JP2021144965A - Electronic device - Google Patents

Abstract

To provide an electronic device with a novel configuration which can further suppress temperature rise of an electronic component.SOLUTION: An electronic device 1A comprises: an electronic component 20 which transmits or receives an electric signal; a substrate 10 having a first surface on which the electronic component is mounted; a cover which has a first surface 10a and a second surface 10b that faces the electronic component with an interval therefrom, and which covers the first surface and the electronic component; and a heat transfer member 40, interposed between the substrate and the cover 30, which is provided so as to make contact with the first surface, the second surface, and the electronic component. For example, the heat transfer member is provided so as to make surface-contact with each of the first surface, the second surface, and the electronic component.SELECTED DRAWING: Figure 1

Description

The present invention relates to electronic devices.

Conventionally, there is known an electronic device in which a heat transfer member is interposed between an electronic component mounted on a substrate and a case covering the electronic component (Patent Document 1). According to such a configuration, the heat generated in the electronic component can be transferred to the case via the heat transfer member, and the temperature rise of the electronic component can be suppressed.

Special Table 2017-536993

This type of electronic device is used, for example, for signal processing in information communication and sensing technology, but with the further integration of electronic components and the miniaturization of the electronic components, it is necessary to further improve the efficiency of heat dissipation performance. Has been done. Therefore, it would be beneficial if the temperature rise of electronic components could be further suppressed.

Therefore, one of the problems of the present invention is, for example, to obtain an electronic device having a novel configuration capable of further suppressing a temperature rise of an electronic component.

The electronic device of the present invention faces, for example, an electronic component that transmits or receives an electric signal, a substrate having a first surface on which the electronic component is mounted, and the first surface and the electronic component separated from each other. A cover having a second surface and covering the first surface and the electronic component is interposed between the substrate and the cover so as to be in contact with the first surface, the second surface, and the electronic component. It is provided with a heat transfer member to be arranged.

Further, in the electronic device, for example, the heat transfer member is arranged so as to be in surface contact with the first surface, the second surface, and the electronic component, respectively.

Further, in the electronic device, for example, the cover is arranged between the first surface and the second surface, and has an inner peripheral surface configured to surround at least one of the electronic components. The heat transfer member is arranged so as to be in contact with the inner peripheral surface.

Further, in the electronic device, for example, the heat transfer member is arranged so as to make surface contact with the inner peripheral surface.

Further, in the electronic device, for example, the substrate has a conductor exposed on the first surface, and the heat transfer member is in contact with the conductor.

Further, in the electronic device, for example, the conductor is a ground conductor.

Further, in the electronic device, for example, the substrate has a transmission line for the electric signal, and the transmission line passes through the substrate and is arranged so as to be separated from the heat transfer member.

Further, in the electronic device, for example, the transmission line is arranged so as to pass through the substrate and be separated from the heat transfer member in a region where the heat transfer member is in contact with the second surface.

Further, in the electronic device, for example, the heat transfer member has flexibility and intervenes in a compressed state between the first surface and the electronic component and the second surface.

Further, in the electronic device, for example, the heat transfer member has a first portion in contact with the first surface and a second portion in contact with the electronic component, and the thickness of the first portion is In the uncompressed state between the first surface and the electronic component and the second surface, the thickness is greater than or equal to the thickness of the second portion.

Further, in the electronic device, for example, the heat transfer member has a plurality of laminated members laminated in a direction intersecting the first surface.

Further, in the electronic device, for example, the heat transfer member has a plurality of laminated members laminated in a direction intersecting the first surface, and the first portion has more than the second portion. Laminated members are laminated.

Further, in the electronic device, for example, the electronic component has a terminal through which the electric signal is transmitted, and the heat transfer member is provided with a recess for providing a gap between the electronic component and the terminal.

Further, in the electronic device, for example, the heat transfer member is a gel.

Further, in the electronic device, for example, the cover has a protrusion protruding from the second surface toward the first surface.

Further, in the electronic device, for example, the protrusion projects from the second surface toward the first surface so as to press the heat transfer member against the first surface.

Further, in the electronic device, for example, the protrusion has a third surface that is thermally connected to the first surface.

Further, in the electronic device, for example, the third surface comes into contact with the first surface.

According to the present invention, since the heat transfer member is interposed between the substrate and the cover in a state of being in contact with the first surface, the second surface, and the electronic component, the heat generated by the electronic component causes the heat transfer member. It will be transmitted to a wider range through the above, and the temperature rise of the electronic component can be further suppressed.

