JP2021166279A - Band-shaped substrate and band-shaped LED light emitting device - Google Patents

Abstract

To provide a band-shaped substrate and a band-shaped LED light emitting device, capable of suppressing the driving current of an LED element.SOLUTION: A wiring pattern 44a for series and a wiring pattern 44b for connection are formed on a band-shaped substrate 20. The wiring pattern 44a for series connects LED elements 31 in series between a power line L1 and a ground line L2. When the wiring pattern 44a for series between LED pads 41 mounting the LED element 31 is used as a cutting position, the wiring pattern 44a for series connects the front stage side of the wiring pattern 44a for series to be separated, to the ground line L2 via a connection element pad 43 mounting a connection element 33.SELECTED DRAWING: Figure 2

Description

The present invention relates to a strip-shaped substrate in which LED elements are arranged along the length direction and an LED light emitting device in which the LED elements are mounted on the strip-shaped substrate.

An LED light emitting device in which LED elements are arranged on a strip-shaped substrate along the length direction of the strip-shaped substrate is used as a lighting device or used as a character elephant or edging to improve the display effect. ing.
Since the strip-shaped LED light emitting device is long, it is highly convenient if the strip-shaped substrate can be cut in the middle and used when the required length is short with respect to the length of the substrate.
Patent Document 1 discloses a band-shaped LED light emitting device whose length can be adjusted by cutting such a substrate.

The luminaire described in Patent Document 1 is a unit U in which two light emitting elements connected in series with a resistance element sandwiched therein are mounted on a circuit board formed of a flexible printed circuit board having flexibility. A plurality of units are connected in parallel along the length direction of the circuit board.

Japanese Unexamined Patent Publication No. 2014-203821

In the luminaire described in Patent Document 1, since a plurality of units in which light emitting elements are connected in series are connected in parallel, the current required for the light emitting elements is equal to the number of units, which is a long circuit board. In this case, the number of units also increases, so that a large current must be supplied as the drive current.

Therefore, an object of the present invention is to provide a strip-shaped substrate and a strip-shaped LED light emitting device whose length can be adjusted by cutting and which can suppress the driving current of the LED element.

In the strip-shaped substrate of the present invention, the series wiring pattern for connecting the LED elements in series between the power supply line and the ground line and the series wiring pattern between the LED pads on which the LED elements are mounted are cut at a cutting position. The feature is that the connection wiring pattern that connects to the ground wire with the connection element pad on which the connection element is mounted is formed on the front stage side of the series wiring pattern to be separated. It is something to do.

According to the strip-shaped substrate of the present invention, since the LED elements are connected in series between the power supply line and the ground line by the series wiring pattern, the current can be reduced as compared with the parallel connection. Further, even if the series wiring pattern between the LED pads on which the LED elements are mounted is cut as the cutting position, the connection element pad on which the connection element is mounted is placed on the front stage side of the series wiring pattern to be separated. Since the connection wiring pattern that is interposed and connected to the ground wire is formed, the current flowing through the LED element in the middle of the LED elements connected in series can flow to the ground wire.

For a protective element on which a protective element for protecting the LED element is mounted on the rear side of the series wiring pattern to be separated when the series wiring pattern between the LED pads is set as a cutting position. It can be assumed that a power supply wiring pattern connected to the power supply line with a pad interposed therebetween is formed.
Even if the series wiring pattern between the LED pads on which the LED elements are mounted is cut as the cutting position, a protection element for protecting the LED elements is mounted on the rear side of the series wiring pattern to be separated. Since the power supply wiring pattern connected to the power supply line is formed with the protection element pad interposed therebetween, a current can flow from the power supply line to the rear stage side of the cut LED element via the protection element. Therefore, a strip-shaped substrate on the rear stage side can also be used.

