JP2021168366A - Jig table and division method - Google Patents

Abstract

To make it possible to suppress movement of a package board during cutting processing.SOLUTION: A jig table 10 is detachably attached to a table base 40 of a cutting apparatus 1 to hold a package board having division schedule lines. The jig table 10 includes: a plurality of blade clearance grooves 14 formed on the side of a mounting surface 13 on which the package board is to be mounted, the blade clearance grooves corresponding to the division schedule lines of the package board; and a plurality of chip holding regions 15 segmented by the blade clearance grooves 14. Each of the chip holding regions 15 comprises a frame body 16 composed of a flexible member and an adhesive member 12 that is filled in the frame body 16 and has stickiness. On a bottom surface 152 that is defined by the frame body 16 and is slightly lower than a top surface 161 of the frame body 16, a suction port 153 connected to a suction source via an on-off valve is formed. On the adhesive member 12, a suction hole 122 having one end opening on the side of the mounting surface 13 and the other end communicating with the suction port 153 is formed.SELECTED DRAWING: Figure 4

Description

The present invention relates to a jig table for holding a package substrate and a method for dividing the package substrate.

Package substrates such as CSP (Chip Size Package) substrates and QFN (Quad Flat Non-leaded Package) substrates are directly held on a jig-type jig table that reciprocates in a predetermined direction, and are held on the jig table. It is divided into individual chips by a cutting device provided with a disk-shaped cutting blade for cutting the above (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2019-145558

However, with the recent miniaturization of electronic devices, the package size has also been reduced, and in the conventionally used cutting apparatus shown in Patent Document 1 and the like, there is a risk that the package substrate will move during cutting with a cutting blade. be. If the package substrate moves during the cutting process, problems such as the cut out package not falling within the allowable range of predetermined dimensions, package skipping, and damage to the cutting blade may occur.

The present invention has been made in view of such problems, and an object of the present invention is to provide a jig table and a dividing method capable of suppressing the movement of a package substrate during cutting.

In order to solve the above-mentioned problems and achieve the object, the jig table of the present invention is detachably attached to the table base of the cutting device and holds a package substrate having a plurality of intersecting planned division lines. In the jig table, on the mounting surface side on which the package substrate is mounted, a plurality of blade relief grooves corresponding to the planned division lines of the package substrate are formed, and a plurality of chips partitioned by the blade relief grooves are formed. Each of the chip holding regions includes a holding region, and each of the chip holding regions includes a frame made of a flexible member and an adhesive member having a tack property filled in the frame, and the frame defined by the frame. A suction port connected to the suction source via an on-off valve is formed on the support surface slightly lower than the upper surface of the body, and one end of the adhesive member is opened to the mounting surface side and the other end is. It is characterized in that a suction hole communicating with the suction port is formed.

In the jig table, the upper surface of the frame may protrude from the upper surface of the adhesive member.

The division method of the present invention is a division method for dividing a package substrate having a plurality of intersecting planned division lines into individual packages, and the division plan side is on the mounting surface side on which the package substrate is mounted. A plurality of corresponding blade relief grooves are formed, and a plurality of chip holding regions defined by the blade relief grooves are included, and each of the chip holding regions is filled with a frame body made of a flexible member and the frame body. A suction port connected to a suction source via an on-off valve is provided on a support surface slightly lower than the upper surface of the frame, which is provided with an adhesive member having a tack property and is defined by the frame. A preparatory step for mounting a jig table on the table base of a cutting device, the adhesive member having a suction hole having one end open to the mounting surface side and the other end communicating with the suction port. After performing the preparation step, a mounting step of mounting the package substrate on the frame body and a mounting step of mounting the package substrate on the frame body, and after performing the mounting step, the package substrate is sucked from the suction hole to package with the adhesive member. A holding step for holding the substrate, and after performing the holding step, the package substrate is cut along the planned division line while cutting the cutting blade into the package substrate to a depth reaching the blade relief groove, and individual pieces are cut. It is characterized by having a cutting step that divides it into packages.

The present invention has the effect of suppressing the movement of the package substrate during cutting.

