JP2021194908A - Transparent conductive laminated structure and touch panel - Google Patents

Transparent conductive laminated structure and touch panel Download PDF

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JP2021194908A
JP2021194908A JP2020167616A JP2020167616A JP2021194908A JP 2021194908 A JP2021194908 A JP 2021194908A JP 2020167616 A JP2020167616 A JP 2020167616A JP 2020167616 A JP2020167616 A JP 2020167616A JP 2021194908 A JP2021194908 A JP 2021194908A
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adhesive layer
film
conductive
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peel strength
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ユン チェン チャン
Yungchen Chan
チア シェン リャオ
Chia-Sheng Liao
チュン チン シャオ
Zhong Qin Xiao
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Cambrios Film Solutions Xiamen Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Physics & Mathematics (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)

Abstract

To provide a transparent conductive laminated structure and a touch panel.SOLUTION: A transparent conductive laminated structure includes a first conductive film including a first surface and a second surface opposite to the first surface. A first adhesive layer is disposed on the first surface of the first conductive film, and a protective film is disposed on the first adhesive layer. Peel strength between the first adhesive layer and the first conductive film is larger than peel strength between the first adhesive layer and the protective film.SELECTED DRAWING: Figure 1

Description

本開示は、透明導電性積層構造体及びタッチパネルに関する。より詳細には、本開示は、タッチパネルを製造するための透明導電性積層構造体に関する。 The present disclosure relates to a transparent conductive laminated structure and a touch panel. More specifically, the present disclosure relates to a transparent conductive laminated structure for manufacturing a touch panel.

近年、タッチパネルの応用が拡大している。電子製品をより使いやすくするために、直接操作又はコマンド発行機能を提供するタッチパネルを搭載した電子製品が増えている。そのため、タッチパネルに対する需要量は継続して増加している。 In recent years, the application of touch panels has been expanding. In order to make electronic products easier to use, an increasing number of electronic products are equipped with a touch panel that provides a direct operation or command issuing function. Therefore, the demand for touch panels continues to increase.

タッチパネルの現在の作製プロセスでは、種々の層状部品を積層する際に、他の部品を取り付けるために部品の露出面に接着剤を塗布する必要がある。また、作製プロセスにおいて、通常、組み立て工程は異なる時間に、又は異なる場所で行われる。このため、未完成タッチパネルや未完成部品を移動させる際には、保護フィルムや離型フィルムを未完成部品の露出面に塗布し、輸送時の衝突による損傷を回避する。このため、タッチパネルの作製プロセスにおいて、保護フィルムや離型フィルムを除去し、部品を取り付けるための接着剤を塗布する工程が繰り返され、結果的に、作製プロセスが複雑で時間を要し、かつ高価になる。したがって、構造体と作製プロセスをさらに改善する必要がある。 In the current manufacturing process of touch panels, when laminating various layered parts, it is necessary to apply an adhesive to the exposed surface of the parts in order to attach other parts. Also, in the fabrication process, the assembly process is usually performed at different times or at different locations. Therefore, when moving an unfinished touch panel or an unfinished part, a protective film or a release film is applied to the exposed surface of the unfinished part to avoid damage due to a collision during transportation. Therefore, in the touch panel manufacturing process, the steps of removing the protective film and the release film and applying the adhesive for attaching the parts are repeated, and as a result, the manufacturing process is complicated, time-consuming, and expensive. become. Therefore, there is a need to further improve the structure and fabrication process.

米国特許出願公開第２０１５／００８４００４号明細書U.S. Patent Application Publication No. 2015/804004

本開示の目的は、製造プロセスが簡略化され、作製コストが低く、環境に優しい新規な透明導電性積層構造体及び新規なタッチパネルを提供することにある。 An object of the present disclosure is to provide a novel transparent conductive laminated structure and a new touch panel which are environmentally friendly, have a simplified manufacturing process, and have a low manufacturing cost.

本開示の透明導電性積層構造体は、第１の表面と、第１の表面と反対の第２の表面とを含む第１の導電性フィルムと、第１の導電性フィルムの第１の表面上に配置された第１の接着剤層と、第１の接着剤層上に設けられた保護フィルムとを備え、第１の接着剤層と第１の導電性フィルムとの剥離強度は、第１の接着剤層と保護フィルムとの剥離強度よりも大きい。 The transparent conductive laminated structure of the present disclosure includes a first conductive film including a first surface and a second surface opposite to the first surface, and a first surface of the first conductive film. The first adhesive layer arranged above and the protective film provided on the first adhesive layer are provided, and the peel strength between the first adhesive layer and the first conductive film is the first. It is larger than the peel strength between the adhesive layer of 1 and the protective film.

一実施形態では、第１の接着剤層と第１の導電性フィルムとの剥離強度は、第１の接着剤層と保護フィルムとの剥離強度の１００倍以上である。 In one embodiment, the peel strength between the first adhesive layer and the first conductive film is 100 times or more the peel strength between the first adhesive layer and the protective film.

一実施形態では、第１の接着剤層と保護フィルムとの剥離強度は、２００ｍＮ／２５ｍｍ未満である。 In one embodiment, the peel strength between the first adhesive layer and the protective film is less than 200 mN / 25 mm.

一実施形態では、第１の導電性フィルムは、第１の基板と、第１の基板上に配置された第１の導電層とを含み、第１の接着剤層は、第１の基板と保護フィルムとの間、または第１の導電層と保護フィルムとの間に配置される。 In one embodiment, the first conductive film comprises a first substrate and a first conductive layer disposed on the first substrate, and the first adhesive layer is the first substrate. It is arranged between the protective film or between the first conductive layer and the protective film.

一実施形態では、第１の導電性フィルムは、複数の銀ナノワイヤを含む。 In one embodiment, the first conductive film comprises a plurality of silver nanowires.

一実施形態では、透明導電性積層構造体は、第１の導電性フィルムの第２の表面上に配置された第２の接着剤層と、第２の接着剤層上に配置された離型フィルムと、を更に含み、第２の接着剤層と第１の導電性フィルムとの剥離強度は、第２の接着剤層と離型フィルムとの剥離強度よりも大きい。 In one embodiment, the transparent conductive laminated structure has a second adhesive layer arranged on a second surface of the first conductive film and a mold release arranged on the second adhesive layer. Further including the film, the peel strength between the second adhesive layer and the first conductive film is larger than the peel strength between the second adhesive layer and the release film.

