JP2021150312A - Mounting management device - Google Patents

Abstract

To provide a mounting management device capable of achieving an efficiency of a mounting processing by permitting a collection operation using adjacent holding members under a predetermined condition in components which may be interfered with each other.SOLUTION: A mounting management device comprises: a first determination part determining whether or not both interference regions are overlapped; a second determination part determining whether or not the interference of two components is avoided by setting a collection angle of the two components within a predetermined range, and at least one of the components can be mounted at a target mounting angle by a rotation of a holder within the predetermined range; and a setting part that assigns adjacent holding members to two times continuous collection operation.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mounting management device.

The mounting management device manages the mounting process of parts by the parts mounting machine. In the mounting process, the component mounting machine repeatedly executes a PP cycle of collecting components by a holding member such as a suction nozzle and mounting the components at a predetermined mounting position on the substrate. Patent Document 1 discloses a configuration in which the holding angle of a part is adjusted when the part held by the suction nozzle can interfere with another member. Further, Patent Document 1 discloses a configuration in which a collection operation using only one of a plurality of suction nozzles is executed in one PP cycle, and a collection operation by another suction nozzle is stopped.

International Publication No. 2016/135871

By the way, in order to increase the number of parts that can be mounted in one PP cycle, it is conceivable to increase the number of holding members supported by the mounting head. However, if the number of holding members is increased under the restriction on the dimensions of the mounting head, the distance between adjacent holding members becomes narrow, and there is a concern that the parts may interfere with each other depending on the size of the collected parts. At this time, if the collection operation using some of the holding members among the plurality of holding members is suspended, the number of executions of the PP cycle in the mounting process may increase, and as a result, the total required time may become longer.

An object of the present specification is to provide a mounting management device capable of improving the efficiency of mounting processing by allowing a sampling operation using adjacent holding members under predetermined conditions for parts that may interfere with each other. And.

The present specification is a mounting management device for managing the mounting process of parts by the component mounting machine, wherein the component mounting machine includes a plurality of holders to which holding members for holding the components can be mounted, and a plurality of the above. A mounting head that supports the holders so as to be able to move up and down at predetermined intervals and rotatably around the Q-axis, which is a rotation axis for each holder, and a predetermined mounting head that controls the operation of the mounting head in the mounting process and has a predetermined position with respect to the holding member. The mounting management device includes a sampling operation for collecting the parts at a sampling angle and a control device for executing a mounting operation for mounting the parts held by the holding member on a substrate at a predetermined mounting angle. In a state where the component is held by the holding member, the inside of the virtual circle passing through the outermost edge of the component around the Q axis is set as an interference region, and the two components corresponding to the two consecutive sampling operations are adjacent to each other. When the first determination unit that determines whether or not the interference regions overlap each other when held by the matching holding members and the first determination unit determines that the interference regions overlap each other. Interference between the two parts is avoided by keeping the sampling angles of the two parts within a predetermined range, and the rotation of the holder within the predetermined range causes at least one of the parts to be mounted at the target mounting angle. When it is determined by the second determination unit that determines whether or not the parts can be mounted and the second determination unit can avoid interference between the two parts and that the parts can be mounted at the target mounting angle. Disclosed is a mounting management device including a setting unit for assigning the holding member adjacent to the two consecutive sampling operations.

According to such a configuration, even if the interference regions overlap with each other, if the interference can be avoided by adjusting the sampling angle and the mounting can be performed at the target mounting angle, the mounting management devices are adjacent to each other. Allows sampling operations using matching holding members. As a result, it is possible to prevent interference between the parts and prevent the holding member from being excessively stopped during the mounting process. As a result, the efficiency of the mounting process can be improved.

It is a schematic diagram which shows the structure of the component mounting machine. It is the top view which shows typically the mounting head. It is a side view which shows typically the mounting head. It is a block diagram which shows the attachment management apparatus in 1st Embodiment. It is a schematic diagram which viewed a plurality of collected parts from the bottom. It is a figure which shows the control program and various information. It is a flowchart which shows the generation process of a control program. It is a flowchart which shows the mounting process by a component mounting machine. It is a block diagram which shows the attachment management apparatus in the modification of 1st Embodiment. It is a block diagram which shows the attachment management apparatus in 2nd Embodiment. It is a flowchart which shows the check process of a control program.

1. 1. Outline of the Mounting Management Device 70 of the First Embodiment The mounting management device 70 manages the mounting process of parts by the component mounting machine 10. In the present embodiment, the mounting management device 70 is an external device of the component mounting machine 10, and is incorporated in the production control device 60 that controls and manages the production line including the component mounting machine 10. Details of the mounting management device 70 will be described later.

2. Configuration of the component mounting machine 10 The component mounting machine 10 executes a mounting process for mounting components on a substrate and is used for producing a substrate product. The component mounting machine 10 constitutes a production line for producing board products together with a plurality of types of board-to-board working machines including, for example, another component mounting machine 10. The board-to-board working machine constituting the above-mentioned production line may include a printing machine, an inspection device, a reflow furnace, and the like.

As shown in FIG. 1, the component mounting machine 10 includes a board transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16. The substrate transfer device 11 sequentially conveys the substrate 91 in the transfer direction, and positions the substrate 91 at a predetermined position in the machine. The component supply device 12 supplies components to be mounted on the substrate 91. The component supply device 12 is equipped with a feeder 122 in each of the plurality of slots 121. To the feeder 122, for example, a tape feeder in which a carrier tape containing a large number of parts is fed and moved so that the parts can be collected can be applied.

The component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the substrate 91. The component transfer device 13 includes a head drive device 131, a moving table 132, and a mounting head 20. The head driving device 131 moves the moving table 132 in the horizontal direction (X direction and Y direction) by a linear motion mechanism. The mounting head 20 is detachably fixed to the moving table 132 by a clamp member (not shown), and is provided so as to be movable in the machine in the horizontal direction.

The mounting head 20 is provided so as to be movable in the machine in the horizontal direction by the head driving device 131. The mounting head 20 collects the parts supplied by the parts supply device 12 by using a holding member such as a suction nozzle 25. Then, the mounting head 20 rotates and lowers the holding member, and mounts the component at a predetermined mounting position on the substrate 91 at a predetermined mounting angle according to the holding state of the component by the holding member. The detailed configuration of the mounting head 20 will be described later.

