JP2021174780A - Capacitor device, power unit and manufacturing method of capacitor device - Google Patents

Abstract

To provide a capacitor device having a larger capacity than the conventional one and having a good high frequency characteristic, which becomes a power unit having an excellent high frequency characteristic when used as the power unit.SOLUTION: A capacitor device 1 includes a first conductive member 110, a capacitor unit 120 composed of a plurality of chip-type capacitors 121 arranged so as to be connected in parallel, and a plate-shaped second conductive member 130 arranged on the capacitor unit 120. The second conductive member 130 includes a power supply side input electrode 133a formed at the end in the first direction in a plan view, a first output electrode 133c formed at the end in the second direction, a second output electrode 133b formed at the end in the third direction, and a third output electrode 133d formed at the end in the fourth direction.SELECTED DRAWING: Figure 1

Description

The present invention relates to a capacitor device, a power unit, and a method for manufacturing a capacitor device.

Conventionally, a capacitor device including a chip type capacitor (laminated film capacitor) in which patterned metal thin film layers and resin thin film layers are alternately laminated is known (see, for example, Patent Document 1; conventional capacitor device). ).

FIG. 17 is a diagram shown for explaining the conventional capacitor device 900. FIG. 18 is a circuit diagram shown for explaining a three-phase inverter circuit. In FIG. 18, reference numeral V indicates a DC power supply, reference numeral RF indicates an amplifier circuit, and reference numeral M indicates a motor.
The conventional capacitor device 900 is a metal thin film that serves as one electrode of a laminated body in which patterned metal thin film layers 922 and resin thin film layers 923 are alternately laminated, and a patterned metal thin film layer 922. An external electrode 924 connected to the layer and an external electrode 925 connected to the metal thin film layer to be the other electrode of the patterned metal thin film layer 922 are provided (see FIG. 17).

According to the conventional capacitor device 900, since the patterned metal thin film layer 922 and the resin thin film layer 923 are alternately laminated, a large capacity can be obtained by increasing the number of the metal thin film layer 922 and the resin thin film layer 923. Can be a capacitor device.

Japanese Unexamined Patent Publication No. 2000-294449 Japanese Patent No. 6603441

By the way, in recent years, with the progress of technology, there is a demand for a capacitor device having a large capacity, a large capacity, a high yield, and an excellent high frequency characteristic when used as a power unit.
If the capacity of the conventional capacitor device 900 is to be increased, the number of metal thin film layers and resin thin film layers will be increased, or the facing areas will be increased. However, if the number of metal thin film layers and resin thin film layers is increased to a predetermined value or more, or if the facing areas are increased, the amount of laminates produced for one capacitor device increases and the probability of defects increases. There is a circumstance that it is difficult to make a large-capacity capacitor device because the yield is likely to be low due to the tendency of variation.

Further, in the module 9 constituting the three-phase inverter circuit (see FIG. 18, for example, see Patent Document 2) that converts power between the DC power supply and the drive power supply of the motor or the like, the power supplied from the DC power supply V. In many cases, a capacitor device (see reference numeral C in FIG. 18) is connected in parallel with each drive unit DR1, DR2, DR3 in order to smooth the drive unit. However, when the conventional capacitor device 900 is connected to the three-phase inverter circuit, there is a difference in the wiring length from the capacitor device C to each drive unit DR1, DR2, DR3. In particular, the parasitic inductance in the section from the capacitor device C to the drive unit DR3, which has the longest wiring length, becomes large, and ringing noise may occur in that section, so it is difficult to make a power unit with excellent high-frequency characteristics. There is also a situation.
It is conceivable to use an electrolytic capacitor as a large-capacity capacitor, but it is difficult to structurally improve the high-frequency characteristics of the electrolytic capacitor, and it is difficult to make a power unit having excellent high-frequency characteristics.

Furthermore, there is a circumstance that the capacitor device itself is also required to have good high frequency characteristics.

Therefore, the present invention has been made in view of the above circumstances, and is a power unit having a larger capacity than the conventional one, a large capacity, a high yield, and excellent high frequency characteristics when used as a power unit. Furthermore, it is an object of the capacitor device body to provide a capacitor device having good high frequency characteristics. Another object of the present invention is to provide a power unit using such a capacitor device. Furthermore, it is an object of the present invention to provide a method for manufacturing a capacitor device for manufacturing such a capacitor device.

The capacitor device of the present invention is composed of a plate-shaped first conductive member and a plurality of chip-type capacitors arranged so as to be connected in parallel, and is conductive on one surface side of the first conductive member. A plate-shaped second conductive unit arranged via a conductive bonding material on the capacitor unit so as to cover the capacitor unit arranged via the bonding material and the capacitor unit in a plan view. The second conductive member includes a sex member, and the second conductive member is a power supply side input electrode formed at an end portion in the first direction when viewed in a plane, and a side opposite to the first direction when viewed in a plane. A first output electrode formed at the end in the second direction, a second formed at the end in the third direction intersecting the first direction and the second direction in a plan view. It is characterized by having an output electrode and a third output electrode formed at an end portion in a fourth direction opposite to the third direction.

The power unit of the present invention includes the capacitor device of the present invention and three drive units corresponding to the first output electrode, the second output electrode, and the third output electrode of the capacitor device, and is a three-phase inverter. It is characterized in that a circuit is configured.

The method for manufacturing a capacitor device of the present invention is a method for manufacturing a capacitor device for manufacturing the capacitor device of the present invention, and prepares a first lead frame in which a plurality of plate-shaped first conductive members are connected. A capacitor unit composed of one lead frame preparation step and a plurality of chip type capacitors and arranged so that the plurality of chip type capacitors are connected in parallel is placed on one surface of each of the plurality of first conductive members. A capacitor unit arranging step of arranging the capacitors via a conductive bonding material, a power supply side input electrode formed at the end in the first direction when viewed in a plane, and a second input electrode on the side opposite to the first direction. A first output electrode formed at the end of the direction, a second output electrode formed at the end of the first direction and a third direction intersecting the second direction, and the third. A second lead frame in which a plurality of plate-shaped second conductive members having a third output electrode formed at an end in a fourth direction opposite to the direction of the above is connected to the second conductive member. The second lead frame arranging step of arranging the capacitor unit on the capacitor unit so as to cover the capacitor unit, and dying the first lead frame, the capacitor unit, and the second lead frame to separate them into pieces. It is characterized by including a dicing step.

