JP2021184430A - Waterproof electronic apparatus - Google Patents

Waterproof electronic apparatus Download PDF

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JP2021184430A
JP2021184430A JP2020089321A JP2020089321A JP2021184430A JP 2021184430 A JP2021184430 A JP 2021184430A JP 2020089321 A JP2020089321 A JP 2020089321A JP 2020089321 A JP2020089321 A JP 2020089321A JP 2021184430 A JP2021184430 A JP 2021184430A
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housing
lid
main body
sealing resin
electronic device
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JP7038754B2 (en
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寛之 井上
Hiroyuki Inoue
雄介 船引
Yusuke Funabiki
豊秋 有働
Toyoaki Arido
正明 谷川
Masaaki Tanigawa
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

To obtain a waterproof electronic apparatus that can maintain airtightness for a long period.SOLUTION: A housing main body part 1 accommodating an electronic component 10 has, in an area joined to a housing lid part 2, a convex shape part 4 that projects toward the housing lid part 2, is formed at a height not in contact with the housing lid part 2, and has a groove part 4a formed in its apex. A sealing resin part 5 is formed to fill the gap between the housing lid part 2 and the convex shape part 4 and also fill the groove part 4a, and seals the junction between the housing main body part 1 and the housing lid part 2.SELECTED DRAWING: Figure 4

Description

本願は防水型電子装置に関するものである。 The present application relates to a waterproof electronic device.

従来の防水型電子装置として、電子部品を収納する筐体を筐体本体部と筐体蓋部とで構成し、筐体本体部と筐体蓋部との突き合わせ面に各々嵌合部を設けて嵌合させ、それら嵌合部の隙間に封止樹脂を注入して封止する技術が開示されている(例えば特許文献1参照)。 As a conventional waterproof electronic device, a housing for storing electronic components is composed of a housing main body and a housing lid, and fitting portions are provided on the abutting surfaces of the housing main body and the housing lid. Disclosed is a technique for sealing by injecting a sealing resin into a gap between the fitting portions (see, for example, Patent Document 1).

特開2015-211145号公報Japanese Unexamined Patent Publication No. 2015-211145

例えば、筐体本体部と筐体蓋部を防水シールする場合、筐体本体部と筐体蓋部の嵌合部が形成された各々の突き合わせ面を互いに接触させた構成にあっては、嵌合部間に生じた隙間に封止樹脂を注入していたため、防水シール部となる接合部において封止樹脂部が薄く形成される場合があった。防水シール部に屋外環境下で塩水等の水溶液が侵入すると、塩などの溶質が結晶化する場合があり、筐体本体部と筐体蓋部の接合部において結晶が成長することで、筐体本体部と筐体蓋部の間隙を結晶が押し広げ、封止樹脂部が剥がれる方向に応力がかかるという問題があった。 For example, in the case of waterproof sealing the housing body and the housing lid, if the butt surfaces of the housing body and the housing lid are in contact with each other, the fitting is fitted. Since the sealing resin was injected into the gap formed between the joints, the sealing resin portion may be thinly formed at the joint portion to be the waterproof seal portion. When an aqueous solution such as salt water invades the waterproof seal in an outdoor environment, solutes such as salt may crystallize, and crystals grow at the joint between the housing body and the housing lid, causing the housing to grow. There is a problem that the crystal expands the gap between the main body portion and the housing lid portion, and stress is applied in the direction in which the sealing resin portion is peeled off.

本願は、上記のような問題を解決するためになされたものであり、筐体本体部と筐体蓋部の接合部に塩水等の侵入があった場合でも、気密性を保持することが可能な防水型電子装置を提供することを目的とする。 The present application has been made to solve the above-mentioned problems, and it is possible to maintain airtightness even when salt water or the like intrudes into the joint between the housing body and the housing lid. The purpose is to provide a waterproof electronic device.

本願に係わる防水型電子装置は、電子部品、上記電子部品を収納する筐体本体部、上記筐体本体部の開口端面を覆う筐体蓋部、上記筐体本体部と上記筐体蓋部との接合部に配置され、上記電子部品を封止する封止樹脂部を備え、上記筐体本体部は、上記筐体蓋部と接合される領域に、上記筐体蓋部に向かって突出し上記筐体蓋部に接しない高さに形成されるとともに頂部に溝部が形成された凸形状部を有し、上記封止樹脂部は、上記筐体蓋部と上記凸形状部との間隙に充填されるとともに上記溝部に充填されてなることを特徴とするものである。 The waterproof electronic device according to the present application includes an electronic component, a housing main body for accommodating the electronic component, a housing lid portion covering the opening end surface of the housing main body, and the housing main body and the housing lid. The housing main body is provided with a sealing resin portion that is arranged at the joint portion of the above and seals the electronic component, and the housing main body portion protrudes toward the housing lid portion in a region to be joined to the housing lid portion. It has a convex shape portion formed at a height not in contact with the housing lid portion and a groove portion formed at the top portion, and the sealing resin portion fills the gap between the housing lid portion and the convex shape portion. It is characterized in that the groove portion is filled at the same time.

