layer 316 is a non-permanent magnet, such as an induction magnet, so that the polishing assembly 304 can be removed from the polishing assembly holder 302 by removing the current from the magnetic coupling layer 316. May be good.

FIG. 4B shows a plan view of a polishing rotary tool 320 having a screw coupling mechanism. The polishing rotary tool 320 includes a polishing assembly holder 322 and a polishing assembly 324. The polishing assembly holder 322 includes a shank 326 that defines the axis of rotation of the rotary tool 320, a screw coupling layer 336, and an elastic layer disposed between the shank 326 and the screw coupling layer 336. The threaded bond layer 336 includes a female thread 338. The polishing assembly 324 includes a rigid support layer 330 and a polishing layer 332 having a contact surface 334. The rigid support layer 330 includes a male screw 340.

In the embodiment of FIG. 4B, the threaded bond layer 336 is configured to bond to the rigid support layer 330 of the polishing assembly 324. The male thread 340 of the rigid support layer 330 can be engaged with the female thread 338 of the thread coupling layer 336, whereby the polishing assembly 324 can be coupled to the polishing assembly holder 322 via the thread coupling layer 336. For example, the female screw 338 and the male screw 340 may be configured in a direction opposite to the intended rotation direction of the rotary tool 320.

In some embodiments, a rotary tool changer can be used to attach and remove the polishing assembly described herein from the polishing assembly holder. The rotary tool changer can be configured according to the coupling mechanism of the polishing rotary tool, eg, the coupling sequence, or the peeling pressure or pressure range. Therefore, various coupling mechanisms such as adhesive mechanisms (eg, adhesives), magnetic mechanisms (eg, magnets), and mechanical mechanisms (eg, screws or mechanical "quick connect") are used by rotary tool changers. , The polishing assembly can be attached and detached. For example, in the case of a rotary tool utilizing a screw coupling mechanism such as the rotary tool 320 of FIG. 4B, the rotary tool changer removes the first polishing assembly by loosening the screw of the first polishing assembly, and the second polishing assembly is removed. It can be configured to attach a second polishing assembly by screwing in the polishing assembly. As another example, in the case of a rotary tool utilizing a magnetic coupling mechanism such as the rotary tool 300 of FIG. 4A, the rotary tool changing device applies a force larger than the peeling magnetic force of the magnetic coupling layer to perform the polishing assembly. It can be configured to be removed.

5A and 5B show a polishing system 416 including a rotary tool changer 412. The rotary tool changer 412 can be configured to replace the polishing assembly from the polishing assembly holder 402. In the embodiment of FIGS. 5A and 5B, the rotary tool changing device 412 receives the first rotary tool 400A, removes the first polishing assembly 404A from the polishing assembly holder 402 of the first rotary tool 400A, and removes the second polishing assembly 404A. The polishing assembly 404B may be attached to the polishing assembly holder 402 to form a second polishing rotary tool 400B.

In the embodiments of FIGS. 5A and 5B, the rotary tool changer 412 includes a first fixed device 414A and a second fixed device 414B (collectively referred to as "fixed device 414"), but in other embodiments. , The rotary tool changer may include a larger or smaller number of fixed devices 414. The first fixing device 414A may be configured to fix the first polishing assembly 404A in order to remove the first polishing assembly 404A from the polishing assembly holder 402, while the second fixing device 414B may be configured to fix the first polishing assembly 404A. The second polishing assembly 404B may be configured to secure the second polishing assembly 404B for attachment to the polishing assembly holder 402.

FIG. 5A shows a side view of the polishing system 416 that removes the first polishing assembly 404A from the polishing assembly holder 402. The first polishing assembly 404A is coupled to the polishing assembly holder 402 via the bonding layer 410 to form the first polishing rotary tool 400A. The first polishing assembly 404A includes a first rigid support layer and a first contact surface. The polishing assembly holder 402 includes a shank 406, a bond layer 410, and an elastic layer 408 disposed between the shank 406 and the bond layer 410. The shank 406 may be attached to a rotary tool holder (not shown) such as the rotary tool holder 20 of FIG. 1A. In the embodiment of FIG. 5A, the first fixation device 414A is shown to anchor the first polishing assembly 404A so that the polishing assembly 404A can be removed from the polishing assembly holder 402. For example, the rotary tool holder fixing shank 406 can pull the polishing assembly holder 402 from the fixing device 414A.