FIG. 1 is an exemplary and schematic cross-sectional view showing the internal configuration of the electronic device of the first embodiment. FIG. 2 is an exemplary and schematic cross-sectional view showing the internal configuration of the electronic device of the second embodiment. FIG. 3 is an exemplary and schematic cross-sectional view showing the internal configuration of the electronic device of the third embodiment. FIG. 4 is an exemplary and schematic cross-sectional view showing the internal configuration of the electronic device of the fourth embodiment. FIG. 5 is an exemplary and schematic side view of the heat transfer member of the fifth embodiment. FIG. 6 is an exemplary and schematic cross-sectional view showing the internal configuration of the electronic device of the sixth embodiment.

Hereinafter, exemplary embodiments of the present invention will be disclosed. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by the configurations, are examples. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Further, according to the present invention, it is possible to obtain at least one of various effects (including derivative effects) obtained by the configuration.

The embodiments shown below have similar configurations. According to the configuration of each embodiment, similar actions and effects based on the similar configuration can be obtained. Further, in the following, the same reference numerals are given to those similar configurations, and duplicate explanations may be omitted.

In this specification, ordinal numbers are given for convenience in order to distinguish parts, parts, etc., and do not indicate priorities or orders.

Further, in each figure, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X, Y, and Z directions intersect and are orthogonal to each other. The X direction and the Y direction are also referred to as a horizontal direction or an in-plane direction, and the Z direction may also be referred to as a thickness direction, a height direction, a vertical direction, a normal direction, or an out-of-plane direction.

[First Embodiment]
FIG. 1 is a side view showing an internal configuration of the electronic device 1A of the first embodiment. As shown in FIG. 1, the electronic device 1A includes a substrate 10, an electronic component 20, a cover 30, and a heat transfer member 40.

The substrate 10 has an insulating layer 11 and a conductor 12. The substrate 10 is a multilayer substrate. Further, the substrate 10 is a rigid substrate. However, the present invention is not limited to this, and the substrate 10 may be a single-sided substrate, a double-sided substrate, or a flexible substrate.

The substrate 10 extends intersecting and orthogonal to the Z direction. The substrate 10 has a substantially constant thickness in the Z direction and extends in the X and Y directions. The substrate 10 has, for example, a quadrangular shape and a plate shape.

The substrate 10 has a surface 10a and a surface 10b.

The surface 10a faces the Z direction, intersects and is orthogonal to the Z direction. The electronic component 20 is mounted on the surface 10a. Therefore, the surface 10a can also be referred to as a mounting surface or a surface. The surface 10a is an example of the first surface.

Further, the surface 10b faces in the opposite direction to the Z direction, intersects with the Z direction, and is orthogonal to the Z direction. The electronic component 20 is not mounted on the surface 10b. The surface 10b may also be referred to as the back surface.

The insulating layer 11 is made of, for example, ceramic or epoxy glass.

The conductor 12 is made of a conductive metal material such as copper or gold. The conductor 12 has layered conductors 12a1 to 12a4 intersecting and orthogonal to the Z direction, and penetrating conductors 12b1 to 12b3 extending in the Z direction. The through conductors 12b1 to 12b3 are, for example, through holes and vias. The through conductors 12b1 to 12b3 may be any as long as they partially extend in the Z direction between the surfaces 10a and 10b of the substrate 10, and do not necessarily extend between the surfaces 10a and 10b of the substrate 10. It does not have to be.

The electronic component 20 is mounted on the surface 10a. In the present embodiment, the electronic component 20 is a surface mount component (chip component) as an example. However, the present invention is not limited to this, and the electronic component 20 may be a through-hole mounting component (a component with a lead).

The electronic component 20 has a body 21 and a terminal 22.

The body 21 has a surface 21a, a surface 21b, and a surface 21c.

The surface 21a faces the opposite direction of the Z direction, intersects and is orthogonal to the Z direction. The surface 21a faces the surface 10a. The surface 21a may also be referred to as the back surface or the bottom surface.

The surface 21a may be provided with a heat radiating portion thermally connected to a pad provided on the surface 10a of the substrate 10 separately from the terminal 22. Further, an underfill may be filled between the surface 21a and the surface 10a.

The surface 21b faces the Z direction, intersects and is orthogonal to the Z direction. The surface 21b may also be referred to as a surface or top surface.