FIG. 1 is a perspective view showing a configuration example of a cutting device including a jig table according to the first embodiment. FIG. 2 is a plan view of the jig table according to the first embodiment installed on the table base of the cutting device. FIG. 3 is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is an enlarged cross-sectional view showing the IV portion in FIG. FIG. 5 is a flowchart showing the flow of the division method according to the first embodiment. FIG. 6 is a cross-sectional view showing a preparatory step for the division method shown in FIG. FIG. 7 is a cross-sectional view showing a mounting step of the division method shown in FIG. FIG. 8 is an enlarged cross-sectional view showing the VIII portion in FIG. 7. FIG. 9 is a cross-sectional view showing a holding step of the dividing method shown in FIG. FIG. 10 is a cross-sectional view showing an enlarged portion X in FIG. FIG. 11 is a cross-sectional view showing a cutting step of the dividing method shown in FIG. FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG. FIG. 13 is a cross-sectional view of a main part of the jig table according to the modified example of the first embodiment.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The jig table according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a cutting device including a jig table according to the first embodiment. FIG. 2 is a plan view of the jig table according to the first embodiment installed on the table base of the cutting device. FIG. 3 is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is an enlarged cross-sectional view showing the IV portion in FIG.

(Workpiece)
The jig table 10 according to the first embodiment is detachably attached to the table base 40 of the cutting device 1 shown in FIG. The cutting device 1 is a device that cuts the package substrate 200. In the first embodiment, the package substrate 200 includes a substrate 201 (shown in FIG. 7 and the like), a plurality of device chips mounted on the substrate 201, and a mold resin 202 (shown in FIG. 7 and the like) coated on the device chips. Be prepared.

The package substrate 200 is formed in a flat plate shape having a rectangular planar shape. The package substrate 200 has a plurality of grid-shaped planned division lines 203 intersecting each other on the surface of the substrate 201, and the device chip is mounted in the region partitioned by the planned division lines 203 of the substrate 201. The device chip is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration).

In the first embodiment, in the package substrate 200, the device chip mounted on the substrate 201 is coated with the mold resin 202, and the package substrate 200 is divided into individual packages 204 along the planned division line 203 by cutting, so-called QFN (Quad Flat). Non-leaded Package) substrate. In the first embodiment, the package substrate 200 is a QFN substrate in the present invention, but in the present invention, the package substrate 200 is not limited to this, and may be, for example, a CSP (Chip Scale Packaging) substrate or a BGA (Ball grid array). ..

In the first embodiment, if the product number (type) and the like of the package substrate 200 are different, the number of scheduled division lines 203, the number of device chips, the spacing between the scheduled division lines 203 adjacent to each other, and the like are different. Further, in the first embodiment, the package substrate 200 is provided with an alignment mark (not shown) indicating the position of the planned division line 203 on the substrate 201.

(Cutting equipment)
The cutting device 1 shown in FIG. 1 is a processing device that holds the package substrate 200 on a jig table 10 and cuts (corresponds to processing) the package substrate 200 by a cutting blade 21 along a scheduled division line 203. .. As shown in FIG. 1, the cutting device 1 is cured by a jig table 10 that sucks and holds the package substrate 200 on the mounting surface 13, a table base 40 to which the jig table 10 is detachably mounted, and a cutting blade 21. It includes a cutting unit 20 for cutting the package substrate 200 held on the tool table 10, an imaging unit 30 for imaging the package substrate 200 held on the jig table 10, and a control unit 100.

Further, as shown in FIG. 1, the cutting device 1 includes a moving unit 50 that relatively moves the jig table 10 and the cutting unit 20. The moving unit 50 includes an X-axis moving unit 51, which is a machining feed unit for machining and feeding the jig table 10 in the X-axis direction parallel to the horizontal direction, and a cutting unit 20 parallel to the horizontal direction and orthogonal to the X-axis direction. The Y-axis moving unit 52, which is an indexing feed unit that indexes and feeds in the Y-axis direction, and the cutting unit 20 that cuts and feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction. At least a Z-axis moving unit 53, which is a unit, and a rotational moving unit 54, which rotates the jig table 10 around an axis parallel to the Z-axis direction, are provided.