According to the method for manufacturing a capacitor device, a power unit, and a capacitor device of the present invention, a capacitor unit composed of a plurality of chip-type capacitors arranged so as to be connected in parallel is provided, so that the capacitor device has a large capacity. Further, since it is not necessary to increase the number of metal thin film layers and resin thin film layers of each chip type capacitor to a predetermined value or more and to increase the facing area, each capacitor device is selected as a non-defective product with a good yield. Since it is composed of a capacitor, it is possible to prevent the yield from being lowered. The result is a capacitor device with a large capacity and a high yield.

Further, according to the method for manufacturing a capacitor device, a power unit, and a capacitor device of the present invention, the second conductive member is a power supply side input electrode formed at an end portion in the first direction when viewed in a plane. A first output electrode formed at the end of the second direction opposite to the first direction when viewed, in a third direction which intersects the first direction and the second direction when viewed in a plane. The present invention is used in a three-phase inverter circuit because it has a second output electrode formed at an end and a third output electrode formed at an end in a fourth direction opposite to the third direction. Even when the above capacitor device is applied, the wiring length from the capacitor device to each drive can be equalized with the shortest wiring length. Therefore, the parasitic inductance in the section from the capacitor device to the drive portion (which has the longest wiring length in the conventional case) can be reduced, and ringing noise is less likely to occur in the section. As a result, a power unit having excellent high frequency characteristics can be obtained.

Further, according to the method for manufacturing a capacitor device, a power unit, and a capacitor device of the present invention, a plate-shaped first conductive member and a plate-shaped second conductive member arranged on the capacitor unit via a conductive bonding material. Since the member is provided, the joint area between the first conductive member and the electrode of the condenser unit, the joint area between the second conductive member and the electrode of the condenser unit, and the first conductive member and the ground wiring ( The joint area with the ground electrode connection pad) and the joint area between the second conductive member (power supply side input electrode, first output electrode, second output electrode and third output electrode) and the power supply wiring are respectively. growing. Therefore, the parasitic inductance of the first conductive member and the second conductive member can be reduced, and the capacitor device main body also becomes a capacitor device having good high frequency characteristics.

Further, according to the method for manufacturing a capacitor device, a power unit, and a capacitor device of the present invention, since a capacitor unit composed of a plurality of chip-type capacitors arranged so as to be connected in parallel is provided, a metal thin film layer of the chip-type capacitor is provided. And the number of resin thin film layers does not have to be more than a predetermined number. Therefore, in each chip type capacitor, variation is less likely to occur inside the laminate, and defects and the like are less likely to occur inside the laminate, so that the capacitor device is highly reliable.

It is a figure which shows for demonstrating the capacitor device 100 which concerns on Embodiment 1. It is a figure which shows for demonstrating the internal structure of the capacitor device 100 which concerns on Embodiment 1. FIG. It is a figure which shows the chip type capacitor 121 which concerns on Embodiment 1. FIG. It is a figure which shows the three-phase inverter circuit in Embodiment 1. It is a schematic diagram which shows the arrangement relationship of the capacitor device in the power unit 1 which concerns on Embodiment 1, a DC power source and each drive part. It is sectional drawing which shows the appearance which the capacitor device 100 was mounted on the substrate 60. It is a flowchart which shows the manufacturing method of the capacitor device which concerns on Embodiment 1. It is a figure which shows the 1st lead frame preparation process. It is a figure which shows the capacitor unit arrangement process. It is a figure which shows the 2nd lead frame arrangement process. It is a figure which shows the resin sealing process. It is a figure which shows the dicing process. It is a figure which shows for demonstrating the capacitor device 102 which concerns on Embodiment 2. It is a figure which shows for demonstrating the capacitor device which concerns on modification 2-5. It is sectional drawing which shows for explaining the capacitor device 104 which concerns on modification 6. It is a figure which shows for demonstrating the capacitor device 106 which concerns on modification 7. It is a figure which shows for demonstrating the conventional capacitor device 900. It is a circuit diagram shown for demonstrating a three-phase inverter circuit.

Hereinafter, a method for manufacturing a capacitor device, a power unit, and a capacitor device according to an embodiment of the present invention will be described based on the embodiment shown in the figure. It should be noted that each drawing is a schematic view and does not necessarily accurately reflect the actual dimensions. Moreover, not all of the elements and combinations thereof described in each embodiment are indispensable for the means for solving the present invention. In each embodiment, for configurations and elements (including components whose shapes and the like are not completely the same) having the same basic configuration, features, functions, etc., the same reference numerals are used across the embodiments, and the same reference numerals are used again. The explanation may be omitted.

[Embodiment 1]
1. 1. The configuration diagram 1 of the capacitor device 100 according to the first embodiment is a diagram showing the capacitor device 100 according to the first embodiment. 1 (a) is a perspective view of the capacitor device 100, FIG. 1 (b) is a cross-sectional view taken along the line AA of FIG. 1 (a), and FIG. 1 (c) is a bottom view of the capacitor device 100. FIG. 2 is a diagram shown for explaining the internal structure of the capacitor device 100 according to the first embodiment. FIG. 2A is a perspective view of the capacitor device 100 from which the resin has been removed, and FIG. 2B is an exploded view of the capacitor device 100. FIG. 3 is a diagram showing a chip type capacitor 121 according to the first embodiment.

As shown in FIGS. 1 and 2, the capacitor device 100 according to the first embodiment has a rectangular parallelepiped (including the case of a cube) shape, and has a first conductive member 110, a capacitor unit 120, and a second conductive member. It includes a sex member 130. The first conductive member 110, the capacitor unit 120, and the second conductive member 130 are sealed with the resin 140.

On the side surface of the capacitor device 100 in the first direction (−x direction), the tip surface of the convex portion 114a described later of the first conductive member 110 and the tip surface of the two power supply side input electrodes 133a described later are made of resin. It is exposed from 140.
On the side surface of the capacitor device 100 in the second direction (+ x direction), the tip surface of the convex portion 114c described later of the first conductive member 110 and the tip surface of the two first output electrodes 133c described later are made of resin. It is exposed from 140.
On the side surface of the capacitor device 100 in the third direction (+ y direction), the tip surface of the convex portion 114b described later of the first conductive member 110 and the tip surface of the two second output electrodes 133b described later are made of resin. It is exposed from 140.
On the side surface of the capacitor device 100 in the fourth direction (−y direction), the tip surface of the convex portion 114d described later and the tip surface of the two third output electrodes 133d described later are formed on the first conductive member 110. It is exposed from the resin 140.
The total cross-sectional area of the first output electrode 133c, the second output electrode 133b, and the third output electrode 133d in a predetermined cross section is larger than the cross-sectional area of the convex portion 114 of the first conductive member 110. ..
In the first embodiment, the first direction, the second direction, and the third direction (and the fourth direction) are orthogonal to each other, but they do not have to intersect at exactly right angles, and the drive described later may be used. As long as there is no problem in the arrangement of the portions, the angle formed by the first direction and the second direction and the third direction (and the fourth direction) can be an appropriate angle.

