JP2021506116A - 加工基板上の集積デバイスのためのシステムおよび方法 - Google Patents
加工基板上の集積デバイスのためのシステムおよび方法 Download PDFInfo
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- JP2021506116A JP2021506116A JP2020530498A JP2020530498A JP2021506116A JP 2021506116 A JP2021506116 A JP 2021506116A JP 2020530498 A JP2020530498 A JP 2020530498A JP 2020530498 A JP2020530498 A JP 2020530498A JP 2021506116 A JP2021506116 A JP 2021506116A
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Classifications
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Abstract
Description
本出願は、2017年12月6日に出願された米国仮特許出願第62/595,533号の利益を主張する、2018年12月3日に出願された米国特許出願第16/207,793号の優先権を主張し、それらの開示はあらゆる目的でその全体が参照により本明細書に組み込まれる。
Claims (20)
- 複数のデバイスを形成する方法であって、
多結晶セラミックコアを設けること、
前記多結晶セラミックコアを第1の接着シェルでカプセル化すること、
前記第1の接着シェルを障壁層でカプセル化すること、
前記障壁層上に接合層を形成すること、
および前記接合層に結合された実質的に単結晶の層を形成すること
によって基板を形成するステップと、
前記実質的に単結晶の層に結合された緩衝層を形成するステップと、
前記複数のデバイスに関連する要件に従って、前記緩衝層上に1つまたは複数のエピタキシャルIII−V層を形成するステップと、
前記複数のデバイス間に配置された前記1つまたは複数のエピタキシャルIII−V層の一部を除去すること、および
前記複数のデバイス間に配置された前記緩衝層の一部を除去すること
により、前記基板上に前記複数のデバイスを形成するステップと
を含む、方法。 - 前記1つまたは複数のエピタキシャルIII−V層がGaNを含む、請求項1に記載の方法。
- 前記基板上の前記複数のデバイスを平坦化するステップをさらに含む、請求項1に記載の方法。
- 前記平坦化するステップが、
前記複数のデバイス上に誘電体層を形成するステップと、
化学機械平坦化を使用して前記複数のデバイスを平滑化するステップと
をさらに含む、請求項3に記載の方法。 - 前記複数のデバイスのうちの第1のデバイスと前記複数のデバイスのうちの第2のデバイスとの間に1つまたは複数の相互接続を製造するステップをさらに含む、請求項1に記載の方法。
- 前記複数のデバイスの各々の第1の表面を一時的キャリアに接合するステップであって、前記第1の表面が前記基板に対向する、ステップと、
前記デバイスの各々の第2の表面を露出させるために前記基板を除去するステップと、
前記第2の表面上に導電層を形成するステップと、
前記導電層にキャリアウェハを接合するステップと
をさらに含む、請求項1に記載の方法。 - 1つまたは複数の裏面接点を形成するために、前記キャリアウェハの1つまたは複数のセクションを除去するステップをさらに含む、請求項6に記載の方法。
- 前記複数のデバイスが、空乏モード高電子移動度トランジスタ(HEMT)と、エンハンスメントモードHEMTとを含む、請求項1に記載の方法。
- 前記複数のデバイスが、第1の空乏モード高電子移動度トランジスタ(HEMT)と、第2の空乏モードHEMTとを含む、請求項1に記載の方法。
- 前記複数のデバイスが、第1のエンハンスメントモード高電子移動度トランジスタ(HEMT)と、第2のエンハンスメントモードHEMTとを含む、請求項1に記載の方法。
- 前記複数のデバイスが、高電子移動度トランジスタ(HEMT)と、垂直デバイスとを含む、請求項1に記載の方法。
- 複数のデバイスを形成する方法であって、
多結晶セラミックコアを設けること、
前記多結晶セラミックコアを接着シェルでカプセル化すること、
前記接着シェルを障壁層でカプセル化すること、
前記障壁層上に接合層を形成すること、および
前記接合層に結合された実質的に単結晶の層を形成すること
によって基板を形成するステップと、
前記実質的に単結晶の層に結合された導電層を形成するステップと、
前記導電層に結合された緩衝層を形成するステップと、
前記複数のデバイスの各々に対する要件に従って、前記緩衝層上に1つまたは複数のエピタキシャルIII−V層を形成するステップと、
前記導電層の一部を露出させるために、前記複数のデバイス間に配置された前記1つまたは複数のエピタキシャルIII−V層の一部および前記緩衝層の一部を除去すること、
前記導電層の前記露出部分の一部に結合された接点を形成すること、ならびに
前記接点に結合されていない前記導電層の残りの露出部分を除去すること
によって前記複数のデバイスを形成するステップと
を含む、方法。 - 前記基板上の前記複数のデバイスを平坦化するステップをさらに含む、請求項12に記載の方法。
- 前記平坦化するステップが、
前記複数のデバイス上に誘電体層を形成するステップと、
化学機械平坦化を使用して前記複数のデバイスを平滑化するステップと
をさらに含む、請求項13に記載の方法。 - 前記複数のデバイスのうちの第1のデバイスと前記複数のデバイスのうちの第2のデバイスとの間に1つまたは複数の相互接続を製造するステップをさらに含む、請求項12に記載の方法。
- 前記複数のデバイスの各々の第1の表面を一時的キャリアに接合するステップであって、前記第1の表面が前記基板に対向する、ステップと、
前記デバイスの各々の第2の表面を露出させるために前記基板を除去するステップと、
前記第2の表面上に第2の導電層を形成するステップと、
前記第2の導電層にキャリアウェハを接合するステップと
をさらに含む、請求項12に記載の方法。 - 1つまたは複数の裏面接点を形成するために、前記キャリアウェハの1つまたは複数のセクションを除去するステップをさらに含む、請求項16に記載の方法。
- 前記複数のデバイスが、高電子移動度トランジスタ(HEMT)と、垂直デバイスとを含む、請求項12に記載の方法。
- 前記HEMTが、空乏モードHEMTまたはエンハンスメントモードHEMTを含む、請求項18に記載の方法。
- 前記垂直デバイスが、垂直P−Nダイオードまたは垂直ショットキーダイオードを含む、請求項18に記載の方法。
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