本願の防水型電子装置によれば、筐体蓋部と筐体本体部との接合部に、筐体蓋部に接しない高さに筐体本体部の凸形状部を設けるとともに凸形状部の頂部に溝部を設けたため、筐体蓋部に筐体本体部が接する場合と比べて、封止樹脂部を配設する間隙をより大きく確保し、封止樹脂部をより厚く形成することができ、十分な気密性を得ることが可能となる。 According to the waterproof electronic device of the present application, a convex portion of the housing main body is provided at a height not in contact with the housing lid at the joint portion between the housing lid and the housing main body, and the convex portion is provided. Since the groove portion is provided on the top portion, a larger gap for arranging the sealing resin portion can be secured and the sealing resin portion can be formed thicker than when the housing main body portion is in contact with the housing lid portion. , It is possible to obtain sufficient airtightness.

実施の形態1による防水型電子装置の斜視図である。It is a perspective view of the waterproof electronic device according to Embodiment 1. FIG. 実施の形態1による防水型電子装置の筐体蓋部の斜視図である。It is a perspective view of the housing lid part of the waterproof electronic device according to Embodiment 1. FIG. 実施の形態1による防水型電子装置の筐体本体部の斜視図である。FIG. 3 is a perspective view of a housing main body of the waterproof electronic device according to the first embodiment. 実施の形態1による防水型電子装置の筐体蓋部と筐体本体部との接合部を示す要部断面図である。FIG. 5 is a cross-sectional view of a main part showing a joint portion between a housing lid portion and a housing main body portion of the waterproof electronic device according to the first embodiment. 実施の形態1の樹脂封止状態の変形例を示す防水型電子装置の要部断面図である。It is sectional drawing of the main part of the waterproof electronic device which shows the modification of the resin sealed state of Embodiment 1. FIG. 実施の形態1の樹脂封止状態の変形例を示す防水型電子装置の要部断面図である。It is sectional drawing of the main part of the waterproof electronic device which shows the modification of the resin sealed state of Embodiment 1. FIG. 実施の形態1の筐体蓋部の変形例を示す防水型電子装置の要部断面図である。It is sectional drawing of the main part of the waterproof electronic device which shows the modification of the housing lid part of Embodiment 1. FIG. 実施の形態2による防水型電子装置を示す断面図である。It is sectional drawing which shows the waterproof type electronic apparatus by Embodiment 2. FIG. 実施の形態3による防水型電子装置を示す断面図である。It is sectional drawing which shows the waterproof type electronic apparatus by Embodiment 3. FIG.

実施の形態1.
本願の実施の形態1による防水型電子装置100について、図1から図7を用いて説明する。図1は防水型電子装置100の筐体外形形状を示す斜視図である。図2は防水型電子装置100を構成する筐体のうち筐体蓋部2を示す斜視図である。図3は防水型電子装置100を構成する筐体のうち筐体本体部1を示す斜視図である。図4から図6は筐体蓋部2と筐体本体部1との接合部を示す要部断面図であり、各々封止樹脂部5を構成する樹脂の量が異なる場合を示し、図4は樹脂の量が最も多い場合を示し、図5は樹脂の量が中程度の場合を示し、図6は樹脂の量が最も少ない場合を示している。また、図7は、筐体蓋部2の裏面形状を平坦面とした変形例を示すものである。
Embodiment 1.
The waterproof electronic device 100 according to the first embodiment of the present application will be described with reference to FIGS. 1 to 7. FIG. 1 is a perspective view showing the outer shape of the housing of the waterproof electronic device 100. FIG. 2 is a perspective view showing a housing lid 2 among the housings constituting the waterproof electronic device 100. FIG. 3 is a perspective view showing a housing main body 1 among the housings constituting the waterproof electronic device 100. 4 to 6 are cross-sectional views of a main part showing a joint portion between the housing lid portion 2 and the housing main body portion 1, respectively, showing a case where the amounts of the resins constituting the sealing resin portion 5 are different, and FIG. Shows the case where the amount of resin is the largest, FIG. 5 shows the case where the amount of resin is medium, and FIG. 6 shows the case where the amount of resin is the smallest. Further, FIG. 7 shows a modified example in which the shape of the back surface of the housing lid 2 is a flat surface.

図1に例示するように、防水型電子装置100の外形形状は略円筒形状であり、電子部品10(後述する)を収納する有底円筒の筐体本体部1は、電子部品10を実装する平面部1aと、電子部品10の外側に位置する平面部1aの上面から立ち上がる円筒状の側面部1bを含む構成である。そのうち側面部1bは、周方向の一部に別パーツにて形成された側面部1bbを備える場合がある。この側面部1bは、例えば所定の厚さ(幅)に形成される。筐体本体部1の開口端面(上面側)は筐体蓋部2によって覆われ封止されている。 As illustrated in FIG. 1, the external shape of the waterproof electronic device 100 is substantially cylindrical, and the bottomed cylindrical housing body 1 for accommodating the electronic component 10 (described later) mounts the electronic component 10. The configuration includes a flat surface portion 1a and a cylindrical side surface portion 1b rising from the upper surface of the flat surface portion 1a located outside the electronic component 10. Among them, the side surface portion 1b may include a side surface portion 1bb formed of another part in a part in the circumferential direction. The side surface portion 1b is formed, for example, to have a predetermined thickness (width). The open end surface (upper surface side) of the housing body 1 is covered and sealed by the housing lid 2.

