JP2021090002A - Shunt resistor module - Google Patents

Abstract

To provide a shunt resistor module capable of improving the heat dissipation of a resistor.SOLUTION: A shunt resistor module (1) according to the present invention includes a shunt resistor (2) having a resistor (5) and electrodes (6, 7) provided at both ends of the resistor, and wiring members (8, 9) connected to the respective electrodes, in which in a plan view (A), a part of a wiring member overlaps the resistor. In the shunt resistor module according to the present invention, a part of the wiring member is arranged so as to overlap the resistor in a plan view, and therefore, the heat of the resistor can be easily dissipated to the wiring member side. Therefore, the heat dissipation of the resistor can be improved, and the current measurement can be performed with high accuracy.SELECTED DRAWING: Figure 2

Description

The present invention relates to a shunt resistor module with a shunt resistor.

For example, a shunt resistor is used to detect a current in a power semiconductor device or the like.

Patent Document 1 discloses a structure of a resistor and a shunt resistor provided with electrodes on both sides thereof, and a bus bar (wiring member) is connected to the electrodes. Further, the shunt resistor is provided with a voltage detection terminal for measuring a voltage value between electrodes.

Japanese Unexamined Patent Publication No. 2016-217829

When a current flows through the shunt resistor, the resistor generates heat, and there is a problem that the current value cannot be measured accurately. In particular, in high-voltage applications (current detection) such as power semiconductor devices, a large current flows through the shunt resistor, so the amount of heat generated by the resistor becomes extremely large. There wasn't.

Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a shunt resistance module capable of improving heat dissipation of a resistor.

The shunt resistor module of one aspect of the present invention has a shunt resistor including a resistor, electrodes provided at both ends of the resistor, and a wiring member connected to each electrode, and has a flat surface. Visually, a part of the wiring member overlaps the resistor.

According to the shunt resistance module of the present invention, by arranging a part of the wiring member so as to overlap the resistor in a plan view, the heat of the resistor can be easily dissipated to the wiring member side. Therefore, the heat dissipation of the resistor can be improved, and the current measurement can be performed with high accuracy.

FIG. 1A is a perspective view of the shunt resistance module of the present embodiment, and FIG. 1B is a side view of the shunt resistance module. It is a partially enlarged side view which enlarged the shunt resistance module of FIG. 1B. It is an exploded perspective view of the shunt resistance module of this embodiment.

Hereinafter, the shunt resistance module according to the present embodiment will be described with reference to the accompanying drawings.

<Shunt resistance module 1 of this embodiment>
As a result of diligent research, the present inventor has developed the present invention so as to have a structure in which the heat of the resistor is easily dissipated to the wiring member side connected to the shunt resistor.

That is, the shunt resistance module 1 of the present embodiment has the following features.
(1) A shunt resistor 2 including a resistor 5 and electrodes 6 and 7 provided at both ends of the resistor.
(2) Wiring members 8 and 9 connected to the electrodes 6 and 7 are provided.
(3) In the plan view A, a part of the wiring members 8 and 9 overlaps the resistor 5.
Hereinafter, the structure of the shunt resistor module 1 of the present embodiment will be specifically described.

FIG. 1A is a perspective view of the shunt resistance module of the present embodiment, and FIG. 1B is a side view of the shunt resistance module. FIG. 2 is an enlarged partially enlarged side view of the shunt resistor module of FIG. 1B. FIG. 3 is an exploded perspective view of the shunt resistor module of the present embodiment.

As shown in FIGS. 1 to 3, the shunt resistor module 1 in the present embodiment fixes the shunt resistor 2, the wiring members 8 and 9, the heat radiating member 10, and the shunt resistor 2 and the wiring member 3. It is configured to have a fixing member 11 and a fixing member 11. In the following, the expressions "upper surface", "lower surface", "upper", and "lower" are used, but "upper surface" and "upper surface" refer to the upper surface and direction in the drawing, and are viewed from the shunt resistor 2. , Refers to the side opposite to the arrangement side of the wiring members 8 and 9. Further, "lower surface" and "lower surface" refer to the lower surface and direction in the drawing, and refer to the arrangement side of the wiring members 8 and 9 when viewed from the shunt resistor 2.