FIG. 5B shows a side view of the polishing system 416 that attaches the second polishing assembly 404B to the polishing assembly holder 402. The second polishing assembly 404B is coupled to the polishing assembly holder 402 via the bonding layer 410 to form the second rotary tool 400B. The second polishing assembly 404B includes a second rigid support layer and a second contact surface. In the embodiment of FIG. 5B, the second fixing device 414B is shown to release the second polishing assembly 404B to remove the second rotary tool 400B from the rotary tool changer 412. The rotary tool changer can be configured to facilitate the change of any of the polishing assembly embodiments of the present disclosure.

FIG. 6 is a flowchart showing an exemplary technique for polishing a substrate. The technique of FIG. 6 is described with reference to the operator-operated assembly 10 of FIG. 1A, but other assemblies and operating subjects may be used. The operator prepares a computer-controlled machining system 12 including a computer-controlled rotary tool holder 20 and a substrate platform 22 (500). The operator fixes the polishing rotary tool to the rotary tool holder 20 of the computer-controlled machining system 12 (510). As described herein, the polishing rotary tool includes a first polishing assembly that is attached to the polishing assembly holder via a non-permanent bonding layer.

The operator operates the computer-controlled machining system 12 via, for example, a controller 14 so as to polish one or more surfaces of the substrate (520), such as the substrate 16 of FIG. 1A, with a rotary tool for polishing. .. The operator can operate the computer-controlled machining system 12 to continue polishing other substrates until the threshold associated with the polishing assembly of the rotating tool for polishing is reached. The threshold may include a set number of substrates, a set operating time of the polishing assembly, a set removal rate, or any other measurable parameter related to wear of the contact surface of the polishing assembly. In some embodiments, the threshold may be related to the type of polishing of the substrate. For example, once a coarse level of polishing is completed for a particular substrate, a finer level of polishing can be initiated, so that another polishing assembly corresponding to the finer level of polishing can be attached.

Upon reaching the threshold, the operator can remove the first polishing assembly from the polishing assembly holder of the polishing rotary tool (530). For example, the operator operates at least one of the rotary tool changers such as the rotary tool holder 20 and / or the rotary tool changer 26 to secure the first polishing assembly and remove force or disconnect sequence. Can be applied to remove the first polishing assembly from the polishing assembly holder.

In response to removing the first polishing assembly, the operator can attach the second polishing assembly to the polishing assembly holder of the polishing assembly (540). For example, the operator operates at least one of the rotary tool holder 20 and / or the rotary tool changer 26 to bring the polishing assembly holder into contact with the second polishing assembly and apply a mounting force or coupling sequence. The second polishing assembly can be attached to the polishing assembly holder.

In another embodiment, the present disclosure provides a method of polishing a substrate, comprising a multi-step process involving two or more polishing tools for polishing the substrate. This method utilizes one computer-controlled machining system, and those polishing tools can be used sequentially. Polishing tools typically have different polishing properties. That is, the polishing layer of each polishing tool has different polishing properties, resulting in a slower removal rate step after a faster removal rate step, and a slower removal rate step than the substrate surface roughness after a faster removal rate step. It can provide low substrate surface roughness. The polishing properties of the tool can be adjusted, for example, by replacing the polishing assembly with a coarser contact surface or larger polishing with a polishing assembly with a finer contact surface or smaller polishing. The substrate to be polished can be maintained in a computer controlled machining system during machining, changing the polishing assembly and / or the corresponding polishing parameters. Keeping the substrate in the tool improves efficiency because it does not need to be removed from the machine, reattached, and realigned in the second machine to which the second polishing step is applied. Further, by keeping the polishing assembly holder in the machine, it is not necessary to replace the components of the rotating polishing tool that are not worn, so that the efficiency can be improved and the waste can be reduced.