また、図2に示すように、筐体蓋部2の内面側の筐体本体部1と接合される外周部には環状の蓋側凸部3が形成されている。蓋側凸部3の頂部(この例では平面部)は接合面となる。
さらに、図3に示すように、筐体本体部1の側面部1b(側面部1bbを含む)の上端面(筐体蓋部2の外周部と対向する平面部)には、周方向に伸びる環状の凸形状部4が形成されている。少なくとも凸形状部4の表面部は接合面となる。
Further, as shown in FIG. 2, an annular lid-side convex portion 3 is formed on the outer peripheral portion joined to the housing main body portion 1 on the inner surface side of the housing lid portion 2. The top portion (flat surface portion in this example) of the lid-side convex portion 3 is a joint surface.
Further, as shown in FIG. 3, the upper end surface (the flat surface portion facing the outer peripheral portion of the housing lid portion 2) of the side surface portion 1b (including the side surface portion 1bb) of the housing main body portion 1 extends in the circumferential direction. An annular convex portion 4 is formed. At least the surface portion of the convex shape portion 4 is a joint surface.

次に、図4から図6を用いて、筐体本体部1と筐体蓋部2との接合部に封止樹脂部5が充填されて筐体の封止がなされた状態について説明する。ここで接合部とは、筐体本体部1の側面部1bと筐体蓋部2(この例では蓋側凸部3)とが対向する領域をいう。図4から図6は電子部品10の実装面に垂直な方向に沿った防水型電子装置100の要部断面図であり、封止樹脂部5を中心とした図である。
図4に示すように、筐体本体部1の側面部1bの上端面には、側面部1bの内周面(内側面)と外周面(外側面)との間の中間的な領域、つまり側面部1bの厚みの中央部に位置する領域から凸形状部4が突出している。凸形状部4は筐体蓋部2に向かって上向きに突出しており、筐体蓋部2に接しない高さに調整されて形成されている。凸形状部4の頂部(上面)には、周方向に溝部4aが穿たれている。溝部4aは、凸形状部4の頂部が延在する方向に沿って環状に形成される。
Next, a state in which the sealing resin portion 5 is filled in the joint portion between the housing main body portion 1 and the housing lid portion 2 to seal the housing will be described with reference to FIGS. 4 to 6. Here, the joint portion refers to a region where the side surface portion 1b of the housing main body portion 1 and the housing lid portion 2 (in this example, the lid side convex portion 3) face each other. 4 to 6 are cross-sectional views of a main part of the waterproof electronic device 100 along a direction perpendicular to the mounting surface of the electronic component 10, and is a view centering on the sealing resin part 5.
As shown in FIG. 4, the upper end surface of the side surface portion 1b of the housing main body portion 1 has an intermediate region between the inner peripheral surface (inner surface surface) and the outer peripheral surface (outer surface surface) of the side surface portion 1b, that is, The convex portion 4 protrudes from the region located at the center of the thickness of the side surface portion 1b. The convex shape portion 4 projects upward toward the housing lid portion 2 and is formed so as to be adjusted to a height that does not contact the housing lid portion 2. A groove 4a is formed in the circumferential direction on the top (upper surface) of the convex portion 4. The groove 4a is formed in an annular shape along the direction in which the top of the convex portion 4 extends.

封止樹脂部5は筐体蓋部2の蓋側凸部3と筐体本体部1の側面部1bとの間隙に充填されて、凸形状部4の表面部を含む筐体本体部1の側面部1bの上端面を覆って、凸形状部4の溝部4aに充填され、さらに蓋側凸部3の頂部に接するとともに、筐体本体部1と筐体蓋部2の外側面部にはみ出した状態に充填されている。筐体本体部1と筐体蓋部2の接合部の外側面側を封止樹脂部5で広く覆うことで、接合部への直接的な被水を防止することが可能となる。
なお、図4の例では、封止樹脂部5は、筐体本体部1と筐体蓋部2の接合部の外側面部だけでなく内側面部にもはみ出した状態に充填されていることを示しており、筐体の内面側においても接合面積を稼いでいる。
The sealing resin portion 5 is filled in the gap between the lid-side convex portion 3 of the housing lid portion 2 and the side surface portion 1b of the housing main body portion 1, and the housing main body portion 1 including the surface portion of the convex shape portion 4 It covers the upper end surface of the side surface portion 1b, fills the groove portion 4a of the convex shape portion 4, is in contact with the top of the lid side convex portion 3, and protrudes from the outer surface portions of the housing main body portion 1 and the housing lid portion 2. Filled in state. By widely covering the outer surface side of the joint portion between the housing main body portion 1 and the housing lid portion 2 with the sealing resin portion 5, it is possible to prevent the joint portion from being directly exposed to water.
In the example of FIG. 4, it is shown that the sealing resin portion 5 is filled not only on the outer surface portion of the joint portion between the housing body portion 1 and the housing lid portion 2 but also on the inner side surface portion. The joint area is also earned on the inner surface side of the housing.

