JP2021097068A - Sheet-shaped adhesive peeling device - Google Patents

Abstract

To provide a sheet-shaped adhesive peeling device capable of peeling a sheet-shaped adhesive peeling material attached to a workpiece without causing an abnormality such as cracking in the workpiece.SOLUTION: For a wafer W to which a protective tape PT having an adhesive material Tb that reduces the adhesive strength by contact with liquid L is attached, a part of the outer peripheral portion of the protective tape PT is peeled from the wafer W to form a peeling start site Ds first. Then, the liquid L is supplied to the peeling start site Ds by a liquid supply unit 17, and the entire protective tape PT is peeled from the wafer W while maintaining the state in which the liquid L is in contact with a peeling portion Dp. The formation of the peeling start site Ds enables the liquid L to come into contact with the adhesive material Tb, and the contact reduces the adhesive strength of the protective tape PT at the peeling start site Ds. Therefore, the peeling strength required for peeling the protective tape PT can be reduced, such that the stress applied to the wafer W can be reduced.SELECTED DRAWING: Figure 23

Description

The present invention is used to peel off a sheet-like adhesive material such as an adhesive tape, which is attached to a semiconductor wafer (hereinafter, appropriately referred to as “wafer”) or a work such as a substrate. Regarding the device.

After performing a circuit pattern forming process on the front surface of the wafer, a back grind process is performed to grind the back surface of the wafer to make it thinner. Before performing the backgrinding treatment, a protective adhesive tape (protective tape) is attached to the surface of the wafer to protect the circuit. After thinning the wafer, the wafer is placed in the center of the ring frame, and a supporting adhesive tape (dicing tape) is attached between the ring frame and the back surface of the wafer. After the mount frame is created by attaching the dicing tape, the protective tape is peeled off for each process such as the dicing process.

As a conventional method of peeling the protective tape from the wafer, the peeling tape and the protective tape are separated by attaching a peeling adhesive tape (peeling tape) to the surface of the protective tape after grinding the back surface and peeling the peeling tape. A method of peeling as a unit is used (see, for example, Patent Documents 1 and 2). Specifically, the release tape is attached to the protective tape by pressing the plate-shaped edge member around which the release tape is wrapped against the protective tape, and the release tape is folded back and peeled off by the edge member.

Japanese Unexamined Patent Publication No. 2003-318250 Japanese Unexamined Patent Publication No. 2016-046436

However, the above-mentioned conventional device has the following problems.

In recent years, wafers have been further reduced in thickness for the purpose of high-density mounting, and as an example, backgrinding is performed so as to make the wafer as thin as several tens of μm. Since the rigidity of the wafer is lowered due to such thinning, when the adhesive tape such as the protective tape is peeled off from the wafer, an abnormality such as cracking or chipping occurs more frequently in the wafer. Further, there is a concern that a part of the adhesive material contained in the adhesive tape remains on the surface of the wafer from which the adhesive tape has been peeled off, which adversely affects the performance of the wafer.

As a method for reinforcing the wafer, a method has been proposed in which a back grind treatment is performed while leaving the outer peripheral portion of the wafer to form a thin shape in which an annular convex portion remains along the outer peripheral portion. By forming the annular convex portion, it is possible to suppress bending and deformation of the wafer when performing a general handling step.

However, when the adhesive tape is peeled off from the wafer, it is difficult to suppress the occurrence of cracks even in the wafer having the annular convex portion. That is, the adhesive tape is attached to the entire surface of the wafer. Therefore, when the adhesive tape is peeled from the wafer, the peeling force required for peeling the adhesive tape acts not only on the annular convex portion but also on the thin portion (flat concave portion) in the center. The peeling force needs to be a large force that exceeds the adhesive force of the adhesive tape, and acts in a direction such as shearing the wafer. Therefore, even if a wafer having an annular convex portion is used, it is difficult to avoid the occurrence of cracks in the thin flat concave portion.

The present invention has been made in view of such circumstances, and provides a sheet-shaped adhesive material peeling device capable of peeling a sheet-shaped adhesive material attached to a work without causing an abnormality such as cracking in the work. The main purpose is to do.

As a result of studies by the present inventors in order to solve the above problem, it has been clarified that the cause of the above situation is as follows. That is, when the adhesive tape is peeled from the wafer, it is necessary to wind the peeling tape together with the adhesive tape with a force larger than the adhesive force of the adhesive tape on the wafer. Stress is applied to the wafer due to the application of the hoisting force (peeling force), and the application of the stress causes an abnormality such as cracking in the wafer. Further, since the release tape is wound up with a force that resists the adhesive force of the adhesive tape, it is considered that a part of the adhesive material remains on the wafer surface as a result of the layer of the adhesive material being torn by the winding force.

Further, in the conventional peeling device, the peeling tape is wound while moving the winding member for winding the release tape from one end side to the other end side of the wafer. That is, the adhesive tape attached to one end side of the wafer is peeled off first, and finally the adhesive tape attached to the other end side of the wafer is peeled off. Therefore, when the adhesive force of the adhesive tape to the wafer differs depending on the position on the wafer due to the unevenness of the circuit pattern of the wafer and the material of the wafer, the magnitude of stress applied to the wafer in the peeling process changes. To do. The change in stress causes a stick-slip phenomenon, and as a result, the frequency of cracking of the wafer further increases.

Further, in the conventional peeling device, in order to improve the force against the adhesive force of the adhesive tape on the wafer, the winding member is moved from one end side to the other end side of the wafer while pressing the edge member against the adhesive tape. Since stress is generated on the wafer by pressing the edge member, the frequency of cracking of the wafer increases. In the configuration in which the edge member is pressed, it is necessary to precisely set the height and parallelism between the edge member and the wafer. Therefore, a configuration for finely adjusting the positions of the edge member and the wafer is required.

As a method of suppressing the occurrence of an abnormality in the wafer when the adhesive tape is peeled off, a configuration in which the adhesive strength of the adhesive tape is reduced under specific conditions can be considered. As an example, there is a method of using a heat-removable adhesive tape whose adhesive strength is reduced by heating, or an ultraviolet curable adhesive tape whose adhesive strength is reduced by irradiation with ultraviolet rays.

However, when a wafer thinned to about several tens of μm is used, the frequency of cracking of the wafer cannot be sufficiently suppressed even if a heat-removable adhesive tape or an ultraviolet curable adhesive tape is used. That is, the heat-removable adhesive tape or the ultraviolet-curable adhesive tape has a certain adhesive force even under the conditions of heating or ultraviolet irradiation, and the adhesive force causes stress on the wafer. It is thought that there is.

The present invention has the following configuration in order to achieve such an object.
That is, it is a sheet-shaped adhesive material peeling device that peels the sheet-shaped adhesive material attached to the work from the work.
The sheet-shaped adhesive material has a moisture-sensitive adhesive force-reducing adhesive layer that reduces the adhesive force when it comes into contact with a liquid.
A part of the outer peripheral portion of the sheet-shaped adhesive material is peeled off from the work to form a peeling start part which is a part at the interface between the moisture-sensitive adhesive force-reducing adhesive layer and the work and which is starting to be peeled off. Starting site formation mechanism and
A liquid supply mechanism that supplies liquid to at least a part of the peeling start site,
The state in which the liquid supplied to the peeling start site or the liquid additionally supplied is in contact with at least a part of the peeling site that is moving with the peeling of the sheet-like adhesive material is maintained. A peeling mechanism that moves the sheet-shaped adhesive material relative to the work in a predetermined peeling direction and peels the sheet-shaped adhesive material from the work.
It is characterized by having.

(Action / Effect) According to this configuration, a sheet-like adhesive material having a moisture-sensitive adhesive force-reducing adhesive layer that reduces the adhesive force by contact with a liquid is used. Then, a part of the sheet-like adhesive material attached to the work is peeled off to form a peeling start portion, and the liquid is supplied to the peeling start portion. After the liquid is supplied, the sheet-like adhesive material is peeled from the work while maintaining the state in which the liquid is in contact with the peeled portion.

The peeling start site is the interface between the moisture-sensitive adhesive layer and the work and is starting to peel, and the peeling start site moves as a peeling site as the sheet-like adhesive material is peeled. Further, the formation of the peeling start portion enables the liquid to come into contact with the moisture-sensitive adhesive force-reducing adhesive layer, and the contact greatly reduces the adhesive force of the sheet-shaped adhesive material. Since the sheet-like adhesive material whose adhesive strength is greatly reduced by contact with the liquid is peeled from the work, the magnitude of stress acting on the work at the time of the peeling can be greatly reduced. Therefore, the sheet-like adhesive material attached to the work can be peeled off without causing an abnormality such as cracking in the work.

Further, in the above-described invention, the peeling start site forming mechanism includes a holding member that holds the end portion of the sheet-shaped adhesive material and a holding member moving mechanism that moves the holding member in a direction away from the work. It is preferable that the peeling start portion is formed by moving the holding member in a direction away from the work while the holding member holds the end portion of the sheet-shaped adhesive material.

(Action / Effect) According to this configuration, a holding member for holding the end portion of the sheet-shaped adhesive material is provided, and the holding member is separated from the work while the holding member holds the end portion of the sheet-shaped adhesive material. The peeling start site is formed by moving in the direction of the peeling. By holding the end portion of the sheet-shaped adhesive material, the position of the sheet-shaped pressure-sensitive adhesive material can be stably controlled, so that the peeling start portion can be reliably formed.

Further, in the above-described invention, the peeling start site forming mechanism includes a peeling member having a sharp tip portion and a peeling member moving mechanism for moving the peeling member from the outer peripheral portion to the central portion of the sheet-shaped adhesive material. It is preferable that the peeling member moving mechanism forms the peeling start portion by allowing the tip portion of the peeling member to enter from the outer peripheral portion of the sheet-like adhesive material.

(Action / Effect) According to this configuration, the peeling start portion is formed by allowing the tip end portion of the peeling member to enter from the outer peripheral portion of the sheet-shaped adhesive material. Since the tip portion has a sharp shape, a part of the outer peripheral portion of the sheet-shaped adhesive material can be reliably peeled off from the work by allowing the tip portion to enter. Therefore, the peeling start site can be formed more easily and surely.

Further, in the above-described invention, the liquid supply mechanism is provided on the peeling member, and the peeling member moving mechanism causes the tip portion of the peeling member to enter from the outer peripheral portion of the sheet-like adhesive material to start the peeling. It is preferable that the liquid supply mechanism supplies the liquid to the peeling start site while forming the site.

(Action / Effect) According to this configuration, since the peeling member is provided with the liquid supply mechanism, the peeling member can form the peeling start portion and supply the liquid to the peeling start portion. Therefore, the device can be downsized and the peeling process can be shortened. Further, since the liquid can be supplied while the peeling member forms the peeling start portion, the shape of the sheet-like adhesive material is restored by retracting the peeling member, and an error in supplying the liquid to the peeling start portion occurs. Such a situation can be prevented.

Further, in the above-described invention, it is preferable to provide the work from which the sheet-shaped adhesive material has been peeled off and a drying mechanism for drying the sheet-shaped pressure-sensitive adhesive material peeled off from the work.

(Action / Effect) According to this configuration, the sheet-like adhesive material is peeled from the work using a liquid, and then the sheet-like adhesive material and the work are dried. In this case, it is possible to prevent the sheet-shaped adhesive material and the liquid remaining on the work from affecting the sheet-shaped adhesive material peeling device.

Further, in the above-described invention, when the adhesive force for detecting the adhesive force of the sheet-like adhesive material at the peeled portion and the adhesive force detected by the adhesive sensor are equal to or higher than a predetermined value, the liquid supply mechanism is used. It is preferable to include a control unit that controls the supply of the liquid to the peeled portion.