一実施形態では、第１の導電性フィルムは、第１の基板と、第１の基板上に配置された第１の導電性層とを含み、第１の接着剤層は、第１の基板と保護フィルムとの間に配置され、第２の接着剤層は、第１の導電性層と離型フィルムとの間に配置される。 In one embodiment, the first conductive film comprises a first substrate and a first conductive layer disposed on the first substrate, and the first adhesive layer is a first substrate. The second adhesive layer is placed between the first conductive layer and the release film.

一実施形態では、第２の接着剤層と第１の導電性フィルムとの剥離強度は、第２の接着剤層と離型フィルムとの剥離強度の１００倍以上である。 In one embodiment, the peel strength between the second adhesive layer and the first conductive film is 100 times or more the peel strength between the second adhesive layer and the release film.

一実施形態では、第２の接着剤層と離型フィルムとの剥離強度は、２００ｍＮ／２５ｍｍ未満である。 In one embodiment, the peel strength between the second adhesive layer and the release film is less than 200 mN / 25 mm.

本開示のタッチパネルは、第１の基板と、第１の基板上に配置された第１の導電性フィルムとを含む第１の導電性フィルム；第１の導電性フィルムの下に配置され、第２の基板と、第２の基板上に配置された第２の導電性フィルムとを含む第２の導電性フィルム；及び第１の導電性フィルムと第２の導電性フィルムとの間に配置され、第１の導電性フィルムと第２の導電性フィルムとに接触する第１の接着剤層を備え、第１の接着剤層と第１の導電性フィルムとの剥離強度が１５０００ｍＮ／２５ｍｍより大きい。 The touch panel of the present disclosure is a first conductive film including a first substrate and a first conductive film arranged on the first substrate; an arrangement under the first conductive film, the first. A second conductive film including a second substrate and a second conductive film disposed on the second substrate; and disposed between the first conductive film and the second conductive film. A first adhesive layer that comes into contact with the first conductive film and the second conductive film is provided, and the peel strength between the first adhesive layer and the first conductive film is larger than 15,000 mN / 25 mm. ..

一実施形態では、タッチパネルは、保護フィルムと、第２の基板と保護フィルムとの間に配置された第３の接着剤層とを更に含み、第３の接着剤層と第２の基板との剥離強度は、第３の接着剤層と保護フィルムとの剥離強度よりも大きい。 In one embodiment, the touch panel further comprises a protective film and a third adhesive layer disposed between the second substrate and the protective film, with the third adhesive layer and the second substrate. The peel strength is higher than the peel strength between the third adhesive layer and the protective film.

一実施形態では、第３の接着剤層と第２の基板との剥離強度は、第３の接着剤層と保護フィルムとの剥離強度の１００倍以上である。 In one embodiment, the peel strength between the third adhesive layer and the second substrate is 100 times or more the peel strength between the third adhesive layer and the protective film.

一実施形態では、第３の接着剤層と保護フィルムとの剥離強度は、２００ｍＮ／２５ｍｍ未満である。 In one embodiment, the peel strength between the third adhesive layer and the protective film is less than 200 mN / 25 mm.

一実施形態では、第１の導電性フィルムおよび第２の導電性フィルムは、それぞれ、複数の銀ナノワイヤを含む。 In one embodiment, the first conductive film and the second conductive film each contain a plurality of silver nanowires.

一実施形態では、第１の導電性フィルムおよび第２の導電性フィルムは、パターニングされた電極層である。 In one embodiment, the first conductive film and the second conductive film are patterned electrode layers.

一実施形態では、タッチパネルは、光学接着剤およびパッシベーション層を更に備え、パッシベーション層は、光学接着剤によって第１の導電性フィルムに付着される。 In one embodiment, the touch panel further comprises an optical adhesive and a passivation layer, the passivation layer being attached to the first conductive film by the optical adhesive.

本明細書における「上に（on）」という用語は、本明細書において、構成要素間の相対的な位置を記述するために使用され得ることに留意されたい。例えば、第２の構成要素上に配置される第１の構成要素は、２つの構成要素が直接接触して形成される実施形態を含み、また、追加の構成要素が２つの構成要素間に形成され得る実施形態も含み得る。 It should be noted that the term "on" herein can be used to describe relative positions between components. For example, the first component placed on the second component comprises an embodiment in which the two components are formed in direct contact, and additional components are formed between the two components. It may also include embodiments that may be possible.

なお、本明細書における「第１」、「第２」、「第３」等の用語は、説明を容易にするために用いることができ、その数や順序には関係しない。例えば、「第１の接着剤層」と「第２の接着剤層」は、いずれも「接着剤層」として実現することができる。 In addition, terms such as "first", "second", and "third" in the present specification can be used for ease of explanation, and are not related to the number or order thereof. For example, both the "first adhesive layer" and the "second adhesive layer" can be realized as an "adhesive layer".

本開示の分野では、保護フィルムまたは離型フィルムを付着させるための接着剤層は通常、同時に除去され、基板または導電層は、作製プロセス中に露出される。しかし、本開示では、保護フィルムまたは離型フィルムを除去する工程において、保護フィルムまたは離型フィルムを付着させるための接着剤層は、基板上に、または導電性フィルムの導電層上に残存し、他の部品を導電性フィルム上に付着させるための接着剤として使用することができる。したがって、接着剤を導電性フィルムにコーティングする工程を省略することができる。 In the art of the present disclosure, the adhesive layer for adhering the protective film or release film is usually removed at the same time and the substrate or conductive layer is exposed during the fabrication process. However, in the present disclosure, in the step of removing the protective film or the release film, the adhesive layer for adhering the protective film or the release film remains on the substrate or on the conductive layer of the conductive film. It can be used as an adhesive for adhering other parts onto a conductive film. Therefore, the step of coating the conductive film with the adhesive can be omitted.

本開示の第１の実施形態のタッチパネルの作製フローチャートである。It is a manufacturing flowchart of the touch panel of 1st Embodiment of this disclosure. 本開示の第１の実施形態の第１の透明導電性積層構造の断面図である。It is sectional drawing of the 1st transparent conductive laminated structure of 1st Embodiment of this disclosure. 本開示の第１の実施形態の第１の透明導電性積層構造の断面図である。It is sectional drawing of the 1st transparent conductive laminated structure of 1st Embodiment of this disclosure. 本開示の第１の実施形態の第１の透明導電性積層構造の断面図である。It is sectional drawing of the 1st transparent conductive laminated structure of 1st Embodiment of this disclosure. 本開示の第１の実施形態の第１の透明導電性積層構造の断面図である。It is sectional drawing of the 1st transparent conductive laminated structure of 1st Embodiment of this disclosure. 本開示の第１の実施形態の第１の透明導電性積層構造及び第２の透明導電性積層構造の断面図である。It is sectional drawing of the 1st transparent conductive laminated structure and the 2nd transparent conductive laminated structure of 1st Embodiment of this disclosure. 本開示の第１の実施形態のタッチパネルの断面図である。It is sectional drawing of the touch panel of 1st Embodiment of this disclosure. 本開示の第２の実施形態の透明導電性積層構造体の断面図である。It is sectional drawing of the transparent conductive laminated structure of the 2nd Embodiment of this disclosure. 本開示の第３の実施形態の透明導電性積層構造体の断面図である。It is sectional drawing of the transparent conductive laminated structure of 3rd Embodiment of this disclosure. 本開示の試験例のタッチパネルの断面図である。It is sectional drawing of the touch panel of the test example of this disclosure. 本開示の試験例の透明導電性積層構造体の断面図である。It is sectional drawing of the transparent conductive laminated structure of the test example of this disclosure.

