JP2021086050A - Optical waveguide module - Google Patents

Abstract

To provide an optical waveguide module with reduced height.SOLUTION: An optical waveguide module comprises: a substrate 1; an optical waveguide 5 that is located on a top face of the substrate and has a cladding layer 3 and a core layer 4 located in the cladding layer, in which an emission end face 42 of the core layer is exposed to the outside of the cladding layer; a condenser lens 45 that is located opposite to the emission end face and a side face of the substrate in the emission end face side; and a joint layer 17 that joins the condenser lens to the side face of the substrate.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to an optical waveguide module.

The optical waveguide module of the prior art is described in, for example, Patent Document 1. In this conventional technique, each of the plurality of lens units has a lens portion that collects the laser light output from the laser light source, and a support portion provided with a convex guide that supports the lens unit. The carrier substrate as an optical waveguide has a first main surface on which a plurality of laser light sources are mounted, a stepped surface that supports a plurality of lens units, and a second main surface on which an optical combiner is mounted. Concave guides are provided on at least one of the stepped surface and the second main surface, and the convex guides of each lens unit are guided by the concave guides so that the optical axis of the laser light source and the optical axis of the lens portion coincide with each other. It is positioned so as to be fixed to the carrier substrate by an adhesive, and this carrier substrate is fixed to the package substrate.

Japanese Unexamined Patent Publication No. 2017-1330543

In the prior art described in Patent Document 1, the support portion of the lens unit is fixed to the stepped surface of the carrier substrate with an adhesive, and the lens portion of the lens unit and the holding portion for holding the lens portion are from the upper surface of the carrier substrate. It is located above. Therefore, there is a demand for an optical waveguide module that has a large protrusion height from the package substrate of the lens unit and can reduce the height.

The optical waveguide module of the present disclosure has a substrate, a clad layer located on the upper surface of the substrate, and a core layer located in the clad layer, and the exit end surface of the core layer is outside the clad layer. It includes an exposed optical waveguide, an optical member located facing the exit end surface and the side surface of the substrate on the exit end surface side, and a bonding layer for joining the optical member and the side surface of the substrate. It is characterized by that.

According to the optical waveguide module of the present disclosure, the optical member is located so as to face the emission end surface and the side surface of the substrate on the emission end surface side, and the optical member and the side surface of the substrate are joined by a bonding layer. As a result, the height of the optical member protruding from the substrate can be reduced by the thickness of the substrate, and a low-profile optical waveguide module can be provided.

It is an exploded perspective view which shows the optical waveguide module of Embodiment 1 of this disclosure. It is a side view of the optical waveguide package shown in FIG. It is an enlarged cross-sectional view around the condenser lens. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 2 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 3 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 4 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 5 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 6 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 7 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 8 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 9 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 10 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 11 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 12 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 13 of this disclosure. It is an enlarged sectional view which shows the optical waveguide module of Embodiment 14 of this disclosure. It is an exploded perspective view which shows the optical waveguide package which comprises the optical waveguide module of Embodiment 15 of this disclosure. It is a side view of the optical waveguide package shown in FIG.

(Embodiment 1)
FIG. 1 is an exploded perspective view showing the optical waveguide module of the first embodiment of the present disclosure, and FIG. 2 is a side view of the optical waveguide package shown in FIG. FIG. 3 is an enlarged cross-sectional view of the vicinity of the condenser lens. In each of the following embodiments, it is assumed that the optical waveguide packages shown in FIG. 2 are arranged horizontally, the vertical direction of FIG. 2 is the thickness direction of the optical waveguide package, and the horizontal direction of FIG. 2 is the optical waveguide package. It will be described as assuming that the longitudinal direction and the direction perpendicular to the paper surface of FIG. 2 correspond to the width direction of the optical waveguide package, respectively.

The optical waveguide package of the present embodiment includes a substrate 1 and an optical waveguide 5 having a clad layer 3 and a core layer 4 located in the clad layer 3 as well as being located on the upper surface 2 of the substrate 1. The clad layer 3 has a bottom surface 6 and a plurality of recesses 8 located so as to surround the bottom surface 6. Each of the plurality of recesses 8 constitutes an element mounting portion. The sealing lid 11 is laminated so as to cover these recesses 8. The plurality of recesses 8 may have an inner wall surface 7 that is inclined so that the upper side is located outside the lower side.