Selected embodiments of the present disclosure include, but are not limited to:
In the first embodiment, the present disclosure is a rotary tool for polishing.
A polishing assembly holder with a shank that defines the axis of rotation of the rotating tool for polishing,
The polishing assembly is equipped with,
A rigid support layer with a Shore A hardness of over 90 and
A polishing layer with a contact surface and
Provided is a rotary tool for polishing, which comprises an elastic layer arranged between a shank and a polishing layer and having an elastic layer having a shore A hardness of less than about 70.
In a second embodiment, the present disclosure provides the rotary tool for polishing according to the first embodiment, wherein the elastic layer has a shore A hardness of less than about 50.
In a third embodiment, the present disclosure provides the polishing rotary tool according to the first or second embodiment, further comprising a coupling layer disposed between the shank and the polishing layer.
In a fourth embodiment, the present disclosure provides a rotary tool for polishing according to a third embodiment, wherein the bonding layer has a peeling pressure of about 70 kPa to about 10 MPa.
In a fifth embodiment, the present disclosure provides a rotary tool for polishing according to a third or fourth embodiment, in which an elastic layer is arranged between a shank and a binding layer.
In a sixth embodiment, the present disclosure provides the rotary tool for polishing according to a third or fourth embodiment, in which the elastic layer is arranged between the coupling layer and the rigid support layer.
In a seventh embodiment, the present disclosure provides the polishing rotary tool according to a third or fourth embodiment, in which the elastic layer is arranged between the rigid support layer and the polishing layer.
In an eighth embodiment, the present disclosure comprises a third to seventh bond layer comprising at least one of a hook-and-loop bond layer, a magnetic bond layer, an adhesive bond layer, and a mechanical bond layer. The polishing rotary tool according to any one of the embodiments is provided.
In a ninth embodiment, the present disclosure provides the rotary tool for polishing according to the eighth embodiment, wherein the magnetic coupling layer comprises a magnet and the rigid support layer comprises a ferromagnetic material.
In a tenth embodiment, the present disclosure provides the rotary tool for polishing according to a ninth embodiment, wherein the ferromagnetic material comprises at least one of ferromagnetic steel and ferromagnetic stainless steel.
In the eleventh embodiment, the present disclosure describes the polishing according to any one of the first to tenth embodiments, wherein the elastic layer comprises at least one of an elastomer, a fabric, a non-woven material, or a spring. Provide rotary tools for use.
In a twelfth embodiment, the present disclosure provides a rotary tool for polishing according to any one of the first to eleventh embodiments, wherein the rigid support layer comprises at least one of metal or plastic. do.
In a thirteenth embodiment, the present disclosure provides the polishing rotary tool according to any one of the first to twelfth embodiments, wherein the contact surface of the polishing layer includes a microstructured surface.
In a fourteenth embodiment, the present disclosure provides the polishing rotary tool according to the thirteenth embodiment, wherein the contact surface comprises a plurality of precision-shaped polishing complexes.
In a fifteenth embodiment, the present disclosure provides a rotary tool for polishing according to any one of the first to fourth embodiments, wherein the elastic layer has a relaxation modulus of less than 25%.
In a sixteenth embodiment, the present disclosure provides the polishing rotary tool according to any one of the first to fifteenth embodiments, wherein the contact surface of the polishing layer is parallel to the rotation axis of the rotary tool. do.
In a seventeenth embodiment, the present disclosure describes any one of the first to fifteenth embodiments, wherein the angle between the contact surface of the polishing layer and the axis of rotation is 5 to 90 degrees. A rotary tool for polishing is provided.
In the eighteenth embodiment, the present disclosure is a rotary tool for polishing.
A polishing assembly holder with a shank that defines the axis of rotation of the rotating tool for polishing,
Polishing assembly
A rigid support layer with a compressive elastic modulus exceeding about 1 GPa,
A polishing assembly comprising a polishing layer having a contact surface,
Provided is a rotary tool for polishing, which comprises an elastic layer arranged between a shank and a polishing layer and having an elastic modulus of less than about 0.1 GPa.
In a nineteenth embodiment, the present disclosure provides the rotary tool for polishing according to the eighteenth embodiment, wherein the elastic layer has an elastic modulus of less than 0.01 GPa.
In a twentieth embodiment, the present disclosure provides the polishing rotary tool according to the eighteenth or nineteenth embodiment, further comprising a coupling layer disposed between the shank and the polishing layer.
In a twenty-first embodiment, the present disclosure provides the rotary tool for polishing according to the twentieth embodiment, wherein the bonding layer has a peeling pressure of about 70 kPa to about 10 MPa.
In a twenty-second embodiment, the present disclosure provides the rotary tool for polishing according to the twentieth or twenty-first embodiment, in which the elastic layer is arranged between the shank and the binding layer.
In the 23rd embodiment, the present disclosure provides the rotary tool for polishing according to the 20th or 21st embodiment, in which the elastic layer is arranged between the coupling layer and the rigid support layer.
In a twenty-fourth embodiment, the present disclosure provides the polishing rotary tool according to the twentieth or twenty-first embodiment, in which the elastic layer is arranged between the rigid support layer and the polishing layer.
In a twenty-fifth embodiment, the present disclosure relates to the twentieth to twenty-fifth, wherein the bond layer comprises at least one of a hook-and-loop bond layer, a magnetic bond layer, an adhesive bond layer, and a mechanical bond layer. The polishing rotary tool according to any one of the embodiments is provided.
In a twenty-sixth embodiment, the present disclosure provides the rotary tool for polishing according to the twenty-fifth embodiment, wherein the magnetic coupling layer comprises a magnet and the rigid support layer comprises a ferromagnetic material.
In a 27th embodiment, the present disclosure provides the rotary tool for polishing according to the 26th embodiment, wherein the ferromagnetic material comprises at least one of ferromagnetic steel and ferromagnetic stainless steel.