まず、第１の実施形態のタッチパネル１０００の作製方法は、以下の工程を含む。また、図１のフローチャートおよび図２〜図５の模式図も参照されたい。 First, the method for manufacturing the touch panel 1000 of the first embodiment includes the following steps. Also refer to the flowchart of FIG. 1 and the schematic diagram of FIGS. 2 to 5.

工程（Ａ）は、第１の透明導電性積層構造体１００１を提供する。図２に示す第１の透明導電性積層構造１００１は、主として、第１の導電性フィルム１１、第１の接着剤層１２、第１の保護フィルム１３、第２の接着剤層１４及び第１の離型フィルム１５を含む。 The step (A) provides the first transparent conductive laminated structure 1001. The first transparent conductive laminated structure 1001 shown in FIG. 2 mainly includes a first conductive film 11, a first adhesive layer 12, a first protective film 13, a second adhesive layer 14, and a first. The release film 15 of the above is included.

本実施形態では、第１の導電性フィルム１１は、第１の基板１１１と、第１の導電層１１２と、第１の表面１１３と、第２の表面１１４とを含む。第１の基板１１１は、第１の導電層１１２に機械的支持または保護を付与するものであり、剛性透明基板または可撓性透明基板とすることができる。第１の基板１１１の材料は、限定されるものではないが、ガラス、サファイア、ポリメチルメタクリレート（ＰＭＭＡ）、ポリ塩化ビニル（ＰＶＣ）、ポリプロピレン（ＰＰ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリカーボネート（ＰＣ）、ポリスチレン（ＰＳ）、ポリイミド（ＰＩ）等であってもよい。第１の導電層１１２は、金属ナノワイヤ（銀ナノワイヤ）、透明導電性フィルム（ＩＴＯ、ＩＺＯなど）、または金属メッシュなどの当該技術分野で公知の材料を含む。第１の導電層１１２は、パターニングされた導電層であってもよいし、パターニングされていない導電層であってもよい。本実施形態において、第１の導電層１１２は、第１の基板１１１上に形成された複数の銀ナノワイヤ（ＳＮＷ）によって構成されるパターニングされていない導電層である。第１の表面１１３は第１の基板１１１の露出表面であり、第２の表面１１４は第１の導電層１１２の露出表面である。他の実施形態では、第１の導電層１１２は、銀ナノワイヤ上に形成され、銀ナノワイヤを保護して、銀ナノワイヤの耐久性を向上させるオーバーコート（図に示されていない）をさらに含むことができる。 In this embodiment, the first conductive film 11 includes a first substrate 111, a first conductive layer 112, a first surface 113, and a second surface 114. The first substrate 111 imparts mechanical support or protection to the first conductive layer 112, and may be a rigid transparent substrate or a flexible transparent substrate. The material of the first substrate 111 is, but is not limited to, glass, sapphire, polymethylmethacrylate (PMMA), polyvinyl chloride (PVC), polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (). PEN), polycarbonate (PC), polystyrene (PS), polyimide (PI) and the like may be used. The first conductive layer 112 contains materials known in the art such as metal nanowires (silver nanowires), transparent conductive films (ITO, IZO, etc.), or metal meshes. The first conductive layer 112 may be a patterned conductive layer or an unpatterned conductive layer. In the present embodiment, the first conductive layer 112 is an unpatterned conductive layer composed of a plurality of silver nanowires (SNW) formed on the first substrate 111. The first surface 113 is the exposed surface of the first substrate 111, and the second surface 114 is the exposed surface of the first conductive layer 112. In another embodiment, the first conductive layer 112 further comprises an overcoat (not shown) that is formed on the silver nanowires to protect the silver nanowires and improve the durability of the silver nanowires. Can be done.

第１の接着剤層１２は、第１の保護フィルム１３を第１の導電性フィルム１１の第１の表面１１３に付着させるために利用される。第１の接着剤層１２は、第１の基板１１１と第１の保護フィルム１３との間に配置され、それらと接触して、接着を提供する。第１の接着剤層１２と第１の導電性フィルム１１の第１の基板１１１との剥離強度は、第１の接着剤層１２と第１の保護フィルム１３との剥離強度よりも大きい。具体的には、第１の接着剤層１２と第１の基板１１１との剥離強度が１５０００ｍＮ／２５ｍｍより大きい。第１の接着剤層１２と第１の保護フィルム１３との剥離強度は２００ｍＮ／２５ｍｍ未満である。 The first adhesive layer 12 is used to attach the first protective film 13 to the first surface 113 of the first conductive film 11. The first adhesive layer 12 is arranged between the first substrate 111 and the first protective film 13 and comes into contact with them to provide adhesion. The peel strength between the first adhesive layer 12 and the first substrate 111 of the first conductive film 11 is larger than the peel strength between the first adhesive layer 12 and the first protective film 13. Specifically, the peel strength between the first adhesive layer 12 and the first substrate 111 is larger than 15,000 mN / 25 mm. The peel strength between the first adhesive layer 12 and the first protective film 13 is less than 200 mN / 25 mm.