The surface 21c is along the Z direction between the surfaces 21a and 21b, intersecting and orthogonal to the surfaces 21a and 21b. However, the present invention is not limited to this, and the surface 21c may be a bent surface. The surface 21c may also be referred to as a side surface.

In this embodiment, the terminal 22 is provided on the surface 21b as an example. However, the present invention is not limited to this, and the terminal 22 may protrude from the surface 21c, for example.

The electronic component 20 is a high-frequency component that transmits or receives a high-frequency signal such as an RF (radio frequency) signal, a high-speed digital signal, or a clock. The electronic component 20 is, for example, an RF module. A signal processing unit for transmitting and receiving signals is provided in the body 21 of the electronic component 20.

In the present embodiment, the high-frequency signal terminals 22a of the two electronic components 20 are respectively joined to the layered conductor 12a1 by, for example, soldering, and are electrically connected. The layered conductor 12a1 may also be referred to as a pad.

Further, the high frequency signal terminals 22a of the two electronic components 20 are electrically connected via the layered conductor 12a1, the through conductor 12b1, the layered conductor 12a2, the through conductor 12b2, and the layered conductor 12a2. In the substrate 10, the layered conductor 12a1, the through conductor 12b1, the layered conductor 12a2, the through conductor 12b2, and the layered conductor 12a2 constitute a high frequency signal transmission line 12R.

The cover 30 covers the surface 10a of the substrate 10 and the electronic component 20. The cover 30 has a top wall 31 and a peripheral wall 32.

The top wall 31 intersects and extends orthogonally to the Z direction. The top wall 31 has a quadrangular and plate-like shape. When viewed in the Z direction, the peripheral edge 31a of the top wall 31 and the peripheral edge 10c of the substrate 10 overlap each other.

The peripheral wall 32 projects from the peripheral edge 31a of the top wall 31 in the opposite direction in the Z direction, and extends endlessly along the peripheral edge 31a. The peripheral edge 32a as the end portion of the peripheral wall 32 in the opposite direction in the Z direction extends along the surface 10a of the substrate 10. In the present embodiment, as an example, the peripheral edge 32a and the peripheral edge 10c of the surface 10a overlap each other in the Z direction and are in contact with each other. The peripheral edge 32a and the peripheral edge 10c of the surface 10a are joined to each other.

As shown in FIG. 1, the cover 30 is provided with a recess 30a surrounded by a top wall 31 and a peripheral wall 32 and opened in the opposite direction in the Z direction. By covering the substrate 10 with the cover 30, the electronic device 1A is surrounded by the surface 10a of the substrate 10, the surface 31b as the bottom surface of the recess 30a, and the surface 32b as the inner peripheral surface of the recess 30a. Twenty containment chambers R are provided. The surface 32b is arranged, for example, between the surface 10a and the surface 31b. The cover 30 may be configured to include the peripheral edge 10c of the substrate 10. In this case, the surface 32b may be configured to cover the peripheral edge 10c or may be configured to abut the peripheral edge 10c. good.

The surface 31b faces in the opposite direction to the Z direction, and faces the surface 10a of the substrate 10 and the electronic component 20 at a distance from each other, that is, at a distance from each other. The surface 31b intersects and is orthogonal to the Z direction. The surface 31b is an example of the second surface.

The cover 30 is made of a conductive and thermally conductive metal conductor such as an aluminum alloy or a copper alloy. Therefore, the cover 30 has a function of transferring the heat generated by the electronic component 20 via the substrate 10 and the heat transfer member 40 described later to lower the temperature of the electronic component 20, and also serves as an electromagnetic shield that shields electromagnetic waves. Function.

Further, in the accommodation chamber R, a heat transfer member 40 is accommodated together with the electronic component 20. The heat transfer member 40 is, for example, a flexible and elastic silicon-based heat conductive sheet. The heat transfer member 40 is housed in the storage chamber R in an elastically compressed state. In such a case, the heat transfer member 40 having a thickness equal to or larger than the width between the surface 10a of the substrate 10 and the surface 31b of the cover 30 is pressed against the surface 10a of the substrate 10 and the surface 31b of the cover 30. Therefore, it is preferable that the material is stored in the storage chamber R in an elastically compressed state. The heat transfer member 40 is interposed between the surfaces 10a of the substrate 10, the surfaces 21b and 21c of the electronic component 20, and the surfaces 31b and 32b of the cover 30, and is in contact with and in close contact with these surfaces 10a, 21b, 21c, 31b and 32b. It is arranged and housed in a state of being. The heat transfer member 40 is preferably in close contact with any surface, but is in surface contact with these surfaces 10a, 21b, 21c, 31b, 32b (for example, a range of 80% or more of each surface is the heat transfer member 40. (In contact).

