JP2021190658A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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JP2021190658A
JP2021190658A JP2020097667A JP2020097667A JP2021190658A JP 2021190658 A JP2021190658 A JP 2021190658A JP 2020097667 A JP2020097667 A JP 2020097667A JP 2020097667 A JP2020097667 A JP 2020097667A JP 2021190658 A JP2021190658 A JP 2021190658A
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substrate
roller
downstream
elevating
upstream
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JP7056972B2 (en
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政憲 秋山
Masanori Akiyama
達彦 松尾
Tatsuhiko Matsuo
哲也 片庭
Tetsuya Kataniwa
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CHEMITRON Inc
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CHEMITRON Inc
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Priority to TW109140484A priority patent/TWI740723B/en
Priority to CN202011446244.4A priority patent/CN113764318A/en
Priority to KR1020200171123A priority patent/KR102432828B1/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/08Apparatus, e.g. for photomechanical printing surfaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/002Etching of the substrate by chemical or physical means by liquid chemical etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

To prevent interference between a function part and a substrate as well as effectively functioning the function part.SOLUTION: An elevating body 33 is arranged between a first rotational axis 42 and a second rotational axis 44 above a conveyance reference surface 18, and is maintained at a predetermined downward position with respect to a conveyance reference surface 18 while both of first and second rollers 31 and 32 are not ridden on an upper surface of a substrate 1, and is maintained so as to be lifted to the upward from the downward position by the rotational axis of each roller ridden on the upper surface of the substrate while at least one of the first and second rollers 31 and 32 is ridden on the upper surface of the substrate 1. Elevating direction regulation means 35 and 36 regulate an elevating direction of the elevating body 33 when elevating it from the downward position to an appropriate vertical direction with respect to the conveyance reference surface 18. A function part 50 is fixedly provided to the elevating body 33 so that the elevating body 33 is positioned above the conveyance reference surface 18 in a state where it is dropped at the downward position, and functions so as to be opposite from the upward to the upper surface of the substrate 1 in the middle of the conveyance.SELECTED DRAWING: Figure 8

Description

本発明は、プリント配線板やリードフレーム等の金属板(以下、対象とするプリント配線板、リードフレーム等の金属板を基板と略す)を搬送して処理する基板処理装置に関する。 The present invention relates to a substrate processing apparatus that conveys and processes a metal plate such as a printed wiring board or a lead frame (hereinafter, a metal plate such as a target printed wiring board or a lead frame is abbreviated as a substrate).

特許文献1には、水平に並んだプリント回路板面を有するプリント回路板の搬送手段と、プリント回路板の搬送面の上部に配列され、供給容器から供給された液体状の処理媒体をプリント回路板の上面に吹き付けるためのノズル装置と、スプレー操作の間プリント回路板の上面に吹き付けられた処理媒体を吸引するための吸引ノズルユニット(吸引パイプ)とを備えたスプレー処理装置が記載されている。 In Patent Document 1, a transport means for a printed circuit board having horizontally arranged printed circuit board surfaces and a liquid processing medium arranged on the upper portion of the transport surface of the printed circuit board and supplied from a supply container are printed. A spray processing device including a nozzle device for spraying on the upper surface of a plate and a suction nozzle unit (suction pipe) for sucking a processing medium sprayed on the upper surface of a printed circuit board during a spray operation is described. ..

吸引パイプは、複数の吸引ノズルを備え、吸引ノズルは、吸引パイプの円周上でスリット状の開口部になっている。吸引パイプは、支持部材の前面に固定され、支持部材は、2個の上側搬送ローラに軸受支持されている。 The suction pipe is provided with a plurality of suction nozzles, and the suction nozzles are slit-shaped openings on the circumference of the suction pipe. The suction pipe is fixed to the front surface of the support member, and the support member is bearing-supported by two upper transport rollers.

特開2003−243811号公報Japanese Unexamined Patent Publication No. 2003-243811

特許文献1の装置では、支持部材(昇降体)に2個の上側搬送ローラ(搬送方向上流側の第1のローラと搬送方向下流側の第2のローラ)が軸受支持されているため、第1のローラがプリント回路板(基板)の上面に乗り上げた後、第2のローラが基板の上面に乗り上げるまでの間、及び第1のローラが基板の上面から降下した後、第2のローラが基板の上面から降下するまでの間は、基板に対して昇降体が傾斜した状態となる。このため、吸引パイプ(機能部)の開口部と基板の上面との間の距離が一定せず、吸引機能が有効に発揮されない可能性がある。また、基板の板厚が増大した場合(板厚の厚い基板を処理する場合)、基板が昇降体又は機能部に干渉するおそれがある。 In the apparatus of Patent Document 1, two upper transport rollers (the first roller on the upstream side in the transport direction and the second roller on the downstream side in the transport direction) are bearing-supported on the support member (elevating body). After the first roller rides on the upper surface of the printed circuit board (board), until the second roller rides on the upper surface of the substrate, and after the first roller descends from the upper surface of the substrate, the second roller The elevating body is tilted with respect to the substrate until it descends from the upper surface of the substrate. Therefore, the distance between the opening of the suction pipe (functional portion) and the upper surface of the substrate may not be constant, and the suction function may not be effectively exhibited. Further, when the plate thickness of the substrate is increased (when processing a thick substrate), the substrate may interfere with the elevating body or the functional part.

そこで本発明は、基板の上面の搬送方向の全長域において機能部を有効に機能させるとともに、昇降体及び機能部と基板との干渉を確実に防止することを目的とする。 Therefore, an object of the present invention is to make the functional portion effectively function in the entire length range of the upper surface of the substrate in the transport direction, and to surely prevent the elevating body and the functional portion from interfering with the substrate.

上記目的を達成するため、本発明の第1の態様は、倒伏姿勢の板状の基板の下面が搬送基準面に沿って略水平に移動するように基板を搬送して処理する基板処理装置であって、第1のローラと、第2のローラと、昇降体と、昇降方向規制手段と、機能部とを備える。 In order to achieve the above object, the first aspect of the present invention is a substrate processing apparatus for transporting and processing a substrate so that the lower surface of a plate-shaped substrate in an inverted posture moves substantially horizontally along a transport reference plane. It includes a first roller, a second roller, an elevating body, an elevating direction regulating means, and a functional unit.

第1のローラは、搬送基準面の上方で搬送基準面に対して昇降可能な第1の回転軸を有し、搬送途中の基板の上面に乗り上がった状態で基板の上面に接触しながら第1の回転軸を中心として回転する。第2のローラは、第1のローラの搬送方向下流側の搬送基準面の上方で搬送基準面に対して昇降可能な第2の回転軸を有し、搬送途中の基板の上面に乗り上がった状態で基板の上面に接触ながら第2の回転軸を中心として回転する。 The first roller has a first rotating shaft that can move up and down with respect to the transport reference plane above the transport reference plane, and is in contact with the upper surface of the substrate while riding on the upper surface of the substrate during transport. It rotates around the rotation axis of 1. The second roller has a second rotation axis that can move up and down with respect to the transport reference plane above the transport reference plane on the downstream side in the transport direction of the first roller, and rides on the upper surface of the substrate during transport. In this state, it rotates about the second rotation axis while touching the upper surface of the substrate.

昇降体は、搬送基準面の上方で第1の回転軸と第2の回転軸との間に配置され、第1及び第2のローラの双方が基板の上面に乗り上がっていない間は、搬送基準面に対して所定の下降位置に維持され、第1及び第2のローラの少なくとも一方が基板の上面に乗り上がっている間は、基板の上面に乗り上がったローラの回転軸によって下降位置から上方に持ち上げられて維持される。昇降方向規制手段は、下降位置から昇降(上昇した後に下降)する際の昇降体の昇降方向を、搬送基準面に対して略垂直方向に規制する。機能部は、昇降体が下降位置に降下した状態で搬送基準面の上方に位置するように昇降体に固定的に設けられ、搬送途中の基板の上面に上方から対向して機能する。 The elevating body is arranged above the transfer reference plane between the first rotation axis and the second rotation axis, and is transferred while both the first and second rollers are not riding on the upper surface of the substrate. It is maintained in a predetermined descending position with respect to the reference plane, and while at least one of the first and second rollers rides on the upper surface of the substrate, the rotation axis of the roller riding on the upper surface of the substrate causes the descending position. Lifted upwards and maintained. The ascending / descending direction regulating means regulates the ascending / descending direction of the elevating body when ascending / descending (ascending and then descending) from the descending position in a direction substantially perpendicular to the transport reference plane. The functional unit is fixedly provided on the elevating body so as to be located above the transfer reference surface in a state where the elevating body is lowered to the descending position, and functions so as to face the upper surface of the substrate during transportation from above.

上記構成において、基板の搬送方向に沿った第1のローラの下端と第2のローラの下端との距離(第1の回転軸と第2の回転軸との距離)は、搬送方向に沿った基板の全長(搬送方向下流端と搬送方向上流端との距離)よりも短く設定される。搬送途中の基板の搬送方向下流端は、第1のローラの下端と第2のローラの下端とを順次通過し、基板の搬送方向上流端は、搬送方向下流端が第2のローラの下端に到達した後に第1のローラの下端を通過し、第2のローラの下端を通過する。 In the above configuration, the distance between the lower end of the first roller and the lower end of the second roller along the transport direction of the substrate (distance between the first rotation axis and the second rotation axis) is along the transport direction. It is set shorter than the total length of the substrate (distance between the downstream end in the transport direction and the upstream end in the transport direction). The downstream end of the substrate in the transport direction in the middle of transport passes through the lower end of the first roller and the lower end of the second roller in sequence, and the upstream end of the substrate in the transport direction has the downstream end in the transport direction at the lower end of the second roller. After reaching, it passes through the lower end of the first roller and passes through the lower end of the second roller.

上記構成では、第1のローラは、基板の搬送方向下流端が第1のローラの下端に到達する前は、搬送基準面に対して所定の初期高さに維持され、基板の搬送方向下流端が第1のローラの下端に到達してから基板の搬送方向上流端が第1のローラの下端を通過するまでの間は、基板の上面に乗り上がり、基板の搬送方向上流端が第1のローラの下端を通過した後は、初期高さへ降下する。 In the above configuration, the first roller is maintained at a predetermined initial height with respect to the transport reference plane before the downstream end of the substrate in the transport direction reaches the lower end of the first roller, and the downstream end of the substrate in the transport direction is maintained. From reaching the lower end of the first roller until the upstream end in the transport direction of the substrate passes through the lower end of the first roller, the board rides on the upper surface of the substrate, and the upstream end in the transport direction of the substrate is the first. After passing the lower end of the roller, it descends to the initial height.