The component camera 14 and the substrate camera 15 are digital image pickup devices having an image pickup element such as CMOS. The component camera 14 and the substrate camera 15 take an image based on the control signal and send out the image data acquired by the image pickup. The component camera 14 is configured so that the component held by the suction nozzle 25 can be imaged from below. The board camera 15 is provided on the moving table 132 so as to be movable in the horizontal direction integrally with the mounting head 20. The substrate camera 15 is configured so that the substrate 91 can be imaged from above.

The control device 16 is mainly composed of a CPU, various memories, and a control circuit. The control device 16 stores various data such as the control program M1 and the component information F2 used for controlling the mounting process. The control program M1 indicates a mounting position, a mounting angle, and a mounting order of the components mounted on the substrate 91 in the mounting process (see FIG. 6). The part information F2 includes shape data for each part. In addition to the shape data, the part information F2 may include, for example, the maximum allowable moving speed (acceleration) for each part, a sampling position (for example, a position in contact with the suction nozzle 25), and the like.

The control device 16 controls the operation of the mounting head 20 in the mounting process, and executes a PP cycle (pick and place cycle) including a plurality of collecting operations and a plurality of mounting operations. The above-mentioned "collecting operation" is an operation of collecting the parts supplied by the parts supply device 12 at a predetermined sampling angle with respect to the holding member. Further, the above-mentioned "mounting operation" is an operation of mounting the parts held by the holding member on the substrate 91 at a predetermined mounting angle.

Further, the control device 16 executes a process of recognizing the holding state of the parts held by each of the plurality of holding members. Specifically, the control device 16 performs image processing on the image data acquired by the imaging of the component camera 14 and recognizes the position and angle of each component with respect to the reference position of the mounting head 20. In addition to the component camera 14, the control device 16 performs image processing on image data acquired by, for example, a head camera unit integrally provided with the mounting head 20 capturing the component from the side, the lower side, or the upper side. You may try to do it.

3. 3. Configuration of Mounting Head 20 As shown in FIGS. 2 and 3, the mounting head 20 has a head body 21 that is detachably provided on the moving table 132. The mounting head 20 has a rotary head 22 that is rotatably provided around an R axis that extends in the vertical direction with respect to the head body 21. In this embodiment, the R axis is an axis parallel to the vertical axis. As shown in FIG. 2, the rotary head 22 supports a plurality of holders 23 on the same circumference at equal intervals. In this way, the mounting head 20 supports the plurality of holders 23 at predetermined intervals Nv (see FIG. 5).

The rotary head 22 supports the plurality of holders 23 so as to be able to move up and down and rotatably around the rotation axis (Q-axis) of each of the plurality of holders 23. Compression springs 24 are arranged on the outer peripheral side of the plurality of holders 23, respectively. The compression spring 24 urges the holder 23 upward with respect to the rotary head 22. As a result, each of the plurality of holders 23 is located at the rising end of a predetermined height in the initial state.

A holding member for holding the component 92 is attached to each of the plurality of holders 23. In the present embodiment, the holding member is a suction nozzle 25 that holds the component 92 by sucking the component 92 with the supplied negative pressure air. As the holding member, a chuck or the like that holds the component by gripping it can be adopted.

The mounting head 20 has an R-axis rotating device 30 that rotates the rotary head 22 around the R-axis. The R-axis rotating device 30 rotates the index shaft 32 by driving the R motor 31. The index shaft 32 is provided so as to be rotatable around the R axis integrally with the rotary head 22 with respect to the head main body 21. By determining the angle of the rotary head 22 at a predetermined angle around the R axis, the R-axis rotating device 30 determines an elevating position in which one holder 23 is elevated and lowered by the elevating device 50 described later.

The mounting head 20 has a Q-axis rotating device 40 that rotates a plurality of holders 23 around the Q-axis. In the present embodiment, the Q-axis rotating device 40 has a mechanism for interlocking and rotating a plurality of holders 23 around the Q-axis, and is shared for the rotation of the plurality of holders 23. The Q-axis rotating device 40 rotates the drive gear 42 via the reduction mechanism by driving the Q motor 41. The drive gear 42 is provided on the outer peripheral side of the index shaft 32. The drive gear 42 is formed so that the tooth muscle direction is the vertical direction.

A driven gear 43 fixed to the upper ends of a plurality of holders 23 meshes with the drive gear 42 so as to be slidable in the vertical direction. When the drive gear 42 is rotated by driving the Q-axis rotating device 40, all the driven gears 43 rotate around the Q-axis. According to the above configuration, when one holder 23 is angled to a predetermined angle around the Q axis by driving the Q-axis rotating device 40, the other plurality of holders 23 are interlocked to be angled to a predetermined angle. ..

Further, according to the above configuration, when the R-axis rotating device 30 is driven without driving the Q-axis rotating device 40, the rotary head 22 rotates relative to the drive gear 42 stationary with respect to the head body 21. do. Along with the rotation of the rotary head 22 around the R axis, the driven gear 43 that meshes with the drive gear 42 rotates. As a result, the plurality of holders 23 will rotate about the Q axis even when the R axis rotating device 30 is driven.

The mounting head 20 includes an elevating device 50 that elevates and lowers a part of a plurality of holders 23. In the present embodiment, the elevating device 50 elevates and elevates one holder 23 determined to a predetermined elevating position around the R axis by the rotation of the rotary head 22. The elevating device 50 operates the linear motion mechanism (not shown) by driving the Z motor 51 to move the pusher 52 in the Z direction. The pusher 52 comes into contact with the upper end portion of the holder 23 that is indexed to the elevating position by the rotation of the rotary head 22 around the R axis among the plurality of holders 23.

By lowering the holder 23, the elevating device 50 lowers the holder 23 against the elastic force of the compression spring 24. As a result, the suction nozzle 25 attached to the holder 23 descends integrally with the holder 23. When the pusher 52 moves upward, the holder 23 rises toward the rising end side due to the elastic force of the compression spring 24. The mounting head 20 may be provided with two or more elevating positions, and may adopt a configuration having a plurality of elevating devices that can be independently driven so that the holder 23 positioned at each position can be elevated.

The number of holders 23 supported by the mounting head 20 having the above configuration may differ depending on the type of mounting head 20. Further, the mounting head 20 may adopt various modes in addition to the mode in which the plurality of holders 23 are supported in an annular shape at equal intervals as in the present embodiment. For example, the mounting head 20 may adopt a mode in which the mounting head 20 supports a plurality of holders 23 arranged in a linear or matrix shape.