(Shunt resistor 2)
As shown in FIGS. 1 to 3, the shunt resistor 2 is provided at the resistor 5, the first electrode 6 provided at one end of the resistor 5, and the other end of the resistor 5. It is configured to have a second electrode 7. The first electrode 6 and the second electrode 7 have lower electrical resistance values than the resistor 5. Although the material is not limited, for example, the resistor 5 is a metal such as Cu—Ni, Cu—Mn, or Ni—Cr, and the electrodes 6 and 7 are metals such as Cu. ..

The shunt resistor 2 has a substantially flat plate shape, but in the present embodiment, the thickness t1 of the electrodes 6 and 7 is formed to be thicker than the thickness t2 of the resistor 5, and the upper surface of the shunt resistor 2 is formed. While 2a is a substantially flat surface, the electrodes 6 and 7 of the lower surface 2b of the shunt resistor 2 project downward from the resistor 5. Therefore, on the lower surface 2b side of the shunt resistor 2, a recess 2c in which the portion of the resistor 5 is recessed from the electrodes 6 and 7 is provided.

As shown in FIG. 3, fixing holes 6a and 7a are formed in the electrodes 6 and 7. As shown in FIGS. 1 to 3, voltage detection terminals 12a and 12b are formed on the upper surfaces of the first electrode 6 and the second electrode 7. These voltage detection terminals 12a and 12b have, for example, a pin shape protruding upward. The voltage detection terminals 12a and 12b can be attached to the upper surfaces of the first electrode 6 and the second electrode 7 by welding or the like.

(Wiring members 8 and 9)
The wiring members 8 and 9 are, for example, bus bars, and are connected to the lower surfaces of the electrodes 6 and 7, respectively, as shown in FIGS. 1 and 2. Although the shape of the wiring members 8 and 9 is not limited, it is preferably flat as shown in FIGS. 1 and 3. The wiring members 8 and 9 are formed with fixing holes 8a and 9a communicating with the fixing holes 6a and 7a provided in the electrodes 6 and 7. Although not shown, for example, one of the wiring member 8 or the wiring member 9 is connected to the battery, and the other is driven by the battery or various devices are connected.

As shown in FIG. 2, a part of the wiring members 8 and 9 connected to the electrodes 6 and 7 face each other directly under the resistor 5. That is, the opposite end portions 8b, 9b of the wiring members 8 and 9 overlap with the resistor 5 in the plan view A (arrow view toward the upper surface 2a of the shunt resistor 2 shown in FIG. 2). In order to overlap the ends 8b and 9b of the wiring members 8 and 9 and the resistor 5 in the plan view A, from the fixing holes 8a and 9a of the wiring members 8 and 9 to the end faces 8c and 9c. The length L1 is formed to be longer than the length from the fixing holes 6a and 7a of the electrodes 6 and 7 to the end faces 6c and 7c on the side in contact with the resistor 5.

(Heat dissipation member 10)
As shown in FIGS. 1 to 3, in the present embodiment, the heat radiating member 10 is sandwiched between the lower surface of the resistor 5 and the upper surfaces of the ends 8b and 9b of the wiring members 8 and 9. The “heat dissipation member” refers to a member that receives heat generated from the resistor 5 and dissipates it to the wiring members 8 and 9.

In the present embodiment, the heat radiating member 10 is an electrically insulating heat radiating sheet. As a result, it is possible to electrically insulate the resistor 5 from the wiring members 8 and 9 and between the wiring members 8 and 9. The material of the heat radiating member 10 does not matter, but the thermal conductivity is at least higher than that of air. A commercially available heat radiating sheet can be used for the heat radiating member 10. In the present embodiment, the heat radiating member 10 includes a first heat radiating member 10a interposed between the wiring members 8 and 9 and the resistor 5, and a second heat radiating member 10b interposed between the wiring members 8 and 9. Is a substantially T-shaped form integrally formed with.

In the present embodiment, on the lower surface 2b side of the shunt resistor 2, the portion of the resistor 5 of the shunt resistor 2 is provided with a recess 2c recessed from the electrodes 6 and 7, and therefore, FIG. 2 shows. As shown, a gap is formed between the lower surface of the resistor 5 and the upper surface of the wiring members 8 and 9. Therefore, the first heat radiating member 10a can be interposed in this gap. Further, since there is a predetermined space between the ends 8b and 9b of the wiring members 8 and 9, the second heat radiating member 10b is interposed in the gap formed between the wiring members 8 and 9. Can be done.