第2のローラは、基板の搬送方向下流端が第2のローラの下端に到達する前は、初期高さに維持され、第1のローラの下端を通過した基板の搬送方向下流端が第2のローラの下端に到達してから基板の搬送方向上流端が第2のローラの下端を通過するまでの間は、基板の上面に乗り上がり、基板の搬送方向上流端が第2のローラの下端を通過した後は、初期高さへ降下する。 The second roller is maintained at the initial height before the downstream end of the substrate in the transport direction reaches the lower end of the second roller, and the downstream end of the substrate passing through the lower end of the first roller is the second roller. From reaching the lower end of the roller of the After passing through, it descends to the initial height.

昇降体は、基板の搬送方向下流端が第1のローラの下端に到達する前は、搬送基準面に対して所定の下降位置に維持される。基板の搬送方向下流端が第1のローラの下端に到達し、第1のローラが基板の上面に乗り上がると、昇降体は、第1の回転軸によって下降位置から上方に持ち上げられる。昇降方向規制手段は、下降位置から昇降する際の昇降体の昇降方向を搬送基準面に対して略垂直方向に規制するので、昇降体は、基板の上面への第1のローラの乗り上げと略同時に、基板の板厚分だけ下降位置から上昇する。その後、基板の搬送方向上流端が第1のローラの下端を通過しても、第2のローラが基板の上面に乗り上げている間は、昇降体は、基板の板厚分だけ上昇した上昇位置から下降せず、基板の搬送方向上流端が第2のローラの下端を通過するまで上昇位置に維持される。基板の搬送方向上流端が第2のローラの下端を通過して第2のローラが下降すると、昇降体は、上昇位置から下降位置へ下降する。 The elevating body is maintained at a predetermined lowering position with respect to the transport reference plane before the downstream end of the substrate in the transport direction reaches the lower end of the first roller. When the downstream end of the substrate in the transport direction reaches the lower end of the first roller and the first roller rides on the upper surface of the substrate, the elevating body is lifted upward from the descending position by the first rotation axis. Since the elevating direction regulating means regulates the elevating direction of the elevating body when ascending and descending from the descending position in a direction substantially perpendicular to the transport reference plane, the elevating body is abbreviated as riding the first roller on the upper surface of the substrate. At the same time, it rises from the descending position by the thickness of the substrate. After that, even if the upstream end of the substrate in the transport direction passes through the lower end of the first roller, the elevating body is raised by the thickness of the substrate while the second roller rides on the upper surface of the substrate. It does not descend from and is maintained in the ascending position until the upstream end of the substrate in the transport direction passes through the lower end of the second roller. When the upstream end of the substrate in the transport direction passes through the lower end of the second roller and the second roller descends, the elevating body descends from the ascending position to the descending position.

昇降体が下降位置に降下した状態で搬送基準面の上方に位置するように機能部が昇降体に固定的に設けられ、昇降体が第1のローラと第2のローラとの間に配置され、昇降体の上昇位置が搬送基準面から基板の板厚よりも高い位置となるので、昇降体は、基板の搬送方向下流端が昇降体の下方に到達するまでの間に、基板に対して傾くことなく機能部とともに下降位置から上昇位置へ上昇し、基板の搬送方向上流端が昇降体の下方を通過した後に、基板に対して傾くことなく機能部とともに上昇位置から下降位置へ下降する。 A functional unit is fixedly provided on the elevating body so that the elevating body is positioned above the transport reference surface in a state where the elevating body is lowered to the descending position, and the elevating body is arranged between the first roller and the second roller. Since the ascending position of the elevating body is higher than the plate thickness of the substrate from the transport reference plane, the elevating body should be attached to the substrate until the downstream end of the substrate in the transport direction reaches below the elevating body. It rises from the descending position to the ascending position together with the functional portion without tilting, and after the upstream end in the transport direction of the substrate passes below the elevating body, it descends from the ascending position to the descending position together with the functional portion without tilting with respect to the substrate.

従って、基板の板厚によらず、基板の上面に対する機能部の高さ位置は、基板の上面の搬送方向の全長域において一定に維持され、機能部を効率良く機能させることができる。また、昇降体及び機能部と基板との干渉を確実に防止することができる。 Therefore, regardless of the plate thickness of the substrate, the height position of the functional portion with respect to the upper surface of the substrate is maintained constant in the entire length range of the upper surface of the substrate in the transport direction, and the functional portion can function efficiently. In addition, it is possible to reliably prevent interference between the elevating body and the functional portion and the substrate.

本発明の第2の態様は、第1の態様の基板処理装置であって、第1の回転軸の昇降方向及び第2の回転軸の昇降方向を、搬送基準面に対して略垂直方向に規制する第2昇降方向規制手段を備える。 The second aspect of the present invention is the substrate processing apparatus of the first aspect, in which the elevating direction of the first rotating shaft and the elevating direction of the second rotating shaft are substantially perpendicular to the transport reference plane. A second ascending / descending direction regulating means for regulating is provided.

上記構成では、第2昇降方向規制手段が、第1の回転軸の昇降方向及び第2の回転軸の昇降方向を搬送基準面に対して略垂直方向に規制するので、昇降体及び機能部が昇降する際の挙動を安定させることができ、昇降体及び機能部と基板との干渉をさらに確実に防止することができる。 In the above configuration, the second elevating direction regulating means regulates the elevating direction of the first rotating shaft and the elevating direction of the second rotating shaft in a direction substantially perpendicular to the transport reference plane, so that the elevating body and the functional unit are used. The behavior when ascending and descending can be stabilized, and the interference between the elevating body and the functional part and the substrate can be prevented more reliably.

本発明の第3の態様は、第1又は第2の態様の基板処理装置であって、機能部は、基板の上面から液体を吸引する吸引口を有する。 A third aspect of the present invention is the substrate processing apparatus of the first or second aspect, and the functional unit has a suction port for sucking a liquid from the upper surface of the substrate.

上記構成では、吸引口を基板の上面から一定の距離に維持することができるので、基板の上面から液体を効率良く吸引して除去することができる。 In the above configuration, since the suction port can be maintained at a constant distance from the upper surface of the substrate, the liquid can be efficiently sucked and removed from the upper surface of the substrate.

本発明によれば、基板の上面の搬送方向の全長域において機能部を有効に機能させるとともに、昇降体及び機能部と基板との干渉を確実に防止することができる。 According to the present invention, the functional portion can be effectively functioned in the entire length range of the upper surface of the substrate in the transport direction, and interference between the elevating body and the functional portion and the substrate can be reliably prevented.

本発明の一実施形態に係る基板処理装置を示す概略構成図である。It is a schematic block diagram which shows the substrate processing apparatus which concerns on one Embodiment of this invention. エッチング処理を説明するためのプリント配線板の拡大断面図である。It is an enlarged sectional view of the printed wiring board for demonstrating the etching process. 吸引ユニットの支持構造を装置幅方向の外側から視た側面図である。It is a side view which looked at the support structure of a suction unit from the outside in the width direction of a device. 吸引ユニットの支持構造を装置幅方向の内側から視た側面図である。It is a side view which looked at the support structure of a suction unit from the inside in the width direction of a device. 図3のV−V矢視断面図である。FIG. 3 is a cross-sectional view taken along the line VV of FIG. 図5のVI−VI矢視断面図である。FIG. 5 is a cross-sectional view taken along the line VI-VI of FIG. スライドブロックが下降位置に維持された状態を示す側面図である。It is a side view which shows the state which the slide block is maintained in a descending position. 上流側上ローラが基板に乗り上がった状態を示す側面図である。It is a side view which shows the state which the upper roller on the upstream side got on the substrate. 上流側上ローラ及び下流側上ローラが基板に乗り上がった状態を示す側面図である。It is a side view which shows the state which the upstream side upper roller and the downstream side upper roller got on the substrate. 上流側上ローラが下降した後であって、下流側上ローラが下降する前の状態を示す側面図である。It is a side view which shows the state after the upstream side upper roller descends and before the downstream side upper roller descends. 吸引ユニットの支持構造の他の例を装置幅方向の内側から視た側面図である。Another example of the support structure of the suction unit is a side view seen from the inside in the width direction of the device. 図11の支持構造を上方から視た平面図である。FIG. 11 is a plan view of the support structure of FIG. 11 as viewed from above.

以下、本発明の基板処理装置をエッチング装置に適用した一実施形態を図面に基づいて説明する。 Hereinafter, an embodiment in which the substrate processing apparatus of the present invention is applied to an etching apparatus will be described with reference to the drawings.

まず、本実施形態のエッチング装置を用いたプリント配線板の製造方法の概要について、図2の断面図を参照して説明する。 First, an outline of a method for manufacturing a printed wiring board using the etching apparatus of the present embodiment will be described with reference to the cross-sectional view of FIG.

図2(a)に示すように、エポキシ樹脂などの熱硬化性樹脂やその他の樹脂などからなる絶縁性の基板(処理対象物)1の両面に、例えば銅箔などの導電層(被エッチング層)2を数μm〜数十μmの膜厚で形成する。導電層2を形成する方法は、張り付け、めっき、気相成長など、どのような方法でも可能であり、基板1の両面がエッチング対象面となる。 As shown in FIG. 2A, a conductive layer (etched layer) such as a copper foil is formed on both sides of an insulating substrate (processed object) 1 made of a thermosetting resin such as an epoxy resin or another resin. ) 2 is formed with a film thickness of several μm to several tens of μm. The method of forming the conductive layer 2 can be any method such as sticking, plating, vapor phase growth, etc., and both sides of the substrate 1 are the surfaces to be etched.

次に、図2(b)に示すように、フォトリソグラフィー工程(ドライフィルムレジストや液状レジストなど)によって導電層2の上層にレジスト膜3を成膜し、パターン露光し、現像処理を行うことによって、導電層2の上層にレジスト膜3をパターン形成する。レジスト膜3の形成処理は、基板1の両面に対してそれぞれ行われる。 Next, as shown in FIG. 2B, a resist film 3 is formed on the upper layer of the conductive layer 2 by a photolithography step (dry film resist, liquid resist, etc.), pattern exposed, and developed. , The resist film 3 is patterned on the upper layer of the conductive layer 2. The forming process of the resist film 3 is performed on both sides of the substrate 1, respectively.

