JP2021158151A - Heat dissipation structure of electronic apparatus - Google Patents

Abstract

To provide a heat dissipation structure of an electronic apparatus that can obtain high heat dissipation efficiency.SOLUTION: A heat dissipation structure of an electronic apparatus includes a circuit board 10 having an upper surface on which an electronic component 20 is arranged, a water-cooled heat sink 30 arranged to face the lower surface of the circuit board 10, a vertical heat sink 31 attached to the electronic component 20, a first heat sink 32 arranged to face the upper surface of the circuit board 10, and a second heat sink 33 that is arranged so as to wrap around the outside of the circuit board 10 and connects the water-cooled heat sink 30 and the first heat sink 32, and the vertical heat sink 31 is connected to the water-cooled heat sink 30 via a through hole 11 of the circuit board 10, one end thereof is connected to the water-cooled heat sink 30, and the other end is connected to the first heat sink 32.SELECTED DRAWING: Figure 1

Description

The present invention relates to a heat radiating structure of an electronic device, and more particularly to an improvement of a heat radiating structure for radiating heat of an electronic component arranged on a circuit board by using a water-cooled heat sink.

A heat dissipation structure of an electronic device using a water-cooled heat sink has been conventionally known. FIG. 2 is a diagram showing an example of a heat dissipation structure in a conventional electronic device. A vertical heat sink 31 is attached to the electronic component 20, and the vertical heat sink 31 is connected to the water-cooled heat sink 30. Therefore, the heat generated by the electronic component 20 propagates to the water-cooled heat sink 30 through the vertical heat sink 31, and is exhausted by the cooling water in the cooling pipe 40.

Since the water-cooled heat sink 30 has a substantially flat plate shape, it is arranged on the side opposite to the circuit board 10 when viewed from the electronic component 20. Considering the influence of the leakage of the cooling water, it is desirable that the water-cooled heat sink 30 is arranged below the circuit board 10 and the electronic component 20. Therefore, the circuit board 10 is arranged above the electronic component 20, and the electronic component 20 is provided on the lower surface of the circuit board 10. The lower end of the vertical heat sink 31 is connected to the water-cooled heat sink 30, and the upper end thereof is fixed to the circuit board 10.

Although the water-cooled heat sink 30 has high heat exhaust efficiency, there is no freedom in arranging the water-cooled heat sink 30 and the vertical heat sink 31, and it is difficult to improve the conduction efficiency in the heat propagation path from the electronic component 20 to the water-cooled heat sink 30. There is a problem that it is difficult to improve the heat dissipation efficiency.

Further, by adopting a configuration in which the circuit board 10 and the water-cooled heat sink 30 are arranged so as to sandwich the electronic component 20, there is a problem that the space utilization efficiency is lowered and it is difficult to miniaturize the electronic device. In addition, there is a problem that it is difficult to improve the work efficiency of failure repair.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat dissipation structure of an electronic device capable of obtaining high heat dissipation efficiency. Another object of the present invention is to provide a heat dissipation structure of an electronic device, which can be miniaturized or can facilitate failure repair.

The heat dissipation structure of the electronic device according to the first aspect of the present invention includes a circuit board having a first main surface on which electronic components are arranged and a water-cooled heat sink arranged to face the second main surface of the circuit board. A vertical heat sink attached to the electronic component is provided, and the vertical heat sink is connected to the water-cooled heat sink via a through hole of the circuit board.

By adopting such a configuration, the circuit board and the water-cooled heat sink can be arranged in the same direction when viewed from the electronic components, so that the space utilization efficiency can be improved without lowering the heat dissipation efficiency, and the electronic components can be used. The equipment can be miniaturized. In addition, the work of repairing a failure can be facilitated.

In addition to the above configuration, the heat dissipation structure of the electronic device according to the second aspect of the present invention wraps around the first heat sink arranged to face the first main surface of the circuit board and the outside of the circuit board. A second heat sink that is arranged and connects the water-cooled heat sink and the first heat sink is provided, and one end of the vertical heat sink is connected to the water-cooled heat sink and the other end is connected to the first heat sink. There is.

By adopting such a configuration, the number of paths through which the heat of the electronic component propagates from the vertical heat sink to the water-cooled heat sink can be increased, and the heat dissipation efficiency can be improved.