A component mounting portion on which an electronic component including the LED element is mounted and a wiring portion on which a wiring pattern connecting the component mounting portions is formed are formed, and the component mounting portions are provided at both ends in the width direction. A pair of power supply pad portions for supplying power to the LED element are formed, and the pair of power supply pad portions are formed in the reverse order of arrangement at one end portion and the other end portion. When the power supply pad portion rotates the wiring portion 90 degrees counterclockwise, the wiring portion aligns with the power supply pad portion at one end of the component mounting portion, and the wiring portion is 90 in the clockwise direction. When rotated by a degree, it can be formed at the cutting position so that the arrangement coincides with the power supply pad portion at the other end of the component mounting portion.
By cutting the wiring section and connecting it to the component mounting section, power can be supplied to each component mounting section. Therefore, even if the strip-shaped substrate is cut to form characters, figures, characters, etc., the LED element Can be turned on.

A component mounting portion on which an electronic component including the LED element is mounted and a wiring portion in which a wiring pattern connecting the component mounting portions is formed are formed, and are located between the adjacent component mounting portions and between them. The concave portion in the width direction formed by the wiring portion can be formed into a shape that fits into the convex portion in the width direction formed by the adjacent wiring portions and the component mounting portion located between them.
By fitting the concave portion and the convex portion in the width direction, the strip-shaped substrates can be made to function as a surface light emitting device by arranging them in the width direction.

Further, the band-shaped LED light emitting device of the present invention may include the band-shaped substrate of the present invention, the LED element mounted on the LED pad, and the connecting element mounted on the connecting element pad. can.

The protective element may be either a resistor or a constant current diode, and the connecting element may be either a resistor or a jumper. By doing so, the current from the power supply line to the LED element can be limited by the protection element, and the current from the LED element can flow to the ground line by the connection element.

In the present invention, since the LED elements connected in series can be cut from the middle, the length can be adjusted by cutting, and the driving current of the LED elements can be suppressed.

It is a figure which shows the band-shaped LED light emitting device which concerns on Embodiment 1 of this invention. It is a circuit diagram for demonstrating the strip-shaped substrate of the strip-shaped LED light emitting device shown in FIG. It is a circuit diagram for demonstrating the cutting of the strip-shaped substrate shown in FIG. It is the figure of the state which cut at the step. It is a circuit diagram which shows the modification of the band-shaped LED light emitting device which concerns on Embodiment 1 of this invention. It is a figure which shows the band-shaped LED light emitting device which concerns on Embodiment 2 of this invention. It is a circuit diagram for demonstrating the strip-shaped substrate of the strip-shaped LED light emitting device shown in FIG. It is a circuit diagram for demonstrating the cutting of the strip-shaped substrate shown in FIG. It is the figure of the state which cut at the step. It is a figure which shows the modification of the band-shaped LED light emitting device which concerns on Embodiment 2 of this invention, (A) is the figure which shows the state before cutting, (B) is the state which imitated the alphabet E after cutting and connected. It is a figure. It is a figure which shows the band-shaped LED light emitting device which concerns on Embodiment 3 of this invention.

The band-shaped LED light emitting device according to the embodiment of the present invention will be described with reference to the drawings.
In the LED light emitting device 10 shown in FIG. 1, LED elements 31 are arranged along a length direction on a long strip-shaped substrate 20. The strip-shaped substrate 20 is a film-shaped flexible substrate in which a conductive pattern (not shown) is formed on a flexible insulating substrate, and a cover film covering the conductive pattern is a film-shaped flexible substrate in which a die pad P is exposed for mounting components. be.

The strip-shaped substrate 20 is formed in a long shape by alternately and continuously forming the component mounting portion 21 and the wiring portion 22. Electronic components including the LED element 31 are mounted on the component mounting unit 21. The wiring portion 22 is formed with a wiring pattern that connects the component mounting portions 21 to each other.
In the present embodiment, the wiring portion 22 is formed in an elongated rectangular shape, and the component mounting portion 21 is formed in a hexagonal shape in contour.
The LED element 31 and the protection element 32 or the connection element 33 are mounted on the die pad P in the component mounting portion 21.