次に、図2(c)に示すように、基板1の両面上の導電層2に対してレジスト膜3をマスクとしたエッチング処理を施す。すなわち、導電層2をレジスト膜3のパターンに沿ってエッチングし、配線部2aをパターン形成する。 Next, as shown in FIG. 2C, the conductive layers 2 on both sides of the substrate 1 are subjected to an etching process using the resist film 3 as a mask. That is, the conductive layer 2 is etched along the pattern of the resist film 3 to form the wiring portion 2a as a pattern.

配線部2aをパターン形成した後、例えば、強アルカリ溶液または有機溶剤処理などによりレジスト膜3を剥離する。これにより、所望のプリント配線板が形成される。 After forming the pattern of the wiring portion 2a, the resist film 3 is peeled off by, for example, a strong alkaline solution or an organic solvent treatment. As a result, a desired printed wiring board is formed.

上記のレジスト膜3をマスクとした導電層2に対するエッチング処理は、本実施形態に係るエッチング装置(基板処理装置)を用いて行われる。図1は、本実施形態に係るエッチング装置を模式的に示す概略構成図である。 The etching process for the conductive layer 2 using the resist film 3 as a mask is performed using the etching apparatus (substrate processing apparatus) according to the present embodiment. FIG. 1 is a schematic configuration diagram schematically showing an etching apparatus according to the present embodiment.

エッチング装置10の処理室11内には、一側(図1中左側)の入口14から他側(図1中右側)の出口15に向かって水平直線状に延びる搬送経路が設定され、この搬送経路に複数対の上下の搬送ローラ(下方の搬送ローラ16と上方の搬送ローラ17)が搬送手段として設けられている。搬送ローラ16,17は、レジスト膜3がパターン形成された基板1を、一面が上方を向き他面が下方を向く略水平状に保持して搬送経路に沿って搬送する。下側の搬送ローラ16の上端は、上流側から下流側へ略水平面状に延びる搬送基準面18を規定し、搬送ローラ16,17は、倒伏姿勢の板状の基板1の下面が搬送基準面18に沿って略水平に移動するように基板1を搬送する。搬送ローラ16,17は、モータ等によって駆動回転する駆動ローラのみよって構成されてもよく、非駆動ローラ(基板従動1によって回転する従動ローラ)を含んでもよい。また、上側の搬送ローラ17と対を成さない下側の搬送ローラ16や、下側の搬送ローラ16と対を成さない上側の搬送ローラ17を含んでもよい。 In the processing chamber 11 of the etching apparatus 10, a transport path extending horizontally and linearly from the inlet 14 on one side (left side in FIG. 1) to the outlet 15 on the other side (right side in FIG. 1) is set, and this transport is performed. A plurality of pairs of upper and lower transport rollers (lower transport roller 16 and upper transport roller 17) are provided in the path as transport means. The transport rollers 16 and 17 hold the substrate 1 on which the resist film 3 is patterned so as to be substantially horizontal with one side facing upward and the other side facing downward, and transport the substrate 1 along the transport path. The upper end of the lower transfer roller 16 defines a transfer reference surface 18 extending in a substantially horizontal plane from the upstream side to the downstream side, and in the transfer rollers 16 and 17, the lower surface of the plate-shaped substrate 1 in the inverted posture is the transfer reference surface. The substrate 1 is conveyed so as to move substantially horizontally along the 18. The transport rollers 16 and 17 may be configured only by a drive roller that is driven and rotated by a motor or the like, or may include a non-drive roller (a driven roller that is rotated by a substrate driven 1). Further, a lower transfer roller 16 that does not form a pair with the upper transfer roller 17 and an upper transfer roller 17 that does not form a pair with the lower transfer roller 16 may be included.

入口14と出口15の間の処理室11内の上部は、エッチング工程を行うエッチング処理部12を構成する。エッチング処理部12には複数個の噴射ノズル20が配列して設けられている。噴射ノズル20は、エッチング液を噴射して処理室11内の基板1に吹き付ける。噴射ノズル20は、搬送経路に対して固定的(静置)であってもよく、揺動(オシレーション)させてもよい。噴射ノズル20の噴射形態は限定されず、1流体ノズルであってもよく、2流体ノズルであってもよい。また、複数個の噴射ノズル20を1流体ノズルと2流体ノズルとによって構成してもよい。 The upper part in the processing chamber 11 between the inlet 14 and the outlet 15 constitutes an etching processing unit 12 for performing an etching step. A plurality of injection nozzles 20 are arranged and provided in the etching processing unit 12. The injection nozzle 20 injects the etching solution and sprays it onto the substrate 1 in the processing chamber 11. The injection nozzle 20 may be fixed (stationary) or rocked (oscillated) with respect to the transport path. The injection form of the injection nozzle 20 is not limited, and may be a one-fluid nozzle or a two-fluid nozzle. Further, the plurality of injection nozzles 20 may be composed of a one-fluid nozzle and a two-fluid nozzle.

搬送経路の下方の処理室11内の底部には、塩化第二銅、塩化第二鉄又はアルカリ性物質をベースとしたエッチング液(処理液体)5が貯留される。各噴射ノズル20には、処理室11内に貯留したエッチング液5を供給するエッチング液供給管路21が接続されている。エッチング液供給管路21にはポンプ22とフィルタ24と圧力計23とが設けられ、処理室11内のエッチング液5は、ポンプ22からフィルタ24によって濾過された後、所定圧で各噴射ノズル20に供給される。噴射ノズル20へのエッチング液の供給圧は、圧力計23によって計測される。 An etching solution (treatment liquid) 5 based on cupric chloride, ferric chloride or an alkaline substance is stored in the bottom of the processing chamber 11 below the transport path. An etching solution supply pipe line 21 for supplying the etching solution 5 stored in the processing chamber 11 is connected to each injection nozzle 20. A pump 22, a filter 24, and a pressure gauge 23 are provided in the etching liquid supply pipeline 21, and the etching liquid 5 in the processing chamber 11 is filtered by the filter 24 from the pump 22 and then each injection nozzle 20 at a predetermined pressure. Is supplied to. The supply pressure of the etching solution to the injection nozzle 20 is measured by the pressure gauge 23.

噴射ノズル20は、搬送経路の上方と下方とにそれぞれ配置される。上側及び下側の噴射ノズル20は、搬送ローラ16によって搬送される基板1の上面及び下面にエッチング液をそれぞれ噴射して吹き付ける。 The injection nozzles 20 are arranged above and below the transport path, respectively. The upper and lower injection nozzles 20 inject and spray the etching solution onto the upper surface and the lower surface of the substrate 1 conveyed by the transfer roller 16, respectively.

エッチング液の成分を含む処理室11内の気体は、排気処理装置(図示省略)によって浄化処理された後、排気管路(図示省略)から大気中へ放出される。 The gas in the processing chamber 11 containing the components of the etching solution is purified by an exhaust treatment device (not shown) and then discharged into the atmosphere from the exhaust pipe line (not shown).

エッチング処理部12の搬送経路(搬送基準面18)の上方には、上側の噴射ノズル20から基板1の上面に吹き付けられたエッチング液を吸引して除去する複数個の吸引ユニット(機能部)50が配列して設けられている。各吸引ユニット50は、基板1の全幅を覆うように搬送経路と略直交する方向(装置幅方向)に略水平状に延びる吸引パイプ55(図5及び図6参照)と、吸引パイプ55の外周面(本実施形態では下面)に形成され搬送基準面18(本実施形態では下方)に向かって開口する複数のスリット状の吸引ノズル(吸引口)56(図6参照)とから構成され、吸引ノズル56は、噴射ノズル20から噴射されるエッチング液の吹き付け領域の間に配置され、その配置領域で所望の吸引作用を生じさせる。 Above the transfer path (transport reference surface 18) of the etching processing unit 12, a plurality of suction units (functional units) 50 that suck and remove the etching solution sprayed on the upper surface of the substrate 1 from the upper injection nozzle 20. Are arranged and provided. Each suction unit 50 has a suction pipe 55 (see FIGS. 5 and 6) extending substantially horizontally in a direction substantially orthogonal to the transport path (device width direction) so as to cover the entire width of the substrate 1, and an outer circumference of the suction pipe 55. It is composed of a plurality of slit-shaped suction nozzles (suction ports) 56 (see FIG. 6) formed on a surface (lower surface in the present embodiment) and opening toward a transport reference surface 18 (downward in the present embodiment), and suction is performed. The nozzle 56 is arranged between the spraying regions of the etching solution ejected from the injection nozzle 20, and a desired suction action is generated in the arranged region.

各吸引パイプ55は、液体循環管路54の途中に設けられたエジェクタ52の吸引口52aに、吸引管路51を介して接続されている。液体循環管路54は、両端が処理室11内と連通し、途中に循環ポンプ53が設けられた閉回路である。循環ポンプ53は、処理室11内のエッチング液5を汲み出し、エジェクタ52で圧力を加えた状態として、再び処理室11へ戻す。液体循環管路54を循環するエッチング液は、エジェクタ52を通過する際に、エジェクタ52の吸引口52aを負圧とするため、基板1の上面に吹き付けられたエッチング液は、吸引ノズル56から吸引管路51を通って吸引される。 Each suction pipe 55 is connected to a suction port 52a of an ejector 52 provided in the middle of the liquid circulation pipe 54 via a suction pipe 51. The liquid circulation pipe 54 is a closed circuit in which both ends communicate with the inside of the processing chamber 11 and a circulation pump 53 is provided in the middle. The circulation pump 53 pumps out the etching solution 5 in the processing chamber 11, puts pressure on it with the ejector 52, and returns it to the processing chamber 11 again. When the etching solution circulating in the liquid circulation conduit 54 passes through the ejector 52, the suction port 52a of the ejector 52 has a negative pressure, so that the etching solution sprayed on the upper surface of the substrate 1 is sucked from the suction nozzle 56. It is sucked through the conduit 51.

このように、噴射ノズル20から吹き付けられたエッチング液が基板1の上面から早期に除去されるので、エッチング液の吹き付けに対して障害となり得るエッチング液の滞留の発生を未然に防止することができ、面内均一性の高いエッチングを行うことができる。 In this way, since the etching solution sprayed from the injection nozzle 20 is removed from the upper surface of the substrate 1 at an early stage, it is possible to prevent the occurrence of retention of the etching solution which may be an obstacle to the spraying of the etching solution. , Etching with high in-plane uniformity can be performed.

