JP2021154442A - Electro-deposition band saw - Google Patents

Abstract

To provide an electro-deposition band saw that is good in edge sharpness, is superior in straightness during cutting, and is also capable of improving a lifetime.SOLUTION: An electro-deposition band saw 100 includes a base metal 1 formed of a metal flat plate shape endless band, and multiple abrasive grain layers 10 electrodeposited to one side edge part 2 of the base metal 1 along a longitudinal direction L of the base metal 1 by every predetermined interval. A thickness 10 t of the abrasive grain layer 10 in a thickness direction T of the base metal 1 is increased as separated from the other side edge part of the base metal 1. Also, a front view shape of a tip surface 11 of the abrasive grain layer 10 forms an elliptical shape (shape where the thickness 10 t of a central portion of the longitudinal direction L of the base metal 1 is thickest, and the thickness is decreased toward both end portions of longitudinal direction L smoothly, respectively). A shape of a region including the central portion of the longitudinal direction L of the base metal 1 on the tip surface 11 of the abrasive grain layer 10 forms a convex curved surface (circular arc-shape forming a convex in a direction apart from the base metal 1).SELECTED DRAWING: Figure 2

Description

The present invention relates to a segment type electrodeposition band saw used for cutting silicon ingots, carbons, ceramics, glass, magnetic materials and the like.

Segment-type electrodeposited band saws used when cutting silicon ingots and carbon have various structures and functions in the past for the purpose of improving sharpness, improving straightness during cutting, and extending the life of the band saw. However, as those related to the present invention, the "electroplated band saw" described in Patent Document 1, the "band saw" described in Patent Document 2, and the "band saw" described in Patent Document 3 are described. Electroplated band saw "and so on.

Japanese Unexamined Patent Publication No. 2002-18639 Jitsukaisho 62-15425 Japanese Patent No. 4397193

Although the "electroplated band saw" described in Patent Document 1, the "band saw" described in Patent Document 2, and the "electroplated band saw" described in Patent Document 3, each have excellent functions (performance). In the industrial field of cutting silicon ingots and carbon, there are high demands for improving sharpness, improving straightness during cutting, and reducing edge shavings even in recent years. It is requested. The Kobakake refers to a "chip" that occurs at the end of cutting of the object to be cut in the cutting operation of the object to be cut by the electrodeposition band saw.

Therefore, an object to be solved by the present invention is to provide an electrodeposited band saw having good sharpness, excellent straightness during cutting, and less fluff.

In order to solve the above problems, the electrodeposition band saw according to the present invention is used.
A base metal formed of a metal flat endless band and
One side edge of the base metal is provided with a plurality of abrasive grain layers electrodeposited at predetermined intervals along the longitudinal direction of the base metal.
The thickness of the abrasive grain layer in the thickness direction of the base metal increases as the distance from the other side edge of the base metal increases.
Moreover, the front view shape of the tip surface of the abrasive grain layer is an elliptical shape, an oval shape, a spindle shape, or a rounded quadrilateral shape.

In the electrodeposition band saw, it is desirable that the shape of the region including the central portion in the longitudinal direction of the base metal on the tip surface of the abrasive grain layer is a convex curved surface or a flat surface.

In the electrodeposited band saw, the distance from one side edge of the base metal to the tip surface of the abrasive grain layer exceeds twice the particle size of the abrasive grains contained in the abrasive grain layer and is four times or less. Is desirable.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an electrodeposition band saw having good sharpness, excellent straightness during cutting, and less fluff.

It is a partial perspective view which shows a part of the electrodeposition band saw which is embodiment of this invention. It is a partial front view of the electrodeposition band saw seen from the direction of arrow A in FIG. It is a partial side view of the electrodeposition band saw seen from the arrow line B direction in FIG. FIG. 3 is a partially omitted cross-sectional view taken along the line CC in FIG. It is a partial notch enlarged view of the abrasive grain layer shown in FIG. It is a front view which shows a part of the conventional electrodeposition band saw. It is a partial side view of the electrodeposition band saw seen from the arrow line D direction in FIG. It is a partially omitted perspective view which shows the outline of the cutting processing apparatus used in the cutting processing test of an electrodeposition band saw. It is a figure which shows the specification of the electrodeposition band saw used for the cutting process test. It is a figure which shows the specification of the cutting processing apparatus used for the cutting processing test, and the cutting processing test condition. It is a chart which shows the measurement result of the displacement amount in a cutting process test. It is a chart which shows the measurement result of the number of edge chips in a cutting process test. It is a front view which shows a part of the electrodeposition band saw which is another embodiment. It is a partial side view of the electrodeposition band saw seen from the arrow E direction in FIG. FIG. 6 is a partially omitted cross-sectional view taken along the line FF in FIG.