In the 28th embodiment, the present disclosure describes the polishing according to any one of the 18th to 27th embodiments, wherein the elastic layer comprises at least one of an elastomer, a fabric, a non-woven material, or a spring. Provide rotary tools for use.
In a 29th embodiment, the present disclosure provides a rotary tool for polishing according to any one of the 18th to 28th embodiments, wherein the rigid support layer comprises at least one of metal or plastic. do.
In a thirtieth embodiment, the present disclosure provides the polishing rotary tool according to any one of the eighteenth to twenty-ninth embodiments, wherein the contact surface of the polishing layer includes a microstructured surface.
In a thirty-first embodiment, the present disclosure provides the polishing rotary tool according to the thirtieth embodiment, wherein the contact surface comprises a plurality of precision-shaped polishing complexes.
In a thirty-second embodiment, the present disclosure provides a rotary tool for polishing according to any one of the eighteenth to thirty-first embodiments, wherein the elastic layer has a relaxation modulus of less than 25%.
In the 33rd embodiment, the present disclosure describes the polishing rotary tool according to any one of the 18th to 32nd embodiments, wherein the contact surface of the polishing layer is parallel to the rotation axis of the polishing rotary tool. I will provide a.
In the 34th embodiment, the present disclosure describes any one of the 18th to 32nd embodiments in which the angle between the contact surface of the polishing layer and the axis of rotation is 5 to 90 degrees. A rotary tool for polishing is provided.
In the 35th embodiment, the present disclosure is
It is a rotary tool for polishing,
A polishing assembly holder with a shank that defines the axis of rotation of the rotating tool for polishing,
A first polishing assembly coupled to a polishing assembly holder, comprising a first rigid support layer and a first polishing layer having a first contact surface.
A rotating tool for polishing, comprising a bonding layer disposed between the shank and the polishing layer.
The second polishing assembly
A second polishing assembly comprising a second rigid support layer and a second polishing layer having a second contact surface.
It is a rotary tool changer
Remove the first polishing assembly from the polishing rotary tool,
Provided is a polishing system comprising a rotary tool changer configured to attach a second polishing assembly to a polishing assembly holder.
In the 36th embodiment, the present disclosure provides the polishing system according to the 35th embodiment, wherein the polishing assembly holder further comprises a bonding layer.
In the 37th embodiment, the present disclosure provides the polishing system according to the 35th or 36th embodiment, wherein the binding layer has a peeling pressure of about 70 kPa to about 10 MPa.
In the 38th embodiment, the present disclosure
The rotary tool for polishing further comprises an elastic layer disposed between the shank and the polishing layer, the elastic layer having a shore A hardness of less than about 70.
The polishing system according to any one of the 35th to 37th embodiments, wherein the first rigid support layer and the second rigid support layer have a shore A hardness of more than about 90.
In the 39th embodiment, the present disclosure
The rotary tool for polishing further comprises an elastic layer disposed between the shank and the polishing layer, the elastic layer having a compression ratio of less than about 1.5 MPa with 25% deflection.
The polishing system according to any one of the 35th to 38th embodiments, wherein the first rigid support layer and the second rigid support layer have a compression ratio of more than about 2 MPa at 25% deflection.
In a 40th embodiment, the present disclosure describes any one of the 35th to 39th embodiments, wherein the rotary tool changer comprises a removal device configured to secure the first polishing assembly. Provides a polishing system for.
In a 41st embodiment, the present disclosure is such that the rotary tool changer uses any one of a friction mechanism, a screw mechanism, and a magnetic mechanism to remove the first polishing assembly from the rotary tool. The polishing system according to any one of the 35th to 40th embodiments configured is provided.
In a 42nd embodiment, the present disclosure is an assembly.
Computer-controlled machining systems, including computer-controlled rotary tool holders and substrate platforms,
With the base material fixed to the base material platform,
Provided is an assembly comprising the polishing rotary tool according to any one of the first to third embodiments.
In a 43rd embodiment, the present disclosure provides an assembly according to a 42nd embodiment, wherein the substrate is a component for an electronic device.
In a 44th embodiment, the present disclosure provides the assembly according to a 42nd or 43rd embodiment, wherein the electronic device component is a transparent display element.
In a forty-fourth embodiment, in the present disclosure, the polishing assembly of a rotary tool for polishing is the first polishing assembly, the assembly further comprises a rotary tool changer, and the rotary tool changer.
Remove the first polishing assembly from the polishing assembly holder of the rotating tool for polishing,
The assembly according to any one of the 42nd to 44th embodiments, which is configured to attach a second polishing assembly to a polishing assembly holder of a rotating tool for polishing.
In a 46th embodiment, the present disclosure is a method for polishing a substrate.
Preparing a computer-controlled machining system, including a computer-controlled rotary tool holder and substrate platform,
By fixing the polishing rotary tool to the rotary tool holder of a computer-controlled machining system, the polishing rotary tool
A polishing assembly holder with a shank that defines the axis of rotation of the rotating tool for polishing,
A first polishing assembly coupled to a polishing assembly holder, comprising a first rigid support layer and a first polishing layer having a first contact surface.
With, fixing, and with a bonding layer disposed between the shank and the polishing layer.
To operate a computer-controlled machining system and use the first polishing assembly of the polishing rotary tool to polish the contact surface of the substrate.
Removing the first polishing assembly from the polishing assembly holder of the rotating tool for polishing
Attaching the second polishing assembly to the polishing assembly holder of the rotating tool for polishing, the second polishing assembly is
With the second rigid support layer,
Provided are methods comprising, mounting, and comprising a second polishing layer having a second contact surface.
In the 47th embodiment, the present disclosure provides the method according to the 46th embodiment, wherein the contact surface is a chamfered surface, and the polishing layer of the rotary tool for polishing polishes the chamfered surface.

