JP2021172009A - Woody base material and decorative material using the same - Google Patents

Abstract

To provide a woody base material having superior mechanical strength and water resistance, and a decorative material using the woody base material.SOLUTION: A woody base material 20 is made by heating and pressurizing a raw material mixture 10 containing a powdery or chip-like woody material 11 and a powdery thermoplastic resin composition 12. The thermoplastic resin composition 12 contains a thermoplastic resin and 0.1-3 pts.mass of an organic peroxide based on 100 pts.mass of the thermoplastic resin, and the raw material mixture 10 contains 0.1-8 pts.mass of alkoxysilane compound based on the 100 pts.mass of the sum total of the woody material 11 and the thermoplastic resin composition 12. Further, the alkoxysilane compound may contain at least one of a vinyl group and a meth(acrylic) group, and the alkoxysilane compound may further contain at least one of an amino group, an epoxy group and a mercapto group, and the thermoplastic resin composition 12 may contain an unsaturated dicarboxylic acid.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wood base material having excellent mechanical strength and water resistance and a decorative material using the same.

The wood base material is a base material obtained by heat-press molding a mixture of wood materials such as wood flour, wood chips, and wood fibers with an adhesive. Depending on the type of wood material, particle board or medium density fiber It is called a board and is used in a wide range of applications such as base materials for floors and walls, fittings and furniture.
As the adhesive for the wood base material, a urea resin adhesive, a melamine resin adhesive, and a phenol resin adhesive are usually used together with a curing agent containing formaldehyde. Since formaldehyde is a harmful substance that causes sick building syndrome, emission from wood substrates has become a problem, and various measures to reduce the amount of emission have been studied, but it cannot be completely suppressed.

On the other hand, conventionally, as an adhesive containing no formaldehyde, an adhesive containing powdered saccharides and powdered polycarboxylic acids as main components is used, and this is mixed with plant fibers and heat-pressed to form the fibers. A method for manufacturing a board has been proposed (see paragraph [0017] of Patent Document 1).
Further, conventionally, a method for producing a laminate containing a wood base material using an adhesive composed of polyvinyl alcohol and water has been proposed (see paragraph [0017] of Patent Document 2 and FIG. 1).

Japanese Unexamined Patent Publication No. 2016-55620 Japanese Patent No. 5553279

However, the above-mentioned wood base material using the conventional adhesive has not been practically sufficient in mechanical properties such as bending strength and water resistance.
Therefore, one aspect of the present invention is to provide a wood base material having excellent mechanical strength and water resistance and a decorative material using the same.
That is, as a result of diligent studies to solve the above problems, one aspect of the present invention is used as a thermoplastic resin composition in a wood base material formed by heating and pressurizing a powder mixture of a wood material and a thermoplastic resin composition. We have found that the above problems can be solved by containing an organic peroxide and further containing an alkoxysilane compound in the powder mixture, and have reached the present invention.

The wood-based material according to one aspect of the present invention is a wood-based material formed by heating and pressurizing a raw material mixture containing a powder-like or chip-like wood-based material and a powder-like thermoplastic resin composition. The thermoplastic resin composition contains a thermoplastic resin and 0.1 to 3 parts by mass of an organic peroxide with respect to 100 parts by mass of the thermoplastic resin, and the raw material mixture is the above-mentioned raw material mixture. The total of the wood-based material and the thermoplastic resin composition is 100 parts by mass, and 0.1 to 8 parts by mass of the alkoxysilane compound is contained with respect to the 100 parts by mass.
Further, the wood base material according to one aspect of the present invention is characterized in that the alkoxysilane compound contains at least one of a vinyl group and a meta (acrylic) group.

Further, the wood base material according to one aspect of the present invention is characterized in that the alkoxysilane compound further contains at least one of an amino group, an epoxy group and a mercapto group.
The wood base material according to one aspect of the present invention is characterized in that the thermoplastic resin composition contains an unsaturated dicarboxylic acid.
The wood base material according to one aspect of the present invention is characterized in that the thermoplastic resin composition contains an acidic group-containing resin having at least one of a carboxy group and a structure in which carboxy groups are dehydrated and condensed. ..

In the wood base material according to one aspect of the present invention, the mass ratio (wood material / thermoplastic resin composition) of the wood material to the thermoplastic resin composition in the raw material mixture is 95/5 to 70/30. It is characterized by being.
The wood-based material according to one aspect of the present invention is characterized in that the wood-based material contains a bacterial bed as a raw material.

