JP2021118263A - 熱電変換モジュール - Google Patents
熱電変換モジュール Download PDFInfo
- Publication number
- JP2021118263A JP2021118263A JP2020010771A JP2020010771A JP2021118263A JP 2021118263 A JP2021118263 A JP 2021118263A JP 2020010771 A JP2020010771 A JP 2020010771A JP 2020010771 A JP2020010771 A JP 2020010771A JP 2021118263 A JP2021118263 A JP 2021118263A
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- JP
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- Prior art keywords
- thermoelectric conversion
- type
- heat
- conversion module
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 229910002056 binary alloy Inorganic materials 0.000 claims abstract description 6
- 230000005678 Seebeck effect Effects 0.000 claims abstract description 3
- 238000007599 discharging Methods 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010248 power generation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 1
- 229910017028 MnSi Inorganic materials 0.000 description 1
- 229910004339 Ti-Si Inorganic materials 0.000 description 1
- 229910010978 Ti—Si Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Silicon Compounds (AREA)
- Hybrid Cells (AREA)
Abstract
Description
101 高温電極
102 p型熱電変換素子
103 n型熱電変換素子
104 低温電極
105 低温電極
106 水流
TH 熱を供給する熱源(高温)
TC 熱を排出する冷却源(低温)
300 1対モジュールの全底面積Atot
301 p型熱電変換素子の断面積Ap
302 n型熱電変換素子の断面積An
400 12対モジュールの全底面積Atot
401 p型熱電変換素子の断面積Ap(12対での面積和は12Ap)
402 n型熱電変換素子の断面積An(12対での面積和は12An)
403 出力(正電極)
404 出力(負電極)
Claims (3)
- p型熱電変換材料とn型熱電変換材料が2元系をベースとしたシリサイド材料であり、その複数対で構成される熱電変換モジュールであって、
前記熱電変換モジュールの厚さ方向の上下面に設置され、前記熱電変換モジュールに温度差を付与し、前記熱電変換材料のゼーベック効果により発電するための熱を供給する熱源および熱を排出する冷却源をそれぞれ供給する熱供給部を有し、
前記熱電変換材料のp型:n型の断面積比t:1−tにおいて、0.5<t<0.7であり、かつ、熱電素子の長さLがL≦5mmである、熱電変換モジュール。 - 請求項1において、
断面積Apを有するp型熱電変換材料、および断面積Anを有するn型熱電変換材料からの熱を排出するための各電極が冷却源に接する断面積をそれぞれAp’およびAn’とすると、
面積比Ap’/Ap≧0.73、An’/An≧0.73となる、熱電変換モジュール。 - 請求項1において、
前記熱電変換材料のp型の断面積t=0.6である、熱変換モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020010771A JP7518623B2 (ja) | 2020-01-27 | 2020-01-27 | 熱電変換モジュール |
EP20217979.2A EP3855518A3 (en) | 2020-01-27 | 2020-12-31 | Thermoelectric conversion module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020010771A JP7518623B2 (ja) | 2020-01-27 | 2020-01-27 | 熱電変換モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021118263A true JP2021118263A (ja) | 2021-08-10 |
JP7518623B2 JP7518623B2 (ja) | 2024-07-18 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2020010771A Active JP7518623B2 (ja) | 2020-01-27 | 2020-01-27 | 熱電変換モジュール |
Country Status (2)
Country | Link |
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EP (1) | EP3855518A3 (ja) |
JP (1) | JP7518623B2 (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007095897A (ja) * | 2005-09-28 | 2007-04-12 | Toshiba Corp | 半導体装置とその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6700053B2 (en) * | 2000-07-03 | 2004-03-02 | Komatsu Ltd. | Thermoelectric module |
WO2008111220A1 (ja) * | 2007-03-15 | 2008-09-18 | Ibiden Co., Ltd. | 熱電変換装置の製造方法 |
JPWO2008111218A1 (ja) | 2007-03-15 | 2010-06-24 | イビデン株式会社 | 熱電変換装置 |
WO2013047474A1 (ja) | 2011-09-26 | 2013-04-04 | 学校法人東京理科大学 | 焼結体、熱電変換素子用焼結体、熱電変換素子及び熱電変換モジュール |
WO2013175571A1 (ja) * | 2012-05-22 | 2013-11-28 | 株式会社日立製作所 | 熱電変換モジュール |
JP6252413B2 (ja) | 2013-11-19 | 2017-12-27 | 日立金属株式会社 | 熱電変換材料及びそれを用いた熱電変換モジュール |
WO2017057259A1 (ja) * | 2015-09-28 | 2017-04-06 | 三菱マテリアル株式会社 | 熱電変換モジュール及び熱電変換装置 |
JP6957916B2 (ja) | 2017-03-21 | 2021-11-02 | 三菱マテリアル株式会社 | 熱電変換モジュール |
-
2020
- 2020-01-27 JP JP2020010771A patent/JP7518623B2/ja active Active
- 2020-12-31 EP EP20217979.2A patent/EP3855518A3/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007095897A (ja) * | 2005-09-28 | 2007-04-12 | Toshiba Corp | 半導体装置とその製造方法 |
Also Published As
Publication number | Publication date |
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JP7518623B2 (ja) | 2024-07-18 |
EP3855518A3 (en) | 2021-08-18 |
EP3855518A2 (en) | 2021-07-28 |
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