With such a configuration, the heat transfer member 40 transfers the heat generated by the electronic component 20 to the cover 30 through the surfaces 31b and 32b, and also transfers it to the substrate 10 through the surface 10a.

Here, a layered conductor 12a3 is provided at a portion of the surface 10a that is in contact with the heat transfer member 40. The layered conductor 12a3 is exposed on the surface 10a. The layered conductor 12a3 is electrically connected to the layered conductor 12a4 provided on the surface 10b via the through conductor 12b3. The conductor 12 is made of a metal material and has higher thermal conductivity than the insulating layer 11.

Further, the layered conductor 12a3, the through conductor 12b3, and the layered conductor 12a4 are ground conductors maintained at the ground potential. The layered conductor 12a3 is an example of the conductor 12 exposed on the surface 10a.

Further, among the transmission lines 12R through which high-frequency signals pass, the through conductor 12b1, the layered conductor 12a2, and the through conductor 12b2 are arranged so as to be separated from the heat transfer member 40. In the present embodiment, the through conductor 12b1, the layered conductor 12a2, and the through conductor 12b2 pass through the substrate 10 in a region where the heat transfer member 40 is in contact with the surface 31b (a region substantially parallel to the XY plane) and the heat transfer member 40. Separate. The through conductor 12b1, the layered conductor 12a2, and the through conductor 12b2 are examples of non-contact portions.

As described above, in the present embodiment, the heat transfer member 40 is in contact with the surface 10a (first surface) of the substrate 10, the surface 31b (second surface) of the cover 30, and the electronic component 20. It is interposed between the substrate 10 and the cover 30 to transfer heat from the electronic component 20.

According to such a configuration, the heat transfer member 40 can transfer the heat from the electronic component 20 not only to the cover 30 but also to the substrate 10. Therefore, according to the present embodiment, the heat from the electronic component 20 can be transferred to the cover 30 from a wider range as compared with the case where the heat is transferred only to the cover 30, so that the temperature of the electronic component 20 rises. Can be further suppressed.

Further, in the present embodiment, for example, the heat transfer member 40 is in contact with the surface 32b (inner peripheral surface) of the cover 30.

According to such a configuration, for example, the heat transfer member 40 can transfer the heat from the electronic component 20 to the inner peripheral surface 32b of the cover 30 to transfer the heat to the cover 30 from a wider range. Therefore, the temperature rise of the electronic component 20 can be further suppressed.

Further, in the present embodiment, for example, the substrate 10 has a layered conductor 12a3 (conductor 12) exposed on the surface 10a, and the heat transfer member 40 is in contact with the layered conductor 12a3.

According to such a configuration, for example, the heat transfer member 40 can transfer the heat from the electronic component 20 to the conductor 12, so that the heat from the electronic component is transferred only to the insulating layer 11. In comparison, heat is more easily transferred, and as a result, the temperature rise of the electronic component 20 can be further suppressed.

Further, in the present embodiment, for example, the layered conductor 12a3 is electrically, that is, with the layered conductor 12a4 (conductor 12) exposed on the surface 10b opposite to the surface 10a via the through conductor 12b3 (conductor 12). Mechanically and thermally connected.

According to such a configuration, for example, the heat transferred from the heat transfer member 40 to the conductor 12 can be transferred from the layered conductor 12a4 to the atmosphere, so that the temperature rise of the electronic component 20 can be further suppressed. Can be done.

Further, in the present embodiment, for example, the layered conductor 12a3 is a ground conductor.

According to such a configuration, for example, the ground conductor can be effectively used as the conductor 12 for transferring heat. Further, for example, the ground conductor generally has a larger volume than the signal conductor and can transfer heat to a wider range, so that the temperature rise of the electronic component 20 can be further suppressed. There is something you can do.

Further, in the present embodiment, for example, the substrate 10 has a transmission line 12R for an electric signal, and the transmission line 12R passes through the substrate 10 and is a non-contact portion that does not come into contact with the heat transfer member 40, and is a layered conductor 12a2 and a through conductor. It has 12b1 and 12b2.