4. Production control device 60
The production control device 60 is a host computer that monitors the operating status of the production line including the component mounting machine 10 and controls the board-to-board working machine such as the component mounting machine 10. Various information is stored in the storage device 61 of the production control device 60. The storage device 61 is composed of an optical drive device such as a hard disk device, a flash memory, or the like.

In addition to the control program M1 and component information F2 described above, the storage device 61 stores product information F1 and component information F2. "Product information F1" includes design data of a substrate product produced by anti-board work such as mounting processing on a production line. The product information F1 may include the type, position, and angle of the component 92 mounted on the substrate 91, the required function and accuracy, and the like. The production control device 60 transmits various data such as the control program M1 when, for example, the component mounting machine 10 executes the component mounting process.

5. Mounting management device 70
The mounting management device 70 manages the mounting process of parts by the component mounting machine 10, and aims to improve the efficiency of the mounting process while maintaining the quality of the board product. As described above, the mounting process by the component mounting machine 10 includes a PP cycle that is repeatedly executed over a plurality of times. The PP cycle includes an operation in which the mounting head 20 moves between the component supply device 12 and the board 91 held by the board transfer device 11.

Therefore, from the viewpoint of improving the efficiency of the mounting process, it is desirable to apply a mounting head capable of collecting and mounting a larger number of parts 92 in order to reduce the number of PP cycles in the mounting process. For example, as shown in FIG. 2, a mounting head 20 that supports 24 holders 23 may be applied to the component mounting machine 10. As a result, a maximum of 24 parts 92 can be collected and mounted on the substrate 91 in one PP cycle.

On the other hand, the component mounting machine 10 is required to improve productivity per facility area in a limited production environment. From the above viewpoint, it is desired to reduce the size of the component mounting machine 10 including the mounting head 20. If the number of suction nozzles 25 that can be attached to the mounting head 20 is increased under such restrictions on the dimensions of the mounting head 20, the distance between the adjacent suction nozzles 25 becomes narrow.

In the mounting process using the mounting head 20 in which the distance between the adjacent suction nozzles 25 is narrow, if the size of the collected parts 92 is large, interference between the parts 92 may occur due to rotation around the Q axis. On the other hand, when a large-sized component 92 is to be mounted, the component 92 may be replaced with the corresponding mounting head 20, or the component 92 may be collected by, for example, every other suction nozzle 25 among the plurality of suction nozzles 25. It is expected that it will be installed.

However, using only a part of the plurality of suction nozzles 25 is substantially synonymous with reducing the number of suction nozzles 25 attached to the mounting head 20. As a result, if the number of executions of the PP cycle in the mounting process increases, the total required time may increase. Therefore, the mounting management device 70 of the present embodiment improves the efficiency of the mounting process by allowing the collection operation using the adjacent holding members (suction nozzles 25) under predetermined conditions for the parts 92 that may interfere with each other. Adopt a configuration that can be planned.

For example, even if the parts 92 can interfere with each other if they make one rotation around the Q axis while the parts 92 are held by the suction nozzles 25, the longitudinal direction of the parts 92 is the radial direction of the R axis. If collected so as to be, interference between the parts 92 can be avoided. Further, when the component 92 is collected so as to avoid interference as described above, the rotation angle of the component 92 in the mounting operation is limited. Therefore, one of the above-mentioned "predetermined conditions" is that the mounting management device 70 can mount the component 92 at a target mounting angle within the above restrictions.

5-1. First judgment unit 71
As shown in FIG. 4, the mounting management device 70 includes a first determination unit 71. Here, as shown in FIG. 5, in a state where the component 92 is held by the holding member (suction nozzle 25), the inside of the virtual circle Vc passing through the outermost edge of the component 92 about the Q axis is defined as the interference region Ai. The first determination unit 71 determines whether or not the interference regions Ai overlap each other when the two parts 92 corresponding to the two consecutive sampling operations are held by the adjacent holding members (suction nozzles 25). To judge.

Specifically, the first determination unit 71 first determines the distance between adjacent Q axes (that is, the distance Nv between the adjacent suction nozzles 25) based on the equipment information for each type of the mounting head 20 used in the mounting process. To get. Next, the first determination unit 71 acquires the interference region Ai for each of the plurality of parts 92, assuming that the Q axis coincides with the target sampling position of the parts 92 based on the part information F2. Then, the first determination unit 71 determines whether or not the interference regions Ai overlap each other when the two components 92 are held by the adjacent suction nozzles 25, respectively.

The above-mentioned "collecting position" is set, for example, to the center position, the center of gravity position, or the upper surface of the component 92 where a flat region is formed. The sampling position may be set near the edge farthest from the center of the component 92, for example, so that the interference region Ai is maximized. It should be noted that the first determination unit 71 may substantially obtain the result of whether or not the interference regions Ai overlap each other as described above, for example, the distances from the center of the two parts 92 to the outermost parts. When the sum is less than or equal to the distance between adjacent Q-axises, it may be determined that the interference regions Ai overlap with each other.

5-2. Second judgment unit 72
As shown in FIG. 4, the mounting management device 70 includes a second determination unit 72. When the first determination unit 71 determines that the interference regions Ai overlap with each other, the second determination unit 72 causes the two components 92 to interfere with each other by keeping the sampling angle Ck of the two components 92 within the predetermined range Ta. Determine if it is avoided. Further, the second determination unit 72 determines whether or not at least one component 92 can be attached at the target attachment angle by rotating the holder 23 within the predetermined range Ta.

Here, the “predetermined range Ta” of the above-mentioned collection angle Ck is an angle range in which adjacent parts 92 do not interfere with each other if the parts 92 are collected within the range, and the shapes and collection of the two parts 92. It varies depending on the position. As shown in FIG. 5, the boundary portion of the predetermined range Ta of the component 92 corresponds to the angle of the component 92 when the outermost portion of the component 92 is located at the intersection of the mutual interference regions Ai. In addition to the above, the predetermined range Ta is appropriately set in consideration of an allowable error and the like.

The second determination unit 72 may substantially obtain the result of whether or not the predetermined range Ta set as described above exists. For example, the second determination unit 72 may determine that interference between the two components 92 is avoided when the two components 92 are chip components of the same type. The chip component is formed in a rectangular shape when viewed from above. Therefore, for example, if the chip parts are collected so that the width direction of the chip parts coincides with the extending direction of the virtual line connecting the adjacent Q axes, it is possible to know in advance that interference does not occur between the two chip parts. can.