次に、各吸引ユニット50(吸引パイプ55)の支持構造30について、図3〜図6を参照して説明する。なお、以下では、基板1の搬送方向の上流側を後方、下流側を前方、基板1の搬送方向と直交する水平方向を装置幅方向(左右方向)、搬送基準面18と直交する方向を上下方向として説明する。 Next, the support structure 30 of each suction unit 50 (suction pipe 55) will be described with reference to FIGS. 3 to 6. In the following, the upstream side of the substrate 1 in the transport direction is the rear, the downstream side is the front, the horizontal direction orthogonal to the transport direction of the substrate 1 is the device width direction (horizontal direction), and the direction orthogonal to the transport reference surface 18 is up and down. Explained as a direction.

支持構造30は、上流側上ローラ(第1のローラ)31と、下流側上ローラ(第2のローラ)32と、スライドブロック(昇降体)33と、複数の昇降ガイド34〜37とを備え、複数の吸引ユニット50に対してそれぞれ設けられる。昇降ガイド34〜37は、矩形状のブロック体によってそれぞれ構成され、装置幅方向の両側で前後方向に延びる左右の装置フレーム13の上面に、それぞれ4つずつ前後方向に並んで配置され、装置フレーム13に固定されて鉛直上方へ延びる。装置幅方向の各側の4つの昇降ガイド34〜37は、上流側昇降ガイド(第2昇降方向規制手段)34と、中央後側昇降ガイド(昇降方向規制手段、第2昇降方向規制手段)35と、中央前側昇降ガイド(昇降方向規制手段、第2昇降方向規制手段)36と、下流側昇降ガイド(第2昇降方向規制手段)37とから構成され、これらは上流側から下流側に向かって所定の間隔をおいて直線状に並ぶ。 The support structure 30 includes an upstream side upper roller (first roller) 31, a downstream side upper roller (second roller) 32, a slide block (elevating body) 33, and a plurality of elevating guides 34 to 37. , Each is provided for a plurality of suction units 50. The elevating guides 34 to 37 are each composed of rectangular blocks, and are arranged side by side in the front-rear direction on the upper surfaces of the left and right device frames 13 extending in the front-rear direction on both sides in the device width direction. It is fixed at 13 and extends vertically upward. The four elevating guides 34 to 37 on each side in the device width direction are an upstream elevating guide (second elevating direction regulating means) 34 and a central rear elevating guide (elevating direction regulating means, second elevating direction regulating means) 35. , A central front elevating guide (elevating direction regulating means, second elevating direction regulating means) 36, and a downstream side elevating guide (second elevating direction regulating means) 37, which are directed from the upstream side to the downstream side. Arrange in a straight line at predetermined intervals.

左右の装置フレーム13の上面には、上下の上流側軸支持ブロック38,39と、上記スライドブロック33と、上下の下流側軸支持ブロック40,41とがそれぞれ配置される。 The upper and lower upstream shaft support blocks 38 and 39, the slide block 33, and the upper and lower downstream shaft support blocks 40 and 41 are arranged on the upper surfaces of the left and right device frames 13, respectively.

上流側軸支持ブロック38,39の後端面と前端面とは、上流側昇降ガイド34の前端面と中央後側昇降ガイド35の後端面とに上下方向にスライド移動可能に係合する凹形状をそれぞれ有する(図5参照)。下方の上流側軸支持ブロック39は、上流側昇降ガイド34と中央後側昇降ガイド35との間に上方から挿入され、昇降ガイド34,35と係合した状態で装置フレーム13の上面に載置され支持される。上方の上流側軸支持ブロック38は、下方の上流側軸支持ブロック39が昇降ガイド34,35と係合して装置フレーム13の上面に支持された状態で、上流側昇降ガイド34と中央後側昇降ガイド35との間に上方から挿入され、昇降ガイド34,35と係合した状態で下方の上流側軸支持ブロック39の上方に配置される。 The rear end surfaces and front end surfaces of the upstream shaft support blocks 38 and 39 have a concave shape that engages with the front end surface of the upstream elevating guide 34 and the rear end surface of the central rear elevating guide 35 so as to be slidable in the vertical direction. Each has (see FIG. 5). The lower upstream shaft support block 39 is inserted from above between the upstream elevating guide 34 and the central rear elevating guide 35, and is placed on the upper surface of the apparatus frame 13 in a state of being engaged with the elevating guides 34 and 35. And supported. The upper upstream shaft support block 38 is supported by the upstream elevating guide 34 and the center rear side in a state where the lower upstream shaft support block 39 is engaged with the elevating guides 34 and 35 and supported on the upper surface of the device frame 13. It is inserted from above between the elevating guide 35 and is arranged above the lower upstream shaft support block 39 in a state of being engaged with the elevating guides 34 and 35.

上流側昇降ガイド34と中央後側昇降ガイド35とは、上方の上流側軸支持ブロック38(及び後述する上方の上流側ローラ支持軸42)の昇降方向を、搬送基準面18に対して略垂直方向に規制する。なお、上流側軸支持ブロック38,39と上流側昇降ガイド34及び中央後側昇降ガイド35との係合形態は、上記に限定されず、上流側軸支持ブロック38,39が上下方向にスライド移動可能に支持される形態であればよい。 The upstream side elevating guide 34 and the central rear elevating guide 35 are substantially perpendicular to the transport reference surface 18 in the elevating direction of the upper upstream side shaft support block 38 (and the upper upstream side roller support shaft 42 described later). Regulate in the direction. The engagement form between the upstream shaft support blocks 38 and 39 and the upstream lift guide 34 and the central rear lift guide 35 is not limited to the above, and the upstream shaft support blocks 38 and 39 slide in the vertical direction. Any form may be used as long as it can be supported.

上流側と同様に、下流側軸支持ブロック40,41の後端面と前端面とは、中央前側昇降ガイド36の前端面と下流側昇降ガイド37の後端面とに上下方向にスライド移動可能に係合する凹形状をそれぞれ有する(図5参照)。下方の下流側軸支持ブロック41は、中央前側昇降ガイド36と下流側昇降ガイド37との間に上方から挿入され、昇降ガイド36,37と係合した状態で装置フレーム13の上面に載置され支持される。上方の下流側軸支持ブロック40は、下方の下流側軸支持ブロック41が昇降ガイド36,37と係合して装置フレーム13の上面に支持された状態で、中央前側昇降ガイド36と下流側昇降ガイド37との間に上方から挿入され、昇降ガイド36,37と係合した状態で下方の下流側軸支持ブロック41の上方に配置される。 Similar to the upstream side, the rear end surface and the front end surface of the downstream side shaft support blocks 40, 41 are engaged with each other so as to be slidable in the vertical direction between the front end surface of the central front elevating guide 36 and the rear end surface of the downstream elevating guide 37. Each has a matching concave shape (see FIG. 5). The lower downstream shaft support block 41 is inserted from above between the central front elevating guide 36 and the downstream elevating guide 37, and is placed on the upper surface of the apparatus frame 13 in a state of being engaged with the elevating guides 36 and 37. Be supported. The upper downstream shaft support block 40 is supported by the central front lift guide 36 and the downstream lift in a state where the lower downstream shaft support block 41 is engaged with the lift guides 36 and 37 and supported by the upper surface of the device frame 13. It is inserted from above between the guide 37 and is arranged above the lower downstream shaft support block 41 in a state of being engaged with the elevating guides 36 and 37.

中央前側昇降ガイド36と下流側昇降ガイド37とは、上方の下流側軸支持ブロック40(及び後述する上方の下流側ローラ支持軸44)の昇降方向を、搬送基準面18に対して略垂直方向に規制する。なお、下流側軸支持ブロック40,41と中央前側昇降ガイド36及び下流側昇降ガイド37との係合形態は、上記に限定されず、下流側軸支持ブロック40,41が上下方向にスライド移動可能に支持される形態であればよい。 The center front elevating guide 36 and the downstream elevating guide 37 refer to the elevating direction of the upper downstream side shaft support block 40 (and the upper downstream side roller support shaft 44 described later) in a direction substantially perpendicular to the transport reference surface 18. Regulate to. The engagement form between the downstream shaft support blocks 40 and 41 and the central front lift guide 36 and the downstream lift guide 37 is not limited to the above, and the downstream shaft support blocks 40 and 41 can slide and move in the vertical direction. Any form may be used as long as it is supported by.

スライドブロック33の後端面と前端面とは、中央後側昇降ガイド35の前端面と中央前側昇降ガイド36の後端面とに上下方向にスライド移動可能に係合する凹形状を有する(図5参照)。スライドブロック33は、中央後側昇降ガイド35と中央前側昇降ガイド36との間に上方から挿入され、昇降ガイド35,36と係合して上下方向にスライド可能となる。 The rear end surface and the front end surface of the slide block 33 have a concave shape that engages with the front end surface of the central rear elevating guide 35 and the rear end surface of the central front elevating guide 36 so as to be slidable in the vertical direction (see FIG. 5). ). The slide block 33 is inserted from above between the center rear elevating guide 35 and the center front elevating guide 36, engages with the elevating guides 35 and 36, and can slide in the vertical direction.

左右の上流側軸支持ブロック38,39の間には、装置幅方向に延びる上流側ローラ支持軸42,43が上下に並んでそれぞれ配置される。上方の上流側ローラ支持軸(第1の回転軸)42の両端部は、左右の上方の上流側軸支持ブロック38に回転自在に支持され、下方の上流側ローラ支持軸43の両端部は、左右の下方の上流側軸支持ブロック39に回転自在に支持される。 The upstream roller support shafts 42, 43 extending in the width direction of the apparatus are arranged vertically side by side between the left and right upstream shaft support blocks 38, 39, respectively. Both ends of the upper upstream roller support shaft (first rotating shaft) 42 are rotatably supported by the left and right upper upstream shaft support blocks 38, and both ends of the lower upstream roller support shaft 43 are rotatably supported. It is rotatably supported by the left and right lower upstream shaft support blocks 39.