このように、筐体本体部1側において溝部4aをもつ凸形状部4を形成したことで、凸形状部4および溝部4aを形成しない場合よりも封止樹脂部5との接合面積を稼ぐことができ、接着性が向上する。また、筐体本体部1と筐体蓋部2との接合部から外側および内側に封止樹脂をはみ出させて側面部にも接合面を拡張させることによって、さらに接合面積を稼ぐことが可能となる。
また、凸形状部4の頂部となる上面部において、溝部4aに位置する部分でのみ封止樹脂部5が他部よりも厚く形成されて芯部となり、封止樹脂部5自体の強度が向上するという利点がある。
In this way, by forming the convex-shaped portion 4 having the groove portion 4a on the housing main body 1 side, the bonding area with the sealing resin portion 5 is gained as compared with the case where the convex-shaped portion 4 and the groove portion 4a are not formed. And the adhesiveness is improved. Further, it is possible to further increase the joint area by extending the joint surface to the side surface portion by protruding the sealing resin from the joint portion between the housing main body portion 1 and the housing lid portion 2 to the outside and the inside. Become.
Further, in the upper surface portion which is the top of the convex shape portion 4, the sealing resin portion 5 is formed thicker than the other portions only in the portion located in the groove portion 4a to become the core portion, and the strength of the sealing resin portion 5 itself is improved. There is an advantage to do.

次に、本願の防水型電子装置100の組み立て手順について説明する。
まず、図2、図3に示す形状に形成された筐体蓋部2、筐体本体部1を製作後、筐体本体部1の内底面に電子部品10を実装する。このとき筐体本体部1の側面部1bbについても基部となる側面部1bおよび平面部1aに組み付けを行う。
次に、筐体本体部1に筐体蓋部2を組み付けるが、このとき、筐体本体部1の側面部1bの上端面に封止樹脂を塗布する。これにより凸形状部4を含む本体部側接合面(凹凸面)に封止樹脂を密着させる。その後、塗布した封止樹脂に筐体蓋部2の接合面を重ね合わせて組み付ける。これによって筐体蓋部2の蓋側凸部3と筐体本体部1の凸形状部4の頂点が合うように係合され、凸形状部4の溝部4aを含む間隙部に充填された封止樹脂が凝固することで封止樹脂部5が形成される。
このように、封止樹脂部5によって防水型電子装置100の筐体の接合面が水密シールされ、防水機能を有するユニットを得ることができる。
Next, the procedure for assembling the waterproof electronic device 100 of the present application will be described.
First, after manufacturing the housing lid portion 2 and the housing main body portion 1 formed in the shapes shown in FIGS. 2 and 3, the electronic component 10 is mounted on the inner bottom surface of the housing main body portion 1. At this time, the side surface portion 1bb of the housing main body portion 1 is also assembled to the side surface portion 1b and the flat surface portion 1a which are the base portions.
Next, the housing lid 2 is assembled to the housing main body 1, and at this time, the sealing resin is applied to the upper end surface of the side surface portion 1b of the housing main body 1. As a result, the sealing resin is brought into close contact with the main body side joint surface (concave and convex surface) including the convex shape portion 4. After that, the joint surface of the housing lid 2 is overlapped with the applied sealing resin and assembled. As a result, the lid-side convex portion 3 of the housing lid portion 2 and the apex of the convex shape portion 4 of the housing main body portion 1 are engaged so as to meet each other, and the sealing portion including the groove portion 4a of the convex shape portion 4 is filled. The sealing resin portion 5 is formed by solidifying the stop resin.
In this way, the joint surface of the housing of the waterproof electronic device 100 is watertightly sealed by the sealing resin portion 5, and a unit having a waterproof function can be obtained.

上述したように、本願の防水型電子装置100は、電子部品10、その電子部品10を収納する筐体本体部1、筐体本体部1の開口端面を覆う筐体蓋部2、筐体本体部1と筐体蓋部2との接合部に配置され、筐体本体部1および筐体蓋部2と協同で電子部品10を封止する封止樹脂部5を備え、筐体本体部1は、筐体蓋部2と接合される領域に、筐体蓋部2に向かって突出し筐体蓋部2に接しない高さに形成されるとともに頂部に溝部4aが形成された凸形状部4を有し、封止樹脂部5は、筐体蓋部2と凸形状部4との間隙に充填された形状に設けられた構成となっている。 As described above, the waterproof electronic device 100 of the present application includes an electronic component 10, a housing body 1 for accommodating the electronic component 10, a housing lid 2 covering the opening end surface of the housing body 1, and a housing body. A sealing resin portion 5 that is arranged at a joint portion between the portion 1 and the housing lid portion 2 and that seals the electronic component 10 in cooperation with the housing main body portion 1 and the housing lid portion 2 is provided, and the housing main body portion 1 is provided. Is formed in a region joined to the housing lid 2 at a height that protrudes toward the housing lid 2 and does not come into contact with the housing lid 2, and has a convex portion 4a having a groove 4a formed at the top. The sealing resin portion 5 is provided in a shape that fills the gap between the housing lid portion 2 and the convex shape portion 4.