第１の保護フィルム１３は、第１の導電性フィルム１１の第１の基板１１１の表面を、搬送中や加工前の衝突や汚染による損傷から保護する。第１の保護フィルム１３の材料は通常、当業者に知られている保護フィルムとして用いられる可撓性材料とすることができる。例えば、第１の保護フィルム１３の材料は、第１の保護フィルム１３と第１の接着剤層１２との剥離強度が第１の接着剤層１２と第１の基板１１１との剥離強度よりも小さい限り、すなわち、第１の保護フィルム１３と第１の接着剤層１２との剥離強度が２００ｍＮ／２５ｍｍ未満である限り、ポリエステル、ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート、ポリメチルメタクリレート（ＰＭＭＡ）、アクリル樹脂、ポリカーボネート（ＰＣ）、ポリスチレン、ポリ塩化ビニル（ＰＶＣ）、ポリビニルアルコール、ポリ塩化ビニリデン、ポリエチレン、エチレン酢酸ビニル共重合体、ポリウレタン、セロファン、ポリオレフィン、シクロオレフィンコポリマー（ＣＯＰ）、ポリテトラフルオロエチレン（ＰＴＦＥ）又はこれらの混合物であってもよいが、これらに限定されない。 The first protective film 13 protects the surface of the first substrate 111 of the first conductive film 11 from damage due to collision or contamination during transportation or before processing. The material of the first protective film 13 can be a flexible material usually used as a protective film known to those skilled in the art. For example, in the material of the first protective film 13, the peel strength between the first protective film 13 and the first adhesive layer 12 is higher than the peel strength between the first adhesive layer 12 and the first substrate 111. Polyester, polyethylene terephthalate (PET), polyvinyl terephthalate, polymethylmethacrylate (PMMA) as long as it is small, that is, as long as the peel strength between the first protective film 13 and the first adhesive layer 12 is less than 200 mN / 25 mm. , Acrylic resin, polycarbonate (PC), polystyrene, polyvinyl chloride (PVC), polyvinyl alcohol, polyvinylidene chloride, polyethylene, ethylene vinyl acetate copolymer, polyurethane, cellophane, polyolefin, cycloolefin copolymer (COP), polytetrafluoro It may be, but is not limited to, polyethylene (PTFE) or a mixture thereof.

第２の接着剤層１４は、第１の離型フィルム１５を第１の導電性フィルム１１の第２の表面１１４に付着させるのに利用される。第２の接着剤層１４は、第１の導電層１１２と第１の離型フィルム１５との間に配置され、接着を付与する。本実施形態では、第２の接着剤層１４は、第２の接着剤層１４が第１の導電層１１２から剥離可能であり、かつ第１の離型フィルム１５から剥離可能でない限り、当該技術分野で公知の光学接着剤または水性接着剤（glue）であってもよい。 The second adhesive layer 14 is used to attach the first release film 15 to the second surface 114 of the first conductive film 11. The second adhesive layer 14 is arranged between the first conductive layer 112 and the first release film 15 to impart adhesion. In the present embodiment, the second adhesive layer 14 is the art unless the second adhesive layer 14 can be peeled off from the first conductive layer 112 and from the first release film 15. It may be an optical adhesive or a water-based adhesive (glue) known in the field.

第１の離型フィルム１５は、第１の保護フィルム１３と同様であり、可撓性材料から構成されることができる。第１の離型フィルム１５は、第１の導電性フィルム１１の第１の導電層１１２の表面を、搬送時や加工前の衝突や汚染による損傷から保護する。第１の離型フィルム１５の材料は、第１の保護フィルム１３と同様であり、同じ説明を繰り返す必要はない。 The first release film 15 is similar to the first protective film 13 and can be made of a flexible material. The first release film 15 protects the surface of the first conductive layer 112 of the first conductive film 11 from damage due to collision or contamination during transportation or before processing. The material of the first release film 15 is the same as that of the first protective film 13, and it is not necessary to repeat the same description.

図３を参照すると、工程（Ｂ）は、第１の離型フィルム１５及び第２の接着剤層１４を除去するものである。本実施形態では、第２の接着剤層１４は第１の導電層１１２から剥離可能であり、第１の離型フィルム１５から剥離不可能であるため、第１の離型フィルム１５を除去する際に、第２の接着剤層１４は第１の離型フィルム１５とともに、第１の導電層１１２から分離される。第１の導電層１１２は、第１の離型フィルム１５及び第２の接着剤層１４を除去した後に露出される。 Referring to FIG. 3, step (B) removes the first release film 15 and the second adhesive layer 14. In the present embodiment, the second adhesive layer 14 can be peeled off from the first conductive layer 112 and cannot be peeled off from the first release film 15, so that the first release film 15 is removed. At this time, the second adhesive layer 14 is separated from the first conductive layer 112 together with the first release film 15. The first conductive layer 112 is exposed after removing the first release film 15 and the second adhesive layer 14.

図４を参照すると、工程（Ｃ）は、第１の導電層１１２をパターニングするものである。第１の導電層１１２をパターニングするパターニング工程は、レーザパターニング法により行われる。しかし、本ステップは、スクリーン印刷および硬化によって第１の導電層１１２上に第１の銀ペースト１１５を形成し、次いで、レーザパターニングによって第１の銀ペースト１１５および第１の導電層１１２を一緒にパターニングすることを更に含むことができる。 Referring to FIG. 4, the step (C) is to pattern the first conductive layer 112. The patterning step for patterning the first conductive layer 112 is performed by a laser patterning method. However, in this step, the first silver paste 115 is formed on the first conductive layer 112 by screen printing and curing, and then the first silver paste 115 and the first conductive layer 112 are put together by laser patterning. It can further include patterning.

図５を参照すると、工程（Ｄ）は、パッシベーション層３を第１の透明導電性積層構造体１００１上に付着させるものである。保護を付与するために、パッシベーション層３を、光学接着剤層４を介してパターニングされた第１の導電層１１２および第１の銀ペースト１１５に付着する。光学接着剤層４は、パッシベーション層３を第１の透明導電性積層構造体１００１にしっかりと付着できる限り、当該技術分野で公知の任意の種類の光学接着剤とすることができる。パッシベーション層３は、ガラス板、プラスチック板、サファイア板又は表面強化基板（例えば、６つの表面で強化されるか、または上面と下面だけで強化される）とすることができる。パッシベーション層３を付着させる目的は、ユーザがタッチパネル１０００を押圧したときにタッチパネル１０００の内部構造が損傷から保護することである。 Referring to FIG. 5, in step (D), the passivation layer 3 is attached onto the first transparent conductive laminated structure 1001. To provide protection, the passivation layer 3 is attached to the first conductive layer 112 and the first silver paste 115 patterned via the optical adhesive layer 4. The optical adhesive layer 4 can be any kind of optical adhesive known in the art as long as the passivation layer 3 can be firmly adhered to the first transparent conductive laminated structure 1001. The passivation layer 3 can be a glass plate, a plastic plate, a sapphire plate or a surface reinforced substrate (eg, reinforced on six surfaces or reinforced only on top and bottom surfaces). The purpose of attaching the passivation layer 3 is to protect the internal structure of the touch panel 1000 from damage when the user presses the touch panel 1000.