In the present embodiment, the optical waveguide package has a plurality of recesses 8 (3 in the present embodiment) accommodating each of the light emitting elements 10, and each light emitting element 10 is included in the light emitting device 20. As the light emitting element 10, a laser diode or the like is applied. The optical waveguide 5 is configured by integrally coupling the core layer 4 and the clad layer 3. The substrate 1 may be formed by laminating a plurality of dielectric layers.

The substrate 1 may be a ceramic wiring board whose dielectric layer is made of a ceramic material. Examples of the ceramic material used in the ceramic wiring substrate include an aluminum oxide-based sintered body, a mulite-based sintered body, a silicon carbide sintered body, an aluminum nitride-based sintered body, and a glass-ceramic sintered body. When the substrate 1 is a ceramic wiring substrate, the dielectric layer is provided with conductors such as a connection pad for electrical connection between a light emitting element and a light receiving element and an external circuit, an internal wiring conductor, and an external connection terminal. To.

The material of the substrate 1 may be, for example, an organic wiring board in which the dielectric layer is made of an organic material. The organic wiring board is, for example, a printed wiring board, a build-up wiring board, a flexible wiring board, or the like. Examples of the organic material used for the organic wiring substrate include epoxy resin, polyimide resin, polyester resin, acrylic resin, phenol resin, fluororesin and the like.

The optical waveguide 5 may be, for example, glass such as quartz, resin, or the like. The optical waveguide 5 may be made of glass or resin as the material constituting the core layer 4 and the clad layer 3, and may be one of glass and the other of resin. In this case, the refractive indexes of the core layer 4 and the clad layer 3 are different, and the core layer 4 has a higher refractive index than the clad layer 3. This difference in refractive index is used to totally reflect light. That is, if the path is made of a material having a high refractive index and the surrounding area is surrounded by a material having a low refractive index, the light can be confined in the core layer 4 having a high refractive index.

The core layer 4 has a plurality of dividing paths 41a, 41b, 41c and a plurality of dividing paths 41a having the incident end faces 4a to 4c as one end between the plurality of incident end faces 4a, 4b, 4c and one exit end face 42. , 41b, 41c meet to form a combined waveguide 43 via an integrated path 44 having an exit end surface 42 as one end.

The condenser lens 45, which is an optical member, is arranged so as to face the exit end surface 42 of the core layer 4 and the side surface of the substrate 1 on the exit end surface 42 side. The optical axis of the condenser lens 45 is located on the central axis of the emission end surface 42. At this time, the condenser lens 45, which is an optical member, may have at least a part of the exit end surface 42 of the core layer 4 and the side surface of the substrate 1 on the exit end surface 42 side facing each other.

The red (R) light, green (G) light, and blue (B) light emitted from each light emitting element 10 are incident on the dividing paths 41a, 41b, and 41c from the incident end faces 4a, 4b, and 4c, and are combined. After passing through the wave portion 43 and the integrated path 44, the light is collected by the condenser lens 45 and emitted.

The condenser lens 45 is, for example, a plano-convex lens having an incident surface formed on a flat surface and an emitting surface having a convex surface. The optical waveguide layer, the light emitting element 10, and the condensing lens 45 are assembled so that the optical axes of the dividing paths 41a, 41b, and 41c coincide with the center of the light emitting portion of each light emitting element 10. To configure.

The optical waveguide module of the present embodiment has a substrate 1, a core layer 4 located on the upper surface 2 of the substrate 1, a clad layer, and a core layer 4 located in the clad layer 3, and the exit end surface 42 of the core layer 4 is a clad layer. The optical waveguide 5 exposed to the outside of No. 3, the condenser lens 45 located facing the exit end surface 42 and the side surface of the substrate 1 on the exit end surface 42 side, and the condenser lens 45 and the side surface of the substrate 1 are joined. It includes a bonding layer 17. The lower end of the bonding layer 17 is located above the lower surface of the substrate 1.

By adopting such a configuration, the thickness of the substrate 1 for supporting the condenser lens 45 can be omitted, the thickness in the vertical direction can be suppressed, and the height of the optical waveguide module can be reduced.

As the bonding layer 17, for example, an epoxy adhesive is applied to the lower side surface of the lens region of the condenser lens 45, and then the condenser lens 45 is positioned so that its optical axis coincides with the optical axis of the core layer 4. It may be realized by sticking it on the side surface of the substrate 1 and curing the adhesive.

