JP7038754B2 - Waterproof electronic device - Google Patents

Description

The present application relates to a waterproof electronic device.

As a conventional waterproof electronic device, a housing for storing electronic components is composed of a housing main body and a housing lid, and fitting portions are provided on the abutting surfaces of the housing main body and the housing lid. Disclosed is a technique for sealing by injecting a sealing resin into a gap between the fitting portions (see, for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2015-211145

For example, in the case of waterproof sealing the housing body and the housing lid, if the butt surfaces of the housing body and the housing lid are in contact with each other, the fitting is fitted. Since the sealing resin was injected into the gap formed between the joints, the sealing resin portion may be thinly formed at the joint portion to be the waterproof seal portion. When an aqueous solution such as salt water invades the waterproof seal in an outdoor environment, solutes such as salt may crystallize, and crystals grow at the joint between the housing body and the housing lid, causing the housing to grow. There is a problem that the crystal expands the gap between the main body portion and the housing lid portion, and stress is applied in the direction in which the sealing resin portion is peeled off.

The present application has been made to solve the above-mentioned problems, and it is possible to maintain airtightness even when salt water or the like intrudes into the joint between the housing body and the housing lid. The purpose is to provide a waterproof electronic device.

The waterproof electronic device according to the present application includes an electronic component, a housing main body for accommodating the electronic component, a housing lid portion covering the opening end surface of the housing main body, and the housing main body and the housing lid. The housing main body is provided with a sealing resin portion that is arranged at the joint portion of the above and seals the electronic component, and the housing main body portion protrudes toward the housing lid portion in a region to be joined to the housing lid portion. It has a convex shape portion formed at a height not in contact with the housing lid portion and a groove portion formed on the upper surface serving as the top portion, the convex shape portion is formed in an annular shape, and the groove portion is the convex shape portion. The top is formed in an annular shape along the extending direction and in the intermediate region between the inner circumference and the outer circumference of the convex shape portion, and the sealing resin portion is formed between the housing lid portion and the convex portion. It is characterized in that the gap between the shape portion and the groove portion is filled and the groove portion is filled.

According to the waterproof electronic device of the present application, a convex portion of the housing main body is provided at a height not in contact with the housing lid at the joint portion between the housing lid and the housing main body, and the convex portion is provided. Since the groove portion is provided on the top portion, a larger gap for arranging the sealing resin portion can be secured and the sealing resin portion can be formed thicker than when the housing main body portion is in contact with the housing lid portion. , It is possible to obtain sufficient airtightness.

It is a perspective view of the waterproof electronic device according to Embodiment 1. FIG. It is a perspective view of the housing lid part of the waterproof electronic device according to Embodiment 1. FIG. FIG. 3 is a perspective view of a housing main body of the waterproof electronic device according to the first embodiment. FIG. 3 is a cross-sectional view of a main part showing a joint portion between a housing lid portion and a housing main body portion of the waterproof electronic device according to the first embodiment. It is sectional drawing of the main part of the waterproof electronic apparatus which shows the modification of the resin sealed state of Embodiment 1. FIG. It is sectional drawing of the main part of the waterproof electronic apparatus which shows the modification of the resin sealed state of Embodiment 1. FIG. It is sectional drawing of the main part of the waterproof electronic apparatus which shows the modification of the housing lid part of Embodiment 1. FIG. It is sectional drawing which shows the waterproof type electronic apparatus by Embodiment 2. FIG. It is sectional drawing which shows the waterproof type electronic apparatus by Embodiment 3. FIG.

Embodiment 1.
The waterproof electronic device 100 according to the first embodiment of the present application will be described with reference to FIGS. 1 to 7. FIG. 1 is a perspective view showing the outer shape of the housing of the waterproof electronic device 100. FIG. 2 is a perspective view showing the housing lid 2 of the housing constituting the waterproof electronic device 100. FIG. 3 is a perspective view showing the housing main body 1 of the housing constituting the waterproof electronic device 100. 4 to 6 are cross-sectional views of a main part showing a joint portion between the housing lid portion 2 and the housing main body portion 1, showing a case where the amounts of the resins constituting the sealing resin portion 5 are different from each other. Shows the case where the amount of resin is the largest, FIG. 5 shows the case where the amount of resin is medium, and FIG. 6 shows the case where the amount of resin is the smallest. Further, FIG. 7 shows a modified example in which the shape of the back surface of the housing lid 2 is a flat surface.

