JP2021174883A - Metal plate, metal resin composite body and semiconductor device - Google Patents

Abstract

To provide a metal plate capable of improving, when a closed space is formed by a metal plate and a resin member, sealability between the inside and the outside of the closed space.SOLUTION: A metal plate includes a covering region covered with a resin member on a surface thereof and a recessed part formation region including at least one stripe-shaped recessed part formed, recessed from a surface of the metal plate to cross the direction scanning the surface of the metal plate from the inside to the outside of the closed space formed from a member including the metal plate and the resin member.SELECTED DRAWING: Figure 1

Description

The present invention relates to metal plates, metal resin complexes, and semiconductor devices.

Conventionally, various techniques have been disclosed in order to improve the adhesion between a metal material and a resin member provided on the surface thereof and covering the surface. For example, in the technique disclosed in Patent Document 1, unevenness is formed on the surface of a metal plate used as a lead frame, and the tip of the convex portion is crushed to form a key portion, whereby the metal plate and the metal plate are formed. The adhesion with the resin member covering the surface is improved.

JP-A-2007-258587

However, as in the technique disclosed in Patent Document 1, although the adhesion between the metal plate and the resin member covering the surface thereof can be improved by the conventional technique, the metal plate and the resin member can be separated from each other. When a closed space was formed by the including members, there was room for improvement in the airtightness between the inside of the closed space and the outside of the closed space. In particular, when the metal plate is used as a lead frame for a semiconductor device, a semiconductor chip is enclosed with a member including a metal plate and a resin member to form a closed space. May permeate into the closed space from outside the closed space, and if it permeates, the semiconductor chip that is electrically connected to the lead frame and generates heat during use may come into contact with moisture and cause malfunction.

Therefore, in one embodiment of the present invention, when a closed space is formed by a member including a metal plate and a resin member, it is possible to improve the airtightness between the inside of the closed space and the outside of the closed space. It is an object of the present invention to provide a metal plate, a metal resin composite, and a semiconductor device.

In one embodiment, the metal plate of the present invention is a metal plate having a coated region covered with a resin member on its surface.
Formed by being recessed from the surface of the metal plate so as to intersect the direction of scanning the surface of the metal plate from the inside of the closed space formed by the member including the metal plate and the resin member to the outside of the closed space. It is a metal plate in which a recess-forming region including at least one streaky recess is present.

In one embodiment, the resin composite of the present invention is a metal-resin composite comprising the above-mentioned metal plate and a resin member arranged so as to cover the covering region of the metal plate.

In one embodiment, the semiconductor device of the present invention is a semiconductor device including the above-mentioned metal-resin composite and a semiconductor chip electrically connected to the lead frame of the metal-resin composite.

According to the present invention, a metal plate capable of improving the airtightness between the inside of the closed space and the outside of the closed space when a closed space is formed by a member including a metal plate and a resin member. Metal resin composites and semiconductor devices can be provided.

It is a top view which shows typically the metal plate which concerns on one Embodiment of this invention. It is a top view which shows by enlarging the periphery of the covering area of the metal plate of FIG. FIG. 5 is a plan view schematically showing the metal plate of FIG. 1 in a state where a resin member is arranged in a covering region of the metal plate. It is a figure which shows typically the cross section along the aa line of FIG. It is a figure which shows the part of the recess formation region of FIG. 1 by enlarging the cross section orthogonal to the longitudinal direction. FIG. 5 is an enlarged view showing a cross section of one streak-shaped recess in the recess-forming region of FIG. 5 perpendicular to the longitudinal direction thereof. FIG. 6 is an enlarged view showing a modified example of the streak recess of FIG. 6 in a cross section orthogonal to the longitudinal direction thereof.

Hereinafter, embodiments of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail, but the present invention is not limited to the present embodiment.

As shown in FIG. 1, the metal plate of the present embodiment is a metal plate 10 having a coating region A1 on the surface covered with a resin member 11 (see FIGS. 3 and 4), and the metal plate 10 is particularly limited. Although not, it can be formed from a material containing copper, aluminum, iron, alloys thereof, and the like.

The metal plate 10 of the present embodiment can be used to form a closed space with a member including the metal plate 10 and the resin member 11, and if the closed space is in contact with moisture, for example, a malfunction or failure occurs. It is possible to enclose inclusions such as semiconductor chips and other devices that may be damaged.

More specifically, as shown in FIG. 1, the metal plate 10 of the present embodiment has a plate shape as a whole, and can have a shape suitable for its use. Specifically, the metal plate 10 of FIG. 1 is provided with an opening 12 that opens on both sides of the metal plate 10 and penetrates both sides in the center in a plan view, and is located around the opening 12. A rectangular metal piece 10a (in the figure, there are four large metal pieces 10a and two small metal pieces 10a) and an outer peripheral portion connected to the metal piece 10a by a connecting part 10b. It is configured to include 10c and the like. Further, each metal piece portion 10a is an overhanging portion 10d in which a portion on the opening 12 side extends inward of the opening 12.
Further, as shown in FIGS. 1 and 2, the metal plate 10 has a covering region A1 on the surface thereof, which is covered with the resin member 11. Specifically, a covering region A1 is provided on both surfaces of the overhanging portion 10d of the metal plate 10 as shown in FIGS. 1 and 2.