(Action / Effect) According to this configuration, an adhesive sensor for detecting the adhesive force of the sheet-like adhesive material at the peeled portion is provided. The control unit controls to supply the liquid to the peeled portion when the adhesive strength of the sheet-shaped adhesive is equal to or higher than a predetermined value. When the adhesive strength of the sheet-shaped adhesive is equal to or higher than a predetermined value, it can be determined that the cause is that the liquid and the peeled portion are not in contact with each other. Therefore, when the adhesive strength of the sheet-shaped adhesive is equal to or higher than a predetermined value, the liquid is supplied again to reduce the adhesive strength, so that the peeling error caused by the situation where the liquid and the peeling portion are not in contact with each other. Can be reliably avoided.

According to the sheet-shaped adhesive material peeling device according to the present invention, a sheet-shaped adhesive material having a moisture-sensitive adhesive strength-reducing adhesive layer that reduces the adhesive strength by contact with a liquid is used. Then, a part of the sheet-like adhesive material attached to the work is peeled off to form a peeling start portion, and the liquid is supplied to the peeling start portion. After the liquid is supplied, the sheet-like adhesive material is peeled from the work while maintaining the state in which the liquid is in contact with the peeled portion. The formation of the peeling start site enables the liquid to come into contact with the moisture-sensitive adhesive layer, and the contact greatly reduces the adhesive force of the sheet-like adhesive material. Therefore, the sheet-like adhesive material attached to the work can be peeled off without causing an abnormality such as cracking in the work.

It is a figure which shows the structure of the semiconductor wafer which concerns on Example. (A) is a perspective view of the back surface side of the semiconductor wafer, and (b) is a partial vertical sectional view of the semiconductor wafer. It is a vertical cross-sectional view which shows the structure of the protective tape which concerns on Example. It is a top view which shows the whole structure of the wafer mounting apparatus which comprises the sheet-like adhesive material peeling apparatus which concerns on Example. It is a front view of the wafer mounting apparatus which concerns on embodiment. It is a front view of the pasting unit which concerns on embodiment. It is a left side view which shows the main part of the sheet-like adhesive material peeling apparatus which concerns on Example. It is a perspective view of the 1st peeling member which concerns on Example. It is a top view which shows the main part of the sheet-like adhesive material peeling apparatus which concerns on Example. It is a left side view of the drying unit which concerns on an Example. It is a top view which shows the main part of the drying unit which concerns on Example. It is a flowchart which shows the operation of the sheet-like adhesive material peeling apparatus which concerns on Example. (A) is a flowchart of the overall operation, and (b) is a flowchart for explaining the details of step S5. It is a perspective view which shows the structure of the mount frame which concerns on Example. It is a figure explaining the process of step S2 which concerns on Example. It is a figure explaining the process of step S2 which concerns on Example. It is a figure explaining the process of step S2 which concerns on Example. It is a figure explaining the process of step S3 which concerns on Example. It is a figure explaining the process of step S4 which concerns on Example. It is a figure explaining the process of step S4 which concerns on Example. It is a figure explaining the process of step S5-2 which concerns on Example. It is a figure explaining the process of step S5-2 which concerns on Example. (A) is a diagram showing a state immediately after the first release member is pierced into the side surface of the protective tape, and (b) shows a state in which the first release member is further advanced to deform the protective tape into a curl shape. It is a figure. It is a figure explaining the process of step S5-2 which concerns on Example. It is a figure explaining the process of step S5-2 which concerns on Example. (A) is a diagram showing a state in which the release tape is attached to the end portion of the protective tape, and (b) is a diagram showing a state in which the release tape is wound up to form a release start portion. It is a figure explaining the process of step S5-3 which concerns on Example. It is a figure explaining the effect which a liquid has on an adhesive material in an Example. It is a figure explaining the effect which a liquid has on an adhesive material in an Example. It is a figure explaining the effect which a liquid has on an adhesive material in an Example. It is a figure explaining the process of step S5-4 which concerns on Example. It is a figure explaining the process of step S5-5 which concerns on Example. (A) is a diagram showing a state before the start of drying of the protective tape, and (b) is a diagram showing a state after the start of drying of the protective tape. It is a figure explaining the process of step S5-5 which concerns on Example. (A) is a diagram showing a state before the wafer drying is started, and (b) is a diagram showing a state after the wafer drying is started. It is a figure which compared the structure of the conventional structure and the structure of an Example. (A) is a diagram showing a tear that occurs when the conventional protective tape is peeled off, (b) is a diagram showing a glue residue state that occurs when the conventional protective tape is peeled off, and (c) is a diagram showing a glue residue state. It is a figure which shows the liquid layer generated when peeling off the protective tape which concerns on Example, and (d) is a figure which shows the state which peels off the protective tape which concerns on Example. It is a figure explaining the structure of the modification. (A) is a perspective view showing the first peeling member provided with a liquid supply member according to a modified example, and (b) describes the process of step S5-2 using the first peeling member including a liquid supply member. It is a figure (c) is a figure explaining the process of step S5-2 using the 1st peeling member including a liquid supply pipe. It is a figure explaining the structure of the modification. (A) is a diagram showing a state before peeling off the end portion of the protective tape in a modified example in which step S5-2 is performed using the suction pad, and (b) is a diagram showing step S5-2 using the suction pad. In the modified example to be performed, it is a figure which shows the state after peeling off the end part of the protective tape, (c) is a plan view which shows the wafer which has a notch, and (d) is a step S5-2 using the protrusion member. It is a figure which shows the state before peeling off the end part of the protective tape in the modified example which performs step S5-2, and (e) peeled off the end part of the protective tape in the modified example which performs step S5-2 using the protrusion member. It is a figure which shows the later state. It is a figure explaining the structure of the modification. (A) is a vertical cross-sectional view showing a wafer on which a convex portion is formed, (b) is a vertical cross-sectional view showing a state in which a liquid is in contact with a peeling portion, and (c) is a vertical cross-sectional view showing a state in which the liquid is in contact with the peeling portion. It is a vertical cross-sectional view showing a state in which the liquid is blocked and the liquid is not in contact with the peeling portion, and FIG. 3D is a diagram showing a state in which the liquid is supplied to the peeling portion again. It is a figure explaining the structure of step S5-4 which concerns on a modification. It is a figure explaining the process of step S5 which concerns on a modification. (A) is a diagram showing a state in which ultraviolet rays are irradiated in step S5-2, and (b) is a diagram showing a state in which the end portion of the protective tape is deformed by the first peeling member after irradiation with ultraviolet rays. (C) is a diagram showing a state in which the liquid is being supplied in step S5-3.

Hereinafter, examples of the present invention will be described with reference to the drawings. In this embodiment, a semiconductor wafer (hereinafter referred to as “wafer W”) in which a protective tape PT is attached to a circuit forming surface is mounted on a ring frame via a supporting adhesive tape. A configuration in which the wafer mounting device 1 is provided with the sheet-shaped adhesive material peeling device according to the present invention will be described.

The wafer mounting device 1 attaches a supporting adhesive tape (supporting tape DT) over the back surface of the wafer W and the ring frame f to create a mount frame MF, and further peels the protective tape PT from the wafer W. In this embodiment, the protective tape PT corresponds to the sheet-shaped adhesive material according to the present invention, and the wafer W corresponds to the work according to the present invention.

As shown in FIGS. 1A and 1B, the wafer W is backgrinded with a protective tape PT for circuit protection attached to the surface on which the circuit pattern is formed. is there. The back surface of the wafer W is ground (back grinded) with the outer peripheral portion left about 3 mm in the radial direction. That is, a flat concave portion He is formed on the back surface, and an annular convex portion r remains along the outer periphery thereof. For example, the flat recess He is processed so that the depth d is several hundred μm and the wafer thickness t in the grinding area is several tens of μm to several hundred μm. Therefore, the annular convex portion r formed on the outer periphery of the back surface functions as an annular rib that enhances the rigidity of the wafer W, and suppresses bending deformation of the wafer W in handling and other processing steps. The length of the width m of the annular convex portion r in the radial direction of the wafer W is preferably 5 mm or less, and more preferably 1.5 mm to 3 mm.

As shown in FIG. 2, the protective tape PT used in this embodiment has a long structure in which a non-adhesive base material Ta and an adhesive adhesive material Tb are laminated. The protective tape PT adheres to the surface of the wafer W via the adhesive material Tb. In a state where the entire protective tape PT is attached to the wafer W, the outer peripheral portion of the protective tape PT is designed to prevent water or air from entering the adhesive material Tb.

Examples of materials constituting the base material Ta include polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene terenaphthalate, polyvinylidene chloride, and polyethylene methacrylic. Examples thereof include acid copolymers, polypropylene, terephthalate methacrylic acid, polyamideimide, and polyurethane elastomers. A combination of a plurality of the above-mentioned materials may be used as the base material Ta. Further, the base material Ta may be a single layer or may be a structure in which a plurality of layers are laminated.

The adhesive material Tb has an adhesive force and has a function of maintaining a state in which the protective tape PT adheres to the wafer W, and a property that the adhesive force is reduced by contact with a liquid L described later (moisture-sensitive adhesive force lowering property). ) And can be guaranteed. Examples of the material constituting the pressure-sensitive adhesive material Tb include a mixture of a pro-liquid material C having a high affinity with the liquid L and a polymer pressure-sensitive adhesive Vh having a pressure-sensitive adhesive property. It is desirable that the lipophilic material C is a material having a smaller molecular weight than the polymer pressure-sensitive adhesive Vh.

Examples of the polymer pressure-sensitive adhesive Vh include acrylic acid ester copolymers and the like. Examples of the pro-liquid material C include polyoxyethylene sorbitan monolaurate (manufactured by Kao Corporation: Leodor TW-L120 (trade name), "Leodor" is a registered trademark). As the liquid L, an appropriate material may be used depending on the parent liquid material.

In this example, an adhesive material containing Leodor TW-L120 and an acrylic acid ester copolymer is used as the adhesive material Tb, and ultrapure water is used as the liquid L. The polyoxyethylene sorbitan monolaurate constituting the polyliquid material C is a hydrophilic surfactant and has a very small molecular weight as compared with the acrylic acid ester copolymer constituting the polymer pressure-sensitive adhesive Vh. Therefore, the polyoxyethylene sorbitan monolaurate can move between the molecules of the acrylic acid ester copolymer and easily exude to the surface of the pressure-sensitive adhesive material Tb (that is, the interface between the pressure-sensitive adhesive material Tb and the wafer W). .. In this way, the parent liquid material C exudes to the interface between the pressure-sensitive adhesive material Tb and the wafer W and dissolves or disperses in the liquid L, so that the adhesive strength of the pressure-sensitive adhesive material Tb can be reduced or eliminated. Therefore, the protective tape PT can be easily peeled off from the wafer W with a smaller force.

As another example of the pro-liquid material C, a polyoxyethylene alkyl ether-based material, a sorbitan fatty acid ester-based material, or a polyoxyethylene fatty acid ester (manufactured by Kao Co., Ltd .: Emanone 1112 (trade name), " "Emanone" is a registered trademark) and other nonionic surfactants. In terms of being suitably dissolved or dispersed in the pressure-sensitive adhesive Tb, it is preferable to use a material having high solubility in ethyl acetate as the parent liquid material C.

Examples of polyoxyethylene alkyl ether-based materials include Emargen 105 (trade name, manufactured by Kao Corporation: "Emargen" is a registered trademark). Examples of the sorbitan fatty acid ester-based material include Leodor SP-L10 (trade name), Leodor SP-O10V (trade name), Leodor TW-L106 (trade name), and Leodor TW-O106V (trade name) (trade name). Both are manufactured by Kao Corporation).

Here, the adhesive material Tb according to this embodiment will be described in more detail. The pressure-sensitive adhesive Tb is obtained by mixing Leodor TW-L120 with a solution of a polymer (hereinafter referred to as "A polymer") containing an acrylic acid ester copolymer described below. The A polymer is a polymer having pressure-sensitive adhesiveness.