図６に示すように、工程（Ｅ）は、第２の透明導電性積層構造体１００２を提供するものである。第２の透明導電性積層構造体１００２は、第２の導電性フィルム２１と、第３の接着剤層２２と、第２の保護フィルム２３とを含む。第２の導電性フィルム２１は、第２の基板２１１と、パターニングされた第２の導電層２１２と、パターニングされた第２の銀ペースト層２１３とを含む。第２の透明導電性積層構造体１００２の作製方法は、第１の透明導電性積層構造体１００１と同様である。第３の接着剤層２２は、第１の接着剤層１２と同一であり、同じ説明を繰り返す必要はない。 As shown in FIG. 6, the step (E) provides a second transparent conductive laminated structure 1002. The second transparent conductive laminated structure 1002 includes a second conductive film 21, a third adhesive layer 22, and a second protective film 23. The second conductive film 21 includes a second substrate 211, a patterned second conductive layer 212, and a patterned second silver paste layer 213. The method for producing the second transparent conductive laminated structure 1002 is the same as that for the first transparent conductive laminated structure 1001. The third adhesive layer 22 is the same as the first adhesive layer 12, and it is not necessary to repeat the same description.

最後に、図７に示すように、工程（Ｆ）は、第１の保護フィルム１３を除去し、その後、第１の透明導電性積層構造体１００１と第２の透明導電性積層構造体１００２とを積層してタッチパネル１０００の作製を完了する。タッチパネル１０００は、パッシベーション層３、光学接着剤層４、第１の銀ペースト１１５（パターニングされたもの）、第１の導電層１１２（パターニングされたもの）、第１の基板１１１、第１の接着剤層１２、第２の銀ペースト２１３（パターニングされたもの）、第２の導電層２１２（パターニングされたもの）、第２の基板２１１、第３の接着剤層２２、および第２の保護フィルム２３を、上から下へ順に含む。 Finally, as shown in FIG. 7, in the step (F), the first protective film 13 is removed, and then the first transparent conductive laminated structure 1001 and the second transparent conductive laminated structure 1002 are formed. Are laminated to complete the production of the touch panel 1000. The touch panel 1000 includes a passage layer 3, an optical adhesive layer 4, a first silver paste 115 (patterned), a first conductive layer 112 (patterned), a first substrate 111, and a first adhesive. Agent layer 12, second silver paste 213 (patterned), second conductive layer 212 (patterned), second substrate 211, third adhesive layer 22, and second protective film. 23 is included in order from top to bottom.

本開示により提供されるタッチパネル１０００の以下の組立工程では、例えば、タッチディスプレイパネルを製造するためにタッチパネル１０００をディスプレイに取り付ける際に、第２の保護フィルム２３を除去してもよい。第２の基板２１１上に残っている第３の接着剤層２２は、タッチパネル１０００をディスプレイパネル、他の構成要素、またはキャリアに取り付けるための接着を提供することができる。 In the following assembly steps of the touch panel 1000 provided by the present disclosure, for example, the second protective film 23 may be removed when the touch panel 1000 is attached to the display for manufacturing a touch display panel. The third adhesive layer 22 remaining on the second substrate 211 can provide an adhesive for attaching the touch panel 1000 to a display panel, other component, or carrier.

具体的には、本実施形態のタッチパネル１０００は、ガラス／センサーフィルムＸ／センサーフィルム（ＧＦＦ）構造を有する。すなわち、工程（Ｃ）でパターニングされる第１の導電層１１２は第１の軸タッチ電極を含み、工程（Ｅ）でパターニングされる第２の導電層２１２は第２の軸タッチ電極を含み、第１の軸と第２の軸は互い違いに配置され（staggered）、例えば、第１の軸と第２の軸は垂直に互い違いに配置される。 Specifically, the touch panel 1000 of the present embodiment has a glass / sensor film X / sensor film (GFF) structure. That is, the first conductive layer 112 patterned in the step (C) includes the first shaft touch electrode, and the second conductive layer 212 patterned in the step (E) includes the second shaft touch electrode. The first and second axes are staggered, for example, the first and second axes are vertically staggered.

タッチパネル１０００の作製方法では、保護フィルムを導電層に付着させるために、保護フィルムからの剥離強度が弱い接着剤層を選択する。すなわち、接着剤層は、保護フィルムから剥離可能な光学接着剤である。したがって、接着剤層は基板上に接着剤層が残存する場合があり、保護フィルムを除去する際に、保護フィルムとともに分離されるおそれがある。基板上に残存する接着剤剤層は、依然として粘着性を有しており、導電性フィルム又はタッチパネルを目的のキャリアに付着させるための接着剤として直接使用することができる。これにより、新たな光学接着剤や水性接着剤が不要となる。また、接着剤層を形成し、その後、除去する工程を減らすことにより、タッチパネルの作製工程を簡略化することもできる。また、タッチパネルは、高透過率及び低ヘイズなど、光学特性にも優れている。 In the method for manufacturing the touch panel 1000, in order to attach the protective film to the conductive layer, an adhesive layer having a weak peel strength from the protective film is selected. That is, the adhesive layer is an optical adhesive that can be peeled off from the protective film. Therefore, the adhesive layer may remain on the substrate and may be separated together with the protective film when the protective film is removed. The adhesive layer remaining on the substrate is still adhesive and can be used directly as an adhesive for adhering the conductive film or touch panel to the desired carrier. This eliminates the need for new optical or water-based adhesives. Further, the manufacturing process of the touch panel can be simplified by reducing the steps of forming the adhesive layer and then removing the adhesive layer. The touch panel is also excellent in optical characteristics such as high transmittance and low haze.

図８を参照すると、本開示の第２の実施形態の透明導電性積層構造体２００１は、第１の実施形態と同様であり、透明導電性積層構造体２００１は、主に、第１の導電性フィルム１１、第１の接着剤層１２、第１の保護フィルム１３、第２の接着剤層１４、及び第１の離型フィルム１５を含み、第１の導電性フィルム１１も、第１の基板１１１及び第１の導電層１１２を含む。本実施形態と第１の実施形態との相違点は、第２の接着剤層１４の特性である。本実施形態では、第１の導電性フィルム１１の第２の接着剤層１４と第１の導電層１１２との剥離強度は、第２の接着剤層１４と第１の離型フィルム１５との剥離強度よりも大きい。具体的には、第２の接着剤層１４と第１の導電層１１２との剥離強度は１５０００ｍＮ／２５ｍｍより大きくすべきであり、第２の接着剤層１４と第１の離型フィルム１５との剥離強度は２００ｍＮ／２５ｍｍより小さくすべきである。 Referring to FIG. 8, the transparent conductive laminated structure 2001 of the second embodiment of the present disclosure is the same as that of the first embodiment, and the transparent conductive laminated structure 2001 is mainly a first conductive film. The first conductive film 11 also includes the sex film 11, the first adhesive layer 12, the first protective film 13, the second adhesive layer 14, and the first release film 15. The substrate 111 and the first conductive layer 112 are included. The difference between the present embodiment and the first embodiment is the characteristics of the second adhesive layer 14. In the present embodiment, the peel strength between the second adhesive layer 14 and the first conductive layer 112 of the first conductive film 11 is the peel strength between the second adhesive layer 14 and the first release film 15. Greater than peel strength. Specifically, the peel strength between the second adhesive layer 14 and the first conductive layer 112 should be larger than 15000 mN / 25 mm, and the second adhesive layer 14 and the first release film 15 The peel strength should be less than 200 mN / 25 mm.