本願の防水型電子装置100によれば、筐体本体部1と筐体蓋部2の接合部において、筐体本体部1と筐体蓋部2との間に間隙部が確保されている上、溝部4aにおいては他の部分よりもより厚く封止樹脂部5の樹脂層を形成することが可能であり、この封止樹脂部5により筐体本体部1と筐体蓋部2との気密封止が可能となる。
そのため、例えばこの防水型電子装置100を車載用として使用する環境下において、筐体本体部1と筐体蓋部2の接合部に塩水等の水溶液が侵入しにくくなり、長期的に気密性を保持することが可能となる。そして、仮に塩等の溶質の結晶化が筐体表面近傍において生じたとしても、封止樹脂部5が十分な厚さに形成されているため、接合部における結晶成長自体を抑制することが可能であり、さらに、接合部において結晶成長が生じたとしても、筐体本体部1と筐体蓋部2との間隔を押し広げシールを剥がそうとする応力を低減することが可能となる。
According to the waterproof electronic device 100 of the present application, a gap is secured between the housing main body 1 and the housing lid 2 at the joint between the housing main body 1 and the housing lid 2. In the groove portion 4a, it is possible to form the resin layer of the sealing resin portion 5 thicker than the other portions, and the sealing resin portion 5 allows the housing main body portion 1 and the housing lid portion 2 to be connected to each other. Sealing is possible.
Therefore, for example, in an environment where the waterproof electronic device 100 is used for an in-vehicle use, an aqueous solution such as salt water is less likely to enter the joint portion between the housing main body portion 1 and the housing lid portion 2, and the airtightness is maintained for a long period of time. It becomes possible to hold. Even if crystallization of a solute such as a salt occurs near the surface of the housing, the sealing resin portion 5 is formed to have a sufficient thickness, so that it is possible to suppress the crystal growth itself at the joint portion. Further, even if crystal growth occurs at the joint portion, it is possible to widen the distance between the housing main body portion 1 and the housing lid portion 2 and reduce the stress of trying to peel off the seal.

なお、図4等では、溝部4aの開口形状はV字型の場合を例示しているがその他の形状、例えばU字形状、半円形状等とすることが可能であることは言うまでもない。
また、上述の図2、図3の斜視図と、図4等の断面図では筐体形状が合致していない部分があるが、それは図4等では樹脂封止に寄与する接合部を中心とした概略図を示し、樹脂封止との関連が薄い部分、例えば筐体の外縁部等の構成については略記しているためである。
In FIG. 4 and the like, the opening shape of the groove portion 4a is exemplified as a V-shape, but it goes without saying that other shapes such as a U-shape and a semicircular shape can be used.
Further, in the perspective views of FIGS. 2 and 3 and the cross-sectional view of FIG. 4 and the like, there is a portion where the housing shape does not match, but in FIG. 4 and the like, the joint portion contributing to the resin sealing is the center. This is because the schematic diagram is shown, and the configuration of a portion having little relation to the resin sealing, for example, the outer edge portion of the housing is omitted.

また、図5に図4の樹脂封止状態の変形例を示す。図5の構成は、筐体本体部1および筐体蓋部2の形状は上述の図4のものと同様であるが、接合部に充填した封止樹脂部51の樹脂量がより少ない点で異なる。図5に示すように、筐体本体部1と筐体蓋部2との接合部に配設された封止樹脂部51は、筐体本体部1の側面部1bの凸形状部4の表面を含む上端面に接するとともに、筐体蓋部2の蓋側凸部3の筐体本体部1との対向面に接しているが、筐体本体部1と筐体蓋部2の外側面部にははみ出さない状態に充填されている。
図5に示す封止樹脂部51は、図4に示した封止樹脂部5よりも樹脂量が少ないが、図4の構成と同様に、溝部4aに封止樹脂が充填されているために部分的に厚い樹脂層を得ることができ、気密性を保持することが可能である。
Further, FIG. 5 shows a modified example of the resin-sealed state of FIG. The configuration of FIG. 5 is similar to that of FIG. 4 described above in the shapes of the housing body 1 and the housing lid 2, but the amount of resin in the sealing resin portion 51 filled in the joint is smaller. different. As shown in FIG. 5, the sealing resin portion 51 arranged at the joint portion between the housing main body portion 1 and the housing lid portion 2 is the surface of the convex shape portion 4 of the side surface portion 1b of the housing main body portion 1. In addition to being in contact with the upper end surface including the housing lid portion 2, it is in contact with the facing surface of the lid-side convex portion 3 of the housing lid portion 2 with the housing main body portion 1, but on the outer surface portions of the housing main body portion 1 and the housing lid portion 2. It is filled so that it does not stick out.
The sealing resin portion 51 shown in FIG. 5 has a smaller amount of resin than the sealing resin portion 5 shown in FIG. 4, but the groove portion 4a is filled with the sealing resin as in the configuration of FIG. A partially thick resin layer can be obtained, and airtightness can be maintained.