Here, the conductive pattern formed on the strip-shaped substrate 20 will be described with reference to FIG.
As shown in FIG. 2, the conductive pattern 40 includes power supply pads P1 and P2 which are power supply terminals, an LED pad 41 on which the LED element 31 is mounted, and a protective element pad 42 on which the protective element is mounted. A connection element pad 43 on which the connection element 33 is mounted and a wiring pattern 44 for connecting these die pads are provided.

In the first embodiment, the resistor R1 is mounted on the protective element pad 42 as a protective element that limits and protects the current flowing through the LED element 31, and the connecting element 33 on which the connecting element pad 43 is mounted is used. The resistors R21 and R22 have a resistance value smaller than that of the resistor R1.
The resistance R21 and the resistance R22 have a relationship in which the resistance value is resistance R21> resistance R22 in order to keep the current constant between the case where one LED element 31 is lit and the case where two LED elements 31 are lit. It is adjusted so that
In the band-shaped LED light emitting device 10 according to the first embodiment, the resistor R1 which is the protection element 32 is mounted, but the connection element 33 is not mounted unless the band-shaped substrate 20 is cut. It is implemented depending on the cutting position.

A connection cable (not shown) is connected to the power supply pads P1 and P2 to supply power. A power cable for supplying DC power is connected to the power pad P1, and + 12V is supplied in the present embodiment. A ground cable is connected to the power supply pad P2.

A segment S in which a plurality of LED elements 31 are connected in series is connected in parallel between the power supply line L1 from the power supply pad P1 and the ground line L2 from the power supply pad P2.
A series wiring pattern 44a and a connection wiring pattern 44b are formed in the segment S.
The series wiring pattern 44a connects the protection element pad 42 on which the resistor R1 is mounted and the three LED pads 41 on which the LED element 31 is mounted in series between the power supply line L1 and the ground line L2. It is a thing.
The connection wiring pattern 44b grounds the front stage side of the series wiring pattern 44a to be separated when the series wiring pattern 44a between the LED pads 41 is set as the cutting position, with the connection element pad 43 interposed therebetween. It is connected to the line L2.

The operation and usage state of the band-shaped LED light emitting device 10 according to the first embodiment configured as described above will be described with reference to the drawings.
First, it is assumed that the resistor R1 is mounted as the protection element 32 and the resistors R21 and R22 are not mounted as the connection element 33 in the band-shaped LED light emitting device 10 shown in FIG.
When power is supplied to the power supply terminals P1 and P2, the current flowing from the power supply line L1 to the series wiring pattern 44a flows from the resistor R1 through the three LED elements 31 and flows to the ground line L2.
Since the protective element 32 is not mounted on the protective element pad 42, it is in an open state. Therefore, since the connection wiring pattern 44b is in a disconnected state, the two LED elements 31 in the previous stage and the ground wire L2 are in a non-conducting state.
As a result, light is emitted in a state where the three LED elements 31 are connected in series.

Next, as shown in FIG. 3A, the cutting position is the position C11 between the LED element 31 in the front stage and the LED element 31 in the next stage (the position C11 next to the first LED element 31). , The case where the power supply line L1 and the ground line L2 and the series wiring pattern 44a are disconnected will be described.
In this case, it is assumed that the resistor R21 is mounted as the connection element 33 on the connection element pad 43 of the front stage (first stage).
Even if it is cut by the position C11, the frontmost protection element 32 (resistor R1), the LED element 31 and the connection element 33 (resistor R21) are connected to the series wiring pattern 44a between the power supply line L1 and the ground line L2. It is in a state of being connected by the connection wiring pattern 44b.
Therefore, one LED element 31 can be turned on.

Next, as shown in FIG. 3B, at the position C12 between the second-stage LED element 31 and the third-stage LED element 31 (the position C12 next to the second LED element 31). A case where the power supply line L1, the ground line L2, and the series wiring pattern 44a are disconnected will be described.
In this case, it is assumed that the resistor R22 is mounted as the connecting element 33 on the second-stage connecting element pad 43.