On the bottom surface of the capacitor device 100 according to the first embodiment (the other surface of the capacitor device 100), as shown in FIG. 1 (c), the first conductive member 110 (including the capacitor unit arrangement surface 112 and the convex portion 114). The entire other surface of the resin 140 is exposed from the resin 140. Also, at the bottom edge, (two) power supply side input electrodes 133a, (two) first output electrodes 133c, (two) second output electrodes 133b, and (two) third outputs. The electrode 133d is exposed from the resin 140.

The first conductive member 110 is made of a plate-shaped metal plate (for example, a copper plate). The other surface of the first conductive member 110 (both the capacitor unit arrangement surface 112 and the convex portion 114 described later) is exposed from the resin 140 and constitutes a ground electrode. As shown in FIGS. 1 (c) and 2 (b), the first conductive member 110 has a capacitor unit arrangement surface 112 and convex portions 114a, 114b, 114c, 114d (hereinafter, these four convex portions are grouped together). It also has a convex portion 114).

The capacitor unit arrangement surface 112 is arranged at the center of the first conductive member 110 and has a rectangular shape. The capacitor unit 120 is arranged on one side of the capacitor unit arrangement surface 112. The outer shape of the capacitor unit arrangement surface 112 is not limited to a rectangular shape, and may have a rectangular shape as a whole, such as having rounded corners, or may have a circular shape, a polygonal shape, or any other appropriate shape. good.

The convex portion 114 is outside (in the first direction when viewed in a plane) at a predetermined position (near the middle point of each side in the first embodiment) on each side (four sides) of the outer periphery of the rectangle of the capacitor unit arrangement surface 112. It protrudes toward the second direction, the third direction, and the fourth direction). The tip surface of the convex portion 114 is also exposed from the resin 140 on the side surface of the capacitor device 100.

The capacitor unit 120 is composed of a plurality of chip-type capacitors 121 arranged so as to be connected in parallel, and a conductive bonding material S is provided on one surface of the first conductive member 110 (capacitor unit arrangement surface 112). It is arranged through. In the capacitor unit 120, 3 × 5 chip-type capacitors 121 are arranged, and adjacent chip-type capacitors 121 are bonded to each other with an adhesive. The number of chip type capacitors 121 in the capacitor unit 120 can be an appropriate number.

As the chip type capacitor 121, an appropriate capacitor such as a laminated film capacitor or a laminated ceramic capacitor can be used, but in the first embodiment, a laminated film capacitor is used. As shown in FIG. 3, the chip type capacitor 121 is one of a laminated body in which patterned metal thin film layers 122 and resin thin film layers 123 are alternately laminated, and one of patterned metal thin film layers 122. The upper electrode 124 connected to the metal thin film layer serving as the electrode of the above, and the lower electrode 125 connected to the metal thin film layer serving as the other electrode of the patterned metal thin film layer 122 are provided. As the laminated film capacitor, for example, it is preferable to use a thin film polymer laminated capacitor using a thermosetting resin (for example, acrylic) having high heat resistance as the material of the resin thin film layer.

The upper electrode 124 of the chip type capacitor 121 is connected to the DC power supply via the power supply side input electrode 133a of the second conductive member 130, and the first output electrode 133c, the second output electrode 133b, and the third It is connected to a drive power source such as a motor via an output electrode 133d. The lower electrode 125 of the chip type capacitor 121 is connected to the ground electrode of the DC power supply and the ground electrode of the drive power supply such as a motor via the first conductive member 110.

The second conductive member 130 is a plate-shaped member arranged on the capacitor unit 120 via the conductive bonding material S so as to cover the capacitor unit 120 when viewed in a plane. The second conductive member 130 includes a flat plate portion 131, a step portion 132 (132a to 132d), a power supply side input electrode 133a, a first output electrode 133c, a second output electrode 133b, and a third output. It has an electrode 133d. The "plate-shaped member" refers to a member whose thickness (height) is thin (low) with respect to the width and depth. The "plate-shaped member" includes not only a flat plate-shaped member that is not bent, but also a member having a bent shape, a notch shape, a punched shape, a hole shape, and the like.

The flat plate portion 131 is a connection region with the capacitor unit 120 and has a substantially rectangular shape. The flat plate portion 131 has a portion on each side of the flat plate portion 131 that protrudes outward in a plan view at a position avoiding the convex portion 114 of the first conductive member 110. A power supply side input electrode 133a, a first output electrode 133c, a second output electrode 133b, and a third output electrode 133d are formed at the tip portion.

A step portion 132 is formed between the flat plate portion 131 and the power supply side input electrode 133a, the first output electrode 133c, the second output electrode 133b, and the third output electrode 133d, respectively. The bottom surfaces of the power supply side input electrode 133a, the first output electrode 133c, the second output electrode 133b, and the third output electrode 133d are flush with the other surface of the first conductive member 110. There is.

The power supply side input electrode 133a is a tip portion of two projecting portions protruding from the flat plate portion 131 in the first direction (−x direction) when viewed in a plane, and when mounted, the wiring, terminals, etc. of the board are formed. It is connected to a DC power supply via. The power supply side input electrode 133a has a flat plate shape. Since the power supply side input electrode 133a is composed of two protruding portions (that is, two portions connected in parallel), the current conduction area becomes large, and a large current can be conducted.

The first output electrode 133c is a tip portion of two protruding portions protruding from the flat plate portion 131 in the second direction (+ x direction) when viewed in a plane, and when mounted, the wiring, terminals, etc. of the substrate are formed. It is connected to the drive unit (second drive unit DR2) via. The first output electrode 133c has a flat plate shape.
The second output electrode 133b is a tip portion of two projecting portions projecting from the flat plate portion 131 in the third direction (+ y direction) when viewed in a plane, and when mounted, the wiring, terminals, etc. of the substrate are formed. It is connected to the drive unit (first drive unit DR1) via. The second output electrode 133b has a flat plate shape.
The third output electrode 133d is a tip portion of two protruding portions protruding from the flat plate portion 131 in the fourth direction (-y direction) when viewed in a plane, and when mounted, the wiring and terminals of the substrate. It is connected to the drive unit (third drive unit DR3) via the like. The third output electrode 133d has a flat plate shape.
Since the first output electrode 133c, the second output electrode 133b, and the third output electrode 133d are composed of two protruding portions (that is, two portions connected in parallel), the current conduction area is large. It becomes large and a large current can be conducted.

As the resin 140, an appropriate resin can be used.