<A polymer>
The step of obtaining the solution of A polymer will be described. First, 100 parts by mass of butyl acrylate, 3 parts by mass of acrylic acid, 0.2 parts by mass of a polymerization initiator (2,2'-azobis-isobutyronitrile (AIBN)), and a solvent (ethyl acetate) are added. The monomer composition was prepared by mixing. Next, the monomer composition was put into a 1-liter round-bottomed separable flask equipped with a separable cover, a separating funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade. The mixture was placed in a laboratory device and subjected to nitrogen substitution at room temperature for 2 hours with stirring. Then, nitrogen was introduced and kept at 60 ° C. for 5 hours with stirring for polymerization to obtain a solution of A polymer. The obtained solution of A polymer was cooled to room temperature.

<Adhesive material Tb>
Next, a step of obtaining the pressure-sensitive adhesive Tb from the solution of the A polymer will be described. Per 100 parts by mass of A polymer solution, 0.7 parts by mass of TETRAD-C (manufactured by Mitsubishi Gas Chemical Company, "TETRAD" is a registered trademark) and Coronate L (manufactured by Tosoh Corporation, "Coronate" is a registered trademark) as a cross-linking agent. The pressure-sensitive adhesive Tb was adjusted by adding 2 parts by mass and 0.1 part by mass of Leodor TW-L120 (manufactured by Kao Co., Ltd.) as the parent liquid material C and mixing them uniformly. Leodor TW-L120 can be mixed with the A polymer solution in a state of being previously dissolved in ethyl acetate.

In preparing the pressure-sensitive adhesive Tb, the amount of Leodor TW-L120 is adjusted to be 5% by mass or less with respect to the solution of the A polymer. The amount of Leodor TW-L120 is preferably 3% by mass or less, more preferably 2% by mass or less, and is in the range of 0.05 to 1.5% by mass with respect to the solution of the A polymer. Is most preferable. In this example, the amount of Leodor TW-L120 is adjusted to be 0.5% by mass with respect to the solution of A polymer.

<Protective tape PT>
Further, a step of obtaining the protective tape PT from the adhesive material Tb according to this embodiment will be described. First, as a separator, a polyethylene terephthalate film having a thickness of 38 μm (MRF38 (trade name), manufactured by Mitsubishi Chemical Corporation) was prepared. The pressure-sensitive adhesive Tb was applied to the silicone-treated surface of the separator, and then dried at 140 ° C. for 2 minutes to form a layer of the pressure-sensitive adhesive Tb having a thickness of 20 μm. Then, the adhesive surface of the adhesive material Tb was attached to the base material Ta to prepare a protective tape PT. After laminating, aging was performed at 50 ° C. for 2 days. As the base material Ta, the film pressure after drying NB300 (manufactured by Dainichi Seika Co., Ltd.) on the corona discharge-treated surface of a polyester film (Lumirror S105 (trade name): manufactured by Toray Industries, Inc., "Lumirror" is a registered trademark). A surface-treated polyester film coated and dried with a gravure coater was used so that the thickness was 1 μm to 2 μm.

<Explanation of the overall configuration>
FIG. 3 is a plan view showing a basic configuration of the wafer mounting device 1 according to the embodiment. The wafer mounting device 1 includes a support tape affixing device 2 and a protective tape peeling device 3. The protective tape peeling device 3 corresponds to the sheet-shaped adhesive material peeling device according to the present invention.

The support tape affixing device 2 has a configuration including a horizontally long rectangular portion 2a and a protruding portion 2b. The protruding portion 2b is configured to be connected at the central portion of the rectangular portion 2a and protrude upward. In the following description, the longitudinal direction of the rectangular portion 2a is referred to as the left-right direction (x direction), and the horizontal direction (y direction) orthogonal to the left-right direction is referred to as the front-rear direction.

A wafer transfer mechanism 4 is provided on the right side of the rectangular portion 2a. Two containers 5 containing the wafer W are placed in parallel on the lower right side of the rectangular portion 2a. At the left end of the rectangular portion 2a, a frame collecting portion 6 for collecting the mount frame MF shown in FIG. 12 in which the wafer W has been mounted is provided.

The aligner 7, the holding table 8, the frame supply unit 9, and the reversing unit 10 are arranged in this order from the upper right of the rectangular portion 2a. A peeling table 11 is provided under the reversing unit 10. Further, a pusher 12 is provided so as to straddle the rectangular portion 2a and the protective tape peeling device 3. A sticking unit 13 for sticking the support tape DT to the ring frame f and sticking the support tape DT to the wafer W is provided on the protruding portion 2b.

The protective tape peeling device 3 includes a peeling unit 16 that peels the protective tape PT from the circuit forming surface of the semiconductor wafer W (hereinafter, appropriately referred to as “wafer W”), and an interface between the adhesive material Tb of the protective tape PT and the wafer W. A liquid supply unit 17 for supplying the liquid L and a drying unit 18 for drying the wafer W after the protective tape PT is peeled off and the peeled protective tape PT are provided.

As shown in FIG. 4, the wafer transfer mechanism 4 includes a wafer transfer device 20 supported so as to be reciprocally movable left and right on the right side of a guide rail 19 erected horizontally on the upper portion of the rectangular portion 2a, and a guide rail 19. A frame transfer device 21 supported so as to be movable left and right is provided on the left side.

The wafer transfer device 20 is configured to transfer the wafer W taken out from any one of the containers 5 to the left and right and back and forth, and to reverse the posture of the wafer W. The wafer transfer device 20 is equipped with a left-right movable base 23 and a front-back movable base 25.

The left-right movable base 23 is configured to be able to reciprocate in the left-right direction along the guide rail 19. The front-rear movable table 25 is configured to be able to reciprocate in the front-rear direction along a guide rail 24 provided on the left-right movable table 23.

Further, a holding unit 26 for holding the wafer W is provided at the lower part of the front-rear movable table 25. The holding unit 26 is configured to be able to reciprocate in the vertical direction (z direction) along the elevating rail 27 extending in the vertical direction. Further, the holding unit 26 can be swiveled around an axis in the z direction by a rotation axis (not shown).

The lower part of the holding unit 26 is equipped with a holding arm 28 that is rotatably supported around the horizontal support shaft q. The holding arm 28 has a horseshoe shape. A plurality of suction pads that slightly protrude are provided on the holding surface of the holding arm 28, and the wafer W is sucked and held through the suction pads. Further, the holding arm 28 is communicated with the air pressure device via a flow path formed inside the holding arm 28 and a connecting flow path connected at the base end side of the flow path.

By using the above-mentioned movable structure, the wafer W that is attracted and held is moved back and forth, left and right, and swiveled around the z-direction axis by the holding arm 28, and is also rotated by reversing around the horizontal support axis q. The wafer W can be turned upside down.

The frame transfer device 21 includes a left-right movable base 29, a front-back movable base 30, a bending / stretching link mechanism 31 connected to the lower part of the left-right moving movable base 29, and a suction plate 32 provided at the lower end of the bending / stretching link mechanism 31. And so on. The suction plate 32 sucks and holds the wafer W. A plurality of suction pads 33 that suck and hold the ring frame f are arranged around the suction plate 32. Therefore, the frame transfer device 21 can suck and hold the ring frame f or the mount frame MF placed and held on the holding table 8 to move it up and down and to move it back and forth and left and right. The suction pad 33 can be slidably adjusted in the horizontal direction according to the size of the ring frame f.

As shown in FIGS. 13 to 16, the holding table 8 is a metal chuck table having a size equal to or larger than that of the wafer W, and is communicated with and connected to an external vacuum device 35. The operation of the vacuum device 35 is controlled by the control unit 106. In this embodiment, the holding table 8 is provided with an annular protrusion 8a on the outer peripheral portion, and is hollow as a whole. The protrusion 8a is configured at a position substantially matching the arrangement of the annular convex portion r of the wafer W in a plan view, and the protrusion 8a supports the annular convex portion r of the wafer W so that the holding table 8 is thin and flat. The wafer W can be held without contacting the recess He.

Further, as shown in FIG. 5, the holding table 8 is housed in the lower housing 14A constituting the chamber 14 and is connected to one end of the rod 36 penetrating the lower housing 14A. The other end of the rod 36 is drive-connected to an actuator 37 including a motor or the like. Therefore, the holding table 8 can be moved up and down inside the chamber 14.

The lower housing 14A includes a frame holding portion 38 that surrounds the lower housing 14A. The frame holding portion 38 is configured so that the upper surface of the ring frame f and the top of the cylinder of the lower housing 14A are flush with each other when the ring frame f is placed.

As shown in FIG. 3, the holding table 8 is configured to be reciprocally movable between the set position and the sticking position along the rail 40 attached in the front-rear direction. The set position is inside the rectangular portion 2a, and is the position where the holding table 8 is shown by a solid line in FIG. At the set position, the wafer W and the ring frame f are placed on the holding table 8.

The sticking position is inside the protruding portion 2b, and is the position where the holding table 8 is shown by the dotted line in FIG. By moving the holding table 8 to the sticking position, the support tape DT can be stuck to the wafer W and the ring frame f placed on the holding table 8.

The frame supply unit 9 stores a drawer-type cassette in which a predetermined number of ring frames f are laminated and stored.

The reversing unit 10 is configured to hold the mount frame MF and to be able to flip the mount frame around the horizontal support axis. As an example, the reversing unit 10 includes a chuck claw that grips the mount frame MF, and the chuck claw is configured to be rotatable around an axis in the x direction. After receiving the mount frame MF whose circuit pattern surface faces downward from the frame carrier 21, the inverting unit 10 inverts the mount frame MF so that the circuit pattern surface faces upward.

The peeling table 11 reciprocates between the receiving position and the peeling position along the pair of left and right rails 41 arranged horizontally in the front-rear direction via the drying position. The receiving position is inside the rectangular portion 2a and corresponds directly below the reversing unit 10. By moving the peeling table 11 to the receiving position, the mount frame MF can be placed on the peeling table 11. The peeling position is inside the protective tape peeling device 3, and corresponds directly below the peeling unit 16. By moving the peeling table 11 to the peeling position, the protective tape PT can be peeled from the wafer W. The drying position is inside the protective tape peeling device 3 and corresponds directly below the drying unit 18.

The pusher 12 stores the mount frame MF placed on the peeling table 11 in the frame collecting unit 6. The pusher 12 is configured to be movable back and forth along a rail 43 extending in the front-rear direction, and is provided with a gripping mechanism for holding the mount frame MF from the top and bottom direction.

As shown in FIG. 5, the sticking unit 13 is composed of a support tape supply section 71, a separator recovery section 72, a support tape sticking section 73, a support tape recovery section 74, and the like. The support tape supply unit 71 peels the separator S by the separator peeling roller 75 in the process of supplying the adhesive tape DT to the sticking position from the supply bobbin loaded with the original roll on which the adhesive tape DT for support is wound. It is configured to do so.

The separator recovery unit 72 is provided with a recovery bobbin that winds up the separator S peeled off from the adhesive tape DT. This recovery bobbin is rotationally driven and controlled by a motor in the forward and reverse directions.

The support tape affixing portion 73 includes a chamber 14, a tape affixing mechanism 81, a tape cutting mechanism 82, and the like.

The chamber 14 is composed of a lower housing 14A and an upper housing 14B. The lower housing 14A is arranged so as to surround the holding table 8, and moves back and forth between the setting position and the sticking position together with the holding table 8. The upper housing 14B is arranged on the protrusion 2b and is configured to be able to move up and down.

As shown in FIG. 16, the vacuum device 35 is communicated with each of the flow path provided on the lower housing 14A side and the flow path provided on the upper housing 14B side. That is, the vacuum device 35 is configured so that the air pressure in the space on the lower housing 14 side and the air pressure in the space on the upper housing side can be adjusted independently.