さらに、図6に図5の樹脂封止状態の変形例を示すように、図5で示した封止樹脂部51よりもさらに樹脂量の少ない封止樹脂部52を形成することも可能である。図6に示すように、封止樹脂部52は筐体本体部1の凸形状部4の頂部に接するように配設されている。この時、図6の例では封止樹脂部52が筐体蓋部2の蓋側凸部3の接合面(頂部)の全面には接しない状態を示しているが、頂部全面に接した状態としてもよいことは言うまでもない。
図6に示す封止樹脂部52は、図5に示した封止樹脂部51よりも樹脂量が少ないが、図5の構成と同様に、溝部4aに封止樹脂が充填されているために部分的に厚い樹脂層を得ることができ、気密性を保持することが可能である。
Further, as shown in FIG. 6 as a modified example of the resin-sealed state of FIG. 5, it is also possible to form the sealing resin portion 52 having a smaller amount of resin than the sealing resin portion 51 shown in FIG. .. As shown in FIG. 6, the sealing resin portion 52 is arranged so as to be in contact with the top of the convex portion 4 of the housing main body portion 1. At this time, in the example of FIG. 6, the sealing resin portion 52 does not touch the entire surface of the joint surface (top) of the lid-side convex portion 3 of the housing lid portion 2, but is in contact with the entire top surface. Needless to say, it may be.
The sealing resin portion 52 shown in FIG. 6 has a smaller amount of resin than the sealing resin portion 51 shown in FIG. 5, but the groove portion 4a is filled with the sealing resin as in the configuration of FIG. A partially thick resin layer can be obtained, and airtightness can be maintained.

次に、図7に筐体蓋部2の変形例を示す。上述の図2および図4から図6においては、筐体蓋部2の内面側に蓋側凸部3が設けられた例を挙げていたが、図7に示すように、蓋側凸部3を設けない平板形状の筐体蓋部2とすることも可能である。 Next, FIG. 7 shows a modified example of the housing lid portion 2. In FIGS. 2 and 4 to 6 described above, an example in which the lid-side convex portion 3 is provided on the inner surface side of the housing lid portion 2 has been given, but as shown in FIG. 7, the lid-side convex portion 3 is provided. It is also possible to use a flat plate-shaped housing lid portion 2 that is not provided with the above.

実施の形態2.
次に、実施の形態2の防水型電子装置100について図8を用いて説明する。
上述の実施の形態1では筐体蓋部2の筐体本体部1との接合部に蓋側凸部3を設ける場合、あるいは平坦面とする場合について説明したが、この実施の形態2では、筐体蓋部2の筐体本体部1との接合部に蓋側凹部30を設けた点に特徴がある。
図8に示すように、筐体蓋部2は平板形状であり、筐体蓋部2の外周部の筐体本体部1と接合される接合面には、その接合面から掘り下げられた蓋側凹部30が設けられている。この蓋側凹部30には封止樹脂が充填されて封止樹脂部5が形成されている。
Embodiment 2.
Next, the waterproof electronic device 100 of the second embodiment will be described with reference to FIG.
In the above-described first embodiment, a case where the lid-side convex portion 3 is provided at the joint portion of the housing lid portion 2 with the housing main body portion 1 or a case where a flat surface is provided has been described, but in the second embodiment, the case where the lid side convex portion 3 is provided is described. The feature is that the lid side recess 30 is provided at the joint portion of the housing lid portion 2 with the housing main body portion 1.
As shown in FIG. 8, the housing lid 2 has a flat plate shape, and the joint surface to be joined to the housing main body 1 on the outer peripheral portion of the housing lid 2 has a lid side dug down from the joint surface. The recess 30 is provided. The lid-side recess 30 is filled with a sealing resin to form a sealing resin portion 5.

筐体蓋部2に蓋側凹部30を設けることで、蓋側凹部30を設けない場合よりも、封止樹脂部5を充填するスペースをより多く確保することができ、封止樹脂部5をより厚く形成することができる。また、蓋側凹部30に充填された封止樹脂部5が蓋側凹部30に食い込んだ状態となるため、封止樹脂部5が筐体蓋部2の所定の位置(接合部)からずれにくいという利点がある。 By providing the lid-side recess 30 in the housing lid portion 2, more space for filling the sealing resin portion 5 can be secured as compared with the case where the lid-side recess 30 is not provided, and the sealing resin portion 5 can be provided. It can be formed thicker. Further, since the sealing resin portion 5 filled in the lid-side recess 30 is in a state of biting into the lid-side recess 30, the sealing resin portion 5 is unlikely to be displaced from a predetermined position (joint portion) of the housing lid portion 2. There is an advantage.

実施の形態3.
次に、実施の形態3の防水型電子装置100について図9を用いて説明する。
上述の実施の形態1では筐体蓋部2の筐体本体部1との接合部に蓋側凸部3を設け、蓋側凸部3の頂部(接合面)が平坦面である状態を例示していたが、この実施の形態3では、環状に設けられた筐体蓋部2の蓋側凸部3の頂部に蓋側溝部31を設けた点に特徴がある。例えば、蓋側溝部31は、蓋側凸部3の伸びる方向に沿って環状に形成され、その断面形状は、溝部4aと同様に任意に変更することができることは言うまでもない。
Embodiment 3.
Next, the waterproof electronic device 100 of the third embodiment will be described with reference to FIG.
In the above-described first embodiment, a state in which the lid-side convex portion 3 is provided at the joint portion of the housing lid portion 2 with the housing main body portion 1 and the top portion (joint surface) of the lid-side convex portion 3 is a flat surface is exemplified. However, the third embodiment is characterized in that the lid side groove portion 31 is provided on the top of the lid side convex portion 3 of the housing lid portion 2 provided in an annular shape. For example, it goes without saying that the lid-side groove portion 31 is formed in an annular shape along the extending direction of the lid-side convex portion 3, and the cross-sectional shape thereof can be arbitrarily changed in the same manner as the groove portion 4a.