2. The configuration diagram 4 of the power unit 1 according to the first embodiment is a circuit diagram showing a three-phase inverter circuit according to the first embodiment. FIG. 5 is a schematic view showing the arrangement relationship between the capacitor device 100, the DC power supply V, and the drive units DR1, DR2, and DR3 in the power unit 1 according to the first embodiment. FIG. 6 is a cross-sectional view showing a state in which the capacitor device 100 is mounted on the substrate 60.

The capacitor device 100 according to the first embodiment is preferably used for the following power units (power unit 1 according to the first embodiment). As shown in FIG. 4, the power unit 1 according to the first embodiment includes a capacitor device 100 according to the first embodiment, a first drive unit DR1, a second drive unit DR2, and a third drive unit DR3, and is a three-phase inverter. It constitutes a circuit. The capacitor device 100, the first drive unit DR1, the second drive unit DR2, and the third drive unit DR3 are arranged on the substrate 60 (see FIG. 5).

As the substrate 60, an appropriate substrate can be used. In the first embodiment, the substrate 60 uses a so-called laminated substrate in which the power supply wiring 62 and the ground electrode connection pad 64 are formed on the surface and the ground wiring 66 is formed inside (see FIG. 6). The ground electrode connection pad 64 is connected to the ground wiring 66 via the through hole TH.

The capacitor device 100 is arranged on the ground electrode connection pad 64, and the first conductive member 110 (that is, the capacitor unit arrangement surface 112 and the convex portions 114a to 114d) is connected to the ground electrode connection pad 64 (so-called, so-called). Betagland) (see Figure 6). The power supply side input electrode 133a and the first to third output electrodes 133c, 133b, and 133d are connected to the power supply wiring 62 of the substrate 60, respectively.

As shown in FIG. 4, the first drive unit DR1 has two switching elements SW1 and SW2 connected in series, and is connected to the U phase of the motor M.
In the first drive unit DR1, the electrode not connected to SW2 in SW1 is connected to the second output electrode 133b of the capacitor device 100 via the power supply wiring 62 on the substrate 60, and is connected to SW1 in SW2. The non-existing electrode is connected to the ground electrode (first conductive member 110) of the capacitor device 100 via the ground wiring 66 of the substrate 60.

The second drive unit DR2 has two switching elements SW3 and SW4 connected in series, and is connected to the V phase of the motor M at the connection point between the SW3 and SW4.
In the second drive unit DR2, the electrode not connected to SW4 in SW3 is connected to the first output electrode 133c of the capacitor device 100 via the power supply wiring 62 on the substrate 60, and is connected to SW3 in SW4. The non-existing electrode is connected to the ground electrode (first conductive member 110) of the capacitor device 100 via the ground wiring 66 of the substrate 60.

The third drive unit DR3 has two switching elements SW5 and SW6 connected in series, and is connected to the W phase of the motor via the W phase terminal at the connection point between the SW5 and SW6.
In the third drive unit DR3, the electrode not connected to SW5 in SW6 is connected to the third output electrode 133d of the capacitor device 100 via the power supply wiring 62 on the substrate 60, and is connected to SW6 in SW5. The non-existing electrode is connected to the ground electrode (first conductive member 110) of the capacitor device 100 via the ground wiring 66 of the substrate 60.

The power supply side input electrode 133a is connected to a DC power supply. The ground terminal of the DC power supply is connected to the ground electrode (first conductive member 110) of the capacitor device 100 via the ground wiring 66 of the substrate 60.

As shown in FIG. 5, since the capacitor device 100 according to the first embodiment has output electrodes formed in directions different from each other (directions displaced by approximately 90 degrees), the first capacitor device 100 is equidistant from the capacitor device 100. ~ The third drive unit DR1, DR2, DR3 can be arranged. As a result, the wiring length from the capacitor device 100 to the first drive unit DR1, the wiring length from the capacitor device 100 to the second drive unit DR2, and the wiring length from the capacitor device 100 to the third drive unit DR3 are the shortest. It can be arranged so that the wiring lengths are equal. As a result, the parasitic inductance from the capacitor device 100 to the first drive unit DR1, the second drive unit DR2, and the third drive unit DR3 can be minimized and equalized.

3. 3. Manufacturing Method of Capacitor Device According to Embodiment 1. FIG. 7 is a flowchart showing a manufacturing method of the capacitor device according to the first embodiment. FIG. 8 is a diagram showing a first lead frame preparation step. FIG. 8A is a plan view showing a first lead frame preparation step, and FIG. 8B is a cross-sectional view taken along the line BB of FIG. 8A. FIG. 9 is a diagram showing a capacitor unit arrangement process. 9 (a) is a plan view showing a capacitor unit arrangement process, and FIG. 9 (b) is a cross-sectional view taken along the line BB of FIG. 9 (a). FIG. 10 is a diagram showing a second lead frame arrangement process. 10 (a) is a plan view showing a second lead frame arrangement process, and FIG. 10 (b) is a cross-sectional view taken along the line BB of FIG. 10 (a). FIG. 11 is a diagram showing a resin sealing process. 11 (a) is a plan view showing a resin sealing process, and FIG. 11 (b) is a cross-sectional view taken along the line BB of FIG. 11 (a). FIG. 12 is a diagram showing a dicing process. 12 (a) is a plan view showing a dicing process, and FIG. 12 (b) is a cross-sectional view taken along the line BB of FIG. 12 (a).

As shown in FIG. 7, the method for manufacturing the capacitor device according to the first embodiment includes a first lead frame preparation step, a capacitor unit placement step, a second lead frame placement step, a reflow step, and a resin sealing step. , The dicing step is included in this order.

(1) First Lead Frame Preparation Step First, a first lead frame LF1 to which a plurality of plate-shaped first conductive members 110 are connected is prepared (see FIG. 8). In the first lead frame LF1, the adjacent first conductive member 110 is connected to each other by the convex portions 114 protruding from the capacitor unit arrangement surface 112 to form the connecting portion 114, so that the workability is improved.

(2) Capacitor Unit Arrangement Step Next, a plurality of capacitor units 120 composed of a plurality of chip-type capacitors 121 and arranged so that a plurality of chip-type capacitors 121 are connected in parallel are connected to a plurality of first lead frame LF1s. Is arranged on one surface of each of the first conductive members 110 via the conductive bonding material S (see FIG. 9). At this time, the lower electrode 125 of the capacitor unit 120 (chip type capacitor 121) and the first conductive member 110 are arranged so as to face each other. As the conductive bonding material S, an appropriate bonding material can be used, and for example, a solder paste can be used.