Here, when two components 92 are sampled at a sampling angle within the predetermined range Ta, the suction nozzle 25 holding these components 92 interferes until at least one component 92 is mounted on the substrate 91. In order to avoid the above, it becomes necessary to control the rotation around the Q axis so as to be within a predetermined range Ta. Therefore, the second determination unit 72 determines whether or not at least one component 92 can be mounted at the target mounting angle specified by the control program by rotating the holder 23 within a predetermined range Ta where rotation is allowed. do.

The second determination unit 72 may substantially obtain the result of whether or not at least one of the parts 92 can be mounted at the target mounting angle as described above. For example, the second determination unit 72 may determine that the two parts 92 can be mounted at the target mounting angle when the target mounting angles of the two parts 92 are the same. The second determination unit 72 determines that, for example, if the target mounting angles of the two parts 92 are the same, the amount of rotation of the holder 23 required for the mounting operation is sufficient to correct the sampling error. It may be simply determined that the 92 can be mounted.

5-3. Setting unit 73
As shown in FIG. 4, the mounting management device 70 includes a setting unit 73. The setting unit 73 allocates the holder 23 and the holding member (suction nozzle 25) used for the collecting operation and the mounting operation of the component 92 specified in the control program M1. In the present embodiment, when it is determined by the second determination unit 72 that the interference between the two components 92 is avoided and the component 92 can be mounted at the target mounting angle, the setting unit 73 is mounted twice in succession. A holding member (suction nozzle 25) adjacent to the collecting operation is assigned. As a result, for example, the two parts 92 that are continuously collected in the control program M1 are collected by using the suction nozzles 25 that are adjacent to each other in the PP cycle.

On the other hand, when the first determination unit 71 determines that the above conditions are not satisfied, the setting unit 73 is positioned in the middle of the three holding members (suction nozzles 25) that are continuous in two consecutive collection operations. Two holding members (suction nozzle 25) other than the holding member (suction nozzle 25) to be used are assigned. As a result, for example, the two parts 92 that are continuously collected in the control program M1 are collected by using every other suction nozzle 25 in the PP cycle. Then, in this PP cycle, the suction nozzle 25 located in the middle is not used for the collection operation and the mounting operation, and is suspended. As described above, the setting unit 73 sequentially assigns the suction nozzles 25 used for the continuous pair of collection operations in the control program M1.

Further, the setting unit 73 may be set to divide a large number of collecting operations and mounting operations into a plurality of PP cycles. More specifically, as shown in FIG. 6, the setting unit 73 first allocates a holding member for each pair of consecutive sampling operations in three or more sampling operations. Then, in the setting unit 73, the sum of the number of holding members assigned to the collecting operation and the number of resting holding members located between the two holding members and not assigned to any collecting operation is the mounting head. The collection operation and the attachment operation included in one PP cycle are set so as to be equal to or less than the number of holding members attached to 20.

Specifically, in the setting unit 73, the sum of the number of suction nozzles 25 (Bp) assigned to the collection operation and the number of paused suction nozzles 25 (Br) is equal to or less than the number of suction nozzles 25 (24). (Bp + Br ≦ 24), the collecting operation and the mounting operation are divided into a plurality of PP cycles. Therefore, if the dormant suction nozzle 25 is 0, the maximum number of parts 92 to be collected and mounted in one PP cycle is 24. On the other hand, when the suction nozzle 25 is assigned so that the parts 92 are collected every other part, the number of parts 92 collected and mounted in one PP cycle is halved to 12.

Further, when the setting unit 73 assigns adjacent holding members to two consecutive sampling operations under predetermined conditions, the rotation range of the holder 23 is determined in the mounting operation using one of the adjacent holding members. Set the rotation regulation so that it falls within the range Ta. As a result, the control device 16 of the component mounting machine 10 rotates the holder 23 and the suction nozzle 25 around the Q axis within a predetermined range Ta in accordance with the rotation regulation set by the setting unit 73 in the mounting operation, and the component 92 is moved. Install so that the target mounting angle is achieved.

When the control device 16 determines that it is necessary to rotate the holder 23 beyond a predetermined range Ta in order to mount the component 92 at the target mounting angle, the mounting operation is skipped and postponed. Or take measures such as notifying the worker to that effect. Further, after the mounting operation in which the rotation regulation is set (using one of the adjacent holding members) is completed, the setting unit 73 releases the rotation regulation in the mounting operation using the other of the adjacent holding members.

The above rotation regulation is set so that the parts 92 held by the two adjacent suction nozzles 25 can interfere with each other. Therefore, if one component 92 is mounted and one suction nozzle 25 does not hold the component 92, it is not necessary to regulate the rotation around the Q axis for the mounting operation using the other suction nozzle 25. .. Therefore, the setting unit 73 releases the rotation regulation when the above requirements are satisfied.

In addition, in three or more consecutive mounting operations (L1, L2, L3, ...), When one (L1) of the pair of mounting operations (L1, L2) is executed, the rotation restriction of the other (L2) is released. Even if this is done, rotation restrictions may be set for each of the following pair of mounting operations (L2, L3). In this case, for the other (L2) of the previous pair of mounting operations (L1, L2), the mounting head 20 is mounted according to the rotation regulation based on the predetermined range Ta corresponding to the next pair of mounting operations (L2, L3). Be controlled.

5-4. Command 74
As shown in FIG. 4, the mounting management device 70 includes a command unit 74. After the predetermined holding member (suction nozzle 25) is assigned to the collecting operation by the setting unit 73, the command unit 74 issues a control command in the mounting operation using the holding member. Specifically, the command unit 74 is a holder 23 that accompanies the rotation of the rotary head 22 around the R axis during the execution of the mounting process when the setting unit 73 assigns the holding members adjacent to each other for two consecutive sampling operations. The control device 16 is instructed to control the rotation of the holder 23 by the Q-axis rotation device 40 so as to cancel the rotation around the Q-axis.

Here, the mounting head 20 of the present embodiment has a structure in which when the rotary head 22 is rotated around the R axis, the plurality of holders 23 rotate around the R axis and also around the Q axis. However, when the rotary head 22 is rotated and the holder 23 is rotated around the Q axis in a state where the parts 92 that can interfere with each other are held by the adjacent suction nozzles 25 at a predetermined sampling angle, the angle of the parts 92 with respect to the head body 21 is changed. It fluctuates and the two parts 92 will interfere.