The X-axis moving unit 51 moves the jig table 10 in the X-axis direction, which is the machining feed direction, so that the jig table 10 and the cutting unit 20 are machined and fed relatively along the X-axis direction. be. The Y-axis moving unit 52 indexes and feeds the jig table 10 and the cutting unit 20 relatively along the Y-axis direction by moving the cutting unit 20 in the Y-axis direction, which is the indexing and feeding direction. .. The Z-axis moving unit 53 cuts and feeds the jig table 10 and the cutting unit 20 relatively along the Z-axis direction by moving the cutting unit 20 in the Z-axis direction, which is the cutting and feeding direction. .. The rotary movement unit 54 supports the jig table 10 and moves together with the jig table 10 in the X-axis direction by the X-axis movement unit 51.

The X-axis moving unit 51, the Y-axis moving unit 52, and the Z-axis moving unit 53 are a well-known ball screw rotatably provided around the axis, and a well-known motor and jig table for rotating the ball screw around the axis. A well-known guide rail that movably supports the 10 or the cutting unit 20 in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided.

The jig table 10 is mounted on the table base 40, and the machining area 2 below the cutting unit 20 and the loading / unloading area where the package substrate 200 is carried in / out separated from the lower part of the cutting unit 20 by the X-axis moving unit 51. It is rotatably provided in the X-axis direction over the number 3 and is rotatably provided around the axis parallel to the Z-axis direction by the rotary movement unit 54. The configuration of the jig table 10 will be described later.

The table base 40 has a rectangular planar shape and is formed in a thick flat plate shape, is rotatably supported around the axis by the rotary movement unit 54, and is supported by the X-axis movement unit 51 as a processing area 2 and a loading / unloading area 3. It is supported so as to be movable in the X-axis direction. The upper surface 41 of the table base 40 is formed flat in parallel with the horizontal direction, and a suction recess 42 recessed from the upper surface 41 is formed in the central portion of the upper surface 41. A suction passage 45 for holding a tip, which is connected to the suction source 44 via an on-off valve 43, is opened on the bottom surface of the suction recess 42. Further, a suction passage 47 for holding a jig table connected to a suction source 44 via an on-off valve 46 is opened on the upper surface 41 of the table base 40.

The cutting unit 20 is a cutting unit to which a cutting blade 21 for cutting the package substrate 200 held on the jig table 10 is detachably attached. The cutting unit 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 52 with respect to the package substrate 200 held by the jig table 10, and is movable in the Z-axis direction by the Z-axis moving unit 53. It is provided in.

As shown in FIG. 1, the cutting unit 20 is provided on a support frame 5 erected from the apparatus main body 4 via a Y-axis moving unit 52, a Z-axis moving unit 53, and the like. The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the mounting surface 13 of the jig table 10 by the Y-axis moving unit 52 and the Z-axis moving unit 53.

The cutting unit 20 rotates about the axis of the cutting blade 21, the spindle housing 22 movably provided in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 52 and the Z-axis moving unit 53, and the spindle housing 22. It includes a spindle 23 that is possibly provided and is rotated by a motor (not shown) and to which a cutting blade 21 is mounted at the tip.

The cutting blade 21 is an ultra-thin cutting grindstone having a substantially ring shape. In the first embodiment, the cutting blade 21 is a so-called washer blade including only an annular cutting blade that cuts the package substrate 200. The cutting edge is composed of abrasive grains such as diamond and CBN (Cubic Boron Nitride) and a bonding material (bonding material) such as metal and resin, and is formed to have a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called hub blade including a cutting blade and an annular circular base having the cutting blade arranged on the outer peripheral edge. The cutting blade 21 is rotated by rotating the spindle 23 around the axis by a motor. The axes of the cutting blade 21 and the spindle 23 of the cutting unit 20 are parallel to the Y-axis direction.

The image pickup unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. The image pickup unit 30 includes an image pickup element that is held on the jig table 10 and images a region to be divided of the package substrate 200 before cutting. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The image pickup unit 30 takes an image around the alignment mark of the package substrate 200 held on the jig table 10 to obtain an image for performing alignment for aligning the package substrate 200 and the cutting blade 21. The obtained image is output to the control unit 100.

Further, the cutting device 1 has an X-axis direction position detection unit (not shown) for detecting the position of the jig table 10 in the X-axis direction, and a Y-axis direction (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. A position detection unit and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction are provided. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the positions of the jig table 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100. do. In the first embodiment, the positions of each component of the cutting device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined with reference to a predetermined reference position (not shown).