The operations of the present disclosure will be further described in the context of the following detailed embodiments. These examples are provided to further demonstrate various specific preferred embodiments and techniques. However, it should be understood that many changes and amendments can be made while remaining within the scope of this disclosure.

8 and 9A-9B are diagrams of exemplary polishing rotary tools described herein. The polishing rotary tool of FIGS. 8 and 9A to 9B can be used, for example, as the polishing rotary tool 18 of the assembly 10 of FIG. 1A. FIG. 8 shows Example 1, and FIGS. 9A and 9B show Example 2.

Measurement of peeling pressure

FIG. 7 is a schematic view of an experimental system 600 for determining a peeling force measurement value of the bonding layer 620 of the rotary tool 614 for polishing described herein. The system 600 includes a CNC machine 602 and a CNC machine controller 604. The controller 604 transmits a control signal to the CNC machine 602, and the operation of machining, grinding, or polishing the base material by using the rotary tool 614 mounted in the rotary tool holder 606 of the CNC machine 602 is performed by the CNC machine 602. Is configured to simulate. The CNC machine 602 may be capable of performing routing, turning, drilling, milling, grinding, polishing, and / or other machining operations, and the controller 604 has one or more rotary tools 614. It may include a CNC controller that commands the rotary tool holder 606 to perform machining, grinding, and / or polishing of the substrate in use. The controller 604 may include a general purpose computer that runs the software, and such a computer can be combined with the CNC controller 604 to provide the functionality of the CNC controller 604. The rotary tool 614 can be any one of the polishing rotary tools of the present disclosure.

The rotary tool 614 includes a polishing assembly holder 616, a polishing assembly 622, and a bonding layer 620. The polishing assembly holder 616 includes a shank 617 and an elastic layer 618. The polishing assembly 622 includes a rigid support layer and a polishing layer having a contact surface.

The force gauge 610 may be connected to a CNC machine base 608 communicatively connected to the CNC machine controller 604. The force gauge 610 may be communicably connected to a computer 612 configured to receive force measurements from the force gauge 610. The rotary tool 614 is attached to the force gauge 610 by a mounting device (not shown) in a manner that facilitates the measurement of the peeling force applied to the rotary tool 614 by the CNC machine 602, for example via a clamp or other holding mechanism. Be done. The force meter 610 is configured to measure the force received in one direction by the coupling layer 620 of the rotary tool 614. The rotary tool holder 606 is moved away from the CNC machine base 608 to generate a force in a controlled displacement, strain, or force. The force meter 610 measures the force and records the peak force that can represent the peeling force for the bond layer 620. The computer 612 can use the peeling force and effective surface area of the binding layer 620 to determine the peeling pressure of the binding layer 620 (eg, represented by psi or MPa).

Hardness measurement

Shore A hardness of the foam was measured using a Shore A durometer gauge, Model 1500, Type A available from the Rex Gauge Company (BuffaAlo Grove, Illinois) according to the procedure of ASTM D2240, Revision 15. The Rockwell A hardness of the metal was determined from publicly available material property data. Although not performed in this example, the Rockwell hardness test for determining Rockwell A hardness may be performed, for example, according to the general procedure of ASTM E18-17e1.