Therefore, when the command unit 74 rotates the rotary head 22 around the R axis while holding the two parts 92 as described above, the command unit 74 rotates the holder 23 around the Q axis along with the rotation around the R axis. The Q-axis rotating device 40 commands synchronous control to rotate the holder 23 in the opposite direction so as to cancel the above. As a result, the plurality of holders 23 rotate around the R axis while maintaining an angular relationship with each other. As a result, interference of the parts 92 held by the adjacent suction nozzles 25 is prevented during the rotation of the rotary head 22 around the R axis.

5-5. Program generator 75
As shown in FIG. 4, the mounting management device 70 includes a program generation unit 75. The program generation unit 75 generates the control program M1 based on the product information F1 and the component information F2. Specifically, the program generation unit 75 calculates the mounting order and the like of the parts 92 necessary for the production of the predetermined board product based on the product information F1. At this time, the program generation unit 75 determines the mounting order and the like from the viewpoint of improving the production efficiency and shortening the cycle time, for example, in consideration of the production environment and the like.

The control program M1 includes basic commands for the mounting position, mounting angle, and mounting order of the component 92, and various aspects may be applied to the mounting process. Specifically, the case where the mounting management device 70 specifies the holder 23 used for the collecting operation and the mounting operation based on the above basic command, and the designation of a plurality of PP cycles for classifying the collecting operation and the mounting operation, and the case where the mounting management device 70 is used. In some cases, the control program M1 is input to the component mounting machine 10.

Here, an embodiment in which the program generation unit 75 specifies the holder 23 and the PP cycle in addition to the basic command in advance will be illustrated. The program generation unit 75 adds information to the control program M1 so as to reflect the processing result of the setting unit 73. As a result, as shown in FIG. 6, the control program M1 includes allocation information D1 indicating a holding member (suction nozzle 25) assigned by the setting unit 73 for each collection operation for collecting the plurality of parts 92, respectively. ..

Further, in the present embodiment, when the command unit 74 commands the synchronization control during the execution of the mounting operation, the program generation unit 75 adds the synchronization command information D2 indicating the command to the control program M1. Similarly, when the rotation regulation is set for a predetermined mounting operation by the setting unit 73 and the rotation regulation is set to be released, the program generation unit 75 provides the rotation regulation information D3 indicating the rotation restriction or the release. Add to control program M1.

As a result, the control device 16 of the component mounting machine 10 collects the component 92 with the suction nozzle 25 designated by the control program M1 when executing the mounting process, and mounts the component 92 so as to appropriately implement the synchronous control and comply with the rotation regulation. Control the operation. When a collection error or the like occurs in the mounting process using the control program M1 as described above, the control device 16 can add necessary recovery processing or change the mounting order.

6. Program generation processing The generation processing of the control program M1 by the mounting management device 70 will be described with reference to FIG. 7. First, the program generation unit 75 inputs the product information F1 and the component information F2 from the storage device 61 (S11). Next, the program generation unit 75 sets the mounting position, mounting angle, and mounting order of the component 92 as basic commands based on the product information F1 and the component information F2 (S12). This mounting order coincides with the sampling order of the parts 92.

Subsequently, the first determination unit 71 determines whether the interference regions Ai overlap each other when the two parts 92 corresponding to the two consecutive sampling operations are held by the adjacent suction nozzles 25 in the basic command. Whether or not it is determined (S13). When the first determination unit 71 determines that the interference regions Ai overlap each other (S13: Yes), the second determination unit 72 determines whether or not the interference can be avoided and whether or not the interference regions Ai can be mounted at the target mounting angle (S13: Yes). S14).

When it is determined by the second determination unit 72 that the interference between the two components 92 is avoided and the component 92 can be mounted at the target mounting angle (S14: Yes), the setting unit 73 is the first determination unit. When it is determined by 71 that the interference regions Ai do not overlap each other (S13: No), the suction nozzles 25 adjacent to each other are assigned to the two consecutive sampling operations (S15). As a result, as shown in FIG. 6, the allocation information D1 of the suction nozzle 25 is added to the basic command.

Further, the setting unit 73 sets the rotation regulation for the pair of mounting operations corresponding to these pair of collecting operations so that the synchronization command and the rotation range of the holder 23 fall within the predetermined range Ta (S16). As a result, as shown in FIG. 6, synchronization command information D2 and rotation regulation information D3 are added to the basic command. Further, when the first determination unit 71 determines that the interference regions Ai do not overlap with each other (S13: No), the setting unit 73 determines the synchronization command and the rotation regulation for the pair of mounting operations corresponding to these (S13: No). Omit the setting.

On the other hand, the setting unit 73 is continuous 2 when it is determined by the second determination unit 72 that the interference between the two components 92 cannot be avoided or that the component 92 cannot be mounted at the target mounting angle (S14: No). Two suction nozzles 25 other than the suction nozzle 25 located in the middle of the three suction nozzles 25 that are continuous in the collection operation are assigned (S17). As a result, as shown in FIG. 6, the allocation information D1 of the suction nozzle 25 is added to the basic command.

Subsequently, as shown in FIG. 6, the setting unit 73 assigns the sum of the number of suction nozzles 25 (Bp) assigned to the collection operation and the number of suction nozzles 25 (Br) to be paused (Ba =). Bp + Br), and it is determined whether the allocated number (Ba) is equal to or greater than the number (Ln) of the suction nozzles 25 (S21). When the allocated number (Ba) becomes equal to or greater than the number (Ln) of the suction nozzles 25 (S21: Yes), the setting unit 73 performs a PP cycle in which the collecting operation and the mounting operation corresponding to the allocated number (Ba) are performed once. And reset the allocation number (S22).

On the other hand, when the allocated number (Ba) is less than the number (Ln) of the suction nozzles 25 (S21: No), or after setting one PP cycle (S22), the mounting management device 70 uses the mounting management device 70. For all the collecting operation and the mounting operation, when the allocation of the suction nozzle 25 is not completed (S23: No), the above process (S13-S22) is repeatedly executed. The mounting management device 70 stores the control program M1 including the basic command and various information (D1-D3) when the allocation of the suction nozzles 25 is completed (S23: Yes) for all the collecting operations and the mounting operations. Store in, and end the program generation process.