The tape sticking mechanism 81 includes a movable base 84, a sticking roller 85, a nip roller 86, and the like. The movable base 84 moves horizontally along the guide rail 88 erected in the left-right direction. The sticking roller 85 is pivotally supported by a bracket connected to the tip of a cylinder provided on the movable base 84. The nip roller 86 is provided on the support tape collecting portion 74 side, and includes a feed roller 89 driven by a motor and a pinch roller 90 that moves up and down by a cylinder.

The tape cutting mechanism 82 is provided on an elevating drive base 91 for raising and lowering the upper housing 14B, and includes a support shaft 92 extending in the z direction and a boss portion 93 rotating around the support shaft 92. The boss portion 93 includes a plurality of support arms 94 extending in the radial direction. At the tip of at least one support arm 94, a disk-shaped cutter 95 that cuts the support tape DT along the ring frame f is arranged so as to be movable up and down. A pressing roller 96 is provided at the tip of the other support arm 94 so as to be movable up and down.

The support tape recovery unit 74 includes a recovery bobbin that winds up an unnecessary adhesive tape DT that has been peeled off after cutting. The recovery bobbin is rotationally driven and controlled in the forward and reverse directions by a motor (not shown).

As shown in FIG. 4, the frame collecting unit 6 is provided with a cassette 97 for loading and collecting the mount frame MF. The cassette 97 includes a vertical rail 99 that is connected and fixed to the device frame 98, and an elevating table 101 that is screwed up and down by a motor 100 along the vertical rail 99. Therefore, the frame collecting unit 6 is configured to mount the mount frame MF on the elevating table 101 and feed and lower the pitch.

<Structure of protective tape peeling device>
Next, the details of the configuration of the protective tape peeling device 3 will be described with reference to FIGS. 6 to 10.

The peeling table 11 is supported by a movable base 45 configured to be reciprocally movable in the y direction along a pair of left and right rails 41. The movable base 45 is screw-fed driven by a screw shaft 47 that is driven forward and reverse by a motor 46. A rotating shaft 49 is connected to the lower part of the peeling table 11. A rotary motor 50 is provided below the rotary shaft 49, and the rotary motor 50 rotates the peeling table 11 and the rotary shaft 49 about an axis in the z direction.

A plurality of suction holes 11a are formed on the surface of the peeling table 11. Each of the suction holes 11a is communicated with and connected to the external vacuum device 103 via the flow path 107. By performing vacuum suction using the vacuum device 103, the release table 11 sucks and holds the mounted mount frame MF. The position where each of the suction holes 11a is arranged is designed to correspond to the position where the ring frame f and the wafer W are placed on the release table 11 as an example.

As shown in FIGS. 6 and 8, the peeling unit 16 includes a first peeling mechanism 51 and a second peeling mechanism 52. The first peeling mechanism 51 includes an elevating table 53 that moves up and down in the z direction, and an arm 55 that is cantilevered from the elevating table 53. The elevating table 53 is supported so as to be able to move up and down along a pair of left and right vertical rails 56 erected on the base of the protective tape peeling device 3. The lift 53 is raised and lowered by a ball shaft connected and driven by a motor 57.

A support frame 58 is disposed below the tip of the arm 55, and a first peeling member 59 is attached to the support frame 58. The support frame 58 is connected to the arm 55 via a shaft spring 60. The support frame 58 is configured to be elastically urged upward by the shaft spring 60.

The first peeling member 59 is composed of a metal block having a tip portion 59a and an inclined surface 59b. The tip portion 59a has a shape that tapers toward the tip side to be pierced by the protective tape PT, and the width in the x direction is configured to be shorter than the diameter of the wafer W. The height of the tip portion 59a on the tapered tip side in the z direction is preferably 3 mm or less, and more preferably 2 mm or less. By adjusting the height on the tip side within this range, the end portion of the protective tape PT can be suitably peeled off. The first peeling member 59 is configured to pierce the tip portion 59a into the side surface of the protective tape PT. By being pierced by the tip portion 59a, the end portion of the protective tape PT is deformed so as to be turned up according to the shape of the inclined surface 59b. In this embodiment, the inclined surface 59b is inclined diagonally downward, but the shape of the inclined surface 59b may be changed as appropriate. The constituent material of the first peeling member 59 is not limited to metal, and a material having a certain degree of hardness or higher may be appropriately used.

The second peeling mechanism 52 includes a peeling tape supply unit 104 and a release tape recovery unit 105. The release tape supply unit 104 guides the release tape HT derived from the original roll to the second release member 119, which will be described later. The release tape collecting unit 105 winds up and collects the release tape HT that is sent out from the second release member 119 and is integrated with the protective tape PT.

The second peeling mechanism 52 includes a pair of left and right vertical frames 110 erected on the base of the protective tape peeling device 3. A support frame 111 is fixed to the vertical frame 110, and a box-shaped base 112 is connected to the central portion of the support frame 111 in the x direction. A pair of left and right vertical rails 113 are arranged on the base 112, and the elevating base 115 is supported so as to be slidable up and down via the vertical rails 113. The lift 115 moves up and down by a ball shaft connected and driven by a motor 116.

Side plates 117 are provided on the left and right sides of the lift 115, and the support frame 118 is fixed over each side plate 117. A second peeling member 119 is mounted in the center of the support frame 118. In this embodiment, the second peeling member 119 uses a roller shorter than the diameter of the wafer.

In the second peeling mechanism 52, the guide roller 120 is rotatably supported in front of the side plate 117. The guide roller 120 winds and guides the release tape HT and supplies the release tape HT to the second release member 119. Above the side plate 117, a guide roller 121 for collecting the release tape HT, a nip roller 122, and a tension roller 123 that gives an appropriate tension to the release tape Ts are arranged. The tension roller 123 is provided on the support arm 125, and is swingably arranged via the support arm 125.

The liquid supply unit 17 includes an elevating table 61 that moves up and down in the z direction, and an arm 63 that is cantilevered from the elevating table 61. The lift 61 can be raised and lowered along the vertical rail 64. The lift 61 is raised and lowered by a ball shaft connected and driven by a motor 65. A support frame 66 is disposed below the tip of the arm 63 via a shaft spring 67, and a liquid supply nozzle 68 is attached to the support frame 66. The support frame 66 is configured to be elastically urged upward by a shaft spring 67.

The liquid supply nozzle 68 has a discharge port 68a formed at the tip thereof, and supplies the liquid L to the adhesive material Tb of the protective tape PT. The liquid supply nozzle 68 is connected to a rotation shaft 69 arranged on the support frame 66, and is configured to be rotatable around an axis in the x direction. By rotating the rotation shaft 69, the liquid supply nozzle 68 can change the angle at which the liquid L is supplied to the adhesive material Tb.

The liquid supply nozzle 68 is connected to the liquid storage tank 78 via the liquid supply pipe 76 and the liquid discharge pipe 77. The liquid supply pipe 76 includes a supply valve 79, and the liquid discharge pipe 77 includes a discharge valve 80. The opening / closing operation of the supply valve 79 and the discharge valve 80 is controlled by the control unit 106. The liquid L is stored in the liquid storage tank 78, and as an example, the liquid L is fed toward the liquid supply nozzle 68 by pressure feeding using an inert gas.

The configuration of the drying unit 18 will be described with reference to FIGS. 9 and 10. The drying unit 18 is arranged in front of the peeling unit 16 and includes a work drying mechanism 131 and a tape drying mechanism 132. The work drying mechanism 131 has a shatterproof tank 133. The shatterproof tank 133 is composed of a shatterproof wall 133a and a drainage floor 133b. The shatterproof wall 133a is configured to surround the release table 11 that has moved to the dry position in a plan view.

The work drying mechanism 131 includes a pair of front and rear vertical frames 135 erected on the base of the protective tape peeling device 3. A support frame 136 is fixed to the vertical frame 135, and a box-shaped base 137 is connected to the central portion of the support frame 136 in the y direction. A pair of front and rear vertical rails 138 are arranged on the base 137, and the elevating base 139 is supported so as to be slidable up and down via the vertical rails 138. The shatterproof wall 133a is connected to the elevating table 139, and is configured to be able to move up and down together with the elevating table 139. That is, the shatterproof wall 133a is configured to be able to reciprocate up and down between the initial position shown by the dotted line in FIG. 9 and the connection position shown by the solid line.

The drainage floor 133b is laid on the base of the protective tape peeling device 3, and has substantially the same size as the shatterproof wall 133a in a plan view. The shatterproof wall 133a descends to the connection position and is connected to the drainage floor 133b to form the shatterproof tank 133. A plurality of drainage pipes 133c are communicated with each other in the drainage bed 133b. The drainage hole 133c is connected to the vacuum device 141 via the flow path 140. After the protective tape PT is peeled from the wafer W using the liquid L, the liquid L is shaken off from the surface of the wafer W by the peeling table 11 rotating at high speed around the axis in the z direction, and the shaken liquid L is drained. It is discharged through the pipe 133c.

The tape drying mechanism 132 includes a liquid absorbing roller 143 and a liquid absorbing roller 144. The liquid absorbing roller 143 includes a rotating roller 143a that is rotatably configured, and a liquid absorbing member 143b that is arranged so as to surround the rotating roller 143a. Like the liquid absorbing roller 143, the liquid absorbing roller 144 also includes a rotatable rotating roller 144a and a liquid absorbing member 144b arranged so as to surround the rotating roller 144a. Each of the liquid absorbing member 143b and the liquid absorbing member 144b is made of a material that suitably absorbs the liquid L. An example of such a material is a porous material such as a sponge.

The liquid absorbing roller 143 and the liquid absorbing roller 144 are configured so as to be relatively movable back and forth by a drive mechanism (not shown). In this embodiment, it is assumed that the liquid absorbing roller 144 moves back and forth with respect to the liquid absorbing roller 143. When the liquid absorbing roller 144 moves close to the liquid absorbing roller 143, the protective tape PT peeled together with the peeling tape Ts is sandwiched between the liquid absorbing roller 143 and the liquid absorbing roller 144. By moving the liquid absorbing roller 144 away from the liquid absorbing roller 143, the pinching is released.

<Overview of basic operation>
Here, the basic operation of the wafer mounting device including the sheet-shaped adhesive material peeling device according to the embodiment will be described. FIG. 11A is a flowchart illustrating a series of steps for producing a mount frame MF using the wafer mounting device 1.

Step S1 (supply of work)
When the attachment command is issued, the ring frame f is conveyed from the frame supply portion 9 to the frame holding portion 38 of the lower housing 14A, and the wafer W is conveyed from the container 5 to the holding table 8.

That is, the frame transfer device 21 sucks the ring frame f from the frame supply unit 9 and transfers it to the frame holding unit 38. When the frame transfer device 21 releases the suction of the ring frame f and rises, the ring frame f is aligned. The alignment is performed, for example, by synchronously moving a plurality of support pins erected so as to surround the frame holding portion 38 toward the center. The ring frame f waits until the wafer W is conveyed while being set in the frame holding portion 38.

While the frame transfer device 21 conveys the ring frame f, the wafer transfer device 20 inserts a holding arm 28 between the wafers W stored in multiple stages, and inserts a holding arm 28 from the circuit forming surface of the wafer W via the protective tape PT. It is sucked, held, carried out, and transported to the aligner 7. The aligner 7 sucks the center of the wafer W by the suction pad protruding from the center. At the same time, the wafer transfer device 20 releases the adsorption of the wafer W and retracts it upward. The aligner 7 holds the wafer W with a suction pad and rotates it while aligning the wafer W based on a notch or the like.

When the alignment is completed, the suction pad that sucks the wafer W is projected from the surface of the aligner 7. The wafer transfer device 20 moves to that position and sucks and holds the wafer W from the surface side. The suction pad releases suction and descends.