In the heat dissipation structure of the electronic device according to the third aspect of the present invention, in addition to the above configuration, the circuit board is arranged substantially horizontally, the electronic component is arranged on the upper surface of the circuit board, and the water-cooled heat sink is provided. Is arranged on the lower surface side of the circuit board.

By adopting such a configuration, it is possible to prevent the heat medium leaking from the water-cooled heat sink from affecting the circuit board and electronic components.

According to the present invention, it is possible to provide a heat dissipation structure of an electronic device capable of obtaining high heat dissipation efficiency. Further, it is possible to provide a heat dissipation structure of the electronic device, which can reduce the size of the electronic device or facilitate the repair of a failure.

It is a figure which showed one configuration example of the electronic device 100 to which the heat dissipation structure by embodiment of this invention is applied. It is a figure which showed an example of the heat dissipation structure in the conventional electronic device.

FIG. 1 is a diagram showing a configuration example of an electronic device 100 to which the heat dissipation structure according to the embodiment of the present invention is applied. The electronic device 100 includes a circuit board 10, electronic components 20, and seat sinks 30 to 33.

The circuit board 10 is a board on which one or more electronic components 20 are arranged. For example, it is a printed circuit board formed by processing an insulating material such as glass epoxy into a rectangular plate shape to form a wiring pattern. The mounting surface of the electronic component 20 may be either single-sided or double-sided, and may be either a single-layer structure or a multi-layer structure.

The electronic component 20 is a heat-generating electronic component that generates a relatively large amount of heat during operation, for example, an electronic component for a power source through which a large current flows. The illustrated electronic component 20 is a semiconductor device, and is composed of a component body 21 and a lead terminal 22.

The component main body 21 is formed by resin-sealing power semiconductor elements such as an inverter, a thyristor, and a transistor, and has a heat sink mounting surface 23 to which a vertical heat sink 31 is mounted. The heat sink mounting surface 23 is a surface on which the vertical heat sink 31 is brought into close contact with each other via grease for improving thermal conductivity, and the heat generated by the semiconductor element propagates to the vertical heat sink 31 via the heat sink mounting surface 23. do.

The lead terminal 22 is a terminal connected to a wiring pattern on the circuit board 10. For example, the lead terminal 22 is soldered while being inserted into a through hole of the circuit board 10, conducts with a wiring pattern on the circuit board 10, and supports the component body 21 at a position away from the circuit board 10.

The heat sinks 30 to 33 are all heat radiating members, and a material having good thermal conductivity, for example, a metal material such as aluminum is used. The connection between the heat sinks 30 to 33 is performed by interposing a heat conductive grease between the joint surfaces and fastening the heat sinks with screws 40.

The water-cooled heat sink 30 is a substantially flat plate-shaped heat radiating member provided with a cooling pipe 40. The cooling pipe 40 is a pipe through which a heat medium such as cooling water flows, is arranged on the lower surface side of the water-cooled heat sink 30, and is used for exhaust heat. Since it is necessary to meander the cooling pipe 40 along the water-cooled heat sink 30 in order to obtain the desired heat exhaust effect, the water-cooled heat sink 30 has the surface on which the cooling pipe 40 is arranged as the main surface. It is formed in a substantially flat plate shape.

The water-cooled heat sink 30 is arranged so as to face the lower surface of the circuit board 10 and be substantially parallel to the water-cooled heat sink 30. Further, the circuit board 10 is supported by the water-cooled heat sink 30 via the spacer 41, and is separated from the water-cooled heat sink 30.

By arranging the water-cooled heat sink 30 below the circuit board 10, it is possible to prevent the heat medium leaking from the cooling pipe 40 from affecting the circuit board 10 and the electronic components 20. Further, since the circuit board 10 and the water-cooled heat sink 30 having a flat plate shape can be arranged in the same direction when viewed from the electronic component 20, the electronic component 20 can be arranged between the circuit board 10 and the water-cooled heat sink 30 as compared with the case where the electronic component 20 is sandwiched between the circuit board 10 and the water-cooled heat sink 30. The space utilization efficiency can be improved, and the electronic device 100 can be miniaturized.

The vertical heat sink 31 is a heat radiating member arranged so as to intersect with the circuit board 10. The illustrated vertical heat sink 31 is a columnar body having a rectangular cross section, is vertically erected on the upper surface side of the circuit board 10, and an electronic component 20 is attached to the side surface thereof.