上方の上流側ローラ支持軸42には、複数の上流側上ローラ31が装置幅方向に離間して固定され、下方の上流側ローラ支持軸43には、複数の上流側下ローラ46が上流側上ローラ31と対向するように装置幅方向に離間して固定される。上流側下ローラ46と上流側上ローラ31とは、搬送ローラ16,17を構成し、上流側下ローラ46の上端は搬送基準面18を規定する。上方の上流側ローラ支持軸42(上方の上流側軸支持ブロック38及び上流側上ローラ31)の最下降位置は、上方の上流側軸支持ブロック38と下方の上流側軸支持ブロック39との当接及び/又は上流側上ローラ31と上流側下ローラ46との当接によって規定され、上流側上ローラ31が搬送基準面18に対して最も下降した初期高さにおいて、上流側上ローラ31の下端は上流側下ローラ46の上端(搬送基準面18)に近接又は接触する。搬送途中の基板1の前端が上流側上ローラ31の下端(上流側上ローラ31と上流側下ローラ46との間)に達すると、上流側下ローラ46の上下位置は変動せず、上流側上ローラ31が基板1の上面に乗り上がり、初期高さから基板1の厚さ分だけ上昇する。上流側上ローラ31が上昇すると、上方の上流側ローラ支持軸42及び上方の上流側軸支持ブロック38も上昇する。なお、上流側上ローラ31と上流側下ローラ46とは、駆動ローラであってもよく、従動ローラであってもよい。また、上流側下ローラ46を設けなくてもよい。 A plurality of upstream upper rollers 31 are fixed to the upper upstream roller support shaft 42 separated from each other in the device width direction, and a plurality of upstream lower rollers 46 are upstream to the lower upstream roller support shaft 43. It is fixed at a distance in the width direction of the device so as to face the upper roller 31. The upstream side lower roller 46 and the upstream side upper roller 31 constitute transfer rollers 16 and 17, and the upper end of the upstream side lower roller 46 defines a transfer reference surface 18. The lowest position of the upper upstream roller support shaft 42 (upper upstream shaft support block 38 and upstream upper roller 31) is the contact between the upper upstream shaft support block 38 and the lower upstream shaft support block 39. The upstream side upper roller 31 is defined by contact and / or contact between the upstream side upper roller 31 and the upstream side lower roller 46, and at the initial height at which the upstream side upper roller 31 is most lowered with respect to the transport reference surface 18. The lower end is close to or in contact with the upper end (transport reference surface 18) of the upstream lower roller 46. When the front end of the substrate 1 during transportation reaches the lower end of the upstream side upper roller 31 (between the upstream side upper roller 31 and the upstream side lower roller 46), the vertical position of the upstream side lower roller 46 does not change and the upstream side The upper roller 31 rides on the upper surface of the substrate 1 and rises from the initial height by the thickness of the substrate 1. When the upstream upper roller 31 rises, the upper upstream roller support shaft 42 and the upper upstream shaft support block 38 also rise. The upstream side upper roller 31 and the upstream side lower roller 46 may be a driving roller or a driven roller. Further, it is not necessary to provide the lower roller 46 on the upstream side.

左右の下流側軸支持ブロック40,41の間には、装置幅方向に延びる下流側ローラ支持軸44,45が上下に並んでそれぞれ配置されている。上方の下流側ローラ支持軸(第2の回転軸)44の両端部は、左右の上方の下流側軸支持ブロック40に回転自在に支持され、下方の下流側ローラ支持軸45の両端部は、左右の下方の下流側軸支持ブロック41に回転自在に支持される。 Between the left and right downstream side shaft support blocks 40 and 41, the downstream side roller support shafts 44 and 45 extending in the device width direction are arranged vertically side by side, respectively. Both ends of the upper downstream roller support shaft (second rotating shaft) 44 are rotatably supported by the left and right upper downstream shaft support blocks 40, and both ends of the lower downstream roller support shaft 45 are rotatably supported. It is rotatably supported by the lower left and right lower downstream shaft support blocks 41.

上方の下流側ローラ支持軸44には、複数の下流側上ローラ32が装置幅方向に離間して固定され、下方の下流側ローラ支持軸45には、複数の下流側下ローラ47が下流側上ローラ32と対向するように装置幅方向に離間して固定される。下流側下ローラ47と下流側上ローラ32とは、搬送ローラ16,17を構成し、下流側下ローラ47の上端は搬送基準面18を規定する。上方の下流側ローラ支持軸44(上方の下流側軸支持ブロック40及び下流側上ローラ32)の最下降位置は、上方の下流側軸支持ブロック40と下方の下流側軸支持ブロック41との当接及び/又は下流側上ローラ32と下流側下ローラ47との当接によって規定され、下流側上ローラ32が搬送基準面18に対して最も下降した初期高さにおいて、下流側上ローラ32の下端は下流側下ローラ47の上端(搬送基準面18)に近接又は接触する。搬送途中の基板1の前端が下流側上ローラ32の下端(下流側上ローラ32と下流側下ローラ47との間)に達すると、下流側下ローラ47の上下位置は変動せず、下流側上ローラ32が基板1の上面に乗り上がり、初期高さから基板1の厚さ分だけ上昇する。下流側上ローラ32が上昇すると、上方の下流側ローラ支持軸44及び上方の下流側軸支持ブロック40も上昇する。なお、下流側上ローラ32と下流側下ローラ47とは、駆動ローラであってもよく、従動ローラであってもよい。また、下流側下ローラ47を設けなくてもよい。 A plurality of downstream upper rollers 32 are fixed to the upper downstream roller support shaft 44 at intervals in the device width direction, and a plurality of downstream lower rollers 47 are downstream to the lower downstream roller support shaft 45. It is fixed at a distance in the width direction of the device so as to face the upper roller 32. The lower roller 47 on the downstream side and the upper roller 32 on the downstream side constitute transfer rollers 16 and 17, and the upper end of the lower roller 47 on the downstream side defines a transfer reference surface 18. The lowest position of the upper downstream roller support shaft 44 (upper downstream shaft support block 40 and downstream upper roller 32) is the contact between the upper downstream shaft support block 40 and the lower downstream shaft support block 41. Contact and / or at the initial height at which the downstream upper roller 32 is most lowered with respect to the transport reference surface 18, defined by the contact between the downstream upper roller 32 and the downstream lower roller 47, of the downstream upper roller 32. The lower end is close to or in contact with the upper end (transport reference surface 18) of the lower roller 47 on the downstream side. When the front end of the substrate 1 during transportation reaches the lower end of the downstream upper roller 32 (between the downstream upper roller 32 and the downstream lower roller 47), the vertical position of the downstream lower roller 47 does not change, and the downstream side does not change. The upper roller 32 rides on the upper surface of the substrate 1 and rises from the initial height by the thickness of the substrate 1. When the downstream upper roller 32 rises, the upper downstream roller support shaft 44 and the upper downstream shaft support block 40 also rise. The lower roller 32 on the downstream side and the lower roller 47 on the downstream side may be a drive roller or a driven roller. Further, it is not necessary to provide the lower roller 47 on the downstream side.

上方の上流側軸支持ブロック38と上方の下流側軸支持ブロック40とには、上方へ延びる上流側シャフト60と下流側シャフト61とがそれぞれ取付けられる。上流側シャフト60の下端部と下流側シャフト61の下端部とには、雄ネジ部62がそれぞれ形成され、上方の上流側軸支持ブロック38と上方の下流側軸支持ブロック40とには、上端面から下方へ延びる雌ネジ孔48がそれぞれ形成される。各雌ネジ孔48に雄ネジ部62を螺合し、上流側及び下流側のナット63、64をそれぞれ締付けることによって、上流側シャフト60と下流側シャフト61とが上流側軸支持ブロック38と下流側軸支持ブロック40とに固定される。 An upstream shaft 60 extending upward and a downstream shaft 61 are attached to the upper upstream shaft support block 38 and the upper downstream shaft support block 40, respectively. Male screw portions 62 are formed at the lower end of the upstream shaft 60 and the lower end of the downstream shaft 61, respectively, and the upper upstream shaft support block 38 and the upper downstream shaft support block 40 are on the upper side. Female screw holes 48 extending downward from the end face are formed respectively. By screwing the male screw portion 62 into each female screw hole 48 and tightening the nuts 63 and 64 on the upstream side and the downstream side, respectively, the upstream side shaft 60 and the downstream side shaft 61 are connected to the upstream side shaft support block 38 and the downstream side. It is fixed to the side shaft support block 40.

スライドブロック33の上端面には、逆U状の連結部材65を介してサポートプレート66が固定され、サポートプレート66には、上下方向に貫通する上流側シャフト挿通孔67と下流側シャフト挿通孔68とが形成される。上流側支持ブロック38から上方へ突出する上流側シャフト60の上側部分は上流側シャフト挿通孔67を挿通し、下流側支持ブロック40から上方へ突出する下流側シャフト61の上側部分は下流側シャフト挿通孔68を挿通する。 A support plate 66 is fixed to the upper end surface of the slide block 33 via an inverted U-shaped connecting member 65, and the support plate 66 has an upstream shaft insertion hole 67 and a downstream shaft insertion hole 68 penetrating in the vertical direction. And are formed. The upper portion of the upstream shaft 60 protruding upward from the upstream support block 38 inserts the upstream shaft insertion hole 67, and the upper portion of the downstream shaft 61 protruding upward from the downstream support block 40 inserts the downstream shaft. Insert the hole 68.

上流側上ローラ31が初期高さから持ち上げられると、上方の上流側軸支持ブロック38は、上流側昇降ガイド34及び中央後側昇降ガイド35に案内され、下方の上流側軸支持ブロック39から離れるように、搬送基準面18に対して略直交する方向へ上昇する。上流側軸支持ブロック38が上昇すると、サポートプレート66がナット63によって押し上げられ、スライドブロック33も上流側上ローラ31と同様に上昇する。スライドブロック33の上昇方向は、中央後側昇降ガイド35と中央前側昇降ガイド36とにより、搬送基準面18に対して略直交する方向に規制される。一方、下流側上ローラ32は上昇せずに初期高さに維持される(図8参照)。 When the upstream upper roller 31 is lifted from the initial height, the upper upstream shaft support block 38 is guided by the upstream elevating guide 34 and the central rear elevating guide 35, and separates from the lower upstream shaft support block 39. As such, it rises in a direction substantially orthogonal to the transport reference plane 18. When the upstream side shaft support block 38 rises, the support plate 66 is pushed up by the nut 63, and the slide block 33 also rises in the same manner as the upstream side upper roller 31. The ascending direction of the slide block 33 is regulated by the central rear elevating guide 35 and the central front elevating guide 36 in a direction substantially orthogonal to the transport reference surface 18. On the other hand, the downstream upper roller 32 does not rise and is maintained at the initial height (see FIG. 8).