Then, in the metal plate 10 of the present embodiment, the resin member 11 can be arranged in the covering region A1 of the metal plate 10 as shown in FIGS. 3 and 4 which are cross-sectional views of FIGS. Further, the metal plate 10 is provided with the resin member 11 so that the resin member 11 covers the surface of the metal plate 10, so that the closed space S1 is partitioned and formed by the members including the metal plate 10 and the resin member 11. (Hereinafter, the member that partitions the closed space S1 is also referred to as a partition member).
Specifically, in the illustrated example, as shown in FIGS. 3 and 4, the resin member 11 (first resin member 11a) is placed on the covering regions A1 on both sides of the metal plate 10 and adjacent metal pieces. It is arranged in the inner portion (space) of the opening 12 of the metal plate 10 so as to connect between 10a (covered region A1). Further, in the illustrated example, a closed space S1 is formed around the inside of the opening 12 of the metal plate 10. That is, in the illustrated example, the coating region A1 exists on both surfaces of the metal plate 10, and the resin member 11 is provided on each of the coating regions A1 existing on both surfaces to form the closed space S1.

In the closed space S1 formed in this way, if a space (region) for enclosing the inclusion is formed inside the closed space S1, there is a space (gap) between the partition member and the inclusion. It may exist or the space (gap) may not exist (in the example of FIG. 4, the space (gap) exists). Further, in this example, as shown in FIG. 1, a metal plate 10 having an opening 12 penetrating both sides of the metal plate 10 is used, an enclosure is arranged in the opening 12, and an opening is made from the vicinity of the opening 12. Although the closed space S1 is formed in the portion 12, it is also possible to arrange an enclosure on the surface of the metal plate 10 and form the closed space S1 so as to cover it.
Further, in the present embodiment, the resin member 11 arranged in the covering region A1 is not particularly limited as long as it contains a resin material, and even if it is made of one type of resin material, a plurality of resin materials may be used. It may be mixed or laminated, and the resin material also includes a resin material (adhesive) having adhesiveness. Further, as the member (partition member) forming the closed space S1, in addition to the metal plate 10 and the resin member 11, a member having heat dissipation can be used. For example, copper or aluminum other than the metal plate of the present embodiment can be used. It may be a metal plate 10 made of an alloy or the like (for example, in the example of FIG. 4, a lid material 17 (a metal (copper) plate) is used as a partition member).

Here, in the metal plate 10 of the present embodiment, the covering region A1 is provided with a recess forming region A2 including at least one streaky recess 13 formed by being recessed from the surface of the metal plate 10, and the streaks are also provided. The shaped recesses 13 intersect in a direction of scanning the surface of the metal plate 10 from the inside of the closed space S1 formed by the metal plate 10 and the resin member 11 to the outside of the closed space S1.
More specifically, as shown in FIG. 2, the recess forming region A2 is located in the covering region A1, and more specifically, in the covering region A1 of the metal piece portion 10a of the metal plate 10. The whole is formed so as to be included in the covering region A1, and includes at least one (10 in the illustrated example) streaky recesses 13 formed by being recessed from the surface of the metal plate 10. The streaky recesses 13 intersect with respect to the direction in which the surface of the metal plate 10 is scanned from the inside of the closed space S1 formed as described above to the outside of the closed space S1 (hereinafter, also referred to as a scanning direction). For example, the streak recess 13 is inclined or orthogonal to the scanning direction so as not to be in the direction along the scanning direction. In the illustrated example, each streak-shaped recess 13 in each recess forming region A2 is orthogonal to the scanning direction (arrow Ds in the figure) as shown in FIG.

In the illustrated example, there are a plurality of streaky recesses 13 included in the recess forming region A2, but the plurality of streak recesses 13 are provided so as to be parallel to each other. When a plurality of streaky recesses 13 are included in the recess forming region A2, the streak recesses 13 do not have to extend exactly in parallel with each other as described above, but it is preferable that they do not intersect with each other. For example, if the angle (sharp angle side) formed between the extending direction of one streaky recess 13 and the extending direction of the other streak recess 13 is 5 ° or less, it is acceptable.

Further, it is preferable that the recess forming region A2 is provided so as to include the entire recess forming region A1 in the covering region A1, but a part of the recess forming region A2 is in the covering region A1 and the other part is in the covering region. It may be outside A1. For example, the recess forming region A2 may extend from the inside to the outside of the covering region A1. Further, on the surface of the metal plate 10, for example, recesses extending in a streak shape may be separately formed in a portion other than the covering region A1.