The control unit 100 controls each component of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the package substrate 200. The control unit 100 is an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and input / output. It is a computer having an interface device. The arithmetic processing unit of the control unit 100 executes arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the cutting apparatus 1 to each of the cutting apparatus 1 via an input / output interface device. Output to the component.

The control unit 100 is connected to a display unit (not shown) composed of a liquid crystal display device or the like for displaying a processing operation state, an image, or the like, and an input unit used by an operator when registering processing content information or the like. The input unit is composed of at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

(Jig table)
The jig table 10 sucks and holds the package substrate 200, and is formed in a rectangular shape having a plane shape larger than that of the package substrate 200. In the first embodiment, the jig table 10 is formed in a rectangular shape having the same planar shape as the table base 40. The jig table 10 is formed in a flat plate shape having a rectangular planar shape and a constant thickness. As shown in FIGS. 2, 3 and 3, the jig table 10 includes a table body 11 formed in a rectangular shape having a plane shape larger than that of the package substrate 200, and an adhesive member 12.

The table body 11 is formed in a rectangular shape having the same planar shape as the table base 40, is composed of elastically deformable flexible members such as rubber and urethane, and has a mounting surface on the upper surface on which the package substrate 200 is mounted. It is thirteen. In the table body 11, the package substrate 200 is mounted on the mounting surface 13, and the package substrate 200 is held on the mounting surface 13.

The table body 11 has a blade relief groove 14 formed on the mounting surface 13 side at a position corresponding to the planned division line 203 of the package substrate 200. That is, in the jig table 10, a plurality of blade relief grooves 14 corresponding to the planned division lines 203 are formed in a grid pattern on the mounting surface 13 side of the table body 11. In this specification, the corresponding position is a position overlapping in the thickness direction. The blade relief groove 14 is formed linearly along the planned division line 203 of the package substrate 200 which is concave from the mounting surface 13 and is held on the mounting surface 13. The width of the blade relief groove 14 is formed to be wider than the thickness of the cutting blade 21. The cutting blade 21 that cuts the package substrate 200 held on the mounting surface 13 along the scheduled division line 203 enters the blade relief groove 14.

Further, as shown in FIG. 4, the jig table 10 includes a plurality of chip holding regions 15 partitioned by blade relief grooves 14 on the mounting surface 13 side of the table body 11. The chip holding region 15 is an region in which the package substrate 200 is provided at a position corresponding to the package 204 that is cut and processed by the cutting device 1 and is individually divided, and holds the individually divided package 204. The tip holding region 15 is arranged at a position corresponding to the suction recess 42.

The table body 11 is provided with a recess 151 at the center of the chip holding region 15, and a frame 16 at the outer edge of the chip holding region 15. In the first embodiment, the recess 151 is formed in a quadrangle shape along the planar shape of the package 204. The frame body 16 is provided over the entire circumference of the outer edge portion of each chip holding region 15, is formed along the blade relief groove 14, and is formed in a square frame shape. In the first embodiment, since the frame body 16 is a part of the table body 11, it is made of a flexible member constituting the table body 11.

Further, the table body 11 is shown on the bottom surface 152 (corresponding to the support surface) of the recess 151, which is slightly lower than the upper surface 161 of the frame body 16 which is a part of the mounting surface 13 defined by the frame body 16. As shown in 4, a suction port 153 is formed which communicates with the suction recess 42 and is connected to the suction source 44 via the suction passage 45 for holding the tip and the opening / closing valve 43. The suction port 153 opens in the center of the bottom surface 152 of the recess 151 of all the chip holding regions 15.

The adhesive member 12 is made of a tacky resin filled in the frame body 16 of each chip holding region 15. The tackiness referred to in the present invention means the property of adhering to a solid surface without using an adhesive or an adhesive, so-called self-adhesiveness, and exhibits a so-called sticky feeling generated on a fixed surface such as rubber. ing. The adhesive member 12 is made of, for example, a silicone resin, a silicone-based rubber, or a fluorine-based rubber. For example, "Flex Carrier (registered trademark)" manufactured by UMI Co., Ltd. or "Gel Base (registered trademark)" manufactured by Exceal Corporation. Etc. can be used. In this way, each chip holding region 15 is provided with a frame body 16 and an adhesive member 12 filled in the frame body 16, respectively.