反対に、下流側上ローラ32が初期高さから持ち上げられると、上方の下流側軸支持ブロック40は、中央前側昇降ガイド36及び下流側昇降ガイド37に案内され、下方の下流側軸支持ブロック41から離れるように、搬送基準面18に対して略直交する方向へ上昇する。下流側軸支持ブロック40が上昇すると、サポートプレート66がナット64によって押し上げられ、スライドブロック33も下流側上ローラ32と同様に上昇する。スライドブロック33の上昇方向は、中央後側昇降ガイド35と中央前側昇降ガイド36とにより、搬送基準面18に対して略直交する方向に規制される。一方、上流側上ローラ31は上昇せずに初期高さに維持される(図10参照)。 On the contrary, when the downstream upper roller 32 is lifted from the initial height, the upper downstream shaft support block 40 is guided by the central front elevating guide 36 and the downstream elevating guide 37, and the lower downstream shaft support block 41 is guided. Ascends in a direction substantially orthogonal to the transport reference plane 18 so as to move away from. When the downstream side shaft support block 40 rises, the support plate 66 is pushed up by the nut 64, and the slide block 33 also rises in the same manner as the downstream side upper roller 32. The ascending direction of the slide block 33 is regulated by the central rear elevating guide 35 and the central front elevating guide 36 in a direction substantially orthogonal to the transport reference surface 18. On the other hand, the upstream upper roller 31 does not rise and is maintained at the initial height (see FIG. 10).

吸引ユニット50(吸引パイプ55)の装置幅方向の両端部は、左右のスライドブロック33にそれぞれ固定され支持される。スライドブロック33は、例えばビスなどの締結部材を用いた締結固定の他、任意の方法によって固定可能である。吸引パイプ55の内部には、吸引ノズル56から吸引したエッチング液を整流する整流板57が設けられ、吸引パイプ55内のエッチング液は、整流板57に形成された貫通孔57aを流通し、管継手58を介して吸引管路51へ流出する。スライドブロック33及び吸引ユニット50(吸引パイプ55)の後下端の縁部は、基板1と干渉し難いように傾斜面状又は湾曲面状に形成されている。 Both ends of the suction unit 50 (suction pipe 55) in the device width direction are fixed and supported by the left and right slide blocks 33, respectively. The slide block 33 can be fixed by any method other than fastening and fixing using a fastening member such as a screw. Inside the suction pipe 55, a rectifying plate 57 for rectifying the etching solution sucked from the suction nozzle 56 is provided, and the etching solution in the suction pipe 55 flows through the through hole 57a formed in the rectifying plate 57 and is a pipe. It flows out to the suction pipe line 51 through the joint 58. The edges of the rear lower end of the slide block 33 and the suction unit 50 (suction pipe 55) are formed in an inclined surface shape or a curved surface shape so as not to interfere with the substrate 1.

このように、上流側上ローラ31は、搬送基準面18の上方で搬送基準面18に対して昇降可能な上流側ローラ支持軸42を有し、搬送途中の基板1の上面に乗り上がった状態で基板1の上面に接触しながら上流側ローラ支持軸42を中心として回転する。下流側上ローラ32は、上流側上ローラ31の搬送方向下流側の搬送基準面18の上方で搬送基準面18に対して昇降可能な下流側ローラ支持軸44を有し、搬送途中の基板1の上面に乗り上がった状態で基板1の上面に接触しながら下流側ローラ支持軸44を中心として回転する。 As described above, the upstream upper roller 31 has an upstream roller support shaft 42 that can move up and down with respect to the transfer reference surface 18 above the transfer reference surface 18, and is in a state of riding on the upper surface of the substrate 1 in the middle of transfer. While in contact with the upper surface of the substrate 1, it rotates about the upstream roller support shaft 42. The downstream upper roller 32 has a downstream roller support shaft 44 that can move up and down with respect to the transport reference surface 18 above the transport reference surface 18 on the downstream side in the transport direction of the upstream upper roller 31, and the substrate 1 in the middle of transport. While riding on the upper surface of the substrate 1, it rotates about the downstream roller support shaft 44 while contacting the upper surface of the substrate 1.

スライドブロック33は、搬送基準面18の上方で上方の上流側ローラ支持軸42と上方の下流側ローラ支持軸44との間に配置される。スライドブロック33は、上流側上ローラ31及び下流側上ローラ32の双方が基板1の上面に乗り上がっていない間は、搬送基準面18に対して所定の下降位置に維持され、上流側上ローラ31及び下流側上ローラ32の少なくとも一方が基板1の上面に乗り上がっている間は、基板1の上面に乗り上がったローラの回転軸(上方の上流側ローラ支持軸42及び/又は上方の下流側ローラ支持軸44)によって下降位置から上方に持ち上げられて維持される。 The slide block 33 is arranged above the transport reference surface 18 between the upper upstream roller support shaft 42 and the upper downstream roller support shaft 44. The slide block 33 is maintained at a predetermined lowering position with respect to the transport reference surface 18 while both the upstream side upper roller 31 and the downstream side upper roller 32 do not ride on the upper surface of the substrate 1, and the upstream side upper roller 31 is maintained. While at least one of 31 and the downstream upper roller 32 rides on the upper surface of the substrate 1, the rotation axis of the roller riding on the upper surface of the substrate 1 (upper upstream roller support shaft 42 and / or upper downstream). It is lifted and maintained upward from the lowered position by the side roller support shaft 44).

中央後側昇降ガイド35及び中央前側昇降ガイド36は、下降位置から昇降(上昇した後に下降)する際のスライドブロック33の昇降方向を、搬送基準面18に対して略垂直方向に規制する。上流側昇降ガイド34、中央後側昇降ガイド35、中央前側昇降ガイド36、及び下流側昇降ガイド37は、上方の上流側ローラ支持軸42及び上方の下流側ローラ支持軸44の昇降方向を、搬送基準面18に対して略垂直方向に規制する。 The central rear elevating guide 35 and the central front elevating guide 36 regulate the elevating direction of the slide block 33 when ascending / descending (ascending and then descending) from the descending position in a direction substantially perpendicular to the transport reference surface 18. The upstream elevating guide 34, the central rear elevating guide 35, the central front elevating guide 36, and the downstream elevating guide 37 convey the elevating direction of the upper upstream roller support shaft 42 and the upper downstream roller support shaft 44. It is regulated in a direction substantially perpendicular to the reference plane 18.

吸引ユニット50(吸引パイプ55)は、スライドブロック33が下降位置に降下した状態で搬送基準面18の上方に位置するようにスライドブロック33に固定的に設けられ、搬送途中の基板1の上面に上方から対向して機能する。 The suction unit 50 (suction pipe 55) is fixedly provided on the slide block 33 so as to be located above the transport reference surface 18 in a state where the slide block 33 is lowered to the descending position, and is fixedly provided on the upper surface of the substrate 1 during transport. It works facing from above.

また、基板1の搬送方向に沿った上流側上ローラ31の下端と下流側上ローラ32の下端との距離(上方の上流側ローラ支持軸42と上方の下流側ローラ支持軸44との距離)は、搬送方向に沿った基板1の全長(前端(搬送方向下流端)と後端(搬送方向上流端)との距離)よりも短く設定される。搬送途中の基板1の前端は、上流側上ローラ31の下端と下流側上ローラ32の下端とを順次通過し、基板1の後端は、基板の前端が下流側上ローラ32の下端に到達した後に上流側上ローラ31の下端を通過し、下流側上ローラ32の下端を通過する。 Further, the distance between the lower end of the upstream upper roller 31 and the lower end of the downstream upper roller 32 along the transport direction of the substrate 1 (distance between the upper upstream roller support shaft 42 and the upper downstream roller support shaft 44). Is set shorter than the total length of the substrate 1 along the transport direction (distance between the front end (downstream end in the transport direction) and the rear end (upstream end in the transport direction)). The front end of the substrate 1 during transportation passes through the lower end of the upstream upper roller 31 and the lower end of the downstream upper roller 32 in sequence, and the front end of the substrate reaches the lower end of the downstream upper roller 32 at the rear end of the substrate 1. After that, it passes through the lower end of the upstream upper roller 31 and passes through the lower end of the downstream upper roller 32.

次に、基板1の搬送に伴って昇降する上流側上ローラ31、下流側上ローラ32、スライドブロック33、及び吸引ユニット50の動きについて、図7〜図10を参照して説明する。 Next, the movements of the upstream upper roller 31, the downstream upper roller 32, the slide block 33, and the suction unit 50 that move up and down with the transfer of the substrate 1 will be described with reference to FIGS. 7 to 10.

上流側上ローラ31は、基板1の前端が上流側上ローラ31の下端に到達する前は、搬送基準面18に対して所定の初期高さに維持され(図7参照)、基板1の前端が上流側上ローラ31の下端に到達してから基板1の後端が上流側上ローラ31の下端を通過するまでの間は、基板1の上面に乗り上がり(図8及び図9参照)、基板1の後端が上流側上ローラ31の下端を通過した後は、初期高さへ降下する(図10参照)。 The upstream side upper roller 31 is maintained at a predetermined initial height with respect to the transport reference surface 18 before the front end of the substrate 1 reaches the lower end of the upstream side upper roller 31 (see FIG. 7), and the upstream side upper roller 31 is maintained at a predetermined initial height with respect to the transfer reference surface 18 (see FIG. 7). Rides on the upper surface of the substrate 1 until the rear end of the substrate 1 passes through the lower end of the upstream upper roller 31 after reaching the lower end of the upstream upper roller 31 (see FIGS. 8 and 9). After the rear end of the substrate 1 passes through the lower end of the upstream upper roller 31, it descends to the initial height (see FIG. 10).

下流側上ローラ32は、基板1の前端が下流側上ローラ32の下端に到達する前は、初期高さに維持され(図7及び図8参照)、上流側上ローラ31の下端を通過した基板1の前端が下流側上ローラ32の下端に到達してから基板1の後端が下流側上ローラ32の下端を通過するまでの間は、基板1の上面に乗り上がり(図9及び図10参照)、基板1の後端が下流側上ローラ32の下端を通過した後は、初期高さへ降下する(図7参照)。 The downstream upper roller 32 was maintained at the initial height (see FIGS. 7 and 8) before the front end of the substrate 1 reached the lower end of the downstream upper roller 32, and passed through the lower end of the upstream upper roller 31. From the time when the front end of the substrate 1 reaches the lower end of the downstream upper roller 32 until the rear end of the substrate 1 passes through the lower end of the downstream upper roller 32, the board rides on the upper surface of the substrate 1 (FIGS. 9 and 9). 10), after the rear end of the substrate 1 passes through the lower end of the downstream upper roller 32, it descends to the initial height (see FIG. 7).