Even if it is disconnected by the position C12, between the power supply line L1 and the ground line L2, the frontmost protection element 32 (resistor R1), the two LED elements 31, and the second stage connection element 33 (resistor R22) Is connected by the series wiring pattern 44a and the connection wiring pattern 44b. Further, the pad 43 for the connection element in the front stage is not mounted.
Therefore, the two LED elements 31 can be turned on.

Further, as shown in FIG. 3C, the power supply line L1 and the ground are located at the position C13 between the third-stage LED element 31 and the next segment (the position C13 next to the third LED element 31). The case where the line L2 is cut will be described.

Even if the power line L1 and the ground line L2 are disconnected by the position C13, the frontmost protection element 32 (resistor R1) and the three LED elements 31 are connected to the series wiring pattern 44a and the connection wiring pattern 44b. It becomes connected by. Further, the first-stage and second-stage connection element pads 43 are not mounted.
Therefore, the three LED elements 31 can be turned on.
Subsequent segments S are the same as those in FIGS. 3 (A) to 3 (C), and thus the description thereof will be omitted.

Since the LED elements 31 are connected in series in this way, the current can be reduced as compared with the case where the LED elements 31 are connected in parallel.
Further, as shown in FIGS. 3A to 3C, when the cutting position is between the LED elements 31 connected in series, the connecting element 33 is set as a connecting element pad according to the cutting position. By mounting it on the 43 or not mounting it, it is possible to disconnect between the LED elements 31 connected in series.
Therefore, the LED light emitting device 10 and the strip-shaped substrate 20 according to the present embodiment can cut the LED element 31 in units of one, and the length can be adjusted in units of one, and the LED element can be used. The drive current can be suppressed compared to those connected in parallel.

In this embodiment, it is possible to cut in units of one, and three LED elements 31 are connected in series in one segment S, but if the current flowing through the LED element 31 can be secured. Four or more LED elements may be connected in series, or the LED elements may be cut in units of two or more.

(Modified Example of Embodiment 1)
A modification of the band-shaped LED light emitting device according to the first embodiment of the present invention will be described with reference to the drawings.
In FIG. 4, those having the same configuration as that in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.
In the band-shaped substrate 20X used in the band-shaped LED light emitting device 11 shown in FIG. 4, a constant current diode D1 is mounted on the protective element pad 42 as the protective element 32. Further, jumpers J21 and J22 are mounted on the connecting element pad 43 as the connecting element 43.

In this way, the protective element 32 that limits and protects the current flowing through the LED element 31 is a constant current diode D1, and the current flowing through the LED element 31 becomes constant, so that the connection element pad 43 is interposed for connection. Even if the connecting element 33 connecting the wiring pattern 44b is used as jumpers J21 and J22 for short-circuiting the connecting element pad 43, the same effect as that of the strip-shaped substrate 20 shown in FIG. 1 can be obtained.

(Embodiment 2)
The band-shaped LED light emitting device according to the second embodiment of the present invention will be described with reference to the drawings.
In FIGS. 5 and 6, the same components as those in FIGS. 1 and 2 are designated by the same reference numerals and the description thereof will be omitted.
As shown in FIG. 5, the band-shaped LED light emitting device 12 according to the second embodiment uses only the band-shaped substrate 20Y on the power supply pads P1 and P2 (see FIG. 6), which are power supply terminals, from the cut position. However, the strip-shaped substrate 20Y on the separated side can also be used.