本実施形態の透明導電性積層構造体２００１を用いたタッチパネルの作製工程では、第１の保護フィルム１３を除去する際に第１の接着剤層１２から第１の保護フィルム１３を分離し、第１の離型フィルム１５を除去する際に第２の接着剤層１４から第１の離型フィルム１５を分離する。第１の接着剤層１２及び第２の接着剤層１４はそれぞれ、透明導電性積層構造体２００１を他の部品又はキャリアに付着させるために、第１の基板１１１及び第１の導電層１１２上に残存する。 In the step of manufacturing the touch panel using the transparent conductive laminated structure 2001 of the present embodiment, when the first protective film 13 is removed, the first protective film 13 is separated from the first adhesive layer 12 and the first protective film 13 is separated. When removing the release film 15 of 1, the first release film 15 is separated from the second adhesive layer 14. The first adhesive layer 12 and the second adhesive layer 14 are on the first substrate 111 and the first conductive layer 112, respectively, in order to attach the transparent conductive laminated structure 2001 to other parts or carriers. Remains in.

図９を参照すると、本開示の第３の実施形態の透明導電性積層構造体３００１は、第１の実施形態と同様であり、透明導電性積層構造体３００１は、主に、第１の導電性フィルム１１、第１の接着剤層１２、第１の保護フィルム１３、第２の接着剤層１４、及び第１の離型フィルム１５を含み、第１の導電性フィルム１１も、第１の基板１１１及び第１の導電層１１２を含む。本実施の形態と第１の実施の形態との相違点は、本実施の形態の第１の導電性フィルム１１の方向が第１の実施の形態と逆であることである。すなわち、第１の保護フィルム１３は、第１の接着剤層１２を介して第１の導電性フィルム１１の第１の導電層１１２に付着され、第１の離型フィルム１５は、第２の接着剤層１４を介して第１の導電性フィルム１１の第１の基板１１１に付着される。また、本実施形態では、第１の接着剤層１２と第１の導電層１１２との剥離強度は、第１の接着剤層１２と第１の保護フィルム１３との剥離強度よりも大きい。具体的には、第１の接着剤層１２と第１の導電層１１２との剥離強度は１５０００ｍＮ／２５ｍｍより大きくすべきであり、第１の接着剤層１２と第１の保護フィルム１３との剥離強度は２００ｍＮ／２５ｍｍより小さくすべきである。第２の接着剤層１４と第１の基板１１１との剥離強度は、第２の接着剤層１４と第１の離型フィルム１５との剥離強度よりも小さい。 Referring to FIG. 9, the transparent conductive laminated structure 3001 of the third embodiment of the present disclosure is the same as that of the first embodiment, and the transparent conductive laminated structure 3001 is mainly a first conductive film. The first conductive film 11 also includes the sex film 11, the first adhesive layer 12, the first protective film 13, the second adhesive layer 14, and the first release film 15. The substrate 111 and the first conductive layer 112 are included. The difference between the present embodiment and the first embodiment is that the direction of the first conductive film 11 of the present embodiment is opposite to that of the first embodiment. That is, the first protective film 13 is attached to the first conductive layer 112 of the first conductive film 11 via the first adhesive layer 12, and the first release film 15 is a second. It is adhered to the first substrate 111 of the first conductive film 11 via the adhesive layer 14. Further, in the present embodiment, the peel strength between the first adhesive layer 12 and the first conductive layer 112 is larger than the peel strength between the first adhesive layer 12 and the first protective film 13. Specifically, the peel strength between the first adhesive layer 12 and the first conductive layer 112 should be larger than 15000 mN / 25 mm, and the first adhesive layer 12 and the first protective film 13 The peel strength should be less than 200 mN / 25 mm. The peel strength between the second adhesive layer 14 and the first substrate 111 is smaller than the peel strength between the second adhesive layer 14 and the first release film 15.

したがって、本実施形態の透明導電性積層構造体３００１を用いたタッチパネルの作製工程では、第１の保護フィルム１３を除去する際に、第１の保護フィルム１３を第１の接着剤層１２から分離する。第１の接着剤層１２は、透明導電性積層構造体３００１を他の構成要素またはキャリア上に、以下の組み立て工程で付着させるために、第１の導電層１１２上に残存する。しかし、第２の接着剤層１４は、第１の離型フィルム１５を第１の基板１１１から除去する際に、第１の離型フィルム１５とともに除去され、第１の基板１１１が露出する。 Therefore, in the step of manufacturing the touch panel using the transparent conductive laminated structure 3001 of the present embodiment, when the first protective film 13 is removed, the first protective film 13 is separated from the first adhesive layer 12. do. The first adhesive layer 12 remains on the first conductive layer 112 in order to attach the transparent conductive laminated structure 3001 onto other components or carriers in the following assembly steps. However, the second adhesive layer 14 is removed together with the first release film 15 when the first release film 15 is removed from the first substrate 111, and the first substrate 111 is exposed.

さらに、他の実施形態では、第１の透明導電性積層構造体の第１の導電層は、パターニングされた導電層であってもよい。また、第２透明導電性積層構造体の第２導電層は、パターニングされた導電層であってもよい。 Furthermore, in another embodiment, the first conductive layer of the first transparent conductive laminated structure may be a patterned conductive layer. Further, the second conductive layer of the second transparent conductive laminated structure may be a patterned conductive layer.