スライドブロック33は、基板1の前端が上流側上ローラ31の下端に到達する前は、搬送基準面18に対して所定の下降位置に維持される(図7参照)。基板1の前端が上流側上ローラ31の下端に到達し、上流側上ローラ31が基板1の上面に乗り上がると、スライドブロック33は、上方の上流側ローラ支持軸42によって下降位置から上方に持ち上げられる(図8参照)。中央後側昇降ガイド35及び中央前側昇降ガイド36は、下降位置から昇降(上昇した後に下降)する際のスライドブロック33の昇降方向を搬送基準面18に対して略垂直方向に規制するので、スライドブロック33は、基板1の上面への上流側上ローラ31の乗り上げと略同時に、基板1の板厚D分だけ下降位置から上昇する。その後、基板1の後端が上流側上ローラ31の下端を通過しても、下流側上ローラ32が基板1の上面に乗り上げている間は、スライドブロック33は、基板1の板厚D分だけ上昇した上昇位置から下降せず、基板1の後端が下流側上ローラ32の下端を通過するまで上昇位置に維持される(図10参照)。基板1の後端が下流側上ローラ32の下端を通過して下流側上ローラ32が下降すると、スライドブロック33は、上昇位置から下降位置へ下降する(図7参照)。 The slide block 33 is maintained at a predetermined lowering position with respect to the transport reference surface 18 before the front end of the substrate 1 reaches the lower end of the upstream upper roller 31 (see FIG. 7). When the front end of the substrate 1 reaches the lower end of the upstream upper roller 31 and the upstream upper roller 31 rides on the upper surface of the substrate 1, the slide block 33 is moved upward from the descending position by the upper upstream roller support shaft 42. Lifted (see Figure 8). The center rear elevating guide 35 and the center front elevating guide 36 regulate the elevating direction of the slide block 33 when ascending / descending (ascending and then descending) from the descending position in a direction substantially perpendicular to the transport reference surface 18. The block 33 rises from the descending position by the plate thickness D of the substrate 1 substantially at the same time as the upstream upper roller 31 rides on the upper surface of the substrate 1. After that, even if the rear end of the substrate 1 passes through the lower end of the upstream upper roller 31, the slide block 33 keeps the plate thickness D of the substrate 1 while the downstream upper roller 32 rides on the upper surface of the substrate 1. It does not descend from the ascended position, but is maintained in the ascended position until the rear end of the substrate 1 passes through the lower end of the downstream upper roller 32 (see FIG. 10). When the rear end of the substrate 1 passes through the lower end of the downstream upper roller 32 and the downstream upper roller 32 descends, the slide block 33 descends from the ascending position to the descending position (see FIG. 7).

スライドブロック33が下降位置に降下した状態で搬送基準面18の上方(搬送基準面18に対して所定の高さ)に位置するように吸引ユニット50がスライドブロック33に固定的に設けられ、スライドブロック33が上流側上ローラ31と下流側上ローラ32との間に配置され、スライドブロック33の上昇位置が搬送基準面18から基板1の板厚Dよりも高い位置となるので、スライドブロック33は、基板1の前端がスライドブロック33の下方に到達するまでの間に、基板1(搬送基準面18)に対して傾くことなく吸引ユニット50とともに下降位置から上昇位置へ上昇し、基板1の後端がスライドブロック33の下方を通過した後に、基板1に対して傾くことなく吸引ユニット50とともに上昇位置から下降位置へ下降する。 A suction unit 50 is fixedly provided on the slide block 33 so that the slide block 33 is located above the transport reference surface 18 (at a predetermined height with respect to the transport reference surface 18) in a state of being lowered to the descending position, and slides. Since the block 33 is arranged between the upstream side upper roller 31 and the downstream side upper roller 32, the rising position of the slide block 33 is higher than the plate thickness D of the substrate 1 from the transport reference surface 18, so that the slide block 33 is located. Raises from the descending position to the ascending position together with the suction unit 50 without tilting with respect to the substrate 1 (transport reference surface 18) until the front end of the substrate 1 reaches the lower part of the slide block 33. After the rear end passes below the slide block 33, it descends from the ascending position to the descending position together with the suction unit 50 without tilting with respect to the substrate 1.

従って、基板1の板厚Dによらず、基板1の上面に対する吸引ユニット50(吸引ノズル56)の高さは、基板1の上面の搬送方向の全長域(前後方向の全域)において一定の位置(高い吸引効果が得られるように基板1の上面に近接した位置)に維持され、吸引ユニット50を効率良く機能させることができる。また、スライドブロック33及び吸引ユニット50と基板1との干渉を確実に防止することができる。 Therefore, regardless of the plate thickness D of the substrate 1, the height of the suction unit 50 (suction nozzle 56) with respect to the upper surface of the substrate 1 is a constant position in the total length range (the entire area in the front-rear direction) of the upper surface of the substrate 1 in the transport direction. It is maintained at (a position close to the upper surface of the substrate 1 so that a high suction effect can be obtained), and the suction unit 50 can function efficiently. Further, it is possible to reliably prevent the slide block 33 and the suction unit 50 from interfering with the substrate 1.

また、上流側昇降ガイド34、中央後側昇降ガイド35、中央前側昇降ガイド36、及び下流側昇降ガイド37が、上方の上流側ローラ支持軸42の昇降方向及び上方の下流側ローラ支持軸44の昇降方向を搬送基準面18に対して略垂直方向に規制するので、スライドブロック33及び吸引ユニット50が昇降する際の挙動を安定させることができ、スライドブロック33及び吸引ユニット50と基板1との干渉をさらに確実に防止することができる。 Further, the upstream elevating guide 34, the central rear elevating guide 35, the central front elevating guide 36, and the downstream elevating guide 37 are the elevating directions of the upper upstream roller support shaft 42 and the upper downstream roller support shaft 44. Since the elevating direction is restricted to be substantially perpendicular to the transport reference surface 18, the behavior when the slide block 33 and the suction unit 50 move up and down can be stabilized, and the slide block 33, the suction unit 50, and the substrate 1 can be brought together. Interference can be prevented more reliably.

また、吸引ノズル56を基板1の上面から一定の距離に維持することができるので、基板1の上面からエッチング液を効率良く吸引して除去することができる。 Further, since the suction nozzle 56 can be maintained at a constant distance from the upper surface of the substrate 1, the etching solution can be efficiently sucked and removed from the upper surface of the substrate 1.

以上、本発明について、上記実施形態に基づいて説明を行ったが、本発明は上記実施形態の内容に限定をされるものではなく、当然に本発明を逸脱しない範囲では適宜の変更が可能である。 Although the present invention has been described above based on the above-described embodiment, the present invention is not limited to the contents of the above-described embodiment and can be appropriately modified as long as it does not deviate from the present invention. be.

例えば、吸引ユニット50の支持構造30の形態は上記実施形態に限定されず、スライドブロック33が第1及び第2の回転軸の少なくとも一方によって持ち上げられて搬送基準面18に対して略垂直方向に上昇し、第1及び第2の回転軸の双方が下降するまで上昇位置を維持するように構成されていればよい。例えば図11及び図12に示す支持構造70の例では、サポートプレート66に代えて、上流側プレート71、下流側プレート72及び中央プレート73を設け、サポートプレート66に付帯する上流側シャフト60及び下流側シャフト61を省略している。上流側プレート71は、上方の上流側軸支持ブロック38に固定的に設けられ、装置幅方向の一側が下流側へ延びる。図示の例の上流側プレート71は、上方の上流側軸支持ブロック38の上面に固定され、装置幅方向の内側が下流側へ延びる。下流側プレート72は、上方の下流側軸支持ブロック40に固定的に設けられ、装置幅方向の他側が上流側へ延びる。図示の例の下流側プレート72は、上方の下流側軸支持ブロック40の上面に固定され、装置幅方向の外側が上流側へ延びる。中央プレート73は、スライドブロック33に固定的に設けられ(図示の例では、スライドブロック33の上面に固定され)、スライドブロック33よりも装置幅方向の内側及び外側へ突出する。上流側プレート71の装置幅方向の一側の前部は、中央プレート73の装置幅方向の一側(図示の例では内側)に下方から対向し、下流側プレート72の装置幅方向の他側の後部は、中央プレート73の装置幅方向の他側(図示の例では外側)に下方から対向する。上方の上流側ローラ支持軸42が上昇すると、上流側プレート71が中央プレート73を押し上げ、スライドブロック33が上昇する。同様に、上方の下流側ローラ支持軸44が上昇すると、下流側プレート72が中央プレート73を押し上げ、スライドブロック33が上昇する。スライドブロック33は、上方の上流側ローラ支持軸42及び上方の下流側ローラ支持軸44の双方が下降するまで、上昇位置に維持される。 For example, the form of the support structure 30 of the suction unit 50 is not limited to the above embodiment, and the slide block 33 is lifted by at least one of the first and second rotation axes and is substantially perpendicular to the transport reference surface 18. It may be configured to ascend and maintain the ascending position until both the first and second rotating shafts descend. For example, in the example of the support structure 70 shown in FIGS. 11 and 12, the upstream plate 71, the downstream plate 72 and the central plate 73 are provided in place of the support plate 66, and the upstream shaft 60 and the downstream attached to the support plate 66 are provided. The side shaft 61 is omitted. The upstream side plate 71 is fixedly provided on the upper upstream side shaft support block 38, and one side in the device width direction extends to the downstream side. The upstream side plate 71 of the illustrated example is fixed to the upper surface of the upper upstream side shaft support block 38, and the inside in the device width direction extends to the downstream side. The downstream side plate 72 is fixedly provided on the upper downstream side shaft support block 40, and the other side in the device width direction extends to the upstream side. The downstream side plate 72 of the illustrated example is fixed to the upper surface of the upper downstream side shaft support block 40, and the outside in the device width direction extends to the upstream side. The central plate 73 is fixedly provided on the slide block 33 (fixed to the upper surface of the slide block 33 in the illustrated example), and protrudes inward and outward in the device width direction from the slide block 33. The front portion of the upstream plate 71 on one side in the device width direction faces one side of the central plate 73 in the device width direction (inside in the illustrated example) from below, and the other side of the downstream plate 72 in the device width direction. The rear portion faces the other side (outside in the illustrated example) of the center plate 73 in the device width direction from below. When the upper upstream roller support shaft 42 rises, the upstream plate 71 pushes up the central plate 73, and the slide block 33 rises. Similarly, when the upper downstream roller support shaft 44 rises, the downstream plate 72 pushes up the central plate 73 and the slide block 33 rises. The slide block 33 is maintained in the ascending position until both the upper upstream roller support shaft 42 and the upper downstream roller support shaft 44 descend.