As described above, in the present embodiment, the covering region A1 is provided with the recess forming region A2 including the streak recesses 13, and the streaks 13 are arranged so as to intersect with each other in the scanning direction. When the closed space S1 is formed by the member including the plate 10 and the resin member 11, the airtightness between the inside of the closed space S1 and the outside of the closed space S1 can be improved.
More specifically, by providing the recess forming region A2 including the streak recess 13 in the covering region A1, the resin member 11 covering the surface of the metal plate 10 enters the inside of the streak recess 13 to exert an anchor effect. It is considered that the metal plate 10 can be effectively exerted, and the adhesion between the metal plate 10 and the resin member 11 that covers the surface thereof can be improved. Further, at this time, by arranging the streaky recesses 13 so as to intersect with each other in the scanning direction, the airtightness between the inside of the closed space S1 and the outside of the closed space S1 can be improved. Specifically, the permeation of a fluid such as moisture from the outside of the closed space S1 into the closed space S1 can occur by passing between the metal plate 10 and the resin member 11 (interface), and the streak recess 13 By arranging the above so as to intersect the scanning direction, it is necessary to cross the interface of the resin member 11 fitted in the streak recess 13 when the fluid permeates. Therefore, it is possible to prevent the fluid from penetrating, and as a result, the airtightness can be improved. In addition, for example, when a point-shaped recess formed by being recessed from the surface of the metal plate 10 is used instead of the streak recess 13, a flat portion between the point-shaped recesses exists in the covering region A1 and the fluid is fluid. Cannot be sufficiently prevented from penetrating.
Further, as will be described later, when the streak recess 13 is formed by press working, the metal material (meat) of the crushed portion escapes around the streak recess 13. As a result, convex streaks protruding from the surface of the metal plate 10 are formed in the lateral direction of the streak recesses 13. As a result, the permeation of the fluid can be prevented not only by the streaky concave portion 13 but also by the streak convex portion.

In this example, as shown in FIG. 4, the recess forming region A2 is provided on both surfaces of the metal plate 10, and the resin member 11 arranged in the recess forming region A2 provided on both surfaces and the metal plate. The closed space S1 is formed by the members including 10. As described above, in the present embodiment, when the closed space S1 is formed including the resin members 11 arranged on both surfaces of the metal plate 10, it is combined with the covering region A1 on one surface of the metal plate 10. It is preferable that the recess forming region A2 is provided in both the covering region A1 on the other surface, whereby the airtightness can be further improved.

By the way, in the recess forming region A2, as shown in FIG. 2, both ends 14 of the recess forming region A2 in the longitudinal direction are located at the edge of the metal plate 10. More specifically, both ends 14 in the longitudinal direction of the recess forming region A2 (in the illustrated example, the recess forming region A2 located at the overhanging portion 10d of the metal piece portion 10a) are the openings 12 among the edges of the metal plate 10. The longitudinal intermediate portion 15 of the recess forming region A2 is located on the peripheral edge of the recessed region A2 and is separated from the opening portion 12. In other words, both ends 16 in the longitudinal direction of the streak recess 13 included in the recess forming region A2 do not terminate within the surface of the metal plate 10 (in the illustrated example, the overhanging portion 10d of the metal piece 10a). It extends to the peripheral edge of the opening 12 (note that the longitudinal end portions 14 of the recess forming region A2 are also the longitudinal end portions 16 of the streak recess 13). Further, the intermediate portion 15 in the longitudinal direction of the recess forming region A2, specifically, a portion other than the end portion is separated from the peripheral edge of the opening 12, and the metal plate 10 (in the illustrated example, the metal piece portion 10a is stretched). It is located within the surface of the protruding portion 10d).

As described above, in the present embodiment, the longitudinal end portions 14 of the recess forming region A2 are located at the edges of the metal plate 10, so that the longitudinal end portions 14 of the recess forming region A2 are other than the edges of the metal plate 10. The airtightness can be further improved as compared with the case where the portion is located in the surface of the metal plate 10, for example. Specifically, when both ends 14 in the longitudinal direction of the recess forming region A2 are located in a portion other than the edge of the metal plate 10, for example, in the surface of the metal plate 10, fluid such as moisture flows into the recess forming region A2. From the end portion in the longitudinal direction, there is a possibility that the recess forming region A2 may enter the recess forming region A2 in the longitudinal direction and move along the inside of the streak recess 13 to penetrate from the outside of the closed space S1 into the closed space. On the other hand, when both ends 14 in the longitudinal direction of the recess forming region A2 are located at the edges of the metal plate 10, the resin member 11 wraps around the edge of the metal plate 10 from the covering region A1 on the surface of the metal plate 10. Since it can also cover the metal, it is possible to more reliably prevent the permeation of a fluid such as moisture, and as a result, the airtightness can be improved.
Further, both ends 14 in the longitudinal direction of the recess forming region A2 are located on the peripheral edge of the opening 12 among the edges of the metal plate 10, and the intermediate portion 15 in the longitudinal direction of the recess forming region A2 is the opening. By separating from 12, it is possible to prevent the permeation of fluid such as moisture from the end portion of the recess forming region A2, and further prevent the permeation of fluid such as moisture in the longitudinal intermediate portion 15 of the recess forming region A2. ..

In the present embodiment, the recess forming region A2 has both ends in the longitudinal direction, but it may be endless, for example. In this case, there is no end portion of the recess forming region A2 on the surface of the metal plate 10, and the recess forming region A2 can have a closed shape such as an annular shape in a plan view.