The lower end of the vertical heat sink 31 is connected to the water-cooled heat sink 30 via the through hole 11 of the circuit board 10. Therefore, the heat of the electronic component 20 can be propagated to the water-cooled heat sink 30 at the shortest distance via the vertical heat sink 31. Therefore, higher heat dissipation efficiency can be obtained as compared with the case where the circuit board 10 wraps around the outside and is connected to the water-cooled heat sink 30.

The illustrated vertical heat sink 31 is composed of a main body portion 31A erected on the circuit board 10 and a connecting portion 31B provided at the lower end of the main body portion 31A. Both the main body portion 31A and the connecting portion 31B have a substantially square prism shape, but the cross-sectional area of the connecting portion 31B is smaller than that of the main body portion 31A, and a step is formed on the outer periphery of the vertical heat sink 31. The periphery of the through hole 11 of the circuit board 10 is fixed with a screw to the step surface 31C formed on the step.

The first heat sink 32 is a substantially flat plate-shaped heat radiating member arranged above the electronic component 20. The first heat sink 32 is arranged so as to face the upper surface of the circuit board 10 and be parallel to the first heat sink 32. Further, the upper end of the vertical heat sink 31 is connected to the lower surface of the first heat sink 32.

The second heat sink 33 is a heat-dissipating member that wraps around the outside of the circuit board 10 and connects the water-cooled heat sink 30 and the first heat sink 32 to each other. It has a tubular shape that surrounds the above, for example, a shape in which four substantially flat plates are connected to each other.

The upper end of the second heat sink 33 is connected to the peripheral edge of the lower surface of the first heat sink 32, and the lower end is connected to the peripheral edge of the upper surface of the water-cooled heat sink 30. Therefore, the heat propagated from the electronic component 20 to the vertical heat sink 31 not only propagates to the water-cooled heat sink 30 at the shortest distance, but also propagates to the water-cooled heat sink 30 through the first and second heat sinks 32 and 33. do. By increasing the number of heat propagation paths from the vertical heat sink 31 to the water-cooled heat sink 30 in this way, higher heat dissipation efficiency can be obtained as compared with the case where the first and second heat sinks 32 and 33 are not provided.

In the above embodiment, as a desirable configuration example, an example in which the first heat sink 32 has a flat plate shape and the second heat sink 33 has a tubular shape has been described, but the present invention is not limited to such a configuration. .. The first and second heat sinks 32 and 33 have any shape as long as they wrap around the outside of the circuit board 10 and provide a path for propagating the heat of the vertical heat sink 31 to the water-cooled heat sink 30. Can be adopted.

Further, in the above-described embodiment, an example in which the vertical heat sink 31 is a substantially quadrangular prism has been described as a desirable configuration example, but the present invention is not limited to such a configuration. The vertical heat sink 31 may have any shape as long as it provides two heat dissipation paths by attaching the electronic component 20 and connecting to the water-cooled heat sink 30 and the first heat sink 32. Can be done.

10 Circuit board 11 Through hole 20 Electronic component 21 Component body 22 Lead terminal 23 Heat sink mounting surface 30 Water-cooled heat sink 31 Vertical heat sink 31A Main body 31B Connecting part 31C Step surface 32 First heat sink 33 Second heat sink 40 Cooling pipe 41 Spacer 100 electronic devices

Claims (3)

A circuit board having a first main surface on which electronic components are arranged,
A water-cooled heat sink arranged to face the second main surface of the circuit board,
A vertical heat sink attached to the electronic component is provided.
A heat dissipation structure for an electronic device, wherein the vertical heat sink is connected to the water-cooled heat sink via a through hole in the circuit board. A first heat sink arranged to face the first main surface of the circuit board,
A second heat sink, which is arranged so as to wrap around the outside of the circuit board and connects the water-cooled heat sink and the first heat sink, is provided.
The heat dissipation structure for an electronic device according to claim 1, wherein one end of the vertical heat sink is connected to the water-cooled heat sink and the other end is connected to the first heat sink. The circuit board is arranged substantially horizontally.
The electronic component is arranged on the upper surface of the circuit board.
The heat dissipation structure of an electronic device according to claim 1 or 2, wherein the water-cooled heat sink is arranged on the lower surface side of the circuit board.

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