7. Mounting process by the component mounting machine 10 The mounting process by the component mounting machine 10 will be described with reference to FIG. First, as shown in FIG. 8, the substrate transfer device 11 executes the carry-in process of the substrate 91 (S31). As a result, the substrate 91 is carried into the machine and is positioned at a predetermined position in the machine. The control device 16 repeatedly executes the collection operation included in the current PP cycle based on the control program M1 (S32). At this time, the control device 16 uses the suction nozzle 25 assigned by the setting unit 73 and collects the component 92 at a collection angle of a predetermined range Ta.

Subsequently, the control device 16 executes a process of recognizing the holding state of the parts held by the plurality of suction nozzles 25 (S33). The control device 16 repeatedly executes the mounting operation a plurality of times based on the result of the recognition process (S33) (S34). In the mounting operation, the control device 16 executes mounting movement and mounting rotation so that the component 92 is mounted at a predetermined mounting position designated by the control program M1 at a predetermined mounting angle.

At this time, the control device 16 controls the mounting operation according to the synchronization command and the rotation regulation set for the mounting operation. On the other hand, the control device 16 is normally mounted when there is no synchronization command or the rotation regulation is released for the mounting operation corresponding to the remaining parts 92 held during the execution of the PP cycle, for example. Switch to operation control.

The control device 16 determines whether or not all the PP cycles have been completed based on the control program M1 (S35). If all the PP cycles have not been completed (S35: No), the control device 16 repeatedly executes the PP cycles (S32-S34). When all the PP cycles are completed (S35: Yes), the control device 16 executes the unloading process of the substrate 91 (S36). In the unloading process of the substrate 91, the substrate transport device 11 unclamps the positioned substrate 91 and unloads the substrate 91 out of the component mounting machine 10.

8. Effect of the configuration of the first embodiment According to such a configuration, even when the interference regions Ai overlap each other, it is possible to avoid interference by adjusting the sampling angle, and it is possible to mount the device at the target mounting angle. If so, the mounting management device 70 allows a sampling operation using adjacent holding members (suction nozzles 25). As a result, it is possible to prevent the parts 92 from interfering with each other, and it is possible to prevent the holding member (suction nozzle 25) from being excessively stopped during the mounting process. As a result, the efficiency of the mounting process can be improved.

9. Modification of the first embodiment 9-1. Mounting Head 20 In the first embodiment, the mounting head 20 has a Q-axis rotating device 40 that rotates a plurality of holders 23 in conjunction with each other. On the other hand, the mounting head 20 may have a plurality of rotating devices that rotate each of the plurality of holders 23 about the Q axis independently of each other. However, from the viewpoint of miniaturization and cost reduction of the mounting head 20, the embodiment illustrated in the first embodiment is preferable.

9-2. About the mounting management device In the first embodiment, the mounting management device 70 is configured to be incorporated in the production control device 60 which is an external device of the component mounting machine 10. On the other hand, a part or all of the functions of the mounting management device may be incorporated into the control device 16 of the component mounting machine 10, and the remaining functions may be incorporated into the external device. For example, as shown in FIG. 9, the mounting management device 170 may be configured to be incorporated in the control device 116 of the component mounting machine 110. In this embodiment, the control program M1 includes basic commands for mounting position, mounting angle, and mounting order of the component 92, and does not include allocation information D1, synchronization command information D2, and rotation regulation information D3.

The mounting management device 170 includes a first determination unit 71, a second determination unit 72, a setting unit 73, and a command unit 74. Since each part is substantially the same as the first embodiment, detailed description thereof will be omitted. In the mounting management device 170, the setting unit 73 sets the plurality of parts 92 based on the control program M1 for designating the mounting positions and mounting orders of the plurality of parts 92 and the part information F2 including the shape data for each of the plurality of parts 92. A holding member (suction nozzle 25) is assigned to each sampling operation.

According to this aspect, the control program M1 is input with the designation of the holder 23 used for the collection operation and the mounting operation based on the basic command of the control program M1 and the designation of a plurality of PP cycles for classifying the collection operation and the mounting operation. This is performed by the mounting management device 170 incorporated in the control device 116 of the component mounting machine 110. Further, the command unit 74 of the mounting management device 170 sets synchronization commands and rotation restrictions as necessary. According to such a configuration, the same effect as that of the first embodiment is obtained.

10. Mounting management device 270 of the second embodiment
The mounting management device 270 manages the mounting process of parts by the component mounting machine 10. Here, in the first embodiment, an embodiment in which adjacent holding members or every other holding member is assigned to each collecting operation is illustrated based on a predetermined condition for two consecutive collection operations in the mounting process. Then, when the holding member is assigned for each collecting operation as described above, the allocation information D1 is added to the control program M1.

By the way, it is assumed that the allocation information D1 is manually generated by the operator in addition to being automatically generated by the mounting management device 70. For example, when the control program M1 is generated, the operator can know the size of the parts based on the part information F2 and can determine that interference between the parts may occur. In this case, the operator can generate the allocation information D1 and set the above parts so that they are not collected by the adjacent holding members.

Further, the allocation information D1 is a holding member together with a PP cycle setting based on the type of the mounting head 20 mounted on the component mounting machine 10 when the component mounting machine 10 executes the mounting process based on the control program M1. Can be generated by making an assignment of. As described above, in the allocation information D1 generated by the operator or the component mounting machine 10, it is considered that the holding member is assigned with priority given to the prevention of interference.

However, in the allocation information D1 generated as described above, it may not be clear whether the interference between the parts can be surely avoided due to the oversight of the operator or the like. Therefore, the mounting management device 270 of the present embodiment adopts a configuration in which the control program M1 including the allocation information D1 is checked before the mounting process is executed, and whether or not each collection operation can be executed is determined. In this embodiment, as shown in FIG. 10, a mode in which the mounting management device 270 is incorporated into the component mounting machine 210 will be described as an example.

10-1. First judgment unit 271
The mounting management device 270 includes a first determination unit 271. The first determination unit 271 interferes with each other when the two parts 92 corresponding to the two consecutive sampling operations are held by the two holding members (suction nozzles 25) assigned by the allocation information D1. Determine if Ai overlaps. That is, when the first determination unit 271 executes two consecutive collection operations based on the control program M1 including the allocation information D1, it determines whether the parts 92 collected by these operations can interfere with each other.