実験例１
図１０を参照すると、本実験例では、上から順に、第１の導電層１１２（コーティング層を含む）、第１の基板１１１、第１の接着剤層１２、第２の導電層２１２（コーティング層を含む）、及び第２の基板２１１を備えたタッチパネル４０００を提供した。本実験例では、第１の基板１１１及び第２の基板２１１の材料をＰＥＴとした。第１の導電層１１２および第２の導電層２１２は、コーティング層でコーティングされた複数の銀ナノワイヤから構成され、第１の接着剤層１２は透明光学接着剤であった。本実験例では、タッチパネルの作製工程に含まれる熱処理工程をシミュレーションし、第２の導電層２１２と第１の接着剤層１２との剥離強度、および熱処理工程前後のタッチパネル４０００の透明度、ヘイズ、ｂ＊値を測定した。第２の導電層２１２と第１の接着剤層１２との剥離強度、タッチパネル４０００の透明度、ヘイズ、ｂ＊値に及ぼす熱処理工程の影響を観察した。実施例１のタッチパネル４０００は、熱処理を行っていない。実施例２のタッチパネル４０００を１５０°Ｃで５０分間熱処理した。実施例３のタッチパネル４０００を１５０°Ｃで５０分、かつ１４０°Ｃで４０分熱処理した。第２の導電層２１２と第１の接着剤層１２との剥離強度、タッチパネル４０００の透明度、ヘイズ、ｂ＊値を測定した。結果を表１に示す。

Figure 2021194908
Experimental Example 1
Referring to FIG. 10, in this experimental example, in order from the top, the first conductive layer 112 (including the coating layer), the first substrate 111, the first adhesive layer 12, and the second conductive layer 212 (coating). A touch panel 4000 with a layer) and a second substrate 211 was provided. In this experimental example, the material of the first substrate 111 and the second substrate 211 was PET. The first conductive layer 112 and the second conductive layer 212 were composed of a plurality of silver nanowires coated with a coating layer, and the first adhesive layer 12 was a transparent optical adhesive. In this experimental example, the heat treatment process included in the touch panel manufacturing process is simulated, the peel strength between the second conductive layer 212 and the first adhesive layer 12, and the transparency, haze, and b of the touch panel 4000 before and after the heat treatment process. * The value was measured. The effects of the heat treatment step on the peel strength between the second conductive layer 212 and the first adhesive layer 12, the transparency of the touch panel 4000, the haze, and the b * value were observed. The touch panel 4000 of Example 1 has not been heat-treated. The touch panel 4000 of Example 2 was heat-treated at 150 ° C. for 50 minutes. The touch panel 4000 of Example 3 was heat-treated at 150 ° C for 50 minutes and at 140 ° C for 40 minutes. The peel strength between the second conductive layer 212 and the first adhesive layer 12, the transparency of the touch panel 4000, the haze, and the b * value were measured. The results are shown in Table 1.
Figure 2021194908

実験例１の結果によれば、接着剤層の剥離強度は熱処理の影響を受けず、タッチパネルの透明度、ヘイズ、及びｂ＊値は大きく変化しなかった。すなわち、本開示により提供されるタッチパネルは、熱処理後も、依然として優れた透明性を有している。 According to the results of Experimental Example 1, the peel strength of the adhesive layer was not affected by the heat treatment, and the transparency, haze, and b * value of the touch panel did not change significantly. That is, the touch panel provided by the present disclosure still has excellent transparency even after the heat treatment.

実験例２
図１１を参照すると、本実験例では、透明導電性積層構造体４００１の第１の接着剤層１２と第１の保護フィルム１３との剥離強度を測定し、熱処理が剥離強度に及ぼす影響を評価した。実施例４の透明導電性積層構造体４００１は、熱処理を行っていない。実施例５の透明導電性積層構造体４００１を１５０°Ｃで５０分間熱処理した。実施例６の透明導電性積層体４００１を１５０°Ｃで５０分、かつ１４０°Ｃで４０分熱処理した。第１の接着剤層１２と第１の保護フィルム１３との剥離強度を測定した結果を表２に示す。

Figure 2021194908
その結果、実施例５では剥離強度が４４％減少し、実施例６では５３％増加した。しかし、第１の接着剤層１２と第１の保護フィルム１３との剥離強度は、依然として２００ｍＮ／２５ｍｍ未満であった。したがって、第１の保護フィルム１３は、第１の接着剤層１２から依然として剥離可能であった。 Experimental Example 2
Referring to FIG. 11, in this experimental example, the peel strength between the first adhesive layer 12 and the first protective film 13 of the transparent conductive laminated structure 4001 is measured, and the influence of the heat treatment on the peel strength is evaluated. did. The transparent conductive laminated structure 4001 of Example 4 has not been heat-treated. The transparent conductive laminated structure 4001 of Example 5 was heat-treated at 150 ° C. for 50 minutes. The transparent conductive laminate 4001 of Example 6 was heat-treated at 150 ° C. for 50 minutes and at 140 ° C. for 40 minutes. Table 2 shows the results of measuring the peel strength between the first adhesive layer 12 and the first protective film 13.
Figure 2021194908
 As a result, the peel strength decreased by 44% in Example 5 and increased by 53% in Example 6. However, the peel strength between the first adhesive layer 12 and the first protective film 13 was still less than 200 mN / 25 mm. Therefore, the first protective film 13 was still removable from the first adhesive layer 12.

上記の開示は、その詳細な技術的内容および発明の特徴に関する。当業者は、その特徴から逸脱することなく、記載された開示および開示の示唆に基づいて種々の修正および置換を行うことができる。それにもかかわらず、そのような修正および置換は、上記の説明において完全には開示されていないが、これらは添付の特許請求の範囲において実質的に包含されるものである。 The above disclosure relates to its detailed technical content and features of the invention. One of ordinary skill in the art can make various modifications and substitutions based on the disclosed disclosures and suggestions of disclosure without departing from their characteristics. Nevertheless, such amendments and substitutions are not fully disclosed in the above description, but they are substantially included in the appended claims.