Here, the streak-shaped recess 13 included in the recess-forming region A2 has a depth D (mm) and a width W (mm) as shown in FIG. 5, which is a cross-sectional view of the recess-forming region A2.
The depth D of the streaky recess 13 included in the recess forming region A2 is preferably 0.010 mm or more, more preferably 0.030 mm or more. By setting the depth D to 0.010 mm or more, the airtightness between the inside of the closed space S1 and the outside of the closed space S1 can be further improved. Further, by setting the depth D to 0.030 mm or more, the airtightness can be sufficiently improved, whereby, for example, the metal resin composite 20 in which the resin member 11 is arranged on the metal plate 10 is heated. However, the airtightness can be further ensured.
Further, the upper limit of the depth D is not particularly limited from the viewpoint of airtightness, but from the viewpoint of ensuring the dimensional accuracy of the metal plate 10 and avoiding the influence on physical properties such as strength, the depth D is the metal plate 10. It is preferably 50% or less of the thickness. As a specific value, the depth D is preferably 0.050 mm or less.

The width W of the streaky recess 13 included in the recess forming region A2 is preferably 0.030 to 0.400 mm, more preferably 0.040 to 0.300 mm. By setting the width W in the above range, the anchor effect can be effectively exerted, and the airtightness between the inside of the closed space S1 and the outside of the closed space S1 can be further improved.

The ratio of the depth D (mm) of the streak recess 13 of the recess forming region A2 to the width W (mm) of the streak 13 is preferably 0.2 or more, more preferably 0.4 or more. be. By setting the ratio to 0.2 or more, the airtightness between the inside of the closed space S1 and the outside of the closed space S1 can be further improved.
Further, the upper limit is not particularly limited from the viewpoint of improving the airtightness, but from the viewpoint of efficient formation of the recess forming region A2, the depth D (mm) of the streak recess 13 of the recess forming region A2 The ratio of the streak recess 13 to the width W (mm) is preferably 1.5 or less, more preferably 1.0 or less, and further preferably 0.9 or less.

As shown in FIG. 5, the depth D of the streak recess 13 means the maximum depth measured along the thickness direction of the metal plate 10 from the opening of the streak recess 13 to the bottom surface, for example, streaks. When the edge of the opening of the shaped recess 13 is slightly raised above the surface of the metal plate 10 (for example, when a press process is performed to form the streaky recess 13 on the surface of the metal plate 10 as described later). , The edge of the opening of the streak recess 13 becomes a raised shape due to the meat flow during pressing, although it is not clear from the drawing.) The streak recess 13 which is the starting point for measuring the depth D. The opening refers to an apex that is raised above the surface of the metal plate 10 (hereinafter, when the edge of the opening of the streak recess 13 is slightly raised above the surface of the metal plate 10, the streak recess is used. The opening of 13 refers to the apex of the opening).
Further, the width W of the streak recess 13 is the width at the opening of the streak recess 13 in the cross section orthogonal to the longitudinal direction of the streak recess 13.

Then, as shown in FIG. 5, when a plurality of streaky recesses 13 are included in the recess forming region A2, the adjacent streak recesses 13 are provided at intervals of a pitch length P (mm).
As shown in FIG. 5, the pitch length P (mm) of the adjacent streak recesses 13 is a cycle in which the streak recesses 13 are arranged, and specifically, a cross section orthogonal to the longitudinal direction of the streak recesses 13. The length is the sum of the width W (mm) of the streaky recesses 13 and the separation distance L (mm) between the adjacent streaky recesses 13.
Further, the separation distance L (mm) between the adjacent streak recesses 13 is the cross section orthogonal to the longitudinal direction of the streak recess 13 from the opening of one streak recess 13 to the adjacent streak recess 13. The distance to the opening of.

The separation distance L between the adjacent streaky recesses 13 is preferably 0.040 to 0.500 mm, more preferably 0.060 to 0.500 mm, still more preferably 0.070 to 0.300 mm. be. By setting the separation distance L to the above range, the anchor effect can be effectively exerted, and the airtightness between the inside of the closed space S1 and the outside of the closed space S1 can be further improved.

The number of streaky recesses 13 included in the recess forming region A2 is not particularly limited as long as it is one or more, but it is preferably two or more, and more preferably five or more. By setting the number to two or more, the airtightness can be effectively improved.
The upper limit is not particularly limited from the viewpoint of airtightness, but the number is preferably 15 or less. By setting the number to 15 or less, the dimensional accuracy of the metal plate 10 can be ensured and the influence on physical properties such as strength can be avoided.

Here, in the present embodiment, the shape of the streak recess 13 is not particularly limited and can be arbitrary. In the illustrated example, as shown in FIG. 6, it has an inner surface 13a that partitions the streak-shaped recess 13 along with an opening that opens outward from the covering region A1. The inner surface 13a is formed by a flat bottom surface 13b located at the deepest part of the streak recess 13 and a side surface 13c connecting the opening and the bottom surface 13b.
In the streak-shaped recess 13 having such a flat bottom surface 13b, it is preferable that the bottom surface 13b has an area of 20% to 60% with respect to the area of the opening. When the area of the bottom surface 13b of the streak recess 13 is less than 20% of the area of the opening, the resin member 11 is difficult to enter in the vicinity of the bottom surface 13b because the inner surface 13a of the streak recess 13 becomes too tapered as it gets deeper. Therefore, a relatively large air layer may be formed there. On the other hand, when the area of the bottom surface 13b of the streak-shaped recess 13 exceeds 60% of the area of the opening, the corner portion of the portion where the bottom surface 13b and the side surface 13c intersect becomes sharp, and it becomes difficult for the resin member 11 to enter there. There is concern that a relatively large air layer will be formed. It is even more preferable that the area of the bottom surface 13b is 40% to 60% of the area of the opening.