The decorative material according to one aspect of the present invention is a wood-based base material formed by heating and pressurizing a raw material mixture containing a powder-like or chip-like wood-based material and a powder-like thermoplastic resin composition. The thermoplastic resin composition contains a thermoplastic resin and 0.1 to 3 parts by mass of an organic peroxide with respect to 100 parts by mass of the thermoplastic resin, and the raw material mixture is the wood-based material. The total of the material and the thermoplastic resin composition is 100 parts by mass, and the design base material is laminated on the wood base material containing 0.1 to 8 parts by mass of the alkoxysilane compound with respect to 100 parts by mass. It is characterized by being made of plastic.

According to one aspect of the present invention, it is possible to provide a wood base material having practical mechanical strength and water resistance and a decorative material using the wood base material.

It is a schematic diagram of the raw material mixture of the wood base material which concerns on 1st Embodiment of this invention. It is sectional drawing of the decorative material which concerns on 2nd Embodiment of this invention.

(First Embodiment shown in FIG. 1)
In FIG. 1, reference numeral 20 denotes a wood base material according to the first embodiment of the present invention, which is referred to as a particle board, a medium density fiberboard, or the like depending on the type of the wood material 11, and is used as a base material for floors and walls, fittings, and the like. It is used in a wide range of applications such as furniture.
As shown in FIG. 1, the wood-based base material 20 is formed by heating and pressurizing a raw material mixture 10 containing a powder-like or chip-like wood-based material 11 and a powder-like thermoplastic resin composition 12.
The thermoplastic resin composition 12 contains a thermoplastic resin and an organic peroxide.

The raw material mixture 10 contains an alkoxysilane compound.
That is, the form of the raw material mixture 10 includes at least one of the following forms.
(1) Mixture of wood-based material 11, thermoplastic resin composition 12 and alkoxysilane compound (2) Mixture of wood-based material 11 and thermoplastic resin composition 12 containing an alkoxysilane compound

(Wood-based material 11)
Examples of the wood material 11 include wood flour, wood fiber, and crushed wood into chips, and thinned wood, oga flour, waste wood, and the like can be used as raw materials. In addition to wood, bamboo, hemp, coconut fiber, walnut shells, and other materials containing a cellulose component similar to wood can be candidates.
As a raw material for the wood-based material 11, a used fungal bed generated in large quantities during mushroom cultivation can be preferably used. The fungus bed is a mixture of wood chips and oga flour with nutrients such as wheat bran and rice bran. It is estimated that about 300,000 tons of fungal beds after mushroom cultivation are discarded annually in Japan, and it is promising as biomass, but the current situation is that recycling is not progressing, and using this as a wood raw material has an environmental burden. It is beneficial in reducing the amount of water.

(Thermoplastic resin)
The thermoplastic resin contained in the thermoplastic resin composition 12 can be used in various ways such as polyethylene, polyamide, polyolefin, ethylene / propylene / diene rubber, ethylene vinyl acetate, and silicone rubber. Polyethylene is preferable in that respect.
The polyethylene resin is not particularly limited, and consideration is given to reactivity and fluidity during heating and pressurization from existing materials such as high-density polyethylene, low-density polyethylene, ultra-low-density polyethylene, and linear low-density polyethylene. It is used by selecting it as appropriate.

(Organic peroxide)
The organic peroxide contained in the thermoplastic resin composition 12 is used for radically cross-linking the thermoplastic resin in heating and pressurizing the raw material mixture, for example, peroxyketal, dialkyl peroxide, diacyl peroxide, peroxy. It can be appropriately selected and used from existing materials such as esters in consideration of reactivity and stability.
The amount of the organic peroxide added is 0.1 to 3 parts by mass with respect to 100 parts by mass of the thermoplastic resin.
If the amount added is less than 0.1 parts by mass, the reactivity of the raw material mixture at the time of heating and pressurizing is insufficient, so that sufficient strength cannot be obtained for the wood substrate. Further, if the amount added exceeds 3 parts by mass, the amount of decomposition products during the reaction increases, which may cause deformation of the wood base material, which is not preferable.

(Thermoplastic resin composition 12)
In the thermoplastic resin composition 12, by blending a radically polymerizable material, it may be possible to chemically bond the material to the thermoplastic resin at the time of forming the base material, for example, an unsaturated dicarboxylic acid such as maleic acid. By combining the above, the mechanical strength of the wood base material 1 can be further improved.