Prior to the capacitor unit arrangement step, a capacitor unit forming step of forming a capacitor unit 120 composed of a plurality of chip type capacitors 121 and arranged so that the plurality of chip type capacitors are connected in parallel is performed. That is, the capacitor unit 120 is formed by joining and bundling a plurality of chip type capacitors 121 with a joining material (not shown). At this time, the upper electrode 124 of each chip type capacitor 121 is on the same side, and the lower electrode 125 of each chip type capacitor 121 is also on the same side. As the joining material, for example, an adhesive can be used.

(3) Second Lead Frame Arrangement Step Next, the power supply side input electrode 133a formed at the end in the first direction in a plan view, and the end in the second direction opposite to the first direction. The first output electrode 133c formed in, the second output electrode 133b formed at the end of the third direction intersecting (orthogonal) with the first direction and the second direction, and the third direction. The second lead frame LF2 to which a plurality of plate-shaped second conductive members 130 having a third output electrode 133d formed at the end in the fourth direction opposite to the above are connected to the second conductive member. The 130 is arranged on the capacitor unit 120 so as to cover the capacitor unit 120 (see FIG. 10).
In the second lead frame LF2, between the adjacent second conductive members 130, one power supply side input electrode 133a and the other first output electrode 133c, one second output electrode 133b and the other The third output electrode 133d is connected by a connecting portion 133 formed by connecting the third output electrodes 133d. Further, in the second lead frame LF2, a stepped portion is already formed, and when the second lead frame LF2 is arranged on the capacitor unit 120, the power supply side input electrode 133a, the first output electrode 133c, and the second output The bottom surface of the electrode 133b and the third output electrode 133d is arranged on the same plane as the bottom surface (the other surface) of the first lead frame LF1. Furthermore, as the conductive bonding material S, an appropriate bonding material can be used, and for example, a solder paste can be used.

(4) Reflow Step Next, the first lead frame LF1, the capacitor unit 120, and the second lead frame LF2 are reflowed (not shown). As a result, the first conductive member 110 and the lower electrode 125 of the capacitor unit 120 are joined with a conductive bonding material (solder), and between the second conductive member 130 and the upper electrode 124 of the capacitor unit 120. Is joined with a conductive bonding material (solder).

(5) Resin sealing step Next, the first lead frame LF1, the capacitor unit 120 and the second lead frame LF2 are in a state where the other surface opposite to one surface of the first lead frame LF1 is exposed from the resin 140. It is sealed with a resin so as to be (see FIG. 11). At this time, the power supply side input electrode 133a, the first output electrode 133c, the second output electrode 133b, and the third output electrode 133d are also exposed from the resin 140.

(6) Dicing Step Next, the resin-sealed first lead frame LF1, the capacitor unit 120 and the second lead frame LF2 are diced and separated into individual pieces (see FIG. 12). At this time, since the connection portion 114 of the first lead frame LF1 and the connection portion 133 of the second lead frame LF2 are collectively diced together with the resin 140, the front surfaces of the convex portions 114a to 114d are formed on the side surfaces of the capacitor device 100. The tip surfaces of the power supply side input electrode 133a and the tip surfaces of the first to third output electrodes 133b, 133c, and 133d are exposed.

In this way, the capacitor device 100 according to the first embodiment can be manufactured.

4. Effect of the capacitor device 100, the power unit 1, and the method for manufacturing the capacitor device according to the first embodiment According to the capacitor device 100 and the power unit 1 according to the first embodiment, a plurality of chip type capacitors arranged so as to be connected in parallel. Since the capacitor unit 120 composed of 121 is provided, it becomes a large-capacity capacitor device. Further, since it is not necessary to increase the number of the metal thin film layer 122 and the resin thin film layer 123 of the chip type capacitor 121 to a predetermined value or more and to increase the facing area, each capacitor device is selected as a good product with a good yield. Since it is composed of the capacitors, there are no defects inside the laminated body, and it is possible to prevent the yield from decreasing. The result is a capacitor device with a large capacity, excellent mass productivity, and a high yield.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, the second conductive member 130 is a power supply side input electrode formed at an end portion in the first direction (−x direction) when viewed in a plane. 133a, the first output electrode 133c formed at the end of the second direction (+ x direction) opposite to the first direction when viewed in plan, the first direction and the second in plan view. The second output electrode 133b formed at the end of the third direction (+ y direction) intersecting (orthogonal) with the direction of, and the fourth direction (-y direction) opposite to the third direction. Since it has a third output electrode 133d formed at the end of the capacitor device 100, even when the capacitor device 100 of the first embodiment is applied to the three-phase inverter circuit, the wiring from the capacitor device 100 to each drive unit DR1, DR2, DR3 is provided. The length can be equalized with the shortest wiring length. Therefore, the parasitic inductance in the section from the capacitor device 100 to the drive portion (which has the longest wiring length in the conventional case) can be reduced, and ringing noise is less likely to occur in the section. As a result, a power unit having excellent high frequency characteristics can be obtained.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, the plate-shaped first conductive member 110 and the plate-shaped second conductive member 110 are arranged on the capacitor unit 120 via the conductive bonding material S. Since the conductive member 130 is provided, the joint area between the first conductive member 110 and the lower electrode 125 of the condenser unit 120, the joint area between the second conductive member 130 and the upper electrode 124 of the condenser unit 120, and further. , The joint area between the first conductive member 110 and the ground wiring 66, and the second conductive member 130 (power supply side input electrode 133a, first output electrode 133c, second output electrode 133b, and third output electrode). The joint area between 133d) and the power supply wiring 62 is increased. Therefore, the parasitic inductance of the first conductive member 110 and the second conductive member 130 can be reduced, and the capacitor device main body also becomes a capacitor device having good high frequency characteristics.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, since the capacitor unit 120 composed of a plurality of chip-type capacitors 121 arranged so as to be connected in parallel is provided, the metal thin film of the chip-type capacitor 121 is provided. It is not necessary to increase the number of layers 122 and the resin thin film layer 123 to a predetermined number or more. Therefore, since each capacitor device is composed of capacitors selected as non-defective products with good yield, there are no defects inside the laminate, and the device is highly reliable.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, since the other surface of the first conductive member 110 is exposed from the resin 140, the capacitor device 100 is connected to the ground electrode connection pad 64 of the substrate 60. It is a capacitor device that can be joined in a wide area and can conduct a large current. Further, since the wiring length from the lower electrode 125 of the capacitor unit 120 to the ground wiring 66 can be shortened, the parasitic inductance can be further reduced, and the capacitor device having even better high frequency characteristics can be obtained. Furthermore, since the wiring length from the lower electrode 125 of the capacitor unit 120 to the ground wiring 66 can be shortened, the internal resistance can be reduced.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, on the other side of the capacitor device, the power supply side input electrode 133a, the first output electrode 133c, and the second output electrode of the second conductive member 130 Since the 133b and the third output electrode 133d are exposed from the resin 140, the joint area between the power supply side input electrode 133a and each output electrode 133b, 133c, 133d and the power supply wiring 62 becomes large. Therefore, in this respect as well, the capacitor device can conduct a large current. Further, since the wiring length between the power supply side input electrode 133a and each output electrode 133b, 133c, 133d and the power supply wiring 62 can be shortened, the parasitic inductance can be further reduced, and the high frequency characteristics can be further improved. It is a good capacitor device.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, on the side surface of the capacitor device 100, the power supply side input electrode 133a, the first output electrode 133c, the second output electrode 133b, and the third output Since the electrode 133d is exposed from the resin, a conductive bonding material can be arranged on the exposed portion when the capacitor device 100 is mounted (in the case of solder, a solder fillet can be formed). (See FIG. 6). Therefore, the capacitor device 100 can be stably mounted on the circuit.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, the convex portion 114 protruding in the first direction, the second direction, the third direction, and the fourth direction when viewed in a plane is provided. Therefore, when manufacturing the capacitor device 100, it is possible to form the first lead frame LF1 in which adjacent first conductive members 110 are connected to each other, which facilitates handling.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, since the tip surface of the convex portion 114 is exposed from the resin 140 on the side surface of the capacitor device 100, when the capacitor device 100 is mounted, it is possible to mount the capacitor device 100. A conductive bonding material can also be arranged on the exposed portion of the convex portion 114 (in the case of solder, a solder fillet can be formed). Therefore, the capacitor device 100 can be mounted on the circuit more stably. Further, when the capacitor device 100 is manufactured, the resin 140 is diced together, so that the capacitors can be separated relatively easily. Furthermore, when mounted on a substrate, it can also be used as a terminal for testing.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, the other surface of the first conductive member 110 is the power supply side input electrode 133a, the first output electrode 133c, and the second of the second conductive member 130. Since the output electrode 133b and the third output electrode 133d are on the same plane as the bottom surface, the capacitor device 100 can be stably arranged at the time of mounting.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, since the chip type capacitor is a laminated film capacitor, it is safer and has lower internal resistance than an electrolytic capacitor using an electrolytic solution. Moreover, it can be a large-capacity capacitor device having good high-frequency characteristics.