The wafer transfer device 20 is moved onto the holding table 5, and the wafer W is placed on the holding table 8 with the surface side to which the protective tape PT is attached facing downward. When the holding table 8 sucks and holds the wafer W and the frame holding portion 38 sucks and holds the ring frame f, the lower housing 14A moves from the set position to the sticking position on the tape sticking mechanism 82 side along the rail 40.

Step S2 (Chamber formation)
As shown in FIG. 13, when the lower housing 14A reaches the sticking position, the sticking roller 85 is lowered. On the other hand, the holding table 8 starts to rise and stops at a position where the upper surface of the annular convex portion r is flush with each of the upper surface of the ring frame f and the lower housing 14A.

After the lowering of the sticking roller 85 and the raising of the holding table 8 are completed, as shown in FIG. 14, the ring frame f, the top of the lower housing 14A, and the upper surface of the annular convex portion r are rolled while rolling on the support tape DT. Attach the support tape DT. In conjunction with the movement of the sticking roller 85, a predetermined amount of the support tape DT is fed out from the support tape supply unit 71 while the separator S is peeled off.

When the attachment of the support tape DT to the ring frame f is completed, the upper housing 14B is lowered as shown in FIG. Along with this lowering, the support tape DT whose adhesive surface is exposed between the outer circumference of the wafer W and the inner diameter of the ring frame f is sandwiched between the upper housing 14B and the lower housing 14A to form the chamber 14.

At this time, the support tape DT functions as a sealing material, and the chamber 14 is divided into two spaces by the support tape DT. That is, the support tape DT is sandwiched between the lower space H1 on the lower housing 14A side and the upper space H2 on the upper housing 14B side. The wafer W located in the lower housing 14A is in close contact with the support tape DT with a predetermined clearance.

Step S3 (Attach support tape)
After forming the chamber 14, the step of attaching the support tape DT to the back surface of the wafer W is started. As shown in FIG. 16, the control unit 106 operates the vacuum device 35 to reduce the air pressure in the lower space H1 and the air pressure in the upper space H2 at the same speed.

When the lower space H1 and the upper space H2 are depressurized to a predetermined atmospheric pressure, the control unit 106 stops the operation of the vacuum device 35. Then, the control unit 106 adjusts the opening degree of the valve provided in each flow path so that the air pressure in the upper space H2 is higher than the air pressure in the lower space H1.

Since the air pressure in the upper space H2 is higher than the air pressure in the lower space H1, a differential pressure SP is generated between the two spaces. Then, the support tape DT is pulled toward the lower housing 14A side from the central portion thereof by the differential pressure SP. Then, the inner corner portion of the annular convex portion r is evacuated, and the support tape DT is radially attached from the central portion to the outer peripheral portion of the wafer W while being recessed and curved.

When the air pressure in the upper space H2 reaches a preset air pressure, the control unit 106 adjusts the opening degree of the valve provided in the flow path on the lower housing 14A side, and adjusts the air pressure in the lower space H1 to the air pressure in the upper space H2. Make it the same as atmospheric pressure. After that, the control unit 106 raises the upper housing 14B to open the inside of the upper housing 14B to the atmosphere, and also opens the side of the lower housing 14A to the atmosphere.

Step S4 (cutting the support tape)
While the support tape DT is attached to the wafer W in the chamber 14, the tape cutting mechanism 82 is operated to cut the support tape DT. At this time, as shown in FIG. 17, the cutter 95 cuts the support tape DT attached to the ring frame f into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 on the ring frame f. Press while rolling the tape cutting part.

Since the attachment of the adhesive tape DT to the wafer W and the cutting of the adhesive tape DT are completed when the upper housing 14B is raised, the pinch roller 90 is raised to release the nip of the support tape DT. After that, as shown in FIG. 18, the nip roller 86 is moved toward the support tape collection unit 74 to wind up and collect unnecessary support tape DT after cutting, and at the same time, a predetermined amount of support is provided from the support tape supply unit 71. Pay out the tape DT. By the steps S3 and S4, a mount frame MF to which the support tape DT is attached over the back surface of the wafer W and the ring frame f is created.

When the unnecessary support tape DT is wound up and collected, the nip roller 86 and the sticking roller 85 return to the initial positions. Then, the holding table 8 moves from the sticking position to the setting position while holding the mount frame MF.

Step S5 (Peeling of protective tape)
After the mount frame MF is created, a step of peeling off the protective tape PT attached to the surface of the wafer W is performed. That is, the mount frame MF that has moved to the set position is delivered to the reversing unit 10 by the frame transfer device 21. The reversing unit 10 is turned upside down while holding the mount frame MF. Due to the inversion, the circuit pattern surface to which the protective tape PT is attached to the mount frame MF faces upward.

The reversing unit 10 places the mount frame MF on the peeling table 11 that has moved to the receiving position with the circuit pattern surface facing upward. When the control unit 106 operates the vacuum device 103, the release table 11 sucks and holds the mount frame MF through the suction holes 11a. The peeling table 11 moves from the receiving position inside the rectangular portion 2a to the peeling position inside the protective tape peeling device 3 while sucking and holding the mount frame MF.

After the peeling table 11 moves to the peeling position, the protective tape peeling device 3 peels the protective tape PT from the circuit pattern surface of the wafer W. Details of the operation of the protective tape peeling device 3 will be described later. After the protective tape PT is peeled off, the peeling table 11 returns to the receiving position again while maintaining the state of sucking and holding the mount frame MF.

Step S6 (Recovery of mount frame)
When the mount frame MF returns to the receiving position together with the release table 11, the pusher 12 grips the mount frame MF and conveys the mount frame MF to the frame collecting unit 3. The transported mount frame MF is loaded and stored in the cassette 97.

This completes the round operation of mounting the wafer W on the ring frame f via the support tape DT. After that, the above process is repeated until the number of mount frame MFs reaches a predetermined number.

<Operation of protective tape peeling device>
Here, the details of the operation performed inside the protective tape peeling device 3 in step S5 will be described. FIG. 11B is a flowchart illustrating the details of the process according to step S5 performed in the protective tape peeling device 3.

Step S5-1 (Move to peeling position)
When the mount frame MF is attracted and held by the release table 11 at the receiving position, the release table 11 starts moving in the y direction along the rail 41. Then, as shown in FIG. 6, it moves from the receiving position to the peeling position inside the protective tape peeling device 3 via the drying position.

Step S5-2 (Formation of peeling start site)
After the peeling table 11 moves to the peeling position, the first peeling mechanism 51 is operated to form the peeling start portion Ds. That is, as shown in FIG. 19, the first peeling mechanism 51 descends to a predetermined height. By lowering the first peeling mechanism 51 to the predetermined height, the tip portion 59a of the first peeling member 59 can be pierced into the side surface of the outer peripheral portion of the protective tape PT. In this embodiment, the predetermined height of the tip portion 59a is adjusted so as to be pierced by the side surface of the base material Ta in the protective tape PT.

When the first peeling mechanism 51 descends to a predetermined height, the first peeling mechanism 51 is moved horizontally with respect to the peeling table 11 so that the first peeling mechanism 51 approaches the peeling table 11. Due to the horizontal movement, as shown in FIG. 20A, the tip portion 59a is pierced into the base material Ta. When the tip portion 59a is pierced, the end portion of the base material Ta is deformed along the inclined surface 59b.

Then, the relative horizontal movement between the first peeling mechanism 51 and the peeling table 11 is continued, and the first peeling mechanism 51 and the peeling table 11 are moved by a predetermined distance. As a result of this movement, as shown in FIG. 20B, the tip portion 59a is pierced deeper into the base material Ta. As a result, the end portion of the base material Ta is further deformed and turned up to form a curl shape.

When the end portion of the base material Ta is deformed by the first peeling member 59, the first peeling member 59 is retracted from the peeling table 11 as shown in FIG. After retracting the first peeling member 59, the motor 116 is operated to lower the second peeling mechanism 52. When the second peeling mechanism 52 is lowered, the second peeling member 119 around which the peeling tape HT is wound comes into contact with the protective tape PT, and as shown in FIG. 22A, the peeling tape HT is brought into contact with the protective tape PT. It is pasted on the edge of.

In this embodiment, the end portion of the protective tape PT is deformed into a curl shape by piercing the peripheral side surface of the protective tape PT with a sharp first peeling member 59 before attaching the release tape HT. Therefore, the contact area between the release tape HT and the protective tape PT becomes wider, so that the adhesive strength between the release tape HT and the protective tape PT can be improved.

After the release tape HT is attached to the end of the protective tape PT, the second release mechanism 52 operates the release tape collection unit 105 to wind up the release tape HT and collect it. By winding up the release tape HT, as shown in FIG. 22B, the end portion of the protective tape PT is wound up integrally with the release tape HT and is separated from the wafer W.

By peeling off the end portion of the protective tape PT, the peeling start portion Ds is formed on the peripheral edge portion of the wafer W. The peeling start portion Ds is a region where the peeling of the protective tape PT performed using the liquid L is started, and corresponds to a portion at the interface between the Tb layer and the wafer W where the protective tape PT is starting to peel. ..

Step S5-3 (Liquid supply)
When the peeling start site Ds is formed, the process of supplying the liquid L is started. That is, as shown in FIG. 23, the liquid supply unit 17 is lowered to bring the discharge port 68a of the liquid supply nozzle 68 closer to the peeling start portion Ds. Then, the liquid L is discharged from the discharge port 68a, and the liquid L is supplied to the peeling start portion Ds. By peeling a part of the end portion of the protective tape PT from the wafer W in advance, the supplied liquid L can come into contact with the interface between the wafer W and the adhesive material Tb. The liquid L adhering to the wafer W without contacting the peeling start site Ds is also guided to the peeling start site Ds by the capillary phenomenon.

By supplying the liquid L to the peeling start site Ds, the adhesive force of the protective tape PT sharply decreases at the peeling start site Ds. That is, as shown in FIG. 24, the liquid L comes into contact with the wafer W and the adhesive material Tb at the peeling start portion Ds. The contact between the liquid L and the pressure-sensitive adhesive Tb forms a non-sticky layer composed of the parent liquid material C and the liquid L contained in the pressure-sensitive adhesive material Tb.

That is, the pro-liquid material C having a relatively low molecular weight moves between the molecules of the polymer pressure-sensitive adhesive Vh having a relatively high molecular weight and approaches the liquid L. Further, since the liquid L is also a small molecule, it moves between the molecules of the polymer pressure-sensitive adhesive Vh and approaches the molecule of the parent liquid material C. As the molecules of the liquid L and the molecules of the pro-liquid material C approach each other and the pro-liquid material C dissolves or disperses in the liquid L, as shown in FIG. 25, at the peeling start site Ds and its vicinity, A liquid layer CS composed of the liquid L and the pro-liquid material C is formed between the wafer W and the pressure-sensitive adhesive Tb.

Since neither the liquid L nor the pro-liquid material C has adhesive strength, the adhesion between the wafer W and the protective tape PT is hindered by the liquid layer CS. Therefore, the adhesive force of the protective tape PT to the wafer W is greatly reduced by the contact of the liquid L, and becomes almost zero. As a result, the protective tape PT can be easily peeled from the wafer W in the vicinity of the peeling start portion Ds.

Step S5-4 (Peeling off the entire protective tape)
After supplying the liquid L to the peeling start site Ds, the step of peeling the entire protective tape PT from the wafer W is started. That is, as shown in FIG. 27, the second peeling mechanism 52 winds up and collects the peeling tape HT by the peeling tape collecting unit 105, and peels the protective tape PT from the surface of the wafer W together with the peeling tape HT. When the liquid L comes into contact with the peeling start site Ds, the protective tape PT in the peeling start site Ds and its vicinity is easily peeled from the wafer W by applying a very small winding force.