As shown in FIG. 6, a power supply wiring pattern 44c is formed on the strip-shaped substrate 20Y in addition to the series wiring pattern 44a and the connection wiring pattern 44b as the wiring pattern 44Y of the segment S.
The power supply wiring pattern 44c supplies power to the rear side of the series wiring pattern 44a to be separated when the series wiring pattern 44a between the LED pads 41 is set as the cutting position, with the protection element pad 42 interposed therebetween. It is connected to the line L1. Resistors R11 and R12 are mounted on the protective element pad 42.
In the band-shaped LED light emitting device 12 according to the second embodiment, the resistor R1 which is the protection element 32 is mounted. However, the resistors R11 and 12 and the connecting element 33 are not mounted unless the strip-shaped substrate 20 is cut, but they are mounted depending on the cutting position.

Next, as shown in FIG. 7A, the cutting position is the position C21 between the LED element 31 in the front stage and the LED element 31 in the next stage (the position C21 next to the first LED element 31). , The case where the power supply line L1 and the ground line L2 and the series wiring pattern 44a are disconnected will be described.
In this case, it is assumed that the resistor R21 is mounted as the connecting element 33 on the connecting element pad 43 in the frontmost stage (first stage) as in FIG. 3A in the first embodiment.
Further, the protective element pad 42 in the power supply wiring pattern 44c between the separated rear stage side series wiring pattern 44a (second stage series wiring pattern 44a which is the next stage of the front stage) and the power supply line L1. It is assumed that the resistor R11 is mounted as the protection element 32.

Even if the LED element 31 in the front stage is the same as in FIG. 3A even if the LED element 31 is cut at the position C21, the LED element 31 in the strip-shaped substrate 20Y on the front stage side from the cut position C21 can be lit.
Further, also in the strip-shaped substrate 20Y on the rear stage side from the cut position C21, the resistor R11 is mounted on the protective element pad 42, and the current flows from the power supply line L1 through the resistor R11 via the two LED elements 31. It flows to the ground line L2.
Therefore, since the LED element 31 can emit light even in the strip-shaped substrate 20Y on the rear side of the cut position C21, even if the strip-shaped substrate 20Y is separated at the position C21, it can be used without being thrown away.

Next, as shown in FIG. 7B, at the position C22 between the second-stage LED element 31 and the third-stage LED element 31 (the position C22 next to the second LED element 31). A case where the power supply line L1, the ground line L2, and the series wiring pattern 44a are disconnected will be described.
In this case, it is assumed that the resistor R22 is mounted as the connecting element 33 on the second-stage connecting element pad 43 as in FIG. 3B in the first embodiment.
Further, the protective element pad 42 in the power supply wiring pattern 44c between the separated rear-stage side series wiring pattern 44a (third-stage series wiring pattern 44a) and the power supply line L1 is provided as a protection element 32. It is assumed that the resistor R12 is mounted.

Even if the LED element 31 in the front stage and the next stage is the same as in FIG. 3B even if the LED element 31 is cut at the position C22, the LED element 31 in the strip-shaped substrate 20Y on the front stage side from the cut position C22 can be lit. can.
Further, also in the strip-shaped substrate 20Y on the rear stage side from the cut position C22, the resistor R12 is mounted on the protective element pad 42, and the current flows from the power supply line L1 through the resistor R12 via one LED element 31. It flows to the ground line L2.
Therefore, since the LED element 31 can emit light even in the strip-shaped substrate 20Y on the rear side of the cut position C22, even if the strip-shaped substrate 20Y is separated at the position C22, it can be used without being discarded.

Further, as shown in FIG. 7C, the power supply line L1 and the ground are located at the position C23 between the third-stage LED element 31 and the next segment (the position C23 next to the third LED element 31). A case where the wire L2 and the series wiring pattern 44a are cut will be described.

Even if the LED element 31 is cut at the position C23, it is the same as in FIG. 3C, so that the LED element 31 in the strip-shaped substrate 20Y on the front stage side from the cut position C23 can be turned on.
Further, also in the strip-shaped substrate 20Y on the rear stage side from the cut position C23, since the current can be passed to the LED element 31 by the resistor R1, the LED element 31 can be made to emit light, so that the strip-shaped substrate 20Y is separated at the position C23. Even if it does, it can be used without throwing it away.
Subsequent segments S are the same as those in FIGS. 7 (A) to 7 (C), and thus the description thereof will be omitted.