Further, according to the capacitor device 100 and the power unit 1 according to the first embodiment, since the chip type capacitor 121 is a thin film polymer laminated capacitor, a thermosetting resin having high heat resistance (for example, acrylic) can be used as a material for the resin thin film layer. ) Is used to obtain a capacitor device in which the capacitance change due to a temperature change is small and the leakage current in a high temperature region is small.

According to the method for manufacturing a capacitor device according to the first embodiment, a plurality of first capacitors units 120 are composed of a plurality of chip-type capacitors 121 and are arranged so that the plurality of chip-type capacitors 121 are connected in parallel. Since the capacitor unit arranging step of arranging the capacitor unit S on one surface of the conductive member 110 via the conductive bonding material S is included, the capacity can be increased by using a plurality of chip type capacitors. Further, it is not necessary to increase the number of the metal thin film layer 122 and the resin thin film layer 123 of the chip type capacitor 121 to a predetermined number or more, or to increase the facing area. Therefore, since each capacitor device is composed of capacitors selected as non-defective products with good yield, there are no defects or the like inside the laminate, and it is possible to prevent the yield from decreasing. As a result, it is possible to manufacture a capacitor device having a large capacity and a high yield.

Further, according to the method for manufacturing a capacitor device according to the first embodiment, the power supply side input electrode 133a formed at the end in the first direction in a plan view, and the second input electrode 133a on the side opposite to the first direction. A first output electrode 133c formed at the end of the direction, a second output electrode 133b formed at the end of the third direction intersecting (orthogonal) with the first direction and the second direction, and A second lead frame LF2 to which a plurality of plate-shaped second conductive members 130 having a third output electrode 133d formed at an end in a fourth direction opposite to the third direction are connected is formed. 2 Since the second lead frame arrangement step of arranging the conductive member 130 on the capacitor unit 120 so as to cover the capacitor unit 120 is included, even when the manufactured capacitor device is applied to the three-phase inverter circuit, The wiring length from the capacitor device to each drive can be equalized with the shortest wiring length. Therefore, the parasitic inductance in the section from the capacitor device to the drive portion (which has the longest wiring length in the conventional case) can be reduced, and ringing noise is less likely to occur in the section. As a result, a power unit having excellent high frequency characteristics can be obtained.

Further, according to the method for manufacturing a capacitor device according to the first embodiment, a first lead frame preparation step for preparing a first lead frame LF1 in which a plurality of plate-shaped first conductive members 110 are connected, and a plate-shaped first lead frame preparation step. The second lead frame arrangement step of arranging the second lead frame LF2 to which a plurality of the two conductive members 130 are connected on the capacitor unit 120 so that the second conductive member 130 covers the capacitor unit 120. Therefore, the manufactured capacitor device includes, the joint area between the first conductive member 110 and the lower electrode 125 of the capacitor unit 120, and the joint area between the second conductive member 130 and the upper electrode 124 of the capacitor unit 120. Further, the joint area between the first conductive member 110 and the ground electrode connection pad 64, and the second conductive member 130 (power supply side input electrode 133a, first output electrode 133c, second output electrode 133b, and first The joint area between the output electrode 133d) of No. 3 and the power supply wiring 62 is increased. Therefore, the parasitic inductance of the first conductive member 110 and the second conductive member 130 can be reduced, and the capacitor device main body can also manufacture a capacitor device having good high frequency characteristics.

Further, according to the method for manufacturing a capacitor device according to the first embodiment, a plurality of capacitor units 120 composed of a plurality of chip type capacitors 121 and arranged so that a plurality of chip type capacitors 12 are connected in parallel are provided. Since the capacitor unit arrangement step of arranging the capacitor unit S on one surface of the first conductive member 110 via the conductive bonding material S is included, the number of the metal thin film layer 122 and the resin thin film layer 123 of each chip type capacitor 121 is increased. It does not have to be more than the specified value. Therefore, in each chip type capacitor 121, variation is less likely to occur inside the laminate, and defects and the like are less likely to occur inside the laminate, so that a highly reliable capacitor device can be manufactured.

[Embodiment 2]
FIG. 13 is a diagram shown for explaining the capacitor device 102 according to the second embodiment. 13 (a) is a perspective view of the capacitor device 102, FIG. 13 (b) is a cross-sectional view taken along the line AA of FIG. 13 (a), and FIG. 13 (c) is a bottom view of the capacitor device 102.