また、昇降体33に固定的に設ける機能部は、上記実施形態のような吸引ユニット50に限定されず、他の機能を有するもの(例えば、基板1の上面に向けて気体及び/又は液体を噴射する機能を有するスリットノズルなど)であってもよい。 Further, the functional portion fixedly provided on the elevating body 33 is not limited to the suction unit 50 as in the above embodiment, and has other functions (for example, gas and / or liquid is directed toward the upper surface of the substrate 1). It may be a slit nozzle having a function of injecting).

また、上記実施形態では、スライドブロック33と吸引ユニット50とを別体で形成して両者を固定したが、両者を一体形成してもよい。 Further, in the above embodiment, the slide block 33 and the suction unit 50 are formed separately and fixed to each other, but both may be integrally formed.

また、吸引ユニット50の支持構造30を、装置幅方向の両端部に代えて又は加えて、装置幅方向の中間部に設けてもよい。 Further, the support structure 30 of the suction unit 50 may be provided in the middle portion in the device width direction in place of or in addition to both ends in the device width direction.

1:基板
5:エッチング液(処理液体)
10:エッチング装置(基板処理装置)
11:処理室
12:エッチング処理部
13:装置フレーム
16,17:搬送ローラ(搬送手段)
20:噴射ノズル
30,70:吸引ユニットの支持構造
31:上流側上ローラ(第1のローラ)
32:下流側上ローラ(第2のローラ)
33:スライドブロック(昇降体)
34:上流側昇降ガイド(第2昇降方向規制手段)
35:中央後側昇降ガイド(昇降方向規制手段、第2昇降方向規制手段)
36:中央前側昇降ガイド(昇降方向規制手段、第2昇降方向規制手段)
37:下流側昇降ガイド(第2昇降方向規制手段)
38:上方の上流側軸支持ブロック
39:下方の上流側軸支持ブロック
40:上方の下流側軸支持ブロック
41:下方の下流側軸支持ブロック
42:上方の上流側ローラ支持軸(第1の回転軸)
43:下方の上流側ローラ支持軸
44:上方の下流側ローラ支持軸(第2の回転軸)
45:下方の下流側ローラ支持軸
46:上流側下ローラ
47:下流側下ローラ
50:吸引ユニット(機能部)
55:吸引パイプ
56:吸引ノズル(吸引口)
60:上流側シャフト
61:下流側シャフト
65:連結部材
66:サポートプレート
71:上流側プレート
72:下流側プレート
73:中央プレート
1: Substrate 5: Etching liquid (treatment liquid)
10: Etching device (board processing device)
11: Processing chamber 12: Etching processing unit 13: Equipment frame 16, 17: Conveying roller (conveying means)
20: Injection nozzles 30, 70: Support structure of suction unit 31: Upstream upper roller (first roller)
32: Downstream side upper roller (second roller)
33: Slide block (elevating body)
34: Upstream side elevating guide (second elevating direction regulating means)
35: Center rear elevating guide (elevating direction regulating means, second elevating direction regulating means)
36: Center front elevating guide (elevating direction regulating means, second elevating direction regulating means)
37: Downstream elevating guide (second elevating direction regulating means)
38: Upper upstream shaft support block 39: Lower upstream shaft support block 40: Upper downstream shaft support block 41: Lower downstream shaft support block 42: Upper upstream roller support shaft (first rotation) shaft)
43: Lower upstream roller support shaft 44: Upper downstream roller support shaft (second rotation shaft)
45: Lower downstream roller support shaft 46: Upstream lower roller 47: Downstream lower roller 50: Suction unit (functional part)
55: Suction pipe 56: Suction nozzle (suction port)
60: Upstream shaft 61: Downstream shaft 65: Connecting member 66: Support plate 71: Upstream plate 72: Downstream plate 73: Central plate

エッチング装置10の処理室11内には、一側(図1中左側)の入口14から他側(図1中右側)の出口15に向かって水平直線状に延びる搬送経路が設定され、この搬送経路に複数対の上下の搬送ローラ(下方の搬送ローラ16と上方の搬送ローラ17)が搬送手段として設けられている。搬送ローラ16,17は、レジスト膜3がパターン形成された基板1を、一面が上方を向き他面が下方を向く略水平状に保持して搬送経路に沿って搬送する。下側の搬送ローラ16の上端は、上流側から下流側へ略水平面状に延びる搬送基準面18を規定し、搬送ローラ16,17は、倒伏姿勢の板状の基板1の下面が搬送基準面18に沿って略水平に移動するように基板1を搬送する。搬送ローラ16,17は、モータ等によって駆動回転する駆動ローラのみよって構成されてもよく、非駆動ローラ(基板1の移動によって回転する従動ローラ)を含んでもよい。また、上側の搬送ローラ17と対を成さない下側の搬送ローラ16や、下側の搬送ローラ16と対を成さない上側の搬送ローラ17を含んでもよい。 In the processing chamber 11 of the etching apparatus 10, a transport path extending horizontally and linearly from the inlet 14 on one side (left side in FIG. 1) to the outlet 15 on the other side (right side in FIG. 1) is set, and this transport is performed. A plurality of pairs of upper and lower transport rollers (lower transport roller 16 and upper transport roller 17) are provided in the path as transport means. The transport rollers 16 and 17 hold the substrate 1 on which the resist film 3 is patterned so as to be substantially horizontal with one side facing upward and the other side facing downward, and transport the substrate 1 along the transport path. The upper end of the lower transfer roller 16 defines a transfer reference surface 18 extending in a substantially horizontal plane from the upstream side to the downstream side, and in the transfer rollers 16 and 17, the lower surface of the plate-shaped substrate 1 in the inverted posture is the transfer reference surface. The substrate 1 is conveyed so as to move substantially horizontally along the 18. Conveying rollers 16 and 17, may be only the result structure driving roller which is rotationally driven by a motor or the like, may include a non-driving roller (driven roller which is rotated by the movement of the substrate 1). Further, a lower transfer roller 16 that does not form a pair with the upper transfer roller 17 and an upper transfer roller 17 that does not form a pair with the lower transfer roller 16 may be included.

Claims (3)

倒伏姿勢の板状の基板の下面が搬送基準面に沿って略水平に移動するように前記基板を搬送して処理する基板処理装置であって、
前記搬送基準面の上方で前記搬送基準面に対して昇降可能な第1の回転軸を有し、搬送途中の前記基板の上面に乗り上がった状態で前記基板の上面に接触しながら前記第1の回転軸を中心として回転する第1のローラと、
前記第1のローラの搬送方向下流側の前記搬送基準面の上方で前記搬送基準面に対して昇降可能な第2の回転軸を有し、搬送途中の前記基板の上面に乗り上がった状態で前記基板の上面に接触ながら前記第2の回転軸を中心として回転する第2のローラと、
前記搬送基準面の上方で前記第1の回転軸と前記第2の回転軸との間に配置され、前記第1及び第2のローラの双方が前記基板の上面に乗り上がっていない間は、前記搬送基準面に対して所定の下降位置に維持され、前記第1及び第2のローラの少なくとも一方が前記基板の上面に乗り上がっている間は、前記基板の上面に乗り上がったローラの回転軸によって前記下降位置から上方に持ち上げられて維持される昇降体と、
前記下降位置から昇降する際の前記昇降体の昇降方向を、前記搬送基準面に対して略垂直方向に規制する昇降方向規制手段と、
前記昇降体が前記下降位置に降下した状態で前記搬送基準面の上方に位置するように前記昇降体に固定的に設けられ、搬送途中の前記基板の上面に上方から対向して機能する機能部と、を備える
ことを特徴とする基板処理装置。
A substrate processing device that transports and processes the substrate so that the lower surface of the plate-shaped substrate in the laid-down posture moves substantially horizontally along the transport reference plane.
It has a first rotation axis that can move up and down with respect to the transfer reference surface above the transfer reference surface, and the first rotation shaft is in contact with the upper surface of the substrate while riding on the upper surface of the substrate during transportation. The first roller that rotates around the axis of rotation of
A state in which a second rotating shaft that can move up and down with respect to the transport reference plane is provided above the transport reference plane on the downstream side in the transport direction of the first roller and rides on the upper surface of the substrate during transport. A second roller that rotates about the second rotation axis while in contact with the upper surface of the substrate.
It is arranged between the first rotating shaft and the second rotating shaft above the transport reference surface, and while both the first and second rollers are not riding on the upper surface of the substrate, The rotation of the roller that rides on the upper surface of the substrate while being maintained at a predetermined descending position with respect to the transport reference plane and that at least one of the first and second rollers rides on the upper surface of the substrate. An elevating body that is lifted and maintained upward from the descending position by a shaft,
An elevating direction regulating means that regulates the elevating direction of the elevating body when ascending and descending from the descending position in a direction substantially perpendicular to the transport reference surface.
A functional unit that is fixedly provided on the elevating body so as to be located above the transport reference surface in a state where the elevating body is lowered to the descending position, and functions so as to face the upper surface of the substrate during transportation from above. A substrate processing apparatus characterized by being provided with.
請求項1に記載の基板処理装置であって、
前記第1の回転軸の昇降方向及び前記第2の回転軸の昇降方向を、前記搬送基準面に対して略垂直方向に規制する第2昇降方向規制手段を備える
ことを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1.
A substrate processing apparatus comprising: a second elevating direction regulating means for regulating the elevating direction of the first rotating shaft and the elevating direction of the second rotating shaft in a direction substantially perpendicular to the transport reference plane. ..
請求項1又は請求項2に記載の基板処理装置であって、
前記機能部は、前記基板の上面から液体を吸引する吸引口を有する
ことを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1 or 2.
The functional unit is a substrate processing apparatus having a suction port for sucking a liquid from the upper surface of the substrate.
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