In the first embodiment, the upper surface 161 constituting the mounting surface 13 of the frame body 16 projects upward from the upper surface 121 of the adhesive member 12, and the upper surface 121 of the adhesive member 12 is slightly smaller than the upper surface 161 of the frame body 16. It is placed in a low position. Further, each adhesive member 12 filled in each frame 16 has a suction hole 122 having one end opened to the upper surface 121 on the mounting surface 13 side and the other end communicating with the suction port 153. In the first embodiment, the suction hole 122 is provided at a position corresponding to the package 204 separated from the package substrate 200 by opening in the center of the upper surface 121. In the first embodiment, one suction hole 122 is opened in a region defined by a blade relief groove 14 on the upper surface 121, that is, the mounting surface 13. The suction hole 122 penetrates the adhesive member 12 in the thickness direction. Since the tip holding region 15 is arranged at a position corresponding to the suction recess 42, the suction hole 122 communicates with the suction recess 42 and connects to the suction source 44 through the suction passage 45 for holding the tip.

According to the above-described configuration, in the jig table 10, the lower surface of the table body 11 is overlapped with the upper surface 41 of the table base 40, the open / close valve 46 is opened, and the suction source 44 sucks the inside of the suction passage 47 for the jig table. By doing so, it is attached to and fixed to the upper surface 41 of the table base 40. In the jig table 10, the opening / closing valve 46 is closed, and the suction source 44 does not suck the inside of the suction passage 47 for the jig table (suction is restricted), so that the upper surface 41 of the table base 40 is not sucked. Can be removed from.

The jig table 10 is mounted on the table base 40, the package substrate 200 is placed on the mounting surface 13, the open / close valve 43 is opened, and the tip holding suction passage 45 and the suction recess 42 are used. By sucking the suction hole 122 into the suction source 44, the package substrate 200 placed on the mounting surface 13 is sucked and held. In the first embodiment, the jig table 10 directly puts the package substrate 200, which is divided into individual packages 204 by the cutting blade 21 that penetrates into the blade relief groove 14, on the mounting surface 13, without using an adhesive tape. It sucks and holds.

(Division method)
Next, the division method according to the first embodiment will be described with reference to the drawings. FIG. 5 is a flowchart showing the flow of the division method according to the first embodiment. The division method according to the first embodiment is a division method for dividing the package substrate 200 into individual packages 204, and includes the above-mentioned machining operation of the cutting device 1. As shown in FIG. 5, the division method according to the first embodiment includes a preparation step 1001, a mounting step 1002, a holding step 1003, and a cutting step 1004.

(Preparation step)
FIG. 6 is a cross-sectional view showing a preparatory step for the division method shown in FIG. The preparation step 1001 is a step of mounting the jig table 10 on the table base 40 of the cutting device 1. In the first embodiment, in the preparation step 1001, the operator places the jig table 10 on the table base 40 located in the loading / unloading area, operates the input unit, and inputs the processing content information to the control unit 100. Then, the control unit 100 receives the processing content information. At this time, the operator superimposes the outer edge of the jig table 10 on the outer edge of the table base 40, and arranges all the chip holding regions 15 at positions corresponding to the suction recess 42.

In the first embodiment, in the preparation step 1001, the operator operates the suction source 44 on the control unit 100 by operating the input unit or the like to open the on-off valve 46, and as shown in FIG. 6, the table base 40 The jig table 10 is sucked onto the upper surface 41 of the above surface, and the jig table 10 is attached to the table base 40.

(Placement step)
FIG. 7 is a cross-sectional view showing a mounting step of the division method shown in FIG. FIG. 8 is an enlarged cross-sectional view showing the VIII portion in FIG. 7. The mounting step 1002 is a step of mounting the package substrate 200 on the upper surface 161 of the frame body 16 after performing the preparation step 1001.

In the first embodiment, in the mounting step 1002, as shown in FIG. 7, the operator mounts the mold resin 202 of the package substrate 200 on the upper surface 161 of the frame body 16 constituting the mounting surface 13 of the jig table 1. do. At this time, the operator superimposes the mold resin 202 of the package substrate 200 on all the chip holding regions 15 and arranges all the scheduled division lines 203 on the corresponding blade relief grooves 14. Then, in the first embodiment, the upper surface 161 of the frame body 16 projects upward from the upper surface 121 of the adhesive member 12, and as shown in FIG. 8, the mold resin 202 of the package substrate 200 and the upper surface 121 of the adhesive member 12 A space is formed between and.