When the protective tape PT at the peeling start portion Ds is peeled from the wafer W, the portion at the interface between the wafer W and the adhesive material Tb where the peeling starts to start moves to the right in FIG. 25 as the peeling portion Dp. Then, the liquid L at the peeling start site Ds moves so as to approach the peeling site Dp due to the capillary phenomenon, and comes into contact with the peeling site Dp.

As a result, as shown in FIG. 26, the molecules of the liquid L and the molecules of the pro-liquid material C approach each other at the peeling site Dp newly formed by the peeling of the protective tape PT at the peeling start site Ds. Then, the pro-liquid material C is dissolved or dispersed with respect to the liquid L, and a liquid layer CS is newly formed at the peeling site Dp and its vicinity. Since the liquid layer CS is formed on the peeled portion Dp, the adhesive force of the protective tape PT to the wafer W is greatly reduced in the peeled portion Dp and its vicinity. When the second peeling mechanism 52 applies a small winding force St, the peeling portion Dp and the protective tape PT in the vicinity thereof are peeled from the wafer W, and the peeling portion Dp further moves to the right.

In this way, the second peeling mechanism 52 moves the protective tape PT relative to the peeling table 11 in the y direction while maintaining the state in which the liquid L is in contact with at least a part of the peeling portion Dp. The protective tape PT is peeled off from the wafer W. By maintaining the state in which the liquid L is in contact with the peeling site Dp, the process of forming the liquid layer CS at the peeling site Dp and the adhesive force of the protective tape PT at the peeling site Dp due to the formation of the liquid layer CS The process of greatly reducing and the process of moving the peeled portion Dp further to the right by peeling the protective tape PT of the portion where the adhesive strength is greatly reduced from the wafer W with a minute winding force are repeated in a chain reaction. .. By repeating these chain reactions, the peeling site Dp reaches the right end of the wafer W in a state where the liquid L is in contact, and the entire protective tape PT is peeled from the wafer W.

Step S5-5 (Drying Wafer and Tape)
When the protective tape PT is peeled off from the entire surface of the wafer W, the liquid L adheres to the surface of the wafer W and the adhesive surface of the protective tape PT. Therefore, in order to prevent the liquid L from affecting the wafer mounting device 1 in a later step, a step of removing the liquid L adhering to the wafer W and the protective tape PT and drying both is performed.

After peeling the protective tape PT from the wafer W, the peeling table 11 is moved forward along the rail 41 to reach the drying position. By moving to the dry position, the release table 11 is arranged on the central portion of the drainage bed 133b. After moving the peeling table 11 to the drying position, the wafer W is dried by the work drying mechanism 131 and the protective tape PT is dried by the tape drying mechanism 132.

28 (a) and 28 (b) show a step of drying the protective tape PT by the tape drying mechanism 132. That is, the protective tape PT with the liquid L attached is arranged between the liquid absorbing roller 143 and the liquid absorbing roller 144, and the liquid absorbing roller 144 is moved so as to approach the liquid absorbing roller 143. As shown in FIG. 28A, the protective tape PT is sandwiched between the liquid absorbing roller 143 and the liquid absorbing roller 144 due to the movement.

After sandwiching the protective tape PT, as shown in FIG. 28B, the second peeling mechanism 52 winds up the protective tape PT together with the peeling tape HT, and the tape drying mechanism 132 includes the liquid absorbing rollers 143 and the liquid absorbing rollers 144. To rotate. The liquid L adhering to the protective tape PT is absorbed by the liquid absorbing member 143b and the liquid absorbing member 144b in the process in which the protective tape PT is wound up. That is, the protective tape PT is dried by removing the liquid L adhering to the protective tape PT by the liquid absorbing roller 143 and the liquid absorbing roller 144.

29 (a) and 29 (b) show a step of drying the wafer W by the work drying mechanism 131. That is, after the release table 11 holding the mount frame MF moves to the dry position, the shatterproof wall 133a is lowered from the initial position to the connection position. In the mount frame MF, the liquid L adheres to the surface of the wafer W. By connecting the lowered anti-scattering wall 133a to the drainage floor 133b, the anti-scattering tank 133 for accommodating the release table 11 is formed as shown in FIG. 29 (a).

After the shatterproof tank 133 is formed, the control unit 106 operates the vacuum device 141 to perform vacuum suction, and also operates the rotary motor 50 to rotate the rotary shaft 49 at high speed. As the rotating shaft 49 rotates, the peeling table 11 rotates around the axis in the z direction to generate centrifugal force. Due to the centrifugal force, the liquid L adhering to the wafer W is scattered to the outside of the wafer W and is quickly removed from the surface of the wafer W. The liquid L removed from the wafer W is suction-removed through the drainage holes 133c formed in the drainage bed 133b. By removing the liquid L, the drying of the wafer W is completed.

Step S5-6 (Return to receiving position)
When the drying of the wafer W and the protective tape PT is completed, the shatterproof wall 133a is raised from the connection position to the initial position, and the peeling table 11 is released from the shatterproof tank 133. The rise of the shatterproof wall 133a makes it possible to move the release table 11 to the outside of the drainage floor 133b. After raising the shatterproof wall 133a, the release table 11 is moved from the drying position to the receiving position. When the peeling table 11 returns to the receiving position, the series of processes related to step S5 is completed, and the process proceeds to step S6.

<Effect of the configuration of the example>
According to the apparatus according to the above embodiment, in the process of peeling the protective tape PT having the adhesive Tb that reduces the adhesive force by coming into contact with the liquid L from the wafer W, a part of the outer peripheral portion of the protective tape PT is a wafer. It is peeled from W to form a peeling start site Ds. Then, the liquid L is supplied to at least a part of the peeling start site Ds, and the protective tape PT is peeled from the wafer W with the peeling start site Ds as a starting point.

At this time, the protective tape PT is peeled off while maintaining the state in which the liquid L is in contact with the peeling portion Dp that is moving with the peeling of the protective tape PT. That is, the state in which the liquid L is always in contact with the interface between the adhesive material Tb of the protective tape PT and the wafer W and which has begun to peel off is maintained. Therefore, since the adhesive force of the portion that has begun to peel off at the interface is greatly reduced by the contact with the liquid L, the force required for peeling the protective tape PT (peeling force St) is taken as an example of the force for winding up the protective tape PT. ) Can be greatly reduced.

When the protective tape PT is peeled from the wafer W, a stress having a magnitude corresponding to the peeling force St acting on the protective tape PT acts on the wafer. Therefore, by greatly reducing the peeling force St required for peeling the protective tape PT, the stress acting on the wafer W when peeling the protective tape PT is also greatly reduced. Therefore, even when a thinned wafer W is used, it is possible to reliably avoid a situation in which an abnormality such as cracking occurs in the wafer W due to peeling of the protective tape PT.

Further, in this embodiment, since the protective tape PT is peeled from the wafer W by using the protective tape PT having the pressure-sensitive adhesive Tb and the liquid L, the wafer W after the protective tape PT is peeled off is used. The phenomenon that a part of the adhesive material Tb remains (adhesive residue phenomenon) can be more reliably avoided.

That is, in the conventional method for peeling off the protective tape PT, a large force is applied so as to resist the adhesive force of the adhesive material Tb to wind up the protective tape PT. Therefore, as shown in FIG. 30A, a rupture J occurs inside the layer of the adhesive material Tb, and the protective tape PT is frequently peeled off from the wafer W. When the tear occurs, as shown in FIG. 30B, a part of the adhesive material Tb remains on the wafer W, which adversely affects the circuit formed on the wafer.

Further, even when a heat-removable or ultraviolet-removable pressure-sensitive adhesive material Tb is used as the protective tape PT, it is difficult to suitably avoid the adhesive residue phenomenon. That is, since the adhesive force is reduced in the entire layer of the adhesive material Tb by heating or irradiation with ultraviolet rays, tear J is generated inside the layer of the adhesive material Tb when the protective tape PT is wound up.

On the other hand, in this embodiment, the liquid L is supplied to the interface with the wafer W with respect to the pressure-sensitive adhesive material Tb having a moisture-sensitive adhesive strength lowering property. By supplying the liquid L, a non-adhesive liquid layer CS is formed at the interface between the wafer W and the adhesive material Tb as shown in FIG. 30 (c), so that the entire adhesive material Tb together with the base material Ta is formed on the wafer W. Is peeled off from. Therefore, in addition to the effect of greatly reducing the adhesive force between the wafer W and the protective tape PT, it is also possible to obtain the effect of avoiding the phenomenon that a part of the adhesive material Tb remains as shown in FIG. 30 (d). Can be done.

Further, in this embodiment, the stress received on the wafer W when the release tape HT is used can be reduced. That is, conventionally, since the protective tape is peeled from the wafer in a state where the adhesive force of the protective tape is large, it is necessary to increase the bonding force between the release tape and the protective tape in order to resist the adhesive force. Therefore, conventionally, when the release tape is attached to the protective tape, a plate-shaped edge member that folds the release tape is pressed against the protective tape, and the release tape is attached to a wide range of the protective tape. Then, while pressing the edge member against the protective tape, the winding member is moved from one end side to the other end side of the wafer.

In such a conventional configuration, when the release tape is attached to the protective tape, stress due to pressing of the edge member acts on a wide range of the wafer including the region where the circuit is formed on the wafer W. .. Therefore, the frequency of occurrence of abnormalities such as cracks in the circuit forming region of the wafer increases.

On the other hand, in the configuration according to the embodiment, the protective tape PT is peeled off from the wafer W in a state where the adhesive force of the protective tape PT is greatly reduced by the contact between the liquid L and the adhesive material Tb. Therefore, even when the bonding force between the release tape HT and the protective tape PT is relatively small, the release tape HT and the protective tape PT can be peeled together. Further, it is not necessary to use an edge member for attaching the release tape HT. Therefore, since it is not necessary to press the release tape HT against the protective tape PT to attach it, it is possible to avoid stress acting on the wafer W due to the pressing.

Further, since the release tape PT and the protective tape PT can be peeled together even if the bonding force between the release tape HT and the protective tape PT is small, the area to which the release tape HT is attached can be covered by the wafer W on which the circuit is not formed. It can be limited to the protective tape PT corresponding to the end region. As an example, the release tape HT is attached only to a part of the protective tape PT attached to the annular convex portion r as in the embodiment, and the release tape HT is wound up to attach the protective tape PT to the wafer W. Can be peeled off from. Therefore, when the release tape HT is attached to the protective tape PT, it is possible to more reliably prevent stress from acting on the circuit of the wafer W.

It should be noted that the embodiments disclosed this time are exemplary in all respects and are not restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims. As an example, the present invention can be modified as follows.

(1) In step S5-2 according to the embodiment, the end portion of the protective tape PT is deformed by piercing the first peeling member 59 into the layer of the base material Ta, but the present invention is not limited to this. That is, the first peeling member 59 may be pierced into the layer of the adhesive material Tb to deform the end portion of the protective tape PT. In particular, if the height of the first peeling mechanism 51 is adjusted so that the first peeling member 59 pierces the interface between the adhesive material Tb and the wafer W, the peeling start portion Ds can be formed without using the peeling tape HT, which is preferable. ..

However, if the height of the first peeling mechanism 51 is adjusted so that the first peeling member 59 pierces the layer of the base material Ta as in the embodiment, the first peeling member 59 interferes with the wafer W and the wear W is damaged. You can definitely avoid the situation of doing so. Further, when the first peeling member 59 is pierced into the side surface of the protective tape PT, the adhesive adhesive material Tb does not adhere to the first peeling member 59, so that the tip portion 59a of the first peeling member 59 deteriorates. There is also an advantage that can be prevented.

(2) In the embodiment, the peeling start portion Ds is formed by using the first peeling member 59, and the liquid L is applied to the peeling start portion Ds by using the liquid supply unit 17 having a configuration different from that of the first peeling mechanism 59. It supplies, but is not limited to this. That is, the first peeling member 59P as shown in FIG. 31A may be used to form the peeling start portion Ds and supply the liquid L.