The capacitor device 102 according to the second embodiment basically has the same configuration as the capacitor device 100 according to the first embodiment, but the configuration of the convex portion, the power supply side input electrode, and the output electrode is the capacitor device according to the first embodiment. Different from 100. That is, in the capacitor device 102 according to the second embodiment, as shown in FIG. 13, the first conductive member 110 is located at a position deviated from the center on each side of the capacitor unit arrangement surface 112 which is rectangular when viewed in a plane. It has convex portions 115a to 115d protruding outward. Further, the power supply side input electrodes 134a and the first to third output electrodes 134b to 134d are convex of the first conductive member 110 instead of being composed of the tip portions of the two protruding portions (as in the first embodiment). Each of the portions 115a to 115d is formed from the tip portion of one wide projecting portion that protrudes outward when viewed in a plane at a position avoiding the portions 115a to 115d.

As described above, the capacitor device 102 according to the second embodiment has different configurations of the convex portion, the input electrode on the power supply side, and the output electrode from the case of the capacitor device 100 according to the first embodiment, but the capacitor device 100 according to the first embodiment. Since the capacitor unit 120 composed of a plurality of chip-type capacitors arranged so as to be connected in parallel is provided as in the case of the above case, it is possible to obtain a large-capacity capacitor device. Further, the second conductive member 130 has a power supply side input electrode 134a formed at an end portion in the first direction when viewed in a plane, and a second direction opposite to the first direction when viewed in a plane. The first output electrode 134c formed at the end of the Since it has 134b and a third output electrode 134d formed at the end in the fourth direction opposite to the third direction, a power unit having excellent high frequency characteristics can be obtained. Furthermore, since the plate-shaped first conductive member 110 and the plate-shaped second conductive member 130 arranged on the capacitor unit 120 via the conductive bonding material S are provided, the capacitor device main body also has high-frequency characteristics. It becomes a good capacitor device.

Further, according to the capacitor device 100 and the power unit 2 according to the second embodiment, the power supply side input electrode 134a, the first output electrode 134c, the second output electrode 134b, and the third output electrode 134d are one wide portion. Since it is composed of, it is a capacitor device that can not only conduct a large current but also facilitate the circuit design of wiring and ground wiring.

The capacitor device 102 according to the second embodiment has the same configuration as the capacitor device 100 according to the first embodiment except for the configuration of the convex portion, the input electrode on the power supply side, and the output electrode. Among the effects of the capacitor device 100, the corresponding effect is obtained.

Although the present invention has been described above based on the above-described embodiment, the present invention is not limited to the above-described embodiment. It can be carried out in various aspects within a range that does not deviate from the purpose, and for example, the following modifications are also possible.

The number, material, shape, position, size, etc. of the components described in the above embodiment are examples, and can be changed as long as the effects of the present invention are not impaired.

In each of the above embodiments, the capacitor device 100 is used as a smoothing capacitor for a three-phase inverter circuit, but the present invention is not limited thereto. It can also be used as a capacitor for snubber circuits, output capacitors, and other suitable applications.

In each of the above embodiments, a plurality of chip type capacitors 121 are bundled in advance and then arranged on the first conductive member 110, but the present invention is not limited thereto. The chip type capacitor 121 may be arranged on the first conductive member and then bundled, or may not be bundled with the chip type capacitor 121 arranged on the first conductive member.

In each of the above embodiments, a plurality of chip type capacitors 121 are bundled by using an adhesive, but the present invention is not limited to this. The chip type capacitors may be bundled with an insulating band, or the chip type capacitors may be bundled by an appropriate method.

In each of the above embodiments, solder is used as a conductive joining material for joining between the first conductive member and the capacitor unit and between the capacitor unit and the second conductive member. It is not limited to this. As the conductive bonding material, a conductive paste such as silver paste may be used, or high-temperature solder may be used. When high-temperature solder or the like is used, the melting temperature is different from that of solder generally used when mounting a capacitor device, so the solder does not melt due to soldering during mounting, and the capacitor device is even more reliable. It becomes.

In each of the above embodiments, the conductive bonding materials between the first conductive member and the capacitor unit and between the capacitor unit and the second conductive member are collectively reflowed and bonded. The invention is not limited to this. Separately reflow the conductive bonding material between the first conductive member and the capacitor unit and between the capacitor unit and the second conductive member (after the capacitor unit placement process is performed and the second conductive member). Each may be joined (by reflowing twice after the placement process is performed).

In each of the above embodiments, the power supply side input electrode and each output electrode are formed at the same height position as the first conductive member, but the present invention is not limited thereto. The power supply side input electrode and each output electrode may be formed at the same height position as the flat plate portion without providing the step portion, or the power supply side input electrode and each output electrode may be formed at a height position different from that of the first conductive member. It may be formed.

The capacitor device according to the first modification has the same configuration as the capacitor device 100 according to the first embodiment, except that no convex portion is formed on any of the four sides of the outer shape of the capacitor unit arrangement surface 112. It is a capacitor device that has. Further, the capacitor device according to the second modification is the same as the capacitor device 100 according to the first embodiment, except that only one of the four sides of the outer shape of the capacitor unit arrangement surface 112 has a convex portion. It is a capacitor device having a configuration. The capacitor device according to the third modification has the same configuration as the capacitor device 100 according to the first embodiment, except that convex portions are formed on two of the four sides of the outer shape of the capacitor unit arrangement surface 112. It is a capacitor device. The capacitor device according to the fourth modification has the same configuration as the capacitor device 100 according to the first embodiment, except that convex portions are formed on three of the four sides of the outer shape of the capacitor unit arrangement surface 112. It is a capacitor device that has.
FIG. 14 is a diagram showing capacitor devices according to Modifications 1 to 4. 14 (a) to 14 (d) are bottom views of the capacitor devices according to the modified examples 1 to 4, and FIG. 14 (e) is a plan view showing the first lead frame LF1'in the modified example 4. ..

In each of the above embodiments, convex portions are formed on all sides of the outer shape of the capacitor unit arrangement surface 112 of the first conductive member 110, but the present invention is not limited thereto. Of the four sides of the outer shape of the capacitor unit arrangement surface 112, no convex portion may be formed on one side (see the capacitor device according to the first modification, FIG. 14A), and only one side has a convex portion. It may be formed (condenser device according to the modified example 2, see FIG. 14B), or a convex portion may be formed on only two or three sides (the capacitor device and the modified form according to the modified example 3). The capacitor device according to Example 4, see FIGS. 14 (c) and 14 (d)). When one or more convex portions are formed, the adjacent first conductive members 110 are connected to form the first lead frame LF1'(for example, when only three sides are formed, the figure is shown in the figure. 14 (e)), the handling of the first lead frame LF1'becomes easy.