Further, the thermoplastic resin composition 12 can further improve the mechanical strength of the wood substrate 1 by blending a carboxy group or an acidic group-containing resin having at least one structure in which carboxy groups are dehydrated and condensed. can.
As the acidic group-containing resin, for example, maleic anhydride-modified polyolefin such as maleic anhydride-modified polyethylene or polyprolene maleic anhydride, ethylene (meth) acrylic acid copolymer, or the like can be used.

(Unsaturated dicarboxylic acid)
The unsaturated dicarboxylic acid is used to improve the adhesiveness between the wood material 11 and the thermoplastic resin, and preferably contains at least one of fumaric acid, maleic acid and maleic anhydride.
The amount of unsaturated dicarboxylic acid added is 0.01 to 3 parts by mass with respect to 100 parts by mass of the thermoplastic resin. If the amount added is less than 0.01 parts by mass, the adhesiveness between the wood material 11 and the thermoplastic resin is insufficient, so that sufficient strength cannot be obtained for the wood base material 1. On the other hand, if the amount added exceeds 3 parts by mass, unreacted unsaturated dicarboxylic acid tends to remain on the wood substrate, which may cause a decrease in odor and water resistance, which is not preferable.
The thermoplastic resin composition 12 containing an organic peroxide and an unsaturated dicarboxylic acid can be produced by various known methods, for example, heat using a uniaxial kneader or a batch kneader. After heat-kneading the organic peroxide and the unsaturated dicarboxylic acid together with the plastic resin, it can be pulverized by a method such as mechanical pulverization or freeze pulverization.

(Acid group-containing resin)
As the acidic group-containing resin, a resin containing at least one of carboxylic acid or carboxylic acid anhydride is used in order to improve the adhesiveness between the wood material 11 and the thermoplastic resin. As specific examples, maleic anhydride-modified polyolefins such as maleic anhydride-modified polyethylene and polyprolene maleic anhydride, and ethylene (meth) acrylic acid copolymers can be used.
The amount of the acidic group-containing resin added is 1 to 50 parts by mass with respect to 100 parts by mass of the thermoplastic resin. If the amount added is less than 1 part by mass, the adhesiveness between the wood material 11 and the thermoplastic resin is insufficient, so that sufficient strength cannot be obtained for the wood base material 1. Further, if the addition amount exceeds 50 parts by mass, the strength often decreases, which is not preferable.
The thermoplastic resin composition 12 containing the organic peroxide and the acidic group-containing resin can be produced by various known methods, for example, heat using a uniaxial kneader or a batch type kneader. After heat-kneading the organic peroxide and the acid-containing resin together with the plastic resin, it can be pulverized by a method such as mechanical pulverization or freeze pulverization.

(Alkoxysilane compound)
The alkoxysilane compound is used to improve the mechanical strength of the wood substrate 1, for example, methyltrimethoxysilane, tetramethoxysilane, methyltriethoxysilane, tetraethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-Epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane , 3-Methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltri Methoxysilane, 3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine , 3-Mercaptopropylmethyldimethoxysilane, 3-Mercaptopropyltrimethoxysilane, 3-Ixionpropyltriethoxysilane, 3-trimethoxysilylpropylsuccinate anhydride, etc., can be appropriately selected and used from various known materials. ..
In the above example, vinyltrimethoxysilane and vinyltriethoxysilane are examples of the "vinyl group" -containing processed product.
In the above example, the processed product containing "(meth) acrylic group" corresponds to 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-acryloxypropyltrimethoxysilane.

The alkoxysilane compound includes a state in which at least a part of the alkoxy group is hydrolyzed or a state in which the alkoxysilane compound is partially condensed. For example, known materials such as an alkoxysilane hydrolyzate and a condensate called an oligomer or a resin can be used, but the raw material mixture 10 may be hydrolyzed before being blended.

The alkoxysilane compound is preferably a compound having a vinyl group or a (meth) acrylic group from the viewpoint of the mechanical strength of the wood base material, and further, the alkoxysilane compound containing an amino group, an epoxy group and a mercapto group together with the compound. It is preferable to use at least one in combination. As the compound containing a vinyl group, a (meth) acrylic group, an amino group, an epoxy group, and a mercapto group, for example, the above-mentioned various known materials can be used.

(Amount of Alkoxysilane Compound Blended)
The blending amount of the alkoxysilane compound is 0.1 to 8 parts by mass with respect to 100 parts by mass of the raw material mixture 10. If the amount added is less than 0.1 parts by mass, sufficient strength cannot be obtained for the wood substrate 1. Further, if the addition amount exceeds 8 parts by mass, the strength and water resistance of the wood base material often decrease, which is not preferable.