As shown in FIG. 1B, it is preferable that the second heat radiating member 10b is formed with a length extending downward from the lower surface of each of the wiring members 8 and 9 in order to further enhance the heat radiating effect.

(Assembly of shunt resistor module 1)
As shown in FIG. 3, a first heat radiating member 10a constituting the heat radiating member 10 is arranged in a recess 2c provided on the lower surface 2b of the shunt resistor 2 facing the resistor 5, and a second heat radiating member is provided. With the member 10b sandwiched between them, the wiring members 8 and 9 are arranged on the lower surfaces of the electrodes 6 and 7 so that the fixing holes 6a, 7a, 8a and 9a are aligned with each other.

Then, the wiring members 8 and 9 are fixedly supported by the fixing members 11 on the electrodes 6 and 7 of the shunt resistor 2. In this embodiment, the fixing member 11 is a combination of a bolt and a nut, but the fixing member 11 is not limited to this.

When measuring the current, a current is passed between the wiring members 8 and 9 via the shunt resistor 2. At this time, the voltage value between the voltage detection terminals 12a and 12b, that is, the voltage value between the electrodes 6 and 7 of the shunt resistor 2 is measured. Since the resistance value of the resistor 5 of the shunt resistor 2 is known, the current value can be detected by Ohm's law.

<About the effect of this embodiment>
When a current flows through the shunt resistor 2, heat is mainly generated from the resistor 5 having a large resistance value, but in the present embodiment, the ends 8b, 9b and the resistor 5 of the wiring members 8 and 9 are connected to each other. Since they are arranged so as to be overlapped in the plan view A, the heat of the resistor 5 can be dissipated to the wiring members 8 and 9 side. At this time, since the wiring members 8 and 9 are made of metal and have high thermal conductivity, the heat dissipation of the resistor 5 can be effectively improved. As a result, the current measurement can be performed with high accuracy. In addition, in the present embodiment, the heat dissipation effect can be obtained with a simple structure. That is, in the present embodiment, the arrangement of the end portions 8b and 9b of the wiring members 8 and 9 is improved so as to overlap with the resistor 5 in the plan view A. It can be improved to obtain the optimum heat dissipation structure, and the number of parts can be minimized.

In the present embodiment, as shown in FIG. 2 and the like, the electrodes 6 and 7 are projected downward from the resistor 5 on the lower surface 2b side of the shunt resistor 2, and the recess 2c is formed on the lower surface side of the resistor 5. Was provided. As a result, when the wiring members 8 and 9 are fixed to the electrodes 6 and 7 of the shunt resistor 2, a gap based on the recess 2c is interposed between the resistor 5 and the wiring members 8 and 9, and the resistor 5 and The wiring members 8 and 9 can be prevented from coming into contact with each other. As a result, an electric current can be appropriately passed between the electrodes 6 and 7 of the shunt resistor 2 and the wiring members 8 and 9.

Further, in the present embodiment, the first heat radiating member 10a is arranged in the gap between the resistor 5 of the shunt resistor 2 and the wiring members 8 and 9. The first heat radiating member 10a is an electrically insulating member, and can more reliably electrically insulate between the resistor 5 and the wiring members 8 and 9, and can also generate heat generated by the resistor 5. , It is possible to effectively dissipate heat to the wiring members 8 and 9 side via the first heat radiating member 10a.

Further, in the present embodiment, a second heat radiating member 10b is provided between the wiring members 8 and 9. As a result, the heat from the resistor 5 can be easily dissipated to the lower side of the wiring members 8 and 9 via the second heat radiating member 10b. In particular, it can be effectively applied to high voltage applications (current detection) such as power semiconductor devices in which a large current flows through the shunt resistor 2.

In the present embodiment, the first heat radiating member 10a and the second heat radiating member 10b can be provided as separate bodies, but as shown in FIG. 3 and the like, the first heat radiating member 10a and the second heat radiating member 10b Is preferable because the heat dissipation effect can be enhanced and the shunt resistance module 1 can be easily assembled.

As described above, the present embodiment and the modified examples have been described, but as another embodiment, the above-described embodiments and modified examples may be combined in whole or in part.

Further, the present embodiment is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea. Further, if the technical idea can be realized in another way by the advancement of the technology or another technology derived from it, it may be carried out by using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea.