According to such a configuration, for example, the impedance change of the transmission line 12R due to the proximity to the heat transfer member 40 can be avoided at the non-contact portion, so that the deterioration of the signal on the transmission line 12R is suppressed. It's easy to do.

Further, in the present embodiment, for example, the heat transfer member 40 has flexibility and is interposed between the surface 10a and the electronic component 20 and the surface 31b in a compressed state.

According to such a configuration, for example, the heat transfer member 40 and the substrate 10, the electronic component 20, and the cover 30 are in close contact with each other, so that the amount of heat transferred through the heat transfer member 40 is further increased. As a result, the temperature rise of the electronic component 20 can be further suppressed.

Further, in the present embodiment, for example, the heat transfer member 40 may be a gel.

According to such a configuration, for example, by injecting gel into the accommodation chamber R or placing the cover 30 on the substrate 10 with the gel applied, the surfaces 10a, 31b, and the electronic component 20 are formed. The electronic device 1A provided with the heat transfer member 40 in contact with the heat transfer member 40 can be realized relatively easily.

[Second Embodiment]
FIG. 2 is a side view showing the internal configuration of the electronic device 1B of the second embodiment. As shown in FIG. 2, the cover 30 of the electronic device 1B has a surface 32b (second surface) of the top wall 31 of the cover 30 to a surface 10a (first surface) of the substrate 10 between the two electronic components 20. It has a protrusion 31c that protrudes toward. The protrusion 31c may project from the surface 32b toward the surface 10a so as to press the heat transfer member 40 against the surface 10a, for example.

With such a configuration, for example, it is possible to reduce variations in the thickness of the heat transfer member 40 depending on the location, so that the heat transfer member 40 can be relatively easily manufactured so as to have a substantially constant thickness. When the heat transfer member 40 is housed in the storage chamber R in an elastically compressed state, it is possible to suppress the stress generated in the heat transfer member 40 from fluctuating depending on the location, or the surface of the surface 10a of the substrate 10 at a portion adjacent to the protrusion 31c. Advantages such as increasing the pressure and increasing the amount of heat transfer to the surface 10a can be obtained.

[Third Embodiment]
FIG. 3 is a side view showing the internal configuration of the electronic device 1C of the third embodiment. As shown in FIG. 3, the cover 30 of the electronic device 1C is also directed from the surface 32b of the top wall 31 of the cover 30 to the surface 10a of the substrate 10 between the two electronic components 20 as in the second embodiment. It has a protrusion 31c that protrudes from the surface.

However, in the present embodiment, the tip of the protrusion 31c, in other words, the end surface 31c1 of the end in the opposite direction in the Z direction, is mechanically and thermally in contact with the surface 10a of the substrate 10. The electronic device 1C of the present embodiment has the same configuration as the electronic device 1B of the second embodiment except that the end surface 31c1 is in contact with the surface 10a.

The end surface 31c1 is thermally connected to the surface 10a and the layered conductor 12a3. In this case, the end face 31c1 may be joined to the layered conductor 12a3 by, for example, soldering, or a heat conductive sheet having flexibility between the end face 31c1 and the surface 10a (layered conductor 12a3). A heat transfer member may intervene. The end face 31c1 is an example of the third face.

Further, the layered conductor 12a3 is connected to the layered conductor 12a4 provided in a state of being exposed on the surface 10b via the through conductor 12b3 as in the first embodiment.

As described above, in the present embodiment, the protrusion 31c has an end surface 31c1 (third surface) that is in contact with or in close contact with the surface 10a (first surface) and is thermally connected to the surface 10a. ing.

According to such a configuration, for example, the heat generated by the electronic component 20 can be further transferred to the substrate 10 via the heat transfer member 40 and the cover 30. Therefore, since heat can be transferred to a wider range, the temperature rise of the electronic component 20 may be further suppressed.

Further, in the present embodiment, the end surface 31c1 is in contact with the layered conductor 12a3 (conductor 12) exposed on the surface 10a, and the layered conductor 12a3 is further exposed to the surface 10b via the through conductor 12b3 (conductor 12). It is electrically connected to the conductor 12a4 (conductor 12), that is, mechanically and thermally.

According to such a configuration, for example, the heat transferred from the cover 30 to the conductor 12 can be transferred from the layered conductor 12a4 to the atmosphere, so that the temperature rise of the electronic component 20 can be further suppressed. ..