(Mass ratio of wood material 11 and thermoplastic resin composition 12)
The mass ratio of the wood material 11 to the thermoplastic resin composition 12 is in the range of 95/5 to 70/30 for the wood material / thermoplastic resin composition. If the content of the wood-based material is larger than this range, it is not possible to impart sufficient bending strength to the wood-based material 1. On the other hand, if the content of the wood material is smaller than this range, the wood base material is likely to be deformed during heating and pressurization, which is not preferable.

(Method for Producing Thermoplastic Resin Composition 12)
The thermoplastic resin composition 12 can be produced by various known methods. For example, a uniaxial kneader or a batch type kneader can be used to combine the thermoplastic resin with an organic peroxide (if necessary). ) After heat-kneading with the alkoxysilane compound, it can be pulverized by a method such as mechanical pulverization or freeze pulverization.

(Method of heating and pressurizing the raw material mixture 10)
Various known methods can be used for heating and pressurizing the raw material mixture 10, but press molding using a frame mold is preferable. The heating temperature is usually 120 ° C. to 250 ° C., which is required to be equal to or higher than the melting point of the thermoplastic resin, but if it exceeds 250 ° C., thermal deterioration of the wood-based material 11 may occur remarkably. Applied pressure is usually a ^{10kgf / cm 2 ~400kgf / cm 2} , using the appropriate set value due density of the desired wood substrate.
The density and shape of the wood substrate 1 obtained above are appropriately determined depending on the intended use, but the density is preferably ^{0.5 to 1.2 g / cm 3} , particularly preferably 0.6 to 1.1 g / cm ^2. ..

(Second embodiment shown in FIG. 2)
The second embodiment will be described with reference to FIG.
A feature of the second embodiment is that the decorative material 30 is obtained by laminating a design base material 31 having a design property on the wood base material 20 according to the first embodiment described above with reference to FIG. ..
According to the second embodiment, the design property can be imparted by laminating the design base material 31 on the wood base material 20.
That is, the wood base material 20 can be put into practical use as a decorative material by itself, but in order to impart designability, as shown in FIG. 2, a design such as a paper or a film to which a design such as a pattern is given is given. The sex base material 31 is laminated on the wood base material 20 to form a decorative material 30.

Hereinafter, Examples 1 to 8 and Comparative Examples 1 to 4 of the wood base material according to the first embodiment of the present invention will be described. The present invention is not limited to the following Examples 1 to 8.

(Example 1)
In Example 1, 100 parts by mass of a low-density polyethylene resin (hereinafter, also referred to as “LDPE”) and an organic peroxide (trade name: Perhexa C, manufactured by NOF CORPORATION, hereinafter also referred to as “PO”) 1. A powdery thermoplastic resin composition was obtained by heating and kneading 5 parts by mass with a batch kneading device and then mechanically pulverizing the mixture.
The wood-based material is a material in which the fungus bed after harvesting mushrooms is washed and then dried.
Examples of the alkoxysilane compound include a methacryloxy group-containing silane (3-methacryloxypropyltrimethoxysilane, trade name KBM503, manufactured by Shin-Etsu Chemical Co., Ltd., hereinafter also referred to as "KBM503"), and an amino group-containing silane (3-aminopropyl). Trimethoxysilane, trade name KBM903, Shin-Etsu Chemical Co., Ltd., hereinafter also referred to as "KBM903") is used.
The wood material / thermoplastic resin composition / KBM503 / KBM903 was mixed at a mass ratio of 85/15/1/1 to obtain a raw material mixture of a wood base material.
The composition of the raw material mixture is as shown in Table 1 below.

This raw material mixture was introduced into an aluminum mold and heated and pressed with a hot pressing device to obtain a wood base material (pressing conditions: 100 kgf / cm ² , 200 ° C. for 10 minutes, base material thickness: 10 mm, base). Material density: 0.7 g / cm ³ ).

(Example 2)
In Example 2, the amino group-containing silane of Example 1 is replaced with an epoxy group-containing silane (3-glycidoxypropyltrimethoxysilane, trade name KBM403, Shin-Etsu Chemical Co., Ltd., hereinafter also referred to as "KBM403"). A wood substrate was obtained by the same method as in Example 1 except for the replacement.

(Example 3)
In Example 3, the amino group-containing silane of Example 1 was replaced with a mercapto group-containing silane (3-mercaptopropyltrimethoxysilane, trade name KBM803, Shin-Etsu Chemical Co., Ltd., hereinafter also referred to as "KBM803"). A wood base material was obtained in the same manner as in Example 1 except for the above.