In each of the above embodiments, the power supply side input electrode and the output electrode are formed by projecting outward from each side of the flat plate portion 131 of the second conductive member 130, but the present invention is not limited thereto. No. The output electrode may be formed by projecting from one side of the flat plate portion 131 of the second conductive member 130 and branching in three directions from the side (for example, projecting from the flat plate portion 131 in the second direction and from there. , The output electrode may be formed by projecting in the second direction, the third direction and the fourth direction). In the present specification, the "end in the first direction" does not necessarily mean the end located on the most first direction side of the second conductive member. The same applies to the second direction, the third direction, and the fourth direction. Therefore, when the flat plate portion 131 is projected in the second direction and then projected in the second direction, the third direction, and the fourth direction, the protruding portions are each second conductive. Even if it is not the end located on the most second direction side, the third direction side, or the fourth direction side of the member, the "second direction end" and the "third direction end", respectively. And "ends in the fourth direction", and the output electrodes formed at each end are the first output electrode of the present invention, the second output electrode of the present invention, and the third output electrode of the present invention, respectively. It becomes an output electrode.

The capacitor device 104 according to the fifth modification has the same configuration as the capacitor device 100 according to the first embodiment, except that the tips of the power supply side input electrode and the output electrode are bent upward on the side surface of the capacitor device. It is a capacitor device.
FIG. 15 is a cross-sectional view shown for explaining the capacitor device 104 according to the modified example 5.
In each of the above embodiments, only the tip surfaces of the power supply side input electrode and the output electrode are exposed on the side surface of the capacitor device, but the present invention is not limited thereto. On the side surface of the capacitor device, the tips of the input electrode and the output electrode on the power supply side may be bent upward to increase the area exposed on the side surface (see the capacitor device 104 and FIG. 15 according to the modified example 5).

The capacitor device 106 according to the sixth modification is a capacitor device having the same configuration as the capacitor device according to the first embodiment except that it is not sealed with a resin. FIG. 16 is a diagram shown for explaining the capacitor device 106 according to the modified example 7. 16 (a) is a perspective view of the capacitor device 106, and FIG. 16 (b) is a cross-sectional view showing how the capacitor device 106 is mounted.
In each of the above embodiments, the capacitor device is resin-sealed, but the present invention is not limited thereto. The capacitor device does not have to be resin-sealed (see the capacitor device 106 according to Modification 6 and FIG. 16).

1, 9 ... Power unit (module), 100, 102, 104, 106, 900, C ... Capacitor device, 110, 110a ... First conductive member, 112 ... Capacitor unit arrangement surface, 114 ... Convex part (lead frame connection) Part), 114a, 114b, 114c, 114d, 115a, 115b, 115c, 115d ... Ground electrode (convex part), 120 ... Capacitor unit, 121 ... Chip type capacitor, 130 ... Second conductive member, 133a, 134a ... Power supply Side input electrodes 133b, 134b ... 2nd output electrodes 133c, 134c ... 1st output electrodes 133d, 134d ... 3rd output electrodes, DR1 ... 1st drive unit, DR2 ... 2nd drive unit, DR3 ... 3rd drive unit, LF1 ... 1st lead frame, LF2 ... 2nd lead frame, S ... Conductive bonding material

Claims (10)

Plate-shaped first conductive member and
A capacitor unit composed of a plurality of chip-type capacitors arranged so as to be connected in parallel, and arranged on one side of the first conductive member via a conductive bonding material, and a capacitor unit.
A plate-shaped second conductive member arranged on the capacitor unit via a conductive bonding material is provided so as to cover the capacitor unit when viewed in a plane.
The second conductive member is a power supply side input electrode formed at an end in the first direction when viewed in a plane, and an end in a second direction opposite to the first direction when viewed in a plane. A first output electrode formed on the portion, a second output electrode formed on an end portion in a third direction intersecting the first direction and the second direction when viewed in a plane, and the said A capacitor device comprising a third output electrode formed at an end in a fourth direction opposite to the third direction. The capacitor device according to claim 1, wherein the third direction is orthogonal to the first direction and the second direction. The first conductive member, the capacitor unit, and the second conductive member are resin-sealed.
The capacitor device according to claim 1 or 2, wherein the other surface of the first conductive member opposite to the one surface is exposed from the resin. The first conductive member, the capacitor unit, and the second conductive member are resin-sealed.
On the other side of the capacitor device, the power supply side input electrode, the first output electrode, the second output electrode, and the third output electrode of the second conductive member are exposed from the resin. The capacitor device according to any one of claims 1 to 3. The first conductive member, the capacitor unit, and the second conductive member are resin-sealed.
On the side surface of the capacitor device, at least one of the power supply side input electrode, the first output electrode, the second output electrode, and the third output electrode is exposed from the resin. The capacitor device according to any one of claims 1 to 4. The first conductive member has a protrusion protruding in at least one of the first direction, the second direction, the third direction, and the fourth direction when viewed in a plane. The capacitor device according to any one of claims 1 to 5, wherein the capacitor device has a part. The first conductive member, the capacitor unit, and the second conductive member are resin-sealed.
The capacitor device according to claim 6, wherein the tip surface of the convex portion on the side surface of the capacitor device is exposed from the resin. The other surface of the first conductive member includes the bottom surfaces of the power supply side input electrode, the first output electrode, the second output electrode, and the third output electrode of the second conductive member. The capacitor device according to any one of claims 1 to 7, wherein the capacitor device is coplanar. The capacitor device according to any one of claims 1 to 8 and three drive units corresponding to the first output electrode, the second output electrode, and the third output electrode of the capacitor device are provided. A power unit characterized in that a phase inverter circuit is configured. A method for manufacturing a capacitor device for manufacturing the capacitor device according to any one of claims 1 to 8.
A first lead frame preparation step for preparing a first lead frame in which a plurality of plate-shaped first conductive members are connected, and a first lead frame preparation step.
A capacitor unit composed of a plurality of chip-type capacitors and arranged so that the plurality of chip-type capacitors are connected in parallel is placed on one surface of each of the plurality of first conductive members via a conductive bonding material. And the capacitor unit placement process
The power supply side input electrode formed at the end in the first direction when viewed in a plane, the first output electrode formed at the end in the second direction opposite to the first direction, the first. A second output electrode formed at the end of the first direction and the third direction intersecting the second direction, and formed at the end of the fourth direction opposite to the third direction. A second lead frame in which a plurality of plate-shaped second conductive members having a third output electrode are connected is mounted on the capacitor unit so that the second conductive member covers the capacitor unit. The second lead frame placement process to be placed in
A method for manufacturing a capacitor device, which comprises a dicing step of dicing the first lead frame, the capacitor unit, and the second lead frame into individual pieces.

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