Further, since the protrusion 31c functions as an electromagnetic shield, there is an advantage that mutual interference between the two electronic components 20 via the electromagnetic wave can be suppressed.

[Fourth Embodiment]
FIG. 4 is a side view showing the internal configuration of the electronic device 1D of the fourth embodiment. As shown in FIG. 4, in the present embodiment, both the surfaces 10a and 10b of the substrate 10 are mounting surfaces on which the electronic component 20 is mounted. The electronic device 1D includes a surface 10b and a cover 30 that covers the electronic component 20 mounted on the surface 10b.

A layered conductor 12a4 is provided at the center of the substrate 10 in the Z direction (thickness direction). The electronic device 1D has a structure symmetrical with respect to the virtual plane Pv passing through the center of the layered conductor 12a4, and the configuration on the upper side (surface 10a side) of the layered conductor 12a4 is the same as that of the second embodiment. Is. That is, the electronic device 1D has a so-called double-sided mounting configuration. However, the electronic device 1D does not have to have a plane-symmetrical structure. Even in the electronic device 1D of the present embodiment, the same effect as that of the second embodiment can be obtained.

[Fifth Embodiment]
FIG. 5 is a side view of the heat transfer member 40E of the fifth embodiment. The heat transfer member 40E of FIG. 5 is applied to the electronic device 1A of the first embodiment. FIG. 5 shows a free state not housed in the electronic device 1A.

As shown in FIG. 5, the heat transfer member 40E is configured by laminating a plurality of heat conductive sheets 41 in the Z direction (direction intersecting the surface 10a) and joining them by adhesion or the like. The heat conductive sheet 41 is, for example, a silicon-based heat conductive sheet having flexibility and elasticity. The heat conductive sheet 41 is an example of a laminated member.

According to such a configuration, for example, the heat transfer member 40E can be manufactured relatively easily.

Further, in the present embodiment, the heat transfer member 40E has a first portion 40a and a second portion 40b. As is clear from comparing FIG. 5 with FIG. 1, the first portion 40a is a portion in contact with the surface 10a, and the second portion 40b is a portion in contact with the electronic component 20. Then, in the free state shown in FIG. 5, that is, in the state where the heat transfer member 40E is not compressed between the surface 10a (first surface) and the electronic component 20 and the surface 31b (second surface) of the cover 30. The thickness T1 of the first portion 40a is equal to or greater than the thickness T2 of the second portion 40b, and is larger than the thickness T2 in the present embodiment.

According to such a configuration, for example, the shape of the heat transfer member can be easily designed according to the surface shape of the circuit board 10 and the arrangement of the electronic components 20. Further, for example, there is an advantage that the stress generated in the heat transfer member 40E compressed between the substrate 10 and the cover 30 can be suppressed from being scattered depending on the location. Further, for example, as compared with the case where the thickness of the heat transfer member is constant, the required surface pressure due to the pressing of the heat transfer member 40E is secured on the surface 10a of the substrate 10, and the required heat from the heat transfer member 40E to the surface 10a is secured. The advantage is that it becomes easier to secure the transportation volume.

Further, in the present embodiment, in the first portion 40a, more of the laminated members are laminated than in the second portion 40b.

According to such a configuration, for example, a heat transfer member 40E having a first portion 40a and a second portion 40b having different thicknesses can be relatively easily manufactured.

[Sixth Embodiment]
FIG. 6 is a side view showing the internal configuration of the electronic device 1F of the sixth embodiment. As is clear from a comparison between FIGS. 6 and 1, the electronic device 1F of the present embodiment is different from the electronic device 1A of the first embodiment except that the heat transfer member 40F is provided with a recess 40c. It has the same configuration.

The recess 40c is provided at a portion in contact with the surface 10a of the heat transfer member 40F and the surface 21c of the body 21 of the electronic component 20. The recess 40c prevents the heat transfer member 40F from coming into contact with the high frequency signal terminal 22a of the electronic component 20.

According to such a configuration, for example, the impedance change of the transmission line 12R due to the proximity to the heat transfer member 40F can be avoided at the non-contact portion, so that the signal deterioration in the transmission line 12R is further improved. It can be further suppressed.

Although the embodiments of the present invention have been exemplified above, the above-described embodiment is an example and is not intended to limit the scope of the invention. The above-described embodiment can be implemented in various other forms, and various omissions, replacements, combinations, and changes can be made without departing from the gist of the invention. In addition, specifications such as each configuration and shape (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) are changed as appropriate. Can be carried out.

