JP2021503229A - 圧電共振器および圧電共振器の製造方法 - Google Patents
圧電共振器および圧電共振器の製造方法 Download PDFInfo
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
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- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
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- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
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- H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
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- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
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- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
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- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
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- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
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- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/021—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the air-gap type
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- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0407—Temperature coefficient
Abstract
Description
上面に凹溝が形成された基板と、
前記凹溝との間に空洞が形成されるように、前記基板の上面および前記凹溝の開口を覆う第1圧電層と、
前記第1圧電層の前記基板から離れた側に設けられた第1電極および温度補償層と、を備え、
前記基板に垂直な方向において、前記第1電極の前記基板における投影が前記凹溝の所在エリアに位置する、圧電共振器を提供する。
基板の上面に凹溝を形成することと、
前記凹溝に犠牲材料を充填し、前記犠牲材料の上面が前記基板の上面と面一になるようにすることと、
前記基板の上面および前記犠牲材料の上面を第1圧電層で覆うことと、
前記第1圧電層の前記基板から離れた側に第1電極および温度補償層を形成することと、
前記犠牲材料を除去して空洞を形成することとを含み、
前記基板に垂直な方向において、前記第1電極の前記基板における投影が前記凹溝の所在エリアに位置する、圧電共振器の製造方法を更に提供する。
Claims (13)
- 上面に凹溝が形成された基板と、
前記凹溝との間に空洞が形成されるように、前記基板の上面および前記凹溝の開口を覆う第1圧電層と、
前記第1圧電層の前記基板から離れた側に設けられた第1電極および温度補償層と、を備え、
前記基板に垂直な方向において、前記第1電極の前記基板における投影が前記凹溝の所在エリアに位置する、圧電共振器。 - 前記第1電極は前記第1圧電層の前記基板から離れた側の表面に位置し、前記温度補償層は前記第1電極を覆う、請求項1に記載の圧電共振器。
- 前記温度補償層は前記第1圧電層の前記基板から離れた側の表面に位置し、前記第1電極は前記温度補償層の前記基板から離れた側に位置する、請求項1に記載の圧電共振器。
- 前記第1電極は前記温度補償層の前記基板から離れた側の表面に位置する、請求項3に記載の圧電共振器。
- 前記温度補償層と前記第1電極との間に位置する第2圧電層を更に備え、前記第1電極は、前記第2圧電層の前記基板から離れた側の表面に位置する、請求項3に記載の圧電共振器。
- 前記空洞に位置し、且つ、前記第1圧電層の前記基板に接近する側の表面に設けられた第2電極を更に備える、請求項1から5のいずれか1項に記載の圧電共振器。
- 前記第1電極がインターデジタル電極または面状電極であることと、前記第2電極がインターデジタル電極または面状電極であることとのうちの少なくとも1つを含む、請求項6に記載の圧電共振器。
- 前記基板の材料はシリコンである、請求項1に記載の圧電共振器。
- 前記温度補償層の材料は正温度係数材料である、請求項1に記載の圧電共振器。
- 前記温度補償層の材料は二酸化ケイ素である、請求項9に記載の圧電共振器。
- 前記第1電極の厚さは100nm〜200nmである、請求項1に記載の圧電共振器。
- 基板の上面に凹溝を形成することと、
前記凹溝に犠牲材料を充填し、前記犠牲材料の上面が前記基板の上面と面一になるようにすることと、
前記基板の上面および前記犠牲材料の上面を第1圧電層で覆うことと、
前記第1圧電層の前記基板から離れた側に第1電極および温度補償層を形成することと、
前記犠牲材料を除去して空洞を形成することと、を含み、
前記基板に垂直な方向において、前記第1電極の前記基板における投影が前記凹溝の所在エリアに位置する、圧電共振器の製造方法。 - 前記犠牲材料を除去して空洞を形成することとは、
前記基板に垂直な方向において、前記凹溝の所在エリアにおいて孔を開け、開けられた孔によって前記犠牲材料をエッチングすることを含む、請求項12に記載の圧電共振器の製造方法。
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CN201711121168.8A CN107733395A (zh) | 2017-11-14 | 2017-11-14 | 一种压电谐振器和压电谐振器的制备方法 |
CN201721512611.X | 2017-11-14 | ||
CN201711121168.8 | 2017-11-14 | ||
CN201721512611.XU CN207339804U (zh) | 2017-11-14 | 2017-11-14 | 一种压电谐振器 |
PCT/CN2018/085289 WO2019095640A1 (zh) | 2017-11-14 | 2018-05-02 | 压电谐振器和压电谐振器的制备方法 |
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JP (1) | JP2021503229A (ja) |
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GB201802659D0 (en) * | 2018-02-19 | 2018-04-04 | Cambridge Entpr Ltd | Resonator and method for operation of resonator |
WO2020158673A1 (ja) * | 2019-01-31 | 2020-08-06 | 株式会社村田製作所 | 弾性波デバイスおよびマルチプレクサ |
CN114128139A (zh) * | 2019-09-05 | 2022-03-01 | 常州承芯半导体有限公司 | 一种体声波谐振装置及一种体声波滤波器 |
CN112653417A (zh) * | 2020-12-18 | 2021-04-13 | 广东广纳芯科技有限公司 | 声表面波谐振器及该声表面波谐振器的制造方法 |
CN113437947B (zh) * | 2021-07-06 | 2023-03-28 | 电子科技大学 | 一种基于声子晶体抑制侧边能量辐射的薄膜体声波谐振器 |
CN114978089B (zh) * | 2022-05-20 | 2023-11-21 | 武汉敏声新技术有限公司 | 一种谐振器及其制备方法、滤波器 |
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- 2018-05-02 WO PCT/CN2018/085289 patent/WO2019095640A1/zh active Application Filing
- 2018-05-02 KR KR1020207010371A patent/KR20200052928A/ko not_active Application Discontinuation
- 2018-05-02 JP JP2020526508A patent/JP2021503229A/ja active Pending
- 2018-05-02 US US16/754,169 patent/US20210211115A1/en not_active Abandoned
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JP2011166259A (ja) * | 2010-02-05 | 2011-08-25 | Murata Mfg Co Ltd | 弾性表面波装置 |
US20110227671A1 (en) * | 2010-03-16 | 2011-09-22 | Hao Zhang | Temperature compensated thin film acoustic wave resonator |
JP2013214954A (ja) * | 2012-03-07 | 2013-10-17 | Taiyo Yuden Co Ltd | 共振子、周波数フィルタ、デュプレクサ、電子機器及び共振子の製造方法 |
JP2013219743A (ja) * | 2012-03-15 | 2013-10-24 | Taiyo Yuden Co Ltd | 弾性波デバイス |
US20150318837A1 (en) * | 2014-04-30 | 2015-11-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator device with air-ring and temperature compensating layer |
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US20210211115A1 (en) | 2021-07-08 |
WO2019095640A1 (zh) | 2019-05-23 |
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