JP2021111706A

JP2021111706A - Vehicle control device

Info

Publication number: JP2021111706A
Application number: JP2020003120A
Authority: JP
Inventors: 千尋甲斐; Chihiro KAI
Original assignee: Nippon Seiki Co Ltd
Current assignee: Nippon Seiki Co Ltd
Priority date: 2020-01-10
Filing date: 2020-01-10
Publication date: 2021-08-02

Abstract

To provide a vehicle control device which enables a case to be inclined easily.SOLUTION: A vehicle control device includes: a circuit board 2; circuit elements 3 mounted on the circuit board 2; a sealing resin 4 which seals the circuit elements 3; and a case member 1 which has a bottom part 11 arranged substantially parallel with a substrate surface 21 of the circuit board 2 and which houses the circuit board 2 and the sealing resin 4 therein. The case member 1 has an inclined part 141 which inclines relative to the substrate surface 21. An upper surface 41 of the sealing resin 4 is formed in parallel with the inclined part 141.SELECTED DRAWING: Figure 2

Description

本開示は、車両用制御装置に関する。 The present disclosure relates to a vehicle control device.

従来の車両用制御装置として、例えば、特許文献１に記載されたものが知られている。特許文献１の車両用制御装置（電子制御装置）は、回路基板上に各種回路素子（電子部品）が実装されている。各種回路素子は、回路基板上において封止用樹脂によって樹脂封止されている。封止用樹脂は、硬化する前にケースを傾けることで、回路基板の基板面に対し傾斜して形成される。 As a conventional vehicle control device, for example, the one described in Patent Document 1 is known. In the vehicle control device (electronic control device) of Patent Document 1, various circuit elements (electronic components) are mounted on a circuit board. Various circuit elements are resin-sealed with a sealing resin on a circuit board. The sealing resin is formed so as to be inclined with respect to the substrate surface of the circuit board by inclining the case before curing.

特開２０１８−０９３０３２号公報JP-A-2018-09032

しかしながら、ケースを傾けるためには、斜面を有するケースの受け治具が必要となりコストがかかるといった問題点があった。 However, in order to tilt the case, there is a problem that a jig for receiving the case having a slope is required, which is costly.

そこで、本発明はこの様な点に鑑みなされたもので、容易にケースを傾けることができる車両用制御装置を提供することを目的とする。 Therefore, the present invention has been made in view of such a point, and an object of the present invention is to provide a vehicle control device capable of easily tilting the case.

上記目的を達成するため、回路基板２と、前記回路基板２上に実装された複数の回路素子３と、複数の前記回路素子３を封止する封止用樹脂４と、前記回路基板２の基板面２１と略平行な底部１１を有し、前記回路基板２と前記封止用樹脂４を内部に収容するケース部材１と、を備える車両用制御装置において、前記ケース部材１は、前記基板面２１に対し傾斜する傾斜部１４１を有し、前記封止用樹脂４の上面４１は、前記傾斜部１４１と平行に形成されることを特徴とする。 In order to achieve the above object, the circuit board 2, the plurality of circuit elements 3 mounted on the circuit board 2, the sealing resin 4 for sealing the plurality of circuit elements 3, and the circuit board 2. In a vehicle control device having a bottom portion 11 substantially parallel to a substrate surface 21 and including a circuit board 2 and a case member 1 for accommodating the sealing resin 4 inside, the case member 1 is the substrate. It has an inclined portion 141 that is inclined with respect to the surface 21, and the upper surface 41 of the sealing resin 4 is formed in parallel with the inclined portion 141.

本開示の第１の実施形態に係るケースの斜視図。The perspective view of the case which concerns on 1st Embodiment of this disclosure. 図１のＡ−Ａ線に沿った車両用制御装置の断面図。FIG. 3 is a cross-sectional view of a vehicle control device along the line AA of FIG. 図２の車両用制御装置を治具に配置した状態を示す図。The figure which shows the state which arranged the vehicle control device of FIG. 2 on a jig. 本開示の車両用制御装置の他の実施形態。Another embodiment of the vehicle control device of the present disclosure.

本開示は、車両用制御装置に関し、例えば、自動車やオートバイ、あるいは農業機械や建設機械を備えた移動体に搭載される車両用制御装置に適用することができる。本開示の実施形態について図１乃至３を参照して説明するが、発明はこれら実施形態に限定されるものではなく、本開示の要旨の範囲において、種々の変形が可能である。 The present disclosure relates to a vehicle control device, and can be applied to, for example, a vehicle control device mounted on a moving body including an automobile, a motorcycle, or an agricultural machine or a construction machine. Although the embodiments of the present disclosure will be described with reference to FIGS. 1 to 3, the invention is not limited to these embodiments, and various modifications can be made within the scope of the gist of the present disclosure.