The first peeling member 59P according to the modified example includes liquid supply members 150 on both sides of the tip portion 59a. The liquid supply member 150 is, for example, a porous material such as a sponge impregnated with the liquid L, and the tip portion 59a deforms the end portion of the protective tape PT and supplies the liquid L from the end portion. It is preferable that the tip portion 59a protrudes slightly as compared with the tip portion of the liquid supply member 150.

In step S5-2 according to the modification, as shown in FIG. 31B, the end portion of the protective tape PT is deformed by piercing the tip portion 59a of the first peeling member 59P into the side surface of the adhesive material Tb. .. By further pushing the first peeling member 59P to the right with the tip portion 59a pierced, the liquid supply member 150 is pressed against the side surface of the deformed protective tape PT.

When the liquid supply member 150 is pressed, the liquid L that has soaked into the liquid supply member 150 seeps out of the liquid supply member 150 and flows to the tip portion 59a along the surface of the first release member 59P. To go. Therefore, when the liquid supply member 150 is pressed, the liquid L is supplied to the peeling start portion Ds formed by the tip portion 59a. With such a configuration, the steps of step S5-2 and step S5-3 can be continuously completed by using the same member. Therefore, the device can be simplified and the peeling process can be shortened.

The configuration in which the end portion of the protective tape PT is deformed and the liquid L is supplied by using the same member is not limited to the configuration in which the liquid supply member 150 is provided in the first peeling member 59. As another example, as shown in FIG. 31 (c), there is a configuration in which the liquid supply pipe 151 is provided inside the first peeling member 59. The liquid supply pipe 151 is a pipe through which the liquid L flows, and the discharge port of the liquid supply pipe 151 is provided at or near the tip portion 59a. Even in such a configuration, the tip portion 59a of the first peeling member 59 is pierced into the side surface of the adhesive material Tb, and at the same time, the liquid L is discharged from the discharge port of the liquid supply pipe 151 provided at the tip portion 59a, and the tip portion 59a ejects the liquid L. The liquid L can be supplied to the formed peeling start site Ds.

(3) In the example, the step of forming the peeling start portion Ds according to step S5-2 was performed using the first peeling mechanism 51 and the second peeling mechanism 52, but is not limited thereto. That is, the peeling start portion Ds may be formed by piercing the first peeling member 59 into the peripheral side surface of the protective tape PT and deforming the end portion of the protective tape PT into a curl shape using only the first peeling mechanism 51. .. Further, using only the second peeling mechanism 52, the peeling tape HT is attached to the surface of the end portion of the protective tape PT by the second peeling member 119, and the peeling tape HT is wound up and collected to remove the end portion of the protective tape PT. The peeling start portion Ds may be formed by winding up together with the peeling tape HT and peeling the end portion of the protective tape PT from the wafer W.

Further, the configuration for forming the peeling start portion Ds is not limited to the first peeling mechanism 51 or the second peeling mechanism 52. That is, as shown in FIG. 32 (a), the suction pad 153 may be used to suck the end portion of the protective tape PT, and the suction pad 153 may be raised while maintaining the suction state. In this case, as shown in FIG. 32 (b), the end portion of the protective tape PT is peeled from the wafer W as the suction pad 153 rises, and the peeling start portion Ds is formed.

Further, when the wafer W has the notch N as shown in FIG. 32 (c), the peeling start portion Ds can be formed by another configuration. By attaching the circular protective tape PT to the wafer W having the notch N, the protective tape PT protrudes from the end of the wafer W at the notch N portion. Therefore, as shown in FIG. 32 (d), the protrusion member 155 is raised from below at the notch N portion. By raising the protrusion member 155, the protective tape PT at the notch N portion is pushed up as shown in FIG. 32 (e). As a result, the protective tape PT attached to the end portion of the wafer W is peeled from the wafer W, and the peeling start portion Ds is formed.

(4) In step S5 according to the embodiment, the liquid L was injected once, but it may be injected a plurality of times. In particular, when the wafer W has irregularities formed by bumps such as those shown in FIG. 33A, it is more preferable that the liquid L is injected a plurality of times.

When the protective tape PT is peeled from the flat wafer W as in the embodiment, the liquid L is maintained in contact with the peeled portion Dp in the step of peeling the entire protective tape PT according to step S5-4. That is relatively easy. However, when the protective tape PT is peeled from the wafer W on which irregularities are formed and the undulations are severe, it is relatively difficult to maintain the state in which the liquid L is in contact with the peeled portion Dp.

That is, as shown in FIG. 33 (b), when the protective tape PT in the flat portion of the wafer W is peeled off, the liquid L easily approaches and comes into contact with the peeled portion Dp due to the capillary phenomenon. Since the adhesive force of the adhesive material Tb to the wafer W is greatly reduced by the contact of the liquid L, the peeling force St required to peel the protective tape PT from the wafer W becomes very small. At this time, the stress acting on the wafer W is very small.

On the other hand, when the protective tape PT on the uneven portion of the wafer W is peeled off, as shown in FIG. 33 (c), the liquid L moves due to being caught in the convex region such as bump Ba. The liquid L may not be able to come into contact with the peeling portion Dp. Since the adhesive force of the adhesive material Tb to the wafer W is not reduced unless the liquid L comes into contact with the peeling portion Dp, a large peeling force St is required to peel off the protective tape PT. As a result, a situation in which the protective tape PT cannot be peeled off favorably, or a situation in which the wafer W is stressed by applying a large peeling force St and the wafer W is damaged is likely to occur.

Therefore, when the liquid L does not come into contact with the peeled portion Dp, the liquid supply unit 17 is operated again to supply the liquid L to the peeled portion Dp as shown in FIG. 33 (d). When the liquid L comes into contact with the peeling portion Dp again, the peeling force St is reduced, so that the protective tape PT can be easily peeled from the wafer W again.

In such a modified example, it is preferable to include an adhesive sensor that detects the adhesive force of the protective tape PT at the peeled portion Dp. As an example of the adhesive sensor, there is a peeling force sensor 157 that detects the peeling force St as shown in FIG. 33 (b) and the like. The peeling force St is a force required to peel the protective tape PT from the wafer against the adhesive force of the protective tape PT at the peeling site Dp. Therefore, by measuring the peeling force St, the adhesive force of the protective tape PT at the peeling site Dp can be measured. When the peeling force St becomes equal to or higher than a predetermined value by the peeling force sensor 157, it can be determined that the liquid L needs to be resupplied because the liquid L is not in contact with the peeling site Dp or the peeling start site Ds.

As an example of the peeling force sensor 157, there is a sensor that detects the tension of the protective tape PT that is peeling off. Since the tension of the protective tape PT also increases as the peeling force St increases, the peeling force St can be detected by measuring the tension. Further, as a configuration for determining the necessity of resupplying the liquid L, an optical sensor such as a camera that inspects the contact between the peeling portion Ds or the peeling start portion Ds and the liquid L may be used.

(5) In step S5-4 according to the embodiment, the entire protective tape PT was peeled from the wafer W by winding and collecting the release tape HT attached to the end of the protective tape PT. 4 is not limited to the configuration using the release tape HT. That is, as shown in FIG. 34, the entire protective tape PT is moved by gripping the end portion of the protective tape PT using the gripping member 159 and moving the gripping member 157 relative to the release table 11 in a predetermined direction. It may be peeled from the wafer W. In this case, the second peeling mechanism 52 can be omitted instead of providing the gripping member 159.

(6) In step S5-5 according to the embodiment, other members may be appropriately used as the configuration for drying the wafer W and the protective tape PT. Another example of the configuration for drying is a configuration in which the wafer W or the protective tape PT is dried by blowing a gas such as air. Further, the liquid L adhering to the wafer W or the protective tape PT may be absorbed and removed by pressing a flat plate-shaped liquid-absorbent material (for example, a sponge). As another configuration, a configuration may be used in which the liquid L adhering to the wafer W or the protective tape PT is vaporized by heating.

(7) In the examples, the protective tape PT is exemplified as the sheet-shaped adhesive material, but the sheet-shaped adhesive material is not limited to the protective tape PT, and various adhesive tapes such as the support tape DT may be used. .. That is, the configuration of the present invention can be applied to any sheet-like material having adhesive strength.

(8) In the embodiment, the protective tape peeling device 3 which is the sheet-shaped adhesive material peeling device exemplifies the configuration which is a part of the wafer mounting device 1, but the present invention is not limited to this. That is, it may be an independent device as the sheet-shaped pressure-sensitive adhesive peeling device, or the sheet-shaped pressure-sensitive adhesive peeling device according to the present invention may be applied to another wafer processing device.

(9) In the embodiment, a circular wafer W in a plan view is illustrated as a work to which the sheet material is attached, but the shape and material of the work are not limited to this. In the configuration according to this embodiment, various semiconductor members such as a substrate, a panel, and a wafer can be applied as a work. Further, the shape of the work may be a rectangular shape, a polygonal shape, a substantially circular shape, or the like, in addition to the circular shape. Further, the configuration is not limited to the configuration having the annular convex portion r, and may have a flat shape. Further, the work may have a curved surface.

(10) In the example, the liquid L is not limited to ultrapure water and can be changed as appropriate. When a hydrophilic material is used as the liquid L, examples of the liquid L include alcohols, ketones, aldehydes and the like such as methanol or ethanol. A hydrophobic material may be used as the liquid L. When the liquid L is hydrophobic, the configuration according to the present invention can be realized by using a material having a high affinity with a hydrophobic solvent as the parent liquid material C.

(11) In the examples, A polymer is exemplified as the polymer which is the polymer pressure-sensitive adhesive Vh contained in the pressure-sensitive adhesive Tb, but the present invention is not limited to this. As another example of the polymer which is the polymer pressure-sensitive adhesive Vh, a polymer having -2-ethylhexyl acrylate as described below (hereinafter referred to as “B polymer”) can be mentioned. Hereinafter, a step of obtaining the pressure-sensitive adhesive Tb according to the modified example will be described using the B polymer and Leodor TW-L120.

<B polymer>
The step of obtaining the solution of the B polymer will be described. First, 100 parts by mass of -2-ethylhexyl acrylate, 25.5 parts by mass of acryloyl molofophosphoric acid, 18.5 parts by mass of -2-hydroxylethyl acrylate, and 0 polymerization initiator (benzoyl peroxide (BPO)). A monomer composition was prepared by mixing 3 parts by mass and a solvent (toluene). Next, the monomer composition was put into a 1-liter round-bottomed separable flask equipped with a separable cover, a separating funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade. The mixture was placed in a laboratory device and subjected to nitrogen substitution at room temperature for 6 hours with stirring. Then, nitrogen was introduced and kept at 60 ° C. for 8 hours with stirring for polymerization to obtain a resin solution. The obtained resin solution was cooled to room temperature. Then, 12.3 parts by mass of 2-isocyanatoethyl methacrylate (manufactured by Showa Denko Co., Ltd., trade name: Karenz MOI, "Karenzu" is a registered trademark) was added to the resin solution as a compound having a polymerizable carbon-carbon double bond. added. Further, 0.1 part by mass of dibutyltin dilaurate IV (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and a solution of B polymer was prepared by stirring at 50 ° C. for 24 hours in an air atmosphere.

Next, a step of obtaining the pressure-sensitive adhesive Tb according to the modified example of (11) from the solution of the B polymer will be described. Per 100 parts by mass of B polymer solution, 5 parts by mass of Coronate L (manufactured by Tosoh Corporation, "Coronate" is a registered trademark) as a cross-linking agent and Irgacure 369 (manufactured by Ciba Japan Co., Ltd. The pressure-sensitive adhesive Tb was adjusted by adding 1 part by mass of (trademark) and 0.5 part by mass of Leodor TW-L120 (manufactured by Kao Co., Ltd.) as the parent liquid material C and mixing them uniformly. Leodor TW-L120 can be mixed with the B polymer solution in a state of being previously dissolved in ethyl acetate.