As shown in FIG. 6, it is preferable that the side surface 13c, which is substantially linear in cross-sectional view, is inclined at an angle θ within a range of 2 ° to 10 ° with respect to the perpendicular line erected on the bottom surface 13b. If this inclination angle θ is too large, there is a concern that the anchor effect cannot be sufficiently obtained. If the inclination angle θ is small, for example, when the streak recess 13 is formed by press working, when the streak recess 13 is formed by the punch used in the press working, the punch may not easily come out of the streak recess 13. be.

Alternatively, as in the modified example shown in FIG. 7, it is also possible to form a streak-shaped recess 13 having a curved inner surface 13d from the side surface to the bottom surface. The inner surface 13d of the streak-shaped recess 13 shown in FIG. 7 has a curved surface shape from the opening to the bottom surface through the side surface, and further, the curved surface shape is an arc shape in a cross-sectional view.
The streak-shaped recess 13 having such a curved inner surface 13d is also suitable from the viewpoint of suppressing the formation of an air layer because the resin is easily filled over the entire surface.

By the way, the recess forming region A2 may include the curved streak recess 13 and the linear streak 13, but as shown in FIGS. 2 and 3, the recess forming region A2 includes the linear streak 13. Is preferable. By including the linear streaky recess 13, it is easy to make a mold part and the productivity can be increased.

Further, in the present embodiment, it is preferable that at least the surface portion of the surface of the metal plate 10 where the recess forming region A2 exists is a roughened surface, and specifically, the arithmetic average roughness Ra of the surface portion is determined. It is preferably 0.4 μm or more, more preferably 0.5 μm or more, and further preferably 0.8 μm or more. By making the surface portion of the surface of the metal plate 10 where at least the recess forming region A2 exists as a roughened surface, the airtightness can be improved more effectively. Further, by setting the roughness Ra of the surface portion to 0.4 μm or more, the airtightness can be further effectively improved.
Further, the upper limit value is not particularly limited from the viewpoint of airtightness, but the roughness Ra is 2.0 μm or less because the efficiency of its formation tends to decrease if the roughness Ra becomes too large. Is preferable.
The calculated average roughness Ra referred to here is measured in accordance with JIS B0601. The roughened surface can be roughened. The roughened surface can be confirmed by a stereomicroscope or SEM. When the roughening treatment is not performed, the surface becomes a glossy surface, and when the roughening treatment is performed, the surface becomes a non-glossy surface, so that the surface can be visually identified.

By the way, as shown in FIG. 4, the illustrated metal plate 10 has a covering region A1 on both surfaces of the metal plate 10, and a recess forming region A2 is provided on both covering regions A1. Further, in the illustrated example, the streak-shaped recess 13 included in one recess-forming region A2 and the streak-shaped recess 13 included in the other recess-forming region A2 have the same shape and dimensions, respectively.
However, in the present embodiment, the recess forming region A2 may be provided only on one surface of the metal plate 10 instead of on both surfaces. Further, when provided on both surfaces, the streak-shaped recesses 13 included in the respective recess-forming regions A2 may have different shapes and dimensions.

Then, as shown in FIG. 4, each recess forming region A2 is preferably provided alternately (in a staggered pattern) in a cross-sectional view of the metal plate 10, and is not overlapped in the thickness direction. More preferred. By doing so, even if the depth D is made larger, the dimensional accuracy of the metal plate 10 can be ensured and the influence on the physical properties such as strength can be avoided.
More preferably, when viewed from the thickness direction, the opening of the streak recess 13 on one surface has a pitch length P (mm) of the streak 13 more than the opening of the streak 13 on the other surface. It is positioned up to 1/2.

Further, here, the thickness of the metal plate 10 in the present embodiment is not particularly limited, but can be, for example, 0.1 to 3.0 mm, and by setting the thickness within the range, it is suitable for a semiconductor device. Can be made easier to use.

The metal plate 10 as described above can be used for various purposes in which the resin member 11 is arranged in the covering region A1, and is particularly suitable for use in a semiconductor device. .. When used for a semiconductor device, the metal plate 10 of the present embodiment can be used as a lead frame, and the portion of the metal plate 10 where the covering region A1 is located and the portion of the metal plate 10 located in the closed space S1 are inner. The lead can be used, and the portion of the metal plate 10 located in the outer region of the closed space S1 following the inner lead can be used as the outer lead. Specifically, when the metal plate 10 shown in FIG. 2 is used as the lead frame, for example, the inside of the opening 12 is set as a region for arranging the semiconductor chip, and among the metal piece portions 10a around the region, the covering region A1 The portion where the metal plate 10 is located and the portion on the opening 12 side of the inner lead can be used as the inner lead, and the portion on the peripheral side of the metal plate 10 with respect to the covering region A1 can be used as the outer lead. Further, the outer peripheral portion 10c of the metal plate 10 can be used as an outer frame that supports the entire lead frame.