For example, in the present embodiment, the heat radiating member 10 may not be arranged, and a gap as an air layer may be interposed between the resistor 5 and the wiring members 8 and 9. According to this configuration, the heat generated from the resistor 5 can be dissipated to the wiring members 8 and 9 via the air layer. In the present embodiment, it is sufficient to leave a gap between the resistors 5 and the wiring members 8 and 9 so that the resistors 5 and the wiring members 8 and 9 do not come into contact with each other. The heat dissipation effect can be enhanced by making it as narrow as possible. However, it is preferable that the first heat radiating member 10a is interposed in the gap between the resistor 5 and the wiring members 8 and 9, because the heat radiating effect can be further enhanced.

Further, the lower surfaces of the resistors 5 and the electrodes 6 and 7 constituting the shunt resistor 2 may be at substantially the same position, and the lower surface 2b of the shunt resistor 2 may be a substantially flat surface. In such a configuration, the shunt resistor 2 and the wiring members 8 and 9 are arranged at intervals so as to leave a gap between the resistor 5 of the shunt resistor 2 and the wiring members 8 and 9, and the electrodes 6 are arranged. , 7 and the wiring members 8 and 9 need to be electrically connected. At this time, it is preferable that the first heat radiating member 10a is interposed in the gap provided between the resistor 5 and the wiring members 8 and 9. Further, by using the fixing member 11 as a conductive member, the electrodes 6 and 7 and the wiring members 8 and 9 can be fixedly supported and made conductive.

Further, the heat radiating member 10 may be composed of only the first heat radiating member 10a interposed between the resistor 5 of the shunt resistor 2 and the wiring members 8 and 9, but in order to further enhance the heat radiating effect, the heat radiating member 10 may be composed of only the first heat radiating member 10a. It is preferable that the second heat radiating member 10b is arranged between the wiring members 8 and 9, and that the first heat radiating member 10a and the second heat radiating member 10b are integrally formed.
The feature points in the above-described embodiment are summarized below.

The shunt resistor module according to the above embodiment includes a shunt resistor including a resistor, electrodes provided at both ends of the resistor, and a wiring member connected to each electrode. In a plan view, a part of the wiring member overlaps the resistor.

Further, in the shunt resistance module of the present embodiment, it is preferable that the wiring member and the resistor are not in contact with each other.

Further, in the shunt resistance module of the present embodiment, it is preferable that the electrode projects toward the wiring member side with respect to the resistor.

Further, in the shunt resistance module of the present embodiment, it is preferable that the first heat radiating member is interposed between the wiring member and the resistor.

Further, in the shunt resistance module of the present embodiment, it is preferable that a second heat radiating member is interposed between the wiring members.

Further, in the shunt resistance module of the present embodiment, it is preferable that the first heat radiating member and the second heat radiating member interposed between the wiring members are integrally formed.

As described above, the shunt resistor module of the present invention has excellent heat dissipation and can perform current detection with high accuracy. For example, it is applied to current detection for control applications such as power semiconductor devices and energy management of batteries. Can be done.

1: Shunt resistance module 2: Shunt resistor 2a: Top surface 2b: Bottom surface 2c: Recessed portion 3: Wiring member 5: Resistor 6: First electrode 7: Second electrode 8, 9: Wiring member 10: Heat dissipation member 10a : First heat radiation member 10b: Second heat radiation member 11: Fixing members 12a, 12b: Voltage detection terminal 12b: Voltage detection terminal A: Plan view

Claims (6)

A shunt resistor comprising a resistor and electrodes provided at both ends of the resistor.
It has a wiring member connected to each electrode,
A shunt resistance module characterized in that a part of the wiring member overlaps the resistor in a plan view. The shunt resistance module according to claim 1, wherein the wiring member and the resistor are not in contact with each other. The shunt resistance module according to claim 1 or 2, wherein the electrode projects toward the wiring member side with respect to the resistor. The shunt resistance module according to any one of claims 1 to 3, wherein a first heat radiating member is interposed between the wiring member and the resistor. The shunt resistance module according to any one of claims 1 to 4, wherein a second heat radiating member is interposed between the wiring members. The shunt resistance module according to claim 4, wherein the first heat radiating member and the second heat radiating member interposed between the wiring members are integrally formed.

Images