The adhesive is not limited to the epoxy adhesive, and for example, an ultraviolet curable adhesive may be used. As the ultraviolet curable adhesive, an epoxy-based adhesive, an acrylic-based adhesive, a urethane-based adhesive, an ester-based adhesive, a silicon-based adhesive, or the like can be used. The thickness of such a bonding layer 17 may be, for example, about 0.01 μm to 1000 μm.

The region where the bonding layer 17 is formed may be the entire surface of the region where the side surface 1a of the substrate 1 and the condenser lens 45 face each other, or may be formed only on both sides in the width direction, which is a part of the region. It may be formed only in the central portion in the width direction.

(Embodiment 2)
FIG. 4 is an enlarged cross-sectional view showing the optical waveguide module of the second embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the side surface 1a of the substrate 1 is located closer to the condenser lens 45 than the one plane m including the surface where the exit end surface 42 of the optical waveguide 5 is exposed. The term "close" means that the bonding layer 17 protrudes according to the desired adjustment of the optical axis, and may be about the same as the thickness of the bonding layer 17 of 0.01 μm to 1000 μm.

By adopting such a configuration, the side surface of the substrate 1 can be projected toward the condenser lens 45 side from the end surface of the optical waveguide 5, and the optical axis can be adjusted by the bonding layer 17. Even in such optical axis adjustment, since the condenser lens 45 is bonded to the side surface of the substrate 1 by the bonding layer 17, it does not interfere with the light passing region.

(Embodiment 3)
FIG. 5 is an enlarged cross-sectional view showing the optical waveguide module of the third embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, at least a part of the surface of the condenser lens 45 in contact with the bonding layer 17 is roughened. The region to be roughened may be the entire surface of the region where the side surface 1a of the substrate 1 and the condenser lens 45 face each other, or a part thereof, as in the region where the bonding layer 17 is formed. It may be formed only on both sides in the direction, or may be formed only on the center in the width direction.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be roughened, for example, with a surface roughness Ra of about 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

By adopting such a configuration, the lower side surface 45a of the condenser lens 45 is roughened, so that the bonding force by the bonding layer 17 is increased and the support stability of the condenser lens 45 can be improved. it can.

(Embodiment 4)
FIG. 6 is an enlarged cross-sectional view showing the optical waveguide module of the fourth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the bonding layer 17 has a support portion 17a in contact with the lower surface of the condenser lens 45.

By adopting such a configuration, the bonding region formed by the bonding layer 17 extends to the lower surface of the condenser lens 45, whereby the support stability of the condenser lens 45 can be improved. Also in this case, the bonding layer 17 in contact with the lower surface of the condenser lens 45 may be roughened, or the entire or part of the remaining bonding region may be roughened. Thereby, even higher bonding strength can be obtained.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be roughened, for example, with a surface roughness Ra of about 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

(Embodiment 5)
FIG. 7 is an enlarged cross-sectional view showing the optical waveguide module according to the fifth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, at least a part of the surface of the condenser lens 45 in contact with the support portion 17a of the bonding layer 17 is roughened.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be roughened, for example, with a surface roughness Ra of about 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

By adopting such a configuration, the bonding by the bonding layer 17 of the condenser lens 45 can be further strengthened, and the support stability is improved. Also in this case, the bonding layer 17 in contact with the lower surface of the condenser lens 45 may be roughened, or the entire or part of the remaining bonding region may be roughened. Thereby, even higher bonding strength can be obtained.

(Embodiment 6)
FIG. 8 is an enlarged cross-sectional view showing the optical waveguide module of the sixth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the upper end portion of the bonding layer 17 is in contact with the upper surface 2 of the substrate 1.

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 is increased, the bonding strength is increased, and the support stability of the condenser lens 45 can be improved. Also in this case, the bonding layer 17 in contact with the lower surface of the condenser lens 45 may be roughened, or the entire or part of the remaining bonding region may be roughened. Thereby, even higher bonding strength can be obtained.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be roughened, for example, with a surface roughness Ra of about 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

(Embodiment 7)
FIG. 9 is an enlarged cross-sectional view showing the optical waveguide module according to the seventh embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the upper end portion of the bonding layer 17 faces the exit end surface 42 of the optical waveguide 5. This facing means that the upper end portion of the bonding layer 17 is located above the upper surface of the substrate 1.