Hereinafter, the electrodeposition band saws 100 and 200 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 12.

First, the electrodeposition band saw 100 will be described with reference to FIGS. 1 to 5. As shown in FIG. 1, the electrodeposition band saw 100 has a base metal 1 formed of a flat metal flat endless band and one side edge portion 2 of the base metal 1 along the longitudinal direction L of the base metal 1. A plurality of abrasive grain layers 10 electrodeposited at predetermined intervals are provided. As shown in FIG. 4, the thickness 10t of the abrasive grain layer 10 in the thickness direction T of the base metal 1 increases as the thickness of the abrasive grain layer 10 increases away from the other side edge portion 3 of the base metal 1 (back taper shape).

Further, as shown in FIG. 2, the front view shape of the tip surface 11 of the abrasive grain layer 10 is elliptical (the thickness of the central portion of the base metal 1 in the longitudinal direction L is the thickest, and the thickness is 10t toward both ends in the longitudinal direction L. Each has a shape in which the thickness of 10 tons is continuously reduced).

Further, as shown in FIG. 3, in the electrodeposited band saw 100, the shape of the region including the central portion of the base metal 1 in the longitudinal direction L on the tip surface 11 of the abrasive grain layer 10 is a convex curved surface shape (arrow line in FIG. 1). When viewed from the B direction, it has an arc shape that is convex in the direction away from the base metal 1. That is, in the abrasive grain layer 10, the distance H from the side edge portion 2 of the base metal 1 to the tip surface 11 of the abrasive grain layer 10 is the largest at the central portion of the base metal 1 of the abrasive grain layer 10 in the longitudinal direction L. There, the number of the abrasive grain layers 10 decreases continuously toward both ends of the base metal 1 in the longitudinal direction L.

On the other hand, as shown in FIG. 5, in the electrodeposition band saw 100, from one side edge 2 of the base metal 1 to the tip surface 11 of the abrasive grain layer 10 (the tip of the abrasive grains 12 protruding from the surface of the bond 13). The distance H is more than twice and less than four times the particle size of the abrasive grains 12 contained in the abrasive grain layer 10. The particle size of the abrasive grains 12 is an average particle size obtained by measuring based on "classification by JISB4130 sieve".

Next, the test contents and test results of the cutting process test for comparing the cutting performance of the electrodeposited band saw 100 and the conventional electrodeposited band saw 50 shown in FIG. 1 will be described with reference to FIGS. 6 to 12.

First, a conventional electrodeposition band saw 50, which is a performance comparison target of the electrodeposition band saw 100, will be described with reference to FIGS. 6 and 7. As shown in FIG. 6, in the conventional electrodeposition band saw 50, the front view shape of the tip surface 52 of the abrasive grain layer 51 is a drum shape (the thickness 51t of the central portion of the base metal 1 in the longitudinal direction L is the thinnest, and the length is long. A shape in which the thickness 51t is continuously increased toward both ends in the direction L).

Further, as shown in FIG. 7, in the electrodeposited band saw 50, the shape of the region including the central portion of the base metal 1 in the longitudinal direction L on the tip surface 52 of the abrasive grain layer 51 is a concave curved surface shape. That is, the distance H from the side edge portion 2 of the base metal 1 to the tip surface 52 of the abrasive grain layer 51 is the smallest in the central portion of the base metal 1 of the base metal 1 in the longitudinal direction L, and the abrasive grain layer 10 The shape of the base metal 1 is continuously increased toward both ends of the base metal 1 in the longitudinal direction L.