Measurement of elastic modulus

The elastic modulus of the material of the elastic layer was determined using publicly available material property data. Although not performed in this example, elastic tests for elastic modulus may be performed, for example, according to the general procedure of ASTM D1621-16.

Compression rate measurement

The compressibility of the elastic layer at 25% deflection was determined using manufacturer data from McMaster Carr (PO Box 4355, Chicago, IL 60680-4355). Although not performed in this example, the compressibility test to determine the compressibility at 25% deflection follows the general procedure of ASTM D3574 (for foam material) and ASTM D575 (for rubber material), MTS Systems Corp. .. It can be performed using the MTS INSIGHT Electrical Testing System available from (14000 Technology Drive, Eden Prairie, Minnesota).

The table below represents test and estimated values for various material properties in the following examples, as described above.

Manufacturing example

Example 1 is shown in FIG. FIG. 8 shows a polishing rotary tool 740 with a removable flat polishing assembly 744 and a polishing assembly holder 742 using a dual lock coupling mechanism (available from part number SJ3550, 3M Company (St. Paul, MN 55144)). It is a figure. The polishing rotary tool 740 includes the illustrated polishing assembly 744 removed from the polishing assembly holder 742. The polishing assembly holder 742 includes a shank 746 made of 6061 aluminum and an elastic layer 754. The elastic layer 754 is made of a wear resistant rapid recovery foam (part number 86375K133, available from McMaster Carr (PO Box 4355, Chicago, IL 60680-4355)). Adhesive transfer tape is applied to both sides of the elastic layer 754 (part number 9472LE, manufactured by 3M Company (St. Paul, MN 55144)). The polishing assembly 744 includes a rigid support layer 748 and a polishing layer 752 coupled to the rigid support layer 748 and having a contact surface 752. The rigid support layer 748 is made of 6061 aluminum. The polishing layer 752 is part number 578XA-TP2 with PSA (available from 3M Company (St. Paul, MN, 55144)). The rotary tool for polishing 740 includes a first bonding layer 750A bonded to the shank 746 and a second bonding layer 750B bonded to the rigid support layer 748 (collectively referred to as "bonding layer 750"). Includes a bond layer. The bonding layer 750 uses an inter-hook bonding mechanism in which a portion of the bonding layer 750 is on the polishing assembly 744 and the polishing assembly holder 742, respectively.

Example 2 is shown in FIGS. 9A and 9B. FIG. 9A is a view of a polishing rotary tool 760 having a removable cylindrical polishing assembly 764 coupled to a polishing assembly holder 762 using a magnetic coupling mechanism. The polishing rotary tool 760 includes a polishing assembly 764 coupled to a polishing assembly holder 762. Polished assembly holder 762 includes shank 766 made of 6061 aluminum. The polishing assembly 764 includes a rigid support layer 768 and a polishing layer 772 having a contact surface 774 and bonded to the constituent support layer 768. The rigid support layer 768 is made of ferromagnetic steel. The polishing layer 752 is made of 578XA-TP2 with PSA (available from 3M Company (St. Paul, MN, 55144)). The polishing assembly holder 762 includes a shank 766 and an elastic layer 767 bonded to the bonding layer 770. The elastic layer 754 is made of a wear resistant rapid recovery foam (part number 86375K133, available from McMaster Carr (PO Box 4355, Chicago, IL 60680-4355)). An adhesive transfer tape (part number 9472LE, manufactured by 3M Company (St. Paul, MN, 55144)) is applied to both sides of the elastic layer 754. The bonding layer 770 is arranged between the elastic layer 776 and the rigid support layer 768. Bonding layer 770 is made of neodymium magnets (part number 5862K985K985, available from McMaster Carr (PO Box 4355, Chicago, IL 60680-4355)), with some of the bonding layer 770 being polished assembly 764 and Above each of the polishing assembly holders 762. The magnet is glued in place with a CA4 made by 3M Company (St. Paul, MN, 55144).
In Example 3, the binding layer can be an adhesive such as PSA. PSAs known in the art can be used, such as 91022 from 3M Company (St. Paul, MN, 55144). Other adhesives include peelable adhesives, transfer adhesives, hot melt adhesives, foam tape adhesives, instant adhesives, non-permanent adhesives such as 4658F, 3798 LM, and 3M Company (St. Paul). , MN, 55144), but is not limited to permanent adhesives such as CA5 cyanoacrylate.

FIG. 9B is a view of the polishing rotary tool 760 of FIG. 9A, in which the removable polishing assembly 764 has been removed from the polishing assembly holder 762. As shown in FIG. 9B, the polishing assembly holder 762 includes a first bonding layer 770A bonded to the elastic layer 767, and the polishing assembly 764 contains a second bonding layer 770B bonded to the rigid support layer 768. ..