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 can be increased, the bonding strength can be increased, the support stability of the condenser lens 45 can be improved, and the emission light can be diffused. It can be suppressed. In this case as well, the bonding layer 17 in contact with the lower surface of the condenser lens 45 may be roughened, or the entire or part of the remaining bonding region including the upper end portion described above may be roughened. Thereby, even higher bonding strength can be obtained.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be roughened, for example, with a surface roughness Ra of about 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

(Embodiment 8)
FIG. 10 is an enlarged cross-sectional view showing the optical waveguide module of the eighth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the lower side surface of the lens of the bonding layer 17 is in contact with the surface of the condenser lens 45 on the exit end surface 42 side.

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 is increased, the bonding strength is increased, and the support stability of the condenser lens 45 can be improved.

(Embodiment 9)
FIG. 11 is an enlarged cross-sectional view showing the optical waveguide module of the ninth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, in the condenser lens 45, at least a part of the surface 45b of the bonding layer 17 facing the lower side surface of the lens is roughened.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface 1a of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be, for example, 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

By adopting such a configuration, the bonding strength between the condensing lens 45 and the substrate 1 by the bonding layer 17 can be increased, and the support stability of the condensing lens 45 can be improved. Also in this case, the bonding layer 17 in contact with the lower surface of the condenser lens 45 may be roughened, or the entire or part of the remaining bonding region may be roughened. Thereby, even higher bonding strength can be obtained.

(Embodiment 10)
FIG. 12 is an enlarged cross-sectional view showing the optical waveguide module of the tenth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the bonding layer 17 includes an upper bonding portion 17c for joining the condensing lens 45 with an upper region extending over the exit end surface 42 of the optical waveguide 5 and the upper surface of the optical waveguide 5. ..

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 can be increased, the bonding strength can be increased, the support stability of the condenser lens 45 can be improved, and the emission light can be diffused. It can be suppressed. In this case as well, the entire or part of the bonding region including the upper bonding portion 17c of the condenser lens 45 may be roughened. Thereby, even higher bonding strength can be obtained.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be, for example, 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

(Embodiment 11)
FIG. 13 is an enlarged cross-sectional view showing the optical waveguide module according to the eleventh embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the upper joint portion 17c extends on the upper surface of the optical waveguide 5. The term "extending" means that the upper junction 17c is also located on the upper end side of the condenser lens 45 so as not to overlap the core layer 4. That is, the bonding layer 17 may not overlap with the core layer 4 and may be located at a location not on the optical axis.

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 can be increased, the bonding strength can be increased, the support stability of the condenser lens 45 can be improved, and the emission light can be diffused. It can be suppressed. Also in this case, the entire or a part of the bonding region between the condenser lens 45 and the substrate 1 may be roughened. Thereby, even higher bonding strength can be obtained.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be, for example, 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

(Embodiment 12)
FIG. 14 is an enlarged cross-sectional view showing the optical waveguide module according to the twelfth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the surface of the condenser lens 45 facing the upper junction 17c is roughened.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be, for example, 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 can be increased, the bonding strength can be increased, the support stability of the condenser lens 45 can be improved, and the emission light can be diffused. It can be suppressed. Also in this case, the entire or a part of the bonding region between the condenser lens 45 and the substrate 1 may be roughened. Thereby, even higher bonding strength can be obtained.

(Embodiment 13)
FIG. 15 is an enlarged cross-sectional view showing the optical waveguide module according to the thirteenth embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the optical waveguide module of the present embodiment, the upper surface of the optical waveguide 5 is roughened.

In the present embodiment, the region where the condenser lens 45 is roughened may be a region facing the side surface 1a of the substrate 1 at least outside the light passage path. Further, when a sufficient bonding strength can be obtained between the side surface of the substrate 1 and the condenser lens 45, it may be a part of the facing regions, for example, about 10% to 60%.

Further, the surface roughness Ra of the condenser lens 45 may be, for example, 0.05 μm to 10 μm. At this time, the roughening process can be performed by blasting, etching, imprinting, or the like. The surface roughness referred to here is an arithmetic average roughness Ra, and the average surface roughness can be measured by a stylus type surface roughness meter.

By adopting such a configuration, the bonding region of the bonding layer 17 with respect to the substrate 1 by the upper bonding portion 17c is increased, and the support stability of the condenser lens 45 can be improved.

(Embodiment 14)
FIG. 16 is an enlarged cross-sectional view showing the optical waveguide module of the 14th embodiment of the present disclosure. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. The optical waveguide module of the present embodiment includes a diffraction grating 145 as a condenser lens.