本開示の実施形態に係る車両用の制御装置１００を、図１乃至３を参照して説明する。制御装置１００は、車両に搭載されて、所定の車載機器（例えば、表示器）に対する作動制御を行う装置である。制御装置１００は、例えば、車両の開いたスペース（例えば、インパネの裏側や、椅子の座面下部等）に組付けされる。 The vehicle control device 100 according to the embodiment of the present disclosure will be described with reference to FIGS. 1 to 3. The control device 100 is a device that is mounted on a vehicle and controls the operation of a predetermined in-vehicle device (for example, a display). The control device 100 is assembled, for example, in an open space of the vehicle (for example, the back side of the instrument panel, the lower part of the seat surface of the chair, etc.).

制御装置１００は、図１，２に示すように、ケース（ケース部材）１と、回路基板２と、複数の回路素子３と、封止用樹脂４と、を備える。 As shown in FIGS. 1 and 2, the control device 100 includes a case (case member) 1, a circuit board 2, a plurality of circuit elements 3, and a sealing resin 4.

尚、以下では、制御装置１００の構成の理解を容易にするために、各部材に対して、上下方向(図中Ｔ−Ｂ)は、取り付けステー１７側（図２の上側）を「上（Ｔ）」とする回路基板２の基板面２１の法線方向であり、前後方向(図中Ｆ−Ｒ)は、コネクタ３２側（図２の左側）を「前（Ｆ）」とする基板面２１に平行な方向であり、左右方向(図中Ｌ−Ｒ)は、上下方向及び前後方向と直交する両取り付けステー１７を結ぶ方向である。 In the following, in order to facilitate understanding of the configuration of the control device 100, in the vertical direction (TB in the drawing), the mounting stay 17 side (upper side in FIG. 2) is "upper (upper)" with respect to each member. T) ”is the normal direction of the board surface 21 of the circuit board 2, and the front-back direction (FR in the figure) is the board surface with the connector 32 side (left side in FIG. 2) as the“ front (F) ”. The direction parallel to 21 and the left-right direction (LR in the figure) is a direction connecting both mounting stays 17 orthogonal to the up-down direction and the front-back direction.

回路基板２は、例えば、ガラスエポキシ樹脂（ＧｌａｓｓＦｉｂｅｒＲｅｉｎｆｏｒｃｅｄＰｌａｓｔｉｃｓ）からなる絶縁性を有する略四角形の板状の基材である。回路基板２は、表面に制御部３１やコネクタ３２等を含む各種の回路素子３が実装され、各種配線がプリントされる。回路基板２は、ケース１の内部に配置される。制御部３１は、制御装置１００の外部装置（例えば、車両のＥＣＵ（ＥｌｅｃｔｒｏｎｉｃＣｏｎｔｒｏｌＵｎｉｔ）等）から車両の速度等の車両情報を取得し、取得した情報に基づいて表示器を駆動させることができる。 The circuit board 2 is, for example, a substantially quadrangular plate-shaped base material having an insulating property made of glass epoxy resin (Glass Fiber Reinforced Plastics). Various circuit elements 3 including a control unit 31, a connector 32, and the like are mounted on the surface of the circuit board 2, and various wirings are printed on the circuit board 2. The circuit board 2 is arranged inside the case 1. The control unit 31 can acquire vehicle information such as the speed of the vehicle from an external device of the control device 100 (for example, an ECU (Electronic Control Unit) of the vehicle) and drive the display based on the acquired information. ..

コネクタ３２は、直方体の樹脂ソケットの内部に複数の電極ピン３２１が並んだ、表面実装タイプの雌型コネクタである。コネクタ３２は、回路基板２の面方向と平行な方向に接続穴３２２を有するアングルタイプのコネクタである。コネクタ３２は、接続穴３２２が前方を向き、電極ピン３２１が後方を向くように回路基板２の前方に配置される。 The connector 32 is a surface mount type female connector in which a plurality of electrode pins 321 are arranged inside a rectangular parallelepiped resin socket. The connector 32 is an angle type connector having a connection hole 322 in a direction parallel to the surface direction of the circuit board 2. The connector 32 is arranged in front of the circuit board 2 so that the connection hole 322 faces the front and the electrode pin 321 faces the rear.

回路素子３は、高さの高い高回路素子群３３と、高さの低い低回路素子群３４と、を有する。高回路素子群３３は、コネクタ３２に近い位置に配置され、低回路素子群３４は、コネクタ３２から遠い位置に配置される。つまり、前後方向において、回路素子３は、コネクタ３２から離れるに従い高さが低くなるように配置される。 The circuit element 3 has a high circuit element group 33 having a high height and a low circuit element group 34 having a low height. The high circuit element group 33 is arranged at a position close to the connector 32, and the low circuit element group 34 is arranged at a position far from the connector 32. That is, in the front-rear direction, the circuit element 3 is arranged so that the height decreases as the distance from the connector 32 increases.