図9に示すように、蓋側凸部3の頂部には蓋側溝部31が形成され、その蓋側溝部31に封止樹脂部5が充填された構成とすることで、部分的に大きな厚みをもつ封止樹脂部5を得ることができる。筐体本体部1の溝部4aの直上に筐体蓋部2の蓋側溝部31を設けることで、接合面の幅の中央部において、封止樹脂部5を筐体本体部1と筐体蓋部2とに食い込ませることができ、その位置において、封止樹脂部5の厚みを、溝部4aの底部から蓋側溝部31の底部に至る距離に相当する寸法に増大させることができ、封止樹脂部5自体の強度を向上させることが可能となり、気密性の保持に有効となる。 As shown in FIG. 9, a lid-side groove portion 31 is formed on the top of the lid-side convex portion 3, and the lid-side groove portion 31 is filled with the sealing resin portion 5, so that the thickness is partially large. The sealing resin portion 5 having the above can be obtained. By providing the lid side groove portion 31 of the housing lid portion 2 directly above the groove portion 4a of the housing main body portion 1, the sealing resin portion 5 is provided with the housing main body portion 1 and the housing lid at the central portion of the width of the joint surface. It can be made to bite into the portion 2, and at that position, the thickness of the sealing resin portion 5 can be increased to a dimension corresponding to the distance from the bottom portion of the groove portion 4a to the bottom portion of the lid side groove portion 31, and the sealing can be performed. It is possible to improve the strength of the resin portion 5 itself, which is effective in maintaining airtightness.

本開示は、例示的な実施の形態が記載されているが、実施の形態に記載された様々な特徴、態様、及び機能は特定の実施の形態の適用に限られるのではなく、単独で、または様々な組み合わせで実施の形態に適用可能である。
従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも1つの構成要素を変形する場合、追加する場合または省略する場合が含まれるものとする。
Although the present disclosure describes exemplary embodiments, the various features, embodiments, and functions described in the embodiments are not limited to the application of a particular embodiment, but alone. Alternatively, various combinations can be applied to the embodiments.
Therefore, innumerable variations not exemplified are envisioned within the scope of the techniques disclosed herein. For example, it is assumed that at least one component is modified, added or omitted.

1 筐体本体部、 1a 平面部、 1b、1bb 側面部、 2 筐体蓋部、 3 蓋側凸部、 4 凸形状部、 4a 溝部、 5、51、52 封止樹脂部、 10 電子部品、 30 蓋側凹部、 31 蓋側溝部、 100 防水型電子装置 1 Housing body, 1a flat surface, 1b, 1bb side surface, 2 housing lid, 3 lid side convex, 4 convex, 4a groove, 5, 51, 52 sealing resin, 10 electronic components, 30 Closure side recess, 31 Closure side groove, 100 Waterproof electronic device

本願に係わる防水型電子装置は、電子部品、上記電子部品を収納する筐体本体部、上記筐体本体部の開口端面を覆う筐体蓋部、上記筐体本体部と上記筐体蓋部との接合部に配置され、上記電子部品を封止する封止樹脂部を備え、上記筐体本体部は、上記筐体蓋部と接合される領域に、上記筐体蓋部に向かって突出し上記筐体蓋部に接しない高さに形成されるとともに頂部となる上面に溝部が形成された凸形状部を有し、上記凸形状部は環状に形成され、上記溝部は、上記凸形状部の頂部が延在する方向に沿って、かつ、上記凸形状部の内周と外周との間の中間的な領域に環状に形成され、上記封止樹脂部は、上記筐体蓋部と上記凸形状部との間隙に充填されるとともに上記溝部に充填されてなることを特徴とするものである。
The waterproof electronic device according to the present application includes an electronic component, a housing main body for accommodating the electronic component, a housing lid portion covering the opening end surface of the housing main body, and the housing main body and the housing lid. The housing main body is provided with a sealing resin portion that is arranged at the joint portion of the above and seals the electronic component, and the housing main body portion protrudes toward the housing lid portion in a region to be joined to the housing lid portion. It has a convex shape portion formed at a height not in contact with the housing lid portion and a groove portion formed on the upper surface serving as the top portion, the convex shape portion is formed in an annular shape, and the groove portion is the convex shape portion. The top is formed in an annular shape along the extending direction and in the intermediate region between the inner circumference and the outer circumference of the convex shape portion, and the sealing resin portion is formed between the housing lid portion and the convex portion. It is characterized in that the gap between the shape portion and the groove portion is filled and the groove portion is filled.