10-2. Second judgment unit 272
The mounting management device 270 includes a second determination unit 272. When the first determination unit 271 determines that the interference regions Ai overlap with each other, the second determination unit 272 determines whether or not interference can be avoided and whether or not the second determination unit 272 can be mounted at the target mounting angle. Since the second determination unit 272 is substantially the same as the second determination unit 72 of the first embodiment, detailed description thereof will be omitted.

10-3. Operation judgment unit 276
The mounting management device 270 includes an operation determination unit 276. The operation determination unit 276 executes two consecutive sampling operations when it is determined by the second determination unit 272 that the interference between the two parts 92 is avoided and that the parts 92 can be mounted at the target mounting angle. Allow. When the operation determination unit 276 permits the execution of two consecutive collection operations, the operation determination unit 276 may allow the execution by omitting the notification process and the error process to the operator, which will be described later, or the collection operation. Execution permission may be recorded for each control program M1 or for each control program M1.

10-4. Notification unit 277
The mounting management device 270 includes a notification unit 277 in the present embodiment. The notification unit 277 determines that the interference between the two parts 92 cannot be avoided by the second determination unit 272 or that the component 92 cannot be mounted at the target mounting angle, and the motion judgment unit 276 makes two consecutive sampling operations. If the execution of is not permitted, the notification process is executed for the worker. Specifically, the notification unit 277 notifies the worker that there is an abnormality in the allocation information D1 of the control program M1 in the notification process.

In the notification process, the notification unit 277 may specify a command corresponding to the two collection operations determined to be abnormal in the control program M1 and notify the specific information together. Further, the notification unit 277 guides the operator to change the holding member to be assigned, change the mounting order, and the like in order to avoid interference of the parts 92 and enable the mounting operation at the target mounting angle. May be good. As a result, the operator can appropriately edit the control program M1 based on the content of the notification by the notification unit 277.

11. Check processing of the control program M1 The check processing of the control program M1 by the mounting management device 270 will be described with reference to FIG. First, the mounting management device 270 inputs the control program M1 including the allocation information D1 to be checked and the component information F2 (S41). Next, when the first determination unit 71 holds two parts 92 corresponding to two consecutive sampling operations in the basic command by the two suction nozzles 25 assigned by the allocation information D1, each other It is determined whether or not the interference regions Ai overlap (S42).

When the first determination unit 71 determines that the interference regions Ai overlap each other (S42: Yes), the second determination unit 72 determines whether or not the interference can be avoided and whether or not the interference regions Ai can be mounted at the target mounting angle (S42: Yes). S43). When it is determined by the second determination unit 72 that the interference between the two components 92 is avoided and the component 92 can be mounted at the target mounting angle (S43: Yes), or when the first determination unit 71 interferes with each other. When it is determined that the regions Ai do not overlap (S42: No), the operation determination unit 276 permits the execution of two consecutive collection operations (S44). As a result, the execution of the mounting operation corresponding to the collection operation is also permitted.

The mounting management device 270 repeatedly executes the above-mentioned processing (S42-S44) for all the collecting operations and the mounting operations when the execution permission / rejection determination is not completed (S45: No). As a result, the operation determination unit 276 determines whether or not to execute each of the collection operations for collecting the plurality of parts 92 in the mounting process scheduled to be executed by using the control program M1 (S44).

The mounting management device 270 ends the check process of the control program M1 when the execution permission / rejection determination is completed (S45: Yes) for all the collecting operations and the mounting operations. Further, when the second determination unit 72 determines that the interference between the two parts 92 cannot be avoided or that the component 92 cannot be mounted at the target mounting angle (S43: No), the notification unit 277 executes the notification process. (S46).

According to such a configuration, the mounting management device 270 checks the control program M1 including the allocation information D1 before executing the mounting process, and determines whether or not each collecting operation can be executed. Thereby, when the holding member (suction nozzle 25) is not properly set for the collection operation by the allocation information D1, the execution of the mounting process using the control program M1 can be restricted.

12. Modification of the second embodiment 12-1. About the mounting management device In the second embodiment, the mounting management device 270 is configured to be incorporated in the component mounting machine 210. On the other hand, a part or all of the functions of the mounting management device 270 may be incorporated into the external device of the component mounting machine 210, and the remaining functions may be incorporated into the component mounting machine 210. In that case, for example, the above check process can be executed when the control program M1 is generated by the operator in the external device or when the control program M1 is transmitted from the external device to the component mounting machine.

12-2. Check processing of the control program M1 In the second embodiment, the mounting management device 270 targets the control program M1 including the allocation information D1 as a check target. On the other hand, when the control program M1 includes the synchronization command information D2 and the rotation regulation information D3, the mounting management device 270 also checks whether or not these information are appropriate. You may.

Further, the mounting management device 270 determines whether or not interference between the parts 92 occurs when the mounting process according to the allocation information D1 is executed in the second embodiment. On the other hand, in the mounting management device 270, when every other holding member is set for two consecutive sampling operations, these sampling operations can be performed under predetermined conditions (interference avoidance and target mounting). The operator may be informed that it is possible to assign two adjacent holding members when satisfying (which can be mounted at an angle). As a result, the operator is informed that there is room for improving the efficiency of the mounting process, and can be urged to edit the allocation information D1.

Further, the check process of the control program M1 by the mounting management device 270 is executed at an appropriate timing. Specifically, the check process may be executed when the component mounting machine 210 inputs the control program M1 from the production control device 60 or when the mounting process using the control program M1 is executed. Further, when a part of the functions of the mounting management device 270 is in the external device, the check process may be executed, for example, when the control program M1 is generated.