封止用樹脂４は、例えば、ウレタンなどからなる熱硬化性樹脂が使用されており、図２に示すように、ケース１内において、回路基板２の下側（裏側）と上側（表側）とに供給されて、回路基板２及び回路素子３を樹脂封止（所謂ポッティング技術）する部材である。 As the sealing resin 4, for example, a thermosetting resin made of urethane or the like is used, and as shown in FIG. 2, in the case 1, the lower side (back side) and the upper side (front side) of the circuit board 2 It is a member that is supplied to the circuit board 2 and the circuit element 3 is resin-sealed (so-called potting technique).

ケース１は、合成樹脂材からなり、例えば、遮光性のある黒色のポリプロピレン樹脂から構成されている。ケース１は、上方が開口した略箱状に形成され、回路基板２と封止用樹脂４を内部に収容する。ケース１は、底板部（底部）１１と、前側壁部１２と、後側壁部１３と、左右側壁部１４と、開口部１６と、取り付けステー（取り付け部）１７と、を有する。 The case 1 is made of a synthetic resin material, for example, a black polypropylene resin having a light-shielding property. The case 1 is formed in a substantially box shape with an upper opening, and houses the circuit board 2 and the sealing resin 4 inside. The case 1 has a bottom plate portion (bottom portion) 11, a front side wall portion 12, a rear side wall portion 13, left and right side wall portions 14, an opening 16, and a mounting stay (mounting portion) 17.

底板部１１は、回路基板２と略平行に形成される。底板部１１は、上方に突出した４個のボス部１１１を有する。このボス部１１１の上に回路基板２を配置し、回路基板２の上方から螺子が螺合されて回路基板２がケース１に固定される。前側壁部１２，後側壁部１３，左右側壁部１４，は、底板部１１の外周位置から上方へ突出形成され、回路基板２を覆う。 The bottom plate portion 11 is formed substantially parallel to the circuit board 2. The bottom plate portion 11 has four boss portions 111 protruding upward. The circuit board 2 is arranged on the boss portion 111, and screws are screwed from above the circuit board 2 to fix the circuit board 2 to the case 1. The front side wall portion 12, the rear side wall portion 13, and the left and right side wall portions 14 are formed so as to project upward from the outer peripheral position of the bottom plate portion 11 and cover the circuit board 2.

左右側壁部１４は、底板部１１から上方に一段の階段状に形成される傾斜部１４１を有する。傾斜部１４１は、左右側壁部１４の前側壁部１２から後側壁部１３方向に向かって底板部１１及び回路基板２の基板面２１に対し傾斜して形成される。傾斜部１４１は、前側壁部１２が底板部１１から最も離れて形成され、後側壁部１３に近づくに従い高さが徐々に低くなり。後側壁部１３が最も近くなるように形成される。 The left and right side wall portions 14 have an inclined portion 141 formed in a stepped shape upward from the bottom plate portion 11. The inclined portion 141 is formed so as to be inclined from the front side wall portion 12 of the left and right side wall portions 14 toward the rear side wall portion 13 with respect to the bottom plate portion 11 and the substrate surface 21 of the circuit board 2. The inclined portion 141 is formed so that the front side wall portion 12 is formed farthest from the bottom plate portion 11, and the height of the inclined portion 141 gradually decreases as it approaches the rear side wall portion 13. The rear side wall portion 13 is formed so as to be closest to each other.

開口部１６は、前側壁部１２の上方に設けられた切り欠きである。開口部１６は、コネクタ３２を挿通する。取り付けステー１７は、左右側壁部１４の上方から外部へ略矩形のフランジ状で突出形成される。取り付けステー１７は、制御装置１００を螺子で車両に取り付けるための螺子の貫通する貫通孔１７１を有する。 The opening 16 is a notch provided above the front side wall portion 12. The opening 16 inserts the connector 32. The mounting stay 17 is formed so as to project from above the left and right side wall portions 14 to the outside in a substantially rectangular flange shape. The mounting stay 17 has a through hole 171 through which a screw for mounting the control device 100 to the vehicle with a screw penetrates.