As illustrated in FIG. 1, the external shape of the waterproof electronic device 100 is substantially cylindrical, and the bottomed cylindrical housing body 1 for accommodating the electronic component 10 (described later) mounts the electronic component 10. The configuration includes a flat surface portion 1a and a cylindrical side surface portion 1b rising from the upper surface of the flat surface portion 1a located outside the electronic component 10. Among them, the side surface portion 1b may include a side surface portion 1bb formed of another part in a part in the circumferential direction. The side surface portion 1b is formed, for example, to have a predetermined thickness (width). The open end surface (upper surface side) of the housing body 1 is covered and sealed by the housing lid 2.

Further, as shown in FIG. 2, an annular lid-side convex portion 3 is formed on the outer peripheral portion joined to the housing main body portion 1 on the inner surface side of the housing lid portion 2. The top portion (flat surface portion in this example) of the lid-side convex portion 3 is a joint surface.
Further, as shown in FIG. 3, the upper end surface (the flat surface portion facing the outer peripheral portion of the housing lid portion 2) of the side surface portion 1b (including the side surface portion 1bb) of the housing main body portion 1 extends in the circumferential direction. An annular convex portion 4 is formed. At least the surface portion of the convex shape portion 4 is a joint surface.

Next, a state in which the sealing resin portion 5 is filled in the joint portion between the housing main body portion 1 and the housing lid portion 2 to seal the housing will be described with reference to FIGS. 4 to 6. Here, the joint portion refers to a region where the side surface portion 1b of the housing main body portion 1 and the housing lid portion 2 (in this example, the lid side convex portion 3) face each other. 4 to 6 are cross-sectional views of a main part of the waterproof electronic device 100 along a direction perpendicular to the mounting surface of the electronic component 10, and is a view centering on the sealing resin part 5.
As shown in FIG. 4, the upper end surface of the side surface portion 1b of the housing main body portion 1 has an intermediate region between the inner peripheral surface (inner surface surface) and the outer peripheral surface (outer surface surface) of the side surface portion 1b, that is, The convex portion 4 protrudes from the region located at the center of the thickness of the side surface portion 1b. The convex shape portion 4 projects upward toward the housing lid portion 2 and is formed so as to be adjusted to a height that does not contact the housing lid portion 2. A groove 4a is formed in the circumferential direction on the top (upper surface) of the convex portion 4. The groove 4a is formed in an annular shape along the direction in which the top of the convex portion 4 extends.

The sealing resin portion 5 is filled in the gap between the lid-side convex portion 3 of the housing lid portion 2 and the side surface portion 1b of the housing main body portion 1, and the housing main body portion 1 including the surface portion of the convex shape portion 4 It covers the upper end surface of the side surface portion 1b, fills the groove portion 4a of the convex shape portion 4, is in contact with the top of the lid side convex portion 3, and protrudes from the outer surface portions of the housing main body portion 1 and the housing lid portion 2. Filled in state. By widely covering the outer surface side of the joint portion between the housing main body portion 1 and the housing lid portion 2 with the sealing resin portion 5, it is possible to prevent the joint portion from being directly exposed to water.
In the example of FIG. 4, it is shown that the sealing resin portion 5 is filled not only on the outer surface portion of the joint portion between the housing body portion 1 and the housing lid portion 2 but also on the inner side surface portion. The joint area is also earned on the inner surface side of the housing.