Since the LED elements 31 are connected in series in this way, the current can be reduced as compared with the case where the LED elements 31 are connected in parallel.
Further, as shown in FIGS. 7A to 7C, the connecting element 33 is mounted on the connecting element pad 43 on the strip-shaped substrate 20Y on the front stage side from the cutting positions C21 to C23 according to the cutting position. By mounting the protective element 32 on the protective element pad 42 on the strip-shaped substrate 20Y on the rear stage side, it is possible to cut even between the LED elements 31 connected in series.

In the second embodiment, as in the first embodiment, the protection elements 32 are the resistors R1, R11, R12, and the connection elements 33 are the resistors R21, R22, but they are connected in series with one LED element 31. If the intensity of light emission may differ from that of the LED element 31, the connecting element 33 may be used as a jumper. Further, the protection element 32 may be a constant current diode as in the modification of the first embodiment.
Further, in the first and second embodiments, the segments S in which the three LED elements 31 are connected in series are connected in parallel, but the number of the LED elements 31 connected in series may be four or more and is mounted on the strip-shaped substrate. All of the LED elements 31 may be connected in series.

(Modified Example of Embodiment 2)
The band-shaped LED light emitting device according to the embodiment of the present invention will be described with reference to the drawings.
In FIG. 8, those having the same configuration as that in FIG. 5 are designated by the same reference numerals, and the description thereof will be omitted.
As shown in FIG. 8A, power supply pad portions P1 and P2 are formed on the component mounting portion 21 and the wiring portion 22 on the strip-shaped substrate 20.

In the component mounting portion 21, a pair of power supply pad portions P1 and P2 are formed at both ends of the strip-shaped substrate 20 in the width direction F1. The pair of power supply pad portions P1 and P2 are formed in the opposite order.
In the wiring portion 22, the power supply pad portion P1 is formed at one end of the band-shaped substrate 20 in the width direction F1, and the power supply pad portion P2 is formed at the other end.

In particular, when the wiring portion 22 is rotated 90 degrees counterclockwise, the power pad portions P1 and P2 of the wiring portion 22 are aligned with the power pad portions P1 and P2 at one end of the component mounting portion 21. When the wiring portion 22 is rotated 90 degrees clockwise, it is formed at the cutting position so that the arrangement coincides with the power supply pad portions P2 and P1 at the other end of the component mounting portion 21.

By forming the strip-shaped substrate 20 in this way, as shown in FIG. 8B, the wiring portion 22 cut and separated from the component mounting portion 21 is separated from the component mounting portion 21 at the end of the component mounting portion 21 in the width direction F1. The component mounting portion 21 and the wiring portion 22 can be connected by connecting to the power pad portion P1 by the abutting connecting member.
In the present embodiment, the connecting member is the chip jumper J31, but it may be a lead jumper.

In the example shown in FIG. 8 (B), the alphabet "E" is imitated as shown by the virtual line by the dotted line.
In this way, the wiring portion 22 is cut and connected to the component mounting portion 21 by a chip element such as a chip jumper J31 or a lead jumper, whereby the wiring portion 22 and the component mounting portion 21 are connected by a lead wire. Compared to the case, it is possible to connect at the shortest distance. Further, since the wiring unit 22 connected to the component mounting unit 21 can supply power to each component mounting unit 21 on the separated side, the strip-shaped substrate 20 is cut to form characters, figures, characters, and the like. Also, the LED element 31 can be turned on.