Example of peeling pressure

For each of the dual lock mechanism of FIG. 8 and the magnetic mechanism of FIGS. 9A-9B, the peeling pressure was determined using the mechanism described in FIG. 7 above. The peeling force was measured using a Simpo digital force meter (model FGV-10, manufactured by Simpo (3310 Kitty Hawk Road Suite 100, Wilmington, NC 28405)). The separation force was measured while moving the tool shank in the positive Z direction. The peak force was recorded and the separation pressure was calculated using the contact area of the bond layer. The dual lock mechanism required a peeling pressure of 76 kPa. The neodymium mechanism requires a separation of 395 kPa. In some embodiments, the larger the area, the higher the force value, depending on factors such as material and surface quality.

Various embodiments of the present invention have been described. These and other embodiments are within the scope of the following claims.

Claims (47)

It is a polishing rotary tool
A polishing assembly holder with a shank that defines the axis of rotation of the rotary tool,
Polishing assembly
A polishing assembly comprising a rigid support layer having a Shore A hardness of greater than about 90 and a polishing layer having a contact surface.
A rotary tool for polishing, comprising an elastic layer arranged between the shank and the polishing layer and having an elastic layer having a shore A hardness of less than about 70. The polishing rotary tool according to claim 1, wherein the elastic layer has a shore A hardness of less than about 50. The rotary tool for polishing according to claim 1, further comprising a bonding layer arranged between the shank and the polishing layer. The rotary tool for polishing according to claim 3, wherein the bonding layer has a peeling pressure of about 70 kPa to about 10 MPa. The rotary tool for polishing according to claim 3, wherein the elastic layer is arranged between the shank and the bonding layer. The rotary tool for polishing according to claim 3, wherein the elastic layer is arranged between the connecting layer and the rigid support layer. The polishing rotary tool according to claim 3, wherein the elastic layer is arranged between the rigid support layer and the polishing layer. The rotary tool for polishing according to claim 3, wherein the bonding layer includes at least one of a hook-and-loop bonding layer, a magnetic bonding layer, an adhesive bonding layer, and a mechanical bonding layer. The rotary tool for polishing according to claim 8, wherein the magnetic coupling layer contains a magnet and the rigid support layer contains a ferromagnetic material. The rotary tool for polishing according to claim 9, wherein the ferromagnetic material contains at least one of ferromagnetic steel and ferromagnetic stainless steel. The rotary tool for polishing according to claim 1, wherein the elastic layer contains at least one of an elastomer, a fabric, a non-woven fabric material, and a spring. The polishing rotary tool according to claim 1, wherein the rigid support layer contains at least one of metal or plastic. The rotary tool for polishing according to claim 1, wherein the contact surface of the polishing layer includes a microstructured surface. The rotary tool for polishing according to claim 13, wherein the contact surface includes a plurality of precision-shaped polishing complexes. The polishing rotary tool according to claim 1, wherein the elastic layer has a relaxed elastic modulus of less than 25%. The polishing rotary tool according to claim 1, wherein the contact surface of the polishing layer is parallel to the rotary axis of the rotary tool. The rotating tool for polishing according to claim 1, wherein the angle between the contact surface of the polishing layer and the rotating shaft is 5 degrees to 90 degrees. It is a rotary tool for polishing,
A polishing assembly holder with a shank that defines the axis of rotation of the rotary tool,
Polishing assembly
A polishing assembly having a rigid support layer having a compressive modulus of more than about 1 GPa and a polishing layer having a contact surface.
A rotary tool for polishing, comprising an elastic layer arranged between the shank and the polishing layer and having an elastic modulus of less than about 0.1 GPa. The polishing rotary tool according to claim 18, wherein the elastic layer has an elastic modulus of less than 0.01 GPa. The rotating tool for polishing according to claim 18, further comprising a bonding layer arranged between the shank and the polishing layer. The rotary tool for polishing according to claim 20, wherein the bonding layer has a peeling pressure of about 70 kPa to about 10 MPa. The polishing rotary tool according to claim 20, wherein the elastic layer is arranged between the shank and the bonding layer. The polishing rotary tool according to claim 20, wherein the elastic layer is arranged between the coupling layer and the rigid support layer. The polishing rotary tool according to claim 20, wherein the elastic layer is arranged between the rigid support layer and the polishing layer. The rotary tool for polishing according to claim 20, wherein the bonding layer includes at least one of a hook-and-loop bonding layer, a magnetic bonding layer, an adhesive bonding layer, and a mechanical bonding layer. 