Further, since the metal plate 10 has high adhesion and airtightness to the resin member 11, it is also suitable to be used for, for example, a waterproof connector or an insert part such as a camera part or a smartphone part that requires waterproofness. Is.
Further, in the metal plate 10 (in other words, the metal resin composite 20 described later) shown in the state where the resin member 11 is arranged in the covering region A1 shown in FIG. 3, the front side in the drawing is the front side and the back side is the back side. However, the front side and the back side here are used to distinguish one surface of both surfaces of the metal plate 10 from the other surface on the back side thereof, and are referred to as "front side". It is also possible to replace the "back side" with the interpretation.

Further, although not shown, holes can be provided in the recess forming region A2 to open on both surfaces of the metal plate 10. As a result, the holes are also filled with the resin, so that the strength can be expected to be improved.

Subsequently, a method for manufacturing the metal plate 10 of the present embodiment will be described.
In the present embodiment, first, the unprocessed plate-shaped metal material is formed into a desired shape as shown in FIG. 1 by a method such as press working to obtain a metal plate 10 in which the recess forming region A2 is not formed. Next, the recess forming region A2 is formed at a desired position in the metal plate 10 in which the recess forming region A2 is not formed (in the example of FIG. 1, the covering region A1 of the overhanging portion 10d of the metal piece portion 10a). Pressing is performed using a punch provided with at least one streaky convex portion on the surface. When the recess forming region A2 is provided on both surfaces of the metal plate 10 as in the example shown in FIG. 4, both of the metal plates 10 in which the recess forming region A2 is not formed are provided. Pressing can be performed in order from one of the surfaces, but in particular, as shown in FIG. 4, each recess forming region A2 is provided alternately (in a staggered pattern) in the cross-sectional view of the metal plate 10. If so, it is preferable to press both surfaces at the same time. By performing the process from both surfaces at the same time, it is easier to maintain the shape and dimensions of the metal plate 10.

Regarding the punch for forming the streak recess 13 of the metal plate 10, the shape of the streak convex portion of the punch is not particularly limited, and for example, the cross-sectional shape orthogonal to the longitudinal direction of the streak convex portion is trapezoidal. Or a cannonball shape (a shape in which the corners of a trapezoidal shape are curved, for example, a circular shape or an elliptical shape). However, the shell shape is preferable from the viewpoint of securing the depth D of the streak recess 13 while sufficiently maintaining the shape and dimensions of the metal plate 10.
Further, when the streak recess 13 of the metal plate 10 is pressed in this way and the end portion of the streak 13 in the longitudinal direction is located at the edge of the metal plate 10, the streak 13 On the edge (side surface) of the metal plate 10 where the end is located, the metal meat protrudes (swells) by press working, and an uneven shape is formed.

Subsequently, in the method for manufacturing the metal plate 10 of the present embodiment, when the size of the metal plate 10 becomes large after the recess forming region A2 is provided as described above (for example, the size is increased by press working or the like). When it grows larger), the expanded portion can be cut (press punched) to fit the desired dimensions.
Further, the surface of the metal plate 10 can be roughened after the concave portion forming region A2 is provided and any additional cutting is performed. When the roughening treatment is performed, for example, a chemical oxidizing agent such as a manganese compound, a chromium compound or a persulfate compound can be used. These chemical oxidizing agents are used as an aqueous solution or an organic solvent dispersion solution after water or an organic solvent is added. The roughening liquid used for the roughening treatment generally contains an alkali such as sodium hydroxide as a pH adjuster or the like.

Next, the metal resin composite 20 of the present embodiment will be described.
As shown in FIGS. 3 and 4, the metal-resin composite 20 of the present embodiment is a resin member arranged so as to cover the metal plate 10 of the above-described embodiment of the present invention and the covering region A1 of the metal plate 10. 11 and.
More specifically, in the illustrated example, as shown in FIG. 4, the metal resin composite 20 has the resin member 11 (first resin member 11a) in the covering region A1 located on both surfaces of the metal plate 10. It is arranged and formed so as to cover the recess forming region A2. In this way, the resin member 11 covers the recess forming region A2, so that the resin member 11 is inside the streak recess 13 of the recess forming region A2. It can be in a state of being intruded. Further, in the metal resin composite 20 of this example, the resin member 11 is arranged in the covering region A1 located on both surfaces of the metal plate 10, and is separated from each other inside the opening 12 of the metal plate 10. A resin member 11 is provided so as to connect the covering region A1. As described above, in the metal resin composite 20 of this example, the resin member 11 is arranged on the covering region A1 of the metal plate 10, and the resin member 11 is also arranged inside the opening 12 of the metal plate 10. The opening surface in the opening 12 of the metal resin composite 20 is narrower than the opening surface of the opening 12 of the metal plate 10 itself, and the resin member 11 arranged in this way is rectangular in a plan view. It forms a closed shape. The metal resin composite 20 of the present embodiment may also include the second resin member 11b and the adhesive 11c as the resin member 11 shown by the broken line in FIG. 4 (the second resin member 11b is the first resin). It is provided so as to be laminated on the surface of the member 11a via the adhesive 11c. In FIG. 3, the second resin member 11b is omitted).