By adopting such a configuration, it is possible to shorten the length of the optical waveguide module in the optical axis direction. In this case as well, as in each of the above-described embodiments, the entire or a part of the joint region between the condenser lens 45 and the substrate 1 may be roughened. Thereby, even higher bonding strength can be obtained.

FIG. 17 is an exploded perspective view showing an optical waveguide package including the optical waveguide module according to the fifteenth embodiment of the present disclosure, and FIG. 18 is a side view of the optical waveguide package shown in FIG. The same reference numerals are given to the parts corresponding to the above-described embodiments, and duplicate description will be omitted. In the above-described embodiment, the configuration in which the upper portion of the light emitting element 10 protrudes from each recess 8 and the box-shaped sealing lid 11 is used so as to cover the recess 8 is described, but in other embodiments, the entire light emitting element 10 is used. May be configured to be housed in the recess 8 and the recess 8 may be covered with a plate-shaped sealing lid 11a to seal the recess 8. By adopting such a configuration, the configuration of the sealing lid 11a can be simplified.

In still another embodiment of the present disclosure, the light emitting element 10 is not limited to a light emitting diode (LED), and is, for example, an LD (Laser Diode), a VCSEL (Vertical Cavity Surface Emitting Laser), or the like. May be good. Further, the optical component may be an optical element such as various lenses such as a selfock lens and a rod lens instead of the above-mentioned condenser lens and diffraction grating.

Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various changes, improvements, etc. may be made without departing from the gist of the present disclosure. It is possible. Needless to say, all or a part of each of the above embodiments can be combined as appropriate and within a consistent range.

1 Substrate 2 Top surface 3 Clad layer 4 Core layer 4a, 4b, 4c Incident end surface 5 Optical waveguide 6 Bottom surface 7 Inner wall surface 7a, 7b, 7c, 7d Wall surface 8 Recessed 9ab, 9bc, 9cd, 9ad Corner support surface 10 Light emitting element 17 Bonding layer 20 Light emitting device 41a, 41b, 41c Dividing path 42 Exiting end face 43 Converging part 44 Integrated path 45 Condensing lens

Claims (15)

With the board
An optical waveguide located on the upper surface of the substrate, having a clad layer and a core layer located in the clad layer, and having an exit end surface of the core layer exposed to the outside of the clad layer.
An optical member located so as to face the emission end surface and the side surface of the substrate on the emission end surface side.
An optical waveguide module including a bonding layer that joins the optical member and the side surface of the substrate. The optical waveguide module according to claim 1, wherein the lower end portion of the bonding layer is located above the lower surface of the substrate. The optical waveguide module according to claim 1 or 2, wherein the side surface of the substrate is located closer to the optical member than the exit end surface of the optical waveguide. The optical waveguide module according to any one of claims 1 to 3, wherein at least a part of the surface of the optical member in contact with the bonding layer is roughened. The optical waveguide module according to any one of claims 1 to 4, wherein the bonding layer has a support portion in contact with the lower surface of the optical member. The optical waveguide module according to claim 5, wherein at least a part of the surface of the bonding layer in contact with the support portion of the optical member is roughened. The optical waveguide module according to any one of claims 1 to 5, wherein the upper end portion of the bonding layer is in contact with the upper surface of the substrate. The optical waveguide module according to claim 7, wherein the upper end portion faces the exit end surface of the optical waveguide. The optical wave according to any one of claims 6 to 8, wherein the bonding layer has a lower side surface of a lens in contact with the surface of the optical member on the exit end surface side. Waveguide module. The optical waveguide module according to claim 9, wherein at least a part of the surface of the bonding layer facing the lower side surface of the lens is roughened. The bonding layer according to any one of claims 1 to 10, wherein the bonding layer includes an upper region extending over the exit end surface of the optical waveguide and the upper surface of the optical waveguide, and an upper bonding portion for joining the optical member. Optical waveguide module. The optical waveguide module according to claim 11, wherein the upper joint portion extends on the upper surface of the optical waveguide. The optical waveguide module according to claim 11 or 12, wherein the optical member has a roughened surface facing the upper joint. The optical waveguide module according to any one of claims 11 to 14, wherein the upper surface of the optical waveguide is roughened. The optical waveguide module according to any one of claims 1 to 14, wherein the optical member includes a diffraction grating.

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