25. The rotary tool for polishing according to claim 25, wherein the magnetic coupling layer contains a magnet and the rigid support layer contains a ferromagnetic material. The rotating tool for polishing according to claim 26, wherein the ferromagnetic material includes at least one of ferromagnetic steel and ferromagnetic stainless steel. The rotary tool for polishing according to claim 18, wherein the elastic layer contains at least one of an elastomer, a fabric, or a non-woven fabric material. The polishing rotary tool according to claim 18, wherein the rigid support layer comprises at least one of metal or plastic. The polishing rotary tool according to claim 18, wherein the contact surface of the polishing layer includes a microstructured surface. The rotary tool for polishing according to claim 30, wherein the contact surface includes a plurality of precision-shaped polishing complexes. The polishing rotary tool according to claim 18, wherein the elastic layer has a relaxation elastic modulus of less than 25%. The polishing rotary tool according to claim 18, wherein the contact surface of the polishing layer is parallel to the rotation axis of the polishing rotary tool. The rotating tool for polishing according to claim 18, wherein the angle between the contact surface of the polishing layer and the rotating shaft is 5 degrees to 90 degrees. It is a rotary tool for polishing,
A polishing assembly holder with a shank that defines the axis of rotation of the rotary tool,
A first polishing assembly comprising a first rigid support layer and a first polishing layer having a first contact surface and coupled to the polishing assembly holder.
A polishing rotary tool comprising a bonding layer disposed between the shank and the polishing layer.
A second polishing assembly with a second rigid support layer and a second polishing layer with a second contact surface.
A polishing system comprising a rotary tool changer configured to remove the first polishing assembly from the rotary tool and attach the second polishing assembly to the polishing assembly holder. 35. The polishing system of claim 35, wherein the polishing assembly holder further comprises the bonding layer. The polishing system according to claim 35, wherein the bonding layer has a peeling pressure of about 70 kPa to about 10 MPa. The polishing rotary tool further comprises an elastic layer disposed between the shank and the polishing layer, the elastic layer having a shore A hardness of less than about 70.
The polishing system according to claim 35, wherein the first rigid support layer and the second rigid support layer have a shore A hardness of more than about 90. The polishing rotary tool further includes an elastic layer disposed between the shank and the polishing layer, which has a compression ratio of less than about 1.5 MPa at 25% deflection.
The polishing system according to claim 35, wherein the first rigid support layer and the second rigid support layer have a compressibility of more than about 2 MPa at 25% deflection. 35. The polishing system of claim 35, wherein the rotary tool changer comprises a removal device configured to secure the first polishing assembly. 35. The rotary tool changer is configured to use any one of a friction mechanism, a screw mechanism, and a magnetic mechanism to remove the first polishing assembly from the rotary tool. Polishing system described in. A computer-controlled machining system with a computer-controlled rotary tool holder and substrate platform,
With the base material fixed to the base material platform,
An assembly comprising the polishing rotary tool according to any one of claims 1 to 34. 42. The assembly of claim 42, wherein the substrate is a component for an electronic device. The assembly according to claim 43, wherein the component for the electronic device is a transparent display element. The polishing assembly of the rotary tool for polishing is a first polishing assembly, which further comprises a rotary tool changer, wherein the rotary tool changer includes a rotary tool changer.
The first polishing assembly is removed from the polishing assembly holder of the rotary tool.
42. The assembly of claim 42, which is configured to attach a second polishing assembly to the polishing assembly holder of the rotary tool. A method for polishing the substrate,
To provide a computer-controlled machining system including a computer-controlled rotary tool holder and a substrate platform.
The polishing rotary tool is fixed to the rotary tool holder of the computer-controlled machining system, and here, the polishing rotary tool is used.
A polishing assembly holder with a shank that defines the axis of rotation of the rotary tool,
A first polishing assembly comprising a first rigid support layer and a first polishing layer having a first contact surface and coupled to a polishing assembly holder.
It comprises a bonding layer disposed between the shank and the polishing layer.
Activating the computer-controlled machining system to polish the contact surface of the substrate using the first polishing assembly of the rotating tool for polishing.
Removing the first polishing assembly from the polishing assembly holder of the rotating tool for polishing
The second polishing assembly is attached to the polishing assembly holder of the rotating tool for polishing, and the second polishing assembly is
A method comprising attaching, comprising a second rigid support layer and a second polishing layer having a second contact surface. 46. The method of claim 46, wherein the contact surface is a chamfered surface, and the polishing layer of the rotating tool for polishing polishes the chamfered surface.

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