JP2021128528A - 情報処理装置、及び、情報処理装置の製造方法 - Google Patents
情報処理装置、及び、情報処理装置の製造方法 Download PDFInfo
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- JP2021128528A JP2021128528A JP2020022597A JP2020022597A JP2021128528A JP 2021128528 A JP2021128528 A JP 2021128528A JP 2020022597 A JP2020022597 A JP 2020022597A JP 2020022597 A JP2020022597 A JP 2020022597A JP 2021128528 A JP2021128528 A JP 2021128528A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
- G06K7/0056—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers housing of the card connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5213—Covers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
【解決手段】情報処理装置は、電子機器、第1の接点及びピン穴を有する基板と、前記第1の接点と接触する第2の接点、前記第2の接点に接続されるタンパ検知用の配線であるタンパ検知配線、寸法公差を許容する貫通穴、及び、前記基板の前記ピン穴に対応する位置決めピンを有し、前記基板上の前記電子機器及び前記第1の接点を覆うカバーと、前記基板及び前記カバーを収容するケースと、を備え、前記カバーは、前記貫通穴に挿入された所定のネジによって前記ケースの裏面に取り付けられ、前記位置決めピンによって前記基板の前記ピン穴に対して位置決めされる。
【選択図】図2
Description
<決済端末>
図1は、本実施の形態に係る決済端末の構成例を示す図であり、(a)上面図、(b)側面図、(c)正面図である。
図2は、本実施の形態に係る情報処理装置の構成例を示す図であり、情報処理装置を斜め上から見た分解斜視図である。図3は、本実施の形態に係る情報処理装置の構成例を示す図であり、情報処理装置を斜め下から見た分解斜視図である。次に、図2及び図3を参照して、情報処理装置について詳細に説明する。
(工程1)製造者は、保護カバー130の貫通穴136A、136Bの位置をケース140のネジ穴141A、141Bの位置に合わせる。
(工程2)製造者は、段付きネジ150を貫通穴136A、136Bに挿入して、ネジ穴141A、141Bに螺号することにより、保護カバー130をケース140に取り付ける。
(工程3)製造者は、保護カバー130の位置決めピン137を基板120のピン穴122に挿入させて、基板120と、保護カバー130及びケース140とを組み立てる。
本開示に係る情報処理装置(100)は、電子機器、第1の接点(121)及びピン穴(122A、122B)を有する基板(120)と、前記第1の接点と接触する第2の接点(134)、前記第2の接点に接続されるタンパ検知用の配線であるタンパ検知配線、寸法公差を許容する貫通穴(136A、136B)、及び、前記基板の前記ピン穴に対応する位置決めピン(137A、137B)を有し、前記基板上の前記電子機器及び前記第1の接点を覆うカバー(130)と、前記基板及び前記カバーを収容するケース(140)と、を備え、前記カバーは、前記貫通穴に挿入された所定のネジによって前記ケースの裏面に取り付けられ、前記位置決めピンによって前記基板の前記ピン穴に対して位置決めされる。前記所定のネジは、段付きネジ(150)であってよい。前記電子機器は、カードコネクタ(110)であってよい。
10 筐体
11 磁気カード決済用のスロット
12 接触型ICカード決済用のスロット
13 非接触型決済用のタッチ面
14 操作画面
15 底面
16 ICカード
100 情報処理装置
110 カードコネクタ
111 カードスロット
120 基板
121 基板側接点
122A、122B ピン穴
130 保護カバー
131 主面
132A、132B、132C 側面
133 開口部
134 カバー側接点
135A、135B 延出部
136A、136B 貫通穴
137A、137B 位置決めピン
140 ケース
141A、141B ネジ穴
150 段付きネジ
151 頭部
152 首部
153 ネジ溝部
α 載置面
Claims (4)
- 電子機器、第1の接点及びピン穴を有する基板と、
前記第1の接点と接触する第2の接点、前記第2の接点に接続されるタンパ検知用の配線であるタンパ検知配線、寸法公差を許容する貫通穴、及び、前記基板の前記ピン穴に対応する位置決めピンを有し、前記基板上の前記電子機器及び前記第1の接点を覆うカバーと、
前記基板及び前記カバーを収容するケースと、を備え、
前記カバーは、前記貫通穴に挿入された所定のネジによって前記ケースの裏面に取り付けられ、前記位置決めピンによって前記基板の前記ピン穴に対して位置決めされる、
情報処理装置。 - 前記所定のネジは、段付きネジである、
請求項1に記載の情報処理装置。 - 前記電子機器は、カードコネクタである、
請求項1に記載の情報処理装置。 - 電子機器及び第1の接点を有する基板と、
前記第1の接点と接触する第2の接点、前記第2の接点に接続されるタンパ検知用の配線であるタンパ検知配線、寸法公差を許容する貫通穴、及び、前記基板のピン穴に対する位置決めピンを有し、前記基板上の前記電子機器及び前記第1の接点を覆うカバーと、
前記基板及び前記カバーを収容するケースと、を備える情報処理装置の製造方法であって、
所定のネジを前記貫通穴に挿入して前記カバーを前記ケースの裏面に取り付ける工程と、
前記位置決めピンを前記基板の前記ピン穴に挿入する工程と、を含む、
情報処理装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2020022597A JP6712793B1 (ja) | 2020-02-13 | 2020-02-13 | 情報処理装置、及び、情報処理装置の製造方法 |