In this way, by forming the convex-shaped portion 4 having the groove portion 4a on the housing main body 1 side, the bonding area with the sealing resin portion 5 is gained as compared with the case where the convex-shaped portion 4 and the groove portion 4a are not formed. And the adhesiveness is improved. Further, it is possible to further increase the joint area by extending the joint surface to the side surface portion by protruding the sealing resin from the joint portion between the housing main body portion 1 and the housing lid portion 2 to the outside and the inside. Become.
Further, in the upper surface portion which is the top of the convex shape portion 4, the sealing resin portion 5 is formed thicker than the other portions only in the portion located in the groove portion 4a to become the core portion, and the strength of the sealing resin portion 5 itself is improved. There is an advantage to do.

Next, the procedure for assembling the waterproof electronic device 100 of the present application will be described.
First, after manufacturing the housing lid portion 2 and the housing main body portion 1 formed in the shapes shown in FIGS. 2 and 3, the electronic component 10 is mounted on the inner bottom surface of the housing main body portion 1. At this time, the side surface portion 1bb of the housing main body portion 1 is also assembled to the side surface portion 1b and the flat surface portion 1a which are the base portions.
Next, the housing lid 2 is assembled to the housing main body 1, and at this time, the sealing resin is applied to the upper end surface of the side surface portion 1b of the housing main body 1. As a result, the sealing resin is brought into close contact with the main body side joint surface (concave and convex surface) including the convex shape portion 4. After that, the joint surface of the housing lid 2 is superposed on the applied sealing resin and assembled. As a result, the lid-side convex portion 3 of the housing lid portion 2 and the apex of the convex shape portion 4 of the housing main body portion 1 are engaged so as to meet each other, and the sealing portion including the groove portion 4a of the convex shape portion 4 is filled. The sealing resin portion 5 is formed by solidifying the stop resin.
In this way, the joint surface of the housing of the waterproof electronic device 100 is watertightly sealed by the sealing resin portion 5, and a unit having a waterproof function can be obtained.

As described above, the waterproof electronic device 100 of the present application includes an electronic component 10, a housing body 1 for accommodating the electronic component 10, a housing lid 2 covering the opening end surface of the housing body 1, and a housing body. A sealing resin portion 5 that is arranged at a joint portion between the portion 1 and the housing lid portion 2 and that seals the electronic component 10 in cooperation with the housing main body portion 1 and the housing lid portion 2 is provided, and the housing main body portion 1 is provided. Is formed in a region joined to the housing lid 2 at a height that protrudes toward the housing lid 2 and does not come into contact with the housing lid 2, and has a convex portion 4a having a groove 4a formed at the top. The sealing resin portion 5 is provided in a shape that fills the gap between the housing lid portion 2 and the convex shape portion 4.

According to the waterproof electronic device 100 of the present application, a gap is secured between the housing main body 1 and the housing lid 2 at the joint between the housing main body 1 and the housing lid 2. In the groove portion 4a, it is possible to form the resin layer of the sealing resin portion 5 thicker than the other portions, and the sealing resin portion 5 allows the housing main body portion 1 and the housing lid portion 2 to be separated from each other. Sealing is possible.
Therefore, for example, in an environment where the waterproof electronic device 100 is used for an in-vehicle use, an aqueous solution such as salt water is less likely to enter the joint portion between the housing main body portion 1 and the housing lid portion 2, and the airtightness is maintained for a long period of time. It becomes possible to hold. Even if crystallization of a solute such as a salt occurs near the surface of the housing, the sealing resin portion 5 is formed to have a sufficient thickness, so that it is possible to suppress the crystal growth itself at the joint portion. Further, even if crystal growth occurs at the joint portion, it is possible to widen the distance between the housing body portion 1 and the housing lid portion 2 and reduce the stress of trying to peel off the seal.

In FIG. 4 and the like, the opening shape of the groove portion 4a is exemplified as a V-shape, but it goes without saying that other shapes such as a U-shape and a semicircular shape can be used.
Further, in the perspective views of FIGS. 2 and 3 and the cross-sectional view of FIG. 4 and the like, there is a portion where the housing shape does not match, but in FIG. 4 and the like, the joint portion contributing to the resin sealing is the center. This is because the schematic diagram is shown, and the configuration of a portion having little relation to the resin sealing, for example, the outer edge portion of the housing is omitted.