(Embodiment 3)
The band-shaped LED light emitting device according to the third embodiment of the present invention will be described with reference to the drawings.
In FIG. 9, those having the same configuration as that in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.
The band-shaped LED light emitting device 13 shown in FIG. 9 is a band-shaped LED light emitting device 10 (strip-shaped substrate 20) shown in FIG. 1 arranged in the width direction.
In the strip-shaped substrate 20 shown in FIGS. 1 and 9, the recesses 23 in the width direction between the adjacent component mounting portions 21 and the wiring portions 22 located between the component mounting portions 21 are adjacent wiring portions 22 to each other. And the component mounting portion 21 located between the wiring portions 22 are formed in a shape that fits into the convex portion 24 in the width direction.

The band-shaped LED light emitting device 10 is formed in this way, and by arranging the band-shaped LED light emitting device 10 in the width direction, it can function as a surface light emitting device. It can be expressed, and figures, characters, etc. can be expressed.
Further, since the band-shaped LED light emitting device 10 can be arranged without a gap, the modeled object can be displayed in a natural state, so that a high appealing power can be obtained when used for an advertisement or the like.

Although the band-shaped LED light emitting device 10 shown in FIG. 9 has been described in the first embodiment, the band-shaped LED light emitting devices 11 and 12 may be used.

The present invention is suitable for lighting devices, advertisements on which characters, pictures, etc. are displayed.

10, 11, 12, 13 LED light emitting device 20, 20X, 20Y Band-shaped board 21 Parts mounting part 22 Wiring part 31 LED element 32 Protective element 33 Connection element 40 Conductive pattern 41 LED pad 42 Protective element pad 43 Connection element pad 44 Wiring pattern 44a Wiring pattern for series 44b Wiring pattern for connection C11 to C13, C21 to C23 Position L1 Power supply line L2 Ground wire P Die pad P1, P2 Power supply pad D1 Constant current diode R1, R21, R22 Resistance J21, J22 Jumper J31 Chip jumper S segment

Claims (7)

A series wiring pattern that connects LED elements in series between the power supply line and the ground line,
When the series wiring pattern between the LED pads on which the LED elements are mounted is set as the cutting position, the connection element pad on which the connection element is mounted is placed on the front stage side of the series wiring pattern to be separated. A strip-shaped substrate on which a connection wiring pattern that is interposed and connected to the ground wire is formed. For a protective element in which a protective element for protecting the LED element is mounted on the rear side of the series wiring pattern to be separated when the series wiring pattern between the LED pads is set as a cutting position. The strip-shaped substrate according to claim 1, wherein a wiring pattern for a power source that is connected to a power supply line with a pad interposed therebetween is formed. A component mounting portion on which an electronic component including the LED element is mounted and a wiring portion in which a wiring pattern connecting the component mounting portions is formed are formed.
A pair of power pad portions for supplying power to the LED element are formed at both ends of the component mounting portion in the width direction.
The pair of power supply pads are formed in the opposite order of arrangement at one end and the other end.
When the power pad portion rotates the wiring portion 90 degrees counterclockwise, the wiring portion aligns with the power pad portion at one end of the component mounting portion, and the wiring portion is rotated clockwise. The strip-shaped substrate according to claim 2, which is formed at a cutting position so that the arrangement coincides with the power pad portion at the other end of the component mounting portion when rotated by 90 degrees. A component mounting portion on which an electronic component including the LED element is mounted and a wiring portion in which a wiring pattern connecting the component mounting portions is formed are formed.
The concave portion in the width direction due to the adjacent component mounting portions and the wiring portion located between them has a shape that fits into the convex portion in the width direction due to the adjacent wiring portions and the component mounting portion located between the adjacent wiring portions. The strip-shaped substrate according to claim 1 or 2 formed. A band-shaped LED light emitting device including the band-shaped substrate according to any one of claims 1 to 4, an LED element mounted on the LED pad, and a connecting element mounted on the connecting element pad. The band-shaped LED light emitting device according to claim 5, wherein the connecting element is either a resistor or a jumper. The strip-shaped substrate according to claim 2 or 3, the LED element mounted on the LED pad, and the connecting element mounted on the connecting element pad are provided.
The protective element is a band-shaped LED light emitting device that is either a resistor or a constant current diode.

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