The material of the resin member 11 is not particularly limited, but for example, a liquid crystal polymer, an acrylonitrile-butadiene-styrene copolymer synthetic resin (ABS), a polyamide (PA), a polypropylene (PP), a polyester-based thermoplastic elastomer (TPC), and the like. Examples thereof include polyacetal (POM), polybutylene terephthalate (PBT), and polyphenylene sulfide (PPS). In particular, since the liquid crystal polymer has poor bondability with the metal, the metal-resin composite 20 of the present embodiment is more improved in the airtightness between the metal and the resin member 11. As shown in the illustrated example, when the first resin member 11a is provided on the covering region A1 and then a member for forming the closed space S1 is further provided, the first resin member provided on the covering region A1 is provided. As described above, 11a is not particularly limited, but for example, liquid crystal polymer, acrylonitrile-butadiene-styrene copolymer synthetic resin (ABS), polyamide (PA), polypropylene (PP), polyester-based thermoplastic elastomer (TPC), and the like. Polyacetal (POM), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), and the like can be used. In particular, when a liquid crystal polymer is used, the metal resin composite 20 of the present embodiment is made of a metal and a resin member 11. The airtightness with and is improved.

The resin member 11 can be arranged in the covering region A1 of the metal plate 10 by, for example, insert molding or the like.
Further, the illustrated metal resin composite 20 has a coating region A1 and a recess forming region A2 on both surfaces of the metal plate 10, and a resin member 11 is arranged on the coating regions A1 on both surfaces. Although not shown, the covering region A1 and the recess forming region A2 may be formed on only one surface, and / or the resin member 11 may be arranged on only one surface. ..

Further, in the metal resin composite 20 of the present embodiment, the metal plate 10 can be used as a lead frame to which a semiconductor chip is electrically connected.

The resin member 11 of the metal-resin composite 20 in the illustrated example has a thickness of about several millimeters, and the closed space S1 is not formed by the member including the metal plate 10 and the resin member 11. However, the metal-resin composite 20 of the present embodiment includes a metal plate 10 and a resin member 11 arranged so as to cover the covering region A1 of the metal plate 10, and the metal plate 10 and the resin member are provided. Even if the closed space S1 is formed by the member including the metal plate 10 and the closed space S1 is not formed by the member including the metal plate 10 and the resin member 11, as shown in FIG. 3, the subsequent steps can be performed. The closed space S1 may be formed by a member including the metal plate 10 and the resin member 11.
That is, in the metal-resin composite 20 as shown in the illustrated example, the closed space S1 is not formed by the member including the metal plate 10 and the resin member 11, but the metal plate 10 is used as a lead frame and the semiconductor chip is opened. After being arranged in the portion 12, the resin member 11 (second resin member 11b) of the same material or different material as the resin member 11 (first resin member 11a) previously provided on the metal plate 10 and the resin member 11 (the second resin member 11b). The resin member 11 (first resin member 11a) provided earlier by the adhesive 11c as the resin member 11 provided between the first resin member 11a and the second resin member 11b) and the copper lid material 17. By covering so as to include, a semiconductor device in which the closed space S1 is formed can be obtained. The closed space S1 in the semiconductor device thus obtained is formed by the resin member 11 including the first resin member 11a and the second resin member 11b, the metal plate 10, and the lid member 17.

Subsequently, the semiconductor device of this embodiment will be described.
The semiconductor device of the present embodiment includes the metal resin composite 20 of the embodiment of the present invention described above, and a semiconductor chip electrically connected to the lead frame of the metal resin composite 20. More specifically, the overhanging portion 10d of the metal plate 10 and the semiconductor chip (not shown) can be connected via a bonding wire.

In the semiconductor device of the present embodiment, the metal plate 10 of the above-described embodiment of the present invention can be a lead frame electrically connected to the semiconductor chip. Some lead frames have, for example, a die pad on which a semiconductor chip is arranged, leads such as inner leads and outer leads around the die pad, and an outer frame that supports the entire lead frame. The metal plate shown in FIG. 1 and the like is used. Reference numeral 10 denotes an opening 12 and no die pad. In such a case, as shown in FIG. 4, a lid material for arranging the semiconductor chip on the lower surface of the metal resin composite 20. 17 can be provided and a semiconductor chip can be arranged therein.

The method for producing the semiconductor device of the present embodiment is not particularly limited, but the metal resin composite 20 of the above-described embodiment of the present invention is used before the closed space S1 is formed as shown in FIG. A member for forming a closed space S1 after arranging a semiconductor chip at a predetermined position and electrically connecting the semiconductor chip and a lead frame (for example, a resin member 11 (second resin member in the illustrated example)). It can be manufactured by sealing with 11b, an adhesive 11c), and a lid material 17).

Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above examples, and the present invention can be appropriately modified.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples.