Further, FIG. 5 shows a modified example of the resin-sealed state of FIG. The configuration of FIG. 5 is similar to that of FIG. 4 described above in the shapes of the housing body 1 and the housing lid 2, but the amount of resin in the sealing resin portion 51 filled in the joint is smaller. different. As shown in FIG. 5, the sealing resin portion 51 arranged at the joint portion between the housing main body portion 1 and the housing lid portion 2 is the surface of the convex shape portion 4 of the side surface portion 1b of the housing main body portion 1. In addition to being in contact with the upper end surface including the housing lid portion 2, it is in contact with the facing surface of the lid-side convex portion 3 of the housing lid portion 2 with the housing main body portion 1, but on the outer surface portions of the housing main body portion 1 and the housing lid portion 2. It is filled so that it does not stick out.
The sealing resin portion 51 shown in FIG. 5 has a smaller amount of resin than the sealing resin portion 5 shown in FIG. 4, but the groove portion 4a is filled with the sealing resin as in the configuration of FIG. A partially thick resin layer can be obtained, and airtightness can be maintained.

Further, as shown in FIG. 6 as a modified example of the resin-sealed state of FIG. 5, it is also possible to form the sealing resin portion 52 having a smaller amount of resin than the sealing resin portion 51 shown in FIG. .. As shown in FIG. 6, the sealing resin portion 52 is arranged so as to be in contact with the top of the convex-shaped portion 4 of the housing main body portion 1. At this time, in the example of FIG. 6, the sealing resin portion 52 does not touch the entire surface of the joint surface (top) of the lid-side convex portion 3 of the housing lid portion 2, but is in contact with the entire top surface. Needless to say, it is okay.
The sealing resin portion 52 shown in FIG. 6 has a smaller amount of resin than the sealing resin portion 51 shown in FIG. 5, but the groove portion 4a is filled with the sealing resin as in the configuration of FIG. A partially thick resin layer can be obtained, and airtightness can be maintained.

Next, FIG. 7 shows a modified example of the housing lid portion 2. In FIGS. 2 and 4 to 6 described above, an example in which the lid-side convex portion 3 is provided on the inner surface side of the housing lid portion 2 has been given, but as shown in FIG. 7, the lid-side convex portion 3 is provided. It is also possible to use a flat plate-shaped housing lid portion 2 without the above.

Embodiment 2.
Next, the waterproof electronic device 100 of the second embodiment will be described with reference to FIG.
In the above-described first embodiment, a case where the lid-side convex portion 3 is provided at the joint portion of the housing lid portion 2 with the housing main body portion 1 or a case where a flat surface is provided has been described. The feature is that the lid side recess 30 is provided at the joint portion of the housing lid portion 2 with the housing main body portion 1.
As shown in FIG. 8, the housing lid 2 has a flat plate shape, and the joint surface to be joined to the housing main body 1 on the outer peripheral portion of the housing lid 2 has a lid side dug down from the joint surface. The recess 30 is provided. The lid-side recess 30 is filled with a sealing resin to form a sealing resin portion 5.

By providing the lid-side recess 30 in the housing lid portion 2, more space for filling the sealing resin portion 5 can be secured as compared with the case where the lid-side recess 30 is not provided, and the sealing resin portion 5 can be provided. It can be formed thicker. Further, since the sealing resin portion 5 filled in the lid-side recess 30 is in a state of biting into the lid-side recess 30, the sealing resin portion 5 is unlikely to be displaced from a predetermined position (joint portion) of the housing lid portion 2. There is an advantage.

Embodiment 3.
Next, the waterproof electronic device 100 of the third embodiment will be described with reference to FIG.
In the above-described first embodiment, a state in which the lid-side convex portion 3 is provided at the joint portion of the housing lid portion 2 with the housing main body portion 1 and the top portion (joint surface) of the lid-side convex portion 3 is a flat surface is exemplified. However, the third embodiment is characterized in that the lid side groove portion 31 is provided on the top of the lid side convex portion 3 of the housing lid portion 2 provided in an annular shape. For example, it goes without saying that the lid-side groove portion 31 is formed in an annular shape along the extending direction of the lid-side convex portion 3, and the cross-sectional shape thereof can be arbitrarily changed in the same manner as the groove portion 4a.