(Example 4)
In Example 4, 1 part by mass of maleic anhydride powder (trade name: CRYSTAL MAN, manufactured by NOF CORPORATION, hereinafter also referred to as “MA”) was added to the components of the thermoplastic resin composition of Example 1. A wood substrate was obtained in the same manner as in Example 1 except for the above.

(Example 5)
In Example 5, the amino group-containing silane (KBM903) of Example 1 was not used, and the mass ratio of wood-based material / thermoplastic resin composition / KBM503 was 85/15/2, otherwise the same as in Example 1. A wood-based substrate was obtained by the above method.

(Example 6)
In Example 6, a tetraethoxysilane oligomer was used as the alkoxysilane compound of Example 1, and the mass ratio was wood material / the thermoplastic resin composition / alkoxysilane compound = 85/15/5. Other than that, Example 1 A wood-based substrate was obtained in the same manner as in the above.

(Example 7)
In Example 7, the amino group-containing silane (KBM903) of Example 1 was not used, the wood material / thermoplastic resin composition / KBM503 was set to a mass ratio of 85/15 / 0.1, and the mass ratio of the other parts was set to 85/15 / 0.1. A wood-based substrate was obtained in the same manner as in the above.

(Example 8)
In Example 8, the amino group-containing silane (KBM903) of Example 1 was not used, and the wood material / thermoplastic resin composition / KBM503 had a mass ratio of 85/15/8, otherwise the same as in Example 1. A wood-based substrate was obtained by the above method.

(Comparative Example 1)
In Comparative Example 1, the alkoxysilane compound of Example 1 was not used, and a wood base material was obtained by the same method as in Example 1 except that the alkoxysilane compound of Example 1 was not used.

(Comparative Example 2)
In Comparative Example 2, the organic peroxide of Example 1 was not used, and a wood base material was obtained by the same method as in Example 1 except that the organic peroxide was not used.

(Comparative Example 3)
In Comparative Example 3, the wood material / thermoplastic resin composition / KBM503 / KBM903 of Example 1 was changed to a mass ratio of 85/15/5/5, and other than that, the wood group was formed in the same manner as in Example 1. I got the wood.

(Comparative Example 4)
In Comparative Example 4, the blending amount of the organic peroxide of Example 1 was changed to 5 parts by mass, and a wood base material was obtained by the same method as in Example 1 except that.

(Evaluation of wood base material)
The physical properties of the wood base material were evaluated based on the following three points: (1) mechanical strength, (2) water resistance, and (3) deformation of the base material.

(Mechanical strength)
For the mechanical strength, the bending strength was measured by a method conforming to JIS A5908. The evaluation criteria for mechanical strength with respect to the measured value (unit: N / mm ² ) are as follows based on the JIS standard value.
The evaluation criteria for mechanical strength are as follows: "◎", "○", "△", "×", "◎", "○" and "△" are passed, and "×" is It was rejected.
Note (1) ◎: 18 or more (passed)
(2) ○: 13 or more (passed)
(3) △: 8 or more and less than 13 (pass)
(4) ×: Less than 8 (failed)

(water resistant)
For water resistance, the water absorption thickness and swelling rate were measured by a method according to JIS A5908.
The evaluation criteria for water resistance with respect to the measured value (unit:%) are as follows based on the JIS standard value.
The evaluation criteria for water resistance were as follows, with three grades of "○", "△", and "×", "○" and "△" were accepted, and "×" was rejected.
Note (1) ○: Less than 8 (passed)
(2) △: 8 or more and less than 12 (pass)
(3) ×: 12 or more (failed)

(Base material deformation)
The base material deformation is a state in which the surface of the base material is partially swollen, and is mainly generated by the retention of gas generated inside the base material during pressing.
Since the deformation of the base material is clearly reflected by the state of the edge of the base material, the appearance of the end of the base material was visually evaluated. The evaluation criteria were as follows.
The evaluation criteria for the deformation of the base material were as follows, with three grades of "○", "△", and "×", "○" and "△" were accepted, and "×" was rejected.
Note (1) ○: No void (passed)
(2) △: There is a gap of about trace (pass)
(3) ×: There is a gap (failed)

(Evaluation results)
The evaluation results of the wood base material are shown in Table 2 below.

All of the three physical property evaluations were "passed" in 8 cases of Examples 1 to 8, and the remaining 4 cases of Comparative Examples 1 to 4 included one or more failures.