Next, the cutting processing apparatus 30 used in the cutting processing test of the electrodeposition band saws 100 and 50 will be described with reference to FIG. In the cutting processing apparatus 30, a silicon ingot Si having a diameter of 200 mm is cut and processed by an electrodeposition band saw 100 (and a conventional electrodeposition band saw 50) that rotates while being bridged by a pair of pulleys 31 and 32. The amount of displacement of the cutting edge of the electrodeposited band saw inside was measured by the eddy current sensor 33, and the power consumption was measured by a power consumption meter (not shown).

FIG. 9 shows the dimensions, specifications, and electrodeposition patterns of the electrodeposition band saws 100 and 50 used in the cutting process test. The "diameter φ" and "pitch P" described in the electrodeposition pattern column at the bottom of FIG. 9 mean "φ" and "P" shown in FIG. 1, respectively.

FIG. 10 shows the contents of the cutting processing apparatus 30 shown in FIG. 8 and the conditions of the cutting processing test. The electrodeposition band saw 100 and the conventional electrodeposition band saw 50 were subjected to a cutting processing test under the conditions shown in FIG. 8, and the test results were compared and examined.

FIG. 11 shows the results of cutting a silicon ingot Si having a diameter of 200 mm with the electrodeposited band saws 100 and 50 and measuring the displacement amount of the cutting edge of the electrodeposited band saws 100 and 50 during the cutting process with the eddy current sensor 33. There is. The electrodeposited band saw 100 maintains a stable state in which the amount of displacement is small from the start of cutting to the number of cuts of 20, whereas the electrodeposited band saw 50 has the number of cuts of 5 after the start of cutting. Before reaching the limit, the amount of displacement became excessive and the test was discontinued.

As shown in FIG. 11, since the electrodeposition band saw 100 has a smaller displacement amount of the cutting edge during the cutting process than the conventional electrodeposition band saw 50, the straightness during the cutting process is good and the sharpness is also good. I understand. The reason is that, as shown in FIG. 2, the shape of the tip surface 11 of the abrasive grain layer 10 of the electrodeposition band saw 100 is smaller at both ends than the thickness of the central portion of the base metal 1 in the longitudinal direction L. Therefore, it is presumed that the resistance during the work cutting process is reduced and the straightness of the back taper shape of the abrasive grain layer 10 shown in FIG. 4 is exhibited.

FIG. 12 shows the measurement results of the number of edge chips of 0.75 mm or more generated per silicon wafer cut in the cutting process test. As shown in FIG. 12, when the conventional electrodeposition band saw 50 is used for cutting, about 10 pieces of fluff are generated per silicon wafer, whereas when the electrodeposition band saw 100 is used for cutting, about 10 silicon wafers are generated. It can be seen that only about 6 wafers are generated per hit.

The reason is that, as shown in FIG. 2 described above, the shape of the tip surface 11 of the abrasive grain layer 10 of the electrodeposition band saw 100 is the thickness of both end portions with respect to the thickness of the central portion of the base metal 1 in the longitudinal direction L. It is presumed that this is because the resistance at the time of cutting the work is small, the straightness of the back taper shape of the abrasive grain layer 10 shown in FIG. 4 is exhibited, and the load on the work is reduced.

Further, in the electrodeposition band saw 100, as shown in FIG. 5, the distance H from one side edge portion 2 of the base metal 1 to the tip surface 11 of the abrasive grain layer 10 is included in the abrasive grain layer 10. It is more than twice the particle size of 12 and less than four times. Therefore, the straightness can be maintained for a long time, which is also effective for improving the service life.

Next, the electrodeposition band saw 200, which is another embodiment, will be described with reference to FIGS. 13 and 14. As shown in FIG. 13, the electrodeposition band saw 200 has a base metal 1 formed of a flat metal flat endless band and one side edge portion 2 of the base metal 1 along the longitudinal direction L of the base metal 1. A plurality of abrasive grain layers 20 electrodeposited at predetermined intervals are provided. As shown in FIG. 15, the thickness 20t of the abrasive grain layer 20 in the thickness direction T of the base metal 1 increases as the distance from the other side edge portion 3 of the base metal 1 increases (back taper shape).

Further, as shown in FIG. 13, the front view shape of the tip surface 21 of the abrasive grain layer 20 is a four-sided rounded corner shape (excluding both ends of the base metal 1 in the longitudinal direction L, the thickness of the abrasive grain layer 20 is 20 t. The shape is equivalent along the longitudinal direction L of 1.