US17/116,752 US20210259101A1 (en) | 2020-02-13 | 2020-12-09 | Information processing apparatus and method of manufacturing information processing apparatus |
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JP2020022597A JP6712793B1 (ja) | 2020-02-13 | 2020-02-13 | 情報処理装置、及び、情報処理装置の製造方法 |
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JP6712793B1 JP6712793B1 (ja) | 2020-06-24 |
JP2021128528A true JP2021128528A (ja) | 2021-09-02 |
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JP (1) | JP6712793B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6887134B1 (ja) * | 2020-02-28 | 2021-06-16 | パナソニックIpマネジメント株式会社 | 情報処理装置 |
JP6948611B1 (ja) * | 2021-06-30 | 2021-10-13 | パナソニックIpマネジメント株式会社 | 情報処理装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US7788801B2 (en) * | 2005-07-27 | 2010-09-07 | International Business Machines Corporation | Method for manufacturing a tamper-proof cap for an electronic module |
US7094069B1 (en) * | 2005-08-24 | 2006-08-22 | Advanced Interconnections Corporation | Seal member limiting solder flow |
JP4349389B2 (ja) * | 2006-07-28 | 2009-10-21 | ソニー株式会社 | データ記憶装置、および、通信装置 |
US8278948B2 (en) * | 2009-08-10 | 2012-10-02 | Apple Inc. | Mechanisms for detecting tampering of an electronic device |
JP5656303B1 (ja) * | 2014-03-28 | 2015-01-21 | パナソニック株式会社 | 情報処理装置 |
US9894749B2 (en) * | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US9913370B2 (en) * | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
US10251260B1 (en) * | 2016-08-29 | 2019-04-02 | Square, Inc. | Circuit board to hold connector pieces for tamper detection circuit |
US10192076B1 (en) * | 2016-08-29 | 2019-01-29 | Square, Inc. | Security housing with recesses for tamper localization |
US9730315B1 (en) * | 2016-08-29 | 2017-08-08 | Square, Inc. | Environment-tolerant tamper-proof circuit board |
FR3061972B1 (fr) * | 2017-01-13 | 2020-02-14 | Ingenico Group | Corps de lecteur de cartes a memoire securise |
US10595401B1 (en) * | 2019-05-29 | 2020-03-17 | International Business Machines Corporation | Tamper detection at enclosure-to-board interface |
US11366019B2 (en) * | 2019-06-28 | 2022-06-21 | X Development Llc | Enhanced ambient temperature detection |
JP7256707B2 (ja) * | 2019-07-03 | 2023-04-12 | 日立Astemo株式会社 | 電子装置 |
US11714206B2 (en) * | 2019-11-27 | 2023-08-01 | Varex Imaging Corporation | Removable battery connector adapter |
JP6731662B1 (ja) * | 2020-02-13 | 2020-07-29 | パナソニックIpマネジメント株式会社 | 情報処理装置 |
JP6803551B1 (ja) * | 2020-02-13 | 2020-12-23 | パナソニックIpマネジメント株式会社 | 耐タンパ壁、及び、情報処理装置 |
-
2020
- 2020-02-13 JP JP2020022597A patent/JP6712793B1/ja active Active
- 2020-12-09 US US17/116,752 patent/US20210259101A1/en not_active Abandoned
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JP6712793B1 (ja) | 2020-06-24 |
US20210259101A1 (en) | 2021-08-19 |
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