(Evaluation result of mechanical strength)
The mechanical strength was unacceptable in 3 cases of Comparative Examples 1 to 3.
In Comparative Example 1, it can be inferred that the cause is that the alkoxysilane compound is not used. In Comparative Example 2, it can be inferred that the cause is that no organic peroxide is used. In Comparative Example 3, it can be inferred that the cause was that the total amount of the alkoxysilane compound added to KBM503 and KBM903 was too large.

(Evaluation result of water resistance)
The case in which the water resistance was unacceptable was one of Comparative Example 3.
In Comparative Example 3, it can be inferred that the cause was that the total amount of the alkoxysilane compound added to KBM503 and KBM903 was too large.

(Evaluation result of substrate deformation)
There were two cases in which the base material deformation was unacceptable, Comparative Example 3 and Comparative Example 4.
In Comparative Example 3, it can be inferred that the cause was that the total amount of the alkoxysilane compound added to KBM503 and KBM903 was too large. In Comparative Example 4, it can be inferred that the cause was that the amount of perhexa C (PO) added, which is an organic peroxide, was too large.

(Comprehensive evaluation result)
As a comprehensive evaluation result, in Examples 1 to 8, all of the three physical property evaluations were "passed", and as is clear from Table 2, the wood substrate of the present invention has excellent mechanical strength and water resistance. It was shown that it has the property and there is no problem in the deformation of the base material.
Comparing Examples 1 to 8, in Example 4, the evaluation result of the mechanical strength was “⊚”. In Example 4, it can be inferred that the cause was the addition of 1 part by mass of maleic anhydride powder (MA).
Further, the evaluation result of the mechanical strength was "Δ" in 4 cases of Examples 5 to 8 among Examples 1 to 8. In Examples 5 to 8, it can be inferred that the cause was that the amino group-containing silane (KBM903) or the like was not used.
The evaluation result of water resistance was "Δ" in two cases, Example 6 and Example 8. In Example 6, it can be inferred that the cause was the use of a tetraethoxysilane oligomer as the alkoxysilane compound. Further, in Example 6, it can be inferred that the cause was an increase in the ratio of the alkoxysilane compound.
The evaluation result of the substrate deformation was "Δ" in one case of Example 6. In Example 6, it can be inferred that the cause was the use of a tetraethoxysilane oligomer as the alkoxysilane compound.

10 Raw material mixture 11 Wood material 12 Thermoplastic resin composition 20 Wood base material 30 Decorative material 31 Design base material

Claims (8)

A wood base material formed by heating and pressurizing a raw material mixture containing a powdery or chip-shaped wood material and a powdery thermoplastic resin composition.
The thermoplastic resin composition contains a thermoplastic resin and 0.1 to 3 parts by mass of an organic peroxide with respect to 100 parts by mass of the thermoplastic resin.
The wood-based mixture is characterized by containing 0.1 to 8 parts by mass of an alkoxysilane compound with respect to 100 parts by mass of the total of the wood-based material and the thermoplastic resin composition. Base material. The wood base material according to claim 1, wherein the alkoxysilane compound contains at least one of a vinyl group and a meta (acrylic) group. The wood base material according to claim 2, wherein the alkoxysilane compound further contains at least one of an amino group, an epoxy group, and a mercapto group. The wood base material according to any one of claims 1 to 3, wherein the thermoplastic resin composition contains an unsaturated dicarboxylic acid. The invention according to any one of claims 1 to 4, wherein the thermoplastic resin composition contains an acidic group-containing resin having at least one of a carboxy group and a structure in which the carboxy groups are dehydrated and condensed. Wood base material. Claims 1 to 5 characterized in that the mass ratio (wood material / thermoplastic resin composition) of the wood material and the thermoplastic resin composition in the raw material mixture is 95/5 to 70/30. The wood-based material according to any one of the above items. The wood-based material according to any one of claims 1 to 6, wherein the wood-based material contains a fungal bed as a raw material. A wood base material formed by heating and pressurizing a raw material mixture containing a powdery or chip-shaped wood material and a powdery thermoplastic resin composition.
The thermoplastic resin composition contains a thermoplastic resin and 0.1 to 3 parts by mass of an organic peroxide with respect to 100 parts by mass of the thermoplastic resin.
The raw material mixture is used on the wood base material containing 0.1 to 8 parts by mass of an alkoxysilane compound with respect to 100 parts by mass of the total of the wood material and the thermoplastic resin composition. A decorative material characterized by being laminated with a design base material.

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