10,110,210: Parts mounting machine, 13: Parts transfer device, 16,116,216: Control device, 20: Mounting head, 21: Head body, 22: Rotary head, 23: Holder, 24: Compression spring, 25: Suction nozzle (holding member), 30: R-axis rotating device, 40: Q-axis rotating device, 50: Elevating device, 60: Production control device, 70, 170, 270: Mounting control device, 71,271: First Judgment unit, 72, 272: Second judgment unit, 73: Setting unit, 74: Command unit, 75 Program generation unit, 276: Operation judgment unit, 277: Notification unit, 91: Board, 92: Parts, M1: Control program , D1: Allocation information, D2: Synchronization command information, D3: Rotation control information, F1: Design information, F2: Parts information, Ck: Collection angle, Ta: Predetermined range, Vc: Virtual circle, Ai: Interference area, Nv: Spacing (between holders)

Claims (15)

It is a mounting management device that manages the mounting process of parts by the parts mounting machine.
The parts mounting machine is
A plurality of holders to which holding members for holding the parts can be attached, and
A mounting head that supports a plurality of the holders so as to be able to move up and down at predetermined intervals and rotatably around the Q axis, which is a rotation axis for each holder.
In the mounting process, the operation of the mounting head is controlled to collect the component at a predetermined sampling angle with respect to the holding member, and the component held by the holding member is mounted on the substrate at a predetermined mounting angle. Equipped with a control device that executes the mounting operation,
The mounting management device is
In a state where the component is held by the holding member, the inside of the virtual circle passing through the outermost edge of the component around the Q axis is set as an interference region, and the two components corresponding to the two consecutive sampling operations are A first determination unit that determines whether or not the interference regions overlap each other when held by the adjacent holding members, respectively.
When the first determination unit determines that the interference regions overlap with each other, the interference between the two parts is avoided by keeping the sampling angles of the two parts within a predetermined range, and the interference between the two parts is within the predetermined range. A second determination unit that determines whether or not at least one of the parts can be mounted at the target mounting angle by rotating the holder in the above.
When it is determined by the second determination unit that the interference between the two parts is avoided and the parts can be mounted at the target mounting angle, the holding member adjacent to the two consecutive sampling operations. And the setting part to assign
A mounting management device equipped with. The mounting head
With the head body
A rotary head that is rotatably provided around the R axis extending in the vertical direction with respect to the head body and supports a plurality of the holders on the same circumference at equal intervals.
The mounting management device according to claim 1. The mounting head
An R-axis rotating device that rotates the rotary head around the R-axis, and
A Q-axis rotating device that rotates a plurality of the holders in conjunction with each other around the Q-axis,
2. The mounting management device according to claim 2. In the mounting management device, when the setting unit allocates the holding member adjacent to the two consecutive sampling operations, the holder is accompanied by rotation of the rotary head around the R axis during execution of the mounting process. The mounting management device according to claim 3, further comprising a command unit that commands the control device to control the rotation of the holder by the Q-axis rotating device so as to cancel the rotation around the Q-axis. The mounting according to any one of claims 1-4, wherein the second determination unit determines that interference between the two components is avoided when the two components are chip components of the same type. Management device. The second determination unit determines that the two parts can be mounted at the target mounting angle when the mounting angles of the targets of the two parts are the same. The mounting management device according to any one of -5. In the setting unit, the first determination unit determines that the interference regions overlap with each other, and the second determination unit does not avoid interference between the two components, or the components are mounted at the target mounting angle. Any of claims 1-6, in which, when it is determined that it is not possible, two holding members other than the holding member located in the middle of the three holding members consecutive to the two consecutive collection operations are assigned. The mounting management device described in item 1. In the mounting process, the control device executes a PP cycle including the collection operation a plurality of times and the mounting operation a plurality of times.
The setting unit allocates the holding member for each pair of continuous collecting operations in the three or more collecting operations, and is located between the number of the holding members assigned to the collecting operation and the two holding members. The PP cycle is included in one PP cycle so that the sum of the number of the holding members in the pause not assigned to any of the collecting operations is equal to or less than the number of the holding members attached to the mounting head. The mounting management device according to claim 7, wherein the collecting operation and the mounting operation are set. When the holding members adjacent to each other are assigned to the two consecutive collection operations, the rotation range of the holder falls within the predetermined range in the mounting operation using one of the adjacent holding members. The mounting management device according to any one of claims 1 to 8, wherein the rotation regulation is set as described above. The mounting management device according to claim 9, wherein the setting unit releases the rotation regulation in the mounting operation using the other of the adjacent holding members after the mounting operation in which the rotation regulation is set is completed. The mounting management device generates a control program for designating mounting positions and mounting orders of a plurality of the components based on product information including design data of the board product and component information including shape data for each of the plurality of components. With a program generator
The control program according to any one of claims 1-10, wherein the control program includes allocation information indicating the holding member assigned by the setting unit for each collection operation for collecting a plurality of the parts. Mounting management device. The mounting management device is incorporated in the component mounting machine, and is based on a control program for designating mounting positions and mounting orders of the plurality of components and component information including shape data for each of the plurality of components. The mounting management device according to any one of claims 1 to 10, wherein the holding member is assigned to each of the collecting operations for collecting a plurality of the parts. It is a mounting management device that manages the mounting process of parts by the parts mounting machine.
The parts mounting machine is
A plurality of holders to which holding members for holding the parts can be attached, and
A mounting head that supports a plurality of the holders so as to be able to move up and down at predetermined intervals and rotatably around the Q axis, which is a rotation axis for each holder.
In the mounting process, the operation of the mounting head is controlled based on a control program that specifies the mounting position and mounting order of the plurality of the parts, and the parts are picked at a predetermined sampling angle with respect to the holding member. A control device for executing a mounting operation for mounting the component held by the holding member on the substrate at a predetermined mounting angle is provided.
The control program includes allocation information indicating the holding member assigned for each collection operation for collecting a plurality of the parts.
The mounting management device is
In a state where the component is held by the holding member, the inside of the virtual circle passing through the outermost edge of the component around the Q axis is set as an interference region, and the two components corresponding to the two consecutive sampling operations are A first determination unit that determines whether or not the interference regions of each other overlap when each of the two holding members assigned by the allocation information is held.
When the first determination unit determines that the interference regions overlap with each other, the interference between the two parts is avoided by keeping the sampling angles of the two parts within a predetermined range, and the interference between the two parts is within the predetermined range. A second determination unit that determines whether or not at least one of the parts can be mounted at the target mounting angle by rotating the holder in the above.
When it is determined by the second determination unit that the interference between the two parts is avoided and the parts can be mounted at the target mounting angle, the operation of permitting the execution of the sampling operation twice in succession. Judgment unit and
A mounting management device equipped with. In the mounting management device, it is determined by the second determination unit that interference between the two components cannot be avoided or that the component cannot be mounted at the target mounting angle, and the operation determination unit is continuously performed twice. The mounting management device according to claim 13, further comprising a notification unit for notifying the operator that the allocation information of the control program is abnormal when the execution of the collection operation is not permitted. The mounting management device is incorporated in the component mounting machine.
The mounting according to claim 13 or 14, wherein the operation determining unit determines whether or not to execute each of the collecting operations for collecting a plurality of the parts in the mounting process scheduled to be executed by using the control program. Management device.

Images