Further, as shown in FIG. 14, in the electrodeposited band saw 200, the shape of the region including the central portion of the base metal 1 in the longitudinal direction L on the tip surface 21 of the abrasive grain layer 20 is a planar shape (base of the abrasive grain layer 20). Except for both ends of the gold 1 in the longitudinal direction L, the shape is parallel to the side edge 2 of the base metal 1). That is, in the abrasive grain layer 20, the distance H from the side edge portion 2 of the base metal 1 to the tip surface 21 of the abrasive grain layer 20 is constant along the longitudinal direction L of the base metal 1 of the abrasive grain layer 10. ..

As shown in FIG. 13, the thickness 20t of the abrasive grain layer 20 of the electrodeposition band saw 200 is equivalent along the longitudinal direction L of the base metal 1, and as shown in FIG. 15, the abrasive grain layer 20 has a back taper shape. I'm doing it. Therefore, like the electrodeposition band saw 100, the resistance during the work cutting process is small, the straightness is excellent, and the sharpness is also good. Further, by reducing the resistance during the work cutting process, the original straightness of the back taper shape of the abrasive grain layer 20 shown in FIG. 15 is exhibited, and the load on the work is reduced, so that the occurrence of edge chipping is also reduced. Can be done.

Further, although not shown, in the electrodeposition band saw 200, the distance H from one side edge portion 2 of the base metal 1 to the tip surface 21 of the abrasive grain layer 20 is the distance H of the abrasive grains included in the abrasive grain layer 20. It is more than twice the particle size and less than four times. Therefore, the straightness can be maintained for a long time, which is also effective for improving the service life.

The electrodeposition band saws 100 and 200 described with reference to FIGS. 1 to 15 are examples of the electrodeposition band saw according to the present invention, and the electrodeposition band saw according to the present invention is the electrodeposition band saw 100 and 200 described above. Not limited to.

The electrodeposited band saw according to the present invention can be widely used in various industrial fields for cutting highly brittle materials such as silicon ingots, carbon, ceramics, glass, and magnetic materials.

1 Base metal 2,3 Side edge 10,20 Abrasive layer 10t, 20t Thickness 11,21 Tip surface 12 Abrasive 13 Bond 30 Cutting device 31,32 Pulley 100,200 Electroplated band saw H Distance L Longitudinal P pitch Si Silicon Ingot T Thickness Direction φ Diameter

In order to solve the above problems, the electrodeposition band saw according to the present invention is used.
A base metal formed of a metal flat endless band and
One side edge of the base metal is provided with a plurality of abrasive grain layers electrodeposited at predetermined intervals along the longitudinal direction of the base metal.
The thickness of the abrasive grain layer in the thickness direction of the base metal increases as the distance from the other side edge of the base metal increases.
And, a front view shape is an elliptical shape of the distal end surface of the abrasive grain layer, oval, Ri fusiform or rounded quadrilateral der,
Wherein the shape of the region containing the longitudinal center portion of the base metal at the tip surface of the abrasive layer, wherein the convex curved der Rukoto forming the convex in a direction away from the base metal.

In the electrodeposition band saw, the shape of the region including the central portion in the longitudinal direction of the base metal at the tip surface of the abrasive grain layer, Ru Oh a convex curved surface forming the projection in a direction away from the base metal.

Claims (3)

A base metal formed of a metal flat endless band and
One side edge of the base metal is provided with a plurality of abrasive grain layers electrodeposited at predetermined intervals along the longitudinal direction of the base metal.
The thickness of the abrasive grain layer in the thickness direction of the base metal increases as the distance from the other side edge of the base metal increases.
Further, an electrodeposition band saw in which the front view shape of the tip surface of the abrasive grain layer is an elliptical shape, an oval shape, a spindle shape, or a rounded quadrilateral shape. The electrodeposition band saw according to claim 1, wherein the shape of the region including the central portion in the longitudinal direction of the base metal on the tip surface of the abrasive grain layer is a convex curved surface shape or a flat shape. The first or second claim, wherein the distance from one side edge of the base metal to the tip surface of the abrasive grain layer is more than twice and four times or less the particle size of the abrasive grains contained in the abrasive grain layer. Electroplated band saw.

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