1A to 1D, 1F ... Electronic device 10 ... Substrate 10a ... Surface (first surface, mounting surface, surface)
10b ... front side (back side)
10c ... Peripheral 11 ... Insulating layer 12 ... Conductor 12a1 ... Layered conductor (transmission line)
12a2 ... Layered conductor (transmission line, non-contact part)
12a3 ... Layered conductor (ground conductor)
12a4 ... Layered conductor (ground conductor)
12b1 ... Through conductor (transmission line, non-contact part)
12b2 ... Through conductor (transmission line, non-contact part)
12b3 ... Through conductor (ground conductor)
12R ... Transmission line 20 ... Electronic component 21 ... Body 21a ... Front surface (back surface, bottom surface)
21b ... Surface (surface, top surface)
21c ... Surface (side surface)
22 ... Terminal 22a ... Terminal 30 ... Cover 30a ... Recess 31 ... Top wall 31a ... Peripheral 32b ... Surface (inner peripheral surface)
31c ... Protrusion 31c1 ... End face (third surface)
32 ... Peripheral wall 32a ... Peripheral 31b ... Surface (second surface, bottom surface)
40, 40E, 40F ... Heat transfer member 40a ... First part 40b ... Second part 40c ... Recessed 41 ... Heat conduction sheet Pv ... Virtual plane R ... Containment chamber T1 ... (First part) Thickness T2 ... (Second part) (Part) Thickness X ... Direction Y ... Direction Z ... Direction

Claims (18)

Electronic components that send or receive electrical signals
A substrate having a first surface on which the electronic components are mounted and
A cover having the first surface and a second surface separated from the electronic component and covering the first surface and the electronic component.
A heat transfer member that is interposed between the substrate and the cover and is arranged so as to be in contact with the first surface, the second surface, and the electronic component.
Equipped with electronic equipment. The electronic device according to claim 1, wherein the heat transfer member is arranged so as to be in surface contact with the first surface, the second surface, and the electronic component, respectively. The cover is arranged between the first surface and the second surface, and has an inner peripheral surface configured to surround at least one of the electronic components.
The electronic device according to claim 1 or 2, wherein the heat transfer member is arranged so as to be in contact with the inner peripheral surface. The electronic device according to claim 3, wherein the heat transfer member is arranged so as to make surface contact with the inner peripheral surface. The substrate has a conductor exposed on the first surface.
The electronic device according to any one of claims 1 to 4, wherein the heat transfer member is in contact with the conductor. The electronic device according to claim 5, wherein the conductor is a ground conductor. The substrate has a transmission line for the electrical signal.
The electronic device according to any one of claims 1 to 6, wherein the transmission line passes through the substrate and is arranged so as to be separated from the heat transfer member. The electronic device according to claim 7, wherein the transmission line is arranged so as to pass through the substrate and be separated from the heat transfer member in a region where the heat transfer member is in contact with the second surface. The heat transfer member has flexibility and is interposed between the first surface and the electronic component and the second surface in a compressed state, according to any one of claims 1 to 8. The electronic device described. The heat transfer member is
The first part in contact with the first surface and
It has a second part in contact with the electronic component, and has
The thickness of the first portion is equal to or greater than the thickness of the second portion in an uncompressed state between the first surface and the electronic component and the second surface, according to claim 9. Electronics. The electronic device according to claim 9 or 10, wherein the heat transfer member has a plurality of laminated members laminated in a direction intersecting the first surface. The heat transfer member has a plurality of laminated members laminated in a direction intersecting the first surface.
The electronic device according to claim 10, wherein more of the laminated members are laminated in the first portion than in the second portion. The electronic component has a terminal on which the electric signal is transmitted.
The electronic device according to any one of claims 10 to 12, wherein the heat transfer member is provided with a recess for providing a gap between the heat transfer member and the terminal. The electronic device according to any one of claims 1 to 13, wherein the heat transfer member is a gel. The electronic device according to any one of claims 1 to 14, wherein the cover has a protrusion protruding from the second surface toward the first surface. The protrusion projects from the second surface toward the first surface so as to press the heat transfer member against the first surface.
The electronic device according to claim 15. The electronic device according to claim 15 or 16, wherein the protrusion has a third surface that is thermally connected to the first surface. The electronic device according to claim 12, wherein the third surface is in contact with the first surface.

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