以下に封止用樹脂４の充填状態を説明する。
内部に回路基板２を固定したケース１を、図３に示すよう、天面９１が水平な治具９の上に配置する。傾斜部１４１は、天面９１に配置される。すると、ケース１は前側壁部１２側が下を向くように傾いて配置される。この状態でケース１に流動性のある状態にした封止用樹脂４を供給すると、封止用樹脂４の上面４１は、天面９１と平行に形成され、傾斜部１４１の板厚は均一であるので、傾斜部１４１とも略平行に形成される。上面４１は、回路基板２の基板面２１に対し傾斜して形成される。 The filling state of the sealing resin 4 will be described below.
As shown in FIG. 3, the case 1 in which the circuit board 2 is fixed is arranged on the jig 9 whose top surface 91 is horizontal. The inclined portion 141 is arranged on the top surface 91. Then, the case 1 is arranged so as to be inclined so that the front side wall portion 12 side faces downward. When the sealing resin 4 in a fluid state is supplied to the case 1 in this state, the upper surface 41 of the sealing resin 4 is formed parallel to the top surface 91, and the plate thickness of the inclined portion 141 is uniform. Therefore, it is formed substantially parallel to the inclined portion 141. The upper surface 41 is formed so as to be inclined with respect to the substrate surface 21 of the circuit board 2.

上面４１は、コネクタ３２に近い位置では基板面２１から高くなり、コネクタ３２から遠い位置では基板面２１に近くなるように形成される。封止用樹脂４は、コネクタ３２に近い位置で高回路素子群３３を樹脂封止し、コネクタ３２から遠い位置で低回路素子群３４を樹脂封止する。上面４１は、傾斜部１４１の高さに達するまで供給される。その後、封止用樹脂４が硬化すると制御装置１００が完成する。 The upper surface 41 is formed so as to be higher than the substrate surface 21 at a position close to the connector 32 and closer to the substrate surface 21 at a position far from the connector 32. The sealing resin 4 resin-seals the high circuit element group 33 at a position close to the connector 32 and resin-seals the low circuit element group 34 at a position far from the connector 32. The upper surface 41 is supplied until it reaches the height of the inclined portion 141. After that, when the sealing resin 4 is cured, the control device 100 is completed.

このように形成されることで、治具９に斜面等を形成する必要が無く、傾斜した上面４１を有する樹脂封止を得ることができる。また、傾斜部１４１は、図１に示すように、封止用樹脂４の供給量の目視管理用の目安として利用することができる。 By forming in this way, it is not necessary to form a slope or the like on the jig 9, and a resin seal having an inclined upper surface 41 can be obtained. Further, as shown in FIG. 1, the inclined portion 141 can be used as a guideline for visually controlling the supply amount of the sealing resin 4.

尚、傾斜部１４１は、底板部１１から上方に一段の階段状に形成されていたが、図４に示すように、上方が傾斜した左右側壁部１４の上方から外部へ突出形成されてもよい。この時、取り付けステー１７は、傾斜部１４１と同じ面に形成される。 The inclined portion 141 was formed in a stepped shape upward from the bottom plate portion 11, but as shown in FIG. 4, the inclined portion 141 may be formed so as to project outward from above the left and right side wall portions 14 that are inclined upward. .. At this time, the mounting stay 17 is formed on the same surface as the inclined portion 141.

１ケース（ケース部材）
１１底板部（底部）
１１１ボス部
１２前側壁部
１３後側壁部
１４左右側壁部
１４１傾斜部
１６開口部
１７取り付けステー（取り付け部）
１７１貫通孔
２回路基板
３回路素子
３１制御部
３２コネクタ
３２１電極ピン
３２２接続穴
３３高回路素子群
３４低回路素子群
４封止用樹脂
４１上面
９治具
１００制御装置 1 case (case member)
11 Bottom plate (bottom)
111 Boss part 12 Front side wall part 13 Rear side wall part 14 Left and right side wall part 141 Inclined part 16 Opening part 17 Mounting stay (mounting part)
171 Through hole 2 Circuit board 3 Circuit element 31 Control unit 32 Connector 321 Electrode pin 322 Connection hole 33 High circuit element group 34 Low circuit element group 4 Sealing resin 41 Top surface 9 Jig 100 Control device

Claims

With the circuit board
A plurality of circuit elements mounted on the circuit board and
A sealing resin that seals a plurality of the circuit elements,
In a vehicle control device having a bottom portion substantially parallel to the substrate surface of the circuit board, and including the circuit board and a case member for accommodating the sealing resin inside.
The case member has an inclined portion that is inclined with respect to the substrate surface.
A vehicle control device characterized in that the upper surface of the sealing resin is formed parallel to the inclined portion.

The vehicle control device according to claim 1, wherein the inclined portion is formed on a side wall portion of the case member.

The vehicle control device according to claim 2, wherein the inclined portion is formed in a stepped shape from the bottom portion.

The vehicle control device according to claim 2, wherein the upper surface is formed at the height of the inclined portion.

The case member has a mounting portion for a vehicle and has a mounting portion.
The vehicle control device according to claim 1, wherein the inclined portion has the mounting portion.