(Holding step)
FIG. 9 is a cross-sectional view showing a holding step of the dividing method shown in FIG. FIG. 10 is a cross-sectional view showing an enlarged portion X in FIG. The holding step 1003 is a step of holding the package substrate 200 by the adhesive member 12 by sucking the package substrate 200 from the suction hole 122 after performing the mounting step 1002.

In the first embodiment, in the holding step 1003, when the operator inputs a machining operation start instruction to the control unit 100 by operating the input unit or the like and the control unit 100 receives the machining operation start instruction, FIG. 9 shows. As described above, the opening / closing valve 43 is opened, and the package substrate 200 on the upper surface 161 of the frame body 16 is sucked by the suction source 44 through the suction passage 45 for holding the tip, the suction recess 42, the suction port 153, and the suction hole 122.

Then, since the frame body 16 is made of a flexible member, it is pressed by the mold resin 202 of the package substrate 200 sucked by the suction force from the suction source 44, and as shown in FIG. 10, the frame body 16 shrinks. The upper surface 161 is elastically deformed to be located on the same plane as the upper surface 121 of the adhesive member 12. Thus, in the holding step 1003, the adhesive member 12 holds the mold resin 202 of the package substrate 200 on the upper surface 121. Then, since the adhesive member 12 has a tack property, the jig table 10 holds the package substrate 200 on the mounting surface 13 due to the tack property of the adhesive member 12 in addition to the suction force from the suction source 44. , Will be fixed.

(Cutting step)
FIG. 11 is a cross-sectional view showing a cutting step of the dividing method shown in FIG. FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG. In the cutting step 1004, after performing the holding step 1003, the package substrate 200 is cut along the planned division line 203 while cutting the cutting blade 21 into the package substrate 200 to a depth reaching the blade relief groove 14, and each individual is cut. This is the step of dividing into package 204.

In the first embodiment, in the cutting step 1004, the cutting device 1 controls the X-axis moving unit 51 to move the jig table 10 toward the machining area 2, and the imaging unit 30 around the alignment mark of the package substrate 200. Is imaged, and alignment is performed based on the image obtained by the image pickup unit 30.

In the first embodiment, in the cutting step 1004, the cutting device 1 controls the moving unit 50 to relatively move the package substrate 200 and the cutting unit 20 along the planned division line 203, and FIGS. 11 and 12 show the drawings. As shown, the cutting blade 21 is cut into each scheduled division line 203 until it reaches the blade relief groove 14, and the package substrate 200 is divided into individual packages 204. The cutting device 1 moves the package substrate 200 divided into individual packages 204 toward the carry-in / out region 3, releases the suction holding of the package substrate 200 on the mounting surface 13 in the carry-in / out region 3, and performs a machining operation. To finish. Then, the upper surface 161 of the frame body 16 projects upward from the upper surface 121 of the adhesive member 12 due to the elastic restoring force of the frame body 16, and the mold resin 202 of the package substrate 200 divided into individual packages 204 is formed on the adhesive member 12. Move away from the top surface 121. The individually divided packages 204 are carried out from the jig table 10.

As described above, in the jig table 10 according to the first embodiment, the frame body 16 of the table body 11 is composed of a flexible member, and the adhesive member 12 filled in the frame body 16 has a tack property. .. For this reason, when the jig table 10 sucks and holds the package substrate 200 on the mounting surface 13 by the suction force from the suction source 44, the frame 16 shrinks and the package substrate 200 is placed on the upper surface 121 of the adhesive member 12. In close contact. Therefore, when the jig table 10 sucks and holds the package substrate 200 on the mounting surface 13 by the suction force from the suction source 44, the package substrate 200 is sucked and held by the tackiness of the adhesive member 12 in addition to the suction force from the suction source 44. Since it is held and fixed on the mounting surface 13, the package substrate 200 can be held more firmly than in the conventional case. As a result, the jig table 10 has an effect that the movement of the package substrate 200 during the cutting process can be suppressed.