Claims (16)

第１の表面および前記第１の表面の反対の第２の表面を含む第１の導電性フィルムと、
前記第１の導電性フィルムの前記第１の表面上に配置された第１の接着剤層と、
前記第１の接着剤層上に配置された保護フィルムと、を備え、
前記第１の接着剤層と前記第１の導電性フィルムとの剥離強度は、前記第１の接着剤層と前記保護フィルムとの剥離強度よりも大きい、透明導電性積層構造体。 A first conductive film comprising a first surface and a second surface opposite the first surface.
A first adhesive layer disposed on the first surface of the first conductive film and
With a protective film disposed on the first adhesive layer,
A transparent conductive laminated structure in which the peel strength between the first adhesive layer and the first conductive film is larger than the peel strength between the first adhesive layer and the protective film. 請求項１に記載の透明導電性積層構造体であって、前記第１の接着剤層と前記第１の導電性フィルムとの剥離強度は、前記第１の接着剤層と前記保護フィルムとの剥離強度の１００倍以上である、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 1, wherein the peel strength between the first adhesive layer and the first conductive film is the same as that of the first adhesive layer and the protective film. A transparent conductive laminated structure having a peel strength of 100 times or more. 請求項２に記載の透明導電性積層構造体であって、前記第１の接着剤層と前記保護フィルムとの剥離強度が２００ｍＮ／２５ｍｍ未満である、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 2, wherein the peel strength between the first adhesive layer and the protective film is less than 200 mN / 25 mm. 請求項１に記載の透明導電性積層構造体であって、前記第１の導電性フィルムは、第１の基板と、前記第１の基板上に配置された第１の導電層とを含み、前記第１の接着剤層は、前記第１の基板と前記保護フィルムとの間又は前記第１の導電層と前記保護フィルムとの間に配置されている、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 1, wherein the first conductive film includes a first substrate and a first conductive layer arranged on the first substrate. The first adhesive layer is a transparent conductive laminated structure arranged between the first substrate and the protective film or between the first conductive layer and the protective film. 請求項１に記載の透明導電性積層構造体であって、前記第１の導電性フィルムは、複数の銀ナノワイヤを含む、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 1, wherein the first conductive film is a transparent conductive laminated structure containing a plurality of silver nanowires. 請求項１に記載の透明導電性積層構造体であって、
前記第１の導電性フィルムの前記第２の表面上に配置された第２の接着剤層と、
前記第２の接着剤層上に配置された離型フィルムと、
を更に含み、
前記第２の接着剤層と前記第１の導電性フィルムとの剥離強度は、前記第２の接着剤層と前記離型フィルムとの剥離強度よりも大きい、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 1.
A second adhesive layer disposed on the second surface of the first conductive film and
With the release film arranged on the second adhesive layer,
Including
A transparent conductive laminated structure in which the peel strength between the second adhesive layer and the first conductive film is larger than the peel strength between the second adhesive layer and the release film. 請求項６に記載の透明導電性積層構造体であって、前記第１の導電性フィルムは、第１の基板と、前記第１の基板上に配置された第１の導電層とを含み、前記第１の接着剤層は、前記第１の基板と前記保護フィルムとの間に配置され、前記第２の接着剤層は、前記第１の導電層と前記離型フィルムとの間に配置される、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 6, wherein the first conductive film includes a first substrate and a first conductive layer arranged on the first substrate. The first adhesive layer is arranged between the first substrate and the protective film, and the second adhesive layer is arranged between the first conductive layer and the release film. A transparent conductive laminated structure. 請求項６に記載の透明導電性積層構造体であって、前記第２の接着剤層と前記第１の導電性フィルムとの剥離強度は、前記第２の接着剤層と前記離型フィルムとの剥離強度の１００倍以上である、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 6, wherein the peel strength between the second adhesive layer and the first conductive film is different from that of the second adhesive layer and the release film. A transparent conductive laminated structure having a peel strength of 100 times or more. 請求項８に記載の透明導電性積層構造体において、前記第２の接着剤層と前記離型フィルムとの剥離強度が２００ｍＮ／２５ｍｍ未満である、透明導電性積層構造体。 The transparent conductive laminated structure according to claim 8, wherein the peel strength between the second adhesive layer and the release film is less than 200 mN / 25 mm. 第１の基板と、前記第１の基板上に配置された第１の導電性フィルムとを含む第１の導電性フィルム、
前記第１の導電性フィルムの下に配置され、第２の基板と、前記第２の基板上に配置された第２の導電性フィルムとを含む第２の導電性フィルム、及び
前記第１の導電性フィルムと前記第２の導電性フィルムとの間に配置され、前記第１の導電性フィルムと前記第２の導電性フィルムとに接触する第１の接着剤層、を備え、
前記第１の接着剤層と前記第１の導電性フィルムとの剥離強度が１５０００ｍＮ／２５ｍｍより大きい、タッチパネル。 A first conductive film comprising a first substrate and a first conductive film disposed on the first substrate,
A second conductive film, which is arranged under the first conductive film and includes a second substrate and a second conductive film arranged on the second substrate, and the first. A first adhesive layer, which is arranged between the conductive film and the second conductive film and is in contact with the first conductive film and the second conductive film, is provided.
A touch panel having a peel strength between the first adhesive layer and the first conductive film of more than 15,000 mN / 25 mm. 請求項１０に記載のタッチパネルであって、
保護フィルムと、
前記第２の基板と前記保護フィルムとの間に配置された第３の接着剤層と、を更に含み、
前記第３の接着剤層と前記第２の基板との剥離強度は、前記第３の接着剤層と前記保護フィルムとの剥離強度よりも大きい、タッチパネル。 The touch panel according to claim 10.
With a protective film
Further comprising a third adhesive layer disposed between the second substrate and the protective film.
A touch panel in which the peel strength between the third adhesive layer and the second substrate is larger than the peel strength between the third adhesive layer and the protective film. 請求項１１に記載のタッチパネルであって、前記第３の接着剤層と前記第２の基板との剥離強度は、前記第３の接着剤層と前記保護フィルムとの剥離強度の１００倍以上である、タッチパネル。 In the touch panel according to claim 11, the peel strength between the third adhesive layer and the second substrate is 100 times or more the peel strength between the third adhesive layer and the protective film. There is a touch panel. 請求項１１に記載のタッチパネルであって、前記第３の接着剤層と前記保護フィルムとの剥離強度が２００ｍＮ／２５ｍｍ未満である、タッチパネル。 The touch panel according to claim 11, wherein the peel strength between the third adhesive layer and the protective film is less than 200 mN / 25 mm. 請求項１０に記載のタッチパネルであって、前記第１の導電性フィルムおよび前記第２の導電性フィルムは、それぞれ、複数の銀ナノワイヤを含む、タッチパネル。 The touch panel according to claim 10, wherein the first conductive film and the second conductive film each include a plurality of silver nanowires. 請求項１０に記載のタッチパネルであって、前記第１の導電性フィルム及び前記第２の導電性フィルムは、パターニングされた電極層である、タッチパネル。 The touch panel according to claim 10, wherein the first conductive film and the second conductive film are patterned electrode layers. 請求項１０に記載のタッチパネルであって、光学接着剤層とパッシベーション層とを更に含み、前記パッシベーション層は前記光学接着剤層によって前記第１の導電性フィルムに付着されている、タッチパネル。 The touch panel according to claim 10, further comprising an optical adhesive layer and a passivation layer, wherein the passivation layer is attached to the first conductive film by the optical adhesive layer.
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