In the examples, a metal plate on which the resin member was arranged was produced, and the airtightness was verified.
First, the metal-resin composite used in Examples and Comparative Examples, and an evaluation method thereof will be described below.
The metal-resin composite of Example 1 is a metal-resin composite as shown in FIG. 3 produced by using a metal plate as shown in FIG. 1 and arranging a resin member in a covering region by insert molding. Specifically, a metal plate having a thickness of 0.150 mm made of copper was used, and recessed regions were provided on both sides of the metal plate. The recess forming region included 10 streaky recesses, had a width W of 0.040 mm and a pitch length P of 0.100 mm. The surface of the metal plate was roughened, and the arithmetic mean roughness was 0.5 μm. The depth D of the streaky recess is shown in Table 1. Further, although the resin members shown in Table 1 were used, in the insert molding, the resin members were arranged under the condition that the resin members were sufficiently flowed and filled in each streak recess.
The metal-resin composites of Examples 2 to 5 were produced in the same manner as in Example 1 except that the depth D was changed as shown in Table 1. Further, the metal-resin composite of Comparative Example 1 was produced in the same manner as in Example 1 except that the recess forming region (and the streaky recess) was not provided.

As the resin member used in Examples and Comparative Examples, LCP resin (manufactured by JX Liquid Crystal Co., Ltd., M-350B) was used.

The metal-resin composites of each Example and Comparative Example were subjected to a red check test to verify whether or not the red test solution permeated between the resin member arranged as shown in FIG. 3 and the metal plate. Specifically, a small amount of the test solution is applied to the peripheral edge of the opening of the metal-resin composite with the tip of a wire, left for 0.5 hours, and if it does not leak to the outside of the resin member (if it does not penetrate). ) Good. For each Example and Comparative Example, the metal resin composites used were 5 samples of the metal resin composite before heating and 5 samples of the metal resin composite after heating (260 ° C. for 2 hours). In Table 1, the number of samples n that did not leak out of the 5 samples is expressed as n / 5, the case of n = 0 is ×, the case of 1 ≦ n ≦ 4 is 〇, and the case of n = 5 is ⊚. bottom.

As can be seen from Table 1, in Examples 1 to 5 in which the recess-forming region was provided in the coating region of the metal plate, improvement in airtightness was confirmed. Further, in Examples 3 to 5 in which the depth D of the streaky recess was 0.030 mm or more, it was confirmed that the airtightness was ensured even when the metal resin composite was heated.

According to the present invention, when a closed space is formed by a member including the metal plate and the resin member, the metal plate capable of improving the airtightness between the inside of the closed space and the outside of the closed space can be improved. , Metal resin composites and semiconductor devices can be provided.

10: Metal plate 10a: Metal piece portion 10b: Connecting portion 10c: Outer peripheral portion 10d: Overhanging portion 10e: Edge of metal plate 11: Resin member 11a: Resin member (first resin member)
11b: Resin member (second resin member)
11c: Adhesive 12: Opening 13: Streaky recess 13a, 13d: Inner surface 13b: Bottom surface 13c: Side surface 14: Longitudinal end 15: (of recess forming region) Longitudinal intermediate portion 16: Longitudinal end (of streaky recess) 17: Lid material 20: Metal resin composite A1: Covering region A2: Recess forming region S1: Closed space Ds: Scanning direction D: Depth W: Width P: Pitch length L: Separation distance

Claims (14)

A metal plate having a coated area covered with a resin member on its surface.
Formed by being recessed from the surface of the metal plate so as to intersect the direction of scanning the surface of the metal plate from the inside of the closed space formed by the member including the metal plate and the resin member to the outside of the closed space. A metal plate in which a recess forming region including at least one streaked recess is present. The metal plate according to claim 1, wherein the recess forming region is formed in the covering region. The metal plate according to claim 1 or 2, wherein both ends in the longitudinal direction of the recess forming region are located at the edges of the metal plate. The metal plate has openings that penetrate both sides of the metal plate.
Any one of claims 1 to 3, wherein both ends in the longitudinal direction of the recess forming region are located on the peripheral edge of the opening, and the intermediate portion in the longitudinal direction of the recess forming region is separated from the opening. The metal plate described in the section. The method according to any one of claims 1 to 4, wherein the ratio of the depth D (mm) of the streak-shaped recess to the width W (mm) of the streak is 0.2 or more. Metal plate. The metal plate according to any one of claims 1 to 5, wherein the depth D of the streaky recess in the recess forming region is 0.010 mm or more. The metal plate according to any one of claims 1 to 6, wherein the metal plate is formed of copper or a copper alloy. The metal plate according to any one of claims 1 to 7, wherein the recess-forming region includes a linear recess in a plan view. The metal plate according to any one of claims 1 to 8, wherein the recess-forming region includes a plurality of streaky recesses. The metal plate according to any one of claims 1 to 9, wherein the surface portion of the surface of the metal plate where at least the recessed region is present has an arithmetic mean roughness of 0.5 μm or more. The metal plate according to any one of claims 1 to 10, wherein the recess forming region exists on both surfaces of the metal plate. A metal-resin composite comprising the metal plate according to any one of claims 1 to 11 and a resin member arranged so as to cover the covering region of the metal plate. The metal-resin composite according to claim 12, wherein the metal plate is a lead frame to which a semiconductor chip is electrically connected. A semiconductor device comprising the metal-resin composite according to claim 13 and a semiconductor chip electrically connected to the lead frame of the metal-resin composite.

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