Further, in the jig table 10 according to the first embodiment, since the upper surface 161 of the frame body 16 protrudes from the upper surface 121 of the adhesive member 12, when the suction force from the suction source 44 does not act, the frame body 16 Due to the elastic restoring force, the mold resin 202 of the package substrate 200 is separated from the upper surface 121 of the adhesive member 12. As a result, the jig table 10 can prevent the mold resin 202 of the package substrate 200 divided into the individual packages 204 from coming into close contact with the upper surface 121 of the adhesive member 12, so that the individual packages 204 can be placed from the mounting surface 13. It can be reliably carried out.

Further, in the division method according to the first embodiment, since the package substrate 200 is held and fixed on the mounting surface 13 of the jig table 10 described above, the movement of the package substrate 200 during the cutting process can be suppressed. It works.

[Modification example]
A jig table according to a modified example of the first embodiment of the present invention will be described with reference to the drawings. FIG. 13 is a cross-sectional view of a main part of the jig table according to the modified example of the first embodiment. In FIG. 13, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In the jig table 10-2 according to the modified example of the first embodiment, as shown in FIG. 13, the upper surface 161 of the frame body 16 and the upper surface 121 of the adhesive member 12 are located on the same plane. And the configuration is the same.

The jig table 10-2 according to the modified example has a suction source because the frame body 16 of the table body 11 is composed of a flexible member and the adhesive member 12 filled in the frame body 16 has tackiness. In addition to the suction force from 44, the tackiness of the adhesive member 12 causes the package substrate 200 to be held and fixed on the mounting surface 13. As a result, the jig table 10-2 according to the modified example has an effect that the movement of the package substrate 200 during the cutting process can be suppressed as in the first embodiment.

The present invention is not limited to the above embodiments and modifications. That is, it can be modified in various ways without departing from the gist of the present invention. For example, in the present invention, the cutting device 1 may be carried by the operator into the jig tables 10 and 10-2 of the package substrate 200, or may be carried by a transfer mechanism (not shown) of the cutting device 1.

1 Cutting device 10,10-2 Jig table 12 Adhesive member 13 Mounting surface 14 Blade relief groove 15 Chip holding area 16 Frame 40 Table base 43 Open / close valve 44 Suction source 121 Top surface 122 Suction hole 152 Bottom surface (support surface)
153 Suction port 161 Top surface 200 Package board 203 Scheduled division line 1001 Preparation step 1002 Mounting step 1003 Holding step 1004 Cutting step

Claims (3)

A jig table that is detachably attached to the table base of a cutting device and holds a package substrate having a plurality of intersecting scheduled division lines.
On the mounting surface side on which the package substrate is mounted, a plurality of blade relief grooves corresponding to the planned division lines of the package substrate are formed, and a plurality of chip holding regions partitioned by the blade relief grooves are included.
Each of the chip holding regions includes a frame body made of a flexible member and an adhesive member having a tack property filled in the frame body.
A suction port connected to a suction source via an on-off valve is formed on a support surface slightly lower than the upper surface of the frame defined by the frame, and a suction port is formed.
A jig table in which one end of the adhesive member is open to the mounting surface side and the other end is formed with a suction hole communicating with the suction port. The jig table according to claim 1, wherein the upper surface of the frame body protrudes from the upper surface of the adhesive member. A division method for dividing a package substrate having a plurality of intersecting planned division lines into individual packages.
A plurality of blade relief grooves corresponding to the planned division line are formed on the mounting surface side on which the package substrate is mounted, and a plurality of chip holding regions partitioned by the blade relief grooves are included.
Each of the chip holding regions includes a frame body made of a flexible member and an adhesive member having a tack property filled in the frame body, and is more than an upper surface of the frame body defined by the frame body. A suction port connected to the suction source via an on-off valve is formed on the slightly lower support surface, and one end of the adhesive member opens to the mounting surface side and the other end communicates with the suction port. A preparatory step for mounting the jig table on the table base of the cutting device with the suction holes formed.
After performing the preparation step, the mounting step of mounting the package substrate on the frame body and the mounting step
After performing the mounting step, a holding step of holding the package substrate by the adhesive member by sucking the package substrate from the suction hole, and a holding step.
After performing the holding step, a cutting step of cutting the package substrate along the planned division line and dividing it into individual packages while cutting the cutting blade into the package substrate to a depth reaching the blade relief groove. A split method with ,.

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