JP2021503687A5 - - Google Patents
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- JP2021503687A5 JP2021503687A5 JP2020526156A JP2020526156A JP2021503687A5 JP 2021503687 A5 JP2021503687 A5 JP 2021503687A5 JP 2020526156 A JP2020526156 A JP 2020526156A JP 2020526156 A JP2020526156 A JP 2020526156A JP 2021503687 A5 JP2021503687 A5 JP 2021503687A5
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- JP
- Japan
- Prior art keywords
- signal
- plasma
- frequency
- amplitude
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762587418P | 2017-11-16 | 2017-11-16 | |
| US62/587,418 | 2017-11-16 | ||
| PCT/US2018/052223 WO2019099102A1 (en) | 2017-11-16 | 2018-09-21 | Plasma processing system with synchronized signal modulation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021503687A JP2021503687A (ja) | 2021-02-12 |
| JP2021503687A5 true JP2021503687A5 (https=) | 2021-10-28 |
| JP7210094B2 JP7210094B2 (ja) | 2023-01-23 |
Family
ID=66432407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020526156A Active JP7210094B2 (ja) | 2017-11-16 | 2018-09-21 | 信号変調同期式プラズマ処理システム |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10991554B2 (https=) |
| JP (1) | JP7210094B2 (https=) |
| KR (1) | KR102724209B1 (https=) |
| CN (1) | CN111357077B (https=) |
| TW (1) | TWI801424B (https=) |
| WO (1) | WO2019099102A1 (https=) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9089319B2 (en) | 2010-07-22 | 2015-07-28 | Plasma Surgical Investments Limited | Volumetrically oscillating plasma flows |
| US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
| US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
| US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
| US11361947B2 (en) * | 2019-01-09 | 2022-06-14 | Tokyo Electron Limited | Apparatus for plasma processing and method of etching |
| CN118315254A (zh) | 2019-01-22 | 2024-07-09 | 应用材料公司 | 用于控制脉冲电压波形的反馈回路 |
| US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
| KR102879033B1 (ko) * | 2019-05-20 | 2025-10-30 | 삼성전자주식회사 | 반도체 처리 장치 |
| US11848176B2 (en) | 2020-07-31 | 2023-12-19 | Applied Materials, Inc. | Plasma processing using pulsed-voltage and radio-frequency power |
| EP4205515A2 (en) * | 2020-08-28 | 2023-07-05 | Plasma Surgical Investments Limited | Systems, methods, and devices for generating predominantly radially expanded plasma flow |
| US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
| US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
| US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
| US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
| US12525441B2 (en) | 2021-06-09 | 2026-01-13 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
| US12148595B2 (en) | 2021-06-09 | 2024-11-19 | Applied Materials, Inc. | Plasma uniformity control in pulsed DC plasma chamber |
| US20220399186A1 (en) | 2021-06-09 | 2022-12-15 | Applied Materials, Inc. | Method and apparatus to reduce feature charging in plasma processing chamber |
| US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
| US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
| US11776788B2 (en) * | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
| US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
| US12106938B2 (en) | 2021-09-14 | 2024-10-01 | Applied Materials, Inc. | Distortion current mitigation in a radio frequency plasma processing chamber |
| JP7607539B2 (ja) * | 2021-09-24 | 2024-12-27 | 東京エレクトロン株式会社 | プラズマ処理装置及び処理方法 |
| US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
| US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
| US12315732B2 (en) | 2022-06-10 | 2025-05-27 | Applied Materials, Inc. | Method and apparatus for etching a semiconductor substrate in a plasma etch chamber |
| US12586768B2 (en) | 2022-08-10 | 2026-03-24 | Applied Materials, Inc. | Pulsed voltage compensation for plasma processing applications |
| US12272524B2 (en) | 2022-09-19 | 2025-04-08 | Applied Materials, Inc. | Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics |
| US12111341B2 (en) | 2022-10-05 | 2024-10-08 | Applied Materials, Inc. | In-situ electric field detection method and apparatus |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3546977B2 (ja) * | 1994-10-14 | 2004-07-28 | 富士通株式会社 | 半導体装置の製造方法と製造装置 |
| US6875700B2 (en) * | 2000-08-29 | 2005-04-05 | Board Of Regents, The University Of Texas System | Ion-Ion plasma processing with bias modulation synchronized to time-modulated discharges |
| US20030213559A1 (en) * | 2002-05-20 | 2003-11-20 | Applied Science And Technology, Inc. | Stabilization of electronegative plasmas with feedback control of RF generator systems |
| US20050241762A1 (en) * | 2004-04-30 | 2005-11-03 | Applied Materials, Inc. | Alternating asymmetrical plasma generation in a process chamber |
| US20080230008A1 (en) * | 2007-03-21 | 2008-09-25 | Alexander Paterson | Plasma species and uniformity control through pulsed vhf operation |
| US20090004836A1 (en) | 2007-06-29 | 2009-01-01 | Varian Semiconductor Equipment Associates, Inc. | Plasma doping with enhanced charge neutralization |
| JP2008047938A (ja) * | 2007-10-17 | 2008-02-28 | Masayoshi Murata | 高周波プラズマｃｖｄ装置と高周波プラズマｃｖｄ法及び半導体薄膜製造法。 |
| JP5319150B2 (ja) * | 2008-03-31 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法及びコンピュータ読み取り可能な記憶媒体 |
| KR101489326B1 (ko) * | 2008-09-09 | 2015-02-11 | 삼성전자주식회사 | 기판의 처리 방법 |
| US7993937B2 (en) * | 2009-09-23 | 2011-08-09 | Tokyo Electron Limited | DC and RF hybrid processing system |
| JP5606821B2 (ja) * | 2010-08-04 | 2014-10-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN103098559B (zh) * | 2010-09-15 | 2015-03-25 | 三菱电机株式会社 | 高频电力供给装置、等离子体处理装置以及薄膜制造方法 |
| US20120283973A1 (en) * | 2011-05-05 | 2012-11-08 | Imec | Plasma probe and method for plasma diagnostics |
| US10325759B2 (en) * | 2012-02-22 | 2019-06-18 | Lam Research Corporation | Multiple control modes |
| US10861679B2 (en) * | 2014-09-08 | 2020-12-08 | Tokyo Electron Limited | Resonant structure for a plasma processing system |
| JP6449674B2 (ja) | 2015-02-23 | 2019-01-09 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US9741539B2 (en) * | 2015-10-05 | 2017-08-22 | Applied Materials, Inc. | RF power delivery regulation for processing substrates |
| US10026592B2 (en) * | 2016-07-01 | 2018-07-17 | Lam Research Corporation | Systems and methods for tailoring ion energy distribution function by odd harmonic mixing |
| US10396601B2 (en) * | 2017-05-25 | 2019-08-27 | Mks Instruments, Inc. | Piecewise RF power systems and methods for supplying pre-distorted RF bias voltage signals to an electrode in a processing chamber |
-
2018
- 2018-09-21 US US16/138,375 patent/US10991554B2/en active Active
- 2018-09-21 CN CN201880074291.5A patent/CN111357077B/zh active Active
- 2018-09-21 JP JP2020526156A patent/JP7210094B2/ja active Active
- 2018-09-21 WO PCT/US2018/052223 patent/WO2019099102A1/en not_active Ceased
- 2018-09-21 KR KR1020207013556A patent/KR102724209B1/ko active Active
- 2018-09-28 TW TW107134304A patent/TWI801424B/zh active
-
2021
- 2021-04-26 US US17/240,733 patent/US20210249226A1/en not_active Abandoned
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