Claims (8)

電子部品、上記電子部品を収納する筐体本体部、上記筐体本体部の開口端面を覆う筐体蓋部、上記筐体本体部と上記筐体蓋部との接合部に配置され、上記電子部品を封止する封止樹脂部を備え、
上記筐体本体部は、上記筐体蓋部と接合される領域に、上記筐体蓋部に向かって突出し上記筐体蓋部に接しない高さに形成されるとともに頂部に溝部が形成された凸形状部を有し、
上記封止樹脂部は、上記筐体蓋部と上記凸形状部との間隙に充填されるとともに上記溝部に充填されてなることを特徴とする防水型電子装置。
Electronic components, a housing main body for accommodating the electronic components, a housing lid covering the open end surface of the housing main body, and an electronic component arranged at a joint between the housing main body and the housing lid. Equipped with a sealing resin part that seals parts
The housing main body is formed in a region to be joined to the housing lid at a height that protrudes toward the housing lid and does not come into contact with the housing lid, and a groove is formed at the top. It has a convex shape and has a convex shape.
The waterproof electronic device is characterized in that the sealing resin portion is filled in the gap between the housing lid portion and the convex shape portion and is also filled in the groove portion.
上記凸形状部は環状に形成され、上記溝部は上記凸形状部の頂部が延在する方向に沿って環状に形成されたことを特徴とする請求項1記載の防水型電子装置。 The waterproof electronic device according to claim 1, wherein the convex portion is formed in an annular shape, and the groove portion is formed in an annular shape along a direction in which the top of the convex portion extends. 上記筐体本体部は、上記電子部品を実装する平面部と、上記平面部の上記電子部品の外側の上面から立ち上がる側面部とを有し、上記凸形状部は上記側面部の上端面に配設されたことを特徴とする請求項1または請求項2記載の防水型電子装置。 The housing main body portion has a flat surface portion on which the electronic component is mounted and a side surface portion of the flat surface portion that rises from the outer upper surface of the electronic component, and the convex shape portion is arranged on the upper end surface of the side surface portion. The waterproof electronic device according to claim 1 or 2, wherein the waterproof electronic device is provided. 上記封止樹脂部は、上記凸形状部の表面部を含む上記筐体本体部の上記側面部の上端面を覆う領域に配設されたことを特徴とする請求項3記載の防水型電子装置。 The waterproof electronic device according to claim 3, wherein the sealing resin portion is arranged in a region covering the upper end surface of the side surface portion of the housing main body portion including the surface portion of the convex shape portion. .. 上記封止樹脂部は、上記筐体蓋部の外側面側と上記筐体本体部の上記側面部の外側面側にはみ出した状態に形成されたことを特徴とする請求項3または請求項4記載の防水型電子装置。 3. The waterproof electronic device described. 平板形状である上記筐体蓋部の外周部から上記筐体本体部に向かって突出した蓋側凸部を有し、上記蓋側凸部と上記封止樹脂部とが接することを特徴とする請求項1から5のいずれか一項記載の防水型電子装置。 It has a lid-side convex portion protruding from the outer peripheral portion of the housing lid portion having a flat plate shape toward the housing main body portion, and is characterized in that the lid-side convex portion and the sealing resin portion are in contact with each other. The waterproof electronic device according to any one of claims 1 to 5. 上記蓋側凸部の頂部には蓋側溝部が形成され、上記蓋側溝部に上記封止樹脂部が充填されてなることを特徴とする請求項6記載の防水型電子装置。 The waterproof electronic device according to claim 6, wherein a lid-side groove is formed on the top of the lid-side convex portion, and the lid-side groove is filled with the sealing resin portion. 上記筐体蓋部は平板形状であり、上記筐体蓋部の外周部の上記筐体本体部と接合される接合面には、上記接合面から掘り下げられた蓋側凹部が形成され、上記蓋側凹部に上記封止樹脂部が充填されてなることを特徴とする請求項1から5のいずれか一項記載の防水型電子装置。 The housing lid portion has a flat plate shape, and a lid-side recess dug down from the joint surface is formed on the joint surface joined to the housing main body portion on the outer peripheral portion of the housing lid portion, and the lid portion is formed. The waterproof electronic device according to any one of claims 1 to 5, wherein the side recess is filled with the sealing resin portion.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026538A (en) * 2000-07-06 2002-01-25 Fujitsu Ten Ltd Structure of air-tight case
JP2013069735A (en) * 2011-09-21 2013-04-18 Hitachi Automotive Systems Ltd Seal structure of electronic control device
JP2014170669A (en) * 2013-03-04 2014-09-18 Denso Corp Electronic controller
JP5745127B1 (en) * 2014-03-28 2015-07-08 三菱電機株式会社 Waterproof control unit
JP2018074677A (en) * 2016-10-26 2018-05-10 株式会社デンソー Housing member and driver using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026538A (en) * 2000-07-06 2002-01-25 Fujitsu Ten Ltd Structure of air-tight case
JP2013069735A (en) * 2011-09-21 2013-04-18 Hitachi Automotive Systems Ltd Seal structure of electronic control device
JP2014170669A (en) * 2013-03-04 2014-09-18 Denso Corp Electronic controller
JP5745127B1 (en) * 2014-03-28 2015-07-08 三菱電機株式会社 Waterproof control unit
JP2018074677A (en) * 2016-10-26 2018-05-10 株式会社デンソー Housing member and driver using the same

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