As shown in FIG. 9, a lid-side groove portion 31 is formed on the top of the lid-side convex portion 3, and the lid-side groove portion 31 is filled with the sealing resin portion 5, so that the thickness is partially large. The sealing resin portion 5 having the above can be obtained. By providing the lid side groove portion 31 of the housing lid portion 2 directly above the groove portion 4a of the housing main body portion 1, the sealing resin portion 5 is provided with the housing main body portion 1 and the housing lid at the central portion of the width of the joint surface. It can be made to bite into the portion 2, and at that position, the thickness of the sealing resin portion 5 can be increased to a dimension corresponding to the distance from the bottom portion of the groove portion 4a to the bottom portion of the lid side groove portion 31, and the sealing can be performed. It is possible to improve the strength of the resin portion 5 itself, which is effective in maintaining airtightness.

Although the present disclosure describes exemplary embodiments, the various features, embodiments, and functions described in the embodiments are not limited to the application of a particular embodiment, but alone. Alternatively, various combinations can be applied to the embodiments.
Therefore, innumerable variations not illustrated are envisioned within the scope of the techniques disclosed herein. For example, it is assumed that at least one component is modified, added or omitted.

1 housing body, 1a flat surface, 1b, 1bb side surface, 2 housing lid, 3 lid side convex part, 4 convex shape part, 4a groove part, 5, 51, 52 sealing resin part, 10 electronic parts, 30 Closure side recess, 31 Closure side groove, 100 Waterproof electronic device

Claims (8)

Electronic components, a housing main body for storing the electronic components, a housing lid covering the opening end surface of the housing main body, and a joint portion between the housing main body and the housing lid, and the electronic components are arranged. Equipped with a sealing resin part that seals parts
The housing body portion is formed in a region to be joined to the housing lid portion at a height that protrudes toward the housing lid portion and does not come into contact with the housing lid portion, and has a groove portion on the upper surface serving as the top portion. It has a formed convex shape and has a convex shape.
The convex portion is formed in an annular shape and is formed in an annular shape.
The groove portion is formed in an annular shape along the direction in which the top of the convex shape portion extends and in an intermediate region between the inner circumference and the outer circumference of the convex shape portion .
The waterproof electronic device is characterized in that the sealing resin portion is filled in the gap between the housing lid portion and the convex shape portion and is also filled in the groove portion. The housing main body portion has a flat surface portion on which the electronic component is mounted and a side surface portion of the flat surface portion that rises from the outer upper surface of the electronic component, and the convex shape portion is arranged on the upper end surface of the side surface portion. The waterproof electronic device according to claim 1 , wherein the waterproof electronic device is provided. The waterproof electronic device according to claim 2 , wherein the sealing resin portion is arranged in a region covering the upper end surface of the side surface portion of the housing main body portion including the surface portion of the convex shape portion. .. 2 . The waterproof electronic device described. It has a lid-side convex portion protruding from the outer peripheral portion of the housing lid portion having a flat plate shape toward the housing main body portion, and is characterized in that the lid-side convex portion and the sealing resin portion are in contact with each other. The waterproof electronic device according to any one of claims 1 to 4 . The waterproof electronic device according to claim 5 , wherein a lid-side groove is formed on the top of the lid-side convex portion, and the lid-side groove is filled with the sealing resin portion. The waterproof electronic device according to claim 6, wherein the lid-side groove portion of the housing lid portion is provided directly above the groove portion of the housing main body portion. The housing lid portion has a flat plate shape, and a lid-side recess dug down from the joint surface is formed on the joint surface joined to the housing main body portion on the outer peripheral portion of the housing lid portion, and the lid portion is formed. The waterproof electronic device according to any one of claims 1 to 5, wherein the side recess is filled with the sealing resin portion.

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