The amount of Leodor TW-L120 is adjusted to be 5% by mass or less based on the solution of the B polymer. The amount of Leodor TW-L120 is preferably 3% by mass or less, more preferably 2% by mass or less, and is in the range of 0.05 to 1.5% by mass with respect to the solution of the B polymer. Is most preferable. Since the step of obtaining the protective tape PT from the adhesive material Tb according to the modified example is the same as that of the embodiment, the description thereof will be omitted.

The B polymer has a property of lowering the adhesive strength by irradiation with ultraviolet rays, that is, an ultraviolet curable property. That is, the adhesive material Tb obtained from the solution of the B polymer and Leodor TW-L120 has both UV curable properties and moisture-sensitive adhesive force reducing properties. Therefore, when the protective tape PT having the adhesive material Tb containing the B polymer is peeled off from the wafer W, first, the protective tape PT is irradiated with ultraviolet rays to reduce the adhesive strength to some extent, and then the protective tape PT and the wafer W are combined. The protective tape PT can be suitably peeled off from the wafer W by bringing the liquid L into contact with the interface to further significantly reduce the adhesive force.

When the protective tape PT including the adhesive material Tb containing the B polymer is peeled from the wafer W, the peeling unit 16 in the protective tape peeling device 3 further includes an ultraviolet irradiation mechanism 201 in which the ultraviolet lamp 201a is arranged. Then, in step S5-2, first, as shown in FIG. 35 (a), the adhesive material Tb is irradiated with ultraviolet rays Va by using the ultraviolet irradiation mechanism 201. By irradiating with ultraviolet rays, the adhesive force of the adhesive material Tb to the wafer W is reduced.

However, the adhesive material Tb has a certain adhesive strength in the state of being irradiated with the ultraviolet rays. Therefore, if the entire protective tape PT is to be peeled off from the wafer W without using the liquid L in this state, stress acts on the wafer W and the wafer W is frequently damaged.

Therefore, after irradiating with ultraviolet rays Va, as shown in FIG. 35 (b), the tip portion 59a of the first peeling member 59 is pierced into the outer peripheral portion of the protective tape PT to deform the end portion of the base material Ta. Then, by winding the release tape HT in a state where the release tape HT is attached to the end portion of the protective tape PT, the release start portion Ds is formed on the peripheral edge portion of the wafer W. Then, step S5-3 is started, and as shown in FIG. 35 (c), the liquid L is supplied to the peeling start portion Ds using the liquid supply nozzle 68.

When the liquid L comes into contact with the pressure-sensitive adhesive Tb having a moisture-sensitive adhesive strength-reducing property, the adhesive strength of the pressure-sensitive adhesive Tb is further reduced or eliminated. Therefore, when the entire protective tape PT is peeled off in step S5-4, the magnitude of stress acting on the wafer W can be significantly reduced. Therefore, the protective tape PT can be easily peeled from the wafer W with a smaller peeling force St without causing damage to the wafer W.

As a substitute for the B polymer, a polymer containing butyl acrylate or the like (hereinafter referred to as "C polymer") or a polymer containing -2-ethylhexyl acrylate or the like (hereinafter referred to as "D polymer") as described below ”) May be used. The C polymer and the D polymer have UV curability like the B polymer. Hereinafter, a step of obtaining the C polymer and a step of obtaining the D polymer will be described. Regarding the step of obtaining the pressure-sensitive adhesive Tb using the C polymer and Leodor TW-L120 and the step of obtaining the pressure-sensitive material Tb using the D polymer and Leodor TW-L120, the B polymer and Leodor TW-L120 are used. Since it is the same as the step of obtaining the adhesive material Tb, the description thereof will be omitted.

<C polymer>
The process of obtaining a solution of C polymer will be described. First, 100 parts by mass of butyl acrylate, 78 parts by mass of ethyl acrylate, 40 parts by mass of -2-hydroxylethyl acrylate, 0.3 parts by mass of a polymerization initiator (benzoyl peroxide (BPO)), and a solvent ( A monomer composition was prepared by mixing with (toluene). Next, the monomer composition was put into a 1-liter round-bottomed separable flask equipped with a separable cover, a separating funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade. The mixture was placed in a laboratory device and subjected to nitrogen substitution at room temperature for 6 hours with stirring. Then, nitrogen was kept inflow and stirred at 60 ° C. for 6 hours, and further held at 78 ° C. for 1 hour for polymerization to obtain a resin solution. The obtained resin solution was cooled to room temperature. Then, 42.6 parts by mass of 2-isocyanatoethyl methacrylate (manufactured by Showa Denko Co., Ltd., trade name: Karenz MOI, "Karenzu" is a registered trademark) was added to the resin solution as a compound having a polymerizable carbon-carbon double bond. added. Further, 0.2 parts by mass of dibutyltin dilaurate IV (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and a solution of C polymer was prepared by stirring at 50 ° C. for 24 hours in an air atmosphere.

<D polymer>
The step of obtaining a solution of D polymer will be described. First, 100 parts by mass of -2-ethylhexyl acrylate, 25.5 parts by mass of acryloyl molofophosphoric acid, 22 parts by mass of -2-hydroxylethyl acrylate, and 0.3 parts by mass of a polymerization initiator (benzoyl peroxide (BPO)). A monomer composition was prepared by mixing a mass portion and a solvent (toluene). Next, the monomer composition was put into a 1-liter round-bottomed separable flask equipped with a separable cover, a separating funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade. The mixture was placed in a laboratory device and subjected to nitrogen substitution at room temperature for 6 hours with stirring. Then, nitrogen was introduced and kept at 60 ° C. for 8 hours with stirring for polymerization to obtain a resin solution. The obtained resin solution was cooled to room temperature. Then, 22.5 parts by mass of 2-isocyanatoethyl methacrylate (manufactured by Showa Denko Co., Ltd., trade name: Karenz MOI, "Karenzu" is a registered trademark) was added to the resin solution as a compound having a polymerizable carbon-carbon double bond. added. Further, 0.1 part by mass of dibutyltin dilaurate IV (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and a solution of D polymer was prepared by stirring at 50 ° C. for 24 hours in an air atmosphere.

(12) In the example, as long as the pressure-sensitive adhesive Tb has a moisture-sensitive adhesive strength lowering property, the structure is not limited to the structure containing the parent liquid material C. As an example, the pressure-sensitive adhesive Tb obtained by adding a photopolymerization initiator and a cross-linking agent to a solution of a B polymer or a C polymer has a moisture-sensitive adhesive strength-reducing property even if it does not contain the parent liquid material C. Has been confirmed to have. When the protective tape PT provided with the adhesive material Tb is peeled off from the wafer W, the adhesive material Tb for the wafer W is formed by forming the peeling start portion Ds and bringing the liquid L into contact with the peeling start portion Ds as in the embodiment. Adhesive strength is greatly reduced or eliminated.

1 ... Wafer mounting device 2 ... Support tape affixing device 3 ... Protective tape peeling device 4 ... Wafer transfer mechanism 5 ... Container 6 ... Frame collection unit 7 ... Aligner 8 ... Holding table 9 ... Frame supply unit 11 ... Peeling table 13 ... Affixing unit 14… Chamber 14A… Lower housing 14B… Upper housing 16… Peeling unit 17… Liquid supply unit 18… Drying unit 20… Wafer transfer device 21… Frame transfer device 28… Holding arm 32… Suction plate 33… Suction pad 35… Vacuum device 38 ... Frame holding part 41 ... Rail 49 ... Rotating shaft 50 ... Rotating motor 51 ... 1st peeling mechanism 52 ... 2nd peeling mechanism 59 ... 1st peeling member 68 ... Liquid supply nozzle 71 ... Support tape supply part 72 ... Separator recovery part 73 ... Support tape sticking part 74 ... Support tape collecting part 75 ... Separator peeling roller 76 ... Liquid supply pipe 77 ... Liquid discharge pipe 78 ... Liquid storage tank 81 ... Tape sticking mechanism 82 ... Tape cutting mechanism 85 ... Sticking roller 86 ... Nip roller 95 … Cutter 103… Vacuum device 106… Control unit 119… Second peeling member 131… Work drying mechanism 132… Tape drying mechanism 133… Scattering prevention tank 141… Vacuum device 143… Liquid absorbing roller 144… Liquid absorbing roller W… Semiconductor wafer f … Ring frame DT… Support tape PT… Protective tape HT… Peeling tape L… Liquid Ta… Base material Tb… Adhesive material C… Parent liquid material Vh… Polymer adhesive CS… Liquid layer

Claims (6)

A sheet-like adhesive material peeling device for peeling a sheet-like adhesive material attached to a work from the work.
The sheet-shaped adhesive material has a moisture-sensitive adhesive force-reducing adhesive layer that reduces the adhesive force when it comes into contact with a liquid.
A part of the outer peripheral portion of the sheet-shaped adhesive material is peeled off from the work to form a peeling start part which is a part at the interface between the moisture-sensitive adhesive force-reducing adhesive layer and the work and which is starting to be peeled off. Starting site formation mechanism and
A liquid supply mechanism that supplies liquid to at least a part of the peeling start site,
The state in which the liquid supplied to the peeling start site or the liquid additionally supplied is in contact with at least a part of the peeling site that is moving with the peeling of the sheet-like adhesive material is maintained. A peeling mechanism that moves the sheet-shaped adhesive material relative to the work in a predetermined peeling direction and peels the sheet-shaped adhesive material from the work.
A sheet-like adhesive material peeling device comprising. In the sheet-like adhesive material peeling device according to claim 1,
The peeling start site forming mechanism is
A holding member that holds the end of the sheet-shaped adhesive and
A holding member moving mechanism that moves the holding member in a direction away from the work,
Is equipped with
The sheet-shaped adhesive material peeling is characterized in that the peeling start portion is formed by moving the holding member in a direction away from the work while the holding member holds the end portion of the sheet-shaped pressure-sensitive adhesive material. apparatus. In the sheet-like adhesive material peeling device according to claim 1 or 2.
The peeling start site forming mechanism is
A peeling member with a tapered tip and
A peeling member moving mechanism that moves the peeling member from the outer peripheral portion to the central portion of the sheet-shaped adhesive material,
Is equipped with
A sheet-shaped pressure-sensitive adhesive peeling device, wherein the peeling member moving mechanism forms the peeling start portion by allowing the tip portion of the peeling member to enter from the outer peripheral portion of the sheet-shaped pressure-sensitive adhesive material. In the sheet-like adhesive material peeling device according to claim 3,
The liquid supply mechanism is provided on the peeling member, and the liquid supply mechanism is provided on the peeling member.
The liquid supply mechanism supplies the liquid to the peeling start portion while the peeling member moving mechanism causes the tip portion of the peeling member to enter from the outer peripheral portion of the sheet-like adhesive material to form the peeling start portion. A sheet-like adhesive material peeling device characterized by this. In the sheet-like adhesive material peeling device according to any one of claims 1 to 4.
A sheet-shaped pressure-sensitive adhesive peeling device comprising a drying mechanism for drying the work from which the sheet-shaped pressure-sensitive adhesive has been peeled off and the sheet-shaped pressure-sensitive adhesive material peeled off from the work. In the sheet-like adhesive material peeling device according to any one of claims 1 to 5.
An adhesive sensor that detects the adhesive force of the sheet-like adhesive material at the peeled portion, and an adhesive sensor.
A sheet-like adhesive characterized by comprising a control unit that controls the liquid supply mechanism to supply the liquid to the peeling portion when the adhesive force detected by the adhesive sensor is equal to or higher than a predetermined value. Material peeling device.

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